TWI770806B - The base of the voice coil motor - Google Patents
The base of the voice coil motor Download PDFInfo
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- TWI770806B TWI770806B TW110104249A TW110104249A TWI770806B TW I770806 B TWI770806 B TW I770806B TW 110104249 A TW110104249 A TW 110104249A TW 110104249 A TW110104249 A TW 110104249A TW I770806 B TWI770806 B TW I770806B
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Abstract
本發明為一種音圈馬達的基座，該音圈馬達包括一框件，在該框件上設有一用來承接該光學鏡片組的電磁線圈組、複數用來與該電磁線圈組產生場反應的磁石；該基座透過一個以上彈性元件與該框件連接；以及，該基座至少在與該其中兩個相鄰磁石對應的位置，分別設置一用來感測磁場變化的霍爾半導體晶片，該基座表面設有複數分別與該電磁線圈組及各該霍爾半導體晶片電氣連接的電路接點。俾有效縮短基座與框件的間距，大幅縮減音圈馬達高度，有助於所應用的攝像頭模組朝微型化發展，提升音圈馬達的市場競爭性。 The present invention relates to a base of a voice coil motor. The voice coil motor includes a frame member. The frame member is provided with an electromagnetic coil assembly for receiving the optical lens assembly, and a plurality of electromagnetic coil assemblies for generating a field reaction with the electromagnetic coil assembly. The base is connected with the frame through one or more elastic elements; and the base is provided with a Hall semiconductor chip for sensing magnetic field changes at least at positions corresponding to the two adjacent magnets. , the surface of the base is provided with a plurality of circuit contacts which are respectively electrically connected with the electromagnetic coil group and each of the Hall semiconductor chips. In order to effectively shorten the distance between the base and the frame, and greatly reduce the height of the voice coil motor, it is conducive to the miniaturization of the applied camera module and improves the market competitiveness of the voice coil motor.
Description
本發明與使用在攝像頭模組的音圈馬達有關，旨在提供音圈馬達一種能夠大幅縮減音圈馬達高度，有助於攝像頭模組朝微型化發展的基座。 The invention relates to a voice coil motor used in a camera module, and aims to provide a base for the voice coil motor that can greatly reduce the height of the voice coil motor and help the camera module to develop towards miniaturization.
坊間的智慧型手機為了滿足在拍攝照片或影片時能夠確保圖片或影像不會因為晃動而模糊不清，皆陸續引入鏡頭的防手震技術；在已知的鏡頭防手震技術當中，OIS(光學防手震)利用內置的光學鏡片組與圖像傳感器相對水平或上下的動作來逆向修正，可靠性較高且不會犧牲影像的解析度。 In order to ensure that the pictures or images will not be blurred due to shaking when taking photos or videos, smartphones in the market have gradually introduced the anti-shake technology of the lens; among the known anti-shake technologies of the lens, OIS ( Optical anti-shake) Use the built-in optical lens group and the image sensor to move horizontally or vertically to reverse the correction, with high reliability and without sacrificing the resolution of the image.
如[圖1]所示，一般智慧型手機普遍習用具自動變焦(AF)及OIS防手震功能的攝像頭模組(CCM)，主要係在一結合有光學鏡片組10的音圈馬達20與一圖像傳感器30之間設置分別用以感測音圈馬達20水平橫向、水平縱向偏移程度的位置感測元件26，另由搭配的驅動元件(圖略)帶動該音圈馬達20逆向修正篇移的程度。
As shown in FIG. 1 , a camera module (CCM) with automatic zoom (AF) and OIS anti-shake function is commonly used in smart phones, which is mainly connected to a
再者，類似應用在智慧型手機、平板電腦或筆記性型電腦的攝像頭模組(CCM)結構，為能滿足不同產品定位差異的開
發需求，上述該音圈馬達20用以驅動光學鏡片組10產生自動變焦功能的電磁線圈組22、磁石23係裝配在一框件21上，另透過數量不等的彈性元件24將該框件21與一基座25連接，至於位置感測元件26則以能夠感測到磁石23磁場變化的型態固設在該基座25處，成為一可視需求搭配不同光學鏡片組10或圖像傳感器30規格使用的音圈馬達設計。
Furthermore, similar to the camera module (CCM) structure used in smart phones, tablet computers or notebook computers, in order to meet the development of different product positioning differences.
According to the requirements, the above-mentioned
然而，習用整合有自動變焦(AF)及OIS防手震功能的音圈馬達，大多採用將整個完成封裝的位置感測元件26成品焊接在基座25表面的結構設計，其基座25表面必須再額外附加位置感測元件26之底座261的厚度、內部霍爾半導體晶片262的厚度、霍爾半導體晶片262上方封裝線材263的厚度、封裝外殼264的厚度，相對增加基座25與框件21之間的距離，導致音圈馬達20的整體高度無法滿足攝像頭模組的微型化設計需求進而失去市場競爭性。
However, conventional voice coil motors integrated with automatic zoom (AF) and OIS anti-shake functions mostly adopt a structural design in which the entire packaged position sensing
本發明之主要目的，即在提供音圈馬達一種能夠大幅縮減音圈馬達高度，有助於攝像頭模組朝微型化發展的基座。 The main purpose of the present invention is to provide a base for the voice coil motor that can greatly reduce the height of the voice coil motor and help the development of the camera module towards miniaturization.
為了達到上述目的，本發明提供一種音圈馬達的基座，該音圈馬達用來與一光學鏡片組及一圖像傳感器整合成一攝像頭模組；該音圈馬達包括一框件，在該框件上設有一用來承接該光學鏡片組的電磁線圈組、複數用來與該電磁線圈組產生場反應的磁石；該基座透過一個以上彈性元件與該框件連接；其中： 該基座至少在與該其中兩個相鄰磁石對應的位置，分別設置一用來感測磁場變化的霍爾半導體晶片，該基座表面設有複數分別與該電磁線圈組及各該霍爾半導體晶片電氣連接的電路接點。 In order to achieve the above object, the present invention provides a base for a voice coil motor, the voice coil motor is used to integrate with an optical lens group and an image sensor to form a camera module; the voice coil motor includes a frame, in which the frame is The element is provided with an electromagnetic coil group for receiving the optical lens group, and a plurality of magnets for generating field reaction with the electromagnetic coil group; the base is connected with the frame element through one or more elastic elements; wherein: The base is provided with a Hall semiconductor chip for sensing magnetic field changes at least at positions corresponding to the two adjacent magnets. Circuit contacts for electrical connection of semiconductor wafers.
本發明音圈馬達的基座透過將該些霍爾半導體晶片與該對應的電路接點電氣連接，縮短該基座與該框件的間距，大幅縮減音圈馬達高度，有助於所應用的攝像頭模組朝微型化發展，提升市場競爭性。 The base of the voice coil motor of the present invention shortens the distance between the base and the frame member by electrically connecting the Hall semiconductor chips with the corresponding circuit contacts, greatly reducing the height of the voice coil motor, which is conducive to the application of The camera module is developing towards miniaturization, which improves market competitiveness.
依據上述技術特徵，各該霍爾半導體晶片底面透過焊料與對應的電路接點電氣連接。 According to the above technical features, the bottom surfaces of the Hall semiconductor chips are electrically connected to the corresponding circuit contacts through solder.
依據上述技術特徵，各該霍爾半導體晶片底面透過焊料與對應的電路接點電氣連接，且在各該霍爾半導體晶片處設有將霍爾半導體晶片遮蔽的絕緣材料。 According to the above technical features, the bottom surface of each Hall semiconductor chip is electrically connected to the corresponding circuit contacts through solder, and an insulating material for shielding the Hall semiconductor chip is provided at each Hall semiconductor chip.
依據上述技術特徵，各該霍爾半導體晶片底部透過接著材料與該基座接合，各該霍爾半導體晶片頂面透過線材與對應的電路接點電氣連接。 According to the above technical features, the bottom of each Hall semiconductor chip is bonded to the base through an adhesive material, and the top surface of each Hall semiconductor chip is electrically connected to the corresponding circuit contacts through wires.
依據上述技術特徵，各該霍爾半導體晶片底部透過接著材料與該基座接合，各該霍爾半導體晶片頂面透過線材與對應的電路接點電氣連接，且在各該霍爾半導體晶片處設有將霍爾半導體晶片及線材遮蔽的絕緣材料。 According to the above technical features, the bottom of each Hall semiconductor chip is bonded to the base through a bonding material, the top surface of each Hall semiconductor chip is electrically connected with the corresponding circuit contacts through wires, and each Hall semiconductor chip is provided with There are insulating materials that shield the Hall semiconductor chips and wires.
依據上述技術特徵，該基座相對於各該霍爾半導體晶片的位置，凹設有一晶片容置部，該些霍爾半導體晶片個別設 在該些晶片容置部中。 According to the above technical features, the base is concavely provided with a chip accommodating portion relative to the position of each of the Hall semiconductor chips, and the Hall semiconductor chips are individually provided. in the wafer accommodating portions.
依據上述技術特徵，該些電路接點繞過該基座側面延伸至與該框件相對應的另一側表面。 According to the above technical features, the circuit contacts extend around the side surface of the base to the other side surface corresponding to the frame member.
依據上述技術特徵，該些電路接點貫穿該基座外露於與該框件相對應的另一側表面。 According to the above technical features, the circuit contacts are exposed to the other side surface corresponding to the frame through the base.
依據上述技術特徵，該電磁線圈組的上下端分別透過一彈性元件與該框件連接。 According to the above technical features, the upper and lower ends of the electromagnetic coil set are respectively connected to the frame through an elastic element.
依據上述技術特徵，該電磁線圈組包括一承接該光學鏡片組的鏡片支架、一繞設在該鏡片支架外圍的電磁線圈。 According to the above technical features, the electromagnetic coil assembly includes a lens holder for receiving the optical lens assembly, and an electromagnetic coil wound around the periphery of the lens holder.
依據上述技術特徵，該鏡片支架的上下端分別透過一彈性元件與該框件連接。 According to the above technical features, the upper and lower ends of the lens holder are respectively connected to the frame through an elastic element.
與先前技術相較，本發明音圈馬達的基座，主要將該些霍爾半導體晶片與基板上的電路接點電氣連接的型態直接設在該基座上，有效縮短基座與框件的間距，大幅縮減音圈馬達高度，有助於所應用的攝像頭模組朝微型化發展。 Compared with the prior art, the base of the voice coil motor of the present invention is mainly arranged on the base in which the Hall semiconductor chips are electrically connected to the circuit contacts on the substrate, which effectively shortens the length of the base and the frame. The distance between them greatly reduces the height of the voice coil motor, which is helpful for the miniaturization of the applied camera module.
甚至，可藉以降低霍爾半導體晶片的封裝成本，縮短電子訊號的傳輸距離，尤適合應用在高速傳輸的電子產品，以相對更為積極、可靠的手段提升音圈馬達的市場競爭性。 In addition, it can reduce the packaging cost of Hall semiconductor chips and shorten the transmission distance of electronic signals. It is especially suitable for high-speed transmission electronic products, and improves the market competitiveness of voice coil motors in a relatively positive and reliable way.
10:光學鏡片組 10: Optical lens group
20:音圈馬達 20: Voice coil motor
21:框件 21: Frame parts
22:電磁線圈組 22: Solenoid coil set
23:磁石 23: Magnet
24:彈性元件 24: Elastic element
25:基座 25: Pedestal
26:位置感測元件 26: Position sensing element
261:底座 261: Base
262:霍爾半導體晶片 262: Hall semiconductor chip
263:封裝線材 263: encapsulation wire
264:封裝外殼 264: Encapsulation shell
30:圖像傳感器 30: Image sensor
40:音圈馬達 40: Voice coil motor
41:框件 41: Frame parts
42:電磁線圈組 42: Solenoid coil set
421:鏡片支架 421: Lens holder
422:電磁線圈 422: Solenoid coil
43:磁石 43: Magnet
44:彈性元件 44: Elastic element
45:基座 45: Pedestal
451:電路接點 451: circuit contacts
452:焊料 452: Solder
453:接著材料 453: Next Material
454:線材 454: Wire
455:絕緣材料 455: Insulation material
456:晶片容置部 456: Chip accommodating part
46:霍爾半導體晶片 46: Hall semiconductor chip
47:彈性元件 47: Elastic element
50:光學鏡片組 50: Optical lens group
60:圖像傳感器 60: Image sensor
圖1 一習用攝像頭模組局部結構示意圖。 Figure 1 is a schematic diagram of the partial structure of a conventional camera module.
圖2 本發明第一實施例局部結構示意圖。 FIG. 2 is a schematic diagram of the partial structure of the first embodiment of the present invention.
圖3 本發明第二實施例局部結構示意圖。 FIG. 3 is a schematic diagram of the partial structure of the second embodiment of the present invention.
圖4 本發明第三實施例局部結構示意圖。 FIG. 4 is a schematic diagram of the partial structure of the third embodiment of the present invention.
圖5 本發明第四實施例局部結構示意圖。 FIG. 5 is a schematic diagram of the partial structure of the fourth embodiment of the present invention.
如[圖2]所示，本發明提供一種音圈馬達40的基座45，該音圈馬達40可以用來與一光學鏡片組50及一圖像傳感器60整合成一攝像頭模組；該音圈馬達40包括一框件41，在該框件41上設有一用來承接該光學鏡片組50的電磁線圈組42、複數用來與該電磁線圈組42產生場反應的磁石43。
As shown in FIG. 2 , the present invention provides a base 45 for a
該基座45透過一個以上彈性元件44與該框件41連接，以及該基座45至少在與該其中兩個相鄰磁石43對應的位置，分別設置一用來感測磁場變化的霍爾半導體晶片46，該基座45表面設有複數分別與該電磁線圈組42及各該霍爾半導體晶片46電氣連接的電路接點451。
The
實施時，該電磁線圈組42的上下端分別透過一彈性元件47與該框件41連接；圖示中，該電磁線圈組42包括一承接該光學鏡片組50的鏡片支架421、一繞設在該鏡片支架421外圍的電磁線圈422，該鏡片支架421的上下端分別透過一彈性元件47與該框件41連接。
During implementation, the upper and lower ends of the
本發明音圈馬達40的基座45透過彈性件44與框件41
構成連接，可與框件41上的電磁線圈組42、磁石43等構件，組合構成一可搭配光學鏡片組50及圖像感測器60的音圈馬達40總成，進而與光學鏡片組50及圖像感測器60整合構成一可使用在智慧型手機、平板電腦或筆記性型電腦等電子產品的攝像頭模組。
The
尤其，將該些霍爾半導體晶片46與對應的電路接點電氣連接的方式設在該基座45上，有效縮短基座45與框件41的間距，大幅縮減音圈馬達40高度，有助於所應用的攝像頭模組朝微型化發展。
In particular, the electrical connection between the Hall semiconductor chips 46 and the corresponding circuit contacts is provided on the
甚至，可藉以降低霍爾半導體晶片46的封裝成本，縮短電子訊號的傳輸距離，尤適合應用在高速傳輸的電子產品，以相對更為積極、可靠的手段提升音圈馬達40的市場競爭性。
In addition, the packaging cost of the
本發明在[圖2]所示的實施例中，可採用各該霍爾半導體晶片46底面透過焊料452與對應的電路接點451電氣連接的型態，將各該霍爾半導體晶片46設於該基座45上。
In the embodiment of the present invention shown in FIG. 2 , the bottom surface of each
上述實施例中，可進一步在各該霍爾半導體晶片46處設有將霍爾半導體晶片46遮蔽的絕緣材料455，透過該絕緣材料455對霍爾半導體晶片46產生設定的屏蔽效果，使整體音圈馬達40結構更為穩固、可靠。
In the above-mentioned embodiment, an insulating
本發明實施時亦可如[圖3]所示，採用各該霍爾半導體晶片46底部透過接著材料453與該基座45接合，且各該霍爾半導體晶片46頂面透過線材454與對應的電路接點451電氣連接的型
態，將各該霍爾半導體晶片46設於該基座45上。
In the implementation of the present invention, as shown in FIG. 3 , the bottom of each
同樣的，[圖3]所示的實施例中，可進一步在各該霍爾半導體晶片46處設有將霍爾半導體晶片46及線材454遮蔽的絕緣材料455，透過該絕緣材料455對霍爾半導體晶片46及線材454產生設定的屏蔽效果。
Similarly, in the embodiment shown in FIG. 3 , an insulating
如[圖4]及[圖5]所示，本發明在上揭不同實施樣態下，可進一步在該基座45相對於各該霍爾半導體晶片46的位置，凹設有一晶片容置部456，該些霍爾半導體晶片46則個別設在該些晶片容置部456中，透過將該些霍爾半導體晶片46個別設在該些晶片容置部456中的結構設計，讓該些霍爾半導體晶片46得以相對深入該基座45，可再更進一步縮短基座45與框件41的間距，並且可藉以提升對霍爾半導體晶片46的屏蔽效果。
As shown in [ FIG. 4 ] and [ FIG. 5 ], in the present invention, under the different embodiments disclosed above, a chip accommodating portion can be further recessed at the position of the base 45 relative to each of the Hall semiconductor chips 46 . 456, the Hall semiconductor chips 46 are individually arranged in the
附帶一提的是，本發明在上揭各種可能實施的樣態下，該些電路接點451可採用[圖4]所示繞過該基座45側面延伸至與該框件41相對應的另一側表面，或者如[圖5]所示貫穿該基座45外露於與該框件41相對應的另一側表面，以符合不同使用對象的設計需求。
Incidentally, under various possible implementations of the present invention, the
具體而言，本發明音圈馬達的基座，主要將該些霍爾半導體晶片與基板上的電路接點電氣連接的型態直接設在該基座上，有效縮短基座與框件的間距，大幅縮減音圈馬達高度，有助於所應用的攝像頭模組朝微型化發展。 Specifically, the base of the voice coil motor of the present invention is mainly arranged on the base in which the Hall semiconductor chips are electrically connected to the circuit contacts on the substrate, thereby effectively shortening the distance between the base and the frame. , which greatly reduces the height of the voice coil motor, which is conducive to the miniaturization of the applied camera module.
甚至，可藉以降低霍爾半導體晶片的封裝成本，縮短電子訊號的傳輸距離，尤適合應用在高速傳輸的電子產品，以相對更為積極、可靠的手段提升音圈馬達的市場競爭性。 In addition, it can reduce the packaging cost of Hall semiconductor chips and shorten the transmission distance of electronic signals. It is especially suitable for high-speed transmission electronic products, and improves the market competitiveness of voice coil motors in a relatively positive and reliable way.
40:音圈馬達 40: Voice coil motor
41:框件 41: Frame parts
42:電磁線圈組 42: Solenoid coil set
421:鏡片支架 421: Lens holder
422:電磁線圈 422: Solenoid coil
43:磁石 43: Magnet
44:彈性元件 44: Elastic element
45:基座 45: Pedestal
451:電路接點 451: circuit contacts
452:焊料 452: Solder
455:絕緣材料 455: Insulation material
46:霍爾半導體晶片 46: Hall semiconductor chip
47:彈性元件 47: Elastic element
50:光學鏡片組 50: Optical lens group
60:圖像傳感器 60: Image sensor
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110104249A TWI770806B (en) | 2021-02-04 | 2021-02-04 | The base of the voice coil motor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110104249A TWI770806B (en) | 2021-02-04 | 2021-02-04 | The base of the voice coil motor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI770806B true TWI770806B (en) | 2022-07-11 |
| TW202232858A TW202232858A (en) | 2022-08-16 |
Family
ID=83439289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110104249A TWI770806B (en) | 2021-02-04 | 2021-02-04 | The base of the voice coil motor |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI770806B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201443546A (en) * | 2013-05-10 | 2014-11-16 | Tdk Taiwan Corp | Optical image stabilizer |
| CN110082984A (en) * | 2018-01-25 | 2019-08-02 | 台湾东电化股份有限公司 | Lens unit |
| TW201947269A (en) * | 2018-05-03 | 2019-12-16 | 大陽科技股份有限公司 | Lens assembly actuating module and electronic device |
| EP3706298A1 (en) * | 2014-03-05 | 2020-09-09 | LG Innotek Co., Ltd. | Lens driving device and camera module comprising same |
-
2021
- 2021-02-04 TW TW110104249A patent/TWI770806B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201443546A (en) * | 2013-05-10 | 2014-11-16 | Tdk Taiwan Corp | Optical image stabilizer |
| EP3706298A1 (en) * | 2014-03-05 | 2020-09-09 | LG Innotek Co., Ltd. | Lens driving device and camera module comprising same |
| CN110082984A (en) * | 2018-01-25 | 2019-08-02 | 台湾东电化股份有限公司 | Lens unit |
| TW201947269A (en) * | 2018-05-03 | 2019-12-16 | 大陽科技股份有限公司 | Lens assembly actuating module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202232858A (en) | 2022-08-16 |
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