TWI726546B - Method for coating metal layer to reduce surface tension of indium bismuth alloy and substrate and complex made by the method - Google Patents
Method for coating metal layer to reduce surface tension of indium bismuth alloy and substrate and complex made by the method Download PDFInfo
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本發明係關於一種降低銦鉍與基板之間表面張力的方法及該方法製造之複合材，特別是指一種藉由塗覆金屬層以降低銦鉍與基板之間表面張力的方法及該方法製造之複合材。 The present invention relates to a method for reducing the surface tension between indium and bismuth and a substrate and a composite material produced by the method, in particular to a method for reducing the surface tension between indium and bismuth and the substrate by coating a metal layer, and the method for manufacturing The composite material.
一般在不易潤濕的基材上結合相變化金屬時，以銦鉍合金為例，由於基材表面潤濕性較低，當銦鉍合金變化為液態時，在基材表面容易凝聚成球狀，液態之銦鉍合金的接觸角超過150度。當基材移動或傾斜時，如此大的接觸角使銦鉍合金與基材間的結合能力較差，銦鉍合金可能會溢出至基材之外。 當基材為電子產品的部分元件時，可導電的銦鉍合金若溢出，甚至可能造成基材的短路，使整個電子產品損壞。 Generally, when combining phase change metals on a substrate that is not easy to wet, take the indium-bismuth alloy as an example. Due to the low wettability of the substrate surface, when the indium-bismuth alloy changes to a liquid state, it tends to condense into a spherical shape on the surface of the substrate , The contact angle of liquid indium-bismuth alloy exceeds 150 degrees. When the substrate moves or tilts, such a large contact angle makes the bonding ability between the indium-bismuth alloy and the substrate poor, and the indium-bismuth alloy may overflow outside the substrate. When the substrate is a part of the electronic product, if the conductive indium-bismuth alloy overflows, it may even cause a short circuit of the substrate and damage the entire electronic product.
目前，仍無增加銦鉍合金與基材表面結合能力的方法，傳統使用黏著劑幫助結合，但黏著劑只適用於固態的銦鉍合金，然而，液態的銦鉍合金本身有流動性，無法良好附著於基材，流動不易控制其方向，即使使用黏著劑也有可能流動而溢出。 At present, there is still no way to increase the bonding ability of indium-bismuth alloy with the surface of the substrate. Traditionally, adhesives are used to help bond, but the adhesives are only suitable for solid indium-bismuth alloys. However, liquid indium-bismuth alloys themselves have fluidity and cannot be good. Attached to the substrate, the flow is not easy to control its direction, even if the adhesive is used, it may flow and overflow.
爰此，本發明人提出一種塗覆金屬層降低銦鉍合金與基板表面張力方法，包含：於一基板及一液相銦鉍合金之間存在一金屬層；使該液相銦鉍合金透過該金屬層結合於該基板；以及該液相銦鉍合金降溫至熔點以下而成為一固相銦鉍合金，該固相銦鉍合金與該基板維持結合。 In view of this, the present inventor proposes a method for coating a metal layer to reduce the surface tension of an indium-bismuth alloy and a substrate, which includes: a metal layer exists between a substrate and a liquid indium-bismuth alloy; and the liquid-phase indium-bismuth alloy penetrates the The metal layer is combined with the substrate; and the liquid phase indium-bismuth alloy is cooled to below the melting point to become a solid-phase indium-bismuth alloy, and the solid-phase indium-bismuth alloy remains bonded to the substrate.
進一步，該液相銦鉍合金及該金屬層加熱至攝氏60度至250度。 Further, the liquid phase indium-bismuth alloy and the metal layer are heated to 60°C to 250°C.
其中，該金屬層為錫層或銦層。 Wherein, the metal layer is a tin layer or an indium layer.
其中，該基板為銅質或鋁質。 Among them, the substrate is copper or aluminum.
其中，該液相銦鉍合金與基板之接觸角不大於50度。 Wherein, the contact angle between the liquid phase indium-bismuth alloy and the substrate is not more than 50 degrees.
進一步，該液相銦鉍合金含有低於40wt%的錫。 Further, the liquid phase indium-bismuth alloy contains less than 40wt% tin.
進一步，藉由該液相銦鉍合金熔蝕該金屬層，降低該液相銦鉍合金在該基板上的表面張力，使該液相銦鉍合金成為一導熱通道。 Further, the metal layer is etched by the liquid phase indium-bismuth alloy to reduce the surface tension of the liquid phase indium-bismuth alloy on the substrate, so that the liquid phase indium-bismuth alloy becomes a heat conduction channel.
其中，該固相銦鉍合金的基地相為BiIn2相或BiIn相。 Wherein, the base phase of the solid-phase indium-bismuth alloy is BiIn 2 phase or BiIn phase.
本發明人再提出一種使用前述塗覆金屬層降低銦鉍合金與基板表面張力方法製造的複合材。 The inventor of the present invention further proposes a composite material manufactured by using the aforementioned coating metal layer to reduce the surface tension of the indium-bismuth alloy and the substrate.
根據上述技術特徵可達成以下功效： According to the above technical features, the following effects can be achieved:
1.金屬層降低液相銦鉍合金的表面張力，液相銦鉍合金不會從基板溢出。 1. The metal layer reduces the surface tension of the liquid-phase indium-bismuth alloy, and the liquid-phase indium-bismuth alloy will not overflow from the substrate.
2.於一般使用狀態下，金屬層無強烈氣味，不會造成使用者的反感。 2. Under normal use conditions, the metal layer has no strong odor and will not cause disgust to users.
3.液相銦鉍合金降溫至熔點以下而成為固相銦鉍合金時，固相銦鉍合金與基板仍會維持結合，可以避免將空氣導入至固相銦鉍合金與基板之間。 3. When the liquid phase indium-bismuth alloy is cooled below the melting point to become a solid-phase indium-bismuth alloy, the solid-phase indium-bismuth alloy and the substrate will still maintain the bond, which can avoid introducing air between the solid-phase indium-bismuth alloy and the substrate.
4.金屬層與基板之間是低強度界面，利用金屬層保留基板電鍍過程的乾淨表面，當液相銦鉍合金熔蝕金屬層而接觸到基板時，可以更容易潤濕基板。 4. There is a low-strength interface between the metal layer and the substrate. The metal layer is used to retain the clean surface of the substrate during electroplating. When the liquid phase indium-bismuth alloy etches the metal layer and contacts the substrate, the substrate can be wetted more easily.
1:滴管 1: Dropper
2:液相銦鉍合金 2: Liquid phase indium-bismuth alloy
3:金屬層 3: Metal layer
4:基板 4: substrate
[第一圖]係本發明第一實施例之剖視圖一。 [The first figure] is a cross-sectional view of the first embodiment of the present invention.
[第二圖]係本發明第一實施例之流程方塊示意圖。 [The second figure] is a block diagram of the flow of the first embodiment of the present invention.
[第三A圖]係本發明第一實施例於實施狀態下之照片一，示意加熱0分鐘。
[Third Figure A] is a
[第三B圖]係本發明第一實施例於實施狀態下之照片二，示意加熱9分鐘。 [Third Figure B] is the second photo of the first embodiment of the present invention in the implementation state, indicating heating for 9 minutes.
[第三C圖]係本發明第一實施例於實施狀態下之照片三，示意加熱15分鐘。 [Third Figure C] is the third photo of the first embodiment of the present invention in the implementation state, indicating heating for 15 minutes.
[第三D圖]係本發明第一實施例之熱傳導係數及熱阻值對時間關係圖。 [Third Diagram D] is a diagram showing the relationship between thermal conductivity and thermal resistance versus time in the first embodiment of the present invention.
[第四A圖]係本發明第二實施例於實施狀態下之照片一，示意加熱0分鐘。
[Fourth Figure A] is a
[第四B圖]係本發明第二實施例於實施狀態下之照片二，示意加熱9分鐘。 [Fourth Figure B] is the second photo of the second embodiment of the present invention in the implementation state, indicating heating for 9 minutes.
[第四C圖]係本發明第二實施例於實施狀態下之照片三，示意加熱15分鐘。 [Fourth Figure C] is the third photo of the second embodiment of the present invention in the implementation state, indicating heating for 15 minutes.
[第五A圖]係本發明第三實施例於實施狀態下之照片一，示意加熱0分鐘。
[Figure 5A] is a
[第五B圖]係本發明第三實施例於實施狀態下之照片二，示意加熱9分鐘。 [Fifth Figure B] is the second photo of the third embodiment of the present invention in the implementation state, indicating heating for 9 minutes.
[第五C圖]係本發明第三實施例於實施狀態下之照片三，示意加熱15分鐘。 [Figure 5C] is the third photo of the third embodiment of the present invention in the implementation state, indicating heating for 15 minutes.
[第六圖]係本發明第四實施例於實施狀態下之照片。 [Figure 6] is a photo of the fourth embodiment of the present invention in its implementation state.
[第七圖]係本發明第一實施例之剖視圖二，示意液相銦鉍合金熔蝕金屬層。 [Figure 7] is the second cross-sectional view of the first embodiment of the present invention, showing the metal layer being etched by the liquid phase indium-bismuth alloy.
[第八圖]係本發明第一實施例之微結構組織照片。 [Figure 8] is a photo of the microstructure organization of the first embodiment of the present invention.
[第九圖]係本發明第二實施例之微結構組織照片。 [Figure 9] is a photo of the microstructure organization of the second embodiment of the present invention.
[第十圖]係本發明第三實施例之微結構組織照片。 [Figure 10] is a photo of the microstructure organization of the third embodiment of the present invention.
綜合上述技術特徵，本發明塗覆金屬層降低銦鉍合金與基板表面張力方法及該方法製造之複合材的主要功效將可於下述實施例清楚呈現。 Based on the above technical features, the method for reducing the surface tension of the indium-bismuth alloy and the substrate of the present invention by coating the metal layer and the main effects of the composite material produced by the method will be clearly presented in the following embodiments.
要特別注意的是，在以下不同實施例中，相同名稱的元件係以相同符號做標示。 It should be particularly noted that in the following different embodiments, elements with the same name are marked with the same symbols.
請參閱第一圖及第二圖，係揭示本發明塗覆金屬層降低銦鉍合金與基板表面張力方法之第一實施例，包含以下步驟：先將一金屬層(3)結合於一基板(4)，再使用一滴管(1)將一液相銦鉍合金(2)透過該金屬層(3)結合於該基板(4)，並將該液相銦鉍合金(2)及該金屬層(3)加熱至攝氏60度至250度，較佳是攝氏100度。藉由該液相銦鉍合金(2)熔蝕該金屬層(3)，使該液相銦鉍合金(2)在該基板(4)上的表面張力降低，該液相銦鉍合金(2)之接觸角不大於50度。 Please refer to the first and second figures, which disclose the first embodiment of the method for reducing the surface tension of the indium-bismuth alloy and the substrate by coating the metal layer of the present invention. The method includes the following steps: first bonding a metal layer (3) to a substrate ( 4) Use a dropper (1) to bond a liquid phase indium-bismuth alloy (2) to the substrate (4) through the metal layer (3), and combine the liquid-phase indium-bismuth alloy (2) and the metal layer (3) Heating to 60°C to 250°C, preferably 100°C. The metal layer (3) is etched by the liquid phase indium-bismuth alloy (2), so that the surface tension of the liquid-phase indium-bismuth alloy (2) on the substrate (4) is reduced, and the liquid-phase indium-bismuth alloy (2) ) The contact angle is not more than 50 degrees.
在本實施例中，該液相銦鉍合金(2)含有67wt%的銦及33wt%的鉍。該液相銦鉍合金(2)不限制必須由該滴管(1)滴於該金屬層(3)上，也可以先將固態的銦鉍合金透過該金屬層(3)貼合於該基板(4)，再將固態的銦鉍合金加熱至熔點以上，使固態的銦鉍合金熔融為該液相銦鉍合金(2)。該金屬層(3)可以是塗料的形式，並塗覆在該基板(4)及/或該液相銦鉍合金(2)上，在本實施例中，該金屬層(3)藉由電鍍的方式塗覆在該基板(4)上。該金屬層(3)為錫層，且該基板(4)的材質為銅質或鋁質，本實施例以銅質的該基板(4)為例，在一般的使用狀態下該金屬層(3)不會產生強烈的氣味，可以避免有使用者感到反感。為了更直觀的表示本發明之功效，以潤濕性做為表面張力的判斷，又潤濕性越大，接觸角會越小，因此，從接觸角的大小即可判斷表面張力。最後觀察該液相銦鉍合金(2)的接觸角大小。 In this embodiment, the liquid phase indium-bismuth alloy (2) contains 67wt% indium and 33wt% bismuth. The liquid-phase indium-bismuth alloy (2) is not limited to be dropped on the metal layer (3) from the dropper (1), and the solid indium-bismuth alloy can also be attached to the substrate through the metal layer (3). (4) The solid indium-bismuth alloy is heated to above the melting point to melt the solid indium-bismuth alloy into the liquid phase indium-bismuth alloy (2). The metal layer (3) can be in the form of paint and coated on the substrate (4) and/or the liquid phase indium-bismuth alloy (2). In this embodiment, the metal layer (3) is electroplated The method is coated on the substrate (4). The metal layer (3) is a tin layer, and the material of the substrate (4) is copper or aluminum. In this embodiment, the copper substrate (4) is taken as an example. In a general use state, the metal layer ( 3) It will not produce a strong odor, which can prevent users from feeling disgusted. In order to show the effect of the present invention more intuitively, the wettability is used as the judgment of the surface tension. The greater the wettability, the smaller the contact angle. Therefore, the surface tension can be judged from the size of the contact angle. Finally, observe the contact angle of the liquid phase indium-bismuth alloy (2).
請參閱第三A圖至第三C圖，並請搭配第一圖，將該液相銦鉍合金(2)透過該金屬層(3)結合於該基板(4)，並藉由烘箱等加溫設備將該液相銦鉍合金(2)及該金屬層(3)加熱至攝氏100度後，當該液相銦鉍合金(2)與該金屬層(3)之間的附著力，大於該液相銦鉍合金(2)分子間之內聚力時，該液相銦鉍合金(2)的表面張力會降低，進而在該金屬層(3)上平展開，提高該液相銦鉍合金(2)對該金屬層(3)的結合能力。由第三A圖可以看出，該液相銦鉍合金(2)剛以該滴管(1)滴於該金屬層(3)上，加熱時間為0分鐘時，該液相銦鉍合金(2)仍無法良好的貼附在該金屬層(3)上。隨著該液相銦鉍合金(2)加熱時間的增長，當加熱時間到9分鐘時，由第三B圖可以看出，相較於0分鐘，已經有更多的該液相銦鉍合金(2)熔蝕該金屬層(3)，該液相銦鉍合金(2)可以更好地貼附在該金屬層(3)上。加熱時間到15分鐘後，由第三C圖可以看出，該液相銦鉍合金(2)幾乎完全貼附在在該 金屬層(3)上，該液相銦鉍合金(2)與該基板(4)之接觸角確實不大於50度，該液相銦鉍合金(2)不易繼續流動，無需擔心該液相銦鉍合金(2)溢出至該基板(4)之外，該液相銦鉍合金(2)降溫至熔點以下而冷卻成為一固相銦鉍合金後，該固相銦鉍合金仍結合於該基板(4)，無分離現象。 Please refer to the third A to the third C, and please match the first picture, the liquid phase indium-bismuth alloy (2) is bonded to the substrate (4) through the metal layer (3), and added by an oven, etc. After heating the liquid-phase indium-bismuth alloy (2) and the metal layer (3) to 100 degrees Celsius, when the adhesion force between the liquid-phase indium-bismuth alloy (2) and the metal layer (3) is greater than When the liquid phase indium-bismuth alloy (2) has intermolecular cohesive force, the surface tension of the liquid-phase indium-bismuth alloy (2) will be reduced, and then it will spread flat on the metal layer (3) to increase the liquid-phase indium-bismuth alloy ( 2) The bonding ability of the metal layer (3). It can be seen from the third figure A that the liquid indium-bismuth alloy (2) has just been dropped on the metal layer (3) with the dropper (1), and the heating time is 0 minutes, the liquid-phase indium-bismuth alloy (2) 2) It still cannot be attached to the metal layer (3) well. As the heating time of the liquid-phase indium-bismuth alloy (2) increases, when the heating time reaches 9 minutes, it can be seen from the third figure B that there are more of the liquid-phase indium-bismuth alloy than 0 minutes. (2) The metal layer (3) is eroded, and the liquid phase indium-bismuth alloy (2) can be better attached to the metal layer (3). After the heating time reaches 15 minutes, it can be seen from the third figure C that the liquid phase indium-bismuth alloy (2) is almost completely attached to the On the metal layer (3), the contact angle between the liquid-phase indium-bismuth alloy (2) and the substrate (4) is indeed not greater than 50 degrees, and the liquid-phase indium-bismuth alloy (2) is not easy to continue to flow, so there is no need to worry about the liquid-phase indium. The bismuth alloy (2) overflows out of the substrate (4), the liquid phase indium-bismuth alloy (2) is cooled to below the melting point and becomes a solid-phase indium-bismuth alloy, the solid-phase indium-bismuth alloy is still bonded to the substrate (4) There is no separation phenomenon.
請參閱第三D圖，並請搭配第一圖，當該接觸角減小，也代表該液相銦鉍合金(2)與該金屬層(3)的接觸面機會增加，由下表一及第三D圖都可以看出，隨著加熱時間的增加，本實施例有更高的熱傳導係數及更低的熱阻值，當該基板(4)為發熱性元件時，該液相銦鉍合金(2)有更好的散熱效果。 Please refer to the third figure D, and please match the first figure. When the contact angle decreases, it also means that the contact surface of the liquid indium-bismuth alloy (2) and the metal layer (3) will increase, as shown in Table 1 and It can be seen from the third figure D that as the heating time increases, this embodiment has a higher thermal conductivity and a lower thermal resistance. When the substrate (4) is a heat generating element, the liquid phase indium bismuth Alloy (2) has better heat dissipation effect.
請參閱第四A圖至第四C圖，並請搭配第一圖，係揭示本發明第二實施例，本實施例與第一實施例不同之處在於：本實施例中，該液相銦鉍合金(2)進一步含有低於40wt%的錫成分，更明確的說，該液相銦鉍合金(2)含有51wt%的銦、32.5wt%的鉍及16.5wt%的錫。與第一實施例相同，將該液相銦鉍合金(2)透過該金屬層(3)結合於該基板(4)，並藉由烘箱等加溫設備將該液相銦鉍合金(2)及該金屬層(3)加熱至攝氏100度後，同樣可以使該液相銦鉍合金(2)在該基板(4)上的表面張力降低，提高該液相銦鉍合金(2)對該金屬層(3)的結合能力。 隨著該液相銦鉍合金(2)加熱時間的增長，相較於第四A圖的0分鐘，加熱到15分鐘後，第四C圖的該液相銦鉍合金(2)在該金屬層(3)上展現了更佳的貼附能力。 Please refer to FIGS. 4A to 4C, together with FIG. 1, to disclose the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that in this embodiment, the liquid phase indium The bismuth alloy (2) further contains less than 40wt% tin. More specifically, the liquid phase indium-bismuth alloy (2) contains 51wt% indium, 32.5wt% bismuth and 16.5wt% tin. As in the first embodiment, the liquid phase indium-bismuth alloy (2) is bonded to the substrate (4) through the metal layer (3), and the liquid-phase indium-bismuth alloy (2) is heated by a heating device such as an oven. And after the metal layer (3) is heated to 100 degrees Celsius, the surface tension of the liquid-phase indium-bismuth alloy (2) on the substrate (4) can also be reduced, and the liquid-phase indium-bismuth alloy (2) against the substrate (4) can be increased. The bonding ability of the metal layer (3). As the heating time of the liquid-phase indium-bismuth alloy (2) increases, compared to 0 minutes in the fourth diagram A, after heating to 15 minutes, the liquid-phase indium-bismuth alloy (2) in the fourth diagram C is in the metal The layer (3) shows better attachment ability.
請參閱第五A圖至第五C圖，並請搭配第一圖，係揭示本發明第三實施例，本實施例與第二實施例不同之處在於：本實施例中，該液相銦鉍合金(2)的成分比例與第二實施例不同，更明確的說，該液相銦鉍合金(2)含有25wt%的銦、57wt%的鉍及18wt%的錫。與第二實施例相同，將該液相銦鉍合金(2)透過該金屬層(3)結合於該基板(4)，並藉由烘箱等加溫設備將該液相銦鉍合金(2)及該金屬層(3)加熱至攝氏100度後，同樣可以使該液相銦鉍合金(2)在該基板(4)上的表面張力降低，提高該液相銦鉍合金(2)對該金屬層(3)的結合能力。隨著該液相銦鉍合金(2)加熱時間的增長，當加熱時間到15分鐘後，由第五C圖可以看出，該液相銦鉍合金(2)幾乎完全貼附在在該金屬層(3)上。 Please refer to FIG. 5A to FIG. 5C, together with FIG. 1, to disclose the third embodiment of the present invention. The difference between this embodiment and the second embodiment is that in this embodiment, the liquid phase indium The composition ratio of the bismuth alloy (2) is different from that of the second embodiment. More specifically, the liquid phase indium-bismuth alloy (2) contains 25wt% indium, 57wt% bismuth and 18wt% tin. As in the second embodiment, the liquid phase indium-bismuth alloy (2) is bonded to the substrate (4) through the metal layer (3), and the liquid-phase indium-bismuth alloy (2) is heated by a heating device such as an oven. And after the metal layer (3) is heated to 100 degrees Celsius, the surface tension of the liquid-phase indium-bismuth alloy (2) on the substrate (4) can also be reduced, and the liquid-phase indium-bismuth alloy (2) against the substrate (4) can be increased. The bonding ability of the metal layer (3). With the increase of the heating time of the liquid phase indium-bismuth alloy (2), when the heating time reaches 15 minutes, it can be seen from the fifth figure C that the liquid-phase indium-bismuth alloy (2) is almost completely attached to the metal On layer (3).
請參閱第六圖，並請搭配第一圖，係揭示本發明第四實施例，本實施例與第一實施例不同之處在於：本實施例中，該金屬層(3)為銦層。由第六圖中可以清楚看出，在上方的該液相銦鉍合金(2)經過長時間加熱後，該液相銦鉍合金(2)可以良好地附著於該金屬層(3)，無論該金屬層(3)為錫層或銦層，本發明都可以確實達到降低該液相銦鉍合金(2)表面張力的功效。 Please refer to the sixth figure, in conjunction with the first figure, to disclose the fourth embodiment of the present invention. The difference between this embodiment and the first embodiment is that in this embodiment, the metal layer (3) is an indium layer. It can be clearly seen from the sixth figure that after the liquid phase indium-bismuth alloy (2) above is heated for a long time, the liquid phase indium-bismuth alloy (2) can be well attached to the metal layer (3), regardless of The metal layer (3) is a tin layer or an indium layer, and the present invention can indeed achieve the effect of reducing the surface tension of the liquid phase indium-bismuth alloy (2).
請參閱第七圖，使用前述塗覆金屬層降低銦鉍合金與基板表面張力方法，可以製造出一複合材。以第一實施例為例，在該基板(4)上電鍍該金屬層(3)後，以該滴管(1)將該液相銦鉍合金(2)滴於該金屬層(3)，該液相銦鉍合金(2)會熔蝕該金屬層(3)，並擴散或進入該金屬層(3)而到達該基板(4)表面，降低該液相銦鉍合金(2)的表面張力，該液相銦鉍合金(2)、該金屬層(3)及該基板(4)會共同形成該複合材。更詳細的說，該金屬層(3)與該基板(4)之間是低強度界面， 利用該金屬層(3)保留該基板(4)電鍍過程的乾淨表面，該液相銦鉍合金(2)接觸該金屬層(3)後會熔蝕該金屬層(3)，等到該液相銦鉍合金(2)突破該金屬層(3)後，該金屬層(3)會上浮，而該液相銦鉍合金(2)則會更快且更容易接觸到該基板(4)的乾淨表面，冷卻凝固焊接形成金屬鍵結，可以提高潤濕該基板(4)的效果，形成接合更好的該液相銦鉍合金(2)/該基板(4)界面，無論該液相銦鉍合金(2)是否冷卻都不易與該基板(4)分離，第七圖僅以該液相銦鉍合金(2)突破該金屬層(3)後接觸該基板(4)的情形做簡單示意。該複合材可以用於散熱或連結不同裝置，並藉由該液相銦鉍合金(2)由固相轉液相的相變化形成一導熱通道填補不同裝置之間的縫隙以傳導熱能。 Please refer to the seventh figure. Using the aforementioned method of coating the metal layer to reduce the surface tension of the indium-bismuth alloy and the substrate, a composite material can be manufactured. Taking the first embodiment as an example, after the metal layer (3) is electroplated on the substrate (4), the liquid-phase indium-bismuth alloy (2) is dropped onto the metal layer (3) using the dropper (1), The liquid-phase indium-bismuth alloy (2) will ablate the metal layer (3) and diffuse or enter the metal layer (3) to reach the surface of the substrate (4), lowering the surface of the liquid-phase indium-bismuth alloy (2) Under tension, the liquid phase indium-bismuth alloy (2), the metal layer (3) and the substrate (4) will form the composite material together. In more detail, there is a low-strength interface between the metal layer (3) and the substrate (4), The metal layer (3) is used to keep the clean surface of the substrate (4) during the electroplating process. The liquid phase indium-bismuth alloy (2) will etch the metal layer (3) after contacting the metal layer (3), and wait until the liquid phase After the indium-bismuth alloy (2) breaks through the metal layer (3), the metal layer (3) will float up, and the liquid-phase indium-bismuth alloy (2) will be faster and easier to access the cleanness of the substrate (4) Surface, cooling and solidification welding to form a metal bond, which can improve the effect of wetting the substrate (4), and form a better bonding liquid phase indium-bismuth alloy (2)/substrate (4) interface, regardless of the liquid-phase indium-bismuth alloy (2)/substrate (4) interface The alloy (2) is not easy to separate from the substrate (4) whether it is cooled or not. The seventh figure only illustrates the situation where the liquid phase indium-bismuth alloy (2) breaks through the metal layer (3) and then contacts the substrate (4). The composite material can be used to dissipate heat or connect different devices, and a heat conduction channel is formed by the phase change of the liquid phase indium-bismuth alloy (2) from a solid phase to a liquid phase to fill gaps between different devices to conduct heat energy.
在該複合材中，即使該液相銦鉍合金(2)降溫至熔點以下而冷卻成為該固相銦鉍合金，該固相銦鉍合金仍會與該基板(4)維持結合，該金屬層(3)確實有幫助該固相銦鉍合金及該液相銦鉍合金(2)該結合在該基板(4)的功效。在該固相銦鉍合金應用在導熱的情況下，若是該固相銦鉍合金未維持附著在該基板(4)上而與該基板(4)分離，會使空氣導入至該固相銦鉍合金與該基板(4)之間的縫隙中，下次該基板(4)發熱時，這些導熱率僅有0.024W/mK的空氣將隔絕該固相銦鉍合金的熱能傳遞，即使該固相銦鉍合金重新熔融為該液相銦鉍合金(2)而形成該導熱通道，這些空氣仍然可能會阻擋該導熱通道的熱能傳遞，並使該固相銦鉍合金更不容易附著在該基板(4)上，進而導入更多空氣，如此惡性循環，將導致該基板(4)因無法良好散熱而過熱毀損。 In the composite material, even if the liquid phase indium-bismuth alloy (2) is cooled below the melting point and becomes the solid-phase indium-bismuth alloy, the solid-phase indium-bismuth alloy will still maintain the bond with the substrate (4), and the metal layer (3) It does help the solid phase indium-bismuth alloy and the liquid phase indium-bismuth alloy (2) be combined with the substrate (4). In the case that the solid-phase indium-bismuth alloy is used for heat conduction, if the solid-phase indium-bismuth alloy is not maintained attached to the substrate (4) and separated from the substrate (4), air will be introduced into the solid-phase indium-bismuth In the gap between the alloy and the substrate (4), the next time the substrate (4) heats up, the air with a thermal conductivity of only 0.024W/mK will isolate the heat transfer of the solid-phase indium-bismuth alloy, even if the solid-phase The indium-bismuth alloy is re-melted into the liquid-phase indium-bismuth alloy (2) to form the heat-conducting channel. The air may still block the heat transfer of the heat-conducting channel and make the solid-phase indium-bismuth alloy more difficult to adhere to the substrate ( 4), and then introduce more air. Such a vicious circle will cause the substrate (4) to be overheated and damaged due to inability to dissipate heat well.
請參閱第八圖至第十圖，並請搭配第一圖，第八圖至第十圖分別係不同實施例下之該液相銦鉍合金(2)由掃描式顯微鏡觀察的微結構組織照片。第八圖是以67wt%的銦及33wt%的鉍共晶形成的該液相銦鉍合金(2)，熔點在70 ℃，將第八圖以能量色散X射線譜(Energy-dispersive X-rayspectroscopy,EDS)分析後，白灰色基地相的成分百分比為銦：鉍=68.57：31.43，符合相圖的BiIn2相。第九圖是51wt%的銦、32.5wt%的鉍及16.5wt%的錫共晶形成的該液相銦鉍合金(2)，熔點在60℃，此時該液相銦鉍合金(2)的原子百分比為銦：鉍：錫=60.1：21.1：18.8，而將第九圖以EDS分析後，白灰色基地相的成分百分比為銦：鉍：錫=62.2：23.5：14.46，符合三相圖的BiIn2相。第十圖是以25wt%的銦、57wt%的鉍及18wt%的錫共晶形成的該液相銦鉍合金(2)，熔點在80℃，而將第十圖以EDS分析後，白灰色基地相的成分百分比為銦：鉍：錫=46.76：50.84：2.4，符合三相圖的BiIn相。由以上分析可以得知，該固態夾層的基地相確實為BiIn2相或BiIn相。 Please refer to the eighth to tenth figures, and please match the first figure. The eighth to tenth figures are the microstructure photos of the liquid phase indium-bismuth alloy (2) under different embodiments, respectively, observed by scanning microscope . The eighth figure is the liquid phase indium-bismuth alloy (2) formed by 67wt% indium and 33wt% bismuth eutectic, the melting point is 70 ℃, and the eighth figure is the energy-dispersive X-ray spectroscopy (Energy-dispersive X-rayspectroscopy). ,EDS) After analysis, the composition percentage of the white-gray base phase is indium:bismuth=68.57:31.43, which is in line with the BiIn 2 phase of the phase diagram. The ninth figure shows the liquid-phase indium-bismuth alloy (2) formed by the eutectic of 51wt% indium, 32.5wt% bismuth and 16.5wt% tin, with a melting point of 60°C. At this time, the liquid-phase indium-bismuth alloy (2) The atomic percentage of is indium:bismuth:tin=60.1:21.1:18.8, and after the ninth figure is analyzed by EDS, the composition percentage of the white-gray base phase is indium:bismuth:tin=62.2:23.5:14.46, which conforms to the three-phase diagram BiIn 2 phase. The tenth figure is the liquid phase indium-bismuth alloy (2) formed by 25wt% indium, 57wt% bismuth and 18wt% tin eutectic, the melting point is 80℃, and the tenth figure is white-gray after EDS analysis The composition percentage of the base phase is indium: bismuth: tin = 46.76: 50.84: 2.4, which conforms to the BiIn phase of the three-phase diagram. From the above analysis, it can be known that the base phase of the solid interlayer is indeed BiIn 2 phase or BiIn phase.
綜合上述實施例之說明，當可充分瞭解本發明之操作、使用及本發明產生之功效，惟以上所述實施例僅係為本發明之較佳實施例，當不能以此限定本發明實施之範圍，即依本發明申請專利範圍及發明說明內容所作簡單的等效變化與修飾，皆屬本發明涵蓋之範圍內。 Based on the description of the above embodiments, when one can fully understand the operation and use of the present invention and the effects of the present invention, but the above embodiments are only the preferred embodiments of the present invention, and the implementation of the present invention cannot be limited by this. The scope, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the description of the invention, are all within the scope of the present invention.
1:滴管 1: Dropper
2:液相銦鉍合金 2: Liquid phase indium-bismuth alloy
3:金屬層 3: Metal layer
4:基板 4: substrate
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