TWI763298B

TWI763298B - Manufacturing method of crystal oscillator and structure thereof

Info

Publication number: TWI763298B
Application number: TW110104072A
Authority: TW
Inventors: 洪瑞華
Original assignee: 國立陽明交通大學
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2022-05-01
Also published as: TW202232887A

Abstract

A manufacturing method of crystal oscillator is provided, and includes a first electrode part forming step which forming a first electrode part on a piezoelectric substrate, a bonding step which attaching a temporary substrate on the piezoelectric substrate on a same side of the first electrode part, a thinning step which thinning the piezoelectric substrate, a second electrode forming step which forming a second electrode on a thinning piezoelectric substrate opposite to the first electrode part, an extension electrode forming step which forming an extension electrode, and a frame setting step which setting a hollow frame on the thinning piezoelectric substrate. Since the thinning piezoelectric substrate has the good thickness uniformity, the electrodes will not be damaged due to the thickness difference of the thinning piezoelectric substrate during the electrodes forming process. It is in favor of forming the electrodes, improves a production yield rate, and makes the crystal oscillator having a good oscillatory property and an enough mechanical property.

Description

石英振盪器的製作方法與結構Quartz oscillator manufacturing method and structure

本發明是有關於一種振盪器的製作方法與結構，特別是指一種高頻率的壓電振盪器的製作方法與結構。The present invention relates to a manufacturing method and structure of an oscillator, in particular to a manufacturing method and structure of a high-frequency piezoelectric oscillator.

石英振盪器為一種常見的壓電振盪器，是利用石英晶體本身的壓電效應來產生高振盪頻率的元件，經常配置於各種電子產品中，例如：通訊設備或是可攜式電子產品。傳統的石英振盪器大致包括一石英基板，及分別形成於該石英基板相對二表面的一頂電極及一底電極，且該底電極會自該石英基板的底面，延著側周面延伸至與該石英基板的頂面，令該頂電極及該底電極可位於同一表面，用以供對外電連接。A quartz oscillator is a common piezoelectric oscillator, which uses the piezoelectric effect of the quartz crystal itself to generate a high oscillation frequency. It is often configured in various electronic products, such as communication equipment or portable electronic products. A traditional quartz oscillator generally includes a quartz substrate, and a top electrode and a bottom electrode respectively formed on two opposite surfaces of the quartz substrate, and the bottom electrode extends from the bottom surface of the quartz substrate along the side peripheral surface to the opposite side. The top surface of the quartz substrate allows the top electrode and the bottom electrode to be located on the same surface for external electrical connection.

一般而言，石英基板的厚度越薄，能產生的振盪頻率就越高，因此，為了讓石英振盪器可應用在高頻元件，就須要薄化該石英基板，使其厚度可達到所需的高頻振盪頻率。參閱圖1，目前常見的高頻石英振盪器1的作法通常是利用將一石英基板11的中間區域111減薄以提升其振盪頻率，並讓該石英基板11的週緣維持一定的厚度使其形成一以提供足夠機械支撐力的支撐框架112。Generally speaking, the thinner the thickness of the quartz substrate, the higher the oscillation frequency that can be generated. Therefore, in order for the quartz oscillator to be applied to high-frequency components, the quartz substrate needs to be thinned so that its thickness can reach the required thickness. High frequency oscillation frequency. Referring to FIG. 1 , the current common practice of high frequency quartz oscillator 1 is to use thinning of the middle region 111 of a quartz substrate 11 to increase the oscillation frequency, and to maintain a certain thickness on the periphery of the quartz substrate 11 to form A support frame 112 to provide sufficient mechanical support.

然而，由於該石英基板11呈現其中間區域111較薄，週緣的支撐框架112厚度較大的結構，因此，於其頂電極12的製程中，須要將該頂電極12延伸至該支撐框架112，會因為該中間區域111與該支撐框架112之間的厚度差，造成該頂電極12的製程不易控制，此外，因為該支撐框架112厚度較大，因此，於將該底電極13延伸至該石英基板11的頂面時，也需要爬升較大的厚度。However, since the quartz substrate 11 has a structure in which the middle region 111 is thin and the supporting frame 112 at the periphery is thick, the top electrode 12 needs to be extended to the supporting frame 112 during the manufacturing process of the top electrode 12 . Due to the thickness difference between the middle region 111 and the support frame 112, the process of the top electrode 12 is difficult to control. In addition, because the support frame 112 is thicker, the bottom electrode 13 is extended to the quartz The top surface of the substrate 11 also needs to be climbed to a larger thickness.

因此，本發明的目的，即在提供一種石英振盪器的製作方法，有利於其電極的製作。Therefore, the purpose of the present invention is to provide a method for manufacturing a quartz oscillator, which is beneficial to the manufacture of its electrodes.

於是，本發明石英振盪器的製作方法，包含一第一電極部製作步驟、一貼合步驟、一薄化步驟、一第二電極製作步驟、一延伸電極製作步驟，及一框架設置步驟。Therefore, the manufacturing method of the quartz oscillator of the present invention includes a first electrode part manufacturing step, a laminating step, a thinning step, a second electrode manufacturing step, an extending electrode manufacturing step, and a frame setting step.

該第一電極部製作步驟是於一具有預定厚度的壓電基板的其中一表面形成一第一電極部，得到一第一中間物。The first electrode part fabrication step is to form a first electrode part on one surface of a piezoelectric substrate with a predetermined thickness to obtain a first intermediate.

該貼合步驟是將該第一中間物以該第一電極部朝向一暫時基板的方向貼合於該暫時基板，得到一第二中間物。In the laminating step, the first intermediate is attached to the temporary substrate in a direction in which the first electrode portion faces the temporary substrate to obtain a second intermediate.

該薄化步驟是將該第二中間物的壓電基板進行全面薄化，而得到一整體厚度小於該壓電基板的薄化壓電基板。In the thinning step, the piezoelectric substrate of the second intermediate is fully thinned to obtain a thinned piezoelectric substrate with an overall thickness smaller than that of the piezoelectric substrate.

該第二電極製作步驟是於該薄化壓電基板反向該暫時基板的表面且相應於該第一電極部的位置形成一第二電極，並令該第二電極的正投影與該第一電極部至少部分重合。In the second electrode fabrication step, a second electrode is formed on the surface of the thinned piezoelectric substrate opposite to the surface of the temporary substrate and corresponding to the position of the first electrode portion, and the orthographic projection of the second electrode is aligned with that of the first electrode. The electrode portions at least partially overlap.

該延伸電極製作步驟是形成一自該第一電極部延伸並沿著該薄化壓電基板的側周面延伸至該薄化壓電基板形成有該第二電極的表面的第一延伸電極部。The extended electrode fabrication step is to form a first extended electrode portion extending from the first electrode portion and extending along the side peripheral surface of the thinned piezoelectric substrate to the surface of the thinned piezoelectric substrate on which the second electrode is formed .

該框架設置步驟是將一具有預定厚度的中空框架貼合在該薄化壓電基板形成有該第二電極的表面，並令該中空框架框圍該第二電極。In the frame setting step, a hollow frame with a predetermined thickness is attached to the surface of the thinned piezoelectric substrate on which the second electrode is formed, and the hollow frame surrounds the second electrode.

此外，本發明的另一目的，即在提供一種由如前所述的製作方法所製得的石英振盪器。In addition, another object of the present invention is to provide a quartz oscillator manufactured by the aforementioned manufacturing method.

於是，本發明石英振盪器，包含一薄化壓電基板、一第一電極、一第二電極、一中空框架，及一黏膠層。Therefore, the quartz oscillator of the present invention includes a thinned piezoelectric substrate, a first electrode, a second electrode, a hollow frame, and an adhesive layer.

該薄化壓電基板具有相同厚度，包括彼此反向的一第一表面及一第二表面。The thinned piezoelectric substrate has the same thickness and includes a first surface and a second surface opposite to each other.

該第一電極包括一位於該薄化壓電基板的該第一表面的第一電極部，及一自該第一電極部延伸並沿著該薄化壓電基板的側周面延伸至該第二表面的延伸電極部。The first electrode includes a first electrode portion located on the first surface of the thinned piezoelectric substrate, and a first electrode portion extending from the first electrode portion and extending along the side peripheral surface of the thinned piezoelectric substrate to the first electrode portion Extended electrode portions on both surfaces.

該第二電極位於該薄化壓電基板的該第二表面，具有一與該第一電極部的正投影範圍部分疊合的第二電極部，及一自該第二電極部延伸至與該第一延伸電極部位於同側的第二延伸電極部。The second electrode is located on the second surface of the thinned piezoelectric substrate, and has a second electrode portion partially overlapping with the orthographic projection range of the first electrode portion, and a second electrode portion extending from the second electrode portion to the The first extension electrode portion is located on the same side of the second extension electrode portion.

該中空框架與該薄化壓電基板的第二表面黏接。The hollow frame is bonded to the second surface of the thinned piezoelectric substrate.

該黏膠層介於該薄化壓電基板與該中空框架之間，用於接合該薄化壓電基板與該中空框架。The adhesive layer is interposed between the thinned piezoelectric substrate and the hollow frame for bonding the thinned piezoelectric substrate and the hollow frame.

本發明的功效在於：通過先將形成有該第一電極部的該壓電基板貼合於該暫時基板，並將該壓電基板整體薄化後而形成該薄化壓電基板，再形成該第二電極，因為薄化後的該薄化壓電基板有該暫時基板支撐，因此可避免該薄化壓電基板因厚度較薄而於製程中碎裂的問題，此外，因該薄化壓電基板厚度較薄且表面平坦，因此，可更有利於電極的製作。The effect of the present invention lies in that the thinned piezoelectric substrate is formed by first bonding the piezoelectric substrate formed with the first electrode portion to the temporary substrate, and then thinning the piezoelectric substrate as a whole, and then forming the thinned piezoelectric substrate. For the second electrode, since the thinned piezoelectric substrate is supported by the temporary substrate, it can avoid the problem of the thinned piezoelectric substrate being cracked during the manufacturing process due to its thin thickness. The thickness of the electrical substrate is thin and the surface is flat, so it is more favorable for the fabrication of electrodes.

有關本發明之相關技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚的呈現。此外，要說明的是，本發明圖式僅為表示元件間的結構及/或位置相對關係，與各元件的實際尺寸並不相關。The related technical content, features and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. In addition, it should be noted that the drawings of the present invention only show the relative structure and/or positional relationship among the elements, and are not related to the actual size of each element.

參閱圖4、圖5，本發明石英振盪器的製作方法的一實施例是用以製作如圖4與圖5所示的石英振盪器400。該石英振盪器400包含一薄化壓電基板2、一第一電極3、一第二電極4、一中空框架5，及一黏膠層6。Referring to FIGS. 4 and 5 , an embodiment of a method for manufacturing a quartz oscillator of the present invention is used to manufacture the quartz oscillator 400 shown in FIGS. 4 and 5 . The quartz oscillator 400 includes a thinned piezoelectric substrate 2 , a first electrode 3 , a second electrode 4 , a hollow frame 5 , and an adhesive layer 6 .

該薄化壓電基板2的整體具有相同厚度，包括彼此反向的一第一表面21及一第二表面22。該薄化壓電基板2由壓電材料所構成，其厚度或外型可視使用需求而有不同態樣，並無特別限制，且根據該薄化壓電基板2的厚度、晶體結構或是形狀不同，能產生相應的振盪頻率，相關的條件參數已為相關領域知悉，在此不特別描述。在本實施例中，該薄化壓電基板2為厚度不大於50μm的石英晶體，並具有良好的高頻頻率穩定度。於一些實施例中，該薄化壓電基板2的厚度不大於10μm。The entire thinned piezoelectric substrate 2 has the same thickness, and includes a first surface 21 and a second surface 22 opposite to each other. The thinned piezoelectric substrate 2 is made of piezoelectric material, and its thickness or shape can vary depending on the needs of use, and is not particularly limited, and depends on the thickness, crystal structure or shape of the thinned piezoelectric substrate 2 Different, corresponding oscillation frequencies can be generated, and the relevant condition parameters are known in the related art and are not specifically described here. In this embodiment, the thinned piezoelectric substrate 2 is a quartz crystal with a thickness of not more than 50 μm, and has good high-frequency frequency stability. In some embodiments, the thickness of the thinned piezoelectric substrate 2 is not greater than 10 μm.

該第一電極3位於該薄化壓電基板2的第一表面21，包括一位於該第一表面21的第一電極部31，及一自該第一電極部31延伸並沿著該薄化壓電基板2的側周面延伸至該第二表面22的第一延伸電極部32。The first electrode 3 is located on the first surface 21 of the thinned piezoelectric substrate 2 , and includes a first electrode portion 31 located on the first surface 21 , and a first electrode portion 31 extending from the first electrode portion 31 and along the thinned The side peripheral surface of the piezoelectric substrate 2 extends to the first extended electrode portion 32 of the second surface 22 .

該第二電極4位於該薄化壓電基板2的第二表面22，包括一與該第一電極部31的正投影範圍部分疊合的第二電極部41，及一自該第二電極部41延伸至該薄化壓電基板2週緣並與該第一延伸電極部32位於同一側的第二延伸電極部42。The second electrode 4 is located on the second surface 22 of the thinned piezoelectric substrate 2 , and includes a second electrode portion 41 partially overlapping with the orthographic range of the first electrode portion 31 , and a second electrode portion 41 from the second electrode portion 41 extends to the second extended electrode portion 42 of the peripheral edge of the thinned piezoelectric substrate 2 and located on the same side as the first extended electrode portion 32 .

在本實施例中，該第一電極部31、第二電極部41、該第一延伸電極部32，及該第二延伸電極部42的材料可各自選自金、銀或鋁，且彼此可以由相同或不同的材料構成。In this embodiment, the materials of the first electrode part 31 , the second electrode part 41 , the first extended electrode part 32 , and the second extended electrode part 42 can be selected from gold, silver or aluminum, respectively, and can be mutually Constructed of the same or different materials.

該中空框架5通過該黏膠層6貼合在該薄化壓電基板2的第二表面22，並具有一預定厚度。The hollow frame 5 is attached to the second surface 22 of the thinned piezoelectric substrate 2 through the adhesive layer 6 and has a predetermined thickness.

詳細的說，該中空框架5會框圍該第二電極部41並與該薄化壓電基板2的邊緣成一距離間隔，而讓該第二電極部41位於該中空框架5的框圍範圍內，並令該第二表面22具有一位於該中空框架5外圍的邊緣區。該第二延伸電極部42可經由該第二表面22延伸並通過該中空框架5而位於該邊緣區；該第一延伸電極部32也同樣會自該第一表面21延伸至該第二表面22的邊緣區，而與第二延伸電極部42位於同側，藉由該第一延伸電極部32與該第二延伸電極部42將該第一電極3與該第二電極4延伸至同一表面，而可更易於對外電連接。此外，透過具有預定厚度的該中空框架5提供該薄化壓電基板2一機械支撐力，以避免製得的該石英振盪器400在後續封裝製程或使用過程中損毀，同時還能作為一供夾持或設置於其他元件的連接區域，而利於該石英振盪器400後續封裝或配置於電子產品中。Specifically, the hollow frame 5 surrounds the second electrode portion 41 and is spaced apart from the edge of the thinned piezoelectric substrate 2 , so that the second electrode portion 41 is located within the frame of the hollow frame 5 . , and make the second surface 22 have an edge region at the periphery of the hollow frame 5 . The second extension electrode portion 42 can extend through the second surface 22 and be located in the edge region through the hollow frame 5 ; the first extension electrode portion 32 also extends from the first surface 21 to the second surface 22 The edge area is located on the same side as the second extension electrode portion 42, and the first electrode 3 and the second electrode 4 are extended to the same surface by the first extension electrode portion 32 and the second extension electrode portion 42, And it can be easier to connect externally. In addition, the thinned piezoelectric substrate 2 is provided with a mechanical support force through the hollow frame 5 with a predetermined thickness, so as to prevent the manufactured quartz oscillator 400 from being damaged during the subsequent packaging process or use, and at the same time, it can also be used as a supply The crystal oscillator 400 can be clamped or arranged in the connection area of other components, so as to facilitate the subsequent packaging or configuration of the quartz oscillator 400 in electronic products.

於一些實施例中，該中空框架5的寬度、形狀及位置可視依需求或設計而有所不同，只要可令該第一電極3的延伸電極部32與該第二電極4的延伸電極部42能露出於該薄化壓電基板2的第二表面22週緣，以供對外電連接即可，並無具體限制。In some embodiments, the width, shape and position of the hollow frame 5 may be different according to requirements or designs, as long as the extension electrode portion 32 of the first electrode 3 and the extension electrode portion 42 of the second electrode 4 can be formed. It can be exposed on the periphery of the second surface 22 of the thinned piezoelectric substrate 2 for external electrical connection, and there is no specific limitation.

參閱圖2與圖3，前述該石英振盪器的製作方法的該實施例包含：一第一電極部製作步驟71、一貼合步驟72、一薄化步驟73、一第二電極製作步驟74、一延伸電極製作步驟75、一框架設置步驟76，及一移除步驟77。Referring to FIGS. 2 and 3 , the foregoing embodiment of the method for fabricating the quartz oscillator includes: a first electrode part fabrication step 71 , a lamination step 72 , a thinning step 73 , a second electrode fabrication step 74 , An extension electrode fabrication step 75 , a frame setting step 76 , and a removal step 77 .

該第一電極部製作步驟71是於一具有預定厚度的壓電基板20的其中一表面以沉積或印刷方式形成該第一電極部31，得到一第一中間物200。在本實施例中，該壓電基板20是由一具有原始厚度約為100μm的石英晶體構成，且該第一電極部31是以導電材料透過沉積的方式形成於該壓電基板20上且其中一側端會與該壓電基板20的側周面齊平。The first electrode portion fabrication step 71 is to form the first electrode portion 31 on one surface of a piezoelectric substrate 20 having a predetermined thickness by deposition or printing to obtain a first intermediate 200 . In this embodiment, the piezoelectric substrate 20 is made of a quartz crystal with an original thickness of about 100 μm, and the first electrode portion 31 is formed on the piezoelectric substrate 20 by a conductive material through deposition method, and wherein One side end is flush with the side peripheral surface of the piezoelectric substrate 20 .

該貼合步驟72是將該第一中間物200以該第一電極部31朝向一暫時基板30的方向透過一膠材貼合於該暫時基板30，以在後續製程提供一暫時性的支撐，而得到一第二中間物300。為了易於後續該暫時基板30的移除，該膠材可選自光解黏材料或熱解黏材料。The attaching step 72 is to attach the first intermediate 200 to the temporary substrate 30 through a glue material in the direction of the first electrode portion 31 facing the temporary substrate 30, so as to provide a temporary support in the subsequent process. And a second intermediate 300 is obtained. In order to facilitate subsequent removal of the temporary substrate 30 , the adhesive can be selected from photo-debonding materials or thermal-debonding materials.

要說明的是，該暫時基板30的寬度可等於、大於、或小於該壓電基板20的寬度。於一些實施例中，可令該暫時基板30的寬度小於該壓電基板20的寬度，而不完全遮覆該第一電極部31，以易於該第一延伸電極部31的製作。It should be noted that the width of the temporary substrate 30 may be equal to, greater than, or less than the width of the piezoelectric substrate 20 . In some embodiments, the width of the temporary substrate 30 may be smaller than the width of the piezoelectric substrate 20 without completely covering the first electrode portion 31 to facilitate the fabrication of the first extended electrode portion 31 .

該薄化步驟73是將該第二中間物300的壓電基板20進行全面薄化，而得到該薄化壓電基板2。實施時，該壓電基板20可以研磨或化學蝕刻(濕蝕刻、乾蝕刻)的方式進行全面薄化而得到該薄化壓電基板2，且令該薄化壓電基板2整體具有相同的厚度。The thinning step 73 is to thin the entire piezoelectric substrate 20 of the second intermediate 300 to obtain the thinned piezoelectric substrate 2 . During implementation, the piezoelectric substrate 20 can be fully thinned by grinding or chemical etching (wet etching, dry etching) to obtain the thinned piezoelectric substrate 2, and the entire thinned piezoelectric substrate 2 has the same thickness. .

要說明的是，由於該壓電基板2於薄化的過程中有該暫時基板30作為支撐，因此，其厚度可薄化至極薄，而可更適用於高頻振盪。以該壓電基板20的厚度為100μm為例，該薄化壓電基板2的厚度可薄化至不大於50μm，或是不大於10μm的厚度。It should be noted that, since the piezoelectric substrate 2 is supported by the temporary substrate 30 during the thinning process, the thickness of the piezoelectric substrate 2 can be reduced to an extremely thin level, which is more suitable for high-frequency oscillation. Taking the thickness of the piezoelectric substrate 20 as 100 μm as an example, the thickness of the thinned piezoelectric substrate 2 can be reduced to a thickness of not more than 50 μm, or not more than 10 μm.

該第二電極製作步驟74是於該薄化壓電基板2反向該暫時基板30的表面且相應於該第一電極部31的位置透過沉積或印刷的方式形成該第二電極4，並令該第二電極4的正投影與該第一電極部31至少部分重合。The second electrode forming step 74 is to form the second electrode 4 by deposition or printing on the surface of the thinned piezoelectric substrate 2 opposite to the surface of the temporary substrate 30 and corresponding to the position of the first electrode portion 31 , and make the second electrode 4 . The orthographic projection of the second electrode 4 at least partially coincides with the first electrode portion 31 .

具體的說，該第二電極製作步驟74是於該薄化壓電基板2表面的中央區域以沉積或印刷方式形成與該第一電極部31的正投影範圍部分疊合的該第二電極部41，及自該第二電極部41延伸至該薄化壓電基板2週緣的該第二延伸電極部42(見圖4)，而製得該第二電極2。Specifically, the second electrode fabrication step 74 is to form the second electrode portion partially overlapping the orthographic projection range of the first electrode portion 31 by deposition or printing in the central area of the surface of the thinned piezoelectric substrate 2 . 41 , and the second extended electrode portion 42 (see FIG. 4 ) extending from the second electrode portion 41 to the periphery of the thinned piezoelectric substrate 2 , to obtain the second electrode 2 .

該延伸電極製作步驟75是以印刷或鍍膜方式形成自該第一電極部31延伸並沿著該薄化壓電基板2的側周面延伸至該薄化壓電基板2形成有該第二電極4的表面的該第一延伸電極部32。在本實施例中，該第一電極3的第一延伸電極部32是以導電材料透過印刷方式形成。The extended electrode fabrication step 75 is formed by printing or coating, extending from the first electrode portion 31 and extending along the side peripheral surface of the thinned piezoelectric substrate 2 to the thinned piezoelectric substrate 2 where the second electrode is formed 4 of the first extended electrode portion 32 on the surface. In the present embodiment, the first extending electrode portion 32 of the first electrode 3 is formed by a conductive material through printing.

要說明的是，該第二電極製作步驟74與該延伸電極製作步驟75可依製程需求而有不同的實行順序。It should be noted that, the second electrode fabrication step 74 and the extended electrode fabrication step 75 may have different execution sequences according to process requirements.

該框架設置步驟76是將具有預定厚度的該中空框架5利用黏膠形成的該黏膠層6貼合在該薄化壓電基板2形成有該第二電極4的表面，並令該中空框架5框圍該第二電極4的第二電極部41。其中，該中空框架5是由一絕緣材料構成的基板通過預加工形成所需的形狀、尺寸後，再利用黏膠將其貼合至該薄化壓電基板2，且該預加工可透過CNC車床、雷射裁切或是蝕刻等方式進行。The frame setting step 76 is to attach the hollow frame 5 with a predetermined thickness to the adhesive layer 6 formed by adhesive on the surface of the thin piezoelectric substrate 2 where the second electrode 4 is formed, and make the hollow frame 5 5. The second electrode portion 41 of the second electrode 4 is surrounded by a frame. Wherein, the hollow frame 5 is a substrate made of an insulating material that is pre-processed to form the desired shape and size, and then bonded to the thin piezoelectric substrate 2 by adhesive, and the pre-processing can pass through the CNC Lathe, laser cutting or etching.

最後，實施該移除步驟77，將該暫時基板30自該薄化壓電基板2移除，而得到該石英振盪器400。Finally, the removing step 77 is performed to remove the temporary substrate 30 from the thinned piezoelectric substrate 2 to obtain the quartz oscillator 400 .

該移除步驟77可視該貼合步驟72中使用的膠材，而選擇相應的移除方式。例如，該膠材為使用光解黏材料或熱解黏材料時，該移除步驟77則可使用照光或加熱方式，移除該暫時基板30。In the removing step 77 , a corresponding removing method can be selected according to the adhesive material used in the laminating step 72 . For example, when the adhesive material is a photo-debonding material or a thermal-debonding material, the removing step 77 may use light or heating to remove the temporary substrate 30 .

該石英振盪器400可透過後續封裝，而應用於電子產品。The quartz oscillator 400 can be applied to electronic products through subsequent packaging.

在本實施例的製作方法中，該薄化壓電基板2因為整體具有相同厚度，因此該第二延伸電極部42也為平面延伸，而不會如習知的高頻石英振盪器1(參圖1)的頂電極12會形成在有不同厚度差的表面，且該第一電極3的延伸電極部32只需沿著經薄化的該薄化壓電基板2的側周面延伸至該第二表面22，相較於傳統的高頻石英振盪器1的底電極13須延伸爬過較厚的該支撐框架112，本實施例的製作方法更有利於電極的製作，進而提升產品的良率。In the manufacturing method of the present embodiment, since the thinned piezoelectric substrate 2 has the same thickness as a whole, the second extended electrode portion 42 is also extended in a plane, which is not as in the conventional high-frequency quartz oscillator 1 (refer to The top electrode 12 of FIG. 1) is formed on surfaces with different thickness differences, and the extended electrode portion 32 of the first electrode 3 only needs to extend along the side peripheral surface of the thinned piezoelectric substrate 2 to the surface of the thinned piezoelectric substrate 2. For the second surface 22 , compared with the conventional high-frequency quartz oscillator 1 where the bottom electrode 13 has to extend and climb over the thicker support frame 112 , the fabrication method of this embodiment is more conducive to the fabrication of electrodes, thereby improving the quality of the product. Rate.

綜上所述，本發明石英振盪器的製作方法透過先將形成有該第一電極部31的壓電基板20貼合於該暫時基板30，再將該壓電基板20進行全面薄化，再於薄化後得到的該薄化壓電基板2表面形成該第二電極4，因為薄化後的該薄化壓電基板2有該暫時基板30支撐，因此能更有效薄化，且能避免該薄化壓電基板2因厚度較薄而於製程中碎裂的問題，此外，因為該薄化壓電基板2的表面平坦，因此，該第二延伸電極部42於延伸時也為平面延伸，而可避免習知(如圖1所示)，由於該石英基板11的中間區域111與週緣的支撐框架112的厚度不同，使該頂電極12於延伸至該支撐框架112的過程需要經過該中間區域111與該支撐框架112的厚度差，而使得該頂電極12製程複雜且有良率不易控制的問題；此外，因為薄化後的該薄化壓電基板2的整體厚度極薄，因此，於製作該第一延伸電極部32時的延伸高度也大幅減小，而可更有利於該第一電極3與該第二電極4的製作。此外，通過該中空框架5增加該石英振盪器400週緣的厚度，能提高該石英振盪器400在產生高頻振盪期間的承受力，而使該石英振盪器400同時能維持良好的高頻振盪性與足夠的機械支撐力，故確實可達成本發明的目的。To sum up, the method for manufacturing a quartz oscillator of the present invention involves firstly attaching the piezoelectric substrate 20 with the first electrode portion 31 formed thereon to the temporary substrate 30 , and then thinning the piezoelectric substrate 20 in its entirety, and then thinning the piezoelectric substrate 20 . The second electrode 4 is formed on the surface of the thinned piezoelectric substrate 2 obtained after thinning, because the thinned piezoelectric substrate 2 after thinning is supported by the temporary substrate 30 , so it can be thinned more effectively and can avoid The thinned piezoelectric substrate 2 has a problem of cracking during the manufacturing process due to its thin thickness. In addition, because the surface of the thinned piezoelectric substrate 2 is flat, the second extending electrode portion 42 also extends in a plane when extending. , and the conventional (as shown in FIG. 1 ) can be avoided. Since the thicknesses of the middle region 111 of the quartz substrate 11 and the peripheral support frame 112 are different, the process of extending the top electrode 12 to the support frame 112 needs to pass through the support frame 112 . The difference in thickness between the middle region 111 and the support frame 112 makes the top electrode 12 complex and the yield is difficult to control; , the extension height of the first extending electrode portion 32 is also greatly reduced, which is more beneficial to the fabrication of the first electrode 3 and the second electrode 4 . In addition, by increasing the thickness of the periphery of the quartz oscillator 400 through the hollow frame 5, the bearing capacity of the quartz oscillator 400 during high frequency oscillation can be improved, and the quartz oscillator 400 can maintain good high frequency oscillation at the same time. With sufficient mechanical supporting force, the purpose of the present invention can indeed be achieved.

惟以上所述者，僅為本發明的實施例而已，當不能以此限定本發明實施的範圍，凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾，皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention, and should not limit the scope of implementation of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the patent specification are still included in the scope of the present invention. within the scope of the invention patent.

20:壓電基板 2:薄化壓電基板 21:第一表面 22:第二表面 30:暫時基板 3:第一電極 31:第一電極部 32:第一延伸電極部 4:第二電極 41:第二電極部 42:第二延伸電極部 5:中空框架 6:黏膠層 200:第一中間物 300:第二中間物 400:石英振盪器 71:第一電極部製作步驟 72:貼合步驟 73:薄化步驟 74:第二電極製作步驟 75:延伸電極製作步驟 76:框架設置步驟 77:移除步驟20: Piezoelectric substrate 2: Thin piezoelectric substrate 21: First surface 22: Second surface 30: Temporary substrate 3: The first electrode 31: The first electrode part 32: The first extension electrode part 4: The second electrode 41: Second electrode part 42: Second extension electrode part 5: Hollow frame 6: Adhesive layer 200: First Intermediate 300: Second Intermediate 400: Quartz oscillator 71: First electrode part fabrication steps 72: Fitting step 73: Thinning step 74: Second electrode fabrication steps 75: Extension electrode fabrication steps 76: Frame Setup Steps 77: Removal step

本發明的其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一剖視示意圖，說明習知的一高頻石英振盪器的剖視結構；圖2是一流程圖，說明本發明實施例的石英振盪器的製作方法；圖3是一流程示意圖，輔助說明圖2該石英振盪器的製作方法；圖4是一俯視圖，說明該石英振盪器的俯視結構；及圖5是一剖視圖，輔助說明沿圖4的V-V割面線的剖視結構。Other features and effects of the present invention will be clearly shown in the embodiments with reference to the drawings, wherein: FIG. 1 is a schematic cross-sectional view illustrating the cross-sectional structure of a conventional high-frequency quartz oscillator; FIG. 2 is a A flowchart illustrating a method for manufacturing a quartz oscillator according to an embodiment of the present invention; FIG. 3 is a schematic flowchart illustrating the method for manufacturing the quartz oscillator in FIG. 2 ; FIG. 4 is a plan view illustrating a top-view structure of the quartz oscillator. and FIG. 5 is a cross-sectional view to assist in explaining the cross-sectional structure along the V-V secant line in FIG. 4 .

20:壓電基板 20: Piezoelectric substrate

2:薄化壓電基板 2: Thin piezoelectric substrate

21:第一表面 21: First surface

22:第二表面 22: Second surface

30:暫時基板 30: Temporary substrate

3:第一電極 3: The first electrode

31:第一電極部 31: The first electrode part

32:第一延伸電極部 32: The first extension electrode part

4:第二電極 4: The second electrode

41:第二電極部 41: Second electrode part

42:第二延伸電極部 42: Second extension electrode part

5:中空框架 5: Hollow frame

6:黏膠層 6: Adhesive layer

200:第一中間物 200: First Intermediate

300:第二中間物 300: Second Intermediate

400:石英振盪器 400: Quartz oscillator

Claims

一種石英振盪器的製作方法，包含：一第一電極部製作步驟，於一具有預定厚度的壓電基板的其中一表面形成一第一電極部，得到一第一中間物；一貼合步驟，將該第一中間物以該第一電極部朝向一暫時基板的方向貼合於該暫時基板，得到一第二中間物；一薄化步驟，將該第二中間物的壓電基板進行全面薄化，而得到一整體厚度小於該壓電基板的薄化壓電基板；一第二電極製作步驟，於該薄化壓電基板反向該暫時基板的表面且相應於該第一電極部的位置形成一第二電極，並令該第二電極的正投影與該第一電極部至少部分重合；一延伸電極製作步驟，形成一自該第一電極部延伸並沿著該薄化壓電基板的側周面延伸至該薄化壓電基板形成有該第二電極的表面的第一延伸電極部；及一框架設置步驟，將一具有預定厚度的中空框架貼合在該薄化壓電基板形成有該第二電極的表面，並令該中空框架框圍該第二電極。 A method for manufacturing a quartz oscillator, comprising: a first electrode part manufacturing step, forming a first electrode part on one surface of a piezoelectric substrate with a predetermined thickness to obtain a first intermediate; a bonding step of bonding the first intermediate to the temporary substrate with the first electrode portion facing the temporary substrate to obtain a second intermediate; In a thinning step, the piezoelectric substrate of the second intermediate is fully thinned to obtain a thinned piezoelectric substrate whose overall thickness is smaller than that of the piezoelectric substrate; In a second electrode fabrication step, a second electrode is formed on the surface of the thinned piezoelectric substrate opposite to the temporary substrate and corresponding to the position of the first electrode portion, and the orthographic projection of the second electrode is aligned with the first electrode. The electrode portions at least partially overlap; an extension electrode fabrication step, forming a first extension electrode portion extending from the first electrode portion and extending along the side peripheral surface of the thinned piezoelectric substrate to the surface of the thinned piezoelectric substrate on which the second electrode is formed ;and In a frame setting step, a hollow frame with a predetermined thickness is attached to the surface of the thinned piezoelectric substrate on which the second electrode is formed, and the hollow frame surrounds the second electrode.

如請求項1所述的石英振盪器的製作方法，其中，還包含一實施於該框架設置步驟後的移除步驟，將該暫時基板自該薄化壓電基板移除。The method for manufacturing a quartz oscillator according to claim 1, further comprising a removing step performed after the frame setting step, to remove the temporary substrate from the thinned piezoelectric substrate.

如請求項1所述的石英振盪器的製作方法，其中，該第二電極製作步驟是於該薄化壓電基板的表面形成一對應於該第一電極部的第二電極部，及一自該第二電極部延伸至該薄化壓電基板週緣的第二延伸電極部，且令該第二電極部的正投影與該第一電極部至少部分重合，而製得該第二電極。The method for manufacturing a quartz oscillator according to claim 1, wherein the second electrode manufacturing step is to form a second electrode portion corresponding to the first electrode portion on the surface of the thinned piezoelectric substrate, and a self- The second electrode portion extends to the second extending electrode portion on the periphery of the thinned piezoelectric substrate, and the orthographic projection of the second electrode portion is at least partially overlapped with the first electrode portion to obtain the second electrode.

如請求項1所述的石英振盪器的製作方法，其中，該第一電極部及該第二電極是以導電材料透過沉積或印刷方式形成。The method for manufacturing a quartz oscillator according to claim 1, wherein the first electrode portion and the second electrode are formed by deposition or printing of conductive materials.

如請求項1所述的石英振盪器的製作方法，其中，該延伸電極部是以導電材料透過印刷或鍍膜方式形成。The method for manufacturing a quartz oscillator according to claim 1, wherein the extended electrode portion is formed by printing or plating through a conductive material.

如請求項1所述的石英振盪器的製作方法，其中，該薄化步驟是將該壓電基板以研磨或化學蝕刻的方式進行薄化而形成該薄化壓電基板。The method for manufacturing a quartz oscillator according to claim 1, wherein the thinning step is to thin the piezoelectric substrate by grinding or chemical etching to form the thinned piezoelectric substrate.

如請求項6所述的石英振盪器的製作方法，其中，該薄化壓電基板的厚度不大於50μm。The method for manufacturing a quartz oscillator according to claim 6, wherein the thickness of the thinned piezoelectric substrate is not greater than 50 μm.

如請求項1所述的石英振盪器的製作方法，其中，該第一電極部、該延伸電極部，及該第二電極的材料選自金、銀，或鋁，且彼此為相同或不同。The method for manufacturing a quartz oscillator according to claim 1, wherein the materials of the first electrode portion, the extended electrode portion, and the second electrode are selected from gold, silver, or aluminum, and are the same or different from each other.

一種石英振盪器，包含：一薄化壓電基板，具有相同厚度，包括彼此反向的一第一表面及一第二表面；一第一電極，包括一位於該薄化壓電基板的該第一表面的第一電極部，及一自該第一電極部延伸並沿著該薄化壓電基板的側周面延伸至該第二表面的延伸電極部；一第二電極，位於該薄化壓電基板的該第二表面，包括一與該第一電極部的正投影範圍部分疊合的第二電極部，及一自該第二電極部延伸至與該第一延伸電極部位於同側的第二延伸電極部；一中空框架，與該薄化壓電基板的第二表面黏接；及一黏膠層，介於該薄化壓電基板與該中空框架之間，用於接合該薄化壓電基板與該中空框架。 A quartz oscillator comprising: a thinned piezoelectric substrate with the same thickness, including a first surface and a second surface opposite to each other; a first electrode, comprising a first electrode portion located on the first surface of the thinned piezoelectric substrate, and a first electrode portion extending from the first electrode portion and extending along the side peripheral surface of the thinned piezoelectric substrate to the the extended electrode portion of the second surface; a second electrode, located on the second surface of the thinned piezoelectric substrate, comprising a second electrode portion partially overlapping with the orthographic projection range of the first electrode portion, and a second electrode portion extending from the second electrode portion to the first extension electrode part is located at the second extension electrode part on the same side; a hollow frame bonded to the second surface of the thinned piezoelectric substrate; and An adhesive layer is interposed between the thinned piezoelectric substrate and the hollow frame for bonding the thinned piezoelectric substrate and the hollow frame.

如請求項9所述的石英振盪器，其中，該第二電極部位於該中空框架的框圍範圍內。The quartz oscillator according to claim 9, wherein the second electrode portion is located within a frame surrounding of the hollow frame.