TWI769687B - Joint structure, joint module and method of assembling joint structure to object - Google Patents
Joint structure, joint module and method of assembling joint structure to object Download PDFInfo
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Abstract
本發明係提供一種接合結構、接合模組及接合結構組裝於物體之方法，其包含身部以及作動件。作動件與身部活動組合，作動件具有第一接合部，第一接合部位於身部之外側，第一接合部可進行縱向活動、橫向活動或旋向活動。藉此，可使本發明之身部、作動件或第一接合部之配合，而組合於第一物體與第二物體，或脫離於第一物體與第二物體，以達到完成至少兩物體之組合或分離之功效。 The present invention provides a joint structure, a joint module and a method for assembling the joint structure to an object, which includes a body and an actuating member. The actuating member is combined with the body to move, the actuating member has a first joint portion, the first joint portion is located on the outer side of the body portion, and the first joint portion can perform longitudinal movement, lateral movement or rotational movement. In this way, the body, the actuating part or the first joint part of the present invention can be combined with the first object and the second object, or separated from the first object and the second object, so as to achieve the completion of the at least two objects. Efficacy of combination or separation.
Description
本發明係提供一種接合結構、接合模組及接合結構組裝於物體之方法，尤指一種可完成至少兩物體之組合或分離之功效的接合結構、接合模組及接合結構組裝於物體之方法。 The present invention provides a joint structure, a joint module and a method for assembling the joint structure to an object, especially a joint structure, joint module and joint structure assembling method for an object that can complete the combination or separation of at least two objects.
一般當至少兩第一物體組合時，通常以螺絲或鎖件進行鎖接，以作為第一物體之組合。 Generally, when at least two first objects are combined, screws or locks are usually used for locking to serve as the combination of the first objects.
雖然此方式可將兩第一物體加以組合，但組合後便有無法移動或分離之情形，使得螺絲或鎖件較不符合實際運用之需求。 Although the two first objects can be combined in this way, there is a situation in which they cannot be moved or separated after the combination, so that the screw or the locking piece is less suitable for practical use.
有鑑於上述習知技術，發明人研發出一種接合結構、接合模組及接合結構組裝於物體之方法，以期可組合於第一物體與第二物體，或脫離於第一物體與第二物體，以達到完成至少兩物體之組合或分離之功效。 In view of the above-mentioned prior art, the inventor has developed a joint structure, a joint module and a method for assembling the joint structure to an object, so as to be able to be combined with the first object and the second object, or separated from the first object and the second object, In order to achieve the effect of completing the combination or separation of at least two objects.
為達上述目的及其他目的，本發明提供一種接合結構，其包含：一身部以及一作動件。該作動件與該身部活動組合，該作動件具有一第一接合部，該第一接合部位於該身部之外側，該第一接合部可進行縱向活動、橫向活動或旋向活動。 In order to achieve the above object and other objects, the present invention provides a joint structure, which includes: a body part and an actuating member. The actuating member is movably combined with the body, the actuating member has a first joint portion, the first joint portion is located on the outer side of the body portion, and the first joint portion can perform longitudinal movement, lateral movement or rotational movement.
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件具有一第一接合部及一桿部，該桿部活動組合於該身部之內側，使該 作動件與該身部活動組合，該第一接合部位於該身部之外側，該第一接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member has a first joint portion and a rod portion, and the rod portion is movably assembled on the inner side of the body, so that the The actuating piece is movably combined with the body, the first engaging portion is located on the outer side of the body, and the first engaging portion can perform longitudinal movement, lateral movement or rotational movement.
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件具有一第一接合部、一桿部、一擋止部及一彈性元件，該桿部活動組合於該身部之內側，使該作動件與該身部活動組合，該第一接合部位於該身部之外側，該彈性元件之一端擋抵於該身部，該彈性元件之另一端擋抵於該擋止部，該第一接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member has a first engaging portion, a rod portion, a blocking portion and an elastic element. The rod portion is movably assembled on the inner side of the body, so that the actuating member and the body are movably assembled, and the first engagement The part is located on the outer side of the body, one end of the elastic element is blocked against the body, the other end of the elastic element is blocked against the blocking part, and the first engaging part can perform longitudinal movement, lateral movement or rotational movement .
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件具有一第一接合部、一桿部及一第二接合部，該桿部活動組合於該身部之內側，使該作動件與該身部活動組合，該第一接合部位於該身部之外側，該第二接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member has a first joint portion, a rod portion and a second joint portion, the rod portion is movably assembled on the inner side of the body, so that the actuating member and the body are movably assembled, and the first joint portion is located at the inner side of the body. On the outside of the body, the second joint can perform longitudinal movement, lateral movement or rotational movement.
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件具有一第一接合部、一桿部、一彈性元件及一第二接合部，該桿部活動組合於該身部之內側，使該作動件與該身部活動組合，該第一接合部位於該身部之外側，該彈性元件之一端擋抵於該身部，該彈性元件之另一端擋抵於該第二接合部，該第二接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member has a first joint portion, a rod portion, an elastic element and a second joint portion. The rod portion is movably assembled inside the body portion, so that the actuating member and the body portion can be movably combined. The engaging portion is located on the outer side of the body, one end of the elastic element is blocked against the body, and the other end of the elastic element is blocked against the second engaging portion, and the second engaging portion can perform longitudinal movement, lateral movement or rotation. to the activity.
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件與該身部活動組合，該作動件具有一第二接合部，該第二接合部位於該身部之內側或外側，該第二接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member is movably combined with the body, the actuating member has a second joint portion, the second joint portion is located on the inner side or the outer side of the body portion, and the second joint portion can perform longitudinal movement, lateral movement or rotational movement .
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件具有一第二接合部及一桿部，該桿部活動組合於該身部之內側，使該 作動件與該身部活動組合，該第二接合部位於該身部之內側或外側，該第二接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member has a second joint portion and a rod portion, and the rod portion is movably assembled on the inner side of the body, so that the The actuating piece is movably combined with the body, the second joint portion is located at the inner side or the outer side of the body portion, and the second joint portion can perform longitudinal movement, lateral movement or rotational movement.
本發明另提供一種接合結構，其包含：一身部以及一作動件。該作動件具有一第二接合部、一桿部、一擋止部及一彈性元件，該桿部活動組合於該身部之內側，使該作動件與該身部活動組合，該第二接合部位於該身部之內側或外側，該彈性元件之一端擋抵於該身部，該彈性元件之另一端擋抵於該擋止部，該第二接合部可進行縱向活動、橫向活動或旋向活動 The present invention further provides a joint structure, which includes: a body and an actuating member. The actuating member has a second engaging portion, a rod portion, a blocking portion and an elastic element. The rod portion is movably assembled on the inner side of the body, so that the actuating member and the body are movably assembled, and the second engagement The part is located on the inner or outer side of the body, one end of the elastic element is blocked against the body, the other end of the elastic element is blocked against the blocking part, and the second engaging part can perform longitudinal movement, lateral movement or rotation to the activity
本發明另提供一種接合結構之組裝方法，其係將部分之該作動件與該身部活動組合，以使該作動件之第一接合部位於該身部之外側，並使該第一接合部可進行縱向活動、橫向活動或旋向活動。 The present invention further provides an assembling method of a joint structure, which is to movably combine a part of the actuating member with the body, so that the first joint portion of the actuating member is located outside the body, and the first joint portion is Vertical, horizontal or rotational movements are possible.
本發明另提供一種接合結構組裝於物體之方法，其包含下列步驟：提供一取置工具取起該接合結構；使該取置工具移動該接合結構至該物體的組裝位置；用以使該接合結構下落至該物體的組裝位置。 The present invention further provides a method for assembling a joint structure to an object, which comprises the following steps: providing a pick-and-place tool to pick up the joint structure; making the pick-and-place tool move the joint structure to the assembly position of the object; The structure falls to the assembly position of the object.
本發明另提供一種接合結構組裝於物體之方法，包含下列步驟：提供一取置工具取起該接合結構；使該取置工具移動該接合結構至該物體的組裝位置；使該取置工具放開或鬆開該接合結構，以使該接合結構組裝至該物體的組裝位置。 The present invention further provides a method for assembling a joint structure to an object, comprising the following steps: providing a pick-and-place tool to pick up the joint structure; making the pick-and-place tool move the joint structure to the assembly position of the object; The engaging structure is opened or released so that the engaging structure is assembled to the assembly position of the object.
本發明另提供一種接合結構組裝於物體之方法，包含下列步驟：提供一取置工具取起該接合結構；使該取置工具移動該接合結構至該物體的組裝位置上；該取置工具下壓該接合結構於該物體用以使該接合結構放置至該物體的組裝位置。 The present invention further provides a method for assembling a joint structure to an object, comprising the following steps: providing a pick-and-place tool to pick up the joint structure; making the pick-and-place tool move the joint structure to the assembly position of the object; Pressing the joint structure on the object enables the joint structure to be placed in the assembly position of the object.
本發明另提供一種接合結構組裝於物體之方法，包含下列步驟：提供一取置工具取起該接合結構；使該取置工具移動該接合結構至該物體的組裝位置；以及該取置工具彈性下壓該接合結構於該物體，用以使該接合結構放置至該物體的組裝位置。 The present invention further provides a method for assembling a joint structure to an object, comprising the following steps: providing a pick-and-place tool to pick up the joint structure; making the pick-and-place tool move the joint structure to the assembly position of the object; and the pick-and-place tool elastically The joint structure is pressed down on the object, so that the joint structure is placed at the assembly position of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含有一彈性元件，該彈性元件之一端抵頂於該身部，該彈性元件之另一端抵頂於該身部內之作動件，或彈性元件之一端抵頂於該身部，該彈性元件之另一端抵頂於該身部內之桿部，或彈性元件之一端抵頂於該身部，該彈性元件之另一端抵頂於該身部內之第二接合部。 The above-mentioned joint structure, joint module and method for assembling the joint structure to an object further include an elastic element, one end of the elastic element abuts against the body, and the other end of the elastic element abuts against the action in the body or one end of the elastic element is pressed against the body, the other end of the elastic element is pressed against the rod in the body, or one end of the elastic element is pressed against the body, and the other end of the elastic element is pressed against the body a second joint in the body.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該身部具有一組接部，該組接部用以組接於一第一物體。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the body has a set of connecting parts, and the connecting part is used to be assembled with a first object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該組接部具有一容料部，使該身部被外力施壓而擠壓該第一物體，讓該第一物體之材料進入該容料部，以進行該組接部與該第一物體之組裝。 In the above-mentioned joint structure, joint module and joint structure assembly method for an object, the joint part has a material-receiving part, so that the body is pressed by an external force to press the first object, so that the first object can be compressed. The material enters the container portion to perform the assembly of the assembling portion and the first object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該組接部具有一擴接部，使該擴接部被外力施壓型變擴接而與該第一物體進行組裝。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the joint part has an expansion joint part, so that the expansion joint part is compressed and expanded by an external force to be assembled with the first object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該接合結構以一取置工具取起，並經一比對裝置比對距離或位置後放置於一第一物體之組裝位置。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the joint structure is picked up with a pick-and-place tool, and is placed at the assembly position of a first object after comparing the distance or position with a comparison device .
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該身部之表面具有一可焊層，該身部之可焊層用以焊接於一第一物體之一可焊層。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the surface of the body has a solderable layer, and the solderable layer of the body is used for welding to a solderable layer of a first object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該身部具有一可焊層，該身部用以被加熱焊接於一第一物體之一可焊層，該第一物體為PCB板。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure in an object, the body has a solderable layer, and the body is used for being heated and welded to a solderable layer of a first object, the first object for the PCB board.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該身部之可焊層為錫層或鎳層，並於錫層或鎳層內具有一銅層。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure in an object, the solderable layer of the body is a tin layer or a nickel layer, and a copper layer is provided in the tin layer or the nickel layer.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一物體之可焊層為銅層上預設有錫層。 In the above-mentioned method of assembling the bonding structure, the bonding module and the bonding structure to an object, the solderable layer of the first object is a copper layer with a tin layer pre-set.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部或第二接合部具有一扳動部，該扳動部與桿部拴接組合。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the first joint part or the second joint part has a pulling part, and the pulling part is bolted and combined with the rod part.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該扳動部旋動帶動該第一接合部或該第二接合部旋動，並使該桿部上、下活動。 In the method of assembling the above-mentioned joint structure, joint module and joint structure to an object, the rotation of the pulling part drives the first joint part or the second joint part to rotate, and makes the rod part move up and down.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該扳動部橫向與縱向之寬度不同，於旋轉時使該桿部呈不同距離移動。 In the above-mentioned method of assembling the joint structure, joint module and joint structure to an object, the width of the pulling portion is different in the lateral direction and the vertical direction, and the rod portion moves at different distances during rotation.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該扳動部橫向與縱向之寬度相同，於旋轉時使該桿部呈相同距離移動。 In the above-mentioned joint structure, joint module and joint structure assembly method, the width of the pulling portion is the same in the horizontal direction and the vertical direction, and the rod portion is moved at the same distance during rotation.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該扳動部於旋轉時驅動第二接合部活動。 In the above-mentioned method of assembling the joint structure, the joint module and the joint structure to an object, the pulling part drives the second joint part to move when it rotates.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部與第二接合部可同時進行扣接以及同時進行解扣。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the first joint part and the second joint part can be buckled and released at the same time.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部與第二接合部可分別進行扣接以及分別進行解扣。 In the above-mentioned method of assembling the joint structure, the joint module and the joint structure to an object, the first joint part and the second joint part can be respectively buckled and respectively released.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部之數量為一個、兩個或兩個以上。 In the above-mentioned method of assembling the joint structure, the joint module and the joint structure to an object, the number of the first joint portion is one, two or more.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部可穿過一第一物體之扣入部而扣入一第二物體。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the first joint portion can pass through the buckle portion of a first object to fasten a second object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部可進行縱向扣接、橫向扣接或旋向扣接。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the first joint portion can be fastened longitudinally, laterally or rotationally.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，彈性元件常態抵頂於該身部與該作動件，使該作動件之第一接合部、擋止部或第二接合部常態處於被彈力推動，而往下施以往復彈力。 In the above-mentioned method of assembling the joint structure, joint module and joint structure to an object, the elastic element normally presses against the body and the actuating member, so that the first joint portion, the stop portion or the second joint portion of the actuating member is The normal state is to be pushed by the elastic force, while the downward reciprocating elastic force is applied.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部為一散熱元件，用以先上移後下壓至一發熱之電子元件，以協助進行散熱或協助電子元件之訊號穩定傳輸。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure to an object, the first bonding portion is a heat-dissipating element, which is used to move up and then press down to a heat-generating electronic element, so as to assist in heat dissipation or assist electronic The signal of the component is transmitted stably.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部上移後放入一散熱元件至該作動件於一發熱之電子元件之間，以協助進行散熱。 In the above-mentioned method of assembling the bonding structure, the bonding module and the bonding structure to an object, the first bonding portion is moved upward and then a heat dissipation element is placed between the actuator and a heat generating electronic element to assist heat dissipation.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該散熱元件為散熱片、散熱器、散熱膏或散熱液。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure in an object, the heat dissipation element is a heat dissipation fin, a heat sink, a heat dissipation paste or a heat dissipation liquid.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部上可堆疊一散熱元件或一散熱物質。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure to an object, a heat dissipation element or a heat dissipation material can be stacked on the first bonding portion.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部具有一限位結構，該限位結構用以限位一散熱元件、一散熱物質或一發熱之電子元件。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure to an object, the first bonding portion has a limiting structure, and the limiting structure is used to limit a heat dissipation element, a heat dissipation material or a heat-generating electronic element .
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該作動件與該身部之間具有一浮動限制部，該浮動限制部限制該身部之浮動量，使該身部設於一第一物體之組接位置。 In the above-mentioned joint structure, joint module and joint structure assembly method, a floating restricting portion is arranged between the actuating member and the body, and the floating restricting portion restricts the floating amount of the body, so that the body can be set. at the assembly position of a first object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該作動件具有一穿設部，該第一接合部可下壓使一散熱元件設於該穿設部。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the actuating member has a through portion, and the first joint portion can be pressed down so that a heat dissipation element is disposed in the through portion.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該作動件之桿部為擴接結構、鉚接結構或鎖接結構，以結合至該作動件之設置部，或該作動件與桿部一體成型。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the rod portion of the actuator is an expansion structure, a riveting structure or a locking structure, so as to be coupled to the setting portion of the actuator, or the actuator Formed in one piece with the stem.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部設有一散熱元件或一冷卻裝置，或該第一接合部為一散熱元件或一冷卻裝置，該散熱元件或該冷卻裝置用以冷卻或散熱一電子元件。 In the above-mentioned bonding structure, bonding module and method for assembling the bonding structure to an object, the first bonding portion is provided with a heat dissipation element or a cooling device, or the first bonding portion is a heat dissipation element or a cooling device, the heat dissipation element Or the cooling device is used to cool or dissipate an electronic component.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該作動件為一旋動體，使該作動件旋動提起拴接之桿部後組接於一第三物體，並下壓接合於一散熱元件或一發熱之電子元件。 In the method of assembling the above-mentioned joint structure, joint module and joint structure to an object, the actuating member is a rotating body, so that the actuating member is rotated to lift the rod portion of the bolt and then assembled to a third object, and then lowered. Press-bonded to a heat-dissipating element or a heat-generating electronic element.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該作動件具有一組接部，該組接部組接於該第三物體之組接部。 In the above-mentioned joint structure, joint module and method for assembling the joint structure into an object, the actuating member has a set of connecting parts, and the connecting part is assembled with the connecting part of the third object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該接合結構組接於一存置體，使該第一接合部扣入一物體，使該物體限位於該存置體，或使該第一接合部上移脫離該物體，使該物體於該存置體脫離。 In the above-mentioned joint structure, joint module and method for assembling the joint structure in an object, the joint structure is assembled with a storage body, so that the first joint portion is buckled into an object, so that the object is confined to the storage body, or The first engaging portion moves upward to disengage the object, so that the object is disengaged from the storage body.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該身部具有一防轉部，該作動件具有一對應防轉部，該防轉部與該對應防轉部對應防轉，且可使該對應防轉部與該防轉部脫離，而旋轉該作動件至該身部之一承靠部，使該作動件停留或暫時停留至該承靠部。 In the above-mentioned joint structure, joint module, and method for assembling the joint structure to an object, the body has an anti-rotation portion, the actuating member has a corresponding anti-rotation portion, and the anti-rotation portion corresponds to the corresponding anti-rotation portion. , and the corresponding anti-rotation part can be disengaged from the anti-rotation part, and the actuating part can be rotated to a bearing part of the body part, so that the actuating part can stay or temporarily stay on the bearing part.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該身部具有一防轉部，該作動件具有一對應防轉部，該防轉部與該對應防轉部對應防轉，且可使該對應防轉部上提後與該防轉部脫離，而旋轉該作動件至該身部之一承靠部，使該作動件停留或暫時停留至該承靠部。 In the above-mentioned joint structure, joint module, and method for assembling the joint structure to an object, the body has an anti-rotation portion, the actuating member has a corresponding anti-rotation portion, and the anti-rotation portion corresponds to the corresponding anti-rotation portion. , and the corresponding anti-rotation part can be lifted up and separated from the anti-rotation part, and the actuating piece can be rotated to a bearing part of the body, so that the actuating piece can stay or temporarily stay on the bearing part.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該防轉部為對應該對應防轉部之切邊、剖邊、剖槽、切槽、凹部、凸部或階部。 In the above-mentioned joint structure, joint module and joint structure assembling method, the anti-rotation portion is a trimming, edge-cut, slot, slot, concave, convex or step corresponding to the corresponding anti-rotation portion.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體的組裝位置或組裝距離；使該取置工具根據該比對裝置的比對訊息，用以使該接合結構組裝至該物體的組裝位置。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further includes the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object Or the assembly distance; the pick-and-place tool is used to assemble the joint structure to the assembly position of the object according to the comparison information of the comparison device.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體之組裝位置之一可焊層的位置或距離；使該取置工具根據該比對 裝置的比對訊息，移動該接合結構至該物體之可焊層，用以使該接合結構組裝至該物體之可焊層。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further includes the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object the position or distance of one of the solderable layers; make the pick and place tool according to the comparison The comparison information of the device moves the bonding structure to the solderable layer of the object, so that the bonding structure is assembled to the solderable layer of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體的組裝位置或組裝距離；使該取置工具根據該比對裝置的比對訊息，移動該接合結構至該物體的組裝位置上的預設高度；使該取置工具放開或鬆開該接合結構，以使該接合結構組裝至該物體的組裝位置。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further includes the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object or assembly distance; make the pick-and-place tool move the joint structure to a preset height on the assembly position of the object according to the comparison information of the comparison device; make the pick-and-place tool release or release the joint structure to The engaging structure is assembled to the assembly position of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體之組裝位置之一可焊層的位置或距離；使該取置工具根據該比對裝置的比對訊息，移動該接合結構至該物體之可焊層上的預設高度；使該取置工具放開或鬆開該接合結構，以使該接合結構組裝至該物體之可焊層。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further includes the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object position or distance of a solderable layer; make the pick-and-place tool move the bonding structure to a preset height on the solderable layer of the object according to the comparison information of the comparison device; make the pick-and-place tool release or The bonding structure is released so that the bonding structure is assembled to the solderable layer of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部或第二接合部為柱體、桿體、扣體、螺紋體、凸扣體、內扣體或彈扣體。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the first joint part or the second joint part is a cylinder, a rod, a buckle, a screw, a male buckle, an inner buckle or a spring Buckle.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，第一接合部具有一扣部，該扣部與該第一接合部固定組合。 In the above-mentioned joint structure, joint module and method of assembling the joint structure to an object, the first joint part has a buckle part, and the buckle part is fixedly combined with the first joint part.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該扣部為金屬材質或塑膠材質，該第一接合部為塑膠材質或金屬材質。 In the above-mentioned joint structure, joint module and method for assembling the joint structure to an object, the buckle portion is made of metal material or plastic material, and the first joint portion is made of plastic material or metal material.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，第一接合部為塑膠材質或金屬材質。 In the above-mentioned method of assembling the joint structure, the joint module and the joint structure to the object, the first joint part is made of plastic material or metal material.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體的組裝位置或組裝距離；使該取置工具根據該比對裝置的比對訊息，移動該接合結構至該物體的組裝位置；以及該取置工具下壓該接合結構於該物體，用以使該接合結構放置至該物體的組裝位置。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further comprises the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object or assembly distance; make the pick-and-place tool move the joint structure to the assembly position of the object according to the comparison information of the comparison device; and the pick-and-place tool presses the joint structure down on the object to make the joint structure Place in the assembly position of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體之組裝位置之一可焊層的位置或距離；使該取置工具根據該比對裝置的比對訊息，移動該接合結構至該物體之可焊層；以及該取置工具下壓該接合結構於該物體，用以使該接合結構放置至該物體的組裝位置。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further includes the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object the position or distance of a solderable layer; make the pick-and-place tool move the bonding structure to the solderable layer of the object according to the comparison information of the comparison device; and the pick-and-place tool presses the bonding structure to the object , for placing the joint structure in the assembly position of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體的組裝位置或組裝距離；使該取置工具根據該比對裝置的比對訊息，移動該接合結構至該物體的組裝位置；以及該取置工具彈性下壓該接合結構於該物體，用以使該接合結構放置至該物體的組裝位置。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further comprises the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object or assembly distance; make the pick-and-place tool move the joint structure to the assembly position of the object according to the comparison information of the comparison device; and the pick-and-place tool elastically presses the joint structure on the object to make the joint structure The structure is placed into the assembly position of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，更包含下列步驟：該取置工具取起該接合結構後，提供一比對裝置比對該接合結構與該物體之組裝位置之一可焊層的位置或距離；使該取置工具根據該比對裝置的比對訊息，移動該接合結構至該物體之可焊層；以及該取置工具彈性下壓該接合結構於該物體，用以使該接合結構放置至該物體的組裝位置。 The above-mentioned method for assembling the joint structure, joint module and joint structure to an object further includes the following steps: after the pick-and-place tool picks up the joint structure, a comparison device is provided to compare the assembly positions of the joint structure and the object the position or distance of a solderable layer; make the pick-and-place tool move the bonding structure to the solderable layer of the object according to the comparison information of the comparison device; and the pick-and-place tool elastically presses the bonding structure to the solderable layer of the object an object for placing the joint structure in the assembly position of the object.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該作動件具有受壓部，該受壓部與桿部組合、該受壓部與桿部活動組合、或受壓部與桿部一體成型。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the actuating member has a pressure-receiving part, the pressure-receiving part is combined with the rod part, the pressure-receiving part and the rod part are movably combined, or the pressure-receiving part is combined with the rod part. The rod is integrally formed.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該受壓部與桿部鉚接組合。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the pressure-receiving portion and the rod portion are riveted and assembled.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該受壓部與桿部擴接組合。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the pressure-receiving portion and the rod portion are expanded and combined.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該受壓部之組裝方法為，該受壓部先在模具內結合塑膠射出成形之第一接合部，之後再與該桿部鉚接組合或擴接組合。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the assembling method of the pressure-receiving part is as follows: the pressure-receiving part is first combined with the first joint part of plastic injection molding in the mold, and then is combined with the rod. Partial riveting combination or expansion combination.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該受壓部之組裝方法為，第一接合部或第二接合部先在模具內以塑膠射出成型，再使該第一接合部或第二接合部於該受壓部與該身部之間限位組合。 In the above-mentioned method of assembling the joint structure, joint module and joint structure to an object, the assembly method of the pressure-receiving part is as follows: firstly the first joint part or the second joint part is injection-molded with plastic in a mold, and then the first joint part or the second joint part is formed by plastic injection molding. The joint portion or the second joint portion is limited and combined between the pressure-receiving portion and the body.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該第一接合部或第二接合部於該模具內射出或塑膠射出，使液態之材料或液態之塑膠材料於流道中進入該模具，藉以冷卻後形成該第一接合部或第二接合部。 In the method of assembling the above-mentioned joint structure, joint module and joint structure to an object, the first joint part or the second joint part is injected into the mold or plastic is injected, so that the liquid material or the liquid plastic material enters the flow channel The mold is cooled to form the first joint portion or the second joint portion.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該受壓部與該身部為金屬材質，用以於外力施壓於受壓部與身部用以進行鉚接組合或擴接組合於一第一物體時承受施壓之外力。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the pressure-receiving part and the body part are made of metal materials, which are used to press the pressure-receiving part and the body part by external force for riveting combination or expansion. When the connection is combined with a first object, it is subjected to external pressure.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該受壓部高於第一接合部之表面，以用以於外力施壓時使該受壓部先承受施壓之外力。 In the method for assembling the above-mentioned joint structure, joint module and joint structure to an object, the pressure-receiving part is higher than the surface of the first joint part, so that the pressure-receiving part can first bear the external force when the external force is applied. .
上述之接合結構、接合模組及接合結構組裝於物體之方法中，第一接合部或第二接合部具有一扣部，該扣部為金屬材質，該第一接合部或第二接合部為塑膠材質，並該第一接合部或第二接合部與該扣部以塑膠埋入模具射出組合、鉚接組合、擴接組合或卡接組合。 In the above-mentioned joint structure, joint module and joint structure assembly method, the first joint part or the second joint part has a buckle part, the buckle part is made of metal material, and the first joint part or the second joint part is Plastic material, and the first joint part or the second joint part and the buckle part are assembled by injection molding, riveting combination, expansion joint combination or snap joint combination with a plastic embedded mold.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，第一接合部或第二接合部具有一扣部，該扣部為金屬材質，該第一接合部或第二接合部於模具內使液態之塑膠於流道內進入模腔，藉以於冷卻後使該第一接合部與該扣部組合。 In the above-mentioned joint structure, joint module and method of assembling the joint structure to an object, the first joint part or the second joint part has a buckle part, the buckle part is made of metal, and the first joint part or the second joint part is In the mold, the liquid plastic enters the mold cavity in the flow channel, so that the first joint portion and the buckle portion are combined after cooling.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該接合結構組接於一存置體，使該第一接合部或第二接合部扣入一物體，使該物體限位於該存置體，或使該第一接合部或第二接合部上移脫離該物體，使該物體於該存置體脫離。 In the above-mentioned joint structure, joint module and joint structure assembly method for an object, the joint structure is assembled to a storage body, so that the first joint part or the second joint part is buckled into an object, so that the object is limited to the The storage body, or the first joint part or the second joint part is moved upward to disengage the object, so that the object is disengaged from the storage body.
上述之接合結構、接合模組及接合結構組裝於物體之方法中，該接合結構組接於一第一物體或與一第一物體一體成型，其中該第一物體為機殼、機箱、箱體、主機板、軌道、PCB板、電腦、記憶體、金屬件或塑膠件，或該接合結構組接於一存置體，使該第一接合部或第二接合部扣入一物體，使該物體限位於該存置體，或使該第一接合部或第二接合部上移脫離該物體，使該物體於該存置體脫離，其中該存置體為機殼、機箱、箱體、主機板、軌道、PCB板、電腦、記憶體、金屬件或塑膠件。 In the above-mentioned joint structure, joint module and joint structure assembly method in an object, the joint structure is assembled with a first object or integrally formed with a first object, wherein the first object is a casing, a case, a box body , a motherboard, a rail, a PCB board, a computer, a memory, a metal part or a plastic part, or the joint structure is assembled in a storage body, so that the first joint part or the second joint part is buckled into an object, so that the object Limit to the storage body, or move the first joint part or the second joint part up to disengage the object, so that the object is disengaged from the storage body, wherein the storage body is a casing, a case, a box, a motherboard, a rail , PCB board, computer, memory, metal parts or plastic parts.
藉此，本發明之接合結構、接合模組及接合結構組裝於物體之方法，可使本發明之身部、作動件或第一接合部之配合，而組合於第一物體與第二物體，或脫離於第一物體與第二物體，以達到完成至少兩物體之組合或分離的目的。 Therefore, the joint structure, joint module and joint structure of the present invention can be assembled to the object, so that the body, the actuating element or the first joint part of the present invention can be combined with the first object and the second object, Or separate from the first object and the second object to achieve the purpose of completing the combination or separation of at least two objects.
1:接合結構 1: Joint structure
11:身部 11: Body
111:組接部 111: Assembly Department
112:容料部 112: Material holding department
113:擴接部 113: expansion part
114:防轉部 114: Anti-rotation Department
115:承靠部 115: Relying Department
116:可焊層 116: Solderable layer
12:作動件 12: Actuator
121:第一接合部 121: The first joint
1211:限位結構 1211: Limit structure
1212:穿設部 1212: Wearing Department
1213:設置部 1213: Setup Department
1214:浮動限制部 1214: Floating Limits
1215:組接部 1215: Assembly Department
1216:扣部 1216: Buckle
122:桿部 122: Rod
123:擋止部 123: Stopper
124:彈性元件 124: elastic element
125:扳動部 125: Wrench
126:第二接合部 126: Second joint
127:栓接部 127: Bolting part
128:對應防轉部 128: Corresponding to the anti-rotation department
129:受壓部 129: Pressurized part
10:第一物體 10: The first object
101:扣入部 101: Deduction Department
102:可焊層 102: Solderable layer
20:第二物體 20: Second Object
30:第三物體 30: Third Object
301:組接部 301: Assembly Department
40:電子元件 40: Electronic Components
41:散熱元件 41: Cooling components
50:存置體 50: Deposit
51:物體 51: Objects
60:取置工具 60: Pick and place tool
61:感知器 61: Perceptron
70:比對裝置 70: Comparison device
80:載體 80: Carrier
90:模具 90: Mold
91:流道 91: runner
a:預設高度 a: preset height
[圖1]係本發明接合結構之第一實施例示意圖。 [FIG. 1] is a schematic diagram of the first embodiment of the joint structure of the present invention.
[圖2]係本發明接合結構之第一實施例之使用狀態示意圖。 FIG. 2 is a schematic view of the use state of the first embodiment of the joint structure of the present invention.
[圖3]係本發明接合結構之第二實施例之使用狀態示意圖。 FIG. 3 is a schematic view of the use state of the second embodiment of the joint structure of the present invention.
[圖4]係本發明接合結構之第三實施例之使用狀態示意圖。 FIG. 4 is a schematic diagram of the use state of the third embodiment of the joint structure of the present invention.
[圖5]係本發明接合結構之第四實施例之使用狀態示意圖。 FIG. 5 is a schematic diagram of the use state of the fourth embodiment of the joint structure of the present invention.
[圖6]係本發明接合結構之第五實施例之使用狀態示意圖。 FIG. 6 is a schematic diagram of the use state of the fifth embodiment of the joint structure of the present invention.
[圖7]係本發明接合結構之第六實施例之使用狀態示意圖。 FIG. 7 is a schematic diagram of the use state of the sixth embodiment of the joint structure of the present invention.
[圖8]係本發明接合結構之第七實施例之使用狀態示意圖。 FIG. 8 is a schematic diagram of the use state of the seventh embodiment of the joint structure of the present invention.
[圖9]係本發明接合結構之第八實施例之使用狀態示意圖。 FIG. 9 is a schematic diagram of the use state of the eighth embodiment of the joint structure of the present invention.
[圖10]係本發明接合結構之第九實施例之使用狀態外觀示意圖。 FIG. 10 is a schematic view of the appearance of the ninth embodiment of the joint structure of the present invention in the use state.
[圖11]係本發明接合結構之第十實施例之示意圖。 Fig. 11 is a schematic diagram of the tenth embodiment of the joint structure of the present invention.
[圖12]係本發明接合結構之第十一實施例之使用狀態示意圖一。 12 is a schematic diagram 1 of the use state of the eleventh embodiment of the joint structure of the present invention.
[圖13]係本發明接合結構之第十一實施例之使用狀態示意圖二。 FIG. 13 is a second schematic diagram of the use state of the eleventh embodiment of the joint structure of the present invention.
[圖14]係本發明接合結構之第十二實施例之使用狀態示意圖。 Fig. 14 is a schematic diagram of the use state of the twelfth embodiment of the joint structure of the present invention.
[圖15]係本發明接合結構之第十三實施例之使用狀態示意圖。 Fig. 15 is a schematic diagram of the use state of the thirteenth embodiment of the joint structure of the present invention.
[圖16]係本發明接合結構之第十四實施例之使用狀態示意圖。 Fig. 16 is a schematic diagram of the use state of the fourteenth embodiment of the joint structure of the present invention.
[圖17]係本發明接合結構之第十五實施例之使用狀態示意圖。 FIG. 17 is a schematic diagram of the use state of the fifteenth embodiment of the joint structure of the present invention.
[圖18]係本發明接合結構之第十六實施例之使用狀態示意圖。 Fig. 18 is a schematic diagram of the use state of the sixteenth embodiment of the joint structure of the present invention.
[圖19]係本發明接合結構之第十七實施例之外觀示意圖。 Fig. 19 is a schematic view of the appearance of the seventeenth embodiment of the joint structure of the present invention.
[圖20]係本發明接合結構之第十七實施例之使用狀態示意圖。 Fig. 20 is a schematic diagram of the use state of the seventeenth embodiment of the joint structure of the present invention.
[圖21]係本發明接合結構之第十八實施例之使用狀態示意圖。 Fig. 21 is a schematic view of the use state of the eighteenth embodiment of the joint structure of the present invention.
[圖22]係本發明接合結構之第十九實施例之使用狀態示意圖一。 22 is a schematic diagram 1 of the use state of the nineteenth embodiment of the joint structure of the present invention.
[圖23]係本發明接合結構之第十九實施例之使用狀態示意圖二。 FIG. 23 is a second schematic diagram of the use state of the nineteenth embodiment of the joint structure of the present invention.
[圖24]係本發明接合結構之第二十實施例之使用狀態示意圖。 Fig. 24 is a schematic diagram of the use state of the twentieth embodiment of the joint structure of the present invention.
[圖25]係本發明接合結構之第二十一實施例之使用狀態示意圖。 Fig. 25 is a schematic diagram of the use state of the twenty-first embodiment of the joint structure of the present invention.
[圖26]係本發明接合結構之第二十一實施例之仰視狀態示意圖。 Fig. 26 is a schematic view of the bottom view of the twenty-first embodiment of the joint structure of the present invention.
[圖27]係本發明接合結構之接合結構之組裝狀態示意圖。 FIG. 27 is a schematic view of the assembled state of the joint structure of the joint structure of the present invention.
[圖28]係本發明接合結構組裝於物體之示意圖一。 [FIG. 28] It is a schematic diagram 1 of the present invention assembling the joint structure to an object.
[圖29]係本發明接合結構組裝於物體之示意圖二。 [Fig. 29] is a second schematic diagram of the joint structure of the present invention assembled to an object.
[圖30]係本發明第一接合部與第二接合部之不同型態示意圖。 FIG. 30 is a schematic diagram of different types of the first joint part and the second joint part of the present invention.
[圖31]係本發明接合結構之第二十二實施例之組裝狀態示意圖。 FIG. 31 is a schematic view of the assembled state of the twenty-second embodiment of the joint structure of the present invention.
[圖32]係本發明接合結構之第二十三實施例之組裝狀態示意圖。 FIG. 32 is a schematic view of the assembled state of the twenty-third embodiment of the joint structure of the present invention.
[圖33]係本發明接合結構之第二十四實施例之組裝狀態示意圖。 FIG. 33 is a schematic view of the assembled state of the twenty-fourth embodiment of the joint structure of the present invention.
[圖34]係本發明接合結構之第二十五實施例之組裝狀態示意圖。 Fig. 34 is a schematic view of the assembled state of the twenty-fifth embodiment of the joint structure of the present invention.
[圖35]係本發明接合結構之第二十六實施例之組裝狀態示意圖。 Fig. 35 is a schematic view of the assembled state of the twenty-sixth embodiment of the joint structure of the present invention.
[圖36]係本發明接合結構之第二十七實施例之組裝狀態示意圖。 Fig. 36 is a schematic view of the assembled state of the twenty-seventh embodiment of the joint structure of the present invention.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：
請參閱圖1及圖2，如圖所示：本發明係提供一種接合結構、接合模組及接合結構組裝於物體之方法，該接合結構1包含有一身部11以及一作動件12。
In order to fully understand the purpose, features and effects of the present invention, hereby, the present invention is described in detail by the following specific embodiments and in conjunction with the accompanying drawings, and the description is as follows:
Please refer to FIG. 1 and FIG. 2 . As shown in the figures, the present invention provides a joint structure, a joint module and a method for assembling the joint structure to an object. The
該作動件12與該身部11活動組合，該作動件12具有一第一接合部121，該第一接合部121位於該身部11之外側，該第一接合部121可進行縱向活動、橫向活動或旋向活動。
The actuating
於本發明接合結構1之一實施例中，該作動件12更可包括有一桿部122，該桿部122活動組合於該身部11之內側，以使該作動件12與該身部11活動組合。
In one embodiment of the
於本發明接合結構1之一實施例中，該作動件12更可包括有一擋止部123及一彈性元件124，該彈性元件124之一端擋抵於該身部11，該彈性元件124之另一端擋抵於該擋止部123；其中該彈性元件124常態抵頂於該身部11與該作動件12之擋止部123，使該作動件12之第一接合部121與該擋止部123常態處於被彈力推動，而往下施以往復彈力。
In one embodiment of the
本發明另提供一種接合結構之組裝方法，當本發明之接合結構1於組裝時，係可將部分之該作動件(如：該桿部122與該擋止部123)與該身部11活動組合，以使該作動件12之第一接合部121位於該身部11之外側，並使該第一接合部121可進行縱向活動、橫向活動或旋向活動。
The present invention further provides an assembling method of the joint structure. When the
於本發明之一實施例中，該身部11具有一組接部111，該組接部111具有一容料部112，使該身部11被外力施壓而擠壓於一第一物體10，讓該第一物體10之材料進入該容料部112，以進行該組接部111與該第一物體10之組裝。
In an embodiment of the present invention, the
當使用時，可拉動該作動件12，使該作動件12向上移動並壓縮該彈性元件124，待設置一欲扣接之第二物體20後，則可放開該作動件12，使該作動件12受該彈性元件124之彈力釋放而向下移動，進而讓該第一接合部121可穿過該第一物體10之扣入部101而縱向扣入該第二物體20。而當欲分離該第二物體20時，則可拉動該作動件12，使該作動件12向上移動並壓縮該彈性元件124，進而讓該第一接合部121脫離該第二物體20(或同時離開該扣入部101)，以進行該第二物體20之分離。如此，可藉由該接合結構1組合於該第一物體10與該第二物體20，以達到完成至少兩物體之組合或分離的目的。
When in use, the actuating
請參閱圖3，如圖所示，本實施例與上述實施例之不同之處在於，該第一接合部121之數量可為一個、兩個或兩個以上，本實施例中該第一接合部之數量為兩個。
Please refer to FIG. 3 . As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that the number of the first
於本發明之一實施例中，該組接部111具有一擴接部113，使該擴接部113被外力施壓型變擴接而與該第一物體10進行組裝。
In an embodiment of the present invention, the assembling
當使用時，可拉動該作動件12，使該作動件12向上移動並壓縮該彈性元件124，待設置一欲扣接之第二物體20後，則可放開該作動件12，使該作動件12受該彈性元件124之彈力釋放而向下移動，進而讓該等第一接合部121可穿過該第一物體10之扣入部101而縱向扣入該第二物體20。而當欲分離該第二物體20時，則可拉動該作動件12，使該作動件12向上移動並壓縮該彈性元件124，進而讓該等第一接合部121脫離該第二物體20(或同時離開該扣入部101)，以進行該第二物體20之分離。如此，可藉由該接合結構1組合於該第一物體10與該第二物體20，以達到完成至少兩物體之組合或分離的目的。
When in use, the actuating
請參閱圖4及圖5，如圖所示，本實施例與上述實施例之不同之處在於，當使用時可拉動後再轉動該作動件12，使該作動件12向上移動並壓縮該彈性元件124，待設置一欲扣接之第二物體20後，則可放開該作動件12，使該作動件12受該彈性元件124之彈力釋放而向下移動，進而讓該第一接合部121(或該等第一接合部121)可穿過該第一物體10之扣入部101而縱向扣入該第二物體20，使該第一接合部121(或該等第一接合部121)可進行橫向扣接或旋向扣接。而當欲分離該第二物體20時，則可拉動後再轉動該作動件12，使該作動件12向上移動並壓縮該彈性元件124，進而讓該第一接合部121(或該等第一接合部121)脫離該第二物體20(或同時離開該扣入部101)，以進行該第二物體20之分離。如此，可藉由該接合結構1組合於該第一物體10與該第二物體20，以達到完成至少兩物體之組合或分離的目的。
Please refer to FIG. 4 and FIG. 5 , as shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the actuating
請參閱圖6，如圖所示，本實施例與上述實施例之不同之處在於，該第一接合部121具有一扳動部125，該扳動部125與該桿部122拴接組合，該扳動部125旋動帶動該第一接合部121旋動，並使該桿部122上、下活動。其中該扳動部125橫向與縱向之寬度不同或相同，於旋轉時使該桿部122呈不同或相同距離移動；其中該作動件12以一栓接部127與該桿部122進行拴接。
Referring to FIG. 6 , as shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that the first engaging
當使用時，可扳動該作動件12之扳動部125，該扳動部125旋動帶動該第一接合部121旋動，使該桿部122向上活動並壓縮該彈性元件124，待設置一欲扣接之第二物體20後，則可再扳動該扳動部125，使該作動件12受該彈性元件124之彈力釋放而向下移動，進而讓該第一接合部121可穿過該第一物體10之扣入部101而縱向扣入該第二物體20。而當欲分離該第二物體20時，則可扳動該扳動部125，使該作動件12向上移動並壓縮該彈性元件124，進而讓該第一接
合部121脫離該第二物體20(或同時離開該扣入部101)，以進行該第二物體20之分離。如此，可藉由該接合結構1組合於該第一物體10與該第二物體20，以達到完成至少兩物體之組合或分離的目的。
When in use, the pulling
請參閱圖7及圖8，如圖所示，本實施例與上述實施例之不同之處在於，該作動件12具有一第一接合部121、一桿部122及一第二接合部126，該第一接合部121具有一扳動部125，該桿部122活動組合於該身部11之內側，使該作動件12與該身部11活動組合，該第一接合部121位於該身部11之外側，該扳動部125於旋轉時驅動第二接合部126活動，使該第二接合部126可進行縱向活動、橫向活動或旋向活動。
Please refer to FIG. 7 and FIG. 8 . As shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the actuating
另外，本發明之接合結構1亦可依據實際運用之需求同時設置有該第一接合部121與該第二接合部126，或是僅設置該第二接合部126(圖未示)，以使本發明能更符合實際運用之需求。
In addition, the
本發明接合結構1之一實施例中，該彈性元件124之一端抵頂於該身部11，該彈性元件124之另一端抵頂於該身部11內之第二接合部126，並該彈性元件常態抵頂於該身部與該作動件之第二接合部126，使該作動件之該第一接合部與該第二接合部常態處於被彈力推動，而往下施以往復彈力。
In one embodiment of the
當使用時，可扳動該作動件12之扳動部125，該扳動部125旋動帶動該第一接合部121旋動，使該桿部122與該第二接合部126向上活動並壓縮該彈性元件124，待設置一欲扣接之第二物體20後，則可再扳動該扳動部125，使該作動件12受該彈性元件124之彈力釋放而向下移動，進而讓該該第二接合部126可穿過該第一物體10之扣入部101而縱向扣入該第二物體20。而當欲分離該第二物體20時，則可扳動該扳動部125，使該作動件12向上移動並壓縮該彈性元
件124，進而讓該第二接合部126脫離該第二物體20(或同時離開該扣入部101)，以進行該第二物體20之分離。如此，可藉由該接合結構1組合於該第一物體10與該第二物體20，以達到完成至少兩物體之組合或分離的目的。
When in use, the pulling
請參閱圖9及圖10，如圖所示，本實施例與上述實施例之不同之處在於，該接合結構1之該第一接合部121與該第二接合部126可同時進行扣接以及同時進行解扣，使該第一接合部121於該第三物體30進行扣接或解扣，而該第二接合部126於該第二物體20進行扣接或解扣。另外，該第一接合部121與第二接合部126可分別進行扣接以及分別進行解扣(圖未示)。如此，可藉由該接合結構1組合於該第一物體10並與該第二物體20及該第三物體30進行扣接或解扣，以達到完成至少兩物體之組合或分離的目的。
Please refer to FIG. 9 and FIG. 10 , as shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the first engaging
請參閱圖11，如圖所示，本實施例與上述實施例之不同之處在於，該作動件12以一栓接部127與該桿部122進行拴接，而該彈性元件124之一端擋抵於該身部11，該彈性元件124之另一端擋抵於該擋止部123。使該接合結構1之該第一接合部121與該第二接合部126可同時進行扣接以及同時進行解扣。如此，可達到完成至少兩物體之組合或分離的目的。
Please refer to FIG. 11 . As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that the actuating
請參閱圖12及圖13，如圖所示，本實施例與上述實施例之不同之處在於，該作動件12以一栓接部127與該桿部122進行拴接，而該彈性元件124之一端抵頂於該身部11，該彈性元件124之另一端抵頂於該作動件12。
Please refer to FIG. 12 and FIG. 13 . As shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the actuating
當使用時，可下壓該作動件12，使該作動件12向上移動並壓縮該彈性元件124，待設置一欲扣接之第二物體20後，則可放開該作動件12，使該作動件12受該彈性元件124之彈力釋放而向下移動，進而讓該第二接合部126可穿過該第一物體10之扣入部101而縱向扣入該第二物體20。而當欲分離該第二物
體20時，則可下壓該作動件12，使該作動件12向上移動並壓縮該彈性元件124，進而讓該第二接合部126脫離該第二物體20(或同時離開該扣入部101)，以進行該第二物體20之分離。如此，可藉由該接合結構1組合於該第一物體10與該第二物體20，以達到完成至少兩物體之組合或分離的目的。
When in use, the actuating
請參閱圖14，如圖所示，本實施例與上述實施例之不同之處在於，該第一接合部121為一散熱元件或一冷卻裝置，該散熱元件為散熱片、散熱器、散熱膏或散熱液，用以先上移後下壓至一發熱之電子元件40，以協助進行散熱或協助該發熱之電子元件40之訊號穩定傳輸。
Please refer to FIG. 14. As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that the first
請參閱圖15，如圖所示，本實施例與上述實施例之不同之處在於，該第一接合部121上可堆疊一散熱元件41或一散熱物質，以協助進行散熱或協助該發熱之電子元件40之訊號穩定傳輸。
Please refer to FIG. 15 . As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that a
請參閱圖16，如圖所示，本實施例與上述實施例之不同之處在於，該第一接合部121上移後放入一散熱元件41至該作動件12於該發熱之電子元件40之間，以協助進行散熱或協助該發熱之電子元件40之訊號穩定傳輸。
Please refer to FIG. 16 . As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that a
請參閱圖17及圖18，如圖所示，本實施例與上述實施例之不同之處在於，該第一接合部121具有一限位結構1211(如圖17所示)，該限位結構1211用以限位一散熱元件41、一散熱物質或一發熱之電子元件40。如圖17所示該限位結構1211用以限位該發熱之電子元件40；如圖18所示該限位結構1211用以限位該散熱元件41，以使本發明能更符合實際散熱運用之需求。
Please refer to FIG. 17 and FIG. 18 . As shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the first
請參閱圖19及圖20，如圖所示，本實施例與上述實施例之不同之處在於，該作動件12具有一穿設部1212，該第一接合部121可下壓使該散熱元件41設於該穿設部1212，以使本發明能更符合實際散熱運用之需求。
Please refer to FIG. 19 and FIG. 20 . As shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the actuating
於本發明之一實施例中，該作動件12之桿部122為擴接結構、鉚接結構或鎖接結構，今以擴接結構為實施例，可使桿部122結合至該作動件之一設置部1213，另外，該作動件12亦可與該桿部122一體成型(圖未示)，以使本發明能更符合實際運用之需求。
In an embodiment of the present invention, the
請參閱圖21，如圖所示，本實施例與上述實施例之不同之處在於，該作動件12與該身部11之間具有一浮動限制部1214，該浮動限制部1214限制該身部11之浮動量，進而以一取置工具60取起該接合結構1，使該身部11穩固設於該第一物體10之組接位置，以使本發明能更符合實際運用之需求。
Please refer to FIG. 21 . As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that there is a floating restricting
請參閱圖22及圖23，如圖所示，本實施例與上述實施例之不同之處在於，該作動件12為一旋動體，使該作動件12旋動提起拴接之桿部122後組接於一第三物體30，並下壓接合於該散熱元件41或該發熱之電子元件40。如圖23所示該作動件12用以下壓接合於該散熱元件41與該發熱之電子元件40；如圖24所示該作動件12用以下壓接合於該發熱之電子元件40，以使本發明能更符合實際散熱運用之需求。
Please refer to FIG. 22 and FIG. 23 , as shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the actuating
於本發明之一實施例中，該作動件12具有一組接部1215，該組接部1215組接於該第三物體30之組接部301，以使該作動件12下壓而穩固接合於該散熱元件41或該發熱之電子元件40，以使本發明能更符合實際散熱運用之需求。
In one embodiment of the present invention, the actuating
請參閱圖24，如圖所示，本實施例與上述實施例之不同之處在於，該接合結構1組接於一存置體50，使該第一接合部121扣入一物體51，使該物體51限位於該存置體50，且可使該第一接合部121上移脫離該物體51，使該物體51於該存置體50脫離，以使本發明能更符合實際運用之需求。
Please refer to FIG. 24. As shown in the figure, the difference between this embodiment and the above-mentioned embodiment is that the
本發明之一實施例中，該第一物體為機殼、機箱、箱體、主機板、軌道、PCB板、電腦、記憶體、金屬件或塑膠件或該接合結構1組接於一存置體50，使該第一接合部121(或第二接合部126)扣入一物體，使該物體51限位於該存置體50，或使該第一接合部121(或第二接合部126)上移脫離該物體，使該物體於該存置體50脫離，其中該存置體50為機殼、機箱、箱體、主機板、軌道、PCB板、電腦、記憶體、金屬件或塑膠件、或該物體51為機殼、機箱、箱體、主機板、軌道、PCB板、電腦、記憶體、金屬件或塑膠件。
In one embodiment of the present invention, the first object is a casing, a chassis, a box, a motherboard, a rail, a PCB, a computer, a memory, a metal part or a plastic part, or the
請參閱圖25及圖26，如圖所示，本實施例與上述實施例之不同之處在於，該身部11具有一防轉部114，該作動件12具有一對應防轉部128，該防轉部114與該對應防轉部128相互對應防轉，且可使該對應防轉部128上提後與該防轉部114脫離，而旋轉該作動件12至該身部11之一承靠部115，使該作動件12停留或暫時停留至該承靠部115，以使本發明能更符合實際運用之需求。
Please refer to FIG. 25 and FIG. 26 . As shown in the figures, the difference between this embodiment and the above-mentioned embodiment is that the
本發明之一實施例中，該防轉部114為對應該對應防轉部128之切邊、剖邊、剖槽、切槽、凹部、凸部或階部。以使本發明能更符合實際運用之需求。
In one embodiment of the present invention, the
請參閱圖27，如圖所示，本發明係提供一種接合結構組裝於物體之方法，當組裝時，係將該接合結構1於一載體80中以一取置工具60取起，並經一比對裝置70比對距離或位置後放置於該第一物體10之組裝位置；而當該接合結構1以該取置工具60取起後，可於一預設高度a放開或鬆開該接合結構1，使該接合結構1下落至該第一物體10之組裝位置，以進行該接合結構1與該第一物體10之組裝。
Please refer to FIG. 27 . As shown in the figure, the present invention provides a method for assembling a joint structure to an object. When assembling, the
本發明之一實施例中，該身部11之表面具有一可焊層116，該身部11之可焊層116用加熱以焊接於該第一物體10之一可焊層102，以進行該接合結構1與該第一物體10之組裝，其中該第一物體10為PCB板，以使本發明能更符合實際運用之需求。
In one embodiment of the present invention, the surface of the
於本發明之一實施例中，該身部11之可焊層116可為錫層或鎳層，並於錫層或鎳層內具有一銅層。另外，該第一物體10之可焊層102為銅層上預設有錫層，用加熱以焊接進行該接合結構1與該第一物體10之組裝，以使本發明能更符合實際運用之需求。
In one embodiment of the present invention, the
請參閱圖28，如圖所示，本發明另提供一種接合結構組裝於物體之方法，包含下列步驟：提供一取置工具60取起該接合結構1(可由該作動件12之位置取起)。
Please refer to FIG. 28 , as shown in the figure, the present invention further provides a method for assembling a joint structure to an object, comprising the following steps: providing a pick-and-
使該取置工具60移動該接合結構1至該第一物體10的組裝位置上的預設高度a，並使該接合結構1的組接部111的一部分位於所述第一物體10的組合孔內。
Make the pick-and-
使該取置工具60放開或鬆開該接合結構1，以使該接合結構1下落至該第一物體10的組裝位置。如此，本發明可將該接合結構1組合至該第一物體10。
The pick-and-
於本發明之一實施例中，該取置工具60取起該接合結構1後，提供一比對裝置70比對該接合結構1與該第一物體10的組裝位置或組裝距離；使該取置工具60根據該比對裝置70的比對訊息，移動該接合結構1至該第一物體10的組裝位置上的預設高度a；使該取置工具60放開或鬆開該接合結構1，以使該接
合結構1下落至該第一物體10的組裝位置。如此，本發明可將該接合結構1組合至該第一物體10。
In an embodiment of the present invention, after the pick-and-
於本發明之一實施例中，該取置工具60取起該接合結構1後，提供一比對裝置70比對該接合結構1與該第一物體10之組裝位置之一可焊層102的位置或距離；使該取置工具60根據該比對裝置70的比對訊息，移動該接合結構1至該第一物體10之可焊層102上的預設高度a；使該取置工具60放開或鬆開該接合結構1，以使該接合結構1下落至該第一物體10之可焊層102，讓該身部11該第一物體10之可焊層102以焊接方式結合。如此，本發明可將該接合結構1組合至該第一物體10。
In an embodiment of the present invention, after the pick-and-
另外，於該取置工具60取起該接合結構1後，提供一比對裝置70比對該接合結構1與該第一物體10的組裝位置或組裝距離；使該取置工具60根據該比對裝置70的比對訊息，移動該接合結構1至該第一物體10的組裝位置；使該取置工具60放開或鬆開該接合結構1，以使該接合結構1組裝至該第一物體10的組裝位置。或是由該取置工具60取起該接合結構1後，以該比對裝置70比對該接合結構與該第一物體10之組裝位置之一可焊層102的位置或距離；使該取置工具60根據該比對裝置70的比對訊息，移動該接合結構1至該第一物體10之可焊層102；使該取置工具60放開或鬆開該接合結構1，以使該接合結構1組裝至該第一物體10之可焊層102。以使本發明能更符合實際組裝時之需求。
In addition, after the pick-and-
此外，於本發明之一實施例中，亦可以取置工具60取起該接合結構1，使該取置工具60移動該接合結構至該第一物體10的組裝位置，用以使該接合結構1組裝至該第一物體10的組裝位置，或是使該取置工具60放開或鬆開該接合結構1，以使該接合結構1組裝至該第一物體10的組裝位置；且組裝時可由
該取置工具60取起該接合結構1後，提供一比對裝置70比對該接合結構1與該第一物體10的組裝位置或組裝距離；使該取置工具60根據該比對裝置70的比對訊息，用以使該接合結構1組裝至第一物體10的組裝位置，或是由該取置工具60取起該接合結構後，提供一比對裝置70比對該接合結構與第一物體10之組裝位置之一可焊層102的位置或距離；使該取置工具60根據該比對裝置70的比對訊息，移動該接合結構1至該物體之可焊層102，用以使該接合結構1至第一物體10之可焊層102(圖未示)，讓本發明能更符合實際組裝時之需求。
In addition, in an embodiment of the present invention, a pick-and-
請參閱圖29，如圖所示，本發明另提供一種接合結構組裝於物體之方法，包含下列步驟：提供一取置工具60取起該接合結構1；使該取置工具60移動該接合結構1至該第一物體10的組裝位置上；該取置工具60下壓該接合結構1於該第一物體10，用以使該接合結構1放置至該第一物體10的組裝位置；而前述該取置工具60之下壓方式可為彈性下壓。
Please refer to FIG. 29 , as shown in the figure, the present invention further provides a method for assembling a joint structure to an object, comprising the following steps: providing a pick-and-
如本發明之具體實施例中，可提供一取置工具60取起該接合結構1；使該取置工具60移動該接合結構1至該第一物體10的組裝位置上；於該取置工具60感知該接合結構1接觸該第一物體10之回饋訊息後，使該取置工具60放開或鬆開該接合結構1，以使該接合結構1放置至該第一物體10的組裝位置。
As in the embodiment of the present invention, a pick-and-
於上述之取置工具60具有一感知器61，當該取置工具60移動該接合結構1至該第一物體10的組裝位置上時，可藉由該取置工具60之感知器61感知該接合結構1接觸該第一物體10之回饋訊息後，使該取置工具60放開或鬆開該接合結構1，以使該接合結構1放置至該第一物體10的組裝位置，且亦可依需求搭配前述之比對裝置70或可焊層102，藉以與該第一物體10進行組裝時之使用(圖未示)。以使本發明能更符合實際組裝時之需求。
The pick-and-
於本發明之一實施例中，當該接合結構1接觸該第一物體10之後，便可使該接合結構1接觸該第一物體10形成電性導通之狀態，以使該感知器61感知其電性導通後產生回饋訊息，以藉由該回饋訊息驅動該取置工具60放開或鬆開該接合結構1。
In one embodiment of the present invention, after the
請參閱圖30，如圖所示，於本發明之一實施例中，該第一接合部121與該第二接合部126為柱體(如圖30之a部分)、桿體、扣體、凸扣體(如圖30之c部分)、內扣體(如圖30之d部分)或彈扣體(如圖30之e部分)。以使本發明能更符合實際運用時之需求。
Please refer to FIG. 30 . As shown in the figure, in one embodiment of the present invention, the first engaging
請參閱圖31至圖34，如圖所示，於本發明之一實施例中提供一種接合模組，其包含上述各實施例所述之接合結構1，其中該作動件12具有受壓部129，該受壓部129與桿部122組合(該受壓部129與桿部122活動組合、或該受壓部129與該桿部122一體成型)。
Please refer to FIGS. 31 to 34 , as shown in the figures, an embodiment of the present invention provides a joint module, which includes the
於本發明之一實施例中，該受壓部129與該桿部122可為鉚接組合(如圖31所示)或擴接組合(如圖32所示)。
In an embodiment of the present invention, the pressure-receiving
於本發明之一實施例中，該受壓部129之組裝方法為，該受壓部129先在模具90內結合塑膠射出成形之第一接合部121(如圖32及圖33所示)，之後再與該桿部122鉚接組合或擴接組合。
In an embodiment of the present invention, the assembly method of the pressure-receiving
於本發明之一實施例中，該受壓部129之組裝方法為，該第一接合部121先在模具90內以射出或塑膠射出成型(如圖31及圖34所示)，再使該第一接合部121(或第二接合部126)於該受壓部129與該身部11之間限位且與該桿部122鉚接組合或擴接組合。
In an embodiment of the present invention, the assembling method of the pressure-receiving
於本發明之一實施例中，該第一接合部121於該模具90內射出或塑膠射出，使液態之材料或液態之塑膠材料於流道91中進入該模具90，藉以冷卻後形成該第一接合部121。
In one embodiment of the present invention, the first
於本發明之一實施例中，該受壓部129與該身部11為金屬材質，用以於外力施壓於該受壓部129與該身部11用以進行鉚接組合或擴接組合於一第一物體10時承受施壓之外力，而不會壓壞塑膠製之第一接合部121，以使本發明能更符合實際運用時之需求。
In one embodiment of the present invention, the pressure-receiving
於本發明之一實施例中，該受壓部129高於該第一接合部121之表面，以用以於外力施壓時使該受壓部129先承受施壓之外力，而不是塑膠製之第一接合部121，以避免壓壞塑膠製之第一接合部121，以使本發明能更符合實際運用時之需求。
In an embodiment of the present invention, the pressure-receiving
請參閱圖35，如圖所示，於本發明之一實施例中，該第一接合部121具有一扣部1216，該扣部1216為金屬材質或塑膠材質，該第一接合部121為金屬材質或塑膠材質，該扣部1216與該第一接合部121固定組合，並該第一接合部121與該扣部1216以塑膠埋入模具90射出組合、鉚接組合、擴接組合或卡接組合，以使本發明能更符合實際運用時之需求。
Please refer to FIG. 35 . As shown in the figure, in one embodiment of the present invention, the first
請參閱圖36，如圖所示，於本發明之一實施例中，該第一接合部121(或第二接合部126)具有一扣部1216，該扣部1216為金屬材質，該第一接合部121於模具90內使液態之塑膠於流道91內進入模腔，藉以於冷卻後使該第一接合部121與該扣部1216組合，以使本發明能更符合實際運用時之需求。
Please refer to FIG. 36 , as shown in the figure, in an embodiment of the present invention, the first engaging portion 121 (or the second engaging portion 126 ) has a
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注 意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。 The present invention has been disclosed above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the present invention, and should not be construed as limiting the scope of the present invention. should be noted It is intended that all changes and substitutions equivalent to this embodiment should be considered to be included within the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.
1:接合結構 1: Joint structure
11:身部 11: Body
111:組接部 111: Assembly Department
112:容料部 112: Material holding department
12:作動件 12: Actuator
121:第一接合部 121: The first joint
122:桿部 122: Rod
123:擋止部 123: Stopper
124:彈性元件 124: elastic element
Claims (20)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW110103873A TWI769687B (en) | 2021-02-02 | 2021-02-02 | Joint structure, joint module and method of assembling joint structure to object |
| CN202122005848.1U CN218111782U (en) | 2020-10-23 | 2021-08-24 | Bonding structure and bonding module |
| CN202110975765.7A CN114474758A (en) | 2020-10-23 | 2021-08-24 | Joint structure, joint module and method for assembling joint structure on object |
| US17/492,702 US20220128073A1 (en) | 2020-10-23 | 2021-10-04 | Joint structure, joint module and method of assembling joint structure on object |
| US18/446,495 US20230383775A1 (en) | 2020-10-23 | 2023-08-09 | Joint structure |
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| TW110103873A TWI769687B (en) | 2021-02-02 | 2021-02-02 | Joint structure, joint module and method of assembling joint structure to object |
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| TWI769687B true TWI769687B (en) | 2022-07-01 |
| TW202232003A TW202232003A (en) | 2022-08-16 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM402972U (en) * | 2010-11-09 | 2011-05-01 | Hanwit Prec Ind Ltd | Improved structure for positioning device |
| TWI500854B (en) * | 2014-12-22 | 2015-09-21 | Hanwit Prec Ind Ltd | Rotary fixture |
| TWM523780U (en) * | 2015-11-20 | 2016-06-11 | Dtech Prec Ind Co Ltd | Fastener assembly of fixing structure and fixing structure |
| TWM542798U (en) * | 2016-11-16 | 2017-06-01 | 伍鐌科技股份有限公司 | Fast coupling device |
| TWI674365B (en) * | 2018-06-06 | 2019-10-11 | 伍鐌科技股份有限公司 | Limiter |
-
2021
- 2021-02-02 TW TW110103873A patent/TWI769687B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM402972U (en) * | 2010-11-09 | 2011-05-01 | Hanwit Prec Ind Ltd | Improved structure for positioning device |
| TWI500854B (en) * | 2014-12-22 | 2015-09-21 | Hanwit Prec Ind Ltd | Rotary fixture |
| TWM523780U (en) * | 2015-11-20 | 2016-06-11 | Dtech Prec Ind Co Ltd | Fastener assembly of fixing structure and fixing structure |
| TWM542798U (en) * | 2016-11-16 | 2017-06-01 | 伍鐌科技股份有限公司 | Fast coupling device |
| TWI674365B (en) * | 2018-06-06 | 2019-10-11 | 伍鐌科技股份有限公司 | Limiter |
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| TW202232003A (en) | 2022-08-16 |
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