TWI731993B - Measuring device - Google Patents
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- TWI731993B TWI731993B TW106121252A TW106121252A TWI731993B TW I731993 B TWI731993 B TW I731993B TW 106121252 A TW106121252 A TW 106121252A TW 106121252 A TW106121252 A TW 106121252A TW I731993 B TWI731993 B TW I731993B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Condensed Matter Physics & Semiconductors (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
本發明之課題在於提供一種測量裝置,其可以在短時間內有效率地測量板狀物的厚度或高度。 The subject of the present invention is to provide a measuring device that can efficiently measure the thickness or height of a plate in a short time.
根據本發明所提供之測量裝置,至少是由寬頻光源、分光器、分配組件、聚光透鏡、光傳輸組件、測定端子、光分歧組件、分光干涉波形生成組件、及計算組件所構成;該寬頻光源會發出對板狀物具有穿透性之波長區的光;該分光器是將該寬頻帶光源所發出之光在波長區進行分光;該分配組件是將藉由該分光器所分光之各波長的光以經過時間來變更分配方向;該聚光透鏡是將藉由該分配組件所分配之各波長的光聚光;該光傳輸組件是與該聚光透鏡相向,且傳輸藉由該聚光透鏡所聚光之各波長的光;該測定端子具備有鏡子與複數個接物透鏡,該鏡子是將構成該光傳輸組件之複數條光纖的另一端之端面分歧成2條路徑而配設在複數個第1端面並生成於該光纖逆行的第1返回光,該等接物透鏡是相向於該板狀物而成列且對應於複數個第2端面而配設;該光分歧組件是將在該板狀物之上表面反射之光與穿透板狀物而在下表面反射之光於各光纖逆行的第2返回光、及該第1返回光,配設於光傳輸組件之光的傳輸路徑上以從各光纖進行分歧;該分光干涉波形生成組件是從藉由該分配組件對各光纖分配之時間中對該第1返回光與該第2返回光之波長,檢測各波長之光的強度,以對應於各光纖生成分光干涉波形;該計算組件是對該分光干涉波形生成組件所生成之對應於各光纖的分光干涉波形進行波形解析,以計算板狀物的厚度或高度。 The measurement device provided according to the present invention is at least composed of a broadband light source, a beam splitter, a distribution component, a condenser lens, an optical transmission component, a measuring terminal, an optical branching component, a light splitting interference waveform generation component, and a calculation component; the broadband The light source emits light in the wavelength region that is transparent to the plate; the beam splitter is to split the light emitted by the broadband light source in the wavelength region; the distribution component is to split the light by the beam splitter The light of the wavelength changes the distribution direction with the elapsed time; the condensing lens condenses the light of each wavelength distributed by the distributing component; the light transmission component faces the condensing lens, and transmits through the condensing lens. The light of each wavelength condensed by the optical lens; the measuring terminal is equipped with a mirror and a plurality of objective lenses, and the mirror is arranged by dividing the end surface of the other end of the plurality of optical fibers constituting the optical transmission component into two paths The first returning light generated in the retrograde direction of the optical fiber on the plurality of first end faces, the objective lenses are arranged in rows facing the plate and corresponding to the plurality of second end faces; the light branching component is The light reflected on the upper surface of the plate and the light reflected on the lower surface of the plate are retrograde to the second return light of each optical fiber, and the first return light, which are arranged in the light of the optical transmission component The transmission path is branched from each optical fiber; the light splitting interference waveform generation component detects the wavelengths of the first return light and the second return light from the time allocated to each optical fiber by the distribution component The intensity of, to generate a spectral interference waveform corresponding to each optical fiber; the calculation component is to perform waveform analysis on the spectral interference waveform corresponding to each optical fiber generated by the spectral interference waveform generation component to calculate the thickness or height of the plate.
Description
發明領域 Field of invention
本發明是有關於一種測量板狀物之厚度、或高度的測量裝置。 The invention relates to a measuring device for measuring the thickness or height of a plate.
發明背景 Background of the invention
在將IC、LSI等複數個器件以分割預定線區劃出而形成於正面之晶圓,是在被磨削背面而形成預定的厚度之後,藉由切割裝置、雷射加工裝置來分割成一個個的器件,以利用於行動電話、個人電腦等電氣機器上。 The wafer formed on the front side by dividing a plurality of devices such as IC, LSI, etc. with predetermined dividing lines is grounded on the back side to form a predetermined thickness, and then divided into individual pieces by a dicing device and a laser processing device. The devices can be used in electrical equipment such as mobile phones and personal computers.
相對於以往的磨削裝置,已提出有下述的技術方案:藉由至少具備保持板狀的晶圓的工作夾台、將磨削被保持在該工作夾台上之晶圓的背面的磨削磨石配置成環狀的磨削輪以可旋轉的方式設置的磨削組件、及藉由分光干涉波形以非接觸方式來檢測晶圓的高度、厚度的檢測組件,以將晶圓磨削成所期望之厚度或高度(參照例如專利文獻1)。 Compared with the conventional grinding device, the following technical solution has been proposed: by having at least a work chuck table holding a plate-shaped wafer, grinding the back of the wafer held on the work chuck table The grinding stone is arranged in a ring-shaped grinding wheel that is rotatably arranged in a grinding assembly, and a detection assembly that detects the height and thickness of the wafer in a non-contact manner by using a spectral interference waveform to grind the wafer To a desired thickness or height (see, for example, Patent Document 1).
專利文獻1:日本專利特開2011-143488號公報 Patent Document 1: Japanese Patent Laid-Open No. 2011-143488
發明概要 Summary of the invention
然而,在上述專利文獻1所記載之技術中,是形成為讓檢測被保持在保持組件上之晶圓的厚度、或高度的端子在水平方向上擺動來檢測晶圓整體之構成,在必須進行要一面適當地重複水平方向的擺動、與晶圓之移動的測量的情形下,為了使用這樣的組件來檢測晶圓整體的厚度、或高度,需要花相當的時間,而有生產性較差的問題。
However, in the technique described in
本發明是有鑒於上述事實而作成的發明,其主要的技術課題在於提供一種測量裝置,其可在短時間內有效率地測量板狀物的厚度或高度。 The present invention is made in view of the above facts, and its main technical subject is to provide a measuring device that can efficiently measure the thickness or height of a plate in a short time.
為了解決上述主要的技術課題,根據本發明可提供一種測量裝置,其為測量板狀物的厚度或高度的測量裝置,且至少是由下述所構成:寬頻光源,發出對板狀物具有穿透性之波長區的光;分光器,將該寬頻光源所發出之光在波長區進行分光;分配組件,將藉由該分光器所分光之各波長的光以經過時間來變更分配方向;聚光透鏡,將藉由該分配組件所分配之各波長的光聚光;光傳輸組件,與該聚光透鏡相向,且將複數條光纖的 一端的端面成列配設,以傳輸藉由該聚光透鏡所聚光之各波長的光;測定端子,將構成該光傳輸組件之複數條光纖的另一端之端面分歧成2條路徑,並具備有鏡子與複數個接物透鏡,該鏡子是配設在複數個第1端面並生成於該光纖逆行的第1返回光,該等接物透鏡是相向於該板狀物而成列且對應於複數個第2端面而配設;光分歧組件,配設於光傳輸組件之光的傳輸路徑上,並將在該板狀物之上表面反射之光與穿透板狀物而在下表面反射之光於各光纖逆行的第2返回光、及該第1返回光,從各光纖進行分歧;分光干涉波形生成組件,將在該光分歧組件所分歧之對應於各光纖的該第1返回光與該第2返回光之波長從藉由該分配組件對各光纖分配之時間起,檢測各波長之光的強度,並對應於各光纖生成分光干涉波形;及計算組件,對該分光干涉波形生成組件所生成之對應於各光纖的分光干涉波形進行波形解析,以計算對應於各光纖之板狀物的表面高度或厚度。 In order to solve the above-mentioned main technical problems, according to the present invention, a measuring device can be provided, which is a measuring device for measuring the thickness or height of a plate, and is at least composed of the following: a broadband light source, which emits light that penetrates the plate. Transparency of light in the wavelength region; a beam splitter, which splits the light emitted by the broadband light source in the wavelength region; a distribution component, which changes the distribution direction of the light of each wavelength divided by the beam splitter with the elapse of time; The optical lens condenses the light of each wavelength distributed by the distributing component; the optical transmission component faces the condensing lens and divides the light of a plurality of optical fibers The end faces of one end are arranged in rows to transmit the light of each wavelength condensed by the condenser lens; the measuring terminal divides the end faces of the other end of the plurality of optical fibers constituting the optical transmission assembly into 2 paths, and Equipped with a mirror and a plurality of objective lenses, the mirrors are arranged on a plurality of first end faces and generate the first return light retrograde of the optical fiber, and the objective lenses are arranged in rows facing the plate and corresponding It is arranged on a plurality of second end surfaces; the light branching component is arranged on the light transmission path of the light transmission component, and reflects the light reflected on the upper surface of the plate and penetrating the plate to reflect on the lower surface The second return light and the first return light that are retrograde to each optical fiber are branched from each optical fiber; the light splitting interference waveform generation component will be branched by the optical branching component to correspond to the first return light of each optical fiber With the wavelength of the second return light from the time when the distribution component is distributed to each optical fiber, the intensity of the light of each wavelength is detected, and the spectral interference waveform is generated corresponding to each optical fiber; and the calculation component generates the spectral interference waveform The spectral interference waveform generated by the component corresponding to each optical fiber is analyzed for waveform to calculate the surface height or thickness of the plate corresponding to each optical fiber.
又,較理想的是形成為:具備有保持該板狀物之保持組件,且將該測定端子與該保持組件構成為可在X軸方向上相對地移動,構成該測定端子之對應於各光纖的端面而配設之接物透鏡之列,是定位在與X軸方向正交之Y軸方向上,並且具備儲存組件,該儲存組件是在以該測定端子和該保持組件之相對的X軸方向之移動、與定位 於Y軸方向之接物透鏡所特定之X座標、Y座標中,儲存以該厚度計算組件所計算出之板狀物的厚度。 Moreover, it is preferable to form a holding member for holding the plate, and the measurement terminal and the holding member are configured to be relatively movable in the X-axis direction, and each optical fiber corresponding to the measurement terminal is formed. The column of the objective lens arranged on the end surface of the lens is positioned in the Y-axis direction orthogonal to the X-axis direction, and is equipped with a storage component that is positioned on the opposite X-axis between the measuring terminal and the holding component Direction of movement and positioning Store the thickness of the plate calculated by the thickness calculation component in the X coordinate and Y coordinate specified by the objective lens in the Y axis direction.
本發明之測量裝置至少是由寬頻光源、分光器、分配組件、聚光透鏡、光傳輸組件、測定端子、光分歧組件、分光干涉波形生成組件、及計算組件所構成,其中該寬頻光源會發出對板狀物具有穿透性之波長區的光,該分光器是將該寬頻光源所發出之光在波長區進行分光,該分配組件是將藉由該分光器所分光之各波長之光以經過時間來變更分配方向,該聚光透鏡是將藉由該分配組件所分配之各波長的光聚光,該光傳輸組件是與該聚光透鏡相向,且將複數條光纖的一端之端面成列配設,以傳輸藉由該聚光透鏡聚光之各波長的光,該測定端子將構成該光傳輸組件之複數條光纖的另一端之端面分歧成2條路徑,並具備有鏡子與複數個接物透鏡,該鏡子是配設在複數個第1端面並生成於該光纖逆行的第1返回光,該等接物透鏡是相向於該板狀物而成列且對應於複數個第2端面而配設,該光分歧組件是配設於光傳輸組件之光的傳輸路徑上,並將在該板狀物之上表面反射之光與穿透板狀物而在下表面反射之光於各光纖逆行的第2返回光、及該第1返回光,從各光纖進行分歧,該分光干涉波形生成組件是將在該光分歧組件所分歧之對應於各光纖的該第1返回光與該第2返回光之波長從藉由該分配組件對各光纖分配之時間起,檢測各波長之光強度,並對應於各光纖生成分光干涉波形, 該計算組件是對該分光干涉波形生成組件所生成之對應於各光纖的分光干涉波形進行波形解析,以計算對應於各光纖之板狀物的表面高度或厚度,因此可藉由成複數列而配設之複數個接物透鏡與複數條光纖而同時得到複數個厚度資訊、或高度資訊,且變得可在短時間內進行必要的測量。 The measuring device of the present invention is at least composed of a broadband light source, a beam splitter, a distribution component, a condenser lens, an optical transmission component, a measuring terminal, an optical branch component, a spectral interference waveform generation component, and a calculation component, wherein the broadband light source emits For the light of the transparent wavelength region of the plate, the beam splitter is to split the light emitted by the broadband light source in the wavelength region, and the distributing component is to divide the light of each wavelength divided by the beam splitter into The distribution direction is changed over time. The condensing lens condenses the light of each wavelength distributed by the distribution component. The optical transmission component faces the condensing lens and forms the end faces of one end of the plurality of optical fibers. It is arranged in rows to transmit light of each wavelength condensed by the condenser lens. The measuring terminal divides the end faces of the other ends of the plurality of optical fibers constituting the optical transmission component into 2 paths, and is equipped with mirrors and plural Objective lenses, the mirrors are arranged on a plurality of first end faces and generate the first return light of the optical fiber retrograde, the objective lenses are arranged facing the plate and correspond to the plurality of second The light branching component is arranged on the light transmission path of the light transmission component, and the light reflected on the upper surface of the plate and the light reflected on the lower surface of the plate are distributed to each The second return light of the retrograde optical fiber and the first return light are branched from each optical fiber, and the light splitting interference waveform generating module is to combine the first return light corresponding to each optical fiber and the first return light branched by the optical branching module. 2 The wavelength of the return light starts from the time when the optical fiber is distributed by the distribution component, the light intensity of each wavelength is detected, and the spectral interference waveform is generated corresponding to each optical fiber. The calculation component is to perform waveform analysis on the spectral interference waveform corresponding to each optical fiber generated by the spectral interference waveform generation component to calculate the surface height or thickness of the plate corresponding to each optical fiber. A plurality of objective lenses and a plurality of optical fibers are provided to obtain a plurality of thickness information or height information at the same time, and it becomes possible to perform necessary measurements in a short time.
1:磨削裝置 1: Grinding device
2:裝置殼體 2: Device housing
10:晶圓 10: Wafer
10b:背面 10b: back
12:保護膠帶 12: Protective tape
20:控制組件 20: Control components
21:主部 21: Main part
22:直立壁 22: upright wall
3:磨削單元 3: Grinding unit
31:移動基台 31: Mobile abutment
4:主軸單元 4: Spindle unit
41:主軸殼體 41: Spindle housing
42:旋轉主軸 42: Rotating spindle
43:伺服馬達 43: Servo motor
44:輪座 44: wheel seat
5:磨削輪 5: Grinding wheel
51:磨削磨石 51: Grinding grindstone
6:磨削單元進給機構 6: Grinding unit feed mechanism
61:公螺桿 61: Male screw
62:脈衝馬達 62: Pulse motor
7:工作夾台機構 7: Work clamping table mechanism
71:工作夾台 71: work clamp
72:蓋構件 72: cover member
73、74:伸縮罩組件 73, 74: telescopic cover assembly
70a:被加工物載置區 70a: Placement area for processed objects
70b:磨削區 70b: Grinding area
8:測量裝置 8: Measuring device
8a、8b、8c:光 8a, 8b, 8c: light
8d:第1路徑 8d: 1st path
8e:第2路徑 8e: second path
8f:第3路徑 8f: 3rd path
80:測量殼體 80: measuring case
81:發光源 81: luminous source
82:分光器 82: Splitter
83:多面鏡 83: Polygonal mirror
83a、83b:反射面 83a, 83b: reflective surface
84:聚光透鏡 84: Condenser lens
85:保持構件 85: holding member
86:光分歧組件 86: Optical branch component
87:測定端子 87: Measuring terminal
87a:分歧部 87a: Division
87b:聚光部 87b: Condenser
88:物鏡 88: Objective
89:鏡子 89: Mirror
90:線型影像感測器 90: Linear image sensor
F(1)~F(8):分光干涉波形 F(1)~F(8): Spectral interference waveform
t、t1、t2、t3、t4:時間 t, t1, t2, t3, t4: time
L1、L2、L3:光路長度 L1, L2, L3: optical path length
d:光路長度差 d: difference in optical path length
d1:第1光路長度差 d1: The first optical path length difference
d2:第2光路長度差 d2: The second optical path length difference
d3:第3光路長度差 d3: The third optical path length difference
T:厚度 T: thickness
h:高度 h: height
a、b、c:訊號 a, b, c: signal
λ:反射光波長 λ: wavelength of reflected light
X、Y、Z:方向 X, Y, Z: direction
圖1是根據本發明所構成之測量裝置可適用的磨削裝置的立體圖。 Fig. 1 is a perspective view of a grinding device to which the measuring device constructed according to the present invention can be applied.
圖2是用於說明根據本發明所構成之測量裝置之構成的說明圖。 Fig. 2 is an explanatory diagram for explaining the structure of a measuring device constructed according to the present invention.
圖3(a)~(c)是用於說明圖2所示之測量裝置的作用的說明圖。 3(a)~(c) are explanatory diagrams for explaining the function of the measuring device shown in FIG. 2.
圖4是用於說明構成圖3所示之測量裝置的多面鏡的作用的說明圖。 Fig. 4 is an explanatory diagram for explaining the function of the polygon mirror constituting the measuring device shown in Fig. 3.
圖5是顯示藉由圖2所示之測量裝置所生成的分光干涉波形之一例的圖。 Fig. 5 is a diagram showing an example of a spectral interference waveform generated by the measuring device shown in Fig. 2.
圖6是顯示藉由以圖2所示之測量裝置對分光干涉波形進行波形解析而得到的光路長度差和訊號強度之一例的圖。 FIG. 6 is a diagram showing an example of optical path length difference and signal intensity obtained by performing waveform analysis on the spectral interference waveform with the measuring device shown in FIG. 2.
圖7是顯示藉由本發明的測量裝置,而按每條光纖取得的晶圓之高度、及厚度之一例的圖。 FIG. 7 is a diagram showing an example of the height and thickness of a wafer obtained for each optical fiber by the measuring device of the present invention.
用以實施發明之形態 The form used to implement the invention
以下,將參照附加圖式,針對依照本發明所構成之測
量裝置的較佳的實施形態,詳細地進行說明。圖1中所示為,具備有本發明之測量裝置的磨削裝置1的整體立體圖、及藉由本發明之測量裝置來測量厚度或高度之作為板狀物的晶圓10。
Hereinafter, referring to the attached drawings, the test constructed in accordance with the present invention
The preferred embodiment of the measuring device will be described in detail. FIG. 1 shows an overall perspective view of a grinding
圖1所示之磨削裝置1具備有以標號2來表示整體的裝置殼體。此裝置殼體2具有大致長方體形狀之主部21、及設置於該主部21的後端部(在圖1中為右上端)且朝上方延伸的直立壁22。在直立壁22的前表面,以可朝上下方向移動的方式裝設有作為磨削組件的磨削單元3。
The grinding
磨削單元3具備有移動基台31、與裝設在該移動基台31的主軸單元4。移動基台31是構成為與配設在直立壁22之一對引導軌道可滑動地卡合。像這樣,在可滑動地裝設在設置於直立壁22之一對該引導軌道上的移動基台31的前表面上,可透過朝前方突出之支撐部而安裝作為磨削組件的主軸單元4。
The grinding
該主軸單元4具備有主軸殼體41、旋轉自如地配設在該主軸殼體41之旋轉主軸42、及用於驅動旋轉該旋轉主軸42之作為驅動源的伺服馬達43。可旋轉地支撐於該主軸殼體41之旋轉主軸42,是將一端部(圖1中為下端部)從主軸殼體41的下端突出而配設,且於下端部設置有輪座44。並且,將磨削輪5安裝在此輪座44的下表面。在此磨削輪5的下表面配設有由複數個磨輪片(segment)所構成的磨削磨石51。
The
圖示之磨削裝置1具備有使磨削單元3沿著
該一對引導軌道朝上下方向(相對於後述之工作夾台的保持面垂直方向)移動的磨削單元進給機構6。該磨削單元進給機構6具備配設於直立壁22的前側且實質上鉛直地延伸的公螺桿61、及用於旋轉驅動該公螺桿61之作為驅動源的脈衝馬達62,且由設置在該移動基台31之背面的圖未示的公螺桿61之軸承構件等所構成。當此脈衝馬達62正轉時,會使移動基台31(即研磨單元3)下降(亦即使其前進),且當脈衝馬達62逆轉時,會使移動基台31(即磨削單元3)上升(亦即使其後退)。
The grinding
於上述殼體2的主部21配設有保持作為被加工物之板狀物(晶圓10)之作為保持組件的工作夾台機構7。工作夾台機構7具備有工作夾台71、覆蓋該工作夾台71之周圍的蓋構件72、和配設在該蓋構件72之前後的伸縮罩組件73及74。工作夾台71是構成為在其上表面(保持面)上藉由作動圖未示之吸引組件而吸引保持晶圓10。此外,將工作夾台71藉由圖未示之旋轉驅動組件而可旋轉地構成,並且藉由圖未示之工作夾台移動組件而使其可在圖1所示之被加工物載置區70a、及與磨削輪5相向之磨削區70b之間(以箭頭X所示之X軸方向上)移動。
The
再者,上述之伺服馬達43、脈衝馬達62、圖未示之工作夾台移動組件等,是受後述之控制組件20所控制。又,圖示之實施形態中,晶圓10在外周部形成有表示結晶方位的凹口(notch),在其正面貼附有作為保護構件之保護膠帶12,且將此保護膠帶12側保持在工作夾台71的上
表面(保持面)。
Furthermore, the above-mentioned
圖示之磨削裝置1具備有測量被保持在工作夾台71之晶圓10的厚度、高度的測量裝置8。此測量裝置8是內置於測量殼體80內,且測量殼體80是如圖所示地在構成裝置殼體2之長方體形狀的主部21之上表面,配設在使工作夾台71從被加工物載置區域70a移動至磨削區70b之間的路徑途中的側邊,且以工作夾台71於被加工物載置區域70a與磨削區70b之間移動之時,可從上方測量被保持在工作夾台71上的晶圓10之整體的方式配置。參照圖2進一步說明該測量裝置8。
The grinding
圖示之實施形態中的測量裝置8具備有作為寬頻光源的發光源81、及分光器82,該作為寬頻光源的發光源81會發出對作為被加工物之晶圓10具有穿透性之包含預定的波長範圍(例如波長1000nm~1100nm)之光,該分光器82會將來自該發光源81的光8a反射並且於預定之波長範圍進行分光。該發光源81可以選擇LED、SLD(超發光二極體(Superluminescent diode))、ASE(放大自發放射(Amplified Spontaneous Emission))、SC(超連續光譜(Supercontinuum))、鹵素光源等。該分光器82是藉由繞射光柵所構成,且藉由該繞射光柵的作用,將由1000nm~1100nm波長所構成之光8a分光,而形成具有預定之展寬的光8b。該光8b可被分光成藉由於圖中下方側較短之波長(1000nm)、於上方側較長之波長(1100nm)的光所構成。
The measuring device 8 in the embodiment shown in the figure is provided with a light-emitting
由分光器82所分光並反射的光8b,是藉由具有將各波長之光以經過時間來變更其分配方向之功能的分配組件來進行反射。該分配組件是由各邊為藉由反射面(鏡子(mirror))所形成之由例如正8面體形成之多面鏡83所構成,並且該多面鏡83是構成為於圖中朝順時針方向以預定之旋轉速度旋轉。入射到多面鏡83之反射面的光8b,是以預定之展寬被反射並成為光8c而入射到與多面鏡83之反射面相向而配置的聚光透鏡84。藉由聚光透鏡84而聚光各波長之光的光8c,會入射到以預定間隔依序排列且將端部以保持構件85保持之構成光傳輸組件之例如18條光纖(1)~(18)。再者,可以藉由縮小相對於晶圓之直徑的光纖之直徑,並增加光纖的之條數(例如100條),以提高後述之測量的解析力。在本實施形態中,當多面鏡83位於如圖2所示之預定的角度位置時,會將在多面鏡83的其中一個反射面上反射之光,全部入射於聚光透鏡84。可將分光器82、多面鏡83、聚光透鏡84、及保持構件85的設置位置、角度等設定成按已分光之每個波長來對保持於該保持構件85之光纖(1)~(18)入射。再者,關於多面鏡83的作用,將隨後詳細敘述。
The light 8b that is split and reflected by the
該測量裝置8具備有光分歧組件86,該光分歧組件86是用於將入射到光纖(1)~(18)之光通過由光纖(1)~(18)所形成之光的第1路徑8d而引導至面向被保持在工作夾台71之晶圓10的第2路徑8e側,並且將在晶圓10反射而於該第2路徑8e逆行之反射光分歧並引導至第3路徑
8f。再者,該第1~第3路徑8d~8f是由光纖(1)~(18)所構成,且光分歧組件86可由例如偏振保持光纖耦合器、偏振保持光纖循環器、單模光纖耦合器等的任一個之中適當選擇。
The measuring device 8 is provided with an optical branching
透過光分歧組件86而引導至第2路徑8e之光,會被引導至測定端子87,該測定端子87是面對被保持於工作夾台71上之晶圓10。該測定端子87是形成為在Y軸方向上較細長的形狀,且是以覆蓋作為測量對象之晶圓10之直徑的尺寸所形成。又,該測定端子87是以分歧部87a、及聚光部87b所構成,該分歧部87a是將構成該光傳輸組件之複數條光纖(1)~(18)的另一端的端部分歧成2條路徑。於該聚光部87b上設有複數個鏡子89和複數個接物透鏡88,該等鏡子89會生成按在該分歧部87a所分歧之其中一條路徑的每個端部於該光纖(1)~(18)逆行的第1返回光,該等接物透鏡88會將被引導至按在該分歧部87a所分歧之另一條路徑之每個端部的光,引導到被保持在工作夾台71的晶圓10,且將該接物透鏡88及鏡子89配設成在與工作夾台71移動之方向(X軸方向)正交的方向(Y軸方向)上成列。再者,在圖2中,雖然為了方便說明而將從該分歧部87a至鏡子89的距離記載得較短,但實際上是將從該分歧部87a至工作夾台71之上表面的距離作為基準來設定鏡子89的位置。
The light guided to the
該第3路徑8f是將於第2路徑8e逆行而去之光,藉由在光分歧組件86中分歧而傳輸之光纖(1)~(18)所
形成,且在其端部配設有作為檢測光之強度的組件之線型影像感測器(line image sensor)90。線型影像感測器90是以可在構成第3路徑8f之光纖(1)~(18)的對應於各端部之位置上檢測從各光纖(1)~(18)所照射出的光之光強度的方式構成,且將所測量到的光強度傳送至構成該測量裝置8的控制裝置20,並與所檢測到的時間(t)一起儲存於該控制裝置20的儲存部。
The
該控制組件20是由電腦構成,並且具備有依照控制程式進行運算處理的中央運算處理裝置(CPU)、保存控制程式等的唯讀記憶體(ROM)、用於暫時保存檢測出的檢測值、運算結果等的可讀寫之隨機存取記憶體(RAM)、輸入介面、及輸出介面(省略了關於細節之圖示)。本實施形態中的控制組件20是控制磨削裝置1之各驅動部分並且構成該測量裝置8的組件,且如上述,可構成為具有下述功能:藉由儲存線型影像感測器90之檢測值,並驅動多面鏡83、發光組件81,來計算晶圓10之厚度、高度。本實施形態的磨削裝置1、測量裝置8是大致如以上地構成,以下說明其作用。
The
以本發明的測量裝置8進行之晶圓10的厚度、高度的測量,是藉由例如以磨削裝置1磨削已載置在工作夾台71的晶圓10之後,使其從磨削區70b移動至被加工物載置區70a,而使其通過測定端子87的正下方來進行。此時,控制組件20是從線型影像感測器90之表示光強度的檢測訊號中求出如圖5所示之分光干涉波形、且依據
該分光干涉波形來實行波形解析,而可從在測定端子87所具備之鏡子89反射而逆行的第1返回光所前進的光路長度、與在被載置於工作夾台71上之晶圓10的上表面及下表面反射而逆行的第2返回光所前進的光路長度之差中,計算出晶圓10之上表面的高度、下表面的高度、及晶圓10的厚度(T)。關於具體的計算方法,容後敘述。
The measurement of the thickness and height of the
參照著圖2~4來說明本實施形態中的計算晶圓10的厚度、及高度的順序。多面鏡83是如上述、將成正8角形之各邊以反射面(鏡子)來構成,且藉由圖未示的脈衝馬達等的驅動組件,將其旋轉位置與時間(t)建立關連並儲存到控制組件20之隨機存取記憶體(RAM)中,並且在圖中朝順時針方向進行旋轉驅動。
The procedure for calculating the thickness and height of the
從發光源81照射光,且將多面鏡83朝圖中箭頭的方向旋轉時,會使藉由分光器82所分光而具有展寬之光8b的一部分在多面鏡83的反射面83a上反射而形成反射光8c,並且開始入射到聚光透鏡84。並且,當多面鏡83之反射面83a成為圖3(a)所示之狀態時,是使構成在聚光透鏡84聚光之光8c的一部分之1000nm波長的範圍入射到將一端部保持在保持構件85上的光纖(1)(時間t1)。入射到光纖(1)之1000nm波長之光,會於構成於上述之光傳輸組件的第1、第2路徑8d、8e行進,而到達測定端子87。到達該測定端子87的1000nm波長的光,是在分歧部87a分歧,且其中一側的光在鏡子89反射而成為第1返回光,並於第2路徑8e逆行而在所到達的光分歧組件86上分歧至構成第3路徑
8f之光纖(1)。然後,該已分歧之光會到達已分配到線型影像感測器90中的光纖(1)的位置。又,同時在分歧部87a中分歧至接物透鏡88側之另一側的光,是使其於該測定端子87的正下方朝X方向方向移動的晶圓10之上表面及下表面反射,而形成於第2路徑8e逆行的第2返回光,並到達在光分歧組件86分歧且在線型影像感測器90中的分配於光纖(1)的位置。其結果為,可檢測對光纖(1)有光入射的時間t1中的以第1、第2返回光所構成的反射光的光強度。此光強度是與時間t1、及被照射之晶圓10的X軸方向的X座標、Y軸方向的Y座標的位置建立關連並儲存於控制組件20之隨機存取記憶體(RAM)的任意的儲存區域中。
When light is irradiated from the light-emitting
再者,圖4所顯示的是,於橫軸表示時間(t)、於縱軸表示光纖(1)~(18)之端部的配設位置,且是否隨著時間(t)的經過,而使在多面鏡83反射之1000nm~1100nm波長之光之任意的波長範圍入射到任意之光纖(1)~(18)的圖,並可理理到例如下述情形:在時間t1,1000nm波長的光開始入射到光纖(1)。藉由將在此圖4所示之時間(t)、及表示是否使任意的波長範圍入射到任意之光纖(1)~(18)之關係儲存於控制組件20,可以使以線型影像感測器90檢測之光強度,對是否為任意的波長範圍入射到任意之光纖(1)~(18)時所檢測出之光強度建立關連。
Furthermore, Figure 4 shows that the horizontal axis represents time (t), and the vertical axis represents the arrangement positions of the ends of the optical fibers (1) to (18), and whether the time (t) elapses, And make the arbitrary wavelength range of 1000nm~1100nm wavelength reflected by the
回到圖3繼續說明,藉由於時間t1藉由分光器82所分光之光在入射到光纖(1)之後,使多面鏡83繼續旋轉,以使多面鏡83的反射面83a相對於光8b的方向變
化,而使被分光之光8b的1000nm~1100nm波長之範圍朝圖中下方移動,並且依序朝保持光纖(1)~(18)的保持組件85進行照射。然後,於時間t2中,如圖3(b)所示,成為將藉由分光器82所分光之光的範圍相對於光纖(1)~(18)全部入射的狀態(也一併參照圖4)。在此狀態中,會使1100nm波長之光入射到光纖(1),且將1000nm波長之光入射到光纖(18)。也就是說,成為相對於光纖(1),從時間t1至t2可將藉由分光器82所分光之1000nm~1100nm波長範圍的全部入射的情形。
Returning to Figure 3 to continue the description, after the light split by the
從圖3(b)所示之狀態中可知,當進一步旋轉多面鏡83而到達時間t3時,會成為如圖3(c)所示,藉由分光器82所分光之光的波長範圍之中,1100nm波長之範圍入射至光纖(18)之狀態,且在時間t1~t3中,可將藉由分光器82所分光之1000nm~1100nm波長之光照射至光纖(1)~(18)的全部。再者,如從圖3、4可理解到的是,當時間進一步經過而成為t4時,可相對於相鄰於多面鏡83的反射面83a之反射面83b照射被分光之光8b而將1000nm波長之光的範圍再次開始照射於光纖(1),成為與圖3(a)相同之狀態,且之後重複同樣的作動。
From the state shown in Fig. 3(b), it can be seen that when the
如上述,在控制組件20中儲存有對時間(t)建立關連而將藉由線型影像感測器90所檢測之光強度、與如圖4所示之對於該時間(t)中的各光纖(1)~(18)藉由多面鏡83所分配的波長,且可以藉由參照兩者,而按各光纖(1)~(18)生成如圖5所示的分光干涉波形。圖5所顯示的
是,例如關於光纖(1)所檢測之分光干涉波形(F(1)),且橫軸是表示入射到光纖的反射光波長(λ),縱軸是表示藉由線型感測器90所檢測的光強度。
As mentioned above, the
以下,根據控制組件20以上述之分光干涉波形為依據而實行的波形解析,來說明關於計算晶圓10的厚度及高度的例子。
Hereinafter, an example of calculating the thickness and height of the
將從第2路徑8e中的測定端子87的分歧部87a至鏡子89的光路長度設為(L1),將從該測定端子87的分歧部87a至被保持在工作夾台71的晶圓10的上表面的光路長度設為(L2),將從該測定端子87的分歧部87a至被保持在工作夾台71的晶圓10的下表面的光路長度設為(L3),並且將光路長度(L1)與光路長度(L2)之差值設為第1光路長度差(d1=L1-L2)、將光路長度(L1)與光路長度(L3)之差值設為第2光路長度差(d2=L1-L3)、將光路長度(L3)與光路長度(L2)之差值設為第3光路長度差(d3=L3-L2)。再者,如上述,該光路長度(L1)本身為不會變化的光路長度,並且設想從測定端子87的分歧部87a至工作夾台71的上表面的距離來設定。
The optical path length from the
接著,控制組件20會依據如上述之圖5所示之對每條光纖(1)~(18)所生成之分光干涉波形來實行波形解析。此波形解析雖然可以依據例如傅立葉(Fourier)轉換理論及小波(Wavelet)轉換理論來實行,但在以下所述之實施形態中是針對使用如下述數學式1、數學式2、數學式3所示之傅立葉轉換公式的例子來說明。
Next, the
上述數學式中,λ為波長,d為上述第1光路長度差(d1=L1-L2)、第2光路長度差(d2=L1-L3)、及第3光路長度差(d3=L3-L2),W(λ n)為窗函數。上述數學式1是在cos的理論波形與上述分光干涉波形(I(λ n))的比較中,求出波的周期最相近(相關性高)之光路長度差(d)、亦即求出分光干涉波形與理論上之波形函數的相關係數較高之光路長度差(d)。又,上述數學式2是在sin的理論波形與上述分光干涉波形(I(λ n))的比較中,求出波的周期最相近(相關性高)之第1光路長度差(d1=L1-L2)、第2光路長度差(d2=L1-L3)、及第3光路長度差(d3=L3-L2)、亦即求出分光干涉波形與理論上的波形函數的相關係數為第1光路長度差(d1=L1-L2)、第2光路長度差(d2=L1-L3)、及第3光路長度差(d3=L3-L2)。並且,上述數學式3是求出數學式1的結果與數學式2的結果之平均值。
In the above formula, λ is the wavelength, and d is the first optical path length difference (d1=L1-L2), the second optical path length difference (d2=L1-L3), and the third optical path length difference (d3=L3-L2) ), W(λ n) is the window function. The
控制組件20是藉由實行依據上述數學式1、數學式2、數學式3之運算,而能夠依據起因於包含在反射光之返回光的各光路長度差之分光的干涉,得到圖6所示之訊號強度的波形。在圖6中,橫軸是表示光路長度差(d),縱軸是表示訊號強度。如圖6所示之例子中,會在光路長度差(d)為450μm的位置、300μm的位置、150μm的位置上使訊號強度顯示得較高。亦即,光路長度差(d)為450μm的位置之訊號強度(a)是第1光路長度差(d1=L1-L2)的位置,且所顯示的是晶圓11的上表面的高度(h)。又,光路長度差(d)為300μm的位置之訊號強度(b)是第2光路長度差(d2=L1-L3)的位置,並所顯示的是晶圓11的下表面的高度(h)。此外,光路長度差(d)為150μm的位置之訊號強度(c)是第3光路長度差(d3=L3-L2)的位置,且所顯示的是晶圓10的厚度(T)。並且,將在該測定端子87與該工作夾台71之相對的X軸方向之位置、及定位於Y軸方向之接物透鏡88的位置所特定之測量位置的座標(X座標、Y座標)中的晶圓10的高度(h)、厚度(T)予以儲存。一邊使晶圓10在X軸方向上移動一邊對整體實行像這樣的測量。
The
如以上所述,由於根據圖示之實施形態中的測量裝置8,能夠求出晶圓10之厚度及高度,且是依據起因於進行反射之反射光的光路長度差所得到之分光干涉波形來檢測晶圓10在加工時的晶圓10之上表面、下表面的高度(h)、厚度(T),所以可以在不受貼附於晶圓10之正面的保護膠帶12的厚度的變化影響的情形下,正確地測量晶圓
11的厚度(T)、高度。
As described above, the thickness and height of the
測量裝置8是如以上地構成,以下,說明關於使用具備有該測量裝置8之磨削裝置1將晶圓10磨削成預定之厚度的順序。
The measuring device 8 is configured as described above. Hereinafter, the procedure for grinding the
在正面貼附有保護膠帶12的晶圓10,是藉由將保護膠帶12側載置在已定位於圖1所示之磨削裝置1中的被加工物載置區70a的工作夾台71上,且作動圖未示之吸引組件,而被吸引保持在工作夾台71上。因此,吸引保持於工作夾台71上的晶圓11會成為背面10b在上側。
The
接著,控制組件20會作動已保持有晶圓10的工作夾台71之圖未示的移動組件,並移動工作夾台71以定位至磨削區70b、且將磨削輪5的複數個磨削磨石51的外周緣定位成通過工作夾台71之旋轉中心。
Next, the
像這樣將磨削輪5與保持在工作夾台71之晶圓10設定成預定的位置關係,且控制組件20會驅動圖未示之旋轉驅動組件而以例如300rpm的旋轉速度來旋轉工作夾台71,並且驅動上述之伺服馬達43而以例如6000rpm的旋轉速度來旋轉磨削輪5。然後,對晶圓10供給磨削水,並且正轉驅動磨削單元進給機構6之脈衝馬達62以使磨削輪5下降(磨削進給),並以預定之壓力將複數個磨削磨石51推壓於晶圓10之上表面(背面10b)的被磨削面。其結果,可磨削晶圓10之被磨削面(磨削步驟)。
In this way, the
結束磨削步驟之後,藉由使已保持有已磨削之晶圓10的工作夾台71朝位於X軸方向之前方的被加工物
載置區70a側移動,以將晶圓10定位在測量裝置8之測定端子87的正下方,並且如上述地使測量裝置8作動以得到對應於晶圓10整體之各部位的分光干涉波形並且進行波形解析,來測量晶圓10的厚度、及高度。圖7所示之表所表示的是,在測定端子87通過晶圓10之中心並在沿著Y軸方向的預定之位置上,測量晶圓10的厚度(T)、及上表面之高度(h)的例子。藉由按晶圓10的X軸方向中的每個預定間隔實行這樣的測量,並儲存晶圓10之正面的高度、厚度,且確認磨削後之晶圓10整體的厚度、及高度,可以判定磨削步驟之良窳,並且因應需要而實施再磨削。
After the grinding step is completed, the
再者,在本實施形態中,雖然採用了多面鏡83作為藉由分光器所分光之各波長的光以經過時間來變更分配方向之分配組件,但是本發明並不限定於此,且可以採用可做到將反射面之方向與經過時間一起控制之例如振鏡掃描器(galvano scanner)。此外,在本實施形態中,雖然作為用於檢測反射光之光強度的受光元件而使用了線型影像感測器90,但並不限定於此,亦可為對應於每條光纖(1)~(18)而配設的光檢測器(photodetector)。
Furthermore, in the present embodiment, although the
又,在上述之實施形態中,雖然以對已結束磨削步驟之晶圓的整體進行由該測量裝置8進行之測量的方式作了說明,但並非限定於此,例如,可以將該測量裝置8之測量殼體80的設置位置設定在圖1所示之磨削區70b的附近,並且將該測量殼體80的設置位置可移動地設置。藉由像這樣地構成,亦可做到在使保持在磨削裝置之工作
夾台上的晶圓接受磨削輪之作用而被磨削之時,與露出之晶圓相向來使測定端子87淹沒在磨削時所供給之磨削水中並定位,以測量磨削中之晶圓的厚度,且可做到藉由將磨削中之晶圓10的厚度反饋至控制組件20來磨削成所期望的厚度。又,依據本發明所構成的測量裝置8,不需要如本實施形態地配設在磨削裝置1中,亦可作為與磨削裝置1獨立之單一的裝置而構成,或是合併設置到與磨削裝置不同的其他加工裝置上。
In addition, in the above-mentioned embodiment, although the measurement performed by the measuring device 8 is performed on the entire wafer after the grinding step has been completed, it is not limited to this. For example, the measuring device may be used. The setting position of the measuring
10:晶圓 10: Wafer
12:保護膠帶 12: Protective tape
20:控制組件 20: Control components
71:工作夾台 71: work clamp
8:測量裝置 8: Measuring device
8a、8b、8c:光 8a, 8b, 8c: light
8d:第1路徑 8d: 1st path
8e:第2路徑 8e: second path
8f:第3路徑 8f: 3rd path
80:測量殼體 80: measuring case
81:發光源 81: luminous source
82:分光器 82: Splitter
83:多面鏡(分配組件) 83: Polygonal mirror (distribution component)
84:聚光透鏡 84: Condenser lens
85:保持構件 85: holding member
86:光分歧組件 86: Optical branch component
87:測定端子 87: Measuring terminal
87a:分歧部 87a: Division
87b:聚光部 87b: Condenser
88:接物透鏡 88: contact lens
89:鏡子 89: Mirror
90:線型影像感測器 90: Linear image sensor
F(1)~F(18):分光干涉波形 F(1)~F(18): Spectral interference waveform
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