TWI734026B - Conveying device, resin molding device, and resin molded product manufacturing method - Google Patents
Conveying device, resin molding device, and resin molded product manufacturing method Download PDFInfo
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- TWI734026B TWI734026B TW107132286A TW107132286A TWI734026B TW I734026 B TWI734026 B TW I734026B TW 107132286 A TW107132286 A TW 107132286A TW 107132286 A TW107132286 A TW 107132286A TW I734026 B TWI734026 B TW I734026B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/261—Handling means, e.g. transfer means, feeding means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/10—Forming by pressure difference, e.g. vacuum
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/14—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
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Abstract
本發明提供一種搬送裝置、樹脂成形裝置以及樹脂成形品製造方法。搬送裝置(20)包含成形對象物保持部(28),所述成形對象物保持部(28)包括:成形對象物載置部(25),載置成形對象物(S);以及多個端緣限制構件(27),其是設置於成形對象物載置部(25)的周緣或所述成形對象物載置部(25)的外側並用以限制成形對象物(S)的端緣的構件,且能夠朝成形對象物載置部(25)的內部的方向移動。樹脂成形裝置(10)包括搬送裝置(20)、以及成形模(15),所述成形模(15)包含具有安裝成形對象物(S)的成形對象物安裝部(1511A)的第一模(上模151)、以及與所述第一模相向配置的第二模(下模152)。The present invention provides a conveying device, a resin molding device, and a method for manufacturing a resin molded product. The conveying device (20) includes a molded object holding portion (28), the molded object holding portion (28) includes: a molded object placement portion (25) on which the molded object (S) is placed; and a plurality of ends An edge restriction member (27), which is a member provided on the periphery of the molding object placement portion (25) or outside of the molding object placement portion (25) to restrict the edge of the molding object (S) , And can move in the direction of the inside of the molding object placement portion (25). The resin molding device (10) includes a conveying device (20), and a molding die (15), and the molding die (15) includes a first mold ( Upper mold 151), and a second mold (lower mold 152) arranged opposite to the first mold.
Description
本發明是有關於一種將成形對象物搬送至樹脂成形裝置的成形模的搬送裝置、樹脂成形裝置以及樹脂成形品製造方法。The present invention relates to a conveying device for conveying a molded object to a molding die of a resin molding device, a resin molding device, and a resin molded product manufacturing method.
盛行使用成形模對基板等成形對象物進行樹脂成形。為了將成形對象物安裝於成形模的成形對象物安裝部而使用了如下的樹脂成形裝置:所述樹脂成形裝置設置有將成形對象物搬送(搬入)至成形模的第1模與第2模之間的搬送裝置。例如在專利文獻1中,記載有通過利用多個支撐部對成形對象物的側部進行支撐而將成形對象物的橫向上的位置固定,以使所述位置與設置於作為第2模的上模的下表面的成形對象物安裝部(箝位面)對準的方式將搬送裝置(裝運機(loader))搬入至成形對象物安裝部的正下方後,從設置於成形對象物安裝部的吸附孔抽吸氣體,藉此將成形對象物安裝於成形對象物安裝部。 [現有技術文獻]Molding molds are commonly used for resin molding of molded objects such as substrates. In order to mount the molded object to the molded object mounting portion of the molding die, the following resin molding apparatus is used: the resin molding apparatus is provided with a first mold and a second mold that transport (carry in) the molded object to the molding die Between the conveying device. For example, in
[專利文獻] [專利文獻1] 日本專利特開2013-153146號公報(圖15)[Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. 2013-153146 (Figure 15)
[發明所要解決的問題] 成形對象物的外廓尺寸有時會因加工時產生的加工誤差等而產生偏差。因此,存在如下情況:不能利用搬送裝置的支撐部對成形對象物的側部進行支撐,或者支撐部與成形對象物之間的間隙變大。此種情況下,存在如下擔憂:不能利用搬送裝置對成形對象物進行搬送,或者在將成形對象物安裝於成形對象物安裝部時,安裝位置產生偏離。[Problems to be Solved by the Invention] The outer dimensions of the molded object may vary due to machining errors that occur during machining. Therefore, there are cases in which the side portion of the molding object cannot be supported by the support portion of the conveying device, or the gap between the support portion and the molding object becomes large. In this case, there is a concern that the molding target cannot be conveyed by the conveying device, or the mounting position may deviate when the molding target is mounted on the molding target mounting portion.
因此,本發明的課題在於提供一種即便在成形對象物的外廓尺寸上產生偏差,也能夠搬送成形對象物,且能夠抑制朝向成形模的成形對象物安裝部的安裝位置的偏離的搬送裝置、樹脂成形裝置以及樹脂成形品製造方法。 [解決問題的技術手段]Therefore, the subject of the present invention is to provide a conveying device capable of conveying a molded object even if there is a deviation in the outer dimension of the molded object, and capable of suppressing the deviation of the mounting position of the molded object mounting portion of the molding die, Resin molding apparatus and resin molded product manufacturing method. [Technical means to solve the problem]
為了解決上述課題而成的本發明的搬送裝置是將成形對象物搬送至樹脂成形裝置的成形模的裝置,其特徵在於包含成形對象物保持部, 所述成形對象物保持部包括:成形對象物載置部,載置所述成形對象物;以及多個端緣限制構件,其是設置於所述成形對象物載置部的周緣或所述成形對象物載置部的外側並用以限制所述成形對象物的端緣的構件,且能夠朝所述成形對象物載置部的內部的方向移動。In order to solve the above-mentioned problems, the conveying device of the present invention is an apparatus for conveying a molded object to a molding die of a resin molding apparatus, and is characterized by including a molded object holding portion, the molded object holding portion including: a molded object A placement portion on which the molded object is placed; and a plurality of edge restriction members provided on the periphery of the molded object placement portion or the outside of the molded object placement portion to restrict the A member of the edge of the molded object and can move in the direction of the inside of the molded object mounting portion.
本發明的樹脂成形裝置的特徵在於包括: 所述搬送裝置;以及 成形模,包含具有安裝所述成形對象物的成形對象物安裝部的第1模、以及與所述第1模相向配置的第2模。The resin molding apparatus of the present invention is characterized by including: the conveying device; and a molding die, including a first mold having a molding object mounting portion for mounting the molding object, and a second mold disposed opposite to the
本發明的樹脂成形品製造方法的特徵在於包括: 搬入時成形對象物保持步驟,將成形對象物載置於搬送裝置的成形對象物保持部中所設置的成形對象物載置部,使設置於所述成形對象物載置部的周緣或所述成形對象物載置部的外側並對所述成形對象物的端緣進行限制的多個端緣限制構件朝所述成形對象物載置部的內部的方向移動,藉此將所述成形對象物保持於所述成形對象物保持部; 成形對象物搬入步驟,以使所述成形對象物載置部的位置與成形模的成形對象物安裝部對準的方式使所述成形對象物保持部移動,當將所述成形對象物安裝於所述成形對象物安裝部後,使所述成形對象物保持部移動至所述成形模的外部,所述成形模包含具有安裝成形對象物的所述成形對象物安裝部的第1模及與所述第1模相向配置的第2模;以及 樹脂成形步驟,在將所述第1模與所述第2模合模後,對所述成形對象物進行樹脂成形。 [發明的效果]The method for manufacturing a resin molded product of the present invention is characterized by including: a step of holding a molded object during loading, placing the molded object on a molded object mounting portion provided in a molded object holding portion of a conveying device, and setting it on The peripheral edge of the molded object placement portion or the outer side of the molded object placement portion and a plurality of edge restriction members that restrict the edges of the molded object face toward the edge of the molded object placement portion The inner direction is moved to thereby hold the molded object in the molded object holding portion; the molded object carrying-in step is to adjust the position of the molded object placement portion to the molded object mounting portion of the molding die The aligning method moves the molded object holding portion, and after the molded object is mounted on the molded object mounting portion, the molded object holding portion is moved to the outside of the molding die, so The molding mold includes a first mold having the molded object mounting portion on which a molded object is mounted, and a second mold disposed opposite to the first mold; and a resin molding step, in which the first mold and the After the second mold is closed, the molded object is resin molded. [Effects of the invention]
根據本發明,即便在每個成形對象物的外廓尺寸上產生偏差,也能夠搬送成形對象物,且能夠抑制朝向成形模的成形對象物安裝部的安裝位置的偏離。According to the present invention, even if there is a deviation in the outline size of each molding object, the molding object can be conveyed, and the deviation of the mounting position of the molding object mounting portion toward the molding die can be suppressed.
在本發明的搬送裝置、樹脂成形裝置以及樹脂成形品製造方法中,將成形對象物載置於成形對象物載置部,並使端緣限制構件朝所述成形對象物載置部的內部的方向移動,藉此將成形對象物保持於成形對象物保持部。如此通過使用能夠移動的端緣限制構件,即便在成形對象物的外廓尺寸上產生偏差,也能夠保持成形對象物。另外,因能夠以減小端緣限制構件與成形對象物之間的間隙的方式使端緣限制構件移動,從而能夠抑制將成形對象物安裝於成形對象物安裝部的位置產生偏離。In the conveying device, the resin molding device, and the resin molded product manufacturing method of the present invention, the molded object is placed on the molded object placement portion, and the edge restriction member is directed toward the inside of the molded object placement portion. By moving in the direction, the molded object is held in the molded object holding portion. In this way, by using the movable edge restriction member, even if there is a deviation in the outline size of the molded object, the molded object can be held. In addition, since the edge restricting member can be moved so as to reduce the gap between the edge restricting member and the molded object, it is possible to suppress deviation of the position where the molded object is mounted on the molded object mounting portion.
端緣限制構件的形狀並無特別限定。另外,成形對象物的種類及形狀也無特別限定。作為能夠應用本發明的成形對象物的種類,可列舉半導體晶片、電路基板、引線框架、玻璃基板、金屬基板等,作為成形對象物的形狀,可列舉圓形、矩形以及其他的多邊形、橢圓形等。The shape of the edge restriction member is not particularly limited. In addition, the type and shape of the molded object are also not particularly limited. Examples of the types of molding objects to which the present invention can be applied include semiconductor wafers, circuit boards, lead frames, glass substrates, metal substrates, etc., and examples of the shapes of molding objects include circles, rectangles, other polygons, and ellipses. Wait.
本發明的樹脂成形品製造方法還可包括: 搬出時成形對象物保持步驟,在所述樹脂成形步驟後使所述第1模與所述第2模開模,以使所述成形對象物載置部的位置與所述成形對象物安裝部對準的方式使所述成形對象物保持部移動,將進行了樹脂成形而被安裝於成形對象物安裝部的所述成形對象物載置於所述成形對象物載置部,使所述端緣限制構件朝所述成形對象物載置部的內部的方向移動,藉此將所述成形對象物保持於所述成形對象物保持部;以及 搬出步驟,使所述成形對象物保持部移動至所述成形模的外部。The method of manufacturing a resin molded product of the present invention may further include: a step of holding a molded object during unloading, and after the resin molding step, the first mold and the second mold are opened to load the molded object The molded object holding portion is moved so that the position of the placement portion is aligned with the molded object mounting portion, and the molded object that has been resin molded and mounted on the molded object mounting portion is placed on the molded object mounting portion. The molded object placement portion moves the edge restricting member toward the inside of the molded object placement portion, thereby holding the molded object in the molded object holding portion; and carrying out A step of moving the molded object holding portion to the outside of the molding die.
成形對象物的外廓尺寸的偏差除上述加工時產生的加工誤差這一原因以外,例如也基於以下的原因而產生。第1原因的例子是起因於成形對象物的熱膨脹。在樹脂成形時第1模及第2模已升溫至能夠進行樹脂成形的溫度,因此成形對象物的溫度在剛剛進行樹脂成形後變得高於成形前的溫度。為了提高生產效率,需要在溫度充分下降前將成形對象物從成形對象物安裝部卸下並搬出至成形模的外側,因此成形對象物在搬出時,與搬入時相比產生熱膨脹,從而在搬入時與搬出時外廓尺寸不同。另外,若成形對象物的材質不同則熱膨脹率不同,因此成形對象物的外廓尺寸也因成形對象物的材質而不同。關於第2原因的例子,列舉在進行以下所述的二次成型(overmold)的情況下產生的問題。二次成型是指進行樹脂成形直至比成形對象物更靠外側為止,且當進行在比經樹脂密封的晶片更靠外側處也設置配線或輸入輸出端子的扇出型封裝時等使用。進行了二次成型的成形對象物的形狀變得大於原來的形狀,因此成形對象物的外廓尺寸在搬入時與搬出時不同。根據本發明的搬送裝置、樹脂成形裝置以及樹脂成形品製造方法,在所述第1原因及第2原因的例子中的任一者中均能對成形對象物進行保持,且能夠抑制將成形對象物安裝於成形對象物安裝部的位置產生偏離。In addition to the above-mentioned processing error caused during the processing, the deviation in the outline size of the molded object also occurs due to, for example, the following reasons. An example of the first cause is due to thermal expansion of the molded object. During the resin molding, the first mold and the second mold are heated to a temperature at which resin molding can be performed, so the temperature of the molded object becomes higher than the temperature before molding immediately after the resin molding. In order to improve production efficiency, it is necessary to remove the molded object from the molded object mounting part and carry it out to the outside of the molding die before the temperature drops sufficiently. Therefore, when the molded object is moved out, thermal expansion occurs compared to when it is moved in. The outer dimensions are different from when it was moved out. In addition, if the material of the molding object is different, the coefficient of thermal expansion is different, and therefore the outer size of the molding object also differs depending on the material of the molding object. As an example of the second cause, the problems that occur when overmold described below is performed are listed. Secondary molding refers to performing resin molding to the outside of the object to be molded, and is used when performing fan-out packages in which wiring or input/output terminals are also arranged on the outside of a resin-sealed wafer. The shape of the molded object that has undergone secondary molding becomes larger than the original shape, and therefore the outer dimensions of the molded object are different between when it is carried in and when it is carried out. According to the conveying device, resin molding device, and resin molded product manufacturing method of the present invention, the molded object can be held in any of the examples of the first cause and the second cause, and the molded object can be prevented from being molded. The position where the object is attached to the molded object attachment portion is deviated.
另外,在所述第1原因及第2原因的例子中,在成形對象物朝成形模的搬入時與從成形模中搬出成形對象物時成形對象物的外廓尺寸不同,因此在專利文獻1中記載的樹脂成形裝置中,與搬入用的搬送裝置(裝運機)獨立地具備搬出用的搬送裝置(卸載機(offloader)),從而成為樹脂成形裝置的成本上升的因素。與此相對,在本發明的搬送裝置、樹脂成形裝置以及樹脂成形品製造方法中,在搬入時與搬出時使用相同的搬送裝置,因此能夠抑制成本。In addition, in the examples of the first and second reasons, the outer dimensions of the molded object are different when the molded object is loaded into the molding die and when the molded object is removed from the molding die. Therefore, it is described in
在本發明的搬送裝置以及樹脂成形裝置中,理想的是所述成形對象物保持部還包括施力構件,所述施力構件對所述多個端緣限制構件朝所述方向(成形對象物載置部的內部的方向)進行施力。另外,在本發明的樹脂成形品製造方法中,理想的是在將成形對象物保持於所述成形對象物保持部的狀態下,利用施力構件對所述多個端緣限制構件在所述方向上進行施力。藉此,在將成形對象物保持於成形對象物保持部期間,通過利用施力構件朝成形對象物載置部的內部的方向被施力的多個端緣限制構件而成形對象物得以保持,因此能夠更穩定地對成形對象物進行保持。例如,存在如下情況:當成形對象物保持部及其所保持的成形對象物靠近已升溫的第1模及第2模時,成形對象物保持部及成形對象物分別與各自的熱膨脹率對應地產生膨脹。即便是此種情況,也能夠通過對多個端緣限制構件朝成形對象物載置部的內部的方向進行施力來穩定地保持成形對象物。In the conveying device and the resin molding device of the present invention, it is desirable that the molded object holding portion further includes an urging member, and the urging member opposes the plurality of edge restriction members in the direction (molded object The direction of the inside of the mounting part) to apply force. In addition, in the method for manufacturing a resin molded product of the present invention, it is desirable that the plurality of edge restriction members are urged by the urging member in the state in which the molded object is held in the molded object holding portion. Apply force in the direction. Thereby, while the molded object is held in the molded object holding portion, the molded object is held by the plurality of edge restriction members that are urged toward the inside of the molded object placement portion by the urging member. Therefore, the molded object can be held more stably. For example, there are cases where the molded object holding portion and the molded object held by the molded object are close to the first mold and the second mold that have increased in temperature, and the molded object holding portion and the molded object correspond to their respective thermal expansion coefficients. Produce swelling. Even in this case, it is possible to stably hold the molded object by urging the plurality of edge restriction members in the direction of the inside of the molded object mounting portion.
在本發明的搬送裝置中,可採用包括如下構件的構成: 板狀的轉動構件,繞轉動中心進行轉動; 端緣限制構件引導長孔,在所述轉動構件上相對於多個所述端緣限制構件的各者而各設置一個,供所述端緣限制構件插通,且能夠使所述端緣限制構件移動;以及 端緣限制構件移動限制部,相對於多個所述端緣限制構件的各者而各設置一個,將所述端緣限制構件能夠移動的方向限制在穿過所述端緣限制構件與所述轉動中心的直線上。此種搬送裝置能夠用於本發明的樹脂成形裝置以及樹脂成形品製造方法。In the conveying device of the present invention, a configuration including the following members can be adopted: a plate-shaped rotating member that rotates around the center of rotation; Each of the restricting members is provided with one for each of the end edge restricting members to be inserted through and capable of moving the end edge restricting member; and an end edge restricting member movement restricting portion relative to the plurality of end edge restricting members One is provided for each, and the direction in which the end edge restricting member can move is restricted to a straight line passing through the end edge restricting member and the center of rotation. Such a conveying device can be used for the resin molding apparatus and the resin molded product manufacturing method of the present invention.
根據具有所述轉動構件、端緣限制構件引導長孔、以及端緣限制構件移動限制部的構成,通過使轉動構件繞轉動中心進行轉動,端緣限制構件在端緣限制構件引導長孔內的位置發生變化,伴隨於此,端緣限制構件以與轉動中心的距離發生變化的方式在穿過所述端緣限制構件與所述轉動中心的直線上進行移動。藉此,能夠使端緣限制構件朝成形對象物載置部的內部的方向、或所述方向的相反方向移動。According to the configuration having the rotating member, the guide long hole of the edge restricting member, and the movement restricting portion of the edge restricting member, by rotating the rotating member around the center of rotation, the edge restricting member guides the long hole in the edge restricting member. The position changes, and accompanying this, the edge restriction member moves on a straight line passing through the edge restriction member and the rotation center such that the distance from the rotation center changes. Thereby, the edge restriction member can be moved in the direction of the inside of the molding object placement part, or in the opposite direction of the said direction.
所述端緣限制構件引導長孔能夠採用如下構成:連結所述端緣限制構件引導長孔的寬度方向上的中心的寬度方向中心線上的一點和所述轉動中心的距離與不同於所述一點的所述寬度方向中心線上的一點和所述轉動中心的距離不同。藉此,當利用轉動構件的轉動而端緣限制構件在端緣限制構件引導長孔內的所述兩個點之間進行移動時,所述兩個點與轉動中心的距離彼此不同,因此端緣限制構件在穿過所述端緣限制構件與所述轉動中心的直線上進行移動。此處所謂的「寬度方向」是指將端緣限制構件引導長孔的外緣上的某一點、與從所述點夾持所述端緣限制構件引導長孔的內部而位於最短距離的所述外緣上的另一點連結的方向。The guide hole of the end edge restriction member can be configured as follows: a distance between a point on a center line in the width direction connecting the center of the guide hole of the end edge restriction member in the width direction and the rotation center is different from the point The distance between a point on the center line in the width direction and the center of rotation is different. Thereby, when the end edge restricting member moves between the two points in the guide long hole of the end edge restricting member by the rotation of the rotating member, the distances between the two points and the center of rotation are different from each other. The edge restricting member moves on a straight line passing through the end edge restricting member and the center of rotation. The "width direction" as used herein refers to a point on the outer edge of the long hole that guides the edge restricting member, and the point that sandwiches the inside of the long hole of the end edge restricting member and is located at the shortest distance. State the direction in which another point on the outer edge connects.
能夠採用如下構成:所述端緣限制構件引導長孔以所述寬度方向中心線上的點與所述轉動中心的距離隨著所述點從所述寬度方向中心線的一端朝向另一端而增加的方式形成。藉此,當使轉動構件以俯視時順時針或逆時針的任一方向進行轉動時,端緣限制構件以靠近轉動中心的方式進行移動,當使轉動構件進行反方向轉動時,端緣限制構件以遠離轉動中心的方式進行移動。The following configuration can be adopted: the end edge restricting member guides the elongated hole so that the distance between the point on the center line in the width direction and the center of rotation increases as the point moves from one end of the center line in the width direction to the other end Way to form. Thereby, when the rotating member is rotated in either clockwise or counterclockwise direction in a plan view, the edge restricting member moves close to the center of rotation, and when the rotating member is rotated in the opposite direction, the edge restricting member Move away from the center of rotation.
在具有所述施力構件的搬送裝置以及樹脂成形裝置中,理想的是還包括施力構件控制部,所述施力構件控制部使所述施力構件的作動開始/停止(ON/OFF)。另外,在進行使用所述施力構件的操作的樹脂成形品製造方法的所述搬入時成形對象物保持步驟(及所述搬出時成形對象物保持步驟)中,理想的是在將成形對象物載置於所述成形對象物載置部之前,使所述施力構件的作動停止,在將所述成形對象物載置於所述成形對象物載置部後,使所述施力構件的作動開始。藉此,在將成形對象物載置於成形對象物載置部時,多個端緣限制構件不會利用施力構件朝成形對象物載置部的內部的方向被施力,因此能夠在確保所述多個端緣限制構件與成形對象物之間的間隙的同時,將成形對象物載置於成形對象物載置部。In the conveying device and the resin molding apparatus having the urging member, it is desirable to further include an urging member control unit that starts/stops the operation of the urging member (ON/OFF) . In addition, in the step of holding the molded object at the time of loading (and the step of holding the molded object at the time of unloading) in the method of manufacturing a resin molded product using the operation of the urging member, it is desirable that the molded object Before placing on the molded object placement portion, the operation of the urging member is stopped, and after the molded object is placed on the molded object placement portion, the force of the urging member The action begins. Thereby, when the molded object is placed on the molded object placement portion, the plurality of edge restriction members are not urged toward the inside of the molded object placement portion by the urging member, so that the The plurality of end edge restricting members and the forming object simultaneously place the forming object on the forming object placing portion.
在本發明的搬送裝置以及樹脂成形裝置中,理想的是全部的所述多個端緣限制構件能夠連動地在所述方向上進行移動。另外,在本發明的樹脂成形品製造方法中,理想的是在使所述多個端緣限制構件在所述方向上進行移動時,使全部的所述多個端緣限制構件連動地在所述方向上進行移動。藉此,能夠將成形對象物保持於成形對象物保持部的中央附近,從而能夠提高朝成形對象物安裝部的安裝位置的精度。In the conveying device and the resin molding device of the present invention, it is desirable that all of the plurality of edge restriction members can move in the direction in conjunction with each other. In addition, in the method of manufacturing a resin molded article of the present invention, it is desirable that when the plurality of edge restriction members are moved in the direction, all of the plurality of edge restriction members are interlocked with each other. Move in the direction described. Thereby, the molded object can be held in the vicinity of the center of the molded object holding portion, and the accuracy of the attachment position to the molded object attachment portion can be improved.
理想的是在與載置於所述成形對象物載置部的所述成形對象物上所設置的切口(凹口(notch))對應的位置設置有所述多個端緣限制構件中的一個。藉此,通過使切口的位置對準所述端緣限制構件來將所述成形對象物載置於所述成形對象物載置部,能夠確定成形對象物載置部上的成形對象物的方向。It is desirable to provide one of the plurality of edge restriction members at a position corresponding to a notch (notch) provided on the molded object placed on the molded object placement portion . Thereby, by aligning the position of the cutout with the edge restriction member to place the molded object on the molded object placement portion, the direction of the molded object on the molded object placement portion can be determined .
以下,使用圖1~圖15對本發明的搬送裝置、樹脂成形裝置以及樹脂成形品製造方法的更具體的實施方式進行說明。Hereinafter, more specific embodiments of the conveying device, resin molding device, and resin molded product manufacturing method of the present invention will be described using FIGS. 1 to 15.
(1) 本實施方式的搬送裝置以及樹脂成形裝置的構成 圖1中,用概略圖表示作為本發明的一實施方式的搬送裝置(搬送機構)20、及作為本發明的一實施方式的且具有所述搬送裝置20的樹脂成形裝置10的整體構成。所述樹脂成形裝置10是進行壓縮成形的裝置,且包括:基底111、直立設置於基底111上的四根(圖1中僅示出兩根,在縱深方向上設置有其餘兩根)系杆(tie bar)112、以能夠進行上下移動的方式保持於系杆112的可動台板121、固定於系杆112的上端的固定台板122、以及設置於基底111上的使可動台板121上下移動的曲柄連杆113。另外,樹脂成形裝置10在可動台板121的上表面具備下模152,在固定台板122的下表面具備上模151。由所述上模151與下模152構成一組成形模15。(1) The structure of the conveying device and the resin molding device of the present embodiment In FIG. 1, a schematic diagram shows a conveying device (conveying mechanism) 20 as an embodiment of the present invention, and a conveying device (conveying mechanism) 20 as an embodiment of the present invention. The overall structure of the
上模151相當於所述第1模,且下表面成為保持成形對象物的成形對象物安裝部1511,在所述成形對象物安裝部1511上設置有氣體抽吸孔1512。在上模151與固定台板122之間,在靠近上模151處設置有加熱器142,在靠近固定台板122處設置有隔熱材141。氣體抽吸孔1512經由設置於上模151及加熱器142內的氣體抽吸管1513而連接於真空泵(未圖示)。The
下模152相當於所述第2模,且具有包含平面形狀(俯視時)為圓形的框的周壁構件1521、裝入至周壁構件1521的框內的且平面形狀為圓形的底面構件1522、以及設置於周壁構件1521的下表面的彈性構件1523。由所述周壁構件1521及底面構件1522所包圍的空間成為供給樹脂材料的腔室C。再者,周壁構件1521的框及底面構件1522的形狀能夠根據製造的樹脂成形品的形狀而設為圓形以外的長方形等形狀。在下模152與可動台板121之間,在靠近下模152處設置有加熱器142,在靠近可動台板121處設置有隔熱材141。利用至此為止所述的各構成要素來構成壓縮成形裝置101。The
搬送裝置20在成形模15為開模的狀態下,能夠在上模151和下模152之間(成形模15內)的成形對象物安裝部1511的正下方的位置與成形模15的外側之間沿橫向進行移動,且在上表面具有載置成形對象物S的成形對象物載置部25。在本實施方式中,載置於成形對象物載置部25的成形對象物S為板狀,且設為圓形的基板。When the forming mold 15 is opened, the conveying
使用圖2(a)~圖5對搬送裝置20的構成進行詳細說明。The configuration of the conveying
圖2(a)是搬送裝置20的整體的俯視圖,圖2(b)是圖2(a)所示的A-A'縱剖面的圖,圖2(c)是圖2(a)所示的B-B'縱剖面的圖。搬送裝置20具有底架21、升降架22、轉動架(轉動構件)23、非轉動架24、成形對象物載置部25、升降機構26、以及端緣限制構件27。在本實施方式中,設置有十個端緣限制構件27,其中的九個以相等間隔(40°間隔)配置於圓周上。剩下的一個端緣限制構件27A配置於所述九個中鄰接的兩個端緣限制構件27之間,且配置於比所述圓周略靠內側處。再者,此處所示的端緣限制構件27的個數只是一例,並不限定於此。升降架22、轉動架23、非轉動架24及成形對象物載置部25從下方起按照此順序重疊設置,且均是平面形狀的外廓為相同大小的圓形。升降架22設置於底架21上。Fig. 2(a) is a plan view of the entire conveying
底架21在平面形狀的一個方向(圖2(a)的橫向)上具有延伸至比升降架22等的外廓的圓更靠外側處的形狀。在底架21的所述一個方向上的兩端的下表面設置有一對凸狀軌211,所述一對凸狀軌211在與所述一個方向正交的方向(圖2(a)的縱向,圖2(b)的與紙面垂直的方向)上延伸。在樹脂成形裝置10中,設置有與所述凸狀軌211對應的軌16(在圖2(a)~圖2(c)中未圖示。參照後述的圖7(a)~圖7(f)),搬送裝置20的整體被這些軌引導而在成形模15內側與成形模15外側之間進行移動。The
圖3(a)中表示升降架22的俯視圖,圖3(b)中表示轉動架23的俯視圖。在升降架22的上表面的中心突出有軸體221。在轉動架23的中心設置有供軸體221插通的孔231,轉動架23以所述軸體221為轉動中心進行轉動。FIG. 3(a) shows a plan view of the
在升降架22上設置有十個端緣限制構件引導凹部222,其中的九個沿著外廓的圓周以40°間隔設置於比升降架22的外廓稍靠內側處(圖2(c)、圖3(a))。剩下的一個端緣限制構件引導凹部222A配置於所述九個中鄰接的兩個端緣限制構件引導凹部222之間,且配置於比所述九個端緣限制構件引導凹部222略靠內側處。配置端緣限制構件引導凹部222A的圓周方向上的位置只要在將成形對象物安裝於成形模時,與想要配置成形對象物中所設置的切口(凹口)的位置(想要面向切口的方向)對準而任意設定即可。一個端緣限制構件27所具有的圓筒狀的端緣限制構件收容部272(後述)的下表面附近被保持於一個端緣限制構件引導凹部222(包含端緣限制構件引導凹部222A)中。端緣限制構件引導凹部222的與轉動中心相交的直線(圖3(a)中的點劃線)延伸方向上的兩端的距離設定地比端緣限制構件收容部272的直徑大。另外,將端緣限制構件引導凹部222的與所述直線垂直的方向上的寬度設定地比所述距離短,且比端緣限制構件收容部272的直徑稍大,以使端緣限制構件收容部272幾乎不會在與所述直線垂直的方向上進行移動,且能夠在所述直線的方向上進行移動。藉此,端緣限制構件27以被端緣限制構件引導凹部222引導而在所述直線延伸的方向上進行移動的方式被限制。所述端緣限制構件引導凹部222相當於所述端緣限制構件移動限制部。Ten edge limiting member guide recesses 222 are provided on the lifting
轉動架23為板狀,且設置有十個端緣限制構件引導長孔232,其中的九個沿著外廓的圓周以40°間隔設置於比轉動架23的外廓稍靠內側處(圖3(b))。剩下的一個端緣限制構件引導長孔232A配置於所述九個中鄰接的兩個端緣限制構件引導長孔232之間,且配置於比所述九個端緣限制構件引導長孔232略靠轉動架23的內側處。在各端緣限制構件引導長孔232中,各插通一個保持於升降架22的端緣限制構件引導凹部222中的端緣限制構件27,其中在端緣限制構件引導長孔232A中插通端緣限制構件27A。端緣限制構件引導長孔232在與轉動中心相交的直線延伸的方向上具有比端緣限制構件收容部272的直徑略大的寬度。端緣限制構件引導長孔232中,將在所插通的端緣限制構件27在端緣限制構件引導長孔232的長邊方向上進行移動的期間中端緣限制構件本體271描繪的軌跡(圖3(b)中的粗線)規定為「寬度方向中心線」。以從所述寬度方向中心線的左端朝向右端(此處,左右是在端緣限制構件引導長孔232位於比轉動中心更靠圖3(b)所說的正上方的位置的情況下規定),端緣限制構件引導長孔232與轉動架23的轉動中心(孔231的中心)的距離(在端緣限制構件引導長孔232的左端設為r1
,在右端設為r2
。另外,將端緣限制構件引導長孔232的左端設為「r1
端」,將右端設為「r2
端」)逐漸減少(因而r1
>r2
)的方式,相對於以所述轉動中心為中心的圓的切線方向而傾斜地設置端緣限制構件引導長孔232。除端緣限制構件引導長孔232A以外的九個端緣限制構件引導長孔232以相同形狀且以相對於切線方向而相同的斜率設置。端緣限制構件引導長孔232A以從寬度方向中心線的左端朝向右端(定義與其他端緣限制構件引導長孔232的情況相同,在圖3(b)中所描繪的端緣限制構件引導長孔232A的位置下是從右端朝向左端),與轉動架23的轉動中心的距離從r3
逐漸減少至r4
(r3
>r4
,r1
>r3
,r2
>r4
)的方式相對於切線方向而傾斜。將端緣限制構件引導長孔232A的左端設為「r3
端」,將右端設為「r4
端」。The
利用此種構成,當使轉動架23在俯視時逆時針(以下,「逆時針」及「順時針」是在俯視時規定)轉動時,各端緣限制構件27的位置從端緣限制構件引導長孔232內的r1
端側移動至r2
端側(在端緣限制構件引導長孔232A中是從r3
端側移動至r4
端側),藉此端緣限制構件27(27A)與轉動中心的距離逐漸變小而朝成形對象物載置部25的內部的方向(存在轉動中心的方向)移動(圖4(a))。另一方面,當使轉動架23順時針轉動時,各端緣限制構件27的位置從端緣限制構件引導長孔232內的r2
端側移動至r1
端側(在端緣限制構件引導長孔232A中是從r4
端側移動至r3
端側),藉此端緣限制構件27(27A)與轉動中心的距離逐漸變大而朝成形對象物載置部25的外部的方向移動(圖4(b))。此處,除端緣限制構件引導長孔232A以外的九個端緣限制構件引導長孔232以相同形狀且以相對於切線方向而相同的斜率設置,藉此在所述朝成形對象物載置部25的內部的方向及外部的方向的移動中,在除端緣限制構件27A以外的九個端緣限制構件27之間維持與轉動中心的距離相等的狀態。端緣限制構件27A以與其他端緣限制構件27相比與轉動中心的距離更近的方式移動。With this structure, when the
在升降架22上設置有在使轉動架23逆時針轉動的方向上進行施力的扭轉彈簧234。藉此,端緣限制構件27朝成形對象物載置部25的內部的方向被施力。所述扭轉彈簧234及轉動架23相當於所述施力構件。再者,施力構件不限定於扭轉彈簧,也能夠使用使轉動架23逆時針轉動的氣缸或伺服馬達等。The lifting
在轉動架23的外緣設置有一處切口235。另外,在升降架22的外緣設置有止動件225。止動件225利用彈簧朝切口235側被施力,且設置於當使轉動架23順時針轉動一整圈時卡合於切口235的位置。如上所述,轉動架23利用扭轉彈簧234而在逆時針轉動(即,使端緣限制構件27朝成形對象物載置部25的內部的方向移動)的方向上被施力,但通過使止動件225卡合於切口235,能夠使轉動架23在順時針轉動一整圈(即,使端緣限制構件27朝成形對象物載置部25的外部的方向移動)的狀態下停止。而且,通過使經卡合的止動件225從切口235中脫離,轉動架23利用扭轉彈簧234的作用而逆時針轉動。所述止動件225及切口235相當於使施力構件的作動開始/停止的施力構件控制部。止動件225的位置或方向並無特別限定。A
非轉動架24及成形對象物載置部25中在分別對應於升降架22的端緣限制構件引導凹部222的位置,設置有具有與所述端緣限制構件引導凹部222相同平面形狀的端緣限制構件穿過孔242及端緣限制構件穿過孔252(圖2(c))。The
升降機構26是設置於底架21的上表面,且使升降架22上升及下降的機構。伴隨升降架22的上升及下降,設置於升降架22上的轉動架23、非轉動架24及成形對象物載置部25也上升及下降。The elevating
如圖5所示,端緣限制構件27具有端緣限制構件本體271、上文所述的圓筒狀的端緣限制構件收容部272、以及彈性構件273。端緣限制構件本體271是直徑比端緣限制構件收容部272的圓筒小的圓柱狀的構件。彈性構件273對端緣限制構件本體271的下端進行支撐,且設置於端緣限制構件收容部272內的底部。當按壓端緣限制構件本體271的上端時,彈性構件273被壓縮而所述上端下降。當解除所述按壓時,彈性構件273伸長,所述上端回到原來的位置。當端緣限制構件本體271的上端位於所述原來的位置時,所述上端穿過端緣限制構件穿過孔252而突出至比成形對象物載置部25的上表面更靠上側處。另一方面,端緣限制構件收容部272的上端位於比成形對象物載置部25的上表面更靠下側處。成形對象物載置部25與端緣限制構件27合併構成成形對象物保持部28。As shown in FIG. 5, the
在升降架22上設置有用以在成形模15內使搬送裝置20與上模151的橫向上的位置對準的四個板狀的定位件2241~定位件2244。定位件2241~定位件2244以如下方式配置:當使搬送裝置20從上模151的下方上升時,定位件2241~定位件2244中的各一個分別抵接於上模151的四個側面。The lifting
(2) 本實施方式的搬送裝置及樹脂成形裝置的動作以及本實施方式的樹脂成形品製造方法 接著,使用圖6(a-1)~圖8(b)對搬送裝置20及樹脂成形裝置10的動作、以及本發明的樹脂成形品製造方法的實施方式進行說明。再者,在圖7(a)~圖7(f)以及圖8(a)及圖8(b)中,表示從圖1的右方向觀察樹脂成形裝置10的圖。(2) The operation of the conveying device and the resin molding device of this embodiment, and the resin molded product manufacturing method of this embodiment Next, the conveying
首先,使搬送裝置20沿著與設置於底架21的凸狀軌211卡合的設置於樹脂成形裝置10中的軌16而移動至成形對象物的拆裝位置。First, the conveying
接著,使轉動架23順時針轉動來使止動件225卡合於切口235。藉此,端緣限制構件27移動至成形對象物載置部25的外部側(圖6(a-1)、圖6(a-2))。在所述狀態下,將圓板狀的成形對象物(半導體晶片)S配置於成形對象物載置部25的上表面中的由九個端緣限制構件27所包圍的區域的內側。此處,在成形對象物S的外緣設置有一處切口SC,使所述切口SC的位置對準端緣限制構件27A的位置(圖6(a-1))。在所述狀態下,各端緣限制構件27(包含端緣限制構件27A)未抵接於成形對象物S的外緣。Next, the rotating
接著,使止動件225從切口235中脫離,並利用扭轉彈簧234的作用而使轉動架23逆時針轉動。藉此,十個端緣限制構件27連動地朝成形對象物載置部25的內部的方向移動。而且,通過端緣限制構件27的端緣限制構件本體271抵接於成形對象物S的外緣,轉動架23的轉動停止(因而,轉動架23不一定逆時針轉動一整圈),成形對象物S被保持於成形對象物載置部25(圖6(b-1)、圖6(b-2))。如此,通過多個端緣限制構件27連動地抵接於成形對象物載置部25的外緣,成形對象物S被保持於成形對象物載置部25的中央,能夠抑制成形對象物S的位置偏離。另外,即便因加工誤差等而在成形對象物S的外廓尺寸上存在偏差,也能夠通過端緣限制構件27進行移動來保持成形對象物S,能夠抑制安裝位置的偏離。進而,端緣限制構件27中的配置於切口SC的位置的端緣限制構件27A與所述切口SC卡合,藉此成形對象物S的圓周方向上的位置也如規定,從而能夠確定成形對象物載置部25上的成形對象物S的方向。至此,搬入時成形對象物保持步驟完成。Next, the
在如此將成形對象物S載置於成形對象物載置部25後,使搬送裝置20沿著軌16在上模151與下模152之間進行移動,以使成形對象物載置部25與上模151的成形對象物安裝部1511的位置對準(圖7(a))。After the molding object S is placed on the molding
在所述位置,利用升降機構26使包含成形對象物載置部25的比升降架22更靠上側的部分升降,來使載置於成形對象物載置部25的成形對象物S抵接於成形對象物安裝部1511(圖7(b))。此時,端緣限制構件本體271的上端比成形對象物S先抵接於成形對象物安裝部1511,其後當利用升降機構26進一步上升時,彈性構件273被壓縮,藉此與成形對象物載置部25的上表面的相對位置下降。因此,能夠使成形對象物S不被端緣限制構件27干擾地抵接於成形對象物安裝部1511。In this position, the elevating
在如此成形對象物S抵接於成形對象物安裝部1511的狀態下,利用真空泵從氣體抽吸孔1512抽吸氣體,藉此成形對象物被安裝於成形對象物安裝部1511。繼續從氣體抽吸孔1512抽吸氣體直至後述的停止時為止。而且,使轉動架23順時針轉動來使端緣限制構件27朝成形對象物載置部25的外側的方向移動,在利用升降機構26使成形對象物載置部25等下降後,使搬送裝置20移動至成形模15的外側(圖7(c))。至此,成形對象物搬入步驟完成。In such a state that the molding object S is in contact with the molding
接著,利用未圖示的脫模膜鋪設機構將脫模膜F鋪設於下模152的腔室C的內表面後,利用未圖示的樹脂材料供給機構將包含熱硬化性樹脂的樹脂材料P供給至腔室C內(圖7(d))。所述脫模膜鋪設機構及樹脂材料供給機構在現有的樹脂成形裝置中已被廣泛使用,因而省略詳細的說明。樹脂材料P利用從加熱器142供給的熱而在腔室C內熔融。Next, after the mold release film F is laid on the inner surface of the cavity C of the
在腔室C內的樹脂材料P熔融後,利用曲柄連杆113來使可動台板121上升。藉此,可動台板121上的下模152抵接於上模151並按壓所述上模151,從而上模151被固定於固定台板122,藉此上模151與下模152合模(圖7(e))。在所述狀態下經過規定時間後,樹脂材料P硬化,獲得在成形對象物S的表面進行樹脂成型而成的樹脂成形品PS。至此,樹脂成形步驟完成。After the resin material P in the cavity C is melted, the
其後,通過利用曲柄連杆113使可動台板121下降,來使成形模15開模(圖7(f))。繼而,在上模151與下模152之間對搬送裝置20進行搬送,以使成形對象物載置部25與上模151的成形對象物安裝部1511的位置對準(圖8(a))。而且,在通過使轉動架23朝右方向轉動來使端緣限制構件27移動至成形對象物載置部25的外部側的狀態(圖6(a-1)、圖6(a-2))下,利用升降機構26使成形對象物載置部25等上升,來使成形對象物載置部25的上表面抵接於樹脂成形品PS的下表面(圖8(b))。接著,停止從氣體抽吸孔1512抽吸氣體,並利用升降機構26使成形對象物載置部25等下降。After that, the
進而,通過使轉動架23逆時針轉動,來使端緣限制構件27朝成形對象物載置部25的內部側移動(圖6(b-1)、圖6(b-2))而抵接於樹脂成形品PS的外緣。藉此,在成形對象物S的表面進行樹脂成型而成的樹脂成形品PS成為保持於成形對象物保持部28的狀態。此時,樹脂成形品PS還未被充分冷卻,有時外廓尺寸會比樹脂成形前的成形對象物S大,但即便是在此種情況下,也能夠通過端緣限制構件27進行移動來保持樹脂成形品PS。同樣地,進行樹脂成型至比成形對象物S的外廓更靠外側為止而成的二次成型的樹脂成形品PS也能夠通過端緣限制構件27進行移動而保持。至此,搬出時成形對象物保持步驟完成。Furthermore, by rotating the
其後,使搬送裝置20移動至成形模15的外側(搬出步驟)。然後,在通過使轉動架23朝右轉動而使端緣限制構件27移動至成形對象物載置部25的外部側的狀態下,從成形對象物載置部25卸下樹脂成形品PS,藉此一個樹脂成形品PS的製造結束。After that, the conveying
至此為止所敘述的搬送裝置20的動作、具體來說轉動架23的轉動、沿著軌16的移動、及利用升降機構26的成形對象物載置部25等的升降可使用動力自動地進行,也可由操作者手動進行。The operations of the conveying
(3) 本實施方式的搬送裝置的變形例 使用圖9(a)~圖11(b)來表示本實施方式的搬送裝置的變形例。所述變形例的搬送裝置均能夠在上述實施方式的樹脂成形裝置10中用來代替搬送裝置20。(3) Modification of the conveying device of this embodiment A modification of the conveying device of this embodiment is shown using FIGS. 9(a) to 11(b). The conveying device of the above-mentioned modification can be used in place of the conveying
圖9(a)表示第1變形例的搬送裝置20B的俯視圖,圖9(b)表示第1變形例的搬送裝置20B的縱剖面圖。本變形例中的搬送裝置20B不具有轉動架及非轉動架,而是在升降架22B上直接設置有圓形的成形對象物載置部25B。在成形對象物載置部25B上設置有九個端緣限制構件收容孔252B,在各端緣限制構件收容孔252B中各設置有一個端緣限制構件27B及端緣限制構件移動部275B。端緣限制構件27B與端緣限制構件移動部275B是通過連結杆276B而連結。端緣限制構件移動部275B使端緣限制構件27B在成形對象物載置部25B的內部(中央)側及外部側移動。各端緣限制構件移動部275B進行連動,且以成形對象物載置部25B的中心與各端緣限制構件27B的距離變得相等的方式被控制部(未圖示)控制。另外,搬送裝置20B具有與上文所述的搬送裝置20中所設置的底架同樣的底架21B、以及使升降架22B升降的升降機構26B。再者,此例中雖省略,但也可與上述實施方式中的端緣限制構件27A同樣地,在對應於成形對象物的切口的位置設置端緣限制構件及端緣限制構件收容孔。另外,端緣限制構件移動部275B可為氣缸或伺服馬達等。Fig. 9(a) shows a plan view of the conveying
關於搬送裝置20B的詳細的動作,除端緣限制構件27B利用端緣限制構件移動部275B而在成形對象物載置部25B的內部側及外部側移動這一方面以外,與上文所述的搬送裝置20相同。The detailed operation of the conveying
圖10中,針對第2變形例的搬送裝置20C來表示成形對象物載置部25C及端緣限制構件27C的上表面。In FIG. 10, the upper surface of the molding target
成形對象物載置部25C在俯視時具有正方形的形狀,在比所述正方形的四條邊更靠內側處,分別並列地設置有各兩個、合計設置有八個端緣限制構件穿過孔252C。在各端緣限制構件穿過孔252C中分別穿過有各一個端緣限制構件27C。端緣限制構件27C包含與上文所述同樣的端緣限制構件本體、端緣限制構件收容部及彈性構件。端緣限制構件穿過孔252C呈如下的平面形狀:與端緣限制構件收容部272C的直徑相比,從所述正方形的中央更朝向邊延伸,且在與此垂直的方向上具有大致相同的大小。The molding
在各端緣限制構件穿過孔252C中分別設置有與第1變形例的端緣限制構件移動部275B同樣的端緣限制構件移動部275C。In each end edge restricting
第2變形例的樹脂成形裝置在將正方形的板狀的成形對象物S'載置於成形對象物載置部25C後,使端緣限制構件27C朝成形對象物載置部25C的內部的方向移動,在利用端緣限制構件27C保持成形對象物S'的外緣的狀態下,進行成形對象物S'朝成形模的搬入及樹脂成形品從成形模的搬出。關於搬送裝置20C的詳細的動作,除端緣限制構件27C的動作與第1變形例的搬送裝置20B相同以外,與上文所述的搬送裝置20的動作相同。In the resin molding apparatus of the second modification example, after the square plate-shaped molding object S'is placed on the molding
圖11(a)中表示第3變形例的搬送裝置20D的俯視圖,圖11(b)中表示第3變形例的搬送裝置20D的縱剖面圖。本變形例中的搬送裝置20D在升降架22D上直接設置有圓形的成形對象物載置部25D。在升降架22D的下方設置有與上文所述的搬送裝置20中所設置的構件同樣的底架21D、以及使升降架22D升降的升降機構26D。在成形對象物載置部25D的上表面設置有四個包含可撓性銷的端緣限制構件27D。端緣限制構件27D以等間隔(每隔90°)配置於直徑比圓形的成形對象物S略大的圓周上。各端緣限制構件27D上分別設置有載置於升降架22、且配置於成形對象物載置部25D的外側的夾具29。夾具29是以與成形對象物載置部25D的上表面平行的軸為中心進行轉動的棒狀材,且以朝所述上表面的射影朝向成形對象物載置部25D的中心的方式配置。當夾具29的一端通過轉動而下降時與端緣限制構件27D接觸,將端緣限制構件27D朝向成形對象物載置部25D的中心推出。Fig. 11(a) shows a plan view of the conveying
在利用第3變形例中的搬送裝置20D對成形對象物S進行搬送時,將圓形的成形對象物S載置於成形對象物載置部25D後,使夾具29轉動,藉此成形對象物載置部25D的中心側的夾具29的端部下降,將包含可撓性銷的端緣限制構件27D朝向所述中心側推出(圖12)。藉此,將端緣限制構件27D壓抵至成形對象物S的端部而使成形對象物S固定於成形對象物載置部25D。此處,通過使四個夾具29同步,能夠將成形對象物S配置於成形對象物載置部25D的中央。When the molding object S is transported by the
本發明並不限定於上述實施方式以及變形例。例如,在上述實施方式中以使用壓縮成形裝置的情況為例進行了說明,但即便使用移送(轉注(transfer))成形裝置來代替壓縮成形裝置,也能夠採用具備與上述同樣的搬送裝置20、搬送裝置20B、搬送裝置20C、搬送裝置20D的構成。The present invention is not limited to the above-mentioned embodiment and modification examples. For example, in the above embodiment, a case where a compression molding device is used is used as an example. However, even if a transfer (transfer) molding device is used instead of the compression molding device, it is possible to use the same conveying
能夠使用以下的止動件225A以及槽226A來代替搬送裝置20中所設置的包含止動件225以及切口235的施力構件控制部。圖13(a)中,針對設置有止動件225A以及槽226A的搬送裝置20而放大地表示升降架22的上表面的一部分。止動件225A具有安裝於轉動架23,且在從轉動架23的中心朝向外側的方向上延伸的杆2251A、連接於杆2251A的輥2252A、對杆2251A朝升降架22的中心的方向施力的彈性構件2253A。槽226A設置於升降架22且具有分別朝升降架22的中心的方向及與升降架22的中心的方向垂直的方向延伸的L字狀的形狀。輥2252A嵌入至槽226A。The following
在所述構成中,當使轉動架23轉動時,伴隨於此,杆2251A也轉動。而且,當使轉動架23順時針轉動一整圈時,即當使端緣限制構件27移動至最外側時,輥2252A到達槽226A的朝升降架22的中心的方向延伸的部分的外側的端部。接著,杆2251A利用彈性構件2253A被施力,藉此輥2252A被拉入至槽226A的所述部分(圖13(b))。如此,轉動架23的轉動被槽226A的所述部分限制,從而轉動架23得以固定。藉此,端緣限制構件27在最外側的位置得以固定。而且,當將杆2251A拉向外側的方向時,轉動的限制被解除,然後通過扭轉彈簧234的作用,轉動架23逆時針轉動,端緣限制構件27移動至內側而對成形對象物S的端緣進行限制。In the above configuration, when the
或者,如圖14(a)所示,也可使用如下的施力構件控制部:其將能夠繞軸轉動的杆2251B安裝於轉動架23,在杆2251B上設置有鉤2252B,並在升降架22中設置有槽226B。所述情況下,當使轉動架23順時針轉動一整圈時,通過使杆2251B繞軸進行轉動而將鉤2252B嵌入至槽226B(圖14(a)),藉此來限制轉動架23的轉動。Or, as shown in Figure 14 (a), the following force-applying member control unit can also be used: it mounts the
另外,在上述實施方式中,表示了相對於一組壓縮成形裝置而設置一台搬送裝置的例子,但也可在多組壓縮成形裝置中共用一台搬送裝置。在成形對象物朝成形模的安裝與從成形模中搬出樹脂成形品之間需要用以進行樹脂成形的時間,因此,能夠利用所述用以進行樹脂成形的時間來將成形對象物安裝於另一壓縮成形裝置的成形模、或者從另一成形模中搬出樹脂成形品。藉此,能夠抑制搬送裝置所需的成本。In addition, in the above-mentioned embodiment, the example in which one conveying device is provided for a group of compression molding apparatuses is shown, but one conveying apparatus may be shared among a plurality of groups of compression molding apparatuses. The time required for resin molding is required between the installation of the molded object to the molding die and the removal of the resin molded product from the molding die. Therefore, the time for resin molding can be used to mount the molded object to another A molding die of a compression molding device, or a resin molded product is unloaded from another molding die. Thereby, the cost required for the conveying device can be suppressed.
作為在多組壓縮成形裝置中共用一台搬送裝置的例子,可列舉以下所述的圖15所示的樹脂成形單元30。所述樹脂成形單元30具有一台材料接收模塊31、多台成形模塊32、以及一台支出模塊33。材料接收模塊31是用以從外部接收樹脂材料P以及成形對象物S並送出至成形模塊32的裝置,且具有成形對象物接收部311以及樹脂材料供給裝置312。一台成形模塊32具有上述實施方式的樹脂成形裝置10中的壓縮成形裝置101。在圖15中示出了三台成形模塊32,但在樹脂成形單元30中可設置任意台數的成形模塊32。另外,即使在已組成樹脂成形單元30並開始使用後也能夠增減成形模塊32。支出模塊33從成形模塊33中搬入利用成形模塊32製造的樹脂成形品PS並進行保持,且具有樹脂成形品保持部331。搬送裝置20沿著樹脂成形單元30內所設置的搬送軌35,將成形對象物從材料接收模塊31內的成形對象物接收部31搬入至成形模塊32內的成形模的成形對象物安裝部,且將利用成形模塊32所成形的樹脂成形品從成形對象物安裝部搬出至支出模塊33內的樹脂成形品保持部331。此外,在樹脂成形單元30中設置樹脂材料搬送裝置,所述樹脂材料搬送裝置將樹脂材料P從材料接收模塊31內的樹脂材料供給裝置312搬送至成形模塊32內的成形模的腔室。As an example of sharing one conveying device in a plurality of sets of compression molding devices, a resin molding unit 30 shown in FIG. 15 described below can be cited. The resin molding unit 30 has a
10‧‧‧樹脂成形裝置15‧‧‧成形模16‧‧‧軌20、20B、20C、20D‧‧‧搬送裝置(搬送機構)21、21B、21D‧‧‧底架22、22B、22D‧‧‧升降架23‧‧‧轉動架24‧‧‧非轉動架25、25B、25C、25D‧‧‧成形對象物載置部26、26B、26D‧‧‧升降機構27、27A、27B、27C、27D‧‧‧端緣限制構件28‧‧‧成形對象物保持部29‧‧‧夾具30‧‧‧樹脂成形單元31‧‧‧材料接收模塊32‧‧‧成形模塊33‧‧‧支出模塊35‧‧‧搬送軌101‧‧‧壓縮成形裝置111‧‧‧基底112‧‧‧系杆113‧‧‧曲柄連杆121‧‧‧可動台板122‧‧‧固定台板141‧‧‧隔熱材142‧‧‧加熱器151‧‧‧上模(第1模)152‧‧‧下模(第2模)211‧‧‧凸狀軌221‧‧‧軸體222、222A‧‧‧端緣限制構件引導凹部225、225A‧‧‧止動件226A、226B‧‧‧槽231‧‧‧孔232、232A‧‧‧端緣限制構件引導長孔234‧‧‧扭轉彈簧235‧‧‧切口242、252、252C‧‧‧端緣限制構件穿過孔252B‧‧‧端緣限制構件收容孔271‧‧‧端緣限制構件本體272、272C‧‧‧端緣限制構件收容部273、2253A‧‧‧彈性構件275B、275C‧‧‧端緣限制構件移動部276B‧‧‧連結杆311‧‧‧成形對象物接收部312‧‧‧樹脂材料供給裝置331‧‧‧樹脂成形品保持部1511‧‧‧成形對象物安裝部1512‧‧‧氣體抽吸孔1513‧‧‧氣體抽吸管1521‧‧‧周壁構件1522‧‧‧底面構件1523‧‧‧彈性構件2241、2242、2243、2244‧‧‧定位件2251A、2251B‧‧‧杆2252A‧‧‧輥2252B‧‧‧鉤C‧‧‧腔室F‧‧‧脫模膜P‧‧‧樹脂材料PS‧‧‧樹脂成形品S、S'‧‧‧成形對象物SC‧‧‧切口r1、r2、r3、r4‧‧‧距離A-A'、B-B'‧‧‧剖線10‧‧‧Resin molding device 15‧‧‧Forming die 16‧‧‧Rail 20, 20B, 20C, 20D‧‧‧Transfer device (transport mechanism) 21, 21B, 21D‧‧‧Underframe 22, 22B, 22D‧ ‧‧Elevating frame 23‧‧‧Turning frame 24‧‧‧Non-rotating frame 25, 25B, 25C, 25D ,27D‧‧‧End edge restricting member 28‧‧‧Molding object holding part 29‧‧‧Jig 30‧‧‧Resin molding unit 31‧‧‧Material receiving module 32 ‧‧‧Transport rail 101‧‧‧Compression molding device 111‧‧‧Base 112‧‧‧Tie rod 113‧‧‧Crank connecting rod 121‧‧‧Movable platen 122‧‧‧Fixed platen 141‧‧‧Heat insulation Material 142‧‧‧Heater 151‧‧‧Upper mold (first mold) 152‧‧‧Lower mold (second mold) 211‧‧‧Convex rail 221‧‧‧Shaft 222, 222A‧‧‧End edge Restriction member guide recess 225, 225A‧‧stopper 226A, 226B‧‧‧ slot 231‧‧‧ hole 232, 232A‧‧‧end limit member guide long hole 234‧‧‧torsion spring 235‧‧‧notch 242 , 252, 252C‧‧‧End edge restricting member passing hole 252B ‧Elastic member 275B, 275C‧‧‧End edge restriction member moving part 276B‧‧‧Connecting rod 311‧‧‧Molding object receiving part 312‧‧Resin material supply device 331‧‧‧Resin molded product holding part 1511‧‧ ‧Molded object mounting part 1512‧‧‧Gas suction hole 1513‧‧‧Gas suction pipe 1521‧‧‧Surrounding wall member 1522‧‧ Positioning piece 2251A, 2251B‧‧‧Pole 2252A‧‧‧Roller 2252B‧‧‧Hook C‧‧‧Chamber F‧‧‧Release film P‧‧‧Resin material PS‧‧‧Resin molded product S, S'‧ ‧‧Shaped object SC‧‧‧Cut r 1 , r 2 , r 3 , r 4 ‧‧‧Distance A-A', B-B'‧‧‧Cut
圖1是表示本發明的搬送裝置以及樹脂成形裝置的一實施方式的概略圖。 圖2(a)是表示本實施方式的搬送裝置的整體的俯視圖,圖2(b)是A-A'縱剖面圖,圖2(c)是B-B'縱剖面圖。 圖3(a)是表示本實施方式的搬送裝置的升降架的俯視圖,圖3(b)是表示本實施方式的搬送裝置的轉動架的俯視圖。 圖4(a)及圖4(b)是表示伴隨轉動架的轉動的端緣限制構件的動向的圖,圖4(a)是表示端緣限制構件朝成形對象物載置部的內部的方向移動的情況的圖,圖4(b)是表示端緣限制構件朝成形對象物載置部的外部的方向移動的情況的圖。 圖5是表示本實施方式的搬送裝置及樹脂成形裝置中的端緣限制構件的縱剖面圖。 圖6(a-1)~圖6(b-2)是表示本實施方式的搬送裝置及樹脂成形裝置中的轉動架及端緣限制構件的動作的俯視圖,圖6(a-1)是表示使端緣限制構件朝成形對象物載置部的外部的方向移動的動作的圖,圖6(a-2)是圖6(a-1)的局部放大圖,圖6(b-1)是表示使端緣限制構件朝成形對象物載置部的內部的方向移動的動作的圖,圖6(b-2)是圖6(b-1)的局部放大圖。 圖7(a)~圖7(f)是表示本實施方式的搬送裝置以及成形模等的動作的圖,圖7(a)是表示朝上模與下模之間搬入搬送裝置的圖,圖7(b)是表示搬送裝置上升的圖,圖7(c)表示朝成形對象物安裝部安裝成形對象物的圖,圖7(d)是表示朝腔室鋪設脫模膜以及供給樹脂材料的圖,圖7(e)是表示合模的狀態的圖,圖7(f)是表示開模的狀態的圖。 圖8(a)及圖8(b)是表示圖7(a)~圖7(f)所示的搬送裝置以及成形模等的動作的後續的圖,圖8(a)是表示朝上模與下模之間搬入搬送裝置的圖,圖8(b)是表示搬送裝置上升的圖。 圖9(a)是表示第1變形例的搬送裝置的俯視圖,圖9(b)是B-B'縱剖面圖。 圖10是表示第2變形例的搬送裝置的成形對象物載置部及端緣限制構件的俯視圖。 圖11(a)是表示第3變形例的搬送裝置的俯視圖,圖11(b)是表示第3變形例的搬送裝置的側面圖。 圖12是表示第3變形例的搬送裝置的動作的側面圖。 圖13(a)是表示施力構件控制部的變形例的構成的平面圖,圖13(b)是表示施力構件停止(OFF)的狀態的平面圖。 圖14(a)是表示施力構件控制部的另一變形例的平面圖,圖14(b)是表示施力構件停止(OFF)的狀態的平面圖。 圖15是表示具有本實施方式的搬送裝置以及樹脂成形裝置的樹脂成形單元的構成的概略圖。Fig. 1 is a schematic view showing an embodiment of the conveying device and the resin molding device of the present invention. Fig. 2(a) is a plan view showing the entire conveying device of the present embodiment, Fig. 2(b) is an AA' longitudinal sectional view, and Fig. 2(c) is a BB' longitudinal sectional view. Fig. 3 (a) is a plan view showing the elevator frame of the conveying device of the present embodiment, and Fig. 3(b) is a plan view showing the turret of the conveying device of the present embodiment. 4(a) and 4(b) are diagrams showing the movement of the edge restricting member accompanying the rotation of the turret, and Fig. 4(a) is a diagram showing the direction of the edge restricting member toward the inside of the molding object placement portion Fig. 4(b) is a diagram showing a state of movement, and Fig. 4(b) is a diagram showing a state in which the edge restricting member moves toward the outside of the molding target placement portion. Fig. 5 is a longitudinal cross-sectional view showing an edge restricting member in the conveying device and the resin molding device of the present embodiment. Figures 6(a-1) to 6(b-2) are plan views showing the movements of the turret and the edge restricting member in the conveying device and the resin molding device of this embodiment, and Figure 6(a-1) shows Figure 6(a-2) is a partial enlarged view of Figure 6(a-1), and Figure 6(b-1) is a diagram of the action of moving the edge restricting member toward the outside of the molding object placement part. It is a figure which shows the operation|movement which moves the edge restriction|limiting member toward the inside of a shaping|molding object mounting part, FIG. 6(b-2) is a partial enlarged view of FIG. 6(b-1). Figs. 7(a) to 7(f) are diagrams showing the operations of the conveying device and the forming mold according to the present embodiment, and Fig. 7(a) is a diagram showing the conveying device that is moved between the upper mold and the lower mold. 7(b) is a diagram showing the ascending of the conveying device, FIG. 7(c) is a diagram showing the mounting of the molded object to the molding object mounting part, and FIG. 7(d) is a diagram showing the laying of the release film and the supply of resin material to the cavity Fig. 7(e) is a diagram showing a state where the mold is closed, and Fig. 7(f) is a diagram showing a state where the mold is opened. Figures 8(a) and 8(b) are subsequent diagrams showing the operations of the conveying device and the forming mold shown in Figures 7(a) to 7(f), and Figure 8(a) shows the upward mold The figure of the conveying device carried in between the lower mold and FIG. 8(b) is a figure which shows that the conveying device rises. Fig. 9(a) is a plan view showing the conveying device of the first modification, and Fig. 9(b) is a BB' longitudinal cross-sectional view. Fig. 10 is a plan view showing a molding target placement portion and an edge restricting member of a conveying device according to a second modification. Fig. 11(a) is a plan view showing the conveying device of the third modification, and Fig. 11(b) is a side view showing the conveying device of the third modification. Fig. 12 is a side view showing the operation of the conveying device according to the third modification. Fig. 13(a) is a plan view showing the configuration of a modification of the urging member control unit, and Fig. 13(b) is a plan view showing a state where the urging member is stopped (OFF). Fig. 14(a) is a plan view showing another modification of the urging member control unit, and Fig. 14(b) is a plan view showing a state where the urging member is stopped (OFF). FIG. 15 is a schematic diagram showing the configuration of a resin molding unit including the conveying device and the resin molding device of the present embodiment.
21‧‧‧底架 21‧‧‧Underframe
22‧‧‧升降架 22‧‧‧Lift frame
23‧‧‧轉動架 23‧‧‧Turning frame
24‧‧‧非轉動架 24‧‧‧Non-rotating frame
25‧‧‧成形對象物載置部 25‧‧‧Molding object placement part
26‧‧‧升降機構 26‧‧‧Lifting mechanism
27、27A‧‧‧端緣限制構件 27, 27A‧‧‧End edge restraint member
28‧‧‧成形對象物保持部 28‧‧‧Molding object holding part
211‧‧‧凸狀軌 211‧‧‧Convex rail
221‧‧‧軸體 221‧‧‧Shaft
222‧‧‧端緣限制構件引導凹部 222‧‧‧End edge restriction member guide recess
225‧‧‧止動件 225‧‧‧stop
231‧‧‧孔 231‧‧‧Hole
242、252‧‧‧端緣限制構件穿過孔 242, 252‧‧‧End edge restriction member through hole
2241、2242、2243、2244‧‧‧定位件 2241, 2242, 2243, 2244‧‧‧Positioning piece
A-A'、B-B'‧‧‧剖線 Section A-A', B-B'‧‧‧
Claims (14)
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CN118024485B (en) * | 2024-04-15 | 2024-06-14 | 福建荣阳鞋业有限公司 | Sole forming die and manufacturing process thereof |
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JPH0565965U (en) * | 1992-02-13 | 1993-08-31 | 株式会社壬生電機製作所 | Support drum for bundle-shaped body such as bundle-shaped tube and bundle-shaped wire |
TW200420404A (en) * | 2002-11-26 | 2004-10-16 | Towa Corp | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
US20100194009A1 (en) * | 2009-02-03 | 2010-08-05 | Wkk Distribution, Ltd. | Substrate holding platen with adjustable shims |
US20130161879A1 (en) * | 2011-12-27 | 2013-06-27 | Apic Yamada Corporation | Method for resin molding and resin molding apparatus |
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JPH0691151B2 (en) * | 1987-11-27 | 1994-11-14 | 富士電機株式会社 | Wafer centering positioning device for semiconductor wafer transfer equipment |
JP4162282B2 (en) * | 1997-12-24 | 2008-10-08 | アピックヤマダ株式会社 | Resin molding equipment |
JP4603209B2 (en) * | 2001-08-23 | 2010-12-22 | 株式会社アドバンテスト | Positioning and fixing device for wafer transfer |
KR101077075B1 (en) * | 2008-11-25 | 2011-10-26 | 세크론 주식회사 | Loader for semiconductor device molding apparatus, semiconductor device molding apparatus with the same, and semiconductor device molding method using the same |
CN202985183U (en) * | 2012-12-14 | 2013-06-12 | 铜陵市金利电子有限公司 | Three-jaw disc-type fixture for drilling machine |
JP5934156B2 (en) * | 2013-08-20 | 2016-06-15 | Towa株式会社 | Substrate transport and supply method and substrate transport and supply apparatus |
DE202014004713U1 (en) * | 2014-06-06 | 2015-04-13 | Klingelnberg Ag | Clamping system for a workpiece on a measuring machine |
JP6612024B2 (en) * | 2014-09-30 | 2019-11-27 | Towa株式会社 | Resin molding apparatus, resin molding method, and resin molded product manufacturing method |
JP2016111323A (en) * | 2014-11-26 | 2016-06-20 | 株式会社デンソー | Substrate fixing device |
CN205058373U (en) * | 2015-10-14 | 2016-03-02 | 巢湖市荣达塑业有限公司 | Vibration device |
JP2017212419A (en) * | 2016-05-27 | 2017-11-30 | Towa株式会社 | Resin sealed product manufacturing method and resin sealing device |
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JPH0565965U (en) * | 1992-02-13 | 1993-08-31 | 株式会社壬生電機製作所 | Support drum for bundle-shaped body such as bundle-shaped tube and bundle-shaped wire |
TW200420404A (en) * | 2002-11-26 | 2004-10-16 | Towa Corp | Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material |
US20100194009A1 (en) * | 2009-02-03 | 2010-08-05 | Wkk Distribution, Ltd. | Substrate holding platen with adjustable shims |
US20130161879A1 (en) * | 2011-12-27 | 2013-06-27 | Apic Yamada Corporation | Method for resin molding and resin molding apparatus |
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JP7034700B2 (en) | 2022-03-14 |
CN109940792A (en) | 2019-06-28 |
KR102198457B1 (en) | 2021-01-06 |
TW201929101A (en) | 2019-07-16 |
CN109940792B (en) | 2022-03-08 |
JP2019111673A (en) | 2019-07-11 |
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