TWI738816B - Cutting method of workpiece - Google Patents

Cutting method of workpiece Download PDF

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TWI738816B
TWI738816B TW106122724A TW106122724A TWI738816B TW I738816 B TWI738816 B TW I738816B TW 106122724 A TW106122724 A TW 106122724A TW 106122724 A TW106122724 A TW 106122724A TW I738816 B TWI738816 B TW I738816B
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workpiece
cutting
height
thickness
information
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TW201812881A (en
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小松淳
高木敦史
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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  • Machine Tool Sensing Apparatuses (AREA)
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Abstract

提供可以在短時間高精度控制切削刀對被加工物之切入深度的被加工物之切削方法。 Provides a method for cutting workpieces that can control the cutting depth of the cutting tool to the workpiece with high precision in a short time.

一種被加工物之切削方法，包含：保持面資訊記憶步驟，其係以移動單元使安裝用以測量高度之高度測量器之切削單元，和挾盤台做相對性移動，在複數之座標(X,Y)測量挾盤台之保持面之高度(Z)，記憶各個座標(X,Y)和高度(Z)之關係作為保持面資訊；厚度資訊記憶步驟，其係測量被加工物之厚度，作為厚度資訊而予以記憶；保持步驟，其係以挾盤台保持記憶厚度資訊之被加工物；算出步驟，其係從保持面資訊和厚度資訊，在任意之座標(X,Y)算出在挾盤台所保持的該被加工物之上面之高度；及切削步驟，其係根據在算出步驟所算出之被加工物之高度，使切削刀切入在挾盤台所保持的被加工物，形成期望之深度的溝部。 A method for cutting a workpiece, including: maintaining surface information memory step, which uses a moving unit to move the cutting unit equipped with a height measuring device for height measurement, and the clamping table to move relative to the plural coordinates (X ,Y) Measure the height (Z) of the holding surface of the clamping plate, and memorize the relationship between each coordinate (X, Y) and height (Z) as the holding surface information; the thickness information memory step is to measure the thickness of the workpiece, It is memorized as the thickness information; the holding step is to hold the processed object with the memorized thickness information by the clamping table; the calculating step is to calculate the holding surface information and the thickness information at arbitrary coordinates (X, Y). The height of the upper surface of the workpiece held by the plate table; and the cutting step, which is based on the height of the workpiece calculated in the calculation step, so that the cutting knife cuts into the workpiece held on the plate holder to form the desired depth的沟部。 Department of the ditch.

Description

被加工物之切削方法 Cutting method of workpiece

本發明係關於切削板狀之被加工物之時所使用的被加工物之切削方法。 The present invention relates to a cutting method of a workpiece used when cutting a plate-shaped workpiece.

於將代表半導體晶圓之板狀被加工物分割成複數晶片之時，使用例如具備用以保持被加工物之挾盤台，和用以切削被加工物之環狀切削刀的切削裝置。一面使旋轉之切削刀對藉由挾盤台所保持之被加工物切入，一面使切削刀和挾盤台做相對性移動，依此沿著該移動之路徑，切削被加工物。 When dividing a plate-shaped workpiece representing a semiconductor wafer into a plurality of wafers, for example, a cutting device equipped with a clamping table for holding the workpiece and a ring cutter for cutting the workpiece is used. While making the rotating cutter cut into the workpiece held by the clamping table, while making the cutting knife and the clamping table move relative to each other, the workpiece is cut along the moving path accordingly.

在上述切削裝置中，通常將與被加工物相接之挾盤台之保持面之高度，設定為切削刀之高度的基準(零點)。依此，可以將切削刀之高度對準挾盤台上之被加工物，使切削刀切入至被加工物的期望之深度。 In the above-mentioned cutting device, the height of the holding surface of the nip table in contact with the workpiece is usually set as the reference (zero point) of the height of the cutting blade. According to this, the height of the cutting blade can be aligned with the workpiece on the clamping table, so that the cutting blade can cut to the desired depth of the workpiece.

但是，近年來，增加在被加工物設置被稱為Low-k膜等之介電率低的絕緣膜的機會。因該Low-k膜脆弱，故於切削被加工物之時，有在非預期的區域剝落之情形。於是，研究出事先僅除去重疊在切削預定線(切割道、分割預定線)的Low-k膜之方法等(例如，參照專利 文獻1)。 However, in recent years, there has been an increase in the opportunity to provide an insulating film with a low dielectric constant, such as a low-k film, on the workpiece. Because the Low-k film is fragile, it may peel off in unexpected areas when cutting the workpiece. Therefore, a method of removing only the Low-k film superimposed on the planned cutting line (cutting line, planned dividing line) in advance has been developed (for example, refer to the patent Literature 1).

在該方法中，使切削刀切入厚度為數μm左右的Low-k膜，從被加工物僅除去重疊在切削預定線之Low-k膜。另外，在上述挾盤台之保持面，也存在例如數μm以上之高度的偏差。在此情況，由於切削刀對被加工物之切入深度也產生同樣程度的偏差，故無法適當地實施上述方法。 In this method, a cutting blade cuts a Low-k film with a thickness of about several μm, and only the Low-k film overlapping the planned cutting line is removed from the workpiece. In addition, the holding surface of the above-mentioned disc clamping table also has a height deviation of, for example, several μm or more. In this case, since the cutting depth of the cutting blade to the workpiece also varies by the same degree, the above method cannot be implemented appropriately.

對此，提案有使切削刀切入被加工物之複數位置，以所形成之確認用的溝部(切痕、切口)之長度為基準，確認切削刀之切入深度的方法等(例如，參照專利文獻2)。若使用以該方法所確認出之切入深度，控制切削刀之高度時，即使在挾盤台之保持面具有高度之偏差之情況，亦可以僅切削且除去薄的Low-k膜。 In response to this, there have been proposed methods for confirming the cutting depth of the cutting blade based on the length of the grooves (notches, cuts) formed for confirmation by cutting the cutting blade into the plural positions of the workpiece (for example, refer to the patent document). 2). If the cutting depth confirmed by this method is used to control the height of the cutting blade, even if the holding surface of the nip table has a height deviation, only the thin Low-k film can be cut and removed.

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文件1]日本特開2015-18965號公報 [Patent Document 1] Japanese Patent Application Publication No. 2015-18965

[專利文獻2]日本特開2015-142022號公報 [Patent Document 2] JP 2015-142022 A

但是，在上述方法中，因在被加工物形成複數溝部之後，必須測量其長度，故有至切削完成所需的時間大幅度增長。 However, in the above method, since the length of the workpiece must be measured after the plurality of grooves are formed on the workpiece, the time required to complete the cutting is greatly increased.

本發明係鑑於如此之問題點而創作出，其目的在於提供可以在短時間高精度地控制切削刀對被加工物之切入深度的被加工物之切削方法。 The present invention was created in view of such problems, and its object is to provide a method for cutting a workpiece that can control the cutting depth of the cutting tool to the workpiece with high accuracy in a short time.

若藉由本發明之一態樣時，提供一種被加工物之切削方法，其係使用切削裝置的被加工物之切削方法，該切削裝置具備：挾盤台，其係在保持面保持板狀之被加工物；切削單元，其係以切削刀加工被保持於該挾盤台之該被加工物；移動單元，其係使該挾盤台和該切削單元在相對於該保持面平行的X軸方向及Y軸方向做相對性移動，該被加工物之切削方法具備：保持面資訊記憶步驟，其係以該移動單元使安裝用以測量高度之高度測量器之該切削單元，和該挾盤台做相對性移動，在複數之座標(X,Y)測量該挾盤台之該保持面之高度(Z)，記憶各個座標(X,Y)和高度(Z)之關係作為保持面資訊；厚度資訊記憶步驟，其係測量該被加工物之厚度，作為厚度資訊而予以記憶；保持步驟，其係在該挾盤台保持記憶該厚度資訊之該被加工物；算出步驟，其係從該保持面資訊和該厚度資訊，在任意之座標(X,Y)算出在該挾盤台所保持的該被加工物之上面之高度；及切削步驟，其係根據在該算出步驟算出之該被加工物之高度，使該切削刀切入在該挾盤台所保持的該被加工物，形成期望之深度的溝部。 According to one aspect of the present invention, there is provided a method for cutting a workpiece, which is a method for cutting a workpiece using a cutting device, the cutting device includes: a clamping table that maintains a plate-like shape on a holding surface The workpiece; the cutting unit, which uses a cutting tool to process the workpiece held on the clamping table; the moving unit, which makes the clamping table and the cutting unit on the X axis parallel to the holding surface The direction and the Y-axis direction are moved relative to each other. The cutting method of the workpiece includes: a step of maintaining surface information memory, which uses the moving unit to install the cutting unit of the height measuring device for height measurement, and the clamping plate The table moves relatively, and measures the height (Z) of the holding surface of the clamping table at the plural coordinates (X, Y), and memorizes the relationship between each coordinate (X, Y) and height (Z) as the holding surface information; The thickness information memory step is to measure the thickness of the processed object and memorize it as thickness information; the holding step is to hold the processed object with the thickness information stored on the clamping table; the calculation step is from the The holding surface information and the thickness information are used to calculate the height above the workpiece held by the clamping table at arbitrary coordinates (X, Y); and the cutting step is based on the calculated step in the calculation step The height of the object is such that the cutting knife cuts into the workpiece held by the chucking table to form a groove of a desired depth.

在本發明之一態樣中，進一步具備位置資訊記憶步驟，其係於該算出步驟之前，為了攝像該被加工物，使用被安裝於該切削單元之攝像單元或該高度測量器，檢測出在該挾盤台所保持的該被加工物之外周緣的座標，和被形成該外周緣或該被加工物之上面的標記，記憶從該外周緣之座標被算出的該被加工物之中心的座標，和連結該中心和該標記之直線相對於基準線所構成的角度，作為該被加工物相對於該挾盤台的位置資訊，在該厚度資訊記憶步驟中，在複數座標(x,y)測量該被加工物之厚度(t)，記憶各個座標(x,y)和厚度(t)之關係作為該厚度資訊，在該算出步驟中，從該位置資訊和該保持面資訊和該厚度資訊，在任意之座標(x,y)算出該被加工物之該上面之高度為佳。 In one aspect of the present invention, there is further provided a position information memorizing step, which is prior to the calculating step, in order to image the workpiece, using the imaging unit or the height measuring device installed in the cutting unit to detect The coordinates of the outer periphery of the workpiece held by the clamping table, and the mark formed on the outer periphery or the upper surface of the workpiece, memorize the coordinates of the center of the workpiece calculated from the coordinates of the outer periphery , And the angle formed by the straight line connecting the center and the mark with respect to the reference line, as the position information of the workpiece relative to the clamping table, in the thickness information memory step, in the plural coordinates (x, y) Measure the thickness (t) of the workpiece, and memorize the relationship between each coordinate (x, y) and thickness (t) as the thickness information. In the calculation step, from the position information, the holding surface information, and the thickness information , It is better to calculate the height of the upper surface of the workpiece at any coordinate (x, y).

再者，在本發明之一態樣中，該被加工物具有包含被疊層在一方之面側的機能層的裝置，在該切削步驟中，沿著區劃該裝置之複數切割道以該切削刀形成該溝部為佳。 Furthermore, in one aspect of the present invention, the workpiece has a device including a functional layer laminated on one surface side. It is better to form the groove with a knife.

在本發明之一態樣有關之被加工物之切削方法中，因從在複數座標(X,Y)測量挾盤台之保持面之高度(Z)而所取得之保持面資訊，和測量被加工物之厚度而所取得之厚度資訊，在任意之座標(X,Y)算出以在盤台所保持之被加工物之上面的高度，故可以高精度地控制 切削刀對被加工物的切入深度。 In the method of cutting the workpiece related to one aspect of the present invention, the holding surface information obtained from measuring the height (Z) of the holding surface of the clamping table at plural coordinates (X, Y), and the measurement of the holding surface The thickness information obtained from the thickness of the processed object is calculated at arbitrary coordinates (X, Y) as the height above the processed object held by the table, so it can be controlled with high precision The cutting depth of the cutting tool to the workpiece.

再者，在與本發明之一態樣有關之被加工物之切削方法中，因不需要在被加工物形成確認用之溝部，故比起形成確認用之溝部的以往之方法，可以縮短至切削完成所需的時間。如此一來，若藉由與本發明之一態樣有關之被加工物之切削方法時，可以在短時間高精度地控制切削刀對被加工物的切入深度。 Furthermore, in the method for cutting a workpiece related to one aspect of the present invention, since it is not necessary to form a confirmation groove on the workpiece, it can be shortened to The time required to complete the cutting. In this way, if the cutting method of the workpiece related to one aspect of the present invention is used, the cutting depth of the cutting tool into the workpiece can be controlled with high precision in a short time.

11:被加工物 11: processed objects

11a:表面(一方之面、上面) 11a: Surface (on one side, above)

11b:背面(另一方之面、下面) 11b: back side (the other side, bottom side)

11c:凹槽 11c: groove

13:切削預定線(切割道、分割預定線) 13: Cutting plan line (cutting path, dividing plan line)

15:裝置 15: device

21:保護構件 21: Protective member

21a:表面 21a: surface

21b:背面 21b: back

31、33:測量線 31, 33: measuring line

35:視野 35: Vision

37:區域(座標) 37: Area (coordinates)

2:切削裝置 2: Cutting device

4:基台 4: Abutment

4a、4b、4c:開口 4a, 4b, 4c: opening

6:卡匣支撐台 6: Cassette support table

8:卡匣 8: Cassette

10:X軸移動台 10: X axis moving stage

12:防塵防滴蓋 12: Dust-proof and drip-proof cover

14:挾盤台 14: Pinch table

16:保持面 16: keep the face

18:切削單元 18: Cutting unit

20:支撐構造 20: Support structure

22:切削單元移動機構 22: Cutting unit moving mechanism

24:Y軸導軌 24: Y axis guide

26:Y軸移動板 26: Y-axis moving plate

28:Y軸滾珠螺桿 28: Y-axis ball screw

30:Y軸脈衝馬達 30: Y-axis pulse motor

32:Z軸導軌 32: Z axis guide

34:Z軸移動板 34: Z-axis moving plate

36:Z軸滾珠螺桿 36: Z axis ball screw

38:Z軸脈衝馬達 38: Z-axis pulse motor

40:主軸 40: Spindle

42:切削刀 42: Cutter

44:複合測量單元(高度測量器、攝像單元) 44: Composite measuring unit (height measuring device, camera unit)

46:洗淨單元 46: Washing unit

48:控制單元 48: control unit

48a:記憶部 48a: Memory Department

52:厚度測量裝置 52: Thickness measuring device

54:保持台 54: hold the stage

56:保持面 56: Keep the face

58:測量器 58: Measurer

圖1(A)為示意性地表示被加工物之構成例的斜視圖，圖1(B)為示意性地表示在被加工物黏貼保護構件之樣子的斜視圖。 Fig. 1(A) is a perspective view schematically showing a configuration example of a workpiece, and Fig. 1(B) is a perspective view schematically showing a state in which a protective member is attached to the workpiece.

圖2為示意性表示切削裝置之構成例的圖示。 Fig. 2 is a diagram schematically showing a configuration example of a cutting device.

圖3(A)為用以說明保持面資訊記憶步驟的側面圖，圖3(B)為示意性地表示測量線之設定例的俯視圖。 FIG. 3(A) is a side view for explaining the step of storing the information on the holding surface, and FIG. 3(B) is a plan view schematically showing an example of the setting of the measurement line.

圖4(A)為用以說明厚度資訊記憶步驟的側面圖，圖4(B)為示意性地表示測量線之設定例的俯視圖。 FIG. 4(A) is a side view for explaining the thickness information memory step, and FIG. 4(B) is a plan view schematically showing a setting example of the measurement line.

圖5(A)為用以說明保持步驟的側面圖，圖5(B)為用以說明位置資訊記憶步驟的俯視圖。 FIG. 5(A) is a side view for explaining the holding step, and FIG. 5(B) is a top view for explaining the position information storing step.

圖6(A)為視覺性地表示保持面資訊所示的保持面之高度(Z)的圖示，圖6(B)為視覺性地表示厚度資訊所示的被加工物之厚度(t)的圖示，圖6(C)為視覺性地表示被加工物之表面(上面)之高度的圖示。 Fig. 6(A) is a diagram visually showing the height (Z) of the holding surface indicated by the holding surface information, and Fig. 6(B) is a diagram visually showing the thickness (t) of the workpiece indicated by the thickness information Figure 6(C) is a visual representation of the height of the surface (top) of the workpiece.

圖7為示意性地表示切削步驟之俯視圖。 Fig. 7 is a plan view schematically showing a cutting step.

參照附件圖面，針對與本發明之一態樣有關的實施型態進行說明。與本實施型態有關之被加工物之切削方法包含保持面資訊記憶步驟(參照圖3(A)及圖3(B))、厚度資訊記憶步驟(參照圖4(A)及圖4(B))、保持步驟(參照圖5(A))、位置資訊記憶步驟(參照圖5(B))、算出步驟(參照圖6(A)、圖6(B)及圖6(C))及切削步驟(參照圖7)。 With reference to the attached drawings, the implementation type related to one aspect of the present invention will be described. The cutting method of the workpiece related to this embodiment includes the step of holding surface information memory (refer to Figure 3 (A) and Figure 3 (B)), the thickness information memory step (refer to Figure 4 (A) and Figure 4 (B) )), holding step (refer to Figure 5(A)), location information memory step (refer to Figure 5(B)), calculation step (refer to Figure 6(A), Figure 6(B) and Figure 6(C)) and Cutting step (refer to Figure 7).

在保持面資訊記憶步驟中，在複數座標(X,Y)測量被設置在切削裝置之挾盤台之保持面之高度(Z)，記憶各個座標(X,Y)和高度(Z)之關係作為保持面資訊。在該厚度資訊記憶步驟中，在複數座標(x,y)測量該被加工物之厚度(t)，記憶各個座標(x,y)和厚度(t)之關係作為厚度資訊。 In the step of memorizing the information of the holding surface, measure the height (Z) of the holding surface of the clamping plate set on the cutting device at plural coordinates (X, Y), and memorize the relationship between each coordinate (X, Y) and height (Z) As a keep-to-face information. In the thickness information memory step, the thickness (t) of the workpiece is measured at plural coordinates (x, y), and the relationship between each coordinate (x, y) and thickness (t) is memorized as the thickness information.

在保持步驟中，係在挾盤台保持被記憶厚度資訊的被加工物。在位置資訊記憶步驟中，檢測出在挾盤台所保持的被加工物之外周緣的座標，和被形成在外周緣的凹槽等之標記(或是被形成在被加工物之上面的標記)，記憶位置資訊。在算出步驟中，從位置資訊和保持面資訊和厚度資訊，在任意之座標(X,Y)算出被加工物之上面之高度。 In the holding step, the workpiece with the memorized thickness information is held on the clamping table. In the position information memory step, the coordinates of the outer periphery of the workpiece held by the clamping table and the marks formed on the outer periphery of the groove (or the marks formed on the workpiece) are detected. Memorize location information. In the calculation step, from the position information, the holding surface information and the thickness information, the height of the upper surface of the workpiece is calculated at any coordinate (X, Y).

在切削步驟中，根據在算出步驟算出的被加 工物之上面之高度，使切削刀切入，在被加工物形成期望之深度的溝部。以下，針對與本實施型態有關之被加工物之切削方法予以詳述。 In the cutting step, according to the calculated The height of the upper surface of the workpiece allows the cutting knife to cut in and form a groove of the desired depth in the workpiece. Hereinafter, the cutting method of the workpiece related to this embodiment will be described in detail.

圖1(A)為示意性地表示在本實施型態被切削之被加工物之構成例的斜視圖，圖1(B)為示意性地表示在被加工物黏貼保護構件之樣子的斜視圖。如圖1(A)所示般，本實施型態之被加工物11為例如使用矽等之半導體材料所形成的圓盤狀之晶圓，在其表面(一方之面、上面)11a側，設置成為配線之金屬膜，或絕緣配線間之絕緣膜(包含Low-k膜)等之機能層(無圖示)。 Fig. 1(A) is a perspective view schematically showing a configuration example of the workpiece to be cut in this embodiment, and Fig. 1(B) is a perspective view schematically showing the state of attaching a protective member to the workpiece . As shown in FIG. 1(A), the workpiece 11 of this embodiment is a disc-shaped wafer formed of a semiconductor material such as silicon, and on the surface (one side, upper surface) 11a side, A functional layer (not shown) such as a metal film for wiring or an insulating film (including Low-k film) between the wirings is provided.

設置該機能層之被加工物11之表面11a側以被配列成格子狀之切削預定線(切割道、分割預定線)13被區劃成複數區域，在各區域，形成IC、LSI等之裝置15。各裝置15包含上述機能層作為構成要素。即是，機能層成為裝置15之一部分。再者，在被加工物11之外周緣，設置有判定被加工物11之方向(例如，結晶方位)之時之標記的凹槽11c(或定向平面)。 The surface 11a side of the workpiece 11 on which the functional layer is provided is divided into a plurality of areas with planned cutting lines (cutting paths, planned dividing lines) 13 arranged in a grid shape, and in each area, a device 15 for IC, LSI, etc. is formed . Each device 15 includes the above-mentioned functional layer as a constituent element. That is, the functional layer becomes part of the device 15. Furthermore, on the outer periphery of the workpiece 11, there is provided a groove 11c (or orientation plane) that is a mark for determining the direction of the workpiece 11 (for example, the crystal orientation).

另外，在本實施型態中，雖然將以矽等之半導體材料所構成之圓盤狀之晶圓設為被加工物11，但是被加工物11之材質、形狀、構造等不受限制。例如，亦可以使用以陶瓷、金屬、樹脂等之材料所構成之基板作為被加工物11。同樣地，裝置15之種類、數量、配置等也不受限制。 In addition, in this embodiment, although a disk-shaped wafer made of a semiconductor material such as silicon is used as the workpiece 11, the material, shape, structure, etc. of the workpiece 11 are not limited. For example, a substrate made of materials such as ceramics, metals, and resins may also be used as the workpiece 11. Similarly, the type, number, configuration, etc. of the device 15 are also not limited.

再者，亦可以與上述凹槽11c等一起，或取代 凹槽11c等，利用被形成在被加工物11之表面11a側的裝置15之圖案等，作為判定被加工物11之方向之時的標記。在此情況，不一定在被加工物11之外周緣設置凹槽11c等亦可。 Furthermore, it can also be combined with the above-mentioned groove 11c, etc., or instead of The grooves 11c and the like use the pattern of the device 15 formed on the surface 11a side of the workpiece 11 as a mark when determining the direction of the workpiece 11. In this case, it is not necessary to provide the groove 11c or the like on the outer periphery of the workpiece 11.

在被加工物11之背面(另一方之面、下面)11b側，如圖1(B)所示般，黏貼保護構件21。保護構件21係持有與被加工物11同等之直徑的圓形之薄膜(膠帶)，在其表面21a側設置具有黏著力之糊層。於在被加工物11黏貼保護構件21之時，使該表面21a側密接於被加工物11之背面11b側。 On the back surface (the other surface, the lower surface) 11b side of the workpiece 11, as shown in FIG. 1(B), a protective member 21 is attached. The protective member 21 has a circular film (tape) with the same diameter as the workpiece 11, and a paste layer with adhesive force is provided on the surface 21a side. When the protective member 21 is adhered to the workpiece 11, the surface 21a side is brought into close contact with the back surface 11b side of the workpiece 11.

另外，在本實施型態中，雖然在被加工物11之背面11b側，黏貼保護構件21，使表面11a側露出，但是即使在從背面11b切削被加工物11之情況等，在表面11a側黏貼保護構件21，使背面11b側露出亦可。即是，在此情況，被加工物11之背面11b成為上面，表面11a成為下面。再者，若被加工物11之破損等不成為問題時，即使不一定在被加工物11之背面11b(或是表面11a)黏貼保護構件21亦可。 In addition, in this embodiment, although the protective member 21 is attached to the back surface 11b side of the workpiece 11 to expose the surface 11a side, even when the workpiece 11 is cut from the back surface 11b, it is on the surface 11a side. The protective member 21 may be pasted so that the back surface 11b side may be exposed. That is, in this case, the back surface 11b of the workpiece 11 becomes the upper surface, and the surface 11a becomes the lower surface. Furthermore, if the damage etc. of the workpiece 11 is not a problem, the protective member 21 may not necessarily be pasted on the back surface 11b (or the surface 11a) of the workpiece 11.

再者，如上述般，可以藉由從背面11b側切削被加工物11，一面使表面11a側之機能層殘存，一面在被加工物11之背面11b側形成溝部。依此，與本發明有關之被加工物之切削方法，在欲一面使機能層確實地殘存一面除去被加工物11之其他部分之情況等也有效。 Furthermore, as described above, by cutting the workpiece 11 from the back surface 11b side, while leaving the functional layer on the front surface 11a side, it is possible to form a groove on the back surface 11b side of the workpiece 11. According to this, the cutting method of the workpiece according to the present invention is also effective when removing other parts of the workpiece 11 while the functional layer is to be surely left.

圖2為示意性地表示在本實施型態中所使用之 切削裝置2之構成例的圖示。如圖2所示般，切削裝置2具備支撐各構造的基台4。在基台4之前方之角部，形成矩形之開口4a，在該開口4a內，設置升降的卡匣支撐台6。在卡匣支撐台6之上面，被裝載可以收容複數被加工物11的卡匣8。另外，在圖1中，為了便於說明，僅表示卡匣8之輪廓。 Figure 2 is a schematic representation of the An illustration of a configuration example of the cutting device 2. As shown in FIG. 2, the cutting device 2 includes a base 4 that supports each structure. A rectangular opening 4a is formed at the front corner of the base 4, and a cassette support table 6 that is raised and lowered is provided in the opening 4a. On the upper surface of the cassette support table 6, cassettes 8 capable of accommodating plural workpieces 11 are loaded. In addition, in FIG. 1, for convenience of description, only the outline of the cassette 8 is shown.

在卡匣支撐台6之側方，形成X軸方向(前後方向、加工進給方向)長的矩形之開口4b。在該開口4b內，設置X軸移動台10、使X軸移動台10在X軸方向移動之X軸移動機構(移動單元)(無圖示)及覆蓋X軸移動機構的防塵防滴蓋12。 On the side of the cassette support table 6, a rectangular opening 4b long in the X-axis direction (front-rear direction, processing feed direction) is formed. In the opening 4b, an X-axis moving stage 10, an X-axis moving mechanism (moving unit) (not shown) that moves the X-axis moving stage 10 in the X-axis direction, and a dust-proof and drip-proof cover 12 covering the X-axis moving mechanism are installed. .

X軸移動機構具備與X軸方向平行之一對X軸導軌(無圖示)，在X軸導軌，X軸移動台10被安裝成能夠滑動。在X軸移動台10之下面側設置有螺帽部(無圖示)，該螺帽部被螺合於與X軸導軌平行之X軸滾珠螺桿(無圖示)。 The X-axis moving mechanism is provided with a pair of X-axis guide rails (not shown) parallel to the X-axis direction. On the X-axis guide rails, the X-axis movement table 10 is mounted so as to be slidable. A nut portion (not shown) is provided on the lower surface side of the X-axis moving table 10, and the nut portion is screwed to an X-axis ball screw (not shown) parallel to the X-axis guide rail.

在X軸滾珠螺桿之一端部連結有X軸脈衝馬達(無圖示)。藉由以X軸脈衝馬達使X軸滾珠螺桿旋轉，X軸移動台10沿著X軸導軌在X軸方向移動。 An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. By rotating the X-axis ball screw by the X-axis pulse motor, the X-axis moving table 10 moves in the X-axis direction along the X-axis guide rail.

在X軸移動台10之上方設置有用以保持被加工物11之挾盤台14。挾盤台14被連結於例如馬達等之旋轉驅動源(無圖示)，在與Z軸方向(垂直方向)大概平行的旋轉軸之周圍旋轉。再者，挾盤台14係以上述X軸移動機構與X軸移動台10一起朝X軸方向被加工進給。 A clamping table 14 for holding the workpiece 11 is provided above the X-axis moving table 10. The nip table 14 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis approximately parallel to the Z-axis direction (vertical direction). Furthermore, the nip table 14 is processed and fed in the X-axis direction by the X-axis moving mechanism described above together with the X-axis moving table 10.

挾盤台14之上面成為吸引、保持被加工物11之保持面16。該保持面16係透過被形成在挾盤台14之內部的吸引路等而被連接於吸引源(無圖示)。 The upper surface of the nip table 14 serves as a holding surface 16 for sucking and holding the workpiece 11. The holding surface 16 is connected to a suction source (not shown) through a suction path or the like formed inside the nip table 14.

在接近於開口4b之位置，設置有將上述被加工物11搬運至挾盤台14之搬運單元(無圖示)。以搬運單元被搬運的被加工物11係以例如表面11a側露出於上方之方式，被載置於挾盤台14之保持面16。 At a position close to the opening 4b, a conveying unit (not shown) for conveying the above-mentioned workpiece 11 to the pinching table 14 is provided. The workpiece 11 conveyed by the conveying unit is placed on the holding surface 16 of the nip table 14 such that the surface 11a side is exposed upward, for example.

在基台4之上面，以跨越開口4b之方式配置有用以支撐2組切削單元18之門型支撐構造20。在支撐構造20之前面上部，設置有使各切削單元18在Y軸方向(左右方向、分度進給方向)及Z軸方向移動之2組切削單元移動機構(移動單元)22。 On the upper surface of the base 4, a gate-shaped support structure 20 for supporting two sets of cutting units 18 is arranged so as to span the opening 4b. On the upper part of the front surface of the support structure 20, two sets of cutting unit moving mechanisms (moving units) 22 that move each cutting unit 18 in the Y-axis direction (left-right direction, indexing feed direction) and Z-axis direction are provided.

各切削單元移動機構22共同具備被配置在支撐構造20之前面且與Y軸方向平行的一對Y軸導軌24。在Y軸導軌24，構成各切削單元移動機構22之Y軸移動板26分別被安裝成能夠滑動。 Each cutting unit moving mechanism 22 is provided with a pair of Y-axis guide rails 24 that are arranged on the front surface of the support structure 20 and are parallel to the Y-axis direction. On the Y-axis guide rail 24, Y-axis moving plates 26 constituting each cutting unit moving mechanism 22 are respectively mounted so as to be slidable.

在各Y軸移動板26之背面側(後面側)設置有螺帽部(無圖示)，該螺帽部螺合與Y軸導軌24平行之Y軸滾珠螺桿28。在各Y軸滾珠螺桿28之一端部連結有Y軸脈衝馬達30。若以Y軸脈衝馬達30使Y軸滾珠螺桿28旋轉時，Y軸移動板26沿著Y軸導軌24而在Y軸方向移動。 A nut portion (not shown) is provided on the back side (rear side) of each Y-axis moving plate 26, and the Y-axis ball screw 28 parallel to the Y-axis guide rail 24 is screwed into the nut portion. A Y-axis pulse motor 30 is connected to one end of each Y-axis ball screw 28. When the Y-axis ball screw 28 is rotated by the Y-axis pulse motor 30, the Y-axis moving plate 26 moves along the Y-axis guide rail 24 in the Y-axis direction.

在各Y軸移動板26之表面(前面)設置有與Z軸方向平行之一對Z軸導軌32。在Z軸導軌32，Z軸移動板34被安裝成能夠滑動。 A pair of Z-axis guide rails 32 parallel to the Z-axis direction is provided on the surface (front) of each Y-axis moving plate 26. In the Z-axis guide 32, the Z-axis moving plate 34 is installed so as to be slidable.

在各Z軸移動板34之背面側(後面側)設置有螺帽部(無圖示)，該螺帽部螺合與Z軸導軌32平行之Z軸滾珠螺桿36。在各Z軸滾珠螺桿36之一端部連結有Z軸脈衝馬達38。若以Z軸脈衝馬達38使Z軸滾珠螺桿36旋轉時，Z軸移動板34沿著Z軸導軌32而在Z軸方向移動。 A nut portion (not shown) is provided on the back side (rear side) of each Z-axis moving plate 34, and the Z-axis ball screw 36 parallel to the Z-axis guide 32 is screwed into the nut portion. A Z-axis pulse motor 38 is connected to one end of each Z-axis ball screw 36. When the Z-axis ball screw 36 is rotated by the Z-axis pulse motor 38, the Z-axis moving plate 34 moves in the Z-axis direction along the Z-axis guide 32.

在各Z軸移動板34之下部設置切削單元18。該切削單元18具備被安裝於成為旋轉軸之主軸40(參照圖7)之一端側的圓環狀之切削刀42。再者，在切削單元18，安裝有用以測量挾盤台14之保持面16等之高度的高度測量器(高度測量單元)，和用以攝像被加工物11等之攝影機(攝像單元)成為一體的複合測量單元(高度測量器(高度測量單元)、攝影機(攝像單元))44。 A cutting unit 18 is provided below each Z-axis moving plate 34. The cutting unit 18 includes an annular cutting blade 42 attached to one end side of a main shaft 40 (refer to FIG. 7) serving as a rotating shaft. Furthermore, the cutting unit 18 is equipped with a height measuring device (height measuring unit) for measuring the height of the holding surface 16 of the clamping table 14 and the like, and a camera (imaging unit) for imaging the workpiece 11 and the like are integrated. The composite measuring unit (height measuring device (height measuring unit), camera (camera unit)) 44.

若以各切削單元移動機構22使Y軸移動板26在Y軸方向移動時，切削單元18及複合測量單元44一起在Y軸方向被分度進給。再者，若以各切削單元移動機構22使Z軸移動板34在Z軸方向移動時，切削單元18及複合測量單元44一起升降。 When each cutting unit moving mechanism 22 moves the Y-axis moving plate 26 in the Y-axis direction, the cutting unit 18 and the composite measuring unit 44 are indexed and fed in the Y-axis direction together. Furthermore, when the Z-axis moving plate 34 is moved in the Z-axis direction by each cutting unit moving mechanism 22, the cutting unit 18 and the composite measuring unit 44 are raised and lowered together.

相對於開口4b，在與開口4a相反側之位置，形成圓形之開口4c。在開口4c內設置用以洗淨切削後之被加工物11等之洗淨單元46。在X軸移動機構、挾盤台14、切削單元18、切削單元移動機構22、複合測量單元44、洗淨單元46等之構成要素，連接著控制單元48。各構成要素藉由該控制單元48被控制。 With respect to the opening 4b, a circular opening 4c is formed at a position opposite to the opening 4a. In the opening 4c, a washing unit 46 for washing the workpiece 11 and the like after cutting is provided. The control unit 48 is connected to the components such as the X-axis moving mechanism, the clamping table 14, the cutting unit 18, the cutting unit moving mechanism 22, the composite measuring unit 44, and the cleaning unit 46. Each component is controlled by the control unit 48.

在與本實施型態有關之被加工物之切削方法 中，首先，進行用以在複數座標(X,Y)測量挾盤台14之保持面16之高度(Z)，記憶各個座標(X,Y)和高度(Z)之關係作為保持面資訊的保持面資訊記憶步驟。圖3(A)為用以說明保持面資訊記憶步驟的側面圖。 The cutting method of the workpiece related to this embodiment In the first step, it is used to measure the height (Z) of the holding surface 16 of the clamping table 14 at plural coordinates (X, Y), and memorize the relationship between each coordinate (X, Y) and height (Z) as the holding surface information Keep face information memorizing steps. Fig. 3(A) is a side view for explaining the step of storing information on the holding surface.

如圖3(A)所示般，該保持面資訊記憶步驟係使用被安裝於切削單元18之複合測量單元44之高度測量器而進行。高度測量器係例如使用雷射光束L1而測量對象之位置(高度)的雷射位移計，可以以非接觸測量挾盤台14之保持面16之高度(Z)。 As shown in FIG. 3(A), the step of memorizing the holding surface information is performed using the height measuring device of the composite measuring unit 44 installed in the cutting unit 18. The height measuring device is, for example, a laser displacement meter that uses a laser beam L1 to measure the position (height) of an object, and can measure the height (Z) of the holding surface 16 of the clamping table 14 in a non-contact manner.

在保持面資訊記憶步驟中，首先，使挾盤台14和複合測量單元44做相對性移動，使複合測量單元44移動至事先設定之保持面16之測量線31(參照圖3(B))之上方。而且，如圖3(A)所示般，一面以複合測量單元44照射測量用之雷射光束L1，一面使挾盤台14和複合測量單元44沿著測量線31做相對性移動。 In the step of memorizing the holding surface information, first, the clamping table 14 and the composite measuring unit 44 are moved relative to each other, and the composite measuring unit 44 is moved to the measurement line 31 of the holding surface 16 set in advance (refer to FIG. 3(B)) Above. Furthermore, as shown in FIG. 3(A), while the laser beam L1 for measurement is irradiated with the composite measuring unit 44, the clamping table 14 and the composite measuring unit 44 are moved relatively along the measurement line 31.

依此，可以在測量線31上之複數座標(X,Y)測量挾盤台14之保持面16之高度(Z)。藉由複數測量單元44所測量出之高度(Z)和座標(X,Y)之關係，被記憶於控制單元48之記憶部48a作為保持面資訊。當沿著被設定之所有的測量線31測量保持面16之高度(Z)，所對應之保持面資訊被記憶於記憶部48a時，保持面資訊記憶步驟結束。 According to this, the height (Z) of the holding surface 16 of the clamping table 14 can be measured at the plural coordinates (X, Y) on the measuring line 31. The relationship between the height (Z) and the coordinates (X, Y) measured by the plural measuring unit 44 is stored in the memory portion 48a of the control unit 48 as the holding surface information. When the height (Z) of the holding surface 16 is measured along all the set measurement lines 31, and the corresponding holding surface information is stored in the memory portion 48a, the holding surface information storing step ends.

圖3(B)為示意性地表示測量線31之設定例的俯視圖。在圖3(B)之設定例中，在例如X座標為X1、 X2、X3之位置，分別設定與X軸方向垂直(與Y軸方向平行)之直線狀的測量線31。再者，在Y座標為Y1、Y2、Y3之位置，分別設定與Y軸方向垂直(與X軸方向平行)之直線狀之測量線31。 FIG. 3(B) is a plan view schematically showing a setting example of the measurement line 31. In the setting example of FIG. 3(B), for example, at positions where the X coordinates are X 1 , X 2 , and X 3 , linear measurement lines 31 perpendicular to the X axis direction (parallel to the Y axis direction) are respectively set. Furthermore, at the positions where the Y coordinates are Y 1 , Y 2 , and Y 3 , a linear measurement line 31 perpendicular to the Y axis direction (parallel to the X axis direction) is respectively set.

依此，例如，若X座標沿著X1之測量線31測量保持面16之高度(Z)時，可取得相對於測量線31上之複數座標(X1,Y)的高度(Z)資訊。另外，在本實施型態中，雖然在保持面16上設定合計6條的測量線31，但是被設定的測量線31之數量、配置等不受限制。可以因應所要求之切削的精度等，自由地設定測量線31。 So, for example, if the X coordinate holding surface 16 of the height (Z) measured along the 31 measuring 1 X line, may be made with respect to a plurality of coordinates (X 1, the Y) 31 on the measurement line height (Z) Information . In addition, in this embodiment, although a total of six measurement lines 31 are set on the holding surface 16, the number, arrangement, etc. of the set measurement lines 31 are not limited. The measurement line 31 can be freely set according to the required cutting accuracy, etc.

再者，在本實施型態中，雖然沿著事先設定的測量線31連續性地測量保持面16之高度(Z)，但是即使事先設定複數測量點，在該測量點測量保持面16之高度(Z)亦可。即使在此情況，因應所要求之切削的精度等，可以自由地設定測量點。 Furthermore, in this embodiment, although the height (Z) of the holding surface 16 is continuously measured along the measurement line 31 set in advance, even if a plurality of measurement points are set in advance, the height of the holding surface 16 is measured at the measurement point. (Z) is also possible. Even in this case, the measuring point can be set freely according to the required cutting accuracy, etc.

於保持面資訊記憶步驟之後，進行在複數座標(x,y)測量被加工物之厚度(t)，記憶各個座標(x,y)和厚度(t)之關係作為厚度資訊的厚度資訊記憶步驟。圖4(A)為用以說明厚度資訊記憶步驟的側面圖。 After the step of keeping the surface information memory, perform the thickness information memory step of measuring the thickness (t) of the workpiece at plural coordinates (x, y), and memorizing the relationship between each coordinate (x, y) and thickness (t) as the thickness information . FIG. 4(A) is a side view for explaining the thickness information memory step.

如圖4(A)所示般，該厚度資訊記憶步驟係利用被設置在切削裝置2之內部或外部之任意的厚度測量裝置52來進行。厚度測量裝置52具備用以保持被加工物11之保持台54。保持台54之上面成為用以保持被加工物11之保持面56。該保持面56以可以高精度地測量被加工物11之 厚度之方式被形成平坦。 As shown in FIG. 4(A), the thickness information memory step is performed by an arbitrary thickness measuring device 52 installed inside or outside the cutting device 2. The thickness measuring device 52 includes a holding table 54 for holding the workpiece 11. The upper surface of the holding table 54 serves as a holding surface 56 for holding the workpiece 11. The holding surface 56 can measure the workpiece 11 with high precision. The thickness is formed flat.

在保持台54之上方配置有測量器58。測量器58係例如使用雷射光束L2而測量對象之位置(高度)的雷射位移計，可以非接觸地測量被加工物11之表面11a對保持台54之保持面56的高度(即是，包含保護構件21之被加工物11之厚度)。該測量器58被構成可以對保持台54做相對性移動。另外，作為測量器58，即使使用接觸式之測微計等亦可。 A measuring instrument 58 is arranged above the holding table 54. The measuring device 58 is, for example, a laser displacement meter that measures the position (height) of the object using the laser beam L2, and can measure the height of the surface 11a of the workpiece 11 relative to the holding surface 56 of the holding table 54 in a non-contact manner (that is, The thickness of the to-be-processed object 11 including the protective member 21). The measuring device 58 is configured to be able to relatively move the holding table 54. In addition, as the measuring device 58, a contact type micrometer or the like may be used.

在厚度資訊記憶步驟中，首先以保持台54之保持面56，和被黏貼於被加工物11之保護構件21之背面21b相接之方式，將被加工物11載置於保持台54。依此，在被加工物11係在表面11a側露出於上方之狀態，被保持於保持台54。 In the thickness information memory step, first, the workpiece 11 is placed on the holding table 54 in such a way that the holding surface 56 of the holding table 54 is in contact with the back surface 21 b of the protective member 21 pasted to the workpiece 11. According to this, the workpiece 11 is held by the holding table 54 in a state where the workpiece 11 is exposed upward on the surface 11 a side.

在以保持台54保持被加工物11之後，使保持台54和測量器58做相對性移動，使測量器58移動至事先設定的被加工物11之測量線33(參照圖4(B))之上方。而且，如圖4(A)所示般，一面以測量器58照射測量用之雷射光束L2，一面使挾盤台14和測量器58沿著測量線33做相對性移動。 After the workpiece 11 is held by the holding table 54, the holding table 54 and the measuring device 58 are moved relative to each other, and the measuring device 58 is moved to the measurement line 33 of the workpiece 11 set in advance (refer to FIG. 4(B)) Above. Furthermore, as shown in FIG. 4(A), while the measuring device 58 is irradiated with the laser beam L2 for measurement, the nip table 14 and the measuring device 58 are moved relative to each other along the measurement line 33.

依此，可以在測量線33上之複數座標(x,y)測量被加工物11之厚度(t)。藉由測量器58被測量到的厚度(t)和座標(x,y)之關係，以任意的方式被送至切削裝置2，被記憶在控制單元48之記憶部48a作為厚度資訊。當沿著被設定之所有的測量線33測量被加工物11之厚 度(t)，所對應之厚度資訊被記憶於記憶部48a時，厚度資訊記憶步驟結束。 According to this, the thickness (t) of the workpiece 11 can be measured at the plural coordinates (x, y) on the measuring line 33. The relationship between the thickness (t) and the coordinates (x, y) measured by the measuring device 58 is sent to the cutting device 2 in an arbitrary manner, and is stored in the memory portion 48a of the control unit 48 as thickness information. When measuring the thickness of the workpiece 11 along all the measurement lines 33 that are set Degree (t), when the corresponding thickness information is stored in the memory portion 48a, the thickness information memory step ends.

圖4(B)為示意性地表示測量線33之設定例的俯視圖。另外，在圖4(B)中，被加工物11使用固有的座標系(x座標及y座標)。在圖4(B)之設定例中，在例如x座標為x1、x2、x3之位置，分別設定與x軸方向垂直(與y軸方向平行)之直線狀的測量線33。再者，在y座標為y1、y2、y3之位置，分別設定與y軸方向垂直(與x軸方向平行)之直線狀之測量線33。 FIG. 4(B) is a plan view schematically showing an example of the setting of the measurement line 33. In addition, in FIG. 4(B), the workpiece 11 uses a unique coordinate system (x-coordinate and y-coordinate). In the setting example of FIG. 4(B), for example, at positions where the x-coordinates are x 1 , x 2 , and x 3 , linear measurement lines 33 perpendicular to the x-axis direction (parallel to the y-axis direction) are respectively set. Furthermore, at positions where the y coordinate is y 1 , y 2 , and y 3 , a linear measurement line 33 perpendicular to the y-axis direction (parallel to the x-axis direction) is respectively set.

依此，例如，若x座標沿著x1之測量線33測量被加工物11之厚度(t)時，可取得相對於測量線33上之複數座標(x1,y)的厚度(t)資訊。另外，在本實施型態中，雖然在上述保持面資訊記憶步驟對準被設定在保持面16上之測量線31，在被加工物11之表面11a上設定合計6條之測量線33，但是所設定之測量線33之數量、配置等不受限制。可以因應所要求之切削的精度等，自由地設定測量線33。 Accordingly, for example, if the x coordinate is along the measuring line 33 of x 1 to measure the thickness (t) of the workpiece 11, the thickness (t) relative to the plural coordinates (x 1 , y) on the measuring line 33 can be obtained News. In addition, in this embodiment, although the measurement line 31 set on the holding surface 16 is aligned with the measurement line 31 set on the holding surface 16 in the above-mentioned holding surface information memory step, a total of 6 measurement lines 33 are set on the surface 11a of the workpiece 11, but The number and configuration of the set measuring lines 33 are not limited. The measurement line 33 can be set freely in accordance with the required cutting accuracy, etc.

再者，在本實施型態中，雖然沿著事先設定的測量線33連續性地測量被加工物11之厚度(t)，但是即使事先設定複數測量點，在該測量點測量被加工物11之厚度(t)亦可。即使在此情況，因應所要求之切削的精度等，可以自由地設定測量點。 Furthermore, in this embodiment, although the thickness (t) of the workpiece 11 is continuously measured along the measurement line 33 set in advance, even if a plurality of measurement points are set in advance, the workpiece 11 is measured at the measurement points. The thickness (t) is also acceptable. Even in this case, the measuring point can be set freely according to the required cutting accuracy, etc.

於厚度資訊記憶步驟之後，進行在挾盤台保持被記憶厚度資訊的被加工物11之保持步驟。圖5(A)為 用以說明保持步驟的側面圖。在該保持步驟中，以挾盤台14之保持面16，和被黏貼於被加工物11之保護構件21之背面21b相接之方式，將被加工物11載置於挾盤台14。之後，藉由使吸引源之負壓作用於保持面16，被加工物11在表面11a側露出於上方之狀態下，被吸引、保持於挾盤台14。 After the thickness information memory step, a holding step of holding the workpiece 11 with the memorized thickness information on the clamping table is performed. Figure 5(A) is A side view to illustrate the holding step. In this holding step, the workpiece 11 is placed on the gripper table 14 in such a manner that the holding surface 16 of the gripper table 14 and the back surface 21b of the protective member 21 adhered to the workpiece 11 are in contact with each other. After that, the negative pressure of the suction source is applied to the holding surface 16, so that the workpiece 11 is sucked and held on the pinch table 14 in a state where the surface 11 a side is exposed upward.

於保持步驟之後，進行用以檢測出在挾盤台14所保持之被加工物11之外周緣的座標，和被形成在外周緣的凹槽11c(或是，被形成在被加工物11之表面11a的裝置15之圖案等)，記憶位置資訊的位置資訊記憶步驟。圖5(B)為用以說明位置資訊記憶步驟的俯視圖。 After the holding step, it is performed to detect the coordinates of the outer peripheral edge of the workpiece 11 held by the nip table 14, and the groove 11c formed on the outer peripheral edge (or, formed on the surface of the workpiece 11 11a, the device 15 pattern, etc.), the location information memory step of memory location information. FIG. 5(B) is a top view for explaining the step of storing position information.

在位置資訊記憶步驟中，首先將複合測量單元44所具備之攝影機之視野35對準包含被加工物11之外周緣的區域，以攝影機攝像該區域。攝影機所進行的攝像，例如一面使挾盤台14旋轉，一面在不同的複數位置進行。藉由攝像所形成之畫像之資料被送至控制單元48。 In the step of storing position information, firstly, the field of view 35 of the camera of the composite measuring unit 44 is aligned with the area including the outer periphery of the workpiece 11, and the area is captured by the camera. The imaging performed by the camera, for example, is performed at different plural positions while rotating the disc clamping table 14. The data of the image formed by the camera is sent to the control unit 48.

控制單元48係對從攝影機被送出的畫像進行邊緣檢測處理，取得表示被加工物11之外周緣的曲線。之後，控制單元48抽出曲線上之任意的3點A、B、C之座標。3點A、B、C之座標即使從以一次攝像所取得之一個畫像資料被抽出亦可，即使從複數次之攝像所取得之複數畫像資料被抽出亦可。 The control unit 48 performs edge detection processing on the image sent from the camera, and obtains a curve representing the outer periphery of the workpiece 11. After that, the control unit 48 extracts the coordinates of any three points A, B, and C on the curve. The coordinates of 3 points A, B, and C can be extracted even from one image data obtained by one shot, or even multiple image data obtained from multiple shots.

接著，控制單元48算出與連結點A及點B之線段垂直之2等分線，和與連結點B及點C之線段垂直之2等 分線之交點的座標。該交點之座標相當於被加工物11之中心O的座標。於算出中心O之座標(交點之座標)之後，抽出凹槽11c之座標，算出連結中心O和凹槽11c之直線，通過中心O，而對與表面11a平行之任意的基準線所構成之角度θ(無圖示)。 Next, the control unit 48 calculates the two-division line perpendicular to the line segment connecting point A and point B, and the two-division line perpendicular to the line segment connecting point B and point C. The coordinates of the intersection of the dividing line. The coordinates of the intersection point are equivalent to the coordinates of the center O of the workpiece 11. After calculating the coordinates of the center O (the coordinates of the point of intersection), extract the coordinates of the groove 11c, and calculate the angle formed by the straight line connecting the center O and the groove 11c, passing through the center O, to any reference line parallel to the surface 11a θ (not shown).

於算出中心O之座標(交點之座標)，和角度θ之後，將該些作為被加工物11對挾盤台14之位置資訊而記憶於控制單元48之記憶部48a。藉由使用該位置資訊，可以將在被加工物11以固有之座標系(x座標及y座標)所表示的厚度資訊，變換成挾盤台14(切削裝置2)之座標系(X座標及Y座標)。 After calculating the coordinates of the center O (the coordinates of the point of intersection) and the angle θ, these are stored in the memory 48a of the control unit 48 as position information of the workpiece 11 to the clamping table 14. By using this position information, it is possible to convert the thickness information represented by the inherent coordinate system (x coordinate and y coordinate) on the workpiece 11 into the coordinate system (X coordinate and Y coordinate).

於位置資訊記憶步驟之後，實施從位置資訊和保持面資訊和厚度資訊，在任意之座標(X,Y)算出被加工物11之表面11a之高度的算出步驟。圖6(A)為視覺性地表示保持面資訊所示的保持面16之高度(Z)的圖示，圖6(B)為視覺性地表示厚度資訊所示的被加工物11之厚度(t)的圖示，圖6(C)為視覺性地表示被加工物11之表面11a之高度的圖示。 After the position information storage step, a calculation step of calculating the height of the surface 11a of the workpiece 11 at arbitrary coordinates (X, Y) from the position information, the holding surface information, and the thickness information is carried out. Fig. 6(A) is a diagram visually showing the height (Z) of the holding surface 16 indicated by the holding surface information, and Fig. 6(B) is a diagram visually showing the thickness (Z) of the workpiece 11 indicated by the thickness information. Fig. 6(C) is a diagram showing the height of the surface 11a of the workpiece 11 visually.

另外，在圖6(B)中，表示變換成挾盤台14之座標系之後的厚度(t)。再者，在圖6(A)、圖6(B)及圖6(C)中，以「0」表示高度或厚度之基準值，使用「+1」「-1」等之數值表示從該基準值偏移的量。 In addition, in FIG. 6(B), the thickness (t) after conversion to the coordinate system of the clamping table 14 is shown. Furthermore, in Fig. 6(A), Fig. 6(B) and Fig. 6(C), "0" is used to indicate the reference value of height or thickness, and numerical values such as "+1" and "-1" are used to indicate from the The amount by which the reference value is shifted.

例如，如圖6(A)及圖6(B)所示般，在挾 盤台14上之區域(座標)37，保持面16之高度為「0」，被加工物11之厚度為「+1」。依此，在該區域37中，如圖6(C)所示般，算出被加工物11之表面11a之高度(t+Z)為「+1」(即是，僅比基準值「0」高出「1」)。 For example, as shown in Figure 6 (A) and Figure 6 (B), In the area (coordinates) 37 on the plate table 14, the height of the holding surface 16 is "0", and the thickness of the workpiece 11 is "+1". According to this, in this area 37, as shown in FIG. 6(C), the height (t+Z) of the surface 11a of the workpiece 11 is calculated to be "+1" (that is, only higher than the reference value "0" Higher than "1").

另外，也可預想保持面資訊之座標和厚度資訊之座標不對應之情形。在此情況，例如若使用相對於任意座標之保持面資訊(高度(Z))，最近的座標之厚度資訊(厚度(t))，算出被加工物11之表面11a之高度即可。另外，若適當設定測量線31、33(或測量點)之後，因應在位置資訊記憶步驟所算出之角度θ，使被加工物11對挾盤台14旋轉時，亦可以使保持面資訊之座標和厚度資訊之座標一致。 In addition, it is also conceivable that the coordinates of the surface information and the coordinates of the thickness information do not correspond to each other. In this case, for example, the height of the surface 11a of the workpiece 11 can be calculated by using the holding surface information (height (Z)) relative to any coordinate and the thickness information (thickness (t)) of the nearest coordinate. In addition, if the measuring lines 31 and 33 (or measuring points) are appropriately set, the coordinates of the holding surface information can also be maintained when the workpiece 11 is rotated against the clamping table 14 in accordance with the angle θ calculated in the position information memory step Consistent with the coordinates of the thickness information.

於算出步驟之後，進行根據在算出步驟算出的被加工物11之表面11a之高度(t+Z)，使旋轉的切削刀42切入至被加工物11，在被加工物11形成期望之深度的溝部之切削步驟。圖7為示意性地表示切削步驟之俯視圖。 After the calculation step, based on the height (t+Z) of the surface 11a of the workpiece 11 calculated in the calculation step, the rotating cutter 42 is cut into the workpiece 11 to form a desired depth on the workpiece 11 Cutting steps of the groove. Fig. 7 is a plan view schematically showing a cutting step.

在本實施型態中，因正確地算出被加工物11之表面11a之高度(t+Z)，故可以根據該表面11a之高度(t+Z)，使切削刀42精度佳地切入。依此，可以從被加工物11之表面11a沿著切削預定線13形成期望之深度的溝部。 In this embodiment, since the height (t+Z) of the surface 11a of the workpiece 11 is accurately calculated, the cutting blade 42 can be accurately cut according to the height (t+Z) of the surface 11a. According to this, a groove of a desired depth can be formed from the surface 11 a of the workpiece 11 along the planned cutting line 13.

如上述般，在本實施型態有關之被加工物之切削方法中，因從在複數座標(X,Y)測量挾盤台14之保持面16之高度(Z)而所取得之保持面資訊，和測量被加 工物11之厚度(t)而所取得之厚度資訊，在任意之座標(X,Y)算出在挾盤台14所保持之被加工物11之表面(上面)11a的高度，故可以高精度地控制切削刀42對被加工物11的切入深度。 As mentioned above, in the cutting method of the workpiece related to this embodiment, the holding surface information is obtained by measuring the height (Z) of the holding surface 16 of the clamping table 14 at the plural coordinates (X, Y) , And the measurement is added The thickness information obtained from the thickness (t) of the work piece 11 is calculated at arbitrary coordinates (X, Y) on the height of the surface (upper surface) 11a of the work piece 11 held by the clamping table 14, so that it can be highly accurate The cutting depth of the cutting blade 42 into the workpiece 11 is controlled ground.

再者，在與本實施型態有關之被加工物之切削方法中，因不需要在被加工物11形成確認用之溝部，故比起形成確認用之溝部的以往之方法，可以縮短至切削完成所需的時間。 Furthermore, in the method of cutting the workpiece related to this embodiment, since it is not necessary to form a confirmation groove in the workpiece 11, it can be shortened to cutting compared to the conventional method of forming a confirmation groove. The time required to complete.

另外，本發明並不限制於上述實施型態之記載，能夠做各種變更而加以實施。例如，在上述實施型態之厚度資訊記憶步驟中，雖然在測量線33上之複數座標(x,y)測量被加工物11之厚度(t)，但是在被加工物11之厚度偏差非常小的情況等，可以使用被加工物11之1點的厚度(t)作為厚度資訊。在此情況，即使省略位置資訊記憶步驟亦可。 In addition, the present invention is not limited to the description of the above-mentioned embodiments, and can be implemented with various changes. For example, in the thickness information memory step of the above embodiment, although the thickness (t) of the workpiece 11 is measured at the multiple coordinates (x, y) on the measurement line 33, the thickness deviation of the workpiece 11 is very small In the case of, the thickness (t) of one point of the workpiece 11 can be used as the thickness information. In this case, even if the position information memory step is omitted.

再者，在上述實施型態之位置資訊記憶步驟中，使用具備複合測量單元44之攝影機(攝像單元)而檢測出被加工物11之外周緣或凹槽11c等，但是亦可以使用複合測量單元44所具備之高度測量器(高度測量單元)而檢測出被加工物11之外周緣或凹槽11c等。 Furthermore, in the position information memory step of the above embodiment, a camera (imaging unit) equipped with a composite measuring unit 44 is used to detect the outer periphery of the workpiece 11 or the groove 11c, etc., but a composite measuring unit can also be used The height measuring device (height measuring unit) provided in 44 detects the outer periphery of the workpiece 11 or the groove 11c.

其他，與上述實施型態有關之構造、方法等只要在不脫離本發明之目的的範圍，可以適當變更而加以實施。 In addition, the structure, method, etc. related to the above-mentioned embodiments can be implemented with appropriate changes as long as they do not depart from the purpose of the present invention.

14:挾盤台 14: Pinch table

16:保持面 16: keep the face

31:測量線 31: Measuring line

44:複合測量單元(高度測量器、攝像單元) 44: Composite measuring unit (height measuring device, camera unit)

Claims (3)

一種被加工物之切削方法，其係使用切削裝置的被加工物之切削方法，該切削裝置具備：挾盤台，其係在保持面保持板狀之被加工物；切削單元，其係以切削刀加工被保持於該挾盤台之該被加工物；移動單元，其係使該挾盤台和該切削單元在相對於該保持面平行的X軸方向及Y軸方向做相對性移動，該被加工物之切削方法具備：保持面資訊記憶步驟，其係以該移動單元使安裝用以測量高度之高度測量器之該切削單元，和該挾盤台做相對性移動，在複數之座標(X,Y)測量該挾盤台之該保持面之高度(Z)，記憶各個座標(X,Y)和高度(Z)之關係作為保持面資訊；厚度資訊記憶步驟，其係測量該被加工物之厚度，作為厚度資訊而予以記憶；保持步驟，其係在該挾盤台保持記憶該厚度資訊之該被加工物；算出步驟，其係從該保持面資訊和該厚度資訊，在任意之座標(X,Y)算出在該挾盤台所保持的該被加工物之上面之高度；及切削步驟，其係根據在該算出步驟算出之該被加工物之高度，使該切削刀切入在該挾盤台所保持的該被加工物，形成期望之深度的溝部。 A method of cutting a workpiece, which is a method of cutting a workpiece using a cutting device. The cutting device is provided with: a clamping table for holding a plate-shaped workpiece on a holding surface; and a cutting unit for cutting The knife processes the workpiece held on the clamping table; a moving unit that makes the clamping table and the cutting unit move relative to the X-axis direction and the Y-axis direction parallel to the holding surface, the The cutting method of the workpiece includes: a step of maintaining surface information memory, which uses the moving unit to move the cutting unit equipped with a height measuring device for height measurement and the clamping table to move relative to the plural coordinates ( X, Y) Measure the height (Z) of the holding surface of the clamping table, and memorize the relationship between each coordinate (X, Y) and height (Z) as the holding surface information; the thickness information memory step is to measure the processed The thickness of the object is memorized as thickness information; the holding step is to hold the processed object that memorizes the thickness information on the clamping table; the calculation step is to use the holding surface information and the thickness information in an arbitrary The coordinates (X, Y) calculate the height of the upper surface of the workpiece held by the clamping table; and the cutting step, which is based on the height of the workpiece calculated in the calculation step, so that the cutting knife is cut in the The workpiece held by the nip table forms a groove with a desired depth. 如請求項1所記載之被加工物之切削方法，其中進一步具備位置資訊記憶步驟，其係於該算出步驟之前，為了攝像該被加工物，使用被安裝於該切削單元之攝像單元或該高度測量器，檢測出在該挾盤台所保持的該被加工物之外周緣的座標，和被形成該外周緣或該被加工物之上面的標記，記憶從該外周緣之座標被算出的該被加工物之中心的座標，和連結該中心和該標記之直線相對於基準線所構成的角度，作為該被加工物相對於該挾盤台的位置資訊，在該厚度資訊記憶步驟中，在複數座標(x,y)測量該被加工物之厚度(t)，記憶各個座標(x,y)和厚度(t)之關係作為該厚度資訊，在該算出步驟中，從該位置資訊和該保持面資訊和該厚度資訊，在任意之座標(X,Y)算出該被加工物之該上面之高度。 The method for cutting a workpiece as described in claim 1, which further includes a position information memory step, which is prior to the calculation step, in order to image the workpiece, using the imaging unit installed in the cutting unit or the height The measuring instrument detects the coordinates of the outer periphery of the workpiece held by the clamping table, and the marks formed on the outer periphery or the upper surface of the workpiece, and memorizes the coordinates calculated from the coordinates of the outer periphery. The coordinates of the center of the processed object and the angle formed by the straight line connecting the center and the mark with respect to the reference line are used as the position information of the processed object relative to the clamping table. In the thickness information memory step, in the plural The coordinate (x, y) measures the thickness (t) of the workpiece, and the relationship between each coordinate (x, y) and thickness (t) is memorized as the thickness information. In the calculation step, the position information and the hold With the surface information and the thickness information, the height of the upper surface of the workpiece is calculated at any coordinate (X, Y). 如請求項1或2所記載之被加工物之切削方法，其中該被加工物具有包含被疊層在一方之面側的機能層的裝置，在該切削步驟中，沿著區劃該裝置之複數切割道以該切削刀形成該溝部。 The method for cutting a workpiece according to claim 1 or 2, wherein the workpiece has a device including a functional layer laminated on one surface side, and in the cutting step, a plurality of the devices are divided along the region The cutting channel forms the groove with the cutting blade.
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