TWI734956B - Laser welding device for semiconductor element and method for using the same - Google Patents

Laser welding device for semiconductor element and method for using the same Download PDF

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TWI734956B
TWI734956B TW108103763A TW108103763A TWI734956B TW I734956 B TWI734956 B TW I734956B TW 108103763 A TW108103763 A TW 108103763A TW 108103763 A TW108103763 A TW 108103763A TW I734956 B TWI734956 B TW I734956B
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welding
frame
substrate
axis
module
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TW108103763A
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Chinese (zh)
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TW202030041A (en
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徐秋田
賴允晉
梁奕智
邱添煌
莊承林
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惠特科技股份有限公司
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Priority to TW108103763A priority Critical patent/TWI734956B/en
Priority to CN201911074618.1A priority patent/CN111508862B/en
Priority to KR1020200003082A priority patent/KR102326855B1/en
Priority to JP2020004277A priority patent/JP7062703B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02—Carriages for supporting the welding or cutting element
    • B23K37/0211—Carriages for supporting the welding or cutting element travelling on a guide member, e.g. rail, track
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Laser Beam Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)

Abstract

A laser welding device for semiconductor element and method for using the same are provided, which for bonding a plurality of semiconductor elements to a plurality of conductive lines of a substrate quickly, and laser welding the semiconductor elements to the conductive lines, so as to Improve process speed and cost reduction in the semiconductor industry.

Description

半導體元件雷射焊接裝置及方法Semiconductor element laser welding device and method

本發明係有關於一種半導體元件雷射焊接裝置及方法。 The invention relates to a laser welding device and method for semiconductor components.

按，一般半導體產業製程中，晶粒廠透過晶粒分選機，將晶粒排列於膠膜(Tape)上，出貨給下游固晶廠，固晶廠使用貼件機方式(Pick and Place)，將晶片逐個擺放固定於線路基板上，過程中還需要點上錫膏等可固晶且又可導電之膏狀有黏性介質，而後才將整片固晶後的導電板經過回流焊接(Reflow)製程進行加熱固化。 According to the general semiconductor industry process, the die factory arranges the die on the tape through the die sorting machine, and ships it to the downstream die-bonding plant. The die-bonding plant uses the pick and place method (Pick and Place). ), place the chips one by one and fix them on the circuit substrate. During the process, solder paste and other paste-like and conductive paste-like media that can be die-bonded and can be conductive are also applied, and then the entire die-bonded conductive plate is reflowed Welding (Reflow) process for heating and curing.

然而，在此類習知製造過程具有下述缺點，1.Reflow製程溫度上升曲線慢，一顆晶片上至少有2個回焊點的固化反應時間不一，容易使得晶粒翹起形成不良，2.Reflow製程無法針對單一不良晶粒進行修補或重工，重工整片會進而影響其他回焊正常的晶片，3.小於3密耳(mil)之晶粒，點膠技術良率難以突破，4.經過分選機、固晶機2次的Pick and Place製程作業時間慢、設備投資成本相當龐大，存在亟待改善之缺弊。 However, this kind of conventional manufacturing process has the following disadvantages: 1. The temperature rise curve of the Reflow process is slow, and the curing reaction time of at least two reflow points on a wafer is different, which is easy to cause the formation of poor die warping. 2. The Reflow process cannot be repaired or reworked for a single defective die, and reworked the whole piece will further affect other normal reflow wafers. 3. Die less than 3 mils (mil), the yield rate of dispensing technology is difficult to break through, 4 .The Pick and Place process, which passes through the sorting machine and the die-bonding machine twice, has a slow operation time and a huge equipment investment cost, and there are shortcomings that need to be improved urgently.

因此，有必要提供一種新穎且具有進步性之半導體元件雷射焊接裝置及方法，以解決上述之問題。 Therefore, it is necessary to provide a novel and progressive laser welding device and method for semiconductor devices to solve the above-mentioned problems.

本發明之主要目的在於提供一種半導體元件雷射焊接裝置及方法，將半導體元件依照線路基板接合點間距排列於Tape上，可直接進行Tape與導電基板的貼合，並以雷射光加熱方式進行穿透式掃描焊接，其優點為：1.可減少LED等半導體元件回焊難以克服的異常問題，取代現有固晶機、Reflow設備，2.無須再次依電路板位置，由固晶設備對晶粒做Pick and Place作業，可直接由晶粒分選段之Tape膜進行真空貼合巨量轉移，以顯示屏動輒數千萬顆的晶粒，速度遠高於Pick and Place數萬倍，可節省許多製程時間，3.雷射穿透式掃描焊接技術，因晶粒夾在Tape與線路基板之間，且真空貼合對晶粒與線路間具有壓合的效果，雷射加熱溫度上升曲線快速，製程上不會有晶粒翹起等不良問題產生。 The main purpose of the present invention is to provide a semiconductor element laser soldering device and method. The semiconductor elements are arranged on the tape according to the pitch of the circuit substrate joints, so that the tape and the conductive substrate can be directly bonded, and the laser light heating method is used for the penetration. Through scanning welding, its advantages are: 1. It can reduce the abnormal problems that are difficult to overcome in the reflow of semiconductor components such as LEDs, and replace the existing die-bonding machine and Reflow equipment. For Pick and Place operations, vacuum bonding can be directly carried out from the tape film of the die sorting section for massive transfer. With the display screen tens of millions of die, the speed is much higher than Pick and Place by tens of thousands of times, which can save a lot Process time, 3. Laser penetration scanning welding technology, because the die is sandwiched between the Tape and the circuit substrate, and the vacuum bonding has a pressing effect between the die and the circuit, the laser heating temperature rises quickly, During the manufacturing process, there will be no defects such as die lifting.

為達成上述目的，本發明提供一種半導體元件雷射焊接裝置，供焊接一貼合成品，該貼合成品由一框架及一基板相貼合而成，該框架設有一貼膜及排列設於該貼膜之複數半導體元件，該半導體元件雷射焊接裝置包括一焊接設備。該焊接設備包括一座體，該座體設有一焊接載台及一焊接模組，該焊接載台供承載該貼合成品，該焊接模組設有一掃描模組及一雷射焊頭，該掃描模組供掃描該貼合成品，該雷射焊頭發出雷射光束穿透該貼膜與該基板至少其中一者。 In order to achieve the above objective, the present invention provides a semiconductor device laser welding device for welding a pasting composite, the pasting composite is formed by bonding a frame and a substrate, the frame is provided with a film and arranged on the film For a plurality of semiconductor elements, the semiconductor element laser welding device includes a welding device. The welding equipment includes a body, the base body is provided with a welding carrier and a welding module, and the welding carrier is used to carry the paste composite product. The module is used for scanning the sticker composite, and the laser welding head emits a laser beam to penetrate at least one of the sticker film and the substrate.

為達成上述目的，本發明另提供一種半導體元件雷射焊接方法，其提供一如上所述的半導體元件雷射焊接裝置，另包括以下步驟。貼合：該第一對位平台供將該基板轉動並對位至一第一預定角度，該第二對位平台供將該框架轉動並對位至一第二預定角度，該第一拿取裝置供將對位至該第一預定角度之基板及對位至該第二預定角度之框架其中一者拿取，並貼合至另一者以形 成該貼合成品；焊接：將該貼合成品置放於該焊接載台，該掃描模組掃描定位該貼合成品，並相對移動該雷射焊頭與該焊接載台之相對位置，以使該雷射焊頭定位及對應該等半導體元件並發出雷射光束穿透該貼膜與該基板至少其中一者，以加熱該等焊料進行焊接。 In order to achieve the above objective, the present invention further provides a semiconductor device laser welding method, which provides a semiconductor device laser welding device as described above, and further includes the following steps. Fitting: The first alignment platform is used for rotating and positioning the substrate to a first predetermined angle, and the second alignment platform is used for rotating and positioning the frame to a second predetermined angle, and the first picking The device is used to take one of the substrate aligned to the first predetermined angle and the frame aligned to the second predetermined angle, and attach to the other to shape Into the paste composite; welding: place the paste composite on the welding stage, the scanning module scans and locates the paste composite, and relatively moves the relative position of the laser welding head and the welding stage to The laser welding head is positioned and corresponding to the semiconductor elements and emits a laser beam to penetrate at least one of the film and the substrate to heat the solder for welding.

1:貼合設備 1: Laminating equipment

2:基座 2: pedestal

3:基板檢測機構 3: Substrate inspection mechanism

4:框架檢測機構 4: Frame inspection agency

5:焊接設備 5: Welding equipment

6:座體 6: Seat

7:焊接載台 7: Welding stage

8:焊接模組 8: Welding module

11:第一拿取裝置 11: The first picking device

12:基板拿取手臂 12: substrate taking arm

13:框架拿取手臂 13: Frame take arm

14:第一粗對位平台 14: The first rough counterpoint platform

15:中繼平台 15: Relay platform

16:貼合監控模組 16: Fit the monitoring module

131:夾具 131: Fixture

61:第一軌道 61: The first track

62:第二軌道 62: second track

63:升降裝置 63: Lifting device

81:掃描模組 81: Scanning module

82:雷射焊頭 82: Laser welding head

83:聚焦單元 83: Focusing unit

91:基板 91: substrate

92:框架 92: Frame

93:焊料 93: Solder

94:貼合成品 94: Paste composites

95:晶座盒 95: crystal holder box

96:框架盒座 96: frame box seat

911:導電線路 911: Conductive circuit

921:貼膜 921: film

922:半導體元件 922: Semiconductor components

31:第一對位平台 31: The first counterpoint platform

32:第一檢測模組 32: The first detection module

41:第二對位平台 41: The second counterpoint platform

42:第二檢測模組 42: The second detection module

L1:X軸 L1: X axis

L2:Y軸 L2: Y axis

L3:Z軸 L3: Z axis

圖1為本發明一較佳實施例之貼合設備立體圖。 Fig. 1 is a perspective view of a laminating device according to a preferred embodiment of the present invention.

圖2為本發明一較佳實施例之貼合設備俯視圖。 Figure 2 is a top view of a laminating device according to a preferred embodiment of the present invention.

圖3及4為本發明一較佳實施例之貼合成品立體示意圖。 3 and 4 are three-dimensional schematic diagrams of a pasting composite product according to a preferred embodiment of the present invention.

圖5及6為本發明一較佳實施例之貼合成品側視示意圖。 Figures 5 and 6 are schematic side views of a pasting composite according to a preferred embodiment of the present invention.

圖7為本發明一較佳實施例之焊接設備立體圖。 Fig. 7 is a perspective view of a welding equipment according to a preferred embodiment of the present invention.

圖8為本發明一較佳實施例之焊接設備側視圖。 Fig. 8 is a side view of a welding equipment according to a preferred embodiment of the present invention.

圖9為本發明一較佳實施例之焊接過程示意圖。 Fig. 9 is a schematic diagram of the welding process of a preferred embodiment of the present invention.

圖10為本發明一較佳實施例之另一焊接過程示意圖。 Fig. 10 is a schematic diagram of another welding process according to a preferred embodiment of the present invention.

圖11為本發明一較佳實施例之貼合設備另一立體圖。 Fig. 11 is another perspective view of the laminating device according to a preferred embodiment of the present invention.

以下僅以實施例說明本發明可能之實施態樣，然並非用以限制本發明所欲保護之範疇，合先敘明。 The following examples are only used to illustrate the possible implementation aspects of the present invention, but they are not intended to limit the scope of protection of the present invention, and are described first.

請參考圖1至11，其顯示本發明之一較佳實施例，本發明之半導體元件雷射焊接裝置供焊接一貼合成品94，該貼合成品94由一框架92及一基板91 相貼合而成，該框架92設有一貼膜921及排列設於該貼膜921之複數半導體元件922，該半導體元件雷射焊接裝置包括一焊接設備5。 Please refer to FIGS. 1 to 11, which show a preferred embodiment of the present invention. The semiconductor device laser soldering device of the present invention is used for soldering a bonding compound 94, which consists of a frame 92 and a substrate 91 The frame 92 is formed by bonding, and the frame 92 is provided with a film 921 and a plurality of semiconductor elements 922 arranged on the film 921. The semiconductor element laser welding device includes a welding device 5.

該焊接設備5包括一座體6，該座體6設有一焊接載台7及一焊接模組8，該焊接載台7供承載該貼合成品94，該焊接模組8設有一掃描模組81及一雷射焊頭82，該掃描模組81供掃描該貼合成品94，該雷射焊頭82發出雷射光束穿透該貼膜921與該基板91至少其中一者。 The welding equipment 5 includes a base body 6, the base body 6 is provided with a welding carrier 7 and a welding module 8, the welding carrier 7 is for carrying the pasting composite 94, and the welding module 8 is provided with a scanning module 81 And a laser welding head 82. The scanning module 81 is used for scanning the pasted product 94. The laser welding head 82 emits a laser beam to penetrate at least one of the pasting film 921 and the substrate 91.

本發明另包括一貼合設備1，該貼合設備1包括一基座2、一基板檢測機構3、一框架檢測機構4及一第一拿取裝置11，該基座2定義相互垂直之一X軸L1、一Y軸L2及一Z軸L3，該基板檢測機構3設於該基座2並包括一第一對位平台31及一第一檢測模組32，該第一對位平台31可沿該Z軸L3轉動並供置放該基板91，該基板91設有複數導電線路911，該第一檢測模組32供檢測掃描該基板91，該框架檢測機構4設於該基座2並包括一第二對位平台41及一第二檢測模組42，該第二對位平台41可沿該Z軸L3轉動並供置放框架92，於本實施例中該半導體元件922為LED晶粒，該第二檢測模組42供檢測掃描該框架92，該第二對位平台41供將該框架92轉動並對位至一第二預定角度，該導電線路911或該等半導體元件922預先設有複數焊料93，於本實施例中該等焊料93設於該等半導體元件922，該第一拿取裝置11供將該第一預定角度之基板91及該框架92其中一者拿取，並貼合至另一者以形成該貼合成品94(於本實施例中該第一拿取裝置11係拿取該框架92並貼合於該基板91)，要說明的是，於本實施例中該第一拿取裝置11可選擇性地沿X軸L1及Z軸L3移動，該第一拿取裝置11為吸盤，該第一拿取裝置11將該基板91與該框架92沿該Z軸L3之方向相貼合，以使該框架92之各該半導體元件922精準 貼合於該基板91之該等導電線路911，各該焊料93分別與該半導體元件922及該導電線路911相接觸。 The present invention further includes a laminating device 1, the laminating device 1 includes a base 2, a substrate detection mechanism 3, a frame detection mechanism 4, and a first picking device 11, the base 2 defines one perpendicular to each other An X axis L1, a Y axis L2 and a Z axis L3. The substrate inspection mechanism 3 is arranged on the base 2 and includes a first alignment platform 31 and a first inspection module 32. The first alignment platform 31 The substrate 91 can be rotated along the Z axis L3 to be placed on the substrate 91. The substrate 91 is provided with a plurality of conductive circuits 911. The first detection module 32 is used to detect and scan the substrate 91. The frame detection mechanism 4 is provided on the base 2 It also includes a second alignment platform 41 and a second detection module 42. The second alignment platform 41 can rotate along the Z axis L3 and is provided with a frame 92. In this embodiment, the semiconductor element 922 is an LED Die, the second detection module 42 is used to detect and scan the frame 92, the second alignment platform 41 is used to rotate and align the frame 92 to a second predetermined angle, the conductive circuit 911 or the semiconductor elements 922 A plurality of solders 93 are provided in advance. In this embodiment, the solders 93 are provided on the semiconductor elements 922. The first picking device 11 is used to pick up one of the first predetermined angle of the substrate 91 and the frame 92 , And attached to the other to form the attached composite 94 (in this embodiment, the first picking device 11 picks up the frame 92 and attaches it to the substrate 91). It should be noted that in this In the embodiment, the first picking device 11 can selectively move along the X axis L1 and the Z axis L3. The first picking device 11 is a suction cup. The first picking device 11 moves the substrate 91 and the frame 92 together. The direction of the Z axis L3 is aligned so that each of the semiconductor elements 922 of the frame 92 is accurate The conductive lines 911 attached to the substrate 91, and each of the solders 93 are in contact with the semiconductor element 922 and the conductive line 911, respectively.

本發明另提供一種半導體元件雷射焊接方法，其提供一如上所述的半導體元件雷射焊接裝置，另包括以下步驟。貼合：該第一對位平台31供將該基板91轉動並對位至一第一預定角度，該第二對位平台41供將該框架92轉動並對位至一第二預定角度，該第一拿取裝置11供將對位至該第一預定角度之基板91及對位至該第二預定角度之框架4其中一者拿取，並貼合至另一者以形成該貼合成品94(於本實施例中該第一拿取裝置11係拿取該框架92並貼合於該基板91)，值得一提的是，於本實施例中該貼合設備1另設有一貼合監控模組16(如圖11所示)，以在貼合後之該基板91與該框架4進行監控，以確認該等半導體元件922順利地貼合於該等導電線路911。焊接：將該貼合成品94置放於該焊接載台7，該掃描模組81掃描定位該貼合成品94，並相對移動該雷射焊頭82與該焊接載台7之相對位置，以使該雷射焊頭82定位及對應該等半導體元件922並發出雷射光束穿透該貼膜921與該基板91至少其中一者，以加熱該等焊料93進行焊接。如圖9所示，當該基板91為可透光材質(如可透光之陶瓷板、玻璃板、PCB板或藍寶石板)，該貼合成品94可以該基板91朝向該雷射焊頭82進行作業，雷射光束即可穿透該基板91進行焊接作業；當該基板91為不可透光材質(如不可透光之陶瓷板、矽晶板或PCB板)，如圖10所示，該貼合成品94僅可以該貼膜921朝向該雷射焊頭82進行作業，雷射光束即穿透該貼膜921進行焊接作業，可依照該基板91之實際材質進行作業，該貼模921材質可為PE藍膜、UV膜或其它可透光且可撓曲之貼膜，該等半導體元件922無需上膠及可黏貼於該貼膜911，因此具有較簡單之製程，該等焊料93可以印刷、點膠、電鍍或蝕刻之方式設於該等半導體元件上，以提升效率， 較佳地該雷射光束之波長介於0.2um至11um，可具有最佳穿透貼膜921與該基板91之效果，以確實地加熱該等焊料93，其功率密度範圍介於1KW/cm2至10MW/cm2，加熱時間介於0.01至2000毫秒，於本實施例中最佳化的功率密度為100KW/cm2，加熱時間為0.05毫秒，雷射加熱過程可以調變雷射為脈衝式，其頻率範圍為1至100KHz，最佳化的條件為4KHz，佔空比為15%，於本實施例中該焊接模組8使用雷射控制卡送出電子訊號給雷射源，進行雷射頻率、佔空比、能量範圍調變。 The present invention also provides a laser welding method for semiconductor devices, which provides a laser welding device for semiconductor devices as described above, and further includes the following steps. Fitting: The first alignment platform 31 is used to rotate and align the substrate 91 to a first predetermined angle, and the second alignment platform 41 is to rotate and align the frame 92 to a second predetermined angle, the The first taking device 11 is used to take one of the substrate 91 aligned to the first predetermined angle and the frame 4 aligned to the second predetermined angle, and attach to the other to form the laminated product 94 (In this embodiment, the first picking device 11 picks up the frame 92 and attaches it to the substrate 91). It is worth mentioning that in this embodiment, the lamination device 1 is additionally provided with a lamination The monitoring module 16 (as shown in FIG. 11) monitors the substrate 91 and the frame 4 after bonding to confirm that the semiconductor elements 922 are smoothly bonded to the conductive lines 911. Welding: Place the paste composition 94 on the welding stage 7, the scanning module 81 scans and locates the paste composition 94, and relatively moves the relative positions of the laser welding head 82 and the welding stage 7 to The laser welding head 82 is positioned to correspond to the semiconductor elements 922 and emit a laser beam to penetrate at least one of the film 921 and the substrate 91 to heat the solder 93 for welding. As shown in FIG. 9, when the substrate 91 is made of a transparent material (such as a transparent ceramic plate, a glass plate, a PCB board or a sapphire board), the bonded composite 94 can face the substrate 91 toward the laser welding head 82 When the operation is performed, the laser beam can penetrate the substrate 91 for welding operation; when the substrate 91 is made of an impermeable material (such as an impermeable ceramic board, silicon crystal board, or PCB board), as shown in Figure 10, the The paste composition 94 can only be operated by the paste film 921 toward the laser welding head 82, and the laser beam penetrates the paste film 921 for welding operations. The work can be performed according to the actual material of the substrate 91. The material of the paste mold 921 can be PE blue film, UV film or other transparent and flexible film. The semiconductor components 922 do not need to be glued and can be attached to the film 911, so they have a simpler manufacturing process. The solder 93 can be printed and glued. , Electroplating or etching is placed on the semiconductor elements to improve efficiency. Preferably, the wavelength of the laser beam is between 0.2um and 11um, which can best penetrate the film 921 and the substrate 91. The power density of the solder 93 is reliably heated in the range of 1KW/cm 2 to 10 MW/cm 2 , and the heating time is in the range of 0.01 to 2000 milliseconds. The optimized power density in this embodiment is 100 KW/cm 2 , The heating time is 0.05 milliseconds. The laser heating process can be adjusted to pulse type, the frequency range is 1 to 100KHz, the optimized condition is 4KHz, and the duty cycle is 15%. In this embodiment, the welding mode Group 8 uses the laser control card to send an electronic signal to the laser source to adjust the laser frequency, duty cycle, and energy range.

具體而言，該座體6另設有一沿該X軸L1延伸之第一軌道61及一沿該Y軸L2延伸之第二軌道62，該第二軌道62滑設於該第一軌道61，該焊接載台7滑設於該第二軌道62，以使該焊接載台7可相對該焊接模組8沿該X軸L1及Y軸L2移動，以使該焊接模組8之掃描模組81可掃描對位該貼合成品94。 Specifically, the base 6 is further provided with a first rail 61 extending along the X axis L1 and a second rail 62 extending along the Y axis L2. The second rail 62 is slidably disposed on the first rail 61, The welding stage 7 is slidably disposed on the second rail 62, so that the welding stage 7 can move relative to the welding module 8 along the X-axis L1 and Y-axis L2, so that the scanning module of the welding module 8 81 can scan and align the paste composite 94.

進一步的說，該雷射焊頭8可根據該掃描模組81所掃瞄出之該等半導體元件922及該等導電線路911之分佈位置及資訊而將設定雷射光束所照射之位置、分佈，或者可根據半導體業者所預先設定要焊接之位置資訊而進行焊接，可依照實際使用需求而進行焊接作業，不以此為限。且該雷射焊頭92具有聚焦準直功能，可使雷射光束聚焦在焊料93上，該半導體元件922受到熱傳導之升溫效率較慢，以防止半導體元件922過熱受損，詳細的說，其中雷射掃描座標取得方式，依該等導電線路911之線路特徵點進行轉正對位、取得基準起始座標，有以下3種方座標取得方式進行加工：1.可依該第一檢測模組32及該第二檢測模組42對該基板91及該框架92做全域的影像掃描定位取得該等焊料93之座標，供該掃描模組81依此座標進行移動加工，2.可匯入線路圖檔座標，供掃該掃描模組81依此座標進行移動加工，3.可輸入陣列數量、間隔距離，供該掃描模組81依此座標進行移動加工。 Furthermore, the laser welding head 8 can set the position and distribution of the laser beam irradiated by the laser beam according to the distribution position and information of the semiconductor elements 922 and the conductive lines 911 scanned by the scanning module 81 , Or welding can be carried out according to the position information to be welded pre-set by the semiconductor industry, welding operation can be carried out according to actual use requirements, and it is not limited to this. In addition, the laser soldering head 92 has a focusing and collimating function, which can focus the laser beam on the solder 93. The semiconductor element 922 has a slower heating efficiency due to heat conduction, so as to prevent the semiconductor element 922 from being overheated and damaged. In detail, The laser scanning coordinate acquisition method is based on the line feature points of the conductive lines 911 to perform alignment and obtain the fiducial starting coordinates. There are the following three methods of obtaining square coordinates for processing: 1. The first detection module 32 can be used for processing. And the second detection module 42 performs global image scanning and positioning on the substrate 91 and the frame 92 to obtain the coordinates of the solder 93, for the scanning module 81 to move and process according to the coordinates, 2. Import circuit diagrams The file coordinates are used for scanning the scanning module 81 to move and process according to this coordinate. 3. The number of arrays and spacing distances can be input for the scanning module 81 to move and process according to this coordinate.

另外，該焊接模組另設有一聚焦單元83，該聚焦單元83可以焊接載台7之平面為雷射最小聚焦基礎原點，輸入考慮該基板91之厚度、該等焊料93之直徑，依光學聚焦設計為計算基礎，自動調整雷射聚焦位置，原理為雷射聚光截面，涵蓋該等導電線路911之接點全域為概念，進行調整離焦。 In addition, the welding module is additionally provided with a focusing unit 83. The focusing unit 83 can be used to set the plane of the welding stage 7 as the basic origin of the laser minimum focus. The focus design is the calculation basis, and the focus position of the laser is automatically adjusted. The principle is that the laser condensing section covers the entire area of the contacts of the conductive lines 911 as the concept, and the defocus is adjusted.

於本實施例中該座體6另設有一可相對該焊接載台7沿該Z軸L3移動之升降裝置63，該焊接模組8設於該升降裝置63以進行升降。 In this embodiment, the base 6 is further provided with a lifting device 63 that can move along the Z axis L3 relative to the welding stage 7, and the welding module 8 is provided on the lifting device 63 for lifting.

於本實施例中該基座另設有一基板拿取手臂12及一第一粗對位平台14，該基板拿取手臂12先將該基板91置放於該第一粗對位平台14進行粗對位後，再將該基板91置放於該第一對位平台31，可節省該第一對位平台31之作業時間。 In this embodiment, the base is additionally provided with a substrate taking arm 12 and a first rough alignment platform 14. The substrate taking arm 12 first places the substrate 91 on the first rough alignment platform 14 for roughing. After the alignment, the substrate 91 is placed on the first alignment platform 31, which can save the working time of the first alignment platform 31.

該基座2另設有一框架拿取手臂13及一中繼平台15，該中繼平台15及該框架拿取手臂13可沿該Y軸L2方向移動，該框架拿取手臂13供自一框架盒座96拿取一該框架92並置放於該中繼平台15，該第一拿取裝置11再將該框架92自該中繼平台15拿取並置放於該第二對位平台41，該第一拿取裝置11另供將該貼合成品94自該第二對位平台41拿取，並置放回該中繼平台15，該框架拿取手臂13即可將該貼合成品94自該中繼平台15拿取並放置於該框架盒座96，以供雷射焊接製程使用。於本實施例中該框架拿取手臂13為一夾具131，該框架拿取手臂13可選擇性地沿該Y軸L2移動。 The base 2 is further provided with a frame taking arm 13 and a relay platform 15. The relay platform 15 and the frame taking arm 13 can move along the Y axis L2 direction, and the frame taking arm 13 is provided by a frame The box holder 96 takes a frame 92 and places it on the relay platform 15. The first taking device 11 takes the frame 92 from the relay platform 15 and places it on the second alignment platform 41. The first picking device 11 is also used for picking up the sticking composite 94 from the second alignment platform 41 and placing it back on the relay platform 15. The frame picking arm 13 can then take the sticking composite 94 from the second alignment platform 41. The relay platform 15 is taken and placed on the frame box base 96 for use in the laser welding process. In this embodiment, the frame grabbing arm 13 is a clamp 131, and the frame grabbing arm 13 can selectively move along the Y axis L2.

另外一提的是，於本實施例中該第一檢測模組32與該第二檢測模組42為感光耦合元件(CCD)感應器，該第一檢測模組32供掃描對位該基板91之導電線路911，該第二檢測模組42供掃描對位該等半導體元件922之排列，以達到準確對位之效果。 In addition, in this embodiment, the first detection module 32 and the second detection module 42 are photosensitive coupling element (CCD) sensors, and the first detection module 32 is used for scanning and aligning the substrate 91. The second detection module 42 is used to scan and align the arrangement of the semiconductor elements 922 to achieve the effect of accurate alignment.

綜上，本發明之半導體元件雷射焊接裝置及方法可快速將排列於該框件上之該等半導體元件貼合於該基板之該等導電線路，以進行雷射焊接將該等半導體元件與該等導電線路進行焊接，利用貼膜可一次貼合巨量(數千至數千萬顆)之1至80密耳等小尺寸之半導體元件之貼合，並藉由雷射焊接焊接巨量半導體元件，因此可提高半導體產業之製程速度及降低成本。 In summary, the semiconductor device laser welding device and method of the present invention can quickly attach the semiconductor devices arranged on the frame to the conductive lines of the substrate for laser welding of the semiconductor devices and These conductive circuits are soldered, and a huge amount (thousands to tens of millions) of small-sized semiconductor components ranging from 1 to 80 mils can be attached at a time using the film, and a huge amount of semiconductors can be welded by laser welding Therefore, it can increase the process speed and reduce the cost of the semiconductor industry.

82:雷射焊頭 82: Laser welding head

83:聚焦單元 83: Focusing unit

91:基板 91: substrate

93:焊料 93: Solder

911:導電線路 911: Conductive circuit

921:貼膜 921: film

922:半導體元件 922: Semiconductor components

Claims (9)

一種半導體元件雷射焊接裝置，供焊接一貼合成品，該貼合成品由一框架及一基板相貼合而成，該框架設有一貼膜及排列設於該貼膜之複數半導體元件，包括：一焊接設備，包括一座體，該座體設有一焊接載台及一焊接模組，該焊接載台供承載該貼合成品，該焊接模組設有一掃描模組及一雷射焊頭，該掃描模組供掃描該貼合成品，該雷射焊頭發出雷射光束穿透該貼膜與該基板至少其中一者；其中，該座體另設有一沿一X軸延伸之第一軌道及一沿一Y軸延伸之第二軌道，該第二軌道滑設於該第一軌道，該焊接載台滑設於該第二軌道，以使該焊接載台可相對該焊接模組沿該X軸及Y軸移動，該座體另設有一可相對該焊接載台沿該Z軸移動之升降裝置，該焊接模組設於該升降裝置。 A laser welding device for semiconductor components for welding a pasted composite product formed by bonding a frame and a substrate. The frame is provided with a pasting film and a plurality of semiconductor components arranged on the pasting film, including: a The welding equipment includes a base body, the base body is provided with a welding carrier and a welding module, the welding carrier is used to carry the paste composite product, the welding module is provided with a scanning module and a laser welding head, the scanning The module is used for scanning the sticker composite, the laser welding head emits a laser beam penetrating at least one of the sticker film and the substrate; wherein the base body is additionally provided with a first track extending along an X axis and an edge A Y-axis extending second track, the second track is slidably arranged on the first track, and the welding stage is slidably arranged on the second track, so that the welding stage can move along the X axis and the welding module relative to the welding module. Moving on the Y axis, the base body is additionally provided with a lifting device that can move along the Z axis relative to the welding stage, and the welding module is provided on the lifting device. 如請求項1所述的半導體元件雷射焊接裝置，另包括一貼合設備，該貼合設備包括一基座、一基板檢測機構、一框架檢測機構及一第一拿取裝置，該基座定義相互垂直之一X軸、一Y軸及一Z軸，該基板檢測機構設於該基座並包括一第一對位平台及一第一檢測模組，該第一對位平台可沿該Z軸轉動並供置放該基板，該基板設有複數導電線路，該第一檢測模組供檢測掃描該基板，該框架檢測機構設於該基座並包括一第二對位平台及一第二檢測模組，該第二對位平台可沿該Z軸轉動並供置放該框架，該第二檢測模組供檢測掃描該框架，該導電線路或該等半導體元件預先設有複數焊料，該第一拿取裝置供將該基板及該框架其中一者拿取並貼合至另一者，以使該框架之各該半導體元件貼合於該基板之該等導電線路以形成一貼合成品，各該焊料分別與該半導體元件及該導電線路相接觸。 The semiconductor element laser welding device according to claim 1, further comprising a bonding equipment, the bonding equipment including a base, a substrate inspection mechanism, a frame inspection mechanism and a first taking device, the base An X axis, a Y axis, and a Z axis are defined perpendicular to each other. The substrate inspection mechanism is set on the base and includes a first alignment platform and a first inspection module. The first alignment platform can move along the The Z-axis rotates and places the substrate, the substrate is provided with a plurality of conductive circuits, the first detection module is used to detect and scan the substrate, and the frame detection mechanism is provided on the base and includes a second alignment platform and a first Two inspection modules, the second alignment platform can be rotated along the Z axis and placed on the frame, the second inspection module is used for detecting and scanning the frame, the conductive circuit or the semiconductor components are pre-installed with plural solders, The first pick-up device is used for picking up and attaching one of the substrate and the frame to the other, so that each of the semiconductor elements of the frame is attached to the conductive lines of the substrate to form a bond In the finished product, each of the solder is in contact with the semiconductor element and the conductive circuit. 如請求項2所述的半導體元件雷射焊接裝置，其中該雷射焊頭根據該掃描模組所掃瞄出之該等半導體元件及該等導電線路之分佈位置及資訊而將設定雷射光束所照射之位置、分佈。 The semiconductor element laser welding device according to claim 2, wherein the laser welding head sets the laser beam according to the distribution position and information of the semiconductor elements and the conductive lines scanned by the scanning module The location and distribution of the irradiation. 如請求項2所述的半導體元件雷射焊接裝置，其中該基座另設有一框架拿取手臂及一中繼平台，該中繼平台及該框架拿取手臂可沿該Y軸方向移動，該框架拿取手臂供自一框架盒座拿取一該框架並置放於該中繼平台，該第一拿取裝置再將該框架自該中繼平台拿取並置放於該第二對位平台，該第一拿取裝置另供將該貼合成品自該第二對位平台拿取，並置放回該中繼平台，該框架拿取手臂即可將該貼合成品自該中繼平台拿取並放置於該框架盒座。 The semiconductor device laser welding device according to claim 2, wherein the base is additionally provided with a frame grabbing arm and a relay platform, the relay platform and the frame grabbing arm can move along the Y-axis direction, the The frame taking arm is used to take a frame from a frame box base and place it on the relay platform, the first taking device then takes the frame from the relay platform and places it on the second alignment platform, The first picking device is additionally used for picking up the pasting composite from the second alignment platform and placing it back on the relay platform. The frame picking arm can take the pasting composite from the relay platform And placed in the frame box seat. 如請求項4所述的半導體元件雷射焊接裝置，其中該框架拿取手臂為一夾具，該框架拿取手臂可選擇性地沿該Y軸移動。 The semiconductor device laser welding device according to claim 4, wherein the frame taking arm is a jig, and the frame taking arm can selectively move along the Y axis. 如請求項2所述的半導體元件雷射焊接裝置，其中該第一拿取裝置可選擇性地沿X軸及Z軸移動，該第一拿取裝置為吸盤，該第一拿取裝置將該基板與該框架沿該Z軸之方向相貼合。 The semiconductor device laser welding device according to claim 2, wherein the first pick-up device can selectively move along the X-axis and the Z-axis, the first pick-up device is a sucker, and the first pick-up device The substrate is attached to the frame along the direction of the Z axis. 如請求項2所述的半導體元件雷射焊接裝置，其中該第一檢測模組為感光耦合元件(CCD)感應器，該第一檢測模組供掃描對位該基板之導電線路，該第二檢測模組為感光耦合元件(CCD)感應器，該第二檢測模組供掃描對位該等半導體元件之排列。 The semiconductor device laser soldering device according to claim 2, wherein the first detection module is a photosensitive coupling element (CCD) sensor, the first detection module is used for scanning and aligning the conductive lines of the substrate, and the second The detection module is a CCD sensor, and the second detection module is used for scanning and aligning the arrangement of the semiconductor elements. 一種半導體元件雷射焊接方法，其提供一如請求項2至7其中任一項所述的半導體元件雷射焊接裝置，另包括以下步驟：貼合：該第一對位平台供將該基板轉動並對位至一第一預定角度，該第二對位平台供將該框架轉動並對位至一第二預定角度，該第一拿取裝置供將對位至該第一預定角度之基板及對位至該第二預定角度之框架其中一者拿取，並貼合至另一者以形成該貼合成品； 焊接：將該貼合成品置放於該焊接載台，該掃描模組掃描定位該貼合成品，並相對移動該雷射焊頭與該焊接載台之相對位置，以使該雷射焊頭定位及對應該等半導體元件並發出雷射光束穿透該貼膜與該基板至少其中一者，以加熱該等焊料進行焊接。 A laser welding method for semiconductor elements, which provides a semiconductor element laser welding device according to any one of claims 2 to 7, and further includes the following steps: bonding: the first alignment platform is used for rotating the substrate And align to a first predetermined angle, the second alignment platform is for rotating and aligning the frame to a second predetermined angle, the first picking device is for aligning the substrate and the first predetermined angle Take one of the frames aligned to the second predetermined angle and attach to the other to form the pasted composite; Welding: Place the paste composite product on the welding stage, the scanning module scans and locates the paste composite product, and relatively moves the relative position of the laser welding head and the welding stage to make the laser welding head Position and correspond to the semiconductor elements and emit a laser beam to penetrate at least one of the film and the substrate to heat the solder for soldering. 如請求項8所述的半導體元件雷射焊接方法，其中該焊接模組另設有一聚焦單元，該聚焦單元可以焊接載台之平面為雷射最小聚焦基礎原點，輸入考慮該基板之厚度、該等焊料之直徑，依光學聚焦設計為計算基礎，自動調整雷射聚焦位置，原理為雷射聚光截面，涵蓋該等導電線路之接點全域為概念，進行調整離焦。 The semiconductor device laser welding method according to claim 8, wherein the welding module is additionally provided with a focusing unit, and the focusing unit can be used to weld the plane of the stage as the laser minimum focusing base origin, and input considering the thickness of the substrate, The diameter of these solders is calculated based on the optical focus design, and the focus position of the laser is automatically adjusted. The principle is that the laser condensing section covers the entire area of the contact points of the conductive circuits, and the defocus is adjusted.
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