TWI736167B - Ways to improve the temperature uniformity of plastics - Google Patents
Ways to improve the temperature uniformity of plastics Download PDFInfo
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- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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Abstract
本發明提供一種提升塑膠均溫性的方法，其係包含：步驟(A)，提供一塑膠基材，且該塑膠基材具有一接觸面；步驟(B)，提供一石墨烯紙，且該石墨烯紙係用於與一熱源直接接觸或間接接觸；步驟(C)，將該石墨烯紙置放於該接觸面。藉由將本發明之提升塑膠均溫性的方法，能夠提升塑膠的均溫性，使得塑膠能夠達到接近於金屬材料的散熱性，進而能夠提供更佳的散熱方案。 The present invention provides a method for improving the temperature uniformity of plastic, which includes: step (A), providing a plastic substrate, and the plastic substrate has a contact surface; step (B), providing a graphene paper, and the The graphene paper is used for direct contact or indirect contact with a heat source; step (C), the graphene paper is placed on the contact surface. By using the method of improving the temperature uniformity of the plastic of the present invention, the temperature uniformity of the plastic can be improved, so that the plastic can achieve a heat dissipation performance close to that of a metal material, thereby providing a better heat dissipation solution.
Description
本發明係有關於一種提升塑膠均溫性的方法。 The present invention relates to a method for improving the temperature uniformity of plastics.
一直以來，因為金屬材料有優良的導熱度，故被作為常用的散熱材料；然而，金屬材料卻有重量大、形狀複雜之成品不易製造及成本較高等缺點，且在網通領域，金屬材料的外殼亦具有影響天線訊號之缺點。因此，金屬材料已無法滿足某些電子散熱產品的使用要求。 For a long time, metal materials have been used as a common heat dissipation material because of their excellent thermal conductivity. However, metal materials have the disadvantages of heavy weight, complex shapes, difficult to manufacture finished products, and high cost. In the field of Netcom, metal shells It also has the disadvantage of affecting the antenna signal. Therefore, metal materials can no longer meet the requirements of certain electronic heat dissipation products.
又，在電子散熱產品被要求不可使用金屬材料來製作的情況下，通常會使用塑膠來製作。然而，因為塑膠的散熱效果不佳，使得電子散熱產品所使用之塑膠元件難以有效地滿足電子散熱產品內部的散熱需求。 In addition, when electronic heat dissipation products are required not to be made of metal materials, they are usually made of plastic. However, because of the poor heat dissipation effect of plastic, it is difficult for the plastic components used in electronic heat dissipation products to effectively meet the internal heat dissipation requirements of the electronic heat dissipation products.
因此，有人提出了一種導熱塑膠，其係藉由在塑膠中添加金屬粉或陶瓷粉，以提升散熱效果。 Therefore, some people have proposed a thermally conductive plastic, which improves the heat dissipation effect by adding metal powder or ceramic powder to the plastic.
然而，雖然導熱塑膠具有較一般塑膠還佳的導熱性，但習知導熱塑膠之熱源接觸面的XY軸向的均溫效果仍不佳，導致熱點容易集中於特定位置積熱，故有因為散熱不佳而使電子產品因過熱導致損壞的疑慮。 However, although thermally conductive plastics have better thermal conductivity than general plastics, the XY-axis temperature equalization effect of the heat source contact surface of conventional thermally conductive plastics is still not good, causing hot spots to easily concentrate on specific locations and accumulate heat, which is due to heat dissipation. Worry about damage to electronic products due to overheating due to poor performance.
有鑑於此，本案發明人們針對提升塑膠均溫性的方法進行研究，發現了一種提升塑膠均溫性的方法，其能夠提升塑膠的均溫性，進而能夠提供更佳的散熱方案。藉由使用本發明之提升塑膠均溫性的方法，透過石墨烯紙的 導熱特性，能夠提升塑膠的均溫性，使得塑膠能夠達到接近於金屬材料的散熱性。 In view of this, the inventors of the present case conducted research on the method of improving the temperature uniformity of the plastic, and found a method to improve the temperature uniformity of the plastic, which can improve the temperature uniformity of the plastic, and thus can provide a better heat dissipation solution. By using the method of improving the temperature uniformity of the plastics of the present invention, through the graphene paper The thermal conductivity can improve the temperature uniformity of the plastic, so that the plastic can achieve heat dissipation close to that of metal materials.
為達上述目的及其他目的，本發明係提供一種提升塑膠均溫性的方法，其係包含：步驟(A)，提供一塑膠基材，且該塑膠基材具有一接觸面；步驟(B)，提供一石墨烯紙，且該石墨烯紙係用於與一熱源直接接觸或間接接觸；步驟(C)，將該石墨烯紙置放於該接觸面。 In order to achieve the above and other objectives, the present invention provides a method for improving the temperature uniformity of plastic, which includes: step (A), providing a plastic substrate, and the plastic substrate has a contact surface; step (B) , Providing a graphene paper, and the graphene paper is used to directly or indirectly contact a heat source; step (C), placing the graphene paper on the contact surface.
在一實施例中，該石墨烯紙的厚度與該塑膠基材的厚度之比值為1比3~300。 In one embodiment, the ratio of the thickness of the graphene paper to the thickness of the plastic substrate is 1 to 3 to 300.
在一實施例中，該石墨烯紙的厚度與該塑膠基材的厚度之比值為1比3~20。 In one embodiment, the ratio of the thickness of the graphene paper to the thickness of the plastic substrate is 1 to 3-20.
在一實施例中，於步驟(C)中，藉由黏貼方式，以將該石墨烯紙置放於該接觸面。 In one embodiment, in step (C), the graphene paper is placed on the contact surface by pasting.
在一實施例中，於步驟(C)中，藉由包射射出方式，形成嵌入有該石墨烯紙的塑膠基材，且該石墨烯紙置放於該接觸面，並露出於該接觸面中的與該熱源接觸之位置。 In one embodiment, in step (C), a plastic substrate embedded with the graphene paper is formed by the injection molding method, and the graphene paper is placed on the contact surface and exposed on the contact surface The position in contact with the heat source.
在一實施例中，該塑膠基材為塑膠散熱片。 In one embodiment, the plastic substrate is a plastic heat sink.
在一實施例中，該塑膠基材為塑膠外殼。 In one embodiment, the plastic substrate is a plastic shell.
在一實施例中，該塑膠基材為塑膠背板。 In one embodiment, the plastic substrate is a plastic backplane.
在一實施例中，該石墨烯紙的面積係大於該熱源的與該石墨烯紙接觸之面的面積。 In one embodiment, the area of the graphene paper is larger than the area of the surface of the heat source that is in contact with the graphene paper.
綜上所述，本發明之提升塑膠均溫性的方法，能夠提升塑膠的均溫性，使得塑膠能夠達到接近於金屬材料的散熱性，進而能夠提供更佳的散熱方案。 In summary, the method for improving the temperature uniformity of the plastic of the present invention can improve the temperature uniformity of the plastic, so that the plastic can achieve a heat dissipation performance close to that of a metal material, thereby providing a better heat dissipation solution.
1:塑膠基材 1: Plastic substrate
2:石墨烯紙 2: Graphene paper
3:背膠 3: Adhesive
4:熱源 4: heat source
10:塑膠原料 10: Plastic raw materials
11:接觸面 11: Contact surface
100:散熱片 100: heat sink
[圖1]係本發明一實施例之流程圖。 [Figure 1] is a flowchart of an embodiment of the present invention.
[圖2]係本發明一較佳實施例中使用黏貼方式製作散熱片之示意圖。 [Figure 2] is a schematic diagram of a heat sink made by pasting in a preferred embodiment of the present invention.
[圖3]的(A)係使用包射射出方式製作散熱片之示意圖；(B)係包射射出後散熱片的縱向剖面之示意圖。 [Fig. 3] (A) is a schematic diagram of the heat sink produced by the package injection method; (B) is a schematic diagram of the longitudinal section of the heat sink after the package is injected.
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：首先，針對本發明一實施例之提升塑膠均溫性的方法(以下亦簡稱為本發明方法)進行說明。 In order to fully understand the purpose, features and effects of the present invention, the following specific embodiments are used in conjunction with the accompanying drawings to give a detailed description of the present invention. The description is as follows: First of all, regarding an embodiment of the present invention The method for improving the temperature uniformity of the plastic (hereinafter also referred to as the method of the present invention) will be described.
請參照圖1，本發明方法係包含：步驟(A)，提供一塑膠基材，且該塑膠基材具有一接觸面；步驟(B)，提供一石墨烯紙，且該石墨烯紙係用於與一熱源直接接觸或間接接觸；步驟(C)，將該石墨烯紙置放於該接觸面。 1, the method of the present invention includes: step (A), providing a plastic substrate, and the plastic substrate has a contact surface; step (B), providing a graphene paper, and the graphene paper is used In direct contact or indirect contact with a heat source; step (C), placing the graphene paper on the contact surface.
又，步驟(A)之塑膠基材的材質可為一般習知的塑膠，例如PP塑膠、ABS塑膠、PE塑膠、PVC塑膠、PC塑膠、FR4塑膠、POM塑膠、PET塑膠PA塑膠、PS塑膠等，並未特別限制。在一實施例中，塑膠基材的材質也可以為導熱塑膠，例如今展公司製的導熱塑膠K1、導熱塑膠K4.5。 In addition, the material of the plastic substrate in step (A) can be commonly known plastics, such as PP plastic, ABS plastic, PE plastic, PVC plastic, PC plastic, FR4 plastic, POM plastic, PET plastic, PA plastic, PS plastic, etc. , There is no special restriction. In one embodiment, the material of the plastic substrate can also be a thermally conductive plastic, such as thermally conductive plastic K1 and thermally conductive plastic K4.5 manufactured by the company.
又，前述塑膠基材可被製為電子用品或3C產品的散熱片、外殼及背板等等，並未特別限制。又，前述塑膠基材的厚度可為0.3mm~45mm，較佳係0.5mm~40mm，並未特別限制。在一實施例中，塑膠基材可為塑膠散熱片。在另一實施例中，該塑膠基材為塑膠外殼。在又一實施例中，該塑膠基材為塑膠背板。此外，在一較佳實施例中，藉由本發明方法所獲得之散熱片可為鰭片狀、 柱狀或任何可增加散熱面積的形式。以鰭片狀為例，前述鰭片狀散熱片係可從垂直於塑膠外殼平面的方向自塑膠外殼延伸。又，藉由本發明方法所獲得之散熱片可與塑膠基材一體成形。 In addition, the aforementioned plastic substrates can be made into heat sinks, shells, backplanes, etc. of electronic appliances or 3C products, and there is no particular limitation. In addition, the thickness of the aforementioned plastic substrate can be 0.3 mm to 45 mm, preferably 0.5 mm to 40 mm, and is not particularly limited. In one embodiment, the plastic substrate may be a plastic heat sink. In another embodiment, the plastic substrate is a plastic shell. In another embodiment, the plastic substrate is a plastic backplane. In addition, in a preferred embodiment, the heat sink obtained by the method of the present invention may be fin-shaped, Columnar or any form that can increase the heat dissipation area. Taking the fin shape as an example, the aforementioned fin-shaped heat sink may extend from the plastic casing in a direction perpendicular to the plane of the plastic casing. In addition, the heat sink obtained by the method of the present invention can be integrally formed with the plastic substrate.
接著，如圖1所示，於步驟(B)中提供一石墨烯紙，且該石墨烯紙係用於與一熱源直接接觸或間接接觸。前述石墨烯紙可為今展公司製的150μm石墨烯紙。前述石墨烯紙可使用習知的石墨烯紙，並未特別限定。又，石墨烯紙的厚度係可搭配塑膠基材的厚度，使兩者的厚度成為特定比例，並未特別限定。 Next, as shown in FIG. 1, in step (B), a graphene paper is provided, and the graphene paper is used for direct contact or indirect contact with a heat source. The aforementioned graphene paper may be 150 μm graphene paper manufactured by Konzhan. As the aforementioned graphene paper, conventional graphene paper can be used, and it is not particularly limited. In addition, the thickness of the graphene paper can be matched with the thickness of the plastic substrate so that the thickness of the two becomes a specific ratio, and it is not particularly limited.
再者，石墨烯紙的厚度與塑膠基材的厚度之比值可為1比3~300。在一較佳實施例中，石墨烯紙的厚度與塑膠基材的厚度之比值為1比3~20。在一最佳實施例中，石墨烯紙的厚度與塑膠基材的厚度之比值為1比20。舉例來說，當塑膠基材的厚度為0.5mm時，較佳係使用厚度為25~150μm的石墨烯紙。藉由使石墨烯紙的厚度與塑膠基材的厚度之比值在上述範圍內，更能夠達成提升塑膠均溫性之效果。 Furthermore, the ratio of the thickness of the graphene paper to the thickness of the plastic substrate can be 1:3~300. In a preferred embodiment, the ratio of the thickness of the graphene paper to the thickness of the plastic substrate is 1 to 3-20. In a preferred embodiment, the ratio of the thickness of the graphene paper to the thickness of the plastic substrate is 1:20. For example, when the thickness of the plastic substrate is 0.5 mm, it is preferable to use graphene paper with a thickness of 25 to 150 μm. By making the ratio of the thickness of the graphene paper to the thickness of the plastic substrate within the above range, the effect of improving the temperature uniformity of the plastic can be more achieved.
接著，在步驟(C)中，將石墨烯紙置放於塑膠基材的接觸面。此處所謂「置放」係至少包含從塑膠基材的外部置放石墨烯紙以及從塑膠基材的內部置放石墨烯紙兩種方式，詳細內容將參照圖2~3並於以下進行說明。 Next, in step (C), the graphene paper is placed on the contact surface of the plastic substrate. The so-called "placement" here includes at least two ways of placing graphene paper from the outside of the plastic substrate and placing graphene paper from the inside of the plastic substrate. The details will refer to Figures 2 to 3 and will be described below. .
就從塑膠基材的外部置放石墨烯紙的方法而言，可例如為黏貼方式及其等效方式。接著，請參照圖2，圖2係使用黏貼方式製作散熱片之示意圖。 As far as the method of placing the graphene paper from the outside of the plastic substrate is concerned, it may be, for example, a pasting method and its equivalent method. Next, please refer to Figure 2. Figure 2 is a schematic diagram of the heat sink produced by the pasting method.
如圖2所示，準備前述步驟(A)的塑膠基材1，接著藉由背膠3等黏著劑，將前述步驟(B)的石墨烯紙2黏貼於塑膠基材1之接觸面11，以形成散熱片100。此處，就背膠3(或其他黏著劑)的選擇而言，並未特別限制，可例如為PVC背膠。
As shown in Fig. 2, the plastic substrate 1 of the aforementioned step (A) is prepared, and then the
又，就從塑膠基材的內部置放石墨烯紙的方法而言，可例如為包射射出方式及其等效方式。接著，請參照圖3，圖3A係使用包射射出方式製作散熱片之示意圖；圖3B係包射射出後散熱片的縱向剖面之示意圖。 In addition, the method of placing graphene paper from the inside of the plastic substrate can be, for example, a package injection method and its equivalent method. Next, please refer to FIG. 3. FIG. 3A is a schematic diagram of the heat sink produced by the package injection method; FIG. 3B is a schematic diagram of the longitudinal section of the heat sink after the package injection is injected.
如圖3A所示，首先，將前述步驟(B)的石墨烯紙2放置於模具(未圖示)內，接著準備步驟(A)的塑膠基材之塑膠原料10並將其填入模具中，此時，填入之塑膠原料10包覆該石墨烯紙2。然後，再以使石墨烯紙2貼近並被置放於成型後塑膠基材1的接觸面11之方式，藉由包射射出方式將嵌入(包覆)有石墨烯紙的塑膠基材1射出成形，以形成散熱片。藉此，即使在塑膠基材的表面存在著肋條(或是表面不均勻)的情況下，相較於黏貼方式，包射射出方式也能夠使石墨烯紙均勻地置放於接觸面。
As shown in FIG. 3A, first, the
接著，如圖3B所示，在包射射出後散熱片的縱向剖面中，石墨烯紙2被置放於貼近接觸面11的位置。然後，於嵌入有石墨烯紙2的前述接觸面11中的與熱源4接觸之位置開孔，使石墨烯紙2露出於該接觸面11中的與熱源4接觸之位置，以使該熱源4能夠與該石墨烯紙2直接接觸並提升散熱效果。
Next, as shown in FIG. 3B, the
此外，該石墨烯紙的面積係不小於該熱源的與該石墨烯紙接觸之面的面積。如圖2及圖3B所示，在一較佳實施例中，該石墨烯紙2的面積係大於該熱源4的與該石墨烯紙2接觸之面的面積，以提升散熱效果。
In addition, the area of the graphene paper is not less than the area of the surface of the heat source that is in contact with the graphene paper. As shown in FIGS. 2 and 3B, in a preferred embodiment, the area of the
以下，將由本發明方法所形成之塑膠基材與石墨烯紙的複合體作為測試散熱片，並藉由以下實施例進行說明。 Hereinafter, the composite of the plastic substrate and graphene paper formed by the method of the present invention is used as a test heat sink, and the following examples are used to illustrate.
<實施例1> <Example 1>
使用向宏青公司購買的PP塑膠片(長100mm x寬100mm x厚3mm)作為塑膠基材，並使用今展公司製的厚度為150μm的石墨烯紙。接著，藉由本發明方法中 的黏貼方式，製作測試散熱片1(PP塑膠+石墨烯紙)。石墨烯紙與塑膠基材的厚度比為1比20。 The PP plastic sheet (length 100mm x width 100mm x thickness 3mm) purchased from Hongqing Company was used as the plastic substrate, and the graphene paper with a thickness of 150μm made by Kenzhan Company was used. Then, by the method of the present invention To make test heat sink 1 (PP plastic + graphene paper) by pasting method. The thickness ratio of graphene paper to plastic substrate is 1:20.
<實施例2~10> <Examples 2~10>
除了將塑膠基材的種類變更為下述表1所示的各種塑膠基材以外，以與實施例1相同的方式，製作測試散熱片2~10。
Except that the type of the plastic base material was changed to various plastic base materials shown in Table 1 below, the
<實施例11~12> <Examples 11~12>
除了將塑膠基材的種類變更為下述表1所示的各種塑膠基材、以及將塑膠基材的厚度調整為0.5mm~40mm(即，將石墨烯紙與塑膠基材的厚度比變更為1比3.3及1比266.7)以外，以與實施例1相同的方式，製作測試散熱片11~12。
In addition to changing the type of plastic substrate to the various plastic substrates shown in Table 1 below, and adjusting the thickness of the plastic substrate to 0.5 mm to 40 mm (that is, the thickness ratio of the graphene paper to the plastic substrate is changed to Except for 1:3.3 and 1:266.7), in the same manner as in Example 1,
<比較例1~12> <Comparative Examples 1-12>
將下述表1所示之未置放石墨烯紙的各種塑膠基材作為比較例1~12。 The various plastic substrates without graphene paper shown in Table 1 below were used as Comparative Examples 1-12.
針對上述實施例1~12及比較例1~12，以下述評價方法進行評價。 With respect to the above-mentioned Examples 1 to 12 and Comparative Examples 1 to 12, the following evaluation methods were used for evaluation.
針對上述實施例1~12的測試散熱片1~12及比較例1~12的塑膠基材，依照下述步驟(1)~(6)，進行XY均溫性的測試。 For the test heat sinks 1-12 of the foregoing Examples 1-12 and the plastic substrates of the Comparative Examples 1-12, the XY temperature uniformity test was performed according to the following steps (1) to (6).
(1)使用致茂電子製的電源供應器(型號62006P-100-25)，設定供應6W的熱量至加熱器(Heater)的加熱台上進行加熱。在加熱30分鐘後，加熱台的溫度達到約144℃。 (1) Use a power supply (model 62006P-100-25) made by Chimao Electronics, set to supply 6W of heat to the heating table of the heater (Heater) for heating. After heating for 30 minutes, the temperature of the heating stage reached about 144°C.
(2)接著，於加熱台上放置今展公司的K 1.5(SSTCP015A,0.5mm)導熱填隙墊片(Gap pad)，以讓加熱台的熱源能夠藉由該導熱填隙墊片傳導至測試散熱片或塑膠基材。 (2) Next, place Jinzhan’s K 1.5 (SSTCP015A, 0.5mm) thermally conductive gap pad on the heating table, so that the heat source of the heating table can be conducted to the test through the thermally conductive gap pad Heat sink or plastic substrate.
(3)使用雷射筆定位導熱填隙墊片的中心位置。 (3) Use a laser pointer to locate the center of the thermally conductive gap filler.
(4)以將測試散熱片或塑膠基材的中心位置與導熱填隙墊片的中心位置重合的方式，於導熱填隙墊片上放上測試散熱片1~12及比較例1~12的塑膠基材。 (4) Put the test heat sinks 1-12 and comparative examples 1-12 on the thermally conductive gap filler by overlapping the center position of the test heat sink or plastic substrate with the center position of the thermally conductive gap filler. Plastic substrate.
(5)使用柱狀物(例如竹筷)對準測試散熱片或塑膠基材的中心壓住並固定之，再用鬆緊帶固定柱狀物的位置。藉此，使測試散熱片或塑膠基材與導熱填隙墊片密合，以模擬測試散熱片或塑膠基材與熱源緊貼時的散熱效果。 (5) Use a pillar (such as bamboo chopsticks) to align the test heat sink or the center of the plastic substrate to press and fix it, and then fix the position of the pillar with an elastic band. In this way, the test heat sink or the plastic base material and the thermally conductive gap filler are closely attached to simulate the heat dissipation effect when the test heat sink or the plastic base material is in close contact with the heat source.
(6)保持上述的固定狀態30分鐘溫度穩態後，量測測試散熱片或塑膠基材附近5個位置的空氣溫度，並計算其平均值來作為環境溫度。量測加熱器(加熱台)的溫度來模擬晶片表面溫度。又，電源供應器在步驟(1)~(6)中持續進行加熱。 (6) After maintaining the above-mentioned fixed state for 30 minutes at the temperature steady state, measure the air temperature at 5 locations near the test heat sink or plastic substrate, and calculate the average value as the ambient temperature. Measure the temperature of the heater (heating stage) to simulate the surface temperature of the wafer. In addition, the power supply continues to heat during steps (1) to (6).
將晶片表面溫度減去環境溫度，計算出△T值，即△T=晶片表面溫度-環境溫度。當△T值較低時表示XY均溫性較佳進而降低了晶片表面溫度。將實驗結果整理於下述表1。 The ΔT value is calculated by subtracting the ambient temperature from the surface temperature of the wafer, that is, ΔT = the surface temperature of the wafer-the ambient temperature. When the ΔT value is lower, it means that the XY temperature uniformity is better and the wafer surface temperature is lowered. The experimental results are summarized in Table 1 below.
如表1所示，相較於比較例1~12，因為實施例1~12皆在塑膠基材的接觸面上置放石墨烯紙，故皆呈現了△T值下降的情形。由此可知，藉由本發明的方法，因為能夠有效地提升塑膠的均溫性，降低了晶片表面溫度及△T值，進而能夠提供更佳的散熱方案。 As shown in Table 1, compared with Comparative Examples 1-12, since the graphene paper is placed on the contact surface of the plastic substrate in Examples 1-12, the ΔT value decreases. It can be seen that the method of the present invention can effectively improve the temperature uniformity of the plastic, reduce the surface temperature of the chip and the ΔT value, and thus can provide a better heat dissipation solution.
又，如表1的實施例11~12及比較例11~12所示，在石墨烯紙與塑膠基材之厚度比為1比3.3及1比266.7的情況下，使△T值分別下降約73℃及38℃。 In addition, as shown in Examples 11 to 12 and Comparative Examples 11 to 12 in Table 1, when the thickness ratio of graphene paper to plastic substrate is 1:3.3 and 1:266.7, the ΔT value is reduced by approximately 73°C and 38°C.
再者，相較於比較例1~10，在石墨烯紙與塑膠基材之厚度比為1比20的情況下，實施例1~10的測試散熱片(塑膠基材+石墨烯紙)皆能夠使△T值下降約80℃。 Furthermore, compared to Comparative Examples 1-10, when the thickness ratio of the graphene paper to the plastic substrate is 1:20, the test heat sinks (plastic substrate + graphene paper) of Examples 1-10 are all It can reduce the ΔT value by about 80°C.
因此，若比較實施例1~10及實施例11~12則能夠發現，在石墨烯紙與塑膠基材之厚度比為1比20的情況下，△T值下降的幅度較大，故效果最佳；而在石墨烯紙與塑膠基材之厚度比為1比3.3的情況下，△T值下降約70℃，效果次佳。 Therefore, comparing Examples 1 to 10 and Examples 11 to 12, it can be found that when the thickness ratio of graphene paper to plastic substrate is 1:20, the ΔT value decreases more widely, so the effect is the most effective. Good; and when the thickness ratio of graphene paper to plastic substrate is 1:3.3, the ΔT value drops by about 70°C, which is the second best.
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。 The present invention has been disclosed in a preferred embodiment above, but those skilled in the art should understand that the embodiment is only used to describe the present invention and should not be construed as limiting the scope of the present invention. It should be noted that all changes and substitutions equivalent to this embodiment should be included in the scope of the present invention. Therefore, the protection scope of the present invention should be defined by the scope of the patent application.
(A)~(C):步驟 (A)~(C): Steps
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