TWI767839B - Double-layer solder resist structure of a printed circuit board, method for making the same, and double-layer solder resist dry film - Google Patents
Double-layer solder resist structure of a printed circuit board, method for making the same, and double-layer solder resist dry film Download PDFInfo
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Abstract
Description
本發明是關於一種印刷電路板的防焊結構的改良。The present invention relates to an improvement of a solder resist structure of a printed circuit board.
印刷電路板的表面一般會形成防焊層，用來保護內部的電路，達到防潮、防氧化、防塵、阻焊等效果。由於形成防焊層後，後續仍可能會進行上錫、表面貼裝、自動光學檢測等程序，這些程序經常涉及光學定位校準，為了增加光學定位校準的良率，普遍會使用非透明的防焊層來增加機器視覺的分辨率。A solder resist layer is generally formed on the surface of the printed circuit board to protect the internal circuit and achieve the effects of moisture resistance, oxidation resistance, dust resistance, and solder resistance. After the solder mask is formed, tinning, surface mount, automatic optical inspection and other procedures may still be performed later. These procedures often involve optical positioning calibration. In order to increase the yield of optical positioning calibration, non-transparent solder masks are generally used. layers to increase the resolution of machine vision.
防焊層的光固化處理過往經常採用高功率的汞燈作為光源，目前有也人嘗試以無光罩方式對防焊層進行光固化，例如，使用LED作為光固化的光源，搭配數位微鏡裝置（Digital Micromirror Device）對防焊層進行光固化，然而，出於數位微鏡裝置的限制，只能使用低功率的LED作為光源（通常功率小於100 W），而低功率的光源並沒有辦法很好地穿透到厚度較大的防焊層底部，防焊層的長期以來根深柢固的不透明特性（技術偏見）也加遽了上述問題，而這會造成防焊層底部無法完全固化，以致於後續顯影、開窗時，產生嚴重的內旋（overcut）問題，大幅影響防焊層的製作良率。The light curing treatment of the solder mask used to use high-power mercury lamps as the light source. At present, some people try to light-cur the solder mask without a mask. For example, LEDs are used as the light source for light curing, and a digital micromirror is used. The device (Digital Micromirror Device) performs light curing on the solder mask. However, due to the limitation of the digital micromirror device, only low-power LEDs can be used as light sources (usually less than 100 W), and low-power light sources have no way to Penetrates well to the bottom of thicker solder masks, which is compounded by the long-established opaque nature of the solder mask (technical bias), which causes the bottom of the solder mask to not fully cure, resulting in During subsequent development and window opening, a serious overcut problem occurs, which greatly affects the production yield of the solder mask.
有鑑於此，本發明之主要目的在於解決前述防焊層以低功率光源進行光處理後，後續顯影、開窗時容易產生的內旋問題。In view of this, the main purpose of the present invention is to solve the problem of internal rotation that is likely to occur during subsequent development and window opening after the aforementioned solder mask is light-treated with a low-power light source.
為了達成上述的目的，本發明提供一種印刷電路板的雙層防焊結構，其包括一底部防焊層及一與底部防焊層同時被光固化的表面防焊層，底部防焊層為透明或半透明，表面防焊層非透明，且表面防焊層設於底部防焊層的頂面。In order to achieve the above purpose, the present invention provides a double-layer solder mask structure for a printed circuit board, which includes a bottom solder mask layer and a surface solder mask layer that is simultaneously photocured with the bottom solder mask layer, and the bottom solder mask layer is transparent Or translucent, the surface solder mask is non-transparent, and the surface solder mask is arranged on the top surface of the bottom solder mask.
為了達成上述目的，本發明還提供一種雙層防焊乾膜，其包括一膜狀載體、一具有指觸乾燥性的表面防焊油墨及一具有指觸乾燥性的底部防焊油墨，表面防焊油墨設於該膜狀載體，該表面防焊油墨非透明，底部防焊油墨供與該印刷電路板的電路接觸，該底部防焊油墨為透明或半透明，該底部防焊油墨設於該表面防焊油墨上。In order to achieve the above object, the present invention also provides a double-layer solder resist dry film, which includes a film carrier, a surface solder resist ink with touch dryness and a bottom solder resist ink with touch dryness. Soldering ink is provided on the film carrier, the surface solder resist ink is non-transparent, the bottom solder resist ink is used for contact with the circuit of the printed circuit board, the bottom solder resist ink is transparent or translucent, and the bottom solder resist ink is provided on the Soldermask ink on the surface.
為了達成上述目的，本發明還提供一種印刷電路板的雙層防焊結構的製法，包括：In order to achieve the above object, the present invention also provides a method for making a double-layer solder mask structure of a printed circuit board, including:
在一膜狀載體上塗布一未固化的表面防焊油墨；Coating an uncured surface solder resist ink on a film carrier;
對該表面防焊油墨進行烘烤而使該表面防焊油墨具有指觸乾燥性，但不對該表面防焊油墨進行光固化處理；Baking the surface solder mask ink to make the surface solder mask ink dry to the touch, but not subjecting the surface solder mask ink to light curing treatment;
在該表面防焊油墨上塗布一未固化的底部防焊油墨；Coating an uncured bottom solder mask on the surface solder mask;
對該底部防焊油墨進行烘烤而使該底部防焊油墨具有指觸乾燥性，但不對該該底部防焊油墨進行光固化處理；Baking the bottom solder resist ink to make the bottom solder resist ink dry to the touch, but not performing light curing treatment on the bottom solder resist ink;
將具有指觸乾燥性的該表面防焊油墨及該底部防焊油墨層合到該印刷電路板上而使該底部防焊油墨接觸該印刷電路板的電路；以及Laminating the surface solder resist ink and the bottom solder resist ink having touch dryness to the printed circuit board such that the bottom solder resist ink contacts the circuit of the printed circuit board; and
將該底部防焊油墨及該表面防焊油墨光固化處理為一底部防焊層及一表面防焊層。The bottom solder resist ink and the surface solder resist ink are photocured into a bottom solder resist layer and a surface solder resist layer.
藉由上述設計，表面防焊層非透明的特性可以維持機器視覺的分辨率，而底部防焊層則一改防焊層普遍為非透明的刻板印象，而具有透明或半透明的特性，這樣的特性使得低功率光源在照光時，光線更容易到達底部防焊層的底部，從而避免或至少大幅減緩因底部無法完全固化而衍生的顯影、開窗內旋問題。With the above design, the non-transparent properties of the surface solder mask can maintain the resolution of machine vision, while the bottom solder mask changes the stereotype that the solder mask is generally opaque, and has transparent or translucent properties, so that The characteristics of the low-power light source make it easier for the light to reach the bottom of the bottom solder mask when the low-power light source is illuminated, thereby avoiding or at least greatly reducing the problems of development, window opening and internal rotation caused by the incomplete curing of the bottom.
請參考第1圖，所繪示者為本發明雙層防焊結構的其中一實施例，其包括一底部防焊層10及一表面防焊層20，底部防焊層10是與印刷電路板1的電路2接觸，表面防焊層20不與電路2接觸，底部防焊層10為透明或半透明（至少在可見光波長範圍），表面防焊層20則非透明（至少在可見光波長範圍），例如為綠色、黑色、白色、藍色、紅色、黃色或棕色等顏色，但並不侷限其色彩，並且，表面防焊層20的厚度小於10 ㎛，其主要目的是為了要讓整個防焊結構顯色，表面防焊層20的厚度越厚，越不利於底部防焊層10的光固化。所述印刷電路板可為單層板結構或多層複合板結構，其可為軟性電路板（Flexible Printed Circuit, FPC）之載板或硬式電路板（Printed Circuit Board, PCB）之載板，所使用的材質可為但不限於聚乙烯對苯二甲酸酯（PET）或其他聚酯薄膜、聚醯亞胺薄膜、聚醯胺醯亞胺薄膜、聚丙烯薄膜、聚苯乙烯薄膜。底部防焊層10及表面防焊層20主要組成為光可成像防焊樹酯，其以含羧基光可成像樹酯為佳，或者併用環氧樹酯與含羧基光可成像樹酯。Please refer to FIG. 1, which is an embodiment of the double-layer solder mask structure of the present invention, which includes a bottom
以下通過第2至4圖說明本發明的雙層防焊結構的製法：The manufacturing method of the double-layer solder mask structure of the present invention will be described below through Figures 2 to 4:
首先，請參考第2圖，在一膜狀載體3上塗布一未固化的表面防焊油墨21，膜狀載體可為聚乙烯對苯二甲酸酯（PET）或其他聚酯薄膜、聚醯亞胺薄膜、聚醯胺醯亞胺薄膜、聚丙烯薄膜、聚苯乙烯薄膜等，其厚度較佳介於10-150 µm。所述塗布例如使用唇形塗布機進行。First, please refer to FIG. 2, apply an uncured surface
接著，使用烘烤機對表面防焊油墨21進行烘烤處理，使表面防焊油墨具有指觸乾燥性，但不對表面防焊油墨21進行光固化處理以避免其產生光聚合作用。Next, use a baking machine to bake the surface
然後，如第3圖所示，在表面防焊油墨21上再塗布一層未固化的底部防焊油墨11，底部防焊油墨11的厚度可以大於表面防焊油墨21而對電路達到更好的保護效果。Then, as shown in Figure 3, a layer of uncured bottom
而後，再使用烘烤機對底部防焊油墨11進行烘烤處理，使底部防焊油墨11也具有指觸乾燥性，從而形成一雙層防焊乾膜，亦即，雙層防焊乾膜包括膜狀載體3及具有指觸乾燥性的表面防焊油墨21及底部防焊油墨11，並且，在過程中不對底部防焊油墨11進行光固化處理以避免其光聚合。其中，為了避免底部防焊油墨11的表面受到污染，可在烘烤處理後在底部防焊油墨11表面層合一保護膜（圖未繪示），例如聚乙烯薄膜、聚四氟乙烯薄膜、聚丙烯薄膜或經表面處理的紙。Then, use a baking machine to bake the bottom
接著，如第4圖所示，將具有指觸乾燥性表面防焊油墨21及底部防焊油墨11層合到印刷電路板1上而使底部防焊油墨11接觸印刷電路板1的電路2。如果底部防焊油墨11表面有貼上保護膜，則在層合前需先移除保護膜。Next, as shown in FIG. 4 , a surface solder resist 21 having finger-drying properties and a
最後，通過曝光機或類似設備將底部防焊油墨11及表面防焊油墨21光固化處理為如第1圖所示的底部防焊層10及表面防焊層20，由於底部防焊層10是透明或半透明的，因此光線可以更容易地到達底部防焊層10的底部而使其充分光固化。在可能的實施方式中，還可以對底部防焊層及表面防焊層進行顯影、開窗處理。並且，在光固化處理前或光固化處理後，可以將膜狀載體移除。Finally, the bottom
1:印刷電路板 2:電路 3:膜狀載體 10:底部防焊層 11:底部防焊油墨 20:表面防焊層 21:表面防焊油墨1: Printed circuit board 2: Circuit 3: Membrane carrier 10: Bottom solder mask 11: Bottom solder mask ink 20: Surface solder mask 21: Surface solder mask ink
第1圖是本發明雙層防焊結構其中一實施例的示意圖。FIG. 1 is a schematic diagram of one embodiment of the double-layer solder mask structure of the present invention.
第2至4圖是本發明雙層防焊結構的製造流程的示意圖。FIGS. 2 to 4 are schematic diagrams of the manufacturing process of the double-layer solder mask structure of the present invention.
1:印刷電路板 1: Printed circuit board
2:電路 2: Circuit
10:底部防焊層 10: Bottom solder mask
20:表面防焊層 20: Surface solder mask
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102763036A (en) * | 2010-02-08 | 2012-10-31 | 太阳控股株式会社 | Layered structure and light-sensitive dry film used in same |
| CN107254205A (en) * | 2013-11-05 | 2017-10-17 | 太阳油墨制造株式会社 | Curing composition, cured coating film and printed circuit board (PCB) using it |
| CN107710074A (en) * | 2015-06-24 | 2018-02-16 | 互应化学工业株式会社 | Solder mask composition, envelope, the manufacture method of coated printed wiring board, the manufacture method of envelope and coated printed wiring board |
| TW202100633A (en) * | 2019-06-19 | 2021-01-01 | 鷹克國際股份有限公司 | Pre-prepared b-stage polymer materials |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102763036A (en) * | 2010-02-08 | 2012-10-31 | 太阳控股株式会社 | Layered structure and light-sensitive dry film used in same |
| CN107254205A (en) * | 2013-11-05 | 2017-10-17 | 太阳油墨制造株式会社 | Curing composition, cured coating film and printed circuit board (PCB) using it |
| CN107710074A (en) * | 2015-06-24 | 2018-02-16 | 互应化学工业株式会社 | Solder mask composition, envelope, the manufacture method of coated printed wiring board, the manufacture method of envelope and coated printed wiring board |
| TW202100633A (en) * | 2019-06-19 | 2021-01-01 | 鷹克國際股份有限公司 | Pre-prepared b-stage polymer materials |
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