TWI756079B - Illuminated keyswitch structure - Google Patents

Abstract

An illuminated keyswitch structure incudes a keycap, a switch circuit board, and at least one light-emitting die. The keycap is movably disposed in a vertical direction. The switch circuit board is disposed under the keycap. The at least one light-emitting die is disposed under the switch circuit board. The circuitry of the switch circuit board does not cover the at least one light-emitting die. Light emitted upward by the at least one light-emitting die passes through the switch circuit board to illuminate the keycap. There is a light-emitting distance between the at least one light-emitting die and the circuitry in a horizontal direction. The light-emitting distance is between 0.17 mm and 0.78 mm. Thereby, by controlling the distance between the circuitry and the at least one light-emitting die, the influence of the circuitry on the light emitted by the at least one light-emitting die is suppressed effectively.

Description

發光按鍵結構 Light-emitting key structure

本發明關於一種按鍵結構，尤指一種發光按鍵結構。 The present invention relates to a key structure, in particular to a light-emitting key structure.

一對一的發光按鍵通常於每顆鍵帽下方設置一光源，發射光線形成背光。當鍵帽具有可透光區對應文字或符號等字符時，該光源通常會正對該字符設置並朝向該字符發射光線。於實際產品中，光源至鍵帽可透光區間常常存在著其他構件，例如支架、底板、電路板等，使得光線傳遞路徑受到干擾，造成鍵帽的字符色彩不均勻。在光源具有多種顏色的情況下，也會發生色彩偏差嚴重的問題。 One-to-one light-emitting keys are usually provided with a light source under each keycap, which emits light to form a backlight. When the keycap has a light-transmitting area corresponding to characters such as characters or symbols, the light source is usually disposed directly on the character and emits light toward the character. In actual products, there are often other components, such as brackets, bottom plates, circuit boards, etc., between the light source and the light-transmitting area of the keycap, which interferes with the light transmission path and causes uneven color of the characters on the keycap. In the case where the light source has multiple colors, the problem of serious color deviation also occurs.

鑑於先前技術中的問題，本發明之一目的在於提供一種發光按鍵結構，其發光晶粒與開關電路板中的電路之間具有一出光間距，以抑制電路對發光晶粒發射的光線的影響。 In view of the problems in the prior art, an object of the present invention is to provide a light-emitting key structure with a light-emitting distance between the light-emitting die and the circuit in the switch circuit board, so as to suppress the influence of the circuit on the light emitted by the light-emitting die.

根據本發明之一發光按鍵結構包含一鍵帽、一開關電路板及至少一發光晶粒。該鍵帽沿一垂直方向可移動地設置。該開關電路板設置於該鍵帽下方且包含一電路。該至少一發光晶粒設置於該開關電路板下方，該電路未遮蔽該至少一發光晶粒。該至少一發光晶粒向上發射之光線穿過該開關電路板以照射該鍵帽。該至少一發光晶粒與該電路間於一水平方向上具有一出光間距，介於0.17mm至0.78mm。藉此，透過控制該電路與該至少一發光晶粒之間距，以抑制該電路對該至少一發光晶粒發射的光線的影響。 A light-emitting key structure according to the present invention includes a key cap, a switch circuit board and at least one light-emitting die. The keycap is movably arranged in a vertical direction. The switch circuit board is disposed under the keycap and includes a circuit. The at least one light-emitting die is disposed under the switch circuit board, and the circuit does not shield the at least one light-emitting die. The light emitted upward from the at least one light-emitting die passes through the switch circuit board to illuminate the keycap. The at least one light-emitting die and the circuit have a light-emitting distance in a horizontal direction, ranging from 0.17mm to 0.78mm. Therefore, by controlling the distance between the circuit and the at least one light-emitting die, the influence of the circuit on the light emitted by the at least one light-emitting die can be suppressed.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到 進一步的瞭解。 The advantages and spirit of the present invention can be obtained from the following detailed description of the invention and the accompanying drawings. Better understanding of.

1,3:發光按鍵結構 1,3: Illuminated key structure

12:鍵帽 12: Keycaps

12a,12a':可透光指示區域 12a, 12a': light-permeable indicating area

12b,12b':長度方向 12b, 12b': length direction

12c:長軸 12c: long axis

12d:短軸 12d: Short axis

14:底板 14: Bottom plate

142,142',144:通孔 142, 142', 144: through hole

146:外板緣 146: Outer board edge

16:第一支架 16: The first bracket

162:下表面 162: Lower Surface

164:上表面 164: Top surface

18:第二支架 18: Second bracket

20:開關電路板 20: Switch circuit board

202,203a,203b:開關接點 202, 203a, 203b: Switch contacts

202a:平邊 202a: Flat edge

202b:圓心 202b: center of circle

202c:半徑 202c: Radius

2032a,2032b:外圍部 2032a, 2032b: Peripheral Department

2034a,2034b:中心部 2034a, 2034b: Central Department

2036a,2036b:連接部 2036a, 2036b: Connections

204:導線段 204: Wire segment

206:貫穿孔 206: Through hole

22a,22b,22c:發光晶粒 22a, 22b, 22c: luminescent grains

24:光源電路板 24: Light source circuit board

26:彈性圓突 26: Elastic dome

D1:垂直方向 D1: vertical direction

D2,D2',D2":排列方向 D2,D2',D2": Arrangement direction

D3,D3',D3":水平方向 D3,D3',D3": horizontal direction

d1,d1a,d1a',d1b,d1b',d2,d3:出光間距 d1,d1a,d1a',d1b,d1b',d2,d3: Lighting distance

G:間隙投影 G: Gap projection

圖1為根據一實施例之一發光按鍵結構之示意圖。 FIG. 1 is a schematic diagram of a light-emitting key structure according to an embodiment.

圖2為圖1中發光按鍵結構之***圖。 FIG. 2 is an exploded view of the light-emitting key structure in FIG. 1 .

圖3為圖1中發光按鍵結構沿線X-X之剖面圖。 FIG. 3 is a cross-sectional view of the light-emitting key structure in FIG. 1 along the line X-X.

圖4為圖2中發光按鍵結構之部分的開關電路板與發光晶粒之俯視配置圖。 FIG. 4 is a top view of the configuration of the switch circuit board and the light-emitting die of the part of the light-emitting key structure in FIG. 2 .

圖5為圖4中開關接點與發光晶粒根據另一實施例之俯視配置圖。 FIG. 5 is a top view of the configuration of the switch contacts and the light-emitting die in FIG. 4 according to another embodiment.

圖6為圖4中開關接點與發光晶粒根據另一實施例之俯視配置圖。 FIG. 6 is a top view of the configuration of the switch contacts and the light-emitting die in FIG. 4 according to another embodiment.

圖7為圖1中發光按鍵結構之俯視圖。 FIG. 7 is a top view of the light-emitting key structure in FIG. 1 .

圖8為部分的開關電路板與發光晶粒根據一實施例之俯視配置圖。 FIG. 8 is a top plan view of a portion of the switch circuit board and the light-emitting die according to an embodiment.

圖9為對應圖8實施例沿線Y-Y之剖面圖。 FIG. 9 is a cross-sectional view along line Y-Y corresponding to the embodiment of FIG. 8 .

圖10為根據另一實施例之一發光按鍵結構之***圖。 FIG. 10 is an exploded view of a light-emitting key structure according to another embodiment.

圖11為圖10中發光按鍵結構移除鍵帽後之俯視圖。 FIG. 11 is a top view of the light-emitting key structure in FIG. 10 after the keycap is removed.

圖12為圖10中發光按鍵結構之剖面圖，其切面位於如圖10中線Z-Z所示之位置。 FIG. 12 is a cross-sectional view of the light-emitting key structure in FIG. 10 , the section of which is located at the position indicated by the line Z-Z in FIG. 10 .

圖13為圖10中發光按鍵結構之俯視圖。 FIG. 13 is a top view of the light-emitting key structure in FIG. 10 .

請參閱圖1至圖3。根據一實施例之一發光按鍵結構1包含一鍵帽12、一底板14、一第一支架16、一第二支架18、一透明的開關電路板20及一或多顆發光晶粒(例如但不限於三個發光晶粒22a、22b、22c，發射不同色光的光線，例如紅光、綠光及藍光；又，發光晶粒22a、22b、22c可由但不限於發光二極體實作)。鍵帽12設置於底板14上方，第一支架16及第二支架18均連接至鍵帽12及底板14之間，以支撐鍵帽12並使鍵帽12能經由第一支架16及第二支架18沿一垂直方向D1(以雙頭箭頭標示於圖中)可移動。開關電路板20放置於底板14上(即位於 鍵帽12下方)。發光晶粒22a、22b、22c設置於開關電路板20下方，例如固定於位於底板14下方的光源電路板24(例如但不限於撓性印刷電路板)上，底板14形成對應的通孔142，以露出發光晶粒22a、22b、22c；於實作上，發光晶粒22a、22b、22c可部分或全部進入通孔142。開關電路板20的電路(其部分以虛線繪示於圖2中)未遮蔽發光晶粒22a、22b、22c，使得發光晶粒22a、22b、22c向上發射之光線能穿過開關電路板20以照射鍵帽12。 See Figures 1 through 3. A light-emitting key structure 1 according to an embodiment includes a key cap 12 , a bottom plate 14 , a first bracket 16 , a second bracket 18 , a transparent switch circuit board 20 and one or more light-emitting chips (eg, but Not limited to three light-emitting chips 22a, 22b, 22c, emitting light of different colors, such as red light, green light and blue light; in addition, the light-emitting chips 22a, 22b, 22c can be implemented by but not limited to light-emitting diodes). The keycap 12 is disposed above the bottom plate 14 , and the first bracket 16 and the second bracket 18 are connected between the keycap 12 and the bottom plate 14 to support the keycap 12 and enable the keycap 12 to pass through the first bracket 16 and the second bracket 18 is movable in a vertical direction D1 (indicated by a double-headed arrow in the figure). The switch circuit board 20 is placed on the bottom plate 14 (ie, at below keycap 12). The light-emitting die 22a, 22b, 22c are disposed under the switch circuit board 20, for example, fixed on the light source circuit board 24 (such as but not limited to a flexible printed circuit board) located under the bottom plate 14, and the bottom plate 14 forms corresponding through holes 142, In order to expose the light-emitting die 22a, 22b, 22c; in practice, the light-emitting die 22a, 22b, 22c may partially or fully enter the through hole 142. The circuit of the switch circuit board 20 (the part of which is shown in dashed lines in FIG. 2 ) does not shield the light-emitting die 22a, 22b, 22c, so that the light emitted upward from the light-emitting die 22a, 22b, 22c can pass through the switch circuit board 20 to The keycap 12 is illuminated.

於本實施例中，開關電路板20以一薄膜電路板實作，其通常由三層透明薄片疊置而成，其中上層及下層透明薄片其上形成所需的電路，中間的透明薄片提供電路所需的絕緣效果。開關電路板20的電路包含開關接點202及數個導線段(其隱藏輪廓於圖2中均以虛線繪示)。發光按鍵結構1利用一可透光的彈性圓突26作為回復元件，彈性圓突26對齊開關接點202設置於開關電路板20上並於垂直方向D1上遮蓋住開關接點202及發光晶粒22a、22b、22c。鍵帽12可被按壓(例如使用者以手指按壓)而向下擠壓彈性圓突26，進而觸發開關接點202。施加於鍵帽12上之外力移除後(例如使用者自鍵帽12移開手指)，被擠壓的彈性圓突26可回復原狀以向上推抵鍵帽12回到原位。 In this embodiment, the switch circuit board 20 is implemented as a thin film circuit board, which is usually formed by stacking three layers of transparent sheets, wherein the upper and lower transparent sheets form the required circuits, and the middle transparent sheet provides the circuit. the desired insulating effect. The circuit of the switch circuit board 20 includes a switch contact 202 and several wire segments (the hidden outlines of which are shown in dotted lines in FIG. 2 ). The light-emitting key structure 1 uses a transparent elastic round protrusion 26 as a restoring element. The elastic round protrusion 26 is arranged on the switch circuit board 20 in alignment with the switch contact 202 and covers the switch contact 202 and the light-emitting die in the vertical direction D1 22a, 22b, 22c. The keycap 12 can be pressed (eg, by a user's finger) to squeeze the elastic round protrusion 26 downward, thereby triggering the switch contact 202 . After the external force applied to the keycap 12 is removed (eg, the user removes a finger from the keycap 12 ), the squeezed elastic round protrusion 26 can return to its original shape to push the keycap 12 upward to return to its original position.

請亦參閱圖4，其中開關電路板20的電路及發光晶粒22a、22b、22c的隱藏輪廓均以實線繪示。開關接點202具有一非圓形輪廓，例如但不限於一切平圓形輪廓，此切平圓形輪廓具有一平邊202a。發光晶粒22a、22b、22c沿一排列方向D2(以雙頭箭頭標示於圖中)排列，排列方向D2平行於平邊202a。發光晶粒22a、22b、22c與開關接點202間於一水平方向D3(以雙頭箭頭標示於圖中)具有一出光間距d1(亦即發光晶粒22a、22b、22c的出光範圍邊緣於開關電路板20上之投影至平邊202a之距離)。原則上，發光晶粒22a、22b、22c離開關接點202越遠越能減少開關接點202遮蔽發光晶粒22a、22b、22c發射的光線的情形；於實作上，此出光間距d1可設計為介於0.3mm至0.5mm。此外，於本實施例中，該切 平圓形輪廓具有一圓心202b及一半徑202c，圓心202b至平邊202a之距離202d對半徑202c之比大於0.5，原則上開關接點202可保有可接受的接觸導通性質。 Please also refer to FIG. 4 , wherein the circuit of the switch circuit board 20 and the hidden outlines of the light-emitting chips 22 a , 22 b , and 22 c are shown with solid lines. The switch contact 202 has a non-circular profile, such as but not limited to a flat circular profile, and the flat circular profile has a flat edge 202a. The light-emitting die 22a, 22b, 22c are arranged along an arrangement direction D2 (indicated by a double-headed arrow in the figure), and the arrangement direction D2 is parallel to the flat side 202a. The light-emitting die 22a, 22b, 22c and the switch contact 202 have a light-emitting distance d1 in a horizontal direction D3 (marked by a double-headed arrow in the figure) (that is, the light-emitting range edge of the light-emitting die 22a, 22b, 22c is at The distance from the projection on the switch circuit board 20 to the flat side 202a). In principle, the farther the light-emitting chips 22a, 22b, and 22c are from the switch contact 202, the more the switch contact 202 can shield the light emitted by the light-emitting chips 22a, 22b, and 22c. Designed to be between 0.3mm to 0.5mm. In addition, in this embodiment, the The flat circular contour has a center 202b and a radius 202c. The ratio of the distance 202d from the center 202b to the flat edge 202a to the radius 202c is greater than 0.5. In principle, the switch contact 202 can maintain acceptable contact conduction properties.

另外，於實作上，開關電路板20的開關接點可能有不同的形狀。例如，如圖5所示，根據一實施例之開關接點203a包含一外圍部2032a及位於外環部2032a內側之一中心部2034a及二連接部2036a。連接部2036a於位於中心部2034a之相對兩側並連接外圍部2032a及中心部2034a。外圍部2032a沿一圓形路徑(以虛線表示於圖中)不完整延伸而呈一C形。中心部2034a具有一圓形輪廓。發光晶粒22a、22b、22c位於外圍部2032a兩末端之間(即位於該C形開口處)，且該圓形路徑通過發光晶粒22a、22b、22c(即發光晶粒22a、22b、22c排列於該圓形路徑上)。發光晶粒22a、22b、22c較靠近中心部2034a且與中心部2034a間有一出光間距d1a(亦即發光晶粒22a、22b、22c的出光範圍邊緣於開關電路板20上之投影至中心部2034a之距離)；同樣的，於實作上，此出光間距d1a可設計為介於0.3mm至0.5mm。若發光晶粒22a、22b、22c較靠近外圍部2032a兩末端且與外圍部2032a兩末端間有一出光間距d1a'；同樣的，於實作上，此出光間距d1a'亦可設計為介於0.3mm至0.5mm。 In addition, in practice, the switch contacts of the switch circuit board 20 may have different shapes. For example, as shown in FIG. 5, the switch contact 203a according to an embodiment includes a peripheral portion 2032a, a central portion 2034a located inside the outer ring portion 2032a, and two connecting portions 2036a. The connecting portions 2036a are located on opposite sides of the central portion 2034a and connect the peripheral portion 2032a and the central portion 2034a. The peripheral portion 2032a does not extend completely along a circular path (shown in phantom in the figure) and has a C-shape. The central portion 2034a has a circular outline. The light-emitting chips 22a, 22b, and 22c are located between the two ends of the peripheral portion 2032a (ie, at the C-shaped opening), and the circular path passes through the light-emitting chips 22a, 22b, and 22c (ie, the light-emitting chips 22a, 22b, and 22c). arranged on the circular path). The light-emitting chips 22a, 22b, and 22c are closer to the center portion 2034a and have a light-emitting distance d1a from the center portion 2034a (that is, the edges of the light-emitting ranges of the light-emitting chips 22a, 22b, and 22c are projected on the switch circuit board 20 to the center portion 2034a ). distance); also, in practice, the light-emitting distance d1a can be designed to be between 0.3mm and 0.5mm. If the light-emitting die 22a, 22b, and 22c are closer to both ends of the peripheral portion 2032a and have a light-exiting distance d1a' between the two ends of the peripheral portion 2032a; similarly, in practice, the light-extracting distance d1a' can also be designed to be between 0.3 mm to 0.5mm.

又例如，如圖6所示，根據一實施例之開關接點203b包含一外圍部2032b及位於外環部2032b內側之一中心部2034b及一連接部2036b。連接部2036b連接外圍部2032b及中心部2034b。外圍部2032b沿一凸多邊形路徑(例如但不限於五邊形路徑，以虛線表示於圖中)不完整延伸而略呈一C形。中心部2034b具有一凸多邊形輪廓(例如但不限於四邊形)。該凸多邊形路徑通過發光晶粒22a、22b、22c。發光晶粒22a、22b、22c較靠近中心部2034b且與中心部2034b間有一出光間距d1b；同樣的，於實作上，此出光間距d1b可設計為介於0.3mm至0.5mm。若發光晶粒22a、22b、22c較靠近外圍部2032b且與外圍部2032b間有一出光間距d1b'；同樣的，於實作上，此出光間距d1b'亦可設計為介於0.3mm至0.5mm。此外，於 圖5及圖6中，該凸多邊形路徑於實作上亦可為三角形路徑、六邊形路徑等等；該中心部2034a、2034b的輪廓亦可為其他凸多邊形輪廓，例如三角形輪廓、六邊形輪廓等等。 For another example, as shown in FIG. 6 , the switch contact 203b according to an embodiment includes a peripheral portion 2032b, a central portion 2034b located inside the outer ring portion 2032b, and a connecting portion 2036b. The connecting portion 2036b connects the peripheral portion 2032b and the central portion 2034b. The peripheral portion 2032b does not extend completely along a convex polygonal path (such as but not limited to a pentagonal path, shown in dashed lines in the figure) and is slightly C-shaped. The central portion 2034b has a convex polygonal outline (such as, but not limited to, a quadrilateral). The convex polygonal path passes through the light emitting dies 22a, 22b, 22c. The light-emitting chips 22a, 22b, and 22c are closer to the center portion 2034b and have a light-emitting distance d1b between them and the center portion 2034b. Similarly, in practice, the light-emitting distance d1b can be designed to be between 0.3 mm and 0.5 mm. If the light-emitting chips 22a, 22b, 22c are closer to the peripheral portion 2032b and have a light-emitting distance d1b' with the peripheral portion 2032b; similarly, in practice, the light-emitting distance d1b' can also be designed to be between 0.3mm and 0.5mm . Furthermore, on In FIGS. 5 and 6 , the convex polygonal path can also be a triangular path, a hexagonal path, etc. in practice; the contours of the central portions 2034a and 2034b can also be other convex polygonal contours, such as outlines, etc.

請參閱圖1至圖3。於本實施例中，鍵帽12具有一可透光指示區域12a(以虛線框示於圖中)，發光晶粒22a、22b、22c發射的光線可穿過可透光指示區域12a以形成視覺上的指示效果。於實作上，可透光指示區域12a可為數字、符號、字母、文字、圖形或其組合等等。 See Figures 1 through 3. In this embodiment, the keycap 12 has a light-permeable indication area 12a (shown in a dotted frame in the figure), and the light emitted by the light-emitting chips 22a, 22b, 22c can pass through the light-permeable indication area 12a to form a visual on the indication effect. In practice, the light-transmittable indicating area 12a may be numbers, symbols, letters, characters, graphics or combinations thereof, and the like.

請亦參閱圖7(其中發光晶粒22a、22b、22c的隱藏輪廓以細實線繪示)。於本實施例中，可透光指示區域12a具有一長度方向12b(例如圖中字母排列方向，以雙頭箭頭標示於圖中)。發光晶粒22a、22b、22c垂直於長度方向12b排列於可透光指示區域12a下方(即排列方向D2垂直於長度方向12b)，藉此可減少或消除發光晶粒22a、22b、22c因間隔排列而產生混光不均的現象對可透光指示區域12a的影響。 Please also refer to FIG. 7 (wherein the hidden outlines of the light-emitting dies 22a, 22b, 22c are shown with thin solid lines). In this embodiment, the transparent indicating area 12a has a length direction 12b (eg, the direction in which the letters are arranged in the figure, which is indicated by a double-headed arrow in the figure). The light-emitting chips 22a, 22b, 22c are arranged perpendicular to the length direction 12b under the light-transmitting indicator area 12a (ie, the arrangement direction D2 is perpendicular to the length direction 12b), thereby reducing or eliminating the space between the light-emitting chips 22a, 22b, 22c. The phenomenon of uneven light mixing caused by the arrangement has an influence on the light permeable indicating area 12a.

此外，於本實施例中，可透光指示區域12a呈一長方形，其上可定義一長軸12c及一短軸12d(均以鏈線表示於圖7中)，長軸12c平行於長度方向12b，短軸12d垂直於長度方向12b。可透光指示區域12a分別相對於長軸12c及短軸12d結構對稱。發光晶粒22a、22b、22c整體通過長軸12c且發光晶粒22a、22b、22c整體的中心(於本實施例中即為發光晶粒22b)位於長軸12c上。實作上亦可設計發光晶粒22a、22b、22c整體通過長軸12c中心，如圖7中虛線方框所示者；此時，發光晶粒22a、22b、22c整體亦通過短軸12d中心，且發光晶粒22a、22b、22c整體的中心(於本實施例中即為發光晶粒22b)亦位於短軸12d中心。 In addition, in this embodiment, the transparent indicating area 12a is in the shape of a rectangle, on which a long axis 12c and a short axis 12d (both shown by chain lines in FIG. 7) can be defined, and the long axis 12c is parallel to the longitudinal direction 12b, the short axis 12d is perpendicular to the length direction 12b. The light-permeable indicating area 12a is symmetrical with respect to the long axis 12c and the short axis 12d, respectively. The light-emitting die 22a, 22b, and 22c pass through the long axis 12c as a whole, and the center of the light-emitting die 22a, 22b, and 22c (in this embodiment, the light-emitting die 22b) is located on the long axis 12c. In practice, the light-emitting die 22a, 22b, 22c can also be designed to pass through the center of the long axis 12c as a whole, as shown by the dotted box in FIG. , and the entire center of the light-emitting die 22a, 22b, and 22c (in this embodiment, the light-emitting die 22b) is also located at the center of the short axis 12d.

另外，於發光按鍵結構1中，開關接點202大致位於中央區域，但實作上不以此為限。例如開關接點202偏離中央區域設置，且由鍵帽12(例如向下突出的結構)或支架(第一支架16或第二支架18)觸發，此時發光晶粒22a、22b、 22c可脫離彈性圓突26下方，使得發光晶粒22a、22b、22c發射的光線無需穿過彈性圓突26，可減少光線強度衰減。此外，所述開關電路板20的電路泛指複數導線(trace)與複數電路元件(circuit element)(如前述的開關接點202)的聯集，均是發光晶粒22a、22b、22c需要避讓的對象。詳言之，於發光按鍵結構1中，發光晶粒22a、22b、22c相較於電路其他部分更靠近開關接點202；但於實作上，發光晶粒22a、22b、22c亦可能相較於開關接點202更靠近其他部分的電路。 In addition, in the light-emitting key structure 1, the switch contact 202 is generally located in the central area, but the implementation is not limited to this. For example, the switch contact 202 is set off from the central area, and is triggered by the keycap 12 (for example, a downwardly protruding structure) or a bracket (the first bracket 16 or the second bracket 18 ), at this time, the light-emitting die 22a, 22b, The 22c can be separated from the bottom of the elastic round protrusion 26, so that the light emitted by the light-emitting chips 22a, 22b, 22c does not need to pass through the elastic round protrusion 26, which can reduce the attenuation of light intensity. In addition, the circuit of the switch circuit board 20 generally refers to a combination of a plurality of traces and a plurality of circuit elements (such as the aforementioned switch contact 202 ), all of which need to be avoided by the light-emitting die 22a, 22b, and 22c. Object. In detail, in the light-emitting key structure 1, the light-emitting chips 22a, 22b, 22c are closer to the switch contact 202 than other parts of the circuit; but in practice, the light-emitting chips 22a, 22b, 22c may also be relatively The switch contact 202 is closer to other parts of the circuit.

例如，於另一實施例中，如圖8所示(其中開關電路板20的電路的隱藏輪廓以細實線繪示)，發光晶粒22a、22b、22c靠近一導線段204設置。導線段204成直線延伸，發光晶粒22a、22b、22c的排列方向D2'平行於導線段204，發光晶粒22a、22b、22c與導線段204間於一水平方向D3'具有一出光間距d2(亦即發光晶粒22a、22b、22c的出光範圍邊緣於開關電路板20上之投影至導線段204之距離)。於實作上，此出光間距d2亦可設計為介於0.3mm至0.5mm。 For example, in another embodiment, as shown in FIG. 8 (in which the hidden outline of the circuit of the switch circuit board 20 is shown with thin solid lines), the light-emitting dies 22 a , 22 b , 22 c are disposed close to a wire segment 204 . The wire segment 204 extends in a straight line, the arrangement direction D2' of the light-emitting die 22a, 22b, 22c is parallel to the wire segment 204, and the light-emitting die 22a, 22b, 22c and the wire segment 204 have a light-emitting distance d2 in a horizontal direction D3' (that is, the distance from the projection of the edge of the light-emitting range of the light-emitting die 22a, 22b, 22c on the switch circuit board 20 to the wire segment 204). In practice, the light-emitting distance d2 can also be designed to be between 0.3 mm and 0.5 mm.

實作上，開關電路板20也可能視需要設置於底板14下方，此時開關電路板20更靠近最下層的發光晶粒22a、22b、22c而遮蔽更大出光範圍，需要更大幅度的避讓遠離開關電路板20的電路，對於構成電路的電路元件(如開關接點202)或導線(如導線段204)，合適的前述出光間距d1、d2可能會超過上述較高臨界值0.5mm；在一些實作例中，合適的出光間距d1、d2為0.59mm、0.66mm和0.78mm。當開關電路板20的電路遠離發光晶粒22a、22b、22c，例如使用厚度較大之底板14、或因發光按鍵結構1多出其他結構件(如磁吸復位或下沉鍵盤使用的移動板、磁鐵、凸台等等)，合適的出光間距d1、d2可能會低於較低臨界值；例如在某些實作例中，合適的出光間距d1、d2為0.27mm、0.23mm和0.17mm。因此，就不同機種的實驗數據，出光間距d1、d2較佳為落於0.17mm至0.78mm範圍內。 In practice, the switch circuit board 20 may also be disposed under the bottom plate 14 as required. At this time, the switch circuit board 20 is closer to the bottom light-emitting die 22a, 22b, and 22c to shield a larger light-emitting range, requiring greater avoidance. For circuits away from the switch circuit board 20, for circuit elements (such as switch contacts 202) or wires (such as wire segments 204) constituting the circuit, the appropriate light-emitting distances d1 and d2 may exceed the above-mentioned higher critical value by 0.5 mm; In some practical examples, suitable light-emitting distances d1 and d2 are 0.59 mm, 0.66 mm and 0.78 mm. When the circuit of the switch circuit board 20 is far away from the light-emitting die 22a, 22b, 22c, for example, a base plate 14 with a thicker thickness is used, or the light-emitting key structure 1 has additional structural components (such as a magnetic reset or a mobile board used for a sinking keyboard). , magnets, bosses, etc.), the suitable light-emitting distances d1 and d2 may be lower than the lower critical value; for example, in some embodiments, the suitable light-emitting distances d1 and d2 are 0.27mm, 0.23mm and 0.17mm. Therefore, according to the experimental data of different models, the light-emitting distances d1 and d2 are preferably within the range of 0.17mm to 0.78mm.

再者，開關接點202可能分別印刷在開關電路板20的上層和下層透明薄片上，並且上層和下層的開關接點202可能具有不同圖案與外徑，發光晶粒 22a、22b、22c通常需要避讓開關電路板20的上層和下層開關接點202的最外側邊緣，也就是前述出光間距d1須以上層和下層開關接點202的整體外輪廓為基準。 Furthermore, the switch contacts 202 may be printed on the upper and lower transparent sheets of the switch circuit board 20, respectively, and the switch contacts 202 of the upper and lower layers may have different patterns and outer diameters, and the light-emitting die 22a, 22b, and 22c usually need to avoid the outermost edges of the upper and lower switch contacts 202 of the switch circuit board 20, that is, the aforementioned light exit distance d1 must be based on the overall outline of the upper and lower switch contacts 202.

此外，請亦參閱圖9。於此例中，開關電路板20具有一貫穿孔206，發光晶粒22a、22b、22c正對底板14之通孔142'且正對貫穿孔206設置，使得發光晶粒22a、22b、22c向上發射之光線能穿過通孔142'及貫穿孔206以照射鍵帽12，此可消除光線穿過開關電路板20實體結構而產生的強度衰減。於圖4所示之配置中，若結構設計允許，開關電路板20亦可於靠近開關接點202處形成正對發光晶粒22a、22b、22c的貫穿孔，以減少光線強度衰減。 Also, please refer to Figure 9. In this example, the switch circuit board 20 has a through hole 206, and the light emitting chips 22a, 22b, 22c are disposed facing the through hole 142' of the bottom plate 14 and facing the through hole 206, so that the light emitting chips 22a, 22b, 22c emit upwardly The light can pass through the through hole 142 ′ and the through hole 206 to illuminate the keycap 12 , which can eliminate the intensity attenuation caused by the light passing through the physical structure of the switch circuit board 20 . In the configuration shown in FIG. 4 , if the structural design allows, the switch circuit board 20 can also form through holes facing the light-emitting chips 22 a , 22 b , 22 c near the switch contact 202 to reduce light intensity attenuation.

另外，於本實施例中，用於提供鍵帽12背光的所有發光晶粒22a、22b、22c呈平行於平邊202a之直線排列，但實作上不以此為限。例如發光晶粒22a、22b、22c以其他排列方式(例如弧形、陣列)排列，其中最靠近開關接點202的發光晶粒22a、22b或22c與開關接點202間於水平方向D3上之距離即定義為出光間距。同理，開關接點202靠近發光晶粒22a、22b、22c的輪廓亦不以直線為限，靠近發光晶粒22a、22b、22c的導線段204亦不以直線延伸為限。發光晶粒22a、22b、22c能越靠近電路設置，越能增加發光晶粒22a、22b、22c可設置的範圍，亦即能增加可透光指示區域12a的設計彈性。 In addition, in this embodiment, all the light-emitting chips 22a, 22b, 22c for providing the backlight of the keycap 12 are arranged in a straight line parallel to the flat edge 202a, but the practice is not limited to this. For example, the light-emitting die 22a, 22b, and 22c are arranged in other arrangements (eg, arc, array), wherein the light-emitting die 22a, 22b or 22c closest to the switch contact 202 and the switch contact 202 are in the horizontal direction D3. The distance is defined as the light exit spacing. Similarly, the contour of the switch contact 202 close to the light-emitting die 22a, 22b, 22c is not limited to a straight line, nor is the wire segment 204 close to the light-emitting die 22a, 22b, 22c limited to a straight line. The closer the light-emitting chips 22a, 22b, and 22c can be disposed to the circuit, the more the range in which the light-emitting chips 22a, 22b, and 22c can be disposed can be increased, that is, the design flexibility of the transparent indicating area 12a can be increased.

請參閱圖10及圖11，顯示根據另一實施例之一發光按鍵結構3，其與發光按鍵結構1結構相似，發光按鍵結構3原則上沿用發光按鍵結構1之元件符號。關於發光按鍵結構3之其他說明，請參閱前文發光按鍵結構1中相同命名構件及其變化例之相關說明。於發光按鍵結構3中，第一支架16及第二支架18相對設置且可透光，並共同連接於鍵帽12底側及底板14頂側。 10 and FIG. 11 , a light-emitting key structure 3 according to another embodiment is shown, which is similar in structure to the light-emitting key structure 1 . The light-emitting key structure 3 uses the component symbols of the light-emitting key structure 1 in principle. For other descriptions of the light-emitting key structure 3, please refer to the related descriptions of the same named components and their modifications in the light-emitting key structure 1 above. In the light-emitting key structure 3 , the first bracket 16 and the second bracket 18 are disposed opposite to each other and can transmit light, and are jointly connected to the bottom side of the keycap 12 and the top side of the bottom plate 14 .

鍵帽12未被按壓時，可透光的第一支架16及第二支架18是伸展狀態下的X型剪刀腳支撐架(如圖10所示或參閱圖3)。換言之，位於底板14下方的發光晶粒22a、22b、22c所發出光線，距離第一支架16及第二支架18的傾斜上半段和 傾斜下半段、以及上端、下端等不同部位的不同表面，有著不同的傳遞路徑與入射/反射/折射角度。若將單色光源放置於第一支架16及第二支架18的間隙投影G範圍(以虛線影線表示於圖11中)內，會使得光線經由第一支架16及第二支架18的不同部位，直接或間接向鍵帽12傳遞照射，最終造成嚴重的光照不均問題。 如將多色光源如發光晶粒22a、22b、22c放置於間隙投影G範圍內，則會因為混光不均，而在鍵帽12上的不同位置產生顏色偏差問題。 When the keycap 12 is not pressed, the light-transmitting first bracket 16 and the second bracket 18 are X-shaped scissor leg supports in an extended state (as shown in FIG. 10 or refer to FIG. 3 ). In other words, the light emitted from the light-emitting die 22a, 22b, 22c located under the bottom plate 14 is far from the inclined upper half of the first bracket 16 and the second bracket 18 and Different surfaces in different parts of the inclined lower half, as well as the upper and lower ends have different transmission paths and angles of incidence/reflection/refraction. If the monochromatic light source is placed within the projection G range of the gap between the first bracket 16 and the second bracket 18 (represented by dashed hatching in FIG. 11 ), the light will pass through different parts of the first bracket 16 and the second bracket 18 , directly or indirectly transmits the illumination to the keycap 12 , which eventually causes a serious problem of uneven illumination. If the multi-color light sources such as the light-emitting die 22a, 22b, 22c are placed within the range of the gap projection G, uneven light mixing will cause color deviation at different positions on the keycap 12.

因此，於本實施例中，用於提供背光的所有發光晶粒22a、22b、22c(於圖11中，其隱藏的輪廓以粗實線繪示)均設置於第一支架16之下方(即發光晶粒22a、22b、22c均位於第一支架16於垂直方向D1之投影範圍內)且正對底板14之通孔144位於底板下方。發光晶粒22a、22b、22c發射的光線穿過通孔144及第一支架16以照射鍵帽12。由於發光晶粒22a、22b、22c發射的光線穿過同一支架，故原則上光線受到十分相近的影響(例如強度衰減、進行路徑發散或偏移等)，進而能抑制該光線穿過結構件後可能產生色偏的程度。又，於本實施例中，發光晶粒22a、22b、22c發射的光線是自第一支架16之一下表面162進入第一支架16，並自第一支架16之一上表面164射出第一支架16，下表面162與上表面164平行，此結構配置亦有助於抑制該光線穿過結構件後可能產生色偏的程度。同理，於實作上，發光晶粒22a、22b、22c亦可改設置第二支架18下方，如圖11中虛線所示。如此一來，只要第一支架16及第二支架18的間隙投影G(也就是第一支架16及第二支架18的間隙區在垂直方向的投影區域)，並不與發光晶粒22a、22b、22c重疊，即能避免產生前述色偏問題。前述第一支架16及第二支架18的間隙投影G與發光晶粒22a、22b、22c重疊的情況，除了意指間隙投影G直接重疊通過任一顆發光晶粒22a、22b、22c本身，也涵蓋間隙投影G通過任兩顆相鄰發光晶粒22a/22b、22b/22c之間的空隙。 Therefore, in this embodiment, all the light-emitting dies 22a, 22b, 22c for providing backlight (in FIG. 11, the hidden outlines thereof are shown with thick solid lines) are disposed below the first bracket 16 (ie, The light-emitting chips 22a, 22b, and 22c are all located within the projection range of the first bracket 16 in the vertical direction D1), and the through holes 144 facing the bottom plate 14 are located below the bottom plate. The light emitted by the light-emitting die 22 a , 22 b , and 22 c passes through the through hole 144 and the first bracket 16 to illuminate the keycap 12 . Since the light emitted by the light-emitting die 22a, 22b, and 22c passes through the same bracket, in principle, the light is affected by very similar effects (such as intensity attenuation, path divergence or deviation, etc.), which can prevent the light from passing through the structural member. The degree of color cast that may occur. In addition, in this embodiment, the light emitted by the light-emitting chips 22a, 22b, 22c enters the first bracket 16 from a lower surface 162 of the first bracket 16, and exits the first bracket from an upper surface 164 of the first bracket 16 16. The lower surface 162 is parallel to the upper surface 164. This structure configuration also helps to restrain the degree of color shift that may occur after the light passes through the structure. Similarly, in practice, the light-emitting chips 22a, 22b, and 22c can also be disposed below the second bracket 18, as shown by the dotted line in FIG. 11 . In this way, as long as the projection G of the gap between the first bracket 16 and the second bracket 18 (that is, the projection area of the gap area between the first bracket 16 and the second bracket 18 in the vertical direction) is not related to the light-emitting die 22a, 22b , 22c overlap, which can avoid the aforementioned color shift problem. The above-mentioned case where the gap projection G of the first bracket 16 and the second bracket 18 overlaps with the light-emitting die 22a, 22b, and 22c means that the gap projection G directly overlaps any one of the light-emitting die 22a, 22b, and 22c. The coverage gap projection G passes through the gap between any two adjacent light-emitting die 22a/22b, 22b/22c.

此外，請亦參閱圖12。於本實施例中，底板14於一水平方向D3"上具 有最靠近發光晶粒22a、22b、22c之一外板緣146，發光晶粒22a、22b、22c與外板緣146間於水平方向D3"上具有一出光間距d3。原則上，發光晶粒22a、22b、22c離外板緣146越遠底板14越能抑制發光晶粒22a、22b、22c發射的光線自外板緣146逸出的情形；於實作上，數個機種的合適出光間距為4.8mm,5.3mm,6.2mm,7.1mm,7.8mm，此出光間距d3較佳為介於4.8至7.7mm。此外，於本實施例中，發光晶粒22a、22b、22c的排列方向D2"平行於外板緣146，但實作上不以此為限。 Also, please refer to Figure 12. In this embodiment, the bottom plate 14 is provided on a horizontal direction D3". There is an outer plate edge 146 closest to the light-emitting die 22a, 22b, 22c, and the light-emitting die 22a, 22b, 22c and the outer plate edge 146 have a light-emitting distance d3 in the horizontal direction D3". In principle, the light-emitting die The farther the 22a, 22b, and 22c are from the outer plate edge 146, the more the bottom plate 14 can prevent the light emitted by the light-emitting die 22a, 22b, 22c from escaping from the outer plate edge 146; It is 4.8mm, 5.3mm, 6.2mm, 7.1mm, 7.8mm, and the light-emitting distance d3 is preferably between 4.8 and 7.7mm. In addition, in this embodiment, the arrangement direction D2 of the light-emitting die 22a, 22b, 22c "Parallel to the outer plate edge 146, but not limited to this in practice.

此外，請亦參閱圖13，其中發光晶粒22a、22b、22c的隱藏輪廓以細實線繪示。一般而言，單色光源的排列方向並不需要考量鍵帽12的可透光指示區域12a'的長度方向12b'。不過在多色光源的情況，如以發光晶粒22a、22b、22c三色混光成各種需要呈現的顏色時，若發光晶粒22a、22b、22c的排列方向D2"平行鍵帽12的可透光指示區域12a'的長度方向12b'，外側的兩顆發光晶粒22a、22c在鄰近的字符區段提供的光量最充足，但遠離發光晶粒22a、22c的字符區段即有光量不足問題，造成可透光指示區域12a'在長度方向12b'上兩末梢區段產生色偏問題。 In addition, please also refer to FIG. 13, wherein the hidden outlines of the light-emitting chips 22a, 22b, 22c are shown with thin solid lines. Generally speaking, the arrangement direction of the monochromatic light sources does not need to consider the length direction 12b' of the light-permeable indicating area 12a' of the keycap 12. However, in the case of a multi-color light source, for example, when the three colors of the light-emitting chips 22a, 22b, and 22c are mixed into various colors to be displayed, if the arrangement direction of the light-emitting chips 22a, 22b, and 22c is parallel to the keycap 12, it is possible to In the length direction 12b' of the light-transmitting indication area 12a', the two outer light-emitting dies 22a, 22c provide the most sufficient light in the adjacent character section, but the character section far from the light-emitting dies 22a, 22c has insufficient light. The problem is that the color shift problem occurs in the two distal sections of the light permeable indicating area 12a' in the longitudinal direction 12b'.

於本實施例中，鍵帽12位於發光晶粒22a、22b、22c上方的可透光指示區域12a'的長度方向12b'與排列方向D2"垂直，故可減少或消除發光晶粒22a、22b、22c因間隔排列而產生混光不均的現象對可透光指示區域12a'的影響。另外，關於發光晶粒22a、22b、22c與可透光指示區域12a'相對位置關係之其他說明，可參閱前文發光晶粒22a、22b、22c與可透光指示區域12a相對位置關係及其變化例之相關說明，不另贅述。 In this embodiment, the length direction 12b' of the light-transmitting indicating area 12a' of the keycap 12 located above the light-emitting chips 22a, 22b, 22c is perpendicular to the arrangement direction D2", so the light-emitting chips 22a, 22b can be reduced or eliminated. , 22c due to the spaced arrangement and the phenomenon of uneven light mixing on the permeable indicator area 12a'. In addition, regarding the other descriptions of the relative positional relationship between the light-emitting crystal grains 22a, 22b, 22c and the permeable indicator area 12a', Please refer to the above description of the relative positional relationship between the light-emitting die 22a, 22b, and 22c and the light-transmitting indicator region 12a and their modification examples, which will not be repeated.

另外，於發光按鍵結構中，實作上亦可經修改以將發光晶粒22a、22b、22c設置於底板14上方，可避免底板14對發光晶粒22a、22b、22c發射的光線的干擾。此時，底板14無需對應發光晶粒22a、22b、22c形成通孔，有益於底板14強度。又，發光晶粒22a、22b、22c可整合至開關電路板20的電路中，例如 發光晶粒22a、22b、22c直接設置於開關電路板20中下層透明薄片上，由其上的電路提供電力，中間及上層透明薄片對應形成開口，以使發光晶粒22a、22b、22c露出，此結構配置可排除開關電路板20對發光晶粒22a、22b、22c發射的光線的干擾。 In addition, in the light-emitting key structure, the light-emitting die 22a, 22b, 22c can also be modified in practice to dispose the light-emitting die 22a, 22b, 22c above the bottom plate 14, which can avoid the interference of the bottom plate 14 to the light emitted by the light-emitting die 22a, 22b, 22c. At this time, the base plate 14 does not need to form through holes corresponding to the light-emitting die 22 a , 22 b , 22 c , which is beneficial to the strength of the base plate 14 . In addition, the light-emitting chips 22a, 22b, 22c can be integrated into the circuit of the switch circuit board 20, for example The light-emitting crystal grains 22a, 22b, and 22c are directly disposed on the lower-layer transparent sheet of the switch circuit board 20, and electric power is provided by the circuit thereon. The middle and upper-layer transparent sheets are correspondingly formed with openings to expose the light-emitting crystal grains 22a, 22b, and 22c. This structural configuration can eliminate the interference of the switch circuit board 20 to the light emitted by the light-emitting die 22a, 22b, 22c.

此外，於發光按鍵結構1、3中，第一及第二支架16、18以其中間部位相互樞接而形成X型剪刀腳支撐架，但實作上不以此為限。例如，第一及第二支架16、18可改以其一端部相互樞接、或以端部直接連接在底板14上而形成V型蝴蝶腳支架或倒V型蝙蝠支架。又例如，第一及第二支架16、18可改以相對且分隔設置，另以一連動支架以連動第一及第二支架16、18。又，發光按鍵結構1、3以彈性圓突26作為回復力機制，但實作上不以此為限，例如改以彈簧、磁吸機構實現回復力機制。 In addition, in the light-emitting key structures 1 and 3 , the first and second brackets 16 and 18 are pivotally connected to each other at their middle parts to form an X-shaped scissor leg support bracket, but the practice is not limited to this. For example, the first and second brackets 16 and 18 can be pivoted to each other at one end or directly connected to the bottom plate 14 to form a V-shaped butterfly foot bracket or an inverted V-shaped bat bracket. For another example, the first and second brackets 16 and 18 can be changed to be opposite and separated from each other, and another linking bracket can be used to link the first and second brackets 16 and 18 . In addition, the light-emitting key structures 1 and 3 use the elastic round protrusions 26 as the restoring force mechanism, but this is not limited in practice. For example, a spring and a magnetic attraction mechanism are used to realize the restoring force mechanism.

此外，前文以發光按鍵結構1、3分別說明發光晶粒22a、22b、22c與開關電路板20的電路及第一、第二支架16、18間之相對位置關係，於其他實施例中，發光按鍵結構亦可能兼具兩種情形。例如開關接點202鄰近或位於第一支架16或第二支架18下方，發光晶粒22a、22b、22c則位於第一支架16或第二支架18下方。又例如，位於第一支架16或第二支架18下方的發光晶粒22a、22b、22c亦鄰近開關電路板20的電路。又，於實際應用中，各實施例中的部分結構特徵亦可能應用至其他實施例中。例如，當位於底板14下方的發光晶粒22a、22b、22c靠近開關電路板20的電路設置時，發光晶粒22a、22b、22c亦可能靠近底板14邊緣，而有前述發光按鍵結構3之適用。 In addition, the light-emitting key structures 1 and 3 are used to illustrate the relative positional relationship between the light-emitting die 22a, 22b, 22c and the circuit of the switch circuit board 20 and the first and second brackets 16 and 18, respectively. In other embodiments, the light-emitting The key structure may also have both cases. For example, the switch contact 202 is adjacent to or located under the first bracket 16 or the second bracket 18 , and the light-emitting chips 22 a , 22 b , and 22 c are located under the first bracket 16 or the second bracket 18 . For another example, the light-emitting chips 22 a , 22 b , 22 c located under the first bracket 16 or the second bracket 18 are also adjacent to the circuit of the switch circuit board 20 . In addition, in practical applications, some structural features in each embodiment may also be applied to other embodiments. For example, when the light-emitting chips 22a, 22b, 22c located under the bottom plate 14 are disposed close to the circuit of the switch circuit board 20, the light-emitting chips 22a, 22b, 22c may also be close to the edge of the bottom plate 14, and the aforementioned light-emitting key structure 3 is applicable .

雖然本發明經由實作數據揭露出光間距d1、d2、d3的前述較佳實作範圍，但實作上利用本發明出光間距d1、d2、d3較佳實作範圍略為犧牲出光效果，仍能達到一定水準的整體光學設計效益，因此利用本發明出光間距d1、d2、d3較佳實作範圍端值加減的15%至20%，仍應屬本發明出光間距d1、d2、d3之涵 蓋範圍。 Although the present invention discloses the above-mentioned preferred implementation ranges of the light spacings d1, d2, and d3 through practical data, in practice, the preferred implementation ranges of the light extraction distances d1, d2, and d3 of the present invention slightly sacrifice the light extraction effect, and can still achieve The overall optical design benefit of a certain level, so the use of the light-emitting distances d1, d2, d3 of the present invention is preferably 15% to 20% of the end value of the implementation range, which should still belong to the light-emitting distances d1, d2, d3 of the present invention. cover range.

以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。 The above descriptions are only preferred embodiments of the present invention, and all equivalent changes and modifications made according to the scope of the patent application of the present invention shall fall within the scope of the present invention.

1:發光按鍵結構 1: Light-emitting key structure

12:鍵帽 12: Keycaps

12a:可透光指示區域 12a: Transmissive indicator area

12b:長度方向 12b: Length direction

14:底板 14: Bottom plate

142,142':通孔 142, 142': through hole

16:第一支架 16: The first bracket

18:第二支架 18: Second bracket

20:開關電路板 20: Switch circuit board

202:開關接點 202: switch contacts

204:導線段 204: Wire segment

206:貫穿孔 206: Through hole

22a,22b,22c:發光晶粒 22a, 22b, 22c: luminescent grains

24:光源電路板 24: Light source circuit board

26:彈性圓突 26: Elastic dome

D2:排列方向 D2: Arrangement direction

Claims (11)

一種發光按鍵結構，包含：一鍵帽，沿一垂直方向可移動地設置；一開關電路板，設置於該鍵帽下方且包含一電路；以及至少一發光晶粒，設置於該開關電路板下方，該電路未遮蔽該至少一發光晶粒，該至少一發光晶粒向上發射之光線穿過該開關電路板以照射該鍵帽，該至少一發光晶粒與該電路間於一水平方向上具有一出光間距，介於0.17mm至0.78mm。 A light-emitting key structure, comprising: a key cap, which is movably arranged along a vertical direction; a switch circuit board, which is arranged under the key cap and includes a circuit; and at least one light-emitting die, which is arranged under the switch circuit board , the circuit does not shield the at least one light-emitting chip, the light emitted by the at least one light-emitting chip upward passes through the switch circuit board to illuminate the keycap, and there is a horizontal direction between the at least one light-emitting chip and the circuit. A light output spacing, between 0.17mm to 0.78mm. 如請求項1所述之發光按鍵結構，其中該電路包含一開關接點，該開關接點具有一非圓形輪廓，該非圓形輪廓具有一平邊，該出光間距為該至少一發光晶粒於該開關電路板上之投影至該平邊之距離。 The light-emitting key structure of claim 1, wherein the circuit comprises a switch contact, the switch contact has a non-circular outline, the non-circular outline has a flat edge, and the light-emitting distance is the distance between the at least one light-emitting die The distance from the projection on the switch circuit board to the flat edge. 如請求項2所述之發光按鍵結構，其中該非圓形輪廓為一切平圓形輪廓並具有一圓心及一半徑，該圓心至該平邊之距離對該半徑之比大於0.5。 The light-emitting key structure of claim 2, wherein the non-circular outline is a flat circular outline with a center and a radius, and the ratio of the distance from the center to the flat side to the radius is greater than 0.5. 如請求項2所述之發光按鍵結構，其中該至少一發光晶粒數量為複數個且沿一排列方向排列，該排列方向平行於該平邊。 The light-emitting key structure of claim 2, wherein the at least one light-emitting die is plural in number and arranged along an arrangement direction, and the arrangement direction is parallel to the flat side. 如請求項1所述之發光按鍵結構，其中該電路包含一開關接點，該開關接點包含一外圍部及位於該外環部內側之一中心部及至少一連接部，該至少一連接部連接該外圍部及該中心部，該出光間距為該至少一發光晶粒於該開關電路板上之投影至該中心部之距離。 The light-emitting key structure of claim 1, wherein the circuit includes a switch contact, the switch contact includes a peripheral portion, a central portion located inside the outer ring portion, and at least one connecting portion, the at least one connecting portion The peripheral portion and the central portion are connected, and the light-emitting distance is the distance from the projection of the at least one light-emitting die on the switch circuit board to the central portion. 如請求項5所述之發光按鍵結構，其中該外圍部沿一圓形路徑或一凸多邊形路徑不完整延伸，該圓形路徑或該多邊形路徑通過該少一發光晶粒。 The light-emitting key structure as claimed in claim 5, wherein the peripheral portion extends incompletely along a circular path or a convex polygonal path, and the circular path or the polygonal path passes through the at least one light-emitting die. 如請求項6所述之發光按鍵結構，其中該中心部具有一圓形輪廓或一凸多邊形輪廓。 The light-emitting key structure of claim 6, wherein the central portion has a circular outline or a convex polygon outline. 如請求項2或5所述之發光按鍵結構，更包含一可透光的彈性圓突， 設置於該開關電路板上並於該垂直方向上遮蓋住該開關接點及該至少一發光晶粒。 The light-emitting key structure according to claim 2 or 5 further comprises a light-transmitting elastic round protrusion, It is arranged on the switch circuit board and covers the switch contact and the at least one light-emitting chip in the vertical direction. 如請求項1所述之發光按鍵結構，其中該電路包含一導線段，該出光間距為該至少一發光晶粒於該開關電路板上之投影至該導線段之距離。 The light-emitting key structure of claim 1, wherein the circuit comprises a wire segment, and the light-emitting distance is a distance from the projection of the at least one light-emitting die on the switch circuit board to the wire segment. 如請求項9所述之發光按鍵結構，其中該導線段成直線延伸，該至少一發光晶粒數量為複數個且沿一排列方向排列，該排列方向平行於該導線段。 The light-emitting key structure of claim 9, wherein the wire segment extends in a straight line, and the at least one light-emitting die is plural in number and arranged in an arrangement direction parallel to the wire segment. 如請求項9所述之發光按鍵結構，其中該開關電路板具有一貫穿孔，正對該至少一發光晶粒，該至少一發光晶粒向上發射之光線穿過該貫穿孔以照射該鍵帽。 The light-emitting key structure of claim 9, wherein the switch circuit board has a through hole facing the at least one light-emitting die, and the light emitted upward from the at least one light-emitting die passes through the through hole to illuminate the keycap.

Images