TWI775023B - Adhesion preventing member and vacuum processing apparatus - Google Patents
Adhesion preventing member and vacuum processing apparatus Download PDFInfo
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- TWI775023B TWI775023B TW108146592A TW108146592A TWI775023B TW I775023 B TWI775023 B TW I775023B TW 108146592 A TW108146592 A TW 108146592A TW 108146592 A TW108146592 A TW 108146592A TW I775023 B TWI775023 B TW I775023B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
Abstract
本發明係提供一種能夠對在真空處理時從被配置於放電空間之防附著構件所產生的粒子作抑制的技術。本發明之防附著構件(30),係具備有:框狀的防附著主體構件(10)、以及框狀的保持構件(20),係將防附著主體構件(10)以密接於真空槽(6)內的放電空間(9)側之狀態作保持。防附著主體構件(10),係從保持構件(20)之與放電空間(9)側之面相反側之面,亦即是裏側面(20R),藉由複數個支撐螺桿(23)而被固定,並且支撐螺桿(23),係被構成為,使各自的前端部不會從防附著主體構件(10)之放電空間(9)側之面,亦即是表側面(10F),而露出於放電空間(9)側。The present invention provides a technology capable of suppressing particles generated from an anti-adhesion member disposed in a discharge space during vacuum processing. The anti-adhesion member (30) of the present invention is provided with a frame-shaped anti-adhesion main body member (10) and a frame-shaped holding member (20). The state of the discharge space (9) side in 6) is maintained. The anti-adhesion main body member (10) is held by a plurality of supporting screws (23) from the surface opposite to the surface on the side of the discharge space (9) of the holding member (20), that is, the inner surface (20R). It is fixed and the support screw (23) is configured so that the respective front ends are not exposed from the surface on the side of the discharge space (9) of the anti-adhesion main body member (10), that is, the surface side (10F). on the side of the discharge space (9).
Description
本發明,係有關於使用於例如濺鍍裝置等之真空處理裝置的防附著構件之技術。The present invention relates to a technique for an anti-adhesion member used in a vacuum processing apparatus such as a sputtering apparatus.
以往,於此種真空處理裝置中,為了防止在進行濺鍍等之真空處理時對於真空槽內之壁面等之成膜材料等的附著,係設置有板狀的防附著構件。Conventionally, in such a vacuum processing apparatus, in order to prevent adhesion of film-forming materials and the like to the wall surface in the vacuum chamber during vacuum processing such as sputtering, a plate-shaped adhesion preventing member is provided.
此防附著構件,係被設置於例如濺鍍裝置般之進行電漿處理的放電空間之基板的附近。This adhesion prevention member is provided in the vicinity of the board|substrate of the discharge space which performs plasma processing like a sputtering apparatus, for example.
於此情況中,防附著構件,係於真空槽內朝向與基板平行的方向而被安裝於例如框狀的保持構件。In this case, the adhesion preventing member is attached to, for example, a frame-shaped holding member in a direction parallel to the substrate in the vacuum chamber.
以往,這種防附著構件,係使用多數個螺桿來被安裝於保持構件。 但,在被安裝於保持構件的防附著構件中,係存在有各種的課題。Conventionally, such an anti-adhesion member has been attached to the holding member using a plurality of screws. However, the adhesion prevention member attached to the holding member has various problems.
亦即是,在濺鍍等之成膜時,成膜材料也會附著於防附著構件。此時,成膜材料也會附著於螺桿的表面而成為粒子之產生的原因。因此,雖然是構成為對於各螺桿安裝有用以防止成膜材料之附著的蓋,但是,附著於此蓋的成膜材料也會成為粒子之產生的原因。That is, even during film formation such as sputtering, the film formation material adheres to the adhesion preventing member. At this time, the film-forming material also adheres to the surface of the screw and causes particles to be generated. Therefore, although the cap is attached to each screw to prevent adhesion of the film-forming material, the film-forming material adhering to the cap also causes particles to be generated.
又,由於防附著構件係使用多數個螺桿來從放電空間側而被安裝於保持構件,因此起因於放電時之熱所導致的防附著構件之伸展,會與保持構件之間產生摩擦,因此,而導致粒子產生。 [先前技術文獻] [專利文獻]In addition, since the anti-adhesion member is attached to the holding member from the discharge space side using a plurality of screws, the expansion of the anti-adhesion member caused by the heat during discharge causes friction with the holding member. resulting in the generation of particles. [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本特開平4-78132號公報 [專利文獻2] 日本特開平10-060624號公報 [專利文獻3] 日本特開2004-315948號公報 [專利文獻4] 國際公開2006-067836號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 4-78132 [Patent Document 2] Japanese Patent Application Laid-Open No. 10-060624 [Patent Document 3] Japanese Patent Laid-Open No. 2004-315948 [Patent Document 4] International Publication No. 2006-067836
[發明所欲解決之課題][The problem to be solved by the invention]
本發明,係考慮到上述以往之技術課題而完成者,其目的為,提供一種能夠對在真空處理時從被配置於放電空間之防附著構件所產生的粒子作抑制的技術。 [用以解決課題之手段]The present invention has been accomplished in consideration of the above-mentioned conventional technical problems, and an object thereof is to provide a technology capable of suppressing particles generated from an anti-adhesion member disposed in a discharge space during vacuum processing. [means to solve the problem]
為了達成上述目的而完成的本發明,係一種防附著構件,其係防止在使用有電漿之真空處理時所產生的物質之對於真空槽內的附著,該防附著構件,係具備有:框狀的防附著主體構件、以及框狀的保持構件,係將前述防附著主體構件以密接於前述真空槽內的放電空間側之狀態作保持,前述防附著主體構件,係從前述保持構件之與前述放電空間側之面相反側之面藉由複數個緊固構件而被固定,並且該各緊固構件,係被構成為,使各自的前端部分不會從前述防附著主體構件之前述放電空間側之面露出於該放電空間側。 本發明之防附著構件,係於前述保持構件之前述防附著主體構件側之面設置有將該防附著主體構件冷卻的冷卻部。 本發明之防附著構件,係於前述防附著主體構件之各構成構件的周緣部,設置有朝與前述真空槽內之放電空間相對向之面側延伸的電漿遮蔽用之壁部。 本發明之防附著構件,係於前述防附著主體構件之各構成構件的周緣部,以相對於前述電漿遮蔽用之壁部而朝外側延伸的方式,設置有對於前述保持構件之安裝部。 本發明之防附著構件,係被構成為,於前述真空槽內朝向概略垂直方向來作配置。 本發明係一種真空處理裝置,其係具備有:真空槽、以及被設置於前述真空槽內之上述任一項之防附著構件,該真空處理裝置,係被構成為,對於被配置在前述防附著構件的附近之處理對象物來進行特定的真空處理。 本發明之真空處理裝置,係具有配置有濺鍍靶材之前述真空槽,並被構成為,對於被配置在前述防附著構件的附近之處理對象物來進行濺鍍。 [發明效果]The present invention accomplished in order to achieve the above-mentioned object is an anti-adhesion member for preventing adhesion of substances generated during vacuum processing using plasma to the inside of a vacuum chamber, the anti-adhesion member comprising: a frame The anti-adhesion main body member and the frame-shaped holding member hold the adhesion-preventing main body member in a state of being in close contact with the discharge space side in the vacuum chamber, and the adhesion-preventing main body member is formed from the holding member and the The surface on the opposite side of the surface on the side of the discharge space is fixed by a plurality of fastening members, and each of the fastening members is configured so that the front end portion thereof does not penetrate the discharge space of the adhesion-preventing main body member. The side surfaces are exposed on the discharge space side. In the adhesion preventing member of the present invention, a cooling portion for cooling the adhesion preventing main body member is provided on the surface of the holding member on the adhesion preventing main body member side. The adhesion preventing member of the present invention is provided with a wall portion for plasma shielding extending toward the surface side facing the discharge space in the vacuum chamber on the peripheral edge of each constituent member of the adhesion preventing main body member. The adhesion preventing member of the present invention is provided with a mounting portion for the holding member so as to extend outward relative to the wall portion for plasma shielding on the peripheral edge portion of each constituent member of the adhesion preventing main body member. The adhesion prevention member of this invention is comprised so that it may arrange|position in the substantially vertical direction in the said vacuum chamber. The present invention relates to a vacuum processing apparatus comprising: a vacuum chamber and any one of the above-mentioned adhesion preventing members installed in the vacuum chamber, the vacuum processing device being configured to A specific vacuum treatment is performed by attaching the object to be processed in the vicinity of the member. The vacuum processing apparatus of this invention has the said vacuum chamber in which the sputtering target material is arrange|positioned, and is comprised so that it may sputter the process target object arrange|positioned in the vicinity of the said adhesion prevention member. [Inventive effect]
於本發明中,防附著主體構件,係從保持構件之與放電空間側之面相反側之面藉由複數個緊固構件而被固定,並且各緊固構件,係被構成為使各自的前端部分不會從防附著主體構件之放電空間側之面而露出於放電空間側,因此,並不需要為了將防附著主體構件保持於保持構件而如以往技術般地使用多數個附有蓋的螺桿。In the present invention, the anti-adhesion main body member is fixed by a plurality of fastening members from the surface of the holding member on the opposite side to the surface on the discharge space side, and each fastening member is configured so that the front end of each Since a part is not exposed to the discharge space side from the surface of the anti-adhesion main body member on the discharge space side, it is not necessary to use a large number of screws with covers in order to hold the anti-adhesion main body member to the holding member as in the prior art.
其結果,若依據本發明,則由於能夠減少防附著構件之放電空間側之面的凹凸部並縮小其之表面積,因此能夠對起因於在真空處理時所附著的成膜材料等之從防附著構件的表面之剝離所導致的粒子之產生作抑制。As a result, according to the present invention, since the unevenness of the surface of the anti-adhesion member on the discharge space side can be reduced and the surface area thereof can be reduced, it is possible to prevent the adhesion of the film-forming material or the like caused by adhering during the vacuum treatment. The generation of particles due to peeling of the surface of the member is suppressed.
又,若依據本發明,則由於可使防附著主體構件與保持構件確實地密接,因此即使在例如將防附著構件朝向垂直方向來作配置的情況,也不會有起因於防附著構件的翹曲所導致之在防附著主體構件與保持構件之間產生間隙的情形。In addition, according to the present invention, since the adhesion preventing main body member and the holding member can be reliably brought into close contact with each other, even when the adhesion preventing member is arranged in the vertical direction, for example, there is no warping caused by the adhesion preventing member. A situation in which a gap is created between the adhesion prevention main body member and the holding member due to bending.
又,於本發明中,於在保持構件之前述防附著主體構件側之面設置有將防附著主體構件冷卻的冷卻部之情況時,防附著主體構件與保持構件會確實地密接,與此相輔相成地,可將防附著構件確實地冷卻。其結果,若依據本發明,則能夠確實地防止起因於因為放電時的熱所致之防附著構件的伸展所造成的摩擦而導致的粒子之產生。In addition, in the present invention, when the cooling portion for cooling the adhesion prevention main body member is provided on the surface of the holding member on the adhesion prevention main body member side, the adhesion prevention main body member and the holding member are reliably brought into close contact with each other. Therefore, the adhesion preventing member can be surely cooled. As a result, according to the present invention, it is possible to reliably prevent the generation of particles due to friction caused by the expansion of the adhesion preventing member due to heat during discharge.
再者,於本發明中,於在防附著主體構件之各構成構件的周緣部設置有朝與真空槽之放電空間相對向之面側延伸的電漿遮蔽用之壁部的情況時,由於能夠進一步減少附著於防附著構件之放電空間側之面的成膜材料等之物質的量,因此可對起因於該物質之從防附著構件的表面之剝離所導致的粒子之產生作進一步抑制。Furthermore, in the present invention, when the wall portion for plasma shielding extending toward the surface side facing the discharge space of the vacuum chamber is provided on the peripheral edge portion of each constituent member of the main body member, it is possible to Since the amount of the substance such as the film-forming material adhering to the discharge space side surface of the adhesion preventing member is further reduced, the generation of particles due to peeling of the substance from the surface of the adhesion preventing member can be further suppressed.
再進而,於本發明中,當在防附著主體構件之各構成構件的周緣部,以從電漿遮蔽用之壁部朝外側延伸的方式而設置有對於保持構件之安裝部的情況時,即便是於在安裝部處使用螺絲來將防附著主體構件安裝於保持構件的情況時,在真空處理時所產生的物質也會藉由設置於防附著主體構件的電漿遮蔽用之壁部而被遮蔽,而可防止對於防附著主體構件之安裝部的附著,因此,可對起因於該物質之從防附著構件的表面之剝離所導致的粒子之產生作進一步抑制。Furthermore, in the present invention, when a mounting portion for the holding member is provided on the peripheral edge portion of each constituent member of the anti-adhesion main body member so as to extend outward from the wall portion for plasma shielding, even if In the case of attaching the anti-adhesion main body member to the holding member using screws at the attachment portion, substances generated during vacuum processing are also removed by the wall portion for plasma shielding provided in the anti-adhesion main body member. By shielding, adhesion to the attachment portion of the adhesion preventing body member can be prevented, and therefore, generation of particles caused by peeling of the substance from the surface of the adhesion preventing member can be further suppressed.
以下,參照圖面,對本發明之實施形態作詳細說明。 第1圖,係對身為本發明之真空處理裝置之例的濺鍍裝置之內部構成作展示的概略構成圖。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic configuration diagram showing the internal configuration of a sputtering apparatus which is an example of a vacuum processing apparatus according to the present invention.
第2圖(a)(b),係對本發明之防附著構件之防附著主體構件之例作展示的概略構成圖,第2圖(a),係為從放電空間側來作觀察的正面圖,第2圖(b),係為從放電空間之相反側來作觀察的正面圖。Fig. 2(a)(b) is a schematic configuration diagram showing an example of the adhesion-preventing main body member of the adhesion-preventing member of the present invention, and Fig. 2(a) is a front view viewed from the discharge space side , Figure 2 (b), is a front view viewed from the opposite side of the discharge space.
又,第3圖(a)(b),係對該防附著主體構件之例作展示的概略構成圖,第3圖(a),係為從放電空間側來作觀察的正面圖,第3圖(b),係為第3圖(a)之A-A線剖面圖。In addition, Fig. 3(a)(b) is a schematic configuration diagram showing an example of the anti-adhesion main body member, Fig. 3(a) is a front view viewed from the discharge space side, and the third Fig. Figure (b) is a sectional view taken along the line A-A of Figure 3 (a).
再者,第4圖(a)~(d),係對被設置於防附著主體構件之保持部的構成例作展示者,第4圖(a),係對從防附著主體構件之表側面側來觀察的狀態作展示的正面圖,第4圖(b),係對從防附著主體構件之裏側面側來觀察的狀態作展示的正面圖,第4圖(c),係為第4圖(b)之B-B線部分剖面圖,第4圖(d)係為第4圖(b)之C-C線剖面圖。In addition, Fig. 4(a)-(d) shows a configuration example of the holding portion provided in the anti-adhesion main body member, and Fig. 4(a) is for the front side of the anti-adhesion main body member. A front view showing the state viewed from the side, and Fig. 4(b) is a front view showing the state viewed from the inner side of the anti-adhesion main body member, and Fig. 4(c) is the fourth Figure (b) is a partial cross-sectional view taken along line B-B, and Figure 4 (d) is a cross-sectional view taken along line C-C of Figure 4 (b).
如第1圖所示般地,本例之防附著主體構件10,係構成使用於身為真空處理裝置之濺鍍裝置40的防附著構件30,且在被作了接地的真空槽6內之基板8(處理對象物)的附近,以被保持於後述之保持構件20的狀態來被作配置。As shown in FIG. 1, the anti-adhesion
在此,於本例中,基板8、濺鍍靶材(以下,稱作「靶材」)7及防附著構件30,係朝向概略垂直方向來被作設置,防附著主體構件10,係在基板8與靶材7之間的放電空間9中以與靶材7相對向的方式來被作配置。Here, in this example, the
於具有這種構成之濺鍍裝置40中,係於真空槽6內導入濺鍍氣體,並對靶材7施加負電壓而於放電空間9中產生電漿放電。In the
藉由此,使被設為負電荷的靶材7藉由電漿中之離子而被濺鍍,藉由從靶材7表面飛出的濺鍍粒子而於基板8上形成膜。Thereby, the target 7 set to negative charge is sputtered by ions in the plasma, and a film is formed on the
如第2圖(a)(b)所示般地,本例之防附著主體構件10,係被形成為例如具有直線板狀之第1~第4構成構件1~4且具有開口部10a的矩形框狀。As shown in FIGS. 2( a ) and ( b ), the adhesion preventing
第2圖(a),係對防附著主體構件10的放電空間9側之面,亦即是表側面10F作展示者,於第2圖(b)中,係展示防附著主體構件10之與放電空間9相反側之面,亦即是裏側面10R。Fig. 2(a) shows the surface on the side of the
本例之防附著主體構件10,例如係由鋁(Al)、不鏽鋼、鈦(Ti)等之金屬所構成,通常是以朝向概略垂直方向的狀態而被作配置。The adhesion-preventing
在此,防附著主體構件10,係具有:被配置於上下側並分別朝水平方向延伸的第1構成構件1及第2構成構件2、和在第1構成構件1及第2構成構件2之間,以水平方向為基準而被配置於左右側並朝垂直方向延伸的第3構成構件3及第4構成構件4。Here, the anti-adhesion
以下,將防附著主體構件10之第1構成構件1及第2構成構件2的長邊方向適當稱作「X軸方向」,將第3構成構件3及第4構成構件4的長邊方向適當稱作「Z軸方向」。Hereinafter, the longitudinal direction of the first
本例之第1~第4構成構件1~4,係考慮到真空處理時之因熱所導致的伸展,而被設置成在相鄰接的構件之兩端部彼此之間設有些許間隙。The first to
第1~第4構成構件1~4當中,第1構成構件1與第2構成構件2、以及第3構成構件3與第4構成構件4,係被配置成以通過防附著主體構件10的中心點之直線為基準而被形成為線對稱的形狀。Among the first to
並且,第1~第4構成構件1~4,係被保持於後述之保持構件20。In addition, the first to
另外,於第1~第4構成構件1~4之各者的周緣部處,係設置有朝向第1~第4構成構件1~4之如第1圖所示的放電空間9側(表面側)以朝例如垂直方向延伸的方式而被形成的電漿遮蔽壁(電漿遮蔽用之壁部)1c、2c、3c、4c。In addition, at the peripheral edge portion of each of the first to
於本例之第1~第4構成構件1~4的裏側面10R,係在包圍開口部10a的位置處設置有保持部15,該保持部15,係具有用以使第1~第4構成構件1~4分別保持於保持構件20之後述的緊固保持構件16。In the
在此,保持部15,係具有:被形成為細長形狀,且基本構成為相同之朝水平方向延伸的水平保持部15h、以及朝垂直方向延伸的垂直保持部15v。Here, the
水平保持部15h,係被設置成,於第1及第2構成構件1、2中,沿著各自之長邊方向(X軸方向),以直線狀例如並排為一列地而被設置。The
垂直保持部15v,係被設置成,於第1及第2構成構件1、2的兩端部與第3及第4構成構件3、4中,沿著第3及第4構成構件3、4的長邊方向(Z軸方向),以直線狀例如並排為一列地而被設置。The
於本發明之情況中,雖然並無特別限定,但是,就防止防附著構件30之翹曲的觀點而言,水平保持部15h及垂直保持部15v,較理想係於防附著主體構件10中,以將相對於第1~第4構成構件1~4的長邊方向而為正交的直線作為基準而成為線對稱的方式,來分別設置複數個水平保持部15h及垂直保持部15v。In the case of the present invention, although not particularly limited, from the viewpoint of preventing the warpage of the
另一方面,於第1~第4構成構件1~4之周緣部,係設置有複數個用以將第1~第4構成構件1~4使用後述之螺桿來安裝於保持構件20的安裝部5,該複數個安裝部5,係分別從電漿遮蔽壁1c~4c朝外側延伸(突出)。On the other hand, a plurality of attaching portions for attaching the first to fourth
於此些複數個安裝部5,係分別設置有用以將防附著主體構件10從放電空間9側以螺桿來作安裝之螺孔50(第3圖(a))。The plurality of mounting
如第4圖(a)~(d)所示般地,上述之本例之保持部15,係被構成為,在被設置於防附著主體構件10的裏側面10R之例如長方體形狀的凹部10b處,安裝有例如細長形狀之緊固保持構件16。As shown in FIGS. 4( a ) to ( d ), the holding
此緊固保持構件16,係具有:由例如附有板之螺帽所構成,且於防附著主體構件10之裏側面10R側,形成有與後述之支撐螺桿23之螺紋部23c(參照第8圖(c)(d))相咬合的螺紋部16b之螺孔16a。The fastening and holding
並且,此緊固保持構件16,係被構成為,藉由具有與設置於防附著主體構件10之裏側面10R的一對的螺洞10c之螺紋部相咬合的螺紋部之一對的固定螺桿17,而將朝防附著主體構件10之凹部10b的長邊方向兩側延伸之一對的凸緣部安裝於防附著主體構件10並作固定。Further, the fastening and holding
第5圖(a)(b),係對使用於本發明之保持構件之例作展示的概略構成圖,第5圖(a),係為從放電空間側來作觀察的正面圖,第5圖(b),係為從放電空間之相反側來作觀察的正面圖。Fig. 5(a)(b) is a schematic configuration diagram showing an example of the holding member used in the present invention, Fig. 5(a) is a front view viewed from the discharge space side, and Fig. 5 Figure (b) is a front view viewed from the opposite side of the discharge space.
第6圖(a)~(d),係對保持構件之收容凹部及孔部的構成例作展示者,第6圖(a),係對從保持構件之表側面側來觀察的狀態作展示的正面圖,第6圖(b),係對從保持構件之裏側面側來觀察的狀態作展示的正面圖,第6圖(c),係為第6圖(a)之D-D線剖面圖,第6圖(d),係為第6圖(b)之E-E線剖面圖。Figures 6(a) to (d) show the configuration examples of the accommodating recesses and holes of the holding member, and Figure 6(a) shows the state viewed from the surface side of the holding member Fig. 6(b) is a front view showing the state viewed from the inner side of the holding member, and Fig. 6(c) is a sectional view taken along the line D-D in Fig. 6(a). , Fig. 6(d), is a cross-sectional view taken along the line E-E of Fig. 6(b).
於本例中,保持構件20,係被固定於第1圖所示之真空槽6內,於保持構件20之放電空間9側處,安裝有上述之防附著主體構件10之第1~第4構成構件1~4。In this example, the holding
如第5圖(a)(b)所示般地,本例之保持構件20,係被形成為矩形框狀。As shown in Fig. 5(a)(b), the holding
此保持構件20,係使用剛性高的板材而一體性地被形成,具有較上述之防附著主體構件10之外徑更些許大的外徑,並且設置有具有較上述之防附著主體構件10之開口部10a更些許大的內徑之開口部20a。The holding
保持構件20,係由與防附著主體構件10之第1~第4構成構件1~4相對應的第1~第4框部11~14所構成。亦即是,於保持構件20之上下部分處設置有朝水平方向延伸的第1框部11及第2框部12,於第1框部11及第2框部12之間,以水平方向為基準而於保持構件20的左右部分處設置有朝垂直方向延伸的第3框部13及第4框部14。The holding
以下,將保持構件20之第1框部11及第2框部12的長邊方向適當稱作「X軸方向」,將第3框部13及第4框部14的長邊方向適當稱作「Z軸方向」。Hereinafter, the longitudinal direction of the
如第5圖(a)所示般地,於保持構件20之如第1圖所示的放電空間9側之面,亦即是表側面20F,係在包圍開口部20a並且與被安裝於防附著主體構件10之複數個保持部15相對應的位置處,作為收容各保持部15之空間而設置有複數個收容凹部21。As shown in Fig. 5(a), the surface of the holding
在此,各收容凹部21,係具有:被形成為細長形狀,且基本構成為相同之朝水平方向延伸的水平收容凹部21h、以及朝垂直方向延伸的垂直收容凹部21v。Here, each
水平收容凹部21h,係被設置成,於保持構件20之第1框部11及第2框部12中,沿著各自之長邊方向(X軸方向),以直線狀例如並排為一列地被作設置。The horizontal
另一方面,垂直收容凹部21v,係被設置成,於保持構件20之第3框部13及第4框部14中,沿著各自之長邊方向(Z軸方向),以直線狀例如並排為一列地被作設置。On the other hand, the vertical
於本發明之情況中,雖然並無特別限定,但是,就防止防附著構件30之翹曲的觀點而言,水平收容凹部21h及垂直收容凹部21v,較理想係於保持構件20中,以將相對於第1~第4框部11~14的長邊方向而為正交的直線作為基準而成為線對稱的方式,來分別設置複數個水平收容凹部21h及垂直收容凹部21v。In the case of the present invention, although not particularly limited, from the viewpoint of preventing the warpage of the
如第6圖(a)、(c)及(d)所示般地,本例之保持構件20的收容凹部21,係被構成為,在保持構件20之表側面20F設置有細長形狀的凹部21a,並於此凹部21a之內側設置有孔部21b。As shown in FIGS. 6( a ), ( c ) and ( d ), the accommodating
在此,保持構件20之收容凹部21的凹部21a,係以可收容被安裝於防附著主體構件10的保持部15之緊固保持構件16的大小而被作形成,在使防附著主體構件10保持於保持構件20的情況時,係被構成為使防附著主體構件10之裏側面10R與保持構件20之表側面20F相密接(參照第8圖(c)(d))。Here, the
另一方面,如第5圖(b)所示般地,於保持構件20之如第1圖所示之與放電空間9相反側之面,亦即是裏側面20R,係在包圍開口部20a並且與防附著主體構件10之複數個保持部15相對應的位置處,設置有複數個收容孔部22。On the other hand, as shown in FIG. 5(b), the surface of the holding
在此,各收容孔部22,係具有:被形成為長孔形狀,且基本構成為相同之朝水平方向延伸的水平孔部22h、以及朝垂直方向延伸的垂直孔部22v。Here, each receiving
水平孔部22h,係被設置成,於保持構件20之第1框部11及第2框部12中,沿著各自之長邊方向(X軸方向),以直線狀例如並排為一列地被作設置。The
另一方面,垂直孔部22v,係被設置成,於保持構件20之第3框部13及第4框部14中,沿著各自之長邊方向(Z軸方向),以直線狀例如並排為一列地被作設置。On the other hand, the
進而,於保持構件20之表側面20F的緣部處,係設置有複數個螺洞25,該螺洞25,係用以將上述之防附著主體構件10之安裝部5使用後述之螺桿24來安裝於保持構件20之表側面20F。Furthermore, a plurality of screw holes 25 are provided at the edge of the
如第6圖(b)~(d)所示般地,本例之被設置於保持構件20之裏側面20R的各收容孔部22,係被形成為朝與被設置於保持構件20之表側面20F的收容凹部21之孔部21b相同方向延伸。As shown in FIGS. 6( b ) to ( d ), each receiving
並且,各收容孔部22,係被形成為與保持構件20之表側面20F的收容凹部21之孔部21b相連續。Moreover, each receiving
如第5圖(a)、(b)所示般地,於保持構件20之表側面20F的內部,係設置有將防附著構件30冷卻的冷卻部26。As shown in FIGS. 5( a ) and ( b ), inside the
此冷卻部26,例如,係可藉由於保持構件20的表側面20F設置溝並封蓋而構成,於本例中,係被形成為於保持構件20之開口部20a的周圍而圍繞保持構件20的下部與上部之間。The cooling
本例之冷卻部26,係具有以包夾著與通過保持構件20之中心部的Z軸平行之直線而成為線對稱的方式所形成之一對的冷卻部26a、26b。The cooling
此冷卻部26,係被構成為,從將被設置於保持構件20之裏側面20R側的第2框部12之冷媒(例如水)作導入的冷媒導入口26c,來對於保持構件20之表側面20F側的第2框部12之一對的冷卻部26a、26b之其中一方的端部26e而分別導入冷媒。The cooling
並且,一對的冷卻部26a、26b,係使保持構件20之表側面20F側的第2框部12之一對的冷卻部26a、26b之另一方的端部26f彼此,藉由被設置於保持構件20之裏側面20R側的第2框部12之連接管26d而被作連接。In addition, the pair of cooling
第7圖(a)(b),係對本發明之防附著構件之例作展示的概略構成圖,第7圖(a),係為從放電空間側來作觀察的正面圖,第7圖(b),係為從放電空間之相反側來作觀察的正面圖。Fig. 7(a)(b) is a schematic configuration diagram showing an example of the anti-adhesion member of the present invention, Fig. 7(a) is a front view viewed from the discharge space side, Fig. 7( b), is a front view viewed from the opposite side of the discharge space.
於具有上述構成之本實施形態中,在使防附著主體構件10保持於保持構件20的情況時,係在將保持構件20之第1~第4框部11~14相對於防附著主體構件10而各自作了定位的狀態下,將身為緊固構件的支撐螺桿23,從保持構件20之裏側面20R側分別***水平孔部22h及垂直孔部22v內,來將此些支撐螺桿23分別鎖緊於防附著主體構件10的保持部15處,藉由此,而將防附著主體構件10以密接於保持構件20的狀態作固定。In the present embodiment having the above-described configuration, when the adhesion prevention
又,在此定位狀態下,從防附著主體構件10之表側面10F側將螺桿24分別***防附著主體構件10之安裝部5的螺孔50,並將此些螺桿24分別鎖緊於保持構件20的螺洞25(參照第5圖(a)),藉由此,而將防附著主體構件10安裝於保持構件20。In this positioning state, the
第8圖(a)~(d),係對本例之防附著構件中之防附著主體構件與保持構件的固定部分作展示的圖,第8圖(a),係對從保持構件之裏側面側來觀察的狀態作展示的正面圖,第8圖(b),係對從防附著主體構件之表側面側來觀察的狀態作展示的正面圖,第8圖(c),係為第8圖(a)之G-G線剖面圖,第8圖(d),係為第8圖(a)之H-H線剖面圖。Figures 8 (a) to (d) are views showing the fixing part of the adhesion preventing main body member and the holding member in the adhesion preventing member of this example, and Figure 8 (a) is a view from the inner side of the holding member. A front view showing the state viewed from the side, Fig. 8(b) is a front view showing the state viewed from the surface side of the anti-adhesion main body member, and Fig. 8(c) is the 8th The G-G line cross-sectional view in Fig. (a), and the H-H line cross-sectional view in Fig. 8(a) in Fig. 8(d).
如第8圖(a)及第8圖(d)所示般地,使用於本例之支撐螺桿23,例如,係使用使其之頭部23a的外徑(直徑)較設置於保持構件20之裏側面20R的收容孔部22之寬度更大且使其之胴體部23b的直徑較保持構件20的收容孔部22之寬度更些許小者。As shown in FIGS. 8( a ) and 8 ( d ), the
接著,將支撐螺桿23的螺紋部23c***保持構件20的收容孔部22來使其咬合於保持部15之緊固保持構件16的螺紋部16b而將支撐螺桿23拴緊,藉由此,在支撐螺桿23之頭部23a的座面被按壓於保持構件20之裏側面20R而完成了鎖緊的狀態下,以使支撐螺桿23之胴體部23b的前端部被按壓於緊固保持構件16之保持構件20側的面並且於支撐螺桿23之螺紋前端部23d與防附著主體構件10之凹部10b的底面之間會形成特定之間隙的方式,來對支撐螺桿23的胴體部23b及螺紋部23c之尺寸以及防附著主體構件10的凹部10b及緊固保持構件16的螺紋部16b之尺寸作設定。Next, the
並且,於具有這種構成之本實施形態中,係被構成為,在組裝防附著構件30時,使固定防附著主體構件10及保持構件20之支撐螺桿23的螺紋前端部23d不會從防附著主體構件10的表側面10F露出於放電空間9側。In addition, in the present embodiment having such a configuration, when the
第9圖(a)(b),係對本例之防附著構件中之防附著主體構件之安裝部與保持構件的安裝部分作展示的圖,第9圖(a),係對從保持構件之表側面側來觀察的狀態作展示的正面圖,第9圖(b),係為第9圖(a)之I-I線剖面圖。Fig. 9(a)(b) is a diagram showing the attachment portion of the attachment preventing main body member and the attachment portion of the holding member in the attachment preventing member of this example, and Fig. 9(a) is a view of the attachment portion of the attachment preventing member from the holding member. Fig. 9(b) is a cross-sectional view taken along the line I-I in Fig. 9(a).
如第9圖(a)(b)所示般地,於本例中,係從防附著主體構件10之表側面10F側經由防附著主體構件10之安裝部5的螺孔50(參照第2圖(a)),來將螺桿24的螺紋部24b鎖緊於保持構件20之螺孔25的螺紋部25a,藉由此,而將防附著主體構件10安裝於保持構件20。As shown in FIGS. 9( a ) and ( b ), in this example, the
於本發明之情況中,雖然並無特別限定,但是,就確保防附著構件30之必要的強度且確實地防止其之翹曲的觀點而言,較理想係於螺桿24的頭部24a與防附著主體構件10的表側面10F之間,設置些許之間隙c。In the case of the present invention, although it is not particularly limited, from the viewpoint of ensuring the necessary strength of the
具體而言,較理想係將螺桿24的頭部24a與防附著主體構件10的表側面10F之間的間隙c設定為0.1~1mm左右。Specifically, it is preferable to set the clearance c between the
於以上所述之本實施形態中,防附著主體構件10,係從保持構件20之與放電空間9側之面相反側之面藉由複數個支撐螺桿23而被固定,並且各支撐螺桿23,係被構成為使各自的前端部23d不會從防附著主體構件10之放電空間9側之面露出於放電空間9側,因此,並不需要為了將防附著主體構件10保持於保持構件20而如以往技術般地使用多數個附有蓋的螺桿。In the present embodiment described above, the adhesion preventing
其結果,若依據本實施形態,則由於能夠減少防附著構件30之放電空間9側之面的凹凸部並縮小其之表面積,因此能夠對起因於在真空處理時所附著的成膜材料等之從防附著構件的表面之剝離所導致的粒子之產生作抑制。As a result, according to the present embodiment, since the unevenness of the surface of the
又,若依據本實施形態,則由於可使防附著主體構件10與保持構件20確實地密接,因此即使在例如將防附著構件30朝向垂直方向來作配置的情況,也不會有起因於防附著構件30的翹曲所導致之在防附著主體構件10與保持構件20之間產生間隙的情形。In addition, according to the present embodiment, since the adhesion preventing
又,於本實施形態中,由於是在保持構件20之前述防附著主體構件10側之面設置有將防附著主體構件10冷卻的冷卻部26,因此防附著主體構件10與保持構件20會確實地密接,與此相輔相成地,可將防附著構件30確實地冷卻。其結果,若依據本實施形態,則能夠確實地防止由於起因於放電時的熱所致之防附著構件30的伸展所造成的摩擦而導致之粒子的產生。Furthermore, in the present embodiment, since the cooling
再者,於本實施形態中,由於是在防附著主體構件10之第1~第4構成構件1~4的周緣部設置有朝與真空槽6之放電空間9相對向之面側延伸的電漿遮蔽壁1c~4c,因此能夠進一步減少附著於防附著構件30之放電空間9側之面的成膜材料等之物質的量,因而可對起因於該物質之從防附著構件30的表面之剝離所導致的粒子之產生作進一步抑制。Furthermore, in the present embodiment, since the peripheral edge portions of the first to fourth
再進而,於本實施形態中,由於是在防附著主體構件10之第1~第4構成構件1~4的周緣部,以從電漿遮蔽壁1c~4c朝外側延伸的方式,設置有對於保持構件20之安裝部5,因此即便是在使用螺桿24來從放電空間9側將防附著主體構件10安裝於保持構件20的情況,在真空處理時所產生的物質也會藉由設置於防附著主體構件10的電漿遮蔽壁1c~4c而被遮蔽,而可防止對於防附著主體構件10之安裝部5的附著,因而可對起因於該物質之從防附著構件30的表面之剝離所導致的粒子之產生作進一步抑制。Furthermore, in the present embodiment, since the peripheral edge portions of the first to fourth
另外,本發明,係並不被限定於上述實施形態,而可進行各種之變更。例如,於上述實施形態中,雖作為將防附著主體構件鎖緊於保持構件的緊固構件而使用了支撐螺桿,但是,本發明係並不被限制於此,只要是可從保持構件之與放電空間側之面相反側之面作固定,且被構成為使各自的前端部分不會從防附著主體構件之放電空間側之面露出於該放電空間內,則可使用各種的緊固構件來將防附著主體構件鎖緊於保持構件。In addition, this invention is not limited to the said embodiment, Various changes are possible. For example, in the above-mentioned embodiment, although the support screw is used as the fastening member for locking the adhesion preventing main body member to the holding member, the present invention is not limited to this, as long as the holding member can be connected with the holding member. The surface on the opposite side of the discharge space side is fixed, and the respective front ends are not exposed in the discharge space from the surface of the discharge space side of the anti-adhesion main body member, and various fastening members can be used. The anti-adhesion body member is locked to the retaining member.
進而,上述實施形態,雖係以適用於濺鍍裝置的情況為例來作了說明,但是,本發明係並不被限定於此,而可適用於各種的真空處理裝置。Furthermore, the above-mentioned embodiment has been described by taking a case where it is applied to a sputtering apparatus as an example, but the present invention is not limited to this, and can be applied to various vacuum processing apparatuses.
1:第1構成構件
1c:電漿遮蔽壁(電漿遮蔽用之壁部)
2:第2構成構件
2c:電漿遮蔽壁
3:第3構成構件
3c:電漿遮蔽壁
4:第4構成構件
4c:電漿遮蔽壁
5:安裝部
6:真空槽
7:濺鍍靶材
8:基板(處理對象物)
10:防附著主體構件
11:第1框部
12:第2框部
13:第3框部
14:第4框部
20:保持構件
21:收容凹部
21h:水平收容凹部
21v:垂直收容凹部
22:收容孔部
22h:水平孔部
22v:垂直孔部
23:支撐螺桿(緊固構件)
24:螺桿
25:螺洞
26:冷卻部
40:濺鍍裝置(真空處理裝置)
50:螺孔1: The
[第1圖]:係對身為本發明之真空處理裝置之例的濺鍍裝置之內部構成作展示的概略構成圖。 [第2圖](a)(b):係對本發明之防附著構件之防附著主體構件之例作展示的概略構成圖,第2圖(a),係為從放電空間側來作觀察的正面圖,第2圖(b),係為從放電空間側之相反側來作觀察的正面圖。 [第3圖](a)(b):係對該防附著主體構件之例作展示的概略構成圖,第3圖(a),係為從放電空間側來作觀察的正面圖,第3圖(b),係為第3圖(a)之A-A線剖面圖。 [第4圖](a)~(d):係對被設置於防附著主體構件之保持部的構成例作展示者,第4圖(a),係對從防附著主體構件之表側面側來觀察的狀態作展示的正面圖,第4圖(b),係對從防附著主體構件之裏側面側來觀察的狀態作展示的正面圖,第4圖(c),係為第4圖(b)之B-B線部分剖面圖,第4圖(d)係為第4圖(b)之C-C線剖面圖。 [第5圖](a)(b):係對使用於本發明中之保持構件之例作展示的概略構成圖,第5圖(a),係為從放電空間側來作觀察的正面圖,第5圖(b),係為從放電空間之相反側來作觀察的正面圖。 [第6圖](a)~(d):係對保持構件之收容凹部及孔部的構成例作展示者,第6圖(a),係對從保持構件之表側面側來觀察的狀態作展示的正面圖,第6圖(b),係對從保持構件之裏側面側來觀察的狀態作展示的正面圖,第6圖(c),係為第6圖(a)之D-D線剖面圖,第6圖(d),係為第6圖(b)之E-E線剖面圖。 [第7圖](a)(b):係對本發明之防附著構件之例作展示的概略構成圖,第7圖(a),係為從放電空間側來作觀察的正面圖,第7圖(b),係為從放電空間之相反側來作觀察的正面圖。 [第8圖](a)~(d):係對本例之防附著構件中之防附著主體構件與保持構件的固定部分作展示的圖,第8圖(a),係對從保持構件之裏側面側來觀察的狀態作展示的正面圖,第8圖(b),係對從防附著主體構件之表側面側來觀察的狀態作展示的正面圖,第8圖(c),係為第8圖(a)之G-G線剖面圖,第8圖(d),係為第8圖(a)之H-H線剖面圖。 [第9圖](a)(b):係對本例之防附著構件中之防附著主體構件之安裝部與保持構件之間的安裝部分作展示的圖,第9圖(a),係對從保持構件之表側面側來觀察的狀態作展示的正面圖,第9圖(b),係為第9圖(a)之I-I線剖面圖。[FIG. 1]: It is the schematic block diagram which shows the internal structure of the sputtering apparatus which is an example of the vacuum processing apparatus of this invention. [Fig. 2](a)(b): It is a schematic configuration diagram showing an example of the adhesion-preventing main body member of the adhesion-preventing member of the present invention, and Fig. 2(a) is viewed from the discharge space side The front view, Fig. 2(b), is a front view viewed from the side opposite to the discharge space side. [Fig. 3] (a) (b): It is a schematic configuration diagram showing an example of the anti-adhesion main body member, Fig. 3 (a) is a front view viewed from the discharge space side, and the third Figure (b) is a sectional view taken along the line A-A of Figure 3 (a). [FIG. 4] (a) to (d): It shows the configuration example of the holding part provided in the anti-adhesion main body member, and FIG. 4(a) is for the front surface side of the anti-adhesion main body member. The front view showing the state of observation, Fig. 4(b), is the front view showing the state observed from the inner side of the anti-adhesion main body member, and Fig. 4(c) is the fourth picture. (b) is a partial cross-sectional view taken along line B-B, and Fig. 4(d) is a cross-sectional view taken along line C-C of Fig. 4(b). [FIG. 5](a)(b): It is a schematic configuration diagram showing an example of the holding member used in the present invention, and FIG. 5(a) is a front view viewed from the discharge space side , Fig. 5(b), is a front view viewed from the opposite side of the discharge space. [Fig. 6] (a) to (d): It shows the configuration example of the receiving recess and the hole portion of the holding member, and Fig. 6(a) shows the state viewed from the surface side of the holding member Figure 6(b) is a front view showing the state viewed from the inner side of the holding member, and Figure 6(c) is the D-D line in Figure 6(a). The cross-sectional view, Fig. 6(d), is a cross-sectional view taken along the line E-E of Fig. 6(b). [Fig. 7](a)(b): It is a schematic configuration diagram showing an example of the anti-adhesion member of the present invention. Fig. 7(a) is a front view viewed from the discharge space side, and Fig. 7 Figure (b) is a front view viewed from the opposite side of the discharge space. [Fig. 8] (a) to (d): It is a diagram showing the fixing part of the adhesion preventing main body member and the holding member in the adhesion preventing member of this example, and Fig. 8(a) is a view of the attachment preventing member from the holding member. A front view showing the state viewed from the back side, Fig. 8(b) is a front view showing the state viewed from the front side of the anti-adhesion main body member, and Fig. 8(c) is a Fig. 8(a) is a sectional view taken along line G-G, and Fig. 8(d) is a sectional view taken along line H-H of Fig. 8(a). [Fig. 9](a)(b): It is a diagram showing the attachment portion between the attachment portion of the attachment preventing main body member and the holding member in the attachment preventing member of this example, and Fig. 9(a) is a pair of Fig. 9(b) is a cross-sectional view taken along the line I-I in Fig. 9(a), which is a front view showing the state viewed from the surface side of the holding member.
5:安裝部 5: Installation Department
10:防附著主體構件 10: Anti-adhesion main body components
10F:表側面 10F: surface side
10R:裏側面 10R: Inside side
11:第1框部
11:
12:第2框部
12:
13:第3框部
13:
14:第4框部
14:
15:保持部 15: Keeping Department
20:保持構件 20: Keeping Components
20a:開口部 20a: Opening
20F:表側面 20F: surface side
20R:裏側面 20R: Inside side
22h:水平孔部 22h: Horizontal hole
22v:垂直孔部 22v: vertical hole
23:支撐螺桿(緊固構件) 23: Support screw (fastening member)
24:螺桿 24: Screw
26:冷卻部 26: Cooling Department
26a:冷卻部 26a: Cooling section
26b:冷卻部 26b: Cooling section
30:防附著構件 30: Anti-adhesion components
Claims (6)
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JP2869159B2 (en) | 1990-07-19 | 1999-03-10 | 富士通株式会社 | Screws for fixing the protection plate |
US5527439A (en) * | 1995-01-23 | 1996-06-18 | The Boc Group, Inc. | Cylindrical magnetron shield structure |
JPH1060624A (en) * | 1996-08-20 | 1998-03-03 | Matsushita Electric Ind Co Ltd | Sputtering device |
JP2000054124A (en) * | 1998-08-07 | 2000-02-22 | Matsushita Electric Ind Co Ltd | Mask arranging apparatus and sputtering apparatus |
JP2000096222A (en) * | 1998-09-28 | 2000-04-04 | Hitachi Ltd | Film forming device |
JP2001335930A (en) | 2000-05-25 | 2001-12-07 | Matsushita Electric Ind Co Ltd | Thin film deposition system |
JP2002363743A (en) | 2001-06-08 | 2002-12-18 | Matsushita Electric Ind Co Ltd | Sputtering device |
JP4519416B2 (en) | 2003-04-21 | 2010-08-04 | 日鉱金属株式会社 | Anti-contamination device for thin film forming equipment |
JP2005139488A (en) * | 2003-11-05 | 2005-06-02 | Ulvac Japan Ltd | Sputtering apparatus |
KR101082866B1 (en) | 2004-12-21 | 2011-11-11 | 알박 싱가포르 피티이 리미티드 | Film forming mask and mask assembly jig |
US7713390B2 (en) * | 2005-05-16 | 2010-05-11 | Applied Materials, Inc. | Ground shield for a PVD chamber |
WO2010013476A1 (en) * | 2008-07-31 | 2010-02-04 | キヤノンアネルバ株式会社 | Plasma processing apparatus and method for manufacturing electronic device |
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