TWI757914B

TWI757914B - Liquid supplying system and liquid supplying method

Info

Publication number: TWI757914B
Application number: TW109135532A
Authority: TW
Inventors: 黄揚倫; 陳裕凱; 方進坤
Original assignee: 台灣積體電路製造股份有限公司
Priority date: 2020-10-14
Filing date: 2020-10-14
Publication date: 2022-03-11
Also published as: TW202214356A

Abstract

A liquid supplying method includes applying, using a liquid supplying system, a liquid onto a first wafer, wherein the liquid supplying system comprises a liquid tank, a nozzle, and a first filter, and the liquid supplying system is configured to allow the liquid to flow from the liquid tank to the nozzle through the first filter; stopping the applying of the liquid onto the first wafer; replacing the first filter with a second filter; connecting a recirculating system to the liquid supplying system; recirculating, using the recirculating system, the liquid through the second filter; after recirculating the liquid through the second filter, removing the recirculating system from the liquid supplying system; and after removing the recirculating system, applying, using the liquid supplying system, the liquid onto a second wafer.

Description

液體供應系統以及液體供應方法Liquid supply system and liquid supply method

本揭露是關於一種液體供應系統以及液體供應方法。The present disclosure relates to a liquid supply system and a liquid supply method.

近年來，半導體積體電路(semiconductor integrated circuits)經歷了指數級的成長。在積體電路材料以及設計上的技術進步下，產生了多個世代的積體電路，其中每一世代較前一世代具有更小更複雜的電路。在積體電路發展的過程中，當幾何尺寸(亦即製程中所能產出的最小元件或者線)縮小時，功能密度(亦即每一晶片區域所具有的內連接裝置的數量)通常會增加。一般而言，此種尺寸縮小的製程可以帶來增加生產效率以及降低製造成本的好處，然而，此種尺寸縮小的製程亦會增加製造與生產積體電路的複雜度。In recent years, semiconductor integrated circuits have experienced exponential growth. Technological advances in integrated circuit materials and design have resulted in multiple generations of integrated circuits, each of which has smaller and more complex circuits than the previous generation. During the development of integrated circuits, as the geometry size (ie, the smallest component or line that can be produced in the process) shrinks, the functional density (ie, the number of interconnect devices per chip area) usually increases Increase. Generally speaking, such downsizing process can bring benefits of increased production efficiency and lower manufacturing cost, however, such downsizing process also increases the complexity of manufacturing and producing integrated circuits.

在半導體元件製造過程中，光刻微影製程(lithography)扮演了相當重要的角色，其用於在晶圓上形成所需的特定圖案。光刻微影製程的基本步驟包括了以光阻液在晶圓上塗佈光阻層、以特定圖案對光阻層進行曝光以及以顯影液對光阻層顯影以去除不需要的部分，進而能在晶圓上形成所需的特定圖案等。In the manufacturing process of semiconductor devices, lithography plays a very important role in forming desired specific patterns on wafers. The basic steps of the lithography process include coating the photoresist layer on the wafer with a photoresist solution, exposing the photoresist layer in a specific pattern, and developing the photoresist layer with a developer solution to remove the unwanted parts, and then A desired specific pattern, etc., can be formed on the wafer.

本揭露的部分實施方式提供了一種方法。該方法包含使用一液體供應系統提供一液體至一第一晶圓上，其中該液體供應系統具有一液體容置槽、一噴頭以及一第一過濾器，該液體供應系統用以使該液體從該液體容置槽經該第一過濾器而流至該噴頭；停止提供該液體至該第一晶圓上；將該第一過濾器替換為一第二過濾器；外接一循環系統至該液體供應系統；使用該循環系統，使該液體循環地流過該第二過濾器；在使該液體循環地流過該第二過濾器之後，從該液體供應系統上，移除該循環系統；以及在移除該循環系統之後，使用該液體供應系統提供該液體至一第二晶圓上。Some embodiments of the present disclosure provide a method. The method includes using a liquid supply system to provide a liquid on a first wafer, wherein the liquid supply system has a liquid holding tank, a shower head and a first filter, the liquid supply system is used to make the liquid from The liquid accommodating tank flows to the shower head through the first filter; stop supplying the liquid to the first wafer; replace the first filter with a second filter; externally connect a circulation system to the liquid supplying system; circulating the liquid through the second filter using the circulation system; removing the circulation system from the liquid supply system after circulating the liquid through the second filter; and After removing the circulation system, the liquid is supplied onto a second wafer using the liquid supply system.

本揭露的部分實施方式提供了一種方法。該方法包含將一第一過濾器安裝於一第一管路以及一第二管路之間；將一循環系統的一第一外接管路連接於該第一管路，且將該循環系統的一第二外接管路連接於該第二管路；使一液體經由該第一管路、該第一過濾器、該第二管路以及該第二外接管路，流至該循環系統之一第一容置槽；使該液體經由該第一管路以及該第一外接管路，流至該循環系統之一第二容置槽；以及在該液體流至該循環系統之該第一容置槽以及該第二容置槽後，進行一第一循環步驟，使該液體從該二容置槽經該第一外接管路、該第一管路、該第一過濾器、該第二管路以及該第二外接管路，流至該第一容置槽。Some embodiments of the present disclosure provide a method. The method comprises: installing a first filter between a first pipeline and a second pipeline; connecting a first external pipeline of a circulation system to the first pipeline, and A second external pipeline is connected to the second pipeline; a liquid flows through the first pipeline, the first filter, the second pipeline and the second external pipeline to one of the circulation systems a first accommodating tank; make the liquid flow to a second accommodating tank of the circulation system through the first pipeline and the first external pipeline; and the first container where the liquid flows to the circulation system After placing the tank and the second accommodating tank, a first circulation step is performed, so that the liquid passes through the first external pipeline, the first pipeline, the first filter, the second accommodating tank from the two accommodating tanks The pipeline and the second external pipeline flow to the first accommodating tank.

本揭露的部分實施方式提供了一種液體供應系統。該液體供應系統包含液體容置槽、噴頭、過濾器、第一管路以及第二管路以及可拆式循環系統。過濾器流體連接於該液體容置槽以及該噴頭之間。第一管路以及第二管路分別連接於該過濾器的入口以及出口。可拆式循環系統具有第一外接管路以及第二外接管路，分別連接於該第一管路以及該第二管路。Some embodiments of the present disclosure provide a liquid supply system. The liquid supply system includes a liquid accommodating tank, a spray head, a filter, a first pipeline and a second pipeline, and a detachable circulation system. The filter is fluidly connected between the liquid accommodating tank and the spray head. The first pipeline and the second pipeline are respectively connected to the inlet and the outlet of the filter. The detachable circulation system has a first external pipeline and a second external pipeline, which are respectively connected to the first pipeline and the second pipeline.

以下本揭露將提供許多個不同的實施方式或實施例以實現所提供之專利標的之不同特徵。許多元件與設置將以特定實施例在以下說明，以簡化本揭露。當然這些實施例僅用以示例而不應用以限制本揭露。舉例而言，敘述「第一特徵形成於第二特徵上」包含多種實施方式，其中涵蓋第一特徵與第二特徵直接接觸，以及額外的特徵形成於第一特徵與第二特徵之間而使兩者不直接接觸。此外，於各式各樣的實施例中，本揭露可能會重複標號以及/或標註字母。此重複是為了簡化並清楚說明，而非意圖表明這些討論的各種實施方式以及/或配置之間的關係。The following disclosure will provide many different implementations or examples for implementing the various features of the provided patented subject matter. A number of elements and arrangements are described below in specific embodiments to simplify the present disclosure. Of course, these embodiments are only used as examples and should not be used to limit the present disclosure. For example, the statement "a first feature is formed on a second feature" includes embodiments that encompass the first feature being in direct contact with the second feature, as well as additional features being formed between the first feature and the second feature such that The two are not in direct contact. Furthermore, in various embodiments, the present disclosure may repeat reference numerals and/or reference letters. This repetition is for simplicity and clarity of illustration and is not intended to indicate the relationship between the various implementations and/or configurations of these discussions.

更甚者，空間相對的詞彙，例如「下層的」、「低於」、「下方」、「之下」、「上層的」、「上方」等相關詞彙，於此用以簡單描述元件或特徵與另一元件或特徵的關係，如圖所示。在使用或操作時，除了圖中所繪示的轉向之外，這些空間相對的詞彙涵蓋裝置的不同的轉向。或者，這些裝置可旋轉（旋轉90度或其他角度），且在此使用的空間相對的描述語可作對應的解讀。What's more, spatially relative words, such as "lower", "below", "below", "below", "upper", "above" and other related words, are used here to simply describe elements or features Relationship to another element or feature, as shown. In use or operation, these spatially relative terms encompass different turns of the device in addition to the turns shown in the figures. Alternatively, these devices can be rotated (rotated 90 degrees or other angles) and the spatially relative descriptors used herein can be interpreted accordingly.

在半導體元件製造過程中，光刻微影製程用於在晶圓上形成所需的特定圖案。在進行光刻微影製程之前，光阻液供應系統經由噴塗裝置將光阻液塗佈至晶圓的光阻層上。光阻液供應系統設有過濾器，以過濾光阻層中的微粒，避免影響晶圓的圖案化。在使用一段時間後，過濾器上可能會附著太多微粒，而需更換新的過濾器。在更換新的過濾器後，常需耗費大量的光阻液，以浸潤新的過濾器並排泡。此外，在浸潤新的過濾器時，也需要人力守在現場，防止容置槽空掉而空轉。In the fabrication of semiconductor components, photolithography processes are used to form desired specific patterns on wafers. Before performing the photolithography process, the photoresist liquid supply system applies the photoresist liquid to the photoresist layer of the wafer through a spraying device. The photoresist liquid supply system is provided with a filter to filter particles in the photoresist layer to avoid affecting the patterning of the wafer. After a period of use, too many particles may adhere to the filter and a new filter may be required. After replacing the new filter, it is often necessary to consume a large amount of photoresist liquid to soak the new filter and remove the bubbles. In addition, when infiltrating a new filter, manpower is also required to guard the site to prevent the accommodating tank from emptying and idling.

本揭露的部分實施方式，提供一外接的循環系統，在更換新的過濾器後並在浸潤新的過濾器之前，將循環系統接至過濾器的前後兩端。接著，使用此循環系統浸潤新的過濾器。藉此，循環系統能夠重複地將光阻液導入過濾器，以在不耗費大量的光阻液的情況下，浸潤新的過濾器並完成排泡過程。Some embodiments of the present disclosure provide an external circulation system, which is connected to the front and rear ends of the filter after the filter is replaced and before the new filter is soaked. Next, use this circulation system to infiltrate a new filter. Thereby, the circulation system can repeatedly introduce the photoresist liquid into the filter, so as to infiltrate a new filter and complete the bubble removal process without consuming a large amount of photoresist liquid.

第1圖為根據本揭露的部分實施方式中外接循環裝置的液體供應系統100的方塊示意圖。於本實施方式中，液體供應系統100可用於提供光阻液至晶圓W上。於部分其他實施方式中，液體供應系統100可用於提供顯影液至晶圓W上。或者，於部分其他實施方式中，液體供應系統100可用於提供其他液體。換句話說，液體供應系統100所處理的液體可以是光阻液、顯影液、清潔液、稀釋液或其他適當的液體。FIG. 1 is a schematic block diagram of a liquid supply system 100 with an external circulation device according to some embodiments of the present disclosure. In this embodiment, the liquid supply system 100 can be used to provide the photoresist liquid on the wafer W. As shown in FIG. In some other embodiments, the liquid supply system 100 may be used to provide the developer solution onto the wafer W. As shown in FIG. Alternatively, in some other embodiments, the liquid supply system 100 may be used to provide other liquids. In other words, the liquid handled by the liquid supply system 100 may be photoresist liquid, developer liquid, cleaning liquid, diluent liquid, or other suitable liquids.

液體供應系統100可包含輸送液體的管路LL(包含管路LL1~LL5)，用以將液體輸送至晶圓W上。液體供應系統100還可包含其他的管路FL，用以蒐集氣體及/或含有氣量較高的液體(例如含有氣泡的液體)，作為廢液排至廠務。以功能性而言，液體供應系統100可包含槽區110、抽送區120以及鍍膜區130。The liquid supply system 100 may include a pipeline LL (including pipelines LL1 - LL5 ) for conveying the liquid for conveying the liquid to the wafer W. The liquid supply system 100 may further include other pipelines FL for collecting gas and/or liquid containing a relatively high amount of gas (eg, liquid containing bubbles), and discharging to the factory as waste liquid. Functionally, the liquid supply system 100 may include a tank area 110 , a pumping area 120 and a coating area 130 .

在槽區110中，液體供應系統100可包含液體供應瓶112、容置槽114、過濾器116、小容置槽118以及閥件110V1~110V3。液體供應瓶112用以容納大量的液體LB。如前所述，此液體LB可以是光阻液、顯影液、清潔液、稀釋液或其他適當的液體。In the tank area 110 , the liquid supply system 100 may include a liquid supply bottle 112 , an accommodating tank 114 , a filter 116 , a small accommodating tank 118 , and valve members 110V1 to 110V3 . The liquid supply bottle 112 is used to hold a large amount of liquid LB. As mentioned above, the liquid LB can be a photoresist liquid, a developer liquid, a cleaning liquid, a diluting liquid or other suitable liquids.

管路LL之一(例如管路LL1)連接於液體供應瓶112以及容置槽114之間，管路LL之另一(例如管路LL2)連接於容置槽114以及小容置槽118之間。於部分實施方式中，閥件110V1可設置於管路LL1上，閥件110V2~110V3可設置於管路LL2上，而過濾器116可以安裝於管路LL2上且位於閥件110V2~110V3之間。具體而言，管路LL2之前部分(即閥件110V2所在的部分)連接過濾器116的入口，管路LL2之後部分 (即閥件110V3所在的部分)連接過濾器116的出口。藉此，可以藉由設置於管路LL2之前部分的閥件110V2以及設置於管路LL2之後部分的閥件110V3，控制液體LB是否流通經過過濾器116。於部分實施方式中，閥件110V1~110V3可以為二通二位閥。或者，於其他實施方式中，閥件110V1~110V3可以採用任何適當配置。於本文中，管路LL2之前部分(即閥件110V2所在的部分)亦可稱為第一管路，管路LL2之後部分 (即閥件110V3所在的部分)亦可稱為第二管路。One of the pipelines LL (eg, pipeline LL1 ) is connected between the liquid supply bottle 112 and the accommodating tank 114 , and the other of the pipelines LL (eg, pipeline LL2 ) is connected between the accommodating tank 114 and the small accommodating tank 118 . between. In some embodiments, the valve 110V1 can be installed on the pipeline LL1, the valves 110V2-110V3 can be installed on the pipeline LL2, and the filter 116 can be installed on the pipeline LL2 and located between the valves 110V2-110V3. . Specifically, the front part of the pipeline LL2 (ie the part where the valve 110V2 is located) is connected to the inlet of the filter 116 , and the rear part of the pipeline LL2 (ie the part where the valve 110V3 is located) is connected to the outlet of the filter 116 . Thereby, whether the liquid LB flows through the filter 116 can be controlled by the valve element 110V2 disposed in the front part of the pipeline LL2 and the valve element 110V3 disposed in the rear part of the pipeline LL2. In some embodiments, the valve elements 110V1 to 110V3 may be two-way two-position valves. Alternatively, in other embodiments, the valve members 110V1 to 110V3 may adopt any suitable configuration. Herein, the part before the pipeline LL2 (ie the part where the valve 110V2 is located) may also be called the first pipeline, and the part after the pipeline LL2 (ie the part where the valve 110V3 is located) may also be called the second pipeline.

於部分實施方式中，過濾器116可包含聚四氟乙烯(Polytetrafluoroethylene；PTFE)過濾膜、高密度聚乙烯(High DensityPolyethylene；HDPE)過濾膜、尼龍(Nylon)過濾膜以及/或其他適當過濾材料。In some embodiments, the filter 116 may include a polytetrafluoroethylene (PTFE) filter membrane, a high density polyethylene (HDPE) filter membrane, a nylon (Nylon) filter membrane, and/or other suitable filter materials.

於部分實施方式中，容置槽114周圍可以設有感測器114S，以感測容置槽114的液體含量。舉例而言，感測器114S可例如為紅外線感測器等。In some embodiments, a sensor 114S may be disposed around the accommodating groove 114 to sense the liquid content of the accommodating groove 114 . For example, the sensor 114S can be, for example, an infrared sensor or the like.

在槽區110中，液體供應系統100更可包含氣體供應源GS、氣體管路110GL以及氣體閥件GV1~GV4。氣體管路110GL包含連接至液體供應瓶112的氣體管路110GL1以及連接至容置槽114的氣體管路110GL2。藉此，經由氣體閥件GV1~GV4的控制，氣體管路110GL1~110GL2能個別對液體供應瓶112以及容置槽114提供氣體加壓，以便於使液體供應瓶112以及容置槽114內的液體LB往後續管路LL1以及LL2流動。於部分實施方式中，氣體供應源GS所提供的氣體可以選用不容易與液體LB發生反應的氣體，例如氮氣等。In the tank area 110, the liquid supply system 100 may further include a gas supply source GS, a gas pipeline 110GL, and gas valve parts GV1-GV4. The gas pipeline 110GL includes a gas pipeline 110GL1 connected to the liquid supply bottle 112 and a gas pipeline 110GL2 connected to the accommodating tank 114 . In this way, through the control of the gas valves GV1 ˜ GV4 , the gas pipelines 110GL1 ˜ 110GL2 can individually provide gas pressure to the liquid supply bottle 112 and the accommodating tank 114 , so as to make the liquid supply bottle 112 and the accommodating tank 114 gas pressurized. The liquid LB flows to the subsequent pipelines LL1 and LL2. In some embodiments, the gas provided by the gas supply source GS may be a gas that is not easily reacted with the liquid LB, such as nitrogen gas.

於部分實施方式中，靠近氣體供應源GS的氣體閥件GV1可以為逆時閥，氣體閥件GV2可以為三通二位閥(常閉型)、氣體閥件GV3~GV4可以為二通二位閥。於部分實施方式中，氣體管路110GL上可以設有止回閥GV5，以防止逆流。或者，於其他實施方式中，氣體閥件GV1~GV4以及止回閥GV5可以採用任何適當配置。於部分其他實施方式中，氣體管路110GL上可以設有壓力計110W，以監測氣體壓力。In some embodiments, the gas valve GV1 close to the gas supply source GS can be a counterclockwise valve, the gas valve GV2 can be a three-way two-position valve (normally closed type), and the gas valves GV3 to GV4 can be two-way two-way valves. position valve. In some embodiments, a check valve GV5 may be provided on the gas pipeline 110GL to prevent reverse flow. Alternatively, in other embodiments, the gas valves GV1 ˜ GV4 and the check valve GV5 may adopt any suitable configuration. In some other embodiments, a pressure gauge 110W may be provided on the gas pipeline 110GL to monitor the gas pressure.

在抽送區120中，液體供應系統100可包含幫浦122、電控驅動器124以及小容置槽126。於部分實施方式中，管路LL之一(例如管路LL3)連接於槽區110的小容置槽118以及幫浦122之間，管路LL之另一(例如管路LL4)連接於幫浦122以及小容置槽126之間。於部分實施方式中，幫浦122可驅使槽區110的小容置槽118內的液體LB流動至抽送區120的小容置槽126，並使抽送區120的小容置槽126內的液體LB流動至鍍膜區130。於部分實施方式中，電控驅動器124電性連接幫浦122，以控制幫浦122的運作。於部分實施方式中，液體供應系統100更可包含閥件120V，設置於管路LL3上，以控制液體LB進入幫浦122的流動速率。於部分實施方式中，閥件120V可以是二通二位閥。或者，於其他實施方式中，閥件120V可以採用任何適當配置。In the pumping area 120 , the liquid supply system 100 may include a pump 122 , an electronically controlled driver 124 , and a small holding tank 126 . In some embodiments, one of the pipelines LL (eg, pipeline LL3 ) is connected between the small accommodating tank 118 of the tank area 110 and the pump 122 , and the other of the pipelines LL (eg, pipeline LL4 ) is connected to the pump. between the port 122 and the small accommodating groove 126 . In some embodiments, the pump 122 can drive the liquid LB in the small holding tank 118 of the tank area 110 to flow to the small holding tank 126 of the pumping area 120 , and make the liquid in the small holding tank 126 of the pumping area 120 flow to the small holding tank 126 of the pumping area 120 LB flows to the coating region 130 . In some embodiments, the electronically controlled driver 124 is electrically connected to the pump 122 to control the operation of the pump 122 . In some embodiments, the liquid supply system 100 may further include a valve member 120V disposed on the pipeline LL3 to control the flow rate of the liquid LB into the pump 122 . In some embodiments, the valve member 120V may be a two-way two-position valve. Alternatively, in other embodiments, the valve member 120V may adopt any suitable configuration.

在鍍膜區130中，液體供應系統100可包含噴頭132以及噴塗閥件(dispense valve)130V。管路LL之一(例如管路LL5)連接於抽送區120的小容置槽126以及鍍膜區130的噴頭132之間。噴塗閥件130V可以設置於管路LL5上，以控制噴頭132噴灑液體LB的速率。於部分實施方式中，液體供應系統100的鍍膜區130可以視為鍍膜機(coater)的一部分。In the coating area 130, the liquid supply system 100 may include a spray head 132 and a dispense valve 130V. One of the pipelines LL (eg, pipeline LL5 ) is connected between the small accommodating tank 126 of the pumping area 120 and the shower head 132 of the coating area 130 . A spray valve 130V may be disposed on the pipeline LL5 to control the rate at which the spray head 132 sprays the liquid LB. In some embodiments, the coating area 130 of the liquid supply system 100 may be considered part of a coater.

在液體供應系統100的配置中，管路FL可以連接於液體供應瓶112、容置槽114、過濾器116、小容置槽118以及小容置槽126的上半位置，以從中蒐集氣體及/或含有氣量較高的液體。於部分實施方式中，液體供應系統100更可包含多個閥件FV1~FV5。閥件FV1~FV5可以是二通二位閥。或者，於其他實施方式中，閥件FV1~FV5可以採用任何適當配置。閥件FV1~FV5可以設置於管路FL的適當位置，以控制管路FL於適當的時間點，從液體供應瓶112、容置槽114、過濾器116、小容置槽118以及小容置槽126等蒐集氣體及/或含氣量較高的液體，以作為廢液排至廠務。舉例而言，噴塗一預定量的晶圓後，可以開啟閥件FV1~FV5，以經由管路FL排出液體供應瓶112、容置槽114、過濾器116、小容置槽118以及小容置槽126中的氣泡。於部分實施方式中，管路FL可以連接過濾器116的一出口，而閥件FV3可以用以控制該部分管路FL的開關。閥件FV3在供應液體LB的過程中可維持關閉狀態；當過濾器116中累積過量的氣泡時，能於適當時點開啟閥件FV3，以排出過濾器116中的氣泡。In the configuration of the liquid supply system 100, the line FL can be connected to the liquid supply bottle 112, the holding tank 114, the filter 116, the small holding tank 118, and the upper half of the small holding tank 126 to collect gas and / or liquids with high gas content. In some embodiments, the liquid supply system 100 may further include a plurality of valve elements FV1 ˜ FV5 . The valve parts FV1 to FV5 can be two-way two-position valves. Alternatively, in other embodiments, the valve members FV1 to FV5 may adopt any suitable configuration. The valves FV1 to FV5 can be set at appropriate positions in the pipeline FL to control the pipeline FL at an appropriate time point, from the liquid supply bottle 112 , the accommodating tank 114 , the filter 116 , the small accommodating tank 118 and the small accommodating tank 114 . The tank 126, etc. collects gas and/or liquid with high gas content, and discharges it to the factory as waste liquid. For example, after spraying a predetermined amount of wafers, the valves FV1 to FV5 can be opened to discharge the liquid supply bottle 112 , the accommodating tank 114 , the filter 116 , the small accommodating groove 118 and the small accommodating tank 112 through the pipeline FL Air bubbles in slot 126. In some embodiments, the pipeline FL can be connected to an outlet of the filter 116, and the valve FV3 can be used to control the opening and closing of the part of the pipeline FL. The valve FV3 can be kept closed during the supply of the liquid LB; when excessive air bubbles accumulate in the filter 116 , the valve FV3 can be opened at an appropriate time to discharge the air bubbles in the filter 116 .

於本揭露之部分實施方式中，液體供應系統100更可包含一外接的循環系統140，其可拆卸地連接於槽區110的過濾器116前後。循環系統140可包含管路140L1~140L3、閥件140V1~140V3以及容置槽142以及144。於部分實施方式中，容置槽142可經由管路140L1連接至管路LL2的前部分(位於過濾器116之前)，容置槽144可經由管路140L3連接至管路LL2的後部分(位於過濾器116之後)，管路140L2連接於容置槽142以及144之間。於本文中，管路140L1、140L3亦可稱為外接管路，管路140L2亦可稱為循環管路。In some embodiments of the present disclosure, the liquid supply system 100 may further include an external circulation system 140 , which is detachably connected to the front and rear of the filter 116 in the tank area 110 . The circulation system 140 may include pipelines 140L1 ˜ 140L3 , valves 140V1 ˜ 140V3 , and accommodating grooves 142 and 144 . In some embodiments, the accommodating tank 142 may be connected to the front portion of the line LL2 (located before the filter 116) via the line 140L1, and the accommodating tank 144 may be connected to the rear portion of the line LL2 (located before the filter 116) via the line 140L3. After the filter 116 ), the pipeline 140L2 is connected between the accommodating grooves 142 and 144 . Herein, the pipelines 140L1 and 140L3 may also be referred to as external pipelines, and the pipeline 140L2 may also be referred to as a circulation pipeline.

於部分實施方式中，管路LL2上可以設置適當的三通閥V1、V2，位於過濾器116之前後。藉由適當的三通閥V1(例如一進二出的三通閥)，循環系統140的管路140L3可以連接至管路LL2的前部分(位於過濾器116之前)。於部分實施方式中，藉由適當的三通閥V2(例如一進一出的三通閥)，管路140L1可以連接至管路LL2的後部分(位於過濾器116之後)。In some embodiments, appropriate three-way valves V1 and V2 may be provided on the pipeline LL2 before and after the filter 116 . The line 140L3 of the circulation system 140 can be connected to the front part of the line LL2 (located before the filter 116 ) by means of a suitable three-way valve V1 (eg, a one-in-two-out three-way valve). In some embodiments, line 140L1 can be connected to the rear portion of line LL2 (behind filter 116 ) by means of a suitable three-way valve V2 (eg, a one-in-one-out three-way valve).

於部分實施方式中，閥件140V1~140V3分別設置於管路140L1~140L3上。於部分實施方式中，閥件140V1可以是二通二位閥，閥件140V2可以是二通二位閥、逆時閥或止回閥，閥件140V3可以是二通二位閥。其中，閥件140V1、閥件140V2可以是單向的，閥件140V3可以是雙向的。或者，於其他實施方式中，閥件140V1~140V3可以採用任何適當配置。In some embodiments, the valve members 140V1 to 140V3 are respectively disposed on the pipelines 140L1 to 140L3. In some embodiments, the valve element 140V1 may be a two-way two-position valve, the valve element 140V2 may be a two-way two-position valve, a counter-time valve or a check valve, and the valve element 140V3 may be a two-way two-position valve. The valve member 140V1 and the valve member 140V2 may be one-way, and the valve member 140V3 may be two-way. Alternatively, in other embodiments, the valve members 140V1 to 140V3 may adopt any suitable configuration.

藉此，在更換新的過濾器116後並在浸潤新的過濾器116之前，循環系統140能夠重複地將液體(例如光阻液)導入新的過濾器116，以在不耗費大量的液體(例如光阻液)的情況下，浸潤新的過濾器116並完成排泡過程。Thereby, after replacing the new filter 116 and before infiltrating the new filter 116, the circulation system 140 can repeatedly introduce liquid (eg, photoresist) into the new filter 116, so as not to consume a large amount of liquid ( In the case of photoresist, for example, a new filter 116 is soaked and the bubbling process is completed.

於部分實施方式中，循環系統140更可包含氣體管路140GL1~140GL2，分別連接容置槽142以及144。氣體管路140GL1~140GL2相對於容置槽142以及144的一端可以分別連接至適當獨立氣體供應源。於部分實施方式中，此些氣體供應源所提供的氣體可以選用不容易與液體LB發生反應的氣體，例如氮氣等。藉此，氣體管路140GL1~140GL2能對容置槽142以及144提供氣體加壓，以便於使容置槽142以及144內的液體LB往後續管路140L2以及140L3流動。In some embodiments, the circulation system 140 may further include gas pipelines 140GL1 to 140GL2, which are connected to the accommodating grooves 142 and 144, respectively. One ends of the gas pipelines 140GL1 to 140GL2 relative to the accommodating grooves 142 and 144 can be respectively connected to appropriate independent gas supply sources. In some embodiments, the gas provided by these gas supply sources may be a gas that is not easy to react with the liquid LB, such as nitrogen gas. Thereby, the gas pipelines 140GL1 - 140GL2 can provide gas pressure to the accommodating grooves 142 and 144 , so as to make the liquid LB in the accommodating grooves 142 and 144 flow to the subsequent pipelines 140L2 and 140L3 .

於部分實施方式中，循環系統140更可包含管路140FL以及閥件FV6~FV7。於部分實施方式中，閥件FV6~FV7可以是二通二位閥。或者，於其他實施方式中，閥件FV6~FV7可以採用任何適當配置。閥件FV6~FV7設置於管路140FL的適當位置，以控制管路140FL於適當的時間點，從容置槽142以及144等中蒐集氣體及/或含氣量較高的液體，以作為廢液排至廠務。In some embodiments, the circulation system 140 may further include a pipeline 140FL and valves FV6 to FV7. In some embodiments, the valve elements FV6 to FV7 may be two-way two-position valves. Alternatively, in other embodiments, the valve members FV6-FV7 may adopt any suitable configuration. Valves FV6~FV7 are arranged at appropriate positions of pipeline 140FL to control pipeline 140FL to collect gas and/or liquid with higher gas content from accommodating tanks 142 and 144, etc., at a suitable time point, and discharge them as waste liquid to the factory.

於部分實施方式中，液體供應系統100可包含一控制裝置，控制裝置可包含處理器以及儲存電路。處理器可為微處理器或中央處理器。儲存電路可為隨機存取記憶體(Random Access Memory；RAM)、快閃記憶體(flash memory)等或在此領域現有技術中任何其它電腦可讀取的儲存媒體格式。儲存電路可儲存用以控制液體供應系統100中各個元件的程式以及相關資料。舉例而言，控制裝置可電性連接電控驅動器124、閥件110V1~110V3、閥件120V、噴塗閥件130V、閥件FV1~FV5、閥件140V1~140V3、閥件FV6~FV7以及控制氣體加壓的元件(例如氣體管路140GL1~140GL2上的其他閥件)。藉此，控制裝置能夠控制這些元件的運作。In some embodiments, the liquid supply system 100 may include a control device, which may include a processor and a storage circuit. The processor may be a microprocessor or a central processing unit. The storage circuit can be a random access memory (RAM), a flash memory, etc., or any other computer-readable storage medium format in the art. The storage circuit may store programs and related data for controlling various elements in the liquid supply system 100 . For example, the control device can be electrically connected to the electric control driver 124, the valve parts 110V1-110V3, the valve part 120V, the spraying valve part 130V, the valve parts FV1-FV5, the valve parts 140V1-140V3, the valve parts FV6-FV7 and the control gas Pressurized components (such as other valves on gas lines 140GL1~140GL2). Thereby, the control device can control the operation of these elements.

於部分實施方式中，液體供應系統100可包含感測器100S，設置於管路LL以及FL的適當位置。感測器100S可例如為紅外線感測器等，用以感測管路LL以及FL中的液體LB以及氣泡。舉例而言，當感測器100S的讀值較低時，表示管路LL以及FL中液體LB的含量較高、氣泡較少；當感測器100S的讀值較高時，表示管路LL以及FL中液體LB的含量較低、氣泡較多。In some embodiments, the liquid supply system 100 may include a sensor 100S disposed at appropriate positions of the pipelines LL and FL. The sensor 100S can be, for example, an infrared sensor, etc., for sensing the liquid LB and air bubbles in the pipelines LL and FL. For example, when the reading value of the sensor 100S is low, it means that the content of the liquid LB in the pipeline LL and FL is high and the air bubbles are less; when the reading value of the sensor 100S is high, it means that the pipeline LL is high In addition, the content of liquid LB in FL is lower and the bubbles are more.

於部分實施方式中，管路(例如管路LL以及FL、管路140L1~140L3、氣體管路140GL1~140GL2等)可以採用不易被液體LB腐蝕的適當材料製成，例如鐵氟龍(Polytetrafluoroethene；PFA)等。In some embodiments, the pipelines (such as pipelines LL and FL, pipelines 140L1-140L3, gas pipelines 140GL1-140GL2, etc.) can be made of suitable materials that are not easily corroded by liquid LB, such as Teflon (Polytetrafluoroethene; PFA) etc.

第2圖為根據本揭露的部分實施方式中使用液體供應系統100的方法M的流程圖。方法M包含步驟S1~S8。本揭露不限於步驟S1~S8的描述，並且其他步驟也在本揭露的精神和範圍內。在進行方法M的過程中，可以進行方法M中未顯示的其他步驟。此外，本文提供的揭露的進行可能不需要所有的步驟S1~S8。另外，第2圖所示的部分步驟S1~S8可以同時進行或以不同順序進行。在部分實施方式中，除了當前描述的步驟S1~S8，可以進行一個或多個其他步驟；或者，可以進行一個或多個其他步驟，以代替當前描述的步驟S1~S8。為了說明的目的，將參考第3A圖至第3K圖中所示的實施方式描述方法M。FIG. 2 is a flowchart of a method M of using the liquid supply system 100 in accordance with some embodiments of the present disclosure. Method M includes steps S1 to S8. The present disclosure is not limited to the description of steps S1 to S8, and other steps are also within the spirit and scope of the present disclosure. In performing Method M, other steps not shown in Method M may be performed. Furthermore, all steps S1-S8 may not be required for the disclosure provided herein to proceed. In addition, some of the steps S1 to S8 shown in FIG. 2 may be performed simultaneously or in different orders. In some embodiments, in addition to the currently described steps S1-S8, one or more other steps may be performed; or, one or more other steps may be performed instead of the currently described steps S1-S8. For illustrative purposes, Method M will be described with reference to the embodiments shown in Figures 3A-3K.

第3A圖至第3K圖是根據本揭露的部分實施方式中於各階段使用液體供應系統100的示意圖。此描述僅為例示，而不意圖進一步限制後續專利申請範圍中所載的內容。應了解到，可以在第3A圖至第3K圖步驟之前、之中以及之後加入額外的步驟，且對於該方法的另一部份實施方式，以下提到的部分步驟可以被取代或取消。步驟/程序的順序可以被改變。FIGS. 3A-3K are schematic diagrams of using the liquid supply system 100 at various stages in accordance with some embodiments of the present disclosure. This description is exemplary only, and is not intended to further limit what is set forth in the scope of subsequent patent applications. It should be understood that additional steps may be added before, during, and after the steps of FIGS. 3A to 3K, and that some of the steps mentioned below may be replaced or eliminated for another partial embodiment of the method. The sequence of steps/procedures can be changed.

參照第2圖以及第3A圖，方法M開始於步驟S1，將晶圓W放置於鍍膜區130的載台上，使用液體供應系統100，提供液體LB至晶圓W上。於部分實施方式中，在第3A圖之前，先將液體LB從液體供應瓶112運輸至容置槽114中。舉例而言，開啟氣體閥件GV2，而使氣體經由管線110GL1傳送至液體供應瓶112而對液體供應瓶112加壓，開啟閥件110V1而使液體LB經由管路LL1流至容置槽114中。Referring to FIG. 2 and FIG. 3A , the method M starts from step S1 , placing the wafer W on the stage of the coating area 130 , and using the liquid supply system 100 to supply the liquid LB onto the wafer W. In some embodiments, before FIG. 3A , the liquid LB is transported from the liquid supply bottle 112 to the accommodating tank 114 . For example, open the gas valve GV2, so that the gas is sent to the liquid supply bottle 112 through the pipeline 110GL1 to pressurize the liquid supply bottle 112, and the valve 110V1 is opened to allow the liquid LB to flow into the accommodating tank 114 through the pipeline LL1 .

接著，在第3A圖中，將液體LB從容置槽114傳送至噴頭132，以提供液體LB至晶圓W上。舉例而言，閥件110V2~110V3、閥件120V開啟，電控驅動器124控制幫浦122運作而抽送液體LB，且噴塗閥件130V開啟，而使容置槽114中的液體LB從經管路LL2~LL5流動至噴頭132。此時，氣體閥件GV3可開啟、氣體閥件GV4可關閉，而使氣體經由管線110GL2傳送至容置槽114以加壓於容置槽114。在將液體LB從容置槽114傳送至噴頭132的過程中，閥件110V1以及氣體閥件GV2可以是關閉的。於部分實施方中，當感測器114S監測到容置槽114中液體LB不足時，可以開啟閥件110V1以及氣體閥件GV2，以使液體供應瓶112的液體LB流動至容置槽114中。Next, in FIG. 3A , the liquid LB is transferred from the accommodating tank 114 to the shower head 132 to provide the liquid LB onto the wafer W. FIG. For example, the valves 110V2~110V3, the valve 120V are opened, the electronic control driver 124 controls the pump 122 to operate to pump the liquid LB, and the spray valve 130V is opened, so that the liquid LB in the accommodating tank 114 flows from the pipeline LL2 ~LL5 flows to showerhead 132 . At this time, the gas valve GV3 can be opened and the gas valve GV4 can be closed, so that the gas is transmitted to the accommodating tank 114 through the pipeline 110GL2 to be pressurized in the accommodating tank 114 . During the process of transferring the liquid LB from the holding tank 114 to the shower head 132, the valve member 110V1 and the gas valve member GV2 may be closed. In some embodiments, when the sensor 114S detects that the liquid LB in the accommodating tank 114 is insufficient, the valve 110V1 and the gas valve GV2 can be opened to allow the liquid LB of the liquid supply bottle 112 to flow into the accommodating tank 114 . .

於部分實施方式中，容置槽114與噴頭132之間存在第一過濾器116，而能過濾液體LB中的微粒，避免影響晶圓W上液體LB的塗佈以及後續的製程(例如圖案化等)。在處理大量的晶圓W之後，第一過濾器116上累積了大量的微粒，而需更換新的過濾器。In some embodiments, the first filter 116 exists between the accommodating tank 114 and the shower head 132, which can filter the particles in the liquid LB, so as to avoid affecting the coating of the liquid LB on the wafer W and subsequent processes (such as patterning). Wait). After processing a large number of wafers W, a large number of particles are accumulated on the first filter 116, and a new filter needs to be replaced.

參照第2圖以及第3B圖，方法M來到步驟S2，停止將液體LB從容置槽114傳送至噴頭132。舉例而言，電控驅動器124控制幫浦122停止運作，且閥件110V2~110V3、閥件120V以及噴塗閥件130V關閉，而使液體LB停止從容置槽114經管路LL2~LL5流動至噴頭132。此時，管路LL2中的液體LB停止流動。Referring to FIG. 2 and FIG. 3B , the method M proceeds to step S2 to stop the transfer of the liquid LB from the accommodating tank 114 to the spray head 132 . For example, the electronic control driver 124 controls the pump 122 to stop operating, and the valves 110V2-110V3, the valve 120V and the spray valve 130V are closed, so that the liquid LB stops flowing from the accommodating tank 114 to the spray head 132 through the pipelines LL2-LL5 . At this time, the flow of the liquid LB in the line LL2 is stopped.

參照第2圖以及第3C圖，方法M來到步驟S3，使用第二過濾器116’，更換液體供應系統100中的第一過濾器116。在部分實施方式中，第二過濾器116’與第一過濾器116可以是實質相同的，差別在於第二過濾器116’上累積較少或尚未累積液體LB的微粒，且第二過濾器116’尚未經過液體LB浸潤。Referring to Figs. 2 and 3C, the method M proceeds to step S3, where the second filter 116' is used to replace the first filter 116 in the liquid supply system 100. In some embodiments, the second filter 116' may be substantially the same as the first filter 116, with the difference that the second filter 116' accumulates less or no particles of the liquid LB, and the second filter 116 'Not yet infiltrated with liquid LB.

參照第2圖以及第3D圖，方法M來到步驟S4，在第二過濾器116’前後，外接如前所述的循環系統140。於此，將循環系統140的管路140L3、140L1分別連接至液體供應系統100的第二過濾器116’前後的管路LL2。舉例而言，將循環系統140的管路140L3經由三通閥V1連接至第二過濾器116’前的管路LL2的前半段，並將循環系統140的管路140L1經由三通閥V2連接至第二過濾器116’後的管路LL2的後半段。Referring to Fig. 2 and Fig. 3D, the method M goes to step S4, before and after the second filter 116', the circulation system 140 as described above is externally connected. Here, the pipelines 140L3 and 140L1 of the circulation system 140 are respectively connected to the pipeline LL2 before and after the second filter 116' of the liquid supply system 100. For example, the pipeline 140L3 of the circulation system 140 is connected to the first half of the pipeline LL2 before the second filter 116' through the three-way valve V1, and the pipeline 140L1 of the circulation system 140 is connected to the pipeline through the three-way valve V2. The second half of the pipeline LL2 after the second filter 116'.

參照第2圖以及第3E圖至第3H圖，方法M來到步驟S5，將液體LB傳送至第二過濾器116’，並經循環系統140，重複回傳到第二過濾器116’。在此過程中，閥件FV3可以維持關閉，以在不耗費多餘液體LB的情況下，使液體LB進入循環系統140，並進行液體LB的循環。以下第3E圖至第3H圖用於描述此循環方法的各個階段。Referring to Fig. 2 and Figs. 3E to 3H, the method M proceeds to step S5, and the liquid LB is sent to the second filter 116', and is repeatedly returned to the second filter 116' through the circulation system 140. During this process, the valve member FV3 can be kept closed to allow the liquid LB to enter the circulation system 140 and circulate the liquid LB without consuming the excess liquid LB. Figures 3E-3H below are used to describe the various stages of this cycle method.

參照第3E圖，在外接循環系統140之後，容置槽114供應液體LB，以使液體LB填滿循環系統140的管路140L1~140L3。舉例而言，液體供應系統100的閥件110V2開啟，閥件110V3、120V以及噴塗閥件130V關閉，外接循環系統140的閥件140V1~140V3開啟。藉此，一部分液體LB從容置槽114經管路LL2流動至第二過濾器116’，並從管路LL2以及管路140L1進入容置槽142，另一部分液體LB從容置槽114經管路LL2流動至管路140L3而進入容置槽144。進入容置槽142的液體LB可在經由管路140L2輸送至容置槽144。藉此，液體LB可填滿管路140L1~140L3並進入容置槽142、144。Referring to FIG. 3E , after the external circulation system 140 is connected, the accommodating tank 114 supplies the liquid LB, so that the liquid LB fills the pipelines 140L1 to 140L3 of the circulation system 140 . For example, the valve 110V2 of the liquid supply system 100 is opened, the valves 110V3 and 120V and the spraying valve 130V are closed, and the valves 140V1 to 140V3 of the external circulation system 140 are opened. Thereby, a part of the liquid LB flows from the accommodating tank 114 to the second filter 116' through the pipeline LL2, and enters the accommodating tank 142 from the pipeline LL2 and the pipeline 140L1, and another part of the liquid LB flows from the accommodating tank 114 to the second filter 116' through the pipeline LL2. The pipeline 140L3 enters the accommodating groove 144 . The liquid LB entering the accommodating tank 142 can be delivered to the accommodating tank 144 via the pipeline 140L2. Thereby, the liquid LB can fill up the pipelines 140L1 to 140L3 and enter the accommodating grooves 142 and 144 .

在此過程中，氣體管路140GL1~140GL2可不輸送氣體至容置槽142以及144中，以使液體LB能注入容置槽142以及144。在此過程中，可以開啟閥件FV7，以使氣體或含氣量較高的液體LB能夠經由連接容置槽144的管路140FL排出，以便於排泡。在此過程中，可以關閉閥件FV6，以便於使容置槽142中液體LB經由管路140L2輸送至容置槽144。During this process, the gas pipelines 140GL1 - 140GL2 may not deliver gas to the accommodating grooves 142 and 144 , so that the liquid LB can be injected into the accommodating grooves 142 and 144 . During this process, the valve member FV7 can be opened, so that the gas or the liquid LB with a high gas content can be discharged through the pipeline 140FL connected to the accommodating groove 144, so as to facilitate bubble discharge. During this process, the valve member FV6 can be closed, so that the liquid LB in the accommodating tank 142 can be transported to the accommodating tank 144 via the pipeline 140L2.

在將液體LB從容置槽114傳送至循環系統140以填滿管路140L1~140L3的過程中，閥件110V1以及氣體閥件GV2可以是關閉的，以便於氣體經過氣體閥件GV3而加壓於容置槽114。於部分實施方式中，當監測到容置槽114中液體LB不足時，可以開啟閥件110V1以及氣體閥件GV2，以使液體供應瓶112的液體LB流動至容置槽114中。During the process of transferring the liquid LB from the holding tank 114 to the circulation system 140 to fill the pipelines 140L1-140L3, the valve 110V1 and the gas valve GV2 may be closed, so that the gas passes through the gas valve GV3 to be pressurized at accommodating groove 114 . In some embodiments, when it is detected that the liquid LB in the accommodating tank 114 is insufficient, the valve element 110V1 and the gas valve GV2 can be opened to allow the liquid LB of the liquid supply bottle 112 to flow into the accommodating tank 114 .

參照第3F圖，在容置槽114供應一預定量的液體LB之後，停止從容置槽114供應液體LB至循環系統140。詳細而言，使液體LB填滿循環系統140的管路140L1~140L3(如第3E圖所示的步驟)之後，關閉液體供應系統100的閥件110V2，而使液體LB不再由容置槽114提供至循環系統140中。於部分實施方式中，可一併關閉氣體閥件GV3，以不施壓於容置槽114。Referring to FIG. 3F, after the accommodating tank 114 supplies a predetermined amount of the liquid LB, the supply of the liquid LB from the accommodating tank 114 to the circulation system 140 is stopped. Specifically, after filling the pipelines 140L1 to 140L3 of the circulation system 140 with the liquid LB (as shown in the step in FIG. 3E ), the valve 110V2 of the liquid supply system 100 is closed, so that the liquid LB is no longer contained in the accommodating tank. 114 is provided to the circulation system 140 . In some embodiments, the gas valve GV3 can be closed together so as not to pressurize the accommodating groove 114 .

於部分實施方式中，在此步驟所指的容置槽114供應的一預定量的液體LB可以在大約200立方公分至大約600立方公分的範圍內。如果供應的液體LB少於200立方公分，則可能無法有效地浸潤第二過濾器116’及填滿循環系統140的管路140L1~140L3，而使後續提供液體LB時容易有氣泡產生；如果供應的液體LB多於600立方公分，則可能會不必要地浪費液體LB。In some embodiments, the predetermined amount of liquid LB supplied by the accommodating tank 114 in this step may be in the range of about 200 cubic centimeters to about 600 cubic centimeters. If the supplied liquid LB is less than 200 cubic centimeters, it may not be able to effectively infiltrate the second filter 116 ′ and fill the pipelines 140L1 to 140L3 of the circulation system 140 , so that bubbles are likely to be generated when the liquid LB is supplied subsequently; If the liquid LB is more than 600 cubic centimeters, the liquid LB may be wasted unnecessarily.

接著，使氣體管路140GL1輸送氣體至容置槽142中，以壓迫容置槽142中的液體LB經由管路140L2傳送至容置槽144。具體而言，可以使氣體管路140GL1輸送氣體至容置槽142，而迫使液體LB經由管路140L2傳送至容置槽144。此時，可控制氣體管路140GL2不輸送氣體至容置槽144中。於此，可維持閥件110V3、120V以及噴塗閥件130V關閉，使外接循環系統140的閥件140V1、140V3關閉，並維持閥件140V2的開啟狀態。在此過程中，可以維持閥件FV7開啟，以宣洩壓力，且能將液體LB注入容置槽144的過程中，使氣體或含氣量較高的液體LB能夠經由連接容置槽144的管路140FL排出。如此一來，可以使外接循環系統140中的液體LB從容置槽142流動至容置槽144，並降低液體LB中的氣泡含量。在此過程中，可以維持閥件FV6關閉，以便於液體LB流入管路140L2。Next, the gas pipeline 140GL1 is used to transport gas into the accommodating tank 142 to press the liquid LB in the accommodating tank 142 to be transferred to the accommodating tank 144 through the pipeline 140L2. Specifically, the gas pipeline 140GL1 can be made to deliver gas to the accommodating tank 142, and the liquid LB can be forced to be transferred to the accommodating tank 144 through the pipeline 140L2. At this time, the controllable gas pipeline 140GL2 does not deliver gas into the accommodating tank 144 . Here, the valves 110V3 and 120V and the spraying valve 130V can be kept closed, the valves 140V1 and 140V3 of the external circulation system 140 can be closed, and the open state of the valve 140V2 can be maintained. During this process, the valve FV7 can be kept open to vent the pressure, and the liquid LB can be injected into the accommodating tank 144 so that the gas or the liquid LB with higher gas content can pass through the pipeline connecting the accommodating tank 144 140FL discharge. In this way, the liquid LB in the external circulation system 140 can flow from the accommodating tank 142 to the accommodating tank 144, and the content of air bubbles in the liquid LB can be reduced. During this process, the valve member FV6 can be maintained closed to facilitate the flow of the liquid LB into the pipeline 140L2.

參照第3G圖，停止從容置槽142傳送液體LB至容置槽144，接著使氣體管路140GL2輸送氣體至容置槽144中，以壓迫容置槽144中的液體LB經由管路140L3、LL2傳送至第二過濾器116’，再經由管路LL2、140L1傳送至容置槽142。藉此，能使容置槽144提供液體LB至第二過濾器116’以浸潤第二過濾器116’，並使容置槽142接收經過第二過濾器116’的液體LB。Referring to FIG. 3G , stop transferring the liquid LB from the accommodating tank 142 to the accommodating tank 144 , and then make the gas pipeline 140GL2 deliver gas to the accommodating tank 144 to press the liquid LB in the accommodating tank 144 through the pipelines 140L3 and LL2 It is sent to the second filter 116', and then sent to the accommodating tank 142 via the pipelines LL2 and 140L1. Thereby, the accommodating tank 144 can provide the liquid LB to the second filter 116' to infiltrate the second filter 116', and the accommodating tank 142 can receive the liquid LB passing through the second filter 116'.

舉例而言，可以關閉外接循環系統140的閥件140V2，以停止從容置槽142傳送液體LB至容置槽144。接著，可以開啟外接循環系統140的閥件140V1、140V3，可以使氣體管路140GL2輸送氣體至容置槽144，而迫使液體LB經由管路140L3、三通閥V1以及管路LL2傳送至第二過濾器116’，再經由管路LL2、三通閥V2以及管路140L1傳送至容置槽142。此時，可不以氣體管路140GL1輸送氣體至容置槽142中。在此過程中，可維持閥件110V1~110V3、120V以及噴塗閥件130V關閉。For example, the valve 140V2 of the external circulation system 140 can be closed to stop the transfer of the liquid LB from the accommodating tank 142 to the accommodating tank 144 . Next, the valves 140V1 and 140V3 of the external circulation system 140 can be opened, so that the gas pipeline 140GL2 can deliver gas to the accommodating tank 144, and the liquid LB can be forced to be sent to the second through the pipeline 140L3, the three-way valve V1 and the pipeline LL2. The filter 116' is then sent to the accommodating tank 142 via the pipeline LL2, the three-way valve V2 and the pipeline 140L1. At this time, the gas may not be delivered to the accommodating tank 142 through the gas pipeline 140GL1. During this process, the valves 110V1~110V3, 120V and the spray valve 130V can be kept closed.

在此過程中，可以關閉閥件FV7，以便於液體LB流入管路140L3。在此過程中，可以開啟閥件FV6，以宣洩壓力，且能使氣體或含氣量較高的液體LB能夠經由連接容置槽142的管路140FL排出。如此一來，液體LB可以從外接循環系統140中的容置槽144經第二過濾器116’流動至外接循環系統140中容置槽142，並降低液體LB中的氣泡含量。During this process, valve FV7 may be closed to facilitate the flow of liquid LB into line 140L3. During this process, the valve member FV6 can be opened to vent the pressure, and the gas or the liquid LB with high gas content can be discharged through the pipeline 140FL connected to the accommodating tank 142 . In this way, the liquid LB can flow from the accommodating tank 144 in the external circulation system 140 to the accommodating tank 142 in the external circulation system 140 through the second filter 116', thereby reducing the content of air bubbles in the liquid LB.

參照第3H圖，停止從容置槽144傳送液體LB至第二過濾器116’以及容置槽142，接著使氣體管路140GL1輸送氣體至容置槽142中，以壓迫容置槽142中的液體LB經由管路140L2傳送至容置槽144。此時，可不以氣體管路140GL2輸送氣體至容置槽144中。如此一來，液體LB可以從外接循環系統140中的容置槽142流動回到容置槽144。Referring to FIG. 3H, stop transferring the liquid LB from the accommodating tank 144 to the second filter 116' and the accommodating tank 142, and then make the gas pipeline 140GL1 deliver gas to the accommodating tank 142 to compress the liquid in the accommodating tank 142 LB is delivered to the holding tank 144 via the pipeline 140L2. At this time, the gas may not be delivered to the accommodating tank 144 through the gas pipeline 140GL2. In this way, the liquid LB can flow from the accommodating tank 142 in the external circulation system 140 back to the accommodating tank 144 .

在此過程中，可以開啟閥件FV7，以使氣體或含氣量較高的液體LB能夠經由連接容置槽144的管路140FL排出。在此過程中，可以關閉閥件FV6，以便於液體LB流入管路140L2。此步驟與第3F圖的步驟類似，在此不再贅述。During this process, the valve member FV7 can be opened, so that the gas or the liquid LB with higher gas content can be discharged through the pipeline 140FL connected to the accommodating groove 144 . During this process, valve FV6 may be closed to facilitate the flow of liquid LB into line 140L2. This step is similar to the step in FIG. 3F and will not be repeated here.

於部分實施方式中，可以重複第3G圖以及第3H圖的步驟，以使液體LB循環地經過第二過濾器116’，進而達到浸潤第二過濾器116’及排泡的目的。在使該液體循環地流過該第二過濾器的過程中(即重複第3G圖以及第3H圖的步驟時)，容置槽114不提供該液體LB至該第二過濾器116’，且液體LB不流至該噴頭132。換句話說，至少閥件110V2以及110V3是關閉的。藉此，能使用定量的液體LB，達到浸潤第二過濾器116’及排泡的目的，而不耗費過多的液體LB。In some embodiments, the steps of Fig. 3G and Fig. 3H may be repeated, so that the liquid LB circulates through the second filter 116', so as to achieve the purpose of infiltrating the second filter 116' and removing bubbles. During the process of circulating the liquid through the second filter (ie, when repeating the steps of FIG. 3G and FIG. 3H ), the holding tank 114 does not provide the liquid LB to the second filter 116 ′, and Liquid LB does not flow to the spray head 132 . In other words, at least the valves 110V2 and 110V3 are closed. In this way, a quantitative amount of liquid LB can be used to achieve the purpose of infiltrating the second filter 116' and discharging bubbles without consuming too much liquid LB.

參照第1圖以及第3I圖，方法M來到步驟S6，在進行循環系統140的運作(第3G圖以及第3H圖的步驟)一預定運作時間後，可停止循環系統140的運作，並停止將該液體LB傳送至第二過濾器116’。舉例而言，可以透過關閉外接循環系統140的閥件140V1以及140V3，停止循環系統140的運作。此時，容置槽144可不提供液體LB至管路LL2中，且容置槽142可不接收來自管路LL2的液體LB。且，此時，容置槽142可不提供液體LB至容置槽144中，且容置槽144可不接收來自容置槽142的液體LB。於部分實施方式中，在停止循環系統140的運作時，可以控制氣體管路140GL1~140GL2不輸送氣體至容置槽142以及144中。換句話說，可以不加壓使容置槽142以及144中的液體LB流動。Referring to FIG. 1 and FIG. 3I, the method M goes to step S6, and after the operation of the circulation system 140 (steps of FIG. 3G and FIG. 3H ) is performed for a predetermined operation time, the operation of the circulation system 140 can be stopped, and the This liquid LB is passed to the second filter 116'. For example, the operation of the circulation system 140 can be stopped by closing the valves 140V1 and 140V3 of the external circulation system 140 . At this time, the accommodating tank 144 may not provide the liquid LB into the pipeline LL2, and the accommodating tank 142 may not receive the liquid LB from the pipeline LL2. Also, at this time, the accommodating tank 142 may not provide the liquid LB into the accommodating tank 144 , and the accommodating tank 144 may not receive the liquid LB from the accommodating tank 142 . In some embodiments, when the operation of the circulation system 140 is stopped, the gas pipelines 140GL1 - 140GL2 can be controlled not to deliver gas to the accommodating tanks 142 and 144 . In other words, the liquid LB in the accommodating grooves 142 and 144 may flow without pressurization.

於部分實施方式中，此循環系統140的一預定運作時間可以是大約1.5小時至大約3小時。如果循環系統140的運作時間小於1.5小時，則可能無法有效地浸潤第二過濾器116’，而使後續提供液體LB時容易有氣泡產生；如果循環系統140的運作時間大於3小時，則可能會不必要地拖延保養時間。In some embodiments, a predetermined operating time of the circulation system 140 may be about 1.5 hours to about 3 hours. If the operation time of the circulation system 140 is less than 1.5 hours, the second filter 116 ′ may not be infiltrated effectively, so that bubbles are likely to be generated when the liquid LB is subsequently supplied; if the operation time of the circulation system 140 is greater than 3 hours, it may Unnecessarily delay maintenance time.

於部分其他實施方式中，操作者還可以透過肉眼判斷經過第二過濾器116’的液體LB的氣泡量，例如觀察管路LL的後部分中的液體LB的氣泡量，以決定是否停止循環系統140的運作。舉例而言，在進行循環系統140的運作數小時後，如果觀察者在管路LL的後部分中的液體LB的仍觀察到氣泡，則繼續進行循環系統140的運作；如果觀察者在管路LL的後部分中的液體LB的沒有觀察到氣泡，則停止循環系統140的運作。於本揭露的部分實施方式中，可以透過時間控制、操作者觀察結果、其組合或其他任意因素，來決定循環系統140的運作的停止。In some other embodiments, the operator can also visually judge the amount of air bubbles in the liquid LB passing through the second filter 116', for example, observe the air bubble amount in the liquid LB in the rear part of the pipeline LL, so as to decide whether to stop the circulation system. 140 operations. For example, after operating the circulation system 140 for several hours, if the observer still observes bubbles in the liquid LB in the rear part of the pipeline LL, the operation of the circulation system 140 is continued; When no bubbles are observed in the liquid LB in the rear part of the LL, the operation of the circulation system 140 is stopped. In some embodiments of the present disclosure, the cessation of the operation of the circulation system 140 may be determined by time control, operator observations, combinations thereof, or any other factors.

參照第1圖以及第3J圖，方法M來到步驟S7，移除該循環系統140。舉例而言，將循環系統140的管路140L1、140L3(參照第3I圖)拆離於至液體供應系統100的三通閥V1、V2，而使液體供應系統100的管路LL2不連接循環系統140。換句話說，此時液體供應系統100的第二過濾器116’前後的管路LL2不外接循環系統140。Referring to FIG. 1 and FIG. 3J, the method M proceeds to step S7 to remove the circulation system 140 . For example, the pipelines 140L1 and 140L3 (refer to FIG. 3I ) of the circulation system 140 are separated from the three-way valves V1 and V2 to the liquid supply system 100 , and the pipeline LL2 of the liquid supply system 100 is not connected to the circulation system. 140. In other words, the pipeline LL2 before and after the second filter 116' of the liquid supply system 100 is not connected to the circulation system 140 at this time.

參照第1圖以及第3K圖，方法M來到步驟S8，如同步驟S1，將晶圓W’放置於鍍膜區130的載台上，使用該液體供應系統100，將液體LB從該容置槽114傳送至噴頭132，以提供該液體LB至晶圓W’上，其中該容置槽114與噴頭132之間存在第二過濾器116’。於此，電控驅動器124控制幫浦122運作，且閥件110V2~110V3、閥件120V以及噴塗閥件130V開啟，而使液體LB從容置槽114經管路LL2~LL5以及第二過濾器116’流動至噴頭132。藉此，液體LB從該容置槽114傳送至噴頭132，噴頭132能夠對晶圓W’提供液體LB，以進行光阻塗佈、顯影、清潔或其他製程。Referring to FIG. 1 and FIG. 3K, the method M proceeds to step S8, and as in step S1, the wafer W' is placed on the stage of the coating area 130, and the liquid supply system 100 is used to supply the liquid LB from the accommodating tank. 114 is delivered to the showerhead 132 to provide the liquid LB onto the wafer W′, wherein a second filter 116 ′ exists between the receiving groove 114 and the showerhead 132 . Here, the electronic control driver 124 controls the operation of the pump 122, and the valves 110V2-110V3, the valve 120V and the spraying valve 130V are opened, so that the liquid LB flows from the accommodating tank 114 through the pipelines LL2-LL5 and the second filter 116' flow to the showerhead 132 . Thereby, the liquid LB is transferred from the accommodating tank 114 to the shower head 132, and the shower head 132 can provide the liquid LB to the wafer W' for photoresist coating, development, cleaning or other processes.

基於以上討論，可以看出本揭露提供了的多個優點。然而，應該理解，其他實施方式可以提供額外的優點，並且並非所有優點都必須在此公開，並且並非所有實施方式都需要特定優點。本案的優點之一是提供一可拆卸的循環系統，在更換新的過濾器後並在浸潤新的過濾器之前，將循環系統接至過濾器的前後兩端。藉此，能夠重複地將液體(例如光阻液)導入過濾器，以在不耗費大量的液體(例如光阻液)的情況下，浸潤新的過濾器並完成排泡過程。本案的另一個優點是執行循環排泡的過程時，人員不須守在現場，進而可節省人力。Based on the above discussion, it can be seen that the present disclosure provides a number of advantages. It should be understood, however, that other embodiments may provide additional advantages, and not all advantages are necessarily disclosed herein, and not all embodiments require a particular advantage. One of the advantages of this case is to provide a detachable circulation system, which is connected to the front and rear ends of the filter after replacing the new filter and before infiltrating the new filter. Thereby, a liquid (eg, photoresist) can be repeatedly introduced into the filter to wet a new filter and complete the bubbling process without consuming a large amount of liquid (eg, photoresist). Another advantage of this case is that when performing the process of circulating bubble removal, personnel do not need to be on site, thereby saving manpower.

本揭露的部分實施方式提供了一種液體供應方法。該液體供應方法包含使用一液體供應系統提供一液體至一第一晶圓上，其中該液體供應系統具有一液體容置槽、一噴頭以及一第一過濾器，該液體供應系統用以使該液體從該液體容置槽經該第一過濾器而流至該噴頭；停止提供該液體至該第一晶圓上；將該第一過濾器替換為一第二過濾器；外接一循環系統至該液體供應系統；使用該循環系統，使該液體循環地流過該第二過濾器；在使該液體循環地流過該第二過濾器之後，從該液體供應系統上，移除該循環系統；以及在移除該循環系統之後，使用該液體供應系統提供該液體至一第二晶圓上。Some embodiments of the present disclosure provide a liquid supply method. The liquid supply method includes using a liquid supply system to supply a liquid on a first wafer, wherein the liquid supply system has a liquid accommodating tank, a spray head and a first filter, and the liquid supply system is used to make the liquid supply Liquid flows from the liquid accommodating tank through the first filter to the nozzle; stop supplying the liquid to the first wafer; replace the first filter with a second filter; connect a circulation system to the the liquid supply system; using the circulation system, circulating the liquid through the second filter; removing the circulation system from the liquid supply system after circulating the liquid through the second filter ; and after removing the circulation system, using the liquid supply system to provide the liquid to a second wafer.

於部分實施方式中，該液體供應方法更包含在使該液體循環地流過該第二過濾器之前，使液體從該液體容置槽經該第二過濾器流至該循環系統。In some embodiments, the liquid supply method further includes causing the liquid to flow from the liquid holding tank through the second filter to the circulation system before circulating the liquid through the second filter.

於部分實施方式中，在使該液體循環地流過該第二過濾器的進行下，該液體容置槽不提供該液體至該第二過濾器。In some embodiments, the liquid holding tank does not provide the liquid to the second filter while circulating the liquid through the second filter.

於部分實施方式中，在使該液體循環地流過該第二過濾器的進行下，該液體不流至該噴頭。In some embodiments, the liquid does not flow to the spray head while circulating the liquid through the second filter.

本揭露的部分實施方式提供了一種液體供應方法。該液體供應方法包含將一第一過濾器安裝於一第一管路以及一第二管路之間；將一循環系統的一第一外接管路連接於該第一管路，且將該循環系統的一第二外接管路連接於該第二管路；使一液體經由該第一管路、該第一過濾器、該第二管路以及該第二外接管路，流至該循環系統之一第一容置槽；使該液體經由該第一管路以及該第一外接管路，流至該循環系統之一第二容置槽；以及在該液體流至該循環系統之該第一容置槽以及該第二容置槽後，進行一第一循環步驟，使該液體從該二容置槽經該第一外接管路、該第一管路、該第一過濾器、該第二管路以及該第二外接管路，流至該第一容置槽。Some embodiments of the present disclosure provide a liquid supply method. The liquid supply method includes installing a first filter between a first pipeline and a second pipeline; connecting a first external pipeline of a circulation system to the first pipeline, and the circulation A second external pipeline of the system is connected to the second pipeline; a liquid flows to the circulation system through the first pipeline, the first filter, the second pipeline and the second external pipeline a first accommodating tank; make the liquid flow to a second accommodating tank of the circulation system through the first pipeline and the first external pipeline; and the first tank where the liquid flows to the circulation system After the first accommodating tank and the second accommodating tank, a first circulation step is performed, so that the liquid passes through the first external pipeline, the first pipeline, the first filter, the The second pipeline and the second external pipeline flow to the first accommodating tank.

於部分實施方式中，該液體供應方法更包含從該第一管路以及該第二管路上，拆卸該循環系統的該第一外接管路以及該第二外接管路。In some embodiments, the liquid supply method further includes disassembling the first external pipeline and the second external pipeline of the circulation system from the first pipeline and the second pipeline.

於部分實施方式中，該液體供應方法更包含在將該第一過濾器安裝於該第一管路以及該第二管路之間之前，移除該第一管路以及該第二管路之間的一第二過濾器。In some embodiments, the liquid supply method further includes removing the first line and the second line before installing the first filter between the first line and the second line. a second filter in between.

於部分實施方式中，該液體供應方法更包含在進行該第一循環步驟之後，進行一第二循環步驟，使該液體從該第一容置槽流至該二容置槽。In some embodiments, the liquid supply method further includes performing a second circulation step after the first circulation step, so that the liquid flows from the first accommodating tank to the two accommodating tanks.

於部分實施方式中，該可拆式循環系統更包含第一容置槽、第二容置槽以及循環管路。該第一外接管路連接於該第一容置槽與該第一管路之間。該第二外接管路連接於該第二容置槽與該第二管路之間。循環管路連接於該第一容置槽以及該第二容置槽之間。In some embodiments, the detachable circulation system further includes a first accommodating tank, a second accommodating tank and a circulation pipeline. The first external pipeline is connected between the first accommodating groove and the first pipeline. The second external pipeline is connected between the second accommodating tank and the second pipeline. The circulation pipeline is connected between the first accommodating groove and the second accommodating groove.

以上概述多個實施方式之特徵，該技術領域具有通常知識者可較佳地了解本揭露之多個態樣。該技術領域具有通常知識者應了解，可將本揭露作為設計或修飾其他製程或結構的基礎，以實行實施方式中提到的相同的目的以及/或達到相同的好處。該技術領域具有通常知識者也應了解，這些相等的結構並未超出本揭露之精神與範圍，且可以進行各種改變、替換、轉化，在此，本揭露精神與範圍涵蓋這些改變、替換、轉化。The foregoing summarizes the features of various embodiments, and those of ordinary skill in the art may better understand the various aspects of the present disclosure. Those of ordinary skill in the art should appreciate that the present disclosure may be used as a basis for designing or modifying other processes or structures for carrying out the same purposes and/or achieving the same advantages mentioned in the embodiments. Those with ordinary knowledge in this technical field should also understand that these equivalent structures do not exceed the spirit and scope of the present disclosure, and various changes, substitutions, and transformations can be made, and the spirit and scope of the present disclosure cover these changes, substitutions, and transformations. .

100:液體供應系統 100S:感測器 110V1~110V3:閥件 110GL、110GL1~110GL2:氣體管路 110W:壓力計 110:槽區 112:液體供應瓶 114:容置槽 114S:感測器 116:過濾器、第一過濾器 116’:第二過濾器 118:小容置槽 120:抽送區 120V:閥件 122:幫浦 124:電控驅動器 126:小容置槽 130:鍍膜區 130V:噴塗閥件 132:噴頭 140:循環系統 140L1~140L3:管路 140V1~140V3:閥件 140GL1~140GL2:氣體管路 140FL:管路 142:容置槽 144:容置槽 W、W’:晶圓 LL、LL1~LL5:管路 FL:管路 FV1~FV7:閥件 LB:液體 GS:氣體供應源 GV1~GV4:氣體閥件 GV5:止回閥 V1、V2:三通閥 M:方法 S1~S8:步驟 100: Liquid Supply System 100S: Sensor 110V1~110V3: valve parts 110GL, 110GL1~110GL2: gas pipeline 110W: Pressure gauge 110: Slot area 112: Liquid Supply Bottle 114: accommodating slot 114S: Sensor 116: filter, first filter 116': 2nd filter 118: Small accommodating slot 120: Pumping area 120V: valve parts 122: Pump 124: Electronic control driver 126: Small accommodating slot 130: Coating area 130V: spray valve parts 132: Sprinkler 140: Circulatory System 140L1~140L3: pipeline 140V1~140V3: valve parts 140GL1~140GL2: gas pipeline 140FL: Pipeline 142: accommodating slot 144: accommodating slot W, W': Wafer LL, LL1~LL5: pipeline FL: pipeline FV1~FV7: valve parts LB: liquid GS: Gas Supply Source GV1~GV4: Gas valve GV5: Check Valve V1, V2: three-way valve M: method S1~S8: Steps

從以下詳細敘述並搭配圖式檢閱，可理解本揭露的態樣。應注意到，多種特徵並未以產業上實務標準的比例繪製。事實上，為了清楚討論，多種特徵的尺寸可以任意地增加或減少。第1圖為根據本揭露的部分實施方式中外接循環裝置的液體供應系統的方塊示意圖。第2圖為根據本揭露的部分實施方式中使用液體供應系統的方法的流程圖。第3A圖至第3K圖是根據本揭露的部分實施方式中於各階段使用液體供應系統的示意圖。 The aspects of the present disclosure can be understood from the following detailed description and review of the drawings. It should be noted that various features are not drawn to scale that is standard in industry practice. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion. FIG. 1 is a schematic block diagram of a liquid supply system of an external circulation device according to some embodiments of the present disclosure. FIG. 2 is a flowchart of a method of using a liquid supply system in accordance with some embodiments of the present disclosure. FIGS. 3A-3K are schematic diagrams of using a liquid supply system at various stages in accordance with some embodiments of the present disclosure.

100:液體供應系統 100: Liquid Supply System

100S:感測器 100S: Sensor

110V1~110V3:閥件 110V1~110V3: valve parts

110GL、110GL1~110GL2:氣體管路 110GL, 110GL1~110GL2: gas pipeline

110W:壓力計 110W: Pressure gauge

110:槽區 110: Slot area

112:液體供應槽 112: Liquid supply tank

114:容置槽 114: accommodating slot

114S:感測器 114S: Sensor

116、116’:過濾器 116, 116': filter

118:小容置槽 118: Small accommodating slot

120:抽送區 120: Pumping area

120V:閥件 120V: valve parts

122:幫浦 122: Pump

124:電控驅動器 124: Electronic control driver

126:小容置槽 126: Small accommodating slot

130:鍍膜區 130: Coating area

130V:噴塗閥件 130V: spray valve parts

132:噴頭 132: Sprinkler

140:循環系統 140: Circulatory System

140L1~140L3:管路 140L1~140L3: pipeline

140V1~140V3:閥件 140V1~140V3: valve parts

140GL1~140GL2:氣體管路 140GL1~140GL2: gas pipeline

140FL:管路 140FL: Pipeline

142:容置槽 142: accommodating slot

144:容置槽 144: accommodating slot

W:晶圓 W: Wafer

LL、LL1~LL5:管路 LL, LL1~LL5: pipeline

FL:管路 FL: pipeline

FV1~FV7:閥件 FV1~FV7: valve parts

LB:液體 LB: liquid

GS:氣體供應源 GS: Gas Supply Source

GV1~GV4:氣體閥件 GV1~GV4: Gas valve

GV5:止回閥 GV5: Check Valve

V1、V2:三通閥 V1, V2: three-way valve

Claims

一種液體供應方法，包含：使用一液體供應系統提供一液體至一第一晶圓上，其中該液體供應系統具有一液體容置槽、一噴頭以及一第一過濾器，該液體供應系統用以使該液體從該液體容置槽經該第一過濾器而流至該噴頭；停止提供該液體至該第一晶圓上；將該第一過濾器替換為一第二過濾器；外接一循環系統至該液體供應系統；使用該循環系統，使該液體循環地流過該第二過濾器，其中在使該液體循環地流過該第二過濾器的進行下，該液體不流至該噴頭；在使該液體循環地流過該第二過濾器之後，從該液體供應系統上，移除該循環系統；以及在移除該循環系統之後，使用該液體供應系統提供該液體至一第二晶圓上。 A liquid supply method, comprising: using a liquid supply system to provide a liquid on a first wafer, wherein the liquid supply system has a liquid accommodating tank, a spray head and a first filter, the liquid supply system is used for Make the liquid flow from the liquid accommodating tank to the nozzle through the first filter; stop supplying the liquid to the first wafer; replace the first filter with a second filter; connect a circulation system to the liquid supply system; using the circulation system to circulate the liquid through the second filter, wherein the liquid does not flow to the spray head while circulating the liquid through the second filter After making this liquid flow through this second filter cyclically, from this liquid supply system, remove this circulation system; And after removing this circulation system, use this liquid supply system to provide this liquid to a second on the wafer.

如請求項1所述之液體供應方法，更包含：在使該液體循環地流過該第二過濾器之前，使液體從該液體容置槽經該第二過濾器流至該循環系統。 The liquid supply method according to claim 1, further comprising: before circulating the liquid through the second filter, causing the liquid to flow from the liquid accommodating tank to the circulation system through the second filter.

如請求項1所述之液體供應方法，其中在使該液體循環地流過該第二過濾器的進行下，該液體容置槽不提供該液體至該第二過濾器。 The liquid supply method according to claim 1, wherein the liquid accommodating tank does not supply the liquid to the second filter while circulating the liquid through the second filter.

如請求項1所述之液體供應方法，其中該液體是一光阻液。 The liquid supply method according to claim 1, wherein the liquid is a photoresist liquid.

一種液體供應方法，包含：將一第一過濾器安裝於一第一管路以及一第二管路之間；將一循環系統的一第一外接管路連接於該第一管路，且將該循環系統的一第二外接管路連接於該第二管路；使一液體經由該第一管路、該第一過濾器、該第二管路以及該第二外接管路，流至該循環系統之一第一容置槽；使該液體經由該第一管路以及該第一外接管路，流至該循環系統之一第二容置槽；以及在該液體流至該循環系統之該第一容置槽以及該第二容置槽後，進行一第一循環步驟，使該液體從該二容置槽經該第一外接管路、該第一管路、該第一過濾器、該第二管路以及該第二外接管路，流至該第一容置槽。 A liquid supply method, comprising: installing a first filter between a first pipeline and a second pipeline; connecting a first external pipeline of a circulation system to the first pipeline, and connecting A second external pipeline of the circulation system is connected to the second pipeline; a liquid flows to the first pipeline, the first filter, the second pipeline and the second external pipeline through the first pipeline, the first filter, the second pipeline and the second external pipeline A first accommodating tank of the circulation system; making the liquid flow to a second accommodating tank of the circulation system through the first pipeline and the first external pipeline; and before the liquid flows to the circulation system After the first accommodating tank and the second accommodating tank, a first circulation step is performed to make the liquid pass through the first external pipeline, the first pipeline and the first filter from the two accommodating tanks , the second pipeline and the second external pipeline flow to the first accommodating tank.

如請求項5所述之液體供應方法，更包含：從該第一管路以及該第二管路上，拆卸該循環系統的該第一外接管路以及該第二外接管路。 The liquid supply method according to claim 5, further comprising: disassembling the first external pipeline and the second external pipeline of the circulation system from the first pipeline and the second pipeline.

如請求項5所述之液體供應方法，更包含：在將該第一過濾器安裝於該第一管路以及該第二管路之間之前，移除該第一管路以及該第二管路之間的一第二過濾器。 The liquid supply method according to claim 5, further comprising: installing the first filter between the first pipeline and the second pipeline Before time, remove a second filter between the first pipeline and the second pipeline.

如請求項5所述之液體供應方法，更包含：在進行該第一循環步驟之後，進行一第二循環步驟，使該液體從該第一容置槽流至該二容置槽。 The liquid supply method according to claim 5, further comprising: after performing the first circulation step, performing a second circulation step to make the liquid flow from the first accommodating tank to the two accommodating tanks.

一種液體供應系統，包含：一液體容置槽；一噴頭；一過濾器，以流體連接於該液體容置槽以及該噴頭之間；一第一管路以及一第二管路，分別連接於該過濾器的一入口以及一出口；以及一可拆式循環系統，具有一第一外接管路以及一第二外接管路，分別可拆地連接於該第一管路以及該第二管路，其中該可拆式循環系統更包含一第一容置槽、一第二容置槽以及一循環管路，其中該第一外接管路連接於該第一容置槽與該第一管路之間，該第二外接管路連接於該第二容置槽與該第二管路之間，且該循環管路連接於該第一容置槽以及該第二容置槽之間。 A liquid supply system, comprising: a liquid accommodating tank; a spray head; a filter, which is fluidly connected between the liquid accommodating tank and the spray head; a first pipeline and a second pipeline, respectively connected to An inlet and an outlet of the filter; and a detachable circulation system having a first external pipeline and a second external pipeline, respectively detachably connected to the first pipeline and the second pipeline , wherein the detachable circulation system further comprises a first accommodating tank, a second accommodating tank and a circulation pipeline, wherein the first external pipeline is connected to the first accommodating tank and the first pipeline The second external pipeline is connected between the second accommodating tank and the second pipeline, and the circulation pipeline is connected between the first accommodating tank and the second accommodating tank.

如請求項9所述之液體供應系統，更包含：一第一氣體管路；以及一第二氣體管路，其中該第一以及第二氣體管路分別連接該第一以及第二容置槽至複數個獨立氣體供應源。 The liquid supply system according to claim 9, further comprising: a first gas pipeline; and A second gas pipeline, wherein the first and second gas pipelines respectively connect the first and second accommodating tanks to a plurality of independent gas supply sources.