TWI723542B - AC motor speed control structure - Google Patents

AC motor speed control structure Download PDF

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TWI723542B
TWI723542B TW108133248A TW108133248A TWI723542B TW I723542 B TWI723542 B TW I723542B TW 108133248 A TW108133248 A TW 108133248A TW 108133248 A TW108133248 A TW 108133248A TW I723542 B TWI723542 B TW I723542B
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module
speed control
circuit board
heat dissipation
aforementioned
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TW108133248A
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Chinese (zh)
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TW202217148A (en
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郭正炫
郭聿紳
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普天投資有限公司
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Abstract

一種交流馬達轉速控制結構，包括殼體、電路板與散熱模組，電路板包括電源模組、轉速控制模組與操作模組，散熱模組包括散熱層、散熱器與散熱風扇，殼體內設置電路板與散熱模組，並具有輸入模組、輸出模組與電路板電性連接，外部交流電經輸入模組傳輸到電路板，操作模組控制轉速控制產生不同轉速的交流控制電力，達成輸出模組連接一交流馬達裝置後具備轉速控制、且電路板動作時產生的高熱能經散熱模組快速排出，可以高速散熱的結構。 An AC motor speed control structure, including a casing, a circuit board, and a heat dissipation module. The circuit board includes a power supply module, a rotation speed control module and an operation module. The heat dissipation module includes a heat dissipation layer, a radiator and a heat dissipation fan. The circuit board and the heat dissipation module are electrically connected with the input module, the output module and the circuit board. The external AC power is transmitted to the circuit board through the input module. The operating module controls the speed to control the speed to generate AC control power at different speeds to achieve output. After the module is connected to an AC motor device, it is equipped with a speed control structure, and the high heat generated when the circuit board moves is quickly discharged through the heat dissipation module, which can dissipate heat at a high speed.

Description

交流馬達轉速控制結構 AC motor speed control structure

本發明係有關於一種交流馬達轉速控制結構，特別是指一種能夠直接連接電源與交流馬達裝置進行多段轉速控制，且散熱效果良好，結構簡單的交流馬達轉速控制結構。 The present invention relates to an AC motor speed control structure, in particular to an AC motor speed control structure that can directly connect a power supply and an AC motor device to perform multi-stage speed control, has good heat dissipation effects, and has a simple structure.

一般言，傳統風扇的轉速調整方式，是藉由開關選擇線圈的方式，達到改變風扇的轉速，此種方式，受限於交流馬達的結構特性，會增加線圈的成本考量，限制了實務上的轉速控制，導致現有的風扇大多僅分為高、中、低(或稱強、中、弱)等三段風速，當使用者切換線圈時，則會使風扇直接改變成對應的風速(轉速)，而無法對風速作連續、大轉速範圍的控制。 Generally speaking, the traditional fan speed adjustment method is to change the speed of the fan by switching the coil to select. This method is limited by the structural characteristics of the AC motor, which will increase the cost consideration of the coil and limit the practicality. Speed control, the existing fans are mostly divided into three wind speeds: high, medium and low (or strong, medium, and weak). When the user switches the coil, the fan will directly change to the corresponding wind speed (speed) , And it is impossible to control the wind speed continuously and in a large speed range.

因此，便有業者開發出如中華民國專利公告第I329161號「風扇變速器」、中華民國專利公告第M552546號「交流風扇無段控制系統」、中華民國專利公告第I648944號「以電功率調整馬達轉速之控制電路」等專利，用來控制交流馬達的轉速；然，這些專利實際上仍然具有諸多缺失尚待改進；首先是，這些專利仍是電路型態的結構，雖然可以組合在交流馬達或裝置(如電風扇、抽風機、吹風機)的結構中，但是，採用交流馬達的裝置，大多存在著生產成本低、結構簡單的特性，對生產業者而言，交流馬達與風扇裝置的外殼都需要重新設計開模，才能設置這些專利案的電路， 所以，以現有的交流馬達與裝置並無法直接應用這些專利案； 又，上述各專利案，為了應付交流電的不同相位狀態，以及，交流電相對於主、被動元件工作電壓(直流電，均為6V~24V)是屬於大電壓(交流電，均為90V至240V不等)，可視為大電壓，所以，交流馬達轉速控制的主、被動元件，在動作過程中會產生大量的熱能，熱能若不能輕易排除，將會導致整個電路燒毀。 Therefore, some companies have developed products such as the Republic of China Patent Publication No. I329161 "Fan Transmission", the Republic of China Patent Publication No. M552546 "AC Fan Stepless Control System", and the Republic of China Patent Publication No. I648944 "Adjusting Motor Speed with Electric Power" "Control circuit" and other patents are used to control the speed of AC motors. However, these patents still have many shortcomings and need to be improved. First of all, these patents are still circuit-type structures, although they can be combined in AC motors or devices ( However, most of the devices that use AC motors have the characteristics of low production cost and simple structure. For manufacturers, the housings of AC motors and fan devices need to be redesigned. Only by opening the mold can the circuits of these patent cases be installed Therefore, these patent cases cannot be directly applied with the existing AC motors and devices; In addition, the above patents are designed to cope with the different phase states of the alternating current, and the alternating current is a large voltage relative to the operating voltage of the active and passive components (direct current, both 6V~24V) (alternating current, all ranging from 90V to 240V) , Can be regarded as a large voltage. Therefore, the active and passive components of the AC motor speed control will generate a lot of heat energy during the operation. If the heat energy cannot be easily removed, the entire circuit will be burned.

再者，對消費者而言，除非是交流馬達裝置損毀，才會更換具有轉速控制的交流馬達裝置，因此，這些專利案所具備的功能，實際上也無法普及給予消費者做使用。 Furthermore, for consumers, unless the AC motor device is damaged, the AC motor device with speed control will be replaced. Therefore, the functions provided by these patent cases cannot actually be popularized for consumers to use.

有鑑於習用有上述缺點，發明人乃針對前述缺點研究改進之道，終於有本發明產生。 In view of the above-mentioned shortcomings of conventional use, the inventor researched and improved ways to address the above-mentioned shortcomings, and finally came to the present invention.

本發明主要目的在於，提供一種能夠直接連接電源與交流馬達裝置進行多段轉速控制的交流馬達轉速控制結構。 The main purpose of the present invention is to provide an AC motor speed control structure that can directly connect a power source and an AC motor device to perform multi-stage speed control.

本發明次要目的在於，提供一種散熱效果良好的交流馬達轉速控制結構。 The secondary objective of the present invention is to provide an AC motor speed control structure with good heat dissipation effect.

本發明再一目的在於，提供一種結構簡單、成本低廉，且利於搭配任何商品化的的交流馬達轉速控制結構。 Another object of the present invention is to provide a speed control structure for AC motors that is simple in structure and low in cost, and is conducive to collocation with any commercial AC motor.

為達成上述目的及功效，本發明所採行的技術手段至少包括：一殼體、一電路板與一散熱模組，其中： 所述殼體具有一蓋體，內部具有一容置空間，表面設有一輸入模組與一輸出模組。 In order to achieve the above objectives and effects, the technical means adopted by the present invention at least include: a housing, a circuit board and a heat dissipation module, wherein: The casing has a cover, an accommodating space inside, and an input module and an output module on the surface.

所述電路板設在前述容置空間內，並分別與輸入模組、輸出模組電性連接，至少包括：一電源模組、一轉速控制模組與一操作模組，其中：所述電源模組與前述輸入模組電性連接，輸入模組導入一交流電；所述轉速控制模組與前述電源模組、輸出模組電性連接，結合交流電產生一交流控制電力傳輸到輸出模組；所述操作模組部分穿出前述殼體表面，並與轉速控制模組電性連接，控制轉速控制模組產生不同轉速的交流控制電力。 The circuit board is arranged in the aforementioned accommodating space, and is electrically connected to the input module and the output module, and includes at least: a power supply module, a speed control module, and an operation module, wherein: the power supply The module is electrically connected to the aforementioned input module, and the input module introduces an alternating current; the rotational speed control module is electrically connected to the aforementioned power module and output module, combined with the alternating current to generate an alternating current control power and transmit it to the output module; The operating module partially penetrates the surface of the aforementioned housing and is electrically connected to the speed control module to control the speed control module to generate AC control power at different speeds.

所述散熱模組連接在前述電路板，至少包括：一散熱層、一散熱器與一散熱風扇，其中：所述散熱層設在前述電路板表面，為多孔石墨材質內填充高導熱金屬所構成，導出電路板動作時的熱能；所述散熱器連接在前述散熱層並導出熱能；所述散熱風扇與前述電源模組電性連接，設在前述散熱器上。 The heat dissipation module is connected to the circuit board and includes at least: a heat dissipation layer, a heat sink, and a heat dissipation fan, wherein: the heat dissipation layer is provided on the surface of the circuit board and is made of porous graphite material filled with high thermal conductivity metal , Deriving heat energy during the operation of the circuit board; the radiator is connected to the heat dissipation layer and deriving the heat energy; the heat dissipation fan is electrically connected to the power supply module, and is arranged on the radiator.

藉此，外部交流電經輸入模組傳輸到電路板，操作模組控制轉速控制產生不同轉速的交流控制電力，使輸出模組連接一交流馬達裝置後具有轉速控制的結構，且電路板動作時產生的高熱能經散熱模組快速排出，達成高速散熱的結構。 In this way, the external AC power is transmitted to the circuit board through the input module, and the operating module controls the speed control to generate AC control power at different speeds, so that the output module is connected to an AC motor device and has a speed control structure, and it is generated when the circuit board operates The high heat energy is quickly discharged through the heat dissipation module to achieve a high-speed heat dissipation structure.

依上述結構，其中該輸入模組是一插頭結構，輸出模組是一插座結構。 According to the above structure, the input module is a plug structure, and the output module is a socket structure.

依上述結構，其中該輸入模組是一電連接器結構。 According to the above structure, the input module is an electrical connector structure.

依上述結構，進一步包括一遙控器，產生一控制訊號，以及，電路板包括一無線接收模組，與前述轉速控制模組電性連接，接收控制訊號傳輸到前述轉速控制模組。 According to the above structure, it further includes a remote controller for generating a control signal, and the circuit board includes a wireless receiving module electrically connected to the rotational speed control module, and the received control signal is transmitted to the rotational speed control module.

依上述結構，其中該散熱器可以是散熱鰭片、導熱管組或導熱板。 According to the above structure, the heat sink can be a heat dissipation fin, a heat conduction tube group or a heat conduction plate.

依上述結構，其中該電路板包括一計時模組，與前述電源模組、轉速控制模組、操作模組電性連接，操作模組設定計時模組控制電源模組、轉速控制模組，達成定時啟動、定時關閉、週期性動作的結構。 According to the above structure, the circuit board includes a timing module, which is electrically connected to the aforementioned power supply module, speed control module, and operation module. The operation module sets the timing module to control the power supply module and the speed control module to achieve The structure of timing start, timing shutdown, and periodic action.

依上述結構，其中該電路板包括一顯示模組，設在前述殼體表面，並與轉速控制模組電性連接，顯示電路板的動作狀態。 According to the above structure, the circuit board includes a display module, which is arranged on the surface of the casing and is electrically connected to the rotational speed control module to display the operating state of the circuit board.

依上述結構，其中該殼體與蓋體設有複數的散熱孔。 According to the above structure, the casing and the cover are provided with a plurality of heat dissipation holes.

依上述結構，其中該轉速控制模組選自PWM(Pulse Width Modulation，脈衝寬度調變)、SCR(Silicon Controlled Rectifier，矽控整流器)、TRIAC(Bidirectional Thyristor，雙向閘流體)、IGCT(Intergrated Gate Commutated Thyristors，基體閘換向閘流體)、IGBT(Insulated Gate Bipolar Transistor，絕緣柵雙極電晶體)所組成的控制電路群組其中之一。 According to the above structure, the speed control module is selected from PWM (Pulse Width Modulation), SCR (Silicon Controlled Rectifier), TRIAC (Bidirectional Thyristor), IGCT (Intergrated Gate Commutated) Thyristors, substrate gate commutation thyristors), IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) composed of one of the control circuit group.

依上述結構，其中該殼體表面設有一窗孔組，供前述電路板的操作模組、顯示模組延伸至殼體表面。 According to the above structure, the surface of the casing is provided with a window hole group for the operation module and the display module of the circuit board to extend to the surface of the casing.

為使本發明的上述目的、功效及特徵可獲得更具體的瞭解，依各附圖說明如下： In order to obtain a more detailed understanding of the above-mentioned objects, effects and features of the present invention, the descriptions are as follows according to the drawings:

1‧‧‧殼體 1‧‧‧Shell

11‧‧‧蓋體 11‧‧‧Cover body

12‧‧‧輸入模組 12‧‧‧Input Module

13‧‧‧輸出模組 13‧‧‧Output Module

14‧‧‧窗孔組 14‧‧‧Window hole group

15‧‧‧散熱孔 15‧‧‧Heat vent

2‧‧‧電路板 2‧‧‧Circuit board

21‧‧‧電源模組 21‧‧‧Power Module

22‧‧‧轉速控制模組 22‧‧‧Speed Control Module

23‧‧‧操作模組 23‧‧‧Operation Module

24‧‧‧顯示模組 24‧‧‧Display Module

25‧‧‧計時模組 25‧‧‧Timing Module

26‧‧‧無線接收模組 26‧‧‧Wireless receiving module

3‧‧‧散熱模組 3‧‧‧Heat Dissipation Module

31‧‧‧散熱層 31‧‧‧Heat Dissipation Layer

32‧‧‧散熱器 32‧‧‧Radiator

33‧‧‧散熱風扇 33‧‧‧Cooling fan

4‧‧‧遙控器 4‧‧‧Remote control

5‧‧‧交流電源 5‧‧‧AC power supply

6‧‧‧交流馬達裝置 6‧‧‧AC motor device

第1圖是本發明較佳實施例的立體圖。 Figure 1 is a perspective view of a preferred embodiment of the present invention.

第2圖是本發明較佳實施例的立體分解圖。 Figure 2 is an exploded perspective view of a preferred embodiment of the present invention.

第3圖是本發明較佳實施例的電路方塊圖。 Figure 3 is a circuit block diagram of a preferred embodiment of the present invention.

第4圖是本發明再一較佳實施例的電路方塊圖。 Figure 4 is a circuit block diagram of another preferred embodiment of the present invention.

第5圖是本發明再一較佳實施例的立體圖。 Figure 5 is a perspective view of still another preferred embodiment of the present invention.

請參閱第1圖至第3圖所示，可知本發明的結構主要包括：一殼體1、一電路板2與一散熱模組3，其中： 所述殼體1具有一蓋體11，內部具有一容置空間10，表面設有一輸入模組12、一輸出模組13、一窗孔組14與複數的散熱孔15，應注意得的是，本實施例中，輸入模組12是設置在蓋體11上，輸出模組13設置在殼體1的表面，實際上，輸入模組12與輸出模組13設置的位置，包含但不限定在殼體1的任一表面上，可以在同一個表面或各自設置在不同的表面，在一個較佳的實施例中，輸入模組12與輸出模組13可以同時設置在殼體1的同一個表面，例如頂面、底面(即蓋體11)、左側面、右側面、正面或背面等；再另一個較佳的實施例中，輸入模組12與輸出模組13可以分別設置在殼體1的不同表面，例如輸入模組12在左側面，輸出模組13在右側面，或輸入模組12在正面，輸出模組13在背面，或輸入模組12在左/右側面，輸出模組13在正/背面等。 Referring to Figures 1 to 3, it can be seen that the structure of the present invention mainly includes: a housing 1, a circuit board 2 and a heat dissipation module 3, in which: The housing 1 has a cover 11 with an accommodating space 10 inside, and an input module 12, an output module 13, a window hole group 14 and a plurality of heat dissipation holes 15 on the surface. It should be noted that In this embodiment, the input module 12 is arranged on the cover 11, and the output module 13 is arranged on the surface of the housing 1. In fact, the positions where the input module 12 and the output module 13 are arranged include but are not limited to On any surface of the housing 1, they can be set on the same surface or on different surfaces. In a preferred embodiment, the input module 12 and the output module 13 can be set on the same surface of the housing 1 at the same time. One surface, such as the top surface, the bottom surface (namely the cover 11), the left side, the right side, the front or the back, etc.; in another preferred embodiment, the input module 12 and the output module 13 can be respectively arranged in the housing Different surfaces of the body 1, for example, the input module 12 is on the left side, the output module 13 is on the right side, or the input module 12 is on the front, the output module 13 is on the back, or the input module 12 is on the left/right side, and the output The module 13 is on the front/back side, etc.

所述電路板2設在前述容置空間10內，並分別與輸入模組12、輸出模組13電性連接，至少包括：一電源模組21、一轉速控制模組22、一操作模組23、一顯示模組24與一計時模組25，其中： 所述電源模組21與前述輸入模組12電性連接，輸入模組12導入一交流電傳輸到電源模組21，轉換成符合電路板2上各模組動作實的工作電力，而可以是線性電源模組或交換式電源模組，且電源模組21包括但不限定於連接單相、雙相或三相電源，更不限定輸入的電壓，例如90V、110V、220V等，由於電源模組21對應不同相位、不同電壓的交流電的技術，並非本發明技術特徵，在此不再贅述；所述轉速控制模組22與前述電源模組21、輸出模組13電性連接，結合交流電產生一交流控制電力傳輸到輸出模組13；交流控制電力是指控制轉速的訊號直接整合在交流電內，應注意的是，轉速控制模組22包括但不限定於PWM(Pulse Width Modulation，脈衝寬度調變)、SCR(Silicon Controlled Rectifier，矽控整流器)、TRIAC(Bidirectional Thyristor，雙向閘流體)、IGCT(Intergrated Gate Commutated Thyristors，基體閘換向閘流體)、IGBT(Insulated Gate Bipolar Transistor，絕緣柵雙極電晶體)所組成的控制電路群組其中之一，因交流馬達轉速控制的技術，並非本發明技術特徵，在此不再贅述，應強調的是，本發明的核心在於，交流馬達速度控制的功能結合在單一的電器結構內，令各種交流馬達裝置6(如電風扇、抽風機、吹風機、抽水機等)連接後，能夠直接控制其轉速；所述操作模組23經窗孔組14穿出殼體1表面，並與前述轉速控制模組22電性連接，控制轉速控制模組22產生不同轉速的交流控制電力，包括但不限定於按鈕開關、觸控開關、指撥開關、微動開關、旋鈕開關所組成的開關群組其中之一；所述顯示模組2經窗孔組14穿出殼體表面，亦可設置在殼體1的表面，並與轉速控制模組22電性連接，顯示電路板2的動作狀態，包括但不限定於發光二極體、發光二極體陣列、冷光板、液晶面板、電子紙所組成的顯示裝置群組其中之一；所述計時模組25與前述電源模組21、轉速控制模組22、操作模組23電性連接，操作模組23設定計時模組25控制電源模組21、轉速控制模組22，達成定時啟動、定時關閉、週期性動作的結構。 The circuit board 2 is arranged in the aforementioned accommodating space 10 and is electrically connected to the input module 12 and the output module 13 respectively, and includes at least: a power module 21, a rotational speed control module 22, and an operation module 23. A display module 24 and a timing module 25, in which: The power module 21 is electrically connected to the aforementioned input module 12. The input module 12 introduces an alternating current and transmits it to the power module 21, which is converted into working power that conforms to the actual operation of each module on the circuit board 2, which can be linear. Power module or switching power module, and the power module 21 includes but is not limited to connecting single-phase, two-phase or three-phase power, and does not limit the input voltage, such as 90V, 110V, 220V, etc., because the power module 21. The technology corresponding to alternating currents of different phases and voltages is not a technical feature of the present invention and will not be repeated here. The speed control module 22 is electrically connected to the aforementioned power module 21 and output module 13 to generate a combination of alternating current. The AC control power is transmitted to the output module 13; the AC control power means that the signal for controlling the speed is directly integrated into the AC power. It should be noted that the speed control module 22 includes but is not limited to PWM (Pulse Width Modulation). ), SCR (Silicon Controlled Rectifier), TRIAC (Bidirectional Thyristor), IGCT (Intergrated Gate Commutated Thyristors), IGBT (Insulated Gate Bipolar Transistor) Crystal) is one of the control circuit groups. Because the technology of AC motor speed control is not a technical feature of the present invention, it will not be repeated here. It should be emphasized that the core of the present invention lies in the function of AC motor speed control. Combined in a single electrical structure, various AC motor devices 6 (such as electric fans, exhaust fans, blowers, water pumps, etc.) can be connected to directly control their speed; the operating module 23 passes through the window hole group 14 to pass through the shell The surface of the body 1 is electrically connected to the aforementioned speed control module 22, which controls the speed control module 22 to generate AC control power at different speeds, including but not limited to button switches, touch switches, finger switches, micro switches, and knob switches One of the switch groups constituted; the display module 2 penetrates the surface of the housing through the window hole group 14, and can also be arranged on the surface of the housing 1, and is electrically connected to the speed control module 22, the display circuit The operating state of the board 2 includes, but is not limited to, one of a display device group consisting of a light-emitting diode, a light-emitting diode array, a cold light board, a liquid crystal panel, and electronic paper; the timing module 25 and the aforementioned power supply The module 21, the speed control module 22, and the operation module 23 are electrically connected. The operation module 23 sets the timing module 25 to control the power supply module 21 and the speed control module 22 to achieve timing start, timing shutdown, and periodic action. structure.

所述散熱模組3連接在前述電路板2，至少包括：一散熱層31、一散熱器32與一散熱風扇33，其中：所述散熱層31設在前述電路板2表面，為多孔石墨材質內填充高導熱金屬所構成，導出電路板2動作時的熱能，應注意的是，散熱層31可以是單一片狀結構並以導熱膠貼附在電路板2，或利用塗佈、噴塗、電鍍、電鍍、化學鍍、濺鍍、蒸鍍、塗鍍、浸鍍等方式設置在電路板2，或在電路板2製程中，直接穿插在電路板2內層；所述散熱器32連接在前述散熱層31並導出熱能，而可以是散熱器32可以是散熱鰭片、導熱管組或導熱板；所述散熱風扇33與前述電源模組21電性連接，設在前述散熱器32上。 The heat dissipation module 3 is connected to the circuit board 2 and includes at least: a heat dissipation layer 31, a heat sink 32, and a heat dissipation fan 33. The heat dissipation layer 31 is provided on the surface of the circuit board 2 and is made of porous graphite. It is filled with high thermal conductivity metal to derive the heat energy of the circuit board 2 when it moves. It should be noted that the heat dissipation layer 31 can be a single sheet structure and attached to the circuit board 2 with a thermally conductive adhesive, or use coating, spraying, or electroplating. , Electroplating, chemical plating, sputtering, evaporation, coating, immersion plating, etc. are arranged on the circuit board 2, or directly inserted into the inner layer of the circuit board 2 during the manufacturing process of the circuit board 2; the heat sink 32 is connected to the aforementioned The heat dissipation layer 31 conducts heat energy, and the heat sink 32 may be a heat dissipation fin, a heat pipe group or a heat conduction plate; the heat dissipation fan 33 is electrically connected to the power module 21 and is provided on the heat sink 32.

應注意的是，在本實施例中，輸入模組12是以插頭的形式來表示，輸出模組13是以插座的形式來表示，僅是為了利於說明交流電源5連接到輸入模組12、與交流馬達裝置6連接到輸出模組13，並非限定本發明輸入模組12、輸出模組13實際實施的樣態，舉凡包括但不限定於插座、插頭、電器接點、接線端子所組成的電線連接機構群組其中之一。 It should be noted that in this embodiment, the input module 12 is represented in the form of a plug, and the output module 13 is represented in the form of a socket, which is only for the convenience of explaining that the AC power source 5 is connected to the input module 12, Connecting the AC motor device 6 to the output module 13 does not limit the actual implementation of the input module 12 and output module 13 of the present invention, including but not limited to sockets, plugs, electrical contacts, and wiring terminals. One of the group of wire connection mechanism.

交流電源5的交流電經輸入模組12傳輸到電路板2的電源模組21，轉速控制模組22結合交流電產生交流控制電力傳輸到輸出模組13，因交流控制電力是控制轉速的訊號直接整合在交流電內，所以，6交流馬達裝置6接收交流控制電力就能直接運轉，並配合轉速控制模組22的動作控制改變轉速，此時，操作模組23可以操作轉速控制模組22產生不同轉速的交流控制電力，在一個較佳的實施例中，操作模組23可以是旋鈕開關、連續觸發的開關，則可以達成無段轉速控制的效果，在另一個較佳實施例中，操作模組23是單次觸發的開關，則可以設定轉速控制模組22再單次觸發後，增加或減少的轉速幅度。 The AC power of the AC power supply 5 is transmitted to the power supply module 21 of the circuit board 2 through the input module 12, and the speed control module 22 combines the AC power to generate AC control power and transmits it to the output module 13. Because the AC control power is directly integrated with the signal for controlling the speed In AC power, the 6 AC motor device 6 can run directly after receiving AC control power, and coordinate with the action control of the speed control module 22 to change the speed. At this time, the operating module 23 can operate the speed control module 22 to generate different speeds. In a preferred embodiment, the operating module 23 can be a rotary switch or a continuously triggered switch to achieve the effect of stepless speed control. In another preferred embodiment, the operating module 23 is a single trigger switch, you can set the speed range of increase or decrease after the speed control module 22 is triggered once again.

在上述過程中，電路板2產生的熱能，會被散熱層31快速的傳導到散熱器32，並透過散熱風扇33轉動後，帶動熱氣經由散熱孔15對外排放，達到快速散熱的結構。 In the above process, the thermal energy generated by the circuit board 2 is quickly transferred to the radiator 32 by the heat dissipation layer 31, and after the rotation of the heat dissipation fan 33, the hot air is driven to be discharged through the heat dissipation hole 15 to achieve a rapid heat dissipation structure.

請參閱第4、5圖所示，本實施例相較於前述實施例的特點在於：本發明進一步包括一遙控器4，以及，電路板2進一步包括一無線接收模組26，並與前述轉速控制模組22電性連接，操作遙控器4產生一控制訊號傳輸到無線接收模組26，轉速控制模組22便會依照前述的動作，產生不同轉速的交流控制電力，應注意的是，遙控器4與無線接收模組26之間的訊號傳輸，包括但不限定於紅外線、藍芽、ZigBee、WiFi、UWB(Ultra WideBand)、RF(Radio Frequency)、ANT(Adaptive Network Topology)所組成的無線通訊群組其中之一。 Please refer to Figures 4 and 5. Compared with the previous embodiments, this embodiment is characterized in that: the present invention further includes a remote controller 4, and the circuit board 2 further includes a wireless receiving module 26, which is compatible with the aforementioned rotational speed. The control module 22 is electrically connected. When the remote controller 4 is operated to generate a control signal and transmitted to the wireless receiving module 26, the speed control module 22 will generate AC control power at different speeds in accordance with the aforementioned actions. It should be noted that the remote control The signal transmission between the device 4 and the wireless receiving module 26 includes, but is not limited to, wireless composed of infrared, Bluetooth, ZigBee, WiFi, UWB (Ultra WideBand), RF (Radio Frequency), and ANT (Adaptive Network Topology) One of the distribution groups.

綜合以上所述，本發明的交流馬達轉速控制結構實為一具新穎性及進步性的發明，爰依法提出申請發明專利；惟上述說明的內容，僅為本發明的較佳實施例說明，舉凡依本發明的技術手段與範疇所延伸的變化、修飾、改變或等效置換者，亦皆應落入本發明的專利申請範圍內。 Based on the above, the AC motor speed control structure of the present invention is indeed a novel and progressive invention, and an application for invention patents was filed according to law; however, the content of the above description is only a description of the preferred embodiments of the present invention. Any changes, modifications, alterations or equivalent replacements extended by the technical means and scope of the present invention shall also fall within the scope of the patent application of the present invention.

1‧‧‧殼體 1‧‧‧Shell

11‧‧‧蓋體 11‧‧‧Cover body

12‧‧‧輸入模組 12‧‧‧Input Module

13‧‧‧輸出模組 13‧‧‧Output Module

14‧‧‧窗孔組 14‧‧‧Window hole group

15‧‧‧散熱孔 15‧‧‧Heat vent

2‧‧‧電路板 2‧‧‧Circuit board

21‧‧‧電源模組 21‧‧‧Power Module

22‧‧‧轉速控制模組 22‧‧‧Speed Control Module

23‧‧‧操作模組 23‧‧‧Operation Module

24‧‧‧顯示模組 24‧‧‧Display Module

25‧‧‧計時模組 25‧‧‧Timing Module

3‧‧‧散熱模組 3‧‧‧Heat Dissipation Module

31‧‧‧散熱層 31‧‧‧Heat Dissipation Layer

32‧‧‧散熱器 32‧‧‧Radiator

33‧‧‧散熱風扇 33‧‧‧Cooling fan

Claims (10)

一種交流馬達轉速控制結構，至少包括：一殼體，具有一蓋體，內部具有一容置空間，表面設有一輸入模組與一輸出模組；一電路板，設在前述容置空間內，並分別與前述輸入模組、輸出模組電性連接，至少包括：一電源模組，與前述輸入模組電性連接，輸入模組導入一交流電；一轉速控制模組，與前述電源模組、輸出模組電性連接，結合交流電產生一交流控制電力傳輸到輸出模組；一操作模組，與前述轉速控制模組電性連接並部分穿出殼體表面，控制轉速控制模組產生不同轉速的交流控制電力；一散熱模組，連接在前述電路板，至少包括：一散熱層，設在前述電路板表面，為多孔石墨材質內填充高導熱金屬所構成，導出電路板動作時的熱能；一散熱器，連接在前述散熱層並導出熱能；一散熱風扇，與前述電源模組電性連接，設在前述散熱器上；藉此，外部交流電經輸入模組傳輸到電路板，操作模組控制轉速控制產生不同轉速的交流控制電力，達成輸出模組連接一交流馬達裝置後具備轉速控制的結構，且電路板動作時產生的高熱能經散熱模組快速排出，達成高速散熱的結構。 An AC motor speed control structure at least includes: a housing with a cover, an accommodating space inside, an input module and an output module on the surface, and a circuit board arranged in the accommodating space, And are respectively electrically connected to the aforementioned input module and output module, including at least: a power module electrically connected to the aforementioned input module, the input module imports an alternating current; a rotational speed control module, and the aforementioned power module , The output module is electrically connected, combined with alternating current to generate an AC control power to be transmitted to the output module; an operating module is electrically connected to the aforementioned speed control module and partially penetrates the surface of the shell, and the control speed control module is different AC control power for rotating speed; a heat dissipation module, connected to the aforementioned circuit board, at least including: a heat dissipation layer, arranged on the surface of the aforementioned circuit board, made of porous graphite material filled with high thermal conductivity metal, and deriving the heat energy of the circuit board during operation A radiator, connected to the aforementioned heat dissipation layer and deriving heat energy; a heat dissipation fan, electrically connected to the aforementioned power supply module, and arranged on the aforementioned radiator; thereby, the external AC power is transmitted to the circuit board via the input module, and the operation module The group control speed control generates AC control power at different speeds, and the output module is connected to an AC motor device to have a speed control structure, and the high heat generated when the circuit board operates is quickly discharged through the heat dissipation module to achieve a high-speed heat dissipation structure. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該輸入模組是一插頭結構，輸出模組是一插座結構。 For the AC motor speed control structure described in item 1 of the scope of patent application, the input module is a plug structure, and the output module is a socket structure. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該輸入模組是一電連接器結構。 In the AC motor speed control structure described in item 1 of the scope of patent application, the input module is an electrical connector structure. 如申請專利範圍第1項所述之交流馬達轉速控制結構，進一步包括一遙控器，產生一控制訊號，以及，電路板包括一無線接收模組，與前述轉速控制模組電性連接，接收控制訊號傳輸到前述轉速控制模組。 For example, the AC motor speed control structure described in item 1 of the scope of patent application further includes a remote controller to generate a control signal, and the circuit board includes a wireless receiving module electrically connected to the aforementioned speed control module to receive control The signal is transmitted to the aforementioned speed control module. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該散熱器可以是散熱鰭片、導熱管組或導熱板。 In the AC motor speed control structure described in the first item of the scope of patent application, the heat sink can be a heat dissipation fin, a heat-conducting tube group or a heat-conducting plate. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該電路板包括一計時模組，與前述電源模組、轉速控制模組、操作模組電性連接，操作模組設定計時模組控制電源模組、轉速控制模組，達成定時啟動、定時關閉、週期性動作的結構。 For example, in the AC motor speed control structure described in item 1 of the scope of patent application, the circuit board includes a timing module electrically connected to the aforementioned power supply module, speed control module, and operation module, and the operation module sets the timing mode Group control power module and speed control module to achieve the structure of timing start, timing shutdown, and periodic action. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該電路板包括一顯示模組，與前述轉速控制模組電性連接並設置在殼體表面，顯示電路板的動作狀態。 In the AC motor speed control structure described in item 1 of the scope of patent application, the circuit board includes a display module, which is electrically connected to the aforementioned speed control module and is arranged on the surface of the housing to display the operating state of the circuit board. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該殼體與蓋體設有複數的散熱孔。 In the AC motor speed control structure described in item 1 of the scope of patent application, the housing and the cover are provided with a plurality of heat dissipation holes. 如申請專利範圍第1項所述之交流馬達轉速控制結構，其中該轉速控制模組選自PWM(Pulse Width Modulation，脈衝寬度調變)、SCR(Silicon Controlled Rectifier，矽控整流器)、TRIAC(Bidirectional Thyristor，雙向閘流體)、IGCT(Intergrated Gate Commutated Thyristors，基體閘換向閘流體)、IGBT(Insulated Gate Bipolar Transistor，絕緣柵雙極電晶體)所組成的控制電路群組其中之一。 For the AC motor speed control structure described in item 1 of the scope of patent application, the speed control module is selected from PWM (Pulse Width Modulation), SCR (Silicon Controlled Rectifier), TRIAC (Bidirectional) Thyristor, two-way thyristor), IGCT (Intergrated Gate Commutated Thyristors, substrate gate commutating thyristors), IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor) composed of one of the control circuit group. 如申請專利範圍第7項所述之交流馬達轉速控制結構，其中該殼體表面設有一窗孔組，供前述電路板的操作模組、顯示模組延伸至殼體表面。 In the AC motor speed control structure described in item 7 of the scope of patent application, a window hole group is provided on the surface of the casing for the operation module and display module of the aforementioned circuit board to extend to the surface of the casing.
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* Cited by examiner, † Cited by third party
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JPH1197597A (en) * 1997-09-18 1999-04-09 Isuzu Ceramics Res Inst Co Ltd Cooling apparatus for semiconductor circuit
JPH11354955A (en) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp Cooling structure for electronic equipment
CN201467060U (en) * 2009-07-23 2010-05-12 乐洪宾 AC motor speed controller
JP2010111252A (en) * 2008-11-06 2010-05-20 Nsk Ltd Electric power steering device
CN207836065U (en) * 2018-03-08 2018-09-07 曾文学 A kind of energy-saving electric equipment radiator
CN209390580U (en) * 2018-10-22 2019-09-13 深圳市中特威科技有限公司 Multiple field vehicle mould governor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197597A (en) * 1997-09-18 1999-04-09 Isuzu Ceramics Res Inst Co Ltd Cooling apparatus for semiconductor circuit
JPH11354955A (en) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp Cooling structure for electronic equipment
JP2010111252A (en) * 2008-11-06 2010-05-20 Nsk Ltd Electric power steering device
CN201467060U (en) * 2009-07-23 2010-05-12 乐洪宾 AC motor speed controller
CN207836065U (en) * 2018-03-08 2018-09-07 曾文学 A kind of energy-saving electric equipment radiator
CN209390580U (en) * 2018-10-22 2019-09-13 深圳市中特威科技有限公司 Multiple field vehicle mould governor

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