TWI732576B - Miniature robotic device and arrangement system for micro dies - Google Patents
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Description
本發明是有關於微晶粒的運載與排列,特別是指一種微型機器人裝置及微晶粒排列系統。The present invention relates to the carrying and arrangement of micro-crystal grains, in particular to a micro-robot device and a micro-crystal grain arrangement system.
目前微型化的微發光二極體(Micro-LED)正享有體積縮小所帶來的優勢,然而微型化的體積在製造上亦面臨了新的困難與挑戰。特別是,在Micro-LED顯示器的製造程序中的巨量轉移技術已成為是否能量產或獲利的關鍵技術。換言之,若對於數以百萬計微米等級的Micro-LED無法有效地在合理的時間內由磊晶基板精確無誤地轉移至顯示基板,則無法達成量產的目的。At present, miniaturized micro-LEDs are enjoying the advantages brought about by the reduction in size, but the miniaturized size is also facing new difficulties and challenges in manufacturing. In particular, the mass transfer technology in the manufacturing process of Micro-LED displays has become a key technology for energy production or profitability. In other words, if Micro-LEDs with millions of micrometers cannot be efficiently transferred from the epitaxial substrate to the display substrate within a reasonable time, the goal of mass production cannot be achieved.
因此,如何能夠在巨量轉移程序之前將大量的待轉移微LED精確地排列成所欲形態或圖案以利後續的轉移操作實屬當前重要研發課題之一,亦成為當前相關領域極需改進的目標。Therefore, how to accurately arrange a large number of micro LEDs to be transferred into a desired shape or pattern to facilitate the subsequent transfer operation is one of the current important research and development topics, and it has also become a current related field that needs improvement. the goal.
因此,本發明的一目的,即在提供一種微型機器人裝置,其能克服現有技術的至少一缺點。Therefore, an object of the present invention is to provide a micro-robot device which can overcome at least one shortcoming of the prior art.
於是,本發明所提供的一種微型機器人裝置用於運載微晶粒,並包含一基板、一控制電路層、及一手臂層。Therefore, a micro-robot device provided by the present invention is used to carry micro-die, and includes a substrate, a control circuit layer, and an arm layer.
該控制電路層係形成在該基板上,並包含有多個呈陣列排列的控制電路。每一控制電路組配來回應於來自外部的一對應的控制信號產生並輸出第一至第四控制電流。The control circuit layer is formed on the substrate and includes a plurality of control circuits arranged in an array. Each control circuit is configured to generate and output first to fourth control currents in response to a corresponding control signal from the outside.
該手臂層係形成在該控制電路層上,並包含有多個彼此間隔且呈陣列排列的手臂模組。每一手臂模組在位置上對應於且受控於該等控制電路其中一個對應的控制電路,並包括一絕緣的驅動臂、及一線圈組。對於每一手臂模組,該絕緣的驅動臂包括包括一具彈性且自該控制電路層直立延伸的主臂體、及在徑向上彼此相反地自該主臂體往外延伸的兩個側臂體,該驅動臂在徑向上的長度小於要被運載的微晶粒的長度與寬度;及該線圈組電連接該對應控制電路,並且具有兩個分別設於該等側臂體的底側的第一線圈,以及兩個分別與該等第一線圈在縱向上間隔地對齊且設在該控制電路層上的第二線圈,該等第一線圈和該等第二線圈分別允許自該對應控制電路輸出的該第一至第四控制電流通過。The arm layer is formed on the control circuit layer and includes a plurality of arm modules spaced apart and arranged in an array. Each arm module corresponds to and is controlled by a corresponding control circuit of one of the control circuits in position, and includes an insulated driving arm and a coil group. For each arm module, the insulated driving arm includes a main arm body that is elastic and extends upright from the control circuit layer, and two side arm bodies that extend outwardly from the main arm body opposite to each other in the radial direction , The length of the driving arm in the radial direction is less than the length and width of the microcrystalline grains to be carried; and the coil assembly is electrically connected to the corresponding control circuit, and has two first arms respectively arranged on the bottom side of the side arm bodies A coil, and two second coils respectively aligned with the first coils at intervals in the longitudinal direction and arranged on the control circuit layer, the first coils and the second coils are respectively allowed from the corresponding control circuit The outputted first to fourth control currents pass.
每一手臂模組的該驅動臂的該等側臂體的延伸方向垂直於任一相鄰手臂模組的該驅動臂的該等側臂體的延伸方向。The extending direction of the side arm bodies of the driving arm of each arm module is perpendicular to the extending direction of the side arm bodies of the driving arm of any adjacent arm module.
對於每一手臂模組,該對應控制電路透過分別流經該等第一線圈及該等第二線圈的該第一至第四控制電流而使該線圈組產生的電磁效應來控制該主臂體因受到該電磁效應而彎折所導致在其頂端的位移。For each arm module, the corresponding control circuit controls the main arm body through the electromagnetic effect generated by the coil group by the first to fourth control currents respectively flowing through the first coils and the second coils Displacement at the top end caused by bending due to the electromagnetic effect.
當一微晶粒被放置在該手臂層上時,該微晶粒可透過位在其下方的一個或多個手臂模組所產生的位移而移動。When a micro-crystal grain is placed on the arm layer, the micro-crystal grain can move through the displacement generated by one or more arm modules located below it.
因此,本發明的另一目的,即在提供一種微晶粒排列系統,其能克服現有技術的至少一缺點。Therefore, another objective of the present invention is to provide a microcrystalline grain arrangement system that can overcome at least one of the disadvantages of the prior art.
於是,本發明所提供的一種微晶粒排列系統適於將N(N≧2)個微晶粒排列成預定圖案,並包含如上述的微型機器人裝制、一影像拍攝模組、一影像辨識模組、及一移動控制模組。Therefore, the micro-crystal grain arranging system provided by the present invention is suitable for arranging N (N≧2) micro-crystal grains into a predetermined pattern, and includes the above-mentioned micro-robot assembly, an image capturing module, and an image recognition Module, and a mobile control module.
該微型機器人裝置係用於驅動承載在該手臂層上的該N個微晶粒。The micro robot device is used to drive the N micro crystal grains carried on the arm layer.
該影像拍攝模組設置在該微型機器人裝置的上方,並組配來以一預定頻率連續拍攝承載有該N個微晶粒的該手臂層的影像。The image capturing module is arranged above the micro-robot device, and is configured to continuously capture images of the arm layer carrying the N microcrystalline grains at a predetermined frequency.
該影像辨識模組電連接該影像拍攝模組以接收該影像拍攝模組所拍攝的每幅影像,並對於每幅影像,辨識該N個微晶粒且根據辨識結果獲得該手臂層中分別承載有該N個微晶粒的N個操作區域的區域位置資料。The image recognition module is electrically connected to the image capture module to receive each image captured by the image capture module, and for each image, recognize the N micro-crystal grains and obtain the respective bearing in the arm layer according to the recognition result There are regional position data of the N operating regions of the N microcrystalline grains.
該移動控制模組電連接該微型機器人裝置的該控制電路層及該影像辨識模組,並且在接到來自該影像辨識模組且對應於每幅影像的該區域位置資料時,於一預定控制週期執行一控制處理,其中該移動控制模組根據該區域位置資料和與該預定排列圖案相關聯的N個目標區域的參考區域位置資料,利用一移動估測演算法,產生一與該N個微晶粒移動有關的控制輸出,並將該控制輸出傳送至該微型機器人裝置的該控制電路層。The movement control module is electrically connected to the control circuit layer of the micro-robot device and the image recognition module, and when receiving the region position data from the image recognition module and corresponding to each image, performs a predetermined control A control process is periodically executed, wherein the movement control module uses a movement estimation algorithm to generate a movement estimation algorithm based on the area position data and the reference area position data of the N target areas associated with the predetermined arrangement pattern. The control output related to the movement of the micro-crystal grain is transmitted to the control circuit layer of the micro-robot device.
該移動控制模組在該控制處理中所產生的該控制輸出包含多個提供給該控制電路層中在位置上分別對應於該手臂層的該N個操作區域內的多個手臂模組的多個電路模組的控制信號,以使得該等電路模組其中每一者根據所接收到的該等控制信號其中一個對應控制信號產生與電磁效應相關聯的第一至第四控制電流,並使得該等手臂模組的驅動臂受到電磁效應而彎折,以便共同驅使該N個微晶粒其中每一者朝向該N個目標區域其中一對應者移動一預定距離。The control output generated by the movement control module in the control processing includes a plurality of arm modules provided to the control circuit layer in positions corresponding to the arm modules in the N operation regions of the arm layer. Control signals of each circuit module, so that each of the circuit modules generates the first to fourth control currents associated with the electromagnetic effect according to one of the received control signals corresponding to one of the control signals, and causes The driving arms of the arm modules are bent by electromagnetic effects, so as to jointly drive each of the N micro-crystal grains to move a predetermined distance toward one of the N target regions.
該移動控制模組重複執行該控制處理,直到該N個微晶粒排列成該預定圖案。The movement control module repeatedly executes the control process until the N microcrystalline grains are arranged in the predetermined pattern.
本發明之功效在於:由於該微型機器人裝置在適當的電磁效應控制下能以如MHz至GHz等級的操作頻率有效且快速地移動所承載的微晶粒,以使其排列成預定圖案,藉此有利對於排列好的微晶粒進行後續高效能的巨量轉移處理。The effect of the present invention is that the micro-robot device can effectively and quickly move the carried micro-crystal grains at an operating frequency of MHz to GHz level under proper electromagnetic effect control to arrange them in a predetermined pattern, thereby It is beneficial for the subsequent high-efficiency mass transfer treatment of the arranged microcrystalline grains.
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.
參閱圖1,所繪示的本發明實施例的微晶粒排列系統100適於將N(N≧2)個微晶粒(圖未示)排列成預定圖案,並包含一微型機器人裝置10、一影像拍攝模組20、一影像辨識模組30、及一移動控制模組40。在本實施例中,要被排列的微晶粒可以是小於1×1mm的晶粒,例如,Mini-LED、Micro-LED或半導體晶片。Referring to FIG. 1, the micro-crystal
參閱圖2至圖4,該微型機器人裝置10係用於運載該N個微晶粒(圖未示),並包含一基板1、一形成在該基板1上的控制電路層2、及一形成在該控制電路層2上的手臂層3。值得注意的是,在本實施例中,該微型機器人裝置10可經由已知的半導體製程技術製作而成。2 to 4, the
該基板1可以例如晶圓(Wafer)的基材來實施,但不以此例為限。The
該控制電路層2包含有多個呈陣列排列的控制電路21,如圖3所示。應注意的是,實際上,由於每一控制電路21會被設計成具有極小的電路面積,例如約為200×200nm
2,為了清楚說明起見,已將該等控制電路21放大或誇大地呈現於圖3及圖4。每一控制電路21組配來回應於一對應的控制信號產生並輸出第一至第四控制電流I1~I4。舉例來說,每一控制電路21所產生的該第一至第四電流I1~I4根據該對應控制信號而設計成:該第一電流I1與該第二電流I2為具有相同大小但互為反向的電流,亦即I1=-I2;及該第三電流I3與該第四電流I4彼此相同,亦即I3=I4,但不以此例為限,然而,在其他實施態樣中,該第一至第四電流I1~I4亦可被設計成I1=I2且I3=-I4。更具體地,每一控制電路21例如可以一CMOS邏輯電路或一TTL(Transistor-Transistor Logic)電路來實現。
The
該手臂層3包含有多個彼此間隔且呈陣列排列的手臂模組4,其中每一首臂模組4在位置上對應於且受控於對應的控制電路21,如圖3所示。The
再參閱圖2、圖4及圖5,每一手臂模組4包括一絕緣的驅動臂41、及一線圈組42。有關每一手臂模組4的細節將進一步詳細說明如下。Referring again to FIGS. 2, 4 and 5, each arm module 4 includes an insulated
該驅動臂41包括一具彈性且自該控制電路層2直立延伸的主臂體411、及在徑向上彼此相反地自該主臂體411往外延伸的兩個側臂體412。值得注意的是,該驅動臂411在徑向上的長度(也就是,該兩個側壁體412的自由端之間的距離)小於每一要被運載的微晶粒的長度和寬度。舉例來說,若要被運載的微晶粒大小為10um×10um,則該驅動臂411的長度可被設計成約為200nm。應注意的是,每一手臂模組4的該驅動臂41的該等側臂體412的延伸方向垂直於任一相鄰手臂模組4的該驅動臂41的該等側臂體412的延伸方向(見圖3)。The
該線圈組42電連接該對應控制電路21(見圖2),並具有兩個分別設於該等側壁體412的底側的第一線圈421,422,以及兩個分別與該等第一線圈421,422在縱向上間隔地對齊且設在該控制電路層2(的對應控制電路21)上的第二線圈423,424。該等第一線圈421,422和該等第二線圈423,424分別允許自該對應控制電路21輸出的該第一至第四控制電流I1~I4通過(見圖2)。The
在運作上,對於每一手臂模組4,該對應控制電路21透過流經該等第一線圈421,422及該等第二線圈423,424的該第一至第四控制電流I1~I4而由該線圈組42所產生的電磁效應來控制該主壁體411因受到該電磁效應而彎折所導致在其頂端的位移。舉例來說,如圖6所示,若在該第一電流I1與該第三電流I3和該第四電流I4具有相同的電流方向,例如逆時鐘方向,而該第二電流具有例如順時鐘的電流方向,的情況下,該第一線圈421在該第一電流I1流過時所產生的感應磁場之方向相同於該第三線圈423在該第三電流I3流過時所產生的感應磁場的方向,於是該第一線圈421與該第三線圈423因感應磁場相吸的磁力作用彼此接近;同時該第二線圈422在該第二電流I2流過時所產生的感應磁場之方向相反於該第四線圈424在該第四電流I4流過時所產生的感應磁場的方向,於是該第二線圈422與該第四線圈424因感應磁場互斥的磁力作用彼此遠離,致使該主臂體411的該頸段4111朝向彼此接近的該第一線圈421和該第三線圈423彎折,因而在該主臂體411的頂端產生了如朝向圖面左側的位移。或者,如圖7所示,若在該第二電流I2與該第三電流I3和該第四電流I4均具有逆時鐘的電流方向而該第一電流I1具有順時鐘的電流方向的情況下該第一線圈421在該第一電流I1流過時所產生的感應磁場之方向相反於該第三線圈423在該第三電流I3流過時所產生的感應磁場的方向,於是該第一線圈421與該第三線圈423因感應磁場互斥的磁力作用彼此遠離;同時該第二線圈422在該第二電流I2流過時所產生的感應磁場之方向相同於該第四線圈424在該第四電流I4流過時所產生的感應磁場的方向,於是該第二線圈422與該第四線圈424因感應磁場相吸的磁力作用彼此接近,致使該主臂體411的該頸段4111朝向彼此接近的該第二線圈422和該第四線圈424彎折,因而在該主臂體411的頂端產生了如朝向圖面右側的位移。如此,藉由對於該第一電流I1與該第二電流I2彼此反向的設計,可控制該主臂體411的頂端在該等側壁體412的延伸方向上的往返移動。在實際應用上,若該手臂模組4被設計成具有大約200nm×200nm×200nm的大小時(即,該主臂體411的高度為200nm),該位移可被設計成在2nm~5nm的範圍內的極小距離。In operation, for each arm module 4, the
在使用時,當一微晶粒(圖未示)被放置在該手臂層3上時,該微晶粒可透過位在其下方的一個或多個手臂模組4所產生的位移而移動。In use, when a microcrystalline grain (not shown in the figure) is placed on the
該影像拍攝模組20設置在該微型機器人裝置10的上方,並組配來以一預定頻率連續拍攝承載有該N個微晶粒的該手臂層3的影像。The image capturing
該影像辨識模組30電連接該影像拍攝模組20以接收該影像拍攝模組20所拍攝的每幅影像,並對於每幅影像,辨識該N個微晶粒且根據辨識結果獲得該手臂層3中分別承載有該N個微晶粒的N個操作區域的區域位置資料。The
該移動控制模組40電連接該微型機器人裝置10的該控制電路層2及該影像辨識模組30,並且在接到來自該影像辨識模組30且對應於每幅影像的該區域位置資料時,於一預定控制週期內,執行一控制處理,其中該移動控制模組40根據該區域位置資料和與該預定排列圖案相關聯的N個目標區域的參考區域位置資料,利用一移動估測演算法,產生一與該N個微晶粒移動有關的控制輸出,並將該控制輸出傳送至該微型機器人裝置10的該控制電路層2。The
在本實施例中,該移動控制模組40在每次控制處理中所產生的該控制輸出包含多個提供給該控制電路層2中在位置上分別對應於該手臂層3的該N個操作區域內的多個手臂模組4的多個電路模組21的控制信號,以使得該等電路模組21其中每一者根據所接收到的該等控制信號其中一個對應控制信號產生與電磁效應相關聯的第一至第四控制電流,並使得該等手臂模組的驅動臂受到電磁效應而彎折,以便共同驅使該N個微晶粒其中每一者朝向該N個目標區域其中一對應者移動一預定距離。值得注意的是,該預定距離例如為每一手臂模組4的該主臂體411於單次彎折所導致的位移的整數倍。In this embodiment, the control output generated by the
該移動控制模組40重複執行上述控制處理,直到該N個微晶粒排列成該預定圖案。The
以下將參閱圖8至圖10來進一步示例地詳細說明,對於例如9(N=9)個呈矩形的微晶粒(為方便說明,分別以D1~D9來表示),該移動控制模組40在一次控制處理中如何對於該等微晶粒D1~D9進行的移動控制。當該影像辨識模組30獲得的該區域位置資料指示出9個操作區域,如圖8中以實線表示的矩形區域(也就是,該等微晶粒D1~D9所佔據的區域)時,該移動控制模組40根據該區域位置資料和該參考區域位置資料(其指示出與該預定排列圖案相關聯的9個目標區域,如圖9中以假想線繪示出的矩形區域),利用該移動估測演算法,產生一指示出該等微晶粒D1~D9其中每一者要移動的方向的估測結果。更明確地,該估測結果,如圖9所示,指示出相對於圖面而言,該等微晶粒D1,D3要向右移動,該微晶粒D2要向下移動,該等微晶粒D4,D5,D8,D9要向上移動,以及該微晶粒D6要向左移動。在此情況下,該控制輸出包含例如一與向上移動控制有關的第一控制信號、一與向下移動控制有關的第二控制信號、一與向左移動控制有關的第三控制信號、及一與向右移動控制有關的第四控制信號。該移動控制模組40還根據該區域位置資料,將該第一控制信號同時傳送至位在該等微晶粒D4,D5,D8,D9下方且對應於具有縱向延伸的側壁體的手臂模組4的控制電路21,將該第二控制信號同時傳送至位在該微晶粒D2下方且對應於具有縱向延伸的側壁體412的手臂模組4的控制電路21,將該第三控制信號同時傳送至位在該微晶粒D6下方且對應於具有橫向延伸的側壁體412的手臂模組4的控制電路21,並且將該第四控制信號同時傳送至位在該等微晶粒D1,D3下方且對應於具有橫向延伸的側壁體的手臂模組4的控制電路21。於是,接收到該第一/二/三/四控制信號的該等控制電路21產生對應於該第一/二/三/四控制信號的第一至第四電流I1~I4,之後經由對應的手臂模組4各自產生的電磁效應來驅使該等微晶粒D1~D9各自朝向估測的方向移動該預定距離。舉例來說,當該第一至第四電流I1~I4為週期性的信號(如脈波信號)時,若該主臂體411單次彎折所導致之位移例如為5nm時,該預定距離可以是一例如在5nm至50nm之範圍且為5nm整數倍的長度,但不以此例為限。之後,該移動控制模組40型連續執行數次上述控制處理後可將該等微晶粒D1~D9排列成該預定排列圖案,如圖10所示。The following will further illustrate in detail with reference to FIGS. 8-10. For example, for 9 (N=9) rectangular microcrystal grains (for convenience of explanation, they are represented by D1~D9 respectively), the
應注意的是,在實際應用時,該微型機器人裝置10,特別是該手臂模組4的尺寸大小可依照所要運載的微晶粒之尺寸來設計,並且該移動控制模組40可利用如上述的控制方式,或其他已知控制方式,同時對於大量的微晶粒進行移動控制。It should be noted that in practical applications, the size of the
綜上所述,該移動控制模組40透過該控制處理所產生的控制輸出,能使該微型機器人裝置10在適當的電磁效應控制下能以如MHz至GHz等級的操作頻率有效且快速地移動所承載的微晶粒,以使其排列成預定圖案,藉此有利對於排列好的微晶粒進行後續高效能的巨量轉移處理。故確實能達成本發明的目的。In summary, the control output generated by the
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.
100:微晶粒排列系統 10:微型機器人裝置 1:基板 2:控制電路層 21:控制電路 3:手臂層 4:手臂模組 41:驅動臂 411:主臂體 4111:頸段 412:側壁體 42:線圈組 421:第一線圈 422:第一線圈 423:第二線圈 424:第二線圈 I1:第一電流 I2:第二電流 I3:第三電流 I4:第四電流 D1~D9:微晶粒100: Microcrystalline grain arrangement system 10: Micro robotic device 1: substrate 2: Control circuit layer 21: Control circuit 3: Arm layer 4: Arm module 41: Drive arm 411: main arm body 4111: neck 412: side wall body 42: coil group 421: first coil 422: first coil 423: second coil 424: second coil I1: first current I2: second current I3: third current I4: Fourth current D1~D9: Microcrystalline grains
本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中: 圖1是一方塊圖,示例性地繪示本發明實施例的微晶粒排列系統的架構; 圖2是一方塊圖,繪示該實施例的一微型機器人裝置在電性上的配置; 圖3是一部分的立體示意圖,繪示該微型機器人裝置的架構; 圖4是該微型機器人裝置的一部分側示示意圖; 圖5是一示意圖,示例性地說明該微型機器人裝置的一手臂模組的結構; 圖6是一示意圖,示例性地說明該手臂模組產生電磁效應的一種情況; 圖7是一示意圖,示例性地說明該手臂模組產生電磁效應的另一種情況; 圖8是一頂視圖,示例性地說明該微型機器人裝置承載有9個微晶粒的情況; 圖9是一頂視示意圖,說明該微型機器人裝置如何移動該等微晶粒的情況;及 圖10是一頂視示意圖,說明該等微晶粒已被該微型機器人裝置排列成預定排列圖案。 Other features and effects of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a block diagram exemplarily showing the structure of a micro-die arrangement system according to an embodiment of the present invention; 2 is a block diagram showing the electrical configuration of a micro-robot device of this embodiment; FIG. 3 is a partial three-dimensional schematic diagram showing the structure of the micro-robot device; Figure 4 is a schematic side view of a part of the micro-robot device; FIG. 5 is a schematic diagram exemplarily illustrating the structure of an arm module of the micro-robot device; Fig. 6 is a schematic diagram exemplarily illustrating a situation in which the arm module generates electromagnetic effects; Figure 7 is a schematic diagram exemplarily illustrating another situation in which the arm module generates electromagnetic effects; FIG. 8 is a top view, which exemplarily illustrates the case where the micro-robot device carries 9 micro-crystal grains; Figure 9 is a schematic top view illustrating how the micro-robot device moves the micro-crystal grains; and FIG. 10 is a schematic top view illustrating that the micro-crystal grains have been arranged in a predetermined arrangement pattern by the micro-robot device.
10:微型機器人裝置 10: Micro robotic device
1:基板 1: substrate
2:控制電路層 2: Control circuit layer
21:控制電路 21: Control circuit
3:手臂層 3: Arm layer
4:手臂模組 4: Arm module
41:驅動臂 41: Drive arm
42:線圈組 42: coil group
421:第一線圈 421: first coil
422:第一線圈 422: first coil
423:第二線圈 423: second coil
424:第二線圈 424: second coil
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW348293B (en) * | 1996-01-31 | 1998-12-21 | Texas Instruments Inc | Method and apparatus for aligning the position of die on a wafer table a method for determining the position of a die on a wafer table after a wafer has been cut includes stepping the wafer table a series of one die lengths diagonally. |
CN1614738A (en) * | 2003-11-07 | 2005-05-11 | 敏盛科技股份有限公司 | Dynamic position coding method |
TW201436015A (en) * | 2013-01-25 | 2014-09-16 | Applied Materials Inc | Laser and plasma etch wafer dicing with etch chamber shield ring for film frame wafer applications |
-
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW348293B (en) * | 1996-01-31 | 1998-12-21 | Texas Instruments Inc | Method and apparatus for aligning the position of die on a wafer table a method for determining the position of a die on a wafer table after a wafer has been cut includes stepping the wafer table a series of one die lengths diagonally. |
CN1614738A (en) * | 2003-11-07 | 2005-05-11 | 敏盛科技股份有限公司 | Dynamic position coding method |
TW201436015A (en) * | 2013-01-25 | 2014-09-16 | Applied Materials Inc | Laser and plasma etch wafer dicing with etch chamber shield ring for film frame wafer applications |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114952785A (en) * | 2022-05-30 | 2022-08-30 | 江南大学 | Independent magnetic drive system of magnetic micro-nano robot |
CN114952785B (en) * | 2022-05-30 | 2023-03-10 | 江南大学 | Independent magnetic drive system of magnetic micro-nano robot |
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