TWI720430B - Packaging mold and packaging method - Google Patents

Packaging mold and packaging method Download PDF

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TWI720430B
TWI720430B TW108106416A TW108106416A TWI720430B TW I720430 B TWI720430 B TW I720430B TW 108106416 A TW108106416 A TW 108106416A TW 108106416 A TW108106416 A TW 108106416A TW I720430 B TWI720430 B TW I720430B
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mold
cavities
cavity
packaging
molding
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TW108106416A
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Chinese (zh)
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TW202032676A (en
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簡子傑
陳熙洪
曾乙修
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日月光半導體製造股份有限公司
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Priority to TW108106416A priority Critical patent/TWI720430B/en
Priority to CN202010104957.6A priority patent/CN111605139B/en
Publication of TW202032676A publication Critical patent/TW202032676A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C2045/2683—Plurality of independent mould cavities in a single mould

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A packaging mold includes a mold body, two first pots and a plurality of second pots. The mold body has at least one molding zone. The first pots are connected to the mold body. Each of the first pots has an accommodating cavity and at least one connecting channel, and the connecting channel communicates with the molding zone and the accommodating cavity. The second pots are connected to the mold body. Each of the second pots has a pellet cavity and at least one compound injection channel, and the compound injection channel communicates with the molding zone and the pellet cavity. The volume of the connecting channel of the first pot is greater than or equal to the volume of the compound injection channel of the second pot.

Description

封裝模具及封裝方法Packaging mold and packaging method

本發明是有關於一種封裝模具及封裝方法，且更具體言之，是有關於改善封裝模流之封裝模具及封裝方法。The present invention relates to a packaging mold and a packaging method, and more specifically, to a packaging mold and a packaging method for improving the flow of the packaging mold.

為避免耗費過多的製程成本，不同類型或尺寸的高複雜性封裝產品，於模封時會盡量共用同一套模具。然而，由於模腔體積固定，不同的產品大小所排列出來的陣列組合係不相同，使得兩邊側流道的體積也會與中間的模封區有所不同，進而容易造成兩者之間模流不均的現象，並導致尾排的產品未被模封或模封不完全等問題。目前產線上，普遍以犧牲尾排或尾數二至三排的產品來做生產設計。惟，上述作法不僅會大幅減少產能輸出，且由於側流道的模流會快速流到排氣區而造成真空抽氣功能關閉，使得模封區空氣無法順利排出，進而產生空氣殘留之回包現象及翹曲等問題。In order to avoid consuming too much process cost, high complexity package products of different types or sizes will share the same set of molds as much as possible during molding. However, due to the fixed volume of the mold cavity, the array combinations arranged by different product sizes are not the same, so that the volume of the two side runners will also be different from the middle molding area, which will easily cause mold flow between the two. Uneven phenomenon, and lead to problems such as unsealing or incomplete molding of the products in the tail row. At present, the production line is generally designed at the expense of the rear row or the second to third row of products. However, the above method will not only greatly reduce the production output, but also because the mold flow of the side runner will quickly flow to the exhaust area, the vacuum exhaust function will be turned off, so that the air in the mold sealing area cannot be smoothly discharged, and the air residue will be returned. Phenomenon and warpage and other issues.

在一實施例中，一種封裝模具包括一模具本體、二第一腔體及複數個第二腔體。該模具本體具有至少一模封區。所述二第一腔體連接該模具本體，每一所述第一腔體具有一容置腔及至少一連接通道，所述連接通道連通所述模封區及所述容置腔。該等第二腔體連接該模具本體， 每一所述第二腔體具有一置料腔及至少一加料注澆通道，所述加料注澆通道連通所述模封區及所述置料腔，且所述第一腔體之連接通道之容積大於或等於所述第二腔體之加料注澆通道之容積。In one embodiment, a packaging mold includes a mold body, two first cavities, and a plurality of second cavities. The mold body has at least one molding area. The two first cavities are connected to the mold body, and each of the first cavities has an accommodating cavity and at least one connecting passage, and the connecting passage communicates with the molding area and the accommodating cavity. The second cavities are connected to the mold body, and each of the second cavities has a material placement cavity and at least one feeding and pouring channel, and the feeding and pouring channel communicates with the mold sealing area and the material placement cavity And the volume of the connecting channel of the first cavity is greater than or equal to the volume of the pouring channel of the second cavity.

在一實施例中，一種封裝方法包括：提供一封裝模具，所述封裝模具包括一模具本體、二第一腔體及複數個第二腔體，所述模具本體具有一模封區，所述第一腔體及所述第二腔體連接所述模具本體且連通所述模封區；設置至少一待模封物於所述模封區內；將複數個第一模封材料分別置入各所述第二腔體，且淨空各所述第一腔體；及將所述第一模封材料擠入所述模封區內，以形成覆蓋所述待模封物之一第一模流及一第二模流，並使所述第二模流之部分流入各所述第一腔體內。In one embodiment, a packaging method includes: providing a packaging mold, the packaging mold including a mold body, two first cavities and a plurality of second cavities, the mold body has a molding area, the The first cavity and the second cavity are connected to the mold body and communicated with the molding area; at least one object to be molded is arranged in the molding area; a plurality of first molding materials are respectively placed Each of the second cavities and each of the first cavities is clear; and extruding the first molding material into the molding area to form a first mold covering the object to be molded Flow and a second mold flow, and make part of the second mold flow flow into each of the first cavities.

在一實施例中，一種封裝方法包括：提供一封裝模具，所述封裝模具包括一模具本體、二第一腔體及複數個第二腔體，所述模具本體具有一模封區，所述第一腔體及所述第二腔體連接所述模具本體且連通所述模封區；設置至少一待模封物於所述模封區內；將複數個第一模封材料分別置入各所述第二腔體以及將複數個第二模封材料分別置入各所述第一腔體；及將所述第一模封材料及所述第二模封材料擠入所述模封區內，以形成覆蓋所述待模封物之一第一模流及一第二模流，並使所述第二模流之部分流入各所述第一腔體內。In one embodiment, a packaging method includes: providing a packaging mold, the packaging mold including a mold body, two first cavities and a plurality of second cavities, the mold body has a molding area, the The first cavity and the second cavity are connected to the mold body and communicated with the molding area; at least one object to be molded is arranged in the molding area; a plurality of first molding materials are respectively placed Each of the second cavities and a plurality of second molding materials are respectively placed in each of the first cavities; and the first molding material and the second molding material are extruded into the molding seal In the area, a first mold flow and a second mold flow covering the object to be molded are formed, and a part of the second mold flow flows into each of the first cavities.

貫穿圖式及實施方式使用共同參考編號以指示相同或相似組件。自結合附圖的以下詳細描述將更容易理解本發明之實施例。Common reference numbers are used throughout the drawings and embodiments to indicate the same or similar components. It will be easier to understand the embodiments of the present invention from the following detailed description in conjunction with the accompanying drawings.

以下揭示內容提供用於實施所提供主題之不同特徵的許多不同實施例或實例。在下文描述組件及配置之特定實例以闡明本發明之特定態樣。當然，此等組件、值、操作、材料及配置僅為實例且不意欲為限制性的。舉例而言，在本文中所提供之描述中，第一特徵在第二特徵上方或上的形成可包括第一特徵以及第二特徵直接接觸地形成或安置的實施例，且亦可包括額外特徵可在第一特徵與第二特徵之間形成或安置使得第一特徵與第二特徵可不直接接觸的實施例。另外，本發明可在本文中所提供之各種實例中重複參考數字及/或字母。此重複係出於簡化及清楚之目的，且本身並不指示所論述各種實施例及/或組態之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and configurations are described below to clarify specific aspects of the present invention. Of course, these components, values, operations, materials, and configurations are only examples and are not intended to be limiting. For example, in the description provided herein, the formation of the first feature on or on the second feature may include an embodiment in which the first feature and the second feature are formed or arranged in direct contact, and may also include additional features An embodiment may be formed or disposed between the first feature and the second feature such that the first feature and the second feature may not directly contact. In addition, the present invention may repeat reference numbers and/or letters in various examples provided herein. This repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

圖1顯示本發明之一實施例之封裝模具1之立體示意圖。圖2顯示圖1之局部區域A之放大圖。圖3顯示圖1之封裝模具1之結構俯視圖，其中側流道之寬度大於切割道之寬度。配合參閱圖1、圖2及圖3，本發明之封裝模具1包括一模具本體10、二第一腔體20及複數個第二腔體30。在一實施例中，該模具本體10、該等第一腔體20及該等第二腔體30之材質係為金屬。FIG. 1 shows a three-dimensional schematic diagram of a packaging mold 1 according to an embodiment of the present invention. Fig. 2 shows an enlarged view of the partial area A of Fig. 1. FIG. 3 shows a top view of the structure of the packaging mold 1 of FIG. 1, in which the width of the side runner is larger than the width of the cutting channel. With reference to FIGS. 1, 2 and 3, the packaging mold 1 of the present invention includes a mold body 10, two first cavities 20 and a plurality of second cavities 30. In one embodiment, the material of the mold body 10, the first cavities 20 and the second cavities 30 is metal.

該模具本體10具有至少一模封區11，且所述模封區11具有複數個待模封區塊111及複數條切割道112。所述待模封區塊111係間隔排列於所述模封區11內，用以分別設置待模封物。所述切割道112用以定義所述待模封區塊111。在一實施例中，所述模封區11係為該模具本體10之內部空間，且大致上為一封閉空間。所述模封區11係用以容置一基板，該基板具有所述待模封區塊111及所述切割道112。所述切割道112係為切割步驟(singulation process)中切割刀具之路徑，且所述待模封區塊111係為切割步驟完成後所獲得之封裝單元(package unit)之位置。The mold body 10 has at least one molding area 11, and the molding area 11 has a plurality of blocks to be molded 111 and a plurality of cutting channels 112. The blocks 111 to be molded are arranged at intervals in the molding area 11 for respectively setting objects to be molded. The cutting channel 112 is used to define the block 111 to be molded. In one embodiment, the molding area 11 is an internal space of the mold body 10, and is substantially a closed space. The molding area 11 is used for accommodating a substrate having the block to be molded 111 and the cutting lane 112. The cutting path 112 is the path of the cutting tool in the singulation process, and the block to be molded 111 is the position of the package unit obtained after the cutting process is completed.

此外，所述模封區11之兩側分別具有一側流道12，且所述側流道12連通所述模封區11。在一實施例中，所述側流道12係為該基板之側面與該模具本體10之內側壁間之空間。In addition, two sides of the mold sealing area 11 are respectively provided with a side flow passage 12, and the side flow passages 12 are connected to the mold sealing area 11. In one embodiment, the side runner 12 is the space between the side surface of the substrate and the inner side wall of the mold body 10.

所述二第一腔體20連接該模具本體10，且所述二第一腔體20分別鄰近各所述側流道12。The two first cavities 20 are connected to the mold body 10, and the two first cavities 20 are respectively adjacent to each of the side runners 12.

在一實施例中，每一所述第一腔體20具有一容置腔21及至少一連接通道22。所述容置腔21可不設置模封材料或設置少量模封材料。所述連接通道22連通所述模封區11及所述容置腔21。此外，所述連接通道22具有一第一開口221，所述連接通道22係經由所述第一開口221連通所述模封區11。在一實施例中，所述連接通道22呈漏斗狀，而所述第一開口221呈四邊形狀。In one embodiment, each of the first cavities 20 has a containing cavity 21 and at least one connecting channel 22. The accommodating cavity 21 may not be provided with a molding material or a small amount of molding material. The connecting channel 22 communicates with the molding area 11 and the containing cavity 21. In addition, the connecting passage 22 has a first opening 221, and the connecting passage 22 communicates with the molding area 11 through the first opening 221. In one embodiment, the connecting channel 22 has a funnel shape, and the first opening 221 has a quadrangular shape.

該等第二腔體30連接該模具本體10， 且該等第二腔體30係位於所述二個第一腔體20之間。The second cavities 30 are connected to the mold body 10, and the second cavities 30 are located between the two first cavities 20.

在一實施例中，每一所述第二腔體30具有一置料腔31及至少一加料注澆通道32。所述置料腔31用以設置模封材料。所述加料注澆通道32連通所述模封區11及所述置料腔31。此外，所述加料注澆通道32具有一第二開口321，所述加料注澆通道32係經由所述第二開口321連通所述模封區11。在一實施例中，所述至少一加料注澆通道32包括二加料注澆通道32，所述二加料注澆通道32呈八字狀，而所述第二開口321呈四邊形狀。In one embodiment, each of the second cavities 30 has a material placing cavity 31 and at least one filling and pouring channel 32. The material placement cavity 31 is used to set a molding material. The feeding and pouring channel 32 communicates with the mold sealing area 11 and the material placement cavity 31. In addition, the feeding and pouring channel 32 has a second opening 321, and the feeding and casting channel 32 is connected to the molding area 11 through the second opening 321. In one embodiment, the at least one feeding channel 32 includes two feeding channels 32, the two feeding channels 32 are in a figure eight shape, and the second opening 321 is in a quadrangular shape.

在一實施例中，所述第一開口221之開口面積係大於所述第二開口321之開口面積，以使位於所述側流道12的模流能通過所述第一開口221，達到減緩模流流速的效果。In one embodiment, the opening area of the first opening 221 is larger than the opening area of the second opening 321, so that the mold flow located in the side runner 12 can pass through the first opening 221 to slow down The effect of mold flow velocity.

在一實施例中，該模具本體10之模封區11更連通一排氣區，該排氣區係鄰近於該模具本體10之一側壁，且相對於該等第一腔體20及該等第二腔體30。In one embodiment, the molding area 11 of the mold body 10 is further connected to an exhaust area which is adjacent to a side wall of the mold body 10 and is opposite to the first cavities 20 and the The second cavity 30.

圖4顯示本發明之一實施例之封裝模具1a之結構俯視圖，其中側流道之寬度小於切割道之寬度。配合參閱圖3及圖4，為減緩側流道的模流流速，本發明之所述第一腔體20及所述第二腔體30之幾何形狀配置，係可依據所述側流道12與所述切割道112兩者之寬度大小進行調整，茲詳細說明如下。FIG. 4 shows a top view of the structure of the packaging mold 1a according to an embodiment of the present invention, in which the width of the side runner is smaller than the width of the cutting channel. With reference to Figures 3 and 4, in order to slow down the mold flow velocity of the side runners, the geometrical configuration of the first cavity 20 and the second cavity 30 of the present invention can be based on the side runners 12 The width of both and the cutting channel 112 is adjusted, which is described in detail as follows.

如圖3所示，當所述側流道12之寬度W1大於各所述切割道112之寬度W2時，所述第一腔體20之幾何形狀與所述第二腔體30之幾何形狀係為不相同（例如所述連接通道22之幾何形狀與所述加料注澆通道32之幾何形狀不相同。如圖3所示，所述連接通道22呈漏斗狀，而所述二加料注澆通道32呈八字狀），且所述第一腔體20之連接通道22之容積大於所述第二腔體30之加料注澆通道32之容積，以使位於所述側流道12的模流能通過所述第一腔體20之連接通道22及容置腔21所提供之緩衝空間，達到減緩模流流速的效果。As shown in FIG. 3, when the width W1 of the side flow channel 12 is greater than the width W2 of each of the cutting channels 112, the geometric shape of the first cavity 20 and the geometric shape of the second cavity 30 are consistent with each other. Is different (for example, the geometric shape of the connecting channel 22 is different from the geometric shape of the feeding channel 32. As shown in FIG. 3, the connecting channel 22 is funnel-shaped, and the two feeding channels 32 is in the shape of a figure eight), and the volume of the connecting channel 22 of the first cavity 20 is greater than the volume of the filling and pouring channel 32 of the second cavity 30, so that the mold flow in the side runner 12 can be The buffer space provided by the connecting channel 22 and the accommodating cavity 21 of the first cavity 20 achieves the effect of slowing down the flow rate of the mold flow.

如圖4所示，當所述側流道12之寬度W1小於或等於各所述切割道112之寬度W2時，所述第一腔體20a之幾何形狀與所述第二腔體30之幾何形狀係為相同（例如所述連接通道22a之幾何形狀與所述加料注澆通道32之幾何形狀相同。如圖4所示，所述二連接通道22a及所述二加料注澆通道32皆呈八字狀），且所述第一腔體20a之連接通道22a之容積等於所述第二腔體30之加料注澆通道32之容積，以使位於所述側流道12的模流能通過所述第一腔體20a之連接通道22a及容置腔21所提供之緩衝空間，達到減緩模流流速的效果。As shown in FIG. 4, when the width W1 of the side flow channel 12 is less than or equal to the width W2 of each cutting channel 112, the geometric shape of the first cavity 20a and the geometry of the second cavity 30 The shape is the same (for example, the geometric shape of the connecting channel 22a is the same as the geometric shape of the material pouring channel 32. As shown in FIG. 4, the two connecting channels 22a and the two material pouring channels 32 are both Eight-shaped), and the volume of the connecting channel 22a of the first cavity 20a is equal to the volume of the pouring channel 32 of the second cavity 30, so that the mold flow located in the side runner 12 can pass through The buffer space provided by the connecting channel 22a of the first cavity 20a and the accommodating cavity 21 achieves the effect of slowing down the flow rate of the mold flow.

圖5顯示本發明之一實施例之封裝模具1b之結構俯視圖。圖5之封裝模具1b與圖1至圖3之封裝模具1大致相同，其不同處在於圖5之封裝模具1b更設置中空緩衝件80。為了更快速減緩位於所述側流道12的模流流速，在一實施例中，該封裝模具1b可另設置二中空緩衝件80，所述二中空緩衝件80連接該模具本體10，且所述二中空緩衝件80內之緩衝空間分別對應及連通各所述側流道12，以使位於所述側流道12的模流能通過或進入所述二中空緩衝件80內之緩衝空間，達到快速減緩模流流速的效果。FIG. 5 shows a top view of the structure of the packaging mold 1b according to an embodiment of the present invention. The packaging mold 1b of FIG. 5 is substantially the same as the packaging mold 1 of FIGS. 1 to 3, and the difference is that the packaging mold 1b of FIG. 5 is further provided with a hollow cushioning member 80. In order to more quickly slow down the flow rate of the mold flow located in the side runner 12, in one embodiment, the packaging mold 1b may be additionally provided with two hollow buffer members 80, and the two hollow buffer members 80 are connected to the mold body 10, and The buffer spaces in the two hollow buffer members 80 respectively correspond to and communicate with each of the side flow passages 12, so that the mold flow located in the side flow passage 12 can pass through or enter the buffer space in the two hollow buffer members 80, Achieve the effect of quickly slowing down the flow rate of the mold flow.

參閱圖6，其係顯示圖1之封裝模具1設置第一柱塞40及第二柱塞50(兩柱塞端面位於同一平面上)之結構示意圖。為了將模封材料擠入所述模封區11，以產生模流，在一實施例中，該封裝模具1可另設置二第一柱塞40及複數個第二柱塞50。所述二第一柱塞40分別對應且***各所述第一腔體20之所述容置腔21，且各所述第一柱塞40具有一端面（上表面）42。該等第二柱塞50分別對應且***各所述第二腔體30之所述置料腔31，且各所述第二柱塞50具有一端面（上表面）52。Refer to FIG. 6, which is a schematic diagram showing the structure of the packaging mold 1 of FIG. 1 with a first plunger 40 and a second plunger 50 (the end faces of the two plungers are located on the same plane). In order to squeeze the molding material into the molding area 11 to generate mold flow, in one embodiment, the packaging mold 1 may be additionally provided with two first plungers 40 and a plurality of second plungers 50. The two first plungers 40 are respectively corresponding to and inserted into the accommodating cavity 21 of each of the first cavities 20, and each of the first plungers 40 has an end surface (upper surface) 42. The second plungers 50 are respectively corresponding to and inserted into the material placing cavity 31 of each of the second cavities 30, and each of the second plungers 50 has an end surface (upper surface) 52.

在一實施例中，當所述第一腔體20之所述容置腔21不設置模封材料時，各所述第一柱塞40與各所述第二柱塞50係同步移動，以維持各所述第一柱塞40之端面42與各所述第二柱塞50之端面52位於同一平面上，此時之所述容置腔21處於淨空狀態，其腔內空間可作為模流緩衝空間。In one embodiment, when the accommodating cavity 21 of the first cavity 20 is not provided with a molding material, each of the first plungers 40 and each of the second plungers 50 move synchronously to Maintain the end surface 42 of each of the first plungers 40 and the end surface 52 of each of the second plungers 50 on the same plane. At this time, the accommodating cavity 21 is in a clear state, and the space in the cavity can be used as a mold flow. Buffer space.

參閱圖7，其係顯示圖1之封裝模具1設置第一柱塞40及第二柱塞50(兩柱塞端面位於不同平面上)之結構示意圖。在一實施例中，當所述第一腔體20之所述容置腔21設置少量模封材料時，各所述第一柱塞40與各所述第二柱塞50不同步移動，以維持各所述第一柱塞40之端面42與各所述第二柱塞50之端面52位於不同平面上，此時之所述第一柱塞40之端面42與所述容置腔21之間的距離空間可作為模流緩衝空間。Refer to FIG. 7, which is a schematic diagram showing the structure of the packaging mold 1 of FIG. 1 provided with a first plunger 40 and a second plunger 50 (the end faces of the two plungers are located on different planes). In one embodiment, when the containing cavity 21 of the first cavity 20 is provided with a small amount of molding material, each of the first plungers 40 and each of the second plungers 50 move asynchronously to Maintain the end surface 42 of each of the first plungers 40 and the end surface 52 of each of the second plungers 50 on different planes, at this time the end surface 42 of the first plunger 40 and the accommodating cavity 21 The distance between the two can be used as mold flow buffer space.

關於使用該封裝模具1（圖1至圖3）之封裝方法係詳細說明如下，並分別以第一腔體20不設置模封材料及第一腔體20設置模封材料兩種封裝方法實施例予以詳細說明本發明，唯並不意謂本發明僅侷限於此等實施例所揭示之內容。The encapsulation method using the encapsulation mold 1 (FIGS. 1 to 3) is described in detail as follows, and the first cavity 20 is not provided with a molding material and the first cavity 20 is provided with two encapsulation methods. To explain the present invention in detail, it does not mean that the present invention is only limited to the content disclosed in these embodiments.

[第一腔體20不設置模封材料][The first cavity 20 is not provided with a molding material]

參閱圖8，其係顯示本發明封裝方法中之一封裝模具1之結構示意圖。本發明之封裝方法的步驟(a)是提供一封裝模具1，所述封裝模具1包括一模具本體10、二第一腔體20及複數個第二腔體30，所述模具本體10具有一模封區11，且所述模封區11具有複數個待模封區塊111及複數條切割道112，所述待模封區塊111係間隔排列於所述模封區11內，所述切割道112用以定義所述待模封區塊111。所述第一腔體20及所述第二腔體30連接所述模具本體10且連通所述模封區11。Refer to FIG. 8, which is a schematic diagram showing the structure of a packaging mold 1 in the packaging method of the present invention. Step (a) of the packaging method of the present invention is to provide a packaging mold 1. The packaging mold 1 includes a mold body 10, two first cavities 20, and a plurality of second cavities 30. The mold body 10 has one The mold-sealing area 11, and the mold-sealing area 11 has a plurality of blocks 111 to be molded and a plurality of cutting channels 112, and the blocks 111 to be molded are arranged in the mold-sealing area 11 at intervals. The cutting channel 112 is used to define the block 111 to be molded. The first cavity 20 and the second cavity 30 are connected to the mold body 10 and communicated with the molding area 11.

在該步驟(a)中，各所述第一腔體20具有一容置腔21及至少一連接通道22，所述連接通道22連通所述模封區11及所述容置腔21。各所述第二腔體30具有一置料腔31及至少一加料注澆通道32，所述加料注澆通道32連通所述模封區11及所述置料腔31，且所述連接通道22之容積大於或等於所述加料注澆通道32之容積。In this step (a), each of the first cavities 20 has an accommodating cavity 21 and at least one connecting passage 22, and the connecting passage 22 communicates with the molding area 11 and the accommodating cavity 21. Each of the second cavities 30 has a material placing cavity 31 and at least one filling pouring channel 32, the filling pouring channel 32 communicates with the molding area 11 and the material placing cavity 31, and the connecting channel The volume of 22 is greater than or equal to the volume of the filling pouring channel 32.

參閱圖9，其係顯示本發明封裝方法中之設置待模封物於模封區內之示意圖。本發明之封裝方法的步驟(b)是設置至少一待模封物90於所述模封區11內。在該步驟(b)中，所述至少一待模封物90包括複數個待模封物90，且該等待模封物90分別設置於各所述待模封區塊111。在一實施例中，該等待模封物90可以是至少一半導體元件（例如：半導體晶片），其係位於一基板上。Refer to FIG. 9, which shows a schematic diagram of placing the object to be molded in the molding area in the packaging method of the present invention. The step (b) of the packaging method of the present invention is to set at least one object to be molded 90 in the molding area 11. In this step (b), the at least one object to be molded 90 includes a plurality of objects to be molded 90, and the object to be molded 90 is respectively disposed in each of the blocks to be molded 111. In an embodiment, the waiting mold material 90 may be at least one semiconductor device (for example, a semiconductor chip), which is located on a substrate.

參閱圖10，其係顯示本發明封裝方法中之第一模封材料置入第二腔體及淨空第一腔體之示意圖。本發明之封裝方法的步驟(c)是將複數個第一模封材料61分別置入各所述第二腔體30，且淨空各所述第一腔體20。在該步驟(c)中，所述第一模封材料61係分別置入各所述置料腔31。Refer to FIG. 10, which shows a schematic diagram of the first molding material being placed in the second cavity and clearing the first cavity in the packaging method of the present invention. In step (c) of the packaging method of the present invention, a plurality of first molding materials 61 are respectively placed in each of the second cavities 30, and each of the first cavities 20 is cleared. In this step (c), the first molding material 61 is put into each of the material placing cavities 31 respectively.

圖11顯示本發明封裝方法中之第一模封材料擠入模封區內之示意圖。配合參閱圖10及圖11，本發明之封裝方法的步驟(d)是將所述第一模封材料61擠入所述模封區11內，以形成覆蓋所述待模封物90之一第一模流71及一第二模流72，並使所述第二模流72之部分流入各所述第一腔體20內。在一實施例中，所述第一模封材料61係經由一加熱與加壓程序而擠入所述模封區11內，且所述加壓程序係通過圖6所示之第二柱塞50的沖壓動作達成。11 shows a schematic diagram of the first molding material extruded into the molding area in the packaging method of the present invention. With reference to FIGS. 10 and 11, step (d) of the packaging method of the present invention is to extrude the first molding material 61 into the molding area 11 to form one of the objects 90 to be molded. The first mold flow 71 and a second mold flow 72 make part of the second mold flow 72 flow into each of the first cavities 20. In one embodiment, the first molding material 61 is extruded into the molding area 11 through a heating and pressurizing process, and the pressurizing process is through the second plunger shown in FIG. 6 A punching action of 50 is achieved.

在該步驟(d)中，所述第二模流72係形成於所述第一模流71之兩側，且所述第二模流72之部分係流入各所述第一腔體20之所述連接通道22及所述容置腔21。此外，在一實施例中，所述第一模流71之部分亦會流入各所述第一腔體20之所述連接通道22及所述容置腔21。In this step (d), the second mold flow 72 is formed on both sides of the first mold flow 71, and part of the second mold flow 72 flows into each of the first cavities 20 The connecting channel 22 and the containing cavity 21. In addition, in one embodiment, part of the first mold flow 71 also flows into the connecting passage 22 and the containing cavity 21 of each of the first cavities 20.

另外，在該步驟(d)中，所述第一模流71具有一第一深度D1，所述第二模流72具有一第二深度D2，由於所述第二模流72之部分係流入各所述第一腔體20之所述連接通道22及所述容置腔21，使得所述第二模流72之流量減少，因此，可確保所述第一模流71之所述第一深度D1大於或等於所述第二模流72之所述第二深度D2。In addition, in this step (d), the first mold flow 71 has a first depth D1, and the second mold flow 72 has a second depth D2, because part of the second mold flow 72 flows into The connecting passage 22 and the accommodating cavity 21 of each of the first cavities 20 reduce the flow rate of the second mold flow 72, so that the first mold flow 71 of the first mold flow 71 can be ensured. The depth D1 is greater than or equal to the second depth D2 of the second mold flow 72.

圖12顯示本發明封裝方法中之容置腔及連接通道內之第一模流之部分及第二模流之部分擠回模封區之示意圖。配合參閱圖11及圖12，在該步驟(d)之後，本發明之封裝方法更包括：步驟(e)將位於各所述第一腔體20之所述容置腔21及所述連接通道22內之所述第一模流71之部分及所述第二模流72之部分擠回所述模封區11，以使所述第一模流71及所述第二模流72能完全覆蓋所述待模封物90。在一實施例中，所述第一模流71及所述第二模流72可大致同時覆蓋所述待模封物90。12 shows a schematic diagram of the first mold flow part and the second mold flow part in the accommodating cavity and the connecting channel in the packaging method of the present invention being extruded back into the mold sealing area. With reference to FIGS. 11 and 12, after this step (d), the packaging method of the present invention further includes: step (e) placing the receiving cavity 21 and the connecting channel in each of the first cavities 20 The portion of the first mold flow 71 and the portion of the second mold flow 72 within 22 are squeezed back into the molding area 11, so that the first mold flow 71 and the second mold flow 72 can be completely Cover the material to be molded 90. In an embodiment, the first mold flow 71 and the second mold flow 72 may cover the object to be molded 90 substantially at the same time.

本發明以所述第一腔體20作為模流緩衝空間，使位於所述側流道12之所述第二模流72得以減速，不會快速流到排氣區，以維持排氣之暢通，進而可避免產生空氣殘留之回包現象及衍生翹曲問題。此外，本發明之封裝方法可完全模封所有待模封物90，不需犧牲任何產品，因此，可大幅提高產能輸出。In the present invention, the first cavity 20 is used as a mold flow buffer space, so that the second mold flow 72 located in the side runner 12 can be decelerated, and will not flow to the exhaust area quickly, so as to maintain the smooth flow of exhaust. , In turn, it can avoid the back-packing phenomenon of air residue and the resulting warpage problem. In addition, the packaging method of the present invention can completely mold all the objects to be molded 90 without sacrificing any products, and therefore, can greatly increase the production output.

[第一腔體20設置模封材料][The first cavity 20 is provided with a molding material]

參閱圖13，其係顯示本發明封裝方法中之一封裝模具1之結構示意圖。本發明之封裝方法的步驟(a)是提供一封裝模具1，所述封裝模具1包括一模具本體10、二第一腔體20及複數個第二腔體30，所述模具本體10具有一模封區11，且所述模封區11具有複數個待模封區塊111及複數條切割道112，所述待模封區塊111係間隔排列於所述模封區11內，所述切割道112用以定義所述待模封區塊111。所述第一腔體20及所述第二腔體30連接所述模具本體10且連通所述模封區11。Refer to FIG. 13, which is a schematic diagram showing the structure of a packaging mold 1 in the packaging method of the present invention. Step (a) of the packaging method of the present invention is to provide a packaging mold 1. The packaging mold 1 includes a mold body 10, two first cavities 20, and a plurality of second cavities 30. The mold body 10 has one The mold-sealing area 11, and the mold-sealing area 11 has a plurality of blocks 111 to be molded and a plurality of cutting channels 112, and the blocks 111 to be molded are arranged in the mold-sealing area 11 at intervals. The cutting channel 112 is used to define the block 111 to be molded. The first cavity 20 and the second cavity 30 are connected to the mold body 10 and communicated with the molding area 11.

在該步驟(a)中，各所述第一腔體20具有一容置腔21及至少一連接通道22，所述連接通道22連通所述模封區11及所述容置腔21。各所述第二腔體30具有一置料腔31及至少一加料注澆通道32，所述加料注澆通道32連通所述模封區11及所述置料腔31，且所述連接通道22之容積大於或等於所述加料注澆通道32之容積。In this step (a), each of the first cavities 20 has an accommodating cavity 21 and at least one connecting passage 22, and the connecting passage 22 communicates with the molding area 11 and the accommodating cavity 21. Each of the second cavities 30 has a material placing cavity 31 and at least one filling pouring channel 32, the filling pouring channel 32 communicates with the molding area 11 and the material placing cavity 31, and the connecting channel The volume of 22 is greater than or equal to the volume of the filling pouring channel 32.

參閱圖14，其係顯示本發明封裝方法中之設置待模封物於模封區內之示意圖。本發明之封裝方法的步驟(b)是設置至少一待模封物90於所述模封區11內。在該步驟(b)中，所述至少一待模封物90包括複數個待模封物90，且該等待模封物90分別設置於各所述待模封區塊111。Refer to FIG. 14, which shows a schematic diagram of placing the object to be molded in the molding area in the packaging method of the present invention. The step (b) of the packaging method of the present invention is to set at least one object to be molded 90 in the molding area 11. In this step (b), the at least one object to be molded 90 includes a plurality of objects to be molded 90, and the object to be molded 90 is respectively disposed in each of the blocks to be molded 111.

參閱圖15，其係顯示本發明封裝方法中之第一模封材料置入第二腔體及第二模封材料置入第一腔體之示意圖。本發明之封裝方法的步驟(c)是將複數個第一模封材料61分別置入各所述第二腔體30以及將複數個第二模封材料62分別置入各所述第一腔體20。在該步驟(c)中，所述第一模封材料61係分別置入各所述置料腔31，各所述第二模封材料62係分別置入各所述容置腔21。此外，各所述第一模封材料61之體積大於各所述第二模封材料62之體積，由於所述第二模封材料62之體積較小，所佔空間不大，使得各所述容置腔21能有多餘空間作為模流緩衝之用。Refer to FIG. 15, which is a schematic diagram showing that the first molding material is placed in the second cavity and the second molding material is placed in the first cavity in the packaging method of the present invention. Step (c) of the packaging method of the present invention is to place a plurality of first molding materials 61 into each of the second cavities 30, and to place a plurality of second molding materials 62 into each of the first cavities, respectively.体20. In this step (c), the first molding material 61 is respectively placed in each of the material containing cavities 31, and each of the second molding materials 62 is placed into each of the containing cavities 21, respectively. In addition, the volume of each of the first molding materials 61 is greater than the volume of each of the second molding materials 62. Since the volume of the second molding materials 62 is relatively small, the space occupied by each of the second molding materials 62 is small. The accommodating cavity 21 can have surplus space for mold flow buffering.

圖16顯示本發明封裝方法中之第一模封材料及第二模封材料擠入模封區內之示意圖。配合參閱圖15及圖16，本發明之封裝方法的步驟(d)是將所述第一模封材料61及所述第二模封材料62擠入所述模封區11內，以形成覆蓋所述待模封物90之一第一模流71及一第二模流72，並使所述第二模流72之部分流入各所述第一腔體20內。在一實施例中，所述第一模封材料61及所述第二模封材料62係經由一加熱與加壓程序而擠入所述模封區11內，且所述加壓程序係通過圖6所示之第一柱塞40及第二柱塞50的沖壓動作達成。16 shows a schematic diagram of the first molding material and the second molding material extruded into the molding area in the packaging method of the present invention. 15 and 16, step (d) of the packaging method of the present invention is to extrude the first molding material 61 and the second molding material 62 into the molding area 11 to form a covering A first mold flow 71 and a second mold flow 72 of the to-be-molded object 90 make part of the second mold flow 72 flow into each of the first cavities 20. In one embodiment, the first molding material 61 and the second molding material 62 are extruded into the molding area 11 through a heating and pressurizing process, and the pressurizing process is passed through The punching action of the first plunger 40 and the second plunger 50 shown in FIG. 6 is achieved.

在該步驟(d)中，所述第二模流72係形成於所述第一模流71之兩側，且所述第二模流72之部分係流入各所述第一腔體20之所述連接通道22及所述容置腔21。此外，在一實施例中，所述第一模流71之部分亦會流入各所述第一腔體20之所述連接通道22及所述容置腔21。In this step (d), the second mold flow 72 is formed on both sides of the first mold flow 71, and part of the second mold flow 72 flows into each of the first cavities 20 The connecting channel 22 and the containing cavity 21. In addition, in one embodiment, part of the first mold flow 71 also flows into the connecting passage 22 and the containing cavity 21 of each of the first cavities 20.

另外，在該步驟(d)中，所述第一模流71具有一第一深度D1，所述第二模流72具有一第二深度D2，由於所述第二模流72之部分係流入各所述第一腔體20之所述連接通道22及所述容置腔21，使得所述第二模流72之流量減少，因此，可確保所述第一模流71之所述第一深度D1大於或等於所述第二模流72之所述第二深度D2。In addition, in this step (d), the first mold flow 71 has a first depth D1, and the second mold flow 72 has a second depth D2, because part of the second mold flow 72 flows into The connecting passage 22 and the accommodating cavity 21 of each of the first cavities 20 reduce the flow rate of the second mold flow 72, so that the first mold flow 71 of the first mold flow 71 can be ensured. The depth D1 is greater than or equal to the second depth D2 of the second mold flow 72.

圖17顯示本發明封裝方法中之容置腔及連接通道內之第一模流之部分及第二模流之部分擠回模封區之示意圖。配合參閱圖16及圖17，在該步驟(d)之後，本發明之封裝方法更包括：步驟(e)將位於各所述第一腔體20之所述容置腔21及所述連接通道22內之所述第一模流71之部分及所述第二模流72之部分擠回所述模封區11，以使所述第一模流71及所述第二模流72能完全覆蓋所述待模封物90。FIG. 17 shows a schematic diagram of the first mold flow part and the second mold flow part in the accommodating cavity and the connecting channel in the packaging method of the present invention extruded back into the mold sealing area. With reference to Figures 16 and 17, after this step (d), the packaging method of the present invention further includes: step (e) placing the containing cavity 21 and the connecting channel in each of the first cavities 20 The portion of the first mold flow 71 and the portion of the second mold flow 72 within 22 are squeezed back into the molding area 11, so that the first mold flow 71 and the second mold flow 72 can be completely Cover the material to be molded 90.

上述實施例僅為說明本發明之原理及其功效，並非限制本發明，因此習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。The above-mentioned embodiments only illustrate the principles and effects of the present invention, and do not limit the present invention. Therefore, those skilled in the art can modify and change the above-mentioned embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the scope of patent application described later.

1:封裝模具 1a:封裝模具 1b:封裝模具 10:模具本體 11:模封區 12:側流道 20:第一腔體 20a:第一腔體 21:容置腔 22:連接通道 22a:連接通道 30:第二腔體 31:置料腔 32:加料注澆通道 40:第一柱塞 42:端面 50:第二柱塞 52:端面 61:第一模封材料 62:第二模封材料 71:第一模流 72:第二模流 80:中空緩衝件 90:待模封物 111:待模封區塊 112:切割道 221:第一開口 321:第二開口 A:局部區域 D1:第一深度 D2:第二深度 W1:側流道之寬度 W2:切割道之寬度 1: Package mold 1a: Package mold 1b: Package mold 10: Mold body 11: Mold sealing area 12: Side runner 20: The first cavity 20a: first cavity 21: containing cavity 22: connection channel 22a: connection channel 30: second cavity 31: material cavity 32: Feeding pouring channel 40: The first plunger 42: end face 50: second plunger 52: end face 61: The first molding material 62: The second molding material 71: The first mold flow 72: second mold flow 80: Hollow cushion 90: To be molded 111: Block to be molded 112: Cutting Road 221: first opening 321: second opening A: local area D1: first depth D2: second depth W1: width of side runner W2: The width of the cutting path

當結合附圖閱讀時，自以下詳細描述易於理解本發明之一些實施例的態樣。應注意，各種結構可能未按比例繪製，且各種結構之尺寸可出於論述清晰起見任意增大或減小。When read in conjunction with the accompanying drawings, it is easy to understand the aspects of some embodiments of the present invention from the following detailed description. It should be noted that the various structures may not be drawn to scale, and the size of the various structures may be increased or decreased arbitrarily for clarity of discussion.

圖1顯示本發明之一實施例之封裝模具之立體示意圖。FIG. 1 shows a three-dimensional schematic diagram of a packaging mold according to an embodiment of the present invention.

圖2顯示圖1之局部區域A之放大圖。Fig. 2 shows an enlarged view of the partial area A of Fig. 1.

圖3顯示圖1之封裝模具之結構俯視圖。FIG. 3 shows a top view of the structure of the packaging mold of FIG. 1. FIG.

圖4顯示本發明之一實施例之封裝模具之結構俯視圖。FIG. 4 shows a top view of the structure of the packaging mold according to an embodiment of the present invention.

圖5顯示本發明之一實施例之封裝模具之結構俯視圖。FIG. 5 shows a top view of the structure of the packaging mold according to an embodiment of the present invention.

圖6顯示圖1之封裝模具設置第一柱塞及第二柱塞(兩柱塞端面位於同一平面上)之結構示意圖。6 is a schematic diagram showing the structure of the packaging mold of FIG. 1 provided with a first plunger and a second plunger (the end faces of the two plungers are on the same plane).

圖7顯示圖1之封裝模具設置第一柱塞及第二柱塞(兩柱塞端面位於不同平面上)之結構示意圖。FIG. 7 shows a schematic structural view of the packaging mold of FIG. 1 with a first plunger and a second plunger (the end faces of the two plungers are located on different planes).

圖8顯示本發明封裝方法中之一封裝模具之結構示意圖。FIG. 8 shows a schematic diagram of the structure of a packaging mold in the packaging method of the present invention.

圖9顯示本發明封裝方法中之設置待模封物於模封區內之示意圖。FIG. 9 shows a schematic diagram of the object to be molded in the molding area in the packaging method of the present invention.

圖10顯示本發明封裝方法中之第一模封材料置入第二腔體及淨空第一腔體之示意圖。FIG. 10 shows a schematic diagram of the first molding material being placed in the second cavity and the first cavity is cleared in the packaging method of the present invention.

圖11顯示本發明封裝方法中之第一模封材料擠入模封區內之示意圖。11 shows a schematic diagram of the first molding material extruded into the molding area in the packaging method of the present invention.

圖12顯示本發明封裝方法中之容置腔及連接通道內之第一模流之部分及第二模流之部分擠回模封區之示意圖。12 shows a schematic diagram of the first mold flow part and the second mold flow part in the accommodating cavity and the connecting channel in the packaging method of the present invention being extruded back into the mold sealing area.

圖13顯示本發明封裝方法中之一封裝模具之結構示意圖。FIG. 13 shows a schematic diagram of the structure of a packaging mold in the packaging method of the present invention.

圖14顯示本發明封裝方法中之設置待模封物於模封區內之示意圖。FIG. 14 shows a schematic diagram of the object to be molded in the molding area in the packaging method of the present invention.

圖15顯示本發明封裝方法中之第一模封材料置入第二腔體及第二模封材料置入第一腔體之示意圖。15 shows a schematic diagram of the first molding material being placed in the second cavity and the second molding material being placed in the first cavity in the packaging method of the present invention.

圖16顯示本發明封裝方法中之第一模封材料及第二模封材料擠入模封區內之示意圖。16 shows a schematic diagram of the first molding material and the second molding material extruded into the molding area in the packaging method of the present invention.

圖17顯示本發明封裝方法中之容置腔及連接通道內之第一模流之部分及第二模流之部分擠回模封區之示意圖。FIG. 17 shows a schematic diagram of the first mold flow part and the second mold flow part in the accommodating cavity and the connecting channel in the packaging method of the present invention extruded back into the mold sealing area.

1:封裝模具 1: Package mold

10:模具本體 10: Mold body

11:模封區 11: Mold sealing area

12:側流道 12: Side runner

20:第一腔體 20: The first cavity

21:容置腔 21: containing cavity

22:連接通道 22: connection channel

30:第二腔體 30: second cavity

32:加料注澆通道 32: Feeding pouring channel

111:待模封區塊 111: Block to be molded

112:切割道 112: Cutting Road

Claims (25)

一種封裝模具，包括：一模具本體，具有至少一模封區，所述模封區之兩側分別具有一側流道，所述側流道連通所述模封區；二第一腔體，連接該模具本體，每一所述第一腔體具有一容置腔及至少一連接通道，所述連接通道連通所述模封區及所述容置腔；複數個第二腔體，連接該模具本體，每一所述第二腔體具有一置料腔及至少一加料注澆通道，所述加料注澆通道連通所述模封區及所述置料腔，且所述第一腔體之連接通道之容積大於所述第二腔體之加料注澆通道之容積；及二中空緩衝件，所述二中空緩衝件連接所述模具本體，且所述二中空緩衝件分別對應及連通各所述側流道。 A packaging mold includes: a mold body with at least one molding area, two sides of the molding area are respectively provided with a side flow channel, the side flow path is connected to the molding area; two first cavities, Connecting to the mold body, each of the first cavities has an accommodating cavity and at least one connecting channel, and the connecting channel communicates with the molding area and the accommodating cavity; a plurality of second cavities are connected to the The mold body, each of the second cavities has a material placing cavity and at least one filling and pouring channel, the filling and casting channel communicates with the molding area and the material placing cavity, and the first cavity The volume of the connecting channel is greater than the volume of the pouring channel of the second cavity; and two hollow buffer members, the two hollow buffer members are connected to the mold body, and the two hollow buffer members correspond to and communicate with each other, respectively The side flow channel. 如請求項1之封裝模具，其中所述第一腔體之連接通道具有一第一開口，所述第一腔體之連接通道經由所述第一開口連通所述模封區；所述第二腔體之加料注澆通道具有一第二開口，所述第二腔體之加料注澆通道經由所述第二開口連通所述模封區，且所述第一開口之開口面積大於所述第二開口之開口面積。 The packaging mold of claim 1, wherein the connecting passage of the first cavity has a first opening, and the connecting passage of the first cavity is connected to the molding area through the first opening; the second The feeding and pouring passage of the cavity has a second opening, the feeding and pouring passage of the second cavity is connected to the molding area through the second opening, and the opening area of the first opening is larger than that of the first opening. 2. The opening area of the opening. 如請求項1之封裝模具，其中所述連接通道之幾何形狀與所述加料注澆通道之幾何形狀不相同。 The packaging mold of claim 1, wherein the geometric shape of the connecting channel is different from the geometric shape of the filling and pouring channel. 如請求項1之封裝模具，其中所述至少一加料注澆通道包括二加料注澆通道，且所述二加料注澆通道呈八字狀。 The packaging mold of claim 1, wherein the at least one feeding channel includes two feeding channels, and the two feeding channels are in a figure eight shape. 如請求項1之封裝模具，其中所述模封區具有複數個待模封區塊及複數條切割道，所述待模封區塊係間隔排列，所述切割道用以定義所述待模封區塊，且所述側流道之寬度大於各所述切割道之寬度。 Such as the packaging mold of claim 1, wherein the molding area has a plurality of blocks to be molded and a plurality of cutting channels, the blocks to be molded are arranged at intervals, and the cutting channels are used to define the mold to be molded Sealing block, and the width of the side flow channel is greater than the width of each cutting channel. 如請求項5之封裝模具，其中所述第一腔體之幾何形狀與所述第二腔體之幾何形狀不相同。 The packaging mold of claim 5, wherein the geometric shape of the first cavity is different from the geometric shape of the second cavity. 如請求項1之封裝模具，其中所述第一腔體之幾何形狀與所述第二腔體之幾何形狀相同。 The packaging mold of claim 1, wherein the geometric shape of the first cavity is the same as the geometric shape of the second cavity. 如請求項1之封裝模具，更包括二第一柱塞及複數個第二柱塞，所述二第一柱塞分別對應各所述第一腔體之所述容置腔，該等第二柱塞分別對應各所述第二腔體之所述置料腔。 For example, the packaging mold of claim 1, further comprising two first plungers and a plurality of second plungers, the two first plungers respectively corresponding to the accommodating cavities of the first cavities, and the second plungers The plungers respectively correspond to the material placing cavities of the second cavities. 如請求項8之封裝模具，其中各所述第一柱塞具有一端面，各所述第二柱塞具有一端面，且各所述第一柱塞之端面與各所述第二柱塞之端面位於同一平面上。 The packaging mold of claim 8, wherein each of the first plungers has an end surface, each of the second plungers has an end surface, and the end surface of each of the first plungers and each of the second plungers are The end faces are on the same plane. 如請求項8之封裝模具，其中各所述第一柱塞具有一端面，各所述第二柱塞具有一端面，且各所述第一柱塞之端面與各所述第二柱塞之端面位 於不同平面上。 The packaging mold of claim 8, wherein each of the first plungers has an end surface, each of the second plungers has an end surface, and the end surface of each of the first plungers and each of the second plungers are End position On different planes. 一種封裝方法，包括：(a)提供一封裝模具，所述封裝模具包括一模具本體、二第一腔體及複數個第二腔體，所述模具本體具有一模封區，所述第一腔體及所述第二腔體連接所述模具本體且連通所述模封區；(b)設置至少一待模封物於所述模封區內；(c)將複數個第一模封材料分別置入各所述第二腔體，且淨空各所述第一腔體；及(d)將所述第一模封材料擠入所述模封區內，以形成覆蓋所述待模封物之一第一模流及一第二模流，並使所述第二模流之部分流入各所述第一腔體內。 A packaging method includes: (a) providing a packaging mold, the packaging mold including a mold body, two first cavities and a plurality of second cavities, the mold body has a mold sealing area, the first The cavity and the second cavity are connected to the mold body and communicate with the molding area; (b) setting at least one object to be molded in the molding area; (c) sealing a plurality of first molds Materials are respectively placed in each of the second cavities, and each of the first cavities is cleared; and (d) extruding the first molding material into the molding area to form a covering of the to-be-molded A first mold flow and a second mold flow are enclosed, and a part of the second mold flow flows into each of the first cavities. 如請求項11之封裝方法，其中在該步驟(a)中，各所述第一腔體具有一容置腔及至少一連接通道，所述連接通道連通所述模封區及所述容置腔，各所述第二腔體具有一置料腔及至少一加料注澆通道，所述加料注澆通道連通所述模封區及所述置料腔，且所述連接通道之容積大於或等於所述加料注澆通道之容積。 Such as the packaging method of claim 11, wherein in the step (a), each of the first cavities has an accommodating cavity and at least one connecting channel, and the connecting channel communicates with the molding area and the accommodating Cavity, each of the second cavities has a material placing cavity and at least one filling pouring channel, the filling pouring channel communicates with the molding area and the material placing cavity, and the volume of the connecting channel is greater than or It is equal to the volume of the feeding channel. 如請求項12之封裝方法，其中在該步驟(d)中，所述第二模流之部分係流入各所述第一腔體之所述連接通道及所述容置腔。 The packaging method of claim 12, wherein in the step (d), a part of the second mold flow flows into the connecting channel and the containing cavity of each of the first cavities. 如請求項13之封裝方法，其中在該步驟(d)之後，該封裝方法更包 括：(e)將位於各所述第一腔體之所述容置腔及所述連接通道內之所述第二模流之部分擠回所述模封區。 Such as the packaging method of claim 13, wherein after the step (d), the packaging method is more comprehensive Including: (e) squeezing the part of the second mold flow located in the accommodating cavity and the connecting channel of each of the first cavities back to the molding area. 如請求項11之封裝方法，其中在該步驟(d)中，所述第一模流具有一第一深度，所述第二模流具有一第二深度，且所述第一深度大於或等於所述第二深度。 Such as the packaging method of claim 11, wherein in the step (d), the first mold flow has a first depth, the second mold flow has a second depth, and the first depth is greater than or equal to The second depth. 如請求項11之封裝方法，其中在該步驟(d)中，所述第二模流係形成於所述第一模流之兩側。 The packaging method of claim 11, wherein in the step (d), the second mold flow is formed on both sides of the first mold flow. 如請求項11之封裝方法，其中在該步驟(d)中，所述第一模封材料係經由一加熱與加壓程序而擠入所述模封區內。 The packaging method of claim 11, wherein in the step (d), the first molding material is extruded into the molding area through a heating and pressurizing process. 一種封裝方法，包括：(a)提供一封裝模具，所述封裝模具包括一模具本體、二第一腔體及複數個第二腔體，所述模具本體具有一模封區，所述第一腔體及所述第二腔體連接所述模具本體且連通所述模封區；(b)設置至少一待模封物於所述模封區內；(c)將複數個第一模封材料分別置入各所述第二腔體以及將複數個第二模封材料分別置入各所述第一腔體；及(d)將所述第一模封材料及所述第二模封材料擠入所述模封區內，以形成覆蓋所述待模封物之一第一模流及一第二模流，並使所述第 二模流之部分流入各所述第一腔體內。 A packaging method includes: (a) providing a packaging mold, the packaging mold including a mold body, two first cavities and a plurality of second cavities, the mold body has a mold sealing area, the first The cavity and the second cavity are connected to the mold body and communicate with the molding area; (b) setting at least one object to be molded in the molding area; (c) sealing a plurality of first molds Materials are respectively placed in each of the second cavities and a plurality of second molding materials are respectively placed in each of the first cavities; and (d) the first molding material and the second mold are sealed The material is extruded into the molding area to form a first mold flow and a second mold flow covering the object to be molded, and make the first mold flow Part of the second mold flow flows into each of the first cavities. 如請求項18之封裝方法，其中在該步驟(a)中，各所述第一腔體具有一容置腔及至少一連接通道，所述連接通道連通所述模封區及所述容置腔，各所述第二腔體具有一置料腔及至少一加料注澆通道，所述加料注澆通道連通所述模封區及所述置料腔，且所述連接通道之容積大於或等於所述加料注澆通道之容積。 The packaging method of claim 18, wherein in the step (a), each of the first cavities has an accommodating cavity and at least one connecting channel, and the connecting channel communicates with the molding area and the accommodating Cavity, each of the second cavities has a material placing cavity and at least one filling pouring channel, the filling pouring channel communicates with the molding area and the material placing cavity, and the volume of the connecting channel is greater than or It is equal to the volume of the feeding channel. 如請求項19之封裝方法，其中在該步驟(d)中，所述第二模流之部分係流入各所述第一腔體之所述連接通道及所述容置腔。 The packaging method of claim 19, wherein in the step (d), a part of the second mold flow flows into the connecting channel and the containing cavity of each of the first cavities. 如請求項20之封裝方法，其中在該步驟(d)之後，該封裝方法更包括：(e)將位於各所述第一腔體之所述容置腔及所述連接通道內之所述第二模流之部分擠回所述模封區。 Such as the packaging method of claim 20, wherein after the step (d), the packaging method further comprises: (e) placing the accommodating cavity and the connecting channel in each of the first cavities A part of the second mold flow is squeezed back into the molding area. 如請求項18之封裝方法，其中在該步驟(c)中，各所述第一模封材料之體積大於各所述第二模封材料之體積。 The packaging method of claim 18, wherein in the step (c), the volume of each of the first molding materials is greater than the volume of each of the second molding materials. 如請求項18之封裝方法，其中在該步驟(d)中，所述第一模流具有一第一深度，所述第二模流具有一第二深度，且所述第一深度大於或等於所述第二深度。 Such as the packaging method of claim 18, wherein in the step (d), the first mold flow has a first depth, the second mold flow has a second depth, and the first depth is greater than or equal to The second depth. 如請求項18之封裝方法，其中在該步驟(d)中，所述第二模流係形成於所述第一模流之兩側。 The packaging method of claim 18, wherein in the step (d), the second mold flow is formed on both sides of the first mold flow. 如請求項18之封裝方法，其中在該步驟(d)中，所述第一模封材料及所述第二模封材料係經由一加熱與加壓程序而擠入所述模封區內。 The packaging method of claim 18, wherein in the step (d), the first molding material and the second molding material are extruded into the molding area through a heating and pressing process.
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