TWI757897B - Methods of positioning components in desired positions on a board - Google Patents

Methods of positioning components in desired positions on a board Download PDF

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TWI757897B
TWI757897B TW109134059A TW109134059A TWI757897B TW I757897 B TWI757897 B TW I757897B TW 109134059 A TW109134059 A TW 109134059A TW 109134059 A TW109134059 A TW 109134059A TW I757897 B TWI757897 B TW I757897B
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data
sensor
nozzle
pick
stationary computer
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TW109134059A
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TW202111455A (en
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喬瑟夫 L. 赫里喬恩
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荷蘭商安必昂有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1628—Programme controls characterised by the control loop
    • B25J9/1633—Programme controls characterised by the control loop compliant, force, torque control, e.g. combined with position control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/065—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum provided with separating means for releasing the gripped object after suction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49314—Machine with oscillating workpiece, no full rotation
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49363—Minimalize time for tool movement between different positions, holes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

A method of positioning a component in a desired position on a board is provided. The method includes the steps of: (a) picking up the component with a nozzle of a movable placement unit of a pick and place machine; (b) transporting the component towards the board as a function of the desired position; (c) obtaining sensor data about an orientation of the component with respect to the nozzle with a sensor of the placement unit; (d) obtaining in the sensor rotational data about the orientation of the nozzle with respect to the placement unit; (e) combining in the sensor the sensor data and the rotational data into a data set; (f) sending the data set from the sensor to a stationary computer and computing a correction instruction in the stationary computer; and (g) placing the component on the board as a function of the correction instruction from the stationary computer.

Description

將部件定位在板上期望位置的方法Methods for positioning components in desired locations on the board

本發明涉及將部件定位在板上期望位置的方法，藉此用取放機（ pick and place machine ）的能移動放置單元的噴嘴拾取部件。本發明還涉及取放機和用於這種取放機的感應器。The present invention relates to a method of positioning a part in a desired position on a board whereby the part is picked with a nozzle of a pick and place machine capable of moving a place unit. The invention also relates to a pick and place machine and an inductor for such a pick and place machine.

使用取放機，部件可隨著噴嘴（繞噴嘴的旋轉軸）沿著φ方向和沿與φ方向相反的方向旋轉，並且可隨著噴嘴在（ i ）垂直於旋轉軸延伸的 XY 平面和（ ii ）沿平行於旋轉軸延伸的 Z 方向移動。Using a pick-and-place machine, the part can be rotated along the φ direction and in the opposite direction to the φ direction with the nozzle (about the axis of rotation of the nozzle), and can be rotated with the nozzle in the (i) XY plane extending perpendicular to the axis of rotation and ( ii) Movement in the Z direction extending parallel to the axis of rotation.

已知若干方法來確定部件相對於噴嘴和 / 或取放機的定向。 關於部件所使用的單詞「定向（orientation）」將在本文獻通篇使用，包括部件相對於標稱φ基準的角位置以及部件相對於標稱（x，y）基準的（x，y）位置。這種標稱φ基準可以是噴嘴的旋轉軸基準（例如刻度位置（index position）），同時標稱（x，y）基準可以是以旋轉軸的旋轉點為中心的垂直於旋轉軸延伸的 y 平面。但是，也可使用取放機中的其它基準。Several methods are known to determine the orientation of a part relative to the nozzle and/or pick and place machine. The word "orientation" as used with respect to a part will be used throughout this document to include the angular position of the part relative to a nominal phi reference and the (x,y) position of the part relative to a nominal (x,y) reference . Such a nominal phi reference may be the rotational axis reference (eg, index position) of the nozzle, while the nominal (x, y) reference may be a y extending perpendicular to the rotational axis centered on the rotational point of the rotational axis flat. However, other fiducials in the pick and place machine can also be used.

通過現有技術的方法，感應器的感應器資料被發送至固定的對齊處理單元。編碼器資料也可從用於旋轉噴嘴的致動器發送至固定的對齊處理單元。在對齊處理單元中，感應器資料和編碼器資料被即時合併並且用於計算校正指令。來自對齊處理單元的校正指令用於指示致動器的運動控制單元。對齊處理單元和運動控制單元能設置於相同的外殼或不同的外殼內。Through prior art methods, the sensor data of the sensors are sent to a fixed alignment processing unit. Encoder data can also be sent from the actuator used to rotate the nozzle to a fixed alignment processing unit. In the alignment processing unit, sensor data and encoder data are merged on-the-fly and used to calculate correction commands. Correction instructions from the alignment processing unit are used to instruct the motion control unit of the actuators. The alignment processing unit and the motion control unit can be located in the same housing or in different housings.

感應器、致動器和噴嘴一般設置於相對於部件將放置於其上的板的能移動放置單元內。對齊處理單元固定地設置於取放機中或外部。The inductors, actuators and nozzles are generally arranged in a movable placement unit relative to the plate on which the components are to be placed. The alignment processing unit is fixedly arranged in or outside the pick and place machine.

這種現有技術方法的一個缺陷在於在感應器資料和編碼器資料合併之前來自感應器和致動器的資料需要傳送經過相對較大的距離才能到達固定的對齊處理單元。這種現有技術方法的另一個缺陷在於感應器讀取時間一般不與噴嘴的旋轉速度同步，人們必須恆速操作來最小化編碼器資料與感應器資料之間的波動。One drawback of this prior art approach is that data from the sensors and actuators need to travel a relatively large distance to reach the fixed alignment processing unit before the sensor data and encoder data are merged. Another drawback of this prior art approach is that the sensor read time is generally not synchronized with the rotational speed of the nozzle, and one must operate at a constant speed to minimize fluctuations between encoder data and sensor data.

為了保持兩個通訊路徑內（包括處理單元內的資料傳送）資料的等待時間較少，即時處理環境是期望的。A real-time processing environment is desirable in order to keep the latency of data in both communication paths (including data transfer within the processing unit) low.

美國第 6,195,165 號專利公開了一種方法，藉此感測部件相對於噴嘴的角位置，並且計算校正指令。感測和計算均在感應器內進行。校正指令被傳輸至取放機，且部件根據校正指令被放置在板上。US Patent No. 6,195,165 discloses a method whereby the angular position of a component relative to the nozzle is sensed and correction commands are calculated. Both sensing and computation are performed within the sensor. Correction instructions are transmitted to the pick and place machine, and parts are placed on the board according to the correction instructions.

通過該方法，來自致動器的有關噴嘴角位置的資訊和來自感應器的資訊在感應器內被即時合併且用於計算校正指令。所述計算在感應器的計算部分內執行。With this method, the information from the actuator about the angular position of the nozzle and the information from the sensor are combined in real time within the sensor and used to calculate correction commands. The calculations are performed within the computational portion of the inductor.

這種方法的優點在於致動器、感應器的感測部分和感應器的計算部分之間的距離相對較短。然而，一般來說感應器的外殼較小並且直接安裝在還承載噴嘴的放置單元內。保持較低的局部生熱以防止放置單元升溫。熱會導致熱膨脹，對放置精確度產生不良影響。因此，感應器內處理電子器件的功率必須受到限制，這也限制了感應器內執行的計算的複雜性和速度。實際上，旋轉速度基本上保持恆定從而能夠以固定頻率進行感應器讀取並且能夠應用更簡單的處理例行程式。存儲來自致動器的有關噴嘴角位置的資訊和來自感應器的資訊以備隨後分析是不實用的，因為感應器內的儲存體是有限的。The advantage of this approach is that the distance between the actuator, the sensing part of the inductor and the computing part of the inductor is relatively short. However, in general the housing of the inductor is smaller and mounted directly in the placement unit which also carries the nozzle. Keep local heat buildup low to prevent the placement unit from heating up. Heat can cause thermal expansion that can adversely affect placement accuracy. Therefore, the power of the processing electronics within the inductor must be limited, which also limits the complexity and speed of the computations performed within the inductor. In practice, the rotational speed remains substantially constant so that sensor readings can be made at a fixed frequency and simpler processing routines can be applied. It is impractical to store information from the actuator about the angular position of the nozzle and information from the sensor for subsequent analysis because the storage volume within the sensor is limited.

鑑於上述習知技術之缺點，本發明提供改進的取放機、用於取放機的改進感應器和在板上定位部件的改進方法。In view of the above-mentioned shortcomings of the prior art, the present invention provides an improved pick and place machine, an improved sensor for the pick and place machine, and an improved method of positioning components on a board.

根據本發明的一個示例實施例，提供了將部件定位在板上期望位置的方法。所述方法包括如下步驟：（a）用一取放機的一能移動放置單元的一噴嘴拾取部件；（b）根據所述期望位置朝所述板上輸送所述部件；（c）用所述能移動放置單元的一感應器獲取有關所述部件相對於噴嘴的定向的一感應器資料；（d ）獲取有關所述噴嘴相對於所述能移動放置單元的定向的所述感應器的一旋轉資料；（e）在所述感應器內將所述感應器資料和所述旋轉資料組合為一資料集；（f）將所述資料集從所述感應器發送至一固定電腦並且在所述固定電腦內計算一校正指令；並且（g ）根據來自所述固定電腦的所述校正指令在所述板上放置所述部件。According to an example embodiment of the present invention, a method of positioning a component in a desired location on a board is provided. The method includes the steps of: (a) picking up the part with a nozzle of a movable placement unit of a pick and place machine; (b) conveying the part toward the plate according to the desired position; (c) using the a sensor of the movable placement unit obtains a sensor data about the orientation of the component relative to the nozzle; (d) obtains a sensor data about the orientation of the nozzle relative to the movable placement unit rotating data; (e) combining the sensor data and the rotation data into a data set within the sensor; (f) sending the data set from the sensor to a stationary computer and calculating a calibration instruction within the stationary computer; and (g) placing the component on the board in accordance with the calibration instruction from the stationary computer.

根據本發明的另一示例實施例，提供了一種取放機。所述取放機包括：一部件輸送系統；一板輸送系統；一固定電腦；以及包括一噴嘴和一感應器的至少一個能移動放置單元。所述能移動放置單元被構造為在相對於所述部件輸送系統和所述板輸送系統間移動。所述感應器包括：在所述感應器內（例如在感應器的外殼內）的接收電路，被構造為接收有關所述噴嘴的一旋轉位置的一旋轉資料；在所述感應器內（例如在感應器的外殼內）的一光學器件和一檢測電子器件，被構造為獲取有關可移除地附接於所述噴嘴的一部件的定向的一感應器資料，以及在所述感應器內（例如在感應器的外殼內）的信號處理電路，被構造為將所述旋轉資料和所述感應器資料合併為一資料集，及將所述資料集發送至所述固定電腦。所述固定電腦包括：接收來自所述感應器的所述資料集的一接收電路；以及計算來自所述資料集的一校正指令且將所述校正指令作為校正信號輸出至所述至少一個能移動放置單元的信號處理電路。According to another example embodiment of the present invention, a pick and place machine is provided. The pick-and-place machine includes: a component conveying system; a board conveying system; a stationary computer; and at least one movable placement unit including a nozzle and a sensor. The movable placement unit is configured to move relative to the component transport system and the board transport system. The sensor includes: a receiving circuit within the sensor (eg, within a housing of the sensor) configured to receive a rotational data about a rotational position of the nozzle; within the sensor (eg, within a housing of the sensor) an optics and a detection electronics within the housing of the sensor) configured to acquire a sensor data about the orientation of a component removably attached to the nozzle, and within the sensor A signal processing circuit (eg, within the housing of the sensor) is configured to combine the rotation data and the sensor data into a data set and send the data set to the stationary computer. The stationary computer includes: a receiving circuit that receives the data set from the sensor; and calculates a calibration command from the data set and outputs the calibration command as a calibration signal to the at least one movable Place the cell's signal processing circuitry.

根據本發明的又一示例實施例，提供了用於一取放機的一感應器。 所述取放機包括至少一個噴嘴和一固定電腦。所述感應器包括：（a）在所述感應器內（例如在感應器的外殼內）的一接收電路，被構造為接收有關所述噴嘴的一旋轉位置的一旋轉資料；（b）在所述感應器內（例如在感應器的外殼內）的一光學器件和一檢測電子器件，被構造為獲取有關可移除地附接於所述噴嘴的一部件所述定向的一感應器資料，以及（c）在所述感應器內（例如在感應器的外殼內）的信號處理電路，被構造為將所述旋轉資料和所述感應器資料合併為一資料集且發送所述資料集至所述固定電腦。According to yet another example embodiment of the present invention, an inductor for a pick and place machine is provided. The pick and place machine includes at least one nozzle and a fixed computer. The sensor includes: (a) a receiving circuit within the sensor (eg, within a housing of the sensor) configured to receive a rotational data regarding a rotational position of the nozzle; (b) in the sensor An optics and a detection electronics within the sensor (eg, within a housing of the sensor) configured to acquire a sensor data about the orientation of a component removably attached to the nozzle , and (c) a signal processing circuit within the sensor (eg, within a housing of the sensor) configured to combine the rotation data and the sensor data into a data set and transmit the data set to the stationary computer.

此處使用的術語「部件」指的是可使用取放機「取」和「放」的廣義部件。示例的部件包括半導體模具、電容器、電阻器、積體電路、封裝裝置等等。The term "part" as used herein refers to a broad part that can be "picked" and "placed" using a pick and place machine. Exemplary components include semiconductor dies, capacitors, resistors, integrated circuits, packaged devices, and the like.

此處使用的術語「板（ board ）」指的是可使用取放機將部件放置於其上的廣義基板。示例的板（也稱為基板）包括印刷電路板、引線框架、晶片、玻璃基板、金屬板等等。The term "board" as used herein refers to a broad substrate upon which components may be placed using a pick and place machine. Exemplary boards (also referred to as substrates) include printed circuit boards, lead frames, wafers, glass substrates, metal plates, and the like.

本發明涉及將部件定位在板上期望位置的方法，藉此利用取放機的能移動放置單元的噴嘴拾取所述部件。放置單元包括感應器。在確定所述部件相對於噴嘴的定向之後，部件以正確的定向被放置在板上期望位置。本發明還涉及用於執行所述方法的取放機和用於所述取放機的感應器。The present invention relates to a method of positioning a component in a desired position on a board, whereby the component is picked up by a nozzle of a movable placement unit of a pick and place machine. The placement unit includes the sensor. After determining the orientation of the component relative to the nozzle, the component is placed in the desired location on the board with the correct orientation. The invention also relates to a pick and place machine for carrying out the method and an inductor for the pick and place machine.

本發明的一個目的是提供將部件定位在板上期望位置的方法，藉此在被放置在板上之前能夠容易和可靠地確定部件的定向。It is an object of the present invention to provide a method of positioning a component in a desired position on a board whereby the orientation of the component can be easily and reliably determined before being placed on the board.

本發明的另一目的是提供將部件定位在板上期望位置的方法，藉此能保留所獲取的用於確定部件定向的資料以便用於隨後分析。Another object of the present invention is to provide a method of locating components at desired locations on a board, whereby the data acquired for determining component orientation can be retained for subsequent analysis.

根據本發明的論述，將感應器資料和相應旋轉資料合併為感應器內（例如在感應器的外殼內）的資料集具有的一個優點是可使用相對小的信號處理電路。這種信號處理電路可使用較少量的電能，因而顯著地減少了局部生熱的風險。此外，對信號處理電子器件的較低要求也降低了感應器的成本。而且，由於將資料合併為資料集發生在感應器內，獲取感應器資料的位置與信號處理電路之間的距離以及獲取感應器旋轉資料的位置與信號處理電路之間的距離相對較小。因此，產生的資料集也更具可靠性。資料集可被即時或非即時傳送至固定電腦，在固定電腦中資料集可在任何期望的時刻被處理。此外，感應器資料可容易地與噴嘴的旋轉速度和感應器旋轉資料同步，因而噴嘴也能以變化的速度旋轉。In accordance with the teachings of the present invention, combining sensor data and corresponding rotation data into a data set within the sensor (eg, within the sensor's housing) has the advantage that relatively small signal processing circuitry can be used. This signal processing circuit can use a smaller amount of electrical energy, thus significantly reducing the risk of localized heat generation. In addition, the lower requirements for signal processing electronics also reduce the cost of the inductor. Furthermore, since the merging of the data into a data set occurs within the sensor, the distance between the location where sensor data is acquired and the signal processing circuit and the location where sensor rotation data is acquired and the signal processing circuit are relatively small. Therefore, the resulting dataset is also more reliable. Datasets can be delivered real-time or non-real-time to stationary computers, where they can be processed at any desired time. In addition, the sensor data can be easily synchronized with the rotational speed of the nozzle and the sensor rotational data, so that the nozzle can also rotate at varying speeds.

合併的資料集被發送至固定電腦，在該處能在非即時的環境下進行更複雜和靈活的處理。固定電腦能根據需求設置期望多的CPU的數量（和RAM的數量），因為運轉電腦所需的電能不會使放置單元有局部生熱的風險。The combined data set is sent to a stationary computer, where more complex and flexible processing can be performed in a non-real-time environment. Stationary computers can be set as desired with as many CPUs (and RAM) as desired, since the power required to run the computer does not risk localized heating of the placement unit.

根據本發明的某些示例實施例，可在噴嘴相對於取放機的多個不同旋轉位置執行如下步驟：（ i ）在感應器內獲取有關噴嘴相對於放置單元的定向的旋轉資料和（ ii ）在感應器內將感應器資料和旋轉資料合併為資料集。其中，感應器資料和相應旋轉資料的多個資料集被發送至固定電腦，並且基於所述多個資料集在固定電腦內計算校正指令。通過獲取若干資料集，進一步提高了所述部件的定向的精確度。According to some example embodiments of the present invention, the steps of (i) obtaining rotational data within the sensor about the orientation of the nozzle relative to the placement unit and (ii) obtaining rotational information about the orientation of the nozzle relative to the placement unit may be performed at a plurality of different rotational positions of the nozzle relative to the pick and place machine. ) combines sensor data and rotation data into a data set within the sensor. Therein, multiple data sets of sensor data and corresponding rotation data are sent to the stationary computer, and correction instructions are calculated in the stationary computer based on the multiple data sets. By acquiring several datasets, the accuracy of the orientation of the components is further improved.

根據本發明的某些示例實施例，以等間隔的旋轉位置獲取感應器資料。因為旋轉資料已經能在感應器內得到，因此感應器資料和旋轉資料能容易地同步，即使旋轉速度變化較大時亦如此。According to some example embodiments of the present invention, sensor data is acquired at equally spaced rotational positions. Since the rotation data is already available in the sensor, the sensor data and the rotation data can be easily synchronized, even when the rotation speed varies greatly.

根據本發明的某些示例實施例，本發明的將部件定位在板上期望位置的方法包括在固定電腦中存儲資料集，以及在固定電腦內接收至少一定數量（例如預定數量）的資料集後再進行校正指令的計算。According to certain example embodiments of the present invention, the method of the present invention for positioning a component at a desired location on a board includes storing a dataset in a stationary computer, and after receiving at least a certain number (eg, a predetermined number) of datasets in the stationary computer Then perform the calculation of the correction command.

由於在感應器內花費的測量時間一般長於固定電腦中的高速處理能力，資料集因而可以被臨時儲存。在此情況下，感應器內不需要強大的處理能力。感應器內的處理能力能在具有較小占地面積和小功率要求如FPGA內實施，還可能存儲資料集以便未來分析。Since the measurement time spent in the sensor is generally longer than the high-speed processing power of the fixed computer, the data set can be temporarily stored. In this case, no significant processing power is required within the sensor. The processing power within the sensor can be implemented in an FPGA with a small footprint and low power requirements, and it is also possible to store data sets for future analysis.

根據本發明的某些示例實施例，執行感應器內感應器資料的預處理（將感應器資料壓縮為壓縮感應器資料）的步驟後，壓縮感應器資料和旋轉資料接著被合併為資料集。通過壓縮所述感應器資料可獲取壓縮資料組，並可減少資料流量和從感應器至固定電腦的高速通信裝置的需求。壓縮感應器資料可包括如僅僅有關圖像內所述部件的輪廓邊緣的位置的資訊。所述技術可應用於其它圖像壓縮技術如「JPEG」。此外，其它資料簡化技術如僅傳送輪廓邊緣附近圖像資料的「興趣區域選擇（region-of-interest selection）」亦可被使用。According to some example embodiments of the present invention, after performing the steps of in-sensor preprocessing of sensor data (compressing the sensor data into compressed sensor data), the compressed sensor data and the rotation data are then combined into a data set. Compressed data sets are obtained by compressing the sensor data and can reduce data traffic and the need for high-speed communication devices from the sensor to the stationary computer. The compressed sensor data may include, for example, information only about the position of the outline edges of the part within the image. The techniques can be applied to other image compression techniques such as "JPEG". In addition, other data reduction techniques such as "region-of-interest selection" which only transmits image data near the contour edges can also be used.

根據本發明的多個論述，因為感應器內的信號處理電路主要用來將感應器資料和旋轉資料合併為資料集，而固定電腦內的信號處理電路用於處理資料集，因此感應器內的信號處理電路與固定電腦內的比起來相對簡單。According to various discussions of the present invention, because the signal processing circuit in the sensor is mainly used to combine sensor data and rotation data into a data set, and the signal processing circuit in the fixed computer is used to process the data set, the The signal processing circuits are relatively simple compared to those in a stationary computer.

根據本發明的某些示例實施例，所述取放機包括多個能移動放置單元（其中每個放置單元設置有根據本發明的感應器），且固定電腦能被多個（也許所有）放置單元所使用。放置單元的感應器內的相對簡單的信號處理電路的成本相對較低，因此僅需使用一台昂貴的固定電腦。According to some example embodiments of the present invention, the pick-and-place machine includes a plurality of movable placement units (wherein each placement unit is provided with a sensor according to the present invention), and a stationary computer can be placed by a plurality (perhaps all) of them used by the unit. The relatively simple signal processing circuitry placed within the sensor of the unit is relatively inexpensive, so only an expensive stationary computer is required.

在本發明的某些實施例中，感應器包括一光源以獲取所述部件所需要的照明。該光源可透過檢測電子器件拍攝部件的圖像，或在檢測電子器件上投下部件的陰影。In some embodiments of the invention, the sensor includes a light source to obtain the desired illumination of the component. The light source can take an image of the part through the inspection electronics or cast a shadow of the part on the inspection electronics.

根據本發明的某些實施例，感應器資料表示部件的側面圖像。其中，固定電腦中的信號處理電路適用於計算多個旋轉位置處的所述部件的視覺外殼（ visual hull ）的形狀。在部件的側面圖像中，部件的輪廓邊緣的位置將清楚可見。輪廓邊緣的位置在部件旋轉期間變化。根據邊緣位置的位移，可確定部件的拐角的位置。According to some embodiments of the present invention, the sensor profile represents a side image of the part. Wherein, the signal processing circuit in the stationary computer is adapted to calculate the shape of the visual hull of the component at a plurality of rotational positions. In the profile image of the part, the position of the outline edge of the part will be clearly visible. The position of the contour edge changes during part rotation. From the displacement of the edge position, the position of the corner of the part can be determined.

如上所述（例如在本發明的實施方式部分），本發明提供了用於取放機的一感應器。使用所述感應器時，可依改進的性能如時間、可靠性和/或精確度來確定部件的定向。由於這種感應器中的信號處理電路主要用於將感應器資料和旋轉資料合併為資料集，同時該資料集將在固定電腦中處理完畢，因此感應器中的信號處理電路相對簡單。然而，由於信號處理電路相當靠近感應器中的接收電路和檢測電子器件，因此資料集可以容易地及可靠地即時完成。As described above (eg, in the Embodiments of the Invention section), the present invention provides an inductor for a pick and place machine. When using the sensor, the orientation of components can be determined based on improved performance such as time, reliability and/or accuracy. Since the signal processing circuit in this sensor is mainly used to combine sensor data and rotation data into a data set, and the data set will be processed in a fixed computer, the signal processing circuit in the sensor is relatively simple. However, since the signal processing circuit is relatively close to the receiving circuit and detection electronics in the sensor, the data set can be easily and reliably completed in real time.

圖 1 示出美國第7941913號專利 中所述取放機 1 的一部分的透視圖。取放機1包括基板送入/送出裝置2和三個部件放置單元3。基板送入/送出裝置2形成板輸送系統。每個部件放置單元3包括細長的U形框架4、可沿雙箭頭Y所示的方向相對於框架4 移動的第一滑塊 5 以及可沿雙箭頭 X 所示的方向相對於第一滑塊 5 移動的第二滑塊 6。第二滑塊6設有噴嘴7，噴嘴7可沿雙箭頭Z所示的方向相對於第二滑塊6移動。如圖2清楚所示，噴嘴7可繞平行於Z方向延伸的中心軸8沿雙箭頭φ所示的方向旋轉。第二滑塊6還設置有裝置9，裝置9的光軸10平行於中心軸8延伸。裝置9包括成像裝置11、配置在其前部的透鏡12、13、局部配置在透鏡13前部的偏轉鏡14以及光源15。偏轉鏡14包括一與光軸10的45°角。透鏡12、13形成遠心（telecentric）光學元件，其第一聚焦面16 與噴嘴 7 的中心軸 8 重合。第一聚焦面16還與由基板送入/送出裝置2所支撐的基板17重合。由透鏡12、13形成的光學元件的第二聚焦面18與成像裝置11重合。Figure 1 shows a perspective view of a portion of the pick and place machine 1 described in US Pat. No. 7,941,913. The pick-and-place machine 1 includes a substrate feeding/feeding device 2 and three component placement units 3 . The substrate in/out device 2 forms a board conveying system. Each component placement unit 3 includes an elongated U-shaped frame 4, a first slider 5 movable relative to the frame 4 in the direction indicated by the double arrow Y, and a first slider 5 movable relative to the first slider in the direction indicated by the double arrow X 5 Move the second slider 6 . The second slide 6 is provided with a nozzle 7 which is movable relative to the second slide 6 in the direction indicated by the double arrow Z. As clearly shown in FIG. 2 , the nozzle 7 is rotatable in the direction indicated by the double arrow φ about a central axis 8 extending parallel to the Z direction. The second slider 6 is also provided with a device 9 whose optical axis 10 extends parallel to the central axis 8 . The device 9 includes an imaging device 11 , lenses 12 and 13 arranged in front of the imaging device 11 , a deflection mirror 14 arranged partially in front of the lens 13 , and a light source 15 . The deflection mirror 14 includes an angle of 45° with the optical axis 10 . The lenses 12 , 13 form a telecentric optical element, the first focusing surface 16 of which coincides with the central axis 8 of the nozzle 7 . The first focusing surface 16 also coincides with the substrate 17 supported by the substrate in/out device 2 . The second focusing surface 18 of the optical element formed by the lenses 12 , 13 coincides with the imaging device 11 .

光源 15 位於光學元件 12 、13 的遠離聚焦面 16 的一側上並且提供了漫射照明給如已被噴嘴 7 拾取（例如通過施加真空）的部件 19。部件19已經由噴嘴7從部件輸送系統的部件供應位置20拾取。噴嘴7已經以現有技術的方式沿箭頭X和Y所示的方向移動。The light source 15 is located on the side of the optical elements 12, 13 remote from the focusing surface 16 and provides diffuse illumination to the part 19 as it has been picked up by the nozzle 7 (eg by applying a vacuum). The parts 19 have been picked up by the nozzles 7 from the parts supply location 20 of the parts delivery system. The nozzle 7 has been moved in the directions indicated by the arrows X and Y in the manner of the prior art.

當部件 19 從部件供應位置 20 移至基板 17 上的期望位置 21 時，部件 19 黏附於其中的噴嘴 7 繞中心軸 8 沿由雙箭頭φ所示的方向旋轉。在旋轉期間，在提前已知的多個旋轉位置處藉由成像裝置11產生出現在聚焦面16中的部件19輪廓圖像。透過運算單元，便可從輪廓圖像中確定部件19相對於噴嘴7的位置和定向。此外，成像裝置11可在基板17上的期望位置21產生一個或多個圖像。由存儲在運算單元中的在滑塊6相對於框架4的位置處產生的圖像，可確定位置21相對於噴嘴7（從而相對於部件 19 ）的定位。隨後，部件19能被準確地放置在期望位置21處。When the part 19 is moved from the part supply position 20 to the desired position 21 on the base plate 17, the nozzle 7 in which the part 19 is adhered is rotated about the central axis 8 in the direction indicated by the double arrow φ. During rotation, contour images of the component 19 appearing in the focus plane 16 are produced by the imaging device 11 at a number of rotational positions known in advance. By means of the arithmetic unit, the position and orientation of the component 19 relative to the nozzle 7 can be determined from the contour image. Additionally, imaging device 11 may generate one or more images at desired locations 21 on substrate 17 . From the resulting image stored in the arithmetic unit at the position of the slide 6 relative to the frame 4, the positioning of the position 21 relative to the nozzle 7 (and thus relative to the part 19) can be determined. The component 19 can then be placed exactly at the desired location 21 .

由於透鏡 12 、13 位於中心軸 8 的旁邊，因此部件 19 能被放置在基板 17 上而不需要移動成像裝置 11 的各部分。這樣就確保了部件放置單元的各個元件將保持相對於彼此的正確定位。Since the lenses 12, 13 are located beside the central axis 8, the component 19 can be placed on the substrate 17 without moving parts of the imaging device 11. This ensures that the various elements of the component placement unit will remain correctly positioned relative to each other.

透過成像裝置 11 感測部件 19 的輪廓，能以相對簡單的方式確定部件 19 相對於噴嘴 7 的位置和定向。由於光學元件是遠心的，因此可獲取部件19的清晰圖像，且當部件的輪廓點不在焦點上時，部件邊緣在成像裝置11上的位置不會改變。By sensing the contour of the part 19 through the imaging device 11, the position and orientation of the part 19 relative to the nozzle 7 can be determined in a relatively simple manner. Since the optical element is telecentric, a clear image of the part 19 can be obtained and the position of the part edge on the imaging device 11 does not change when the outline point of the part is not in focus.

如圖 3 所示，中心軸 8 與光軸 10 相交。中心軸8的這個位置特別適於相對較小的部件19，其整個輪廓能成像在成像裝置11上。 在部件19更大的情形下，合適的是將中心軸8定位在距光軸10一定距離處，同時中心軸8仍然位於聚焦面 16內。在這個位置，僅部件19的靠近光軸10的一側將成像在成像裝置11上。但是，通過令部件19圍繞中心軸8旋轉，在部件完全旋轉及部件19輪廓的若干圖像產生後，便能確定部件19相對於中心軸 8的位置。As shown in Figure 3, the central axis 8 intersects the optical axis 10. This position of the central axis 8 is particularly suitable for relatively small components 19 , the entire contour of which can be imaged on the imaging device 11 . In the case of a larger component 19, it is appropriate to position the central axis 8 at a distance from the optical axis 10, while the central axis 8 is still located within the focusing plane 16. In this position, only the side of the component 19 close to the optical axis 10 will be imaged on the imaging device 11 . However, by rotating the part 19 about the central axis 8, the position of the part 19 relative to the central axis 8 can be determined after the part is fully rotated and several images of the outline of the part 19 are generated.

光源 15 可以是能消除衍射效應的非相干光源。相對較小的單個LED光源的准直照明（Collimated illumination）和遠心成像也能合併使用。The light source 15 may be an incoherent light source that eliminates diffraction effects. Collimated illumination and telecentric imaging from a relatively small single LED light source can also be combined.

使用成像光學提供了成像光學的聚焦平面內更高的光學解析度，這就能對齊更小和更薄的部件。當部件19變得非常薄（例如約為10µm厚的等級）時，由於放置裝配中的機械公差特別是部件相對於噴嘴的傾斜會生成，所以很難確定部件的正確邊緣。通過使用2D光電二極體陣列檢測器，在每個採集定向處能獲得多個線而非單線。通過合併這些線中的資訊，能發現實際的正確邊緣位置。The use of imaging optics provides higher optical resolution in the focal plane of the imaging optics, which enables alignment of smaller and thinner components. When the part 19 becomes very thin (eg on the order of about 10µm thick) it can be difficult to determine the correct edge of the part due to mechanical tolerances in the placement assembly and in particular the inclination of the part relative to the nozzle. By using a 2D photodiode array detector, multiple lines can be obtained at each acquisition orientation instead of a single line. By combining the information in these lines, the actual correct edge location can be found.

使用成像光學的另一個優點是當成像光在透鏡和照明元件處散焦時對塵粒在光學元件上的阻礙不那麼敏感了。在這種遠心成像裝配中，廓影圖像（silhouette images）中的邊緣位置也必須被處理為部件尺寸資料。Another advantage of using imaging optics is that the imaging light is less sensitive to the obstruction of dust particles on the optics as the imaging light is defocused at the lens and illumination elements. In such telecentric imaging assemblies, edge locations in silhouette images must also be processed as part size information.

圖 4 是現有技術感應器 31 的另一實施例的頂視圖，其包括鐳射二極體 32 、准直透鏡 33 和光電二極體陣列 34。部件19能在准直透鏡33與光電二極體陣列34之間沿雙箭頭φ所示的方向繞中心軸8旋轉。FIG. 4 is a top view of another embodiment of a prior art sensor 31 including a laser diode 32 , a collimating lens 33 and a photodiode array 34 . The member 19 is rotatable about the central axis 8 between the collimating lens 33 and the photodiode array 34 in the direction indicated by the double arrow φ.

准直雷射光束 35 照亮垂直於旋轉軸 8 的部件 19 。准直雷射光束35內的部件19在光電二極體陣列34上投下陰影，使得部件19在光電二極體陣列34 上的廓影的位置和尺寸能由陰影的邊緣位置所確定。當部件19旋轉時，在部件19的多個定向處可獲得陰影圖像。通過合併陰影圖像內的邊緣位置，可確定部件19相對於旋轉軸8沿x 、y 、φ的偏移。使用相干雷射光束提供了光的定義明確的方向性的優點。A collimated laser beam 35 illuminates the component 19 perpendicular to the axis of rotation 8 . Features 19 within collimated laser beam 35 cast shadows on photodiode array 34 such that the location and size of the shadows of features 19 on photodiode array 34 can be determined by the location of the edges of the shadows. As the part 19 is rotated, shadow images can be obtained at multiple orientations of the part 19 . By incorporating the edge positions within the shadow image, the offset of the component 19 relative to the axis of rotation 8 along x , y , φ can be determined. Using a coherent laser beam offers the advantage of a well-defined directionality of light.

圖 5A -5C 是三個不同的現有技術取放機 41 、51 、 61 的示意圖。每個取放機41、51、61包括感應器9、對齊處理單元42、旋轉噴嘴7和連接於其的部件19的致動器43以及觸發致動器43的運動控制單元44。校正資料從對齊處理單元42經由線路45被發送至運動控制單元44。電動機電流從運動控制單元44經由線路46被發送至致動器43。編碼器資料從致動器43經由線路48也被發送至對齊處理單元42。感應器資料從感應器9經由線路49被發送至對齊處理單元42。5A-5C are schematic views of three different prior art pick and place machines 41 , 51 , 61 . Each pick and place machine 41 , 51 , 61 includes a sensor 9 , an alignment processing unit 42 , an actuator 43 that rotates the nozzle 7 and components 19 connected thereto, and a motion control unit 44 that triggers the actuator 43 . Correction data is sent from alignment processing unit 42 to motion control unit 44 via line 45 . The motor current is sent from the motion control unit 44 to the actuator 43 via line 46 . The encoder data is also sent from actuator 43 to alignment processing unit 42 via line 48 . Sensor data is sent from sensor 9 to alignment processing unit 42 via line 49 .

編碼器資料和感應器資料沿兩個不同的線路 48、 49 被置入對齊處理單元 42。在對齊處理單元42中，編碼器資料可和相應的感應器資料同步，並且基於編碼器資料和相應的感應器資料計算校正資料。校正資料用於校正運動控制單元44以便以正確定向將部件19放置在板上。The encoder data and sensor data are placed into the alignment processing unit 42 along two different lines 48, 49. In the alignment processing unit 42, the encoder data may be synchronized with the corresponding sensor data, and correction data may be calculated based on the encoder data and the corresponding sensor data. The calibration data is used to calibrate the motion control unit 44 to place the component 19 on the board in the correct orientation.

在對齊處理單元 42 的位置上，取放機 41 、  51、 61 彼此各異。The pick and place machines 41, 51, 61 are different from each other in the position of the alignment processing unit 42.

通過取放機 41，對齊處理單元 42 設置於第一固定電腦 52 內，同時運動控制單元 45 設置於第二固定電腦 53 內。單詞「固定」意味著電腦不隨著噴嘴7和感應器9在板上移動。Through the pick and place machine 41 , the alignment processing unit 42 is arranged in the first fixed computer 52 , and the motion control unit 45 is arranged in the second fixed computer 53 . The word "fixed" means that the computer does not move with the nozzle 7 and the sensor 9 on the board.

通過取放機 51，對齊處理單元 42 和運動控制單元 45 設置於相同的固定電腦 54 內。通過令對齊處理單元42固定地定位在距能移動噴嘴7和能移動感應器9一定距離處，在感應器資料和編碼器資料合併之前感應器資料和編碼器資料經由相對較大的距離被傳送至固定的對齊處理單元。The alignment processing unit 42 and the motion control unit 45 are housed in the same stationary computer 54 via the pick and place machine 51 . By having the alignment processing unit 42 fixedly positioned at a distance from the movable nozzle 7 and the movable sensor 9, the sensor data and encoder data are transmitted over a relatively large distance before the sensor data and encoder data are merged to a fixed alignment processing unit.

通過取放機 61，對齊處理單元 42 設置於與感應器 9 相同的外殼 55 內並且隨著感應器 9 同時移動。運動控制單元45設置於固定電腦53內。令對齊處理單元與感應器9設置在同樣的外殼內，具有局部生熱和熱膨脹的風險，這對放置精確度有不良影響。因此，必須限制對齊處理單元內處理電子器件的功率，這也限制了在外殼55內執行的計算的複雜性和速度。The alignment processing unit 42 is provided in the same housing 55 as the sensor 9 and moves simultaneously with the sensor 9 by the pick and place machine 61 . The motion control unit 45 is arranged in the fixed computer 53 . Having the alignment processing unit arranged in the same housing as the inductor 9 runs the risk of localized heat generation and thermal expansion, which adversely affects placement accuracy. Therefore, the power of the processing electronics within the alignment processing unit must be limited, which also limits the complexity and speed of the computations performed within the housing 55 .

通過每個現有技術的取放機 41 、  51 、 61 ，編碼器資料和感應器資料沿兩個不同的線路 48、 49 被置入對齊處理單元 42 ，藉此，編碼器資料和感應器資料在對齊處理單元 42 內同步，隨後並根據編碼器資料和相應的感應器資料計算校正資料。By each prior art pick and place machine 41, 51, 61, the encoder data and sensor data are placed into the alignment processing unit 42 along two different lines 48, 49, whereby the encoder data and sensor data are The alignment processing unit 42 is internally synchronized and then calculates correction data based on the encoder data and the corresponding sensor data.

圖 6 是根據本發明一個示例實施例的取放機系統 71 的示意圖。取放機71包括感應器79 、對齊處理單元72 、旋轉噴嘴7和連接於其的部件19的致動器43以及觸發致動器43的運動控制單元44。校正資料從對齊處理單元72經由線路45被發送至運動控制單元44。電動機電流從運動控制單元44經由線路46被發送至致動器43。編碼器資料從致動器43經由線路47被發送至運動控制單元44。FIG. 6 is a schematic diagram of a pick and place machine system 71 according to an example embodiment of the present invention. The pick and place machine 71 includes a sensor 79 , an alignment processing unit 72 , an actuator 43 that rotates the nozzle 7 and the component 19 connected thereto, and a motion control unit 44 that triggers the actuator 43 . Correction data is sent from alignment processing unit 72 to motion control unit 44 via line 45 . The motor current is sent from the motion control unit 44 to the actuator 43 via line 46 . The encoder data is sent from the actuator 43 to the motion control unit 44 via line 47 .

對齊處理單元 72 和運動控制單元 44 位於固定電腦 73 內。若有需求運動控制單元44也能設置於固定電腦73的外部。The alignment processing unit 72 and the motion control unit 44 are located in the stationary computer 73 . The motion control unit 44 can also be arranged outside the stationary computer 73 if required.

透鏡 12 、13 形成感應器 79 的光學器件。同時光源 15 和成像裝置 11 是感應器 79 中的檢測電子器件的一部分。光學器件和檢測電子器件被構造為獲取有關可移除地附接於噴嘴7的部件19的位置的感應器資料。The lenses 12 , 13 form the optics of the sensor 79 . At the same time the light source 15 and the imaging device 11 are part of the detection electronics in the sensor 79. The optics and detection electronics are configured to acquire sensor data about the position of the component 19 removably attached to the nozzle 7 .

感應器 79 包括接收電路 74。接收電路 74 被構造為經由線路 75 接收來自致動器 43 的有關噴嘴 7 旋轉位置的旋轉資料例如編碼器資料。 旋轉資料從接收電路74經由線路77被發送至信號處理電路76。感應器資料從成像裝置11經由線路78被發送至信號處理電路76。Inductor 79 includes receiving circuit 74 . The receiving circuit 74 is configured to receive, via line 75, rotational data, such as encoder data, from the actuator 43 regarding the rotational position of the nozzle 7. The rotation data is sent from the receiving circuit 74 to the signal processing circuit 76 via the line 77 . Sensor data is sent from imaging device 11 to signal processing circuit 76 via line 78 .

在信號處理電路 76 中，旋轉資料和感應器資料被合併為資料集。資料集從信號處理電路76經由線路80被發送至固定電腦73中的對齊處理單元72。In the signal processing circuit 76, the rotation data and the sensor data are combined into a data set. The data set is sent from the signal processing circuit 76 via the line 80 to the alignment processing unit 72 in the stationary computer 73 .

固定電腦 73 中的對齊處理單元 72 包括接收電路 81 ，以經由線路 80 從感應器 79 內的信號處理電路 76 接收資料集。從接收電路81，資料集經由線路82被發送至固定電腦73的對齊處理單元72內的信號處理電路83。 在信號處理電路83中，由資料集計算校正指令。校正指令作為校正資料，其從信號處理電路83經由運動控制單元44被發送至噴嘴7的致動器43，從而使部件 19在安裝在板上之前先將部件19定位在正確的角位置。此外，校正資料還被發送至第一和第二滑塊5、6的致動器從而將部件19定位在板上的期望位置的上方。在期望位置處，噴嘴7沿z方向移動以將部件定位在板上。The alignment processing unit 72 in the stationary computer 73 includes a receiving circuit 81 to receive the data set from the signal processing circuit 76 in the sensor 79 via the line 80 . From the receiving circuit 81 , the data set is sent to the signal processing circuit 83 in the alignment processing unit 72 of the stationary computer 73 via the line 82 . In the signal processing circuit 83, the correction command is calculated from the data set. Correction commands are sent as correction data from the signal processing circuit 83 via the motion control unit 44 to the actuator 43 of the nozzle 7 so that the component 19 is positioned in the correct angular position before being mounted on the board. In addition, the correction data is sent to the actuators of the first and second slides 5, 6 to position the part 19 above the desired position on the plate. At the desired position, the nozzle 7 is moved in the z direction to position the component on the plate.

除了經由線路（如電線或其它連接）傳送信號，當然也可能經由無線傳輸發送至少一些信號。In addition to transmitting signals via wires, such as wires or other connections, it is of course also possible to transmit at least some signals via wireless transmission.

固定電腦 73 也能設置有資料儲存體 84，資料集能經由線路 80 被輸入和存儲在資料儲存體 84 中。資料集從資料儲存體84經由線路85被輸入對齊處理單元72，對齊處理單元72在接收至少若干資料集之後會開始計算校正指令。校正資料被計算後，資料儲存體84內的資料集可被刪除，或被保留以便隨後評估。Stationary computer 73 can also be provided with a data store 84 in which data sets can be imported and stored via line 80 . The data sets are input from the data storage 84 through the line 85 to the alignment processing unit 72, and the alignment processing unit 72 starts to calculate the correction command after receiving at least several data sets. After the calibration data is calculated, the data set within the data store 84 may be deleted, or retained for subsequent evaluation.

圖 7A -7E 示出如圖 6 所示的取放機的五個不同的資料集。圖7A示出資料集91，其包括感應器資料陣列92（例如圖元值93）。資料集91通過將旋轉資料93補加於感應器資料陣列92來擴展旋轉資料94（例如編碼器資料）。 圖7B示出不同於資料集91的資料集95，區別在於補加的順序相反，首先是旋轉資料94然後是感應器資料 92。圖7C示出資料集96，在此感應器資料被預處理為僅包括基本象素位置的資料並且由此壓縮待發送的感應器資料量。壓縮的感應器資料97與旋轉資料94合併。圖7D示出資料集98，其中感應器資料99包括在相同編碼器位置處捕獲的多個感應器資料線路。圖7E示出資料集102，通過施加簡單的算數運算如加法、求平均值或感測相應位置的最小或最大值，多個資料線路100能合併為一個單線路101。在多線路100的情形下，資料甚至能被進一步壓縮為基本象素位置資料。多線路的合併以及感應器資料的壓縮運用很少的資料處理，並且能容易在感應器79的相對簡單的信號處理電路76中執行。Figures 7A-7E illustrate five different datasets for the pick and place machine shown in Figure 6. Figure 7A shows a data set 91 that includes an array of sensor data 92 (eg, primitive values 93). Data set 91 extends rotation data 94 (eg, encoder data) by appending rotation data 93 to sensor data array 92 . Figure 7B shows data set 95 different from data set 91, except that the order of addition is reversed, with rotation data 94 first and then sensor data 92. Figure 7C shows a data set 96 where the sensor data is preprocessed to include only data for basic pixel positions and thereby compressing the amount of sensor data to be sent. The compressed sensor data 97 is merged with the rotation data 94 . Figure 7D shows a data set 98 in which sensor data 99 includes multiple sensor data lines captured at the same encoder location. Figure 7E shows a data set 102. Multiple data lines 100 can be combined into a single line 101 by applying simple arithmetic operations such as addition, averaging, or sensing the minimum or maximum value of the corresponding position. In the case of multiple lines 100, the data can be even further compressed into basic pixel position data. The combining of multiple lines and the compression of sensor data uses very little data processing and can be easily performed in the relatively simple signal processing circuit 76 of the sensor 79 .

圖 8 是當獲取感應器資料時，噴嘴 7 以恒定轉速旋轉的速度 - 時間圖。從圖表可看出，恒定轉速可以是如每秒10轉，因此獲取感應器資料所需的加速度和時間是有限的。Figure 8 is a speed-time diagram of nozzle 7 rotating at a constant rotational speed when acquiring sensor data. As can be seen from the graph, the constant rotational speed can be, for example, 10 revolutions per second, so the acceleration and time required to acquire sensor data are limited.

在大約 0.04 秒期間的第一部分 102 中，噴嘴 7 開始旋轉和加速。進一步地，噴嘴7沿z方向向上移動以將部件19定位在感應器79內。在第二部分103期間，噴嘴7以每秒10轉的恒定轉速旋轉。在該第二部分103期間，通過感應器79在不同時間點104獲取圖像。在第三部分105,105'中，噴嘴7減速並且基於算出的校正資料旋轉至期望的角位置。進一步地，噴嘴7沿z方向向下移動離開感應器79。根據期望的校正，噴嘴7將跟隨部分105或105'。總時間約為0.25秒。During the first part 102 of a period of approximately 0.04 seconds, the nozzle 7 begins to rotate and accelerate. Further, the nozzle 7 is moved upwards in the z direction to position the component 19 within the inductor 79 . During the second part 103, the nozzle 7 rotates at a constant rotational speed of 10 revolutions per second. During this second portion 103, images are acquired by the sensor 79 at different points in time 104. In the third part 105, 105', the nozzle 7 is decelerated and rotated to the desired angular position based on the calculated correction data. Further, the nozzle 7 is moved downwardly away from the inductor 79 in the z direction. Depending on the desired correction, the nozzle 7 will follow the portion 105 or 105'. The total time is about 0.25 seconds.

圖 9 是當獲取感應器資料時噴嘴 7以變化旋轉速度旋轉 的速度 - 時間圖。在第一部分112中，噴嘴7噴嘴開始旋轉並且以與圖8相同的加速度加速。進一步地，噴嘴7沿z方向向上移動以將部件19定位在感應器79內。 在第二部分113期間，噴嘴7以每秒20轉的恒定轉速旋轉。在第一部分112以及第二部分113期間，通過感應器79在不同時間點104獲取圖像。在第三部分115,115'中，噴嘴7減速並且基於算出的校正資料旋轉至期望的角位置。此外，噴嘴7沿z方向向下移動離開感應器79。根據期望的校正，噴嘴7將跟隨部分115或115'。總時間約為0.17秒。Figure 9 is a speed-time diagram of the nozzle 7 rotating at varying rotational speeds when acquiring sensor data. In the first part 112 , the nozzle 7 nozzle starts to rotate and accelerates with the same acceleration as in FIG. 8 . Further, the nozzle 7 is moved upwards in the z direction to position the component 19 within the inductor 79 . During the second part 113, the nozzle 7 rotates at a constant rotational speed of 20 revolutions per second. During the first portion 112 and the second portion 113, images are acquired by the sensor 79 at different points in time 104. In the third part 115, 115', the nozzle 7 is decelerated and rotated to the desired angular position based on the calculated correction data. Furthermore, the nozzle 7 is moved downwards away from the inductor 79 in the z direction. Depending on the desired correction, the nozzle 7 will follow the portion 115 or 115'. The total time is about 0.17 seconds.

用本發明的取放機 71，有可能使用圖 8 和 9 所示的兩個速度 - 時間圖。例如，可能期望使用圖9所示的速度-時間圖，因為總時間更短。由於還在加速度部分期間獲取圖像，該更短的時間是可能的，因為旋轉資料能在感應器79中直接得到並且能直接與感應器79內相應的感應器資料合併為資料集。With the pick and place machine 71 of the present invention, it is possible to use the two speed-time diagrams shown in FIGS. 8 and 9 . For example, it may be desirable to use the speed-time graph shown in Figure 9 because the total time is shorter. Since the image is also acquired during the acceleration portion, this shorter time is possible because the rotation data is available directly in the sensor 79 and can be merged directly with the corresponding sensor data within the sensor 79 into a data set.

通過取放機 71 ，感應器 79 僅用於確定部件 19 在噴嘴 7 上的定向。還可能使用感應器79確定通過取放機1放在板上的期望位置。The sensor 79 is only used to determine the orientation of the part 19 on the nozzle 7 by the pick and place machine 71 . It is also possible to use the sensor 79 to determine the desired position on the board by the pick and place machine 1 .

儘管本發明的示例實施例具體示出和描述了本發明的細節，但本發明並不局限於此。相反地，在專利範圍內對本發明中的各個細節做出不同的改進，並不脫離本發明的範圍。While the exemplary embodiments of the invention specifically illustrate and describe the details of the invention, the invention is not so limited. On the contrary, various modifications can be made in the various details of the invention within the scope of the patent without departing from the scope of the invention.

本申請主張美國第62/268578號臨時申請的優先權，申請日為 2015 年 12 月 17 日，其內容通過引用併入本文。This application claims priority to U.S. Provisional Application No. 62/268578, filed December 17, 2015, the contents of which are incorporated herein by reference.

1:取放機 2:基板送入/送出裝置 3:放置單元 4:框架 5:第一滑塊 6:第二滑塊、滑塊 7:噴嘴 8:中心軸 9:裝置、感應器 10:光軸 11:成像裝置 12:透鏡 13:透鏡 14:偏轉鏡 15:光源 16:第一聚焦面、聚焦面 17:基板 18:第二聚焦面 19:部件 20:部件供應位置 21:期望位置 31:感應器 32:鐳射二極體 33:准直透鏡 34:光電二極體陣列 35:准直雷射光束 41:取放機 42:對齊處理單元 43:致動器 44:運動控制單元 45:運動控制單元 46:線路 47:線路 48:線路 49:線路 51:取放機 52:第一固定電腦 53:第二固定電腦、固定電腦 54:固定電腦 55:外殼 61:取放機 71:取放機、取放機系統 72:對齊處理單元 73:固定電腦 74:接收電路 75:線路 76:信號處理電路 77:線路 78:線路 79:感應器 80:線路 81:接收電路 82:線路 83:信號處理電路 84:資料儲存體 85:線路 91:資料集 92:感應器資料、感應器資料陣列 93:圖元值、旋轉資料 94:旋轉資料 95:資料集 96:資料集 97:感應器資料 98:資料集 99:感應器資料 100:多線路、資料線路 101:單線路 102:第一部分、資料集 103:第二部分 104:時間點 105:第三部分 105’:第三部分 112:第一部分 113:第二部分 115:第三部分、部分 115’:第三部分、部分1: Pick and place machine 2: Substrate feeding/feeding device 3: Place unit 4: Frame 5: The first slider 6: Second slider, slider 7: Nozzle 8: Center axis 9: Devices, sensors 10: Optical axis 11: Imaging device 12: Lens 13: Lens 14: Deflection mirror 15: Light source 16: The first focusing plane, focusing plane 17: Substrate 18: Second Focusing Surface 19: Components 20: Component supply location 21: Desired position 31: Sensor 32: Laser Diode 33: collimating lens 34: Photodiode Array 35: Collimated Laser Beam 41: Pick and place machine 42: Align the processing unit 43: Actuator 44: Motion Control Unit 45: Motion Control Unit 46: Line 47: Line 48: Line 49: Line 51: Pick and place machine 52: The first fixed computer 53: Second fixed computer, fixed computer 54: Fixed computer 55: Shell 61: Pick and place machine 71: Pick and place machine, pick and place machine system 72: Align processing unit 73: Fixed computer 74: Receiver circuit 75: Line 76: Signal processing circuit 77: Line 78: Line 79: Sensor 80: Line 81: Receiver circuit 82: Line 83: Signal processing circuit 84: Data Storage 85: Line 91: Dataset 92: Sensor data, sensor data array 93: Primitive value, rotation data 94: Rotate data 95: Dataset 96: Dataset 97: Sensor data 98: Dataset 99: Sensor data 100: Multiple lines, data lines 101: Single Line 102: Part 1, Dataset 103: Part II 104: Timepoint 105: Part Three 105': Part Three 112: Part 1 113: Part II 115: Part III, part 115’: Part III, part

所屬領域的技術人員透過與附圖一起閱讀本說明書，可以更加了解發明的內容。根據慣例，附圖中各個特徵不按等比例繪製；相反地，各個特徵的尺寸是以清晰性為目的被局部地放大或縮小。附圖包括： 圖 1 是習知取放機的一部分的透視圖； 圖 2 是圖 1 的習知取放機的部件放置單元的側視圖； 圖 3 是圖 2 的習知部件放置單元的光學光路的展開平面圖； 圖 4 是習知感應器的另一實施例的頂視圖； 圖 5A -5C 是三個不同的習知取放機的示意圖； 圖 6 是根據本發明的一個示例實施例的取放機的示意圖； 圖 7 A -7E 是圖 6的取放機的五個不同資料集； 圖 8 是根據本發明的一個示例實施例的當獲取感應器資料時噴嘴以恒定轉速旋轉的速度時間圖；並且 圖 9 是根據本發明的一個示例實施例的當獲取感應器資料時噴嘴以變化的轉速旋轉的速度時間圖； 類似的元件 / 部分可在不同附圖中用相同的示記表示，不論該元件 / 部分是習知結構還是本發明的結構都如此。Those skilled in the art can better understand the content of the invention by reading this specification together with the accompanying drawings. In accordance with common practice, the various features in the drawings are not drawn to scale; instead, the dimensions of the various features have been partially exaggerated or reduced for clarity. The accompanying drawings include: Figure 1 is a perspective view of a portion of a conventional pick and place machine; FIG. 2 is a side view of a component placement unit of the conventional pick and place machine of FIG. 1; FIG. 3 is an expanded plan view of the optical light path of the conventional component placement unit of FIG. 2; 4 is a top view of another embodiment of a conventional sensor; 5A-5C are schematic diagrams of three different conventional pick and place machines; 6 is a schematic diagram of a pick-and-place machine according to an example embodiment of the present invention; Figures 7A-7E are five different datasets of the pick and place machine of Figure 6; FIG. 8 is a speed time diagram of a nozzle rotating at a constant rotational speed when acquiring sensor data according to an example embodiment of the present invention; and FIG. 9 is a speed time diagram of nozzle rotation at varying rotational speeds when acquiring sensor data, according to an example embodiment of the present invention; Similar elements/portions may be represented by the same reference numerals in different drawings, regardless of whether the elements/portions are of conventional construction or of the present invention.

7:噴嘴 7: Nozzle

11:成像裝置 11: Imaging device

12:透鏡 12: Lens

13:透鏡 13: Lens

15:光源 15: Light source

19:部件 19: Components

43:致動器 43: Actuator

44:運動控制單元 44: Motion Control Unit

45:線路 45: Line

46:線路 46: Line

47:線路 47: Line

71:取放機 71: Pick and place machine

72:對齊處理單元 72: Align processing unit

73:固定電腦 73: Fixed computer

74:接收電路 74: Receiver circuit

75:線路 75: Line

76:信號處理電路 76: Signal processing circuit

77:線路 77: Line

78:線路 78: Line

79:感應器 79: Sensor

80:線路 80: Line

81:接收電路 81: Receiver circuit

82:線路 82: Line

83:信號處理電路 83: Signal processing circuit

84:資料儲存體 84: Data Storage

85:線路 85: Line

Claims (5)

一種將部件定位在板上期望的定向和位置的方法，該方法包括以下步驟：(a)用一取放機的一能移動放置單元的一噴嘴拾取該部件，該能移動放置單元包括(i)用於提供該部件相對於該板對齊的校正指令的一感應器，(ii)用於旋轉該噴嘴和連接在其上的該部件的一致動器，該致動器包括一旋轉的編碼器；(b)根據該期望位置，朝該板輸送該部件；(c)通過該感應器的一成像裝置獲取有關該部件相對於該噴嘴的定向的一影像感應器資料；(d)從該編碼器獲取有關該噴嘴相對於該能移動放置單元的定向的一旋轉編碼器資料；(e)在該感應器內將(i)來自該成像裝置之該影像感應器資料和(ii)來自該編碼器的該旋轉編碼器資料合併為一資料集；(f)將該資料集從該感應器發送至一固定電腦並且在該固定電腦內計算該校正指令；以及(g)根據來自該固定電腦的該校正指令將該部件放置在該板上。 A method of positioning a part in a desired orientation and position on a board, the method comprising the steps of: (a) picking up the part with a nozzle of a movable placement unit of a pick and place machine, the movable placement unit comprising (i) ) a sensor for providing corrective commands for the alignment of the component relative to the plate, (ii) an actuator for rotating the nozzle and the component attached thereto, the actuator including a rotary encoder (b) conveying the part toward the plate according to the desired position; (c) acquiring an image sensor data about the orientation of the part relative to the nozzle by an imaging device of the sensor; (d) from the code obtains a rotary encoder data about the orientation of the nozzle relative to the movable placement unit; (e) incorporates (i) the image sensor data from the imaging device and (ii) from the encoder in the sensor the rotary encoder data of the sensor into a data set; (f) send the data set from the sensor to a stationary computer and calculate the correction command in the stationary computer; and (g) according to the data from the stationary computer The calibration instructions place the part on the board. 根據申請專利範圍第1項所述的方法，其中，在該噴嘴相對於該取放機的不同複數個旋轉位置處執行該步驟(d)和該步驟(e)，其中，該影像感應器資料和相應該旋轉編碼器資料的複數個該資料集被 發送至該固定電腦，並且基於該等資料集在該固定電腦內計算該校正指令。 The method according to claim 1, wherein the steps (d) and (e) are performed at a plurality of different rotational positions of the nozzle relative to the pick-and-place machine, wherein the image sensor data and a plurality of the data sets corresponding to the rotary encoder data are is sent to the stationary computer, and the correction command is calculated in the stationary computer based on the data sets. 根據申請專利範圍第2項所述的方法，其中，在等間距的該等旋轉位置處獲取該影像感應器資料。 The method according to claim 2, wherein the image sensor data is acquired at the rotational positions at equal intervals. 根據申請專利範圍第2項所述的方法，其中，該方法進一步包括在該固定電腦中存儲該等資料集，並且在該固定電腦內接收至少該等資料集之後再進行該校正指令的計算。 The method according to claim 2, wherein the method further comprises storing the data sets in the stationary computer, and performing the calculation of the calibration command after receiving at least the data sets in the stationary computer. 根據申請專利範圍第1項所述的方法，其中，該方法包括在該感應器內預處理該影像感應器資料以將該影像感應器資料壓縮為一壓縮影像感應器資料，並且將該壓縮影像感應器資料和該旋轉編碼器資料合併為該資料集。 The method of claim 1, wherein the method includes preprocessing the image sensor data within the sensor to compress the image sensor data into a compressed image sensor data, and the compressed image The sensor data and the rotary encoder data are combined into the data set.
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