TWI724432B - Automatic detection system and method - Google Patents

Automatic detection system and method Download PDF

Info

Publication number
TWI724432B
TWI724432B TW108119834A TW108119834A TWI724432B TW I724432 B TWI724432 B TW I724432B TW 108119834 A TW108119834 A TW 108119834A TW 108119834 A TW108119834 A TW 108119834A TW I724432 B TWI724432 B TW I724432B
Authority
TW
Taiwan
Prior art keywords
status screen
distance
production line
tested
photographing device
Prior art date
Application number
TW108119834A
Other languages
Chinese (zh)
Other versions
TW202046110A (en
Inventor
陳劍威
賈博淵
Original Assignee
撼訊科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 撼訊科技股份有限公司 filed Critical 撼訊科技股份有限公司
Priority to TW108119834A priority Critical patent/TWI724432B/en
Publication of TW202046110A publication Critical patent/TW202046110A/en
Application granted granted Critical
Publication of TWI724432B publication Critical patent/TWI724432B/en

Links

Images

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)

Abstract

一種自動化檢測系統,包括:一產線,包括一感應區以及一檢測區;至少一感應器,該至少一感應器感應藉由該產線輸送的至少一待測物品;至少一補光元件,在該檢測區中設置於該產線的上方及/或側邊;一第一攝影裝置,在該檢測區中以一第一距離設置於該產線的上方,該第一攝影裝置獲取該至少一待測物品的上方狀態畫面;一第二攝影裝置,在該檢測區中以一第二距離設置於該產線的側邊,該第二攝影裝置獲取該至少一待測物品的側邊狀態畫面;以及一計算機裝置,該計算機裝置接收該上方狀態畫面及該側邊狀態畫面,並對該上方狀態畫面及該側邊狀態畫面進行影像辨識。 An automated detection system includes: a production line, including a sensing area and a detection area; at least one sensor, the at least one sensor sensing at least one item to be tested conveyed by the production line; at least one light-filling element, Is arranged above and/or on the side of the production line in the detection zone; a first photographing device is arranged above the production line at a first distance in the detection zone, and the first photographing device captures the at least A picture of the upper state of the item to be tested; a second camera device, which is set on the side of the production line at a second distance in the detection area, and the second camera device acquires the side state of the at least one item to be tested Screen; and a computer device that receives the upper status screen and the side status screen, and performs image recognition on the upper status screen and the side status screen.

Description

自動化檢測系統及其方法Automatic detection system and method

本發明係一種自動化檢測系統及檢測方法,具體而言,係一種藉由影像辨識來檢測各種電子產品的元件的安裝狀態的自動化檢測系統及方法。The present invention is an automatic detection system and detection method, specifically, an automatic detection system and method for detecting the installation status of various electronic products through image recognition.

顯示卡,是個人電腦裝置最基本組成部分之一,用途是將電腦系統所需要的顯示資訊進行轉換驅動顯示器,並向顯示器提供逐行或隔行掃描訊號,控制顯示器的正確顯示,是連接顯示器和個人電腦主機板的重要元件,且是「人機對話」的重要裝置之一。再者,現場可程式化邏輯閘陣列(Field Programmable Gate Array, FPGA),它是在PAL、GAL、CPLD等可程式邏輯裝置的基礎上進一步發展的產物。它是作為特殊應用積體電路領域中的一種半客製化電路而出現的,既解決了全客製化電路的不足,又克服了原有可程式化邏輯裝置閘電路數有限的缺點。The graphics card is one of the most basic components of personal computer devices. It is used to convert the display information required by the computer system to drive the display, and to provide progressive or interlaced scanning signals to the display to control the correct display of the display. It is to connect the display and An important component of the personal computer motherboard, and one of the important devices of "human-machine dialogue". Furthermore, Field Programmable Gate Array (FPGA) is a product of further development on the basis of programmable logic devices such as PAL, GAL, and CPLD. It emerged as a semi-customized circuit in the field of special application integrated circuits, which not only solves the shortcomings of fully customized circuits, but also overcomes the shortcomings of the limited number of gate circuits of the original programmable logic device.

顯示卡及FPGA在運作時皆會產生高溫,導致內部元件,尤其是運算晶片的溫度升高,若顯示卡及FPGA的散熱部件未安裝好,將導致顯示卡及FPGA因高溫而熱當機。因此,在目前顯示卡及FPGA的製程中,通常是利用人工檢測方式來確認每張顯示卡及FPGA的散熱部件是否安裝正確。然而,在上述的人工檢測方式中,往往會發生漏看的情況,導致有不良品卻未檢出的情形發生。此外,人工檢測方式會導致檢測時間拉長,進而導致產能下降。The graphics card and FPGA will generate high temperature during operation, causing the temperature of internal components, especially the computing chip, to rise. If the heat dissipation components of the graphics card and FPGA are not installed properly, the graphics card and FPGA will become hot and crash due to the high temperature. Therefore, in the current manufacturing process of display cards and FPGAs, manual inspection is usually used to confirm whether the heat dissipation components of each display card and FPGA are installed correctly. However, in the above-mentioned manual detection methods, there are often cases of omissions, resulting in the occurrence of defective products but not detected. In addition, manual inspection methods will lead to a longer inspection time, which in turn leads to a decrease in production capacity.

基於上述原因,如何發明一種自動化檢測系統及檢測方法,能夠快速且有效的對顯示卡及FPGA自動進行檢測,乃是待解決的問題。Based on the above reasons, how to invent an automatic detection system and detection method that can quickly and effectively automatically detect the display card and FPGA is a problem to be solved.

為達成前述目的,本發明係提供一種自動化檢測系統,包括:一產線,包括一感應區以及一檢測區;至少一感應器,在感應區處設置於鄰近該產線的位置,該至少一感應器感應藉由該產線輸送的至少一待測物品;至少一補光元件,在該檢測區中設置於該產線的上方及/或側邊;一第一攝影裝置,在該檢測區中以一第一距離設置於該產線的上方,該第一攝影裝置獲取該至少一待測物品的上方狀態畫面;一第二攝影裝置,在該檢測區中以一第二距離設置於該產線的側邊,該第二攝影裝置獲取該至少一待測物品的側邊狀態畫面;以及一計算機裝置,電性連接至該至少一感應器、該至少一補光元件、該第一攝影裝置及該第二攝影裝置,該計算機裝置接收該上方狀態畫面及該側邊狀態畫面,並對該上方狀態畫面及該側邊狀態畫面進行影像辨識。In order to achieve the foregoing objective, the present invention provides an automated inspection system, including: a production line, including a sensing area and a detection area; at least one sensor is arranged in the sensing area adjacent to the production line, the at least one The sensor senses at least one item to be tested conveyed by the production line; at least one supplemental light element is arranged above and/or on the side of the production line in the detection zone; and a first photographing device is in the detection zone Is set above the production line at a first distance, and the first camera device acquires the upper status image of the at least one item to be tested; a second camera device is set at the inspection area at a second distance On the side of the production line, the second camera device acquires the side status screen of the at least one object to be tested; and a computer device electrically connected to the at least one sensor, the at least one light-filling element, and the first camera Device and the second photographing device, the computer device receives the upper status screen and the side status screen, and performs image recognition on the upper status screen and the side status screen.

再者,本發明的自動化檢測系統進一步包括一機械手臂,該機械手臂電性連接置該計算機裝置,且該機械手臂在該檢測區中設置於該產線的側邊,該第二攝影裝置設置於該機械手臂上,該第二攝影裝置藉由該機械手臂的移動而與該至少一待測物品保持該第二距離。Furthermore, the automated inspection system of the present invention further includes a mechanical arm which is electrically connected to the computer device, and the mechanical arm is arranged on the side of the production line in the inspection area, and the second photographing device is arranged On the robotic arm, the second photographing device maintains the second distance from the at least one object to be tested by the movement of the robotic arm.

較佳地,該待測物品為顯示卡或現場可程式化邏輯閘陣列,該上方狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的風扇狀態畫面,該側邊狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的晶片與匯散熱排之間的安裝狀態畫面。Preferably, the object to be tested is a display card or a field programmable logic gate array, the upper status screen is a fan status screen of the display card or the field programmable logic gate array, and the side state screen is the display The installation status screen between the card or the chip of the on-site programmable logic gate array and the bus radiator.

較佳地,該第一距離及該第二距離為10-22.99公分中的任一數值。Preferably, the first distance and the second distance are any value from 10 to 22.99 cm.

較佳地,該第一距離及該第二距離為15公分。Preferably, the first distance and the second distance are 15 cm.

另一方面,本發明亦提供一種自動化檢測方法,包括以下步驟:藉由一產線輸送至少一待測物品,該產線包括一感應區及一檢測區;藉由設置於該感應區的至少一感應器感應該至少一待測物品,且當該至少一感應器感應到該至少一待測物品時會開啟至少一補光元件,其中,該至少一補光元件設置於該檢測區的上方及/或側邊;在該檢測區中藉由設置於該產線上方一第一距離處的一第一攝影裝置擷取該至少一待測物品的上方狀態畫面;在該檢測區中藉由設置於該產線側邊一第二距離處的一第二攝影裝置擷取該至少一待測物品的側邊狀態畫面;以及藉由一計算機裝置接收該上方狀態畫面及該側邊狀態畫面,並對該上方狀態畫面及該側邊狀態畫面進行影像辨識,其中,該計算機裝置電性連接至該至少一感應器、該至少一補光元件、該第一攝影裝置及該第二攝影裝置。On the other hand, the present invention also provides an automated inspection method, including the following steps: conveying at least one object to be tested by a production line, the production line including a sensing area and a detection area; by at least set in the sensing area A sensor senses the at least one object to be tested, and when the at least one sensor senses the at least one object to be tested, at least one light supplement element is turned on, wherein the at least one light supplement element is disposed above the detection area And/or side; in the detection area, by a first camera set at a first distance above the production line, capture the upper status screen of the at least one item to be tested; in the detection area by A second camera device arranged at a second distance from the side of the production line captures the side status screen of the at least one item to be tested; and receives the upper status screen and the side status screen by a computer device, And perform image recognition on the upper status screen and the side status screen, wherein the computer device is electrically connected to the at least one sensor, the at least one light-filling element, the first photographing device and the second photographing device.

較佳地,該待測物品為顯示卡或現場可程式化邏輯閘陣列,該上方狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的風扇狀態畫面,該側邊狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的晶片與匯散熱排之間的安裝狀態畫面。Preferably, the object to be tested is a display card or a field programmable logic gate array, the upper status screen is a fan status screen of the display card or the field programmable logic gate array, and the side state screen is the display The installation status screen between the card or the chip of the on-site programmable logic gate array and the bus radiator.

較佳地,該計算機裝置接收到該安裝狀態畫面後,該計算機裝置在該安裝狀態畫面中設置一邊界框,並藉由該邊界框中的間隙量與該邊界框的長寬比例進行迴歸分析,以判定該晶片與該匯散熱排之間的安裝是否正確及該晶片與該匯散熱排之間的散熱膏是否塗裝完整。Preferably, after the computer device receives the installation status screen, the computer device sets a bounding box in the installation status screen, and performs regression analysis based on the gap amount in the bounding frame and the ratio of the length and width of the bounding frame , To determine whether the mounting between the chip and the heat sink is correct and whether the heat sink paste between the chip and the heat sink is completely painted.

較佳地,該第一距離及該第二距離為10-22.99公分中的任一數值。Preferably, the first distance and the second distance are any value from 10 to 22.99 cm.

較佳地,該第一距離及該第二距離為15公分。Preferably, the first distance and the second distance are 15 cm.

以下配合圖式及元件符號對本發明之實施方式做更詳細的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。The following describes the implementation of the present invention in more detail with the drawings and component symbols, so that those who are familiar with the art can implement it after studying this specification.

圖1為一俯視示意圖,用以說明本發明一實施例的自動化檢測系統的結構。請參照圖1,在本發明一實施例中, 自動化檢測系統1包括一產線10、至少一感應器20、至少一補光元件30、一第一攝影裝置40、一第二攝影裝置50以及一計算機裝置(未於圖中示出)。FIG. 1 is a schematic top view to illustrate the structure of an automated inspection system according to an embodiment of the present invention. 1, in an embodiment of the present invention, the automated inspection system 1 includes a production line 10, at least one sensor 20, at least one light-filling element 30, a first photographing device 40, a second photographing device 50, and A computer device (not shown in the figure).

產線10包括一感應區101以及一檢測區103。至少一感應器20在感應區101處設置鄰近於產線10的位置,例如產線10的上方、側邊等,在圖1中是示出設置於產線10的上方。至少一感應器20可感應藉由產線10所輸送的至少一待測物品60,其中,在產線10的感應區101中,至少一感應器20可藉由至少一支架或滑軌(未示於圖中)裝置而設置於產線10的上方或側邊,且感應器20的數量可為一個以上。舉例而言,感應器20可為一紅外線感應器,當至少一待測物品60經過感應器20時,感應器20可感應到至少一待測物品60。The production line 10 includes a sensing area 101 and a detection area 103. At least one sensor 20 is disposed at a position adjacent to the production line 10 at the sensing area 101, such as above or on the side of the production line 10. In FIG. 1, it is shown to be disposed above the production line 10. At least one sensor 20 can sense at least one object to be tested 60 conveyed by the production line 10, wherein in the sensing area 101 of the production line 10, at least one sensor 20 can be driven by at least one bracket or slide rail (not shown) The device shown in the figure) is arranged above or on the side of the production line 10, and the number of the sensor 20 can be more than one. For example, the sensor 20 can be an infrared sensor. When at least one object 60 to be tested passes the sensor 20, the sensor 20 can sense at least one object 60 to be tested.

至少一補光元件30設置於檢測區103的上方及/或側邊,第一攝影裝置40在檢測區103中以一第一距離設置於產線10的上方,第二攝影裝置50在檢測區103中以一第二距離設置於產線10的側邊。換言之,第一攝影機40及第二攝影機50可選擇性地搭配一補光元件30而設置於產線10的上方及側邊,以進一步獲取進入檢測區103的至少一待測物品60的狀態畫面。At least one supplemental light element 30 is arranged above and/or on the side of the detection area 103. The first photography device 40 is arranged above the production line 10 at a first distance in the detection area 103, and the second photography device 50 is in the detection area. 103 is arranged on the side of the production line 10 at a second distance. In other words, the first camera 40 and the second camera 50 can be optionally combined with a supplementary light element 30 to be arranged above and on the side of the production line 10 to further obtain the status picture of the at least one object under test 60 entering the inspection area 103 .

計算機裝置是電性連接至感應器20、至少一補光元件30、第一攝影裝置40及第二攝影裝置50,當感應器20感應到待測物品60後,會傳訊息以通知該計算機裝置,進而藉由該計算機裝置開啟至少一補光元件30、第一攝影裝置40及第二攝影裝置50,以藉由第一攝影裝置40及第二攝影裝置50獲取進入檢測區103的待測物品60的狀態畫面。再者,該計算機裝置可接收第一攝影裝置40及第二攝影裝置50所獲取到的狀態畫面,並對該狀態畫面進行影像辨識,以判斷待測物品60的元件安裝是否正確。The computer device is electrically connected to the sensor 20, at least one supplemental light element 30, the first photographing device 40 and the second photographing device 50. When the sensor 20 detects the object to be tested 60, it will send a message to notify the computer device , And then turn on at least one light-filling element 30, the first photographing device 40, and the second photographing device 50 by the computer device, so that the first photographing device 40 and the second photographing device 50 can obtain the item to be tested entering the detection area 103 60's status screen. Furthermore, the computer device can receive the status images acquired by the first camera 40 and the second camera 50, and perform image recognition on the status images to determine whether the components of the test object 60 are installed correctly.

圖2為一示意圖,用以說明本發明一實施例的檢測區的結構。請參照圖1及圖2,第一攝影裝置40在檢測區103中是以一第一距離D1設置於產線10的上方,第二攝影裝置50在檢測區103中則是以一第二距離D2設置於產線10的側邊。當待測物品60經過感應器20並進入檢測區103後,設置於產線10上方的第一攝影裝置40可藉由補光元件30的補光並獲取待測物品60的上方狀態畫面,設置於產線10側邊的第二攝影裝置50可藉由補光元件30的補光並獲取待測物品60的側邊狀態畫面。FIG. 2 is a schematic diagram for explaining the structure of the detection area according to an embodiment of the present invention. 1 and 2, the first photographing device 40 is located above the production line 10 at a first distance D1 in the detection area 103, and the second photographing device 50 is located at a second distance in the detection area 103 D2 is set on the side of the production line 10. After the object under test 60 passes through the sensor 20 and enters the detection area 103, the first photographing device 40 arranged above the production line 10 can obtain the upper status screen of the object under test 60 through the supplement light of the light supplement element 30, and set The second photographing device 50 on the side of the production line 10 can obtain the side state image of the object to be tested 60 by using the supplementary light of the supplementary light element 30.

值得一提的是,第一距離D1及第二距離D2對本發明而言非常重要,若第一距離D1及第二距離D2的數值設置錯誤,將導致第一攝影裝置40及第二攝影裝置50獲取到的畫面不清楚,進而無法讓計算機裝置進行影像辨識。因此,在本發明一實施例中,是將第一距離D1及第二距離D2分別設置為10-22.99公分中的任一數值,在本發明較佳的實施例中,是將第一距離D1及第二距離D2皆設置為15公分,如此的距離能使第一攝影裝置40及第二攝影裝置50獲取到最佳的狀態畫面。It is worth mentioning that the first distance D1 and the second distance D2 are very important to the present invention. If the values of the first distance D1 and the second distance D2 are set incorrectly, the first camera 40 and the second camera 50 will be caused. The obtained picture is unclear, and the computer device cannot be used for image recognition. Therefore, in an embodiment of the present invention, the first distance D1 and the second distance D2 are respectively set to any value in the range of 10-22.99 cm. In a preferred embodiment of the present invention, the first distance D1 The distance D2 and the second distance D2 are both set to 15 cm. Such a distance can enable the first photographing device 40 and the second photographing device 50 to obtain the best picture.

另一方面,本發明可藉由第一攝影裝置40及第二攝影裝置50之坐標整合來達成兩台攝影機顯示追蹤資訊之整合,以進行待測物品60的位置判別。On the other hand, the present invention can achieve the integration of the tracking information displayed by the two cameras by integrating the coordinates of the first camera 40 and the second camera 50 to determine the position of the object 60 under test.

圖3A為一示意圖,用以說明本發明一實施例的第一攝影裝置所擷取的畫面。請參照圖3A,在本發明一實施例中,待測物品60可為顯示卡或現場可程式化邏輯閘陣列,在圖3A中是以顯示卡為例,且圖3A示出的即是第一攝影裝置40所獲取待測物品60的上方狀態畫面,該上方狀態畫面為顯示卡60的風扇601狀態畫面,該計算機裝置接收到風扇601狀態畫面後可對風扇601狀態畫面進行影像辨識,以判斷風扇601的狀態是否良好,例如是否有出現破損等缺陷。FIG. 3A is a schematic diagram illustrating a picture captured by the first camera device according to an embodiment of the invention. Please refer to FIG. 3A. In an embodiment of the present invention, the item to be tested 60 may be a display card or a field programmable logic gate array. In FIG. 3A, the display card is taken as an example. A photographing device 40 obtains an upper status screen of the object to be tested 60. The upper status screen is the fan 601 status screen of the display card 60. After receiving the fan 601 status screen, the computer device can perform image recognition on the fan 601 status screen. It is determined whether the condition of the fan 601 is good, for example, whether there are defects such as breakage.

再者,圖3B為一示意圖,用以說明本發明一實施例的第二攝影裝置所獲取的畫面。請參照圖3B,圖3B示出的即是第二攝影裝置50所獲取的待測物品60的側邊狀態畫面,該側邊狀態畫面為顯示卡60的晶片603及匯散熱排605之間的安裝狀態畫面,該計算機裝置接收到晶片603及匯散熱排605之間的安裝狀態畫面後可對晶片603及匯散熱排605之間的安裝狀態畫面進行影像辨識,以判斷晶片603及匯散熱排605之間的安裝狀態是否良好,例如散熱膏是否未塗好或晶片603及匯散熱排605之間是否有出現空隙。Furthermore, FIG. 3B is a schematic diagram for explaining a picture obtained by the second photographing device according to an embodiment of the present invention. Please refer to FIG. 3B. FIG. 3B shows the side status screen of the object to be tested 60 acquired by the second photographing device 50. The side status screen is the image between the chip 603 of the display card 60 and the bus radiator 605. The installation status screen. After the computer device receives the installation status screen between the chip 603 and the bus radiator 605, it can perform image recognition on the installation status screen between the chip 603 and the bus radiator 605 to determine the chip 603 and the bus radiator 605. Whether the installation state between 605 is good, for example, whether the thermal grease is not applied well or whether there is a gap between the chip 603 and the heat sink 605.

進一步地說明,該計算機裝置在對晶片603及匯散熱排605之間的安裝狀態畫面進行影像辨識時,該計算機裝置會藉由在該安裝狀態畫面中設置一邊界框70,並藉由邊界框70中的間隙量與邊界框70的長寬比例進行迴歸分析,以判定晶片603與匯散熱排605之間的安裝是否正確及晶片603與匯散熱排605之間的散熱膏是否塗裝完整。其中,邊界框70的長寬比例是預先設定於該計算機裝置中,邊界框70中的間隙量意指的是晶片603與匯散熱排605之間的空隙大小,若晶片603與匯散熱排605之間有空隙,光線即可穿過該空隙,進而使得空隙的影像被捕捉到,該計算機裝置即可藉由邊界框70的長寬比例來判斷空隙的大小,若空隙大小超過一預設值即判定為不良品。由此可知,圖3B示出即為晶片603與匯散熱排605判定為良品的畫面,因晶片603與匯散熱排605之間並未辨識到空隙。To further explain, when the computer device is performing image recognition on the installation status screen between the chip 603 and the bus radiator 605, the computer device will set a boundary frame 70 in the installation status screen and use the boundary frame The gap amount in 70 and the ratio of length to width of the bounding box 70 are subjected to regression analysis to determine whether the mounting between the chip 603 and the heat sink 605 is correct, and whether the thermal paste between the chip 603 and the heat sink 605 is completely coated. Wherein, the aspect ratio of the bounding box 70 is preset in the computer device, and the gap in the bounding box 70 refers to the size of the gap between the chip 603 and the bus bar 605. If the chip 603 and the bus bar 605 are If there is a gap, the light can pass through the gap, so that the image of the gap is captured. The computer device can determine the size of the gap by the aspect ratio of the bounding box 70. If the gap size exceeds a preset value That is, it is judged as defective. From this, it can be seen that FIG. 3B shows a picture where the chip 603 and the bus bar 605 are judged to be good, because the gap between the chip 603 and the bus bar 605 is not identified.

此外,該計算機裝置可藉由第一攝影裝置40及第二攝影裝置50來計算產線10上待測物品60之平面位置和坐標,以在第二攝影裝置50所獲取到的畫面中設置邊界框70。In addition, the computer device can use the first camera device 40 and the second camera device 50 to calculate the plane position and coordinates of the object 60 on the production line 10 to set the boundary in the frame obtained by the second camera device 50 Box 70.

圖4A為一示意圖,用以說明本發明另一實施例的第一攝影裝置所擷取的畫面。請參照圖4A,在本發明另一實施例中,待測物品60可為顯示卡或現場可程式化邏輯閘陣列,在圖4A中是以顯示卡為例,且圖4A示出的即是第一攝影裝置40所獲取待測物品60的上方狀態畫面,該上方狀態畫面為顯示卡60的風扇601狀態畫面,該計算機裝置接收到風扇601狀態畫面後可對風扇601狀態畫面進行影像辨識,以判斷風扇601的狀態是否良好,例如是否有出現破損等缺陷。FIG. 4A is a schematic diagram for illustrating a screen captured by the first photographing device according to another embodiment of the present invention. Please refer to FIG. 4A. In another embodiment of the present invention, the object to be tested 60 may be a display card or an on-site programmable logic gate array. In FIG. 4A, the display card is taken as an example, and what is shown in FIG. 4A is The first photographing device 40 obtains the upper status screen of the object to be tested 60. The upper status screen is the fan 601 status screen of the display card 60. After receiving the fan 601 status screen, the computer device can perform image recognition on the fan 601 status screen. To determine whether the state of the fan 601 is good, for example, whether there are defects such as breakage.

再者,圖4B為一示意圖,用以說明本發明另一實施例的第二攝影裝置所獲取的畫面。請參照圖4B,圖4B示出的即是第二攝影裝置50所獲取待測物品60的側邊狀態畫面,該側邊狀態畫面為顯示卡60的晶片603及匯散熱排605之間的安裝狀態畫面,且在該安裝狀態畫面中,晶片603與匯散熱排605之間具有空隙607。在此實施例中,光線會穿過空隙607,進而使得空隙607的影像被捕捉到,該計算機裝置即可藉由邊界框70的長寬比例來判斷空隙607的大小,若空隙607大小超過一預設值即判定為不良品,在本發明一實施例中,空隙大小的預設值為2mm,若空隙607的大小超過2mm,表示晶片603與匯散熱排605之間未正確安裝或散熱膏的厚度不足,因此經該計算機裝置的影像辨識後會判定為不良品。Furthermore, FIG. 4B is a schematic diagram for explaining a picture obtained by the second photographing device according to another embodiment of the present invention. Please refer to FIG. 4B. FIG. 4B shows the side status screen of the object to be tested 60 obtained by the second camera device 50. The side status screen shows the installation between the chip 603 of the display card 60 and the heat sink 605. The status screen, and in the installation status screen, there is a gap 607 between the chip 603 and the bus bar 605. In this embodiment, the light passes through the gap 607, so that the image of the gap 607 is captured. The computer device can determine the size of the gap 607 by the aspect ratio of the bounding box 70. If the gap 607 is larger than one The default value is judged to be a defective product. In an embodiment of the present invention, the default value of the gap size is 2mm. If the size of the gap 607 exceeds 2mm, it means that the chip 603 and the heat sink 605 are not installed correctly or the heat sink is not installed correctly. The thickness is not enough, so it will be judged as defective after the image recognition of the computer device.

應了解的是,為了更清楚說明本發明的影像辨識,圖3A-圖4B僅示出邊界框70及邊界框70中所擷取到的畫面。It should be understood that, in order to more clearly illustrate the image recognition of the present invention, FIGS. 3A to 4B only show the bounding box 70 and the images captured in the bounding box 70.

圖5為一示意圖,用以說明本發明又一實施例的檢測區的結構。請參照圖1及圖5,在本發明又一實施例中,本發明的自動化檢測系統1進一步包括一機械手臂501,機械手臂501電性連接至該計算機裝置,且機械手臂501在檢測區103中是設置於產線10的側邊,同時,第二攝影裝置50是設置於機械手臂501上。如此一來,第二攝影裝置50可藉由機械手臂501的移動而與待測物品60保持第二距離D2。舉例而言,產線10上的待測物品60經第一攝影裝置40及第二攝影裝置50之坐標整合並完成定位後,可將位置資訊傳送至該計算機裝置,並藉由該計算機裝置來控制機械手臂501,以將第二攝影裝置50與待測物品60的距離保持在第二距離D2。應了解的是,在本發明其他實施例中,可藉由一線性滑軌(未於圖中示出)來取代機械手臂501,並將第二攝影裝置50設置於該線性滑軌上。FIG. 5 is a schematic diagram for explaining the structure of the detection area according to another embodiment of the present invention. 1 and 5, in another embodiment of the present invention, the automated inspection system 1 of the present invention further includes a robotic arm 501, the robotic arm 501 is electrically connected to the computer device, and the robotic arm 501 is in the detection area 103 The middle is installed on the side of the production line 10, and the second camera device 50 is installed on the robotic arm 501. In this way, the second camera device 50 can maintain the second distance D2 from the object to be tested 60 by the movement of the robotic arm 501. For example, after the object to be tested 60 on the production line 10 is integrated and positioned by the coordinates of the first camera 40 and the second camera 50, the position information can be transmitted to the computer device, and the computer device can be used to The robotic arm 501 is controlled to maintain the distance between the second photographing device 50 and the object to be tested 60 at the second distance D2. It should be understood that in other embodiments of the present invention, a linear slide rail (not shown in the figure) can be used to replace the robotic arm 501, and the second camera device 50 can be arranged on the linear slide rail.

另一方面,本發明其他實施例中,該計算機裝置可進一步與一資料庫(未於圖中示出)連接,當該計算機裝置接收到第一攝影裝置40及第二攝影裝置50所獲取的畫面後,可將判定為不良品的畫面存入該資料庫中,並藉由多種的不良品畫面進行影像深度學習,影像深度學習部分可透過基於深度學習的物件偵測(YOLOv3) 進行顯示卡影像樣本之訓練學習,並進行偵測應用。On the other hand, in other embodiments of the present invention, the computer device may be further connected to a database (not shown in the figure), and when the computer device receives the information obtained by the first photographing device 40 and the second photographing device 50 After the screen is displayed, the screens judged as defective can be stored in the database, and deep learning of images can be carried out through a variety of defective images. The deep learning part of the image can be used to display the card through the object detection based on deep learning (YOLOv3) Training and learning of image samples and detection applications.

圖6為一流程圖,用以說明本發明一實施例的自動化檢測方法。請參照圖6,本發明的自動化檢測方法包括步驟S10-S50,步驟S10為:藉由一產線輸送至少一待測物品,該產線包括一感應區及一檢測區;步驟S20為:藉由設置於該感應區的至少一感應器感應該至少一待測物品,且當該至少一感應器感應到該至少一待測物品時會開啟至少一補光元件,其中,該至少一補光元件設置於該檢測區的上方及/或側邊;步驟S30為:在該檢測區中藉由設置於該產線上方一第一距離處的一第一攝影裝置擷取該至少一待測物品的上方狀態畫面;步驟S40為:在該檢測區中藉由設置於該產線側邊一第二距離處的一第二攝影裝置擷取該至少一待測物品的側邊狀態畫面;以及步驟S50為:藉由一計算機裝置接收該上方狀態畫面及該側邊狀態畫面,並對該上方狀態畫面及該側邊狀態畫面進行影像辨識,其中,該計算機裝置電性連接至該至少一感應器、該至少一補光元件、該第一攝影裝置及該第二攝影裝置。FIG. 6 is a flowchart for explaining an automatic detection method according to an embodiment of the present invention. Referring to FIG. 6, the automated inspection method of the present invention includes steps S10-S50. Step S10 is: conveying at least one item to be tested by a production line, the production line including a sensing area and a detection area; step S20 is: borrow The at least one object under test is sensed by at least one sensor arranged in the sensing area, and when the at least one sensor senses the at least one object under test, at least one light supplement element is turned on, wherein the at least one light supplement The component is arranged above and/or on the side of the detection area; step S30 is: in the detection area, the at least one item to be tested is captured by a first camera device arranged at a first distance above the production line Step S40 is: in the detection area, a second camera device located at a second distance from the side of the production line captures the side state screen of the at least one item to be tested; and step S50 is: receiving the top status screen and the side status screen by a computer device, and performing image recognition on the top status screen and the side status screen, wherein the computer device is electrically connected to the at least one sensor , The at least one light-filling element, the first photographing device and the second photographing device.

另一方面,在本發明的自動化檢測方法中,該待測物品可為顯示卡或現場可程式化邏輯閘陣列,該上方狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的風扇狀態畫面,該側邊狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的晶片與匯散熱排之間的安裝狀態畫面。On the other hand, in the automated detection method of the present invention, the object to be tested can be a display card or a field programmable logic gate array, and the upper status screen is the display card or the fan status of the field programmable logic gate array The screen, the side status screen is the installation status screen between the display card or the chip of the on-site programmable logic gate array and the bus heat sink.

再者,搭配圖4B的示意圖,該計算機裝置接收到該安裝狀態畫面後,該計算機裝置會在該安裝狀態畫面中設置一邊界框70,並藉由邊界框70中空隙607的間隙量與邊界框70的長寬比例進行迴歸分析,以判定晶片603與匯散熱排605之間的安裝是否正確及晶片603與匯散熱排605之間的散熱膏是否塗裝完整。Furthermore, with the schematic diagram of FIG. 4B, after the computer device receives the installation status screen, the computer device sets a bounding box 70 in the installation status screen, and uses the gap amount and the boundary of the gap 607 in the bounding box 70 The length and width ratio of the frame 70 is subjected to regression analysis to determine whether the mounting between the chip 603 and the heat sink 605 is correct and whether the heat dissipation paste between the chip 603 and the heat sink 605 is completely coated.

值得一提的是,再請參照圖2,第一距離D1及第二距離D2對本發明而言非常重要,若第一距離D1及第二距離D2的數值設置錯誤,將導致第一攝影裝置40及第二攝影裝置50獲取到的畫面不清楚,進而無法讓計算機裝置進行影像辨識。因此,在本發明的自動化檢測方法中,是將第一距離D1及第二距離D2分別設置為10-22.99公分中的任一數值,在本發明較佳的實施例中,是將第一距離D1及第二距離D2皆設置為15公分,如此的距離能使第一攝影裝置40及第二攝影裝置50獲取到最佳的狀態畫面。It is worth mentioning that, referring to FIG. 2 again, the first distance D1 and the second distance D2 are very important to the present invention. If the values of the first distance D1 and the second distance D2 are set incorrectly, the first photographing device 40 will be caused. And the image obtained by the second camera device 50 is unclear, and the computer device cannot be used for image recognition. Therefore, in the automatic detection method of the present invention, the first distance D1 and the second distance D2 are respectively set to any value in the range of 10-22.99 cm. In the preferred embodiment of the present invention, the first distance D1 and the second distance D2 are both set to 15 cm. Such a distance can enable the first photographing device 40 and the second photographing device 50 to obtain the best picture.

此外,在本發明的自動化檢測方法中,可在該計算機裝置中顯示一整合畫面,以顯示生產線上之顯示卡定位判別和檢測結果,並發送訊號給予檢測通過亮綠燈,檢測不過亮紅燈,並將所有影像截取畫面及檢測資料及檢測結果,存於主控與該計算機裝置連接的一資料庫中。In addition, in the automatic detection method of the present invention, an integrated screen can be displayed in the computer device to display the display card positioning judgment and detection result on the production line, and a signal is sent to the detection pass to turn on the green light, but the detection does not turn on the red light. And all the image interception screens, test data and test results are stored in a database connected to the main control and the computer device.

綜上所述,本發明成功地提供了一種自動化檢測系統及其方法。本發明的自動化檢測系統及其方法具有以下技術特徵及優點:1.於產線中架設兩台攝影裝置,並藉由兩台攝影裝置之坐標整合計算出待測物品的位置,以達成兩台攝影裝置顯示追蹤資訊之整合。2. 藉由在獲取到的影像中設置一邊界框,並藉由邊界框中之間隙量與長寬比例回歸分析進行分析,以判別顯示卡的晶片與散熱排之間的安裝是否正確及散熱膏是否塗裝。In summary, the present invention successfully provides an automated detection system and method. The automatic detection system and method of the present invention have the following technical features and advantages: 1. Two photographing devices are set up in the production line, and the position of the object to be tested is calculated by the coordinate integration of the two photographing devices to achieve two The camera device displays the integration of tracking information. 2. By setting a bounding box in the acquired image, and analyzing the gap between the bounding box and the aspect ratio regression analysis to determine whether the installation between the chip of the graphics card and the heat sink is correct and heat dissipation Whether the paste is painted.

以上所述者僅為用以解釋本發明之較佳實施例,並非企圖據以對本發明做任何形式上之限制,是以,凡有在相同之發明精神下所作有關本發明之任何修飾或變更,皆仍應包括在本發明意圖保護之範疇。The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to restrict the present invention in any form. Therefore, any modification or change related to the present invention is made under the same spirit of the invention. , Should still be included in the scope of the present invention's intention to protect.

2:自動化檢測系統 10:產線 20:感應器 30:補光元件 40:第一攝影裝置 50:第二攝影裝置 60:待測物品、顯示卡 70:邊界框 101:感應區 103:檢測區 501:機械手臂 601:風扇 603:晶片 605:匯散熱排 607:空隙 D1:第一距離 D2:第二距離 S10-S50:步驟2: Automated detection system 10: Production line 20: Sensor 30: Fill light component 40: The first photographic installation 50: The second photographic device 60: Items to be tested, display card 70: bounding box 101: induction zone 103: detection area 501: Robotic Arm 601: Fan 603: Chip 605: heat sink 607: gap D1: first distance D2: second distance S10-S50: steps

本領域中具有通常知識者在參照附圖閱讀下方的詳細說明後,可以對本發明的各種態樣以及其具體的特徵與優點有更良好的了解,其中,該些附圖包括: 圖1為說明本發明一實施例的自動化檢測系統的結構的俯視示意圖; 圖2為說明本發明一實施例的檢測區的結構示意圖; 圖3A為說明本發明一實施例的第一攝影裝置所獲取的畫面的示意圖; 圖3B為說明本發明一實施例的第二攝影裝置所獲取的畫面的示意圖; 圖4A為說明本發明另一實施例的第一攝影裝置所獲取的畫面的示意圖; 圖4B為說明本發明另一實施例的第二攝影裝置所獲取的畫面的示意圖; 圖5為說明本發明又一實施例的檢測區的結構示意圖;以及 圖6為說明本發明一實施的自動化檢測方法的流程圖。Those with ordinary knowledge in the art can have a better understanding of the various aspects of the present invention and its specific features and advantages after reading the detailed description below with reference to the accompanying drawings. The accompanying drawings include: 1 is a schematic top view illustrating the structure of an automated detection system according to an embodiment of the present invention; 2 is a schematic diagram illustrating the structure of a detection area according to an embodiment of the present invention; 3A is a schematic diagram illustrating a picture obtained by the first photographing device according to an embodiment of the present invention; 3B is a schematic diagram illustrating a picture obtained by a second photographing device according to an embodiment of the present invention; 4A is a schematic diagram illustrating a picture obtained by a first photographing device according to another embodiment of the present invention; 4B is a schematic diagram illustrating a picture acquired by a second photographing device according to another embodiment of the present invention; FIG. 5 is a schematic diagram illustrating the structure of a detection area according to another embodiment of the present invention; and Fig. 6 is a flowchart illustrating an automated detection method implemented by the present invention.

1:自動化檢測系統 1: Automated detection system

10:產線 10: Production line

20:感應器 20: Sensor

30:補光元件 30: Fill light component

40:第一攝影裝置 40: The first photographic installation

50:第二攝影裝置 50: The second photographic device

60:待測物品、顯示卡 60: Items to be tested, display card

101:感應區 101: induction zone

103:檢測區 103: detection area

Claims (8)

一種自動化檢測系統,包括:一產線,包括一感應區以及一檢測區;至少一感應器,在感應區處設置鄰近於該產線的位置,該至少一感應器感應藉由該產線輸送的至少一待測物品;至少一補光元件,在該檢測區中設置於該產線的上方及/或側邊;一第一攝影裝置,在該檢測區中以一第一距離設置於該產線的上方,該第一攝影裝置獲取該至少一待測物品的上方狀態畫面;一第二攝影裝置,在該檢測區中以一第二距離設置於該產線的側邊,該第二攝影裝置獲取該至少一待測物品的側邊狀態畫面;以及一計算機裝置,電性連接至該至少一感應器、該至少一補光元件、該第一攝影裝置及該第二攝影裝置,該計算機裝置接收該上方狀態畫面及該側邊狀態畫面,並對該上方狀態畫面及該側邊狀態畫面進行影像辨識,其中,該待測物品為顯示卡或現場可程式化邏輯閘陣列,該上方狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的風扇狀態畫面,該側邊狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的晶片與匯散熱排之間的安裝狀態畫面。 An automatic detection system includes: a production line, including a sensing area and a detection area; at least one sensor is arranged at a position adjacent to the production line in the sensing area, and the at least one sensor senses the transportation by the production line At least one item to be tested; at least one supplemental light element arranged above and/or on the side of the production line in the detection zone; a first photographing device arranged in the detection zone at a first distance Above the production line, the first photographing device acquires an upper status picture of the at least one item to be tested; a second photographing device is arranged on the side of the production line at a second distance in the detection area, and the second A photographing device acquires a side view of the at least one object to be tested; and a computer device electrically connected to the at least one sensor, the at least one light-filling element, the first photographing device and the second photographing device, the The computer device receives the upper status screen and the side status screen, and performs image recognition on the upper status screen and the side status screen. The object to be tested is a display card or an on-site programmable logic gate array. The status screen is the fan status screen of the display card or the field programmable logic gate array, and the side status screen is the installation status screen between the display card or the field programmable logic gate array chip and the bus radiator . 根據申請專利範圍第1項所述的自動化檢測系統,進一步包括一機械手臂,該機械手臂電性連接置該計算機裝置,且該機械手臂在該檢測區中設置於該產線的側邊,該第二攝影裝置設置於該機械手臂上,該第二攝影裝置藉由該機械手臂的移動而與該至少一待測物品保持該第二距離。 The automated inspection system according to item 1 of the scope of patent application further includes a robotic arm which is electrically connected to the computer device, and the robotic arm is arranged on the side of the production line in the inspection area, the The second photographing device is arranged on the robotic arm, and the second photographing device maintains the second distance from the at least one object to be tested by the movement of the robotic arm. 根據申請專利範圍第1項所述的自動化檢測系統,其中,該第一距離及該第二距離為10-22.99公分中的任一數值。 The automatic detection system according to item 1 of the scope of patent application, wherein the first distance and the second distance are any value in the range of 10-22.99 cm. 根據申請專利範圍第3項所述的自動化檢測系統,其中,該第一距離及該第二距離為15公分。 The automatic detection system according to item 3 of the scope of patent application, wherein the first distance and the second distance are 15 cm. 一種自動化檢測方法,包括以下步驟:藉由一產線輸送至少一待測物品,該產線包括一感應區及一檢測區;藉由設置於該感應區的至少一感應器感應該至少一待測物品,且當該至少一感應器感應到該至少一待測物品時會開啟至少一補光元件,其中,該至少一補光元件設置於該檢測區的上方及/或側邊;在該檢測區中藉由設置於該產線上方一第一距離處的一第一攝影裝置擷取該至少一待測物品的上方狀態畫面;在該檢測區中藉由設置於該產線側邊一第二距離處的一第二攝影裝置擷取該至少一待測物品的側邊狀態畫面;以及藉由一計算機裝置接收該上方狀態畫面及該側邊狀態畫面,並對該上方狀態畫面及該側邊狀態畫面進行影像辨識,其中,該計算機裝置電性連接至該至少一感應器、該至少一補光元件、該第一攝影裝置及該第二攝影裝置,其中,該待測物品為顯示卡或現場可程式化邏輯閘陣列,該上方狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的風扇狀態畫面,該側邊狀態畫面為該顯示卡或該現場可程式化邏輯閘陣列的晶片與匯散熱排之間的安裝狀態畫面。 An automatic detection method includes the following steps: conveying at least one object to be tested by a production line, the production line including a sensing area and a detection area; sensing the at least one object to be tested by at least one sensor arranged in the sensing area The object is measured, and when the at least one sensor senses the at least one object to be tested, at least one supplemental light element is turned on, wherein the at least one supplementary light element is arranged above and/or on the side of the detection area; In the detection area, a first camera device disposed at a first distance above the production line captures the upper status picture of the at least one item to be tested; in the detection area, by setting a side of the production line A second camera device at the second distance captures the side status screen of the at least one object to be tested; and receives the upper status screen and the side status screen by a computer device, and the upper status screen and the side status screen are received by a computer device. The side status screen performs image recognition, wherein the computer device is electrically connected to the at least one sensor, the at least one light-filling element, the first photographing device and the second photographing device, wherein the object to be tested is a display Card or field programmable logic gate array, the upper status screen is the fan status screen of the display card or the field programmable logic gate array, and the side status screen is the display card or the field programmable logic gate array The installation status screen between the chip and the bus heat sink. 根據申請專利範圍第5項所述的自動化檢測方法,其中,該計算機裝置接收到該安裝狀態畫面後,該計算機裝置在該安裝狀態畫面中設置一邊界框,並藉由該邊界框中的間隙量與該邊界框的長寬比例進行迴歸分析,以判定該晶片與該匯散熱排之間的安裝是否正確及該晶片與該匯散熱排之間的散熱膏是否塗裝完整。 The automatic detection method according to item 5 of the scope of patent application, wherein after the computer device receives the installation status screen, the computer device sets a bounding box in the installation status screen, and uses the gap in the bounding frame Regression analysis is performed to determine whether the mounting between the chip and the heat sink is correct and whether the thermal paste between the chip and the heat sink is completely painted. 根據申請專利範圍第5項所述的自動化檢測方法,其中,該第一距離及該第二距離為10-22.99公分中的任一數值。 The automatic detection method according to item 5 of the scope of patent application, wherein the first distance and the second distance are any value in the range of 10-22.99 cm. 根據申請專利範圍第7項所述的自動化檢測方法,其中,該第一距離及該第二距離為15公分。 The automated detection method according to item 7 of the scope of patent application, wherein the first distance and the second distance are 15 cm.
TW108119834A 2019-06-06 2019-06-06 Automatic detection system and method TWI724432B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW108119834A TWI724432B (en) 2019-06-06 2019-06-06 Automatic detection system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108119834A TWI724432B (en) 2019-06-06 2019-06-06 Automatic detection system and method

Publications (2)

Publication Number Publication Date
TW202046110A TW202046110A (en) 2020-12-16
TWI724432B true TWI724432B (en) 2021-04-11

Family

ID=74668554

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108119834A TWI724432B (en) 2019-06-06 2019-06-06 Automatic detection system and method

Country Status (1)

Country Link
TW (1) TWI724432B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8625095B2 (en) * 2011-04-28 2014-01-07 Lg Chem, Ltd. Automatic inspection apparatus for detecting stains on polarizing plate using color difference analysis and inspection method thereof
TWI494538B (en) * 2014-06-25 2015-08-01 Ind Tech Res Inst System and method for measuring an object
TWI582413B (en) * 2015-09-02 2017-05-11 由田新技股份有限公司 One-sided and two-sided lightning inspection apparatus
TWI647444B (en) * 2017-05-12 2019-01-11 廣盈自動化工程股份有限公司 Battery yield automatic detecting device and method thereof
TW201918439A (en) * 2017-11-02 2019-05-16 日商精工愛普生股份有限公司 Electronic component handler and electronic component tester

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8625095B2 (en) * 2011-04-28 2014-01-07 Lg Chem, Ltd. Automatic inspection apparatus for detecting stains on polarizing plate using color difference analysis and inspection method thereof
TWI494538B (en) * 2014-06-25 2015-08-01 Ind Tech Res Inst System and method for measuring an object
TWI582413B (en) * 2015-09-02 2017-05-11 由田新技股份有限公司 One-sided and two-sided lightning inspection apparatus
TWI647444B (en) * 2017-05-12 2019-01-11 廣盈自動化工程股份有限公司 Battery yield automatic detecting device and method thereof
TW201918439A (en) * 2017-11-02 2019-05-16 日商精工愛普生股份有限公司 Electronic component handler and electronic component tester

Also Published As

Publication number Publication date
TW202046110A (en) 2020-12-16

Similar Documents

Publication Publication Date Title
JP6922168B2 (en) Surface mount line quality control system and its control method
JP6574163B2 (en) Substrate inspection method
TWI761880B (en) Apparatus, method, computer readable medium and computer program product for inspecting substrate defect
CN103389309A (en) Method and apparatus for inspecting via hole
TWI468703B (en) Wiring testing method, wiring testing device, wiring testing computer program product, and storage medium
US8964022B2 (en) Dynamic imaging system
TWI724432B (en) Automatic detection system and method
JP4454428B2 (en) Component edge detection method, component edge detection program, and inspection apparatus
JP2013153350A (en) Wiring defect detection device mounted with infrared camera, and abnormality detection method for detecting abnormality in the infrared camera
CN112082946A (en) Automatic detection system and method thereof
KR20130086801A (en) Method and device for inspecting a multi-layer display pannel
KR101126759B1 (en) Method of teaching for electronic parts information in chip mounter
JP2001283194A (en) Method and device for inspecting appearance of circuit board
JP5758474B2 (en) Sitting posture determination device for semiconductor package test
TWM578373U (en) Semiconductor apparatus
TWM585899U (en) System for inspecting defects of semiconductor device
JP4057479B2 (en) Pattern inspection method
US20220375055A1 (en) Setting system, setting method, and program
CN113298793B (en) Circuit board surface defect detection method based on multi-view template matching
Anu et al. Automatic visual inspection of PCB using CAD information
JP2576147B2 (en) Shortage inspection device for mounted parts
TWI704630B (en) Semiconductor apparatus and detection method thereof
JP5249855B2 (en) Electronic component terminal position detection method and electronic component terminal position detection system
KR20110001445U (en) The development equipment of auto surface defect machine vision and using methods of semiconductor BGA
JPH10141930A (en) Method and device for inspecting pattern