TWI734625B - Multi-segment wafer marking method and device - Google Patents

Multi-segment wafer marking method and device Download PDF

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TWI734625B
TWI734625B TW109134620A TW109134620A TWI734625B TW I734625 B TWI734625 B TW I734625B TW 109134620 A TW109134620 A TW 109134620A TW 109134620 A TW109134620 A TW 109134620A TW I734625 B TWI734625 B TW I734625B
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wafer
marked
marking
support
segment
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TW202215632A (en
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朱世杰
莊文忠
邱增明
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佳陞科技有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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Abstract

一種多段式晶片標記方法，準備一標記裝置及一待標記晶片，該標記裝置設有一本體、一多段模組及一標記模組，該多段模組設有一加工區及至少兩支撐組，該待標記晶片經由其中一支撐組的各支撐臂而移動至該加工區，該加工區及該支撐處共同夾持該待標記晶片，該標記模組對於該待標記晶片未被該支撐組各支撐臂所遮蔽的區域進行標記，完成標記後，該多段模組的另一支撐組的各支撐臂朝該加工區移動並與該待標記晶片相抵靠，原先固定該待標記晶片的支撐組的各支撐臂與該待標記晶片相分離並離開該加工區，對於該待標記晶片進行第二次標記作業，經由該多段模組各支撐組相對該待標記晶片移動的方式，於該待標記晶片上完成標記作業。A multi-segment chip marking method prepares a marking device and a chip to be marked. The marking device is provided with a body, a multi-segment module and a marking module. The multi-segment module is provided with a processing area and at least two support groups. The wafer to be marked is moved to the processing area through each support arm of one of the support groups. The processing area and the support jointly clamp the wafer to be marked. The marking module is not supported by the support group for the wafer to be marked. The area shielded by the arm is marked. After the marking is completed, each support arm of the other support group of the multi-segment module moves toward the processing area and abuts against the wafer to be marked, and originally fixes each of the support groups of the wafer to be marked. The support arm is separated from the wafer to be marked and leaves the processing area, and a second marking operation is performed on the wafer to be marked. The support groups of the multi-segment module move relative to the wafer to be marked on the wafer to be marked Complete the marking job.

Description

多段式晶片標記方法及其裝置Multi-segment wafer marking method and device

本發明涉及一種晶片標記方法及其裝置，尤指一種可改善標記效率、準確性及穩定性的多段式晶片標記方法及其裝置。 The invention relates to a method and a device for marking a wafer, in particular to a method and a device for marking a multi-segment wafer that can improve the efficiency, accuracy and stability of the marking.

按，現有晶圓(wafer)在進行半導體批次生產的製程前，必須於晶圓的背面進行文字或數字的標記(marking)，以便進行後續的批次加工及切晶(dicing)，目前大多透過雷射光束對於晶圓進行標記，而隨著晶圓尺寸的加大及薄型化的設計，現有晶圓常會有翹曲(warpage)的情形，使得現有晶圓於進行標記時，不僅無法準確地進行標記，且會對於晶圓造成傷害而無法使用，因此，目前為了避免晶圓產生翹曲的情形，一般會使用夾盤、夾具或按壓構件等加壓裝置進行壓抵，降低現有晶圓翹曲的程度及避免晶圓位移。 According to the existing wafers, prior to the semiconductor batch production process, text or numerical marking must be performed on the back of the wafer for subsequent batch processing and dicing. At present, most The laser beam is used to mark the wafer. With the increase in wafer size and thinner design, the existing wafers often have warpage, which makes the existing wafers not only inaccurate when marking It will cause damage to the wafer and become unusable. Therefore, in order to avoid the warpage of the wafer, pressure devices such as chuck, clamp or pressing member are generally used to press against the existing wafer. The degree of warpage and avoid wafer displacement.

進一步，當現有晶圓進行雷射標記時，主要是將現有晶圓設置於該加壓裝置的一基座(base)上，並於現有晶圓上、下側分別設置一壓環(ring)及一底座(stage)，經由上述三構件同時夾持晶圓的方式，使雷射標記裝置能對於現有晶圓進行標記作業，然而，透過前述三構件同時夾持晶圓的方式，雖可改善現有晶圓翹曲的情形，但該加壓裝置具有較多的構件，相對會增加操作所需的時間、成本及複雜度；再進一步，為避免該加壓裝置遮蔽現有晶圓而影響雷射標記作業，該加壓裝置的壓環呈一中空的環狀結構，僅對於該晶圓的外周緣進行夾持，然而，雖可透過夾持現有晶圓外周緣的方式，避免影響雷射標記裝置的標記作業，但僅夾持現有晶圓外周緣的方式，容易因夾持區域的面積小 而使得該加壓裝置的夾持力道不足，進而影響現有晶圓的夾持穩定度及雷射標記的穩定性；進一步，該加壓裝置的底座為四分之一局部鏤空的結構型態，四分之三為實體的結構型態，該實體結構部分用以對於晶圓進行吸附的真空作業，於進行雷射標記作業時僅針對未被該底座遮蔽的鏤空結分進行雷射標記，需透過多次流程後(旋轉該底座)方能於該晶圓上完成標記，相對會增加對於晶圓進行雷射標記所需的時間及成本。 Furthermore, when laser marking is performed on an existing wafer, it is mainly to set the existing wafer on a base of the pressing device, and set a ring on the upper and lower sides of the existing wafer. And a stage, which enables the laser marking device to perform marking operations on existing wafers through the above-mentioned three-member simultaneous clamping of the wafer. However, through the aforementioned three-member simultaneous clamping of the wafer, it can be improved The existing wafer warping situation, but the pressing device has more components, which will increase the time, cost and complexity required for the operation; further, in order to prevent the pressing device from covering the existing wafer and affecting the laser In the marking operation, the pressing ring of the pressing device is a hollow ring structure and only clamps the outer periphery of the wafer. However, although the outer periphery of the existing wafer can be clamped to avoid affecting the laser marking The marking operation of the device, but only clamps the outer periphery of the existing wafer, which is easy to be caused by the small area of the clamping area As a result, the clamping force of the pressing device is insufficient, which affects the stability of the existing wafer clamping and the stability of the laser mark; further, the base of the pressing device is a quarter-partial hollow structure. Three-quarters of the physical structure type is used for vacuum operation to suck the wafer. When laser marking is performed, only the hollowed out components that are not covered by the base are used for laser marking. After several processes (rotating the base), marking can be completed on the wafer, which will relatively increase the time and cost required for laser marking on the wafer.

另外，現有加壓裝置為因應圓形晶圓的結構態樣，大多設計為與現有晶圓形狀相配合的環形結構，因此，當欲對於面板級封裝(panel level package)等非圓形結構態樣之產品進行雷射標記時，由於無法使用現有的加壓裝置夾持面板外緣旋轉中間底座的方式，因此，用於夾持晶圓的現有加壓裝置無法使用於面板的雷射標記作業上，有鑑於此，現有晶圓或面板的標記方法及裝置，誠有其需加以改進之處。 In addition, the existing pressurizing devices are designed to match the shape of the existing wafer in a ring structure in response to the structure of the circular wafer. Therefore, when it is necessary to deal with the non-circular structure of the panel level package (panel level package), etc. When performing laser marking on the same product, the existing pressing device cannot be used to clamp the outer edge of the panel to rotate the intermediate base. Therefore, the existing pressing device used to clamp the wafer cannot be used for the laser marking operation of the panel. Above, in view of this, the existing marking methods and devices for wafers or panels need to be improved.

因此，為解決現有晶圓或面板標記方法及其裝置，於進行標記時需透過基座、壓環及底座等三構件進行夾持，且該壓環的環狀夾持方式，容易因夾持區域的面積小而使得該加壓裝置的夾持力道不足，進而影響現有晶圓的夾持穩定度及雷射標記的穩定性；進一步，現有加壓裝置於進行雷射標記作業時，該底座需多次旋轉方可於該晶圓上完成雷射標記作業，相對會增加雷射標記作業所需的時間與成本；再進一步，現有加壓裝置無法同時提供晶圓及面板進行使用，相對限制其實用性的問題及不足，本發明提供一種多段式晶片標記方法及其裝置，能以精簡的結構配置進行分段加工的方式，提供較大的夾持面積，進而提供晶片足夠的夾持力道，使晶片能在夾持穩定度佳的情況下進行標記作業；進一步，本發明於進行雷射標記作業時，不需多次旋轉即可於該晶 片上完成雷射標記作業，可相對縮短及減少雷射標記作業所需的時間與成本；再進一步，本發明的結構可同時適用於圓形晶圓以及方形面板，藉以提供一可改善標記效率、準確性及穩定性的多段式晶片標記方法及其裝置。 Therefore, in order to solve the problem of the conventional wafer or panel marking method and its device, the marking needs to be clamped through three components: the base, the pressure ring and the base, and the ring-shaped clamping method of the pressure ring is easy to be clamped. The small area of the area makes the clamping force of the pressing device insufficient, which affects the clamping stability of the existing wafers and the stability of the laser marking; further, when the existing pressing device performs the laser marking operation, the base It takes multiple rotations to complete the laser marking operation on the wafer, which will relatively increase the time and cost required for the laser marking operation; furthermore, the existing pressure device cannot provide the wafer and the panel for use at the same time, which is relatively limited For practical problems and shortcomings, the present invention provides a multi-segment wafer marking method and device, which can perform segmented processing with a simplified structure configuration, provide a larger clamping area, and thereby provide a sufficient clamping force for the wafer , So that the wafer can be marked under the condition of good clamping stability; further, the present invention does not need to rotate multiple times when the laser marking operation is performed on the wafer Finishing the laser marking operation on the chip can relatively shorten and reduce the time and cost required for the laser marking operation; furthermore, the structure of the present invention can be applied to both round wafers and square panels, thereby providing an improved marking efficiency, Accurate and stable multi-segment wafer marking method and device.

基於上述目的，本發明係在於提供一多段式晶片標記方法，其係包括：準備步驟：準備一標記裝置及一待標記晶片，該標記裝置設有一本體、一多段模組及一標記模組，該多段模組設置於該本體上且設有一加工區及至少兩支撐組，該加工區設置於該本體上，該至少兩支撐組設置於該本體上且位於該加工區一側，各該支撐組可移動地靠近或遠離該加工區，各該支撐組設有數個間隔設置的支撐臂，且該至少兩支撐組的支撐臂係相平行且交錯設置，該標記模組設置於該本體上且位於該多段模組的下方；前置步驟：將該待標記晶片放置於該多段模組上並經由其中一支撐組移動至該加工區，該待標記晶片由該加工區及固定於該支撐組的支撐臂共同夾持固定；以及多段標記步驟：當該待標記晶片固定於該支撐組的支撐臂上，經由該標記模組對於該待標記晶片未被該支撐組各支撐臂所遮蔽的區域進行標記，完成標記後，驅動該多段模組的另一支撐組的各支撐臂朝該加工區移動，使該另一支撐組的各支撐臂移動至該待標記晶片的下方並與其相抵靠，此時，原先固定該待標記晶片的支撐組的各支撐臂與該待標記晶片相分離並離開該加工區，使該待標記晶片夾持固定於該加工區及該另一支撐組之間，且該標記模組對於該待標記晶片進行第二次的標記作業，經由該多段模組各支撐組相對該待標記晶片移動的方式，使該標記模組於該待標記晶片上完成標記作業。 Based on the above objective, the present invention is to provide a multi-segment wafer marking method, which includes: preparation steps: preparing a marking device and a wafer to be marked, the marking device is provided with a body, a multi-segment module and a marking mold The multi-segment module is arranged on the body and is provided with a processing area and at least two support groups, the processing area is arranged on the body, the at least two support groups are arranged on the body and located on one side of the processing area, each The supporting group is movably close to or away from the processing area, each supporting group is provided with several supporting arms arranged at intervals, and the supporting arms of the at least two supporting groups are arranged in parallel and staggered, and the marking module is arranged on the body Above and below the multi-segment module; the pre-step: place the wafer to be marked on the multi-segment module and move it to the processing area via one of the support groups, and the wafer to be marked is fixed to the processing area by the processing area and The support arms of the support group are clamped and fixed together; and a multi-stage marking step: when the wafer to be marked is fixed on the support arm of the support group, the wafer to be marked is not covered by the support arms of the support group through the marking module After the marking is completed, the support arms of the other support group of the multi-segment module are driven to move toward the processing area, so that the support arms of the other support group move below the wafer to be marked and resist it By the way, at this time, the support arms of the support group that originally fixed the wafer to be marked are separated from the wafer to be marked and leave the processing area, so that the wafer to be marked is clamped and fixed between the processing area and the other support group And the marking module performs a second marking operation on the wafer to be marked, and the marking module completes marking on the wafer to be marked by moving the support groups of the multi-segment module relative to the wafer to be marked Operation.

進一步，如前所述的多段式晶片標記方法，其中在準備步驟中，該加工區設有一基座及一抑制環，該基座用與該待標記晶片相抵靠，該基 座設有數個環狀間隔設置的頂針，而該抑制環可移動地位於該基座上方，用以壓抵該待標記晶片。 Further, in the multi-stage wafer marking method as described above, in the preparation step, the processing area is provided with a susceptor and a suppression ring, the susceptor is used to abut against the wafer to be marked, and the substrate The seat is provided with a plurality of ring-shaped thimbles arranged at intervals, and the suppression ring is movably located above the pedestal for pressing against the chip to be marked.

再進一步，如前所述的多段式晶片標記方法，其中在前置步驟中，將該待標記晶片經由該多段模組其中一支撐組移動至該加工區該抑制環朝該基座方向移動並壓抵該待標記晶片，該基座朝該抑制環方向移動，使該基座的各頂針與該待標記晶片相貼靠，使該待標記晶片於標記過程中受到該抑制環、該基座以及其中一支撐組共同夾持固定，對於該待標記晶片進行對準及資料讀取。 Still further, the multi-segment wafer marking method as described above, wherein in the pre-step, the wafer to be marked is moved to the processing area via one of the support groups of the multi-segment module, the suppression ring is moved toward the susceptor and When pressing against the wafer to be marked, the susceptor moves in the direction of the suppression ring, so that each ejector pin of the susceptor abuts against the wafer to be marked, so that the wafer to be marked is subjected to the suppression ring and the susceptor during the marking process. And one of the support groups is clamped and fixed together to perform alignment and data reading on the wafer to be marked.

較佳的是，如前所述的多段式晶片標記方法，其中在多段標記步驟中，當該晶片完成標記後，該基座朝下移動而使各頂針與該待標記晶片相分離，驅動該多段模組的另一支撐組的各支撐臂朝該加工區移動，使該支撐組的各支撐臂移動至該待標記晶片的下方並吸附該待標記晶片，此時，該待標記晶片被該抑制環及該兩支撐組同時夾持固定，原先與該待標記晶片吸附的支撐組與該待標記晶片相分離並離開該加工區而回到初始位置，該基座朝上移動使各頂針與該待標記晶片相抵靠，使該待標記晶片被該抑制環、該另一支撐組及該基座共同夾持固定。 Preferably, the multi-segment wafer marking method as described above, wherein in the multi-segment marking step, after the wafer is marked, the susceptor moves downward to separate each ejector pin from the wafer to be marked and drive the wafer to be marked. Each support arm of the other support group of the multi-segment module moves toward the processing area, so that each support arm of the support group moves below the wafer to be marked and adsorbs the wafer to be marked. At this time, the wafer to be marked is The restraining ring and the two support groups are clamped and fixed at the same time. The support group that was originally adsorbed by the wafer to be marked is separated from the wafer to be marked and leaves the processing area to return to the initial position. The base moves upward to make each thimble and The wafer to be marked is pressed against each other, so that the wafer to be marked is clamped and fixed by the suppression ring, the other supporting group and the base.

較佳的是，如前所述的多段式晶片標記方法，其中在多段標記步驟中，該標記模組對於該待標記晶片進行第二次的標記作業，經由該多段模組各支撐組相對該待標記晶片移動的方式，使該標記模組於該待標記晶片上完成標記作業，當該晶片完成標記後，該基座的各頂針朝下移動與該晶片相分離，且該抑制環朝上移動與該晶片相分離，該多段模組的該另一支撐組離開該加工區，完成晶片的標記作業。 Preferably, the multi-segment wafer marking method as described above, wherein in the multi-segment marking step, the marking module performs a second marking operation on the wafer to be marked, and each support group of the multi-segment module faces the The way the wafer to be marked moves is such that the marking module completes the marking operation on the wafer to be marked. After the wafer is marked, the ejector pins of the susceptor move downward to separate from the wafer, and the suppression ring faces upward The movement is separated from the wafer, and the other support group of the multi-segment module leaves the processing area to complete the wafer marking operation.

較佳的是，如前所述的多段式晶片標記方法，其中在準備步驟中，該標記裝置於該本體上設有一位於該多段模組一側的夾取模組，該夾取模 組係用以夾取該待標記晶片，各該支撐組設有一驅動件，各該支撐組的驅動件係與該數個支撐臂相結合，用以帶動該數個支撐臂靠近或遠離該加工區，該標記模組設有至少一雷射頭，各該雷射頭朝向該多段模組的加工區。 Preferably, the multi-segment wafer marking method as described above, wherein in the preparation step, the marking device is provided with a clamping module located on one side of the multi-segment module on the main body, and the clamping mold The group is used to clamp the chip to be marked, each support group is provided with a driving part, and the driving part of each support group is combined with the support arms to drive the support arms closer to or away from the processing Area, the marking module is provided with at least one laser head, and each laser head faces the processing area of the multi-segment module.

本發明係在於提供一多段式晶片標記裝置，其係包括：一本體；一多段模組，該多段模組設置於該本體上且設有一加工區及至少兩支撐組，該加工區設置於該本體上，該至少兩支撐組設置於該本體上且位於該加工區一側，各該支撐組可移動地靠近或遠離該加工區，各該支撐組設有數個間隔設置的支撐臂，且該至少兩支撐組的支撐臂係相平行且交錯設置；以及一標記模組，該標記模組設置於該本體上且位於該多段模組的下方。 The present invention is to provide a multi-segment wafer marking device, which includes: a body; a multi-segment module, the multi-segment module is arranged on the body and is provided with a processing area and at least two support groups, the processing area is provided On the main body, the at least two support groups are arranged on the main body and located at one side of the processing area, each of the support groups is movably close to or away from the processing area, and each of the support groups is provided with several support arms arranged at intervals, And the support arms of the at least two support groups are arranged in parallel and staggered; and a marking module, the marking module is arranged on the body and located below the multi-segment module.

進一步，如前所述的多段式晶片標記裝置，其中該加工區設有一基座及一抑制環，該基座用以承接一標記晶片，該基座設有數個環狀間隔設置的頂針，而該抑制環可移動地位於該基座上方，用以壓抵該待標記晶片。 Furthermore, the multi-segment wafer marking device as described above, wherein the processing area is provided with a base and a suppression ring, the base is used to receive a marking wafer, the base is provided with a plurality of ring-shaped ejection pins arranged at intervals, and The suppression ring is movably located above the base for pressing against the chip to be marked.

再進一步，如前所述的多段式晶片標記裝置，其中各該支撐組設有一驅動件，各該支撐組的驅動件係與該數個支撐臂相結合，用以帶動該數個支撐臂靠近或遠離該加工區。 Still further, in the multi-segment wafer marking device as described above, each of the support groups is provided with a driving member, and the driving member of each support group is combined with the plurality of support arms to drive the plurality of support arms to approach Or stay away from the processing area.

較佳的是，如前所述的多段式晶片標記裝置，其中該標記模組設有至少一雷射頭，各該雷射頭朝向該多段模組的加工區。 Preferably, the multi-segment wafer marking device as described above, wherein the marking module is provided with at least one laser head, and each of the laser heads faces the processing area of the multi-segment module.

較佳的是，如前所述的多段式晶片標記裝置，其中該標記裝置於該本體上設有一位於該多段模組一側的夾取模組，該夾取模組係用以夾取該待標記晶片。 Preferably, the multi-segment chip marking device as described above, wherein the marking device is provided with a clamping module located on one side of the multi-segment module on the main body, and the clamping module is used for clamping the Wafer to be marked.

藉由上述的技術手段，本發明的多段式晶片標記方法及其裝置，在對於該待標記晶片進行標記作業時，係同時透過抑制環、其中一支撐組及基座同時夾持固定該待標記晶片，使該待標記晶片不僅能透過該抑制環及該 基座的各頂針的抵靠，而於該待標記晶片的圓周處提供夾持力，並且同時透過該多段模組至少一支撐組的各支撐臂於該待標記晶片背面的支撐，使該待標記晶片受到夾持的面積大幅提高，進而提供該待標記晶片足夠的夾持力道，使其能在夾持穩定度佳的情況下進行標記作業；再者，該基座除了能與該抑制環及該支撐組提供一共同夾持該待標記晶片的功能及效果，亦可於夾持過程中提供該支撐組一輔助支撐的效果，能大幅提高夾持及標記過程中所需的結構強度及穩定性；進一步，本發明僅需透過該多段模組的各支撐組的移動，即可在不旋轉的情況下完成晶圓的雷射標記作業，可相對縮短或減少所需的時間及成本；再進一步，本發明透過設置該多段模組的至少兩支撐組的結構配置，使本發明不僅能對於圓形晶圓進行穩固的夾持固定及標記作業，亦可對於方形面板進行穩固的夾持固定及標記作業，不需另外購置不同結構或尺寸的加壓裝置，藉以提供一可改善標記效率、準確性及穩定性的多段式晶片標記方法及其裝置。 With the above technical means, the multi-stage wafer marking method and device of the present invention, when marking the wafer to be marked, simultaneously clamp and fix the to-be-marked wafer through the suppression ring, one of the support groups and the base. Chip so that the chip to be marked can not only pass through the suppression ring and the The susceptor’s thimble is pressed against each other to provide a clamping force at the circumference of the wafer to be marked, and at the same time through the support of each support arm of the at least one support group of the multi-segment module on the back of the wafer to be marked, the wafer to be marked The area where the marking wafer is clamped is greatly increased, thereby providing sufficient clamping force for the wafer to be marked, so that it can perform marking operations with good clamping stability; in addition, the base can not only interact with the suppression ring And the support group provides a function and effect of jointly clamping the chip to be marked, and can also provide the effect of an auxiliary support of the support group during the clamping process, which can greatly improve the structural strength and the required structure during the clamping and marking process. Stability; further, the present invention only needs to move through the support groups of the multi-segment module to complete the laser marking operation of the wafer without rotating, which can relatively shorten or reduce the required time and cost; Furthermore, the present invention provides the structure configuration of at least two support groups of the multi-segment module, so that the present invention can not only securely clamp and fix round wafers, but also securely clamp square panels. For fixing and marking operations, there is no need to purchase additional pressurizing devices of different structures or sizes, thereby providing a multi-segment wafer marking method and device that can improve marking efficiency, accuracy, and stability.

10:本體 10: body

20:夾取模組 20: Clamping module

30:多段模組 30: Multi-segment module

31:加工區 31: Processing area

32:第一支撐組 32: The first support group

321:第一支撐臂 321: first support arm

322:驅動件 322: Driver

33:第二支撐組 33: The second support group

331:第二支撐臂 331: second support arm

332:驅動件 332: Driver

34:基座 34: Pedestal

341:頂針 341: Thimble

35:抑制環 35: suppression ring

40:標記模組 40: marking module

60:晶片 60: chip

圖1是本發明多段式晶片標記方法的操作步驟方塊流程圖。 Fig. 1 is a block flow diagram of the operation steps of the multi-segment wafer marking method of the present invention.

圖2是本發明多段式晶片標記裝置的立體外觀圖。 2 is a perspective view of the multi-stage wafer marking device of the present invention.

圖3是本發明多段式晶片標記裝置的局部放大立體外觀圖。 Fig. 3 is a partially enlarged perspective view of the multi-stage wafer marking device of the present invention.

圖4是本發明多段式晶片標記裝置的俯視示意圖。 4 is a schematic top view of the multi-stage wafer marking device of the present invention.

圖5至11是本發明多段式晶片標記方法的連續操作示意圖。 5 to 11 are schematic diagrams of the continuous operation of the multi-stage wafer marking method of the present invention.

為能詳細瞭解本發明的技術特徵及實用功效並可依照說明書的內容來實現，玆進一步以如圖式所示的較佳實施例，詳細說明如後： 本發明係提供一多段式晶片標記方法及其裝置，請配合參看如圖1所示之多段式晶片標記方法，該多段式晶片標記方法包括有一準備步驟、一前置步驟及一多段標記步驟，其中： In order to understand the technical features and practical effects of the present invention in detail and implement it in accordance with the content of the specification, the preferred embodiment shown in the figure is further described in detail as follows: The present invention provides a multi-segment wafer marking method and device. Please refer to the multi-segment wafer marking method shown in FIG. 1. The multi-segment wafer marking method includes a preparation step, a pre-step and a multi-segment marking Steps, where:

A、準備步驟：請配合參看如圖2至圖4所示，在該準備步驟中準備一標記裝置及一待標記晶片60(可為一晶圓或一面板)，其中該標記裝置設有一本體10、一夾取模組20、一多段模組30及一標記模組40，該夾取模組20設置於該本體10上，可用以夾取該待標記晶片60，較佳的是，該夾取模組20可為一機械手臂，該多段模組30設置於該本體10上且位於該夾取模組20的一側，該多段模組30設有一加工區31及至少兩支撐組32、33，該加工區31設置於該本體10上且設有一基座34及一抑制環35，較佳的是，該基座34設有數個環狀間隔設置的頂針341，而該抑制環35可移動地位於該基座34上方，用以壓抵該待標記晶片60，減少該待標記晶片60的翹曲情形，較佳的是，該抑制環35具有一抽真空結構。 A. Preparation steps: please refer to Figures 2 to 4, in which a marking device and a wafer to be marked 60 (which can be a wafer or a panel) are prepared in this preparation step, wherein the marking device is provided with a body 10. A clamping module 20, a multi-segment module 30 and a marking module 40. The clamping module 20 is arranged on the body 10 and can be used to clamp the chip 60 to be marked. Preferably, The clamping module 20 can be a mechanical arm. The multi-segment module 30 is disposed on the body 10 and located on one side of the clamping module 20. The multi-segment module 30 is provided with a processing area 31 and at least two support groups. 32, 33. The processing area 31 is arranged on the body 10 and is provided with a base 34 and a suppression ring 35. Preferably, the base 34 is provided with a plurality of ring-shaped thimble pins 341 arranged at intervals, and the suppression ring 35 is movably located above the base 34 to press against the wafer to be marked 60 to reduce the warpage of the wafer to be marked 60. Preferably, the suppression ring 35 has a vacuum structure.

請進一步配合圖5所示，該至少兩支撐組32、33設置於該本體10上且位於該加工區31的一側，且各該支撐組32、33可移動地靠近或遠離該加工區31，各該支撐組32、33設有數個間隔設置的支撐臂321、331及一驅動件322、332，該至少兩支撐組32、33的支撐臂321、331係相平行且交錯設置，各該支撐組32、33的驅動件322、332係與該數個支撐臂321、331相結合，用以帶動該數個支撐臂321、331靠近或遠離該加工區31，較佳的是，該標記裝置30設有兩支撐組32、33，其分別為一第一支撐組32及一第二支撐組33，該第一支撐組32設有數個第一支撐臂321，該第二支撐組33設有數個第二支撐臂331，進一步，各支撐組32、33的驅動件322、332為一線性滑軌，再進一步，各該支撐組32、33的各支撐臂321、331係設有一抽真空結構。 Please further cooperate with FIG. 5, the at least two support groups 32, 33 are arranged on the main body 10 and located on one side of the processing area 31, and each of the support groups 32, 33 is movably close to or away from the processing area 31 Each of the supporting groups 32, 33 is provided with several supporting arms 321, 331 and a driving member 322, 332 arranged at intervals. The supporting arms 321, 331 of the at least two supporting groups 32, 33 are arranged in parallel and staggered. The driving members 322 and 332 of the support groups 32 and 33 are combined with the support arms 321 and 331 to drive the support arms 321 and 331 closer to or away from the processing area 31. Preferably, the marking The device 30 is provided with two support groups 32, 33, which are respectively a first support group 32 and a second support group 33. The first support group 32 is provided with a plurality of first support arms 321, and the second support group 33 is provided with There are several second support arms 331. Further, the driving members 322, 332 of each support group 32, 33 are linear slide rails, and further, each support arm 321, 331 of each support group 32, 33 is provided with a vacuum structure.

該標記模組40設置於該本體10上且位於該多段模組30的下方，該標記模組40用以對於該待標記晶片60進行標記作業，較佳的是，該標記模組40設有至少一雷射頭41，各該雷射頭41朝向該多段模組30的加工區31。 The marking module 40 is disposed on the main body 10 and located below the multi-segment module 30. The marking module 40 is used for marking the chip 60 to be marked. Preferably, the marking module 40 is provided with At least one laser head 41, each of the laser heads 41 faces the processing area 31 of the multi-segment module 30.

B、前置步驟：在該前置步驟中，係如圖2及圖3所示，藉由該夾取模組20將該待標記晶片60放置於該多段模組30上，並經由其中一支撐組32、33(於本較佳實施例中為該第一支撐組32)移動至該加工區31，使位於該第一支撐組32上的該待標記晶片60位於該基座34及該抑制環35之間，如圖7所示該抑制環35朝該基座34方向移動並壓抵該待標記晶片60，此時如圖6所示該基座34朝該抑制環35方向移動，使該基座34的各頂針341(各頂針341避開該第一支撐組32的各支撐臂321)與該待標記晶片60相貼靠，此時，該待標記晶片60被該抑制環35、第一支撐組32及該基座34共同夾持，對於該待標記晶片60進行對準及資料讀取，其中該基座34除了能與該抑制環35及該第一支撐組32提供一共同夾持該待標記晶片60的功能及效果，亦可於夾持過程中提供該第一支撐組32一輔助支撐的效果，能大幅提高夾持及標記過程中所需的結構強度及穩定性。 B. Pre-step: In the pre-step, as shown in FIGS. 2 and 3, the chip to be marked 60 is placed on the multi-segment module 30 by the clamping module 20, and one of them The support groups 32, 33 (the first support group 32 in the preferred embodiment) are moved to the processing area 31, so that the wafer to be marked 60 on the first support group 32 is located on the base 34 and the Between the suppression rings 35, as shown in FIG. 7, the suppression ring 35 moves toward the base 34 and presses against the wafer to be marked 60. At this time, as shown in FIG. 6, the base 34 moves toward the suppression ring 35. Make each thimble 341 of the base 34 (each thimble 341 avoids the support arms 321 of the first support group 32) abut the wafer 60 to be marked. At this time, the wafer 60 to be marked is blocked by the suppression ring 35. , The first support group 32 and the base 34 are clamped together to perform alignment and data reading of the wafer 60 to be marked. The base 34 can provide a connection with the suppression ring 35 and the first support group 32. The function and effect of jointly clamping the wafer 60 to be marked can also provide the effect of an auxiliary support of the first support group 32 during the clamping process, which can greatly improve the structural strength and stability required during the clamping and marking process .

C、多段標記步驟：當該待標記晶片60夾持固定於該抑制環35、該第一支撐組32的支撐臂321以及該基座34之間，且於校準及讀取資料後，經由該標記模組40對於該待標記晶片60未被該第二支撐組33各支撐臂331所遮蔽的區域進行標記，完成標記後，該基座34朝下移動而使各頂針341與該待標記晶片60相分離，如圖8所示驅動該多段模組30的另一支撐組32、33(於本較佳實施例中為該第二支撐組33)的各支撐臂321、331(第二支撐臂331)朝該加工區31移動，使該第二支撐組33的各支撐臂331移動至該待標記晶片60的下方並吸附該待標記晶片60，此時，該待標記晶片60被該抑制環35、該第一支撐組32及該第二支撐組33同時夾持固定，如圖9所示，原先與該待標記晶片60吸附的第一支撐組32的各支撐臂321與該待標記晶片60相分離並離開該加工區31而 回到初始位置，該基座34朝上移動使各頂針與該待標記晶片60相抵靠，使該待標記晶片60被該抑制環35、第二支撐組33及該基座34共同夾持固定，該標記模組40對於該待標記晶片60進行第二次的標記作業，經由該多段模組30各支撐組32、33相對該待標記晶片60移動的方式，使該標記模組40於該待標記晶片60上完成標記作業，進一步，當該晶片60完成標記後，該基座34的各頂針341朝下移動與該晶片60相分離，且該抑制環35朝上移動與該晶片60相分離，如圖10及11所示該多段模組30的第二支撐組33離開該加工區31，該夾取模組20夾取該晶片60離開該多段模組30。 C. Multi-stage marking step: when the wafer 60 to be marked is clamped and fixed between the suppression ring 35, the support arm 321 of the first support group 32, and the base 34, and after calibration and data reading, pass through the The marking module 40 marks the area of the wafer 60 to be marked that is not covered by the support arms 331 of the second support group 33. After the marking is completed, the base 34 moves downward to cause the ejectors 341 and the wafer to be marked. 60 phase separation, as shown in FIG. 8 to drive the support arms 321, 331 (second support The arm 331) moves toward the processing area 31, so that each support arm 331 of the second support group 33 moves below the wafer to be marked 60 and sucks the wafer to be marked 60. At this time, the wafer to be marked 60 is restrained by the The ring 35, the first support group 32, and the second support group 33 are clamped and fixed at the same time. As shown in FIG. The wafer 60 phase separates and leaves the processing zone 31 while Returning to the initial position, the base 34 moves upward to make each thimble abut the wafer to be marked 60, so that the wafer to be marked 60 is clamped and fixed together by the suppression ring 35, the second support group 33 and the base 34 , The marking module 40 performs a second marking operation on the wafer 60 to be marked, and moves the marking module 40 on the wafer 60 by moving the support groups 32, 33 of the multi-segment module 30 relative to the wafer 60 to be marked. The marking operation is completed on the wafer 60 to be marked. Further, after the wafer 60 is marked, the ejector pins 341 of the susceptor 34 move downward to separate from the wafer 60, and the suppression ring 35 moves upward to be in contact with the wafer 60 Separately, as shown in FIGS. 10 and 11, the second support group 33 of the multi-segment module 30 leaves the processing area 31, and the clamping module 20 clamps the wafer 60 away from the multi-segment module 30.

藉由上述的技術手段，本發明的多段式晶片標記方法及其裝置，在對於該待標記晶片60進行標記作業時，係同時透過抑制環35、其中一支撐組32、33及基座34同時夾持固定該待標記晶片60，使該待標記晶片60不僅能透過該抑制環35及該基座34的各頂針34的抵靠，而於該待標記晶片60的圓周處提供足夠的夾持力，並且同時透過該多段模組30至少一支撐組32、33的各支撐臂321、331於該待標記晶片60背面的支撐，使該待標記晶片60受到夾持的面積大幅提高，進而提供該待標記晶片60足夠的夾持力道，使其能在夾持穩定度佳的情況下進行標記作業該基座34除了能與該抑制環35及各該支撐組32、33提供一共同夾持該待標記晶片60的功能及效果，亦可於夾持過程中提供各該支撐組32、33一輔助支撐的效果，能大幅提高夾持及標記過程中所需的結構強度及穩定性；進一步，本發明於進行雷射標記作業時，不需多次旋轉即可於該晶片上完成雷射標記作業，可相對縮短及減少雷射標記作業所需的時間與成本；再進一步，本發明透過設置該多段模組30的至少兩支撐組32、33的結構配置，使本發明不僅能對於圓形晶圓進行穩固的夾持固定及標記作業，亦可對於方形面板進行穩固的夾持固定及標記作業，不需另外購置不同結構或尺寸的加壓裝置， 藉以提供一可改善標記效率、準確性及穩定性的多段式晶片標記方法及其裝置。 With the above technical means, the multi-stage wafer marking method and device of the present invention, when marking the wafer 60 to be marked, simultaneously passes through the suppression ring 35, one of the support groups 32, 33, and the base 34. Clamp and fix the wafer 60 to be marked so that the wafer 60 to be marked not only penetrates the abutment of the restraining ring 35 and the thimble 34 of the base 34, but also provides sufficient clamping at the circumference of the wafer 60 to be marked At the same time, through the support of the support arms 321, 331 of the at least one support group 32, 33 of the multi-segment module 30 on the back of the wafer 60 to be marked, the clamping area of the wafer 60 to be marked is greatly increased, thereby providing The wafer to be marked 60 has sufficient clamping force to enable marking operations under the condition of good clamping stability. The base 34 can provide a common clamping with the suppression ring 35 and each of the support groups 32, 33. The function and effect of the wafer 60 to be marked can also provide an auxiliary support effect for each of the support groups 32 and 33 during the clamping process, which can greatly improve the structural strength and stability required during the clamping and marking process; When performing laser marking operations, the present invention can complete laser marking operations on the wafer without multiple rotations, which can relatively shorten and reduce the time and cost required for laser marking operations; The structure configuration of at least two support groups 32, 33 of the multi-segment module 30 enables the present invention to not only perform stable clamping and marking operations for round wafers, but also for stable clamping and fixing of square panels. For marking operations, there is no need to purchase additional pressurizing devices of different structures or sizes, Therefore, a multi-segment chip marking method and device which can improve the marking efficiency, accuracy and stability are provided.

以上所述，僅是本發明的較佳實施例，並非對本發明作任何形式上的限制，任何所屬技術領域中具有通常知識者，若在不脫離本發明所提技術方案的範圍內，利用本發明所揭示技術內容所作出局部更動或修飾的等效實施例，並且未脫離本發明的技術方案內容，均仍屬於本發明技術方案的範圍內。 The above are only the preferred embodiments of the present invention, and do not limit the present invention in any form. Anyone with ordinary knowledge in the relevant technical field can use the present invention without departing from the scope of the technical solution proposed by the present invention. The technical content disclosed in the invention is partially changed or modified equivalent embodiments without departing from the technical solution content of the present invention, and all still fall within the scope of the technical solution of the present invention.

Claims (11)

一種多段式晶片標記方法，其係包括：準備步驟：準備一標記裝置及一待標記晶片，該標記裝置設有一本體、一多段模組及一標記模組，該多段模組設置於該本體上且設有一加工區及至少兩支撐組，該加工區設置於該本體上，該至少兩支撐組設置於該本體上且位於該加工區一側，各該支撐組可移動地靠近或遠離該加工區，各該支撐組設有數個間隔設置的支撐臂，且該至少兩支撐組的支撐臂係相平行且交錯設置，該標記模組設置於該本體上且位於該多段模組的下方；前置步驟：將該待標記晶片放置於該多段模組上並經由其中一支撐組移動至該加工區，該待標記晶片由該加工區及該支撐組的支撐臂共同夾持固定；以及多段標記步驟：當該待標記晶片固定於該支撐組的支撐臂上，經由該標記模組對於該待標記晶片未被該支撐組各支撐臂所遮蔽的區域進行標記，完成標記後，驅動該多段模組的另一支撐組的各支撐臂朝該加工區移動，使該另一支撐組的各支撐臂移動至該待標記晶片的下方並與其相抵靠，此時，原先固定該待標記晶片的支撐組的各支撐臂與該待標記晶片相分離並離開該加工區，使該待標記晶片夾持固定於該加工區及該另一支撐組之間，該標記模組對於該待標記晶片進行第二次的標記作業，經由該多段模組各支撐組相對該待標記晶片移動的方式，使該標記模組於該待標記晶片上完成標記作業。 A multi-segment chip marking method, which includes the following steps: preparing a marking device and a chip to be marked. The marking device is provided with a main body, a multi-segment module and a marking module, and the multi-segment module is arranged on the main body A processing area and at least two support groups are provided on the upper part. The processing area is arranged on the body. The at least two support groups are arranged on the body and located on one side of the processing area. Each support group is movably close to or away from the In the processing area, each support group is provided with several support arms arranged at intervals, and the support arms of the at least two support groups are arranged in parallel and staggered, and the marking module is arranged on the body and located below the multi-segment module; Pre-step: placing the wafer to be marked on the multi-segment module and moving to the processing area via one of the support groups, the wafer to be marked is clamped and fixed by the processing area and the support arms of the support group; and multiple segments Marking step: when the wafer to be marked is fixed on the support arm of the support group, mark the area of the wafer to be marked that is not shielded by the support arms of the support group through the marking module, and after the marking is completed, drive the multi-segment Each support arm of the other support group of the module moves toward the processing area, so that each support arm of the other support group moves below and abuts against the wafer to be marked. Each support arm of the support group is separated from the wafer to be marked and leaves the processing area, so that the wafer to be marked is clamped and fixed between the processing area and the other support group. The marking module performs processing on the wafer to be marked. In the second marking operation, the marking module completes the marking operation on the wafer to be marked by moving the support groups of the multi-segment module relative to the wafer to be marked. 如請求項1所述之多段式晶片標記方法，其中在準備步驟中，該加工區設有一基座及一抑制環，該基座用以與該待標記晶片相抵靠，該基座設有數個環狀間隔設置的頂針，而該抑制環可移動地位於該基座上方，用以壓抵該待標記晶片。 The multi-stage wafer marking method according to claim 1, wherein in the preparation step, the processing area is provided with a base and a suppression ring, the base is used to abut against the wafer to be marked, and the base is provided with several The thimble is arranged annularly at intervals, and the suppression ring is movably located above the base for pressing against the chip to be marked. 如請求項2所述之多段式晶片標記方法，其中在前置步驟中，將該待標記晶片經由該多段模組其中一支撐組移動至該加工區進行對準及資料讀取，於校準及讀取資料後，該抑制環朝該基座方向移動並壓抵該待標記晶片，該基座朝該抑制環方向移動，使該基座的各頂針與該待標記晶片相貼靠，使該待標記晶片於標記過程中受到該抑制環、該基座以及其中一支撐組共同夾持固定。 The multi-segment wafer marking method according to claim 2, wherein in the pre-step, the wafer to be marked is moved to the processing area via one of the support groups of the multi-segment module for alignment and data reading, in the calibration and After reading the data, the suppression ring moves in the direction of the susceptor and presses against the wafer to be marked, and the susceptor moves in the direction of the suppression ring, so that the ejectors of the susceptor abut against the wafer to be marked, so that the During the marking process, the wafer to be marked is clamped and fixed by the suppression ring, the base and one of the support groups. 如請求項3所述之多段式晶片標記方法，其中在多段標記步驟中，當該晶片完成標記後，該基座朝下移動而使各頂針與該待標記晶片相分離，驅動該多段模組的另一支撐組的各支撐臂朝該加工區移動，使該支撐組的各支撐臂移動至該待標記晶片的下方並吸附該待標記晶片，此時，該待標記晶片被該抑制環及該兩支撐組同時夾持固定，原先與該待標記晶片吸附的支撐組與該待標記晶片相分離並離開該加工區而回到初始位置，該基座朝上移動使各頂針與該待標記晶片相抵靠，使該待標記晶片被該抑制環、該另一支撐組及該基座共同夾持固定。 The multi-segment wafer marking method according to claim 3, wherein in the multi-segment marking step, after the wafer is marked, the base moves downward to separate each ejector pin from the wafer to be marked, and drives the multi-segment module Each support arm of the other support group moves toward the processing area, so that each support arm of the support group moves below the wafer to be marked and adsorbs the wafer to be marked. At this time, the wafer to be marked is controlled by the suppression ring and The two support groups are clamped and fixed at the same time. The support group originally adsorbed by the wafer to be marked is separated from the wafer to be marked and leaves the processing area to return to the initial position. The base moves upward so that each thimble and the wafer to be marked The wafers are pressed against each other, so that the wafer to be marked is clamped and fixed by the suppression ring, the other support group, and the base. 如請求項4所述之多段式晶片標記方法，其中在多段標記步驟中，該標記模組對於該待標記晶片進行第二次的標記作業，經由該多段模組各支撐組相對該待標記晶片移動的方式，使該標記模組於該待標記晶片上完成標記作業，當該晶片完成標記後，該基座的各頂針朝下移動與該晶片相分離，且該抑制環朝上移動與該晶片相分離，該多段模組的該另一支撐組離開該加工區，完成晶片的標記作業。 The multi-segment wafer marking method according to claim 4, wherein in the multi-segment marking step, the marking module performs a second marking operation on the wafer to be marked, and relative to the wafer to be marked via each support group of the multi-segment module The way of movement enables the marking module to complete the marking operation on the wafer to be marked. After the wafer is marked, the ejector pins of the susceptor move downward to separate from the wafer, and the restraining ring moves upward to separate from the wafer. The wafers are separated, and the other support group of the multi-segment module leaves the processing area to complete the wafer marking operation. 如請求項1至5中任一項所述之多段式晶片標記方法，其中在準備步驟中，該標記裝置於該本體上設有一位於該多段模組一側的夾取模組，該夾取模組係用以夾取該待標記晶片，各該支撐組設有一驅動件，各該支撐組 的驅動件係與該數個支撐臂相結合，用以帶動該數個支撐臂靠近或遠離該加工區，該標記模組設有至少一雷射頭，各該雷射頭朝向該多段模組的加工區。 The multi-segment chip marking method according to any one of claims 1 to 5, wherein in the preparation step, the marking device is provided with a clamping module located on one side of the multi-segment module on the body, and the clamping The module is used to clamp the chip to be marked, each support group is provided with a driving part, and each support group The driving part is combined with the support arms to drive the support arms closer to or away from the processing area. The marking module is provided with at least one laser head, and each laser head faces the multi-segment module Processing area. 一種多段式晶片標記裝置，其係包括有：一本體；一多段模組，該多段模組設置於該本體上且設有一加工區及至少兩支撐組，該加工區設置於該本體上，該至少兩支撐組設置於該本體上且位於該加工區一側，各該支撐組可移動地靠近或遠離該加工區，各該支撐組設有數個間隔設置的支撐臂，且該至少兩支撐組的支撐臂係相平行且交錯設置；以及一標記模組，該標記模組設置於該本體上且位於該多段模組的下方。 A multi-segment wafer marking device includes: a body; a multi-segment module, the multi-segment module is arranged on the body and is provided with a processing area and at least two support groups, the processing area is arranged on the body, The at least two support groups are arranged on the body and located at one side of the processing area, each of the support groups can move close to or away from the processing area, each of the support groups is provided with several support arms arranged at intervals, and the at least two supports The supporting arms of the group are arranged in parallel and staggered; and a marking module, which is arranged on the body and located below the multi-segment module. 如請求項7所述之多段式晶片標記裝置，其中該加工區設有一基座及一抑制環，該基座用以承接一標記晶片，該基座設有數個環狀間隔設置的頂針，而該抑制環可移動地位於該基座上方，用以壓抵該待標記晶片。 The multi-segment wafer marking device according to claim 7, wherein the processing area is provided with a base and a suppression ring, the base is used to receive a marking wafer, and the base is provided with a plurality of ring-shaped ejection pins arranged at intervals, and The suppression ring is movably located above the base for pressing against the chip to be marked. 如請求項8所述之多段式晶片標記裝置，其中各該支撐組設有一驅動件，各該支撐組的驅動件係與該數個支撐臂相結合，用以帶動該數個支撐臂靠近或遠離該加工區。 The multi-segment wafer marking device according to claim 8, wherein each of the supporting groups is provided with a driving member, and the driving member of each supporting group is combined with the plurality of supporting arms to drive the plurality of supporting arms to approach or Stay away from the processing area. 如請求項9所述之多段式晶片標記裝置，其中該標記模組設有至少一雷射頭，各該雷射頭朝向該多段模組的加工區。 The multi-segment wafer marking device according to claim 9, wherein the marking module is provided with at least one laser head, and each laser head faces the processing area of the multi-segment module. 如請求項7至10中任一項所述之多段式晶片標記裝置，其中該標記裝置於該本體上設有一位於該多段模組一側的夾取模組，該夾取模組係用以夾取該待標記晶片。 The multi-segment chip marking device according to any one of claim 7 to 10, wherein the marking device is provided with a clamping module on one side of the multi-segment module on the body, and the clamping module is used for Clamp the wafer to be marked.
TW109134620A 2020-10-06 2020-10-06 Multi-segment wafer marking method and device TWI734625B (en)

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