TWI722206B - A support separation apparatus, and a support separation method - Google Patents

A support separation apparatus, and a support separation method Download PDF

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TWI722206B
TWI722206B TW106119482A TW106119482A TWI722206B TW I722206 B TWI722206 B TW I722206B TW 106119482 A TW106119482 A TW 106119482A TW 106119482 A TW106119482 A TW 106119482A TW I722206 B TWI722206 B TW I722206B
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support
holding
laminated body
substrate
laminate
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TW106119482A
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TW201804541A (en
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石田信悟
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日商東京應化工業股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

實現即使為帶有彎曲的積層體仍可分離支撐體的新穎的支撐體分離裝置。 A novel support separating device capable of separating the support even with a curved laminated body is realized.

一種支撐體分離裝置(100)，將基板(54)與透射光的支撐體(51)，從隔著因吸收光而變質的分離層(52)進行層積而成的積層體(5)，將支撐體(51)分離，具備供於保持積層體(5)用的保持台(1)，保持台(1)係具有：具備供於吸附積層體(5)用的吸附部(2)的保持面(1a)、和朝保持台(1)按壓積層體(5)的按壓部(3)。 A support separation device (100), a laminated body (5) formed by laminating a substrate (54) and a light-transmitting support (51) through a separation layer (52) that is degraded by absorption of light, The support body (51) is separated and equipped with a holding table (1) for holding the layered body (5), and the holding table (1) is provided with an adsorption unit (2) for adsorbing the layered body (5) A holding surface (1a), and a pressing portion (3) that presses the laminated body (5) toward the holding table (1).

Description

支撐體分離裝置、及支撐體分離方法 Support separation device and support separation method

本發明，係有關從積層體將支撐體分離之支撐體分離裝置及支撐體分離方法。 The present invention relates to a support separation device and a support separation method for separating a support from a laminate.

包含半導體元件(電子構件)的半導體封裝體(半導體裝置)方面，已知WLP(Wafer Level Package)、PLP(Panel Level Package)等。在WLP及PLP等的半導體封裝體方面，已知將位於裸晶的端部的端子再配置於晶片區內的扇入型WLP(Fan-in Wafer Level Package)等的扇入型技術、將端子再配置於晶片區外的扇出型WLP(Fan-out Wafer Level Package)等的扇出型技術。 For semiconductor packages (semiconductor devices) containing semiconductor elements (electronic components), WLP (Wafer Level Package), PLP (Panel Level Package), etc. are known. For semiconductor packages such as WLP and PLP, it is known that the terminals located at the ends of the bare die are rearranged in the die area such as fan-in type WLP (Fan-in Wafer Level Package) and other fan-in technologies. Fan-out technology such as fan-out WLP (Fan-out Wafer Level Package) placed outside the chip area.

尤其，扇出型技術，係實現半導體裝置的積體化、薄型化及小型化等，故吸引注目。扇出型技術，係應用於在面板上配置半導體元件而封裝化的扇出型PLP(Fan-out Panel Level Package)，謀求半導體裝置的生產 性的提升。 In particular, fan-out technology is attracting attention because it realizes integration, thinning, and miniaturization of semiconductor devices. Fan-out technology is applied to fan-out PLP (Fan-out Panel Level Package) in which semiconductor elements are placed on the panel and packaged, and it seeks to produce semiconductor devices Sexual improvement.

於此，例如於專利文獻1，已揭露可在已矯正基板的彎曲的狀態下吸附於吸附面的基板吸附裝置。此外，於專利文獻2，已記載使各吸附噴嘴位於與基板的彎曲量相稱之處而吸附基板的基板吸附方法。 Here, for example, Patent Document 1 discloses a substrate suction device that can be adsorbed on the suction surface in a state where the curvature of the substrate has been corrected. In addition, Patent Document 2 has described a substrate suction method in which each suction nozzle is positioned at a position commensurate with the bending amount of the substrate to suction the substrate.

〔先前技術文獻〕 [Prior technical literature] 〔專利文獻〕 〔Patent Literature〕

[專利文獻1]日本專利特開平5-190414號公報(1993年7月30日公開) [Patent Document 1] Japanese Patent Laid-Open No. 5-190414 (published on July 30, 1993)

[專利文獻2]日本專利特開2003-25174號公報(2003年1月29日公開) [Patent Document 2] Japanese Patent Laid-Open No. 2003-25174 (published on January 29, 2003)

本案的發明人，係在扇出型PLP技術的一個方法方面，正檢討一種裝置及方法，係在作為支撐體的玻璃面板上，隔著因吸收光而變質的分離層，形成將複數個晶片以樹脂進行密封的密封體基板，之後照射光而使分離層變質，從而從密封體基板將支撐體分離。具體而言，一面保持光照射後的積層體中的密封體基板側的面，一面施力於密封體基板與支撐體分離的方向，從而進行密封體基板與支撐體的分離。透過PLP技術而製造的面板型的積層體薄且大型，故於積層體發生彎曲。存在難以固定如此的發 生彎曲的積層體而順利分離支撐體如此的問題。 The inventor of this case is reviewing a method of fan-out PLP technology, and is reviewing a device and method. It is formed on a glass panel as a support through a separation layer that is degraded by absorption of light to form a plurality of wafers. The sealing body substrate sealed with resin is then irradiated with light to change the quality of the separation layer, thereby separating the support from the sealing body substrate. Specifically, the sealing body substrate and the support body are separated by applying force to the direction in which the sealing body substrate and the support body are separated while maintaining the surface on the sealing body substrate side of the laminated body after the light irradiation. The panel-type laminate manufactured by PLP technology is thin and large, so the laminate is bent. It is difficult to fix such a hair There is a problem of smooth separation of the support body due to the bending of the laminated body.

然而，於專利文獻1及2中，未揭露任何有關從帶有彎曲的積層體將支撐體順利分離的支撐體分離裝置。 However, Patent Documents 1 and 2 do not disclose any supporting body separating device for smoothly separating the supporting body from the curved laminated body.

本發明，係鑒於上述問題點而創作者，其目的係在於實現即使為帶有彎曲的積層體仍可分離支撐體的新穎的支撐體分離裝置。 The present invention was created in view of the above-mentioned problems, and its object is to realize a novel support separating device capable of separating the support even if it is a laminated body with a curvature.

為了解決上述之課題，本發明相關的支撐體分離裝置，係從將基板與透射光的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，具備供於保持上述積層體用的保持台，上述保持台，係具有：具備供於吸附上述積層體用的吸附部的保持面、和朝上述保持台按壓上述積層體的按壓部。 In order to solve the above-mentioned problems, the support separation device related to the present invention separates the support from a laminate formed by laminating a substrate and a support that transmits light through a separation layer that is degraded by absorption of light. A holding table for holding the layered body is provided, and the holding table has a holding surface provided with an adsorption part for sucking the layered body, and a pressing part for pressing the layered body against the holding table.

為了解決上述之課題，本發明相關的支撐體分離方法，係從將基板與透射光的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，包含：將上述積層體，以上述支撐體側的面為上而載置於保持台的載置程序；朝上述保持台按壓上述積層體的按壓程序；和使上述積層體吸附於上述保持台的吸附程序。 In order to solve the above-mentioned problems, the support separation method related to the present invention separates the support from a laminate formed by laminating a substrate and a support that transmits light through a separation layer that is degraded by absorption of light. Including: a placing procedure of placing the laminate on a holding stand with the surface on the support side as the upper; a pressing procedure of pressing the laminate against the holding stand; and adsorbing the laminate to the holding stand Adsorption procedure.

依本發明時，發揮即使為帶有彎曲的積層體 仍可分離支撐體如此的效果。 According to the present invention, even a layered body with bending This effect can still be separated from the support.

1‧‧‧保持台 1‧‧‧Holding station

1a‧‧‧保持面 1a‧‧‧Keep the surface

2‧‧‧吸附部 2‧‧‧Adsorption part

21‧‧‧O環體(吸附構材) 21‧‧‧O ring body (adsorption structure)

22‧‧‧吸引部 22‧‧‧Attraction Department

3‧‧‧夾具(按壓部) 3‧‧‧Fixture (pressing part)

31‧‧‧夾臂 31‧‧‧Clamp arm

32‧‧‧夾桿 32‧‧‧Clamping lever

4‧‧‧載具(保持夾具) 4‧‧‧Carrier (holding fixture)

41‧‧‧開口部 41‧‧‧Opening

42‧‧‧凸部 42‧‧‧Protrusion

43‧‧‧凹部 43‧‧‧Concave

5‧‧‧面板型積層體(積層體) 5‧‧‧Panel type laminate (Laminate)

51‧‧‧面板(支撐體) 51‧‧‧Panel (support)

52‧‧‧分離層 52‧‧‧Separation layer

53‧‧‧接著層 53‧‧‧Next layer

54‧‧‧密封體基板(基板) 54‧‧‧Sealing body substrate (substrate)

55‧‧‧元件 55‧‧‧Component

56‧‧‧再配線層 56‧‧‧Rewiring layer

57‧‧‧密封材 57‧‧‧Sealing material

58‧‧‧元件形成區域 58‧‧‧Element formation area

6‧‧‧支撐體保持部 6‧‧‧Support body holding part

61‧‧‧吸附部 61‧‧‧Adsorption part

7‧‧‧雷射照射部(光照射部) 7‧‧‧Laser Irradiation Section (Light Irradiation Section)

100‧‧‧支撐體分離裝置 100‧‧‧Support separation device

[圖1]就本發明的一實施形態相關的支撐體分離裝置的概略的構成進行說明的側面圖。 Fig. 1 is a side view explaining the schematic configuration of a support separating device according to an embodiment of the present invention.

[圖2]就在本發明的一實施形態相關的支撐體分離裝置所具備的保持台保持積層體的狀態進行說明的圖。 [Fig. 2] A diagram for explaining the state in which the laminated body is held by the holding table provided in the support body separating device according to an embodiment of the present invention.

[圖3]就本發明的一實施形態相關的支撐體分離裝置所具備的保持夾具的概略的構成進行繪示的圖。 [Fig. 3] A diagram showing the schematic configuration of a holding jig included in a support separating device according to an embodiment of the present invention.

[圖4]就本發明的一實施形態相關的支撐體分離裝置的動作的概略進行說明的圖。 [FIG. 4] A diagram explaining the outline of the operation of the support separation device according to an embodiment of the present invention.

[圖5]示意性就透過扇出型PLP技術而製造的面板型的積層體的構成的一例進行繪示的圖。 [FIG. 5] A diagram schematically showing an example of the structure of a panel-type laminate manufactured by fan-out PLP technology.

以下，就本發明的實施形態，詳細進行說明。其中，本發明非限定於此者，可在所記述的範圍內以施加各種的變形下的態樣進行實施。另外，本說明書中只要未特別記載，表示數值範圍的「A~B」，係表示「A以上、B以下」。 Hereinafter, embodiments of the present invention will be described in detail. However, the present invention is not limited to this, and can be implemented in a state where various deformations are applied within the described range. In addition, as long as there is no special description in this specification, "A to B" indicating the numerical range means "A or more, B or less".

〔1.支撐體分離裝置〕 [1. Support separation device]

本發明相關的支撐體分離裝置，係從將基板與透射光 的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，並構成為具備供於保持上述積層體用的保持台。 The support separation device related to the present invention is based on the separation of the substrate and the transmitted light The support body is a layered body formed by laminating the separation layer that is degraded by absorption of light, and the support body is separated, and is configured to include a holding table for holding the layered body.

利用圖1~4，而詳細說明有關本發明的一實施形態相關的支撐體分離裝置100。 1 to 4, the support body separating device 100 related to an embodiment of the present invention will be described in detail.

圖1，係就本發明的一實施形態相關的支撐體分離裝置100的概略的構成進行說明的側面圖。 Fig. 1 is a side view explaining the schematic configuration of a support separating device 100 according to an embodiment of the present invention.

圖2，係就在支撐體分離裝置100所具備的保持台1保持積層體5的狀態進行說明的圖，圖2的(a)係透視圖，圖2的(b)係側面圖，圖2的(c)係(b)的放大圖。另外，說明方便起見，在圖2，係就保持台1以外的支撐體分離裝置100的構成省略其圖示。 Fig. 2 is a diagram illustrating the state in which the laminated body 5 is held by the holding table 1 provided in the supporting body separating device 100. Fig. 2(a) is a perspective view, Fig. 2(b) is a side view, and Fig. 2 (C) is an enlarged view of (b). In addition, for the convenience of description, in FIG. 2, the structure of the support separating device 100 other than the holding table 1 is omitted from the illustration.

圖3，係就支撐體分離裝置100所具備的載具(保持夾具)4的概略的構成進行繪示的圖，圖3的(a)係俯視圖，圖3的(b)係圖3的(a)中的A-A’箭頭剖面圖。 Fig. 3 is a diagram showing the schematic configuration of the carrier (holding jig) 4 included in the support separating device 100. Fig. 3(a) is a top view, and Fig. 3(b) is ( a) A-A' arrow cross-sectional view.

圖4的(a)~(e)，係就支撐體分離裝置100的動作的概略進行說明的圖。 (A)-(e) of FIG. 4 is a figure explaining the outline of the operation|movement of the support body separating apparatus 100. As shown in FIG.

如示於圖1，本發明的一實施形態相關的支撐體分離裝置100，係具備保持台1、支撐體保持部6、作為光照射部的雷射照射部7。並且，支撐體分離裝置100，係在保持台1上，將積層體5隔著載具4而保持於保持台1，該積層體5係依序層積透射光的支撐體51、照射光而變質的分離層52、接著層53及基板54而成。另外，本發明的一實 施形態相關的支撐體分離裝置100，係以將基板54配置於下側並將支撐體51配置於上側的方式而將積層體5保持於保持台1上。 As shown in FIG. 1, a support separating device 100 according to an embodiment of the present invention includes a holding table 1, a support holding part 6, and a laser irradiation part 7 as a light irradiation part. In addition, the support separating device 100 is attached to the holding table 1, and the laminated body 5 is held on the holding table 1 with the carrier 4 interposed therebetween. The laminated body 5 is formed by sequentially layering a light-transmitting support 51 and irradiating light. The separation layer 52, the adhesive layer 53, and the substrate 54 that have been deteriorated are formed. In addition, an implementation of the present invention The support separating device 100 related to the embodiment holds the laminated body 5 on the holding table 1 so that the substrate 54 is arranged on the lower side and the support 51 is arranged on the upper side.

於以下，就支撐體分離裝置100所具備的保持台1、支撐體保持部6及雷射照射部7，更詳細進行說明。 In the following, the holding table 1, the support holding portion 6 and the laser irradiation portion 7 included in the support separating device 100 will be described in more detail.

(1.保持台1) (1. Hold the table 1)

如示於圖2的(a)~(c)，保持台1，係用於保持積層體5，具有：保持面1a，其係具備供於吸附積層體5用的吸附部2；一對夾具3，其係作為供朝保持面1a按壓積層體5用的按壓部。 As shown in Fig. 2 (a)~(c), the holding table 1 is used to hold the laminated body 5, and has: a holding surface 1a, which is provided with an adsorption part 2 for adsorbing the laminated body 5; a pair of clamps 3. It serves as a pressing part for pressing the laminated body 5 toward the holding surface 1a.

如示於圖2之(b)，保持台1係進一步具有供於保持積層體5用的載具(保持夾具)4，積層體5係隔著載具4而保持於保持台1。 As shown in (b) of FIG. 2, the holding table 1 further has a carrier (holding jig) 4 for holding the laminated body 5, and the laminated body 5 is held on the holding table 1 with the carrier 4 interposed therebetween.

於以下，詳細說明有關保持台1的各構成。 In the following, each configuration of the holding table 1 will be described in detail.

(保持面1a) (Keep face 1a)

在保持台1的保持面1a，係設置供於吸附積層體5用的吸附部2。吸附部2，係設為有助於在保持面1a上的積層體5的吸附的區域。上述「有助於吸附的區域」，具體而言指將積層體5對於保持面1a予以吸附之力所及的保持面1a上的區域。例如，將積層體5與保持面1a之間的氣體(空氣)朝保持面1a吸引，使得可予以產生將積層體5對於保持面1a予以吸附之力，此情況下在積層體5與保持面1a之 間成為負壓的區域為上述「有助於吸附的區域」，相當於吸附部2。 The holding surface 1a of the holding table 1 is provided with an adsorption part 2 for adsorbing the laminated body 5. The adsorption part 2 is provided as a region which contributes to the adsorption of the laminated body 5 on the holding surface 1a. The above-mentioned "area that contributes to adsorption" specifically refers to the area on the holding surface 1a that the layered body 5 absorbs to the holding surface 1a. For example, the gas (air) between the layered body 5 and the holding surface 1a is sucked toward the holding surface 1a, so that a force can be generated to attract the layered body 5 to the holding surface 1a. In this case, the layered body 5 and the holding surface Of 1a The area where the negative pressure becomes negative pressure is the above-mentioned "area that contributes to adsorption", which corresponds to the adsorption part 2.

於本發明的一實施形態，吸附部2，係如示於圖2的(b)及(c)，具有開口部(未圖示)、作為吸附構材的O環體21，O環體21係作成包圍上述開口部而設。上述開口部，係形成為貫通保持台1，連接於設在保持台1的與保持面1a係相反側的面的吸引部22。O環體21，係以其一部分埋入(嵌入)於形成在保持面1a的溝的狀態而設，氣體從開口部排出，使得O環體21密接於積層體5。 In one embodiment of the present invention, the adsorption part 2 is shown in (b) and (c) of FIG. 2 and has an opening (not shown), an O ring body 21 as an adsorption member, and an O ring body 21 It is made to surround the above-mentioned opening. The above-mentioned opening is formed to penetrate the holding table 1 and is connected to the suction part 22 provided on the surface of the holding table 1 on the opposite side to the holding surface 1a. The O-ring body 21 is provided in a state where a part of it is buried (inserted) in a groove formed on the holding surface 1 a, and gas is discharged from the opening, so that the O-ring body 21 is in close contact with the laminated body 5.

從開口部所吸引的氣體，係經由吸引部22而被排出。因此，吸附部2，係在保持積層體5時從開口部排出氣體而將積層體5對於保持面1a減壓吸附，在解除積層體5的保持時停止從開口部的氣體的排出。另外，於本實施形態，雖示出具備一個開口部的構成，惟亦可作成具備複數個開口部的構成。具備複數個開口部的情況下，可構成為以個別的吸附構材包圍個別的開口部，亦可構成為以單一的吸附構材包圍全部的開口部。 The gas sucked from the opening is discharged through the suction portion 22. Therefore, the adsorption unit 2 exhausts gas from the opening when holding the layered body 5 to adsorb the layered body 5 to the holding surface 1a under reduced pressure, and stops the gas discharge from the opening when the holding of the layered body 5 is released. In addition, in this embodiment, although the structure provided with one opening part is shown, it can also be set as the structure provided with a plurality of opening parts. When a plurality of openings are provided, it may be configured to surround the individual openings with individual suction members, or it may be configured to surround all the openings with a single suction member.

於本發明的其他實施形態方面，吸附構材21亦可採用O環體以外的自封墊料。例如，可列舉O環體以外的擠壓墊料或唇形墊料。O環體以外的擠壓墊料方面，可使用X環體、D環體、T環體等。唇形墊料方面，可使用U墊料、V墊料、L墊料、J墊料等。 In other embodiments of the present invention, the adsorption structure 21 may also be a self-sealing gasket material other than the O-ring body. For example, extruded gaskets or lip gaskets other than O-rings can be cited. For extruded gaskets other than O-rings, X-rings, D-rings, T-rings, etc. can be used. For the lip-shaped bedding, U bedding, V bedding, L bedding, J bedding, etc. can be used.

吸附部2，係構成為有助於在保持面1a上的積層體5的吸附即可，故亦可為不設置吸附構材21而僅設置 開口部的構成。其中，在吸附部2作成包圍開口部而設置吸附構材21，可使得提高積層體5與保持面1a的密閉性，故優選上在吸附部2設置吸附構材21。 The suction part 2 is configured to facilitate the suction of the laminated body 5 on the holding surface 1a, so it may not be provided with the suction member 21 but only provided The structure of the opening. Among them, the suction member 2 is formed to surround the opening and the suction member 21 is provided to improve the airtightness between the laminated body 5 and the holding surface 1 a. Therefore, it is preferable to provide the suction member 21 in the suction section 2.

此外，在吸附部2設置吸附構材21的情況下，優選上在與載置於保持台1的積層體5的外周部分對應的位置，設置吸附構材21。 In addition, when the suction member 21 is provided in the suction part 2, it is preferable to provide the suction member 21 at a position corresponding to the outer peripheral portion of the laminated body 5 placed on the holding table 1.

於本發明的其他實施形態，亦可代替使吸附部2的開口部為貫通孔，而由多孔(多孔質的)材質形成。此情況下，透過由多孔的材質而形成的開口部而吸引積層體5與保持面1a之間的氣體(空氣)，使得可使積層體5吸附於保持面1a。多孔的材質方面，可列舉如聚丙烯、碳、鋁、陶瓷等。 In other embodiments of the present invention, instead of making the opening of the adsorption unit 2 a through hole, it may be formed of a porous (porous) material. In this case, the gas (air) between the layered body 5 and the holding surface 1a is sucked through the opening formed of the porous material, so that the layered body 5 can be adsorbed to the holding surface 1a. In terms of porous materials, polypropylene, carbon, aluminum, ceramics, etc. can be cited.

吸附部2，係具有積層體5的基板不損傷之程度的力，且可對於保持面1a將積層體5予以吸附保持之吸附力即可。「可對於保持面1a將積層體5予以吸附保持之吸附力」，係設為如下之程度的吸附力：將積層體5使支撐體側的面為上而予以吸附保持於保持面1a的狀態下，為了從積層體5使支撐體分離而對積層體5施力時，積層體5與保持面1a的吸附不會被解除。例如，如此的吸附力方面，係50kPa以上、100kPa以下為優選。吸附部2佔保持面1a的面積、開口部的開口的面積(具備複數個開口部的情況下係合計的面積)、吸引裝置的能力等，係可考量積層體5的大小、施加於積層體5的基板的吸附力，而酌情設定。 The suction part 2 has only a force to the extent that the substrate of the layered body 5 is not damaged, and that the layered body 5 can be adsorbed and held on the holding surface 1a. The "adsorption force capable of adsorbing and holding the layered body 5 to the holding surface 1a" is an adhesive force of the following degree: the layered body 5 is adsorbed and held on the holding surface 1a with the support side surface up. Next, when a force is applied to the layered body 5 in order to separate the support from the layered body 5, the adsorption of the layered body 5 and the holding surface 1a will not be released. For example, in terms of such an adsorption force, 50 kPa or more and 100 kPa or less are preferable. The area of the suction portion 2 occupying the holding surface 1a, the area of the opening of the opening (the total area when a plurality of openings are provided), the ability of the suction device, etc., can be taken into consideration by the size of the laminated body 5 and applied to the laminated body 5. The adsorption force of the substrate can be set as appropriate.

保持台1的保持面1a優選上為平坦。保持台1的材質係不特別限定，可採不會受到從雷射照射部7照射的雷射光所致的損傷的材質。例如，可利用鋁、陶瓷等而構成保持台1。採該構成，使得保持台1不會受到照射雷射光所致的損傷。此外，亦能以不會對於積層體5的元件形成區域58造成損傷，且不會污染元件形成區域58的物質為覆蓋材，而覆蓋保持台1的保持面1a。例如，亦可將保持台1的保持面1a，透過導電性矽膠、GORE-TEX(註冊商標)等而覆蓋。採該構成，使得不會有對於積層體5的元件形成區域58造成損傷、污染元件形成區域58之虞。 The holding surface 1a of the holding table 1 is preferably flat. The material of the holding table 1 is not particularly limited, and a material that will not be damaged by the laser light irradiated from the laser irradiation unit 7 may be adopted. For example, the holding table 1 can be constructed using aluminum, ceramics, or the like. With this configuration, the holding table 1 will not be damaged by laser light irradiation. In addition, it is also possible to cover the holding surface 1a of the holding table 1 with a material that does not damage the element formation area 58 of the layered body 5 and does not contaminate the element formation area 58 as a covering material. For example, the holding surface 1a of the holding table 1 may be covered with conductive silicone, GORE-TEX (registered trademark), or the like. With this configuration, there is no risk of damage to the element formation region 58 of the layered body 5 and contamination of the element formation region 58.

(按壓部3) (Pressing part 3)

支撐體分離裝置100，係作為按壓部，在保持台1的保持面1a具備一對夾具3。如示於圖2之(c)，夾具3係具有夾臂31、在夾臂31的前端所設的夾桿32。夾具3，係設為可相對於保持台1而轉動。 The support separating device 100 serves as a pressing portion, and includes a pair of clamps 3 on the holding surface 1 a of the holding table 1. As shown in (c) of FIG. 2, the clamp 3 has a clamp arm 31 and a clamp rod 32 provided at the front end of the clamp arm 31. The clamp 3 is set to be rotatable relative to the holding table 1.

夾具3，係使夾臂31朝保持面1a轉動，透過夾桿32按壓積層體5之上表面，從而朝保持面1a按壓積層體5。藉此，可使保持面1a的吸附部2與載具4的下表面的接觸性、及載具4之上表面與積層體5的接觸性提升。此外，積層體5發生彎曲的情況下，係可透過朝保持面1a按壓積層體5，而校正積層體5的彎曲，故可使積層體5與載具4的接觸性提升。 The clamp 3 rotates the clamp arm 31 toward the holding surface 1a, and presses the upper surface of the laminate 5 through the clamp rod 32, thereby pressing the laminate 5 toward the holding surface 1a. Thereby, the contact between the suction part 2 of the holding surface 1a and the lower surface of the carrier 4, and the contact between the upper surface of the carrier 4 and the laminated body 5 can be improved. In addition, when the laminated body 5 is bent, it is possible to correct the curvature of the laminated body 5 by pressing the laminated body 5 toward the holding surface 1a, so that the contact between the laminated body 5 and the carrier 4 can be improved.

將夾臂31予以旋轉驅動的機構方面，可採用 周知的旋轉致動器等。夾桿32的材質係不特別限定，可採不損傷積層體5的支撐體51的平面部，且不污染該平面部的材質。例如，可利用橡膠、丙烯酸系樹脂、導電性矽等的樹脂、不銹鋼、鋁等的金屬而構成夾桿32。採該構成，使得無損傷積層體5的支撐體51的平面部且污染該平面部之虞。 Regarding the mechanism for rotating the clamp arm 31, it can be used Well-known rotary actuators, etc. The material of the clamp rod 32 is not particularly limited, and a material that does not damage the flat part of the support 51 of the laminated body 5 and does not contaminate the flat part can be used. For example, the clip rod 32 can be formed of resin such as rubber, acrylic resin, conductive silicon, or metal such as stainless steel or aluminum. With this configuration, there is no possibility of damaging the flat surface portion of the support 51 of the layered body 5 and contaminating the flat surface portion.

按壓部3按壓的積層體5上的區域係不特別限定，將可使積層體5充分接觸於載具4的積層體5上的區域，透過按壓部3而按壓即可。因此，按壓部3，係可構成為按壓積層體5之上表面的整體，或者只要可使積層體5充分接觸於載具4，則亦可構成為按壓積層體5之上表面的一部分的區域。 The area on the laminated body 5 pressed by the pressing portion 3 is not particularly limited, and the area on the laminated body 5 of the carrier 4 that the laminated body 5 can sufficiently contact with the carrier 4 may be pressed through the pressing portion 3. Therefore, the pressing portion 3 may be configured to press the entire upper surface of the laminated body 5, or as long as the laminated body 5 can sufficiently contact the carrier 4, it may be configured to press a part of the upper surface of the laminated body 5. .

於此，「使積層體5充分接觸於載具4」，係設為使積層體5與載具4接觸成可將積層體5吸附保持於載具4之程度的狀態。此外，「可將積層體5吸附保持於載具4」，係例如設為將積層體5使支撐體側的面為上而予以吸附保持於載具4的狀態下，為了從積層體5使支撐體分離而對積層體5施力時，積層體5與載具4的吸附不會被解除的狀態。因此，在可將積層體5吸附保持於載具4的限度內，載具4之上表面的一部分未接觸於積層體5的情況，亦屬於上述「使積層體5充分接觸於載具4的」狀態。另外，有關按壓部3所按壓的積層體5上的區域，雖以將積層體5隔著載具4而載置於保持面1a的實施形態進行說明，惟於本發明的其他實施形態，亦可將積層體5直接載置於保持面 1a。此情況下，有關按壓部3所按壓的積層體5上的區域的上述說明中，將「載具4」換成「吸附部2」而適用說明，詳細說明係省略。 Here, "make the layered body 5 fully contact the carrier 4" is to make the layered body 5 and the carrier 4 come into contact with each other so that the layered body 5 can be held by the carrier 4 by suction. In addition, "the layered body 5 can be adsorbed and held on the carrier 4", for example, in a state in which the layered body 5 is sucked and held on the carrier 4 with the support side surface up, in order to remove the layered body 5 from the carrier 4. When the support body is separated and a force is applied to the layered body 5, the adsorption of the layered body 5 and the carrier 4 is not released. Therefore, within the limit that the laminated body 5 can be adsorbed and held on the carrier 4, the case where a part of the upper surface of the carrier 4 is not in contact with the laminated body 5 also belongs to the above-mentioned "make the laminated body 5 fully contact the carrier 4". "status. In addition, although the area on the laminated body 5 pressed by the pressing portion 3 is described in the embodiment in which the laminated body 5 is placed on the holding surface 1a with the carrier 4 interposed therebetween, it is also applicable to other embodiments of the present invention. The laminated body 5 can be directly placed on the holding surface 1a. In this case, in the above description regarding the area on the laminated body 5 pressed by the pressing portion 3, the "carrier 4" is replaced with the "suction portion 2" and the description is applied, and the detailed description is omitted.

如示於圖2之(a)，優選上以按壓積層體5之上表面的外周部分的方式而構成按壓部3。在積層體5的基板的外周部分未形成元件，故以按壓積層體5的外周部分的方式構成按壓部3，使得可在不損傷基板下按壓積層體5。 As shown in (a) of FIG. 2, the pressing portion 3 is preferably configured to press the outer peripheral portion of the upper surface of the laminated body 5. Since no element is formed on the outer peripheral portion of the substrate of the laminate 5, the pressing portion 3 is configured to press the outer peripheral portion of the laminate 5 so that the laminate 5 can be pressed without damaging the substrate.

此外，如示於圖2之(c)，於吸附部2，在與載置於保持台1的積層體5外周部分對應的位置設置吸附構材21的情況下，透過按壓部3按壓積層體5之上表面的外周部分，使得能以按壓部3與吸附構材21而夾住載具4及積層體5。藉此，可使吸附構材21與載具4的下表面的接觸性、及載具4之上表面與積層體5的接觸性提升。 In addition, as shown in FIG. 2(c), in the suction part 2, when the suction member 21 is provided at a position corresponding to the outer peripheral portion of the laminated body 5 placed on the holding table 1, the laminated body is pressed through the pressing part 3 5 The outer peripheral portion of the upper surface allows the carrier 4 and the laminated body 5 to be sandwiched by the pressing portion 3 and the suction member 21. Thereby, the contact between the suction member 21 and the lower surface of the carrier 4 and the contact between the upper surface of the carrier 4 and the laminated body 5 can be improved.

按壓積層體5的外周部分的情況下，係在可將積層體5吸附保持於載具4的限度內，可按壓積層體5的外周部分的一部分，亦可按壓積層體5的外周部分的整體。按壓積層體5的外周部分的一部分的情況下，優選上按壓積層體5的外周部分的至少二處。此外，此情況下，較優選上使與積層體5的外周部分的其中一個按壓位置(第1按壓位置)最遠離的位置為另一個按壓位置(第2按壓位置)。藉此，可更平衡佳地按壓積層體5。 When pressing the outer peripheral portion of the laminated body 5, the laminated body 5 can be sucked and held within the limit of the carrier 4, and a part of the outer peripheral portion of the laminated body 5 can be pressed, or the entire outer peripheral portion of the laminated body 5 can be pressed. . When pressing a part of the outer peripheral part of the laminated body 5, it is preferable to press at least two places of the outer peripheral part of the laminated body 5 upwards. In addition, in this case, it is more preferable that the position farthest from one of the pressing positions (first pressing position) of the outer peripheral portion of the laminated body 5 is the other pressing position (second pressing position). Thereby, the laminated body 5 can be pressed in a more balanced manner.

按壓部3的對於積層體5的接觸面的面積雖不特別限定，惟按壓積層體5的外周部分的情況下，如示於 圖2的(a)般積層體5為矩形時，優選上以按壓積層體5的外周部分的一邊整體的方式，而構成按壓部3的對於積層體5的接觸面。 Although the area of the contact surface of the pressing portion 3 with respect to the laminated body 5 is not particularly limited, when the outer peripheral portion of the laminated body 5 is pressed, as shown in When the laminated body 5 of FIG. 2 (a) is generally rectangular, it is preferable to press the entire outer peripheral portion of the laminated body 5 to form the contact surface of the pressing portion 3 with respect to the laminated body 5.

(載具4) (Vehicle 4)

如示於圖3之(a)，載具(保持夾具)4係具備開口部41，該開口部41係作為供於吸引積層體用的貫通孔。另外，於圖3的(a)，係載具4具有的複數個開口部41之中，僅對一個開口部41附加符號，就其他開口部41係省略符號。 As shown in Fig. 3(a), the carrier (holding jig) 4 is provided with an opening 41 as a through hole for sucking the laminated body. In addition, in FIG. 3(a), among the plurality of openings 41 of the carrier 4, only one opening 41 is given a symbol, and the other openings 41 are abbreviated.

載具4，係優選上在與積層體的基板上的未形成元件的區域對應的位置，具有複數個開口部41。藉此，可將積層體的基板上的未形成元件的區域進行吸附而保持積層體，故不會產生損傷元件的在元件殘留吸附痕等的瑕疵。 The carrier 4 preferably has a plurality of openings 41 at positions corresponding to regions on the substrate of the laminate where no elements are formed. Thereby, the area on the substrate of the laminate body where the element is not formed can be adsorbed and the laminate body can be held. Therefore, there is no occurrence of defects such as a suction mark remaining on the element that damages the element.

載具4的大小及形狀，係在可保持積層體的限度內，可依作為保持對象的積層體的大小及形狀而酌情設定。可使載具4的大小及形狀與作為保持對象的積層體的大小及形狀一致，亦可使載具4的大小比積層體大。載具4，係在搬運將支撐體分離後的基板的情況下等，具有為了防止基板的各構成要素的破損或變形所需的強度即可。因此，載具4的厚度，係下限值為2mm以上為優選，較優選上10mm以上。此外，載具4的厚度，係上限值為6mm以下為優選。 The size and shape of the carrier 4 are within the limits of the layered body that can be held, and can be set as appropriate according to the size and shape of the layered body to be held. The size and shape of the carrier 4 can be made to match the size and shape of the laminated body to be held, or the size and shape of the carrier 4 may be larger than the laminated body. The carrier 4 is required to have the strength required to prevent breakage or deformation of each component of the substrate, for example, in the case of transporting the substrate from which the support has been separated. Therefore, the lower limit of the thickness of the carrier 4 is preferably 2 mm or more, and more preferably 10 mm or more. In addition, the upper limit of the thickness of the carrier 4 is preferably 6 mm or less.

載具4，係能以鋁、不銹鋼等而形成。載具4以鋁而形成的情況下，優選上至少載具4的載置積層體之側的面(亦即，光照射程序中光被照射之面)被陽極氧化處理。 The carrier 4 can be formed of aluminum, stainless steel, or the like. When the carrier 4 is formed of aluminum, it is preferable that at least the surface of the carrier 4 on the side where the laminated body is placed (that is, the surface irradiated with light in the light irradiation process) is anodized.

於一實施形態，可使透過扇出型PLP技術而製造的面板型的積層體用的保持夾具，為與作為保持對象的積層體相同的大小及形狀。例如，可使透過扇出型PLP技術而製造的面板型的積層體用的保持夾具，為長邊方向515mm、短邊方向510mm、厚度4mm的矩形的被陽極氧化處理的鋁製的板狀體。 In one embodiment, the holding jig for a panel-type laminate manufactured by fan-out PLP technology can have the same size and shape as the laminate to be held. For example, the holding jig for a panel-type laminate manufactured by fan-out PLP technology can be a rectangular anodized aluminum plate with 515 mm in the long side direction, 510 mm in the short side direction, and 4 mm in thickness. .

此外，有關開口部41的大小及形狀係雖不特別限定，惟優選上具有相同的大小及形狀的複數個開口部41被等間隔地設置。藉此，能以均等的力而平衡佳地吸引積層體。 In addition, although the size and shape of the opening 41 are not particularly limited, it is preferable that a plurality of openings 41 having the same size and shape are provided at equal intervals. Thereby, it is possible to attract the laminated body with an equal force and a good balance.

於此，作為積層體的一例，就透過扇出型PLP技術而製造的面板型的積層體的構成的一例，參照圖5進行說明。圖5係示意性就透過扇出型PLP技術而製造的面板型的積層體的構成的一例進行繪示的圖，圖5的(a)係就透過扇出型PLP技術而製造的面板型的積層體，從密封體基板側的面所見時的俯視圖，圖5的(b)係以(a)的虛線包圍的區域A之側面圖。 Here, as an example of a laminated body, an example of the structure of a panel-type laminated body manufactured by fan-out type PLP technology will be described with reference to FIG. 5. FIG. 5 is a diagram schematically showing an example of the structure of a panel-type laminate manufactured by fan-out PLP technology, and FIG. 5(a) is a diagram of a panel-type laminate manufactured by fan-out PLP technology The laminated body is a plan view when seen from the surface on the side of the sealing body substrate, and FIG. 5(b) is a side view of the region A surrounded by the broken line of (a).

如示於圖5之(b)，於一實施形態，透過扇出型PLP技術而製造的面板型的積層體5(以下，稱為「面板型積層體5」)，係在作為支撐體的面板51上，因吸收 光而變質的分離層52、接著層53、密封體基板54被依此順序而形成。密封體基板54，係具備元件55、將元件55密封的密封材57、形成於元件55上的再配線層56。密封體基板54，係具備複數個元件55，切割如此的密封體基板54，使得可獲得複數個電子構件。另外，有關面板型積層體5具備的各構材的構成，係在後述的「4.積層體5」的項目中詳細進行說明。 As shown in FIG. 5(b), in one embodiment, a panel-type laminate 5 (hereinafter referred to as "panel-type laminate 5") manufactured by fan-out PLP technology is attached to a supporting body On panel 51, due to absorption The separation layer 52, the adhesive layer 53, and the sealing body substrate 54 that are altered by light are formed in this order. The sealing body substrate 54 includes an element 55, a sealing material 57 for sealing the element 55, and a rewiring layer 56 formed on the element 55. The sealing body substrate 54 is provided with a plurality of elements 55, and such a sealing body substrate 54 is cut so that a plurality of electronic components can be obtained. In addition, the configuration of each member included in the panel-type laminate 5 will be described in detail in the item "4. Laminate 5" described later.

將示於圖5的(a)的面板型積層體5的密封體基板54上的形成元件55及再配線層56的區域，稱為「積層體的基板上的形成元件的區域58」(以下，稱為「元件形成區域58」)，將此以外的區域稱為「積層體的基板上的未形成元件的區域」(以下，稱為「元件非形成區域57」)。另外，在圖5的(a)，係填色部分表示元件非形成區域57，填色部分的內側係全部表示元件形成區域58，填色部分的外側係表示面板51。 The area where the elements 55 and the rewiring layer 56 are formed on the sealing body substrate 54 of the panel-type laminate 5 shown in FIG. 5(a) is referred to as the "element forming area 58 on the laminate substrate" (hereinafter , Referred to as "element formation region 58"), and regions other than this are referred to as "a region where elements are not formed on the laminate substrate" (hereinafter referred to as "element non-formation region 57"). In addition, in (a) of FIG. 5, the filled part represents the element non-formation area 57, the inside of the filled part represents the element formation area 58, and the outside of the filled part represents the panel 51.

如示於圖5之(a)，於面板型積層體5，係元件非形成區域57被格子狀地形成。因此，面板型積層體5用的載具4方面，如示於圖3之(a)，優選上將開口部41格子狀地配置。此外，載具4，係優選上在與元件形成區域58(圖5的(a))對應的位置，具有凹部43。另外，於圖3的(a)，係載具4具有的複數個凹部43之中，僅對一個凹部43附加符號，有關其他凹部43係省略符號。 As shown in FIG. 5(a), in the panel type laminate 5, the element non-formation regions 57 are formed in a grid pattern. Therefore, as for the carrier 4 for the panel type laminate 5, as shown in FIG. 3(a), it is preferable that the openings 41 are arranged in a grid pattern. In addition, the carrier 4 preferably has a recess 43 at a position corresponding to the element formation area 58 (FIG. 5(a)). In addition, in (a) of FIG. 3, among the plurality of recesses 43 included in the carrier 4, only one recess 43 is assigned a reference numeral, and the other recesses 43 are omitted from reference numerals.

如示於圖3的(a)及(b)，載具4具有凹部43的情況下，與元件非形成區域57(圖5的(a))對應的 位置係成為凸部42。另外，在圖3的(a)，係填色部分表示凸部42。並且，如示於圖3之(b)，開口部41係設於凸部42。採該構成，使得僅載具4的凸部42、與面板型積層體的元件非形成區域57(圖5的(a))接觸。亦即，元件形成區域58(圖5的(a))與載具4不接觸。為此，可在不損傷面板型積層體的元件下，將面板型積層體吸附保持。 As shown in (a) and (b) of FIG. 3, when the carrier 4 has a recess 43, it corresponds to the element non-forming area 57 (FIG. 5(a)) The position is the convex portion 42. In addition, in (a) of FIG. 3, the filled portion indicates the convex portion 42. In addition, as shown in (b) of FIG. 3, the opening 41 is provided on the convex portion 42. With this structure, only the convex portion 42 of the carrier 4 and the element non-formation area 57 of the panel-type laminate (FIG. 5(a)) are in contact with each other. That is, the element formation area 58 (FIG. 5(a)) and the carrier 4 are not in contact. For this reason, the panel-type laminate can be sucked and held without damaging the elements of the panel-type laminate.

凹部43的深度雖不特別限定，惟於一實施形態，例如凸部42的厚度為4mm的情況下，可使凹部43的厚度為3.5mm(亦即，可使凹部43的深度為0.5mm)。 Although the depth of the concave portion 43 is not particularly limited, in one embodiment, for example, when the thickness of the convex portion 42 is 4 mm, the thickness of the concave portion 43 can be 3.5 mm (that is, the depth of the concave portion 43 can be 0.5 mm) .

載具4的凸部42，係雖能以與載具4的主體相同的材料而形成，惟載具4以鋁而形成的情況下，凸部42係優選上被陽極氧化處理。此外，載具4的凹部43，係優選上以全氟聚乙烯(PTFE)等的氟系樹脂等的樹脂、或GORE-TEX(註冊商標)等的複合樹脂材料而覆蓋。 Although the convex portion 42 of the carrier 4 can be formed of the same material as the main body of the carrier 4, when the carrier 4 is formed of aluminum, the convex portion 42 is preferably anodized. In addition, the recess 43 of the carrier 4 is preferably covered with a resin such as a fluorine resin such as perfluoropolyethylene (PTFE), or a composite resin material such as GORE-TEX (registered trademark).

於一實施形態，載具4係優選上在外周部具有導管(排氣部，未圖示)。藉此，可將屬將支撐體分離後產生的分離層等的殘渣的粉塵，從導管朝支撐體分離裝置之外排出。 In one embodiment, the carrier 4 preferably has a duct (exhaust part, not shown) on the outer peripheral part. Thereby, dust, which is the residue of the separation layer and the like generated after separating the support, can be discharged from the duct to the outside of the support separation device.

(2.雷射照射部7) (2. Laser Irradiation Section 7)

支撐體分離裝置100，係具備作為光照射部的雷射照射部7。如示於圖4之(c)，雷射照射部7，係對照射光前的積層體5的分離層52隔著支撐體51而照射光，使分離層 52變質。 The support separation device 100 includes a laser irradiation unit 7 as a light irradiation unit. As shown in Fig. 4(c), the laser irradiating section 7 irradiates the separation layer 52 of the laminated body 5 before the light is irradiated with light through the support 51, so that the separation layer 52 spoiled.

雷射照射部7，係就保持於保持台1的積層體5之上進行掃描，從而隔著支撐體51對分離層52的整面照射雷射光。 The laser irradiation unit 7 scans the laminated body 5 held on the holding table 1 to irradiate the entire surface of the separation layer 52 with laser light via the support 51.

雷射照射部7照射於分離層52的光方面，係依分離層52可吸收的波長，而酌情選擇例如YAG雷射、紅寶石雷射、玻璃雷射、YVO4雷射、LD雷射及光纖雷射等的固態雷射、色素雷射等的液態雷射、CO2雷射、準分子雷射、Ar雷射及He-Ne雷射等的氣態雷射、以及半導體雷射及自由電子雷射等的雷射光即可。此外，只要可使分離層52變質，則亦可照射非雷射光。對分離層52照射的光方面，可為例如600nm以下的波長的光，但不限定於此。雷射輸出、脈衝頻率，係依分離層的種類、厚度及基板的種類等的條件而酌情調整即可。 Regarding the light irradiated by the laser irradiation unit 7 on the separation layer 52, the wavelengths that can be absorbed by the separation layer 52 can be selected as appropriate, such as YAG laser, ruby laser, glass laser, YVO 4 laser, LD laser, and optical fiber. Solid lasers such as lasers, liquid lasers such as pigment lasers, CO 2 lasers, excimer lasers, gas lasers such as Ar lasers and He-Ne lasers, as well as semiconductor lasers and free electron lasers Laser light such as laser light is sufficient. In addition, as long as the quality of the separation layer 52 can be changed, non-laser light may be irradiated. The light irradiated to the separation layer 52 may be, for example, light having a wavelength of 600 nm or less, but it is not limited to this. The laser output and pulse frequency can be adjusted according to conditions such as the type and thickness of the separation layer and the type of substrate.

另外，透過雷射照射部7進行的朝分離層52的光的照射，係透過使雷射照射部7及保持台1相對移動而進行即可。因此，於其他實施形態相關的支撐體分離裝置，可透過使雷射照射部7及保持台1雙方相對移動，從而對分離層52照射光。 In addition, the irradiation of light to the separation layer 52 through the laser irradiation unit 7 may be performed by relatively moving the laser irradiation unit 7 and the holding table 1. Therefore, in the support separation device according to other embodiments, the separation layer 52 can be irradiated with light by relatively moving both the laser irradiation unit 7 and the holding table 1.

(3.支撐體保持部6) (3. Support body holding part 6)

支撐體保持部6，係用於將照射光後的積層體5中的支撐體51保持而分離。支撐體保持部6，係具備連通於減壓部(未圖示)的複數個吸附部61，經由吸附部61而保持支 撐體51。支撐體保持部6，係構成為吸附支撐體51的周緣部分。另外，支撐體保持部6，係可透過升降部(未圖示)相對於保持台1的載置積層體5之面予以垂直升降。 The supporting body holding portion 6 is for holding and separating the supporting body 51 in the laminated body 5 after the light is irradiated. The support holding portion 6 is provided with a plurality of suction portions 61 communicating with a decompression portion (not shown), and the support is held through the suction portion 61 Support body 51. The support holding portion 6 is configured to adsorb the peripheral portion of the support 51. In addition, the support body holding portion 6 can be vertically raised and lowered with respect to the surface of the holding table 1 on which the layered body 5 is placed through an elevating portion (not shown).

之後，如示於圖1，使吸附部61吸附支撐體51的狀態下將支撐體保持部6抬起，使得可將支撐體51抬起。此時，積層體5，係分離層52變質。亦即，積層體5，係成為分離層52可能受到些微的外力而被破壞的狀態、或與和分離層52相接之層的接著力降低的狀態。為此，支撐體保持部6抬起支撐體51時所施加的些微的力，使得分離層52被破壞。因此，可適當地從積層體5將支撐體51分離。另外，上述「與和分離層52相接之層的接著力降低的狀態」，係亦可包含分離層52從該相接之層(例如，接著層53或支撐體51)脫離的狀態。 After that, as shown in FIG. 1, the support body holding portion 6 is lifted in a state in which the suction portion 61 adsorbs the support body 51 so that the support body 51 can be lifted. At this time, the layered body 5 and the separation layer 52 are deteriorated. That is, the layered body 5 is in a state in which the separation layer 52 may be damaged by a slight external force, or in a state in which the adhesive force of the layer in contact with the separation layer 52 is reduced. For this reason, the slight force applied when the support body holding portion 6 lifts the support body 51 causes the separation layer 52 to be destroyed. Therefore, the support 51 can be appropriately separated from the laminated body 5. In addition, the above-mentioned "state in which the adhesive force of the layer in contact with the separation layer 52 is reduced" may include a state in which the separation layer 52 is separated from the layer in contact (for example, the adhesive layer 53 or the support 51).

支撐體保持部6具有的吸附部61方面，例如雖可使用周知的吸附墊，惟只要為可減壓吸附者，則亦可採用吸附墊以外者作為吸附部。 As for the adsorption part 61 which the support body holding|maintenance part 6 has, although a well-known adsorption pad can be used, for example, as long as it is the thing which can adsorb|suck under reduced pressure, you may use something other than an adsorption pad as an adsorption part.

於本發明的其他實施形態相關的支撐體分離裝置，亦可代替吸附部而將支撐體保持部6構成為具備爪部(例如，夾具等)，將被保持台1所吸附保持的積層體5中的支撐體51的周緣部分端部的倒角部位，透過支撐體保持部6進行把持從而施力，而將基板54與支撐體51分離。 In the support separation device related to other embodiments of the present invention, instead of the suction portion, the support holding portion 6 may be configured to include a claw portion (for example, a clamp, etc.) to hold the laminated body 5 sucked and held by the holding table 1 The chamfered portion of the end of the peripheral portion of the support body 51 is held by the support body holding portion 6 to apply force to separate the substrate 54 from the support body 51.

(4.積層體5) (4.Layered body 5)

作為透過支撐體分離裝置100將支撐體51分離的對象 的積層體5的一例方面，就屬PLP技術的一例的透過扇出型PLP技術而製造的面板型的積層體的構成的一例，參照圖5進行說明。如示於圖5之(b)，透過扇出型PLP技術而製造的面板型的積層體5(以下，稱為「面板型積層體5」)，係在作為支撐體的面板51上，因吸收光而變質的分離層52、接著層53、密封體基板54被依此順序而形成。 As an object to separate the support 51 through the support separation device 100 As for an example of the laminate 5, an example of the structure of a panel-type laminate manufactured by fan-out PLP technology, which is an example of the PLP technology, will be described with reference to FIG. 5. As shown in Fig. 5(b), the panel-type laminate 5 (hereinafter referred to as "panel-type laminate 5") manufactured by fan-out PLP technology is attached to the panel 51 as a support, because The separation layer 52, the adhesive layer 53, and the sealing body substrate 54 that are degraded by absorbing light are formed in this order.

(面板51) (Panel 51)

作為支撐體的面板51，係將密封體基板54形成於面板51上的情況下，在搬運密封體基板54時等，具有為了防止密封體基板54的各構成要素的破損或變形所需的強度即可。此外，面板51，係由使可使形成於面板51上的分離層52變質的波長的光透射的材料而形成即可。 The panel 51 as a support body has the strength required to prevent damage or deformation of each component of the sealing body substrate 54 when the sealing body substrate 54 is formed on the panel 51, when the sealing body substrate 54 is transported, etc. That's it. In addition, the panel 51 may be formed of a material that transmits light of a wavelength that can change the quality of the separation layer 52 formed on the panel 51.

作為面板51的材料，雖可採用例如玻璃、矽、丙烯酸系樹脂等，惟未限定於此等。面板51的形狀方面，係一般而言，可採用矩形的板狀者。於一實施形態，面板51係長邊方向515mm、短邊方向510mm、厚度1.3mm的矩形的玻璃製面板。 As a material of the panel 51, although glass, silicon, acrylic resin, etc. can be used, for example, it is not limited to these. Regarding the shape of the panel 51, generally, a rectangular plate shape can be used. In one embodiment, the panel 51 is a rectangular glass panel of 515 mm in the long side direction, 510 mm in the short side direction, and 1.3 mm in thickness.

(分離層52) (Separation layer 52)

分離層52，係因吸收隔著面板51而照射的光而變質之層。分離層52，係優選上由具有吸收光的構造的材料而形成，惟在不損及分離層的本質的特性的範圍內，亦可添加不具有吸收光的構造的材料而形成分離層52。 The separation layer 52 is a layer that is changed in quality by absorbing the light irradiated through the panel 51. The separation layer 52 is preferably formed of a material having a structure that absorbs light, but within a range that does not impair the essential characteristics of the separation layer, a material that does not have a structure that absorbs light may be added to form the separation layer 52.

於一實施形態，分離層52係亦可由氟碳化物而成。分離層52，係由氟碳化物而構成，使得因吸收光而變質，作為此結果，喪失接收光的照射前的強度或接著性。因此，可施加些微的外力(例如，抬起面板51等)，使得分離層52被破壞，而易於將面板51與密封體基板54分離。構成分離層52的氟碳化物，係可透過電漿CVD(化學氣相堆積)法而適當地進行成膜。 In one embodiment, the separation layer 52 may also be made of fluorocarbon. The separation layer 52 is made of fluorocarbon, so that it is deteriorated due to absorption of light, and as a result, the strength or adhesiveness of the received light before irradiation is lost. Therefore, a slight external force (for example, lifting up the panel 51, etc.) can be applied, so that the separation layer 52 is destroyed, and the panel 51 is easily separated from the sealing body substrate 54. The fluorocarbon constituting the separation layer 52 can be appropriately formed into a film by a plasma CVD (chemical vapor deposition) method.

此外，於其他實施形態，例如分離層52，係可利用於其反復單位含有具有光吸收性的構造的聚合體、無機物、具有紅外線吸收性的構造的化合物、及反應性聚倍半矽氧烷等而形成。另外，在分離層52的光的吸收率係80%以上為優選。 In addition, in other embodiments, for example, the separation layer 52 can be used in its repeating unit containing polymers with light-absorbing structures, inorganic substances, compounds with infrared-absorbing structures, and reactive polysilsesquioxanes. And so on. In addition, it is preferable that the light absorption rate of the separation layer 52 is 80% or more.

分離層52的厚度，係下限值為0.05μm以上為優選，較優選上為0.3μm以上。此外，分離層52的厚度，係上限值為50μm以下為優選，較優選上為1μm以下。只要分離層52的厚度落入0.05μm~50μm的範圍，即可透過短時間的光的照射及低能的光的照射，從而予以發生分離層52所期望的變質。此外，分離層52的厚度，係從生產性的觀點而言特優選上落入1μm以下的範圍。 The lower limit of the thickness of the separation layer 52 is preferably 0.05 μm or more, and the upper limit is more preferably 0.3 μm or more. In addition, the upper limit of the thickness of the separation layer 52 is preferably 50 μm or less, and more preferably 1 μm or less. As long as the thickness of the separation layer 52 falls within the range of 0.05 μm to 50 μm, short-time light irradiation and low-energy light irradiation can be transmitted, and the desired quality of the separation layer 52 can be changed. In addition, the thickness of the separation layer 52 is particularly preferably within a range of 1 μm or less from the viewpoint of productivity.

於本說明書中，分離層「變質」係表示以下現象：予以變成分離層可能受到些微的外力而被破壞的狀態、或與和分離層相接之層的接著力降低的狀態。因吸收光而發生的分離層的變質的結果方面，分離層52係喪失接收光的照射前的強度或接著性。亦即，吸收光使得分離層 脆化。分離層的變質，係可能為發生分離層所吸收的光的能量所致的分解、立體配置的變化或官能基的解離等。分離層的變質，係發生為吸收光的結果。 In this specification, the "deterioration" of the separation layer means the following phenomenon: it becomes a state where the separation layer may be damaged by a slight external force, or a state where the adhesive force of the layer in contact with the separation layer is reduced. As a result of the deterioration of the separation layer due to the absorption of light, the separation layer 52 loses the intensity or adhesiveness of the light-receiving before irradiation. That is, absorption of light makes the separation layer Brittle. The deterioration of the separation layer may be caused by decomposition caused by the energy of the light absorbed by the separation layer, a change in the three-dimensional configuration, or the dissociation of functional groups. The deterioration of the separation layer occurs as a result of light absorption.

因此，例如可予以變質為僅將支撐體抬起即使得分離層被破壞，而容易地將支撐體與密封體基板54分離。更具體而言，例如可透過支撐體分離裝置等而將積層體中的基板及支撐體中的其中一者固定於載置台，透過具備吸附手段的吸附墊(保持部)等將另一者保持而抬起，從而將支撐體與基板分離；或可將支撐體的周緣部分端部的倒角部位，透過具備夾具(爪部)等的分離板進行把持從而施力，將基板與支撐體分離。此外，例如亦可透過具備供應供於剝離接著劑用的剝離液的剝離手段的支撐體分離裝置，從而從積層體中的基板將支撐體剝離。透過該剝離手段而對積層體中的接著層的周端部的至少一部分供應剝離液，使積層體中的接著層溶解，使得力從該接著層溶解之處集中至分離層，使得可對基板與支撐體施力。為此，可適當地將基板與支撐體分離。 Therefore, for example, it can be modified such that only the support body is lifted, that is, the separation layer is destroyed, and the support body and the sealing body substrate 54 can be easily separated. More specifically, for example, one of the substrate and the support in the laminate can be fixed to the mounting table through a support separation device, etc., and the other can be held by an adsorption pad (holding portion) equipped with adsorption means, etc. Lift up to separate the support from the substrate; or the chamfered part of the peripheral end of the support can be grasped by a separation plate equipped with a clamp (claw) to apply force to separate the substrate from the support . In addition, for example, the support may be peeled from the substrate in the laminate through a support separation device provided with a peeling means for supplying a peeling liquid for peeling the adhesive. The peeling liquid is supplied to at least a part of the peripheral end of the adhesive layer in the laminate by the peeling means, and the adhesive layer in the laminate is dissolved, so that the force is concentrated from the place where the adhesive layer is dissolved to the separation layer, so that the substrate can be Apply force to the support body. For this reason, the substrate can be appropriately separated from the support.

另外，施加於積層體之力，係可依積層體的大小等而適當調整即可，雖不限定，惟例如面積為40000~70000mm2程度的積層體時，施加0.98~49N(0.1~5kgf)程度的力，使得可適當地將基板與支撐板分離。 In addition, the force applied to the laminate can be appropriately adjusted according to the size of the laminate. Although it is not limited, for example, for a laminate with an area of about 40,000 to 70,000 mm 2 , 0.98 to 49N (0.1 to 5kgf) is applied. A high degree of force makes it possible to properly separate the substrate from the support plate.

(接著層53) (Next layer 53)

接著層53，係用於將密封體基板54固定於面板51上。 接著層53，係例如可透過旋轉塗佈法、浸漬、輥式刮塗、噴塗、狹縫式塗佈等的方法，而在分離層52上塗佈接著劑從而形成。 The adhesive layer 53 is used to fix the sealing substrate 54 on the panel 51. The adhesive layer 53 can be formed by applying an adhesive on the separation layer 52 by methods such as spin coating, dipping, roll coating, spray coating, and slit coating, for example.

接著層53的厚度，係可依面板51及密封體基板54的種類等而酌情設定。例如，分離層52的厚度，係下限值為10μm以上為優選，較優選上為15μm以上。此外，分離層52的厚度，係上限值為150μm以下為優選，較優選上為100μm以下。 The thickness of the adhesive layer 53 can be set as appropriate according to the types of the panel 51 and the sealing body substrate 54 and so on. For example, the lower limit of the thickness of the separation layer 52 is preferably 10 μm or more, and the upper limit is more preferably 15 μm or more. In addition, the upper limit of the thickness of the separation layer 52 is preferably 150 μm or less, and more preferably 100 μm or less.

此外，接著劑含有的樹脂，亦即接著層53含有的樹脂方面，為具備接著性者即可。例如，較優選上可將烴樹脂、丙烯酸-苯乙烯系樹脂、馬來亞醯胺系樹脂、彈性體樹脂、聚碸系樹脂等、或將此等組合者等用作為接著層53含有的樹脂。此外，接著劑，係優選上含有供於調整塗佈作業性用的稀釋溶劑。於此，稀釋溶劑，係考量與接著層含有的樹脂的相溶性下適當選擇即可。 In addition, the resin contained in the adhesive, that is, the resin contained in the adhesive layer 53 may have adhesive properties. For example, it is more preferable to use hydrocarbon resins, acrylic-styrene resins, maleimide resins, elastomer resins, polycarbonate resins, etc., or combinations thereof, as the resin contained in the adhesive layer 53 . In addition, the adhesive preferably contains a diluting solvent for adjusting coating workability. Here, the dilution solvent may be appropriately selected in consideration of compatibility with the resin contained in the adhesive layer.

構成接著層53的接著劑，係在不損及本質的特性的範圍內，亦可進一步包含具有混和性的其他物質。例如，可進一步使用供於改良接著劑的性能用的附加性樹脂、可塑劑、助黏劑、穩定劑、著色劑、熱聚合抑制劑及界面活性劑等慣用的各種添加劑。 The adhesive constituting the adhesive layer 53 may further include other substances having miscibility within a range that does not impair the essential characteristics. For example, additional resins, plasticizers, adhesion promoters, stabilizers, colorants, thermal polymerization inhibitors, surfactants, and other commonly used additives for improving the performance of the adhesive can be further used.

(密封體基板54) (Sealing body substrate 54)

密封體基板(基板)54，係具備元件55、將元件55密封的密封材57、形成於元件55上的再配線層56。密封體基 板54係具備複數個元件55，切割如此的密封體基板54，使得可獲得複數個電子構件。 The sealing body substrate (substrate) 54 includes an element 55, a sealing material 57 for sealing the element 55, and a rewiring layer 56 formed on the element 55. Seal body base The board 54 is provided with a plurality of elements 55, and such a sealing body substrate 54 is cut so that a plurality of electronic components can be obtained.

元件55，係半導體元件或其他元件，可具有單層或複數層的構造。另外，元件55為半導體元件的情況下，透過切割密封體基板54而獲得的電子構件，係成為半導體裝置。 The element 55 is a semiconductor element or other element, and may have a single-layer or multiple-layer structure. In addition, when the element 55 is a semiconductor element, the electronic component obtained by cutting the sealing body substrate 54 becomes a semiconductor device.

再配線層56，係亦稱為RDL(Redistribution Layer)，為構成連接於元件55的配線的薄膜的配線體，可具有單層或複數層的構造。於一實施形態，再配線層56，係可為於介電體(例如，氧化矽(SiOx)、感光性環氧等的感光性樹脂等)透過導電體(例如，鋁、銅、鈦、鎳、金等的金屬等)而形成配線者，惟未限定於此。 The rewiring layer 56 is also called RDL (Redistribution Layer), and is a wiring body that constitutes a thin film of wiring connected to the element 55, and may have a single-layer or multiple-layer structure. In one embodiment, the rewiring layer 56 can be formed in a dielectric (for example, silicon oxide (SiO x ), photosensitive resin such as photosensitive epoxy, etc.) through a conductive body (for example, aluminum, copper, titanium, etc.) However, it is not limited to those that form wiring such as nickel, gold, etc.).

密封材57方面，可使用例如環氧系的樹脂、矽系的樹脂等。於一實施形態，密封材57非按元件55而設者，而為將安裝於接著層53的複數個元件55的全部一體地密封者。 As for the sealing material 57, for example, epoxy-based resin, silicon-based resin, or the like can be used. In one embodiment, the sealing material 57 is not provided for the elements 55, but is for integrally sealing all of the plurality of elements 55 mounted on the adhesive layer 53.

另外，在示於圖5的(b)的密封體基板54，再配線層56雖設於密封體基板54與接著層53相接之側的相反的面，惟於其他實施形態，再配線層56亦可設於密封體基板54與接著層53相接之側的面。 In addition, in the sealing body substrate 54 shown in FIG. 5(b), although the rewiring layer 56 is provided on the opposite side of the side where the sealing body substrate 54 and the adhesive layer 53 are in contact, in other embodiments, the rewiring layer 56 may also be provided on the surface on the side where the sealing body substrate 54 and the adhesive layer 53 are in contact.

<其他積層體> <Other laminates>

作為透過支撐體分離裝置100將支撐體分離的對象的積層體，係將基板與透射光的支撐體隔著因吸收光而變質 的分離層進行層積而成的積層體即可。因此，不僅如示於圖5的積層體般在分離層52與基板54之間具有接著層53的積層體，在分離層與基板之間不具有接著層的積層體亦落入如此的積層體的範疇。例如，在不具有接著層的積層體方面，可列舉隔著具有接著性的分離層而將基板與支撐體黏貼而成的積層體。於此，在具有接著性的分離層方面，可列舉如利用屬固化型樹脂或熱塑性樹脂且具備光吸收性的樹脂而形成的分離層、及於具有接著性的樹脂混合吸收光的材料而成的分離層等。利用屬固化型樹脂或熱塑性樹脂且具備光吸收性的樹脂而形成的分離層方面，可列舉如利用聚醯亞胺樹脂而形成的分離層。此外，於具有接著性的樹脂混合吸收光的材料而成的分離層方面，可列舉如於丙烯酸系紫外線固化型樹脂混合炭黑等而成的分離層、及於黏著性樹脂混合玻璃泡的紅外線吸收材料等而成的分離層等。另外，此等分離層亦不論接著性的有無，而屬吸收光而變質的分離層的範疇。 The laminate, which is the object of separating the support through the support separating device 100, separates the substrate and the light-transmitting support between the substrate and the light-transmitting support and deteriorates due to light absorption. What is necessary is a laminate formed by laminating the separation layers of. Therefore, not only a laminate having an adhesive layer 53 between the separation layer 52 and the substrate 54 like the laminate shown in FIG. 5, but also a laminate having no adhesive layer between the separation layer and the substrate also falls into such a laminate. Category. For example, with regard to a laminated body that does not have an adhesive layer, a laminated body obtained by pasting a substrate and a support through a separation layer having adhesiveness can be mentioned. Here, as for the separation layer with adhesiveness, for example, a separation layer formed by a resin that is a curable resin or a thermoplastic resin and has light absorption, and a resin having adhesiveness is mixed with a material that absorbs light. The separation layer and so on. As for the separation layer formed of a resin that is a curable resin or a thermoplastic resin and has light absorption properties, for example, a separation layer formed of a polyimide resin can be cited. In addition, the separation layer formed by mixing a light-absorbing material with an adhesive resin includes, for example, a separation layer formed by mixing carbon black with an acrylic ultraviolet curable resin, and an adhesive resin mixed with infrared rays. Separation layer made of absorbent materials, etc. In addition, these separation layers belong to the category of separation layers that absorb light and deteriorate regardless of whether they are adhesive.

此外，在圖5，係雖將僅在一側的面具有支撐體的積層體作為積層體的一例而進行說明，惟在基板的兩面具有支撐體的積層體亦可適用於支撐體分離裝置100。 In addition, in FIG. 5, although a laminate having a support on only one surface is described as an example of a laminate, a laminate having supports on both sides of a substrate can also be applied to the support separation device 100 .

此外，設於積層體5的基板54，係不限定於密封體基板，而可為矽晶圓基板、陶瓷基板、薄膜基板、撓性基板等的任意的基板。 In addition, the substrate 54 provided on the laminated body 5 is not limited to a sealing body substrate, and may be any substrate such as a silicon wafer substrate, a ceramic substrate, a thin film substrate, and a flexible substrate.

〔2.支撐體分離裝置的動作〕 [2. Operation of the support separation device]

就本發明的一實施形態相關的支撐體分離裝置100的動作，參照圖4進行說明。 The operation of the support separation device 100 according to an embodiment of the present invention will be described with reference to FIG. 4.

(1.面板型積層體5的載置：載置程序) (1. Mounting of panel type laminate 5: Mounting procedure)

首先，打開夾具3的夾臂31，而使夾桿32移動至不與面板型積層體5重疊的位置(位置A)。於此，上述「不與面板型積層體5重疊的位置」，係指從面板型積層體5之上表面側視看時，面板型積層體5與夾桿32重疊而看不見的位置(例如，示於圖4的(a)的位置)。並且，將面板型積層體5，使面板(支撐體)51側的面為上，隔著載具4而載置於保持台1(圖4的(a))。 First, the clamp arm 31 of the clamp 3 is opened, and the clamp lever 32 is moved to a position (position A) where it does not overlap with the panel-type laminate 5. Here, the above-mentioned "a position that does not overlap with the panel-type laminate 5" refers to a position where the panel-type laminate 5 overlaps the clamp bar 32 and is invisible when viewed from the upper surface side of the panel-type laminate 5 (e.g. , Shown in Figure 4 (a) position). In addition, the panel-type laminated body 5 is placed on the holding table 1 with the surface of the panel (support body) 51 facing upward, with the carrier 4 interposed therebetween (FIG. 4( a) ).

於載置程序，將面板型積層體5隔著載具4載置於保持台1的順序方面，(i)可將面板型積層體5載置於載具4後，將載具4載置於保持台1；或者(ii)亦可將載具4載置於保持台1，在其上載置面板型積層體5。 In the placing procedure, the order of placing the panel-type laminate 5 on the holding table 1 via the carrier 4 is (i) After the panel-type laminate 5 is placed on the carrier 4, the carrier 4 can be placed On the holding stand 1; or (ii) the carrier 4 may be placed on the holding stand 1, and the panel-type laminate 5 may be placed thereon.

將面板型積層體5隔著載具4而載置於保持台1的順序為(i)及(ii)中的任一順序的情況下，皆優選上以在載具4設置凸部42及開口部41的區域(圖3的(a))、和面板型積層體5的元件非形成區域57(圖5的(a))抵接，且在載具4設置凹部43的區域(圖3的(a))、和面板型積層體5的元件形成區域58(圖5的(a))抵接的方式，將載具4與面板型積層體5位置對準後，將面板型積層體5載置於載具4。藉此，會吸附面板型積層體5的元件非形成區域57(圖5的(a))，故不會由 於吸附而產生損傷元件的在元件殘留吸附痕等的瑕疵。此外，面板型積層體5的元件形成區域58(圖5的(a))與載具4不接觸，故可在不損傷元件下，將面板型積層體5吸附保持。 When the order in which the panel-type laminate 5 is placed on the holding table 1 via the carrier 4 is any one of (i) and (ii), it is preferable to provide the convex portion 42 and the carrier 4 on the carrier 4 in the order of (i) and (ii). The area of the opening 41 (FIG. 3(a)) is in contact with the element non-forming area 57 (FIG. 5(a)) of the panel type laminate 5, and the area where the recessed portion 43 is provided in the carrier 4 (FIG. 3 (A)) and the element formation area 58 of the panel type laminate 5 (FIG. 5(a)). After the carrier 4 and the panel type laminate 5 are aligned, the panel type laminate 5 is placed on the carrier 4. As a result, the element non-formation area 57 of the panel-type laminate 5 (FIG. 5(a)) will be adsorbed, so it will not be affected by Defects such as adsorption marks remaining on the component that damage the component due to suction. In addition, the element formation area 58 (FIG. 5( a )) of the panel type laminate 5 is not in contact with the carrier 4, so the panel type laminate 5 can be sucked and held without damaging the elements.

並且，將載具4以包圍吸附部2的方式載置於保持台1。於此，「以包圍吸附部2的方式」，係指以下狀態：將載具4載置於保持台1的狀態下，從載具4之上表面側視看時，不會看見吸附部2。 In addition, the carrier 4 is placed on the holding table 1 so as to surround the suction part 2. Here, "in a way to surround the suction part 2" refers to the following state: when the carrier 4 is placed on the holding table 1, when viewed from the upper surface of the carrier 4, the suction part 2 is not visible .

(2.面板型積層體5的按壓：按壓程序) (2. Pressing of the panel type laminate 5: pressing procedure)

接著，關閉夾臂31，而使夾桿32移動至與面板型積層體5之上表面(亦即，面板型積層體5的支撐體側的面)相接的位置(位置B)，而將面板型積層體5的面板側的面朝保持台1按壓(圖4的(b))。 Next, the clamp arm 31 is closed, and the clamp lever 32 is moved to a position (position B) in contact with the upper surface of the panel-type laminate 5 (that is, the surface on the support side of the panel-type laminate 5), and The panel-side surface of the panel-type laminate 5 is pressed toward the holding table 1 (FIG. 4(b)).

(3.面板型積層體5的吸附：吸附程序) (3. Adsorption of panel type laminate 5: Adsorption procedure)

一面維持夾桿32按壓面板型積層體5的狀態，一面從與設於保持面1a的開口部(未圖示的)連接的吸引部22排出氣體，從而將面板型積層體5經由載具4的開口部(未圖示)進行吸引。藉此，面板型積層體5被吸附保持於保持台1(圖4的(b))。另外，面板型積層體5被吸附保持於保持台1的狀態，係維持直到面板51從面板型積層體5分離。 While maintaining the clamp lever 32 pressing the panel-type laminate 5, gas is discharged from the suction portion 22 connected to the opening (not shown) provided on the holding surface 1a, so that the panel-type laminate 5 is passed through the carrier 4 The opening part (not shown) of the suction is carried out. Thereby, the panel type laminated body 5 is sucked and held by the holding table 1 (FIG. 4(b)). In addition, the state in which the panel-type laminate 5 is sucked and held on the holding table 1 is maintained until the panel 51 is separated from the panel-type laminate 5.

如此，在支撐體分離裝置100，係將面板型積 層體5朝保持台1按壓，使得可校正彎曲而使帶有彎曲的面板型積層體5成為平坦。藉此，可適當地吸附保持帶有彎曲的面板型積層體5。另外，開始吸附程序直到結束按壓程序，且按壓程序結束後亦繼續吸附程序即可，吸附程序與按壓程序，係何者先開始皆可。例如，可先開始吸附程序而一面繼續吸附程序一面開始按壓程序，亦可使按壓程序與吸附程序同時開始。 In this way, in the support separation device 100, the panel-shaped product is The laminated body 5 is pressed toward the holding table 1 so that the curvature can be corrected and the curved panel-type laminated body 5 becomes flat. Thereby, the curved panel type laminated body 5 can be sucked and held appropriately. In addition, start the adsorption process until the end of the pressing process, and continue the adsorption process after the end of the pressing process. Either the adsorption process or the pressing process can be started first. For example, it is possible to start the adsorption process first and continue the adsorption process while starting the pressing process, or the pressing process and the adsorption process can be started at the same time.

(4.對於分離層52的光照射：光照射程序) (4. Light irradiation to the separation layer 52: light irradiation procedure)

接著，打開夾具3的夾臂31，而解除透過夾桿32進行的面板型積層體5的按壓狀態。再者，使夾桿32移動至不與面板型積層體5重疊的位置(位置A)。並且，從光照射部7，將依面板型積層體5的分離層的種類而選擇的雷射光L，經由面板51而照射於分離層52的整面(圖4的(c))。藉此，可使分離層52變質，而容易使面板51與密封體基板54成為可分離的狀態。雷射光的照射條件(雷射輸出、雷射光的反復頻率、雷射光的掃描速度等)，係可依分離層52的種類、分離層52的厚度、及密封體基板54的種類等的條件而適當調整。 Next, the clamp arm 31 of the clamp 3 is opened, and the pressing state of the panel-type laminate 5 through the clamp lever 32 is released. Furthermore, the clamp lever 32 is moved to a position (position A) that does not overlap with the panel-type laminate 5. Then, the laser light L selected according to the type of the separation layer of the panel-type laminate 5 is irradiated on the entire surface of the separation layer 52 through the panel 51 from the light irradiating unit 7 (FIG. 4( c )). Thereby, the quality of the separation layer 52 can be changed, and the panel 51 and the sealing body substrate 54 can be easily separated into a separable state. The irradiation conditions of the laser light (laser output, repetition frequency of the laser light, scanning speed of the laser light, etc.) can be determined according to the type of separation layer 52, the thickness of the separation layer 52, and the type of sealing substrate 54. Appropriate adjustments.

在帶有彎曲的積層體，係由於彎曲使得分離層52的位置會上下動，故使雷射光的焦點位置對於分離層52上並非容易。相對於此，在支撐體分離裝置100，係能以帶有彎曲的面板型積層體5成為平坦的方式，校正彎曲而吸附保持，故無積層體的分離層52的位置與雷射光的焦 點的位置大幅偏差之虞。為此，可對分離層52效率佳地照射雷射光。 In a laminated body with a curvature, the position of the separation layer 52 moves up and down due to the curvature, so it is not easy to set the focal position of the laser light on the separation layer 52. In contrast, in the support separation device 100, the curved panel-type laminate 5 can be flattened, and the curvature can be corrected and held by suction. Therefore, there is no position of the separation layer 52 of the laminate and the focus of the laser light. The position of the point may be greatly deviated. For this reason, the separation layer 52 can be irradiated with laser light efficiently.

(5.面板51的分離：分離程序) (5. Separation of panel 51: Separation program)

接著，使夾桿32移動至不與面板型積層體5重疊的位置(位置A)的狀態下，使支撐體保持部6下降至吸附部61與面板型積層體5之上表面抵接的位置，而吸附保持面板51。並且，使支撐體保持部6上升於鉛直方向(示於圖4的(d)的箭頭的方向)，從而將面板51抬起於鉛直方向。藉此，面板51從面板型積層體5分離(圖4的(d))。 Next, in a state where the clamp lever 32 does not overlap with the panel-type laminate 5 (position A), the support holding portion 6 is lowered to a position where the suction portion 61 abuts on the upper surface of the panel-type laminate 5 , And the adsorption to maintain the panel 51. And the support body holding part 6 is raised in the vertical direction (the direction of the arrow shown in FIG. 4(d)), and the panel 51 is lifted up in the vertical direction. Thereby, the panel 51 is separated from the panel-type laminate 5 (FIG. 4(d)).

另外，施加於積層體之力，係可依積層體的大小等而適當調整即可，雖不限定，惟分離層因照射光而變質，故施加0.98~147N(0.1~15kgf)程度的力，使得可適當地將密封體基板與面板分離。 In addition, the force applied to the laminated body can be adjusted appropriately according to the size of the laminated body, etc. Although it is not limited, the separation layer is deteriorated due to light irradiation, so a force of about 0.98~147N (0.1~15kgf) is applied. This makes it possible to appropriately separate the sealing body substrate from the panel.

此外，施加於積層體之力的方向，係只要為支撐體與基板彼此分離之方向，則亦可非鉛直方向。 In addition, the direction of the force applied to the laminated body may be a non-vertical direction as long as it is a direction in which the support body and the substrate are separated from each other.

於其他實施形態，支撐體與基板的分離，係使支撐體保持部6及保持台1相對於支撐體保持部6與保持台1分離的方向而移動從而進行即可。因此，於其他實施形態相關的支撐體分離裝置，亦可使支撐體保持部6及保持台1雙方相對移動，從而使支撐體與基板分離。或者，亦可將支撐體保持部6固定，僅使保持台1相對於支撐體保持部6而移動，從而使支撐體與基板分離。 In other embodiments, the separation of the support body and the substrate may be performed by moving the support body holding portion 6 and the holding table 1 with respect to the direction in which the support body holding portion 6 and the holding table 1 are separated. Therefore, in the support separation device related to other embodiments, both the support holding portion 6 and the holding table 1 can be moved relatively to separate the support from the substrate. Alternatively, the support body holding portion 6 may be fixed, and only the holding table 1 may be moved relative to the support body holding portion 6 to separate the support body from the substrate.

接著，將夾具3的夾臂31關閉，而使夾桿32移 動至不與面板型積層體5接觸但重疊的位置(位置C)。於此，上述「不與面板型積層體5接觸但重疊的位置」，係指面板型積層體5與夾桿32未接觸，惟從面板型積層體5之上表面側視看時，面板型積層體5與夾桿32重疊的位置(例如，示於圖4的(d)的位置)。 Next, the clamp arm 31 of the clamp 3 is closed, and the clamp rod 32 is moved Move to a position (position C) where it does not contact the panel-type laminate 5 but overlaps. Here, the above-mentioned "a position that does not contact the panel type laminate 5 but overlaps" means that the panel type laminate 5 is not in contact with the clamp bar 32, but when viewed from the upper surface side of the panel type laminate 5, the panel type The position where the laminated body 5 overlaps with the clamp rod 32 (for example, the position shown in (d) of FIG. 4).

並且，使吸附保持面板51的狀態下的支撐體保持部6，下降於鉛直方向(示於圖4的(e)的箭頭的方向)，而將面板51載置於夾桿32上。之後，解除支撐體保持部6的吸附狀態(圖4的(e))。 Then, the support body holding portion 6 in the state where the panel 51 is sucked and held is lowered in the vertical direction (in the direction of the arrow shown in (e) of FIG. 4 ), and the panel 51 is placed on the clamp bar 32. After that, the suction state of the support body holding portion 6 is released (FIG. 4(e)).

最後，停止從設於保持面1a的開口部(未圖示)的氣體的排氣，從而解除面板51被分離旳密封體基板54的保持狀態。 Finally, the exhaust of gas from the opening (not shown) provided in the holding surface 1a is stopped, and the holding state of the panel 51 being separated and the sealing body substrate 54 is released.

面板51被分離的密封體基板54，係在載置於載具4的狀態下被從支撐體分離裝置搬出。並且，之後接受透過在洗淨裝置(未圖示)中的接著層53及分離層52的殘渣的洗淨進行的除去(除去程序)。 The sealing body substrate 54 from which the panel 51 is separated is carried out from the support separation device in a state of being placed on the carrier 4. Then, the residues of the adhesive layer 53 and the separation layer 52 are removed (removal process) through the cleaning of the adhesive layer 53 and the separation layer 52 in a cleaning device (not shown).

在除去程序，係除去殘留於面板51被分離的密封體基板54的接著層53與分離層52。例如，進行透過包含有機溶劑的洗淨液等而將接著層53及分離層52的殘渣除去的洗淨程序。洗淨液方面，雖可使用如接著劑的稀釋溶劑、顯示鹼性的溶劑(尤其，胺系化合物)等，惟未限定於此。藉此，可獲得經分離的密封體基板54。 In the removal process, the adhesive layer 53 and the separation layer 52 remaining on the sealing body substrate 54 from which the panel 51 is separated are removed. For example, a cleaning process of removing residues of the adhesive layer 53 and the separation layer 52 through a cleaning solution containing an organic solvent or the like is performed. Regarding the cleaning solution, although it is possible to use, for example, a diluting solvent of an adhesive, a solvent showing basicity (especially, an amine compound), etc., it is not limited to this. Thereby, a separated sealing body substrate 54 can be obtained.

被分離的密封體基板54，係在載置於載具4的狀態下接受在切割裝置中的切割(切割程序)，而被分割 為各晶片。可在切割程序前，於密封體基板54形成焊球，此外亦可於密封體基板54上，層積另一個別的元件。 The separated sealing body substrate 54 receives the cutting (cutting procedure) in the cutting device while being placed on the carrier 4, and is divided For each wafer. The solder balls can be formed on the sealing substrate 54 before the cutting process, and another component can also be layered on the sealing substrate 54.

面板51被分離的密封體基板54，係可在載置於載具4的狀態下，接受裝置至裝置的搬運、及洗淨、切割等的處理。藉此，可在分離程序後的處理基板的程序(洗淨程序、切割程序等)中，就非常薄的密封體基板54(例如，厚度0.5μm以下)，在不損傷的情況下進行搬運及處理。 The sealed substrate 54 from which the panel 51 is separated is capable of receiving treatments such as device-to-device transportation, cleaning, and cutting while being placed on the carrier 4. Thereby, in the process of processing the substrate (cleaning process, cutting process, etc.) after the separation process, the very thin sealing body substrate 54 (for example, thickness 0.5μm or less) can be transported without damage. deal with.

在先前技術方面，為了切割將支撐體分離後的基板，而使用切割帶。切割帶，係隔著黏著層而貼合於積層體中的基板側的平面部，故切割帶與基板的配線面接觸，使得具有損傷配線面或塵土附著於配線面之虞。此外，具有如下問題：在將切割帶剝離後黏著層殘留於配線面，使得電氣特性改變。相對於此，在本發明的一實施態樣相關的支撐體分離裝置，係透過載具4而保持從支撐體分離的基板，故無須使用切割帶。因此，損傷基板的配線面，或黏著層附著於配線面使得可防止電氣特性發生變化。此外，可在載置於載具4的狀態下，將厚度0.5μm程度並具有可撓性的密封體基板54從面板51分離，可在將密封體基板54保持載置於載具4的狀態下，順利搬出至支撐體分離裝置100之外。 In the prior art, in order to cut the substrate after separating the support, a dicing tape is used. The dicing tape is bonded to the flat portion on the substrate side of the laminate via the adhesive layer. Therefore, the dicing tape contacts the wiring surface of the substrate, which may damage the wiring surface or deposit dust on the wiring surface. In addition, there is a problem that the adhesive layer remains on the wiring surface after the dicing tape is peeled off, so that electrical characteristics are changed. In contrast, the support separation device related to an embodiment of the present invention holds the substrate separated from the support through the carrier 4, so there is no need to use a dicing tape. Therefore, damage to the wiring surface of the substrate or adhesion of the adhesive layer to the wiring surface makes it possible to prevent changes in electrical characteristics. In addition, the sealing body substrate 54 having a thickness of about 0.5 μm and having flexibility can be separated from the panel 51 while being placed on the carrier 4, and the sealing body substrate 54 can be kept placed on the carrier 4 Next, it is smoothly carried out to the outside of the support separation device 100.

<其他實施形態相關的支撐體分離裝置> <Support separation device related to other embodiments>

本發明的其他實施形態相關的支撐體分離裝置，係亦 可不具備對分離層照射光的光照射部。此情況下，亦可利用設於支撐體分離裝置的外部的光照射裝置而使積層體的分離層變質後，將此積層體搬運至支撐體分離裝置，從積層體將支撐體分離。 Support separation devices related to other embodiments of the present invention are also The light irradiating part for irradiating light to the separation layer may not be provided. In this case, after the separation layer of the laminate is altered by a light irradiation device provided outside the support separation device, the laminate can be transported to the support separation device to separate the support from the laminate.

此外，本發明的其他實施形態相關的支撐體分離裝置，係亦可不具有保持夾具。例如，基板的兩面被透過支撐體而支撐的三明治式的積層體的情況下，係可不隔著保持夾具，而直接予以吸附保持於保持台。 In addition, the support separation device related to other embodiments of the present invention may not have a holding jig. For example, in the case of a sandwich-type laminate in which both surfaces of the substrate are supported through a support, it is possible to directly suck and hold it on the holding table without interposing a holding jig.

〔3.支撐體分離方法〕 [3. Separation method of support]

本發明相關的支撐體分離方法，係從將基板與透射光的支撐體、隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，包含：將上述積層體，以上述支撐體側的面為上而載置於保持台的載置程序；朝上述保持台按壓上述積層體的按壓程序；和使上述積層體吸附於上述保持台的吸附程序。 The method for separating a support body related to the present invention is to separate the support body from a laminated body formed by laminating a substrate, a light-transmitting support body, and a separation layer that is degraded by absorption of light, and includes: The body is placed on a holding table with the surface on the support side as the upper side; a pressing process of pressing the layered body against the holding table; and an adsorption process of adsorbing the layered body to the holding table.

本發明的一實施形態相關的支撐體分離方法，係上述的支撐體分離裝置100的各實施形態，如在上述「2.支撐體分離裝置的動作」之項目所說明。 The support separation method according to an embodiment of the present invention is the respective embodiments of the support separation device 100 described above, as described in the item "2. Operation of the support separation device" above.

本發明係非限定於上述的各實施形態者，示於請求項的範圍內可進行各種的變更，將分別揭露的技術手段適當組合於不同的實施形態而得的實施形態方面亦落入本發明的技術範圍。 The present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the scope of the claims. Embodiments obtained by appropriately combining the technical means disclosed separately in different embodiments also fall into the present invention. The scope of technology.

〔總結〕 〔to sum up〕

本發明亦可表現如下。 The present invention can also be expressed as follows.

本發明的態樣1相關的支撐體分離裝置，係從將基板與透射光的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，具備供於保持上述積層體用的保持台，上述保持台係構成為具有：具備供於吸附上述積層體用的吸附部的保持面、和朝上述保持台按壓上述積層體的按壓部。 The support separating device related to aspect 1 of the present invention is a laminate formed by laminating a substrate and a light-transmitting support through a separation layer that is degraded by absorption of light. The support is separated, and the support is provided with In the holding stand for holding the laminate, the holding stand is configured to include a holding surface provided with an adsorption portion for adsorbing the laminate, and a pressing portion for pressing the laminate against the holding stand.

本發明的態樣2相關的支撐體分離裝置，係亦可作成如下構成：於上述的態樣1中，上述保持台，係進一步具有供於保持上述積層體用的保持夾具；上述保持夾具，係具備供於吸引上述積層體用的開口部，以包圍上述吸附部的方式載置於上述保持台。 The support separation device related to aspect 2 of the present invention may also be configured as follows: in the above aspect 1, the holding table further has a holding jig for holding the laminated body; the holding jig, It is equipped with the opening part for sucking the said laminated body, and is mounted on the said holding stand so that the said adsorption part may be enclosed.

本發明的態樣3相關的支撐體分離裝置，係亦可作成如下構成：於上述的態樣2中，上述保持夾具，係在與上述積層體的上述基板上的未形成元件的區域對應的位置，具有複數個上述開口部。 The support separation device related to aspect 3 of the present invention may also be configured as follows: in the above aspect 2, the holding jig is located corresponding to the area where no element is formed on the substrate of the laminate The position has a plurality of the above-mentioned openings.

本發明的態樣4相關的支撐體分離裝置，係亦可作成如下構成：於上述的態樣3中，上述保持夾具，係格子狀地配置上述開口部。 The support separation device related to the aspect 4 of the present invention may also be configured as follows: in the aspect 3 described above, the holding jig is configured to arrange the openings in a lattice shape.

本發明的態樣5相關的支撐體分離裝置，係亦可作成如下構成：於上述的態樣2至4中任1個態樣中，上述保持夾具，係在與上述積層體的上述基板上的形成元件的區域對應的位置，具有凹部構成。 The support separation device related to aspect 5 of the present invention may also be configured as follows: in any one of the above aspects 2 to 4, the holding jig is attached to the substrate of the laminate The position corresponding to the area where the element is formed has a concave structure.

本發明的態樣6相關的支撐體分離裝置，係亦可作成如下構成：於上述的態樣2至5中任1個態樣中，上述保持夾具，係在外周部具有排氣部。 The support separation device related to aspect 6 of the present invention may also be configured as follows: In any one of the above-mentioned aspects 2 to 5, the holding jig has an exhaust part on the outer periphery.

本發明的態樣7相關的支撐體分離裝置，係亦可作成如下構成：於上述的態樣1至6中任1個態樣中，上述按壓部，係設為可相對於上述保持台而轉動。 The support separation device related to aspect 7 of the present invention may also be configured as follows: in any one of the above-mentioned aspects 1 to 6, the pressing portion is configured to be able to be opposed to the holding table Rotate.

本發明的態樣8相關的支撐體分離方法，係從將基板與透射光的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，包含：將上述積層體，以上述支撐體側的面為上而載置於保持台的載置程序；朝上述保持台按壓上述積層體的按壓程序；和使上述積層體吸附於上述保持台的吸附程序。 The support separation method related to aspect 8 of the present invention is a laminated body formed by laminating a substrate and a light-transmitting support through a separation layer that has deteriorated due to light absorption, and separating the support, including: Placement procedure of placing the laminated body on a holding table with the surface on the support side as the upper side; pressing procedure of pressing the laminated body against the holding table; and suction procedure of adsorbing the laminated body to the holding table .

本發明的態樣9相關的支撐體分離方法，係亦可作成如下方法：於上述的態樣8中，在上述載置程序，上述積層體，係隔著保持夾具而載置於上述保持台；在上述吸附程序，上述積層體，係經由上述保持夾具的開口部而吸引從而吸附於上述保持台。 The supporting body separation method related to aspect 9 of the present invention can also be made as the following method: in the above aspect 8, in the above-mentioned placing procedure, the above-mentioned laminated body is placed on the above-mentioned holding table via a holding jig. In the above-mentioned suction process, the above-mentioned layered body is sucked through the opening of the above-mentioned holding jig to be sucked onto the above-mentioned holding table.

1‧‧‧保持台 1‧‧‧Holding station

1a‧‧‧保持面 1a‧‧‧Keep the surface

2‧‧‧吸附部 2‧‧‧Adsorption part

3‧‧‧夾具(按壓部) 3‧‧‧Fixture (pressing part)

4‧‧‧載具(保持夾具) 4‧‧‧Carrier (holding fixture)

5‧‧‧面板型積層體(積層體) 5‧‧‧Panel type laminate (Laminate)

6‧‧‧支撐體保持部 6‧‧‧Support body holding part

7‧‧‧雷射照射部(光照射部) 7‧‧‧Laser Irradiation Section (Light Irradiation Section)

21‧‧‧O環體(吸附構材) 21‧‧‧O ring body (adsorption structure)

22‧‧‧吸引部 22‧‧‧Attraction Department

51‧‧‧面板(支撐體) 51‧‧‧Panel (support)

52‧‧‧分離層 52‧‧‧Separation layer

53‧‧‧接著層 53‧‧‧Next layer

54‧‧‧密封體基板(基板) 54‧‧‧Sealing body substrate (substrate)

61‧‧‧吸附部 61‧‧‧Adsorption part

100‧‧‧支撐體分離裝置 100‧‧‧Support separation device

Claims (8)

一種支撐體分離裝置，從將基板與透射光的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，具備供於保持上述積層體用的保持台，上述保持台，係具有：具備供於吸附上述積層體用的吸附部的保持面；和具有夾臂和設於夾臂的前端的夾桿的按壓部，其使上述夾臂朝上述保持面轉動而透過上述夾桿按壓上述積層體的上表面。 A support separating device, which separates the support from a laminated body formed by laminating a substrate and a light-transmitting support through a separation layer that has deteriorated due to light absorption, and is provided with a holder for holding the laminated body The stand, the holding stand, has: a holding surface provided with a suction part for absorbing the laminate; and a pressing part having a clamp arm and a clamp rod provided at the tip of the clamp arm, which causes the clamp arm to face the holding The surface is rotated to press the upper surface of the laminated body through the clamp rod. 如申請專利範圍第1項的支撐體分離裝置，其中，上述保持台，係進一步具有供於保持上述積層體用的保持夾具，上述保持夾具，係具備供於吸引上述積層體用的開口部，以包圍上述吸附部的方式載置於上述保持台。 For example, the supporting body separating device according to claim 1, wherein the holding table further has a holding jig for holding the laminated body, and the holding jig is provided with an opening for sucking the laminated body, It is placed on the holding table so as to surround the suction part. 如申請專利範圍第2項的支撐體分離裝置，其中，上述保持夾具，係在與上述積層體的上述基板上的未形成元件的區域對應的位置，具有複數個上述開口部。 The supporting body separating device according to the second patent application, wherein the holding jig has a plurality of the openings at positions corresponding to the regions on the substrate of the laminated body where no elements are formed. 如申請專利範圍第3項的支撐體分離裝置，其中，上述保持夾具，係格子狀地配置上述開口部。 The support separation device according to the third application, wherein the holding jig is arranged in a grid with the openings. 如申請專利範圍第2至4項中任1項的支撐體分離裝置，其中，上述保持夾具，係在與上述積層體的上述基板上的形成元件的區域對應的位置，具有凹部。 The support separation device according to any one of the second to fourth claims, wherein the holding jig has a recessed portion at a position corresponding to a region on the substrate of the laminated body where the element is formed. 如申請專利範圍第2至4項中任1項的支撐體分離裝置，其中，上述保持夾具，係在外周部具有排氣部。 For example, the supporting body separating device according to any one of the 2nd to 4th items in the scope of patent application, wherein the holding jig has an exhaust part on the outer peripheral part. 一種支撐體分離方法，從將基板與透射光的支撐體隔著因吸收光而變質的分離層進行層積而成的積層體，將該支撐體分離，包含：將上述積層體，以上述支撐體側的面為上而載置於保持台的保持面的載置程序；透過為上述保持台具有且具有夾臂和設於夾臂的前端的夾桿的按壓部，使上述夾臂朝上述保持面轉動而透過上述夾桿按壓上述積層體的上表面的按壓程序；和使上述積層體吸附於上述保持台的吸附程序。 A method for separating a support body, which separates the support body from a laminated body formed by laminating a substrate and a light-transmitting support body through a separation layer that has been degraded by absorption of light, comprising: separating the above-mentioned laminated body with the above-mentioned support The body side surface is up and placed on the holding surface of the holding table; the holding table has a clamping arm and a clamping rod provided at the tip of the clamping arm through a pressing portion, so that the clamping arm faces the above A pressing process of pressing the upper surface of the layered body through the clamping rod by rotating the holding surface; and an adsorption process of adsorbing the layered body to the holding table. 如申請專利範圍第7項的支撐體分離方法，其中，在上述載置程序，上述積層體，係隔著保持夾具而載置於上述保持台，在上述吸附程序，上述積層體，係經由上述保持夾具的開口部而吸引從而吸附於上述保持台。 For example, in the support separation method of claim 7, wherein, in the placement process, the laminate is placed on the holding table via a holding jig, and in the adsorption process, the laminate is passed through the The opening of the jig is held and sucked to be adsorbed to the holding table.
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