TWI750733B - Immersion cooling device and electronic device including the same - Google Patents

Immersion cooling device and electronic device including the same Download PDF

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TWI750733B
TWI750733B TW109123730A TW109123730A TWI750733B TW I750733 B TWI750733 B TW I750733B TW 109123730 A TW109123730 A TW 109123730A TW 109123730 A TW109123730 A TW 109123730A TW I750733 B TWI750733 B TW I750733B
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liquid
cooling device
immersion cooling
conductive liquid
side walls
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TW109123730A
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Chinese (zh)
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TW202203736A (en
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洪銀樹
尹佐國
李明聰
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建準電機工業股份有限公司
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Priority to TW109123730A priority Critical patent/TWI750733B/en
Priority to CN202021461550.0U priority patent/CN213694613U/en
Priority to CN202010711396.6A priority patent/CN113939142A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

An immersion cooling device and electronic device including the same are provided to reducing the high usage and high cost of non-conductive liquid. The immersion cooling device includes a sealed tank and an electrical positioning seat. The sealed tank has a cavity inside, which is filled with non-conductive liquid. The electrical positioning seat is located in the cavity, with a plurality of fixing brackets on a base and formed a slot between two of the fixing brackets. A heat source is placed in the slots and immersed in the non-conductive liquid.

Description

浸沒式冷卻裝置及具有該浸沒式冷卻裝置的電子設備 Immersion cooling device and electronic equipment having the same

本發明係關於一種電氣單元的冷卻裝置，尤其是一種將電氣單元沉浸於不導電液中以維持適當工作溫度的浸沒式冷卻裝置及具有該浸沒式冷卻裝置的電子設備。 The present invention relates to a cooling device for an electric unit, especially an immersion cooling device for immersing the electric unit in a non-conductive liquid to maintain a proper working temperature, and an electronic device having the immersion cooling device.

浸沒式冷卻(Immersion cooling)是將電氣單元(例如伺服器、主機板、中央處理器、顯示卡或記憶體等)沉浸於不導電液中，使電氣單元工作時所產生的高溫熱能可直接由該不導電液吸收，使電氣單元能夠維持適當的工作溫度，以達到預期的工作效能與使用壽命。 Immersion cooling is to immerse electrical units (such as servers, motherboards, central processing units, display cards or memory, etc.) It is directly absorbed by the non-conductive liquid, so that the electrical unit can maintain a proper working temperature to achieve the expected working efficiency and service life.

常見的習知浸沒式冷卻裝置大致上包含有一冷卻槽及一冷凝器，該冷卻槽內的下層填裝有液態的不導電液，該冷凝器裝設於該冷卻槽內的上層而位於液態的不導電液上方。需要冷卻的電氣單元係沉浸於液態的不導電液中，由於不導電液的沸點較低，可以在吸收該電氣單元的工作熱能後，使部分的不導電液轉變成氣態，以於液態的不導電液中形成氣泡並向上浮起，直至離開液態不導電液的表層後，在接觸該冷凝器時再度凝結回液態並向下滴落。 A common conventional immersion cooling device generally includes a cooling tank and a condenser, the lower layer in the cooling tank is filled with liquid non-conductive liquid, and the condenser is installed in the upper layer in the cooling tank and is located in the liquid state. Above the non-conductive liquid. The electrical unit that needs to be cooled is immersed in a liquid non-conductive liquid. Due to the low boiling point of the non-conductive liquid, part of the non-conductive liquid can be transformed into a gaseous state after absorbing the working heat energy of the electrical unit, so that the liquid non-conductive liquid can be converted into a gaseous state. Bubbles are formed in the conductive liquid and float upward until it leaves the surface layer of the liquid non-conductive liquid, and then condenses back to the liquid state and drips downward when it contacts the condenser.

其中，習知的浸沒式冷卻裝置大多會在該冷卻槽內放置一分隔架，以供數個電氣單元逐一插設定位。但該分隔架係由薄片構成，本身的體 積並不大；亦即，該冷卻槽內的液位並不會因放置有該分隔架而上升多少。因此，為能使不導電液充分浸潤各該電氣單元，該冷卻槽中的不導電液用量通常需要很多，而不導電液的價格昂貴，導致整體浸沒式冷卻裝置的使用成本難以下降。 Among them, most of the conventional immersion cooling devices place a partition frame in the cooling tank, so that several electrical units can be inserted and set in position one by one. However, the divider is composed of thin sheets, and its own body The volume is not large; that is, the liquid level in the cooling tank does not rise much due to the placement of the divider. Therefore, in order to fully infiltrate the electrical units with the non-conductive liquid, a large amount of the non-conductive liquid is usually required in the cooling tank.

有鑑於此，習知的浸沒式冷卻裝置確實仍有加以改善之必要。 In view of this, the conventional immersion cooling device still needs to be improved.

為解決上述問題，本發明的目的是提供一種浸沒式冷卻裝置及具有該浸沒式冷卻裝置的電子設備，其電氣定位座除可供電氣單元穩固架設外，還能使不導電液的液位明顯上升，從而使用較少量的不導電液就能充分浸潤該電氣單元。 In order to solve the above problems, the purpose of the present invention is to provide an immersion cooling device and an electronic device having the immersion cooling device, whose electrical positioning seat can not only be used for stable erection of electrical units, but also can make the liquid level of non-conductive liquid obvious. rise so that the electrical unit can be sufficiently wetted with a smaller amount of non-conductive liquid.

本發明的次一目的是提供一種浸沒式冷卻裝置及具有該浸沒式冷卻裝置的電子設備，可以導引液態或氣態的不導電液順暢流動，使不導電液與電氣單元的熱交換效率提升，有助提升對電氣單元的散熱性能。 Another object of the present invention is to provide an immersion cooling device and an electronic device having the immersion cooling device, which can guide liquid or gaseous non-conductive liquid to flow smoothly, so as to improve the heat exchange efficiency between the non-conductive liquid and the electrical unit, Helps to improve the heat dissipation performance of the electrical unit.

本發明的又一目的是提供一種浸沒式冷卻裝置及具有該浸沒式冷卻裝置的電子設備，可以對流體產生擾流效果，並增加整體散熱面積以提升對電氣單元的散熱效率。 Another object of the present invention is to provide an immersion cooling device and an electronic device having the immersion cooling device, which can produce a turbulent flow effect on the fluid and increase the overall heat dissipation area to improve the heat dissipation efficiency of the electrical unit.

本發明的再一目的是提供一種浸沒式冷卻裝置及具有該浸沒式冷卻裝置的電子設備，可降低不導電液的流失量。 Another object of the present invention is to provide an immersion cooling device and an electronic device having the immersion cooling device, which can reduce the loss of non-conductive liquid.

本發明全文所述方向性或其近似用語，例如「前」、「後」、「左」、「右」、「上(頂)」、「下(底)」、「內」、「外」、「側面」等，主要係參考附加圖式的方向，各方向性或其近似用語僅用以輔助說明及理解本發明的各實施例，非用以限制本發明。 The directionality or similar terms used throughout the present disclosure, such as "front", "back", "left", "right", "top (top)", "bottom (bottom)", "inside", "outside" , "side surface", etc., mainly refer to the directions of the attached drawings, each directionality or its similar terms are only used to assist the description and understanding of the various embodiments of the present invention, and are not intended to limit the present invention.

本發明全文所記載的元件及構件使用「一」或「一個」之量詞， 僅是為了方便使用且提供本發明範圍的通常意義；於本發明中應被解讀為包括一個或至少一個，且單一的概念也包括複數的情況，除非其明顯意指其他意思。 The elements and components described in the full text of the present invention use the quantifier "a" or "an", It is for convenience only and to provide a general meaning of the scope of the invention; it should be read in the present invention to include one or at least one, and a single concept also includes the plural unless it is obvious that it is meant otherwise.

本發明全文所述「結合」、「組合」或「組裝」等近似用語，主要包含連接後仍可不破壞構件地分離，或是連接後使構件不可分離等型態，係本領域中具有通常知識者可以依據欲相連之構件材質或組裝需求予以選擇者。 Similar terms such as "combined", "combined" or "assembled" mentioned in the whole text of the present invention mainly include the components that can be separated without destroying the components after the connection, or the components can not be separated after being connected, which are common knowledge in the field. It can be selected according to the material of the components to be connected or the assembly requirements.

本發明的浸沒式冷卻裝置，可用以冷卻至少一熱源，包含：一密封槽，內部具有一腔室，該腔室中填裝有一不導電液；及一電氣定位座，位於該腔室中，具有數個固定架位於一底座上，二相鄰的固定架之間形成一插槽，該熱源位於該插槽中，且該不導電液浸潤該熱源。 The immersion cooling device of the present invention can be used for cooling at least one heat source, comprising: a sealing groove with a cavity inside, the cavity is filled with a non-conductive liquid; and an electrical positioning seat located in the cavity, Several fixing frames are located on a base, a slot is formed between two adjacent fixing frames, the heat source is located in the slot, and the non-conductive liquid infiltrates the heat source.

據此，本發明的浸沒式冷卻裝置，其電氣定位座除可供電氣單元穩固架設外，還能使不導電液的液位明顯上升，從而使用較少量的不導電液就能充分浸潤該電氣單元，故可節省不導電液的用量，具有降低不導電液的使用成本等功效。 Accordingly, in the immersion cooling device of the present invention, the electrical positioning seat can not only be used for stable erection of the electrical unit, but also the liquid level of the non-conductive liquid can be significantly increased, so that the non-conductive liquid can be fully infiltrated by using a small amount of the non-conductive liquid. Therefore, the amount of non-conductive liquid can be saved, and the use cost of non-conductive liquid can be reduced.

其中，該電氣定位座可以具有至少一進液通道，該進液通道可以位於該數個插槽下方，並可以連通該數個插槽。如此，具有提升不導電液流動順暢度等功效。 Wherein, the electrical positioning seat may have at least one liquid inlet channel, and the liquid inlet channel may be located under the plurality of slots and may communicate with the plurality of slots. In this way, it has the effect of improving the smoothness of the flow of the non-conductive liquid.

其中，各該固定架可以具有呈縱向延伸的數個氣泡導槽，各該氣泡導槽可以連通該固定架的頂端及該進液通道。如此，被加溫而轉換成氣態的不導電液可以形成氣泡，並順著該數個氣泡導槽的導引而順暢向上流動，具有提升散熱性能等功效。 Wherein, each of the fixing frames may have several air bubble guide grooves extending longitudinally, and each of the air bubble guide grooves may communicate with the top of the fixing frame and the liquid inlet channel. In this way, the non-conductive liquid that is heated and converted into a gaseous state can form bubbles and flow upward smoothly along the guidance of the plurality of bubble guide grooves, thereby improving heat dissipation performance and the like.

其中，該氣泡導槽的寬度可以由下而上遞增。如此，具有提升氣泡流動順暢度等功效。 Wherein, the width of the bubble guide groove may increase from bottom to top. In this way, it has the effect of improving the smoothness of the flow of the bubbles.

其中，該電氣定位座可以具有用以結合固定一電氣單元的一夾架，該夾架可以卡掣結合對應的固定架。如此，可以由簡易的結構固定該電氣單元，具有降低製造成本及提升組裝便利性等功效。 Wherein, the electrical positioning base may have a clamping frame for fixing an electrical unit in combination, and the clamping frame can be clamped and combined with a corresponding fixing frame. In this way, the electrical unit can be fixed by a simple structure, which has the effects of reducing the manufacturing cost and improving the convenience of assembly.

其中，該電氣定位座可以具有相對的二側牆，該二側牆可以位於該底座上，該數個固定架可以位於該二側牆之間，各該側牆與最鄰近的固定架之間可以形成可供一電氣單元插設定位的一插槽。如此，可以在有限空間下提升該電氣定位座所能插設的電氣單元總數量，具有提升空間利用率等功效。 Wherein, the electrical positioning base may have two opposite side walls, the two side walls may be located on the base, the plurality of fixing frames may be located between the two side walls, and between each of the side walls and the nearest fixing frame A slot can be formed into which an electrical unit can be inserted and set. In this way, the total number of electrical units that can be inserted into the electrical positioning seat can be increased in a limited space, which has the effect of improving space utilization rate and the like.

其中，該密封槽可以具有一環牆及一封底盤，該封底盤的一凸環部可以呈液密地結合該環牆並可以位於該腔室中，該底座可以置於該凸環部所圈圍出的空間內，該二側牆可以由局部連接該底座，且局部可以位在該凸環部上方，各該側牆背向該數個固定架的部位可以與該環牆內壁的形狀相符。如此，該底座及該二側牆都能佔用掉該腔室中較不易用來架設該電氣單元的空間，以節省不導電液的用量，具有降低不導電液的使用成本等功效。 Wherein, the sealing groove can have a ring wall and a sealing bottom plate, a convex ring part of the sealing bottom plate can be liquid-tightly combined with the ring wall and can be located in the cavity, and the base can be placed on the convex ring part. In the enclosed space, the two side walls can be partially connected to the base, and a part can be located above the convex ring portion, and the part of each side wall facing away from the plurality of fixing frames can be the same as the shape of the inner wall of the ring wall. match. In this way, the base and the two side walls can occupy the space in the chamber that is not easily used for erecting the electrical unit, so as to save the amount of the non-conductive liquid and reduce the use cost of the non-conductive liquid.

其中，該底座可以具有至少一貫穿槽，該貫穿槽可以連通該數個插槽，一流體驅動件可以驅動該不導電液通過該貫穿槽並流入該數個插槽。如此，該流體驅動件可以驅動不導電液循環流動，具有提升對電氣單元的散熱性能等功效。 Wherein, the base can have at least one through groove, the through groove can communicate with the plurality of slots, and a fluid driving element can drive the non-conductive liquid to pass through the through groove and flow into the plurality of slots. In this way, the fluid driving member can drive the non-conductive liquid to circulate and flow, and has functions such as improving the heat dissipation performance of the electrical unit.

其中，該電氣定位座可以具有相對的二側牆，該二側牆可以位於該底座上，該數個固定架可以位於該二側牆之間，各該側牆可以具有呈縱向延伸的至少一導液通道，該導液通道可以連通該側牆的頂端及該貫穿槽，該流體驅動件可以驅動該不導電液通過該導液通道及該貫穿槽再流入該數個插槽。如此，可以將輸入及流出該插槽的不導電液分流，避免干擾彼此溫度，具有提升對電氣單元的散熱效率等功效。 Wherein, the electrical positioning base may have two opposite side walls, the two side walls may be located on the base, the plurality of fixing frames may be located between the two side walls, and each of the side walls may have at least one longitudinally extending A liquid guiding channel, the liquid guiding channel can communicate with the top of the side wall and the through groove, and the fluid driving element can drive the non-conductive liquid to flow into the plurality of slots through the liquid guiding channel and the through groove. In this way, the non-conductive liquid entering and flowing out of the slot can be shunted to avoid interfering with each other's temperature, thereby improving the heat dissipation efficiency of the electrical unit and the like.

其中，該流體驅動件可以位於該貫穿槽中或可以位於該導液通道中。如此，提升空間利用率等功效。 Wherein, the fluid driving member may be located in the through groove or may be located in the liquid guiding channel. In this way, the efficiency of space utilization is improved.

其中，該腔室中另可以填裝有一保護液，該保護液的密度可以低於該不導電液的密度，該保護液的沸點可以高於該不導電液的沸點。如此，液態不導電液可以在吸收熱能後轉換成氣態，並形成氣泡而上升進入液態保護液中，使氣態的不導電液可以在液態環境中凝結回液態，再下沉回到該保護液下方，具有降低氣態不導電液流失量等功效。 Wherein, the chamber can be filled with a protective liquid, the density of the protective liquid can be lower than the density of the non-conductive liquid, and the boiling point of the protective liquid can be higher than the boiling point of the non-conductive liquid. In this way, the liquid non-conductive liquid can be converted into a gas state after absorbing heat energy, and form bubbles and rise into the liquid protective liquid, so that the gaseous non-conductive liquid can condense back to a liquid state in a liquid environment, and then sink back under the protective liquid , has the effect of reducing the loss of gaseous non-conductive liquid.

本發明的電子設備，可以包含：上述之一浸沒式冷卻裝置；及至少一電氣單元，插設定位於該插槽中，該電氣單元具有該熱源。如此，該電子設備可以藉由該電氣定位座供該電氣單元穩固架設，還能使不導電液的液位明顯上升，從而使用較少量的不導電液就能充分浸潤該電氣單元的熱源，具有降低不導電液的使用成本等功效。 The electronic device of the present invention may include: one of the above-mentioned immersion cooling devices; and at least one electrical unit, which is inserted into the slot, and the electrical unit has the heat source. In this way, the electronic equipment can be stably erected by the electrical positioning seat for the electrical unit, and the liquid level of the non-conductive liquid can also be significantly increased, so that the heat source of the electrical unit can be fully infiltrated by using a small amount of the non-conductive liquid, It has the effect of reducing the use cost of non-conductive liquid.

該電子設備另可以包含至少一輔助散熱器，該輔助散熱器具有一導熱基板貼接該電氣單元的熱源，一多孔層結構接觸該導熱基板及該不導電液。如此，藉由該多孔層結構可增加散熱面積的特性，可更加快速地將該熱源所產生的熱能傳遞給該不導電液，具有提升對該電氣單元的散熱效率等功效。 The electronic device may further include at least one auxiliary heat sink, the auxiliary heat sink has a heat-conducting substrate attached to the heat source of the electrical unit, and a porous layer structure contacts the heat-conducting substrate and the non-conductive liquid. In this way, the porous layer structure can increase the heat dissipation area, the heat energy generated by the heat source can be transferred to the non-conductive liquid more quickly, and the heat dissipation efficiency of the electrical unit can be improved.

其中，該多孔層結構的外表面可以具有凸出或凹陷狀的數個擾流部。如此，可以使流體通過此處時產生渦流，進而擾動周遭流體，增加整體散熱面積，具有提升對該電氣單元的散熱效率等功效。 Wherein, the outer surface of the porous layer structure may have several protruding or concave spoilers. In this way, eddy currents can be generated when the fluid passes here, thereby disturbing the surrounding fluids, increasing the overall heat dissipation area, and improving the heat dissipation efficiency of the electrical unit.

其中，該擾流部的橫截面可以呈三角形。如此，具有更進一步提升對該電氣單元的散熱效率等功效。 Wherein, the cross section of the spoiler may be triangular. In this way, the heat dissipation efficiency of the electrical unit can be further improved.

其中，該輔助散熱器可以具有一框架，該框架可以具有一鏤空口，該框架可以連接該導熱基板，該多孔層結構可以對位於該鏤空口的範圍 內。如此，該框架可以保護該多孔層結構不易受損，並強化整體輔助散熱器的結構，具有降低該輔助散熱器受損率及提升組裝便利性等功效。 Wherein, the auxiliary heat sink can have a frame, the frame can have a hollow opening, the frame can be connected to the thermally conductive substrate, and the porous layer structure can be located in the range of the hollow opening. Inside. In this way, the frame can protect the porous layer structure from being damaged, and strengthen the structure of the overall auxiliary radiator, thereby reducing the damage rate of the auxiliary radiator and improving the convenience of assembly.

其中，該多孔層結構係可以由銅粉燒結形成。如此，該多孔層結構的孔隙細緻且均勻性佳，具有提升散熱效果等功效。 Wherein, the porous layer structure can be formed by sintering copper powder. In this way, the pores of the porous layer structure are fine and uniform, and have functions such as improving the heat dissipation effect.

1:密封槽 1: sealing groove

11:環牆 11: Ring Wall

111:開口 111: Opening

112:蓋合口 112: cover closure

12:封底盤 12: Seal the chassis

12a:盤體 12a: Disc body

12b:凸環部 12b: Convex part

121:結合部 121: Joint

13:槽蓋 13: Slot cover

2:電氣定位座 2: Electrical positioning seat

21:底座 21: Base

211:貫穿槽 211: Through slot

22:固定架 22: Fixed frame

221:氣泡導槽 221: Bubble Guide

23:插槽 23: Slot

24:夾架 24: Clamp frame

25:進液通道 25: Liquid inlet channel

26:側牆 26: Side Wall

261:導液通道 261: catheter channel

27:流體驅動件 27: Fluid Drive

3:輔助散熱器 3: Auxiliary radiator

31:導熱基板 31: Thermally conductive substrate

31a:第一面 31a: first side

31b:第二面 31b: second side

32:多孔層結構 32: Porous layer structure

321:外表面 321: outer surface

322:擾流部 322: Spoiler

33:框架 33: Frame

331:鏤空口 331: Hollow mouth

4:機殼 4: Chassis

C:腔室 C: Chamber

D:浸沒式冷卻裝置 D: Immersion cooling device

E:電氣單元 E: electrical unit

F:內壁 F: inner wall

H:熱源 H: heat source

K:墊塊 K: spacer

L1:不導電液 L1: Non-conductive liquid

L2:保護液 L2: Protective fluid

R:膠圈 R: apron

S:鎖固件 S: Lock Firmware

T:頂端 T: top

W:寬度 W: width

〔第1圖〕本發明第一實施例的分解立體圖。 [FIG. 1] An exploded perspective view of the first embodiment of the present invention.

〔第2圖〕本發明第一實施例的側剖圖。 [FIG. 2] A side sectional view of the first embodiment of the present invention.

〔第3圖〕本發明第一實施例電氣定位座的局部剖視分解立體圖。 [FIG. 3] A partial cross-sectional exploded perspective view of the electrical positioning seat according to the first embodiment of the present invention.

〔第4圖〕本發明第一實施例電氣定位座的俯視剖視圖。 [FIG. 4] A top sectional view of the electrical positioning seat according to the first embodiment of the present invention.

〔第5圖〕本發明第一實施例的使用狀態圖。 [FIG. 5] A use state diagram of the first embodiment of the present invention.

〔第6圖〕本發明第二實施例電氣定位座的立體圖。 [FIG. 6] A perspective view of an electrical positioning seat according to a second embodiment of the present invention.

〔第7圖〕本發明第二實施例的使用狀態圖。 [FIG. 7] A use state diagram of the second embodiment of the present invention.

〔第8圖〕本發明第三實施例電氣定位座的立體圖。 [Fig. 8] A perspective view of an electrical positioning seat according to a third embodiment of the present invention.

〔第9圖〕本發明第三實施例的使用狀態圖。 [Fig. 9] A use state diagram of the third embodiment of the present invention.

〔第10圖〕本發明第四實施例的側剖圖。 [Fig. 10] A side sectional view of a fourth embodiment of the present invention.

〔第11圖〕本發明電子設備的局部剖視示意圖。 [FIG. 11] A schematic partial cross-sectional view of the electronic device of the present invention.

〔第12圖〕本發明另一實施例的輔助散熱器的分解立體圖。 [FIG. 12] An exploded perspective view of an auxiliary radiator according to another embodiment of the present invention.

〔第13圖〕本發明另一實施例的輔助散熱器的組合立體圖。 [FIG. 13] A combined perspective view of an auxiliary radiator according to another embodiment of the present invention.

為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式，作詳細說明如下： In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

請參照第1圖所示，其係本發明浸沒式冷卻裝置D的第一實施例，係包含一密封槽1及一電氣定位座2，該電氣定位座2位於該密封槽1內。 Please refer to FIG. 1 , which is the first embodiment of the immersion cooling device D of the present invention, which includes a sealing groove 1 and an electrical positioning seat 2 , and the electrical positioning seat 2 is located in the sealing groove 1 .

請參照第1、2圖所示，該密封槽1內部具有一腔室C，該腔室C中填裝有一不導電液L1，該不導電液L1可例如為電子工程液等流動性良好但不具導電性的液體。該腔室C中還可容裝該電氣定位座2及需冷卻的至少一電氣單元E，以由該不導電液L1吸收該電氣單元E運作時所產生的熱能。 Referring to Figures 1 and 2, the sealing groove 1 has a chamber C inside, and the chamber C is filled with a non-conductive liquid L1. The non-conductive liquid L1 can be, for example, an electronic engineering liquid with good fluidity but Non-conductive liquid. The chamber C can also accommodate the electrical positioning base 2 and at least one electrical unit E to be cooled, so that the non-conductive liquid L1 can absorb the heat energy generated by the electrical unit E during operation.

本發明不限制該密封槽1的型態，舉例而言，本實施例的密封槽1可以具有一環牆11、一封底盤12及一槽蓋13。該環牆11可以具有一開口111及一蓋合口112，該蓋合口112可以與該開口111相對；在使用狀態下，該開口111可以朝向下，該蓋合口112則可以朝向上。該封底盤12可以呈液密地結合該環牆11並遮蓋該開口111，該槽蓋13則可以呈氣密地結合該環牆11並遮蓋該蓋合口112，以由該環牆11、該封底盤12及該槽蓋13共同圈圍出該腔室C，並確保該腔室C中的液體不會從該密封槽1的底端滲漏至外界，及防止該腔室C中的流體從該槽蓋13與該環牆11之間洩漏至外界。在其他實施例中，該環牆11與該封底盤12也可以一體成型相連(如第7圖所示)，本發明均不加以限制。 The present invention does not limit the type of the sealing groove 1 . For example, the sealing groove 1 in this embodiment may have a ring wall 11 , a sealing bottom plate 12 and a groove cover 13 . The ring wall 11 may have an opening 111 and a cover opening 112 , the cover opening 112 may be opposite to the opening 111 ; in the use state, the opening 111 may face downward, and the cover opening 112 may face upward. The sealing plate 12 can be combined with the ring wall 11 in a liquid-tight manner and cover the opening 111 , and the groove cover 13 can be combined with the ring wall 11 in an air-tight manner and cover the cover opening 112 , so that the ring wall 11 , the The sealing plate 12 and the groove cover 13 together surround the chamber C, and ensure that the liquid in the chamber C will not leak from the bottom end of the sealing groove 1 to the outside, and prevent the fluid in the chamber C from leaking to the outside. It leaks to the outside from between the groove cover 13 and the ring wall 11 . In other embodiments, the ring wall 11 and the cover plate 12 can also be integrally formed and connected (as shown in FIG. 7 ), which is not limited in the present invention.

更詳言之，本實施例的封底盤12可以具有一盤體12a，該盤體12a可以具有數個結合部121，以便將該盤體12a結合固定至該環牆11的預定位置；其中，各該結合部121可例如為鎖孔，並可透過鎖固件S將該盤體12a鎖固結合於該環牆11底端面。本實施例的封底盤12另可以具有一凸環部12b，該凸環部12b可以連接於該盤體12a的頂面並位於該腔室C的底端，該凸環部12b的外周緣可以套有至少一膠圈R，並藉由該膠圈R抵接該 環牆11的內壁F，使該封底盤12與該環牆11之間可形成液密。該槽蓋13也可以具有相類似的結構，於此不再詳述。 More specifically, the cover plate 12 of the present embodiment may have a plate body 12a, and the plate body 12a may have a plurality of joint portions 121, so that the plate body 12a can be combined and fixed to a predetermined position of the ring wall 11; wherein, Each of the joint portions 121 can be, for example, locking holes, and the plate body 12 a can be locked and combined with the bottom end surface of the ring wall 11 through the fastener S. The cover plate 12 of this embodiment may further have a convex ring portion 12b, the convex ring portion 12b may be connected to the top surface of the plate body 12a and located at the bottom end of the chamber C, and the outer peripheral edge of the convex ring portion 12b may be At least one rubber ring R is sleeved, and the rubber ring R abuts the The inner wall F of the ring wall 11 can form a liquid tightness between the sealing plate 12 and the ring wall 11 . The slot cover 13 can also have a similar structure, and details are not described here.

請參照第2、3圖所示，該電氣定位座2可以是塑膠或金屬等材質，本發明並不限制。該電氣定位座2可以穩固設置於該腔室C底端，並供該腔室C中需冷卻的電氣單元E架設定位。例如但不限制地，本實施例的電氣定位座2可以具有一底座21，該底座21可以放置於該封底盤12的凸環部12b所圈圍出的空間內。該電氣定位座2另可以具有數個固定架22位於該底座21上方，以於二相鄰的固定架22之間形成一插槽23，當該電氣單元E為主機板、通訊界面板、顯示板或資料儲存板等片狀結構時，該電氣單元E可以插設定位於該插槽23中，且該不導電液L1可以通過該插槽23而浸潤該電氣單元E的熱源H。舉例而言，本實施例可選擇以一夾架24結合固定在該電氣單元E的上端，並藉由將該夾架24卡掣結合對應的固定架22，使該電氣單元E能維持定位於該插槽23中的預定位置。 Please refer to Figures 2 and 3, the electrical positioning base 2 can be made of plastic or metal, which is not limited in the present invention. The electrical positioning base 2 can be stably arranged at the bottom end of the chamber C, and can be used for setting the position of the electrical unit E in the chamber C that needs to be cooled. For example but not limitation, the electrical positioning base 2 of this embodiment may have a base 21 , and the base 21 may be placed in the space enclosed by the convex ring portion 12 b of the cover base 12 . The electrical positioning base 2 can also have a plurality of fixing frames 22 located above the base 21 to form a slot 23 between two adjacent fixing frames 22. When the electrical unit E is a motherboard, a communication interface board, a display In the case of a sheet-like structure such as a board or a data storage board, the electrical unit E can be inserted into the slot 23 , and the non-conductive liquid L1 can penetrate the slot 23 to infiltrate the heat source H of the electrical unit E. For example, in this embodiment, a clip frame 24 can be selected to be fixed on the upper end of the electrical unit E, and the electrical unit E can be maintained in the position by engaging the clip frame 24 with the corresponding fixing frame 22. a predetermined position in the slot 23 .

更詳言之，該電氣定位座2可以具有至少一進液通道25，該進液通道25可以位於該數個插槽23下方，並連通該數個插槽23，使該不導電液L1可以從該進液通道25流入，再從下方流入該數個插槽23。在本實施例中，該底座21的上表面可以連接有長條狀的數個墊塊K，該數個墊塊K相間隔，較佳呈平行設置；各該墊塊K上方連接有一個前述的固定架22，以於任二相鄰的墊塊K之間形成一個前述的進液通道25，且每個進液通道25連通一個前述的插槽23。其中，該數個墊塊K可以與該底座21一體成型相連接或組合連接，或是每個墊塊K分別與相對應的固定架22一體成型相連接等，本發明均不加以限制。此外，在其他實施例中，也可以由同一個進液通道25連通數個前述的插槽23，只要能順暢導引不導電液L1流入該數個插槽23即可。 More specifically, the electrical positioning seat 2 may have at least one liquid inlet channel 25, and the liquid inlet channel 25 may be located below the plurality of slots 23 and communicate with the plurality of slots 23, so that the non-conductive liquid L1 can be It flows into the liquid inlet channel 25 and then flows into the plurality of slots 23 from below. In this embodiment, the upper surface of the base 21 can be connected with a plurality of elongated pads K, the pads K are spaced apart, preferably arranged in parallel; The fixing frame 22 is formed so as to form the aforementioned liquid inlet channel 25 between any two adjacent pads K, and each liquid inlet channel 25 communicates with one aforementioned slot 23 . The plurality of cushion blocks K may be integrally formed or connected to the base 21, or each cushion block K may be integrally formed and connected to the corresponding fixing frame 22, etc., which are not limited in the present invention. In addition, in other embodiments, the same liquid inlet channel 25 can also be connected to several of the aforementioned slots 23 , as long as the non-conductive liquid L1 can be smoothly guided to flow into the several slots 23 .

請參照第2~4圖所示，各該固定架22可以具有呈縱向延伸的數個氣泡導槽221，各該氣泡導槽221連通該固定架22的頂端T及該進液通道25，且位於該插槽23中的電氣單元E係以其熱源H面向該固定架22具有該數個氣泡導槽221的表面，使得被該熱源H加溫而轉換成氣態的不導電液L1可以形成氣泡，並順著該數個氣泡導槽221的導引而順暢向上流動，以提升散熱性能。又，各該氣泡導槽221的寬度W可以由下而上遞增，使得越往上體積會越大的氣泡能夠順暢通過。 Referring to FIGS. 2 to 4, each of the fixing brackets 22 may have a plurality of air bubble guide grooves 221 extending longitudinally. The electrical unit E located in the slot 23 faces the surface of the fixing frame 22 with the plurality of bubble guide grooves 221 with its heat source H, so that the non-conductive liquid L1 heated by the heat source H and converted into a gaseous state can form bubbles , and flows smoothly upward along the guidance of the plurality of bubble guide grooves 221 to improve the heat dissipation performance. In addition, the width W of each of the bubble guide grooves 221 can be increased from bottom to top, so that the bubbles with larger volume can pass through smoothly.

請參照第1、4圖所示，該電氣定位座2還可以具有相對的二側牆26，該二側牆26位於該底座21上，且該數個固定架22位於該二側牆26之間，各該側牆26與最鄰近的固定架22之間亦可形成一插槽23，以供該電氣單元E插設定位，從而在有限空間下提升該電氣定位座2所能插設的電氣單元E總數量。請配合參照第2圖所示，在本實施例中，該底座21的高度大約可使該固定架22、該插槽23及進液通道25等部位都高出在該封底盤12的凸環部12b之上，使不導電液L1的流動及循環可較為順暢。該二側牆26則可以由局部連接該底座21，且局部凸出於該底座21的範圍而位在該封底盤12的凸環部12b上方，各該側牆26背向該數個固定架22的部位則可以與該環牆11內壁F的形狀相符，而盡量靠近該環牆11的內壁F。如此，該底座21及該二側牆26都能佔用掉該腔室C中較不易用來架設該電氣單元E的空間，即該些空間以不導電液L1來填充也較不具散熱效益，由該底座21及該二側牆26所佔據，反而還能節省不導電液L1的用量。 Referring to Figures 1 and 4, the electrical positioning base 2 may also have two opposite side walls 26, the two side walls 26 are located on the base 21, and the plurality of fixing frames 22 are located between the two side walls 26 A slot 23 can also be formed between each of the side walls 26 and the most adjacent fixing frame 22 for the electrical unit E to be inserted and set in place, so as to increase the amount of the electrical positioning base 2 that can be inserted in a limited space. Total number of electrical units E. Please refer to FIG. 2 , in this embodiment, the height of the base 21 can make the fixing frame 22 , the slot 23 and the liquid inlet channel 25 all higher than the convex ring of the sealing base 12 . Above the portion 12b, the flow and circulation of the non-conductive liquid L1 can be relatively smooth. The two side walls 26 can be partially connected to the base 21 , and partially protrude from the base 21 to be located above the convex ring portion 12 b of the cover plate 12 , and each side wall 26 faces away from the plurality of fixing frames The part 22 can be in conformity with the shape of the inner wall F of the annular wall 11 and be as close to the inner wall F of the annular wall 11 as possible. In this way, the base 21 and the two side walls 26 can occupy the space in the chamber C that is less likely to be used for erecting the electrical unit E, that is, the space is filled with the non-conductive liquid L1, and it is less effective for heat dissipation. Occupied by the base 21 and the two side walls 26, the consumption of the non-conductive liquid L1 can be saved instead.

請參照第5圖所示，本實施例的浸沒式冷卻裝置D，可藉由該電氣定位座2穩固架設該電氣單元E，並藉由該底座21、該固定架22及該二側牆26等部位，佔用掉該腔室C中較不易用來架設該電氣單元E的空間，使少量的不導電液L1就能達到足夠的液位高度，以充分浸潤該電氣單元E的熱 源H。如此，不僅可以在該電氣單元E運作而產生熱能時，由該電氣單元E周遭的不導電液L1吸收熱能以轉換成氣態，形成氣泡並向上流動，自然帶動液態的不導電液L1補充入該插槽23，並接續與該電氣單元E熱交換，使該電氣單元E得以維持在適當的工作溫度，還能降低不導電液L1的需求量，從而有效降低整體浸沒式冷卻裝置D的使用成本。 Please refer to FIG. 5 , in the immersion cooling device D of this embodiment, the electrical unit E can be stably erected by the electrical positioning base 2 , and the base 21 , the fixing frame 22 and the two side walls 26 can be stably erected. and other parts, occupying the space in the chamber C that is not easily used to erect the electrical unit E, so that a small amount of non-conductive liquid L1 can reach a sufficient liquid level to fully infiltrate the heat of the electrical unit E. source H. In this way, when the electrical unit E operates to generate thermal energy, the non-conductive liquid L1 around the electrical unit E absorbs the thermal energy to convert it into a gaseous state, forms bubbles and flows upward, and naturally drives the liquid non-conductive liquid L1 to replenish into the electrical unit E. The slot 23 is continuously exchanged with the electrical unit E, so that the electrical unit E can be maintained at a proper working temperature, and the demand for the non-conductive liquid L1 can also be reduced, thereby effectively reducing the use cost of the overall immersion cooling device D. .

請參照第6、7圖所示，其係本發明浸沒式冷卻裝置D的第二實施例，本實施例的電氣定位座2另具有驅動不導電液L1循環流動的功能。 Please refer to Figures 6 and 7, which are the second embodiment of the immersion cooling device D of the present invention. The electrical positioning seat 2 of this embodiment also has the function of driving the circulating flow of the non-conductive liquid L1.

詳言之，該電氣定位座2的底座21可以具有至少一貫穿槽211，該貫穿槽211將位於該底座21上方的數個插槽23與該底座21的外周或底端相連通，使位於該底座21外周或底端的不導電液L1可以通過該貫穿槽211而從下方輸入該數個插槽23。另設至少一流體驅動件27來驅動腔室C中相對低溫的不導電液L1通過該貫穿槽211並流入該數個插槽23以備熱交換。其中，該流體驅動件27可例如為泵或葉輪。 Specifically, the base 21 of the electrical positioning base 2 may have at least one through-slot 211 , and the through-slot 211 communicates the plurality of slots 23 located above the base 21 with the outer circumference or bottom end of the base 21 , so that the The non-conductive liquid L1 at the outer periphery or the bottom end of the base 21 can be input into the plurality of slots 23 from below through the through-groove 211 . At least one fluid driving member 27 is additionally provided to drive the relatively low temperature non-conductive liquid L1 in the chamber C to pass through the through groove 211 and flow into the plurality of slots 23 for heat exchange. Therein, the fluid driving member 27 can be, for example, a pump or an impeller.

又，為能減少不導電液L1在輸入該插槽23前受到通過該電氣單元E而相對高溫的不導電液L1影響，使相對低溫的不導電液L1能盡量維持低溫地輸入該插槽23，較佳能將輸入及流出該插槽23的不導電液L1分流。因此，本實施例可選擇在該電氣定位座2的側牆26設有呈縱向延伸的至少一導液通道261，該導液通道261連通該側牆26的頂端T及該貫穿槽211，使相對低溫的不導電液L1可以通過該導液通道261再流入該貫穿槽211，形成相對低溫的不導電液L1從外側向下流動，通過該電氣單元E而相對高溫的不導電液L1與氣泡則從中間向上流動，以減少彼此的干擾。 In addition, in order to reduce the influence of the non-conductive liquid L1, which is relatively high temperature through the electrical unit E, before the non-conductive liquid L1 is input into the slot 23, the relatively low-temperature non-conductive liquid L1 can be input into the socket 23 as low as possible. , preferably, the non-conductive liquid L1 entering and flowing out of the slot 23 can be divided. Therefore, in this embodiment, at least one liquid-conducting channel 261 extending longitudinally may be provided on the sidewall 26 of the electrical positioning base 2 , and the liquid-conducting channel 261 is connected to the top T of the sidewall 26 and the through groove 211 , so that the The relatively low-temperature non-conductive liquid L1 can flow into the through groove 211 through the liquid-conducting channel 261 to form the relatively low-temperature non-conductive liquid L1 flowing downward from the outside, and the relatively high-temperature non-conductive liquid L1 and air bubbles pass through the electrical unit E. Then flow upward from the middle to reduce interference with each other.

其中，該流體驅動件27可以位於該貫穿槽211中或位於該導液通道261中，本發明並不加以限制。本實施例可以選擇使該底座21具有二個貫穿槽211，該二個貫穿槽211不相連通，且部分的插槽23連通其中一貫 穿槽211，其餘插槽23連通另一貫穿槽211，而該二個貫穿槽211中分別設有一個前述的流體驅動件27；另將同一側牆26上的導液通道261的數量設為數個，以由各該流體驅動件27驅動相對低溫的不導電液L1可以同步通過該數個導液通道261，並匯集通過該數個導液通道261所共同連通的貫穿槽211，再分別輸入該二個貫穿槽211所對應的數個插槽23中，並藉以提升不導電液L1的流動順暢度。 Wherein, the fluid driving member 27 may be located in the through groove 211 or in the liquid guiding channel 261, which is not limited in the present invention. In this embodiment, the base 21 can be selected to have two through-slots 211 , the two through-slots 211 are not connected, and some of the slots 23 are connected through them. The through-slot 211, the remaining slots 23 are connected to another through-slot 211, and the two through-slots 211 are respectively provided with the aforementioned fluid driving element 27; the number of the liquid-conducting passages 261 on the same side wall 26 is set to several The relatively low-temperature non-conductive liquid L1 driven by each of the fluid driving members 27 can pass through the plurality of liquid-conducting channels 261 synchronously, and collect through the through grooves 211 commonly communicated by the plurality of liquid-conducting channels 261, and then input them respectively. The two penetrating grooves 211 correspond to the plurality of slots 23 , thereby improving the smoothness of the flow of the non-conductive liquid L1 .

據此，本實施例的電氣定位座2可藉由該流體驅動件27的運作，驅動相對低溫的不導電液L1可以從下方輸入該數個插槽23，及幫助通過該電氣單元E而相對高溫的不導電液L1與氣泡向上流動離開該數個插槽23，如此形成循環，不僅能導引液態或氣態的不導電液L1順暢流動，還能使不導電液L1與電氣單元E的熱交換效率提升，有助提升對電氣單元E的散熱性能。 Accordingly, the electrical positioning base 2 of the present embodiment can drive the relatively low-temperature non-conductive liquid L1 to input the plurality of slots 23 from below through the operation of the fluid driving member 27 , and help to pass the electrical unit E relative to each other. The high-temperature non-conductive liquid L1 and the air bubbles flow upward and leave the plurality of slots 23, so that a circulation is formed, which can not only guide the smooth flow of the liquid or gaseous non-conductive liquid L1, but also make the heat of the non-conductive liquid L1 and the electrical unit E. The improved exchange efficiency helps to improve the heat dissipation performance of the electrical unit E.

此外，本實施例的密封槽1，其環牆11與封底盤12可以一體成型相連，以更加簡化該密封槽1的結構，並確保該腔室C中的流體無法從該密封槽1底端洩漏至外界。惟，前述具有驅動不導電液L1循環流動功能的電氣定位座2，並不限於搭配第7圖所示的密封槽1使用，亦可適用於第5圖所示的密封槽1或其他形態的密封槽1，此為本領域中具有通常知識者所能理解，而不應以圖式侷限各實施例。 In addition, in the sealing groove 1 of this embodiment, the ring wall 11 and the sealing plate 12 can be integrally formed and connected to further simplify the structure of the sealing groove 1 and ensure that the fluid in the chamber C cannot pass from the bottom end of the sealing groove 1 leak to the outside world. However, the aforementioned electrical positioning seat 2 with the function of driving the circulating flow of the non-conductive liquid L1 is not limited to be used with the sealing groove 1 shown in Fig. 7, but can also be applied to the sealing groove 1 shown in Fig. The sealing groove 1 is understood by those skilled in the art, and should not be limited by the drawings.

請參照第8、9圖所示，其係本發明浸沒式冷卻裝置D的第三實施例，本實施例則選擇使流體驅動件27設於側牆26上的導液通道261中。 Please refer to FIGS. 8 and 9 , which are the third embodiment of the immersion cooling device D of the present invention. In this embodiment, the fluid driving element 27 is selected to be disposed in the liquid guiding channel 261 on the side wall 26 .

詳言之，該側牆26可以僅具有單一個導液通道261，且該導液通道261可以導引不導電液L1從該流體驅動件27的入液端輸入，且不導電液L1從該流體驅動件27的出液端輸出後，則可流向該導液通道261所連通的貫穿槽211，再輸入該貫穿槽211所對應的數個插槽23中，同樣可提升 不導電液L1的流動順暢度，並使不導電液L1與電氣單元E的熱交換效率提升，有助提升對電氣單元E的散熱性能。舉例而言，當該流體驅動件27選擇為軸進側出的離心式泵或葉輪時，該導液通道261可以導引不導電液L1從該流體驅動件27的軸向輸入該入液端，且通過該出液端而從側向輸出後，則可流向該導液通道261所連通的貫穿槽211。在其他實施例中，該流體驅動件27也可以是軸進軸出式或側進側出式的導流方向，該導液通道261的型態則可依據該流體驅動件27的導流方向對應調整，此為本領域中具有通常知識者所能理解者，故不以圖式所揭露的型態為限。 Specifically, the sidewall 26 may only have a single liquid guiding channel 261, and the liquid guiding channel 261 can guide the non-conductive liquid L1 to be input from the liquid inlet end of the fluid driving member 27, and the non-conductive liquid L1 can be fed from the After the liquid outlet end of the fluid driving member 27 is output, it can flow to the through groove 211 connected to the liquid guiding channel 261, and then input into the plurality of slots 23 corresponding to the through groove 211, which can also be lifted. The smoothness of the flow of the non-conductive liquid L1 increases the heat exchange efficiency between the non-conductive liquid L1 and the electrical unit E, and helps to improve the heat dissipation performance of the electrical unit E. For example, when the fluid driving member 27 is selected as a centrifugal pump or impeller with shaft inlet and side outlet, the liquid guide channel 261 can guide the non-conductive liquid L1 from the axial direction of the fluid driving member 27 into the liquid inlet end , and after passing through the liquid outlet end and outputting from the side, it can flow to the through groove 211 connected with the liquid guiding channel 261 . In other embodiments, the fluid driving member 27 can also be a shaft-in shaft-out type or a side-in side-out type in the guiding direction, and the type of the liquid guiding channel 261 can be based on the guiding direction of the fluid driving member 27 . Corresponding adjustments are understood by those with ordinary knowledge in the art, and therefore are not limited to the types disclosed in the drawings.

請參照第10圖所示，其係本發明浸沒式冷卻裝置D的第四實施例，本實施例的腔室C中可另填裝有一保護液L2，該保護液L2的密度低於該不導電液L1的密度，且該保護液L2的沸點高於該不導電液L1的沸點。如此，該不導電液L1及保護液L2可自然在該腔室C中分層，且該保護液L2鄰接於該不導電液L1上方。其中，液態的不導電液L1可以在吸收熱能後轉換成氣態，並形成氣泡而上升進入液態的保護液L2中，即可將熱能傳遞給液態的保護液L2，從而使氣態的不導電液L1在該保護液L2中冷凝回液態，再藉由該不導電液L1與該保護液L2的密度差，使凝結回液態的不導電液L1能自然下沉回到該保護液L2下方。此外，由於該保護液L2的沸點較高，故氣態的不導電液L1將熱能傳遞給液態的保護液L2時，該保護液L2仍可維持液態，且氣態的不導電液L1只要在未貫穿整層的保護液L2前冷凝回液態，就幾乎不會有流失的情狀發生，故可有效降低該不導電液L1的流失量。值得一提的是，本實施例圖式雖以第一實施例中的電氣定位座2示意，但本實施例具有該保護液L2的概念，可以適用於具有前述各實施例的電氣定位座2的浸沒式冷卻裝置D，故不以圖式所揭露的型態為限。 Please refer to FIG. 10, which is the fourth embodiment of the immersion cooling device D of the present invention. The chamber C of this embodiment can be filled with a protective liquid L2, and the density of the protective liquid L2 is lower than the density of the protective liquid L2. The density of the conductive liquid L1, and the boiling point of the protective liquid L2 is higher than the boiling point of the non-conductive liquid L1. In this way, the non-conductive liquid L1 and the protective liquid L2 can be naturally layered in the chamber C, and the protective liquid L2 is adjacent to the top of the non-conductive liquid L1. Among them, the liquid non-conductive liquid L1 can be converted into a gas state after absorbing heat energy, and form bubbles and rise into the liquid protective liquid L2, which can transfer thermal energy to the liquid protective liquid L2, so that the gaseous non-conductive liquid L1 Condensed back to a liquid state in the protective liquid L2, and then by the density difference between the non-conductive liquid L1 and the protective liquid L2, the non-conductive liquid L1 condensed back to a liquid state can naturally sink back under the protective liquid L2. In addition, due to the high boiling point of the protective liquid L2, when the gaseous non-conductive liquid L1 transfers thermal energy to the liquid protective liquid L2, the protective liquid L2 can still maintain the liquid state, and the gaseous non-conductive liquid L1 is not penetrated Before the entire layer of the protective liquid L2 is condensed back to a liquid state, there is almost no loss, so the loss of the non-conductive liquid L1 can be effectively reduced. It is worth mentioning that although the diagram of this embodiment is illustrated by the electrical positioning seat 2 in the first embodiment, this embodiment has the concept of the protection liquid L2 and can be applied to the electrical positioning seat 2 having the foregoing embodiments. The immersion cooling device D is not limited to the type disclosed in the drawings.

另，本實施例的環牆11與封底盤12之間，或環牆11與槽蓋 13之間，可以選擇將一膠圈R墊於該環牆11的頂端面或底端面，該膠圈R一整圈的大小約與該環牆11頂端面或底端面相符，且該膠圈R可未被鎖固件S貫穿，或也可被該鎖固件S貫穿以避免位移。又，前述的膠圈R型態亦可套用在本發明的其他實施例中，此為本領域中具有通常知識者所能理解，而不應以圖式侷限各實施例。 In addition, in this embodiment, between the ring wall 11 and the sealing plate 12, or between the ring wall 11 and the groove cover Between 13 and 13, a rubber ring R can be selected to be placed on the top surface or bottom end surface of the ring wall 11. The size of a whole circle of the rubber ring R is approximately consistent with the top surface or bottom end surface of the ring wall 11, and the rubber ring R may not be penetrated by the locking member S, or may be penetrated by the locking member S to avoid displacement. In addition, the aforementioned R type of the apron can also be applied to other embodiments of the present invention, which is understood by those skilled in the art, and should not be limited to each embodiment by the drawings.

請參照第3、11圖所示，本發明的電子設備可以包含前述任一實施例的浸沒式冷卻裝置D、數個電氣單元E及至少一輔助散熱器3，其中至少有一電氣單元E可以具有一熱源H，且該熱源H可以被設置於密封槽1的腔室C內，並沉浸於不導電液L1中；該輔助散熱器3則可以貼接於該電氣單元E的熱源H，以更進一步地提升該熱源H與該不導電液L1的熱交換效率。 Referring to Figures 3 and 11, the electronic device of the present invention may include the immersion cooling device D of any of the foregoing embodiments, several electrical units E and at least one auxiliary heat sink 3, wherein at least one electrical unit E may have A heat source H, and the heat source H can be set in the cavity C of the sealing groove 1 and immersed in the non-conductive liquid L1; the auxiliary heat sink 3 can be attached to the heat source H of the electrical unit E, so as to further The heat exchange efficiency between the heat source H and the non-conductive liquid L1 is further improved.

詳言之，該電子設備可例如為工業電腦(Industrial Personal Computer，簡稱IPC)、伺服器或網路通訊設備等，該數個電氣單元E可例如為電源供應器、硬碟、風扇、主機板、中央處理器、記憶體及顯示卡等。大部分的電氣單元E都可被安裝在一機殼4中，其中會在運作時產生高溫以形成該熱源H的電氣單元E，如主機板、中央處理器、記憶體及顯示卡等，可以被安排設置於密封槽1的腔室C內，並使該熱源H沉浸於不導電液L1中；而其他不太會在運作時產生高溫的電氣單元E，則可以安排設置於該密封槽1外。 To be more specific, the electronic device can be, for example, an Industrial Personal Computer (IPC), a server or a network communication device, etc. The electrical units E can be, for example, a power supply, a hard disk, a fan, a motherboard , central processing unit, memory and display card, etc. Most of the electrical units E can be installed in a casing 4, and the electrical units E that generate high temperature during operation to form the heat source H, such as the motherboard, the central processing unit, the memory and the display card, etc., can be It is arranged to be arranged in the chamber C of the sealing groove 1, and the heat source H is immersed in the non-conductive liquid L1; and other electrical units E that are unlikely to generate high temperature during operation can be arranged and arranged in the sealing groove 1. outside.

該輔助散熱器3可以具有一導熱基板31及一多孔層結構32，該導熱基板31可以貼接該電氣單元E的熱源H，該多孔層結構32則可以接觸該導熱基板31及該不導電液L1。舉例而言，該導熱基板31可以為銅材質的基板，該多孔層結構32則可以位於該導熱基板31的表面，以與該導熱基板31共同形成一微纖粉末沸騰器(Micro Fiber Powder Boiler)；其中，該 多孔層結構32可例如為由銅粉燒結形成的毛細薄片，或是將銅網以錫膏鋪設於該導熱基板31的第二面31b(標示於第12圖)再回焊熔接等，本發明均不加以限制，只要能形成多孔性結構即可。此外，該導熱基板31也可以是一均溫板(Vapor Chamber，簡稱VC)的局部，使該多孔層結構32可以形成於均溫板的外表面。 The auxiliary heat sink 3 may have a thermally conductive substrate 31 and a porous layer structure 32, the thermally conductive substrate 31 can be attached to the heat source H of the electrical unit E, and the porous layered structure 32 can contact the thermally conductive substrate 31 and the non-conductive layer structure 32 Liquid L1. For example, the thermally conductive substrate 31 can be a copper substrate, and the porous layer structure 32 can be located on the surface of the thermally conductive substrate 31 to form a Micro Fiber Powder Boiler together with the thermally conductive substrate 31 ; of which the The porous layer structure 32 can be, for example, a capillary sheet formed by sintering copper powder, or laying a copper mesh with solder paste on the second surface 31b (marked in FIG. 12 ) of the thermally conductive substrate 31 and then reflowing and welding, etc. Neither is limited, as long as a porous structure can be formed. In addition, the thermally conductive substrate 31 can also be a part of a vapor chamber (Vapor Chamber, VC for short), so that the porous layer structure 32 can be formed on the outer surface of the vapor chamber.

如此，本實施例的電子設備，其具有該熱源H的電氣單元E運作時，該熱源H所產生的熱能可以被該導熱基板31吸收及傳遞至該多孔層結構32，從而藉由該多孔層結構32可增加散熱面積的特性，更加快速地將熱能傳遞給該不導電液L1，以提升該熱源H與該不導電液L1的熱交換效率，即提升對該熱源H的散熱效率。 In this way, in the electronic device of the present embodiment, when the electrical unit E having the heat source H operates, the heat energy generated by the heat source H can be absorbed by the thermally conductive substrate 31 and transferred to the porous layer structure 32, so that the porous layer The structure 32 can increase the characteristics of the heat dissipation area, and transfer heat energy to the non-conductive liquid L1 more quickly, so as to improve the heat exchange efficiency between the heat source H and the non-conductive liquid L1, ie, improve the heat dissipation efficiency of the heat source H.

請參照第11~13圖所示，在其他實施例中，該導熱基板31可以具有相對的一第一面31a及一第二面31b，該導熱基板31可以由該第一面31a貼接該電氣單元E的熱源H。該多孔層結構32位於該第二面31b，且該多孔層結構32用以接觸該不導電液L1的外表面321可以具有凸出或凹陷狀的數個擾流部322，使流體通過此處可產生渦流，進而擾動周遭氣態及液態的不導電液L1，增加整體散熱面積，使散熱效果提升；較佳地，該擾流部322的橫截面可以呈三角形，以更加強化前述效果。此外，該輔助散熱器3另可以具有一框架33，該框架33可以具有一鏤空口331，該框架33可以連接該導熱基板31的第二面31b，並使該多孔層結構32對位於該鏤空口331的範圍內，使該框架33不會遮蔽該多孔層結構32，並由該框架33保護該多孔層結構32不易受損，並強化整體輔助散熱器3的結構，以便將該輔助散熱器3結合至該電氣單元E，並由該導熱基板31貼接該電氣單元E的熱源H。 Referring to FIGS. 11-13, in other embodiments, the thermally conductive substrate 31 may have a first surface 31a and a second surface 31b opposite to each other, and the thermally conductive substrate 31 may be attached to the first surface 31a. Heat source H of electrical unit E. The porous layer structure 32 is located on the second surface 31b, and the outer surface 321 of the porous layer structure 32 for contacting the non-conductive liquid L1 may have a plurality of protruding or concave spoilers 322 to allow the fluid to pass therethrough Eddy currents can be generated, thereby disturbing the surrounding gaseous and liquid non-conductive liquid L1, increasing the overall heat dissipation area and improving the heat dissipation effect; preferably, the cross section of the spoiler 322 can be triangular to further enhance the aforementioned effect. In addition, the auxiliary heat sink 3 can further have a frame 33, the frame 33 can have a hollow opening 331, the frame 33 can be connected to the second surface 31b of the thermally conductive substrate 31, and the porous layer structure 32 can be located in the hollow Within the range of the opening 331, the frame 33 does not cover the porous layer structure 32, and the frame 33 protects the porous layer structure 32 from being damaged, and strengthens the structure of the overall auxiliary radiator 3, so that the auxiliary radiator 3 is coupled to the electrical unit E, and is attached to the heat source H of the electrical unit E by the thermally conductive substrate 31 .

綜上所述，本發明的浸沒式冷卻裝置，其電氣定位座除可供電氣單元穩固架設外，還能使不導電液的液位明顯上升，從而使用較少量的不 導電液就能充分浸潤該電氣單元，故可節省不導電液的用量，具有降低不導電液的使用成本等功效。此外，本發明還可藉由該電氣定位座的氣泡導槽，導引氣泡更加順暢地向上流動，從而提升對電氣單元的散熱性能。以及，藉由該電氣定位座的流體驅動件，可驅動不導電液循環流動，同可有助提升對電氣單元的散熱性能。 To sum up, in the immersion cooling device of the present invention, the electrical positioning seat can not only be used for stable erection of the electrical unit, but also can significantly increase the liquid level of the non-conductive liquid, so that a smaller amount of non-conductive liquid can be used. The conductive liquid can fully infiltrate the electrical unit, so the amount of the non-conductive liquid can be saved, and the use cost of the non-conductive liquid can be reduced. In addition, the present invention can guide the air bubbles to flow upwards more smoothly by the air bubble guide groove of the electrical positioning seat, thereby improving the heat dissipation performance of the electric unit. And, by the fluid driving element of the electrical positioning seat, the non-conductive liquid can be driven to circulate and flow, and the heat dissipation performance of the electrical unit can also be improved.

雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the patent application attached hereto.

1:密封槽 1: sealing groove

11:環牆 11: Ring Wall

111:開口 111: Opening

112:蓋合口 112: cover closure

12:封底盤 12: Seal the chassis

12a:盤體 12a: Disc body

12b:凸環部 12b: Convex part

121:結合部 121: Joint

13:槽蓋 13: Slot cover

2:電氣定位座 2: Electrical positioning seat

21:底座 21: Base

22:固定架 22: Fixed frame

23:插槽 23: Slot

24:夾架 24: Clamp frame

25:進液通道 25: Liquid inlet channel

26:側牆 26: Side Wall

3:輔助散熱器 3: Auxiliary radiator

C:腔室 C: Chamber

D:浸沒式冷卻裝置 D: Immersion cooling device

E:電氣單元 E: electrical unit

F:內壁 F: inner wall

H:熱源 H: heat source

K:墊塊 K: spacer

L1:不導電液 L1: Non-conductive liquid

R:膠圈 R: apron

S:鎖固件 S: Lock Firmware

T:頂端 T: top

Claims (17)

一種浸沒式冷卻裝置，用以冷卻至少一熱源，包含：一密封槽，內部具有一腔室，該腔室中填裝有一不導電液；及一電氣定位座，位於該腔室中，具有數個固定架位於一底座上，二相鄰的固定架之間形成一插槽，該熱源位於該插槽中，且該不導電液浸潤該熱源。 An immersion cooling device is used for cooling at least one heat source, comprising: a sealing groove with a cavity inside, the cavity is filled with a non-conductive liquid; and an electrical positioning seat, located in the cavity, with a number of Each fixing frame is located on a base, a slot is formed between two adjacent fixing frames, the heat source is located in the slot, and the non-conductive liquid infiltrates the heat source. 如請求項1之浸沒式冷卻裝置，其中，該電氣定位座具有至少一進液通道，該進液通道位於該數個插槽下方，並連通該數個插槽。 The immersion cooling device of claim 1, wherein the electrical positioning base has at least one liquid inlet channel, and the liquid inlet channel is located below the plurality of slots and communicates with the plurality of slots. 如請求項2之浸沒式冷卻裝置，其中，各該固定架具有呈縱向延伸的數個氣泡導槽，各該氣泡導槽連通該固定架的頂端及該進液通道。 The immersion cooling device of claim 2, wherein each of the fixing frames has a plurality of air bubble guide grooves extending longitudinally, and each of the air bubble guide grooves communicates with the top of the fixing frame and the liquid inlet channel. 如請求項3之浸沒式冷卻裝置，其中，該氣泡導槽的寬度由下而上遞增。 The immersion cooling device of claim 3, wherein the width of the bubble guide groove increases from bottom to top. 如請求項1之浸沒式冷卻裝置，其中，該電氣定位座具有用以結合固定一電氣單元的一夾架，該夾架卡掣結合對應的固定架。 The immersion cooling device of claim 1, wherein the electrical positioning base has a clamping frame for fixing an electrical unit, and the clamping frame is engaged with the corresponding fixing frame. 如請求項1之浸沒式冷卻裝置，其中，該電氣定位座具有相對的二側牆，該二側牆位於該底座上，該數個固定架位於該二側牆之間，各該側牆與最鄰近的固定架之間形成可供一電氣單元插設定位的一插槽。 The immersion cooling device of claim 1, wherein the electrical positioning base has two opposite side walls, the two side walls are located on the base, the plurality of fixing brackets are located between the two side walls, each of the side walls and A slot for inserting and setting an electrical unit is formed between the most adjacent fixing frames. 如請求項6之浸沒式冷卻裝置，其中，該密封槽具有一環牆及一封底盤，該封底盤的一凸環部呈液密地結合該環牆並位於該腔室中，該底座置於該凸環部所圈圍出的空間內，該二側牆由局部連接該底座，且局部位在該凸環部上方，各該側牆背向該數個固定架的部位與該環牆內壁的形狀相符。 The immersion cooling device of claim 6, wherein the sealing groove has a ring wall and a bottom plate, a convex ring portion of the cover plate is fluid-tightly combined with the ring wall and located in the chamber, and the bottom plate is placed in the chamber. In the space enclosed by the protruding ring portion, the two side walls are partially connected to the base, and are partially located above the protruding ring portion, and the parts of the side walls facing away from the plurality of fixing brackets are in the ring wall. The shape of the wall matches. 如請求項1之浸沒式冷卻裝置，其中，該底座具有至少一貫穿槽，該貫穿槽連通該數個插槽，一流體驅動件驅動該不導電液通過該貫穿槽並流入該數個插槽。 The immersion cooling device of claim 1, wherein the base has at least one through groove, the through groove communicates with the plurality of slots, and a fluid driving element drives the non-conductive liquid to pass through the through groove and flow into the plurality of slots . 如請求項8之浸沒式冷卻裝置，其中，該電氣定位座具有相對的二側牆，該二側牆位於該底座上，該數個固定架位於該二側牆之間，各該側牆具有呈縱向延伸的至少一導液通道，該導液通道連通該側牆的頂端及該貫穿槽，該流體驅動件驅動該不導電液通過該導液通道及該貫穿槽再流入該數個插槽。 The immersion cooling device of claim 8, wherein the electrical positioning base has two opposite side walls, the two side walls are located on the base, the plurality of fixing frames are located between the two side walls, and each of the side walls has At least one liquid guiding channel extending longitudinally, the liquid guiding channel communicates with the top end of the side wall and the through groove, the fluid driving element drives the non-conductive liquid through the liquid guiding channel and the through groove and then flows into the plurality of slots . 如請求項9之浸沒式冷卻裝置，其中，該流體驅動件位於該貫穿槽中或位於該導液通道中。 The immersion cooling device of claim 9, wherein the fluid driving member is located in the through groove or in the liquid conducting channel. 如請求項1至10中任一項之浸沒式冷卻裝置，其中，該腔室中另填裝有一保護液，該保護液的密度低於該不導電液的密度，該保護液的沸點高於該不導電液的沸點。 The immersion cooling device according to any one of claims 1 to 10, wherein the chamber is additionally filled with a protective liquid, the density of the protective liquid is lower than that of the non-conductive liquid, and the boiling point of the protective liquid is higher than The boiling point of the non-conductive liquid. 一種電子設備，包含：一如請求項1至11中任一項之浸沒式冷卻裝置；及至少一電氣單元，插設定位於該插槽中，該電氣單元具有該熱源。 An electronic device, comprising: the immersion cooling device as claimed in any one of claims 1 to 11; and at least one electrical unit inserted into the slot, the electrical unit having the heat source. 如請求項12之電子設備，另具有至少一輔助散熱器，該輔助散熱器具有一導熱基板貼接該電氣單元的熱源，一多孔層結構接觸該導熱基板及該不導電液。 The electronic device of claim 12 further has at least one auxiliary radiator, the auxiliary radiator has a thermally conductive substrate attached to the heat source of the electrical unit, and a porous layer structure contacts the thermally conductive substrate and the non-conductive liquid. 如請求項13之電子設備，其中，該多孔層結構的外表面具有凸出或凹陷狀的數個擾流部。 The electronic device of claim 13, wherein the outer surface of the porous layer structure has several protruding or concave spoilers. 如請求項14之電子設備，其中，該擾流部的橫截面呈三角形。 The electronic device of claim 14, wherein the cross section of the spoiler is triangular. 如請求項13之電子設備，其中，該輔助散熱器具有一框架，該框架具有一鏤空口，該框架連接該導熱基板，該多孔層結構對位於該鏤空口的範圍內。 The electronic device of claim 13, wherein the auxiliary heat sink has a frame, the frame has a hollow opening, the frame is connected to the thermally conductive substrate, and the porous layer structure pair is located within the hollow opening. 如請求項13之電子設備，其中，該多孔層結構係由銅粉燒 結形成。 The electronic device of claim 13, wherein the porous layer structure is made of copper powder fired knot formation.
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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI750733B (en) * 2020-07-14 2021-12-21 建準電機工業股份有限公司 Immersion cooling device and electronic device including the same
EP4093170A1 (en) * 2021-05-17 2022-11-23 Cgg Services Sas Methods and systems for fluid immersion cooling
US20230217626A1 (en) * 2021-12-30 2023-07-06 Microsoft Technology Licensing, Llc Enhanced fluid replacement structures for use in immersion cooling tanks
TWI824611B (en) * 2022-07-08 2023-12-01 緯穎科技服務股份有限公司 Immersion cooling system
TWI816465B (en) * 2022-07-08 2023-09-21 緯穎科技服務股份有限公司 Immersion cooling system
EP4395480A1 (en) * 2022-12-30 2024-07-03 Delta Electronics, Inc. Electronic device and power system
CN117241566B (en) * 2023-11-14 2024-01-30 东南大学 Immersed multiphase coupling liquid cooling system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447340B (en) * 2009-12-14 2014-08-01 Hon Hai Prec Ind Co Ltd Water-cooled heat sink
TWM530013U (en) * 2016-05-20 2016-10-01 Kuan Ding Ind Co Ltd Liquid-cooling heat dissipation device
TW201921225A (en) * 2017-09-06 2019-06-01 英商艾瑟歐托普集團有限公司 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN209982997U (en) * 2019-04-16 2020-01-21 龙岩思康新材料有限公司 Closed server cooling device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10297339B2 (en) * 2014-02-19 2019-05-21 Advantest Corporation Integrated cooling system for electronics testing apparatus
WO2017066692A1 (en) * 2015-10-16 2017-04-20 ChefSteps, Inc. Thermal immersion circulator
CN108966603A (en) * 2018-08-15 2018-12-07 南京佳力图机房环境技术股份有限公司 A kind of cooling immersion liquid cooling combination unit of server
CN110290677B (en) * 2019-06-06 2024-04-26 深圳绿色云图科技有限公司 Liquid immersion type cooling cabinet
CN110958819B (en) * 2019-12-11 2021-06-01 深圳绿色云图科技有限公司 Cooling device and single-phase immersed liquid cooling cabinet
TWI750733B (en) * 2020-07-14 2021-12-21 建準電機工業股份有限公司 Immersion cooling device and electronic device including the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447340B (en) * 2009-12-14 2014-08-01 Hon Hai Prec Ind Co Ltd Water-cooled heat sink
TWM530013U (en) * 2016-05-20 2016-10-01 Kuan Ding Ind Co Ltd Liquid-cooling heat dissipation device
TW201921225A (en) * 2017-09-06 2019-06-01 英商艾瑟歐托普集團有限公司 Heat sink, heat sink arrangement and module for liquid immersion cooling
CN209982997U (en) * 2019-04-16 2020-01-21 龙岩思康新材料有限公司 Closed server cooling device

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