TWI755247B

TWI755247B - Circuit board structure and manufacturing method thereof

Info

Publication number: TWI755247B
Application number: TW110100568A
Authority: TW
Inventors: 呂政明; 石漢青; 范字遠; 劉祖澔; 石亞琴
Original assignee: 健鼎科技股份有限公司
Priority date: 2021-01-07
Filing date: 2021-01-07
Publication date: 2022-02-11
Also published as: TW202228487A

Abstract

The present invention provides a circuit board structure and a manufacturing method thereof. The manufacturing of the circuit board structure includes: forming a thru-hole in a circuit substrate and forming a conductive connection layer onto a wall of the thru-hole; selecting a heat pipe having a conductive fluid therein and an outer diameter that is greater than a depth of the thru-hole; placing the heat pipe into the thru-hole of the circuit substrate, in which a portion of the heat pipe protrudes from the thru-hole; pressing the heat pipe to deform the heat pipe to abut against the conductive connection layer, so that the heat pipe is entirely arranged in the thru-hole; and forming a first adding layer and a second adding layer on two opposite sides of the circuit substrate and the heat pipe, respectively.

Description

電路板結構及其製造方法Circuit board structure and manufacturing method thereof

本發明涉及一種電路板，尤其涉及一種電路板結構及其製造方法。The invention relates to a circuit board, in particular to a circuit board structure and a manufacturing method thereof.

目前常見的電子產品，例如手機與筆記型電腦，在微型化的趨勢下，整體的封裝模組堆疊密度越來越高。因此，電子產品的功能越來越多，而所消耗的功率也越來越大，以至於電子產品在運作時會產生很多熱能，從而增加電子產品的溫度。At present, common electronic products, such as mobile phones and notebook computers, are under the trend of miniaturization, and the overall packaging and module stacking density is getting higher and higher. Therefore, electronic products have more and more functions, and consume more and more power, so that electronic products generate a lot of heat energy during operation, thereby increasing the temperature of electronic products.

據此，為了減少電子產品因為溫度過高而致使電子產品的可靠度下降，通常於電路板上設計銅柱作為電子元件的散熱路徑。然而，上述設有銅柱之電路板所具備之散熱效率已逐漸不敷使用，因此，如何提升電路板的散熱效率已成為業內研發的主要課題之一。Accordingly, in order to reduce the reliability degradation of electronic products due to excessive temperature, copper pillars are usually designed on the circuit board as heat dissipation paths for electronic components. However, the heat dissipation efficiency of the above-mentioned circuit boards with copper pillars has gradually become insufficient. Therefore, how to improve the heat dissipation efficiency of the circuit boards has become one of the main research and development issues in the industry.

於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

本發明實施例在於提供一種電路板結構及其製造方法，其能有效地改善現有電路板所可能產生的缺陷。The embodiments of the present invention provide a circuit board structure and a manufacturing method thereof, which can effectively improve the defects that may occur in existing circuit boards.

本發明實施例公開一種電路板結構的製造方法，其包括：一前置步驟：在一線路基板形成有貫穿狀的一槽孔，並於所述槽孔的孔壁上形成有一導電連接層；一選管步驟：挑選內部設有導熱流體的一熱管；其中，所述熱管的一外徑大於所述槽孔的孔深；一配置步驟：將所述熱管置於所述線路基板的所述槽孔內，並使所述熱管的局部突伸出所述槽孔；一埋入步驟：擠壓所述熱管，以使所述熱管變形而抵接於所述導電連接層、並使所述熱管完全位於所述槽孔之內；以及一增層步驟：在所述線路基板與所述熱管的一側形成有一第一增設層，並在所述線路基板與所述熱管的另一側形成有一第二增設層。The embodiment of the present invention discloses a manufacturing method of a circuit board structure, which includes: a pre-step: forming a through-shaped slot hole on a circuit substrate, and forming a conductive connection layer on the hole wall of the slot hole; A pipe selection step: selecting a heat pipe with a heat-conducting fluid inside; wherein, an outer diameter of the heat pipe is larger than a hole depth of the slot hole; a configuration step: placing the heat pipe in the groove of the circuit substrate A part of the heat pipe protrudes out of the slot hole; a embedding step: squeeze the heat pipe, so that the heat pipe is deformed to abut on the conductive connection layer and make the heat pipe completely within the slot hole; and a layer build-up step: forming a first build-up layer on one side of the circuit substrate and the heat pipe, and forming a layer on the other side of the circuit substrate and the heat pipe Second additional layer.

本發明實施例也公開一種電路板結構，其以上述的電路板結構的製造方法所製成。The embodiment of the present invention also discloses a circuit board structure, which is manufactured by the above-mentioned manufacturing method of the circuit board structure.

綜上所述，本發明實施例所公開的電路板結構及其製造方法，其通過擠壓所述熱管而使其變形為合適的外形，以令所述熱管能夠妥善地埋置於所述線路基板內，進而有效地提升散熱的效能。To sum up, in the circuit board structure and the manufacturing method thereof disclosed in the embodiments of the present invention, the heat pipe is deformed into a suitable shape by pressing the heat pipe, so that the heat pipe can be properly embedded in the circuit inside the substrate, thereby effectively improving the heat dissipation performance.

為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

以下是通過特定的具體實施例來說明本發明所公開有關“電路板結構及其製造方法”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。The following are specific embodiments to illustrate the embodiments of the "circuit board structure and its manufacturing method" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[實施例一][Example 1]

請參閱圖1至圖10所示，其為本發明的實施例一。本實施例公開一種電路板結構100及其製造方法，並且所述電路板結構100於本實施例中是以所述電路板結構的製造方法所製成，但本發明不以此為限。而為便於理解本實施例，下述將先說明所述電路板結構的製造方法，而後再簡述所述電路板結構100的構造；再者，圖2至圖9的剖視圖是沿著圖1的剖線VIII-VIII，以利於說明所述電路板結構的製造方法。Please refer to FIG. 1 to FIG. 10 , which are Embodiment 1 of the present invention. This embodiment discloses a circuit board structure 100 and a manufacturing method thereof, and the circuit board structure 100 is manufactured by the manufacturing method of the circuit board structure in this embodiment, but the invention is not limited thereto. In order to facilitate the understanding of this embodiment, the following will first describe the manufacturing method of the circuit board structure, and then briefly describe the structure of the circuit board structure 100; The section line VIII-VIII is used to facilitate the description of the manufacturing method of the circuit board structure.

如圖2至圖9所示，所述電路板結構的製造方法於本實施例中依序包含有一前置步驟S110、一選管步驟S120、一配置步驟S130、一埋入步驟S140、一增層步驟S150、一導熱步驟S160、及一防焊步驟S170，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述電路板結構的製造方法也可以省略上述的至少一個步驟（如：所述導熱步驟S160及/或所述防焊步驟S170）、或是搭配其他步驟實施。As shown in FIG. 2 to FIG. 9 , the manufacturing method of the circuit board structure in this embodiment sequentially includes a pre-step S110 , a tube selection step S120 , a configuration step S130 , a burying step S140 , and a build-up layer. Step S150, a heat conduction step S160, and a solder mask step S170, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the manufacturing method of the circuit board structure may also omit at least one of the above steps (eg, the heat conduction step S160 and/or the solder mask step S170 ) , or with other steps.

如圖2和圖3所示，所述前置步驟S110：在一線路基板1形成有貫穿狀的一槽孔14，並於所述槽孔14的孔壁上形成有一導電連接層15。其中，所述線路基板1包含有分別位於相反兩側（如：所述線路基板1的頂側與底側）的一第一線路層11與一第二線路層12、及位於所述第一線路層11與所述第二線路層12之間的至少一個內線路層13。As shown in FIG. 2 and FIG. 3 , in the pre-step S110 , a penetrating slot hole 14 is formed on a circuit substrate 1 , and a conductive connection layer 15 is formed on the hole wall of the slot hole 14 . Wherein, the circuit substrate 1 includes a first circuit layer 11 and a second circuit layer 12 respectively located on opposite sides (eg, the top side and the bottom side of the circuit substrate 1 ), and a first circuit layer 12 located on the first circuit substrate 1 . At least one inner circuit layer 13 between the circuit layer 11 and the second circuit layer 12 .

進一步地說，於形成有所述導電連接層15之後，所述導電連接層15可以是連接於所述第一線路層11、所述第二線路層12、及至少一個所述內線路層13的至少其中之一。再者，所述導電連接層15可以進一步以一藥水（圖未示）來進行氧化，據以利於提升所述導電連接層15與後續構件（如：5的熱管6）之間的結合性，而所述第二線路層12可以依據設計需求而進行圖案化，但本發明不以此為限。Further, after the conductive connection layer 15 is formed, the conductive connection layer 15 may be connected to the first circuit layer 11 , the second circuit layer 12 , and at least one of the inner circuit layers 13 at least one of them. Furthermore, the conductive connection layer 15 can be further oxidized with a potion (not shown in the figure), so as to improve the bonding between the conductive connection layer 15 and subsequent components (such as the heat pipe 6 of 5 ), The second circuit layer 12 may be patterned according to design requirements, but the invention is not limited thereto.

如圖4所示，所述選管步驟S120：挑選內部設有導熱流體6c的一熱管6（heat pipe）。其中，所述熱管6的一外徑D6大於所述槽孔14的孔深D14，並且所述熱管6的體積較佳是介於所述槽孔14的容積的70%～110%。更詳細地說，所述熱管6於本實施例中呈封閉狀並具有一管材（未標示，如：銅管）、設於所述管材內壁的一毛細結構、及容置於所述管材內的所述導熱流體6c（如：水、酒精）。As shown in FIG. 4 , the pipe selection step S120 is to select a heat pipe 6 with a heat transfer fluid 6c inside. Wherein, an outer diameter D6 of the heat pipe 6 is larger than the hole depth D14 of the slot hole 14 , and the volume of the heat pipe 6 is preferably between 70% and 110% of the volume of the slot hole 14 . More specifically, the heat pipe 6 is closed in this embodiment and has a pipe (not shown, such as a copper pipe), a capillary structure disposed on the inner wall of the pipe, and a capillary structure accommodated in the pipe The heat transfer fluid 6c (eg: water, alcohol) inside.

更詳細地說，所述熱管6於本實施例中包含有分別位於相反兩側（如圖4中，所述熱管6的頂側與底側）一第一端部61與一第二端部62、及分別位於相反另兩側（如圖4中，所述熱管6的左側與右側）的兩個側緣63，並且所述第一端部61與所述第二端部62之間的最大距離定義為所述外徑D6。More specifically, the heat pipe 6 in this embodiment includes a first end portion 61 and a second end portion respectively located on opposite sides (as shown in FIG. 4 , the top side and the bottom side of the heat pipe 6 ) 62 , and two side edges 63 located on opposite sides (as shown in FIG. 4 , the left and right sides of the heat pipe 6 ), and between the first end 61 and the second end 62 The maximum distance is defined as the outer diameter D6.

如圖4所示，所述配置步驟S130：將所述熱管6置於所述線路基板1的所述槽孔14內，並使所述熱管6的局部（如：所述第一端部61）突伸出所述槽孔14。其中，所述熱管6較佳是未接觸於所述導電連接層15；也就是說，所述熱管6的兩個所述側緣63面向所述導電連接層15，並且每個所述側緣63與其所相向的所述導電連接層15的部位呈間隔地設置。As shown in FIG. 4 , in the configuration step S130 : place the heat pipe 6 in the slot 14 of the circuit substrate 1 , and make a part of the heat pipe 6 (eg, the first end 61 ) ) protrudes out of the slot 14 . Wherein, the heat pipe 6 is preferably not in contact with the conductive connection layer 15; that is, the two side edges 63 of the heat pipe 6 face the conductive connection layer 15, and each of the side edges 63 and the portion of the conductive connection layer 15 facing each other are arranged at intervals.

如圖5所示，所述埋入步驟S140：擠壓所述熱管6，以使所述熱管6變形而抵接於所述導電連接層15、並使所述熱管6完全位於所述槽孔14之內。於本實施例中，所述熱管6可以是以所述第一端部61與所述第二端部62來承受擠壓，以使兩個所述側緣63分別朝其所相鄰的所述導電連接層15部位變形延伸，進而使每個所述側緣63抵接於其所面向的所述導電連接層15的部位。As shown in FIG. 5 , the embedding step S140 : squeeze the heat pipe 6 , so that the heat pipe 6 is deformed to abut the conductive connection layer 15 , and the heat pipe 6 is completely located in the slot hole within 14. In this embodiment, the heat pipe 6 may be pressed by the first end portion 61 and the second end portion 62, so that the two side edges 63 face the adjacent ones respectively. The portion of the conductive connection layer 15 is deformed and extended, so that each of the side edges 63 abuts against the portion of the conductive connection layer 15 that it faces.

更詳細地說，所述熱管6可依據設計要求或不同的選管條件（如：所述熱管6的體積為所述槽孔14的容積的70%～110%）而被擠壓變形成為不同的形狀。舉例來說，如圖5所示，所述熱管6於擠壓變形後，每個所述側緣63呈平面狀且平貼於其所面向的所述導電連接層15的部位，所述第一端部61切齊於所述第一線路層11，而所述第二端部62切齊於所述第二線路層12。或者，如圖9所示，所述熱管6於擠壓變形後，每個所述側緣63呈圓弧狀且抵接於其所面向的所述導電連接層15的部位的局部，所述第一端部61切齊於所述第一線路層11，而所述第二端部62切齊於所述第二線路層12。In more detail, the heat pipe 6 can be squeezed and deformed into different shapes according to design requirements or different pipe selection conditions (eg, the volume of the heat pipe 6 is 70% to 110% of the volume of the slot hole 14 ). shape. For example, as shown in FIG. 5 , after the heat pipe 6 is extruded and deformed, each of the side edges 63 is flat and is flat on the portion of the conductive connection layer 15 it faces. One end portion 61 is aligned with the first circuit layer 11 , and the second end portion 62 is aligned with the second circuit layer 12 . Alternatively, as shown in FIG. 9 , after the heat pipe 6 is squeezed and deformed, each of the side edges 63 is in the shape of an arc and abuts against a part of the portion of the conductive connection layer 15 facing the heat pipe 6 . The first end portion 61 is aligned with the first circuit layer 11 , and the second end portion 62 is aligned with the second circuit layer 12 .

如圖6所示，所述增層步驟S150：在所述線路基板1與所述熱管6的一側（如：頂側）形成有一第一增設層2，並在所述線路基板1與所述熱管6的另一側（如：底側）形成有一第二增設層3。於本實施例中，所述第一線路層11埋置於所述第一增設層2內，所述第二線路層12埋置於所述第二增設層3內，而所述第一增設層2與所述第二增設層3填滿所述熱管6與所述導電連接層15之間的間隙。As shown in FIG. 6 , the layer build-up step S150 : a first build-up layer 2 is formed on one side (eg, the top side) of the circuit substrate 1 and the heat pipe 6 , and a first build-up layer 2 is formed on the circuit substrate 1 and the heat pipe 6 . A second additional layer 3 is formed on the other side (eg, the bottom side) of the heat pipe 6 . In this embodiment, the first circuit layer 11 is embedded in the first extension layer 2 , the second circuit layer 12 is embedded in the second extension layer 3 , and the first extension layer is The layer 2 and the second additional layer 3 fill the gap between the heat pipe 6 and the conductive connection layer 15 .

如圖7所示，所述導熱步驟S160：於所述第一增設層2形成有埋置於內多個第一導熱柱21，並且多個所述第一導熱柱21的一端（如：頂端）則裸露於所述第一增設層2之外，而多個所述第一導熱柱21的另一端（如：底端）分別連接於所述第一線路層11與所述熱管6的所述第一端部61。As shown in FIG. 7 , in the heat conduction step S160 : forming a plurality of first heat conduction columns 21 embedded in the first additional layer 2 , and one end (eg, the top end of the plurality of first heat conduction columns 21 ) is formed. ) is exposed outside the first additional layer 2 , and the other ends (eg, bottom ends) of the first thermal conductive pillars 21 are respectively connected to the first circuit layer 11 and the heat pipes 6 . The first end portion 61 is described.

再者，所述導熱步驟S160也可以於所述第二增設層3形成有埋置於內多個第二導熱柱31，並且多個所述第二導熱柱31的一端（如：底端）則裸露於所述第二增設層3之外，而多個所述第一導熱柱21的另一端（如：頂端）連接於所述熱管6的所述第二端部62。Furthermore, in the heat-conducting step S160 , a plurality of second heat-conducting pillars 31 may be embedded in the second additional layer 3 , and one end (eg, the bottom end) of the plurality of second heat-conducting pillars 31 may be formed. It is exposed outside the second additional layer 3 , and the other ends (eg, the top ends) of the plurality of first thermally conductive columns 21 are connected to the second ends 62 of the heat pipes 6 .

此外，在本發明未繪示的其他實施例中，所述第二增設層3內還能進一步增設有連接於所述第二線路層12的多個第二導熱柱31，其一端同樣裸露於所述第二增設層3之外。In addition, in other embodiments not shown in the present invention, a plurality of second thermally conductive pillars 31 connected to the second circuit layer 12 can be further added in the second additional layer 3 , and one end of which is also exposed to the outside the second additional layer 3 .

如圖8所示，所述防焊步驟S170：於所述第一增設層2上形成有一第一防焊層4，並且於所述第二增設層3上形成有一第二防焊層5；其中，多個所述第一導熱柱21的所述一端（如：頂端）裸露於所述第一防焊層4之外，而多個所述第二導熱柱31的所述一端（如：底端）裸露於所述第二防焊層5之外。As shown in FIG. 8 , in the solder mask step S170 : a first solder mask layer 4 is formed on the first extension layer 2 , and a second solder mask layer 5 is formed on the second extension layer 3 ; Wherein, the one end (eg: top end) of the plurality of first thermally conductive pillars 21 is exposed outside the first solder resist layer 4 , and the one end (eg: The bottom end) is exposed outside the second solder resist layer 5 .

依上所述，所述電路板結構100能通過實施上述步驟S110～S170而形成，並且所述電路板結構100通過擠壓所述熱管6而使其變形為合適的外形，以令所述熱管6能夠妥善地埋置於所述線路基板1內，進而有效地提升散熱的效能。進一步地說，在所述電路板結構100之中，多個所述第一導熱柱21與多個所述第二導熱柱31能夠依據設計需求而用來連接散熱元件（如：散熱鰭片）或發熱元件（如：電子晶片），據以通過所述熱管6來實現快速散熱的效果。According to the above, the circuit board structure 100 can be formed by implementing the above steps S110-S170, and the circuit board structure 100 is deformed into a suitable shape by pressing the heat pipe 6, so that the heat pipe 6 can be properly embedded in the circuit substrate 1, thereby effectively improving the heat dissipation performance. Further, in the circuit board structure 100 , a plurality of the first thermally conductive pillars 21 and a plurality of the second thermally conductive pillars 31 can be used to connect heat dissipation elements (eg, heat dissipation fins) according to design requirements Or a heating element (such as an electronic chip), so as to achieve the effect of rapid heat dissipation through the heat pipe 6 .

此外，所述電路板結構100的具體構造可以依據設計需求而加以調整變化，並不受限於本實施例的圖式。In addition, the specific structure of the circuit board structure 100 can be adjusted and changed according to design requirements, and is not limited to the drawings of this embodiment.

[實施例二][Example 2]

請參閱圖11至圖14所示，其為本發明的實施例二。本實施例公開一種電路散熱模組1000及電路板結構100，由於本實施例類似於上述實施例一，所以兩個實施例的相同處則不再加以贅述（如：本實施例的電路板結構100可以通過實施例一所載的所述電路板的製造方法所製成），而本實施例與上述實施例一的差異大致說明如下：Please refer to FIG. 11 to FIG. 14 , which are Embodiment 2 of the present invention. This embodiment discloses a circuit heat dissipation module 1000 and a circuit board structure 100. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated (for example, the circuit board structure of this embodiment) 100 can be made by the manufacturing method of the circuit board described in the first embodiment), and the differences between this embodiment and the above-mentioned first embodiment are roughly described as follows:

於本實施例中，所述電路散熱模組1000包含有一電路板結構100、設置於所述電路板結構100上的多個散熱元件200（如：散熱鰭片）、及設置於所述電路板結構100上的多個發熱元件300（如：電子晶片）。需說明的是，所述電路板結構100於本實施例中雖是以搭配於多個所述散熱元件200與多個所述發熱元件300來說明，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述電路板結構100可以是搭配於至少一個散熱元件200及/或至少一個所述發熱元件300；或者，所述電路板結構100也可以單獨地被運用（如：販賣）。In this embodiment, the circuit heat dissipation module 1000 includes a circuit board structure 100, a plurality of heat dissipation elements 200 (eg, heat dissipation fins) disposed on the circuit board structure 100, and disposed on the circuit board. A plurality of heating elements 300 (eg, electronic chips) on the structure 100 . It should be noted that although the circuit board structure 100 is described as being matched with a plurality of the heat dissipation elements 200 and a plurality of the heating elements 300 in this embodiment, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the circuit board structure 100 may be matched with at least one heat dissipation element 200 and/or at least one heating element 300 ; or, the circuit board structure 100 It can also be used individually (eg, sold).

為便於說明本實施例的所述電路散熱模組1000，以下將先說明所述電路板結構100，而後再適時說明所述電路板結構100相較於多個所述散熱元件200與多個所述發熱元件300之間的連接關係。In order to facilitate the description of the circuit heat dissipation module 1000 of the present embodiment, the circuit board structure 100 will be described first, and then the circuit board structure 100 will be described in a timely manner compared with the plurality of the heat dissipation elements 200 and the plurality of heat dissipation elements 200 . The connection relationship between the heating elements 300 is described.

如圖12至圖14所示，所述電路板結構100包含有一主板體M及埋置於所述主板體M內的一熱管6；其中，所述熱管6呈長形且定義有一長度方向L，並且所述熱管6的構造於本實施例中相當於上述實施例一中埋置於所述電路板結構100內的所述熱管6的構造，所以在此不再加以贅述。As shown in FIGS. 12 to 14 , the circuit board structure 100 includes a main board body M and a heat pipe 6 embedded in the main board body M; wherein, the heat pipe 6 is elongated and defines a length direction L , and the structure of the heat pipe 6 in this embodiment is equivalent to the structure of the heat pipe 6 embedded in the circuit board structure 100 in the above-mentioned first embodiment, so it is not repeated here.

所述主板體M包含有連接於所述熱管6的一導熱線路網N，並且所述主板體M形成有位置對應於所述導熱線路網N的多個散熱孔41、51及多個吸熱孔42、52。其中，對應於多個所述散熱孔41、51的所述導熱線路網N的部位分別連接於所述熱管6的多個散熱區64，對應於多個所述吸熱孔42、52的所述導熱線路網N的部位分別連接於所述熱管6的多個吸熱區65，並且多個所述散熱區64與多個所述吸熱區65於所述長度方向L上分別位於不同的位置。The mainboard body M includes a heat-conducting circuit network N connected to the heat pipe 6, and the mainboard body M is formed with a plurality of heat dissipation holes 41, 51 and a plurality of heat-absorbing holes corresponding to the heat-conducting circuit network N. 42, 52. The parts of the heat conduction circuit network N corresponding to the plurality of heat dissipation holes 41 and 51 are respectively connected to the plurality of heat dissipation areas 64 of the heat pipe 6 , and the parts of the heat dissipation holes 42 and 52 corresponding to the plurality of heat absorption holes 42 and 52 are respectively connected to the plurality of heat dissipation regions 64 of the heat pipe 6 . The parts of the heat conducting circuit network N are respectively connected to the plurality of heat absorption regions 65 of the heat pipe 6 , and the plurality of the heat dissipation regions 64 and the plurality of the heat absorption regions 65 are located at different positions in the longitudinal direction L, respectively.

進一步地說，任一個所述散熱區64相較於相鄰的任一個所述吸熱區65於所述長度方向L上間隔有一距離，據以使所述熱管6內的所述導熱流體6c能於所述距離內形成有一熱循環。換個角度來說，至少一個所述吸熱區65所吸收的熱能用來通過所述導熱線路網N的傳輸，以使所述熱管6內的所述導熱流體6c形成兩個熱循環，進而分別於兩個所述散熱孔41、51進行散熱。Further, any one of the heat-dissipating regions 64 is spaced apart from any one of the adjacent heat-absorbing regions 65 in the longitudinal direction L, so that the heat-conducting fluid 6c in the heat pipe 6 can A thermal cycle is formed within the distance. To put it another way, the heat energy absorbed by at least one of the heat-absorbing regions 65 is used for transmission through the heat-conducting circuit network N, so that the heat-conducting fluid 6c in the heat pipe 6 forms two heat cycles, which are respectively The two heat dissipation holes 41 and 51 conduct heat dissipation.

據此，所述電路板結構100於本實施例中通過所述主板體M的所述導熱線路網N搭配於所述熱管6，以使其熱能傳輸路徑是構成多輸入多輸出的分流散熱架構，進而令所述電路板結構100能夠適用於產熱效率不同的多個所述發熱元件300，據以有效地提升散熱的效果。Accordingly, in this embodiment, the circuit board structure 100 is matched with the heat pipe 6 through the heat conduction circuit network N of the main board body M, so that the heat energy transmission path forms a multi-input multi-output split heat dissipation structure , so that the circuit board structure 100 can be applied to a plurality of the heating elements 300 with different heat generating efficiencies, so as to effectively improve the heat dissipation effect.

需額外說明的是，所述電路板結構100於本實施例中是以類似於實施例一的構造來說明，但本發明不以此為限。舉例來說，於本發明未繪示的其他實施例中，所述電路板結構100中的所述熱管6能以初始外型埋置於所述主板體M內、而未受到任何擠壓變形。It should be additionally noted that the circuit board structure 100 is described in this embodiment as a structure similar to that of the first embodiment, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the heat pipe 6 in the circuit board structure 100 can be embedded in the main board body M with an initial shape without any extrusion deformation .

更詳細地說，所述主板體M於本實施例中包含有一線路基板1、分別位於於所述線路基板1相反兩側的一第一增設層2與一第二增設層3、形成於所述第一增設層2的一第一防焊層4、及形成於所述第二增設層3的一第二防焊層5。In more detail, the main board body M in this embodiment includes a circuit substrate 1, a first additional layer 2 and a second additional layer 3 respectively located on opposite sides of the circuit substrate 1, formed on the circuit substrate 1. A first solder resist layer 4 of the first additional layer 2 , and a second solder resist layer 5 formed on the second additional layer 3 .

其中，所述線路基板1於本實施例中包含有埋置於所述第一增設層2內的一第一線路層11、埋置於所述第二增設層3內的一第二線路層12、及位於所述第一線路層11與所述第二線路層12之間的至少一個內線路層13；所述線路基板1、所述第一增設層2、及所述第二增設層3共同形成有所述導熱線路網N。The circuit substrate 1 in this embodiment includes a first circuit layer 11 embedded in the first extension layer 2 and a second circuit layer embedded in the second extension layer 3 12. and at least one inner circuit layer 13 between the first circuit layer 11 and the second circuit layer 12; the circuit substrate 1, the first extension layer 2, and the second extension layer 3. The heat-conducting circuit network N is formed together.

再者，所述線路基板1形成有自所述第一線路層11貫穿至所述第二線路層12的一槽孔14、及形成於所述槽孔14之孔壁的一導電連接層15，並且所述第一線路層11、所述第二線路層12、及至少一個所述內線路層13皆連接於所述導電連接層15。Furthermore, the circuit substrate 1 is formed with a slot hole 14 penetrating from the first circuit layer 11 to the second circuit layer 12 , and a conductive connection layer 15 formed on the wall of the slot hole 14 . , and the first circuit layer 11 , the second circuit layer 12 , and at least one of the inner circuit layers 13 are all connected to the conductive connection layer 15 .

進一步地說，所述熱管6埋置於所述槽孔14內且抵接於所述導電連接層15，並且所述熱管6較佳是一擠壓變形構造且完全位於所述槽孔14之內，所述導電連接層15為一氧化後構造，並且所述第一增設層2與所述第二增設層3填滿所述熱管6與所述導電連接層15之間的間隙。其中，所述熱管6與所述線路基板1之間的細部連接關係如同實施例一對應於圖8和圖9的相關說明，在此不加以贅述。Further, the heat pipe 6 is embedded in the slot hole 14 and abuts against the conductive connection layer 15 , and the heat pipe 6 is preferably an extrusion deformation structure and is completely located in the slot hole 14 Inside, the conductive connection layer 15 is a post-oxidation structure, and the first extension layer 2 and the second extension layer 3 fill the gap between the heat pipe 6 and the conductive connection layer 15 . The detailed connection relationship between the heat pipe 6 and the circuit substrate 1 is the same as that in the first embodiment corresponding to the related descriptions in FIGS. 8 and 9 , and details are not repeated here.

換個角度來說，所述第一增設層2與所述第二增設層3分別形成於所述線路基板1與所述熱管6的相反兩側。再者，多個所述散熱孔41、51及多個所述吸熱孔42、52的位置分別對應於所述第一增設層2與所述第二增設層3的至少其中之一；或是說，多個所述散熱孔41、51及多個所述吸熱孔42、52形成於所述第一防焊層4與所述第二防焊層5的至少其中之一。於本實施例中，多個所述散熱孔41、51及多個所述吸熱孔42、52是分別形成於所述第一防焊層4與所述第二防焊層5。In other words, the first extension layer 2 and the second extension layer 3 are respectively formed on opposite sides of the circuit substrate 1 and the heat pipe 6 . Furthermore, the positions of the plurality of heat dissipation holes 41 and 51 and the plurality of heat absorption holes 42 and 52 respectively correspond to at least one of the first extension layer 2 and the second extension layer 3 ; or In other words, a plurality of the heat dissipation holes 41 and 51 and a plurality of the heat absorption holes 42 and 52 are formed in at least one of the first solder resist layer 4 and the second solder resist layer 5 . In this embodiment, a plurality of the heat dissipation holes 41 and 51 and a plurality of the heat absorption holes 42 and 52 are respectively formed in the first solder resist layer 4 and the second solder resist layer 5 .

更詳細地說，所述第一增設層2內埋置有多個第一導熱柱21，並且多個所述第一導熱柱21的一端裸露於至少一個所述散熱孔41、51及至少一個所述吸熱孔42、52之外，而多個所述第一導熱柱21的另一端分別連接於所述第一線路層11與所述熱管6。也就是說，多個所述第一導熱柱21的所述一端是裸露於形成在所述第一防焊層4的所述散熱孔41、51及所述吸熱孔42、52。In more detail, a plurality of first thermally conductive pillars 21 are embedded in the first additional layer 2 , and one end of the plurality of first thermally conductive pillars 21 is exposed to at least one of the heat dissipation holes 41 , 51 and at least one of the heat dissipation holes 41 and 51 . Outside the heat absorption holes 42 and 52 , the other ends of the plurality of first thermally conductive pillars 21 are respectively connected to the first circuit layer 11 and the heat pipe 6 . That is to say, the one ends of the plurality of first thermal conductive pillars 21 are exposed to the heat dissipation holes 41 , 51 and the heat absorption holes 42 , 52 formed in the first solder resist layer 4 .

再者，所述第二增設層3內埋置有多個第二導熱柱31，並且多個所述第二導熱柱31的一端裸露於至少一個所述散熱孔41、51及至少一個所述吸熱孔42、52之外，而多個所述第二導熱柱31的另一端連接於所述熱管6及所述第二線路層12。也就是說，多個所述第二導熱柱31的所述一端是裸露於形成在所述第二防焊層5的所述散熱孔41、51及所述吸熱孔42、52。Furthermore, a plurality of second thermally conductive pillars 31 are embedded in the second additional layer 3 , and one end of the plurality of second thermally conductive pillars 31 is exposed to at least one of the heat dissipation holes 41 and 51 and at least one of the heat dissipation holes 41 and 51 . Besides the heat absorption holes 42 and 52 , the other ends of the plurality of second thermally conductive pillars 31 are connected to the heat pipe 6 and the second circuit layer 12 . That is to say, the ends of the plurality of second thermally conductive pillars 31 are exposed to the heat dissipation holes 41 , 51 and the heat absorption holes 42 , 52 formed in the second solder resist layer 5 .

據此，多個所述散熱孔41、51及多個所述吸熱孔42、52的位置於本實施例中是分別對應於所述第一增設層2的多個所述第一導熱柱21與所述第二增設層3的多個所述第二導熱柱31。再者，所述導熱線路網N包含有所述第一線路層11、所述導電連接層15、多個所述第一導熱柱21、所述第二線路層12、及多個所述第二導熱柱31。Accordingly, the positions of the plurality of heat dissipation holes 41 , 51 and the plurality of heat absorption holes 42 , 52 in this embodiment correspond to the plurality of first thermal conductive pillars 21 of the first additional layer 2 respectively. and a plurality of the second thermal conductive pillars 31 of the second additional layer 3 . Furthermore, the thermally conductive circuit network N includes the first circuit layer 11 , the conductive connection layer 15 , a plurality of the first thermally conductive pillars 21 , the second circuit layer 12 , and a plurality of the first circuit layers 12 . Two thermally conductive pillars 31 .

此外，在本發明未繪示的其他實施例中，所述第二增設層3內的多個所述第二導熱柱31可以僅裸露於所述散熱孔41、51之外且連接於所述熱管6；或者，所述第二增設層3內的多個所述第二導熱柱31可以僅裸露於所述吸熱孔42、52之外且連接於所述第二線路層12；又或者，所述第二增設層3內的可以不設有任何所述第二導熱柱31，而所述導熱線路網N包含有所述第一線路層11、所述導電連接層15、及多個所述第一導熱柱21。In addition, in other embodiments not shown in the present invention, the plurality of second thermal conductive pillars 31 in the second additional layer 3 may only be exposed outside the heat dissipation holes 41 and 51 and connected to the heat pipe 6; alternatively, the plurality of second thermal conductive pillars 31 in the second additional layer 3 may only be exposed outside the heat absorption holes 42 and 52 and connected to the second circuit layer 12; or, The second additional layer 3 may not be provided with any of the second thermally conductive pillars 31 , and the thermally conductive circuit network N includes the first circuit layer 11 , the conductive connection layer 15 , and a plurality of The first thermal conductive column 21 is described.

以上為本實施例中的所述電路板結構100的構造說明，以下接著介紹所述電路板結構100相較於多個所述散熱元件200與多個所述發熱元件300之間的連接關係。其中，多個所述散熱元件200分別配置於所述電路板結構100的多個所述散熱孔41、51而連接於所述導熱線路網N，並且多個所述發熱元件300分別配置於所述電路板結構100的多個所述吸熱孔42、52而連接於所述導熱線路網N。The above is a description of the structure of the circuit board structure 100 in this embodiment, and the following describes the connection relationship between the circuit board structure 100 compared to the plurality of heat dissipation elements 200 and the plurality of the heating elements 300 . Wherein, a plurality of the heat dissipation elements 200 are respectively arranged in the plurality of the heat dissipation holes 41 and 51 of the circuit board structure 100 to be connected to the heat conduction circuit network N, and the plurality of the heating elements 300 are respectively arranged in the plurality of the heat dissipation holes 41 and 51 of the circuit board structure 100 The plurality of the heat absorption holes 42 and 52 of the circuit board structure 100 are connected to the heat conduction circuit network N.

據此，至少一個所述發熱元件300所產生的熱能用來通過所述導熱線路網N的傳輸，以使所述熱管6內的所述導熱流體6c形成兩個熱循環，進而分別於兩個所述散熱元件200進行散熱。或是說，所述電路板結構100於本實施例中能夠通過所述導熱線路網N與所述熱管6的相互搭配（如：多個所述散熱區64與多個所述吸熱區65於所述長度方向L上分別位於不同的位置），進而適用於產熱效率不同的多個所述發熱元件300。Accordingly, the heat energy generated by at least one of the heating elements 300 is used for transmission through the heat-conducting circuit network N, so that the heat-conducting fluid 6c in the heat pipe 6 forms two heat cycles, and then the heat-conducting fluid 6c in the heat pipe 6 is divided into two The heat dissipation element 200 dissipates heat. In other words, in this embodiment, the circuit board structure 100 can be matched with the heat pipe 6 through the heat conduction circuit network N (for example, the plurality of heat dissipation areas 64 and the plurality of heat absorption areas 65 are located in are located at different positions in the longitudinal direction L), and are further suitable for a plurality of the heating elements 300 with different heat generation efficiencies.

[本發明實施例的技術效果][Technical effects of the embodiments of the present invention]

綜上所述，本發明實施例所公開的電路板結構及其製造方法，其在實施例一中通過擠壓所述熱管而使其變形為合適的外形，以令所述熱管能夠妥善地埋置於所述線路基板內，進而有效地提升散熱的效能。To sum up, in the circuit board structure and the manufacturing method thereof disclosed in the embodiments of the present invention, in the first embodiment, the heat pipe is deformed into a suitable shape by extruding the heat pipe, so that the heat pipe can be properly buried placed in the circuit substrate, thereby effectively improving the heat dissipation performance.

再者，本發明實施例所公開的電路散熱模組及電路板結構，其在實施例二中通過所述主板體的所述導熱線路網搭配於所述熱管，以使其熱能傳輸路徑是構成多輸入多輸出的分流散熱架構，進而令所述電路板結構能夠適用於產熱效率不同的多個所述發熱元件，據以有效地提升散熱的效果。Furthermore, in the circuit heat dissipation module and the circuit board structure disclosed in the embodiment of the present invention, in the second embodiment, the heat conduction circuit network of the main board body is matched with the heat pipe, so that the heat energy transmission path is formed. The multi-input and multi-output shunt heat dissipation structure enables the circuit board structure to be suitable for a plurality of the heat generating elements with different heat generation efficiencies, thereby effectively improving the heat dissipation effect.

以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的專利範圍內。The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

1000:電路散熱模組1000: circuit cooling module

100:電路板結構100: Circuit Board Structure

1:線路基板1: circuit substrate

11:第一線路層11: The first circuit layer

12:第二線路層12: Second circuit layer

13:內線路層13: Internal circuit layer

14:槽孔14: Slotted hole

15:導電連接層15: Conductive connection layer

2:第一增設層2: The first additional floor

21:第一導熱柱21: The first thermal column

3:第二增設層3: The second additional floor

31:第二導熱柱31: Second thermal column

4:第一防焊層4: The first solder mask

41:散熱孔41: cooling holes

42:吸熱孔42: Endothermic hole

5:第二防焊層5: The second solder mask

51:散熱孔51: cooling holes

52:吸熱孔52: Endothermic hole

6:熱管6: Heat pipe

6c:導熱流體6c: Thermal fluid

61:第一端部61: First end

62:第二端部62: Second end

63:側緣63: Lateral edge

64:散熱區64: heat dissipation area

65:吸熱區65: Endothermic zone

M:主板體M: mainboard body

N:導熱線路網N: heat conduction circuit network

200:散熱元件200: cooling element

300:發熱元件300: heating element

L:長度方向L: length direction

D6:外徑D6: outer diameter

D14:孔深D14: hole depth

S110:前置步驟S110: Preliminary Steps

S120:選管步驟S120: Pipe selection step

S130:配置步驟S130: Configuration steps

S140:埋入步驟S140: Embedding step

S150:增層步驟S150: Layer-Up Step

S160:導熱步驟S160: Thermal Conduction Step

S170:防焊步驟S170: Solder Mask Step

圖1為本發明實施例一的電路板結構的立體示意圖。FIG. 1 is a three-dimensional schematic diagram of a circuit board structure according to Embodiment 1 of the present invention.

圖2為本發明實施例一的電路板結構的製造方法的前置步驟示意圖（一）。FIG. 2 is a schematic diagram (1) of the pre-steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

圖3為本發明實施例一的電路板結構的製造方法的前置步驟示意圖（二）。FIG. 3 is a schematic diagram (2) of the pre-steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

圖4為本發明實施例一的電路板結構的製造方法的選管步驟與配置步驟示意圖。FIG. 4 is a schematic diagram of the tube selection steps and the configuration steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

圖5為本發明實施例一的電路板結構的製造方法的埋入步驟示意圖。FIG. 5 is a schematic diagram of the embedding steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

圖6為本發明實施例一的電路板結構的製造方法的增層步驟示意圖。FIG. 6 is a schematic diagram of the build-up steps of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

圖7為本發明實施例一的電路板結構的製造方法的導熱步驟示意圖。FIG. 7 is a schematic diagram of a heat conduction step of the manufacturing method of the circuit board structure according to the first embodiment of the present invention.

圖8為本發明實施例一的電路板結構的製造方法的防焊步驟示意圖，其為圖1沿剖線VIII-VIII的剖視示意圖。FIG. 8 is a schematic diagram of a solder mask step of the manufacturing method of the circuit board structure according to the first embodiment of the present invention, which is a schematic cross-sectional view taken along the line VIII-VIII in FIG. 1 .

圖9為圖8的另一態樣的示意圖。FIG. 9 is a schematic diagram of another aspect of FIG. 8 .

圖10為圖1的局部立體剖視示意圖。FIG. 10 is a schematic partial perspective cross-sectional view of FIG. 1 .

圖11為本發明實施例二的電路散熱模組的立體示意圖。11 is a schematic perspective view of a circuit heat dissipation module according to Embodiment 2 of the present invention.

圖12為圖11的局部立體剖視示意圖（一）。FIG. 12 is a partial perspective cross-sectional schematic diagram (1) of FIG. 11 .

圖13為圖11的局部立體剖視示意圖（二）。FIG. 13 is a schematic partial perspective cross-sectional view (2) of FIG. 11 .

圖14為圖11沿剖線XIV-XIV的剖視示意圖。FIG. 14 is a schematic cross-sectional view along the line XIV-XIV of FIG. 11 .

1:線路基板 1: circuit substrate

11:第一線路層 11: The first circuit layer

12:第二線路層 12: Second circuit layer

13:內線路層 13: Internal circuit layer

14:槽孔 14: Slotted hole

15:導電連接層 15: Conductive connection layer

6:熱管 6: Heat pipe

6c:導熱流體 6c: Thermal fluid

61:第一端部 61: First end

62:第二端部 62: Second end

63:側緣 63: Lateral edge

D6:外徑 D6: outer diameter

D14:孔深 D14: hole depth

S120:選管步驟 S120: Pipe selection step

S130:配置步驟 S130: Configuration steps

Claims

一種電路板結構的製造方法，其包括：一前置步驟：在一線路基板形成有貫穿狀的一槽孔，並於所述槽孔的孔壁上形成有一導電連接層；一選管步驟：挑選內部設有導熱流體的一熱管(heat pipe)；其中，所述熱管的一外徑大於所述槽孔的孔深；一配置步驟：將所述熱管置於所述線路基板的所述槽孔內且未接觸於所述導電連接層，並使所述熱管的局部突伸出所述槽孔；一埋入步驟：擠壓所述熱管，以使所述熱管變形而抵接於所述導電連接層、並使所述熱管完全位於所述槽孔之內；以及一增層步驟：在所述線路基板與所述熱管的一側形成有一第一增設層，並在所述線路基板與所述熱管的另一側形成有一第二增設層，以使所述第一增設層與所述第二增設層填滿所述熱管與所述導電連接層之間的間隙。 A method for manufacturing a circuit board structure, comprising: a pre-step: forming a through-slot hole on a circuit substrate, and forming a conductive connection layer on the hole wall of the slot hole; a tube selection step: selecting A heat pipe with heat-conducting fluid is arranged inside; wherein, an outer diameter of the heat pipe is larger than the hole depth of the slot hole; a configuration step: placing the heat pipe in the slot hole of the circuit substrate inside and not in contact with the conductive connection layer, and make a part of the heat pipe protrude out of the slot; an embedding step: squeeze the heat pipe, so that the heat pipe is deformed and abutted on the conductive connecting the layer and making the heat pipe completely inside the slot; and a layer build-up step: forming a first build-up layer on one side of the circuit substrate and the heat pipe, and forming a first build-up layer on the circuit substrate and the heat pipe. A second extension layer is formed on the other side of the heat pipe, so that the first extension layer and the second extension layer fill the gap between the heat pipe and the conductive connection layer.

如請求項1所述的電路板結構的製造方法，其中，所述線路基板包含有埋置於所述第一增設層內的一第一線路層，並且所述第一線路層連接於所述導電連接層且切齊於所述熱管的一第一端部；其中，所述電路板結構的成形方法在所述增層步驟之後，進一步包含：一導熱步驟：於所述第一增設層形成有埋置於內多個第一導熱柱，並且多個所述第一導熱柱的一端則裸露於所述第一增設層之外，而多個所述第一導熱柱的另一端分別連接於所述第一線路層與所述熱管的所述第一端部。 The method for manufacturing a circuit board structure according to claim 1, wherein the circuit substrate includes a first circuit layer embedded in the first additional layer, and the first circuit layer is connected to the The conductive connection layer is aligned with a first end of the heat pipe; wherein, the forming method of the circuit board structure further comprises: a heat conduction step after the build-up step: forming on the first build-up layer There are a plurality of first thermally conductive pillars embedded therein, one end of the plurality of first thermally conductive pillars is exposed outside the first additional layer, and the other ends of the plurality of first thermally conductive pillars are respectively connected to the first circuit layer and the first end of the heat pipe.

如請求項2所述的電路板結構的製造方法，其中，所述線路基板包含有埋置於所述第二增設層內的一第二線路層，並且所述第二線路層連接於所述導電連接層且切齊於所述熱管的一第二端部；於所述導熱步驟中，於所述第二增設層形成有埋置於內多個第二導熱柱，並且多個所述第二導熱柱的一端則裸露於所述第二增設層之外，而多個所述第一導熱柱的另一端連接於所述熱管的所述第二端部。 The method for manufacturing a circuit board structure according to claim 2, wherein the circuit substrate includes a second circuit layer embedded in the second additional layer, and the second circuit layer is connected to the The conductive connection layer is aligned with a second end of the heat pipe; in the heat conduction step, a plurality of second heat conduction columns embedded in the second additional layer are formed, and a plurality of the first heat conduction columns are formed. One end of the two heat-conducting columns is exposed outside the second additional layer, and the other ends of the plurality of first heat-conducting columns are connected to the second end of the heat pipe.

如請求項2所述的電路板結構的製造方法，其中，所述電路板結構的成形方法在所述增層步驟之後，進一步包含：一防焊步驟：於所述第一增設層上形成有一第一防焊層，並且於所述第二增設層上形成有一第二防焊層；其中，多個所述第一導熱柱的所述一端裸露於所述第一防焊層之外。 The method for manufacturing a circuit board structure according to claim 2, wherein the method for forming the circuit board structure further comprises, after the build-up step, a solder mask step: forming a solder mask on the first build-up layer A first solder resist layer is formed, and a second solder resist layer is formed on the second additional layer; wherein, the one ends of the plurality of first heat conduction columns are exposed outside the first solder resist layer.

如請求項1所述的電路板結構的製造方法，其中，於所述選管步驟中，所述熱管的體積介於所述槽孔的容積的70%~110%。 The method for manufacturing a circuit board structure according to claim 1, wherein, in the pipe selection step, the volume of the heat pipe is between 70% and 110% of the volume of the slot hole.

如請求項1所述的電路板結構的製造方法，其中，於所述前置步驟中，以一藥水來對所述導電連接層進行氧化。 The method for manufacturing a circuit board structure according to claim 1, wherein, in the pre-step, a potion is used to oxidize the conductive connection layer.

如請求項1所述的電路板結構的製造方法，其中，所述熱管包含有面向所述導電連接層的兩個側緣，並且所述熱管於擠壓變形後，每個所述側緣呈平面狀且平貼於其所面向的所述導電連接層的部位。 The method for manufacturing a circuit board structure according to claim 1, wherein the heat pipe includes two side edges facing the conductive connection layer, and after the heat pipe is squeezed and deformed, each of the side edges is in the shape of two sides. It is planar and flatly attached to the portion of the conductive connection layer that it faces.

如請求項1所述的電路板結構的製造方法，其中，所述熱管包含有面向所述導電連接層的兩個側緣，並且所述熱管於擠壓變形後，每個所述側緣呈圓弧狀且抵接於其所面向的所述導電連接層的部位的局部。 The method for manufacturing a circuit board structure according to claim 1, wherein the heat pipe It includes two side edges facing the conductive connection layer, and after the heat pipe is extruded and deformed, each of the side edges is in the shape of an arc and abuts against the portion of the conductive connection layer that it faces. local.

一種電路板結構，其以實施如請求項1所述的電路板結構的製造方法所製成。A circuit board structure is manufactured by implementing the manufacturing method of the circuit board structure as claimed in claim 1.