TWI741151B - Workpiece inspection method, work piece inspection device and processing device - Google Patents
Workpiece inspection method, work piece inspection device and processing device Download PDFInfo
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- TWI741151B TWI741151B TW107106243A TW107106243A TWI741151B TW I741151 B TWI741151 B TW I741151B TW 107106243 A TW107106243 A TW 107106243A TW 107106243 A TW107106243 A TW 107106243A TW I741151 B TWI741151 B TW I741151B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
[課題]更適當且便於檢測出工件的研削痕。[解決手段]本發明包括:加工步驟,係用研削磨石或研磨墊對工件進行加工;投影步驟,係將來自光源的光照射在該工件的被加工面,而被該被加工面所反射的該光抵達螢幕,藉此將反映了該加工步驟之中被加工面上所形成凹凸的狀態之投影影像予以映照在該螢幕;攝像步驟,係對該螢幕的該投影影像進行攝像來形成攝像圖像;及判定步驟,係根據該攝像圖像來掌握該工件的該凹凸狀態,進而判定工件之好壞與否。[Question] It is more appropriate and convenient to detect the grinding marks of the workpiece. [Solution] The present invention includes: a processing step, which is to process a workpiece with a grinding stone or a polishing pad; and a projection step, which irradiates light from a light source on the processed surface of the workpiece and is reflected by the processed surface The light reaches the screen, so that the projection image reflecting the state of the unevenness formed on the processed surface in the processing step is projected on the screen; the imaging step is to capture the projection image of the screen to form a camera Image; and the determination step, based on the camera image to grasp the uneven state of the workpiece, and then determine whether the workpiece is good or bad.
Description
本發明係關於一種對工件上形成的研削痕進行檢查之檢查方法、工件的檢查裝置及加工裝置。The invention relates to an inspection method for inspecting grinding marks formed on a workpiece, a workpiece inspection device and a processing device.
將矽、SiC、藍寶石等材料所構成之各種平板狀工件用研削磨石加以研削、或用研磨墊加以研磨之類的加工手法已為人所悉知。該研削磨石,係將金剛石等磨粒由樹脂或金屬等結合材料予以固定所形成。另外,不織布或胺基甲酸酯(urethane)墊所構成之該研磨墊,係與磨粒一同用於對工件的被研磨面進行研磨。Processing techniques such as grinding various flat workpieces made of materials such as silicon, SiC, and sapphire with a grinding stone or grinding with a polishing pad are known. The grinding grindstone is formed by fixing abrasive grains such as diamond with a bonding material such as resin or metal. In addition, the polishing pad composed of non-woven fabric or urethane pad is used together with abrasive grains to polish the polished surface of the workpiece.
利用研削磨石的研削加工或利用研磨墊的研磨加工當中,由研削磨石或研磨墊與工件接觸來進行加工。在這種加工之中,從研削磨石脫落的磨粒、從工件研削下來的研削屑或凝聚的磨粒,可能會進入研削磨石或研磨墊與工件之間,若繼續進行加工則會在工件上形成又深又長的研削痕跡(刮痕)。In the grinding process using a grinding stone or the grinding process using a polishing pad, the grinding stone or the polishing pad is in contact with the workpiece to perform the processing. In this kind of processing, the abrasive particles dropped from the grinding stone, the grinding chips or agglomerated abrasive particles from the workpiece may enter between the grinding stone or the grinding pad and the workpiece. If the processing is continued, it will be Deep and long grinding marks (scratches) are formed on the workpiece.
若對有該研削痕形成之工件進行分割來形成各個元件晶片,則元件晶片之抗折強度就會降低。於是乎,有人提出以下方法:對加工中或是加工後之工件進行攝像來檢測研削痕、或是對工件照射雷射光再根據所反射雷射光之強度來檢測研削痕。 [習知技術文獻] [專利文獻]If the workpiece formed by the grinding marks is divided to form each element wafer, the flexural strength of the element wafer will be reduced. Therefore, some people have proposed the following methods: taking a video of the workpiece during or after processing to detect the grinding marks, or irradiating the workpiece with laser light and then detecting the grinding marks according to the intensity of the reflected laser light. [Literature Technical Documents] [Patent Documents]
[專利文獻1] 日本特開2016-49581號公報 [專利文獻2] 日本特開2010-17792號公報[Patent Document 1] Japanese Patent Application Publication No. 2016-49581 [Patent Document 2] Japanese Patent Application Publication No. 2010-17792
[發明所欲解決的課題] 然而,無論是實施何種方法,能做到研削痕檢測之裝置的構成很複雜,另外,該裝置價格高昂乃是問題。[Problem to be Solved by the Invention] However, no matter what method is implemented, the structure of the device capable of detecting the grinding marks is complicated. In addition, the high price of the device is a problem.
本發明係鑒於上開問題點而完成,其目的在於提供一種:可更適當更適當地對工件的被加工面上形成的研削痕(刮痕)等凹凸狀態進行檢測之工件的檢查方法、工件的檢查裝置及加工裝置。 [解決課題的技術手段]The present invention was completed in view of the problem of the upper opening, and its purpose is to provide a workpiece inspection method and workpiece that can more appropriately and appropriately detect the uneven state such as grinding marks (scratches) formed on the workpiece surface of the workpiece The inspection device and processing device. [Technical means to solve the problem]
根據本發明的第1態樣,提供一種工件的檢查方法,其特點為具備:加工步驟,係用研削磨石或研磨墊對工件進行加工;投影步驟,係將來自光源的光照射在該工件的被加工面,而該被加工面所反射的該光抵達螢幕,藉此將反映了該加工步驟之中被加工面上所形成的凹凸的狀態之投影影像予以映照在該螢幕;攝像步驟,係對該螢幕的該投影影像進行攝像來形成攝像圖像;及判定步驟,係根據該攝像圖像來掌握該工件的該凹凸狀態,進而判定工件之好壞與否。According to a first aspect of the present invention, a method for inspecting a workpiece is provided, which is characterized by: a processing step, which is to process the workpiece with a grinding stone or a polishing pad; and a projection step, which is to irradiate light from a light source on the workpiece The processed surface, and the light reflected by the processed surface reaches the screen, thereby reflecting the projection image that reflects the state of the unevenness formed on the processed surface during the processing step on the screen; the imaging step, The projection image of the screen is captured to form a captured image; and the determining step is to grasp the uneven state of the workpiece according to the captured image, and then determine whether the workpiece is good or bad.
根據本發明的第2態樣,提供一種工件的檢查方法,其特點為具備:加工步驟,係用研削磨石或研磨墊對工件進行加工;攝像步驟,係將來自光源的光照射在該工件的被加工面,而對該被加工面所反射的該光進行攝像,藉此形成攝像圖像,該攝像圖像寫入反映了該加工步驟之中被加工面上所形成凹凸的狀態之影像;及判定步驟,係根據該攝像圖像來掌握該工件的該凹凸狀態,進而判定工件之好壞與否。According to a second aspect of the present invention, a method for inspecting a workpiece is provided, which is characterized by having: a processing step, which is to process the workpiece with a grinding stone or a polishing pad; and an imaging step, which is to irradiate light from a light source on the workpiece The light reflected by the processed surface is captured to form a captured image, and the captured image is written to reflect the state of the unevenness formed on the processed surface during the processing step ; And the determination step, is based on the camera image to grasp the uneven state of the workpiece, and then determine whether the workpiece is good or bad.
根據本發明的第3態樣,提供如本發明的第1態樣或是第2態樣有關之工件的檢查方法,其特點為:該攝像圖像中,寫入包含該被加工面中心之該被加工面的中央區域,且在該攝像圖像中,未寫入圍繞該中央區域之該被加工面的外周區域。According to a third aspect of the present invention, a method for inspecting a workpiece related to the first aspect or the second aspect of the present invention is provided. The central area of the processed surface, and in the captured image, the outer peripheral area of the processed surface surrounding the central area is not written.
根據本發明的第4態樣,提供一種工件的檢查裝置,其特點為具備:保持台,係在暴露研削磨石或研磨墊加工之工件的被加工面之狀態下,保持該工件;光源,係將光照射在該保持台所保持之該工件的被加工面;螢幕,係受該被加工面所反射的該光照射,藉此映照出反映了該工件的該被加工面上由該加工所形成的凹凸的狀態之投影影像;及攝像單元,係對該螢幕所映照之投影影像進行攝像來形成攝像圖像。According to a fourth aspect of the present invention, a device for inspecting a workpiece is provided, which is characterized by having: a holding table for holding the workpiece in a state where the workpiece surface of the workpiece processed by the grinding stone or polishing pad is exposed; a light source, The light is irradiated on the processed surface of the workpiece held by the holding table; the screen is irradiated by the light reflected by the processed surface, thereby reflecting that the processed surface of the workpiece is reflected by the processed surface The projection image of the formed concavity and convexity state; and the imaging unit, which captures the projection image reflected on the screen to form a captured image.
根據本發明的第5態樣,提供一種工件的檢查裝置,其特點為具備:保持台,係在暴露研削磨石或研磨墊加工之工件的被加工面之狀態下,保持該工件;光源,係將光照射在該保持台所保持之該工件的被加工面;及攝像單元,係對該被加工面所反射的該光進行檢測來形成攝像圖像。According to a fifth aspect of the present invention, a device for inspecting a workpiece is provided, which is characterized by having: a holding table for holding the workpiece in a state where the workpiece surface of the workpiece processed by the grinding stone or polishing pad is exposed; a light source, The light is irradiated on the processed surface of the workpiece held by the holding table; and the imaging unit detects the light reflected by the processed surface to form a captured image.
在本發明的第4態樣及第5態樣之中,該工件的檢查裝置亦可更具備:判定單元,係根據該攝像圖像來掌握該工件的該凹凸狀態,進而判定工件之好壞與否。該判定單元,亦可在包含該被加工面中心的中央區域、與圍繞該中央區域的外周區域,檢測出連續的該凹凸時,將該工件判定為不良品。In the fourth aspect and the fifth aspect of the present invention, the inspection device of the workpiece may be further provided with: a determination unit that grasps the uneven state of the workpiece based on the captured image, and then determines whether the workpiece is good or bad Or not. The determination unit may determine that the workpiece is a defective product when the continuous unevenness is detected in the central area including the center of the processed surface and the outer peripheral area surrounding the central area.
在本發明的第4態樣及第5態樣之中,亦可為:該攝像圖像中,寫入包含該被加工面中心之該被加工面的中央區域;該攝像圖像中,未寫入圍繞該中央區域之該被加工面的外周區域。In the fourth aspect and the fifth aspect of the present invention, it is also possible that: in the captured image, write the center area of the processed surface including the center of the processed surface; in the captured image, no Write the outer peripheral area of the processed surface surrounding the central area.
本發明一態樣亦為一種加工裝置,其特點在於具備:卡盤台,係保持工件;加工單元,係用該研削磨石或是該研磨墊對該卡盤台所保持之該工件進行加工;清洗單元,係對經加工之該工件的被加工面進行清洗;及檢查單元,係對經清洗之該工件的該被加工面上形成的加工痕跡之凹凸狀態進行檢查;其中,該檢查單元,為和本發明有關之工件的檢查裝置。 [發明功效]One aspect of the present invention is also a processing device, which is characterized by having: a chuck table, which holds a workpiece; a processing unit, uses the grinding stone or the polishing pad to process the workpiece held by the chuck table; The cleaning unit is to clean the processed surface of the processed workpiece; and the inspection unit is to inspect the uneven state of the processing traces formed on the processed surface of the cleaned workpiece; wherein, the inspection unit, It is a work piece inspection device related to the present invention. [Efficacy of invention]
根據本發明一態樣有關之檢查方法、檢查裝置及加工裝置,可基於使用包含光源、螢幕或凹面鏡之簡便構成所攝像到之攝像圖像,來掌握工件的被加工面上由加工所形成之研削痕(刮痕)等凹凸狀態。該攝像圖像之攝像中,使用從光源照射在工件的被加工面並從該被加工面反射出的光。According to an aspect of the present invention, the inspection method, inspection device, and processing device can grasp the image formed by the processing on the processed surface of the workpiece based on the captured image captured by a simple configuration including a light source, a screen, or a concave mirror. Concave and convex conditions such as grinding marks (scratches). In the imaging of this captured image, light that is irradiated from a light source on the processed surface of the workpiece and reflected from the processed surface is used.
若工件的被加工面上因加工而形成了凹凸,則利用照射在該被加工面反射出的光所形成之攝像圖像中,寫入強調該凹凸狀態之影像。因此,可便於掌握被加工面上所形成凹凸的狀態,可便於檢查工件。當確認了工件的被加工面有超出容許程度之凹凸形成時,可將該工件判定為不良品,並停止加工,去確認研削磨石或研磨墊之狀態。If unevenness is formed on the processed surface of the workpiece due to processing, an image that emphasizes the uneven state is written in a captured image formed by light irradiated on the processed surface. Therefore, it is easy to grasp the state of the unevenness formed on the surface to be processed, and it is easy to inspect the workpiece. When it is confirmed that there are irregularities on the processed surface of the workpiece that exceed the allowable degree, the workpiece can be judged as a defective product, and the processing can be stopped to confirm the state of the grinding stone or polishing pad.
從而,根據本發明一態樣,會提供一種可更適當更便於對工件的被加工面上形成的研削痕(刮痕)等凹凸狀態進行檢測之工件的檢查方法、工件的檢查裝置及加工裝置。Therefore, according to one aspect of the present invention, there is provided a workpiece inspection method, a workpiece inspection device, and a processing device that can more appropriately and easily detect the uneven state such as grinding marks (scratches) formed on the workpiece surface .
參照附圖,對本發明一態樣有關之實施形態進行說明。圖1(A)係示意性表示本發明一態樣有關之實施形態之工件的檢查方法、工件的檢查裝置、或是加工裝置之中的工件的立體圖。With reference to the drawings, an embodiment related to one aspect of the present invention will be described. FIG. 1(A) is a perspective view schematically showing a workpiece inspection method, a workpiece inspection device, or a workpiece in a processing device according to an embodiment of the present invention.
圖1(A)中,示意性表示了工件1。該工件1,係例如矽、SiC(碳化矽),又或是其他半導體等材料,或是藍寶石、玻璃、石英等材料所構成之略呈圓板狀之基板。In Fig. 1(A), the
工件1的表面1a由成格子狀排列之多條分割預定線(切割槽)3劃分為多個區域,由該多條分割預定線3劃分出的各區域中形成有IC等元件5。最後,將工件1沿著切割槽3加以分割,而形成各個元件晶片。The surface 1 a of the
接著,就該工件1的表面1a所黏貼之保護膠帶,利用圖1(B)加以說明。圖1(B)中,示意性表示了保護膠帶7。保護膠帶7,具有保護該工件1的表面1a上形成的元件5等之功能。保護膠帶7,保護工件1的表面1a側免於對工件1的背面進行加工或搬送等情況下造成的衝撃,防止元件5產生損傷。Next, the protective tape attached to the surface 1a of the
保護膠帶7具有:具有可撓性之膠膜狀基材、及在該基材的其中一面上形成的黏糊層(接著劑層)。例如,基材使用PO(聚烯烴)。亦可使用剛性高於PO之PET(聚對苯二甲酸乙二醇酯)、聚氯乙烯、聚苯乙烯等。另外,黏糊層(接著劑層)使用例如矽氧橡膠、丙烯酸類材料、環氧類材料等。The
接著,說明組裝有對形成凹凸的工件1進行檢查之檢查裝置的加工裝置。圖2係示意性表示作為包含檢查裝置的加工裝置之構成例的研削裝置的立體圖。Next, a description will be given of a processing device incorporating an inspection device for inspecting the
研削裝置2,在略長方體狀的基台4上具備:安裝於圓盤狀旋轉台6上的卡盤台8、研削單元10及研削單元10a。基台4的後部立設有支柱12及支柱12a,該支柱12及支柱12a分別設有研削單元10及研削單元10a。The
基台4上,設有可於水平面内中旋轉之圓盤狀旋轉台6。旋轉台6的上表面,具備有於圓周方向相隔120度的3個卡盤台8,藉由旋轉台6的旋轉,讓各卡盤台8分別定位於工件搬入搬出區域、第1研削區域、第2研削區域。在第1研削區域當中,實施例如粗研削;在第2研削區域當中,實施例如精細研削。The base 4 is provided with a disc-
卡盤台8内部具有一端與吸引源(未圖示)相連之吸引通道(未圖示),該吸引通道之另一端與卡盤台8上的保持面8a相連。該保持面8a由多孔質構件所構成,由該吸引源產生的負壓通過該多孔質構件作用於該保持面8a上載置的工件1,使得卡盤台8吸引保持工件。The chuck table 8 has a suction channel (not shown) with one end connected to a suction source (not shown), and the other end of the suction channel is connected with a
研削單元10具備:由主軸馬達14所旋轉驅動之研削輪16所保持之研削磨石18。研削單元10a具備:由主軸馬達14a所旋轉驅動之研削輪16a所保持之研削磨石18a。該研削輪16、16a所保持之研削磨石18、18a,係藉由加工進給單元20、20a上下移動,來和卡盤台8上所保持之工件1接觸,將該工件1研削成預定的厚度。The
基台4之前側部分比設有旋轉台8的部分更高,基台4之前端固定有卡匣載置台22、22a。卡匣載置台22上載置收納了研削加工前的工件1之卡匣22,卡匣載置台22a載置用以收納研削完畢的工件1之卡匣24a。The front side part of the base 4 is higher than the part where the
工件搬送機械臂26與卡匣載置台22、22a相鄰安裝於基台4上。基台4之前側部分進一步配設有:具有多個定位銷之定位台28、工件搬入機構(裝載臂)30、工件搬出機構(卸載臂)32、對已研削工件進行清洗及旋轉乾燥之旋轉清洗裝置34。The workpiece conveying
研削裝置2具備:在該旋轉清洗裝置34與卡匣載置台22a之間的本實施形態有關之檢查裝置36。該檢查裝置36具備:保持所要檢查的工件1之保持台38、光源40、螢幕42、攝像單元44。The grinding
在保持台38之斜上方,配置有用以對保持台38所保持之工件1全體發光之光源40。作為光源40,使用例如白熾燈泡或LED。不過,光源40的種類或位置等並未有限制。另外,該光可為平行光亦可為非平行光。若該光採用平行光,例如,可對於光源40組合凹面鏡等光學元件。另外,亦可使用發光區域較小、而被視為點光源之光源,來取得平行光或非平行光。Above the holding table 38 obliquely, a
工件1所反射之光的路徑(光路)上,設有藉由反射後的該光照射以形成投影影像之螢幕42。螢幕42,具代表性的是平坦螢幕,形成為大致與工件1相同的尺寸或大致能顯示工件中央區域的尺寸。在該被加工面因加工所形成之凹凸較容易通過工件中央區域,所以若使用例如可投影工件中心附近之直徑約50mm範圍之螢幕,則較易於確認該凹凸狀態。On the path (optical path) of the light reflected by the
本實施形態當中,在保持台38之斜上方配置光源40,並且在工件1所反射之光的路徑上配置螢幕42。若對工件1發射從光源40往斜下方前進之光,則該光會被工件1之暴露面(在此為背面11b)所反射,照射在螢幕42。結果,螢幕42上,形成反映了工件1的暴露面(亦即背面1b)之狀態的投影影像。In this embodiment, the
在可看到螢幕42之位置,配置有用以對螢幕42上形成之投影影像進行攝像以形成攝像圖像之攝像單元(攝像手段)44。該攝像單元44,係例如CCD或CMOS等攝像元件與鏡片等光學元件組合之數位相機,將對投影影像進行攝像所形成之攝像圖像(影像)往外部輸出。再者,作為該攝像單元44,亦可使用形成靜像之數位靜像攝影機、形成動畫之數位攝影機之任一者。At a position where the
在此,用圖4就螢幕42之傾斜角進行說明。圖4中,示意性表示了光源40、工件1、螢幕42、攝像單元44之相關位置。如圖4所示,較佳為工件1的背面1b所反射之該光會垂直入射於螢幕42,以此方式讓螢幕42傾斜。Here, the inclination angle of the
亦即,將螢幕42傾斜以使:入射於工件1之光與該背面1b所成角度、反射光與該背面1b所成角度、和工件1的背面1b之垂直面與螢幕42的傾斜角度、一致(即三個角度一致)。在此情形,可將極度變形的微小投影影像投影於螢幕42,所以可更正確掌握工件1的背面1b上形成凹凸的狀態。此時,為了讓攝像單元44攝像所形成之攝像圖像清晰化,要適當地調整攝像單元44之景深。That is, the
攝像單元44,與判定單元(未圖示)相連,其用以由攝像單元44所輸出之攝像圖像來確認在工件1的被加工面(背面1b) 因加工而形成之凹凸的狀態,並根據該凹凸狀態來判定工件1之好壞與否。The
再者,檢查裝置36,亦可具備凹面鏡以取代螢幕42。若具備凹面鏡而取代螢幕42,則可藉由該凹面鏡將從該工件1的被加工面反射之光聚光於攝像單元44。因此,抵達攝像單元44之光量增加,攝像單元44可形成更清晰的攝像圖像。Furthermore, the
另外,本實施形態有關之加工裝置,不一定是藉由具備研削磨石的研削單元來研削工件之研削裝置,也可以是藉由具備研磨墊的研磨單元來研磨工件之研磨裝置。In addition, the processing device according to this embodiment is not necessarily a grinding device that grinds a workpiece by a grinding unit equipped with a grinding grindstone, but may be a grinding device that grinds a workpiece by a grinding unit equipped with a polishing pad.
接著,就由研削裝置2中所具備的檢查裝置36實施之本實施形態有關之工件的檢查方法進行說明。該檢查方法當中,首先,實施用研削磨石或研磨墊對工件加工之加工步驟。Next, the inspection method of the workpiece according to the present embodiment implemented by the
就該加工步驟,利用圖3(A)及圖3(B)加以說明。圖3(A)係示意性表示研削加工的側視圖,圖3(B)係示意性表示研磨加工的側視圖。This processing step will be described with reference to Figs. 3(A) and 3(B). Fig. 3(A) is a side view schematically showing the grinding process, and Fig. 3(B) is a side view schematically showing the grinding process.
首先,如圖3(A)所表示,就藉由研削裝置2中所具備之研削單元10對工件1的背面1b側進行研削加工之情形加以說明。在表面1a側朝向下方之狀態下隔著保護膠帶7將工件1載於卡盤台8之保持面8a上。接著,使工件1吸引保持於卡盤台8,讓工件1的背面1b側暴露於上方。使研削裝置2之旋轉台6(參照圖2)旋轉,讓卡盤台8定位於研削單元10之下方。First, as shown in FIG. 3(A), a case where the grinding
接著,使研削單元10之主軸馬達14作動,讓研削輪16旋轉。另外,讓卡盤台8繞著與保持面8a垂直的軸周圍旋轉。接著,使加工進給單元20作動,讓研削輪16朝著工件1下降,當旋轉的研削輪16上裝設之研削磨石18與工件1的背面1b側觸碰時,對工件1進行研削加工。當研削磨石18藉加工進給單元20定位於預定高度位置時,將工件1薄化至預定的厚度。Next, the
再者,加工步驟當中,如圖3(B)所表示,亦可藉由研磨單元10b對工件1的背面1b側進行研磨加工。該研磨單元10b具備於研削裝置2中,以取代例如圖2所表示之研削裝置2的研削單元10a。再者,該研磨單元10b,亦可具備在不含研削單元之研磨裝置當中。Furthermore, in the processing steps, as shown in FIG. 3(B), the
該研磨單元10b具有裝設於研磨輪16b之研磨墊18b。使一端與該研磨輪16b相連且與主軸另一端相連之主軸馬達(未圖示)作動,藉以讓研磨輪16b旋轉。The polishing
利用研磨單元10b進行研磨加工的時,與上述的研削加工同樣,在工件1的表面1a側朝向卡盤台8之狀態下隔著保護膠帶7將工件1載於卡盤台8之保持面8a上。接著,使工件1吸引保持於卡盤台8,讓工件1的背面1b側暴露於上方。When the grinding
接著,使研磨輪16b旋轉,讓卡盤台8繞著與保持面8a垂直的軸周圍旋轉,讓研磨輪16b朝著工件1下降。當該研磨輪16b上裝設之研磨墊18b與該工件1的背面1b側觸碰時,實施研磨加工。Next, the
利用研削磨石18的研削加工或利用研磨墊18b的研磨加工當中,從研削磨石18脫落的磨粒、從工件1研削下的研削屑或凝聚的磨粒,可能會進入研削磨石18或研磨墊18b與工件1之間,若繼續進行加工則會在工件1上形成又深又長的研削痕(刮痕)。若對有該研削痕形成之工件1進行分割而形成各個元件晶片,元件晶片之抗折強度就會降低,作為元件無法發揮功能,變成不良品。During the grinding process with the grinding
因此,在本實施形態有關之工件的檢查方法當中,接著實施投影步驟、攝像步驟、判定步驟,以掌握工件1的被加工面上形成的研削痕(刮痕)等凹凸狀態,來判定工件之好壞與否。Therefore, in the inspection method of the workpiece according to this embodiment, the projection step, the imaging step, and the determination step are then implemented to grasp the uneven state such as grinding marks (scratches) formed on the processed surface of the
投影步驟當中,係將光照射在加工完畢之工件1的被加工面,並將所反射之光投影於螢幕。首先,將加工完畢之工件1從卡盤台8上移往檢查裝置36(參照圖2)之保持台38。在此過程中,藉由旋轉清洗裝置34清洗工件1之該被加工面。在工件1的表面1a側朝向保持台38之狀態下隔著保護膠帶7將工件1置於保持台38上,讓被加工面(背面1b)暴露於上方。In the projection step, light is irradiated on the processed surface of the processed
接著,如圖4所表示,從光源40發射光46。光源40,係設置成光46可對於保持台38所保持之工件1全體進行照射之態樣(位置、朝向等)。所以,從光源40發射之光46,會被工件1的被加工面(背面1b)反射。Next, as shown in FIG. 4, light 46 is emitted from the
另外,在被工件1反射之光46的路徑上,配置有螢幕42。因此,被工件1的被加工面(背面1b)反射之光46,會照射在螢幕42,形成與該被加工面上因加工所形成凹凸的狀態相應之投影影像。在此,被工件1反射之光46與背面1b所成角度,和螢幕42與加工物1的被加工面的垂直面之傾斜角一致時,該投影影像之變形變得極低。In addition, a
之後,實施攝像步驟。用攝像單元44對該投影影像進行攝像,而形成攝像圖像。此時,為了讓該攝像圖像清晰化,要適當地調整攝像單元(攝像機)44之景深。接著,將攝像單元44所形成之攝像圖像送往判定單元(未圖示)。After that, the imaging step is carried out. This projected image is captured by the
在攝像步驟之後,實施判定步驟:根據攝像單元44所形成之該攝像圖像,來掌握該工件的該凹凸狀態,進而判定工件的好壞與否。在本實施形態之中,該檢查裝置36之攝像單元44所形成的攝像圖像所寫入的投影影像是投影在螢幕42而非工件1的被加工面(背面1b)。After the imaging step, a determination step is implemented: according to the captured image formed by the
該投影影像,係照射在工件的被加工面之光46被該被加工面反射而照射在螢幕42所形成的影像。在此,該被加工面大致為鏡面,光46於該被加工面被鏡面反射,但在該被加工面有微小凹凸形成之情況,該光46會受該凹凸影響而部分地擴散或收斂。The projected image is an image formed by the light 46 irradiated on the processed surface of the workpiece being reflected by the processed surface and irradiated on the
因此,該投影影像,會是反映了該被加工面上所形成微小凹凸的狀態之有明暗對比的影像。再者,這種將被鏡面反射的光投影在螢幕等,而在所形成的影像中反映了該鏡面的凹凸狀態之有明暗對比之顯像,係稱作魔鏡顯像。接著,相較於對該被加工面進行直接攝像所形成之攝像圖像,對投影在螢幕42的投影影像進行攝像所形成之攝像圖像,更能有效用於掌握被加工面上所形成該凹凸的狀態。因而藉由魔鏡顯像,來強調該凹凸狀態。Therefore, the projected image will be an image with contrast between light and dark that reflects the state of the tiny irregularities formed on the surface to be processed. Moreover, this kind of light reflected by the mirror is projected on a screen, etc., and the formed image reflects the concavity and convexity of the mirror, and the contrast of light and dark is called the magic mirror image. Then, compared to the captured image formed by directly capturing the processed surface, the captured image formed by capturing the projection image projected on the
從而,可根據寫入該投影影像的該攝像圖像來更便於掌握該工件的該凹凸狀態。例如,被加工面未有凹凸形成時,該攝像圖像所寫入之被加工面全體的明亮度都一樣。另外,例如被加工面有凹凸形成時,該攝像圖像所寫入之投影影像會出現強調被加工面上所形成該凹凸的狀態之明暗圖案。也就是說,可從該攝像圖像掌握工件的凹凸狀態。Therefore, it is easier to grasp the uneven state of the workpiece based on the captured image written in the projection image. For example, when there is no unevenness on the processed surface, the brightness of the entire processed surface written in the captured image is the same. In addition, for example, when unevenness is formed on the surface to be processed, the projection image written in the captured image will have a bright and dark pattern that emphasizes the state of the unevenness formed on the surface to be processed. In other words, the uneven state of the workpiece can be grasped from the captured image.
不過,與攝像單元44相連之判定單元(未圖示),已預先登錄了條件:該條件用以根據由該攝像圖像掌握之被加工面的凹凸狀態,來判定是否能充分確保工件1之抗折強度。該判定單元,當工件1的抗折強度充足時,則將工件1判定為良品。另一方面,該判定單元,當因工件1的被加工面上所形成凹凸的狀態導致工件1的抗折強度不足時,則將該工件1判定為不良品。However, the judging unit (not shown) connected to the
例如,該判定單元,在該工件1之包含該被加工面中心之中央區域、與圍繞該中央區域之外周區域,檢測出連續的凹凸(加工痕跡)時,將該工件1判定為不良品。在此,該中央區域,是指例如距離該被加工面中央約該工件半徑的3分之1到4分之1之位置的圓形區域;該外周區域,是指被加工面之該中央區域以外的區域。For example, the determination unit determines that the
該中央區域與該外周區域之連續的凹凸(加工痕跡),因在正常加工下難以形成,所以若檢測出這種凹凸,則可判定加工裝置發生了某些異常,所以判定單元將檢測到該凹凸之工件1判定為不良品。The continuous unevenness (processing trace) between the central area and the outer peripheral area is difficult to form under normal processing. Therefore, if such unevenness is detected, it can be determined that some abnormality has occurred in the processing device, so the determination unit will detect the The
當判定單元將工件1判定為不良品時,不會將該工件1送往之後的製程,可予以廢棄。接著,在判定被加工面上形成的凹凸是因加工步驟之中的加工所產生時,則對加工步驟之中的加工條件等進行檢驗。或是,確認研削磨石或是研磨墊等有無異常。When the judging unit judges the
若實施以上的工件的檢查方法,則可根據用簡便構成所形成之攝像圖像,便於掌握工件1的被加工面因加工所形成之加工痕跡(刮痕)等凹凸狀態。If the inspection method of the workpiece described above is implemented, it is possible to easily grasp the uneven state such as processing marks (scratches) formed on the processed surface of the
再者,上述實施形態當中,光從光源直接照射在工件1,但亦可使從光源發出的光照射在凹面鏡,並讓該凹面鏡所反射之平行光照射在工件1。就此情況,利用圖5(A)加以說明。Furthermore, in the above embodiment, the light is directly irradiated on the
圖5(A)係示意性表示檢查裝置36a之構成例的圖。圖5(A)所表示之檢查裝置36a,具備:光源40a、凹面鏡48a、保持台38a、螢幕42a、攝像單元44、個人電腦50。FIG. 5(A) is a diagram schematically showing a configuration example of the
該檢查裝置36a當中,從光源40a發出的光照射在凹面鏡48a。該凹面鏡48a將平行光朝保持台38a所保持之工件1反射。工件1受到該平行光照射時,會將該平行光朝螢幕42a反射,該螢幕42a上形成反映了該工件的該凹凸狀態之投影影像。攝像單元44將該投影影像予以形成,將攝像圖像送往個人電腦50。該個人電腦50,具有作為判定單元之功能,根據該攝像圖像來掌握該工件之該凹凸狀態,進而判定工件之好壞與否。In the
還有,上述實施形態當中,使工件1所反射的光照射於螢幕而形成投影影像,並使攝像單元對該投影影像進行攝像而形成了攝像圖像。可是,亦可設置凹面鏡以取代該螢幕,使工件1所反射的光照射在該凹面鏡,並使該光朝著攝像單元聚光。就此情況,利用圖5(B)加以說明。In addition, in the above-mentioned embodiment, the light reflected by the
圖5(B)係示意性表示檢查裝置36b之構成例的圖。圖5(B)所表示之檢查裝置36b具備:光源40b、凹面鏡48b、保持台38b、凹面鏡48c、攝像單元44、個人電腦50。FIG. 5(B) is a diagram schematically showing a configuration example of the
該檢查裝置36b當中,從光源40b發出的光照射在凹面鏡48b。該凹面鏡48b將平行光朝保持台38b所保持之工件1反射。工件1受到該平行光照射時,會將該平行光朝凹面鏡48c反射,該凹面鏡48c,讓照射在該凹面鏡48c之該平行光朝向攝像單元44反射並聚光。攝像單元44,檢測該凹面鏡48c所反射出的光。In the
攝像單元44將攝像所得之攝像圖像送往個人電腦50。該個人電腦50,具有作為判定單元之功能,根據該攝像圖像來掌握該工件之該凹凸狀態,進而判定工件之好壞與否。在此,該攝像圖像,並非是將工件1所反射的光照射在螢幕所形成之投影影像予以攝像之圖像,而是該光由凹面鏡48c所反射而聚光在攝像單元44之光被直接補捉到的圖像。The
使工件1所反射的光聚光在攝像單元44,所以抵達攝像圖像之光量變多,所得之攝像圖像較為清晰。於是,可更正確地對工件1的被加工面之凹凸狀態進行評價,可讓作為判定單元發揮功能之個人電腦50實施更細微的判定。The light reflected by the
還有,使光對著工件1的背面1b垂直入射,所反射的光則用對著工件1的背面1b正面配置之攝像單元44予以補捉,藉此可得到無變形的攝像圖像。就這種可得到無變形的攝像圖像之檢查裝置36c,利用圖6加以說明。圖6係示意性表示檢查裝置36c之構成例的圖。In addition, the light is incident perpendicularly to the
檢查裝置36c具備:光源40c、分光鏡52、攝像單元44。從光源40c發射出的光,藉由光源40c與分光鏡52之間的鏡片56a變成平行光。該平行光,若入射在保持台38c所保持之工件1正面所配設之該分光鏡52,則其一部分會朝向工件1反射。The
於是,如圖6所表示,光對著工件1的背面1b從正面入射。此時,工件1的背面1b之全面不受該光照射亦可,例如照射在背面1b包含中央之直徑50mm之範圍。工件1將入射在背面1b之該光往該正面方向反射。工件1所反射之該光,入射在分光鏡52,其一部分會透射。Then, as shown in FIG. 6, the light is incident from the front to the back 1b of the
接著,透射過分光鏡52之光,由該分光鏡52與攝像單元44之間所配設之鏡片56b聚光在攝像單元44。聚光入射在攝像單元44的光,由攝像單元44所具備之鏡片56c予以最後地聚光,而抵達受光元件54。攝像單元44,對抵達受光元件54之光進行攝像而形成攝像圖像。Then, the light transmitted through the
若利用檢查裝置36c,則可使由攝像單元44所形成之攝像圖像的變形極小化,所以可更加正確地評價工件1的背面1b之凹凸狀態。If the
再者,亦可為:該攝像圖像中寫入有包含該被加工面中心之該被加工面的中央區域,該攝像圖像中未寫入有圍繞該中央區域之該被加工面的外周區域。由研削加工等在工件的被加工面形成之加工痕跡較容易通過包含該被加工面中心之該被加工面的中央區域,所以有可掌握該中央區域上所形成凹凸的狀態來判定工件之好壞與否的情況。例如,該中央區域為直徑50mm之圓形區域。Furthermore, it may also be: the captured image is written with the central area of the processed surface including the center of the processed surface, and the captured image is not written with the outer periphery of the processed surface surrounding the central area area. Machining traces formed on the work surface of the workpiece by grinding processing can easily pass through the center area of the work surface including the center of the work surface, so the state of the unevenness formed on the center area can be grasped to determine the quality of the work. Bad or not. For example, the central area is a circular area with a diameter of 50 mm.
除此之外,上述實施形態有關之構造、方法等,在不脫離本發明的目的之範圍當中,可做適度變更予以實施之。In addition, the structure, method, etc. related to the above-mentioned embodiment can be implemented with appropriate changes without departing from the scope of the object of the present invention.
1‧‧‧工件1a‧‧‧表面1b‧‧‧背面3‧‧‧分割預定線5‧‧‧元件7‧‧‧保護膠帶2‧‧‧研削裝置4‧‧‧基台6‧‧‧旋轉台8‧‧‧卡盤台8a‧‧‧保持面10、10a‧‧‧研削單元10b‧‧‧研磨單元12、12a‧‧‧支柱14、14a‧‧‧主軸馬達16、16a‧‧‧研削輪16b‧‧‧研磨輪18、18a‧‧‧研削磨石18b‧‧‧研磨墊20、20a‧‧‧加工進給單元22、22a‧‧‧卡匣載置台24、24a‧‧‧卡匣26‧‧‧工件搬送機械臂28‧‧‧定位台30‧‧‧工件搬入機構(裝載臂)32‧‧‧工件搬出機構(卸載臂)34‧‧‧旋轉清洗裝置36、36a、36b、36c‧‧‧檢查裝置38、38a、38b、38c‧‧‧保持台40、40a、40b、40c‧‧‧光源42、42a‧‧‧螢幕44‧‧‧攝像單元46‧‧‧光48a、48b、48c‧‧‧凹面鏡50‧‧‧個人電腦52‧‧‧分光鏡54‧‧‧受光元件56a、56b、56c‧‧‧鏡片1‧‧‧Workpiece 1a‧‧‧Surface 1b‧‧‧Back 3‧‧‧Preparation line 5‧‧‧Component 7‧‧‧Protective tape 2‧‧‧Grinding device 4‧‧‧Base 6‧‧‧Rotation Table 8‧‧‧Chuck table 8a‧‧‧Retaining surface 10, 10a‧‧‧ Grinding unit 10b‧‧‧ Grinding unit 12, 12a‧‧ Pillar 14, 14a‧‧‧ Spindle motor 16, 16a‧‧‧ Grinding Wheel 16b‧‧‧Grinding wheel 18,18a‧‧‧grinding stone 18b‧‧‧grinding pad 20,20a‧‧‧processing feed unit 22,22a‧‧‧cartridge placing table 24,24a‧‧‧cartridge 26‧‧‧Workpiece transfer robot 28‧‧‧Positioning table 30‧‧‧Workpiece carrying mechanism (loading arm) 32‧‧‧Workpiece carrying mechanism (unloading arm) 34‧‧‧Rotary cleaning device 36, 36a, 36b, 36c ‧‧‧Inspection device 38, 38a, 38b, 38c‧‧‧Holding table 40, 40a, 40b, 40c‧‧‧Light source 42, 42a‧‧‧Screen 44‧‧‧Camera unit 46‧‧‧Light 48a,48b, 48c‧‧‧Concave mirror 50‧‧‧PC 52‧‧‧Splitter 54‧‧‧Receiving element 56a, 56b, 56c‧‧‧Lens
圖1(A)係示意性表示工件的立體圖,圖1(B)係示意性表示黏貼有保護膠帶之工件的立體圖。 圖2係示意性表示包含檢查裝置之加工裝置的立體圖。 圖3(A) 係示意性表示研削加工的側視圖,圖3(B)係示意性表示研磨加工的側視圖。 圖4係示意性表示檢查裝置之構成例的圖。 圖5(A)及圖5(B)係示意性表示檢查裝置之構成例的圖。 圖6係示意性表示檢查裝置之構成例的圖。Fig. 1(A) is a perspective view schematically showing a workpiece, and Fig. 1(B) is a perspective view schematically showing a workpiece to which a protective tape is pasted. Fig. 2 is a perspective view schematically showing a processing device including an inspection device. Fig. 3(A) is a side view schematically showing the grinding process, and Fig. 3(B) is a side view schematically showing the grinding process. Fig. 4 is a diagram schematically showing a configuration example of the inspection device. 5(A) and 5(B) are diagrams schematically showing examples of the structure of the inspection device. Fig. 6 is a diagram schematically showing a configuration example of the inspection device.
2‧‧‧研削裝置 2‧‧‧ Grinding device
4‧‧‧基台 4‧‧‧Abutment
6‧‧‧旋轉台 6‧‧‧Rotating table
8‧‧‧卡盤台 8‧‧‧Chuck table
8a‧‧‧保持面 8a‧‧‧Keep the surface
10、10a‧‧‧研削單元 10, 10a‧‧‧grinding unit
12、12a‧‧‧支柱 12, 12a‧‧‧pillar
14、14a‧‧‧主軸馬達 14, 14a‧‧‧Spindle motor
16、16a‧‧‧研削輪 16, 16a‧‧‧grinding wheel
18、18a‧‧‧研削磨石 18, 18a‧‧‧grinding stone
20、20a‧‧‧加工進給單元 20, 20a‧‧‧Processing feed unit
22、22a‧‧‧卡匣載置台 22, 22a‧‧‧Cassette table
24、24a‧‧‧卡匣 24, 24a‧‧‧Cassette
26‧‧‧工件搬送機械臂 26‧‧‧Workpiece transport robot arm
28‧‧‧定位台 28‧‧‧Positioning table
30‧‧‧工件搬入機構(裝載臂) 30‧‧‧Workpiece loading mechanism (loading arm)
32‧‧‧工件搬出機構(卸載臂) 32‧‧‧Workpiece removal mechanism (unloading arm)
34‧‧‧旋轉清洗裝置 34‧‧‧Rotary cleaning device
36‧‧‧檢查裝置 36‧‧‧Checking device
38‧‧‧保持台 38‧‧‧Holding Taiwan
40‧‧‧光源 40‧‧‧Light source
42‧‧‧螢幕 42‧‧‧Screen
44‧‧‧攝像單元 44‧‧‧Camera unit
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200618944A (en) * | 2004-12-02 | 2006-06-16 | Taiwan Semiconductor Mfg Co Ltd | Methods of predicting CMP removal rate and transferring CMP processes |
JP2008155292A (en) * | 2006-12-21 | 2008-07-10 | Disco Abrasive Syst Ltd | Method and apparatus for machining substrate |
JP2016156822A (en) * | 2015-02-25 | 2016-09-01 | 株式会社昭和電気研究所 | Wafer defect inspection device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06105741B2 (en) * | 1989-11-24 | 1994-12-21 | 株式会社東芝 | Inner lead bonding inspection method |
JPH05288687A (en) * | 1992-04-09 | 1993-11-02 | Fujitsu Ltd | Lead inspection apparatus |
FI111757B (en) * | 1999-05-10 | 2003-09-15 | Metso Automation Oy | Method and Measurement Arrangement to Measure Paper Surface |
NL1018943C2 (en) * | 2001-09-13 | 2003-03-14 | Tno | Method and device for polishing a workpiece surface. |
JP2006208347A (en) * | 2004-02-25 | 2006-08-10 | Jfe Steel Kk | Surface defect detector, grinding device, surface defect detection method and surface defect detection program for reduction roll, and reduction roll grinding method |
JP2006226804A (en) * | 2005-02-17 | 2006-08-31 | Matsushita Electric Ind Co Ltd | Inspection method of flat display panel |
JP4635939B2 (en) * | 2006-03-30 | 2011-02-23 | 株式会社ニコン | Surface inspection device |
JP5274919B2 (en) | 2008-07-09 | 2013-08-28 | 株式会社ディスコ | Grinding device and scratch detection device |
CN101762250A (en) * | 2010-01-28 | 2010-06-30 | 上海交通大学 | Grinding workpiece surface quality optical real-time detection device |
CN101805903B (en) * | 2010-04-12 | 2012-07-25 | 太原理工大学 | Method for cladding copper alloy layer on surface of steel substrate by laser brazing |
KR20150143151A (en) * | 2014-06-13 | 2015-12-23 | 삼성전자주식회사 | Method for polishing substrate |
JP6377459B2 (en) | 2014-08-29 | 2018-08-22 | 株式会社ディスコ | Wafer inspection method, grinding and polishing equipment |
CN107003251B (en) * | 2014-11-18 | 2020-08-28 | 三菱化学株式会社 | Method for repairing metal plate and method for manufacturing casting mold |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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