TWI759083B - Metal circuit pattern and method of producing metal circuit pettern - Google Patents

Metal circuit pattern and method of producing metal circuit pettern Download PDF

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TWI759083B
TWI759083B TW110102216A TW110102216A TWI759083B TW I759083 B TWI759083 B TW I759083B TW 110102216 A TW110102216 A TW 110102216A TW 110102216 A TW110102216 A TW 110102216A TW I759083 B TWI759083 B TW I759083B
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metal
circuit pattern
sheets
carrier tape
friction marks
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TW110102216A
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TW202139799A (en
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加藤治
齋藤彰文
蔡孟位
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日商Ｓｈ精密股份有限公司
界霖科技股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

本發明之課題，在於提供可有效率地製造陶瓷電路基板的技術。本發明之金屬電路圖案係於陶瓷基板上接合有要形成電路圖案之金屬板之陶瓷電路基板製造用的金屬電路圖案；其具備有：要形成電路圖案之各自獨立的複數個金屬單片；及在保持有電路圖案之狀態下可供複數個金屬單片黏貼的載帶；且複數個金屬單片的至少任一側面具有摩擦痕。The subject of this invention is to provide the technique which can manufacture a ceramic circuit board efficiently. The metal circuit pattern of the present invention is a metal circuit pattern used in the manufacture of a ceramic circuit substrate in which a metal plate to form a circuit pattern is bonded to a ceramic substrate; it is provided with: a plurality of independent metal sheets for forming the circuit pattern; and A carrier tape that can be pasted with a plurality of metal single sheets in a state of maintaining a circuit pattern; and at least any side surface of the plurality of metal single sheets has friction marks.

Description

金屬電路圖案及金屬電路圖案之製造方法Metal circuit pattern and manufacturing method of metal circuit pattern

本發明係關於金屬電路圖案及金屬電路圖案之製造方法。The present invention relates to a metal circuit pattern and a method for manufacturing the metal circuit pattern.

作為電源模組用基板，於陶瓷基板上接合有金屬板的陶瓷電路基板被廣泛地使用。例如，於專利文獻1提案有在氧化鋁板之上接合有銅板的陶瓷電路基板。 [先前技術文獻] [專利文獻]As a power supply module substrate, a ceramic circuit substrate in which a metal plate is bonded to a ceramic substrate is widely used. For example, Patent Document 1 proposes a ceramic circuit board in which a copper plate is bonded to an alumina plate. [Prior Art Literature] [Patent Literature]

[專利文獻1] 日本專利特開平3-145748號公報[Patent Document 1] Japanese Patent Laid-Open No. 3-145748

(發明所欲解決之問題)(The problem that the invention intends to solve)

本發明之目的，係提供可效率佳地製造陶瓷電路基板的技術。 (解決問題之技術手段)The objective of this invention is to provide the technique which can manufacture a ceramic circuit board efficiently. (Technical means to solve problems)

根據本發明一態樣，提供一種金屬電路圖案，該金屬電路圖案係將形成電路圖案的金屬板接合到陶瓷基板上的陶瓷電路基板製造用的金屬電路圖案，其中，該金屬電路圖案具有：各自獨立的複數個金屬單片，其用於形成上述電路圖案；以及載帶，其供上述複數個金屬單片以保持有上述電路圖案之狀態黏貼，上述複數個金屬單片之至少任一側面具有摩擦痕。According to an aspect of the present invention, there is provided a metal circuit pattern for manufacturing a ceramic circuit substrate in which a metal plate forming a circuit pattern is bonded to a ceramic substrate, wherein the metal circuit pattern has: A plurality of independent metal single sheets are used to form the above-mentioned circuit patterns; and a carrier tape is used for the above-mentioned plurality of metal single sheets to be pasted in a state where the circuit patterns are maintained, and at least any side of the plurality of metal single sheets has a Friction marks.

根據本發明另一態樣，提供一種金屬電路圖案之製造方法，該金屬電路圖案之製造方法係將金屬板接合到陶瓷基板上而成的陶瓷電路基板用的金屬電路圖案之製造方法，其中，該金屬電路圖案之製造方法包括：對金屬原料板進行沖裁而形成各自獨立的複數個金屬單片的沖壓步驟；以及將載帶黏貼於上述複數個金屬單片的黏貼步驟；在上述沖壓步驟中，將已沖裁出的上述複數個金屬單片向上述金屬原料板的沖裁孔推回，從而在上述複數個金屬單片的側面形成摩擦痕；在上述黏貼步驟中，從上述金屬原料板的上述沖裁孔拆卸掉上述複數個金屬單片，以保持有上述複數個金屬單片的電路圖案之狀態黏貼上述載帶。 (對照先前技術之功效)According to another aspect of the present invention, there is provided a method for manufacturing a metal circuit pattern, which is a method for manufacturing a metal circuit pattern for a ceramic circuit substrate obtained by bonding a metal plate to a ceramic substrate, wherein: The manufacturing method of the metal circuit pattern includes: a punching step of punching a metal raw material plate to form a plurality of independent metal single sheets; and a sticking step of pasting a carrier tape on the plurality of metal single sheets; in the above-mentioned punching step In the process, the plurality of metal single sheets that have been punched out are pushed back to the punching holes of the metal raw material plate, so as to form friction marks on the side surfaces of the plurality of metal single sheets; The above-mentioned punching holes of the board are removed from the above-mentioned plurality of metal single pieces, and the above-mentioned carrier tape is pasted in a state where the circuit patterns of the above-mentioned plurality of metal single pieces are maintained. (Compared to the efficacy of the prior art)

根據本發明，可有效率地製造陶瓷電路基板。According to the present invention, a ceramic circuit board can be efficiently manufactured.

[本發明的實施形態的說明] ＜本發明人所得到的研究結果＞ 首先，對本發明人等所得到的研究結果進行說明。[Description of Embodiments of the Present Invention] <Results of research obtained by the inventors> First, the research results obtained by the present inventors will be described.

作為用於陶瓷電路基板的金屬板，就散熱性與導電性的觀點而言，例如銅板被廣泛地使用。作為將銅板接合於陶瓷基板上的方法，已知有例如直接接合法與活性金屬法。直接接合法例如係如下之方法：將銅板接觸配置於陶瓷基板上並進行加熱，生成Cu-O等之共晶液相，其次，藉由將該共晶液相冷卻固化，而將陶瓷基板與銅板直接接合。另一方面，活性金屬法例如係如下之方法：經由含有Ti等之活性金屬的焊接填料金屬層將陶瓷基板與銅板接合。As a metal plate used for a ceramic circuit board, from the viewpoint of heat dissipation and electrical conductivity, for example, a copper plate is widely used. As a method of bonding a copper plate to a ceramic substrate, for example, a direct bonding method and an active metal method are known. The direct bonding method is, for example, a method in which a copper plate is placed in contact with a ceramic substrate and heated to generate a eutectic liquid phase such as Cu—O, and then the eutectic liquid phase is cooled and solidified, and the ceramic substrate and the eutectic liquid phase are cooled and solidified. Copper plates are directly bonded. On the other hand, the active metal method is, for example, a method in which a ceramic substrate and a copper plate are joined via a solder filler metal layer containing an active metal such as Ti.

又，作為陶瓷電路基板之電路圖案的形成方法，例如已知有預先利用沖壓加工對銅板進行沖裁來形成電路圖案的方法、與在將銅板全面接合後利用蝕刻來形成電路圖案的方法等。Moreover, as a method of forming a circuit pattern of a ceramic circuit board, for example, a method of forming a circuit pattern by punching a copper plate by pressing in advance, and a method of forming a circuit pattern by etching after bonding the copper plate all over are known.

近年來，使用陶瓷電路基板之半導體元件的高輸出化持續發展，陶瓷電路基板被要求更高的散熱性。因此，作為用於陶瓷電路基板的銅板，較佳為具有例如0.5mm以上的厚度。In recent years, the increase in output of semiconductor elements using ceramic circuit boards has continued, and higher heat dissipation properties of ceramic circuit boards have been demanded. Therefore, as a copper plate used for a ceramic circuit board, it is preferable to have a thickness of 0.5 mm or more, for example.

在銅板具有0.5mm以上之厚度的情形時，難以藉由蝕刻來形成電路圖案。另一方面，在預先利用沖壓加工來形成電路圖案的情形時，難以進行沖裁後之獨立之金屬單片的操控(handling)。具體而言，例如，難以進行當要將金屬電路圖案接合於陶瓷基板上時的定位。又，在預先利用沖壓加工來形成電路圖案的情形時，存在有會發生毛邊的問題。When the copper plate has a thickness of 0.5 mm or more, it is difficult to form a circuit pattern by etching. On the other hand, when the circuit pattern is formed by punching in advance, it is difficult to handle the individual metal pieces after punching. Specifically, for example, it is difficult to perform positioning when bonding a metal circuit pattern to a ceramic substrate. Moreover, when forming a circuit pattern by a press process in advance, there exists a problem that a burr may generate|occur|produce.

本案發明人等對如上述般的現象進行深入研究。其結果，發現藉由在沖壓步驟中採用回推(push back)法，並在保持有電路圖案之狀態下將金屬單片黏貼於載帶，可使獨立之金屬單片的操控變容易，而有效率地製造陶瓷電路基板。又，發現其可抑制毛邊的發生。The inventors of the present application have intensively studied the above-mentioned phenomenon. As a result, it was found that by adopting the push back method in the stamping step and sticking the metal single piece to the carrier tape while maintaining the circuit pattern, the handling of the independent metal single piece can be made easier, and Efficiently manufacture ceramic circuit boards. In addition, it was found that it can suppress the occurrence of burrs.

本發明係根據本發明人等發現的上述研究結果所完成者。 [本發明之實施形態的細節]The present invention has been completed based on the above-mentioned research results found by the present inventors. [Details of Embodiments of the Present Invention]

其次，以下一邊參照附圖，一邊對本發明一實施形態進行說明。再者，本發明並非被限定於該等例示者，而本發明係由申請專利範圍所揭示，並包含所有與申請專利範圍同等之意思及範圍內的變更。Next, an embodiment of the present invention will be described below with reference to the accompanying drawings. In addition, the present invention is not limited to these examples, and the present invention is disclosed by the scope of the patent application, and includes all modifications within the meaning and scope equivalent to the scope of the patent application.

＜本發明的第1實施形態＞ (1)金屬電路圖案的構成 本實施形態之金屬電路圖案10係陶瓷電路基板之構成元件的一部分。藉由將本實施形態的金屬電路圖案10接合於例如由氧化鋁或氮化鋁所構成的陶瓷基板，可製造陶瓷電路基板。以下，對本實施形態之金屬電路圖案10的構成進行說明。<The first embodiment of the present invention> (1) Composition of metal circuit pattern The metal circuit pattern 10 of this embodiment is a part of the structural element of a ceramic circuit board. A ceramic circuit board can be produced by bonding the metal circuit pattern 10 of the present embodiment to a ceramic board made of alumina or aluminum nitride, for example. Hereinafter, the structure of the metal circuit pattern 10 of this embodiment is demonstrated.

圖1A係本實施形態之金屬電路圖案10的俯視圖。圖1B係本實施形態之金屬電路圖案10的側視圖。如圖1A及圖1B所示，本實施形態之金屬電路圖案10具有載帶11及複數個金屬單片12。FIG. 1A is a plan view of the metal circuit pattern 10 of the present embodiment. FIG. 1B is a side view of the metal circuit pattern 10 of the present embodiment. As shown in FIG. 1A and FIG. 1B , the metal circuit pattern 10 of the present embodiment includes a carrier tape 11 and a plurality of metal single pieces 12 .

載帶11被構成為，在保持有電路圖案之狀態下可供複數個金屬單片12黏貼。作為如此之載帶11，例如可使用將合成樹脂系的黏著劑塗佈於PET(聚對苯二甲酸乙二醇酯)、聚酯、聚丙烯等之塑膠薄膜而成的帶。The carrier tape 11 is configured so that a plurality of metal monoliths 12 can be pasted with the circuit pattern held thereon. As such a carrier tape 11 , for example, a tape obtained by applying a synthetic resin-based adhesive to a plastic film such as PET (polyethylene terephthalate), polyester, and polypropylene can be used.

複數個金屬單片12各自獨立地被黏貼於載帶11上，而形成電路圖案。作為複數個金屬單片12的材質，可例示例如銅或銅合金。複數個金屬單片12的厚度，較佳例如係0.5mm以上且4.0mm以下。在複數個金屬單片12的厚度未滿0.5mm時，存在有無法得到電源模組用基板所要求量之充分之散熱性的可能性。相對於此，藉由將複數個金屬單片12的厚度設為0.5mm以上，可得到電源模組用基板所要求量之充分的散熱性。另一方面，若複數個金屬單片12的厚度超過4.0mm，生產性便會變差。相對於此，藉由將複數個金屬單片12的厚度設為4.0mm以下，可使生產性提升。再者，若考慮散熱性與生產性的平衡，複數個金屬單片12的厚度更佳係0.7mm以上且3.0mm以下。A plurality of metal single sheets 12 are independently pasted on the carrier tape 11 to form circuit patterns. As the material of the plurality of metal single pieces 12 , for example, copper or copper alloy can be used. The thickness of the plurality of metal single pieces 12 is preferably, for example, 0.5 mm or more and 4.0 mm or less. When the thickness of the plurality of metal single pieces 12 is less than 0.5 mm, there is a possibility that sufficient heat dissipation properties required for the power module substrate cannot be obtained. On the other hand, by setting the thickness of the plurality of metal single pieces 12 to be 0.5 mm or more, sufficient heat dissipation properties required for the power module substrate can be obtained. On the other hand, when the thickness of the plurality of metal single pieces 12 exceeds 4.0 mm, the productivity is deteriorated. On the other hand, by setting the thickness of the plurality of metal single pieces 12 to be 4.0 mm or less, the productivity can be improved. Furthermore, in consideration of the balance between heat dissipation and productivity, the thickness of the plurality of metal single pieces 12 is more preferably 0.7 mm or more and 3.0 mm or less.

本實施形態之金屬電路圖案10由於電路圖案由載帶11所保持，因此可容易地進行複數個金屬單片12的操控。具體而言，例如可容易地進行當要將金屬電路圖案10接合於陶瓷基板時的定位。藉此，可效率佳地製造陶瓷電路基板。In the metal circuit pattern 10 of the present embodiment, since the circuit pattern is held by the carrier tape 11 , the handling of the plurality of metal single pieces 12 can be easily performed. Specifically, for example, positioning when the metal circuit pattern 10 is to be bonded to a ceramic substrate can be easily performed. Thereby, a ceramic circuit board can be manufactured efficiently.

又，如圖1B所示，複數個金屬單片12之至少任一側面具有摩擦痕13。再者，於本說明書中，所謂「摩擦痕」，例如意指金屬彼此摩擦而形成的痕跡。摩擦痕13例如沿著複數個金屬單片12的厚度方向延伸，且於既定的位置中斷。再者，並非複數個金屬單片12的所有側面皆一定有具有摩擦痕13的必要，亦可存在不具有摩擦痕13的側面。複數個金屬單片12之至少任一側面具有摩擦痕13，而在金屬電路圖案10所具有的複數個金屬單片12中，較佳係超過50%之金屬單片12的側面具有摩擦痕13，更佳係超過70%之金屬單片12的側面具有摩擦痕13，而進一步更佳係超過90%之金屬單片12的側面具有摩擦痕13。Furthermore, as shown in FIG. 1B , at least one side surface of the plurality of metal single pieces 12 has friction marks 13 . In addition, in this specification, a "rubbing mark" means the trace which a metal rubs against each other, for example. For example, the friction marks 13 extend along the thickness direction of the plurality of metal single sheets 12 and are interrupted at predetermined positions. Furthermore, not all the side surfaces of the plurality of metal sheets 12 necessarily have the friction marks 13 , and there may also be side surfaces without the friction marks 13 . At least one side surface of the plurality of metal single sheets 12 has friction marks 13 , and among the plurality of metal single sheets 12 of the metal circuit pattern 10 , preferably more than 50% of the metal single sheets 12 have friction marks 13 on their sides. More preferably, more than 70% of the metal sheets 12 have friction marks 13 on their sides, and more preferably more than 90% of the metal sheets 12 have friction marks 13 on their sides.

此處，於一般的電源模組中，將半導體元件焊接於陶瓷電路基板上，並在以焊線連接金屬電路圖案及半導體元件、與外部端子後，為了絕緣性的確保，例如利用矽膠等之樹脂(以下，稱為密封樹脂)來密封。如此之電源模組亦被稱為盒體模組(case module)。在將本實施形態的金屬電路圖案10用於上述般之盒體模組的情形時，由於複數個金屬單片12的側面具有摩擦痕13，因此可使陶瓷電路基板與密封樹脂的密合性提升。藉此，例如當振動被施加於盒體模組時，可抑制陶瓷電路基板的振動。作為結果，可抑制焊線的斷裂等，而使半導體元件的信賴性提升。Here, in a general power supply module, a semiconductor element is soldered on a ceramic circuit board, and after connecting the metal circuit pattern, the semiconductor element, and the external terminals with bonding wires, in order to ensure insulation, for example, a silicone rubber is used. resin (hereinafter, referred to as sealing resin) for sealing. Such a power module is also called a case module. When the metal circuit pattern 10 of the present embodiment is used in the case module as described above, since the side surfaces of the plurality of metal single pieces 12 have the friction marks 13, the adhesion between the ceramic circuit board and the sealing resin can be improved. promote. Thereby, when vibration is applied to the case module, for example, the vibration of the ceramic circuit board can be suppressed. As a result, breakage of the bonding wire and the like can be suppressed, and the reliability of the semiconductor element can be improved.

又，在將本實施形態之金屬電路圖案10用於上述般之盒體模組的情形時，由於複數個金屬單片12的側面具有摩擦痕13，因此複數個金屬單片12之側面的焊錫濕潤性會變小。藉此，例如當要將半導體元件焊接於陶瓷電路基板上時，可降低剩餘的焊料溢出而流出的危險。In addition, when the metal circuit pattern 10 of the present embodiment is used in the above-mentioned case module, since the side surfaces of the plurality of metal single pieces 12 have friction marks 13, the solder on the side surfaces of the plurality of metal single pieces 12 Wetting will be reduced. Thereby, when soldering a semiconductor element to a ceramic circuit board, for example, it can reduce the risk that excess solder overflows and flows out.

本實施形態之金屬電路圖案10如圖1B所示般，複數個金屬單片12之接近摩擦痕13側的主面14被黏貼於載帶11。另一方面，複數個金屬單片12之離摩擦痕13較遠側的主面15露出。離摩擦痕13較遠側的主面15，係周邊部具有平滑之R(圓弧)形狀之所謂的模輥面。離摩擦痕13較遠側之主面15之周緣部的最大高度Rz2 ，較接近摩擦痕13側之主面14之周緣部的最大高度Rz1 小。再者，最大高度Rz係由JIS(日本工業標準)B0601-2001所規定。再者，於本說明書中，所謂模輥意指當對平板進行剪切加工時在其斷面產生之平滑的R形狀。又，將產生模輥側的主面稱為模輥面。In the metal circuit pattern 10 of the present embodiment, as shown in FIG. 1B , the main surfaces 14 of the plurality of metal single pieces 12 on the side close to the friction marks 13 are attached to the carrier tape 11 . On the other hand, the main surfaces 15 of the plurality of metal single pieces 12 on the far side from the friction marks 13 are exposed. The main surface 15 on the far side from the friction mark 13 is a so-called die roll surface having a smooth R (circular arc) shape in the peripheral portion. The maximum height Rz 2 of the peripheral portion of the main surface 15 on the far side from the friction marks 13 is smaller than the maximum height Rz 1 of the peripheral portion of the main surface 14 on the side of the friction marks 13 . In addition, the maximum height Rz is prescribed|regulated by JIS (Japanese Industrial Standard) B0601-2001. In addition, in this specification, the mold roll means the smooth R shape which arises in the cross section when a flat plate is sheared. In addition, the main surface on the side where the die roll occurs is referred to as a die roll surface.

在將本實施形態之金屬電路圖案10接合於陶瓷基板上的情形時，藉由將離摩擦痕13較遠側的主面15接合於陶瓷基板，可在保持有電路圖案之狀態下進行接合。亦即，藉由將未被黏貼於載帶11側的主面15接合於陶瓷基板，可藉由載帶11在保持有電路圖案之狀態下進行接合。於該情形時，由於離摩擦痕13較遠側之主面15的周緣部具有平滑的R形狀，因此離摩擦痕13較遠側的主面15與陶瓷基板的接觸面會成為平坦。亦即，由於離摩擦痕13較遠側之主面15的周緣部不具有會阻礙與陶瓷基板之接觸般的突起等，因此可將與陶瓷基板之接觸面設為平坦。藉此，可使與陶瓷基板的接合性提升。When bonding the metal circuit pattern 10 of the present embodiment to the ceramic substrate, by bonding the main surface 15 farther from the friction mark 13 to the ceramic substrate, the bonding can be performed while the circuit pattern is retained. That is, by bonding the main surface 15 that is not attached to the carrier tape 11 side to the ceramic substrate, the carrier tape 11 can hold the circuit pattern for bonding. In this case, since the peripheral portion of the main surface 15 farther from the friction mark 13 has a smooth R shape, the contact surface of the main surface 15 farther from the friction mark 13 and the ceramic substrate becomes flat. That is, since the peripheral portion of the main surface 15 farther from the friction marks 13 does not have protrusions or the like that hinder the contact with the ceramic substrate, the contact surface with the ceramic substrate can be made flat. Thereby, the bondability with the ceramic substrate can be improved.

又，如上述般，在將離摩擦痕13較遠側的主面15接合於陶瓷基板的情形時，會將半導體元件焊接於接近摩擦痕13側的主面14之上。於該情形時，由於摩擦痕13存在於進行焊接之面的外周，因此可降低剩餘之焊料溢出而流出的危險。Moreover, when bonding the main surface 15 farther from the friction mark 13 to the ceramic substrate as described above, the semiconductor element is soldered to the main surface 14 on the side close to the friction mark 13 . In this case, since the friction marks 13 exist on the outer periphery of the surface to be soldered, it is possible to reduce the risk that the remaining solder overflows and flows out.

(2)金屬電路圖案之製造方法 其次，對本實施形態之金屬電路圖案10之製造方法進行說明。(2) Manufacturing method of metal circuit pattern Next, the manufacturing method of the metal circuit pattern 10 of this embodiment is demonstrated.

圖2係表示本實施形態之金屬電路圖案10之製造方法之一例的流程圖。本實施形態之金屬電路圖案10之製造方法，例如具有沖壓步驟S1、黏貼步驟S2、及檢查、包裝步驟S3。FIG. 2 is a flowchart showing an example of a method of manufacturing the metal circuit pattern 10 of the present embodiment. The manufacturing method of the metal circuit pattern 10 of this embodiment has, for example, a punching step S1, a sticking step S2, and an inspection and packaging step S3.

(沖壓步驟S1) 於沖壓步驟S1中，對金屬原料板20進行沖裁而形成各自獨立的複數個金屬單片12。金屬原料板20，可使用具有與要被搭載於陶瓷電路基板之半導體元件之特性相應之既定的導熱係數及既定的電導率之金屬材料，例如銅或銅合金。又，為了使金屬電路圖案10具有既定的強度與耐熱性等的特性，亦可於上述之金屬材料中添加既定量之鐵、鋅、磷、錫、鎳等的添加元素。(pressing step S1) In the punching step S1 , the metal raw material sheet 20 is punched out to form a plurality of individual metal pieces 12 that are independent of each other. As the metal material plate 20, a metal material having a predetermined thermal conductivity and a predetermined electrical conductivity corresponding to the characteristics of the semiconductor element to be mounted on the ceramic circuit board, such as copper or copper alloy, can be used. In addition, in order to make the metal circuit pattern 10 have predetermined properties such as strength and heat resistance, a predetermined amount of additive elements such as iron, zinc, phosphorus, tin, and nickel may be added to the above-mentioned metal material.

圖3A、圖3B及圖3C係表示沖壓步驟S1之一部分的概略剖視圖。於沖壓步驟S1中，首先，將金屬原料板20送入沖壓機。如圖3A所示，於沖壓機例如設置有衝模(die)21、衝頭(punch)22、頂出件(knock out)23、及脫模件(stripper)24。3A, 3B and 3C are schematic cross-sectional views showing a part of the pressing step S1. In the punching step S1, first, the metal raw material plate 20 is fed into the punching machine. As shown in FIG. 3A , the punching machine is provided with, for example, a die 21 , a punch 22 , a knock out 23 , and a stripper 24 .

衝模21具有用以將金屬原料板20成形為既定之電路圖案之形狀的成形孔25。然後，在將金屬原料板20送入衝模21與衝頭22之間後，如圖3B所示般，使衝頭22下降，一邊壓下成形孔25內的頂出件23，一邊從金屬原料板20朝成形孔25內沖裁複數個金屬單片12。此時，脫模件24會發揮壓抵金屬原料板20之板壓抵件的作用。The die 21 has a forming hole 25 for forming the metal raw material plate 20 into the shape of a predetermined circuit pattern. Then, after the metal raw material plate 20 is sent between the die 21 and the punch 22, as shown in FIG. 3B, the punch 22 is lowered, and the ejector 23 in the forming hole 25 is pressed down, while the metal raw material is removed from the metal raw material. The plate 20 punches a plurality of metal single pieces 12 into the forming holes 25 . At this time, the mold release member 24 functions as a plate pressing member that presses against the metal raw material plate 20 .

在從金屬原料板20沖裁出複數個金屬單片12後，如圖3C所示般，使頂出件23上升，一邊將衝頭22上推，一邊將已沖裁出之複數個金屬單片12之原本之金屬原料板20的沖裁孔26內推回。如此之成形法被稱為回推(push back)法。藉由採用回推法，可抑制毛邊的發生。又，可在保持有電路圖案之狀態下進行下一個步驟。After the plurality of metal sheets 12 are punched out from the metal raw material plate 20, as shown in FIG. 3C, the ejector 23 is raised, and the punch 22 is pushed up to push the punched out plurality of metal sheets The original metal sheet 20 of the sheet 12 is pushed back into the punched hole 26 . Such a shaping method is called a push back method. By adopting the push-back method, the occurrence of burrs can be suppressed. In addition, the next step can be performed in a state in which the circuit pattern is held.

又，當要將沖裁出的複數個金屬單片12朝沖裁孔26內推回時，例如藉由適當地控制衝模21與衝頭22之間隙，可使金屬原料板20之沖裁孔26的內周面與沖裁出之複數個金屬單片12的外周面相摩擦。藉此，可在複數個金屬單片12的側面形成摩擦痕13。更具體而言，可在複數個金屬單片12之側面之接近衝頭22的區域形成摩擦痕13。摩擦痕13會沿著沖壓機的沖裁方向、即沿著複數個金屬單片12的厚度方向形成。In addition, when the punched metal single pieces 12 are to be pushed back into the punching holes 26 , for example, by appropriately controlling the gap between the punching die 21 and the punching head 22 , the punching holes of the metal raw material plate 20 can be cut. The inner peripheral surface of 26 rubs against the outer peripheral surface of the plurality of metal single pieces 12 punched out. Thereby, the friction marks 13 can be formed on the side surfaces of the plurality of metal single sheets 12 . More specifically, the friction marks 13 may be formed on the side surfaces of the plurality of metal single sheets 12 in the region close to the punch 22 . The friction marks 13 are formed along the punching direction of the punching machine, that is, along the thickness direction of the plurality of metal single sheets 12 .

又，當要將沖裁出的複數個金屬單片12朝沖裁孔26內推回時，例如以複數個金屬單片12之厚度的一部分會嵌合於沖裁孔26的方式推回。藉由以複數個金屬單片12之厚度的一部分會嵌合於沖裁孔26的方式推回，將摩擦痕13以在既定的位置中斷之方式形成。Furthermore, when the plurality of metal single pieces 12 punched out are to be pushed back into the punching hole 26 , for example, the plurality of metal single pieces 12 are pushed back so that a part of the thickness of the plurality of metal single pieces 12 is fitted into the punching hole 26 . The friction marks 13 are formed so as to be interrupted at predetermined positions by pushing back so that a part of the thickness of the plurality of metal single sheets 12 is fitted into the punching holes 26 .

複數個金屬單片12之接近摩擦痕13側(衝頭22側)之主面14的周緣部，係毛邊容易發生的區域。另一方面，複數個金屬單片12之離摩擦痕13較遠側(頂出件23側)之主面15的周緣部，係具有平滑之R形狀之所謂模輥面。於沖壓步驟S1中，以離摩擦痕13較遠側之主面15之周緣部的最大高度Rz2 較接近摩擦痕13側之主面14之周緣部之最大高度Rz1 小的方式來形成複數個金屬單片12。The peripheral edge portion of the main surface 14 of the plurality of single metal pieces 12 on the side of the friction mark 13 (the side of the punch 22 ) is an area where burrs are likely to occur. On the other hand, the peripheral edge portion of the main surface 15 of the plurality of metal sheets 12 on the far side (the ejector 23 side) from the friction marks 13 is a so-called die roll surface having a smooth R shape. In the punching step S1, plural numbers are formed in such a way that the maximum height Rz 2 of the peripheral edge portion of the main surface 15 on the far side from the friction mark 13 is smaller than the maximum height Rz 1 of the peripheral edge portion of the main surface 14 on the side of the friction mark 13. A single metal sheet 12.

再者，較佳係當從金屬原料板20沖裁複數個金屬單片12時，在衝頭22的前端未到達衝模21之成形孔25之開口端的階段停止衝頭22的下降，並在該狀態下開始推回。藉此，可抑制毛邊的發生。Furthermore, it is preferable to stop the descending of the punch 22 at the stage when the front end of the punch 22 does not reach the opening end of the forming hole 25 of the punch 21 when punching out a plurality of single metal pieces 12 from the metal raw material plate 20, and to stop the lowering of the punch 22 at the stage when the front end of the punch 22 does not reach the opening end of the forming hole 25 of the punch 21. Start to push back in the state. Thereby, the occurrence of burrs can be suppressed.

(黏貼步驟S2) 於黏貼步驟S2中，將載帶11黏貼於複數個金屬單片12。首先，將複數個金屬單片12在使其嵌合於金屬原料板20之沖裁孔26的狀態下，以保持有電路圖案的狀態送入黏貼裝置。(Paste step S2) In the pasting step S2 , the carrier tape 11 is pasted to the plurality of metal single sheets 12 . First, the plurality of metal single pieces 12 are fed into the sticking apparatus in a state in which they are fitted into the punched holes 26 of the metal raw material plate 20 in a state in which the circuit patterns are retained.

圖4A及圖4B係表示黏貼步驟S2之一部分的概略剖視圖。如圖4A及圖4B所示，例如，於黏貼裝置設置有桿30、第1頭31、及第2頭32。4A and 4B are schematic cross-sectional views showing a part of the sticking step S2. As shown in FIGS. 4A and 4B , for example, the sticking device is provided with a rod 30 , a first head 31 , and a second head 32 .

如圖4A所示，於桿30設置有用以保持複數個金屬單片12的凹部33。以凹部33位於複數個金屬單片12之下方的方式，來調整桿30的位置。其後，第1頭31下降，而將嵌合於沖裁孔26的複數個金屬單片12拆卸。所拆卸之複數個金屬單片12，可藉由桿30的凹部33而在保持有電路圖案之狀態下移動。As shown in FIG. 4A , the rod 30 is provided with a recess 33 for holding the plurality of metal single pieces 12 . The position of the rod 30 is adjusted so that the concave portion 33 is positioned below the plurality of metal single pieces 12 . After that, the first head 31 is lowered to remove the plurality of metal single pieces 12 fitted in the punching holes 26 . The disassembled plurality of metal single pieces 12 can be moved by the concave portion 33 of the rod 30 while maintaining the circuit pattern.

其次，將桿30朝第2頭32的下方移動，而將載帶11朝第2頭32與桿30之間送出。其後，第2頭32下降，將載帶11一邊沖裁成既定的大小，一邊黏貼於複數個金屬單片12。亦即，在保持有複數個金屬單片12之電路圖案的狀態下黏貼載帶11。藉此，可容易地進行複數個金屬單片12的操控。其結果，可效率佳地製造陶瓷電路基板。Next, the rod 30 is moved below the second head 32 , and the carrier tape 11 is fed out between the second head 32 and the rod 30 . After that, the second head 32 is lowered, and the carrier tape 11 is punched into a predetermined size, and is attached to the plurality of metal single pieces 12 . That is, the carrier tape 11 is pasted in a state in which the circuit patterns of the plurality of metal single pieces 12 are held. Thereby, the manipulation of the plurality of metal monoliths 12 can be easily performed. As a result, the ceramic circuit board can be efficiently produced.

又，如上述般，複數個金屬單片12之接近摩擦痕13側之主面14的周緣部，係毛邊容易發生的區域。在複數個金屬單片12之接近摩擦痕13側之主面14的周緣部有毛邊發生的情形時，藉由當黏貼載帶11時調整第2頭32的荷重，可將毛邊壓扁而使其變小。In addition, as described above, the peripheral edge portion of the main surface 14 of the plurality of metal single pieces 12 on the side close to the friction marks 13 is an area where burrs are likely to occur. When burrs occur on the peripheral edge of the main surface 14 of the plurality of metal sheets 12 on the side close to the friction marks 13, the burrs can be compressed by adjusting the load of the second head 32 when the carrier tape 11 is pasted. its smaller.

於黏貼步驟S2中，將載帶11黏貼於複數個金屬單片12之接近摩擦痕13側的主面14。藉此，可將未被黏貼於載帶11側的主面15，在保持有電路圖案之狀態下接合於陶瓷基板。又，於該情形時，由於離摩擦痕13較遠側之主面15的周緣部具有平滑的R形狀，因此離摩擦痕13較遠側的主面15與陶瓷基板的接觸面會成為平坦。藉此，可使與陶瓷基板的接合性提升。In the pasting step S2, the carrier tape 11 is pasted on the main surfaces 14 of the plurality of metal single sheets 12 on the side close to the friction marks 13 . Thereby, the main surface 15 which is not adhered to the carrier tape 11 side can be joined to the ceramic substrate in a state in which the circuit pattern is held. In this case, since the peripheral portion of the main surface 15 farther from the friction mark 13 has a smooth R shape, the contact surface of the main surface 15 farther from the friction mark 13 and the ceramic substrate becomes flat. Thereby, the bondability with the ceramic substrate can be improved.

(檢查、包裝步驟S3) 於檢查、包裝步驟S3中，首先，實施黏貼有載帶11之金屬電路圖案10的外觀檢查。於外觀檢查中，例如，對金屬電路圖案10是否存在傷痕或變形、凹陷等進行檢查。其次，實施金屬電路圖案10的包裝。金屬電路圖案10的包裝係藉由將在外觀檢查中判斷為良品之金屬電路圖案10，例如以每既定的個數收納於包裝用的容器來進行。(Inspecting and packing step S3) In the inspection and packaging step S3, first, the appearance inspection of the metal circuit pattern 10 to which the carrier tape 11 is attached is performed. In the appearance inspection, for example, the metal circuit pattern 10 is inspected for the presence or absence of scratches, deformation, dents, or the like. Next, packaging of the metal circuit pattern 10 is performed. Packaging of the metal circuit pattern 10 is performed by storing the metal circuit pattern 10 judged to be a good product in the appearance inspection, for example, in a container for packaging every predetermined number.

藉由以上的步驟，完成品的金屬電路圖案10便可被製造。Through the above steps, the finished metal circuit pattern 10 can be manufactured.

於本實施形態之金屬電路圖案10之製造方法中，如上述般，藉由於沖壓步驟S1中採用回推法，並於黏貼步驟S2中在保持有複數個金屬單片12之電路圖案之狀態下黏貼載帶11，而可容易地進行複數個金屬單片12的操控。其結果，可有效率地製造陶瓷電路基板。In the manufacturing method of the metal circuit pattern 10 of the present embodiment, as described above, the push-back method is used in the punching step S1, and the circuit pattern of the plurality of metal single pieces 12 is maintained in the sticking step S2. By pasting the carrier tape 11 , the handling of the plurality of metal single sheets 12 can be easily performed. As a result, the ceramic circuit board can be efficiently manufactured.

又，於本實施形態之金屬電路圖案10之製造方法中，如上述般，藉由在沖壓步驟S1中適當地控制衝模21與衝頭22的間隙，可在複數個金屬單片12的側面形成摩擦痕13。藉此，例如可使陶瓷電路基板與密封樹脂的密合性提升。Furthermore, in the method of manufacturing the metal circuit pattern 10 of the present embodiment, as described above, by appropriately controlling the gap between the die 21 and the punch 22 in the punching step S1, it is possible to form on the side surfaces of the plurality of metal single pieces 12 Friction marks 13. Thereby, the adhesiveness of a ceramic circuit board and a sealing resin can be improved, for example.

(3) 本實施形態的效果 根據本實施形態，可發揮以下所示之1個或複數個效果。(3) Effects of this embodiment According to this embodiment, one or a plurality of effects shown below can be exhibited.

(a)本實施形態之金屬電路圖案10由於電路圖案由載帶11所保持，因此可容易地進行複數個金屬單片12的操控。具體而言，例如，可容易地進行當要將陶瓷基板接合於金屬電路圖案10時的定位。(a) In the metal circuit pattern 10 of the present embodiment, since the circuit pattern is held by the carrier tape 11 , the handling of the plurality of metal single pieces 12 can be easily performed. Specifically, for example, positioning when the ceramic substrate is to be bonded to the metal circuit pattern 10 can be easily performed.

此處，於習知的陶瓷電路基板中，由於當要將金屬電路圖案接合於陶瓷基板時，例如必須將沖裁成電路圖案之形狀之板狀的治具放置在陶瓷基板上，並1個1個地排列金屬單片，因此作業性很差。又，其存在有電路圖案的精準度會因當拆卸治具時或搬送至加熱爐時之振動而降低的可能。又，在藉由沖壓加工來形成金屬電路圖案的情形時，其存在有毛邊會發生的問題。Here, in the conventional ceramic circuit board, when the metal circuit pattern is to be bonded to the ceramic board, for example, a plate-shaped jig punched into the shape of the circuit pattern must be placed on the ceramic board, and one jig must be placed on the ceramic board. Since the single metal pieces are arranged one by one, workability is poor. In addition, there is a possibility that the accuracy of the circuit pattern may be lowered due to vibrations when the jig is removed or when it is transported to a heating furnace. Moreover, when forming a metal circuit pattern by press work, there exists a problem that a burr may generate|occur|produce.

相對於此，本實施形態之金屬電路圖案10當要接合於陶瓷基板時，由於可針對每個載帶11個別地將金屬電路圖案10積層於陶瓷基板上，因此相較於習知的方法，可使作業性大幅地提升。又，可使電路圖案的精準度提升。此外，由於採用回推法，因此可抑制毛邊的發生。因此，可有效率地製造陶瓷電路基板。On the other hand, when the metal circuit pattern 10 of the present embodiment is to be bonded to the ceramic substrate, the metal circuit pattern 10 can be individually laminated on the ceramic substrate for each carrier tape 11 . Therefore, compared with the conventional method, the Workability can be greatly improved. In addition, the accuracy of the circuit pattern can be improved. In addition, since the push-back method is adopted, the occurrence of burrs can be suppressed. Therefore, the ceramic circuit board can be efficiently manufactured.

(b)在將本實施形態之金屬電路圖案10用於如上述般之盒體模組的情形時，由於複數個金屬單片12的側面具有摩擦痕13，因此可使陶瓷電路基板與密封樹脂的密合性提升。藉此，例如當振動被施加於盒體模組時，可抑制陶瓷電路基板的振動。其結果，可抑制焊線的斷裂等，而使半導體元件的信賴性提升。(b) When the metal circuit pattern 10 of the present embodiment is used in the case module as described above, since the side surfaces of the plurality of metal single pieces 12 have friction marks 13, the ceramic circuit board and the sealing resin can be improved adhesion. Thereby, when vibration is applied to the case module, for example, the vibration of the ceramic circuit board can be suppressed. As a result, the breakage of the bonding wire and the like can be suppressed, and the reliability of the semiconductor element can be improved.

(c)在將本實施形態之金屬電路圖案10用於如上述般之盒體模組的情形時，由於複數個金屬單片12的側面具有摩擦痕13，因此複數個金屬單片12之側面的焊接潤濕性會變小。藉此，例如當要將半導體元件焊接於陶瓷電路基板上時，可降低剩餘之焊料溢出而流出的危險。(c) When the metal circuit pattern 10 of the present embodiment is used in the case module as described above, since the side surfaces of the plurality of metal single pieces 12 have friction marks 13, the side surfaces of the plurality of metal single pieces 12 have friction marks 13. The solder wettability will be reduced. Thereby, for example, when the semiconductor element is to be soldered on the ceramic circuit board, the risk of overflow of the remaining solder can be reduced.

(d)在將本實施形態的金屬電路圖案10接合於陶瓷基板上的情形時，藉由將離摩擦痕13較遠側的主面15接合於陶瓷基板，可在保持有電路圖案之狀態下進行接合。亦即，藉由將未被黏貼於載帶11側的主面15接合於陶瓷基板，可藉由載帶11在保持有電路圖案之狀態下進行接合。又，於該情形時，由於離摩擦痕13較遠側之主面15的周緣部具有平滑的R形狀，因此，離摩擦痕13較遠側之主面15與陶瓷基板的接觸面會成為平坦。藉此，可使與陶瓷基板的接合性提升。因此，本實施形態之金屬電路圖案10可適當地使用於，例如利用將銅板直接接合於陶瓷基板上之直接接合法所生產的陶瓷電路基板。(d) In the case of bonding the metal circuit pattern 10 of the present embodiment to the ceramic substrate, by bonding the main surface 15 farther from the friction marks 13 to the ceramic substrate, the circuit pattern can be maintained in a state to join. That is, by bonding the main surface 15 that is not attached to the carrier tape 11 side to the ceramic substrate, the carrier tape 11 can hold the circuit pattern for bonding. In this case, since the peripheral edge of the main surface 15 on the far side from the friction marks 13 has a smooth R shape, the contact surface between the main surface 15 on the far side from the friction marks 13 and the ceramic substrate becomes flat . Thereby, the bondability with the ceramic substrate can be improved. Therefore, the metal circuit pattern 10 of the present embodiment can be suitably used for, for example, a ceramic circuit board produced by a direct bonding method in which a copper plate is directly bonded to a ceramic board.

(e)在本實施形態之金屬電路圖案10之製造方法中，藉由於沖壓步驟S1中採用回推法，並於黏貼步驟S2中在保持有複數個金屬單片12之電路圖案之狀態下黏貼載帶11，可容易地進行複數個金屬單片12的操控。其結果，可有效率地製造陶瓷電路基板。(e) In the manufacturing method of the metal circuit pattern 10 of the present embodiment, by adopting the push-back method in the stamping step S1, and in the sticking step S2, the circuit patterns of the plurality of metal single sheets 12 are maintained in the state of sticking The carrier tape 11 can easily handle a plurality of metal sheets 12 . As a result, the ceramic circuit board can be efficiently manufactured.

(f)在本實施形態之金屬電路圖案10之製造方法中，藉由於沖壓步驟S1中適當地控制衝模21與衝頭22之間隙，可在複數個金屬單片12的側面形成摩擦痕13。藉此，例如，可使陶瓷電路基板與密封樹脂的密合性提升。(f) In the manufacturing method of the metal circuit pattern 10 of the present embodiment, by appropriately controlling the gap between the die 21 and the punch 22 in the punching step S1 , the friction marks 13 can be formed on the side surfaces of the plurality of metal sheets 12 . Thereby, for example, the adhesiveness of a ceramic circuit board and a sealing resin can be improved.

(4) 第1實施形態的變形例 上述之實施形態可視需要，如以下所示之變形例般進行變化。以下，僅對與上述之實施形態不同的元件進行說明，而對與在上述之實施形態中所說明之元件實質上相同的元件標示相同的元件符號並省略其說明。(4) Modification of the first embodiment The above-described embodiment can be changed as necessary, as in the following modifications. Hereinafter, only the elements different from the above-mentioned embodiments will be described, and the elements that are substantially the same as the elements described in the above-mentioned embodiments will be denoted by the same reference numerals, and the description thereof will be omitted.

圖5A係本變形例之金屬電路圖案40的俯視圖。圖5B係本變形例之金屬電路圖案40的縱剖視圖。如圖5A及圖5B所示，本變形例之金屬電路圖案40在具有金屬外框41的部分，與第1實施形態的金屬電路圖案10不同。FIG. 5A is a plan view of the metal circuit pattern 40 of this modification. FIG. 5B is a longitudinal cross-sectional view of the metal circuit pattern 40 of this modification. As shown in FIGS. 5A and 5B , the metal circuit pattern 40 of this modification is different from the metal circuit pattern 10 of the first embodiment in the portion having the metal outer frame 41 .

金屬外框41為了保護電路圖案而被設置，例如被黏貼於載帶11的外周部。金屬外框41在將金屬電路圖案40接合於陶瓷基板上之前，可在任意的時間點從載帶11拆卸。The metal frame 41 is provided in order to protect the circuit pattern, and is, for example, pasted to the outer peripheral portion of the carrier tape 11 . The metal frame 41 can be detached from the carrier tape 11 at any timing before the metal circuit pattern 40 is bonded to the ceramic substrate.

本變形例之金屬電路圖案40由於具有金屬外框41，因此可容易地進行複數個金屬單片12的操控。又，例如，可從包裝時或搬送時的振動保護電路圖案，而使電路圖案的精準度提升。Since the metal circuit pattern 40 of this modification has the metal outer frame 41 , the manipulation of the plurality of metal single pieces 12 can be easily performed. In addition, for example, the circuit pattern can be protected from vibration during packaging or transportation, and the accuracy of the circuit pattern can be improved.

＜本發明的第2實施形態＞ 接著，對本發明的第2實施形態，以與第1實施形態的不同點為中心進行說明。<Second embodiment of the present invention> Next, the second embodiment of the present invention will be described focusing on the differences from the first embodiment.

圖6A係本實施形態之金屬電路圖案50的俯視圖。圖6B係本實施形態之金屬電路圖案50的側視圖。如圖6B所示，本實施形態之金屬電路圖案50其複數個金屬單片12之離摩擦痕13較遠側的主面15，被黏貼於載帶11。亦即，被黏貼於載帶11的面與第1實施形態相反。FIG. 6A is a plan view of the metal circuit pattern 50 of the present embodiment. FIG. 6B is a side view of the metal circuit pattern 50 of the present embodiment. As shown in FIG. 6B , in the metal circuit pattern 50 of the present embodiment, the main surfaces 15 of the plurality of metal single pieces 12 on the far side from the friction marks 13 are pasted to the carrier tape 11 . That is, the surface adhered to the carrier tape 11 is opposite to that of the first embodiment.

本實施形態之金屬電路圖案50例如可藉由於黏貼步驟S2中，當要將嵌合於沖裁孔26的複數個金屬單片12拆卸時，預先將載帶11配置於桿30之上。In the metal circuit pattern 50 of the present embodiment, the carrier tape 11 can be disposed on the rod 30 in advance when the plurality of metal pieces 12 fitted in the punched holes 26 are to be disassembled in the pasting step S2 , for example.

在將本實施形態之金屬電路圖案50接合於陶瓷基板上的情形時，藉由將接近摩擦痕13側的主面14接合於陶瓷基板，可在保持有電路圖案之狀態下進行接合。亦即，藉由將未被黏貼於載帶11側的主面14接合於陶瓷基板，可藉由載帶11在保持有電路圖案之狀態下進行接合。於該情形時，由於離摩擦痕13較遠側之主面15的周緣部具有平滑的R形狀，因此當要將半導體元件搭載於離摩擦痕13較遠側的主面15上時，可降低半導體元件受到損傷等的危險。When bonding the metal circuit pattern 50 of the present embodiment to the ceramic substrate, by bonding the main surface 14 close to the friction mark 13 side to the ceramic substrate, the bonding can be performed while the circuit pattern is retained. That is, by bonding the main surface 14 that is not attached to the carrier tape 11 side to the ceramic substrate, the carrier tape 11 can hold the circuit pattern for bonding. In this case, since the peripheral portion of the main surface 15 on the far side from the friction mark 13 has a smooth R shape, when the semiconductor element is to be mounted on the main surface 15 on the far side from the friction mark 13, the reduction in There is a risk that the semiconductor element will be damaged, etc.

又，接近摩擦痕13側之主面14的周緣部，係毛邊容易發生的區域。在將本實施形態之金屬電路圖案50使用於例如利用經由焊接填料金屬層將銅板接合於陶瓷基板上之活性金屬法所生產之陶瓷電路基板的情形時，主面14之周緣部的毛邊會與焊接填料金屬層接觸或接近。藉此，毛邊會成為牆壁，可抑制焊接填料金屬朝向電路圖案表面的滲出。因此，本實施形態之金屬電路圖案50可適當地使用於，例如利用活性金屬法所生產的陶瓷電路基板。In addition, the peripheral edge portion of the main surface 14 on the side of the friction marks 13 is an area where burrs are likely to occur. When the metal circuit pattern 50 of the present embodiment is used in a ceramic circuit substrate produced by, for example, an active metal method in which a copper plate is bonded to a ceramic substrate through a solder filler metal layer, the burrs on the peripheral portion of the main surface 14 may be mixed with Solder filler metal layers are in contact or close to each other. Thereby, the burr becomes a wall, and the seepage of the solder filler metal toward the surface of the circuit pattern can be suppressed. Therefore, the metal circuit pattern 50 of this embodiment can be suitably used for, for example, a ceramic circuit board produced by an active metal method.

＜本發明的其他實施形態＞ 以上，雖已對本發明之實施形態具體地說明，但本發明並非被限定於上述之實施形態者，其可在不脫離其主旨的範圍內進行各種變更。<Other Embodiments of the Present Invention> Although the embodiment of the present invention has been specifically described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the invention.

例如，在上述之實施形態中，雖已對在沖壓步驟S1中，當要將所沖裁出的複數個金屬單片12朝沖裁孔26內推回時，以複數個金屬單片12之一部分厚度嵌合於沖裁孔26的方式推回之情形進行說明，但亦可以複數個金屬單片12之整個厚度嵌合於沖裁孔26的方式推回。For example, in the above-mentioned embodiment, in the punching step S1 , when the plurality of metal single pieces 12 punched out are to be pushed back into the punching hole 26 , the plurality of metal single pieces 12 are separated from each other. The case of pushing back so that a part of the thickness is fitted into the punched hole 26 will be described, but the entire thickness of the plurality of metal pieces 12 may be pushed back so that the entire thickness of the plurality of metal pieces 12 is fitted into the punched hole 26 .

例如，在上述之實施形態中，雖已對在沖壓步驟S1中，當要從金屬原料板20沖裁複數個金屬單片12時，在衝頭22的前端未到達衝模21之成形孔25之開口端的階段停止衝頭22的下降，並在該狀態下開始推回之情形進行說明，但亦可在將複數個金屬單片12完全地沖裁之後再開始推回。For example, in the above-described embodiment, in the punching step S1, when a plurality of single metal pieces 12 are to be punched from the metal raw material sheet 20, the front end of the punch 22 does not reach the forming hole 25 of the die 21. At the stage of the open end, the lowering of the punch 22 is stopped and the push-back is started in this state. However, the push-back may be started after the plurality of metal single pieces 12 are completely punched out.

＜本發明的較佳態樣＞ 以下，記載本發明的較佳態樣。<Preferable aspect of the present invention> Hereinafter, preferred aspects of the present invention will be described.

(記載1) 根據本發明一態樣，可提供一種金屬電路圖案，係於陶瓷基板上接合有要形成電路圖案之金屬板之陶瓷電路基板製造用的金屬電路圖案；其具備有：要形成上述電路圖案之各自獨立的複數個金屬單片；及其在保持有上述電路圖案之狀態下可供上述複數個金屬單片黏貼的載帶；且上述複數個金屬單片之至少任一側面具有摩擦痕。(Record 1) According to an aspect of the present invention, there is provided a metal circuit pattern for manufacturing a ceramic circuit substrate in which a metal plate to be formed with a circuit pattern is bonded to a ceramic substrate; the metal circuit pattern is provided with: each of the circuit patterns to be formed A plurality of independent metal monoliths; and a carrier tape for the above-mentioned plurality of metal monoliths to be pasted under the state of maintaining the above-mentioned circuit pattern; and at least any side surface of the above-mentioned plurality of metal monoliths has friction marks.

(記載2) 如記載1之金屬電路圖案，其中，上述複數個金屬單片之接近上述摩擦痕側之主面，被黏貼於上述載帶。(Record 2) The metal circuit pattern according to the description 1, wherein the principal surfaces of the plurality of metal single sheets on the side close to the friction marks are adhered to the carrier tape.

(記載3) 如記載1之金屬電路圖案，其中，上述複數個金屬單片之離上述摩擦痕較遠側之主面，被黏貼於上述載帶。(Record 3) The metal circuit pattern according to the description 1, wherein the main surfaces of the plurality of metal single sheets on the far side from the friction marks are adhered to the carrier tape.

(記載4) 如記載1至記載3中任一者之金屬電路圖案，其中，上述摩擦痕沿著上述複數個金屬單片的厚度方向延伸。(Record 4) The metal circuit pattern according to any one of descriptions 1 to 3, wherein the friction marks extend along the thickness direction of the plurality of metal single pieces.

(記載5) 如記載1至記載4中任一者之金屬電路圖案，其中，上述摩擦痕在既定的位置中斷。(Record 5) The metal circuit pattern according to any one of descriptions 1 to 4, wherein the friction marks are interrupted at predetermined positions.

(記載6) 如記載1至記載5中任一者之金屬電路圖案，其中，上述複數個金屬單片係由銅或銅合金所構成，厚度為0.5mm以上且4.0mm以下。較佳係上述複數個金屬單片的厚度為0.7mm以上且3.0mm以下。(Record 6) The metal circuit pattern according to any one of descriptions 1 to 5, wherein the plurality of metal single pieces are made of copper or a copper alloy, and have a thickness of 0.5 mm or more and 4.0 mm or less. Preferably, the thickness of the plurality of metal single pieces is 0.7 mm or more and 3.0 mm or less.

(記載7) 如記載1至記載6中任一者之金屬電路圖案，其中，其進一步具有被黏貼於上述載帶之外周部的金屬外框。(Record 7) The metal circuit pattern according to any one of descriptions 1 to 6, further comprising a metal outer frame attached to the outer peripheral portion of the carrier tape.

(記載8) 根據本發明另一態樣，可提供一種金屬電路圖案之製造方法，係於陶瓷基板上接合有金屬板之陶瓷電路基板用的金屬電路圖案之製造方法；其具備有：對金屬原料板進行沖裁而形成各自獨立之複數個金屬單片的沖壓步驟；及將載帶黏貼於上述複數個金屬單片的黏貼步驟；且在上述沖壓步驟中，藉由將已沖裁出之上述複數個金屬單片壓回上述金屬原料板的沖裁孔，而在上述複數個金屬單片的側面形成摩擦痕；在上述黏貼步驟中，從上述金屬原料板的上述沖裁孔將上述複數個金屬單片加以拆卸，並在保持有上述複數個金屬單片之電路圖案的狀態下黏貼上述載帶。(Record 8) According to another aspect of the present invention, there can be provided a method of manufacturing a metal circuit pattern, which is a method of manufacturing a metal circuit pattern for a ceramic circuit substrate having a metal plate bonded to a ceramic substrate; the method includes: punching a metal raw material plate. The punching step of cutting to form a plurality of independent metal single sheets; and the sticking step of pasting the carrier tape to the above-mentioned plurality of metal single sheets; and in the above-mentioned punching step, by punching the above-mentioned plurality of metal sheets The single piece is pressed back to the punching hole of the metal raw material plate, and friction marks are formed on the side surfaces of the plurality of metal single pieces; in the above-mentioned sticking step, the plurality of metal single pieces are cut from the punching hole of the above-mentioned metal raw material plate. It is disassembled, and the carrier tape is pasted in a state where the circuit patterns of the plurality of metal single sheets are kept.

10:金屬電路圖案 11:載帶 12:金屬單片 13:摩擦痕 14:主面 15:主面 20:金屬原料板 21:衝模 22:衝頭 23:頂出件 24:脫模件 25:成形孔 26:沖裁孔 30:桿 31:第1頭 32:第2頭 33:凹部 40:金屬電路圖案 41:金屬外框 50:金屬電路圖案 S1:沖壓步驟 S2:黏貼步驟 S3:檢查、包裝步驟10: Metal circuit pattern 11: Carrier tape 12: Metal Monolithic 13: Friction marks 14: Main side 15: Main side 20: Metal raw material board 21: Die 22: Punch 23: ejector 24: Release parts 25: Forming holes 26: Punching holes 30: Rod 31: Head 1 32: Head 2 33: Recess 40: Metal circuit pattern 41: Metal frame 50: Metal circuit pattern S1: Stamping step S2: Paste Step S3: Inspection, packing steps

圖1A係本發明的第1實施形態的金屬電路圖案10的俯視圖。 圖1B係本發明的第1實施形態的金屬電路圖案10的側視圖。 圖2係表示本發明的第1實施形態的金屬電路圖案10之製造方法之一例的流程圖。 圖3A係表示本發明的第1實施形態的沖壓步驟S1的一部分的概略剖視圖。 圖3B係表示本發明的第1實施形態的沖壓步驟S1的一部分的概略剖視圖。 圖3C係表示本發明的第1實施形態的沖壓步驟S1的一部分的概略剖視圖。 圖4A係表示本發明的第1實施形態的黏貼步驟S2的一部分的概略剖視圖。 圖4B係表示本發明的第1實施形態的黏貼步驟S2的一部分的概略剖視圖。 圖5A係本發明的第1實施形態的變形例的金屬電路圖案40的俯視圖。 圖5B係本發明的第1實施形態的變形例的金屬電路圖案40的縱剖視圖。 圖6A係本發明的第2實施形態的金屬電路圖案50的俯視圖。 圖6B係本發明的第2實施形態的金屬電路圖案50的側視圖。FIG. 1A is a plan view of the metal circuit pattern 10 according to the first embodiment of the present invention. FIG. 1B is a side view of the metal circuit pattern 10 according to the first embodiment of the present invention. FIG. 2 is a flowchart showing an example of a method of manufacturing the metal circuit pattern 10 according to the first embodiment of the present invention. 3A is a schematic cross-sectional view showing a part of the pressing step S1 in the first embodiment of the present invention. 3B is a schematic cross-sectional view showing a part of the pressing step S1 in the first embodiment of the present invention. 3C is a schematic cross-sectional view showing a part of the pressing step S1 in the first embodiment of the present invention. 4A is a schematic cross-sectional view showing a part of the sticking step S2 in the first embodiment of the present invention. 4B is a schematic cross-sectional view showing a part of the sticking step S2 in the first embodiment of the present invention. 5A is a plan view of a metal circuit pattern 40 according to a modification of the first embodiment of the present invention. 5B is a vertical cross-sectional view of the metal circuit pattern 40 according to the modification of the first embodiment of the present invention. FIG. 6A is a plan view of the metal circuit pattern 50 according to the second embodiment of the present invention. FIG. 6B is a side view of the metal circuit pattern 50 according to the second embodiment of the present invention.

10:金屬電路圖案 10: Metal circuit pattern

11:載帶 11: Carrier tape

12:金屬單片 12: Metal Monolithic

13:摩擦痕 13: Friction marks

14:主面 14: Main side

15:主面 15: Main side

Claims (8)

一種金屬電路圖案，係於陶瓷基板上接合有要形成電路圖案之金屬板之陶瓷電路基板製造用的金屬電路圖案；其具備有：要形成上述電路圖案之各自獨立的複數個金屬單片；及在保持有上述電路圖案之狀態下可供上述複數個金屬單片黏貼的載帶；且上述複數個金屬單片之至少任一側面具有摩擦痕，上述複數個金屬單片之離上述摩擦痕較遠側之主面係周緣部具有R(圓弧)形狀的模輥面。 A metal circuit pattern, which is a metal circuit pattern for the manufacture of a ceramic circuit substrate in which a metal plate to form a circuit pattern is bonded to a ceramic substrate; it is provided with: a plurality of independent metal sheets for forming the circuit pattern; and A carrier tape that can be attached to the plurality of metal single sheets while maintaining the above circuit pattern; and at least one side of the plurality of metal single sheets has friction marks, and the plurality of metal sheets are closer to the friction marks. The main surface on the far side is a die roll surface having an R (circular arc) shape at the peripheral edge. 如請求項1之金屬電路圖案，其中，上述複數個金屬單片之接近上述摩擦痕側之主面，被黏貼於上述載帶。 The metal circuit pattern of claim 1, wherein the principal surfaces of the plurality of metal single sheets on the side close to the friction marks are attached to the carrier tape. 如請求項1之金屬電路圖案，其中，上述複數個金屬單片之離上述摩擦痕較遠側之主面，被黏貼於上述載帶。 The metal circuit pattern of claim 1, wherein the main surfaces of the plurality of metal single sheets on the far side from the friction marks are adhered to the carrier tape. 如請求項1之金屬電路圖案，其中，上述摩擦痕沿著上述複數個金屬單片的厚度方向延伸。 The metal circuit pattern of claim 1, wherein the friction marks extend along the thickness direction of the plurality of metal single sheets. 如請求項1之金屬電路圖案，其中，上述摩擦痕在既定的位置中斷。 The metal circuit pattern of claim 1, wherein the friction marks are interrupted at predetermined positions. 如請求項1之金屬電路圖案，其中，上述複數個金屬單片係由銅或銅合金所構成，厚度為0.5mm以上且4.0mm以下。 The metal circuit pattern of claim 1, wherein the plurality of metal single pieces are made of copper or a copper alloy, and have a thickness of 0.5 mm or more and 4.0 mm or less. 如請求項1之金屬電路圖案，其中，其進一步具有被黏貼於上述載帶之外周部的金屬外框。 The metal circuit pattern of claim 1, further comprising a metal outer frame attached to the outer peripheral portion of the carrier tape. 一種金屬電路圖案之製造方法，係於陶瓷基板上接合有金屬板之陶瓷電路基板用的金屬電路圖案之製造方法；其具備有：對金屬原料板進行沖裁而形成各自獨立之複數個金屬單片的沖壓步驟；及將載帶黏貼於上述複數個金屬單片的黏貼步驟；且在上述沖壓步驟中，藉由將已沖裁出之上述複數個金屬單片壓回上述金屬原料板的沖裁孔，而在上述複數個金屬單片的側面形成摩擦痕；在上述黏貼步驟中，從上述金屬原料板的上述沖裁孔將上述複數個金屬單片加以拆卸，並在保持有上述複數個金屬單片之電路圖案的狀態下黏貼上述載帶，在上述沖壓步驟中，以離上述摩擦痕較遠側之主面成為模輥面之方式形成上述摩擦痕。 A method for manufacturing a metal circuit pattern, which is a method for manufacturing a metal circuit pattern for a ceramic circuit substrate with a metal plate bonded to a ceramic substrate; the method includes: punching a metal raw material plate to form a plurality of independent metal sheets The stamping step of the sheet; and the sticking step of sticking the carrier tape on the above-mentioned plural metal single sheets; cutting holes, and forming friction marks on the side surfaces of the plurality of metal single sheets; in the above-mentioned sticking step, the above-mentioned plurality of metal single sheets are removed from the above-mentioned punching holes of the above-mentioned metal raw material plate, and the above-mentioned plurality of metal sheets are retained. The carrier tape is pasted in the state of the circuit pattern of the single metal sheet, and in the punching step, the friction marks are formed so that the main surface farther from the friction marks becomes the die roll surface.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI633952B (en) * 2017-05-17 2018-09-01 Ｊｘ金屬股份有限公司 Metal plate for circuit board, metal plate molded product for circuit board, circuit board, power module, and method for manufacturing power module
TWI663897B (en) * 2016-12-16 2019-06-21 日商Ｊｘ金屬股份有限公司 Metal plate for circuit substrate, circuit substrate, power module, metal plate molded product, and method for manufacturing circuit substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2583532B2 (en) * 1987-10-21 1997-02-19 新光電気工業株式会社 Ceramic with conductor
JP5011845B2 (en) * 2006-06-23 2012-08-29 パナソニック株式会社 Method for manufacturing thermal conductive substrate and thermal conductive substrate manufactured thereby
JP5637719B2 (en) * 2010-03-31 2014-12-10 Ｄｏｗａメタルテック株式会社 Method for manufacturing metal-ceramic bonded circuit board
US9872380B2 (en) * 2014-07-29 2018-01-16 Denka Company Limited Ceramic circuit board and method for producing same
WO2018211640A1 (en) * 2017-05-17 2018-11-22 Ｊｘ金属株式会社 Metal plate for circuit board, metal plate molding for circuit board, circuit board, power module, and method for manufacturing power module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI663897B (en) * 2016-12-16 2019-06-21 日商Ｊｘ金屬股份有限公司 Metal plate for circuit substrate, circuit substrate, power module, metal plate molded product, and method for manufacturing circuit substrate
TWI633952B (en) * 2017-05-17 2018-09-01 Ｊｘ金屬股份有限公司 Metal plate for circuit board, metal plate molded product for circuit board, circuit board, power module, and method for manufacturing power module

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