TWI734535B - Active alignment system and active alignment method - Google Patents
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本發明係涉及光學領域，尤其係關於一種主動式對準系統與一種主動式對準方法。 The invention relates to the field of optics, in particular to an active alignment system and an active alignment method.
由於雷射光源有較大的光電轉換效率，且雷射光源所輸出之雷射光束具有能量高、波長一致、單一頻率以及準直性佳的光學特性，故雷射光源逐漸地被廣泛應用。請參閱圖1與圖2，圖1為習知雷射模組之部分結構的剖面概念示意圖，圖2為圖1所示雷射模組之部分結構的立體分解示意圖。習知的雷射模組1包括外殼體10、內殼體11、基板12、雷射單元13、反射光學元件15、準直光學元件16、繞射光學元件(diffractive optical element,DOE)17以及陶瓷板14，且基板12用以承載雷射單元13、陶瓷板14、外殼體10以及內殼體11，而雷射單元13設置於陶瓷板14上以電性連接於基板12；其中，內殼體11設置於外殼體10的容置
空間內，且準直光學元件16以及繞射光學元件17分別固定於內殼體11以及外殼體10上，使得準直光學元件16在垂直方向上是位於基板12以及繞射光學元件17之間。
Since the laser light source has a large photoelectric conversion efficiency, and the laser beam output by the laser light source has the optical characteristics of high energy, uniform wavelength, single frequency, and good collimation, the laser light source is gradually being widely used. Please refer to FIGS. 1 and 2. FIG. 1 is a schematic cross-sectional conceptual diagram of a partial structure of a conventional laser module, and FIG. 2 is a three-dimensional exploded diagram of a partial structure of the laser module shown in FIG. The
再者，當雷射單元13接收電力後，雷射單元13可提供複數雷射光束L1，且該些雷射光束L1會往反射光學元件15的方向行進，並於投射至反射光學元件15上後被反射光學元件15反射而朝準直光學元件16以及繞射光學元件17的方向行進。其中，準直光學元件16用以準直被反射光學元件15所反射而來的雷射光束L1，使通過準直光學元件16的雷射光束L1以較佳的入射方向入射至繞射光學元件17，而繞射光學元件17則用以對通過準直光學元件16後的雷射光束L1進行光束整型，使該些雷射光束L1形成結構光並予以向外投射。
Furthermore, when the
特別說明的是，雷射模組1零件組成較多，除了增加組裝上的複雜度，亦成為提升組裝精度的屏障；舉例來說，於組裝雷射模組1的過程中，將準直光學元件16固設於反射光學元件15上方時可能會發生定位的偏差，而將繞射光學元件17固設於準直光學元件16上方時亦可能發生定位的偏差，顯然地，各元件的堆疊組成將導致整體偏差不斷擴大，其精度僅約略落在微米級的程度，使得雷射模組1所投射的結構光無法滿足實際使用需求。
In particular, the
其中，現有的校正手段為，透過微機械加工(micro machining)進行機械切割的方式切割承載準直光學元件16之載體(即內殼體11)的底部(即與基板12的連接處)，使準直光學元件16位於準焦的位置與姿態，同樣亦透過微機械加工(micro machining)
進行機械切割的方式切割承載繞射光學元件17之載體(即外殼體10)的底部(即與基板12的連接處)，使繞射光學元件17位於準焦的位置與姿態。然而，上述微機械加工(micro machining)進行機械切割的方式所能提升的精度仍然有限，亦約略落在微米級的程度，且需透過極為昂貴的精密加工機進行，並且不適用於大量生產。
Among them, the existing correction means is to cut the bottom of the carrier (that is, the inner housing 11) (that is, the connection with the substrate 12) of the carrier (that is, the inner housing 11) carrying the collimating
本發明之一第一目的在提供一種用於組裝雷射模組的主動式對準系統，藉此提高雷射模組的製造精度並減少製造成本，且適用於大量生產。 One of the first objects of the present invention is to provide an active alignment system for assembling laser modules, thereby improving the manufacturing accuracy of laser modules and reducing manufacturing costs, and is suitable for mass production.
本發明之一第二目的在提供一種用於組裝雷射模組的主動式對準方法，藉此提高雷射模組的製造精度並減少製造成本，且適用於大量生產。 A second object of the present invention is to provide an active alignment method for assembling a laser module, thereby improving the manufacturing accuracy of the laser module and reducing the manufacturing cost, and is suitable for mass production.
於一較佳實施例中，本發明提供一種主動式對準系統，用以組裝一雷射模組，該雷射模組包括至少一光學鏡片以及一雷射單元，且該雷射單元所產生之一雷射光束於通過該少一光學鏡片後向外投射，其中，該主動式對準系統包括：一定位單元，用以移動該至少一光學鏡片；一第一感測單元，用以感測通過該至少一光學鏡片之該雷射光束而獲得一受測圖案；以及一控制單元，電性連接於該定位單元以及該第一感測單元之間，用以依據該受測圖案而驅動該定位單元移動該至少一光學鏡 片直至該受測圖案符合一檢測標準。 In a preferred embodiment, the present invention provides an active alignment system for assembling a laser module, the laser module includes at least one optical lens and a laser unit, and the laser unit generates A laser beam is projected outward after passing through the one less optical lens, wherein the active alignment system includes: a positioning unit for moving the at least one optical lens; and a first sensing unit for sensing Measuring the laser beam passing through the at least one optical lens to obtain a tested pattern; and a control unit electrically connected between the positioning unit and the first sensing unit for driving according to the tested pattern The positioning unit moves the at least one optical lens Until the tested pattern meets a testing standard.
於一較佳實施例中，該雷射模組還包括一反射光學元件，且該雷射單元係為一邊射型雷射單元；其中，該反射光學元件用以反射該邊射型雷射單元所產生之該雷射光束，使該雷射光束朝該至少一光學鏡片之方向行進。 In a preferred embodiment, the laser module further includes a reflective optical element, and the laser unit is a side shot laser unit; wherein the reflective optical element is used to reflect the side shot laser unit The generated laser beam causes the laser beam to travel in the direction of the at least one optical lens.
於一較佳實施例中，該雷射單元為一垂直共振腔面射型雷射單元(Vertical Cavity Surface Emitting Laser,VCSEL)，且該垂直共振腔面射型雷射單元所產生之該雷射光束朝該至少一光學鏡片之方向行進。 In a preferred embodiment, the laser unit is a vertical cavity surface emitting laser unit (Vertical Cavity Surface Emitting Laser, VCSEL), and the laser generated by the vertical cavity surface emitting laser unit The light beam travels in the direction of the at least one optical lens.
於一較佳實施例中，該定位單元係為一六軸定位單元。 In a preferred embodiment, the positioning unit is a six-axis positioning unit.
於一較佳實施例中，該至少一光學鏡片包括一準直光學元件，且該準直光學元件用以準直通過該準直光學元件之該雷射光束。 In a preferred embodiment, the at least one optical lens includes a collimating optical element, and the collimating optical element is used to collimate the laser beam passing through the collimating optical element.
於一較佳實施例中，該檢測標準包括一光點大小檢測標準、一光點形狀檢測標準及/或一光點位置檢測標準。 In a preferred embodiment, the detection standard includes a light spot size detection standard, a light spot shape detection standard, and/or a light spot position detection standard.
於一較佳實施例中，該第一感測單元係為一光束分析儀(beam profiler)。 In a preferred embodiment, the first sensing unit is a beam profiler.
於一較佳實施例中，該雷射模組還包括一內殼體，且該內殼體用以供該準直光學元件設置於其上；其中，該定位單元係經由移動該內殼體而移動該準直光學元件。 In a preferred embodiment, the laser module further includes an inner housing, and the inner housing is used for disposing the collimating optical element thereon; wherein, the positioning unit is moved by moving the inner housing And move the collimating optical element.
於一較佳實施例中，該主動式對準系統還包括一第二感測單元，其電性連接於該控制單元，並用以拍攝該準直光學元件；其中，該控制單元還用以依據該第二感測單元之一拍攝結 果而驅動該定位單元移動該準直光學元件，使該準直光學元件位於以該雷射單元之所在處為定位參考的一標準位置並處於一標準姿態。 In a preferred embodiment, the active alignment system further includes a second sensing unit, which is electrically connected to the control unit and used to photograph the collimating optical element; wherein the control unit is also used to The shooting result of one of the second sensing units As a result, the positioning unit is driven to move the collimating optical element so that the collimating optical element is located at a standard position with the location of the laser unit as a positioning reference and in a standard posture.
於一較佳實施例中，該雷射模組還包括一內殼體，且該內殼體用以供該準直光學元件設置於其上；其中，該定位單元係經由移動該內殼體而移動該準直光學元件。 In a preferred embodiment, the laser module further includes an inner housing, and the inner housing is used for disposing the collimating optical element thereon; wherein, the positioning unit is moved by moving the inner housing And move the collimating optical element.
於一較佳實施例中，該準直光學元件係先被該定位單元移動而位於以一系統自訂參考標準為定位參考的一預定位置並處於一預定姿態，再被該定位單元置於該內殼體上。 In a preferred embodiment, the collimating optical element is first moved by the positioning unit to be located at a predetermined position with a system-customized reference standard as a positioning reference and in a predetermined posture, and then placed in the positioning unit by the positioning unit. On the inner shell.
於一較佳實施例中，該第二感測單元包括至少三個攝像機，且該至少三個攝像機分別位於該準直光學元件之不同方向上。 In a preferred embodiment, the second sensing unit includes at least three cameras, and the at least three cameras are respectively located in different directions of the collimating optical element.
於一較佳實施例中，該至少一光學鏡片包括一繞射光學元件(diffractive optical element,DOE)，用以對通過其中之該雷射光束進行光束整型，而使該雷射光束形成一結構光。 In a preferred embodiment, the at least one optical lens includes a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, so that the laser beam forms a Structured light.
於一較佳實施例中，該檢測標準包括一特徵點數量(dot count)檢測標準、一對比度(contrast)檢測標準、一照明視場(field of illumination)檢測標準、一熱點(hot spot)檢測標準、一圖案角度(pattern angle)檢測標準、一零階光束(zero order)檢測標準、一能量均勻度(power uniformity)檢測標準及/或一幾何與圖案重心位置(geometrical & pattern mass center)檢測標準。 In a preferred embodiment, the detection standard includes a dot count detection standard, a contrast detection standard, a field of illumination detection standard, and a hot spot detection standard. Standard, a pattern angle (pattern angle) detection standard, a zero order beam (zero order) detection standard, a power uniformity (power uniformity) detection standard and/or a geometrical & pattern mass center detection standard.
於一較佳實施例中，該第一感測單元包括一被投射面以及一攝像模組，且該被投射面設置於該繞射光學元件以及該攝像模組之間；其中，該攝像模組係於該結構光投射至該被投射 面時進行攝像以獲得該受測圖案。 In a preferred embodiment, the first sensing unit includes a projected surface and a camera module, and the projected surface is disposed between the diffractive optical element and the camera module; wherein, the camera module The structured light is projected to the projected Camera is taken while facing to obtain the tested pattern.
於一較佳實施例中，該雷射模組還包括一外殼體，且該外殼體用以供該繞射光學元件設置於其上；其中，該定位單元係經由移動該外殼體而移動該繞射光學元件。 In a preferred embodiment, the laser module further includes an outer casing, and the outer casing is used for disposing the diffractive optical element thereon; wherein, the positioning unit moves the outer casing by moving the outer casing. Diffraction optics.
於一較佳實施例中，該主動式對準系統還包括一第二感測單元，其電性連接於該控制單元，並用以拍攝該繞射光學元件；其中，該控制單還用以依據該第二感測單元之一拍攝結果而驅動該定位單元移動該繞射光學元件，使該繞射光學元件位於一標準位置並處於一標準姿態。 In a preferred embodiment, the active alignment system further includes a second sensing unit, which is electrically connected to the control unit and used to photograph the diffractive optical element; wherein the control list is also used to A shooting result of the second sensing unit drives the positioning unit to move the diffractive optical element so that the diffractive optical element is located in a standard position and in a standard posture.
於一較佳實施例中，該至少一光學鏡片還包括位於該繞射光學元件下方之一準直光學元件，且該雷射模組還包括用以供該準直光學元件設置於其上之一內殼體；其中，該控制單元用以依據該第二感測單元之該拍攝結果而驅動該定位單元移動該繞射光學元件，使該繞射光學元件位於以該內殼體及/或該準直光學元件之所在處為定位參考的該標準位置並處於該標準姿態。 In a preferred embodiment, the at least one optical lens further includes a collimating optical element located below the diffractive optical element, and the laser module further includes a collimating optical element for the collimating optical element to be disposed thereon. An inner housing; wherein the control unit is used to drive the positioning unit to move the diffractive optical element according to the shooting result of the second sensing unit, so that the diffractive optical element is located in the inner housing and/or The position of the collimating optical element is the standard position of the positioning reference and is in the standard posture.
於一較佳實施例中，該第二感測單元包括至少三個攝像機，且該至少三個攝像機分別位於該繞射光學元件之不同方向上。 In a preferred embodiment, the second sensing unit includes at least three cameras, and the at least three cameras are respectively located in different directions of the diffractive optical element.
於一較佳實施例中，該雷射模組還包括一外殼體，且該外殼體用以供該繞射光學元件設置於其上；其中，該定位單元係經由移動該外殼體而移動該繞射光學元件。 In a preferred embodiment, the laser module further includes an outer casing, and the outer casing is used for disposing the diffractive optical element thereon; wherein, the positioning unit moves the outer casing by moving the outer casing. Diffraction optics.
於一較佳實施例中，該第二感測單元對該外殼體進行拍攝以供後續進行一殼體表面分析。 In a preferred embodiment, the second sensing unit photographs the outer shell for subsequent analysis of the shell surface.
於一較佳實施例中，主動式對準系統還包括至少一 鏡面元件，且該至少一鏡面元件設置於該外殼體之鄰近處；其中，該第二感測單元對該外殼體及/或該至少一鏡面元件進行拍攝以供後續進行一殼體表面分析。 In a preferred embodiment, the active alignment system further includes at least one A mirror element, and the at least one mirror element is disposed adjacent to the outer shell; wherein, the second sensing unit photographs the outer shell and/or the at least one mirror element for subsequent analysis of the shell surface.
於一較佳實施例中，該繞射光學元件係先被該定位單元移動而位於以一系統自訂參考標準為定位參考的一預定位置並處於一預定姿態，再被該定位單元置於該外殼體上。 In a preferred embodiment, the diffractive optical element is first moved by the positioning unit to be located at a predetermined position with a system-customized reference standard as a positioning reference and in a predetermined posture, and then placed in the positioning unit by the positioning unit. On the outer shell.
於一較佳實施例中，本發明還提供一種主動式對準方法，用以組裝一雷射模組，該雷射模組包括至少一光學鏡片以及一雷射單元，且該雷射單元所產生之一雷射光束於通過該少一光學鏡片後向外投射，其中，該主動式對準方法包括：(a)感測通過該至少一光學鏡片之該雷射光束而獲得一受測圖案；以及(b)依據該受測圖案而移動該至少一光學鏡片直至該受測圖案符合一檢測標準。 In a preferred embodiment, the present invention also provides an active alignment method for assembling a laser module, the laser module includes at least one optical lens and a laser unit, and the laser unit is A laser beam is generated and projected outward after passing through the at least one optical lens, wherein the active alignment method includes: (a) sensing the laser beam passing through the at least one optical lens to obtain a test pattern And (b) moving the at least one optical lens according to the tested pattern until the tested pattern meets a detection standard.
於一較佳實施例中，該雷射模組還包括一反射光學元件，且該雷射單元係為一邊射型雷射單元；其中，該反射光學元件用以反射該邊射型雷射單元所產生之該雷射光束，使該雷射光束朝該至少一光學鏡片之方向行進。 In a preferred embodiment, the laser module further includes a reflective optical element, and the laser unit is a side shot laser unit; wherein the reflective optical element is used to reflect the side shot laser unit The generated laser beam causes the laser beam to travel in the direction of the at least one optical lens.
於一較佳實施例中，該雷射單元為一垂直共振腔面射型雷射單元(Vertical Cavity Surface Emitting Laser,VCSEL)，且該垂直共振腔面射型雷射單元所產生之該雷射光束朝該至少一光學鏡片之方向行進。 In a preferred embodiment, the laser unit is a vertical cavity surface emitting laser unit (Vertical Cavity Surface Emitting Laser, VCSEL), and the laser generated by the vertical cavity surface emitting laser unit The light beam travels in the direction of the at least one optical lens.
於一較佳實施例中，該步驟(b)包括：利用一六軸定位單元移動該至少一光學鏡片。 In a preferred embodiment, the step (b) includes: using a six-axis positioning unit to move the at least one optical lens.
於一較佳實施例中，該至少一光學鏡片包括一準直光學元件，且該準直光學元件用以準直通過該準直光學元件之該雷射光束。 In a preferred embodiment, the at least one optical lens includes a collimating optical element, and the collimating optical element is used to collimate the laser beam passing through the collimating optical element.
於一較佳實施例中，該檢測標準包括一光點大小檢測標準、一光點形狀檢測標準及/或一光點位置檢測標準。 In a preferred embodiment, the detection standard includes a light spot size detection standard, a light spot shape detection standard, and/or a light spot position detection standard.
於一較佳實施例中，該步驟(a)包括：利用一光束分析儀(beam profiler)感測通過該準直光學元件之該雷射光束。 In a preferred embodiment, the step (a) includes: using a beam profiler to sense the laser beam passing through the collimating optical element.
於一較佳實施例中，該雷射模組還包括一內殼體，且該內殼體用以供該準直光學元件設置於其上；其中，於該步驟(b)中，係經由移動該內殼體而移動該準直光學元件。 In a preferred embodiment, the laser module further includes an inner casing, and the inner casing is used for the collimating optical element to be disposed thereon; wherein, in the step (b), Moving the inner casing moves the collimating optical element.
於一較佳實施例中，於該步驟(a)前還包括：(c1)拍攝該準直光學元件；(c2)依據一拍攝結果而移動該準直光學元件直至該準直光學元件位於以該雷射單元之所在處為定位參考的一標準位置並處於一標準姿態。 In a preferred embodiment, before the step (a), the method further includes: (c1) photographing the collimating optical element; (c2) moving the collimating optical element according to a shooting result until the collimating optical element is located at The location of the laser unit is a standard position for positioning reference and is in a standard attitude.
於一較佳實施例中，該步驟(c1)包括：利用至少三個攝像機拍攝該準直光學元件，且該至少三個攝像機分別位於該準直光學元件之不同方向上。 In a preferred embodiment, the step (c1) includes: using at least three cameras to photograph the collimating optical element, and the at least three cameras are respectively located in different directions of the collimating optical element.
於一較佳實施例中，該步驟(c2)包括：利用一六軸定位單元移動該準直光學元件。 In a preferred embodiment, the step (c2) includes: using a six-axis positioning unit to move the collimating optical element.
於一較佳實施例中，該雷射模組還包括一內殼體，且該內殼體用以供該準直光學元件設置於其上；其中，於該步驟(c2)中，係經由移動該內殼體而移動該準直光學元件。 In a preferred embodiment, the laser module further includes an inner casing, and the inner casing is used for disposing the collimating optical element thereon; wherein, in the step (c2), Moving the inner casing moves the collimating optical element.
於一較佳實施例中，於該步驟(c1)前還包括： (d1)拍攝該準直光學元件；(d2)依據該步驟(d1)所獲得之一拍攝結果而移動該準直光學元件直至該準直光學元件位於以一系統自訂參考標準為定位參考的一預定位置並處於一預定姿態；(d3)拍攝該準直光學元件以及該內殼體；以及(d4)依據該步驟(d3)所獲得之一拍攝結果而移動該準直光學元件，使該準直光學元件對準該內殼體並置於該內殼體上。 In a preferred embodiment, before the step (c1), the method further includes: (d1) photographing the collimating optical element; (d2) moving the collimating optical element according to a photographing result obtained in the step (d1) until the collimating optical element is located at a position referenced by a system-customized reference standard A predetermined position and a predetermined posture; (d3) photographing the collimating optical element and the inner housing; and (d4) moving the collimating optical element according to a photographing result obtained in the step (d3) to make the collimating optical element The collimating optical element is aligned with the inner casing and placed on the inner casing.
於一較佳實施例中，該步驟(d1)包括：利用至少三個攝像機拍攝該準直光學元件，且該至少三個攝像機分別位於該準直光學元件之不同方向上。 In a preferred embodiment, the step (d1) includes: using at least three cameras to photograph the collimating optical element, and the at least three cameras are respectively located in different directions of the collimating optical element.
於一較佳實施例中，該步驟(d2)及/或該步驟(d4)包括：利用一六軸定位單元移動該準直光學元件。 In a preferred embodiment, the step (d2) and/or the step (d4) include: using a six-axis positioning unit to move the collimating optical element.
於一較佳實施例中，該至少一光學鏡片包括一繞射光學元件(diffractive optical element,DOE)，用以對通過其中之該雷射光束進行光束整型，而使該雷射光束形成一結構光。 In a preferred embodiment, the at least one optical lens includes a diffractive optical element (DOE) for beam shaping the laser beam passing therethrough, so that the laser beam forms a Structured light.
於一較佳實施例中，該檢測標準包括一特徵點數量(dot count)檢測標準、一對比度(contrast)檢測標準、一照明視場(field of illumination)檢測標準、一熱點(hot spot)檢測標準、一圖案角度(pattern angle)檢測標準、一零階光束(zero order)檢測標準、一能量均勻度(power uniformity)檢測標準及/或一幾何與圖案重心位置(geometrical & pattern mass center)檢測標準。 In a preferred embodiment, the detection standard includes a dot count detection standard, a contrast detection standard, a field of illumination detection standard, and a hot spot detection standard. Standard, a pattern angle (pattern angle) detection standard, a zero order beam (zero order) detection standard, a power uniformity (power uniformity) detection standard and/or a geometrical & pattern mass center detection standard.
於一較佳實施例中，該步驟(a)包括：於該結構光投射至一被投射面時，利用一攝像模組進行攝像以獲得該受測圖案。 In a preferred embodiment, the step (a) includes: when the structured light is projected onto a projected surface, using a camera module to take a picture to obtain the tested pattern.
於一較佳實施例中，該雷射模組還包括一外殼體， 且該外殼體用以供該繞射光學元件設置於其上；其中，於該步驟(b)中，係經由移動該外殼體而移動該繞射光學元件。 In a preferred embodiment, the laser module further includes an outer shell, And the outer casing is used for disposing the diffractive optical element thereon; wherein, in the step (b), the diffractive optical element is moved by moving the outer casing.
於一較佳實施例中，於該步驟(a)前還包括：(e1)拍攝該繞射光學元件；(e2)依據一拍攝結果而移動該繞射光學元件直至該繞射光學元件位於一標準位置並處於一標準姿態。 In a preferred embodiment, before the step (a), the method further includes: (e1) photographing the diffractive optical element; (e2) moving the diffractive optical element according to a shooting result until the diffractive optical element is located at a Standard position and in a standard posture.
於一較佳實施例中，該至少一光學鏡片還包括位於該繞射光學元件下方之一準直光學元件，且該雷射模組還包括用以供該準直光學元件設置於其上之一內殼體；其中，該步驟(e2)包括：依據該拍攝結果而移動該繞射光學元件直至該繞射光學元件位於以該內殼體及/或該準直光學元件之所在處為定位參考的該標準位置並處於該標準姿態。 In a preferred embodiment, the at least one optical lens further includes a collimating optical element located below the diffractive optical element, and the laser module further includes a collimating optical element for the collimating optical element to be disposed thereon. An inner housing; wherein, the step (e2) includes: moving the diffractive optical element according to the shooting result until the diffractive optical element is positioned at the position of the inner housing and/or the collimating optical element The reference standard position and the standard posture.
於一較佳實施例中，該步驟(e1)包括：利用至少三個攝像機拍攝該繞射光學元件，且該至少三個攝像機分別位於該繞射光學元件之不同方向上。 In a preferred embodiment, the step (e1) includes: using at least three cameras to photograph the diffractive optical element, and the at least three cameras are respectively located in different directions of the diffractive optical element.
於一較佳實施例中，該步驟(e2)包括：利用一六軸定位單元移動該繞射光學元件。 In a preferred embodiment, the step (e2) includes: using a six-axis positioning unit to move the diffractive optical element.
於一較佳實施例中，該雷射模組還包括一外殼體，且該外殼體用以供該繞射光學元件設置於其上；其中，於該步驟(e2)中，係經由移動該外殼體而移動該繞射光學元件。 In a preferred embodiment, the laser module further includes an outer housing, and the outer housing is used for disposing the diffractive optical element thereon; wherein, in the step (e2), by moving the The outer casing moves the diffractive optical element.
於一較佳實施例中，於該步驟(e2)前還包括：(f1)拍攝該繞射光學元件；(f2)依據該步驟(f1)所獲得之一拍攝結果而移動該繞射光學元件直至該繞射光學元件位於以一系統自訂參考標準為定位參考 的一預定位置並處於一預定姿態；(f3)拍攝該繞射光學元件以及該外殼體；以及(f4)依據該步驟(f3)所獲得之一拍攝結果而移動該繞射光學元件，使該繞射光學元件對準該外殼體並置於該外殼體上。 In a preferred embodiment, before the step (e2), the method further includes: (f1) photographing the diffractive optical element; (f2) moving the diffractive optical element according to a photographing result obtained in the step (f1) Until the diffractive optical element is positioned with a system-customized reference standard as the positioning reference (F3) photographing the diffractive optical element and the outer casing; and (f4) moving the diffractive optical element according to a photographing result obtained in the step (f3) to make the The diffractive optical element is aligned with the outer casing and placed on the outer casing.
於一較佳實施例中，該步驟(f1)包括：利用至少三個攝像機拍攝該繞射光學元件，且該至少三個攝像機分別位於該繞射光學元件之不同方向上。 In a preferred embodiment, the step (f1) includes: using at least three cameras to photograph the diffractive optical element, and the at least three cameras are respectively located in different directions of the diffractive optical element.
於一較佳實施例中，該步驟(f2)及/或該步驟(f4)包括：利用一六軸定位單元移動該繞射光學元件。 In a preferred embodiment, the step (f2) and/or the step (f4) include: using a six-axis positioning unit to move the diffractive optical element.
於一較佳實施例中，於該步驟(a)之前還包括：進行一上膠作業，而於該步驟(b)之後還包括：對該上膠作業中所設置之膠體進行一固化程序。 In a preferred embodiment, before the step (a), it further includes: performing a gluing operation, and after the step (b), it further includes: performing a curing process for the glue set in the gluing operation.
1:雷射模組 1: Laser module
2:雷射模組 2: Laser module
3:主動式對準系統 3: Active alignment system
4:雷射模組 4: Laser module
10:外殼體 10: Outer shell
11:內殼體 11: inner shell
12:基板 12: substrate
13:雷射單元 13: Laser unit
14:陶瓷板 14: ceramic plate
15:反射光學元件 15: reflective optics
16:準直光學元件 16: collimation optics
17:繞射光學元件 17: Diffraction optics
20:外殼體 20: outer shell
21:內殼體 21: inner shell
22:基板 22: substrate
23:雷射單元 23: Laser unit
24:陶瓷板 24: ceramic plate
25:反射光學元件 25: reflective optics
26:準直光學元件 26: Collimation optics
27:繞射光學元件 27: Diffraction optics
31:第一感測單元 31: The first sensing unit
32:第二感測單元 32: second sensing unit
33:定位單元 33: positioning unit
34:控制單元 34: control unit
35:電力單元 35: power unit
36:鏡面元件 36: Mirror element
41:雷射單元 41: Laser unit
42:投射結構 42: Projection structure
43:繞射光學元件 43: Diffraction optics
311:光束分析儀 311: Beam Analyzer
312:攝像模組 312: camera module
313:被投射面 313: Projected Surface
321:攝像機 321: Camera
322:攝像機 322: Camera
323:攝像機 323: Camera
324:攝像機 324: Camera
325:攝像機 325: Camera
326:攝像機 326: Camera
331:六軸定位單元 331: Six-axis positioning unit
332:六軸定位單元 332: Six-axis positioning unit
333:六軸定位單元 333: Six-axis positioning unit
334:六軸定位單元 334: Six-axis positioning unit
I1:受測圖案 I1: Test pattern
I2:受測圖案 I2: Test pattern
L1:雷射光束 L1: Laser beam
L2:雷射光束 L2: Laser beam
L3:雷射光束 L3: Laser beam
S11:步驟 S11: steps
S12:步驟 S12: steps
S201:步驟 S201: Step
S202:步驟 S202: steps
S203:步驟 S203: Step
S204:步驟 S204: Step
S205:步驟 S205: steps
S206:步驟 S206: Step
S207:步驟 S207: Step
S208:步驟 S208: Step
S209:步驟 S209: Step
S210:步驟 S210: Step
S211:步驟 S211: Step
S212:步驟 S212: Step
S213:步驟 S213: Step
S214:步驟 S214: Step
S215:步驟 S215: Step
S216:步驟 S216: Step
圖1：係為習知雷射模組之部分結構的剖面概念示意圖。 Figure 1: is a schematic cross-sectional conceptual diagram of part of the structure of a conventional laser module.
圖2：係為圖1所示雷射模組之部分結構的立體分解示意圖。 Fig. 2: is a three-dimensional exploded schematic diagram of part of the structure of the laser module shown in Fig. 1;
圖3：係為應用本案主動式對準系統與主動式對準方法進行組裝之雷射模組於一較佳實施例之部分結構的剖面概念示意圖。 Fig. 3 is a schematic cross-sectional conceptual diagram of a partial structure of a laser module assembled using the active alignment system and the active alignment method of the present application in a preferred embodiment.
圖4：係為圖3所示雷射模組之部分結構的立體分解示意圖。 Fig. 4: is a three-dimensional exploded schematic diagram of part of the structure of the laser module shown in Fig. 3;
圖5：係為本案主動式對準系統於一較佳實施例之方塊概念示意圖。 Fig. 5 is a schematic block diagram of a preferred embodiment of the active alignment system of the present invention.
圖6A：係為利用利用圖5所示主動式對準系統將準直光學元件組裝至內殼體上的第一階段實施概念示意圖。 FIG. 6A is a conceptual schematic diagram of the first stage of assembling the collimating optical element to the inner housing by using the active alignment system shown in FIG. 5.
圖6B：係為利用圖5所示主動式對準系統將準直光學元件組裝至內殼體上的第二階段實施概念示意圖。 Fig. 6B is a conceptual schematic diagram of the second stage of assembling the collimating optical element to the inner housing using the active alignment system shown in Fig. 5.
圖7A：係為利用圖5所示主動式對準系統對準直光學元件進行粗調定位的一較佳實施概念示意圖。 FIG. 7A is a schematic diagram of a preferred implementation concept of using the active alignment system shown in FIG. 5 to align an optical element for coarse adjustment and positioning.
圖7B：係為利用圖5所示主動式對準系統對準直光學元件進行細調定位並予以組裝至雷射模組的一較佳實施概念示意圖。 Fig. 7B is a schematic diagram of a preferred implementation concept of using the active alignment system shown in Fig. 5 to align the optical elements for fine adjustment and positioning and assembly to the laser module.
圖8A：係為受測圖案於準直光學元件位於非準焦的位置與姿態時的一較佳概念示意圖。 FIG. 8A: is a schematic diagram of a preferred concept when the tested pattern is in a non-collimated position and posture of the collimating optical element.
圖8B：係為受測圖案於準直光學元件位於準焦的位置與姿態時的一較佳概念示意圖。 FIG. 8B: is a schematic diagram of a preferred concept of the tested pattern when the collimating optical element is located at the collimating position and posture.
圖9A：係為利用圖5所示主動式對準系統將繞射光學元件組裝至外殼體上的第一階段實施概念示意圖。 FIG. 9A is a conceptual schematic diagram of the first stage of assembling the diffractive optical element to the outer casing by using the active alignment system shown in FIG. 5.
圖9B：係為利用圖5所示主動式對準系統將繞射光學元件組裝至外殼體上的第二階段實施概念示意圖。 FIG. 9B is a conceptual schematic diagram of the second stage of assembling the diffractive optical element to the outer casing by using the active alignment system shown in FIG. 5.
圖10A：係為利用圖5所示主動式對準系統對繞射光學元件進行粗調定位的一較佳實施概念示意圖。 FIG. 10A is a schematic diagram of a preferred implementation concept for coarse adjustment and positioning of a diffractive optical element using the active alignment system shown in FIG. 5.
圖10B：係為利用圖5所示主動式對準系統對繞射光學元件進行細調定位並予以組裝至雷射模組的一較佳實施概念示意圖。 FIG. 10B is a schematic diagram of a preferred implementation concept of using the active alignment system shown in FIG. 5 to finely adjust and position the diffractive optical element and assemble it into the laser module.
圖11：係為受測圖案於繞射光學元件位於準焦的位置與姿態時的一較佳概念示意圖。 Fig. 11 is a schematic diagram of a preferred concept of the tested pattern when the diffractive optical element is in the collimated position and posture.
圖12：係為本案主動式對準方法的一較佳方塊流程示意圖。 Fig. 12 is a schematic diagram of a preferred block flow diagram of the active alignment method of the present invention.
圖13A：係為本案主動式對準方法的一較佳方塊流程示意圖。 FIG. 13A is a schematic diagram of a preferred block flow diagram of the active alignment method of the present invention.
圖13B：係為本案主動式對準方法的一較佳方塊流程示意圖。 FIG. 13B is a schematic diagram of a preferred block flow diagram of the active alignment method of the present invention.
圖14：係為光學式定位與機械式定位之定位公差與組裝成本的相對關係示意圖。 Figure 14: is a schematic diagram of the relative relationship between the positioning tolerance and assembly cost of optical positioning and mechanical positioning.
圖15：係為應用本案主動式對準系統與主動式對準方法進行組裝之雷射模組於一較佳實施例之部分結構的剖面概念示意圖。 Fig. 15 is a schematic cross-sectional conceptual diagram of a partial structure of a laser module assembled using the active alignment system and the active alignment method of the present application in a preferred embodiment.
本發明之實施例將藉由下文配合相關圖式進一步加以解說。盡可能的，於圖式與說明書中，相同標號係代表相同或相似構件。於圖式中，基於簡化與方便標示，形狀與厚度可能經過誇大表示。可以理解的是，未特別顯示於圖式中或描述於說明書中之元件，為所屬技術領域中具有通常技術者所知之形態。本領域之通常技術者可依據本發明之內容而進行多種之改變與修改。 The embodiments of the present invention will be further explained by following relevant drawings. As far as possible, in the drawings and the description, the same reference numerals represent the same or similar components. In the drawings, the shape and thickness may be exaggerated based on simplification and convenient labeling. It can be understood that the elements not specifically shown in the drawings or described in the specification are in the form known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of the present invention.
首先說明應用本案主動式對準系統(Active
Alignment Sysem)以及主動式對準方法(Active Alignment Method)進行組裝的雷射模組。請參閱圖3與圖4，圖3為應用本案主動式對準系統與主動式對準方法進行組裝之雷射模組於一較佳實施例之部分結構的剖面概念示意圖，圖4為圖3所示雷射模組之部分結構的立體分解示意圖。雷射模組2包括外殼體20、內殼體21、基板22、雷射單元23、陶瓷板24、反射光學元件25、準直光學元件26以及繞射光學元件(diffractive optical element,DOE)27，且基板22用以承載雷射單元23、陶瓷板24、外殼體20以及內殼體21，而雷射單元23設置於陶瓷板24上以電性連接於基板22；其中，內殼體21設置於外殼體20的容置空間內，且準直光學元件26以及繞射光學元件27分別固定於內殼體21以及外殼體20上，使得準直光學元件26在垂直方向上是位於基板22以及繞射光學元件27之間。
First, explain the application of the active alignment system (Active
Alignment Sysem) and Active Alignment Method (Active Alignment Method) for assembly of laser modules. Please refer to FIGS. 3 and 4. FIG. 3 is a schematic cross-sectional conceptual diagram of a partial structure of a laser module assembled with the active alignment system and the active alignment method of the present application in a preferred embodiment. FIG. 4 is FIG. 3 The three-dimensional exploded schematic diagram of the partial structure of the laser module shown. The
再者，於本較佳實施例中，雷射單元23為邊射型雷射單元，當雷射單元23接收電力後，雷射單元23可提供複數雷射光束L2，且該些雷射光束L2會往反射光學元件25的方向行進，並於投射至反射光學元件25上後被反射光學元件25反射而朝準直光學元件26以及繞射光學元件27的方向行進。其中，準直光學元件26用以準直被反射光學元件25所反射而來的雷射光束L2，使通過準直光學元件26的雷射光束L2以較佳的入射方向入射至繞射光學元件27，而繞射光學元件27則用以對通過準直光學元件26後的雷射光束L2進行光束整型，使該些雷射光束L2形成結構光並予以向外投射。
Furthermore, in the present preferred embodiment, the
接下來說明本案主動式對準系統。請參閱圖5，其為
本案主動式對準系統於一較佳實施例之方塊概念示意圖。主動式對準系統3包括第一感測單元31、第二感測單元32、定位單元33以及控制單元34，且控制單元34電性連接於第一感測單元31、第二感測單元32以及定位單元33之間，其中，定位單元33用以移動光學鏡片(如準直光學元件26或繞射光學元件27)，且第一感測單元31用以感測通過光學鏡片的雷射光束而獲得受測圖案，而第二感測單元32用以拍攝光學鏡片。
Next, the active alignment system of this case will be explained. Please refer to Figure 5, which is
The block diagram of a preferred embodiment of the active alignment system in this case. The
再者，於組裝雷射模組2的過程中，控制單元34係先依據第二感測單元32的拍攝結果而驅動定位單元33移動光學鏡片，使光學鏡片位於一標準位置並處於一標準姿態而完成初步的粗調定位，再依據第一感測單元31所獲得的受測圖案而驅動定位單元33移動光學鏡片直至受測圖案符合一檢測標準，藉此完成細調定位，以供後續進行固定程序。
Furthermore, in the process of assembling the
以下詳細說明雷射模組2的組裝過程。請參閱圖6A與圖6B，圖6A為利用圖5所示主動式對準系統將準直光學元件組裝至內殼體上的第一階段實施概念示意圖，圖6B為利用圖5所示主動式對準系統將準直光學元件組裝至內殼體上的第二階段實施概念示意圖。於本較佳實施例中，第二感測單元32包括三個攝像機325，而定位單元33包括可對準直光學元件26進行六軸移動的六軸定位單元334。惟，第二感測單元32以及定位單元33的實施態樣與數量並不以上述為限。
The assembly process of the
圖6A示意了於主動式對準系統3將準直光學元件26組裝至內殼體21上的第一階段過程中，六軸定位單元334係先移動準直光學元件26至三個攝像機325之間，使三個攝像機325
分別位於準直光學元件26的下方鄰近處、後方鄰近處與側方鄰近處，接著，該些攝像機325分別對準直光學元件26進行拍攝，且該些攝像機325的拍攝結果會回傳至控制單元34，使控制單元34獲得相關的控制回饋，並據以驅動六軸定位單元334移動準直光學元件26，直到準直光學元件26位於以一系統自訂參考標準為定位參考的預定位置並處於預定姿態(如角度姿態)。於本較佳實施例中，下方的攝像機325用來確認準直光學元件26於XY平面上的位置，而後方與側方的攝像機325則用來確認準直光學元件26的平行度(flatness)。
FIG. 6A illustrates that during the first stage of assembling the collimating
圖6B示意了於主動式對準系統3將準直光學元件26組裝至內殼體21上的第二階段過程中，設置於準直光學元件26上方的攝像機326用以對準直光學元件26以及內殼體21進行拍攝，且攝像機326的拍攝結果會回傳至控制單元34，使控制單元34獲得相關的控制回饋，並據以驅動六軸定位單元334移動準直光學元件26，直到準直光學元件26對準內殼體21並使準直光學元件26置於內殼體21上。
6B illustrates the second stage of the process of assembling the collimating
其中，於上述圖6A與圖6B所示主動式對準系統3將準直光學元件26定位至內殼體21上之前，準直光學元件26或內殼體21會先被進行一上膠作業而使得準直光學元件26或內殼體21上具有膠體，而經過上述圖6A與圖6B所示主動式對準系統3將準直光學元件26定位至內殼體21上之後，膠體會接著被進行固化程序(如紫外線固化程序等)而使得準直光學元件26固定於內殼體21上。
Wherein, before the
請參閱圖7A與圖7B，圖7A為利用圖5所示主動式
對準系統對準直光學元件進行粗調定位的一較佳實施概念示意圖，圖7B為利用圖5所示主動式對準系統對準直光學元件進行細調定位並予以組裝至雷射模組的一較佳實施概念示意圖。於本較佳實施例中，第一感測單元31包括光束分析儀(beam profiler)311，且第二感測單元32包括三個攝像機321，而定位單元33包括可對準直光學元件26進行六軸移動的六軸定位單元331。其中，由於準直光學元件26已先被組裝至內殼體21上，故於本較佳實施例中，六軸定位單元331係經由移動內殼體21而移動準直光學元件26。惟，第一感測單元31、第二感測單元32以及定位單元33的實施態樣與數量並不以上述為限。
Please refer to Figure 7A and Figure 7B, Figure 7A is the use of the active type shown in Figure 5
A schematic diagram of a preferred implementation concept of the alignment system for aligning optical elements for coarse adjustment and positioning. Fig. 7B is the use of the active alignment system shown in Fig. 5 to align the optical elements for fine adjustment and positioning and assembly to the laser module A schematic diagram of a preferred implementation concept. In the preferred embodiment, the first sensing unit 31 includes a beam profiler (beam profiler) 311, the
圖7A示意了於主動式對準系統3對準直光學元件26進行粗調定位的過程中，六軸定位單元331係先移動內殼體21及固定於其上的準直光學元件26至三個攝像機321之間，使三個攝像機321分別位於準直光學元件26的上方鄰近處、後方鄰近處與側方鄰近處，接著，該些攝像機321分別對內殼體21及固定於其上的準直光學元件26進行拍攝，且該些攝像機321的拍攝結果會回傳至控制單元34，使控制單元34獲得相關的控制回饋，並據以驅動六軸定位單元331移動內殼體21及固定於其上的準直光學元件26，直到內殼體21及固定於其上的準直光學元件26位於以雷射單元23之所在處為定位參考的標準位置並處於標準姿態(如角度姿態)，至此已完成粗調定位的程序。於本較佳實施例中，上方的攝像機321用來確認內殼體21及固定於其上的準直光學元件26於XY平面上的位置，而後方與側方的攝像機321則用來確認內殼體21及固定於其上的準直光學元件26的平行度(flatness)。
FIG. 7A illustrates that during the coarse adjustment and positioning of the alignment
圖7B示意了於主動式對準系統3對準直光學元件26進行細調定位的過程中，光束分析儀311設置於雷射模組2的上方鄰近處，而控制單元34驅動與其電性相連的電力單元35提供電力予雷射模組2，使雷射單元23提供雷射光束L2，且於雷射光束L2經由反射光學元件25的反射而朝準直光學元件26的方向行進並通過準直光學元件26後，位於準直光學元件26上方的光束分析儀311感測通過準直光學元件26的雷射光束L2而獲得受測圖案I1，控制單元34再依據受測圖案I1而驅動六軸定位單元331移動內殼體21及固定於其上的準直光學元件26，直到光束分析儀311所獲得的受測圖案I1符合檢測標準，其中，當受測圖案I1符合檢測標準時，代表準直光學元件26位於準焦的位置與姿態，可準備進行後續固定內殼體21的程序。
FIG. 7B illustrates that during the process of fine adjustment and positioning of the alignment
進一步而言，於上述圖7A與圖7B所示主動式對準系統3將內殼體21及其上的準直光學元件26定位至雷射模組2之前，內殼體21或基板22會先被進行一上膠作業而使得內殼體21或基板22上具有膠體，而經過圖7A與圖7B所示主動式對準系統3將內殼體21及其上的準直光學元件26定位至雷射模組2上之後，膠體會接著被進行固化程序(如紫外線固化程序等)而使得內殼體21被固定於雷射模組2上。
Furthermore, before the
此外，有關上述用於定位準直光學元件26之受測圖案I2的檢測標準進一步說明如下。請參閱圖8A與圖8B，圖8A為受測圖案於準直光學元件位於非準焦的位置與姿態時的一較佳概念示意圖，圖8B受測圖案於準直光學元件位於準焦的位置與姿態時的一較佳概念示意圖。由圖8A與圖8B所示可知，受測圖案
I1中光點的大小、形狀以及位置皆會因應準直光學元件26所處之位置與姿態的不同而有所改變，因此，於本較佳實施例中，檢測標準包括光點大小檢測標準、光點形狀檢測標準及/或光點位置檢測標準，透過對受測圖案I1中光點的大小、形狀及/或位置的檢測即可作為判斷準直光學元件26是否位於準焦位置與姿態的依據。惟，檢測標準的設計並不以上述為限，熟知本技藝人士可依據實際應用需求而進行任何均等的變更設計。
In addition, the above-mentioned detection standard for positioning the tested pattern I2 of the collimating
請參閱圖9A與圖9B，圖9A為利用圖5所示主動式對準系統將繞射光學元件組裝至外殼體上的第一階段實施概念示意圖，圖9B為利用圖5所示主動式對準系統將繞射光學元件組裝至外殼體上的第二階段實施概念示意圖。於本較佳實施例中，第二感測單元32包括三個攝像機322，而定位單元33包括可對繞射光學元件27進行六軸移動的六軸定位單元332。惟，第二感測單元32以及定位單元33的實施態樣與數量並不以上述為限。
Please refer to FIGS. 9A and 9B. FIG. 9A is a schematic diagram of the first stage implementation concept of using the active alignment system shown in FIG. 5 to assemble the diffractive optical element on the outer housing. A conceptual diagram of the second stage of the implementation of the quasi-system assembling the diffractive optical element to the outer housing. In this preferred embodiment, the
圖9A示意了於主動式對準系統3將繞射光學元件27組裝至外殼體20上的第一階段過程中，六軸定位單元332係先移動繞射光學元件27至三個攝像機322之間，使三個攝像機322分別位於繞射光學元件27的下方鄰近處、後方鄰近處與側方鄰近處，接著，該些攝像機322分別對繞射光學元件27進行拍攝，且該些攝像機322的拍攝結果會回傳至控制單元34，使控制單元34獲得相關的控制回饋，並據以驅動六軸定位單元332移動繞射光學元件27，直到繞射光學元件27位於以一系統自訂參考標準為定位參考的預定位置並處於預定姿態(如角度姿態)。於本較佳實施例中，下方的攝像機322用來確認繞射光學元件27於XY平面上的
位置，而後方與側方的攝像機322則用來確認繞射光學元件27的平行度(flatness)。
9A shows that during the first stage of assembling the diffractive
圖9B示意了於主動式對準系統3將繞射光學元件27組裝至外殼體20上的第二階段過程中，設置於繞射光學元件27上方的攝像機323用以對繞射光學元件27以及外殼體20進行拍攝，且攝像機323的拍攝結果會回傳至控制單元34，使控制單元34獲得相關的控制回饋，並據以驅動六軸定位單元332移動繞射光學元件27，直到繞射光學元件27對準外殼體20並使繞射光學元件27置於外殼體20上。
9B illustrates the second stage process of the
其中，於上述圖9A與圖9B所示主動式對準系統3將繞射光學元件27定位至外殼體20上之前，繞射光學元件27或外殼體20會先被進行一上膠作業而使得繞射光學元件27或外殼體20上具有膠體，而經過上述圖9A與圖9B所示主動式對準系統3將繞射光學元件27定位至外殼體20上之後，膠體會接著被進行固化程序(如紫外線固化程序等)而使得繞射光學元件27固定於外殼體20上。
Wherein, before the
請參閱圖10A與圖10B，圖10A為利用圖5所示主動式對準系統對繞射光學元件進行粗調定位的一較佳實施概念示意圖，圖10B為利用圖5所示主動式對準系統對繞射光學元件進行細調定位並予以組裝至雷射模組的一較佳實施概念示意圖。於本較佳實施例中，第一感測單元31包括攝像模組312以及被投射面313，且第二感測單元32包括三個攝像機324，而定位單元33包括可對繞射光學元件27進行六軸移動的六軸定位單元333；其中，由於繞射光學元件27已先被組裝至外殼體20上，故於本較
佳實施例中，六軸定位單元333係經由移動外殼體20而移動繞射光學元件27。惟，第一感測單元31、第二感測單元32以及定位單元33的實施態樣與數量並不以上述為限。
Please refer to FIGS. 10A and 10B. FIG. 10A is a schematic diagram of a preferred implementation concept for coarse adjustment and positioning of the diffractive optical element using the active alignment system shown in FIG. A schematic diagram of a preferred implementation concept for the system to fine-tune the positioning of the diffractive optical element and to assemble it into the laser module. In this preferred embodiment, the first sensing unit 31 includes a
圖10A示意了於主動式對準系統3對繞射光學元件27進行粗調定位的過程中，六軸定位單元333係先移動外殼體20及固定於其上的繞射光學元件27至三個攝像機324之間，使三個攝像機324分別位於繞射光學元件27的上方鄰近處、後方鄰近處與側方鄰近處，接著，該些攝像機324分別對外殼體20及固定於其上的繞射光學元件27進行拍攝，且該些攝像機324的拍攝結果會回傳至控制單元34，使控制單元34獲得相關的控制回饋，並據以驅動六軸定位單元333移動外殼體20及固定於其上的繞射光學元件27，直到外殼體20及固定於其上的繞射光學元件27位於以內殼體21及/或準直光學元件26之所在處為定位參考的標準位置並處於標準姿態(如角度姿態)，至此已完成粗調定位的程序。於本較佳實施例中，上方的攝像機324用來確認外殼體20及固定於其上的繞射光學元件27於XY平面上的位置，而後方與側方的攝像機324則用來確認外殼體20及固定於其上的繞射光學元件27的平行度(flatness)。
FIG. 10A illustrates that during the coarse adjustment and positioning of the diffractive
較佳者，但不以此為限，主動式對準系統3還包括位於外殼體20之鄰近處並用以成像至少部分外殼體20的一或多個鏡面元件36，且於該些攝像機324對外殼體20及其鄰近處的鏡面元件36進行拍攝時，控制單元34還可依據該些攝像機324的拍攝結果而對外殼體20進行殼體表面分析，進而判斷外殼體20是否刮傷或損壞。
Preferably, but not limited to this, the
圖10B示意了於主動式對準系統3對繞射光學元件27進行細調定位的過程中，攝像模組312以及被投射面313設置於雷射模組2的上方鄰近處，且投射面313位於繞射光學元件27以及攝像模組312之間，而控制單元34驅動與其電性相連的電力單元35提供電力予雷射模組2，使雷射單元23提供雷射光束L2，且於雷射光束L2經由反射光學元件25的反射而朝準直光學元件26與繞射光學元件27的方向行進、並依序通過準直光學元件26與繞射光學元件27而形成結構光後，位於被投射面313上方的攝像模組312會對投射至被投射面313的結構光進行攝像以獲得受測圖案I2，控制單元34再依據受測圖案I2而驅動六軸定位單元333移動外殼體20及固定於其上的繞射光學元件27，直到攝像模組312所獲得的受測圖案I2符合檢測標準，其中，當受測圖案I2符合檢測標準時，代表繞射光學元件27位於準焦的位置與姿態，可準備進行後續固定外殼體20的程序。
FIG. 10B illustrates that in the process of fine adjustment and positioning of the diffractive
進一步而言，於上述圖10A與圖10B所示主動式對準系統3將外殼體20及其上的繞射光學元件27定位至雷射模組2之前，外殼體20或基板22會先被進行一上膠作業而使得外殼體20或基板22上具有膠體，而經過圖10A與圖10B所示主動式對準系統3將外殼體20及其上的繞射光學元件27定位至雷射模組2上之後，膠體會接著被進行固化程序(如紫外線固化程序等)而使得外殼體20被固定於雷射模組2上。
Furthermore, before the
此外，有關上述用於定位繞射光學元件27之受測圖案I2的檢測標準進一步說明如下。請參閱圖11，其為受測圖案於繞射光學元件位於準焦的位置與姿態時的一較佳概念示意圖。其
中，受測圖案I2的對比度(contrast)、照明視場(field of illumination)、熱點(hot spot)、圖案角度(pattern angle)、能量均勻度(power uniformity)、幾何與圖案重心位置(geometrical & pattern mass center)、零階(zero order)光束的表現以及特徵點的數量(dot count)皆會因應繞射光學元件27所處之位置與姿態的不同而有所改變，因此，於本較佳實施例中，檢測標準包括數量檢測標準、對比度檢測標準、照明視場檢測標準、熱點檢測標準、圖案角度檢測標準、零階光束檢測標準、能量均勻度檢測標準及/或幾何與圖案重心位置檢測標準，透過對受測圖案I2中對比度、照明視場、熱點、圖案角度、能量均勻度、幾何與圖案重心位置、零階光束之表現及/或特徵點之數量的檢測即可作為判斷繞射光學元件27是否位於準焦位置與姿態的依據。惟，檢測標準的設計並不以上述為限，熟知本技藝人士可依據實際應用需求而進行任何均等的變更設計。
In addition, the above-mentioned detection standard for positioning the tested pattern I2 of the diffractive
綜合以上的說明，本發明提供用於組裝雷射模組的主動式對準方法(Active Alignment Method)如圖12所示。主動式對準方法包括：步驟S11，感測通過光學鏡片的雷射光束而獲得受測圖案；以及步驟S12，依據受測圖案而移動光學鏡片直至受測圖案符合檢測標準。 Based on the above description, the present invention provides an Active Alignment Method for assembling a laser module as shown in FIG. 12. The active alignment method includes: step S11, sensing the laser beam passing through the optical lens to obtain the tested pattern; and step S12, moving the optical lens according to the tested pattern until the tested pattern meets the detection standard.
於本較佳實施例中，本發明用於組裝雷射模組2的主動式對準方法可被更進一步表示如圖13A與圖13B所示。主動式對準方法包括：步驟S201，利用至少三個攝像機325拍攝準直光學元件26，且該些攝像機325分別位於準直光學元件26的不同方向上；
步驟S202，依據步驟S201的拍攝結果而利用六軸定位單元334移動準直光學元件26，直至準直光學元件26位於以一系統自訂參考標準為定位參考的預定位置並處於預定姿態；步驟S203，利用攝像機326拍攝準直光學元件26以及內殼體21；步驟S204，依據步驟S203的拍攝結果而移動準直光學元件26，使準直光學元件26對準內殼體21並置於內殼體21上；步驟S205，利用至少三個攝像機321拍攝內殼體21及固定於其上的準直光學元件26，且該些攝像機321分別位於準直光學元件26的不同方向上；步驟S206，依據步驟S205的拍攝結果而利用六軸定位單元331移動內殼體21及固定於其上的準直光學元件26，直至內殼體21及固定於其上的準直光學元件26位於以雷射單元23之所在處為定位參考的標準位置並處於標準姿態；步驟S207，利用光束分析儀311感測通過準直光學元件26的雷射光束L2而獲得受測圖案I1；步驟S208，依據步驟S207所獲得的受測圖案I1而移動內殼體21及固定於其上的準直光學元件26，直至受測圖案I1符合用於定位準直光學元件26的檢測標準；步驟S209，利用至少三個攝像機322拍攝繞射光學元件27，且該些攝像機322分別位於繞射光學元件27的不同方向上；步驟S210，依據步驟S209的拍攝結果而利用六軸定位單元332移動繞射光學元件27，直至繞射光學元件27位於一系統自訂參考標準為定位參考的預定位置並處於預定姿態；
步驟S211，利用攝像機323拍攝繞射光學元件27以及外殼體20；步驟S212，依據步驟S211的拍攝結果而移動繞射光學元件27，使繞射光學元件27對準外殼體20並置於外殼體20上；步驟S213，利用至少三個攝像機324拍攝外殼體20及固定於其上的繞射光學元件27，且該些攝像機324分別位於繞射光學元件27的不同方向上；步驟S214，依據步驟S213的拍攝結果而利用六軸定位單元333移動外殼體20及固定於其上的繞射光學元件27，直至外殼體20及固定於其上的繞射光學元件27位於以內殼體21及/或準直光學元件26之所在處為定位參考的標準位置並處於標準姿態；步驟S215，於雷射光束L2通過繞射光學元件27而形成結構光並投射至被投射面313時，利用攝像模組312進行攝像以獲得受測圖案I2；以及步驟S216，依據步驟S215所獲得的受測圖案I2而移動外殼體20及固定於其上的繞射光學元件27，直至受測圖案I2符合用於定位繞射光學元件27的檢測標準。
In this preferred embodiment, the active alignment method of the present invention for assembling the
特別說明的是，相較於先前技術，本案於組裝雷射模組的過程中利用光學式的主動式對準方法對光學鏡片的位置與姿態進行定位與校正，可大幅提高組裝精度至奈米等級並減少組裝成本，適合大量生產。進一步而言，請參閱圖14，其為光學式定位與機械式定位之定位公差與組裝成本的相對關係示意圖。圖14示意了於定位公差在0.025釐米以下時，採用光學式定位所需的成本比起採用機械式定位所需之成本節省百分之10以上。 In particular, compared with the prior art, this case uses an optical active alignment method to position and correct the position and posture of the optical lens during the assembly of the laser module, which can greatly improve the assembly accuracy to nanometers. Grade and reduce assembly costs, suitable for mass production. Further, please refer to FIG. 14, which is a schematic diagram of the relative relationship between the positioning tolerance and the assembly cost of the optical positioning and the mechanical positioning. Figure 14 shows that when the positioning tolerance is below 0.025 cm, the cost required for optical positioning is reduced by more than 10% compared to the cost required for mechanical positioning.
此外，雖然上述說明中是以具有邊射型雷射單元、反射光學元件、準直光學元件以及繞射光學元件的雷射模組作為釋例，但應用本發明主動式對準系統以及主動式對準方法進行組裝的雷射模組並不以上述為限，熟知本技藝人士皆可經由上述實施例所獲得之啟示而依據實際情況將其應用於組裝各種實施態樣的雷射模組。 In addition, although the above description uses a laser module having a side-fired laser unit, a reflective optical element, a collimating optical element, and a diffractive optical element as an example, the active alignment system and the active alignment system of the present invention are applied. The laser module assembled by the alignment method is not limited to the above. Those skilled in the art can use the enlightenment obtained from the above-mentioned embodiments and apply it to assembling laser modules of various implementation modes according to the actual situation.
舉例來說，請參閱圖15，其為應用本案主動式對準系統與主動式對準方法進行組裝之雷射模組於一較佳實施例之部分結構的剖面概念示意圖。雷射模組4包括雷射單元41、投射結構42以及繞射光學元件43，且雷射單元41為垂直共振腔面射型雷射單元(Vertical Cavity Surface Emitting Laser,VCSEL)，而投射結構42設置於雷射單元41以及繞射光學元件43之間，並具有至少一光學鏡片(圖未示)，其中，當雷射單元41接收電力後，雷射單元41可提供複數雷射光束L3，且該些雷射光束L3會往投射結構42的方向行進，再經由光學鏡片的導引而往繞射光學元件43的方向行進，最後於通過繞射光學元件43後形成結構光並予以向外投射。
For example, please refer to FIG. 15, which is a schematic cross-sectional conceptual diagram of a partial structure of a laser module assembled using the active alignment system and the active alignment method of the present application in a preferred embodiment. The
同樣地，於組裝雷射模組4的過程中，投射結構42及/或其中的光學鏡片可經由本案主動式對準系統與主動式對準方法而與雷射單元41相對位，而繞射光學元件45亦可經由本案主動式對準系統與主動式對準方法而與投射結構42及/或其中的光學鏡片相對位，如此亦可大幅提高雷射模組4的組裝精度並減少組裝成本。
Similarly, in the process of assembling the
以上所述僅為本發明之較佳實施例，並非用以限定 本發明之申請專利範圍，因此凡其它未脫離本發明所揭示之精神下所完成之等效改變或修飾，均應包含於本案之申請專利範圍內。 The above descriptions are only preferred embodiments of the present invention, and are not intended to limit The scope of patent application of the present invention, therefore, all other equivalent changes or modifications completed without departing from the spirit of the present invention should be included in the scope of patent application of this case.
2:雷射模組 2: Laser module
20:外殼體 20: outer shell
21:內殼體 21: inner shell
23:雷射單元 23: Laser unit
25:反射光學元件 25: reflective optics
26:準直光學元件 26: Collimation optics
27:繞射光學元件 27: Diffraction optics
34:控制單元 34: control unit
35:電力單元 35: power unit
312:攝像模組 312: camera module
313:被投射面 313: Projected Surface
333:六軸定位單元 333: Six-axis positioning unit
I2:受測圖案 I2: Test pattern
L2:雷射光束 L2: Laser beam
Claims (47)
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| US4772123A (en) * | 1986-11-24 | 1988-09-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Alignment of optical components |
| CN100523907C (en) * | 2006-12-11 | 2009-08-05 | 环隆电气股份有限公司 | Luminous module as well as method for aligning and assembling thereof |
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| CN107838672A (en) * | 2017-10-17 | 2018-03-27 | 歌尔股份有限公司 | Optics module assembles device and method |
| US20190140420A1 (en) * | 2017-11-07 | 2019-05-09 | Dermal Photonics Corporation | Self-aligning laser assembly |
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| US4772123A (en) * | 1986-11-24 | 1988-09-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Alignment of optical components |
| CN100523907C (en) * | 2006-12-11 | 2009-08-05 | 环隆电气股份有限公司 | Luminous module as well as method for aligning and assembling thereof |
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