TWI727791B

TWI727791B - Dynamic correcting system of manufacturing process using wire and dynamic correcting method using the same

Info

Publication number: TWI727791B
Application number: TW109115578A
Authority: TW
Inventors: 黎尚昆; 施志軒
Original assignee: 財團法人工業技術研究院
Priority date: 2019-12-20
Filing date: 2020-05-11
Publication date: 2021-05-11
Also published as: TW202125135A

Abstract

A dynamic correction system of a manufacturing process using wire includes a driving device, a path sensor and a controller. The driving device is configured to drive a carrier with a motion parameter and make wire cover the carrier. The path sensor is configured to obtain actual path information of the wire covering the carrier. The controller is configured to obtain an actual path of the wire covering the carrier according to the actual path information, obtain actual path difference between a target path and the actual path, determine whether the actual path difference is greater than a predetermined error, control the driving device to change motion parameter so that the actual path of the wire covering the carrier approaches the target path.

Description

使用線材的製程之動態修正系統及應用其之動態修正方法 The dynamic correction system of the manufacturing process using wire and the dynamics of its application Correction method

本揭露是有關於一種修正系統及應用其之修正方法，且特別是有關於一種使用線材的製程之動態修正系統及應用其之動態修正方法。 This disclosure relates to a correction system and a correction method using it, and more particularly to a dynamic correction system using a wire rod and a dynamic correction method using it.

現有線材包覆製程係使用一機台將線材包覆在(或包覆)載體，此類製程例如是包含纏繞(winding)或編織(braiding)。線材包覆在載體的品質優劣受到許多因素影響，如機台的運轉參數、載體外形等，因此並非每個產品的線材包覆(或包覆)品質都合格。一般來說，線材包覆瑕疵例如是線材滑移、***或扭絞等瑕疵。當發現此些線材包覆瑕疵時，現有做法大多是直接判為不良品或報廢。因此，如何提出一種能改善前述線材包覆瑕疵的技術是本技術領域業者努力的目標之一。 The existing wire coating process uses a machine to wrap (or coat) the wire on the carrier. Such a process includes winding or braiding, for example. The quality of the wire coated on the carrier is affected by many factors, such as the operating parameters of the machine, the shape of the carrier, etc. Therefore, not every product has a qualified wire coating (or coating) quality. Generally speaking, wire coating defects are defects such as wire slippage, splitting, or twisting. When such wire coating defects are found, most of the existing methods are directly judged as defective or scrapped. Therefore, how to propose a technology that can improve the aforementioned wire coating defects is one of the goals of the industry in this technical field.

本揭露係有關於一種使用線材的製程之動態修正系統及應用其之動態修正方法，可改善前述習知問題。 The present disclosure relates to a dynamic correction system and a dynamic correction method for a manufacturing process using wires, which can improve the aforementioned conventional problems.

本揭露一實施例提出一種使用線材的製程之動態修正系統。動態修正系統包括一驅動裝置、一路徑感測器及一控制器。驅動裝置用以：以一運轉參數驅動一載體運動及將一線材包覆於載體上。路徑感測器用以取得線材包覆於載體上的一實測路徑資訊。控制器用以：依據實測路徑資訊取得線材包覆於載體上的一實測路徑；取得一目標路徑與實測路徑的一實測路徑差異；判斷實測路徑差異是否大於一即時誤差；以及，當實測路徑差異大於即時誤差時，控制驅動裝置改變運轉參數，使線材包覆於載體上的實測路徑接近目標路徑。 An embodiment of the present disclosure proposes a dynamic correction system for a manufacturing process using wires. The dynamic correction system includes a driving device, a path sensor and a controller. The driving device is used for driving a carrier to move with an operating parameter and wrapping a wire on the carrier. The path sensor is used to obtain the measured path information of the wire covered on the carrier. The controller is used to: obtain a measured path covered by the wire on the carrier according to the measured path information; obtain a measured path difference between a target path and the measured path; determine whether the measured path difference is greater than a real-time error; and, when the measured path difference is greater than When there is an instant error, the driving device is controlled to change the operating parameters so that the measured path of the wire covered on the carrier is close to the target path.

本揭露另一實施例提出一種使用線材的製程之動態修正方法。動態修正方法包括以下步驟。一驅動裝置以一運轉參數驅動一載體運動；驅動裝置將一線材包覆於載體上；一路徑感測器取得線材包覆於載體上的一實測路徑資訊；一控制器依據實測路徑資訊，取得線材包覆於載體上的一實測路徑；控制器取得一目標路徑與實測路徑的一實測路徑差異；控制器判斷實測路徑差異是否大於一即時誤差；以及，當實測路徑差異大於即時誤差時，控制器改變運轉參數，使線材包覆於載體上的實測路徑接近目標路徑。 Another embodiment of the present disclosure proposes a dynamic correction method for a manufacturing process using wires. The dynamic correction method includes the following steps. A driving device drives a carrier to move with an operating parameter; the driving device wraps a wire on the carrier; a path sensor obtains the measured path information of the wire coated on the carrier; a controller obtains the measured path information according to the measured path information The wire is wrapped on a measured path on the carrier; the controller obtains a measured path difference between a target path and the measured path; the controller determines whether the measured path difference is greater than an instant error; and, when the measured path difference is greater than the instant error, control The device changes the operating parameters so that the measured path of the wire covered on the carrier is close to the target path.

為了對本揭露之上述及其他方面有更佳的瞭解，下文特舉實施例，並配合所附圖式詳細說明如下： In order to have a better understanding of the above and other aspects of the present disclosure, the following examples are specially cited, and the accompanying drawings are described in detail as follows:

10:載體 10: Carrier

11:第一端 11: first end

12:第二端 12: second end

13:載體部 13: Carrier Department

20:線材 20: Wire

20A:待檢測區域 20A: Area to be inspected

100、200:動態修正系統 100, 200: dynamic correction system

110、210:驅動裝置 110, 210: drive device

111:轉軸 111: shaft

112、212:機械手臂 112, 212: robotic arm

120:路徑感測器 120: Path sensor

130:控制器 130: Controller

211:編織環 211: Braided Ring

211s:內周面 211s: inner peripheral surface

213:線材提供器 213: Wire Provider

D1:實測路徑資訊 D1: Measured path information

E1:即時誤差 E1: Instant error

E2:預測誤差 E2: prediction error

M1:路徑影像 M1: Path image

M2:待檢測區域影像 M2: Image of the area to be detected

P1:實測路徑 P1: Measured path

P2:目標路徑 P2: target path

P3:預測路徑 P3: Predicted path

△P1:實測路徑差異 △P1: The measured path difference

△P2:預測路徑差異 △P2: Forecast path difference

R1、R2:參考軸 R1, R2: reference axis

S1:端部 S1: End

S110~S170、S260~S280:步驟 S110~S170, S260~S280: steps

δ:轉動角度 δ: rotation angle

θ:目標角度 θ: target angle

θ’:實測角度 θ’: Measured angle

K_p:比例增益 K _p : proportional gain

K_i:積分增益 K _i : integral gain

K_d:微分增益 K _d : differential gain

X、Y、Z:軸向 X, Y, Z: axial

第1A圖繪示依照本揭露一實施例之使用線材的製程之動態修正系統的功能方塊圖。 FIG. 1A is a functional block diagram of a dynamic correction system for a manufacturing process using wires according to an embodiment of the disclosure.

第1B圖繪示第1A圖之使用線材的製程之動態修正系統的示意圖。 Fig. 1B is a schematic diagram of the dynamic correction system of the process using wires in Fig. 1A.

第1C圖繪示第1B圖往方向1B`觀看動態修正系統的示意圖。 Figure 1C shows a schematic diagram of the dynamic correction system in the direction 1B' in Figure 1B.

第2A圖繪示第1B圖之路徑感測器所擷取之線材的路徑影像的示意圖。 FIG. 2A is a schematic diagram of the path image of the wire captured by the path sensor of FIG. 1B.

第2B圖繪示第2A圖之路徑影像中的待檢測區域的待檢測區域影像的示意圖。 FIG. 2B is a schematic diagram of the area to be detected image of the area to be detected in the path image of FIG. 2A.

第3圖繪示第1B圖之動態修正系統的動態修正方法的流程圖。 Figure 3 shows a flow chart of the dynamic correction method of the dynamic correction system in Figure 1B.

第4圖繪示第1B圖之動態修正系統的另一種動態修正方法的流程圖。 Fig. 4 shows a flowchart of another dynamic correction method of the dynamic correction system of Fig. 1B.

第5圖繪示依照本揭露另一實施例之使用線材之製程的動態修正系統的局部示意圖。 FIG. 5 is a partial schematic diagram of a dynamic correction system for a process using wires according to another embodiment of the disclosure.

請參照第1A~1C圖，第1A圖繪示依照本揭露一實施例之使用線材的製程之動態修正系統100的功能方塊圖，第1B圖繪示第1A圖之使用線材的製程之動態修正系統100的示意圖，而第1C圖繪示第1B圖往方向1B’觀看動態修正系統100的示意圖。 Please refer to Figures 1A~1C. Figure 1A shows a functional block diagram of the dynamic correction system 100 for a process using wires according to an embodiment of the present disclosure, and Figure 1B shows a dynamic correction of the process using wires in Figure 1A. A schematic diagram of the system 100, and FIG. 1C shows a schematic diagram of the dynamic correction system 100 viewed from the direction 1B′ in the direction 1B′ in FIG. 1B.

動態修正系統100包括驅動裝置110、路徑感測器120及控制器130。控制器(controller)130例如是採用半導體製程包覆的電路(circuit)結構，其例如是晶片、半導體封裝件或其它電路元件。 The dynamic correction system 100 includes a driving device 110, a path sensor 120 and a controller 130. The controller 130 is, for example, a circuit structure covered by a semiconductor process, such as a chip, a semiconductor package, or other circuit elements.

驅動裝置110用以以一運轉參數驅動載體10運動及將線材20包覆於載體10上。本文的「線材包覆」指的例如是包含纏繞 (winding)製程、編織(braiding)製程等。第1A~1C圖的動態修正系統100係以纏繞系統為例說明，然本揭露實施例不受此限。 The driving device 110 is used for driving the carrier 10 to move with an operating parameter and wrapping the wire 20 on the carrier 10. In this article, "wire coating" refers to, for example, winding (winding) process, braiding process, etc. The dynamic correction system 100 in FIGS. 1A to 1C is illustrated by taking the winding system as an example, but the embodiment of the disclosure is not limited thereto.

路徑感測器120用以取得線材20包覆在載體10上的實測路徑資訊D1。控制器130用以：(1)依據實測路徑資訊D1取得線材20包覆於載體10上的實測路徑P1；(2)取得目標路徑P2與實測路徑P1的實測路徑差異△P1；(3)判斷實測路徑差異△P1是否大於即時誤差E1；以及，(4)當實測路徑差異△P1大於即時誤差E1時，控制驅動裝置110改變運轉參數，使線材20包覆在載體10上的實測路徑P1接近目標路徑P2。綜上，本揭露實施例之動態修正系統100可在實際將線材20包覆在載體10之過程中，同時修正路徑不在目標路徑P2上的線材20(本文稱「線材包覆瑕疵」)，讓發生線材包覆瑕疵的線材20儘可能回到預設的目標路徑P2。 The path sensor 120 is used to obtain the measured path information D1 of the wire 20 coated on the carrier 10. The controller 130 is used to: (1) obtain the measured path P1 of the wire 20 wrapped on the carrier 10 according to the measured path information D1; (2) obtain the measured path difference ΔP1 between the target path P2 and the measured path P1; (3) determine Whether the measured path difference ΔP1 is greater than the instant error E1; and, (4) When the measured path difference ΔP1 is greater than the instant error E1, control the driving device 110 to change the operating parameters so that the measured path P1 of the wire 20 coated on the carrier 10 is close Target path P2. In summary, the dynamic correction system 100 of the disclosed embodiment can correct the wire 20 whose path is not on the target path P2 (herein referred to as the "wire coating defect") during the actual process of coating the wire 20 on the carrier 10, so that The wire 20 where the wire coating defect occurs returns to the preset target path P2 as much as possible.

目標路徑P2例如是一使用軟體產生的模擬路徑。目標路徑P2的路徑型態可依據產品的實際用途而定，本揭露實施例不限定目標路徑P2的路徑型態。目標路徑P2可預先儲存於控制器130中，或一記憶體(未繪示)中，控制器130可存取此記憶體，以儲存、取得、修改及/或設定目標路徑P2。此外，即時誤差E1例如是介於實測路徑差異△P1的0.1%~10%之間。即時誤差E1可預先儲存於控制器130中，或一記憶體(未繪示)中，控制器130可存取此記憶體，以儲存、取得、修改及/或設定即時誤差E1。 The target path P2 is, for example, a simulated path generated using software. The path type of the target path P2 may be determined according to the actual use of the product, and the embodiment of the disclosure does not limit the path type of the target path P2. The target path P2 can be pre-stored in the controller 130, or a memory (not shown), and the controller 130 can access the memory to store, obtain, modify, and/or set the target path P2. In addition, the instant error E1 is, for example, between 0.1% and 10% of the measured path difference ΔP1. The real-time error E1 can be pre-stored in the controller 130, or a memory (not shown), and the controller 130 can access this memory to store, obtain, modify, and/or set the real-time error E1.

在實施例中，載體10例如是瓶體、桿體、球體、錐體等各種能接受線材包覆於其上的載體。本實施例之載體10例如是包括第一端11、第二端12及載體部13，其中載體部13位於第一端11與第二端12之間且連接第一端11與第二端12。第一端11及/或第二端12具有例如是曲面、平面或其組合所構成的外輪廓面，其中曲面例如是如圓球面或其它幾何形態的曲面，而載體部13具有例如是曲面(如圓柱面)、平面或其組合所構成的外輪廓面。本揭露實施例不限定載體10的幾何形態，其可以是任何符合產品需求的形體。 In the embodiment, the carrier 10 is, for example, a bottle, a rod, a sphere, a cone, and other carriers that can accept wires wrapped thereon. The carrier 10 of this embodiment includes, for example, the first The end 11, the second end 12 and the carrier portion 13, wherein the carrier portion 13 is located between the first end 11 and the second end 12 and connects the first end 11 and the second end 12. The first end 11 and/or the second end 12 has, for example, a curved surface, a flat surface, or a combination of outer contour surfaces, wherein the curved surface is, for example, a spherical surface or a curved surface of other geometric shapes, and the carrier portion 13 has, for example, a curved surface ( Such as a cylindrical surface), a flat surface or a combination of the outer contour surface. The embodiment of the present disclosure does not limit the geometric shape of the carrier 10, and it can be any shape that meets the product requirements.

以產品類別來說，載體10例如是交通裝置的部件(如飛機機架、車輛機架、腳踏車機架等)、運動器材的部件(如羽球拍、曲棍球柄、泛舟船槳等)、民生類用品的部件(如液化石油氣瓶、氫氣瓶、氧氣瓶、高壓礙子與高壓管材)等需要高強度(但不限定)的產品。線材20例如是複合材料，如碳纖維、玻璃纖維等質輕且高強度的線材。在完成載體10的線材包覆作業後，可將包覆有線材20的載體10進行高溫烘烤。線材20係由線體(支材)與樹脂(基材)所組成，線材20包覆於載體10後，需經由高溫烘烤使樹脂先融化後，再與線體結合成具耐高應力複合材料。 In terms of product categories, the carrier 10 is, for example, components of transportation devices (such as aircraft racks, vehicle racks, bicycle racks, etc.), components of sports equipment (such as badminton rackets, hockey handles, rafting paddles, etc.), and civilian life The parts of the supplies (such as liquefied petroleum gas cylinders, hydrogen cylinders, oxygen cylinders, high-pressure barriers and high-pressure pipes) require high-strength (but not limited) products. The wire 20 is, for example, a composite material, such as a light-weight and high-strength wire such as carbon fiber and glass fiber. After the wire coating operation of the carrier 10 is completed, the carrier 10 coated with the wire 20 can be baked at a high temperature. The wire 20 is composed of a wire (branch) and a resin (base material). After the wire 20 is coated on the carrier 10, it needs to be baked at a high temperature to melt the resin, and then combine with the wire to form a high-stress resistant composite material.

在本實施例中，如第1B及1C圖所示，驅動裝置110包含轉軸111及機械手臂112。為了清楚表達特徵，第1B圖未繪示路徑感測器120。轉軸111可以轉動角度δ驅動載體10轉動，機械手臂112可將線材20包覆在載體10上。此外，機械手臂112例如是具有六個自由度，例如沿X、Y、Z軸向平移及繞X、Y、Z軸向轉動等六個自由度。機械手臂112可沿-X軸向平移，以將線材20包覆在(或緊迫於)載體10之外表面上。當機械手臂112平移至載體10的第一端11時，轉軸111可以轉動角度δ(如繞+X軸向)驅動載體10轉動，使載體10的另一面(載體10面向紙張之表面)轉動至面向機械手臂112，使機械手臂112提供的線材20可包覆於載體10的此另一面。接著，機械手臂112可沿+X軸向平移至載體10的第二端12，並於過程中繼續將線材20包覆在載體10之外表面上。透過機械手臂112沿+/-X軸向來回平移以及轉軸111繞+/-X軸向來回轉動，可將更多的線材20持續地包覆於載體10上，直到完成線材包覆作業。 In this embodiment, as shown in FIGS. 1B and 1C, the driving device 110 includes a rotating shaft 111 and a robot arm 112. In order to clearly express the characteristics, the path sensor 120 is not shown in FIG. 1B. The rotating shaft 111 can drive the carrier 10 to rotate by a rotation angle δ, and the robot arm 112 can wrap the wire 20 on the carrier 10. In addition, the robotic arm 112 has six degrees of freedom, for example, six degrees of freedom such as translation along the X, Y, and Z axes and rotation around the X, Y, and Z axes. The robot arm 112 can translate along the −X axis to wrap the wire 20 on (or press tightly on) the outer surface of the carrier 10. When the robot arm 112 is translated to the first end 11 of the carrier 10, the rotating shaft 111 can rotate at an angle δ (for example, around the +X axis) to drive the carrier 10 to rotate, so that the other side of the carrier 10 (the surface of the carrier 10) Turn to the surface of the paper to face the robotic arm 112, so that the wire 20 provided by the robotic arm 112 can be wrapped on the other side of the carrier 10. Then, the robot arm 112 can translate along the +X axis to the second end 12 of the carrier 10, and continue to wrap the wire 20 on the outer surface of the carrier 10 during the process. By moving the robot arm 112 back and forth along the +/-X axis and the rotating shaft 111 back and forth around the +/-X axis, more wires 20 can be continuously coated on the carrier 10 until the wire coating operation is completed.

在本實施例中，前述運轉參數例如是轉軸111的轉動角度δ。控制器130更用以：當實測路徑差異△P1大於即時誤差E1時，控制轉軸111改變轉動角度δ，使線材20包覆於載體10上的實測路徑P1接近目標路徑P2。在其中一種控制轉軸111之轉動角度δ的方式中，控制器130可控制轉軸111以往復運動改變轉動角度δ，例如，控制器130控制轉軸111繞+/-X軸向往復地改變轉動角度δ，使線材20包覆於載體10上的實測路徑P1逐漸穩定接近目標路徑P2。本揭露實施例不限定轉軸111繞+/-X軸向往復轉動的次數，往復次數可以是一次或多次。在另一實施例中，控制器130可控制轉軸111維持相同方向減慢轉動速度或反向轉動，使線材20包覆於載體10上的實測路徑P1逐漸穩定接近目標路徑P2。此外，在線材包覆瑕疵的修正過程中，控制器130可控制機械手臂112停止移動，直到線材20包覆於載體10上的實測路徑P1接近目標路徑P2時，方恢復機械手臂112原先的(預設的)控制模式(轉動角度/速度)。 In this embodiment, the aforementioned operating parameter is, for example, the rotation angle δ of the rotating shaft 111. The controller 130 is further used to control the rotating shaft 111 to change the rotation angle δ when the measured path difference ΔP1 is greater than the instantaneous error E1, so that the measured path P1 covered by the wire 20 on the carrier 10 approaches the target path P2. In one of the ways to control the rotation angle δ of the rotating shaft 111, the controller 130 can control the rotating shaft 111 to reciprocate to change the rotating angle δ. For example, the controller 130 controls the rotating shaft 111 to reciprocate around the +/-X axis to change the rotating angle δ. , The measured path P1 covered by the wire 20 on the carrier 10 gradually and stably approaches the target path P2. The embodiment of the present disclosure does not limit the number of reciprocating rotations of the rotating shaft 111 around the +/-X axis, and the number of reciprocating can be one or more times. In another embodiment, the controller 130 may control the rotating shaft 111 to maintain the same direction to slow down the rotation speed or reverse rotation, so that the measured path P1 covered by the wire 20 on the carrier 10 gradually approaches the target path P2 steadily. In addition, during the correction process of the wire coating defect, the controller 130 can control the robot arm 112 to stop moving until the measured path P1 of the wire 20 wrapped on the carrier 10 approaches the target path P2, and then the original robot arm 112 ( The preset) control mode (rotation angle/speed).

在另一實施例中，控制器130也可預測線材20包覆於載體10上的預測路徑，並據以判斷是否改變驅動裝置110的運轉參數。 In another embodiment, the controller 130 can also predict the predicted path of the wire 20 covering the carrier 10 and determine whether to change the operating parameters of the driving device 110 based on it.

舉例來說，控制器130更用以：(1)依據實測路徑P1，預測線材20包覆於載體10上的預測路徑P3；(2)取得預測路徑P3與目標路徑P2的預測路徑差異△P2；(3)判斷預測路徑差異△P2是否大於預測誤差E2；(4)當實測路徑差異△P1大於即時誤差E1且預測路徑差異△P2大於預測誤差E2時，控制驅動裝置110改變運轉參數，使線材20包覆於載體10上的實測路徑P1接近目標路徑P2。 For example, the controller 130 is further used to: (1) predict the predicted path P3 where the wire 20 is wrapped on the carrier 10 based on the measured path P1; (2) obtain the predicted path difference ΔP2 between the predicted path P3 and the target path P2 (3) Determine whether the predicted path difference ΔP2 is greater than the predicted error E2; (4) When the measured path difference ΔP1 is greater than the instant error E1 and the predicted path difference ΔP2 is greater than the predicted error E2, control the driving device 110 to change the operating parameters so that The measured path P1 where the wire 20 is wrapped on the carrier 10 is close to the target path P2.

綜上，即使預測路徑差異△P2大於預測誤差E2，但若實測路徑差異△P1仍小於即時誤差E1，控制器130仍不改變驅動裝置110的運轉參數。如此，透過預測路徑分析的加入，可在不影響線材包覆瑕疵的修正下，減少驅動裝置110改變運轉參數的次數/機率。 In summary, even if the predicted path difference ΔP2 is greater than the predicted error E2, if the measured path difference ΔP1 is still less than the instant error E1, the controller 130 still does not change the operating parameters of the driving device 110. In this way, through the addition of predictive path analysis, the number of times/probability of the driving device 110 to change the operating parameters can be reduced without affecting the correction of wire coating defects.

在一實施例中，預測誤差E2大於即時誤差E1，即，預測誤差E2比即時誤差E1寬鬆。即時誤差E1與預測誤差E2的比值例如是介於0.9~0.1之間，如0.5。此外，預測誤差E2例如是介於預測路徑差異△P2的0.1%~10%之間。預測誤差E2可預先儲存於控制器130中，或一記憶體(未繪示)中，控制器130可存取此記憶體，以儲存、取得、修改及/或設定預測誤差E2。 In an embodiment, the prediction error E2 is greater than the instant error E1, that is, the prediction error E2 is looser than the instant error E1. The ratio of the instant error E1 to the prediction error E2 is, for example, between 0.9 and 0.1, such as 0.5. In addition, the prediction error E2 is, for example, between 0.1% and 10% of the predicted path difference ΔP2. The prediction error E2 can be stored in the controller 130 in advance, or a memory (not shown), and the controller 130 can access this memory to store, obtain, modify, and/or set the prediction error E2.

此外，本揭露實施例之修正線材包覆瑕疵的時機點為：線材20位於機械手臂112之側。例如，控制器130在線材20包覆於載體10之端部S1(端部S1繪示於第1B圖)前控制驅動裝置110改變運轉參數，以於載體10的另一面轉動至面向機械手臂112之前完成線材的修正。前述的端部S1例如是第一端11的外表面的任何一部分、第二端12 的外表面的任何一部分，或是第一端11或第二端12的最端點(最靠近轉軸111的點)。 In addition, the timing point for correcting the wire coating defect in the embodiment of the present disclosure is: the wire 20 is located on the side of the robot arm 112. For example, the controller 130 controls the driving device 110 to change the operating parameters before the wire 20 is wrapped around the end S1 of the carrier 10 (end S1 is shown in Fig. 1B) so as to rotate on the other side of the carrier 10 to face the robot arm 112 Finish the wire correction before. The aforementioned end S1 is, for example, any part of the outer surface of the first end 11, the second end 12 Any part of the outer surface of, or the end point of the first end 11 or the second end 12 (the point closest to the shaft 111).

在一實施例中，控制器130可依據線材20的角度分析線材20之實測路徑P1，如下說明。 In one embodiment, the controller 130 can analyze the measured path P1 of the wire 20 according to the angle of the wire 20, as described below.

請參照第2A及2B圖，第2A圖繪示第1B圖之路徑感測器120所擷取之線材20的路徑影像M1的示意圖，而第2B圖繪示第2A圖之路徑影像M1中的待檢測區域20A的待檢測區域影像M2的示意圖。在本實施例中，路徑感測器120例如是攝像器，其用以擷取線材20包覆於載體10上的路徑影像。如第1A圖所示，路徑感測器120與驅動裝置110可不接觸，例如以無線方式進行傳輸，然視路徑感測器120的種類而定，路徑感測器120與驅動裝置110也可接觸，例如採用有線方式。前述實測路徑資訊D1例如是路徑感測器120所擷取的路徑影像。動態修正系統100的路徑感測器120的數量可以是一個或多個，其可配置在機械手臂112之側，以擷取機械手臂112之側的線材20包覆於載體10的路徑影像。然於另一實施例中，至少一路徑感測器120可更配置在機械手臂112的相對側，以擷取線材20包覆於載體10的另一面(機械手臂112之相對側)的路徑影像。然而，只要是可以實現即時監控及/或修正瑕疵修正即可，本揭露實施例不限定路徑感測器120的數量及/或配置位置。 Please refer to FIGS. 2A and 2B. FIG. 2A shows a schematic diagram of the path image M1 of the wire 20 captured by the path sensor 120 in FIG. 1B, and FIG. 2B shows the path image M1 in the path image M1 in FIG. 2A. A schematic diagram of the to-be-detected area image M2 of the to-be-detected area 20A. In this embodiment, the path sensor 120 is, for example, a camera, which is used to capture the path image of the wire 20 wrapped on the carrier 10. As shown in Figure 1A, the path sensor 120 and the driving device 110 may not be in contact with each other, such as wireless transmission. However, depending on the type of the path sensor 120, the path sensor 120 and the driving device 110 may also be in contact with each other. , Such as using a wired method. The aforementioned measured path information D1 is, for example, a path image captured by the path sensor 120. The number of the path sensor 120 of the dynamic correction system 100 can be one or more, which can be arranged on the side of the robotic arm 112 to capture the path image of the wire 20 on the side of the robotic arm 112 wrapped on the carrier 10. However, in another embodiment, at least one path sensor 120 may be further disposed on the opposite side of the robot arm 112 to capture the path image of the wire 20 wrapped on the other side of the carrier 10 (the opposite side of the robot arm 112) . However, as long as it can realize real-time monitoring and/or correction of defects, the embodiment of the present disclosure does not limit the number and/or arrangement positions of the path sensors 120.

此外，本揭露實施例不限定路徑感測器120的種類，其也可以是3D掃瞄器、線雷射掃瞄器、2D攝相器、超音波測距裝置等。 In addition, the embodiment of the present disclosure does not limit the type of the path sensor 120, which can also be a 3D scanner, a line laser scanner, a 2D camera, an ultrasonic distance measuring device, etc.

控制器130更用以：分析路徑影像M1，以取得實測路徑P1。舉例來說，控制器130可採用影像處理技術，從路徑影像M1中擷取出待檢測區域20A的待檢測區域影像M2。然後，待檢測區域影像M2中待檢測區域20A相對一參考軸R1之間的實測角度θ’。參考軸R1例如是轉軸111的軸向，如第1A圖之X軸向。為方便理解，目標路徑P2以虛線繪製於第2B圖，控制器130以實測角度θ’與目標路徑P2對應的目標角度θ)的差做為實測路徑差異△P1。當實測角度θ’與目標角度θ的差(即，實測路徑差異△P1)大於即時誤差E1時，控制器130判斷線材20已偏離目標路徑P2，然後控制驅動裝置110改變其運轉參數，以修正線材包覆瑕疵。此外，前述影像處理技術例如包含霍夫變換技術及/或感興趣區域(Region Of Interest,ROI)技術。 The controller 130 is further used to analyze the path image M1 to obtain the measured path P1. For example, the controller 130 can use image processing technology to capture from the path image M1 Take out the area to be inspected image M2 of the area to be inspected 20A. Then, the measured angle θ'between the to-be-detected area 20A in the to-be-detected area image M2 with respect to a reference axis R1. The reference axis R1 is, for example, the axial direction of the rotating shaft 111, such as the X-axis in FIG. 1A. To facilitate understanding, the target path P2 is drawn with a dotted line in Figure 2B, and the controller 130 uses the difference between the measured angle θ'and the target angle θ) corresponding to the target path P2 as the measured path difference ΔP1. When the difference between the measured angle θ'and the target angle θ (ie, the measured path difference ΔP1) is greater than the instant error E1, the controller 130 determines that the wire 20 has deviated from the target path P2, and then controls the driving device 110 to change its operating parameters to correct Wire covering defects. In addition, the aforementioned image processing technology includes, for example, Hough transform technology and/or region of interest (Region Of Interest, ROI) technology.

此外，控制器130可採用PID(比例-積分-微分)控制器控制驅動裝置110。舉例來說，如下式(1)所示，K_p表示比例增益(或比例控制器)，K_i表示積分增益(或積分控制器)，K_d表示微分增益(或微分控制器)，e(t)表示誤差函數，例如是回饋值(如實測角度θ’)與設定值(如目標角度θ)的差距，而u(t)表示控制輸出。在一實施例中，比例增益K_p，積分增益K_i及微分增益K_d可以預先計算或以軟體模擬取得。 In addition, the controller 130 may use a PID (Proportional-Integral-Derivative) controller to control the driving device 110. For example, as shown in the following formula (1), K _p represents proportional gain (or proportional controller), K _i represents integral gain (or integral controller), K _d represents derivative gain (or derivative controller), e( t) represents the error function, for example, the difference between the feedback value (such as the measured angle θ') and the set value (such as the target angle θ), and u(t) represents the control output. In one embodiment, the proportional gain K _p , the integral gain K _i and the derivative gain K _d can be calculated in advance or obtained by software simulation.

一組有助於修正線材包覆瑕疵的比例增益K_p，積分增益K_i及微分增益K_d能讓u(t)於時域的變化從上下震盪開始，但隨時間的推移而逐漸或快速進入穩定期(或收斂期)。在PID回饋控制機制下，控制器130控制轉軸111繞+/-X軸向往復改變(對應u(t)於時域中的上下震盪曲線)轉動角度δ，使線材20包覆於載體10上的實測路徑P1逐漸接近目標路徑P2(對應u(t)於時域中的穩定期或收斂期)。 A set of wire-coating defect correction ratio helps gain K _p, the integral gain K _i and derivative gain K _d let u (t) starting from shaking up and down to change the time domain, but with the passage of time gradually or rapidly Enter the stable period (or convergence period). Under the PID feedback control mechanism, the controller 130 controls the rotating shaft 111 to reciprocate around the +/-X axis (corresponding to the up and down oscillation curve of u(t) in the time domain) by the rotation angle δ, so that the wire 20 is wrapped on the carrier 10 The measured path P1 gradually approaches the target path P2 (corresponding to the stable period or convergence period of u(t) in the time domain).

在一實施例中，在線材包覆過程中，路徑感測器120可持續擷取(攝影)線材20包覆於載體10的路徑影像M1或每隔一段時間(例如1秒、更長或更短)擷取線材20包覆於載體10的路徑影像M1。控制器130可持續分析路徑感測器120所擷取的路徑影像M1，以持續性監控線材20包覆於載體10的最新狀況。 In one embodiment, during the wire coating process, the path sensor 120 can continuously capture (photograph) the path image M1 of the wire 20 coated on the carrier 10 or at regular intervals (for example, 1 second, longer or more). Short) Capture the path image M1 where the wire 20 is wrapped on the carrier 10. The controller 130 continuously analyzes the path image M1 captured by the path sensor 120 to continuously monitor the latest status of the wire 20 covering the carrier 10.

請參照第3圖，其繪示第1B圖之動態修正系統100的動態修正方法的流程圖。 Please refer to FIG. 3, which shows a flowchart of the dynamic correction method of the dynamic correction system 100 in FIG. 1B.

在步驟S110中，驅動裝置110以運轉參數驅動載體10運動。例如，驅動裝置110之轉軸111以運轉參數驅動載體10運動。運轉參數例如是轉軸111的轉動角度δ。 In step S110, the driving device 110 drives the carrier 10 to move according to the operating parameters. For example, the rotating shaft 111 of the driving device 110 drives the carrier 10 to move according to operating parameters. The operating parameter is, for example, the rotation angle δ of the rotating shaft 111.

在步驟S120中，驅動裝置110將線材20包覆於載體10上。例如，驅動裝置110之機械手臂112將線材20包覆於載體10上。 In step S120, the driving device 110 wraps the wire 20 on the carrier 10. For example, the robot arm 112 of the driving device 110 wraps the wire 20 on the carrier 10.

在步驟S130中，路徑感測器120取得線材20包覆於載體10上的實測路徑資訊D1。在實施例中，路徑感測器120例如是攝像器，而實測路徑資訊D1例如是路徑感測器120所擷取之線材20包覆於載體10上的路徑影像M1。 In step S130, the path sensor 120 obtains the measured path information D1 of the wire 20 wrapped on the carrier 10. In the embodiment, the path sensor 120 is, for example, a camera, and the measured path information D1 is, for example, the path image M1 captured by the path sensor 120 and covered with the wire 20 on the carrier 10.

在步驟S140中，控制器130依據實測路徑資訊D1，取得線材20包覆於載體10上的實測路徑P1。 In step S140, the controller 130 obtains the measured path P1 where the wire 20 is covered on the carrier 10 according to the measured path information D1.

在步驟S150中，控制器130取得目標路徑P2與實測路徑P1的實測路徑差異△P1。 In step S150, the controller 130 obtains the actual measurement path difference ΔP1 between the target path P2 and the actual measurement path P1.

在步驟S160中，控制器130判斷實測路徑差異△P1是否大於即時誤差E1。當實測路徑差異△P1大於即時誤差E1時，流程進入步驟S170；當實測路徑差異△P1不大於或等於即時誤差E1時，流程回到步驟S110。 In step S160, the controller 130 determines whether the measured path difference ΔP1 is greater than the instantaneous error E1. When the measured path difference △P1 is greater than the instant error E1, the process enters Step S170: When the measured path difference ΔP1 is not greater than or equal to the instant error E1, the flow returns to step S110.

在步驟S170中，控制器130改變驅動裝置110的運轉參數，使線材20包覆於載體10上的實測路徑P1接近目標路徑P2。 In step S170, the controller 130 changes the operating parameters of the driving device 110 to make the measured path P1 covered by the wire 20 on the carrier 10 approach the target path P2.

此外，在線材20持續包覆於載體10的過程中，控制器130可同時重複執行步驟S130~S170，以持續監控線材20包覆於載體10的狀況，且當線材20發生線材包覆瑕疵時，控制器130可即時修正線材20的路徑，使線材20包覆於載體10上的實測路徑P1接近或甚至回到目標路徑P2。 In addition, while the wire 20 is continuously coated on the carrier 10, the controller 130 can simultaneously repeat steps S130 to S170 to continuously monitor the condition of the wire 20 being coated on the carrier 10, and when the wire 20 has a wire coating defect , The controller 130 can immediately modify the path of the wire 20 to make the measured path P1 covered by the wire 20 on the carrier 10 approach or even return to the target path P2.

請參照第4圖，其繪示第1B圖之動態修正系統100的另一種使用線材的製程之動態修正方法的流程圖。第4圖之步驟S110~S150已於前述，容此不再贅述，以下係從步驟S260開始說明。 Please refer to FIG. 4, which shows a flow chart of another dynamic correction method of the dynamic correction system 100 of FIG. 1B for the manufacturing process using wires. Steps S110 to S150 in FIG. 4 have been described above, and will not be repeated here. The following description starts with step S260.

在步驟S260中，控制器130依據實測路徑資訊D1，預測線材20包覆於載體10上的預測路徑P3。 In step S260, the controller 130 predicts the predicted path P3 where the wire 20 is wrapped on the carrier 10 according to the measured path information D1.

在步驟S270中，控制器13取得預測路徑P3與目標路徑P2的預測路徑差異△P2。 In step S270, the controller 13 obtains the predicted path difference ΔP2 between the predicted path P3 and the target path P2.

然後，在步驟S160中，控制器130判斷實測路徑差異△P1是否大於即時誤差E1。當實測路徑差異△P1大於即時誤差E1時，流程進入步驟S280；當實測路徑差異△P1不大於或等於即時誤差E1時，流程回到步驟S110。 Then, in step S160, the controller 130 determines whether the measured path difference ΔP1 is greater than the instantaneous error E1. When the measured path difference ΔP1 is greater than the instant error E1, the flow proceeds to step S280; when the measured path difference ΔP1 is not greater than or equal to the instant error E1, the flow returns to step S110.

在步驟S280中，控制器130判斷預測路徑差異△P2是否大於預測誤差E2。控制器130以預測角度θ”(預測角度θ”繪示於第2B圖)與目標路徑P2對應的目標角度θ的差，做為預測路徑差異△P2。如第2B圖所示，預測角度θ”為預測路徑P3相對於參考軸R1之間的夾角。第2B圖之預測路徑P3僅為示意，實際上的待檢測區域影像M2可不存在預測路徑P3。當預測路徑差異△P2大於預測誤差E2時，流程進入步驟S170；當預測路徑差異△P2不大於或等於預測誤差E2時，流程回到步驟S110。 In step S280, the controller 130 determines whether the predicted path difference ΔP2 is greater than the predicted error E2. The controller 130 uses the predicted angle θ" (the predicted angle θ" is shown in Figure 2B) and The difference of the target angle θ corresponding to the target path P2 is used as the predicted path difference ΔP2. As shown in Figure 2B, the predicted angle θ" is the angle between the predicted path P3 and the reference axis R1. The predicted path P3 in Figure 2B is only for illustration, and the actual image M2 of the area to be detected may not have the predicted path P3. When the predicted path difference ΔP2 is greater than the predicted error E2, the process proceeds to step S170; when the predicted path difference ΔP2 is not greater than or equal to the predicted error E2, the process returns to step S110.

綜上，在實測路徑差異△P1大於即時誤差E1及預測路徑差異△P2大於預測誤差E2同時發生時，控制器130方改變驅動裝置110的運轉參數。換言之，即使預測路徑差異△P2大於預測誤差E2，但若實測路徑差異△P1仍小於即時誤差E1，控制器130仍不改變驅動裝置110的運轉參數。如此，透過預測路徑分析的加入，可在不影響線材包覆瑕疵的修正下，減少驅動裝置110改變運轉參數的次數/機率。 In summary, when the measured path difference ΔP1 is greater than the instant error E1 and the predicted path difference ΔP2 is greater than the predicted error E2 at the same time, the controller 130 changes the operating parameters of the driving device 110. In other words, even if the predicted path difference ΔP2 is greater than the predicted error E2, if the measured path difference ΔP1 is still less than the instant error E1, the controller 130 still does not change the operating parameters of the driving device 110. In this way, through the addition of predictive path analysis, the number of times/probability of the driving device 110 to change the operating parameters can be reduced without affecting the correction of wire coating defects.

此外，在線材20持續包覆於載體10的過程中，控制器130可同時重複執行步驟S130~S150、S260、S270、S160、S280及S170，以持續監控線材20包覆於載體10的狀況且當線材20發生線材包覆瑕疵時即時修正線材20的路徑，使線材20包覆於載體10上的實測路徑P1接近或甚至回到目標路徑P2。 In addition, while the wire 20 is continuously coated on the carrier 10, the controller 130 can simultaneously repeat steps S130 to S150, S260, S270, S160, S280, and S170 to continuously monitor the condition of the wire 20 being coated on the carrier 10 and When a wire covering defect occurs in the wire 20, the path of the wire 20 is immediately corrected, so that the measured path P1 of the wire 20 covered on the carrier 10 approaches or even returns to the target path P2.

雖然前述實施例之動態修正方法係以應用於纏繞系統中為例說明，然亦可應用於編織系統。以下係以第5圖為例說明。 Although the dynamic correction method of the foregoing embodiment is applied to a winding system as an example, it can also be applied to a braiding system. The following is an example in Figure 5.

請參照第5圖，其繪示依照本揭露另一實施例之使用線材之製程的動態修正系統200的局部示意圖。動態修正系統200係以編織系統為例說明。 Please refer to FIG. 5, which shows a partial schematic diagram of a dynamic correction system 200 using a wire manufacturing process according to another embodiment of the present disclosure. The dynamic correction system 200 is explained by taking a knitting system as an example.

動態修正系統200包括驅動裝置210、路徑感測器120及控制器130。本實施例之動態修正系統200具有與前述動態修正系統100相同或相似的特徵，不同處在於，動態修正系統200之驅動裝置210的結構與驅動裝置110不同。 The dynamic correction system 200 includes a driving device 210, a path sensor 120 and a controller 130. The dynamic correction system 200 of this embodiment has the same or similar features as the aforementioned dynamic correction system 100, except that the structure of the driving device 210 of the dynamic correction system 200 is different from that of the driving device 110.

在本實施例中，驅動裝置210例如是包括編織環211、機械手臂212及至少一線材提供器213。機械手臂212用以以運轉參數驅動載體10運動，編織環211用以將線材20包覆於載體10上。至少一線材提供器213環繞編織環211的內周面211s配置，並用以提供線材20給載體10。當編織環211繞Z軸向(+或-Z軸向)轉動時，編織環211帶動線材提供器213繞Z軸向公轉，而拉動線材提供器213上的線材20編織在載體10之外表面上。此外，機械手臂212例如是具有六個自由度，例如沿X、Y、Z軸向平移及繞X、Y、Z軸向轉動等六個自由度。 In this embodiment, the driving device 210 includes, for example, a braided ring 211, a robot arm 212, and at least one wire supplier 213. The robot arm 212 is used to drive the carrier 10 to move according to operating parameters, and the braided ring 211 is used to wrap the wire 20 on the carrier 10. At least one wire supplier 213 is arranged around the inner peripheral surface 211 s of the braided ring 211 and used to provide the wire 20 to the carrier 10. When the braided ring 211 rotates around the Z axis (+ or -Z axis), the braided ring 211 drives the wire provider 213 to revolve around the Z axis, and pulls the wire 20 on the wire provider 213 to weave on the outer surface of the carrier 10 on. In addition, the robot arm 212 has six degrees of freedom, for example, six degrees of freedom such as translation along the X, Y, and Z axes and rotation around the X, Y, and Z axes.

相似於前述驅動裝置110，本實施例之驅動裝置210用以以一運轉參數驅動載體10運動及將線材20包覆於載體10上。路徑感測器120用以取得線材20包覆於載體10上的實測路徑資訊D1。控制器130用以：(1)依據實測路徑資訊D1取得線材20包覆於載體10上的實測路徑P1；(2)取得目標路徑P2與實測路徑P1的實測路徑差異△P1；(3)判斷實測路徑差異△P1是否大於即時誤差E1；以及，(4)當實測路徑差異△P1大於即時誤差E1時，控制驅動裝置210改變運轉參數，使線材20包覆於載體10上的實測路徑P1接近目標路徑P2。綜上，本揭露實施例之動態修正系統200可在實際線材包覆過程中同時修正路徑不在目標路徑P2上的線材20(線材包覆瑕疵)，讓發生線材包覆瑕疵的線材20儘可能回到預設的目標路徑P2。 Similar to the aforementioned driving device 110, the driving device 210 of this embodiment is used to drive the carrier 10 to move and wrap the wire 20 on the carrier 10 with an operating parameter. The path sensor 120 is used to obtain the measured path information D1 of the wire 20 coated on the carrier 10. The controller 130 is used to: (1) obtain the measured path P1 of the wire 20 wrapped on the carrier 10 according to the measured path information D1; (2) obtain the measured path difference ΔP1 between the target path P2 and the measured path P1; (3) determine Whether the measured path difference ΔP1 is greater than the instant error E1; and, (4) When the measured path difference ΔP1 is greater than the instant error E1, control the driving device 210 to change the operating parameters so that the measured path P1 of the wire 20 coated on the carrier 10 is close Target path P2. In summary, the dynamic correction system 200 of the embodiment of the present disclosure can simultaneously correct path errors during the actual wire coating process. The wire 20 (wire covering defect) on the target path P2 allows the wire 20 with the wire covering defect to return to the preset target path P2 as much as possible.

在本實施例中，前述運轉參數例如是機械手臂212的進給速度V，如往+/-Z軸向平移的速度。控制器130更用以：當實測路徑差異△P1大於即時誤差E1時，控制機械手臂212改變進給速度V，使線材20包覆於載體10上的實測路徑P1接近目標路徑P2。在其中一種控制機械手臂212之進給速度V的方式中，控制器130可控制機械手臂212以往復運動改變進給方向，例如，控制器130控制機械手臂212沿+/-Z軸向往復地改變進給方向，使線材20包覆於載體10上的實測路徑P1逐漸穩定接近目標路徑P2。本揭露實施例不限定機械手臂212沿+/-Z軸向往復移動的次數，往復次數可以是一次或多次。在另一實施例中，控制器130可控制機械手臂212維持相同方向減慢進給速度或反向移動，使線材20包覆於載體10上的實測路徑P1逐漸穩定接近目標路徑P2。此外，在線材包覆瑕疵的修正過程中，控制器130可控制編織環211停止轉動，直到線材20包覆於載體10上的實測路徑P1接近目標路徑P2時，方恢復編織環211原先的(預設的)控制模式(轉動速度)。 In this embodiment, the aforementioned operating parameter is, for example, the feed speed V of the robot arm 212, such as the speed of translation in the +/-Z axis. The controller 130 is further used to control the robot arm 212 to change the feed speed V when the measured path difference ΔP1 is greater than the instant error E1, so that the measured path P1 covered by the wire 20 on the carrier 10 approaches the target path P2. In one of the ways to control the feed speed V of the robot arm 212, the controller 130 can control the robot arm 212 to move back and forth to change the feed direction. For example, the controller 130 controls the robot arm 212 to reciprocate along the +/-Z axis. The feeding direction is changed to make the measured path P1 covered by the wire 20 on the carrier 10 gradually and stably approach the target path P2. The embodiment of the present disclosure does not limit the number of reciprocating movements of the robot arm 212 along the +/-Z axis, and the number of reciprocating movements may be one or multiple. In another embodiment, the controller 130 can control the robot arm 212 to maintain the same direction to slow down the feed speed or move in the reverse direction, so that the measured path P1 covered by the wire 20 on the carrier 10 gradually approaches the target path P2 steadily. In addition, in the process of correcting the wire coating defect, the controller 130 can control the braided ring 211 to stop rotating until the measured path P1 of the wire 20 coated on the carrier 10 is close to the target path P2, then the original braided ring 211 ( The preset) control mode (rotation speed).

類似前述動態修正系統100的分析方式，在本實施例中，控制器130可依據線材20的角度分析線材20之實測路徑P1。例如，如第5圖所示，線材20相對一參考軸R2具有實測角度θ’，其中參考軸R2例如是+/-Y軸向，或載體10上的任意幾何參考。控制器130可分析路徑感測器120所擷取的路徑影像M1(未繪示)，而取得實測角度θ’。然後，控制器130以實測角度θ’與目標路徑P2對應的目標角度θ(未繪示)的差做為實測路徑差異△P1。當實測角度θ’與目標路徑P2的差大於即時誤差E1時，控制器130判斷線材20已偏離目標路徑P2，然後或即時控制驅動裝置210改變其運轉參數，以修正線材包覆瑕疵。 Similar to the analysis method of the aforementioned dynamic correction system 100, in this embodiment, the controller 130 can analyze the measured path P1 of the wire 20 according to the angle of the wire 20. For example, as shown in FIG. 5, the wire 20 has a measured angle θ'relative to a reference axis R2, where the reference axis R2 is, for example, the +/- Y axis, or any geometric reference on the carrier 10. The controller 130 can analyze the path image M1 (not shown) captured by the path sensor 120 to obtain the measured angle θ'. Then, the controller 130 uses the difference between the measured angle θ'and the target angle θ (not shown) corresponding to the target path P2 as the actual Measure the path difference △P1. When the difference between the measured angle θ'and the target path P2 is greater than the instant error E1, the controller 130 determines that the wire 20 has deviated from the target path P2, and then or immediately controls the driving device 210 to change its operating parameters to correct the wire coating defects.

此外，動態修正系統200可採用前述第3及4圖的方式修正線材包覆路徑，不同處在於，動態修正系統200所控制的運轉參數為機械手臂212的進給速度V。 In addition, the dynamic correction system 200 can modify the wire coating path in the manner described in FIGS. 3 and 4, except that the operating parameter controlled by the dynamic correction system 200 is the feed speed V of the robotic arm 212.

綜上所述，雖然本揭露已以實施例揭露如上，然其並非用以限定本揭露。本揭露所屬技術領域中具有通常知識者，在不脫離本揭露之精神和範圍內，當可作各種之更動與潤飾。因此，本揭露之保護範圍當視後附之申請專利範圍所界定者為準。 To sum up, although the present disclosure has been disclosed as above through the embodiments, it is not intended to limit the present disclosure. Those with ordinary knowledge in the technical field to which this disclosure belongs can make various changes and modifications without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be subject to the scope of the attached patent application.

100:動態修正系統 100: Dynamic correction system

110:驅動裝置 110: Drive

120:路徑感測器 120: Path sensor

130:控制器 130: Controller

D1:實測路徑資訊 D1: Measured path information

Claims

一種使用線材之製程的動態修正系統，包括：一驅動裝置，用以：以一運轉參數驅動一載體運動；及將一線材包覆於該載體上；一路徑感測器，用以取得該線材包覆於該載體上的一實測路徑資訊；以及一控制器，用以：依據該實測路徑資訊取得該線材包覆於該載體上的一實測路徑；取得一目標路徑與該實測路徑的一實測路徑差異；判斷該實測路徑差異是否大於一即時誤差；及當該實測路徑差異大於該即時誤差時，控制該驅動裝置改變該運轉參數，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 A dynamic correction system for a manufacturing process using a wire, comprising: a driving device for: driving a carrier to move with an operating parameter; and wrapping a wire on the carrier; and a path sensor for obtaining the wire A measured path information wrapped on the carrier; and a controller for: obtaining a measured path of the wire wrapped on the carrier according to the measured path information; obtaining a target path and a measured path of the measured path Path difference; judge whether the measured path difference is greater than an instant error; and when the measured path difference is greater than the instant error, control the driving device to change the operating parameters so that the measured path of the wire wrapped on the carrier is close to Target path.

如請求項1所述之動態修正系統，其中該驅動裝置包含一轉軸及一機械手臂，該運轉參數為該轉軸的一轉動角度，該轉軸用以以該轉動角度驅動該載體轉動，該機械手臂用以將該線材包覆於該載體上；該控制器更用以：當該實測路徑差異大於該即時誤差時，控制該轉軸改變該轉動角度，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction system according to claim 1, wherein the driving device includes a rotating shaft and a robot arm, the operating parameter is a rotating angle of the rotating shaft, the rotating shaft is used to drive the carrier to rotate at the rotating angle, the robot arm The wire is used to wrap the wire on the carrier; the controller is further used to: when the measured path difference is greater than the instant error, control the rotating shaft to change the rotation angle so that the wire is wrapped on the measured The path is close to the target path.

如請求項2所述之動態修正系統，其中該控制器更用以：當該實測路徑差異大於該即時誤差時，控制該轉軸以一往復運動改變該轉動角度，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction system according to claim 2, wherein the controller is further used for: When the measured path difference is greater than the instant error, the rotating shaft is controlled to change the rotation angle with a reciprocating motion, so that the measured path of the wire covered on the carrier is close to the target path.

如請求項2所述之動態修正系統，其中該控制器更用以：在該線材包覆於該載體之一端部前，控制該轉軸改變該運轉參數，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction system according to claim 2, wherein the controller is further used for: before the wire is coated on an end of the carrier, controlling the rotating shaft to change the operating parameters so that the wire is coated on the carrier The measured path is close to the target path.

如請求項1所述之動態修正系統，其中該驅動裝置包含一編織環及一機械手臂，該運轉參數為該機械手臂的一進給速度，該機械手臂用以以該進給速度驅動該載體運動，該編織環用以將該線材包覆於該載體上；該控制器更用以：當該實測路徑差異大於該即時誤差時，控制該機械手臂改變該進給速度，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction system according to claim 1, wherein the driving device includes a knitting loop and a robot arm, the operating parameter is a feed speed of the robot arm, and the robot arm is used to drive the carrier at the feed speed Move, the braided ring is used to wrap the wire on the carrier; the controller is further used to: when the measured path difference is greater than the instant error, control the robotic arm to change the feeding speed, so that the wire is wrapped The measured path on the carrier is close to the target path.

如請求項5所述之動態修正系統，其中該控制器更用以：當該實測路徑差異大於該即時誤差時，控制該機械手臂以往復運動改變該載體之進給方向，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction system according to claim 5, wherein the controller is further used to: when the measured path difference is greater than the instant error, control the mechanical arm to reciprocate to change the feeding direction of the carrier so that the wire is covered The measured path on the carrier is close to the target path.

如請求項1所述之動態修正系統，其中該控制器更用以：依據該實測路徑資訊，預測該線材包覆於該載體上的一預測路徑；取得該預測路徑與該目標路徑的一預測路徑差異；判斷預測路徑差異是否大於一預測誤差；以及當該實測路徑差異大於該即時誤差且該預測路徑差異大於該預測誤差時，控制該驅動裝置改變該運轉參數，使該線材包覆於該載體上的該實測路徑接近該目標路徑；其中，該預測誤差大於即時誤差。 The dynamic correction system according to claim 1, wherein the controller is further used to predict a predicted path of the wire covered on the carrier based on the measured path information; Obtain a predicted path difference between the predicted path and the target path; determine whether the predicted path difference is greater than a prediction error; and when the measured path difference is greater than the instant error and the predicted path difference is greater than the predicted error, control the driving device to change The operating parameter makes the measured path of the wire covered on the carrier close to the target path; wherein, the prediction error is greater than the instant error.

如請求項1所述之動態修正系統，其中該路徑感測器為一攝像器，該實測路徑資訊為該線材包覆於該載體上的一路徑影像；該控制器更用以：分析該路徑影像，以取得該實測路徑。 The dynamic correction system according to claim 1, wherein the path sensor is a camera, and the measured path information is a path image of the wire wrapped on the carrier; the controller is further used to: analyze the path Image to obtain the measured path.

一種使用線材之製程的動態修正方法，包括：一驅動裝置以一運轉參數驅動一載體運動；該驅動裝置將一線材包覆於該載體上；一路徑感測器取得該線材包覆於該載體上的一實測路徑資訊；一控制器依據該實測路徑資訊，取得該線材包覆於該載體上的一實測路徑；該控制器取得一目標路徑與該實測路徑的一實測路徑差異；該控制器判斷該實測路徑差異是否大於一即時誤差；以及當該實測路徑差異大於該即時誤差時，該控制器改變該運轉參數，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 A dynamic correction method for a manufacturing process using wires includes: a driving device drives a carrier to move with an operating parameter; the driving device wraps a wire on the carrier; a path sensor obtains that the wire is wrapped on the carrier A measured path information on the above; a controller obtains a measured path of the wire covered on the carrier according to the measured path information; the controller obtains a measured path difference between a target path and the measured path; the controller Determine whether the measured path difference is greater than an instant error; and when the measured path difference is greater than the instant error, the controller changes the operating parameter so that the measured path of the wire covered on the carrier is close to the target path.

如請求項9所述之動態修正方法，其中該驅動裝置包含一轉軸及一機械手臂，該運轉參數為該轉軸的一轉動角度；該動態修正方法更包括：當該實測路徑差異大於該即時誤差時，該控制器控制該轉軸改變該轉動角度，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction method according to claim 9, wherein the driving device includes a rotating shaft and a mechanical arm, and the operating parameter is a rotation angle of the rotating shaft; the dynamic correction method further includes: when the measured path difference is greater than the instant error At this time, the controller controls the rotating shaft to change the rotation angle so that the measured path of the wire covered on the carrier is close to the target path.

如請求項10所述之動態修正方法，更包括：當該實測路徑差異大於該即時誤差時，該控制器控制該轉軸以一往復運動改變該轉動角度，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 According to claim 10, the dynamic correction method further includes: when the measured path difference is greater than the instant error, the controller controls the rotating shaft to change the rotation angle with a reciprocating motion, so that the wire is covered on the carrier The measured path is close to the target path.

如請求項10所述之動態修正方法，更包括：在該線材包覆於該載體之一端部前，該控制器控制該轉軸改變該運轉參數，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction method according to claim 10, further comprising: before the wire is wrapped on an end of the carrier, the controller controls the rotating shaft to change the operating parameters, so that the wire is wrapped on the carrier. The path is close to the target path.

如請求項9所述之動態修正方法，其中該驅動裝置包含一編織環及一機械手臂，該運轉參數為該機械手臂的一進給速度；該動態修正方法更包括：當該實測路徑差異大於該即時誤差時，控制該機械手臂改變該進給速度，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction method according to claim 9, wherein the driving device includes a braided loop and a robot arm, and the operating parameter is a feed speed of the robot arm; the dynamic correction method further includes: when the measured path difference is greater than When the instant error occurs, the robot arm is controlled to change the feed speed so that the measured path of the wire covered on the carrier is close to the target path.

如請求項13所述之動態修正方法，更包括：當該實測路徑差異大於該即時誤差時，控制該機械手臂以往復運動改變該載體之進給方向，使該線材包覆於該載體上的該實測路徑接近該目標路徑。 The dynamic correction method described in claim 13 further includes: When the measured path difference is greater than the instant error, the robot arm is controlled to reciprocate to change the feeding direction of the carrier so that the measured path covered by the wire on the carrier is close to the target path.

如請求項9所述之動態修正方法，更包括：依據該實測路徑資訊，該控制器預測該線材包覆於該載體上的一預測路徑；該控制器取得該預測路徑與該目標路徑的一預測路徑差異；該控制器判斷預測路徑差異是否大於一預測誤差；以及當該實測路徑差異大於該即時誤差且該預測路徑差異大於該預測誤差時，該控制器控制該驅動裝置改變該運轉參數，使該線材包覆於該載體上的該實測路徑接近該目標路徑；其中，該預測誤差大於即時誤差。 The dynamic correction method according to claim 9, further comprising: according to the measured path information, the controller predicts a predicted path of the wire covered on the carrier; the controller obtains one of the predicted path and the target path Predicted path difference; the controller determines whether the predicted path difference is greater than a prediction error; and when the measured path difference is greater than the instant error and the predicted path difference is greater than the predicted error, the controller controls the driving device to change the operating parameter, The measured path of the wire covered on the carrier is close to the target path; wherein, the prediction error is greater than the instant error.

如請求項9所述之動態修正方法，其中該路徑感測器為一攝像器，該實測路徑資訊為該線材包覆於該載體上的一路徑影像；該動態修正方法更用以：該控制器分析該路徑影像，以取得該實測路徑。 The dynamic correction method according to claim 9, wherein the path sensor is a camera, and the measured path information is a path image of the wire wrapped on the carrier; the dynamic correction method is further used for: the control The device analyzes the path image to obtain the measured path.