TWI759496B - Dressing method - Google Patents

Dressing method Download PDF

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Publication number
TWI759496B
TWI759496B TW107119453A TW107119453A TWI759496B TW I759496 B TWI759496 B TW I759496B TW 107119453 A TW107119453 A TW 107119453A TW 107119453 A TW107119453 A TW 107119453A TW I759496 B TWI759496 B TW I759496B
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Taiwan
Prior art keywords
cutting blade
cutting
trimming
convex portion
blade
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TW107119453A
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Chinese (zh)
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TW201908062A (en
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花見隆之
小野寺剛
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/368—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades installed as an accessory on another machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/36—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades
    • B24B3/46—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of cutting blades of disc blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/18—Wheels of special form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

在不使切割刀片破損的情形下，在短時間內將切割刀片的前端整形為平直。 The front end of the cutting blade is shaped to be straight in a short time without breaking the cutting blade.

設成下述構成：在將切割刀片的前端面修整為平直形狀時所使用的修整板上，形成朝切割刀片的切割方向延伸的複數列凸部。因為將凸部的上表面形成為比切割刀片的厚度更狹窄的寬度，所以可藉由將切割刀片與修整板在切割進給方向上移動，來藉由切割刀片切割凸部而僅將切割刀片的前端面修整為平直形狀。 A configuration is adopted in which a plurality of rows of convex portions extending in the cutting direction of the dicing blade are formed on a trimming plate used when the front end surface of the dicing blade is trimmed into a straight shape. Since the upper surface of the convex portion is formed to have a narrower width than the thickness of the cutting blade, it is possible to cut the convex portion by the cutting blade and only the cutting blade by moving the cutting blade and the trimming plate in the cutting feed direction. The front end face is trimmed to a straight shape.

Description

修整方法 Dressing method

發明領域 Field of Invention

本發明是有關於一種對切割刀片的前端進行修整的修整板、修整方法。 The present invention relates to a trimming plate and trimming method for trimming the front end of a cutting blade.

發明背景 Background of the Invention

在使用了切割刀片的切割加工中，會在切割中使切割刀片的前端形狀帶有圓角而使鋒利程度變差。因此，會定期地對切割刀片的前端實施修整以恢復鋒利程度。以往，作為這種修整已知的有，以修整板將切割刀片的前端整形為平直的平直修整(flat dress)(參照例如專利文獻1、2)。在平直修整中，是在使切割刀片旋轉且稍微切入修整板的狀態下，使修整板與切割刀片在切割刀片的旋轉軸方向上相對地移動來進行修整。 In the dicing process using the dicing blade, the shape of the front end of the dicing blade is rounded during cutting, and the sharpness is deteriorated. Therefore, the leading end of the cutting blade is periodically trimmed to restore sharpness. Conventionally, as such a dressing, a flat dress in which the front end of the dicing blade is straightened with a dressing plate is known (for example, refer to Patent Documents 1 and 2). In straight trimming, trimming is performed by relatively moving the trimming plate and the cutting blade in the direction of the rotation axis of the cutting blade in a state where the cutting blade is rotated to slightly cut into the trimming plate.

先前技術文獻 prior art literature 專利文獻 Patent Literature

專利文獻1：日本專利特開2013-082021號公報 Patent Document 1: Japanese Patent Laid-Open No. 2013-082021

專利文獻2：日本專利特開2011-249571號公報 Patent Document 2: Japanese Patent Laid-Open No. 2011-249571

發明概要 Summary of Invention

然而，因為在專利文獻1、2的平直修整中，是在使切割刀片切入修整板的狀態下原樣使切割刀片在旋轉軸方向上移動，所以恐有在旋轉軸方向上施加較大的負荷而使切割刀片破損之虞。因此，為了不在修整中使切割刀片破損，必須將切割刀片的前端僅些微地切入修整板，且使修整板與切割刀片以低速相對地移動，因為是逐次少量磨耗切割刀片的前端來整形為平直，所以已有修整時間變得較長的問題。 However, in the straight dressing of Patent Documents 1 and 2, since the cutting blade is moved in the direction of the rotation axis in a state where the cutting blade is cut into the dressing plate, a large load may be applied in the direction of the rotation axis. There is a risk of breakage of the cutting blade. Therefore, in order not to damage the cutting blade during dressing, it is necessary to slightly cut the front end of the cutting blade into the dressing plate and move the dressing plate and the cutting blade relatively at a low speed, because the front end of the cutting blade needs to be slightly worn to form a flat surface. straight, so there has been a problem that the dressing time becomes longer.

本發明是有鑒於所述問題點而作成之發明，其中一個目的在於提供一種可以在不使切割刀片破損的情形下，在短時間內將切割刀片的前端整形為平直之修整板及修整方法。 The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a trimming plate and a trimming method that can straighten the front end of the cutting blade in a short time without breaking the cutting blade .

本發明的一態樣的修整板是將預定的厚度的切割刀片的前端修整為平直形狀的修整板，其特徵在於：具備有於該切割刀片的切割方向上延伸的凸部，該凸部的上表面是寬度比該切割刀片的厚度稍微狹窄。 A trimming plate according to one aspect of the present invention is a trimming plate in which a tip end of a cutting blade having a predetermined thickness is trimmed into a straight shape, and is characterized by having a convex portion extending in the cutting direction of the cutting blade, and the convex portion is characterized in that: The upper surface is slightly narrower in width than the thickness of the cutting blade.

根據此構成，因為修整板的凸部的上表面形成得比切割刀片的厚度更狹窄，所以不會有切割刀片的兩側面碰抵到修整板的凸部之情形，而可僅修整切割刀片的前端面。據此，即便切割刀片的前端帶有圓角，也可藉由以切割刀片的前端來切入修整板的凸部，而將切割刀片的前端整形為平直。又，因為修整板的凸部的延伸方向與 切割刀片的切割方向為一致，所以不會有在修整時對切割刀片施加較大的負荷之情形，而可以使修整板與切割刀片以高速相對地移動。據此，可以在不使切割刀片破損的情形下，在短時間內將切割刀片的前端整形為平直。 According to this configuration, since the upper surface of the convex portion of the trimming plate is formed to be narrower than the thickness of the cutting blade, both side surfaces of the cutting blade do not come into contact with the convex portion of the trimming plate, and only the trimming blade can be trimmed. front face. According to this, even if the front end of the cutting blade is rounded, the front end of the cutting blade can be straightened by cutting into the convex portion of the trimming plate with the front end of the cutting blade. In addition, since the extending direction of the convex portion of the trim plate is different from the The cutting direction of the cutting blade is the same, so there is no situation that a large load is applied to the cutting blade during trimming, and the trimming plate and the cutting blade can be relatively moved at high speed. According to this, the front end of the cutting blade can be straightened in a short time without breaking the cutting blade.

本發明的一態樣的修整方法，是使用了上述之修整板的切割刀片的修整方法，其是進行：保持步驟，以保持台保持該修整板；定位步驟，使與朝切割方向延伸的該修整板的該凸部的延伸方向正交的方向之寬度的中心，與該切割刀片的厚度的中心一致，並且將該切割刀片定位在從該凸部的上表面切入預定量的高度上；及使已在該定位步驟中定位的該切割刀片，與該修整板在切割進給方向上相對地移動而切割該凸部，以對該切割刀片進行修整。 A trimming method according to an aspect of the present invention is a trimming method of a cutting blade using the trimming plate described above, and includes: a holding step of holding the trimming plate with a holding table; The center of the width in the direction orthogonal to the extending direction of the convex portion of the trim plate coincides with the center of the thickness of the cutting blade, and the cutting blade is positioned at a height that cuts a predetermined amount from the upper surface of the convex portion; and The cutting blade positioned in the positioning step is moved relative to the trimming plate in the cutting feed direction to cut the convex portion to trim the cutting blade.

本發明的一態樣的其他的修整方法，是從平板的修整板形成凸部，並且將切割刀片的前端修整為平直的修整方法，其是進行：保持步驟，將該平板的修整板保持於保持台；凸部形成步驟，以該切割刀片切割該保持台所保持的該平板的修整板，並且以比該切割刀片的厚度稍微狹窄的寬度形成朝切割方向延伸的凸部；定位步驟，在該凸部形成步驟之後，使與該凸部的延伸方向正交之寬度的中心，與該切割刀片的厚度的中心一致，並且將該切割刀片定位在從該凸部的上表面切入預定 量的高度上；及使已在該定位步驟中定位的該切割刀片，與該凸部形成後的修整板在切割進給方向上相對地移動而切割該凸部，以對該切割刀片進行修整。 Another trimming method according to an aspect of the present invention is a trimming method in which a convex portion is formed from a flat trimming plate and the front end of the dicing blade is trimmed to be straight, and a holding step is performed to hold the flat trimming plate. in a holding table; a convex portion forming step, cutting the trim plate of the flat plate held by the holding table with the cutting blade, and forming a convex portion extending in the cutting direction with a width slightly narrower than the thickness of the cutting blade; positioning step, in After the protruding portion forming step, the center of the width orthogonal to the extending direction of the protruding portion is aligned with the center of the thickness of the cutting blade, and the cutting blade is positioned to cut in a predetermined direction from the upper surface of the protruding portion and the cutting blade positioned in the positioning step is moved relative to the trimming plate after the convex portion is formed in the cutting feed direction to cut the convex portion to trim the cutting blade .

根據本發明，是在修整板上形成比切割刀片的厚度更狹窄的凸部，並以切割刀片的前端切入該凸部的上表面，藉此，可以在不使切割刀片破損的情形下，在短時間內將切割刀片的前端整形為平直。 According to the present invention, a convex portion narrower than the thickness of the cutting blade is formed on the trimming plate, and the front end of the cutting blade is cut into the upper surface of the convex portion. Shape the front end of the cutting blade straight in a short time.

1:切割裝置 1: Cutting device

10:基台 10: Abutment

11:立壁部 11: Standing wall

20:切割進給機構 20: Cutting feed mechanism

21、31、41:導軌 21, 31, 41: Rails

22:X軸工作台 22: X-axis table

23、33、43:滾珠螺桿 23, 33, 43: Ball screw

24:驅動馬達 24: drive motor

25:工作夾台 25: Work clamp table

30:分度進給機構 30: Indexing feed mechanism

32:Y軸工作台 32: Y-axis table

40:切入進給機構 40: Cut into the feed mechanism

42:Z軸工作台 42: Z-axis table

50:切割機構 50: Cutting mechanism

51:殼體 51: Shell

52、73、85:切割刀片 52, 73, 85: cutting blades

53、74:前端面 53, 74: Front face

54、75:兩側面 54, 75: Both sides

60、71:保持台 60, 71: Hold Desk

61、72:保持面 61, 72: Keep Faces

62:淺溝 62: Shallow ditch

63:吸引口 63: Attraction

65、78:凸部 65, 78: convex part

66:凹部 66: Recess

67、79:凸部的上表面 67, 79: Upper surface of convex part

77:切割溝 77: Cutting Groove

81:樹脂層 81: resin layer

82:配線基板 82: Wiring board

83:金屬配線 83: Metal wiring

86:銳角部分 86: acute angle part

C1、C2:中心 C1, C2: Center

D、D1、D2:修整板 D, D1, D2: trim plate

W:工件 W: workpiece

圖1是第1實施形態之切割裝置的立體圖。 FIG. 1 is a perspective view of the cutting device according to the first embodiment.

圖2是顯示封裝基板的切割狀態的圖。 FIG. 2 is a view showing a cut state of the package substrate.

圖3是比較例的平直修整的說明圖。 FIG. 3 is an explanatory diagram of straightening of a comparative example.

圖4是第1實施形態的修整板及保持台的立體圖。 FIG. 4 is a perspective view of the trimming plate and the holding table according to the first embodiment.

圖5是第1實施形態的修整板的凸部的說明圖。 5 is an explanatory diagram of a convex portion of the trimming plate according to the first embodiment.

圖6是第1實施形態的修整方法的說明圖。 FIG. 6 is an explanatory diagram of a dressing method according to the first embodiment.

圖7是第2實施形態的修整方法的說明圖。 FIG. 7 is an explanatory diagram of a dressing method according to the second embodiment.

用以實施發明之形態 Form for carrying out the invention

以下，參照附加圖式針對本實施形態之切割裝置作說明。圖1是第1實施形態之切割裝置的立體圖。圖2是顯示封裝基板的切割狀態的圖。圖3是比較例的平直修整的說明圖。再者，在本實施形態中，雖然是例示具備有單一的切割刀片的切割裝置，但並非限定於此構成。切割裝置只 要為可切割工件的構成即可。 Hereinafter, the cutting device of the present embodiment will be described with reference to the attached drawings. FIG. 1 is a perspective view of the cutting device according to the first embodiment. FIG. 2 is a view showing a cut state of the package substrate. FIG. 3 is an explanatory diagram of straightening of a comparative example. In addition, in this embodiment, although the dicing apparatus provided with the single dicing blade was illustrated, it is not limited to this structure. cutting device only It is only necessary to have a structure capable of cutting workpieces.

如圖1所示，切割裝置1是對保持於工作夾台25上的工件W進行切割的裝置，且是構成為以修整板D1定期地對切割刀片52的前端進行平直修整。工件W是例如在封裝有半導體晶片之上表面視角下長方形的封裝基板，且是將組裝於配線基板上的半導體晶片以塑模樹脂密封而形成。工件W的正面是被分割預定線(圖未示)所區劃，且可藉由沿著分割預定線切割工件W，而將封裝基板分割成一個個的半導體封裝。 As shown in FIG. 1, the cutting apparatus 1 is an apparatus which cuts the workpiece|work W held on the table 25, and is comprised so that the front-end|tip of the cutting blade 52 may be straightened regularly by the dressing plate D1. The workpiece W is, for example, a package substrate having a rectangular shape when viewed from the top surface of the packaged semiconductor wafer, and is formed by sealing the semiconductor wafer mounted on the wiring board with a mold resin. The front surface of the workpiece W is divided by a planned dividing line (not shown), and the package substrate can be divided into individual semiconductor packages by cutting the workpiece W along the planned dividing line.

在切割裝置1的基台10上設有將工作夾台25朝X軸方向切割進給的切割進給機構20。切割進給機構20具有配置於基台10上之平行於X軸方向的一對導軌21、及可滑動地設置在一對導軌21上之馬達驅動的X軸工作台22。在X軸工作台22的背面側形成有未圖示之螺帽部，且在該螺帽部中螺合有滾珠螺桿23。藉由將連結於滾珠螺桿23之一端部的驅動馬達24旋轉驅動，工作夾台25即沿著一對導軌21在X軸方向上切割進給。 The base 10 of the cutting device 1 is provided with a cutting and feeding mechanism 20 that cuts and feeds the table 25 in the X-axis direction. The cutting and feeding mechanism 20 includes a pair of guide rails 21 arranged on the base 10 and parallel to the X-axis direction, and a motor-driven X-axis table 22 slidably provided on the pair of guide rails 21 . A nut portion, not shown, is formed on the back side of the X-axis table 22 , and a ball screw 23 is screwed into the nut portion. By rotationally driving the drive motor 24 connected to one end of the ball screw 23 , the table 25 is cut and fed in the X-axis direction along the pair of guide rails 21 .

在X軸工作台22上是以可繞著Z軸旋轉的方式設置有保持工件W的工作夾台25。在工作夾台25的上表面形成有連接於吸引源(未圖示)的保持面(未圖示)，且可藉由在保持面產生的負壓來吸引保持工件W。又，在X軸工作台22上設有保持修整板D1的保持台60。藉由以切割刀片52切入修整板D1，可實施定心、磨銳、平直修整等。再者，針對使用了修整板D1的修整的詳細內容，容 後敘述。 On the X-axis table 22, a work chuck 25 for holding the workpiece W is rotatably provided around the Z-axis. A holding surface (not shown) connected to a suction source (not shown) is formed on the upper surface of the work chuck 25, and the workpiece W can be sucked and held by the negative pressure generated on the holding surface. Moreover, on the X-axis table 22, a holding table 60 for holding the trimming plate D1 is provided. By cutting into the trimming plate D1 with the cutting blade 52, centering, sharpening, straight trimming, and the like can be performed. In addition, the details of the trimming using the trimming plate D1 are as follows: narrated later.

在基台10上豎立設置有門型的立壁部11，在立壁部11上設有分度進給機構30與切入進給機構40，該分度進給機構30是將切割機構50朝Y軸方向分度進給，該切入進給機構40是將切割機構50朝Z軸方向切入進給。分度進給機構30具有配置於立壁部11的前表面之平行於Y軸方向的一對導軌31、及可滑動地設置在一對導軌31上之Y軸工作台32。切入進給機構40具有配置於Y軸工作台32上之平行於Z軸方向的一對導軌41、及可滑動地設置在一對導軌41上之Z軸工作台42。 A portal-shaped vertical wall portion 11 is erected on the base 10 , and an indexing feeding mechanism 30 and a cutting feeding mechanism 40 are provided on the vertical wall portion 11 . The indexing and feeding mechanism 30 is to move the cutting mechanism 50 toward the Y axis The direction indexing feed is performed, and the cut-in feed mechanism 40 cuts and feeds the cutting mechanism 50 in the Z-axis direction. The index feeding mechanism 30 includes a pair of guide rails 31 arranged on the front surface of the vertical wall portion 11 and parallel to the Y-axis direction, and a Y-axis table 32 slidably provided on the pair of guide rails 31 . The plunge feed mechanism 40 includes a pair of guide rails 41 arranged on the Y-axis table 32 and parallel to the Z-axis direction, and a Z-axis table 42 slidably provided on the pair of guide rails 41 .

在Z軸工作台42的下部設有以切割刀片52切入工件W的切割機構50。於Y軸工作台32及Z軸工作台42的背面側，各自形成有螺帽部，且於該等螺帽部中螺合有滾珠螺桿33、43。在Y軸工作台32用的滾珠螺桿33、Z軸工作台42用的滾珠螺桿43的一端部，各自連結有驅動馬達34、44。藉由以驅動馬達34、44旋轉驅動各自的滾珠螺桿33、43，切割機構50即可沿著導軌31於Y軸方向上移動，並且沿著導軌41於Z軸方向上移動。 A cutting mechanism 50 for cutting the workpiece W with the cutting blade 52 is provided at the lower portion of the Z-axis table 42 . Nut parts are formed on the back sides of the Y-axis table 32 and the Z-axis table 42, respectively, and ball screws 33 and 43 are screwed into the nut parts. Drive motors 34 and 44 are connected to one end portion of the ball screw 33 for the Y-axis table 32 and the ball screw 43 for the Z-axis table 42, respectively. By rotationally driving the respective ball screws 33 and 43 with the drive motors 34 and 44 , the cutting mechanism 50 can move along the guide rail 31 in the Y-axis direction and along the guide rail 41 in the Z-axis direction.

切割機構50是在從殼體51突出的主軸(未圖示)的前端可旋轉地裝設切割刀片52而被構成。切割刀片52是將鑽石等的磨粒藉由黏結劑結合而形成為圓板狀。在這樣構成的切割裝置1中，是將切割刀片52對位於工件W的分割預定線，且在工件W的外側將切割刀片52降下來調整高度位置。並且，在切割刀片52進行旋轉的狀態 下，可藉由相對於切割刀片52將工件W相對地切割進給，而沿著分割預定線切割工件W。 The cutting mechanism 50 is configured by rotatably attaching a cutting blade 52 to the front end of a main shaft (not shown) protruding from the housing 51 . The dicing blade 52 is formed into a disk shape by bonding abrasive grains such as diamonds with a binder. In the dicing device 1 thus constituted, the dicing blade 52 is positioned on the line to be divided into the workpiece W, and the dicing blade 52 is lowered outside the workpiece W to adjust the height position. And, in the state in which the cutting blade 52 is rotated Next, the workpiece W can be cut along the dividing line by relatively cutting and feeding the workpiece W with respect to the cutting blade 52 .

此外，如圖2A所示，本實施形態的切割刀片52是所謂墊圈型的刀片，且為了切斷工件W的樹脂層81或配線基板82，而使用較粗的磨粒來成形。當此切割刀片52的前端隨時間的摩耗而帶有圓角時，會無法將埋設在配線基板82內的金屬配線83良好地切斷。因此，如圖2B所示，雖然可以藉由在切割刀片85的前端面製作V形溝，且將左右兩側切成銳角，來將金屬配線83良好地切斷，但是會因銳角部分86劇烈摩耗而縮短切割刀片85的壽命。 Further, as shown in FIG. 2A , the dicing blade 52 of the present embodiment is a so-called washer type blade, and is formed using coarse abrasive grains in order to cut the resin layer 81 or the wiring board 82 of the workpiece W. As shown in FIG. If the tip of the dicing blade 52 is rounded with wear over time, the metal wiring 83 embedded in the wiring board 82 cannot be cut well. Therefore, as shown in FIG. 2B , the metal wiring 83 can be cut off well by forming a V-shaped groove on the front end surface of the dicing blade 85 and cutting the left and right sides at acute angles, but the sharp angle portion 86 is sharply cut. Wear and shorten the life of the cutting blade 85 .

如圖2C所示，在此已經很清楚的是，本案申請人在改變切割刀片52的前端形狀而重複進行工件W的切割時，藉由將切割刀片52的前端面53與兩側面54的角部整形為直角，可以抑制切割刀片52的摩耗並且提升切割性。藉由將切割刀片52的角部形成為直角，不會有如同銳角的角部一般在短時間內即摩耗的情形，且與銳角的角部同樣地可將配線基板82的金屬配線83良好地切斷。像這樣，於以切割刀片52來切斷配線基板82時，變得可兼顧切割刀片52的長壽命化與切割性的提升。 As shown in FIG. 2C , it is clear here that when the applicant of the present application changes the shape of the front end of the cutting blade 52 and repeats the cutting of the workpiece W, the angle between the front end surface 53 of the cutting blade 52 and the two side surfaces 54 is adjusted. It is possible to suppress the wear of the cutting blade 52 and improve the cutting performance by shaping the section to a right angle. By forming the corners of the dicing blade 52 at right angles, there is no wear in a short time like an acute corner, and the metal wiring 83 of the wiring board 82 can be satisfactorily formed similarly to the acute corner. cut off. In this way, when the wiring board 82 is cut by the dicing blade 52 , it becomes possible to achieve both the prolongation of the life of the dicing blade 52 and the improvement of the cutting performance.

如圖3所示，為了將切割刀片52的角部保持為直角，而實施將切割刀片52的前端面53整形為平直的平直修整。一般來說，平直修整是在邊緣修整時的抑制切割刀片52的偏摩耗之時進行。在此平直修整中，是使切 割刀片52一邊旋轉一邊較淺地切入修整板D，且將切割刀片52與修整板D在切割刀片52的旋轉軸方向上相對地挪動。反覆進行對修整板D的切入與往旋轉軸方向的滑動，來將切割刀片52的前端整形為平直。 As shown in FIG. 3 , in order to keep the corners of the cutting blades 52 at right angles, straightening is performed to straighten the front end surfaces 53 of the cutting blades 52 . Generally, the flat trimming is performed when the uneven wear of the cutting blade 52 is suppressed during edge trimming. In this straightening, it is to make the cut The cutting blade 52 cuts into the trimming plate D relatively shallowly while rotating, and moves the cutting blade 52 and the trimming plate D relatively in the rotation axis direction of the cutting blade 52 . The cutting of the trimming plate D and the sliding in the direction of the rotation axis are repeated to straighten the front end of the cutting blade 52 .

然而，因為是使切割刀片52在旋轉軸方向上移動，所以對切割刀片52在厚度方向上有較大的負荷作用。因此，為了不讓切割刀片52在平直修整中破損，必須使切割刀片52在旋轉軸方向上進行低速移動。又，必須在平直修整中將切割刀片52的切入位置降低。據此，當為了防止切割刀片52的破損而進行低速移動時，會使修整時間變長，反之若藉由高速移動來縮短修整時間時，恐有切割刀片52破損之虞。像這樣，切割刀片52的安定性與修整時間形成為取捨的關係。 However, since the cutting blade 52 is moved in the direction of the rotation axis, a large load acts on the cutting blade 52 in the thickness direction. Therefore, in order not to break the cutting blade 52 in the straightening, it is necessary to move the cutting blade 52 at a low speed in the rotation axis direction. Also, it is necessary to lower the cutting position of the cutting blade 52 in the straight trimming. Accordingly, when the cutting blade 52 is moved at a low speed to prevent breakage, the dressing time becomes longer, and conversely, when the dressing time is shortened by moving at a high speed, the cutting blade 52 may be damaged. In this way, the stability of the dicing blade 52 and the dressing time are in a trade-off relationship.

於是，在本實施形態的平直修整中，是在修整板D1上沿著切割方向以比切割刀片52的厚度稍微狹窄的寬度形成凸部65(參照圖4)，且在凸部65的上表面以切割刀片52切入來進行修整。因為沿著凸部65一邊將切割刀片52朝切割方向挪動一邊進行修整，所以不會有對切割刀片52的厚度方向施加較大的負荷之情形，而可以加快修整時的切割進給速度。據此，可以在不使切割刀片52破損的情形下，在短時間內將切割刀片52的前端整形為平直。 Therefore, in the straight trimming of the present embodiment, the convex portion 65 (see FIG. 4 ) is formed on the trimming plate D1 with a width slightly narrower than the thickness of the cutting blade 52 along the cutting direction, and the convex portion 65 is formed above the convex portion 65 . The surface is trimmed by cutting with a cutting blade 52 . Since trimming is performed while moving the cutting blade 52 in the cutting direction along the convex portion 65, a large load is not applied to the thickness direction of the cutting blade 52, and the cutting feed speed during trimming can be increased. According to this, the front end of the cutting blade 52 can be straightened in a short time without breaking the cutting blade 52 .

以下，參照圖4及圖5，針對本實施形態的修整板作說明。圖4是本實施形態的修整板及保持台的立 體圖。圖5是第1實施形態的修整板的凸部的說明圖。 Hereinafter, referring to FIGS. 4 and 5 , the trimming plate of the present embodiment will be described. Fig. 4 shows the vertical position of the trimming plate and the holding table according to the present embodiment body diagram. 5 is an explanatory diagram of a convex portion of the trimming plate according to the first embodiment.

如圖4A所示，修整板D1是將預定厚度的切割刀片52的前端修整為平直形狀的構成，且被保持在工作夾台25(參照圖1)的附近的保持台60上。修整板D1是使用比切割刀片52更硬質的黏結劑，來將粒徑比切割刀片52大的磨粒固定，以整形成上表面視角下為矩形狀。修整板D1的下表面是平直地形成，且修整板D1的上表面是藉由複數列的凸部65而形成為凹凸狀。各凸部65是沿著切割刀片52的切割方向延伸而形成切割刀片52的修整區域。 As shown in FIG. 4A , the trimming plate D1 is configured by trimming the front end of the cutting blade 52 having a predetermined thickness into a straight shape, and is held on a holding table 60 near the work chuck 25 (see FIG. 1 ). The dressing plate D1 uses a binder harder than the cutting blade 52 to fix the abrasive grains having a larger particle size than the cutting blade 52, and is shaped into a rectangular shape when viewed from the top surface. The lower surface of the trimming plate D1 is formed to be straight, and the upper surface of the trimming plate D1 is formed into a concave-convex shape by a plurality of rows of the convex portions 65 . Each convex portion 65 extends along the cutting direction of the cutting blade 52 to form a trimming region of the cutting blade 52 .

保持台60是支撐修整板D1的構成，且形成有將修整板D1吸引保持在表面的保持面61。於保持台60的保持面61上，是在比修整板D1的外緣更內側形成有淺溝62，此外在保持面61的中心形成有與淺溝62相連的吸引口63。吸引口63是通過保持台60內的流路而連接到吸引源(未圖示)，並藉由吸引源的吸引力使保持面61的淺溝62成為負壓，藉此吸引保持修整板D1。又，在修整板D1的上方定位有切割刀片52。 The holding table 60 is configured to support the trimming plate D1, and has a holding surface 61 that attracts and holds the trimming plate D1 on the surface. On the holding surface 61 of the holding table 60 , a shallow groove 62 is formed on the inner side of the outer edge of the trimming plate D1 , and a suction port 63 connected to the shallow groove 62 is formed in the center of the holding surface 61 . The suction port 63 is connected to a suction source (not shown) through the flow path in the holding table 60, and the shallow groove 62 of the holding surface 61 becomes a negative pressure by the suction force of the suction source, thereby suctioning and holding the trimming plate D1 . Moreover, the cutting blade 52 is positioned above the trimming plate D1.

如圖4B所示，藉由將修整板D1相對於高速旋轉的切割刀片52朝切割方向移動，可藉由修整板D1上的直線狀的凸部65來修整切割刀片52。因為切割刀片52與修整板D1在切割方向上進行橫向切割(traverse cut)，所以不會有在旋轉軸方向上對切割刀片52施加較強大的負荷之情形。據此，即便提高移動速度也不會有切割刀片 52破損之情形，而可以相較於一般的平直修整的進給速度(例如10mm/秒)來設成較高速的進給速度(例如30mm/秒~200mm/秒)。此高速的進給速度可相應於切割刀片的磨粒粒徑、切割刀片的寬度而變更。雖然會例如隨著磨粒粒徑變大而將進給速度設定得較低，且隨著切割刀片的寬度變寬而將進給速度設定得較低，但仍然可以用比以往的平直修整的進給速度更快的速度來使其移動。 As shown in FIG. 4B , by moving the trimming plate D1 in the cutting direction relative to the high-speed rotating cutting blade 52 , the cutting blade 52 can be trimmed by the linear protrusions 65 on the trimming plate D1 . Since the cutting blade 52 and the trimming plate D1 perform a traverse cut in the cutting direction, there is no case where a large load is applied to the cutting blade 52 in the rotation axis direction. According to this, even if the moving speed is increased, there will be no cutting blade 52 In case of damage, it can be set to a higher feed speed (eg 30mm/sec~200mm/sec) than the normal feed speed of straight trimming (eg 10mm/sec). The high-speed feed rate can be changed according to the abrasive grain size of the cutting blade and the width of the cutting blade. Although, for example, the feed speed is set lower as the grain size of the abrasive becomes larger, and the feed speed is set lower as the width of the cutting blade becomes wider, it is still possible to use a straight dressing than the conventional one. The feed rate is faster to make it move.

又，如圖5所示，在修整板D1的上表面交互地形成有凸部65與凹部66。凸部65的上表面67是形成得比切割刀片52的厚度更狹窄，且凹部66是以不使切割刀片52接觸到相鄰的凸部65的方式將凸部65彼此的間隔空出。亦即，為將切割刀片52的厚度形成得比凸部65的寬度更大，且將切割刀片52的厚度形成得比凸部65與兩側的凹部66的寬度的加總寬度更小。修整板D1的凸部65的高度是設定得比對切割刀片52的前端面53的修整量更大，以使得切割刀片52不會切入得比凸部65的根部更深。 Moreover, as shown in FIG. 5, the convex part 65 and the recessed part 66 are alternately formed in the upper surface of the trimming board D1. The upper surface 67 of the convex portion 65 is formed to be narrower than the thickness of the cutting blade 52 , and the concave portion 66 separates the convex portions 65 from each other so that the cutting blade 52 does not come into contact with the adjacent convex portions 65 . That is, in order to make the thickness of the cutting blade 52 larger than the width of the convex part 65, the thickness of the cutting blade 52 is formed to be smaller than the total width of the convex part 65 and the widths of the concave parts 66 on both sides. The height of the convex portion 65 of the trimming plate D1 is set larger than the trimming amount to the front end surface 53 of the cutting blade 52 so that the cutting blade 52 does not cut deeper than the root of the convex portion 65 .

藉此，僅切割刀片52的前端面53被凸部65的上表面67所修整，而可將切割刀片52的前端面53整形為平直。又，因為切割刀片52的兩側面54不會碰抵到修整板D1，所以可將切割刀片52的兩側面54原樣維持鉛直的狀態。從而，不會有在切割刀片52的角部上殘留R形狀之情形，而可將切割刀片52的角部整形為直角(參照圖6D)。又，因為只要將切割刀片52相對於修整板D1的凸 部65朝切割方向挪動，即可修整切割刀片52的前端面53，所以毋須在修整中將切割刀片52的切入位置降低。 Thereby, only the front end surface 53 of the cutting blade 52 is trimmed by the upper surface 67 of the convex portion 65, and the front end surface 53 of the cutting blade 52 can be shaped to be straight. Moreover, since both side surfaces 54 of the cutting blade 52 do not come into contact with the trimming plate D1, the both side surfaces 54 of the cutting blade 52 can be maintained in a vertical state as they are. Therefore, the R-shape does not remain on the corners of the cutting blades 52, and the corners of the cutting blades 52 can be shaped into right angles (see FIG. 6D ). Also, because as long as the cutting blade 52 is positioned relative to the convexity of the trimming plate D1 The front end surface 53 of the cutting blade 52 can be trimmed by moving the portion 65 in the cutting direction, so it is not necessary to lower the cutting position of the cutting blade 52 during trimming.

像這樣，僅對修整板D1的前端面53修整，藉此可將切割刀片52的角部整形為直角。更進一步，即便提高切割刀片52與修整板D1的相對速度也不會產生破損，且毋須在修整中降低切割刀片52的切入位置，而可大幅度地縮短修整時間。再者，修整板D1的凸部65的上表面67的寬度宜形成為比切割刀片52的厚度還小相當於10%-20%。例如，在切割刀片52的厚度為約100μm至500μm時，將凸部65的上表面67的寬度設定為約90μm至400μm。 In this way, only the front end surface 53 of the trimming plate D1 is trimmed, whereby the corner portion of the cutting blade 52 can be trimmed to a right angle. Furthermore, even if the relative speed of the cutting blade 52 and the trimming plate D1 is increased, no damage will occur, and the cutting position of the cutting blade 52 does not need to be lowered during trimming, and the trimming time can be greatly shortened. Furthermore, the width of the upper surface 67 of the convex portion 65 of the trimming plate D1 is preferably formed to be smaller than the thickness of the cutting blade 52 by 10% to 20%. For example, when the thickness of the dicing blade 52 is about 100 μm to 500 μm, the width of the upper surface 67 of the convex portion 65 is set to about 90 μm to 400 μm.

接著，參照圖6針對使用了修整板的修整方法作說明。圖6是第1實施形態的修整方法的說明圖。再者，圖6A是保持步驟、圖6B是定位步驟、圖6C及圖6D是修整步驟之各自顯示一例的圖。 Next, a trimming method using a trimming plate will be described with reference to FIG. 6 . FIG. 6 is an explanatory diagram of a dressing method according to the first embodiment. 6A is a holding step, FIG. 6B is a positioning step, and FIGS. 6C and 6D are diagrams each showing an example of a trimming step.

如圖6A所示，首先實施保持步驟。在保持步驟中，是將修整板D1載置在保持台60的保持面61，且藉由保持面61的吸引力保持修整板D1。在這種情況下，是相對於保持台60的保持面61將修整板D1的方向調整成使得修整板D1上表面的凸部65的延伸方向與切割刀片52(參照圖6B)的切割方向一致。因為保持台60與修整板D1的上表面視角下的外形形狀相同，所以可藉由使修整板D1的外側面與保持台60的外側面為一致而精度良好地進行定位。 As shown in FIG. 6A, the holding step is first performed. In the holding step, the trimming plate D1 is placed on the holding surface 61 of the holding table 60 , and the trimming plate D1 is held by the attractive force of the holding surface 61 . In this case, the direction of the trimming plate D1 with respect to the holding surface 61 of the holding table 60 is adjusted so that the extending direction of the protrusions 65 on the upper surface of the trimming plate D1 matches the cutting direction of the cutting blade 52 (see FIG. 6B ). . Since the external shapes of the holding table 60 and the trimming plate D1 are the same when viewed from the top surface, positioning can be performed with high accuracy by making the outer surface of the trimming plate D1 and the outer surface of the holding table 60 match.

如圖6B所示，在保持步驟之後，可實施定位步驟。在定位步驟中，是將修整板D1定位在切割刀片52的下方，並且將修整板D1之對凸部65的延伸方向的正交方向之寬度的中心C1，與切割刀片52的厚度的中心C2設為一致。在這種情況下，可藉由以拍攝相機(未圖示)進行的校準處理來進行對位。又，將切割刀片52在從修整板D1的正上方遠離的位置上，定位到從凸部65的上表面67切入預定量的高度上。再者，切入預定量的高度所表示的是，比凸部65的上表面67更深，且比凸部65的根部更高的位置。 As shown in FIG. 6B, after the holding step, a positioning step may be performed. In the positioning step, the trimming plate D1 is positioned below the cutting blade 52 , and the center C1 of the width in the orthogonal direction to the extending direction of the convex portion 65 of the trimming plate D1 is aligned with the center C2 of the thickness of the cutting blade 52 . Set to match. In this case, alignment can be performed by a calibration process performed with a photographing camera (not shown). Furthermore, the cutting blade 52 is positioned at a position away from directly above the trimming plate D1 to a height that cuts a predetermined amount from the upper surface 67 of the convex portion 65 . In addition, the height of the cut-in predetermined amount shows the position which is deeper than the upper surface 67 of the convex part 65, and is higher than the root part of the convex part 65. As shown in FIG.

如圖6C所示，在定位步驟之後，可實施修整步驟。在修整步驟中，是將已在定位步驟中定位的切割刀片52與修整板D1在切割進給方向上相對地移動。藉由以切割刀片52切割修整板D1的凸部65，可藉由凸部65的上表面67逐漸地削除切割刀片52的前端面53來修整切割刀片52。此時，因為凸部65的上表面67將寬度形成得比切割刀片52的厚度更狹窄，所以可藉由凸部65來僅削除切割刀片52的帶有圓角的前端面53。 As shown in Figure 6C, after the positioning step, a trimming step may be performed. In the trimming step, the cutting blade 52 positioned in the positioning step is relatively moved in the cutting feed direction with the trimming plate D1. By cutting the convex portion 65 of the trimming plate D1 with the cutting blade 52 , the cutting blade 52 can be trimmed by gradually cutting off the front end surface 53 of the cutting blade 52 by the upper surface 67 of the convex portion 65 . At this time, since the width of the upper surface 67 of the convex portion 65 is narrower than the thickness of the cutting blade 52 , only the rounded front end surface 53 of the cutting blade 52 can be cut off by the convex portion 65 .

如圖6D所示，當藉由切割刀片52切割1列的凸部65後，即可將切割刀片52對位到相隣列的凸部65並再次進行修整。每次反覆進行切割刀片52的修整時，都讓切割刀片52的前端面53的曲率半徑變大以接近於平直。因為切割刀片52的兩側面54未被削除，所以可在將切割刀片52的兩側面54鉛直地維持的狀態下，使前端面 53接近於平直，而將切割刀片52的角部整形為直角。形成為可用與一般的切割動作同樣的動作，來對切割刀片52進行平直修整。 As shown in FIG. 6D , after the protrusions 65 in one row are cut by the cutting blade 52 , the cutting blade 52 can be aligned with the protrusions 65 in the adjacent row and trimmed again. Each time the trimming of the cutting blade 52 is repeated, the radius of curvature of the front end surface 53 of the cutting blade 52 is increased so as to be close to straight. Since the both side surfaces 54 of the dicing blade 52 are not cut off, the front end surface of the dicing blade 52 can be maintained in a state where the both side surfaces 54 of the dicing blade 52 are maintained vertically. 53 is nearly straight, while the corners of the cutting blade 52 are shaped to right angles. It is formed so that the cutting blade 52 can be straightened by the same operation as a general cutting operation.

如以上，在第1實施形態的修整方法中，可在不使切割刀片52的兩側面54碰抵到修整板D1的凸部65的情形下，僅對切割刀片52的前端面53進行修整。據此，即便切割刀片52的前端面53帶有圓角，也可藉由以切割刀片52的前端面53切入修整板D1的凸部65之作法來將切割刀片52的前端面53整形為平直。又，因為修整板D1的凸部65的延伸方向與切割刀片52的切割方向為一致，所以不會有在修整時對切割刀片52施加較大的負荷之情形，而可以使修整板D1與切割刀片52以高速相對地移動。據此，可以在不使切割刀片52破損的情形下，在短時間內將切割刀片52的前端整形為平直。 As described above, in the trimming method of the first embodiment, only the front end surface 53 of the cutter blade 52 can be trimmed without making the both side surfaces 54 of the cutter blade 52 abut against the convex portion 65 of the trimming plate D1. Accordingly, even if the front end surface 53 of the cutting blade 52 is rounded, the front end surface 53 of the cutting blade 52 can be shaped to be flat by cutting the front end surface 53 of the cutting blade 52 into the convex portion 65 of the trimming plate D1. straight. In addition, since the extending direction of the convex portion 65 of the trimming plate D1 coincides with the cutting direction of the cutting blade 52, there is no situation where a large load is applied to the cutting blade 52 during trimming, and the trimming plate D1 and the cutting blade 52 can be The blades 52 are relatively moved at high speed. According to this, the front end of the cutting blade 52 can be straightened in a short time without breaking the cutting blade 52 .

再者，在第1實施形態中雖然是針對準備事先形成有複數列的凸部之修整板，來對切割刀片進行平直修整的構成作說明，但並非限定於此構成。亦可設成下述構成：藉由上表面為平坦的平板的修整板，來將切割刀片的前端修整成平直。在這種情況下，是在進行新品的切割刀片的定心時，在平板的修整板形成凸部，且在切割刀片的平直修整時以修整板的凸部來對切割刀片進行修整。 In addition, in 1st Embodiment, although the structure which prepares the trimming board which formed the convex part of a plurality of rows in advance and straightens a dicing blade is demonstrated, it is not limited to this structure. It is also possible to set it as a configuration in which the front end of the cutting blade is trimmed straight by a trimming plate whose upper surface is a flat flat plate. In this case, when centering a new cutting blade, a convex portion is formed on the flat plate trimming plate, and the trimming blade is trimmed with the convex portion of the trimming plate when the cutting blade is straightened.

以下，參照圖7並針對使用了平板的修整板的修整方法作說明。圖7是第2實施形態的修整方法的說明圖。圖7A是保持步驟、圖7B是凸部形成步驟、圖7C是 定位步驟、圖7D是修整步驟之各自顯示一例的圖。再者，因為在第2實施形態的修整方法中，是使用與第1實施形態相同的切割裝置來實施，所以省略針對裝置各部的說明。又，在此是針對在剛更換成新品的切割刀片之後，即實施對該切割刀片的定心與平直修整之構成作說明。 Hereinafter, the trimming method of the trimming plate using the flat plate will be described with reference to FIG. 7 . FIG. 7 is an explanatory diagram of a dressing method according to the second embodiment. FIG. 7A is a holding step, FIG. 7B is a convex portion forming step, and FIG. 7C is a The positioning step and FIG. 7D are diagrams showing an example of each of the trimming steps. In addition, since the trimming method of 2nd Embodiment is implemented using the same cutting apparatus as 1st Embodiment, description about each part of an apparatus is abbreviate|omitted. Here, a description will be given of a configuration in which centering and straightening of the dicing blade are performed immediately after the dicing blade is replaced with a new one.

如圖7A所示，首先實施保持步驟。在保持步驟中，是將平板的修整板D2載置於保持台71的保持面72，且藉由保持面72的吸引力保持修整板D2。在這種情況下，是相對於保持台71的保持面72將修整板D2的方向調整成使得矩形狀的修整板D2的一邊與切割刀片73(參照圖7B)的切割方向一致。因為保持台71與修整板D2的上表面視角下的外形形狀相同，所以可藉由使修整板D2的外側面與保持台71的外側面一致而精度良好地進行定位。 As shown in FIG. 7A, the holding step is first performed. In the holding step, the flat trimming plate D2 is placed on the holding surface 72 of the holding table 71 , and the trimming plate D2 is held by the attractive force of the holding surface 72 . In this case, the direction of the trimming plate D2 with respect to the holding surface 72 of the holding table 71 is adjusted so that one side of the rectangular trimming plate D2 matches the cutting direction of the cutting blade 73 (see FIG. 7B ). Since the external shapes of the holding table 71 and the trimming plate D2 are the same when viewed from the top surface, positioning can be performed with high accuracy by making the outer surface of the trimming plate D2 and the outer surface of the holding table 71 coincide.

如圖7B所示，在保持步驟之後，可實施凸部形成步驟。在凸部形成步驟中，是安裝新品的切割刀片73，且以該切割刀片73切割平板的修整板D2。在對修整板D2形成1條切割溝77後，朝與切割方向正交的分度方向移動切割刀片73，並以切割刀片73切割平板的修整板D2。藉由反覆進行切割刀片73對平板的修整板D2的切割，可對修整板D2形成複數條切割溝77，並將新品的切割刀片73藉由修整板D2進行定心。 As shown in FIG. 7B , after the holding step, a convex portion forming step may be performed. In the convex portion forming step, a new cutting blade 73 is attached, and the flat trimming plate D2 is cut with the cutting blade 73 . After one cutting groove 77 is formed in the trimming plate D2, the cutting blade 73 is moved in the indexing direction orthogonal to the cutting direction, and the trimming plate D2, which is a flat plate, is cut with the cutting blade 73. By repeatedly cutting the flat trimming plate D2 with the cutting blade 73, a plurality of cutting grooves 77 can be formed in the trimming plate D2, and the new cutting blade 73 can be centered by the trimming plate D2.

此時，在修整板D2的上表面是以空出比切割刀片73的厚度更狹窄的間隔來形成複數條切割溝77。 亦即，在切割刀片73的定心時，於分度進給方向上空出比切割刀片73的厚度狹窄的間隔，來反覆進行對修整板D2的切割。藉由以切割刀片73切割修整板D2，而以比切割刀片73的厚度更狹窄的寬度來形成朝切割方向延伸的複數列的凸部78。像這樣，可利用對切割刀片73的定心，而在平板的修整板D2的上表面上形成有上表面79的寬度比切割刀片73的厚度更狹窄的凸部78。 At this time, a plurality of cutting grooves 77 are formed on the upper surface of the trimming plate D2 with an interval narrower than the thickness of the cutting blade 73 . That is, when the cutting blade 73 is centered, the trimming plate D2 is repeatedly cut with a space narrower than the thickness of the cutting blade 73 in the indexing feed direction. By cutting the trimming plate D2 with the cutting blade 73 , a plurality of rows of convex portions 78 extending in the cutting direction are formed with a width narrower than the thickness of the cutting blade 73 . In this way, by centering the cutting blade 73 , a convex portion 78 having a width of the upper surface 79 narrower than the thickness of the cutting blade 73 can be formed on the upper surface of the flat trimming plate D2 .

再者，在凸部形成步驟中，因為新品的切割刀片73是藉由定心來切割平坦的修整板D2，所以不僅切割刀片73的前端面74，連切割刀片73的兩側面75也被稍微地修整。從而，完成定心後的切割刀片73可將前端面74與兩側面75的角部形成為R形狀。像這樣，因為即便是新品的切割刀片73，也可在完成定心後於切割刀片73的角部附加R形狀，所以可接續於定心來實施平直修整，並以形成有凸部78的修整板D2將切割刀片73的角部整形為直角。 Furthermore, in the convex portion forming step, since the new cutting blade 73 cuts the flat trimming plate D2 by centering, not only the front end surface 74 of the cutting blade 73 but also the both side surfaces 75 of the cutting blade 73 are slightly cut. ground repair. Therefore, the cutting blade 73 after the centering is completed can form the corners of the front end surface 74 and the both side surfaces 75 into an R shape. In this way, even if the cutting blade 73 is a new product, the R-shape can be added to the corner of the cutting blade 73 after the centering is completed, so that straightening can be performed following the centering, and the convex part 78 can be formed. The trimming plate D2 trims the corners of the cutting blade 73 to a right angle.

如圖7C所示，在凸部形成步驟之後，可實施定位步驟。在定位步驟中，是將修整板D2定位在切割刀片73的下方，並將修整板D2之對凸部78的延伸方向的正交方向之寬度的中心C1，與切割刀片73的厚度的中心C2設為一致。在這種情況下，可藉由以拍攝相機(未圖示)進行的校準處理來對位。又，將切割刀片73在從修整板D2的正上方遠離的位置上，定位到從凸部78的上表面79切入預定量的高度上。再者，切入預定量的高度所表 示的是，比凸部78的上表面79更深，且比凸部78的根部更高的位置。 As shown in FIG. 7C, after the protrusion forming step, a positioning step may be performed. In the positioning step, the trimming plate D2 is positioned below the cutting blade 73 , and the center C1 of the width in the orthogonal direction to the extending direction of the convex portion 78 of the trimming plate D2 is aligned with the center C2 of the thickness of the cutting blade 73 . Set to match. In this case, alignment can be performed by a calibration process with a photographing camera (not shown). In addition, the cutting blade 73 is positioned at a position away from directly above the trimming plate D2 to a height that cuts a predetermined amount from the upper surface 79 of the convex portion 78 . Again, cut into a predetermined amount of height represented by Shown is a position deeper than the upper surface 79 of the convex portion 78 and higher than the root of the convex portion 78 .

如圖7D所示，在定位步驟之後，可實施修整步驟。在修整步驟中，是將已在定位步驟中定位的切割刀片73與修整板D2在切割進給方向上相對地移動。藉由以切割刀片73切割修整板D2的凸部78，可藉由凸部78的上表面79修整切割刀片73之帶有圓角的前端面74。由於凸部78的上表面79是形成為比切割刀片73的厚度更狹窄的寬度，所以可在不削除切割刀片73的兩側面75的情形下，將切割刀片73的前端面74削除到成為平直為止，以將切割刀片73的角部整形為直角。 As shown in Figure 7D, after the positioning step, a trimming step may be performed. In the trimming step, the cutting blade 73 that has been positioned in the positioning step is moved relatively to the trimming plate D2 in the cutting feed direction. By cutting the convex portion 78 of the trimming plate D2 with the cutting blade 73 , the rounded front end surface 74 of the cutting blade 73 can be trimmed by the upper surface 79 of the convex portion 78 . Since the upper surface 79 of the convex portion 78 is formed to have a width narrower than the thickness of the cutting blade 73 , the front end surface 74 of the cutting blade 73 can be cut off to be flat without cutting off both side surfaces 75 of the cutting blade 73 . The corners of the cutting blade 73 are shaped into right angles until they are straight.

如以上，即使是第2實施形態的修整方法也可以在不使切割刀片73破損的情形下，在短時間內將切割刀片73的前端整形為平直。又，在對新品的切割刀片73修整時，是藉由以切割刀片73切入平板的修整板D2之作法來進行定心，並藉由以切割刀片73切入於定心時所形成的凸部78之作法來進行平直修整。變得可連續地實施對切割刀片73的定心與平直修整。 As described above, even in the dressing method of the second embodiment, the front end of the cutting blade 73 can be straightened in a short time without damaging the cutting blade 73 . When trimming the new cutting blade 73, the cutting blade 73 is cut into the flat trimming plate D2 for centering, and the cutting blade 73 is cut into the convex portion 78 formed during the centering. This method is used for straightening. It becomes possible to continuously perform centering and straightening of the cutting blade 73 .

又，雖然在第1、第2實施形態中，是設成下述構成：為了作為工件而將封裝基板的配線基板以切割刀片來切割，而對切割刀片實施平直修整以將切割刀片的角部形成為直角，但並非限定於此構成。亦可藉由第1、第2的修整板、修整方法，對並非用以切割配線基板的切割刀片實施平直修整。 Also, in the first and second embodiments, a configuration is adopted in which the wiring board of the package substrate is diced with a dicing blade as a workpiece, and the dicing blade is trimmed so that the corners of the dicing blade are trimmed. The portion is formed at a right angle, but is not limited to this configuration. By the trimming plate and trimming method of the 1st and 2nd, the dicing blade which is not used for dicing a wiring board can also perform flat trimming.

又，在第1、第2實施形態中，雖然所說明的是關於對在切割裝置中切割工件的切割刀片進行平直修整的修整板，但並非限定於此構成。本發明亦可適用於使用切割刀片的加工裝置，且亦可適用於例如切割裝置、邊緣修整裝置、及包含其等的群集(cluster)裝置等之其他的加工裝置。 Moreover, in the 1st, 2nd embodiment, although demonstrated about the trimming plate which performs straight trimming on the cutting blade which cuts a workpiece|work in a cutting apparatus, it is not limited to this structure. The present invention can also be applied to a processing apparatus using a dicing blade, and can also be applied to other processing apparatuses such as a dicing apparatus, an edge trimming apparatus, and a cluster apparatus including the same.

又，作為加工對象的工件，亦可相應於加工的種類，而使用例如半導體元件晶圓、光元件晶圓、封裝基板、半導體基板、無機材料基板、氧化物晶圓、未燒結陶瓷基板、壓電基板等之各種工件。作為半導體元件晶圓，亦可使用元件形成後之矽晶圓或化合物半導體晶圓。作為光元件晶圓，亦可使用元件形成後之藍寶石晶圓或碳化矽晶圓。又，作為封裝基板亦可使用CSP(晶片尺寸封裝，Chip Size Package)基板及FOWLP(扇出型晶圓級封裝，Fan Out Wafer Level Package)用的基板。作為半導體基板亦可使用矽或砷化鎵等，作為無機材料基板亦可使用藍寶石、陶瓷、玻璃等。此外，亦可使用元件形成後或元件形成前的鉭酸鋰，鈮酸鋰作為氧化物晶圓。 Further, as the workpiece to be processed, depending on the type of processing, for example, semiconductor element wafers, optical element wafers, package substrates, semiconductor substrates, inorganic material substrates, oxide wafers, green ceramic substrates, press Various workpieces such as electrical substrates. As the semiconductor element wafer, a silicon wafer or a compound semiconductor wafer after element formation can also be used. As an optical element wafer, a sapphire wafer or a silicon carbide wafer after element formation can also be used. Moreover, as a package board|substrate, a CSP (Chip Size Package) board|substrate and the board|substrate for FOWLP (Fan Out Wafer Level Package, Fan Out Wafer Level Package) can also be used. Silicon, gallium arsenide, etc. may be used as the semiconductor substrate, and sapphire, ceramics, glass, etc. may be used as the inorganic material substrate. In addition, lithium tantalate and lithium niobate after element formation or before element formation can also be used as oxide wafers.

又，雖然說明了本實施形態及變形例，但是作為本發明的其他實施形態，亦可為將上述實施形態及變形例整體或部分地組合而成的形態。 In addition, although the present embodiment and the modified examples have been described, as other embodiments of the present invention, the above-described embodiments and modified examples may be combined in whole or in part.

又，本發明之實施形態及變形例並不限定於上述之實施形態，且亦可在不脫離本發明之技術思想的主旨的範圍內進行各種變更、置換、變形。此外，若能經 由技術之進步或衍生之其他技術而以其他的方式來實現本發明之技術思想的話，亦可使用該方法來實施。從而，申請專利範圍涵蓋了可包含在本發明之技術思想的範圍內的所有的實施形態。 In addition, the embodiment and modification of the present invention are not limited to the above-described embodiment, and various changes, substitutions, and modifications may be made within the scope of the technical idea of the present invention. Furthermore, if the If the technical idea of the present invention is realized in other ways due to the advancement of technology or other derived technologies, this method can also be used to implement. Therefore, the scope of the patent application covers all the embodiments that can be included in the scope of the technical idea of the present invention.

又，在本實施形態中，雖然針對將本發明適用於切割裝置的構成作了說明，但是也可適用在切割刀片的修整為必要的其他的裝置上。 In addition, in this embodiment, although the structure which applied this invention to a dicing apparatus was demonstrated, it can also apply to other apparatuses which require the dressing of a dicing blade.

產業上之可利用性 industrial availability

如以上所說明，本發明具有可以在不使切割刀片破損的情形下，在短時間內將切割刀片的前端整形為平直之效果，特別是在切割封裝基板的切割刀片之進行修整的修整板、修整方法上是有用的。 As described above, the present invention has the effect that the front end of the dicing blade can be straightened in a short time without breaking the dicing blade, especially the trimming plate for trimming the dicing blade for cutting the package substrate , It is useful in the trimming method.

52:切割刀片 52: Cutting Blade

53:前端面 53: Front face

54:兩側面 54: Both sides

60:保持台 60: Hold Desk

61:保持面 61: Keep Faces

65:凸部 65: convex part

67:凸部的上表面 67: Upper surface of convex part

C1、C2:中心 C1, C2: Center

D1:修整板 D1: Trim Plate

Claims (1)

一種修整方法，是從平板的修整板形成凸部，並且將切割刀片的前端修整為平直的修整方法，其是進行：保持步驟，將該平板的修整板保持於保持台；凸部形成步驟，以該切割刀片切割該保持台所保持的該平板的修整板，並且以比該切割刀片的厚度稍微狹窄的寬度形成朝切割方向延伸的凸部；定位步驟，在該凸部形成步驟之後，使該凸部的與延伸方向正交之寬度的中心，與該切割刀片的厚度的中心一致，並且將該切割刀片定位在從該凸部的上表面切入預定量的高度上；及使已在該定位步驟中定位的該切割刀片，與該凸部形成後的修整板在切割進給方向上相對地移動而切割該凸部，以對該切割刀片進行修整。 A trimming method is to form a convex portion from a trimming plate of a flat plate, and trim the front end of a cutting blade to be straight, and it is to carry out: a holding step, the trimming plate of the flat plate is held on a holding table; the convex portion forming step , the trimming plate of the flat plate held by the holding table is cut with the cutting blade, and a convex portion extending toward the cutting direction is formed with a width slightly narrower than the thickness of the cutting blade; the positioning step, after the convex portion forming step, makes The center of the width of the convex portion orthogonal to the extending direction coincides with the center of the thickness of the cutting blade, and the cutting blade is positioned at a height cut in a predetermined amount from the upper surface of the convex portion; and The cutting blade positioned in the positioning step moves relative to the trimming plate after the convex portion is formed in the cutting feed direction to cut the convex portion to trim the cutting blade.
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