TWI745407B - Carrier tape for electronic component storage tape, electronic component storage tape, and manufacturing method of electronic component storage tape - Google Patents

Carrier tape for electronic component storage tape, electronic component storage tape, and manufacturing method of electronic component storage tape Download PDF

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TWI745407B
TWI745407B TW106124703A TW106124703A TWI745407B TW I745407 B TWI745407 B TW I745407B TW 106124703 A TW106124703 A TW 106124703A TW 106124703 A TW106124703 A TW 106124703A TW I745407 B TWI745407 B TW I745407B
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electronic component
recess
tape
storage
carrier tape
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TW106124703A
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TW201806832A (en
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新井貴
関根景行
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日商太陽誘電股份有限公司
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Abstract

本發明提供一種適合於自橫向對承載帶之收納凹部***電子零件之方法的電子零件收納帶用承載帶。 承載帶10包括：帶狀之帶本體11；及收納凹部12a，其具有能夠收納電子零件EC之長度L1、寬度W1及深度D1，且在長度方向上等間隔地設置於帶本體11。於帶本體11中之收納凹部12a之寬度方向一側設置有導引凹部12b，上述導引凹部12b係深度D2自帶本體11之上表面朝向收納凹部12a之寬度方向一側面增加，且與收納凹部12a連續之形態。The present invention provides a carrier tape for an electronic component storage tape suitable for a method of inserting electronic components into a storage recess of the carrier tape from a lateral direction. The carrier belt 10 includes a belt-shaped belt main body 11 and a storage recess 12a having a length L1, a width W1, and a depth D1 capable of storing electronic components EC, and is provided on the belt main body 11 at equal intervals in the longitudinal direction. A guide recess 12b is provided on one side of the storage recess 12a in the belt body 11 in the width direction. The depth D2 of the guide recess 12b increases from the upper surface of the belt body 11 toward the side surface of the storage recess 12a in the width direction. The concave portion 12a is continuous.

Description

電子零件收納帶用承載帶、電子零件收納帶及電子零件收納帶之製造方法Carrier tape for electronic component storage tape, electronic component storage tape, and manufacturing method of electronic component storage tape

本發明係關於一種電子零件收納帶用承載帶、使用該承載帶之電子零件收納帶、及該電子零件收納帶之製造方法。The present invention relates to a carrier tape for an electronic component storage tape, an electronic component storage tape using the carrier tape, and a manufacturing method of the electronic component storage tape.

現有之電子零件收納帶用承載帶具有如下構造，即，於帶狀之帶本體，在長度方向上等間隔地設置有大致長方體狀之多個收納凹部，且在長度方向上等間隔地設置有大致圓形之多個進給孔(例如參照後述專利文獻1～3)。 又，電子零件對上述承載帶之各收納凹部之***一般而言係藉由如下方法進行，即，將已藉由盆式進料機而整齊排列之大致長方體狀之電子零件經由線性進料機依序供給至***機，且使承載帶於***機之下側間歇移動，使已供給至***機之電子零件於承載帶停止之時機向下方移動從而***至收納凹部。 且說，於如上述方法般自上方對承載帶之收納凹部***電子零件時，必須使***前之電子零件之二維位置與供電子零件***之收納凹部之二維位置於俯視下對準。因此，最近，為了簡化***時之相互位置之管理，正研究自橫向對承載帶之收納凹部***電子零件之方法。 然而，上文所述之現有之承載帶係以自上方對承載帶之收納凹部***電子零件為前提之構造，因而可以說並不適合於自橫向對承載帶之收納凹部***電子零件之方法。 [先前技術文獻] [專利文獻] [專利文獻1]日本專利特開2012-081997號公報 [專利文獻2]日本專利特開2006-160369號公報 [專利文獻3]日本專利特開2002-240851號公報The existing carrier tape for electronic parts storage tape has a structure in which a strip-shaped tape body is provided with a plurality of substantially rectangular parallelepiped receiving recesses at equal intervals in the longitudinal direction, and at equal intervals in the longitudinal direction. A plurality of approximately circular feed holes (for example, refer to Patent Documents 1 to 3 described later). In addition, the insertion of the electronic components into the receiving recesses of the above-mentioned carrier tape is generally performed by the following method, that is, the substantially rectangular parallelepiped electronic components that have been neatly arranged by the basin-type feeder are passed through the linear feeder Sequentially supply to the insertion machine, and make the carrier tape move intermittently below the insertion machine, and make the electronic parts supplied to the insertion machine move downward when the carrier tape stops and insert into the receiving recess. In addition, when inserting electronic components into the receiving recess of the carrier tape from above as in the above method, the two-dimensional position of the electronic component before insertion and the two-dimensional position of the receiving recess for the electronic component must be aligned in a plan view. Therefore, recently, in order to simplify the management of mutual positions during insertion, a method of inserting electronic components into the receiving recess of the carrier tape from the lateral direction is being studied. However, the above-mentioned existing carrier tape is constructed based on the premise that the electronic components are inserted into the receiving recess of the carrier tape from above, so it can be said that it is not suitable for the method of inserting the electronic components into the receiving recess of the carrier tape from the lateral direction. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2012-081997 [Patent Document 2] Japanese Patent Laid-Open No. 2006-160369 [Patent Document 3] Japanese Patent Laid-Open No. 2002-240851 Bulletin

[發明所欲解決之問題] 本發明所欲解決之問題在於，提供一種適合於自橫向對承載帶之收納凹部***電子零件之方法的電子零件收納帶用承載帶、使用該承載帶之電子零件收納帶、及該電子零件收納帶之製造方法。 [解決問題之技術手段] 為了解決上述問題，本發明之電子零件收納帶用承載帶係於將承載帶之長邊方向設為長度方向，短邊方向設為寬度方向，與該等方向正交之方向設為高度方法，並且將沿著長度方向之尺寸設為長度，沿著寬度方向之尺寸設為寬度，沿著高度方向之尺寸設為高度或深度時，承載帶包括：帶狀之帶本體；及收納凹部，其具有能夠收納電子零件之長度、寬度及深度，且在長度方向上等間隔地設置於帶本體；於帶本體中之收納凹部之寬度方向一側設置有導引凹部，該導引凹部係深度自帶本體之上表面朝向收納凹部之寬度方向一側面增加，且與收納凹部連續之形態。 又，本發明之電子零件收納帶具備：上述承載帶；電子零件，其收納於承載帶之收納凹部；及覆帶，其以堵住收納有電子零件之收納凹部之上端開口的方式覆蓋承載帶之上表面一部分。 進而，本發明之電子零件收納帶之製造方法包括下述步驟：準備上述承載帶；將電子零件收納於承載帶之收納凹部；及藉由覆帶以堵住收納有電子零件之收納凹部之上端開口的方式覆蓋承載帶之上表面一部分。 [發明之效果] 根據本發明，可提供一種適合於自橫向對承載帶之收納凹部***電子零件之方法的電子零件收納帶用承載帶、使用該承載帶之電子零件收納帶、及該電子零件收納帶之製造方法。[Problem to be solved by the invention] The problem to be solved by the present invention is to provide a carrier tape for an electronic component storage tape suitable for a method of inserting electronic components into a receiving recess of the carrier tape from a lateral direction, and an electronic component using the carrier tape A storage tape and a method for manufacturing the electronic component storage tape. [Technical Means to Solve the Problem] In order to solve the above-mentioned problems, the carrier tape for the electronic component storage tape of the present invention is attached by setting the long side direction of the carrier tape as the length direction and the short side direction as the width direction, which is orthogonal to these directions When the direction is set as the height method, and the size along the length direction is set as the length, the size along the width direction is set as the width, and the size along the height direction is set as the height or depth, the carrier belt includes: belt-like belt The main body; and the accommodating recess, which has a length, width, and depth capable of accommodating electronic components, and is arranged at equal intervals in the length direction on the belt body; a guide recess is provided on one side of the width direction of the accommodating recess in the belt body, The guiding recess has a shape in which the depth increases from the upper surface of the main body toward a side surface in the width direction of the storage recess and is continuous with the storage recess. In addition, the electronic component storage tape of the present invention includes: the above-mentioned carrier tape; electronic components housed in the accommodating recess of the carrier tape; and a cover tape that covers the carrier tape so as to block the opening of the upper end of the accommodating recess where the electronic components are accommodated Part of the upper surface. Furthermore, the manufacturing method of the electronic component storage tape of the present invention includes the following steps: preparing the above-mentioned carrier tape; storing electronic components in the receiving recess of the carrier tape; and covering the upper end of the receiving recess where the electronic components are stored The opening covers a part of the upper surface of the carrier belt. [Effects of the Invention] According to the present invention, it is possible to provide a carrier tape for an electronic component storage tape suitable for a method of inserting electronic components into a storage recess of the carrier tape from a lateral direction, an electronic component storage tape using the carrier tape, and the electronic component The manufacturing method of the storage belt.

以下之說明中，為了方便起見，將後述承載帶10之長邊方向(圖1之左右方向)表述為長度方向，短邊方向(圖1之上下方向)表述為寬度方向，與該等方向正交之方向(圖2之上下方向)表述為高度方向，並且將沿著長度方向之尺寸表述為長度，沿著寬度方向之尺寸表述為寬度，沿著高度方向之尺寸表述為高度或深度。 《第1實施形態》 圖1及圖2表示本發明之第1實施形態之承載帶10。 圖1及圖2所示之承載帶10係壓紋加工型，其材料例如為聚苯乙烯、聚碳酸酯、聚對苯二甲酸乙二酯、聚丙烯等。對壓紋加工之方式不作特別限制，例如可適宜採用壓空成形、壓製成形、真空旋轉成形(真空滾筒成形)等。 承載帶10具有：(1)寬度W之帶狀之帶本體11；(2)多個零件收納部12，其等在長度方向上以等間隔(間距P1)設置於帶本體11之靠近寬度方向一端緣11a之位置；及(3)大致圓形之多個進給孔13，其等在長度方向上以等間隔(間距P2)設置於帶本體11之靠近寬度方向另一端緣11b之位置。承載帶10之高度H相當於後述收納凹部12a之深度D1加上帶本體11之厚度t所得之值。另，對帶本體11之寬度W及厚度t不作特別限制，若列舉一例，則寬度W為8 mm之情形時之厚度t約處於0.15～0.4 mm之範圍內。 又，於承載帶10中之各零件收納部12之寬度方向一端緣(圖1之下側端緣)與帶本體11之寬度方向一端緣11a之間，存在寬度Wm之邊界(margin)部(符號省略)。該邊界部係將覆帶20(參照圖4)附著於帶本體11之上表面時所利用之區域。 各零件收納部12由收納凹部12a、及設置於該收納凹部12a之寬度方向一側之導引凹部12b構成。 收納凹部12a呈具有能夠收納電子零件EC(參照圖3及圖4)之長度L1、寬度W1及深度D1之大致長方體狀。該收納凹部12a由底面12a1、及4個側面12a2(寬度方向上面對面之2個側面與長度方向上面對面之2個側面)構成。雖於圖1及圖2中未予體現，但實際上4個側面12a2分別具有相當於壓紋加工時之脫模斜度之0.2～10度左右之斜度。另，電子零件EC為大致長方體狀，具有與收納凹部12a之長度L1對應之第1尺寸(符號省略)、與收納凹部12a之寬度W1對應之第2尺寸(符號省略)、及與收納凹部之深度D1對應之第3尺寸(符號省略)。 收納凹部12a之寬度W1稍大於電子零件EC之第1尺寸，收納凹部12a之長度L1稍大於電子零件EC之第2尺寸，收納凹部12a之深度D1稍大於電子零件EC之第3尺寸。又，收納凹部12a之4個側面12a2中的導引凹部12b側之寬度方向一側面(圖2之左側側面)之高度相當於深度D1減去導引凹部12b之深度D2之最大值所得之值。 導引凹部12b呈大致五面體狀，係將電子零件EC向收納凹部12a導引之部分。該導引凹部12b由底面12b1、及2個側面12b2(長度方向上面對面之2個側面)構成。雖於圖1及圖2中未予體現，但實際上2個側面12b2分別具有相當於壓紋加工時之脫模斜度之0.2～10度左右之斜度。 根據圖1及圖2可知，導引凹部12b具有深度D2自帶本體11之上表面朝向收納凹部12a之4個側面12a2中的寬度方向一側面(圖2之左側側面)增加，且與收納凹部12a連續之形態，並且具有長度L2自帶本體11之上表面朝向收納凹部12a之寬度方向一側面(圖2之左側側面)減小之形態。 雖未對導引凹部12b之寬度W2進行特別限制，但考慮到收納凹部12a之深度D2之最大值，較佳為以底面12b1之傾斜角度處於15～30度之範圍內的方式設定寬度W2。又，導引凹部12b之長度L2之最小值與收納凹部12a之長度L1一致。長度L2之最大值大於電子零件EC之第2尺寸即可，但較佳為設定於電子零件EC之第2尺寸之1.1倍～1.5倍之範圍內。進而，導引凹部12b之深度D2之最大值小於收納凹部12a之深度D1即可，但較佳為設定於電子零件EC之第3尺寸之1/4～3/4之範圍內。 圖3表示自橫向對圖1及圖2所示之承載帶10之收納凹部12a***電子零件EC的方法之一例。該***方法終歸不過為一例，並非限制自橫向對承載帶10之收納凹部12a***電子零件EC之方法者。 圖3之TG為帶導件，TGa為導槽，IG為零件導件，IGa為零件通路。帶導件TG之上表面對承載帶10之除收納凹部12a及導引凹部12b以外的部分之下表面進行支持，導槽TGa之內表面對收納凹部12a與導引凹部12b之下表面進行支持。另一方面，零件導件IG之下表面介隔不會妨礙承載帶10之長度方向之間歇移動且可抑制承載帶10之上下方向之移位之程度的間隙，而與承載帶10之上表面面對面。又，零件通路IGa之橫截面形狀係稍大於電子零件EC之第2尺寸及第3尺寸之矩形，且具有與導引凹部12b之底面12b1之傾斜角度相吻合之斜度。 如圖3(A)所示，於自橫向對承載帶10之收納凹部12a***電子零件EC時，將已藉由盆式進料機(圖示省略)而排列之電子零件EC經由線性進料機(圖示省略)而送入至零件通路IGa。已送入至零件通路IGa之電子零件EC隨著零件通路IGa之斜度滑動，而被送入至導引凹部12b。然後，如圖3(B)所示，已送入至導引凹部12b之電子零件EC依循底面12b1之斜度滑動，而被送入至收納凹部12a。 如上文所述，導引凹部12b具有長度L2自帶本體11之上表面朝向收納凹部12a之寬度方向一側面(圖3(B)之左側側面)減小之形態，因而即便於剛送入至導引凹部12b之電子零件EC之姿勢出現錯亂之情形時，亦可於沿導引凹部12b移動之過程中矯正該姿勢之錯亂。又，因導引凹部12b之長度L2之最小值與收納凹部12a之長度L1一致，故可將姿勢矯正後之電子零件EC順暢地自導引凹部12b送入至收納凹部12a。 如圖3(C)所示，已送入至收納凹部12a之電子零件EC係以其前端與收納凹部12a之寬度方向另一側面(圖3(C)之右側側面)相接，而其下表面與收納凹部12a之底面12a1相接之方式傾斜，由此，電子零件EC被***至收納凹部12a。因導引凹部12b之深度D2之最大值小於收納凹部12a之深度D1，故即便收納於收納凹部12a後之電子零件EC因外力而發生振動，亦不會產生電子零件EC之一部分進入至導引凹部12b以致收納姿勢大幅錯亂之不良情況。 再者，於因電子零件EC之質量小或尺寸小等原因，而無法順暢地進行電子零件EC於導引凹部12b中之滑動或電子零件EC自導引凹部12b向收納凹部12a之送入時，可通過零件導件IG之不存在零件通路IGa之部分(圖3(A)之右側部分)之下表面與承載帶10之上表面之間的間隙、或者另行設置於零件導件IG之上述部分之抽吸通路，使負壓作用於零件通路IGa，利用該負壓將零件通路IGa內之電子零件EC拉入至導引凹部12b及收納凹部12a。 如上所述，於收納凹部12a之寬度方向一側設置有導引凹部12b，該導引凹部12b係深度D2自帶本體11之上表面朝向收納凹部12a之寬度方向一側面增加，且與收納凹部12a連續之形態，因而可利用該導引凹部12b適當地進行自橫向對承載帶10之收納凹部12a***電子零件EC之方法。 又，因導引凹部12b之深度D2之最大值小於收納凹部12a之深度D1，故即便收納於收納凹部12a後之電子零件EC因外力而發生振動，亦不會產生電子零件EC之一部分進入至導引凹部12b以致收納姿勢大幅錯亂之不良情況。 進而，導引凹部12b具有長度L2自帶本體11之上表面朝向收納凹部12a之寬度方向一側面減小之形態，因而即便於剛送入至導引凹部12b之電子零件EC之姿勢出現錯亂之情形時，亦可於沿導引凹部12b移動之過程中矯正該姿勢之錯亂。並且，因導引凹部12b之長度L2之最小值與收納凹部12a之長度L1一致，故可將姿勢矯正後之電子零件EC順暢地自導引凹部12b送入至收納凹部12a。 圖4表示使用圖1及圖2所示之承載帶10之電子零件收納帶30。 圖4所示之電子零件收納帶30係於承載帶10之各收納凹部12a收納有電子零件EC，且藉由帶狀之覆帶20以堵住收納有電子零件EC之各收納凹部12a之上端開口的方式覆蓋承載帶11之上表面一部分。即，該電子零件收納帶30係藉由如下步驟而製造：於將電子零件EC收納於承載帶10之各收納凹部12a後，藉由帶狀之覆帶20以堵住收納有電子零件EC之各收納凹部12a之上端開口的方式覆蓋承載帶11之上表面一部分。 覆帶20較佳為透明或半透明以便能夠自外部確認收納狀態。又，覆帶20可為感熱型與感壓型中之任一者，且至少寬度方向兩側附著於帶本體11之上表面。即，若使用圖1及圖2所示之承載帶10，則可確實地製造圖4所示之電子零件收納帶30。 《第2實施形態》 圖5表示本發明之第2實施形態之承載帶10-1。 圖5所示之承載帶10-1與圖1及圖2所示之承載帶10不同之處在於：減小導引凹部12b之寬度W2，增大底面12b1之傾斜角度；及伴隨導引凹部12b之寬度W2之減小，邊界部(符號省略)之寬度Wm增大。因其他構成與圖1及圖2所示之承載帶10相同，故省略其說明。 即便為該承載帶10-1，亦與圖1及圖2所示之承載帶10同樣地，不僅可適當地進行自橫向對收納凹部12a***電子零件EC之方法，而且可確實地製造與圖4所示之電子零件收納帶30相同之電子零件收納帶。 圖5所示之承載帶10-1與圖1及圖2所示之承載帶10相比，導引凹部12b之底面12b1之傾斜角度更大，因而如圖6所示，於零件通路IGa之斜度與圖3所示之零件通路IGa之斜度相同之情形時，導引凹部12b之底面12b1之斜度大於零件通路IGa之斜度，並且出口側(導引凹部12b之底面12b1所處之部位)之橫截面形狀大於零件通路IGa之入口側之橫截面形狀。因此，可順暢地進行電子零件EC自零件通路IGa向導引凹部12b之送入、以及電子零件EC自導引凹部12b向收納凹部12a之送入。 再者，於圖5所示之承載帶10-1之情形時，於因電子零件EC之質量小或尺寸小等原因，而無法順暢地進行電子零件EC於導引凹部12b中之滑動或電子零件EC自導引凹部12b向收納凹部12a之送入時，亦可通過零件導件IG之不存在零件通路IGa之部分(圖6之右側部分)之下表面與承載帶10之上表面之間的間隙、或者另外設置於零件導件IG之上述部分之抽吸通路，使負壓作用於零件通路IGa，利用該負壓將零件通路IGa內之電子零件EC拉入至導引凹部12b及收納凹部12a。 《第3實施形態》 圖7表示本發明之第3實施形態之承載帶10-2。 圖7所示之承載帶10-2與圖1及圖2所示之承載帶10不同之處在於：承載帶10-2自身為壓縮加工型。該承載帶10-2之材料例如為紙、合成紙等，因收納凹部12a與導引凹部12b係藉由壓縮加工而形成，故承載帶10-2之高度H於寬度方向上大致固定。因其他構成與圖1及圖2所示之承載帶10相同，故省略其說明。 即便為該承載帶10-2，亦與圖1及圖2所示之承載帶10同樣地，不僅可適當地進行自橫向對收納凹部12a***電子零件EC之方法，而且可確實地製造與圖4所示之電子零件收納帶30相同之電子零件收納帶。 《其他實施形態》 (m1)上述各實施形態中，作為零件收納部12之收納凹部12a，已表示與具有第1尺寸＞第2尺寸＝第3尺寸之關係的大致長方體狀之電子零件EC對應者，若變更收納凹部12a之深度D1，則可將具有第1尺寸＞第2尺寸＞第3尺寸之關係的大致長方體狀之電子零件、或具有第1尺寸＞第3尺寸＞第2尺寸之關係的大致長方體狀之電子零件作為***對象(收納對象)。即便變更收納凹部12a之深度D1，亦不僅可適當地進行自橫向對收納凹部12a***電子零件EC之方法，而且可確實地製造與圖4所示之電子零件收納帶30相同之電子零件收納帶。 (m2)上述各實施形態中，已表示將零件收納部12之配置間隔(間距P1，參照圖1)設為進給孔13之配置間隔(間距P2，參照圖1)之1/2，但亦可根據成為***對象(收納對象)之電子零件之尺寸變更各間距P1及P2。即便變更各間距P1及P2，亦不僅可適當地進行自橫向對收納凹部12a***電子零件EC之方法，而且可確實地製造與圖4所示之電子零件收納帶30相同之電子零件收納帶。 (m3)上述各實施形態中，作為零件收納部12之導引凹部12b，已表示底面12b1由平面構成者，但即便將底面12b1設為具有相同之斜度之平緩之曲面(凸曲面或凹曲面等)，亦不僅可適當地進行自橫向對收納凹部12a***電子零件EC之方法，而且可確實地製造與圖4所示之電子零件收納帶30相同之電子零件收納帶。 (m4)上述各實施形態中，作為零件收納部12之導引凹部12b，已表示具有長度L2自帶本體11之上表面朝向收納凹部12a之寬度方向一側面減小之形態者，但亦可將導引凹部12b之長度L2設為固定，且使該長度L2與收納凹部12a之長度L1一致。該情形時，雖不易獲得由導引凹部12b達成之姿勢矯正作用，但亦不僅可適當地進行自橫向對收納凹部12a***電子零件EC之方法，而且可確實地製造與圖4所示之電子零件收納帶30相同之電子零件收納帶。In the following description, for convenience, the long side direction (left and right direction in FIG. 1) of the carrier tape 10 described later is expressed as the length direction, and the short side direction (up and down direction in FIG. 1) is expressed as the width direction. The orthogonal direction (up and down direction in Figure 2) is expressed as the height direction, and the dimension along the length direction is expressed as length, the dimension along the width direction is expressed as width, and the dimension along the height direction is expressed as height or depth. "First Embodiment" Figs. 1 and 2 show a carrier tape 10 according to the first embodiment of the present invention. The carrier tape 10 shown in FIGS. 1 and 2 is an embossed processing type, and its material is, for example, polystyrene, polycarbonate, polyethylene terephthalate, polypropylene, and the like. The method of embossing is not particularly limited, and for example, air pressure forming, press forming, vacuum rotary forming (vacuum roller forming), etc. can be suitably used. The carrier belt 10 has: (1) a belt-shaped belt body 11 with a width W; (2) a plurality of parts storage portions 12 which are arranged at equal intervals (pitch P1) in the longitudinal direction near the width direction of the belt body 11 The position of one end edge 11a; and (3) a plurality of approximately circular feed holes 13, which are arranged at equal intervals (pitch P2) in the length direction at the position of the belt body 11 close to the other end edge 11b in the width direction. The height H of the carrier tape 10 corresponds to the value obtained by adding the thickness t of the tape body 11 to the depth D1 of the accommodating recess 12a described later. In addition, the width W and thickness t of the belt body 11 are not particularly limited. If one example is given, the thickness t when the width W is 8 mm is approximately in the range of 0.15 to 0.4 mm. In addition, between the widthwise end edge (the lower end edge of FIG. 1) of each component storage portion 12 in the carrier belt 10 and the widthwise end edge 11a of the belt body 11, there is a margin portion ( The symbol is omitted). This boundary part is an area used when attaching the cover tape 20 (refer to FIG. 4) to the upper surface of the tape main body 11. Each component accommodating portion 12 is composed of an accommodating recess 12a and a guide recess 12b provided on one side in the width direction of the accommodating recess 12a. The accommodating recess 12a has a substantially rectangular parallelepiped shape having a length L1, a width W1, and a depth D1 capable of accommodating the electronic component EC (refer to FIGS. 3 and 4). The accommodating recess 12a is composed of a bottom surface 12a1, and four side surfaces 12a2 (two side surfaces facing each other in the width direction and two side surfaces facing each other in the longitudinal direction). Although not shown in Figs. 1 and 2, in fact, the four side faces 12a2 respectively have an inclination of about 0.2 to 10 degrees, which is equivalent to the demolding inclination during embossing. In addition, the electronic component EC has a substantially rectangular parallelepiped shape, and has a first size (sign omitted) corresponding to the length L1 of the storage concave portion 12a, a second size (sign omitted) corresponding to the width W1 of the storage concave portion 12a, and a gap with the storage concave The depth D1 corresponds to the third dimension (the symbol is omitted). The width W1 of the receiving recess 12a is slightly larger than the first size of the electronic component EC, the length L1 of the receiving recess 12a is slightly larger than the second size of the electronic component EC, and the depth D1 of the receiving recess 12a is slightly larger than the third size of the electronic component EC. In addition, the height of one side in the width direction on the side of the guide recess 12b among the four side surfaces 12a2 of the accommodating recess 12a (the left side in FIG. 2) is equivalent to the depth D1 minus the maximum value of the depth D2 of the guide recess 12b . The guide recess 12b has a substantially pentagonal shape, and is a part that guides the electronic component EC to the storage recess 12a. The guide recess 12b is composed of a bottom surface 12b1, and two side surfaces 12b2 (two side surfaces facing each other in the longitudinal direction). Although not shown in Figs. 1 and 2, in fact, the two side faces 12b2 respectively have an inclination of about 0.2 to 10 degrees, which is equivalent to the demolding inclination during embossing. According to Figures 1 and 2, it can be seen that the guide recess 12b has a depth D2 that increases from the upper surface of the main body 11 toward one of the four side faces 12a2 of the storage recess 12a in the width direction (the left side of FIG. 2), and is similar to the storage recess. 12a is a continuous form, and has a form in which the length L2 decreases from the upper surface of the main body 11 toward one side in the width direction of the receiving recess 12a (the left side in FIG. 2). Although the width W2 of the guiding recess 12b is not particularly limited, considering the maximum value of the depth D2 of the receiving recess 12a, it is preferable to set the width W2 such that the inclination angle of the bottom surface 12b1 is in the range of 15-30 degrees. In addition, the minimum value of the length L2 of the guide recess 12b coincides with the length L1 of the storage recess 12a. The maximum value of the length L2 may be greater than the second dimension of the electronic component EC, but it is preferably set within the range of 1.1 to 1.5 times the second dimension of the electronic component EC. Furthermore, the maximum value of the depth D2 of the guide recess 12b may be smaller than the depth D1 of the storage recess 12a, but it is preferably set within the range of 1/4 to 3/4 of the third dimension of the electronic component EC. Fig. 3 shows an example of a method of inserting the electronic component EC into the receiving recess 12a of the carrier tape 10 shown in Figs. 1 and 2 from the lateral direction. This insertion method is nothing but an example, and it is not limited to the method of inserting the electronic component EC into the receiving recess 12a of the carrier tape 10 from the lateral direction. In Figure 3, TG is a belt guide, TGa is a guide groove, IG is a part guide, and IGa is a part passage. The upper surface of the tape guide TG supports the lower surface of the carrier tape 10 except for the storage recess 12a and the guide recess 12b, and the inner surface of the guide groove TGa supports the lower surface of the storage recess 12a and the guide recess 12b. . On the other hand, the gap between the lower surface of the part guide IG does not hinder the intermittent movement of the carrier belt 10 in the longitudinal direction and can inhibit the displacement of the carrier belt 10 in the upper and lower directions, and is with the upper surface of the carrier belt 10 Face to face. In addition, the cross-sectional shape of the component passage IGa is slightly larger than the rectangle of the second and third dimensions of the electronic component EC, and has an inclination that matches the inclination angle of the bottom surface 12b1 of the guide recess 12b. As shown in FIG. 3(A), when the electronic component EC is inserted into the receiving recess 12a of the carrier tape 10 from the lateral direction, the electronic component EC that has been arranged by a basin feeder (illustration omitted) is linearly fed Machine (not shown) and sent to the parts passage IGa. The electronic component EC that has been fed into the component passage IGa slides along the inclination of the component passage IGa, and is fed into the guide recess 12b. Then, as shown in FIG. 3(B), the electronic component EC that has been fed into the guide recess 12b slides along the slope of the bottom surface 12b1, and is fed into the storage recess 12a. As described above, the guide recess 12b has a shape in which the length L2 decreases from the upper surface of the main body 11 toward one side (the left side of FIG. 3(B)) in the width direction of the storage recess 12a, so even if it is just fed to When the posture of the electronic component EC of the guiding recess 12b is disordered, the disorder of the posture can also be corrected in the process of moving along the guiding recess 12b. In addition, since the minimum value of the length L2 of the guide recess 12b coincides with the length L1 of the storage recess 12a, the electronic component EC after the posture correction can be smoothly fed from the guide recess 12b to the storage recess 12a. As shown in FIG. 3(C), the electronic component EC that has been fed into the storage recess 12a is in contact with the other side (the right side of FIG. 3(C)) in the width direction of the storage recess 12a at its front end. The surface is inclined such that the bottom surface 12a1 of the storage recess 12a is in contact with each other, whereby the electronic component EC is inserted into the storage recess 12a. Since the maximum value of the depth D2 of the guide recess 12b is smaller than the depth D1 of the storage recess 12a, even if the electronic component EC stored behind the storage recess 12a vibrates due to external force, it will not cause a part of the electronic component EC to enter the guide The recessed portion 12b is such a problem that the storage posture is greatly disordered. Furthermore, when the electronic component EC is not smoothly sliding in the guiding recess 12b or the electronic component EC is fed from the guiding recess 12b to the receiving recess 12a due to the small quality or small size of the electronic component EC, etc. , Can pass through the gap between the lower surface of the part guide IG where there is no part passage IGa (the right part of FIG. 3(A)) and the upper surface of the carrier belt 10, or the above-mentioned part of the part guide IG Part of the suction passage causes negative pressure to act on the component passage IGa, and the electronic component EC in the component passage IGa is drawn into the guide recess 12b and the receiving recess 12a by the negative pressure. As described above, a guide recess 12b is provided on one side of the storage recess 12a in the width direction. The guide recess 12b has a depth D2 that increases from the upper surface of the main body 11 toward the side surface of the storage recess 12a in the width direction, and is similar to the storage recess 12a. Since 12a is continuous, the guide recess 12b can be used to appropriately insert the electronic component EC into the receiving recess 12a of the carrier tape 10 from the lateral direction. In addition, since the maximum value of the depth D2 of the guide recess 12b is smaller than the depth D1 of the storage recess 12a, even if the electronic component EC stored behind the storage recess 12a vibrates due to external force, it will not cause a part of the electronic component EC to enter The guide recessed portion 12b is a bad situation in which the storage posture is greatly disordered. Furthermore, the guide recess 12b has a form in which the length L2 decreases from the upper surface of the main body 11 toward one side in the width direction of the storage recess 12a, so even if the posture of the electronic component EC just fed into the guide recess 12b is disturbed In the case, the disorder of the posture can also be corrected during the movement along the guiding recess 12b. In addition, since the minimum value of the length L2 of the guide recess 12b coincides with the length L1 of the storage recess 12a, the electronic component EC after the posture correction can be smoothly fed from the guide recess 12b to the storage recess 12a. Fig. 4 shows an electronic component storage tape 30 using the carrier tape 10 shown in Figs. 1 and 2. The electronic component storage tape 30 shown in FIG. 4 is attached to each storage recess 12a of the carrier tape 10 to contain electronic components EC, and the upper end of each storage recess 12a containing the electronic components EC is blocked by the belt-shaped covering tape 20 The opening covers a part of the upper surface of the carrier belt 11. That is, the electronic component storage tape 30 is manufactured by the following steps: after the electronic component EC is stored in each storage recess 12a of the carrier tape 10, the tape-shaped cover tape 20 is used to block the electronic component EC. A part of the upper surface of the carrier tape 11 is covered with the upper end of each storage recessed part 12a open. The cover tape 20 is preferably transparent or semi-transparent so that the storage state can be confirmed from the outside. In addition, the covering tape 20 can be either a heat-sensitive type or a pressure-sensitive type, and at least two sides in the width direction are attached to the upper surface of the belt body 11. That is, if the carrier tape 10 shown in FIGS. 1 and 2 is used, the electronic component storage tape 30 shown in FIG. 4 can be reliably manufactured. "Second Embodiment" Fig. 5 shows a carrier tape 10-1 according to the second embodiment of the present invention. The carrier tape 10-1 shown in Fig. 5 is different from the carrier tape 10 shown in Figs. 1 and 2 in that the width W2 of the guide recess 12b is reduced, and the inclination angle of the bottom surface 12b1 is increased; and the accompanying guide recess As the width W2 of 12b decreases, the width Wm of the border (notation omitted) increases. Since the other structure is the same as the carrier tape 10 shown in FIG. 1 and FIG. 2, the description is abbreviate|omitted. Even if it is the carrier tape 10-1, as with the carrier tape 10 shown in FIGS. 1 and 2, not only can the method of inserting the electronic component EC into the storage recess 12a from the lateral direction be carried out appropriately, but also can be reliably manufactured and illustrated. The electronic component storage tape 30 shown in 4 is the same electronic component storage tape. Compared with the carrier tape 10 shown in Figs. 1 and 2, the carrier tape 10-1 shown in Fig. 5 has a larger inclination angle of the bottom surface 12b1 of the guide recess 12b. When the inclination is the same as the inclination of the part passage IGa shown in FIG. 3, the inclination of the bottom surface 12b1 of the guide recess 12b is greater than the inclination of the part passage IGa, and the outlet side (the bottom surface 12b1 of the guide recess 12b is located The cross-sectional shape of the part) is larger than the cross-sectional shape of the entrance side of the component passage IGa. Therefore, it is possible to smoothly carry out the feeding of the electronic component EC from the component passage IGa to the guiding recess 12b and the feeding of the electronic component EC from the guiding recess 12b to the storage recess 12a. Furthermore, in the case of the carrier tape 10-1 shown in FIG. 5, due to the small mass or size of the electronic component EC, it is impossible to smoothly slide the electronic component EC in the guide recess 12b or the electronic component EC When the part EC is fed from the guide recess 12b to the storage recess 12a, it can also pass between the lower surface of the part guide IG where there is no part passage IGa (the right part of FIG. 6) and the upper surface of the carrier belt 10 Or the suction passage separately provided in the above-mentioned part of the part guide IG, so that negative pressure is applied to the part passage IGa, and the electronic component EC in the part passage IGa is pulled into the guide recess 12b by the negative pressure and accommodated Recess 12a. "Third Embodiment" Fig. 7 shows a carrier tape 10-2 of the third embodiment of the present invention. The carrier tape 10-2 shown in Fig. 7 is different from the carrier tape 10 shown in Figs. 1 and 2 in that the carrier tape 10-2 itself is a compression processing type. The material of the carrier tape 10-2 is, for example, paper, synthetic paper, etc. Since the receiving recess 12a and the guiding recess 12b are formed by compression processing, the height H of the carrier tape 10-2 is substantially constant in the width direction. Since the other structure is the same as the carrier tape 10 shown in FIG. 1 and FIG. 2, the description is abbreviate|omitted. Even for the carrier tape 10-2, as with the carrier tape 10 shown in FIGS. 1 and 2, not only can the method of inserting the electronic component EC into the storage recess 12a from the lateral direction be carried out appropriately, but also the manufacturing and drawing can be performed reliably. The electronic component storage tape 30 shown in 4 is the same electronic component storage tape. "Other Embodiments" (m1) In each of the above embodiments, the receiving recess 12a of the component receiving portion 12 corresponds to the electronic component EC having a substantially rectangular parallelepiped shape having the relationship of the first size>the second size=the third size. Moreover, if the depth D1 of the accommodating recess 12a is changed, it is possible to replace electronic components having a substantially rectangular parallelepiped shape having the relationship of the first size>the second size>the third size, or those having the first size>the third size>the second size The electronic components in the shape of a roughly rectangular parallelepiped in relation to each other are used as insertion objects (accommodation objects). Even if the depth D1 of the accommodating recess 12a is changed, not only can the method of inserting the electronic component EC into the accommodating recess 12a from the lateral direction be performed appropriately, but also an electronic component storage tape that is the same as the electronic component storage tape 30 shown in FIG. 4 can be manufactured reliably . (m2) In the above embodiments, it has been shown that the arrangement interval (pitch P1, see FIG. 1) of the parts storage portion 12 is set to 1/2 of the arrangement interval (pitch P2, see FIG. 1) of the feed holes 13, but The pitches P1 and P2 can also be changed according to the size of the electronic component to be inserted (accommodation target). Even if the pitches P1 and P2 are changed, not only can the method of inserting the electronic component EC into the storage recess 12a from the lateral direction be carried out appropriately, but also the electronic component storage tape which is the same as the electronic component storage tape 30 shown in FIG. 4 can be manufactured reliably. (m3) In each of the above embodiments, the guide recess 12b of the part storage portion 12 has shown that the bottom surface 12b1 is composed of a flat surface, but even if the bottom surface 12b1 is set as a gentle curved surface (convex or concave Curved surface, etc.), not only can the method of inserting the electronic component EC into the storage recess 12a from the lateral direction be appropriately performed, but also the electronic component storage tape that is the same as the electronic component storage tape 30 shown in FIG. 4 can be reliably manufactured. (m4) In each of the above embodiments, as the guide recess 12b of the parts storage portion 12, it has been shown that the length L2 is reduced from the upper surface of the main body 11 toward one side in the width direction of the storage recess 12a, but it may be The length L2 of the guide recess 12b is fixed, and the length L2 is made to coincide with the length L1 of the storage recess 12a. In this case, although it is not easy to obtain the posture correction effect achieved by the guide recess 12b, not only can the method of inserting the electronic component EC into the receiving recess 12a from the lateral direction be carried out appropriately, but also the electronic components shown in FIG. 4 can be manufactured reliably. The parts storage tape 30 is the same electronic component storage tape.

10‧‧‧承載帶 10-1‧‧‧承載帶 10-2‧‧‧承載帶 11‧‧‧帶本體 11a‧‧‧寬度方向一端緣 11b‧‧‧寬度方向另一端緣 12‧‧‧零件收納部 12a‧‧‧收納凹部 12a1‧‧‧底面 12a2‧‧‧側面 12b‧‧‧導引凹部 12b1‧‧‧底面 12b2‧‧‧側面 13‧‧‧進給孔 20‧‧‧覆帶 30‧‧‧電子零件收納帶 D1‧‧‧收納凹部之深度 D2‧‧‧導引凹部之深度 EC‧‧‧電子零件 H‧‧‧高度 IG‧‧‧零件導件 IGa‧‧‧零件通路 L1‧‧‧收納凹部之長度 L2‧‧‧導引凹部之長度 P1‧‧‧間距 P2‧‧‧間距 t‧‧‧厚度 TG‧‧‧帶導件 TGa‧‧‧導槽 W‧‧‧寬度 Wm‧‧‧寬度 W1‧‧‧收納凹部之寬度 W2‧‧‧導引凹部之寬度 10‧‧‧Carrier Belt 10-1‧‧‧Carrier Belt 10-2‧‧‧Carrier Belt 11‧‧‧With body 11a‧‧‧One edge in the width direction 11b‧‧‧The other edge in the width direction 12‧‧‧Parts storage 12a‧‧‧Receiving recess 12a1‧‧‧Bottom 12a2‧‧‧Side 12b‧‧‧Guide recess 12b1‧‧‧Bottom 12b2‧‧‧Side 13‧‧‧Feed hole 20‧‧‧Cover 30‧‧‧Electronic parts storage belt D1‧‧‧The depth of the receiving recess D2‧‧‧The depth of the guide recess EC‧‧‧Electronic Parts H‧‧‧Height IG‧‧‧Part guide IGa‧‧‧Parts access L1‧‧‧The length of the receiving recess L2‧‧‧Length of guide recess P1‧‧‧Pitch P2‧‧‧Pitch t‧‧‧Thickness TG‧‧‧With guide TGa‧‧‧Guide groove W‧‧‧Width Wm‧‧‧Width W1‧‧‧Width of receiving recess W2‧‧‧Width of guide recess

圖1係本發明之第1實施形態之承載帶之局部俯視圖。 圖2係沿著圖1之S1-S1線之剖視圖。 圖3(A)～圖3(C)係表示自橫向對圖1及圖2所示之承載帶之收納凹部***電子零件的方法之一例之圖。 圖4係使用圖1及圖2所示之承載帶之電子零件收納帶之局部俯視圖。 圖5係本發明之第2實施形態之承載帶之與圖2對應之圖。 圖6係表示自橫向對圖5所示之承載帶之收納凹部***電子零件的方法之一例之圖。 圖7係本發明之第3實施形態之承載帶之與圖2對應之圖。Fig. 1 is a partial plan view of the carrier tape of the first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along the line S1-S1 in Fig. 1; 3(A) to 3(C) are diagrams showing an example of a method of inserting electronic components into the receiving recesses of the carrier tape shown in FIGS. 1 and 2 from the lateral direction. Fig. 4 is a partial plan view of an electronic component storage tape using the carrier tape shown in Figs. 1 and 2. Fig. 5 is a view corresponding to Fig. 2 of the carrier tape of the second embodiment of the present invention. Fig. 6 is a diagram showing an example of a method of inserting an electronic component into the receiving recess of the carrier tape shown in Fig. 5 from the lateral direction. Fig. 7 is a view corresponding to Fig. 2 of the carrier tape of the third embodiment of the present invention.

10‧‧‧承載帶 10‧‧‧Carrier Belt

11‧‧‧帶本體 11‧‧‧With body

11a‧‧‧寬度方向一端緣 11a‧‧‧One edge in the width direction

12‧‧‧零件收納部 12‧‧‧Parts storage

12a‧‧‧收納凹部 12a‧‧‧Receiving recess

12a1‧‧‧底面 12a1‧‧‧Bottom

12a2‧‧‧側面 12a2‧‧‧Side

12b‧‧‧導引凹部 12b‧‧‧Guide recess

12b1‧‧‧底面 12b1‧‧‧Bottom

12b2‧‧‧側面 12b2‧‧‧Side

13‧‧‧進給孔 13‧‧‧Feed hole

D1‧‧‧收納凹部之深度 D1‧‧‧The depth of the receiving recess

D2‧‧‧導引凹部之深度 D2‧‧‧The depth of the guide recess

H‧‧‧高度 H‧‧‧Height

t‧‧‧厚度 t‧‧‧Thickness

Wm‧‧‧寬度 Wm‧‧‧Width

Claims (8)

一種電子零件收納帶用承載帶，於將上述承載帶之長邊方向設為長度方向，短邊方向設為寬度方向，與該等方向正交之方向設為高度方法，並且將沿著長度方向之尺寸設為長度，沿著寬度方向之尺寸設為寬度，沿著高度方向之尺寸設為高度或深度時，上述承載帶包括：帶狀之帶本體；及收納凹部，其具有能夠收納電子零件之長度、寬度及深度，且在長度方向上等間隔地設置於上述帶本體；僅於上述帶本體中之上述收納凹部之寬度方向一側設置有導引凹部，上述導引凹部係深度自上述帶本體之上表面朝向上述收納凹部之寬度方向一側面增加，且與上述收納凹部連續之形態。 A carrier tape for an electronic part storage tape, in which the long side direction of the carrier tape is set as the length direction, the short side direction is set as the width direction, the direction orthogonal to these directions is set as the height method, and the length direction When the size is set as length, the size along the width direction is set as width, and the size along the height direction is set as height or depth, the above-mentioned carrier tape includes: a belt-shaped tape body; and a storage recess that can accommodate electronic parts The length, width and depth of the belt body are arranged at equal intervals in the longitudinal direction; only one side of the width direction of the storage recess in the belt body is provided with guide recesses, and the depth of the guide recesses is from the above The upper surface of the belt body increases toward one side surface in the width direction of the storage recess and is continuous with the storage recess. 如請求項1之電子零件收納帶用承載帶，其中上述導引凹部之最大深度小於上述收納凹部之深度。 The carrier tape for an electronic component storage tape of claim 1, wherein the maximum depth of the guide recess is smaller than the depth of the storage recess. 如請求項1或2之電子零件收納帶用承載帶，其中上述電子零件具有與上述收納凹部之寬度對應之第1尺寸、與上述收納凹部之長度對應之第2尺寸、及與上述收納凹部之深度對應之第3尺寸；上述導引凹部之最大深度設定於上述電子零件之第3尺寸之1/4~3/4之範圍內。 The carrier tape for an electronic component storage tape of claim 1 or 2, wherein the electronic component has a first size corresponding to the width of the storage recess, a second size corresponding to the length of the storage recess, and a size corresponding to the storage recess The depth corresponds to the third dimension; the maximum depth of the guide recess is set within the range of 1/4 to 3/4 of the third dimension of the electronic component. 如請求項1或2之電子零件收納帶用承載帶，其中 上述導引凹部具有長度自上述帶本體之上表面朝向上述收納凹部之寬度方向一側面減小之形態。 Such as claim 1 or 2 of the carrier tape for the electronic component storage tape, where The guide recess has a form in which the length decreases from the upper surface of the belt main body toward one side surface in the width direction of the storage recess. 如請求項4之電子零件收納帶用承載帶，其中上述電子零件具有與上述收納凹部之寬度對應之第1尺寸、與上述收納凹部之長度對應之第2尺寸、及與上述收納凹部之深度對應之第3尺寸；上述導引凹部之最大長度設定於上述電子零件之第2尺寸之1.1倍~1.5倍之範圍內。 The carrier tape for an electronic component storage tape of claim 4, wherein the electronic component has a first size corresponding to the width of the storage recess, a second size corresponding to the length of the storage recess, and a depth corresponding to the storage recess The third dimension; the maximum length of the guide recess is set within the range of 1.1 to 1.5 times the second dimension of the electronic component. 如請求項4之電子零件收納帶用承載帶，其中上述導引凹部之最小長度與上述收納凹部之長度一致。 The carrier tape for an electronic component storage tape of claim 4, wherein the minimum length of the guide recess is the same as the length of the storage recess. 一種電子零件收納帶，其包括：如請求項1至6中任一項之承載帶；上述電子零件，其收納於上述承載帶之上述收納凹部；及覆帶，其以堵住收納有上述電子零件之上述收納凹部之上端開口的方式覆蓋上述承載帶之上表面一部分。 An electronic component storage tape, comprising: the carrier tape according to any one of claims 1 to 6; the electronic component stored in the storage recess of the carrier tape; and a cover tape to block the storage of the electronic component A part of the upper surface of the carrier tape is covered in such a way that the upper end of the accommodating recess of the component is open. 一種電子零件收納帶之製造方法，其包括下述步驟：準備如請求項1至6中任一項之承載帶；將上述電子零件收納於上述承載帶之上述收納凹部；及藉由覆帶以堵住收納有上述電子零件之上述收納凹部之上端開口的方式覆蓋上述承載帶之上表面一部分。A method for manufacturing an electronic component storage tape, which includes the following steps: preparing a carrier tape according to any one of claims 1 to 6; accommodating the electronic component in the receiving recess of the carrier tape; and covering the tape with A part of the upper surface of the carrier tape is covered so as to block the opening of the upper end of the accommodating recess in which the electronic component is accommodated.
TW106124703A 2016-07-27 2017-07-24 Carrier tape for electronic component storage tape, electronic component storage tape, and manufacturing method of electronic component storage tape TWI745407B (en)

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JP6836767B1 (en) * 2019-12-26 2021-03-03 日本ファインテック株式会社 Electronic component insertion device
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