TWI755754B - Antenna module - Google Patents

Antenna module Download PDF

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TWI755754B
TWI755754B TW109119894A TW109119894A TWI755754B TW I755754 B TWI755754 B TW I755754B TW 109119894 A TW109119894 A TW 109119894A TW 109119894 A TW109119894 A TW 109119894A TW I755754 B TWI755754 B TW I755754B
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frequency
grounding
radiator
antenna module
coupling portion
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TW109119894A
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TW202147689A (en
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利致誠
丁嗣翰
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英業達股份有限公司
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Abstract

An antenna module includes a grounding plane, a first high-frequency radiator, a second high-frequency radiator, and a low-frequency grounding member. The first high-frequency radiator includes a first feeding portion, a first grounding portion, and a first radiation portion, and the first grounding portion is coupled to the grounding plane. The second high-frequency radiator includes a second feeding portion, a second grounding portion, and a second radiation portion, and the second grounding portion is coupled to the grounding plane. The low-frequency grounding member is located between the first high-frequency radiator and the second high-frequency radiator. The low-frequency grounding member includes a third grounding portion, a first coupling portion, and a second coupling portion, and the third grounding portion is coupled to the grounding plane. The low-frequency grounding member extends from the third grounding portion and simultaneously extends in the first direction and the second direction of the first axis to form the first coupling portion and the second coupling portion in which the first axis is parallel to the grounding plane.

Description

天線模組Antenna module

本發明有關於一種天線模組，特別涉及一種雙天線模組。The present invention relates to an antenna module, in particular to a dual-antenna module.

習知天線模組的輻射體容易受到周遭導體結構的影響，進而影響天線模組的操作頻帶，造成天線模組的設計上必須避免周圍有導體結構出現。The radiator of the conventional antenna module is easily affected by the surrounding conductor structure, which in turn affects the operating frequency band of the antenna module, so that the design of the antenna module must avoid surrounding conductor structures.

為了避免導體結構配置在天線模組周圍，搭配天線模組使用的電子裝置在材料的選擇上有所限制，例如智能手機或平板電腦不能使用金屬殼體，以避免影響天線模組的操作頻帶。In order to avoid the conductor structure being arranged around the antenna module, the selection of materials for electronic devices used with the antenna module is limited. For example, a smart phone or a tablet computer cannot use a metal casing to avoid affecting the operating frequency band of the antenna module.

因此，如何發展出一種新的天線模組，降低導體結構對天線模組的影響，讓所搭載電子裝置的材料有更多的選擇，遂成為各界進一步要探討的主題。Therefore, how to develop a new antenna module, reduce the influence of the conductor structure on the antenna module, and provide more choices of materials for the mounted electronic device has become a topic for further discussion in all walks of life.

有鑑於此，本發明之一目的在於提出一種可有解決上述問題的天線模組，其包含接地面、第一高頻輻射體、第二高頻輻射體及低頻接地構件。接地面具有接地功能。第一高頻輻射體包含第一饋入部、第一接地部及第一輻射部，第一接地部耦接接地面。第二高頻輻射體包含第二饋入部、第二接地部及第二輻射部，第二接地部耦接接地面。低頻接地構件位於第一高頻輻射體及第二高頻輻射體之間，低頻接地構件包含第三接地部、第一耦合部及第二耦合部，第三接地部耦接接地面，而低頻接地構件從三接地部延伸而出，並同時往第一軸向上的第一方向及第二方向延伸形成第一耦合部及第二耦合部，其中第一軸向平行於接地面，而第一方向為第二方向的相反方向，第一輻射部往第一方向延伸並與第一耦合部輻射耦合，第二輻射部往第二方向延伸並與第二耦合部輻射耦合，且第一輻射部及第二輻射部分別位於第一耦合部及第二耦合部在第二軸向上朝向第三接地部的一側，其中第二軸向垂直於第一軸向並平行於接地面。In view of this, one objective of the present invention is to provide an antenna module capable of solving the above problems, which includes a ground plane, a first high-frequency radiator, a second high-frequency radiator, and a low-frequency grounding member. The ground plane has a grounding function. The first high-frequency radiator includes a first feeding part, a first grounding part and a first radiating part, and the first grounding part is coupled to the ground plane. The second high-frequency radiator includes a second feeding portion, a second ground portion, and a second radiation portion, and the second ground portion is coupled to the ground plane. The low-frequency grounding member is located between the first high-frequency radiator and the second high-frequency radiator, the low-frequency grounding member includes a third grounding portion, a first coupling portion and a second coupling portion, the third grounding portion is coupled to the ground plane, and the low-frequency grounding member The grounding member extends from the three grounding portions, and simultaneously extends in the first direction and the second direction on the first axis to form a first coupling portion and a second coupling portion, wherein the first axis is parallel to the ground plane, and the first axis is parallel to the ground plane. The direction is the opposite direction of the second direction, the first radiating portion extends in the first direction and is radiatively coupled with the first coupling portion, the second radiating portion extends in the second direction and is radiatively coupled with the second coupling portion, and the first radiating portion and the second radiating part are respectively located on the side of the first coupling part and the second coupling part facing the third grounding part in the second axial direction, wherein the second axial direction is perpendicular to the first axial direction and parallel to the grounding plane.

在本發明的一個或多個實施方式中，第一高頻輻射體、第二高頻輻射體及低頻接地構件經由彎折而朝第二軸向上的第三方向上延伸。In one or more embodiments of the present invention, the first high-frequency radiator, the second high-frequency radiator, and the low-frequency grounding member extend toward a third direction on the second axis through bending.

在本發明的一個或多個實施方式中，第一接地部、第二接地部及三接地部在第一軸向上排成一列。In one or more embodiments of the present invention, the first ground portion, the second ground portion, and the three ground portions are arranged in a row in the first axial direction.

在本發明的一個或多個實施方式中，第一輻射部、第二輻射部、第一耦合部以及第二耦合部的頂面形成共平面。In one or more embodiments of the present invention, top surfaces of the first radiation part, the second radiation part, the first coupling part, and the second coupling part form a coplanar surface.

在本發明的一個或多個實施方式中，其中低頻接地構件包含電容單元位於第一耦合部、第二耦合部及第三接地部之間。In one or more embodiments of the present invention, the low-frequency grounding member includes a capacitor unit located between the first coupling portion, the second coupling portion, and the third grounding portion.

在本發明的一個或多個實施方式中，電容單元為晶片電容、分部電容或集總電容。In one or more embodiments of the present invention, the capacitor unit is a chip capacitor, a partial capacitor or a lumped capacitor.

在本發明的一個或多個實施方式中，第一輻射部及第一耦合部以小於或等於0.5 mm的距離間隔配置，第二輻射部及第二耦合部以小於或等於0.5 mm的距離間隔配置。In one or more embodiments of the present invention, the first radiation part and the first coupling part are arranged at a distance of less than or equal to 0.5 mm, and the second radiation part and the second coupling part are arranged at a distance of less than or equal to 0.5 mm configuration.

在本發明的一個或多個實施方式中，天線模組更包含金屬殼體，其中第一高頻輻射體、第二高頻輻射體及低頻接地構件位於金屬殼體的內部。In one or more embodiments of the present invention, the antenna module further includes a metal casing, wherein the first high-frequency radiator, the second high-frequency radiator and the low-frequency grounding member are located inside the metal casing.

在本發明的一個或多個實施方式中，天線模組的金屬殼體包含開口，接地面、第一高頻輻射體、第二高頻輻射體及低頻接地構件位於開口與接地面之間。In one or more embodiments of the present invention, the metal casing of the antenna module includes an opening, and the ground plane, the first high frequency radiator, the second high frequency radiator and the low frequency ground member are located between the opening and the ground plane.

在本發明的一個或多個實施方式中，天線模組更包含絕緣蓋體覆蓋金屬殼體的開口。In one or more embodiments of the present invention, the antenna module further includes an insulating cover covering the opening of the metal casing.

綜上所述，本發明所提供的天線模組的低頻接地構件輻射耦合第一高頻輻射體及第二高頻輻射體並配置於兩者之間，利用低頻接地構件與第一高頻輻射體及第二高頻輻射體的相對配置關係，讓第一高頻輻射體及第二高頻輻射體不容易受到導體結構的影響，因此能在天線模組的第一高頻輻射體及第二高頻輻射體周遭配置金屬殼體或其他導電結構，使得天線模組能適用在具有金屬殼體的智慧型手機、平板電腦或筆記型電腦。To sum up, the low-frequency grounding member of the antenna module provided by the present invention is radiatively coupled to the first high-frequency radiator and the second high-frequency radiator and is arranged between the two, using the low-frequency grounding member and the first high-frequency radiation The relative arrangement relationship between the body and the second high frequency radiator makes the first high frequency radiator and the second high frequency radiator not easily affected by the conductor structure, so the first high frequency radiator and the second high frequency radiator of the antenna module can Metal shells or other conductive structures are arranged around the two high-frequency radiators, so that the antenna module can be applied to smart phones, tablet computers or notebook computers with metal shells.

請參閱第1圖，第1圖繪示為電子裝置10的立體示意圖，且電子裝置10搭載有天線模組100，其中電子裝置10可以為智慧型手機、平板電腦，但本發明不以此為限。Please refer to FIG. 1. FIG. 1 is a three-dimensional schematic diagram of an electronic device 10, and the electronic device 10 is equipped with an antenna module 100, wherein the electronic device 10 can be a smart phone or a tablet computer, but the present invention does not take this as an example. limit.

請參閱第2圖，第2圖繪示為天線模組100的立體示意圖。於本發明的一個實施方式中，天線模組100包含接地面110、第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170。接地面110具有接地功能，且接地面110可例如是電子裝置10內部的電路板或接地導體的一平面，但本發明不以此為限。Please refer to FIG. 2 , which is a three-dimensional schematic diagram of the antenna module 100 . In one embodiment of the present invention, the antenna module 100 includes a ground plane 110 , a first high-frequency radiator 130 , a second high-frequency radiator 150 and a low-frequency grounding member 170 . The ground plane 110 has a grounding function, and the ground plane 110 may be, for example, a plane of a circuit board or a ground conductor inside the electronic device 10 , but the invention is not limited thereto.

第一高頻輻射體130包含第一饋入部131、第一接地部133及第一輻射部135。第一饋入部131用以饋入電流，且第一接地部133耦接接地面110。第二高頻輻射體150包含第二饋入部151、第二接地部153及第二輻射部155。第二饋入部151用以饋入電流，且第二接地部153耦接接地面110。低頻接地構件170位於第一高頻輻射體130及第二高頻輻射體150之間。低頻接地構件170包含第三接地部171、第一耦合部173及第二耦合部175。第三接地部171耦接接地面110，而低頻接地構件170從第三接地部171延伸而出，低頻接地構件170並同時往第一軸向A上的第一方向A 1及第二方向A 2延伸分別形成第一耦合部173及第二耦合部175。其中第一軸向A平行於接地面110，第一方向A 1為第二方向A 2的相反方向。第一輻射部135往第一方向A 1延伸並與第一耦合部173輻射耦合，第二輻射部155往第二方向A 2延伸並與第二耦合部175輻射耦合。此外，第一輻射部135及第二輻射部155分別位於第一耦合部173及第二耦合部175在第二軸向B上朝向第三接地部171的一側，其中第二軸向B垂直於第一軸向A並平行於接地面110。 The first high frequency radiator 130 includes a first feeding part 131 , a first grounding part 133 and a first radiating part 135 . The first feeding portion 131 is used for feeding current, and the first grounding portion 133 is coupled to the ground plane 110 . The second high frequency radiator 150 includes a second feeding part 151 , a second grounding part 153 and a second radiating part 155 . The second feeding portion 151 is used for feeding current, and the second grounding portion 153 is coupled to the ground plane 110 . The low frequency ground member 170 is located between the first high frequency radiator 130 and the second high frequency radiator 150 . The low-frequency grounding member 170 includes a third grounding portion 171 , a first coupling portion 173 and a second coupling portion 175 . The third grounding portion 171 is coupled to the grounding plane 110, and the low-frequency grounding member 170 extends from the third grounding portion 171. The low-frequency grounding member 170 is simultaneously directed toward the first direction A1 and the second direction A on the first axis A. 2 extend to form a first coupling portion 173 and a second coupling portion 175, respectively. The first axis A is parallel to the ground plane 110 , and the first direction A 1 is the opposite direction of the second direction A 2 . The first radiating portion 135 extends in the first direction A 1 and is radiatively coupled with the first coupling portion 173 , and the second radiating portion 155 extends in the second direction A 2 and is radiatively coupled with the second coupling portion 175 . In addition, the first radiating part 135 and the second radiating part 155 are respectively located on the side of the first coupling part 173 and the second coupling part 175 facing the third grounding part 171 in the second axial direction B, wherein the second axial direction B is vertical in the first axis A and parallel to the ground plane 110 .

本發明的「輻射耦合」是指，當輻射部接近其他物體(通常為導體)時，產生一條由饋入訊號處至耦合點並至接地處的訊號路徑。The "radiation coupling" of the present invention means that when the radiating part is close to other objects (usually conductors), a signal path is generated from the feed signal to the coupling point and to the ground.

具體而言，第一高頻輻射體130及第二高頻輻射體150為共振頻率約5 GHz的平面式倒F型單極天線(monopole antenna)。低頻接地構件170為共振頻率約2.4 GHz的迴圈天線(loop antenna)。基於低頻接地構件170與第一高頻輻射體130及第二高頻輻射體150之間的配置關係，能降低第一高頻輻射體130及第二高頻輻射體150受到附近導體結構的影響，使得天線模組100附近配置有導體結構，且仍能保持良好的操作頻帶。Specifically, the first high-frequency radiator 130 and the second high-frequency radiator 150 are planar inverted-F monopole antennas with a resonance frequency of about 5 GHz. The low frequency ground member 170 is a loop antenna with a resonance frequency of about 2.4 GHz. Based on the arrangement relationship between the low-frequency grounding member 170 and the first high-frequency radiator 130 and the second high-frequency radiator 150 , the influence of the first high-frequency radiator 130 and the second high-frequency radiator 150 on the nearby conductor structures can be reduced. , so that a conductor structure is arranged near the antenna module 100, and a good operating frequency band can still be maintained.

第3圖及第4圖分別繪示為第2圖中天線模組100的前視圖及上視圖。於本發明的一些實施方式中，第一高頻輻射體130從第一饋入部131及第一接地部133延伸而出，且第一高頻輻射體130經彎折後朝第一方向A 1及第三方向B 1延伸至第一自由端135a，以形成大致平行於接地面110的第一輻射頂板135b。第二高頻輻射體150從第二饋入部151及第二接地部153延伸而出，第二高頻輻射體150經彎折後朝第二方向A 2及第三方向B 1延伸至第二自由端155a，以形成平行於接地面110的第二輻射頂板155b。低頻接地構件170從第三接地部171延伸而出，低頻接地構件170經彎折後朝第三方向B 1延伸一段距離D後朝第一方向A 1及第二方向A 2分別延伸至第三自由端173a及第四自由端175a，以形成平行於接地面110的第一耦合部173及第二耦合部175b。 FIG. 3 and FIG. 4 are respectively a front view and a top view of the antenna module 100 in FIG. 2 . In some embodiments of the present invention, the first high-frequency radiator 130 extends from the first feeding portion 131 and the first ground portion 133 , and the first high-frequency radiator 130 is bent toward the first direction A 1 And the third direction B 1 extends to the first free end 135 a to form the first radiating top plate 135 b substantially parallel to the ground plane 110 . The second high-frequency radiator 150 extends from the second feed-in portion 151 and the second ground portion 153 . The second high - frequency radiator 150 is bent and extends toward the second direction A2 and the third direction B1 to the second The free end 155a is formed to form the second radiation top plate 155b parallel to the ground plane 110 . The low-frequency grounding member 170 extends from the third grounding portion 171 , the low - frequency grounding member 170 is bent and then extends for a distance D toward the third direction B1 and then extends toward the third direction A1 and the second direction A2 to the third direction respectively. The free end 173 a and the fourth free end 175 a form the first coupling portion 173 and the second coupling portion 175 b parallel to the ground plane 110 .

具體而言，第一輻射頂板135b及第二輻射頂板155b具有矩形平面，兩者皆具有介於12 mm至15 mm的長度及介於1.2 mm至1.5mm的寬度。第一耦合部173及第二耦合部175具有矩形平面，並具有介於15 mm至20 mm的長度及介於1.8 mm至2.2mm的寬度，但本發明不以此為限。Specifically, the first radiation top plate 135b and the second radiation top plate 155b have rectangular planes, both of which have a length between 12 mm and 15 mm and a width between 1.2 mm and 1.5 mm. The first coupling portion 173 and the second coupling portion 175 have a rectangular plane, and have a length of 15 mm to 20 mm and a width of 1.8 mm to 2.2 mm, but the invention is not limited thereto.

在本發明的一個或多個實施方式中，第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170相對於接地面110具有介於2 mm至4 mm的高度，亦即第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170在第三軸向C的長度介於2 mm至4 mm，其中第三軸向C垂直於接地面110。In one or more embodiments of the present invention, the first high-frequency radiator 130 , the second high-frequency radiator 150 and the low-frequency grounding member 170 have a height between 2 mm and 4 mm relative to the ground plane 110 , that is, The lengths of the first high frequency radiator 130 , the second high frequency radiator 150 and the low frequency grounding member 170 in the third axial direction C are between 2 mm and 4 mm, wherein the third axial direction C is perpendicular to the ground plane 110 .

具體而言，第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170相對於接地面110的高度相同，因此第一輻射部135的第一輻射頂板135b、第二輻射部155的第二輻射頂板155b、第一耦合部173及第二耦合部175的頂面共平面，以避免第一高頻輻射體130及第二高頻輻射體150受到導體結構的影響。Specifically, the heights of the first high-frequency radiator 130 , the second high-frequency radiator 150 , and the low-frequency grounding member 170 are the same with respect to the ground plane 110 , so the first radiating top plate 135 b and the second radiating portion of the first radiating portion 135 are The top surfaces of the second radiating top plate 155b , the first coupling portion 173 and the second coupling portion 175 of 155 are coplanar, so as to prevent the first high frequency radiator 130 and the second high frequency radiator 150 from being affected by the conductor structure.

除此之外，第一輻射頂板135b與第一耦合部173輻射耦和，而第二輻射頂板155b與第二耦合部175輻射耦和。此外，第一耦合部173及第二耦合部175分別位於第一輻射頂板135b及第二輻射頂板155b在第三方向B 1的一側。相對地，第一輻射頂板135b及第二輻射頂板155b分別位於第一耦合部173及第二耦合部175在第四方向B 2(相反於第三方向B 1)的一側。此外，第一輻射頂板135b及第一耦合部173以小於或等於0.5 mm的距離在第二軸向B上間隔配置，第二輻射頂板155b及第二耦合部175以小於或等於0.5 mm的距離在第二軸向B上間隔配置，但本發明不以此為限。 Besides, the first radiating top plate 135b is radiatively coupled with the first coupling part 173 , and the second radiating top plate 155b is radiatively coupled with the second coupling part 175 . In addition, the first coupling portion 173 and the second coupling portion 175 are respectively located on one side of the first radiation top plate 135b and the second radiation top plate 155b in the third direction B1. In contrast, the first radiation top plate 135b and the second radiation top plate 155b are located on one side of the first coupling portion 173 and the second coupling portion 175 in the fourth direction B 2 (opposite to the third direction B 1 ), respectively. In addition, the first radiation top plate 135b and the first coupling portion 173 are spaced apart in the second axial direction B by a distance of less than or equal to 0.5 mm, and the second radiation top plate 155b and the second coupling portion 175 are arranged at a distance of less than or equal to 0.5 mm They are arranged at intervals in the second axial direction B, but the present invention is not limited to this.

在本發明的一個或多個實施方式中，第一接地部133、第二接地部153及第三接地部171在第一軸向A上排成一列並間隔配置。第一饋入部131位於第一接地部133及第三接地部171之間，而第二饋入部151位於第二接地部153及第三接地部171之間。其中，第一饋入部131、第一接地部133、第二饋入部151及第二接地部153在第一軸向A上排成一列並間隔配置，但本發明並不以此為限。In one or more embodiments of the present invention, the first ground portion 133 , the second ground portion 153 and the third ground portion 171 are arranged in a row in the first axial direction A and arranged at intervals. The first feeding portion 131 is located between the first grounding portion 133 and the third grounding portion 171 , and the second feeding portion 151 is located between the second grounding portion 153 and the third grounding portion 171 . The first feeding portion 131 , the first grounding portion 133 , the second feeding portion 151 and the second grounding portion 153 are arranged in a row on the first axis A and spaced apart, but the invention is not limited thereto.

在本發明的一個或多個實施方式中，低頻接地構件170包含電容單元177，電容單元177位於第一耦合部173、第二耦合部175及第三接地部171之間。具體而言，電容單元177是位在第一耦合部173及第二耦合部175的中間。舉例而言，電容單元177為晶片電容、分部電容或集總電容，但本發明不以此為限。電容單元177的配置增加第一高頻輻射體130及第二高頻輻射體150之間的隔離度，避免兩者相互干擾而影響操作頻帶。In one or more embodiments of the present invention, the low-frequency grounding member 170 includes a capacitor unit 177 located between the first coupling portion 173 , the second coupling portion 175 and the third grounding portion 171 . Specifically, the capacitor unit 177 is located in the middle of the first coupling part 173 and the second coupling part 175 . For example, the capacitor unit 177 is a chip capacitor, a partial capacitor or a lumped capacitor, but the invention is not limited thereto. The configuration of the capacitor unit 177 increases the isolation degree between the first high-frequency radiator 130 and the second high-frequency radiator 150 , so as to prevent the two from interfering with each other and affecting the operating frequency band.

請參閱第2圖，天線模組100更包含金屬殼體190(為便於閱覽金屬殼體190以虛線簡單示意，除非經由特別定義，虛線不限制金屬殼體190的形狀和結構)，其中第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170配置於金屬殼體190的內部。金屬殼體190可以是電子裝置10(請參閱第1圖)的內部結構或外殼，本發明不以此為限。由於第一高頻輻射體130及第二高頻輻射體150受周遭導體結構的影響下降，因此金屬殼體190可以位於第一高頻輻射體130及第二高頻輻射體150周遭，讓電子裝置10在材料上有更多元的選擇性。Please refer to FIG. 2 , the antenna module 100 further includes a metal casing 190 (the metal casing 190 is simply indicated by dashed lines for the convenience of reading, unless otherwise defined, the dashed lines do not limit the shape and structure of the metal casing 190 ), wherein the first The high-frequency radiator 130 , the second high-frequency radiator 150 , and the low-frequency ground member 170 are arranged inside the metal case 190 . The metal casing 190 may be an internal structure or a casing of the electronic device 10 (please refer to FIG. 1 ), and the invention is not limited thereto. Since the first high-frequency radiator 130 and the second high-frequency radiator 150 are lowered due to the influence of the surrounding conductor structures, the metal casing 190 can be located around the first high-frequency radiator 130 and the second high-frequency radiator 150 to allow electrons Device 10 is more selective in materials.

除此之外，天線模組100的金屬殼體190包含開口191，其中第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170配置於開口191與接地面110之間，開口191在第三軸向C上會露出第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170。此外，第三軸向C上有方向相反的第五方向C 1及第六方向C 2，天線模組100更包含絕緣蓋體193，絕緣蓋體193可沿著第六方向C 2朝接地面110覆蓋金屬殼體190的開口191，此時開口191被遮蔽而無法露出第一高頻輻射體130、第二高頻輻射體150及低頻接地構件170，但本發明不以此為限。 Besides, the metal casing 190 of the antenna module 100 includes an opening 191 , wherein the first high-frequency radiator 130 , the second high-frequency radiator 150 and the low-frequency grounding member 170 are disposed between the opening 191 and the ground plane 110 , The opening 191 exposes the first high frequency radiator 130 , the second high frequency radiator 150 and the low frequency grounding member 170 along the third axis C. In addition, there are a fifth direction C 1 and a sixth direction C 2 in opposite directions on the third axis C, the antenna module 100 further includes an insulating cover 193 , and the insulating cover 193 may face the ground plane along the sixth direction C 2 110 covers the opening 191 of the metal casing 190 , and the opening 191 is shielded so that the first high frequency radiator 130 , the second high frequency radiator 150 and the low frequency grounding member 170 cannot be exposed, but the invention is not limited thereto.

請參閱第5圖，第5圖繪示為第2圖中具有金屬殼體190的天線模組100的返回損失圖。其中曲線S1代表第一高頻輻射體130在不同頻率的返回損失值。曲線S2代表第二高頻輻射體150在不同頻率的返回損失值。其中，曲線S1及曲線S2大致重合，僅在約5.5GHz的頻率有所差異。由曲線S1及曲線S2可知，縱使第一高頻輻射體130及第二高頻輻射體150配置於金屬殼體190內，天線模組100仍能保持良好的操作頻帶。此外，曲線S3可代表天線模組100中第一高頻輻射體130及第二高頻輻射體150的隔離度，由約2.5 GHz頻段可知，第一高頻輻射體130及第二高頻輻射體150之間的隔離度佳。Please refer to FIG. 5 . FIG. 5 is a return loss diagram of the antenna module 100 with the metal casing 190 in FIG. 2 . The curve S1 represents the return loss values of the first high-frequency radiator 130 at different frequencies. Curve S2 represents return loss values of the second high-frequency radiator 150 at different frequencies. Among them, the curve S1 and the curve S2 approximately overlap, and only differ at a frequency of about 5.5 GHz. It can be seen from the curve S1 and the curve S2 that even if the first high frequency radiator 130 and the second high frequency radiator 150 are disposed in the metal casing 190 , the antenna module 100 can still maintain a good operating frequency band. In addition, the curve S3 can represent the isolation of the first high-frequency radiator 130 and the second high-frequency radiator 150 in the antenna module 100 . It can be seen from the frequency band of about 2.5 GHz that the first high-frequency radiator 130 and the second high-frequency radiator 150 The isolation between the bodies 150 is good.

綜上所述，本發明所提供的天線模組利用低頻接地構件輻射耦合第一高頻輻射體及第二高頻輻射體並配置於兩者之間，利用低頻接地構件與第一高頻輻射體及第二高頻輻射體的相對配置關係，讓第一高頻輻射體及第二高頻輻射體不容易受到導體結構的影響，因此能在天線模組的第一高頻輻射體及第二高頻輻射體周遭配置金屬殼體或其他導電結構，使得天線模組能適用在具有金屬殼體的智慧型手機、平板電腦或筆記型電腦。To sum up, the antenna module provided by the present invention utilizes the low-frequency grounding member to radiately couple the first high-frequency radiator and the second high-frequency radiator and is arranged between the two, and utilizes the low-frequency grounding member to radiate the first high-frequency radiator. The relative arrangement relationship between the body and the second high frequency radiator makes the first high frequency radiator and the second high frequency radiator not easily affected by the conductor structure, so the first high frequency radiator and the second high frequency radiator of the antenna module can Metal shells or other conductive structures are arranged around the two high-frequency radiators, so that the antenna module can be applied to smart phones, tablet computers or notebook computers with metal shells.

於本發明的內文中，說明書中的用語在所使用的特定上下文中具有本技術領域中的普通涵義。特定的用語用於闡釋本說明書之具體內容，便於引導本發明的通常知識者閱讀本說明書。為便於說明，某些用語特別標示，例如使用斜體和/或引號。這種特別標示並不影響用語的涵義或範圍，也就是說不論某些用語是否被特別標示，並不影響這些用語的涵義或範圍。應當理解的是，可以用不同方式描述同樣的元件。因此，在此討論的任何用詞皆可使用替代用語或同義詞替換之，也不在本文中闡述或討論用語是否有任何特殊意義。所舉例的一個或多個用詞並不會排除其他同義詞。本說明書中例示性的用語僅用於闡述而不限制本發明的涵義或範圍。相同地，本發明也不會被說明書中的實施方式所限制。In the context of this disclosure, terms in the specification have their ordinary meanings in the technical field in the specific context in which they are used. Specific terms are used to explain the specific content of the present specification, so as to easily guide those skilled in the present invention to read the present specification. For ease of description, certain terms are highlighted, eg, using italics and/or quotation marks. Such special marking does not affect the meaning or scope of the terms, that is, whether or not certain terms are specifically marked, does not affect the meaning or scope of these terms. It should be understood that the same elements may be described in different ways. Accordingly, any term discussed herein may be replaced by an alternative term or synonym, nor is it set forth or discussed herein whether a term has any special meaning. The citation of one or more words does not exclude other synonyms. Exemplary terms in this specification are used for illustration only and do not limit the meaning or scope of the invention. Likewise, the present invention is not limited by the embodiments described in the specification.

10:電子裝置 100:天線模組 110:接地面 130:第一高頻輻射體 131:第一饋入部 133:第一接地部 135:第一輻射部 135a:第一自由端 135b:第一輻射頂板 150:第二高頻輻射體 151:第二饋入部 153:第二接地部 155:第二輻射部 155a:第二自由端 155b:第二輻射頂板 170:低頻接地構件 171:第三接地部 173:第一耦合部 173a:第三自由端 175:第二耦合部 175a:第四自由端 177：電容單元 190:金屬殼體 191:開口 193: 絕緣蓋體 A:第一軸向 A 1:第一方向 A 2:第二方向 B:第二軸向 B 1:第三方向 B 2:第四方向 C:第三軸向 C 1:第五方向 C 2:第六方向 D:距離 S1,S2,S3:曲線 10: Electronic device 100: Antenna module 110: Ground plane 130: First high-frequency radiator 131: First feed-in portion 133: First ground portion 135: First radiation portion 135a: First free end 135b: First radiation Top plate 150: Second high frequency radiator 151: Second feed-in part 153: Second ground part 155: Second radiator part 155a: Second free end 155b: Second radiation top plate 170: Low frequency ground member 171: Third ground part 173: first coupling part 173a: third free end 175: second coupling part 175a: fourth free end 177: capacitor unit 190: metal shell 191: opening 193: insulating cover A: first axial direction A 1 : First direction A 2 : second direction B: second axial direction B 1 : third direction B 2 : fourth direction C: third axial direction C 1 : fifth direction C 2 : sixth direction D: distance S1, S2, S3: Curve

為描述獲得本發明上述或其它的優點和特徵，將通過參閱其具體實施方式對上述簡要描述的原理進行更具體的闡釋，而具體實施方式被展現在附圖中。這些附圖僅例示性地描述本發明，因此不被認為是對範圍的限制。通過附圖，本發明的原理會被清楚解釋，且附加的特徵和細節將被完整描述，其中： 第1圖繪示為一個電子裝置的立體示意圖，電子裝置搭載有本發明所提供的天線模組； 第2圖繪示為一個或多個實施方式中，天線模組的立體示意圖； 第3圖繪示為第2圖中天線模組的前視圖； 第4圖繪示為第2圖中天線模組的上視圖；以及 第5圖為本發明一個或多個實施方式中，天線模組的返回損失比較圖。 In order to describe the attainment of the above and other advantages and features of the present invention, the principles briefly described above will be explained in more detail by reference to the detailed description thereof, which is illustrated in the accompanying drawings. These drawings illustrate the invention only by way of illustration and are not to be considered limiting of its scope. The principles of the invention will be clearly explained, and additional features and details will be fully described, through the accompanying drawings, wherein: FIG. 1 is a three-dimensional schematic diagram of an electronic device, and the electronic device is equipped with the antenna module provided by the present invention; FIG. 2 is a three-dimensional schematic diagram of an antenna module in one or more embodiments; Fig. 3 is a front view of the antenna module shown in Fig. 2; Figure 4 is a top view of the antenna module in Figure 2; and FIG. 5 is a comparison diagram of return loss of an antenna module in one or more embodiments of the present invention.

國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic storage information (please note in the order of storage institution, date and number) without Foreign deposit information (please note in the order of deposit country, institution, date and number) without

100:天線模組 110:接地面 130:第一高頻輻射體 131:第一饋入部 133:第一接地部 135:第一輻射部 135a:第一自由端 135b:第一輻射頂板 150:第二高頻輻射體 151:第二饋入部 153:第二接地部 155:第二輻射部 155a:第二自由端 155b:第二輻射頂板 170:低頻接地構件 171:第三接地部 173:第一耦合部 173a:第三自由端 175:第二耦合部 175a:第四自由端 177:電容單元 190:金屬殼體 191:開口 193: 絕緣蓋體 A:第一軸向 A 1:第一方向 A 2:第二方向 B:第二軸向 B 1:第三方向 B 2:第四方向 C:第三軸向 C 1:第五方向 C 2:第六方向 D:距離 100: antenna module 110: ground plane 130: first high-frequency radiator 131: first feed-in portion 133: first ground portion 135: first radiation portion 135a: first free end 135b: first radiation top plate 150: first Two high frequency radiators 151 : second feeding part 153 : second grounding part 155 : second radiating part 155a : second free end 155b : second radiating top plate 170 : low frequency grounding member 171 : third grounding part 173 : first Coupling part 173a: third free end 175: second coupling part 175a: fourth free end 177: capacitor unit 190: metal case 191: opening 193: insulating cover A: first axial direction A 1 : first direction A 2 : second direction B: second axial direction B 1 : third direction B 2 : fourth direction C: third axial direction C 1 : fifth direction C 2 : sixth direction D: distance

Claims (9)

一種天線模組，包含：接地面；第一高頻輻射體，包含第一饋入部、第一接地部及第一輻射部，該第一接地部耦接該接地面，第一高頻輻射體為共振頻率約5GHz的平面式倒F型單極天線；第二高頻輻射體，包含第二饋入部、第二接地部及第二輻射部，該第二接地部耦接該接地面，第二高頻輻射體為共振頻率約5GHz的平面式倒F型單極天線；以及低頻接地構件，該低頻接地構件為共振頻率約2.4GHz的迴圈天線，該低頻接地構件位於該第一高頻輻射體及該第二高頻輻射體之間，該低頻接地構件包含第三接地部、第一耦合部及第二耦合部，該第三接地部耦接該接地面，而該低頻接地構件從該三接地部延伸而出，並同時往第一軸向上的第一方向及第二方向延伸形成該第一耦合部及該第二耦合部，該第一耦合部及該第二耦合部皆具有矩形平面，該矩形平面具有介於15mm至20mm的長度及介於1.8mm至2.2mm的寬度，其中該第一軸向平行於該接地面，而該第一方向為該第二方向的相反方向，該第一輻射部往該第一方向延伸並與該第一耦合部輻射耦合，該第二輻射部往該第二方向延伸並與該第二耦合部輻射耦合，且該第一輻射部及該第二輻射部分別位於該第一耦合部及該第二耦合部在第二軸上朝向該第三接地部的一側，其中該第二軸向垂直於該第一軸向並平行於該接地面，其中該 低頻接地構件包含電容單元位於該第一耦合部、該第二耦合部及該第三接地部之間，該第一高頻輻射體、該第二高頻輻射體及該低頻接地構件相對於該接地面具有介於2mm至4mm的高度。 An antenna module, comprising: a ground plane; a first high-frequency radiator, including a first feeding part, a first grounding part and a first radiating part, the first grounding part is coupled to the grounding plane, the first high-frequency radiator It is a planar inverted-F monopole antenna with a resonance frequency of about 5GHz; the second high-frequency radiator includes a second feeding part, a second grounding part and a second radiating part, the second grounding part is coupled to the ground plane, the first The two high-frequency radiators are planar inverted-F monopole antennas with a resonance frequency of about 5 GHz; and a low-frequency grounding member, which is a loop antenna with a resonance frequency of about 2.4 GHz, and the low-frequency grounding member is located at the first high frequency. Between the radiator and the second high-frequency radiator, the low-frequency grounding member includes a third grounding portion, a first coupling portion, and a second coupling portion, the third grounding portion is coupled to the ground plane, and the low-frequency grounding member from the The three grounding portions extend out, and simultaneously extend in the first direction and the second direction on the first axis to form the first coupling portion and the second coupling portion, the first coupling portion and the second coupling portion both have A rectangular plane having a length between 15mm and 20mm and a width between 1.8mm and 2.2mm, wherein the first axial direction is parallel to the ground plane, and the first direction is the opposite direction of the second direction , the first radiating portion extends in the first direction and is radiatively coupled with the first coupling portion, the second radiating portion extends in the second direction and is radiatively coupled with the second coupling portion, and the first radiating portion and The second radiating portion is located on one side of the first coupling portion and the second coupling portion facing the third ground portion on a second axis, wherein the second axis is perpendicular to the first axis and parallel to the ground plane, where the The low-frequency grounding member includes a capacitor unit located between the first coupling portion, the second coupling portion and the third grounding portion, the first high-frequency radiator, the second high-frequency radiator and the low-frequency grounding member are relative to the The ground plane has a height of between 2mm and 4mm. 如請求項1所述之天線模組，其中該第一高頻輻射體、該第二高頻輻射體及該低頻接地構件經由彎折而朝第二軸向上的第三方向上延伸。 The antenna module of claim 1, wherein the first high-frequency radiator, the second high-frequency radiator, and the low-frequency grounding member extend toward a third direction on the second axis through bending. 如請求項2所述之天線模組，其中該第一接地部、該第二接地部及該三接地部在該第一軸向排成一列。 The antenna module of claim 2, wherein the first ground portion, the second ground portion and the three ground portions are arranged in a row in the first axial direction. 如請求項2所述之天線模組，其中該第一輻射部、該第二輻射部、該第一耦合部以及該第二耦合部的頂面形成共平面。 The antenna module of claim 2, wherein top surfaces of the first radiating part, the second radiating part, the first coupling part and the second coupling part form a coplanar surface. 如請求項1所述之天線模組，其中該電容單元為晶片電容、分部電容或集總電容。 The antenna module of claim 1, wherein the capacitor unit is a chip capacitor, a segmented capacitor or a lumped capacitor. 如請求項1所述之天線模組，其中該第一輻射部及該第一耦合部以小於或等於0.5mm的距離間隔配置，該第二輻射部及該第二耦合部以小於或等於0.5mm的距離間隔配置。 The antenna module of claim 1, wherein the first radiation portion and the first coupling portion are arranged at a distance of less than or equal to 0.5 mm, and the second radiation portion and the second coupling portion are arranged at a distance of less than or equal to 0.5 mm The distance interval configuration in mm. 如請求項1所述之天線模組，更包含金屬殼體，其中該第一高頻輻射體、第二高頻輻射體及低頻接地構件位於該金屬殼體的內部。 The antenna module of claim 1 further comprises a metal casing, wherein the first high-frequency radiator, the second high-frequency radiator and the low-frequency grounding member are located inside the metal casing. 如請求項7所述之天線模組，其中該金屬殼體包含開口，該第一高頻輻射體、第二高頻輻射體及低頻接地構件位於該開口與該接地面之間。 The antenna module of claim 7, wherein the metal casing includes an opening, and the first high-frequency radiator, the second high-frequency radiator and the low-frequency grounding member are located between the opening and the ground plane. 如請求項8所述之天線模組，更包含絕緣蓋體覆蓋該金屬殼體的該開口。 The antenna module of claim 8, further comprising an insulating cover covering the opening of the metal casing.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201303560A (en) * 2011-01-31 2013-01-16 Apple Inc Handheld portable device
TW201611408A (en) * 2014-09-05 2016-03-16 環鴻科技股份有限公司 Antenna apparatus
CN109980364A (en) * 2019-02-28 2019-07-05 华为技术有限公司 A kind of Anneta module, antenna assembly and terminal device
TW202007097A (en) * 2018-07-10 2020-02-01 晶鈦國際電子股份有限公司 Communication device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201303560A (en) * 2011-01-31 2013-01-16 Apple Inc Handheld portable device
TW201611408A (en) * 2014-09-05 2016-03-16 環鴻科技股份有限公司 Antenna apparatus
TW202007097A (en) * 2018-07-10 2020-02-01 晶鈦國際電子股份有限公司 Communication device
CN109980364A (en) * 2019-02-28 2019-07-05 华为技术有限公司 A kind of Anneta module, antenna assembly and terminal device

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