TWI737970B

TWI737970B - Server rack

Info

Publication number: TWI737970B
Application number: TW108109045A
Authority: TW
Inventors: 張龍翹
Original assignee: 神雲科技股份有限公司
Priority date: 2019-03-18
Filing date: 2019-03-18
Publication date: 2021-09-01
Also published as: TW202037246A

Abstract

A server rack includes a chassis housing, a plurality of nodes, a backplane, and a plurality of power supplies. The chassis housing includes a plurality of unit spaces. Each of the nodes is disposed in at least one of the unit spaces of the chassis housing and includes a mainboard. The backplane is disposed in the chassis housing. Each of the power supplies is disposed in the at least one unit space set by a different one of the nodes and transfers a supply power to the backplane and then transfers to these nodes in a power-sharing manner such that the power supplies between the power supplies and the backplane can transmit power without using a cable, and the chassis housing can be provided with a larger number of memory settings under the same size.

Description

伺服器機櫃Server cabinet

本發明是有關於一種伺服器機櫃，特別是指一種具備多個節點且支援電源共享的伺服器機櫃。The present invention relates to a server cabinet, in particular to a server cabinet with multiple nodes and supporting power sharing.

習知的伺服器機櫃(Server rack)包含一機箱殼體、多個節點(Node)及一電源供應單元。該伺服器機櫃是一種標準機櫃，符合美國電子工業聯盟(EIA)所規定的標準。該機箱殼體的常規高度例如是47U、42U、37U、32U、27U、22U、18U等等，其常規寬度是800公釐(mm)、600公釐等等，其常規深度例如是600公釐、800公釐、900公釐、960公釐、1000公釐、1100公釐、1200公釐等等。其中，1U是1.75英吋(即44公釐)。The conventional server rack includes a chassis shell, multiple nodes and a power supply unit. The server cabinet is a standard cabinet that meets the standards set by the Electronic Industries Alliance (EIA). The conventional height of the chassis shell is, for example, 47U, 42U, 37U, 32U, 27U, 22U, 18U, etc., its conventional width is 800 millimeters (mm), 600 mm, etc., and its conventional depth is, for example, 600 mm. , 800 mm, 900 mm, 960 mm, 1000 mm, 1100 mm, 1200 mm, etc. Among them, 1U is 1.75 inches (44 mm).

每一節點例如可以視為一伺服器、一運算節點、或一儲存節點等等。每一節點在該機箱殼體中所佔據的空間的高度是1U的整數倍，且所佔據的空間的寬度例如是8.8英吋(即22.5公分)。舉例來說，該等節點的尺寸可以設計為2U4N、2U2N、1U2N等等，其中，4N表示在該機箱殼體內的同一水平高度上可以設置4個節點。Each node can be regarded as a server, a computing node, or a storage node, etc., for example. The height of the space occupied by each node in the chassis shell is an integer multiple of 1U, and the width of the space occupied is, for example, 8.8 inches (ie, 22.5 cm). For example, the size of the nodes can be designed as 2U4N, 2U2N, 1U2N, etc., where 4N means that 4 nodes can be set on the same level in the chassis shell.

該電源供應單元包括多個電源供應器以提供該等節點運作時所需要的電力，且其設置的方式一般採用獨立設計，或者，採用一種寬度很窄的設計。然而，習知的該伺服器機櫃的該電源供應單元的這些設置方式不但需要多條電纜線(Cable)來傳輸電力而使得線路較為複雜，更嚴重的是都造成該節點的寬度受到較大的限制，進而導致該節點的主板上所能設置的記憶體的數量受到限縮，而成為一個待解決的問題。The power supply unit includes a plurality of power supplies to provide the power required for the operation of the nodes, and the setting method is generally independent design, or a design with a very narrow width is adopted. However, the conventional arrangements of the power supply unit of the server cabinet not only require multiple cables to transmit power and make the circuit more complicated, but also cause the width of the node to be larger. The limitation, which in turn leads to the limitation of the amount of memory that can be set on the motherboard of the node, becomes a problem to be solved.

因此，本發明的目的，即在提供一種在相同尺寸下能夠支援較多數量的記憶體的伺服器機櫃。Therefore, the object of the present invention is to provide a server cabinet that can support a larger amount of memory under the same size.

於是，本發明伺服器機櫃包含一機箱殼體、多個節點、一背板、及多個電源供應器。該機箱殼體包括多個單位空間。每一該節點設置於該機箱殼體的該等單位空間之其中至少一者，且每一該節點包括一主板。該背板設置於該機箱殼體內。Therefore, the server cabinet of the present invention includes a chassis shell, a plurality of nodes, a backplane, and a plurality of power supplies. The case shell includes a plurality of unit spaces. Each of the nodes is arranged in at least one of the unit spaces of the chassis shell, and each of the nodes includes a main board. The backplane is arranged in the chassis shell.

每一該電源供應器設置於該等節點之其中不同者所設置的該至少一單位空間，且將一供應電源傳送至該背板，再以電源共享的方式傳送至該等節點。Each of the power supplies is arranged in the at least one unit space set by different ones of the nodes, and a supply power is transmitted to the backplane, and then transmitted to the nodes in a power sharing manner.

在一些實施態樣中，其中，每一該單位空間的高度是1U，1U等於1.75英吋，每一該單位空間的寬度是一最大寬度的M分之一，M是正整數，該最大寬度相關於該機箱殼體的寬度，每一該單位空間的深度相關於該機箱殼體的深度。In some implementations, the height of each unit space is 1U, 1U is equal to 1.75 inches, and the width of each unit space is one-Mth of a maximum width. M is a positive integer, and the maximum width is related to With respect to the width of the chassis shell, the depth of each unit space is related to the depth of the chassis shell.

在另一些實施態樣中，其中，該背板包括一第一金屬層、一第二金屬層、及多個導通孔(Via)。該第一金屬層包含多個電源輸入點，以分別接收該等電源供應器的該等供應電源。該第二金屬層包含多個電源輸出點，以將該等供應電源共享後所形成的一共享輸出電源輸出至該等節點。In other embodiments, the backplane includes a first metal layer, a second metal layer, and a plurality of vias (Via). The first metal layer includes a plurality of power input points to respectively receive the power supplies from the power supplies. The second metal layer includes a plurality of power output points to output a shared output power formed by sharing the power supply to the nodes.

該等導通孔(Via) 與該第一金屬層及該第二金屬層電連接，以傳送該等供應電源所形成的該共享輸出電源，該等導通孔以鄰近該第一金屬層的該等電源輸入點的幾何中心來設置。The vias (Via) are electrically connected to the first metal layer and the second metal layer to transmit the shared output power formed by the power supplies, and the vias are adjacent to the first metal layer. Set the geometric center of the power input point.

在一些實施態樣中，其中，該等導通孔的數量乘以每一該導通孔所能傳送的一電流臨界值大於等於該等導通孔所能提供的一最大負載電流。In some embodiments, wherein the number of the vias multiplied by a current threshold that each via can transmit is greater than or equal to a maximum load current that the vias can provide.

在另一些實施態樣中，其中，與該等電源供應器設置於不同的該至少一單位空間的該等節點之其中每一者還包括一電源輸入板。該等節點之其中每一者還包括一電源輸出板。每一該節點所包括的該電源輸入板及該電源輸出板分別固定於該機箱殼體。該電源輸入板包含一第一傳輸層，以將與該節點設置在相同的該至少一單位空間的該電源供應器所提供的該供應電源傳送至該背板的該第一金屬層的對應的該電源輸入點。該電源輸出板包含一第二傳輸層，以將該等供應電源共享後所形成的該共享輸出電源經由該背板的該第二金屬層的對應的該電源輸出點傳送至該等節點。In other embodiments, each of the nodes that are disposed in the at least one unit space different from the power supplies further includes a power input board. Each of these nodes also includes a power output board. The power input board and the power output board included in each node are respectively fixed to the chassis shell. The power input board includes a first transmission layer to transmit the power supplied by the power supply provided in the same unit space as the node to the corresponding one of the first metal layer of the backplane The power input point. The power output board includes a second transmission layer, so that the shared output power formed after the power supply is shared is transmitted to the nodes through the power output points corresponding to the second metal layer of the backplane.

在一些實施態樣中，其中，該背板、該等主板、該等電源輸入板、及該等電源輸出板都是一種印刷電路板(Printed circuit board, PCB)。In some embodiments, the backplane, the main boards, the power input boards, and the power output boards are all a printed circuit board (PCB).

在另一些實施態樣中，其中，該等電源供應器支援RPSU(Redundant power supplies unit)規範。In other embodiments, the power supplies support the RPSU (Redundant power supplies unit) specification.

在另一些實施態樣中，其中，該等導通孔是以該第一金屬層的該等電源輸入點的幾何中心為中心而對稱地設置。In other embodiments, the through holes are symmetrically arranged with the geometric center of the power input points of the first metal layer as the center.

在另一些實施態樣中，其中，該第二金屬層還包含一遠端取樣點，該遠端取樣點以鄰近該第二金屬層的該等電源輸出點的幾何中心來設置，該遠端取樣點將一電壓值傳送至該等電源供應器。In other embodiments, the second metal layer further includes a remote sampling point, the remote sampling point is set at the geometric center of the power output points adjacent to the second metal layer, and the remote The sampling point transmits a voltage value to the power supplies.

在另一些實施態樣中，其中，該第一金屬層還包含一電連接該等電源輸入點及該等導通孔的主要電源輸入區域，該第二金屬層還包含一電連接該等電源輸出點及該等導通孔的主要電源輸出區域，藉由該主要電源輸入區域及該主要電源輸出區域之其中至少一者，以共享該等供應電源並形成該共享輸出電源。In other embodiments, the first metal layer further includes a main power input area electrically connected to the power input points and the via holes, and the second metal layer further includes an electrical connection to the power output The dots and the main power output areas of the through holes share the power supply and form the shared output power by at least one of the main power input area and the main power output area.

本發明的功效在於：藉由該等電源供應器設置於該等節點之其中不同者所設置的該至少一單位空間中，再藉由該等電源輸入板、該背板、及該等電源輸出板將該等共享電源傳送至該等節點，而能夠在不使用電纜線的條件下，實現電源共享的目的。此外，由於該等電源供應器在該機箱殼體內並不是採用習知的獨立設計，而是整合於該等節點所設置的該等單位空間中，進而使得該等節點的該等主板能夠提供更多數量的記憶體設置。The effect of the present invention is that the power supplies are arranged in the at least one unit space set by different ones of the nodes, and then the power input boards, the backplane, and the power output The board transmits the shared power to these nodes, and can realize the purpose of power sharing without using cables. In addition, because the power supplies are not designed independently in the chassis shell, but are integrated in the unit spaces provided by the nodes, so that the motherboards of the nodes can provide more Large number of memory settings.

在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

參閱圖1與圖2，本發明伺服器機櫃(Sever rack)100之實施例，包含一機箱殼體1、四個節點2、一背板3、及四個電源供應器4。該機箱殼體1的寬度、高度、及深度分別為W1、H1、及D1，且包括四個單位空間11~14。每一該單位空間11~14的寬度、高度、及深度分別為W2、H2、及D2。該四個節點2及分別對應的該四個電源供應器4都是分別對應設置在該四個單位空間11~14。其中，高度H2等於1U(即1.75英吋)，寬度W2近似於22.5公分，高度H1大於等於高度H2的整數倍，寬度W1大於等於寬度W2的二倍，深度D1大於等於深度D2。也就是說，每一該單位空間11~14的寬度W2是一最大寬度的M分之一，M是正整數，該最大寬度相關於該機箱殼體1的寬度W1，每一該單位空間11~14的深度D2相關於該機箱殼體1的深度D1。Referring to FIGS. 1 and 2, an embodiment of a server rack 100 of the present invention includes a chassis shell 1, four nodes 2, a backplane 3, and four power supplies 4. The width, height, and depth of the case shell 1 are W1, H1, and D1, respectively, and include four unit spaces 11-14. The width, height, and depth of each unit space 11-14 are W2, H2, and D2, respectively. The four nodes 2 and the corresponding four power supplies 4 are respectively correspondingly arranged in the four unit spaces 11-14. Among them, the height H2 is equal to 1U (that is, 1.75 inches), the width W2 is approximately 22.5 cm, the height H1 is greater than or equal to an integer multiple of the height H2, the width W1 is greater than or equal to twice the width W2, and the depth D1 is greater than or equal to the depth D2. That is to say, the width W2 of each unit space 11-14 is one M part of the maximum width, M is a positive integer, and the maximum width is related to the width W1 of the chassis shell 1, and each unit space 11~ The depth D2 of 14 is related to the depth D1 of the chassis shell 1.

另外要強調的是：在本實施例中，該伺服器機櫃100是以包含一個尺寸為2U4N的四個節點2為例作說明，且單一個節點2設置於單一個單位空間11~14，即2U表示佔據2倍的高度H2，4N表示該伺服器機櫃100所包含的節點數量是4個。而在其他實施例中，該伺服器機櫃100也可以包含其他尺寸或數量的節點，例如1U1N、1U2N、3U6N等等，或者，單一個節點也可以設置於多個單位空間。In addition, it should be emphasized that in this embodiment, the server cabinet 100 includes four nodes 2 with a size of 2U4N as an example, and a single node 2 is set in a single unit space 11-14, namely 2U indicates that it occupies twice the height H2, and 4N indicates that the number of nodes included in the server cabinet 100 is 4. In other embodiments, the server cabinet 100 may also include nodes of other sizes or numbers, such as 1U1N, 1U2N, 3U6N, etc., or a single node may also be installed in multiple unit spaces.

參閱圖2與圖3，為方便說明起見，圖2是單一個單位空間11~14、單一個節點2、單一個電源供應器4、及該背板3的一部份的立體示意圖。圖3是位在該等單一空間11、12(或13、14)的二個節點2、二個電源供應器4、二個風扇單元24、及該背板3的一部份的俯視圖。在本實施例中，該四個節點2是相同的伺服器(如圖2)，而在其他實施例中，該四個節點也可以不相同。每一該節點2包括一主板21、一電源輸入板22、一電源輸出板23、及一風扇單元24。在本實施例中，示例性地說明該主板21提供二中央處理器插槽91給二個中央處理器(CPU)93設置，及四組記憶體插槽92給多個記憶體設置。每一該節點2所包括的該電源輸入板22及該電源輸出板23分別固定於該機箱殼體1且位於該節點2的該主板21的相對的二端，並與該主板21互相垂直，且都是一種印刷電路板(Printed circuit board, PCB)，並包含一第一傳輸層，以傳輸電力。2 and 3, for the convenience of description, FIG. 2 is a three-dimensional schematic diagram of a single unit space 11-14, a single node 2, a single power supply 4, and a part of the backplane 3. 3 is a top view of two nodes 2, two power supplies 4, two fan units 24, and a part of the backplane 3 located in the single spaces 11, 12 (or 13, 14). In this embodiment, the four nodes 2 are the same server (as shown in FIG. 2), but in other embodiments, the four nodes may be different. Each node 2 includes a main board 21, a power input board 22, a power output board 23, and a fan unit 24. In this embodiment, it is illustrated by way of example that the motherboard 21 provides two central processing unit sockets 91 for two central processing units (CPU) 93 and four sets of memory sockets 92 for multiple memories. The power input board 22 and the power output board 23 included in each node 2 are respectively fixed to the chassis casing 1 and located at two opposite ends of the main board 21 of the node 2, and are perpendicular to the main board 21, Both are a printed circuit board (PCB) and include a first transmission layer to transmit power.

參閱圖2、圖3、與圖4，圖4是該背板3沿著方向Y所見的透視示意圖，也就是說圖4中的虛線元件實際上並不是位在該背板3鄰近該等主板21的一表面上。該背板3提供該等節點2的該等主板21及該等風扇單元24插設，且可以與該等主板21、該等電源輸入板22、及該等電源輸出板23互相垂直，並設置在鄰近該等主板21的同一端。該等電源供應器4是分別設置在鄰近該等主板21相對於該背板3的另一端。另外要補充說明的是：在本實施例中，該等節點2的該等主板21與該等電源輸入板22及該等電源輸出板23是互相垂直。而在其他實施例中，該等電源輸入板22及該等電源輸出板23也可以是以堆疊的方式分別與該等主板21平行設置。此外，在本實施例中，該等節點2的該等主板21是插設於該背板3上，而在其他的實施例中，該等主板21也可以藉由透過其他的橋接板或該風扇單元24的風扇控制板，再間接地插設於該背板3上。再者，該等電源輸入板22及該等電源輸出板23也可以藉由該等主板21或其他橋接板間接地固定於該機箱殼體1。此外，每一該節點2所包括的該電源輸入板22及該電源輸出板23也可以不是位於該節點2的該主板21的相對的二端，都不在此限。Refer to Figure 2, Figure 3, and Figure 4. Figure 4 is a perspective schematic view of the backplane 3 seen along the direction Y, that is to say, the dotted elements in Figure 4 are not actually located on the backplane 3 adjacent to the motherboards. 21 on the surface. The backplane 3 provides the main boards 21 and the fan units 24 of the nodes 2 to be plugged in, and can be perpendicular to the main boards 21, the power input boards 22, and the power output boards 23, and is arranged At the same end adjacent to the motherboards 21. The power supplies 4 are respectively disposed adjacent to the other end of the main board 21 relative to the back board 3. It should be supplemented that in this embodiment, the main boards 21 of the nodes 2 and the power input boards 22 and the power output boards 23 are perpendicular to each other. In other embodiments, the power input boards 22 and the power output boards 23 may also be arranged in parallel with the main boards 21 in a stacked manner. In addition, in this embodiment, the motherboards 21 of the nodes 2 are inserted on the backplane 3. In other embodiments, the motherboards 21 can also pass through other bridge boards or the The fan control board of the fan unit 24 is then inserted indirectly on the back board 3. Furthermore, the power input boards 22 and the power output boards 23 can also be indirectly fixed to the chassis shell 1 via the motherboard 21 or other bridge boards. In addition, the power input board 22 and the power output board 23 included in each node 2 may not be located at the opposite ends of the main board 21 of the node 2, and they are not limited thereto.

該背板3也是一種印刷電路板，再參閱圖5與圖6，同樣是以方向Y所見的示意圖。該背板3包括一第一電路層30、一第二電路層40、及多個導通孔(Via)33，即該第一電路層30與該第二電路層40是屬於該背板3的多層印刷電路中的不同層，且在本實施例中，該第一電路層30相對於該第二電路層40較鄰近該等主板21。該第一電路層30包含一第一金屬層31。該第一金屬層31包含多個電源輸入點34及一主要電源輸入區域32，以分別經由該四個電源輸入板22接收該四個電源供應器4提供的四個供應電源，以形成一共享輸出電源，該等供應電源及該共享輸出電源例如是提供12伏特的電源電壓。該第二電路層40包含一第二金屬層41。該第二金屬層41包含一主要電源輸出區域42及多個電源輸出點35，以將該等供應電源所形成的該共享輸出電源，經由該四個電源輸出板23輸出至該四個節點2，例如該四個主板21。更精確地說，該等電源輸入點34經由導線、導電元件或金屬區域與該主要電源輸入區域32形成電連接，該主要電源輸入區域32經由該等導通孔33、導線或金屬區域與該主要電源輸出區域42形成電連接，該主要電源輸出區域42再經由導線、導電元件或金屬區域與該等電源輸出點35形成電連接，使得該四個供應電源形成該共享輸出電源。要特別說明的是：在圖5、6中，該等導通孔33的數量是4個，僅是一種示例性地表示，且為使圖式簡單清楚之考量，僅標示出一個導通孔33的編號。The backplane 3 is also a kind of printed circuit board. Refer to FIG. 5 and FIG. 6 again, which are also schematic diagrams seen in the direction Y. The backplane 3 includes a first circuit layer 30, a second circuit layer 40, and a plurality of vias (Via) 33, that is, the first circuit layer 30 and the second circuit layer 40 belong to the backplane 3 Different layers in a multilayer printed circuit, and in this embodiment, the first circuit layer 30 is closer to the main boards 21 than the second circuit layer 40. The first circuit layer 30 includes a first metal layer 31. The first metal layer 31 includes a plurality of power input points 34 and a main power input area 32 to respectively receive four power supplies provided by the four power supplies 4 through the four power input boards 22 to form a shared The output power supply, the supply power supply and the shared output power supply, for example, provide a power supply voltage of 12 volts. The second circuit layer 40 includes a second metal layer 41. The second metal layer 41 includes a main power output area 42 and a plurality of power output points 35, so that the shared output power formed by the power supply is output to the four nodes 2 through the four power output boards 23 , For example, the four main boards 21. More precisely, the power input points 34 are electrically connected to the main power input area 32 via wires, conductive elements or metal areas, and the main power input area 32 is electrically connected to the main power input area 32 via the vias 33, wires or metal areas. The power output area 42 is electrically connected, and the main power output area 42 is electrically connected to the power output points 35 via wires, conductive elements or metal areas, so that the four power supplies form the shared output power. It should be particularly noted that: in Figures 5 and 6, the number of the vias 33 is 4, which is only an exemplary representation, and for the sake of simplicity and clarity of the drawing, only one via 33 is marked. serial number.

另外，舉例來說，每一該電源輸入板22透過其具有多個傳輸腳位(pin)的一電源供應連接器(例如:金手指、表面黏著連接器SMT connector或雙列直插連接器DIP connector)來連接該背板3上具有與該傳輸腳位(pin)對應數量的多個接收腳位(pin)的一第一輸入連接器(圖未示)，則與該第一輸入連接器上的多個接收腳位(pin)分別電連接的該背板3的該第一電路層30的該第一金屬層31的多個電子接點即分別是該等電源輸入點34，如圖4中的區域A2、A4及圖5與圖6中的區域B2、B4即是該四個第一輸入連接器對應的設置位置。類似地，該背板3上具有分別電連接該四個節點21且用以輸出該共享輸出電源的四個第一輸出連接器(圖未示)，則與每一該第一輸出連接器所具有的多個輸出腳位(pin)分別電連接的該第二電路層40的該第二金屬層41的多個電子接點即分別是該等電源輸出點35，如圖4中的區域A1、A3及圖5與圖6中的區域B1、B3即是該四個第一輸出連接器對應的設置位置。In addition, for example, each power input board 22 has a power supply connector (such as gold finger, surface mount connector SMT connector, or dual in-line connector DIP) with multiple transmission pins. connector) to connect a first input connector (not shown) on the backplane 3 with a number of receiving pins (pins) corresponding to the number of transmission pins (pins), and then to the first input connector The electronic contacts of the first metal layer 31 of the first circuit layer 30 of the backplane 3 that are electrically connected to the plurality of receiving pins (pins) are the power input points 34, respectively, as shown in FIG. Areas A2 and A4 in 4 and areas B2 and B4 in FIG. 5 and FIG. 6 are the corresponding positions of the four first input connectors. Similarly, the backplane 3 has four first output connectors (not shown) that are electrically connected to the four nodes 21 and used to output the shared output power, and are connected to each of the first output connectors. The multiple electronic contacts of the second metal layer 41 of the second circuit layer 40 that have multiple output pins are respectively the power output points 35, as shown in the area A1 in FIG. 4 , A3 and the areas B1 and B3 in FIG. 5 and FIG. 6 are the corresponding positions of the four first output connectors.

該第二金屬層41還包含一遠端取樣點43，該遠端取樣點43以鄰近該第二金屬層41的該等電源輸出點35的幾何中心為中心來設置，例如設置在該幾何中心。由於電源負載的變動或是傳輸過程的耗損都有可能影響該共享輸出電源的電壓值，因此，該等電源供應器4分別電耦接該遠端取樣點43以取得該共享輸出電源的電壓值，並分別比對該電源供應器4所輸出的供應電源的電壓值以分別取得各個電源供應器4的傳輸耗損量，以進一步的判斷該傳輸耗損量是否超出一預設範圍，以對應控制電壓補償機制的執行，以其中一電源供應器4為例，當該電源供應器4判斷出該傳輸耗損量超出該預設範圍，則執行該電壓補償機制，意即該電源供應器4根據該傳輸耗損量的比例來對應調整增加該供應電源的電壓值，若該電源供應器4判斷該傳輸耗損量未超出該預設範圍，則不執行該電壓補償機制。The second metal layer 41 also includes a remote sampling point 43. The remote sampling point 43 is arranged around the geometric center of the power output points 35 adjacent to the second metal layer 41, for example, at the geometric center. . Since the change of the power load or the loss in the transmission process may affect the voltage value of the shared output power, the power supplies 4 are electrically coupled to the remote sampling point 43 to obtain the voltage value of the shared output power. , And compare the voltage value of the power supply output by the power supply 4 to obtain the transmission loss of each power supply 4, so as to further determine whether the transmission loss exceeds a preset range to correspond to the control voltage For the execution of the compensation mechanism, take one of the power supplies 4 as an example. When the power supply 4 determines that the transmission loss exceeds the preset range, it executes the voltage compensation mechanism, which means that the power supply 4 responds to the transmission The ratio of the loss is adjusted to increase the voltage value of the power supply. If the power supply 4 determines that the transmission loss does not exceed the preset range, the voltage compensation mechanism is not executed.

另外要特別說明的是：該第二金屬層41的該遠端取樣點43透過一取樣導電通孔的態樣實施，並經由該第一金屬層31耦接多個取樣輸出點，以分別電連接該等電源供應器4。舉例來說，該等取樣輸出點用以與該等第一輸出連接器的多個輸出腳位(pin)中未與該等電源輸出點35直接電連接的腳位(pin)電連接以分別耦接對應的該等電源供應器4。或者，該等取樣輸出點也可以是與該等第一輸入連接器的多個腳位(pin)中沒有與該等電源輸入點34直接電連接的腳位(pin)電連接以分別耦接對應的該等電源供應器4。或者，該等取樣輸出點也可以是透過耦接不同於該等第一輸出連接器及該等第一輸入連接器的其他連接器的其中一腳位(pin)電連接以耦接對應的該等電源供應器4，但不以此為限。In addition, it should be particularly noted that the remote sampling point 43 of the second metal layer 41 is implemented through a sampling conductive through hole, and is coupled to a plurality of sampling output points through the first metal layer 31 to be electrically connected to each other. Connect these power supplies 4. For example, the sampling output points are used to electrically connect the output pins of the first output connectors that are not directly electrically connected to the power output points 35, respectively. The corresponding power supplies 4 are coupled. Alternatively, the sampling output points may also be electrically connected to pins of the first input connectors that are not directly electrically connected to the power input points 34 to be respectively coupled The corresponding power supplies4. Alternatively, the sampling output points can also be electrically connected to one of the pins of other connectors different from the first output connectors and the first input connectors to couple the corresponding ones. Wait for power supply 4, but not limited to this.

該等導通孔33與該第一金屬層31及該第二金屬層41電連接，以傳送該等供應電源所形成的該共享輸出電源，且該等導通孔33以鄰近該第一金屬層31的該等電源輸入點34的幾何中心(如位置P)來設置。該等導通孔33的數量乘以每一該導通孔33所能承載或傳送的一電流臨界值大於等於該等導通孔33所能共同提供的一最大負載電流。舉例來說，該最大負載電流為300安培，假設每一該導通孔33可以承載1.5安培的電流，則該等導通孔33的數量最少需要200個。更詳細地說，在本實施例中，該等導通孔33所設置的位置是以該第一金屬層31的該等電源輸入點34所傳輸的該等供應電源能夠在該第一金屬層31的主要電源輸入區域32大致維持電流平衡的位置。也就是說，在該等電源輸入點34所圍繞的範圍內來設置該等導通孔33，該等導通孔33較佳的設置方式是以鄰近該等電源輸入點34的幾何中心(如位置P)而設置，也就是設置在該四個區域B2、B4的該等電源輸入點34的四個幾何中心的幾何中心(位置P)，例如，該等導通孔33是以該幾何中心為中心而對稱地設置。The via holes 33 are electrically connected to the first metal layer 31 and the second metal layer 41 to transmit the shared output power formed by the power supplies, and the via holes 33 are adjacent to the first metal layer 31 The geometric centers (such as position P) of the power input points 34 are set. The number of the vias 33 multiplied by a current critical value that each via 33 can carry or transmit is greater than or equal to a maximum load current that the vias 33 can provide together. For example, the maximum load current is 300 amperes. Assuming that each of the through holes 33 can carry 1.5 amperes of current, the number of the through holes 33 needs to be at least 200. In more detail, in the present embodiment, the positions where the vias 33 are arranged are such that the supply power transmitted by the power input points 34 of the first metal layer 31 can be on the first metal layer 31 The main power input area 32 roughly maintains the current balance position. That is to say, the through holes 33 are arranged in the range surrounded by the power input points 34, and the preferred arrangement of the through holes 33 is to be adjacent to the geometric center of the power input points 34 (such as the position P ), that is, the geometric centers (position P) of the four geometric centers of the power input points 34 in the four regions B2, B4. For example, the through holes 33 are centered on the geometric center. Set symmetrically.

另外要補充說明的是：在本實施例中，該第二金屬層41是位於較該第一金屬層31遠離該等主板21的一印刷電路層，即該第一電路層30相較於該第二電路層40是位於該背板3上較鄰近該等主板21，且該第一電路層30及該第二電路層40分別包含一層的印刷電路層(即該第一金屬層31及該第二金屬層41)。而在其他的實施例中，該第一電路層30及該第二電路層40也可以分別包含多層的印刷電路層，即分別包含多個第一金屬層31及多個第二金屬層41，以提供足夠的該最大負載電流。或者，該第一電路層30及該第二電路層40也可以設置在該背板3的同一層印刷電路層中，只要能夠提供足夠的該最大負載電流即可。此外，該第一電路層30與該第二電路層40相對於該等主板21的位置也可以對調設置，例如，該第二電路層40相對於該第一電路層30是該背板3上較靠近該等主板21。In addition, it should be added that: in this embodiment, the second metal layer 41 is located on a printed circuit layer farther from the motherboards 21 than the first metal layer 31, that is, the first circuit layer 30 is compared with the The second circuit layer 40 is located on the backplane 3 and is closer to the main boards 21, and the first circuit layer 30 and the second circuit layer 40 each include a printed circuit layer (that is, the first metal layer 31 and the The second metal layer 41). In other embodiments, the first circuit layer 30 and the second circuit layer 40 may also include multiple printed circuit layers, that is, each includes a plurality of first metal layers 31 and a plurality of second metal layers 41, To provide sufficient maximum load current. Alternatively, the first circuit layer 30 and the second circuit layer 40 can also be arranged in the same printed circuit layer of the backplane 3, as long as the maximum load current can be provided enough. In addition, the positions of the first circuit layer 30 and the second circuit layer 40 relative to the motherboards 21 can also be reversed. For example, the second circuit layer 40 is on the backplane 3 relative to the first circuit layer 30. Closer to these motherboards 21.

在本實施例中，在不考慮電流於傳輸過程或變壓等過程中的耗損而言，該共享輸出電源所提供的該最大負載電流是整個伺服器機櫃100上所有電子元件所需要消耗的負載電流的總和，例如提供風扇單元24的風扇運轉所需的電流、全部的硬碟模組運轉所需的電流、該背板3上的元件所需要的電流、該等節點2的該等主板21上的元件所需要的電流等等。而在其他實施例中，該最大負載電流也可以是整個伺服器機櫃100上部分電子元件所需要消耗的負載電流的總和，舉例來說，該伺服器機櫃100包含多個背板及對應的多個電源供應器4，其中，每一背板的共享輸出電源提供對應的該等節點2的該等主板21及硬碟模組上的元件所需要的電流，其中一背板的共享輸出電源還提供風扇單元24的風扇運轉所需的電流，但不以此為限。In this embodiment, the maximum load current provided by the shared output power supply is the load that all electronic components on the entire server cabinet 100 need to consume, regardless of the current loss during the transmission process or voltage transformation process. The sum of the currents, such as the current required for the fan operation of the fan unit 24, the current required for the operation of all hard disk modules, the current required by the components on the backplane 3, and the main boards 21 of the nodes 2 The current required by the components on the board and so on. In other embodiments, the maximum load current may also be the sum of the load currents consumed by some electronic components on the entire server cabinet 100. For example, the server cabinet 100 includes multiple backplanes and corresponding multiple A power supply 4, wherein the shared output power of each backplane provides the current required by the components on the motherboards 21 and hard disk modules corresponding to the nodes 2, and the shared output power of one of the backplanes also The current required for the operation of the fan of the fan unit 24 is provided, but not limited to this.

該四個電源供應器4分別設置於該四個節點2之其中不同者所設置的該四個單位空間11~14，且每一該電源供應器4產生該供應電源。該等電源供應器4還支援RPSU(Redundant power supplies unit)規範因此，每一該電源供應器4需要藉由該遠端取樣點43接收關於對應的該節點2所接收的該共享輸出電源的該電壓值，以偵測並補償所輸出的該供應電源的電壓值。The four power supplies 4 are respectively arranged in the four unit spaces 11-14 of different ones of the four nodes 2, and each of the power supplies 4 generates the power supply. The power supplies 4 also support the RPSU (Redundant power supplies unit) specification. Therefore, each power supply 4 needs to receive the information about the shared output power received by the corresponding node 2 through the remote sampling point 43 The voltage value is used to detect and compensate the output voltage value of the power supply.

另外要特別補充說明的是：在本實施例中，在每一該單位空間11~14中都設置有一個電源供應器4，而在其他實施例中，電源供應器4的數量也可以是小於該等節點2的數量，例如是1個、2個或3個。此時，每一該電源供應器4還是設置於該等節點2之其中不同者所設置的該至少一單位空間11~14，且與該等電源供應器4設置於不同的該至少一單位空間11~14的該等節點2之其中每一者才會包括該電源輸入板22，且該背板3的該第一金屬層31的該等電源輸入點34的數量也與該等電源輸入板22的數量相對應。舉例來說，四個節點2對應設置三個電源供應器4時，只有設置有電源供應器4的節點2才會有該電源輸入板22，但是四個節點2都會分別包含四個該電源輸出板23。此外，由於每一該電源輸入板22及每一該電源輸出板23都是一種印刷電路板的結構，而能夠具有不同的傳輸層，因此，還可以用來傳輸各種信號，例如每一該電源供應器4所產生且符合RPSU規範的通訊信號，但不以此為限。In addition, it should be noted that: in this embodiment, each unit space 11-14 is provided with a power supply 4, while in other embodiments, the number of power supplies 4 may also be less than The number of the nodes 2 is, for example, 1, 2, or 3. At this time, each power supply 4 is still installed in the at least one unit space 11-14 set by a different one of the nodes 2, and is installed in the at least one unit space different from the power supplies 4 Each of the nodes 2 from 11 to 14 includes the power input board 22, and the number of the power input points 34 of the first metal layer 31 of the backplane 3 is also equal to the power input board Corresponding to the number of 22. For example, when four nodes 2 correspond to three power supplies 4, only the node 2 with the power supply 4 will have the power input board 22, but the four nodes 2 will each contain four power outputs.板23. In addition, since each power input board 22 and each power output board 23 is a printed circuit board structure and can have different transmission layers, they can also be used to transmit various signals, for example, each power supply The communication signal generated by the supplier 4 and complying with the RPSU specification, but not limited to this.

舉例來說，採用先前技術中的一種寬度很窄的電源供應器的設置方式，即電源供應器4的寬度顯著小於該單位空間的寬度，並與節點設置於相同的水平高度上，此時，該節點的該主板在如圖2與圖3的中央處理器及記憶體的配置方式下，每一該主板僅能設置至多12個雙列直插式記憶體模組(Dual in-line memory module, DIMM)。然而，藉由本案將電源供應器設置於該等節點所設置的該等單位空間中，能夠使得每一該節點的該主板(如圖2與圖3)達到至多設置16個雙列直插式記憶體模組(DIMM)，而能更有效地利用機箱殼體內的空間。For example, a power supply arrangement with a narrow width in the prior art is adopted, that is, the width of the power supply 4 is significantly smaller than the width of the unit space, and is set at the same level as the node. In this case, The motherboard of the node is configured with the central processing unit and memory as shown in Figure 2 and Figure 3. Each motherboard can only be equipped with up to 12 dual in-line memory modules (Dual in-line memory module). , DIMM). However, by arranging the power supply in the unit spaces of the nodes in this case, the motherboard (as shown in Figure 2 and Figure 3) of each node can be equipped with at most 16 dual-in-line The memory module (DIMM) can make more effective use of the space in the case.

綜上所述，藉由多個(或一個)電源供應器設置於多個節點之其中部分者或全部者所設置的多個(或一個)單位空間中，再藉由該等電源輸入板、該背板、及該等電源輸出板將該等供應電源傳送至該等節點，且藉由該等電源輸入點、該等電源輸出點、及該等遠端輸出點的相對位置關係的設計，不但能夠不使用電纜線作為電力傳輸的媒介，更能夠有效地實現電源共享的目的。此外，由於該等電源供應器在該機箱殼體內並不是採用習知的獨立設計，而是整合於該等節點所設置的該等單位空間中，進而使得該等節點的該等主板能夠提供更多數量的記憶體設置，故確實能達成本發明的目的。In summary, multiple (or one) power supplies are provided in multiple (or one) unit spaces set by some or all of multiple nodes, and then through these power input boards, The backplane and the power output boards transmit the supply power to the nodes, and by designing the relative positional relationship of the power input points, the power output points, and the remote output points, Not only can it eliminate the use of cables as a medium for power transmission, but it can also effectively achieve the purpose of power sharing. In addition, because the power supplies are not designed independently in the chassis shell, but are integrated in the unit spaces provided by the nodes, so that the motherboards of the nodes can provide more A large number of memory settings can indeed achieve the purpose of the invention.

惟以上所述者，僅為本發明的實施例而已，當不能以此限定本發明實施的範圍，凡是依本發明申請專利範圍及專利說明書內容所作的簡單的等效變化與修飾，皆仍屬本發明專利涵蓋的範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to Within the scope covered by the patent of the present invention.

100:伺服器機櫃 1:機箱殼體 11~14:單位空間 2:節點 21:主板 22:電源輸入板 23:電源輸出板 24:風扇單元 3:背板 30:第一電路層 31:第一金屬層 32:主要電源輸入區域 33:導通孔 34:電源輸入點 35:電源輸出點 4:電源供應器 40:第二電路層 41:第二金屬層 42:主要電源輸出區域 43:遠端取樣點 91:中央處理器插槽 92:記憶體插槽 93:中央處理器 P:位置 D1:深度 D2:深度 H1:高度 H2:高度 W1:寬度 W2:寬度 Y:方向 A1~A4:區域 B1~B4:區域 100: server cabinet 1: Chassis shell 11~14: unit space 2: node 21: Motherboard 22: Power input board 23: Power output board 24: Fan unit 3: backplane 30: The first circuit layer 31: The first metal layer 32: Main power input area 33: Via 34: Power input point 35: Power output point 4: power supply 40: second circuit layer 41: second metal layer 42: Main power output area 43: remote sampling point 91: CPU socket 92: memory slot 93: Central Processing Unit P: location D1: depth D2: depth H1: height H2: height W1: width W2: width Y: direction A1~A4: area B1~B4: area

本發明的其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一立體圖，說明本發明伺服器機櫃的一實施例；圖2是一立體圖，說明該實施例的一單位空間、一節點、及一電源供應器；圖3是一俯視圖，說明該實施例的二節點、一背板、二電源供應器、及二風扇單元；圖4是一示意圖，說明該實施例的一背板；圖5是一示意圖，說明該實施例的該背板的一第一電路層；及圖6是一示意圖，說明該實施例的該背板的一第二電路層。Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: Figure 1 is a perspective view illustrating an embodiment of the server cabinet of the present invention; Figure 2 is a perspective view illustrating a unit space, a node, and a power supply of the embodiment; Figure 3 is a top view illustrating two nodes, one backplane, two power supplies, and two fan units of this embodiment; Figure 4 is a schematic diagram illustrating a backplane of the embodiment; FIG. 5 is a schematic diagram illustrating a first circuit layer of the backplane of the embodiment; and FIG. 6 is a schematic diagram illustrating a second circuit layer of the backplane of the embodiment.

2:節點 2: node

21:主板 21: Motherboard

22:電源輸入板 22: Power input board

23:電源輸出板 23: Power output board

3:背板 3: backplane

4:電源供應器 4: power supply

91:中央處理器插槽 91: CPU socket

92:記憶體插槽 92: memory slot

93:中央處理器 93: Central Processing Unit

Y:方向 Y: direction

Claims

一種伺服器機櫃，包含：一機箱殼體，包括多個單位空間；多個節點，每一該節點設置於該機箱殼體的該等單位空間之其中至少一者，且每一該節點包括一主板；一背板，設置於該機箱殼體內；多個電源供應器，每一該電源供應器設置於該等節點之其中不同者所設置的該至少一單位空間，且將一供應電源傳送至該背板，再以電源共享的方式傳送至該等節點，該背板包括：一第一金屬層，包含多個電源輸入點，以分別接收該等電源供應器的該等供應電源；一第二金屬層，包含多個電源輸出點，以將該等供應電源共享後所形成的一共享輸出電源輸出至該等節點；及多個導通孔，與該第一金屬層及該第二金屬層電連接，以傳送該等供應電源所形成的該共享輸出電源，該等導通孔以鄰近該第一金屬層的該等電源輸入點的幾何中心來設置。 A server cabinet includes: a chassis housing including a plurality of unit spaces; a plurality of nodes, each node is arranged in at least one of the unit spaces of the chassis housing, and each node includes a Motherboard; a backplane arranged in the chassis shell; a plurality of power supplies, each of the power supplies is arranged in the at least one unit space provided by a different one of the nodes, and a supply power is transmitted to The backplane is then transmitted to the nodes in a power sharing manner. The backplane includes: a first metal layer including a plurality of power input points to respectively receive the power supplies from the power supplies; Two metal layers, including a plurality of power output points, to output a shared output power formed after the power supply is shared to the nodes; and a plurality of vias, and the first metal layer and the second metal layer The electric connection is used to transmit the shared output power formed by the power supply, and the through holes are arranged at the geometric center of the power input points adjacent to the first metal layer.

如請求項1所述的伺服器機櫃，其中，每一該單位空間的高度是1U，1U等於1.75英吋，每一該單位空間的寬度是一最大寬度的M分之一，M是正整數，該最大寬度相關於該機箱殼體的寬度，每一該單位空間的深度相關於該機箱殼體的深度。 The server cabinet according to claim 1, wherein the height of each unit space is 1U, and 1U is equal to 1.75 inches, the width of each unit space is one M part of a maximum width, and M is a positive integer, The maximum width is related to the width of the chassis shell, and the depth of each unit space is related to the depth of the chassis shell.

如請求項1所述的伺服器機櫃，其中，該等導通孔的數量乘以每一該導通孔所能傳送的一電流臨界值大於等於該等導通孔所能提供的一最大負載電流。 The server cabinet according to claim 1, wherein the number of the vias Multiplying by a current critical value that each of the vias can deliver is greater than or equal to a maximum load current that the vias can provide.

如請求項1所述的伺服器機櫃，其中，與該等電源供應器設置於不同的該至少一單位空間的該等節點之其中每一者還包括一電源輸入板，該等節點之其中每一者還包括一電源輸出板，每一該節點所包括的該電源輸入板及該電源輸出板分別固定於該機箱殼體，該電源輸入板包含一第一傳輸層，以將與該節點設置在相同的該至少一單位空間的該電源供應器所提供的該供應電源傳送至該背板的該第一金屬層的對應的該電源輸入點，該電源輸出板包含一第二傳輸層，以將該等供應電源共享後所形成的該共享輸出電源經由該背板的該第二金屬層的對應的該電源輸出點傳送至該等節點。 The server cabinet according to claim 1, wherein each of the nodes arranged in the at least one unit space different from the power supplies further includes a power input board, and each of the nodes One also includes a power output board, the power input board and the power output board included in each node are respectively fixed to the chassis shell, and the power input board includes a first transmission layer to be set with the node The supply power provided by the power supply in the same at least one unit space is transmitted to the corresponding power input point of the first metal layer of the backplane, and the power output board includes a second transmission layer to The shared output power formed after the supply power is shared is transmitted to the nodes through the corresponding power output point of the second metal layer of the backplane.

如請求項4所述的伺服器機櫃，其中，該背板、該等主板、該等電源輸入板、及該等電源輸出板都是一種印刷電路板(Printed circuit board,PCB)。 The server cabinet according to claim 4, wherein the backplane, the main boards, the power input boards, and the power output boards are all a printed circuit board (PCB).

如請求項1所述的伺服器機櫃，其中，該等電源供應器支援RPSU(Redundant power supplies unit)規範。 The server cabinet according to claim 1, wherein the power supplies support RPSU (Redundant power supplies unit) specifications.

如請求項1所述的伺服器機櫃，其中，該等導通孔是以該第一金屬層的該等電源輸入點的幾何中心為中心而對稱地設置。 The server cabinet according to claim 1, wherein the through holes are symmetrically arranged with the geometric center of the power input points of the first metal layer as the center.

如請求項1所述的伺服器機櫃，其中，該第二金屬層還包含一遠端取樣點，該遠端取樣點以鄰近該第二金屬層的該等電源輸出點的幾何中心來設置，該遠端取樣點將一電壓值傳送至該等電源供應器。 The server cabinet according to claim 1, wherein the second metal layer further includes a remote sampling point, and the remote sampling point is set at a geometric center of the power output points adjacent to the second metal layer, The remote sampling point will be a voltage The value is sent to these power supplies.

如請求項1所述的伺服器機櫃，其中，該第一金屬層還包含一電連接該等電源輸入點及該等導通孔的主要電源輸入區域，該第二金屬層還包含一電連接該等電源輸出點及該等導通孔的主要電源輸出區域，藉由該主要電源輸入區域及該主要電源輸出區域之其中至少一者，以共享該等供應電源並形成該共享輸出電源。 The server cabinet according to claim 1, wherein the first metal layer further includes a main power input area electrically connected to the power input points and the through holes, and the second metal layer further includes an electrical connection to the At least one of the main power input area and the main power output area is used to share the power supply and form the shared output power source with equal power output points and the main power output areas of the through holes.