TWI737906B - Heat conductive sleeve structure - Google Patents

Heat conductive sleeve structure Download PDF

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Publication number
TWI737906B
TWI737906B TW107111890A TW107111890A TWI737906B TW I737906 B TWI737906 B TW I737906B TW 107111890 A TW107111890 A TW 107111890A TW 107111890 A TW107111890 A TW 107111890A TW I737906 B TWI737906 B TW I737906B
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Taiwan
Prior art keywords
sleeve
heat pipe
heat
heat conduction
item
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TW107111890A
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Chinese (zh)
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TW201942533A (en
Inventor
廖邦宏
江文雄
曾國峰
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尼得科超眾科技股份有限公司
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Priority to TW107111890A priority Critical patent/TWI737906B/en
Priority to CN201910074847.7A priority patent/CN110351976B/en
Priority to US16/354,788 priority patent/US20190301813A1/en
Publication of TW201942533A publication Critical patent/TW201942533A/en
Application granted granted Critical
Publication of TWI737906B publication Critical patent/TWI737906B/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Joints Allowing Movement (AREA)

Abstract

A heat conductive sleeve structure including a heat transfer element, a sleeve, and a heat pipe is provided in the present disclosure. The heat transfer element includes a working portion and a sleeving portion, and a matching hole for fixing the sleeve is provided in the sleeving portion. An end of the heat pipe is movably disposed in the sleeve and the other end of the heat pipe protrudes from the sleeve. The heat pipe is inserted in one end of the sleeve and is thereby axially movable in the sleeve and rotatable related to the heat transfer element about the sleeve.

Description

套筒式熱傳導結構 Sleeve heat conduction structure

本發明係與一種熱傳元件有關，尤指一種套筒式熱傳導結構。 The invention relates to a heat transfer element, especially a sleeve type heat transfer structure.

按，由於熱管(Heat Pipe)具有高熱傳能力、重量輕及結構簡單等特性，並可傳遞大量的熱量又不消耗電力，故現今已被廣泛地應用於各式3C產品上作為散熱的必備元件之一。另外，透過上述熱管與均溫板(Vapor Chamber)或平板熱管(Plate Heat Pipe)的結合，也是目前現有技術中用於散熱上的常見技術手段。 According to the fact that heat pipe has the characteristics of high heat transfer capacity, light weight and simple structure, and can transfer a large amount of heat without consuming power, it has been widely used in various 3C products as an essential component for heat dissipation. one. In addition, the combination of the above-mentioned heat pipe and the Vapor Chamber or the Plate Heat Pipe is also a common technical means for heat dissipation in the current prior art.

然而，現有技術中，為了配合不同的3C產品，熱管或均溫板、平板熱管在實際應用上，往往也需視情況經過彎製、或延伸其長度等，因此在生產化必須客製化，也因此容易造成料件間不通用而有庫存等問題。 However, in the prior art, in order to match different 3C products, heat pipes, uniform temperature plates, and flat heat pipes often need to be bent or extended in length depending on the actual application. Therefore, they must be customized in production. Therefore, it is easy to cause problems such as non-universal of materials and inventory.

有鑑於此，本發明人係為改善並解決上述之缺失，乃特潛心研究並配合學理之運用，終於提出一種設計合理且有效改善上述缺失之本發明。 In view of this, in order to improve and solve the above-mentioned shortcomings, the inventor of the present invention made great efforts to research and cooperate with the application of scientific theory, and finally proposed an invention with reasonable design and effective improvement of the above-mentioned shortcomings.

本發明之主要目的，在於可提供一種套筒式熱傳導結構，其係採活動設置方式，使各式熱傳元件在與熱管的配合上能更加靈活，進而能應用於更多不同需求的場合上，以降低料件庫存等問題。 The main purpose of the present invention is to provide a sleeve-type heat conduction structure, which adopts a movable setting mode, so that various heat transfer elements can be more flexible in cooperation with heat pipes, and can be applied to more occasions with different needs. , In order to reduce material inventory and other issues.

為了達成上述之目的，本發明係提供一種套筒式熱傳導結構，包括一熱傳元件、一套筒、以及一熱管；熱傳元件具有一工作部與一套接部，且套接部內設有一配合孔，以供套筒固設於配合孔內，而熱管之一端係活動設置於套筒內，並使熱管之另一端突出於套筒外；其中，熱管套入套筒內之一端係能沿著套筒軸向於套筒內滑動，且熱管能依套筒而與熱傳元件作相對轉動。 In order to achieve the above objective, the present invention provides a sleeve-type heat conduction structure, including a heat transfer element, a sleeve, and a heat pipe; the heat transfer element has a working part and a socket part, and the socket part is provided with There is a matching hole for the sleeve to be fixed in the matching hole, and one end of the heat pipe is movably arranged in the sleeve, and the other end of the heat pipe protrudes out of the sleeve; wherein, one end of the heat pipe is sleeved in the sleeve It can slide in the sleeve along the axial direction of the sleeve, and the heat pipe can rotate relative to the heat transfer element according to the sleeve.

<本發明> <The present invention>

1:熱傳元件 1: Heat transfer element

10:工作部 10: Work Department

11:套接部 11: Socket

110:配合孔 110: Mating hole

3:套筒 3: sleeve

2:熱管 2: heat pipe

圖1係本發明之立體分解示意圖。 Figure 1 is a three-dimensional exploded schematic view of the present invention.

圖2係本發明之立體組合示意圖。 Figure 2 is a schematic diagram of the three-dimensional assembly of the present invention.

圖3係本發明之局部剖面示意圖。 Figure 3 is a schematic partial cross-sectional view of the present invention.

圖4係本發明另一實施例之立體分解示意圖。 Fig. 4 is a three-dimensional exploded schematic view of another embodiment of the present invention.

為了使 貴審查委員能更進一步瞭解本發明之特徵及技術內容，請參閱以下有關本發明之詳細說明與附圖，然而所附圖式僅提供參考與說明用，並非用來對本發明加以限制者。 In order to enable your reviewer to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the accompanying drawings are only for reference and illustration, and are not used to limit the present invention. .

請參閱圖1及圖2，係分別為本發明之立體分解示意圖及立體組合示意圖。本發明係提供一種套筒式熱傳導結構，包括一熱傳元件1、一套筒3、以及一熱管2；其中： 該熱傳元件1可為一內部能產生相變化的熱管(Heat Pipe)、均溫板(Vapor Chamber)、或平板熱管(Plate Heat Pipe)。其主要係由銅或不鏽鋼等金屬材質製成，並具有一工作部10與一套接部11；而在本實施例中，所述熱傳元件1係為一熱管，並為一長條管狀體，且該熱傳元件1呈管狀的一端為前述工作部10、另一端為前述套接部11，所述工作部10可呈一扁平狀而便於貼接在如電子發熱元件等熱源(圖略)上，當然亦可視實際需求而呈彎曲狀、或前述扁平狀與彎曲狀二者之組合等，且所述工作部10內呈真空而封存有工作流體(圖略)，並於內壁上貼附有毛細組織(圖略)，以使所述工作部10內部能產生相變化而提供熱傳效果。 Please refer to FIG. 1 and FIG. 2, which are respectively a three-dimensional exploded schematic diagram and a three-dimensional assembly schematic diagram of the present invention. The present invention provides a sleeve-type heat conduction structure, which includes a heat transfer element 1, a sleeve 3, and a heat pipe 2; wherein: The heat transfer element 1 can be a heat pipe (Heat Pipe), a vapor chamber (Vapor Chamber), or a plate heat pipe (Plate Heat Pipe) that can produce phase changes inside. It is mainly made of metal materials such as copper or stainless steel, and has a working part 10 and a socket 11; and in this embodiment, the heat transfer element 1 is a heat pipe and is a long tube One end of the heat transfer element 1 is the aforementioned working part 10, and the other end is the aforementioned socket part 11. The working part 10 can be in a flat shape so as to be easily attached to a heat source such as an electronic heating element (Figure (Omitted) above, of course, depending on actual needs, it can be curved, or a combination of the aforementioned flat shape and curved shape, etc., and the working part 10 is vacuumed to seal the working fluid (the figure is omitted), and the inner wall Capillary tissue (not shown in the figure) is attached to the top to enable the internal phase change of the working part 10 to provide a heat transfer effect.

請一併參閱圖3所示，本發明主要係於上述熱傳元件1上設有一所述套接部11，該套接部11可沿著工作部10軸向延伸而一體成型，並於該套接部11端面向內凹設有一沿其軸向延伸的配合孔110，所述配合孔110即用以供上述套筒3固設於內後，再供上述熱管2之任一端活動設置於該套筒3內，所謂活動設置係指熱管2之任一端套入該套筒3內後，能沿著軸向於該套筒3內滑動而調整熱管2突出於套筒3外的部位長度，同時，熱管2也能依該套筒3而與該熱傳元件1作相對的轉動。此外，該套筒3可為銅、鋁合金或不銹鋼等金屬材質製成，其係可為熱管、均溫板或平板熱管腔體結構內之一部分，而該套筒3與熱管2間亦可塗佈有導熱膏(圖略)作為潤滑與增加彼此間導熱性。 Please also refer to Figure 3, the present invention is mainly based on the heat transfer element 1 provided with a socket 11, the socket 11 can extend along the axial direction of the working part 10 to be integrally formed, and in the The end face of the socket portion 11 is recessed with a matching hole 110 extending along its axial direction. The matching hole 110 is used for fixing the sleeve 3 inside, and then allowing either end of the heat pipe 2 to be movably set in In the sleeve 3, the so-called movable setting means that after either end of the heat pipe 2 is sleeved in the sleeve 3, it can slide in the sleeve 3 along the axial direction to adjust the length of the part of the heat pipe 2 protruding outside the sleeve 3 At the same time, the heat pipe 2 can also rotate relative to the heat transfer element 1 according to the sleeve 3. In addition, the sleeve 3 can be made of metal materials such as copper, aluminum alloy, or stainless steel. It can be a part of the cavity structure of a heat pipe, a uniform temperature plate or a flat heat pipe. Can be coated with thermal paste (not shown) as lubrication and increase thermal conductivity between each other.

再者，如圖4所示，係為本發明另一實施例之立體分解示意圖。其中，所述熱傳元件1係為一均溫板或平板熱管，並通過上述套筒3而與熱管2活動設置，使得熱管2也能靈活地與均溫板或平板熱管相結合，進而達到可適 應不同場合而靈活可變的廣泛應用。此外，該熱傳元件1上亦可設有一以上之所述套筒3、以及複數分別相互配合於所述套筒3內之熱管2。 Furthermore, as shown in FIG. 4, it is a three-dimensional exploded schematic diagram of another embodiment of the present invention. Wherein, the heat transfer element 1 is a uniform temperature plate or flat heat pipe, and is movably arranged with the heat pipe 2 through the sleeve 3, so that the heat pipe 2 can also be flexibly combined with the uniform temperature plate or flat heat pipe to achieve Adaptable It should be widely used in different occasions and flexibly. In addition, the heat transfer element 1 can also be provided with more than one sleeve 3 and a plurality of heat pipes 2 that are matched with each other in the sleeve 3.

是以，藉由上述之構造組成，即可得到本發明套筒式熱傳導結構。 Therefore, the sleeve-type heat conduction structure of the present invention can be obtained by the above-mentioned structure composition.

因此，藉由本發明套筒式熱傳導結構，由於係透過所述套筒3將熱管2與熱傳元件1以活動設置方式相結合，如此不僅可維持熱管2、熱傳元件1為了薄化而使其壁厚較薄、不需為了增設結合結構而加厚等外，同時透過套筒3也能替換所需規格的熱管2，大大增加了熱傳元件在應用場合上的靈活性，藉以降低料件庫存等問題。 Therefore, with the sleeve-type heat conduction structure of the present invention, since the heat pipe 2 and the heat transfer element 1 are combined in a movable arrangement through the sleeve 3, not only can the heat pipe 2 and the heat transfer element 1 be made thinner. The wall thickness is relatively thin, and there is no need to increase the bonding structure. At the same time, the heat pipe 2 of the required specification can be replaced through the sleeve 3, which greatly increases the flexibility of the heat transfer element in the application situation, thereby reducing the material Item inventory and other issues.

綜上所述，本發明確可達到預期之使用目的，而解決習知之缺失，又因極具新穎性及進步性，完全符合發明專利申請要件，爰依專利法提出申請，敬請詳查並賜准本案專利，以保障發明人之權利。 In summary, this invention clearly achieves the intended purpose of use, and solves the deficiencies of conventional knowledge, and because of its novelty and advancement, it fully meets the requirements of an invention patent application. The application is filed in accordance with the Patent Law. Please check and verify in detail. Grant the patent in this case to protect the rights of the inventor.

惟以上所述僅為本發明之較佳可行實施例，非因此即拘限本發明之專利範圍，故舉凡運用本發明說明書及圖式內容所為之等效技術、手段等變化，均同理皆包含於本發明之範圍內，合予陳明。 However, the above descriptions are only the preferred and feasible embodiments of the present invention, and the scope of the patent of the present invention is not limited thereby. Therefore, all equivalent technologies, means and other changes made by using the description and drawings of the present invention are the same. It is included in the scope of the present invention, and is fully disclosed.

1:熱傳元件 1: Heat transfer element

10:工作部 10: Work Department

11:套接部 11: Socket

110:配合孔 110: Mating hole

3:套筒 3: sleeve

2:熱管 2: heat pipe

Claims (8)

一種套筒式熱傳導結構，包括：一熱傳元件，具有一工作部與一套接部，且該套接部內設有一配合孔；一套筒，固設於該配合孔內；以及一熱管，該熱管之一端係活動設置於該套筒內，並使該熱管之另一端突出於該套筒外；其中，該熱管套入該套筒內之該端係能沿著該套筒軸向於該套筒內滑動，且該熱管能依該套筒而與該熱傳元件作相對轉動。 A sleeve type heat conduction structure includes: a heat transfer element having a working part and a socket part, and the socket part is provided with a matching hole; a sleeve fixed in the matching hole; and a heat pipe , One end of the heat pipe is movably arranged in the sleeve, and the other end of the heat pipe protrudes out of the sleeve; wherein, the end of the heat pipe sleeved in the sleeve can be along the axial direction of the sleeve Sliding in the sleeve, and the heat pipe can rotate relative to the heat transfer element according to the sleeve. 如申請專利範圍第1項所述之套筒式熱傳導結構，其中該熱傳元件係為熱管、均溫板、或平板熱管。 In the sleeve type heat conduction structure described in item 1 of the scope of patent application, the heat conduction element is a heat pipe, a uniform temperature plate, or a flat heat pipe. 如申請專利範圍第1項所述之套筒式熱傳導結構，其中該熱傳元件係為一熱管，且該熱傳元件一端為所述工作部、另一端為所述套接部。 According to the sleeve-type heat conduction structure described in item 1 of the scope of patent application, the heat conduction element is a heat pipe, and one end of the heat conduction element is the working part and the other end is the socket part. 如申請專利範圍第3項所述之套筒式熱傳導結構，其中該工作部係呈一扁平狀、一彎曲狀、或所述扁平狀與所述彎曲狀之組合。 According to the sleeve-type heat conduction structure described in item 3 of the scope of patent application, the working part is in a flat shape, a curved shape, or a combination of the flat shape and the curved shape. 如申請專利範圍第3項所述之套筒式熱傳導結構，其中該配合孔係由該套接部端面向內凹入而形成者。 In the sleeve-type heat conduction structure described in item 3 of the scope of patent application, the mating hole is formed by recessing the end surface of the socket part inward. 如申請專利範圍第1項所述之套筒式熱傳導結構，其中該套筒係為銅、鋁合金或不銹鋼之金屬材質製成。 The sleeve type heat conduction structure as described in item 1 of the scope of patent application, wherein the sleeve is made of copper, aluminum alloy or stainless steel. 如申請專利範圍第1項所述之套筒式熱傳導結構，其中該套筒與該熱管間係塗佈有導熱膏。 According to the sleeve type heat conduction structure described in item 1 of the scope of patent application, a thermal conductive paste is coated between the sleeve and the heat pipe. 如申請專利範圍第1項所述之套筒式熱傳導結構，其中該熱傳元件係具有複數所述套筒、以及複數分別相互配合於該等套筒內之所述熱管。 According to the sleeve type heat conduction structure described in item 1 of the scope of the patent application, the heat transmission element has a plurality of the sleeves and a plurality of the heat pipes respectively matched with each other in the sleeves.
TW107111890A 2018-04-03 2018-04-03 Heat conductive sleeve structure TWI737906B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW107111890A TWI737906B (en) 2018-04-03 2018-04-03 Heat conductive sleeve structure
CN201910074847.7A CN110351976B (en) 2018-04-03 2019-01-25 Sleeve type heat conduction structure
US16/354,788 US20190301813A1 (en) 2018-04-03 2019-03-15 Sleeve-type heat conducting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107111890A TWI737906B (en) 2018-04-03 2018-04-03 Heat conductive sleeve structure

Publications (2)

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