TWI717651B - Method and apparatus for manufacturing piezoelectric material film - Google Patents
Method and apparatus for manufacturing piezoelectric material film Download PDFInfo
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本發明是有關於一種壓電材料技術,且特別是有關於一種壓電材料薄膜之製造方法與設備。 The present invention relates to a piezoelectric material technology, and particularly relates to a method and equipment for manufacturing a piezoelectric material film.
近年來,壓電材料的應用相當廣泛,這些應用包含電子產品觸控感測器、軍機迴聲定位、以及超音波蜂鳴器等。基本上,壓電材料可分為兩大類:無機壓電材料以及有機壓電材料。其中,無機壓電材料可例如為壓電陶瓷,有機壓電材料可例如為壓電高分子材料。這兩類壓電材料各有優缺點,且各有其適合的應用。為了滿足特殊應用的需求,有時壓電材料必須做成薄膜。一般而言,需經過壓電塗料製備、壓電塗料塗布、以及壓電塗膜的極化處理後,才能得到具有壓電特性的薄膜。 In recent years, piezoelectric materials have been widely used. These applications include electronic product touch sensors, military aircraft echolocation, and ultrasonic buzzers. Basically, piezoelectric materials can be divided into two categories: inorganic piezoelectric materials and organic piezoelectric materials. Among them, the inorganic piezoelectric material may be, for example, a piezoelectric ceramic, and the organic piezoelectric material may be, for example, a piezoelectric polymer material. These two types of piezoelectric materials have their own advantages and disadvantages, and each has its own suitable applications. In order to meet the needs of special applications, sometimes piezoelectric materials must be made into thin films. Generally speaking, piezoelectric coating preparation, piezoelectric coating coating, and polarization treatment of the piezoelectric coating film are required to obtain a film with piezoelectric properties.
在高分子壓電塗料的製備過程中,高分子壓電材料與溶劑和其它添加物一起溶解,而得到高分子壓電溶液。陶瓷壓電塗料的製備方法有很多種,其中一種是在高分子基質中添加陶瓷壓電材料粉末和其它添加物,而得到陶瓷 壓電塗料。接下來,可以直接將所製備的高分子壓電溶液或陶瓷壓電塗料直接塗布在基板表面上。接著,對基板上的高分子壓電溶液或陶瓷壓電塗料進行烤乾或乾燥處理。然後,對基板上的高分子壓電塗層(薄膜)或陶瓷壓電塗層進行極化製程,而形成具有壓電特性的高分子壓電材料薄膜或壓電陶瓷薄膜。 In the preparation process of the polymer piezoelectric coating, the polymer piezoelectric material is dissolved together with the solvent and other additives to obtain the polymer piezoelectric solution. There are many methods for preparing ceramic piezoelectric coatings, one of which is to add ceramic piezoelectric material powder and other additives to the polymer matrix to obtain ceramic Piezoelectric paint. Next, the prepared polymer piezoelectric solution or ceramic piezoelectric paint can be directly coated on the surface of the substrate. Then, the polymer piezoelectric solution or ceramic piezoelectric paint on the substrate is baked or dried. Then, the polymer piezoelectric coating (film) or ceramic piezoelectric coating on the substrate is subjected to a polarization process to form a polymer piezoelectric material film or piezoelectric ceramic film with piezoelectric properties.
由於壓電材料裡的分子架構有不對稱的特性,因此帶正電和負電的物質分布不均勻,而造成分子架構裡有局部正極和局部負極。聚偏氟乙烯(PVDF)是非常有名的高分子壓電材料之一。在聚偏氟乙烯的架構中,長碳鏈骨幹與兩個氫原子或兩個氟原子以交錯的方式連接。由於氟原子的電子親和力非常強,因此氟原子變成局部負極,而氫原子則是局部正極。鋯鈦酸鉛(PZT)則是相當有名的壓電陶瓷材料之一。鋯鈦酸鉛具有正交晶格,鋯鈦酸鉛的正交晶格中的鈦陽離子或鋯陽離子的位子不是在晶格正中間而是偏上面或下面,使得晶格分成局部正極和局部負極。這樣的特性是壓電材料產生極性的來源,極性方向定義為從局部負極至局部正極的方向。晶格具有相同極性方向的區域叫做電域。 Because the molecular structure in piezoelectric materials has asymmetric characteristics, the distribution of positively and negatively charged materials is uneven, resulting in local positive and local negative electrodes in the molecular structure. Polyvinylidene fluoride (PVDF) is one of the very famous polymer piezoelectric materials. In the structure of polyvinylidene fluoride, a long carbon chain backbone is connected in a staggered manner with two hydrogen atoms or two fluorine atoms. Because the electron affinity of fluorine atoms is very strong, fluorine atoms become local negative electrodes, and hydrogen atoms are local positive electrodes. Lead zirconate titanate (PZT) is one of the most famous piezoelectric ceramic materials. Lead zirconate titanate has an orthorhombic lattice. In the orthorhombic lattice of lead zirconate titanate, the positions of titanium cations or zirconium cations are not in the middle of the lattice but above or below, making the lattice divided into local positive and local negative electrodes. . Such characteristics are the source of the polarity of piezoelectric materials, and the direction of polarity is defined as the direction from the local negative electrode to the local positive electrode. The region where the crystal lattice has the same polarity direction is called the electric domain.
壓電材料中之電域的極性方向常常沒有規則性而互相抵消,易造成整塊壓電材料沒有極性,進而無法呈現材料本身的壓電特性。因此,通常需對壓電材料進行極化製程,方能使壓電材料的電域方向一致而呈現壓電特性。 The polarity directions of the electrical domains in piezoelectric materials often have no regularity and cancel each other out, which easily causes the entire piezoelectric material to have no polarity, and thus cannot exhibit the piezoelectric properties of the material itself. Therefore, it is usually necessary to perform a polarization process on the piezoelectric material to make the direction of the electric domain of the piezoelectric material consistent and exhibit piezoelectric characteristics.
本發明之一目的就是在提供一種壓電材料薄膜之製造方法與設備,其可同時進行壓電塗料的噴塗與極化,因此不僅可有效縮短壓電材料薄膜的製程時間,更可簡化壓電材料薄膜的製程,進而可提升壓電材料薄膜的製作效率,降低製程成本。 One of the objectives of the present invention is to provide a method and equipment for manufacturing piezoelectric material films, which can simultaneously spray and polarize piezoelectric coatings, thus not only can effectively shorten the manufacturing process time of piezoelectric material films, but also simplify piezoelectric material films. The manufacturing process of the material film can further improve the manufacturing efficiency of the piezoelectric material film and reduce the manufacturing cost.
本發明之另一目的是在提供一種壓電材料薄膜之製造方法與設備,其可在壓電塗料及/或壓電材料塗層尚未固化時,便對壓電塗料及/或壓電材料塗層進行極化處理,因此可大幅縮減極化時間,減少製程能耗。 Another object of the present invention is to provide a method and equipment for manufacturing a piezoelectric material film, which can apply piezoelectric paint and/or piezoelectric material when the piezoelectric paint and/or piezoelectric material coating is not yet cured. The layer is polarized, so the polarization time can be greatly reduced and the energy consumption of the process can be reduced.
根據本發明之上述目的,提出一種壓電材料薄膜之製造設備。此壓電材料薄膜之製造設備包含噴射裝置、電網、以及直流電源。噴射裝置配置以朝基板噴射壓電塗料而在基板上形成壓電材料塗層,其中噴射裝置包含至少一導電噴頭。電網設於噴射裝置與基板之間,且鄰近基板。電網具有至少一開孔,壓電塗料經由此至少一開孔而噴射在基板上。直流電源包含第一輸出端、第二輸出端、與第三輸出端,其中第一輸出端電性耦合於上述至少一導電噴頭,第二輸出端電性耦合於電網,第三輸出端電性耦合於基板,直流電源配置以在導電噴頭與基板之間形成高電場環境,此高電場環境中的電場值至少約4000V/cm。 According to the above-mentioned object of the present invention, a manufacturing equipment of piezoelectric material film is provided. The manufacturing equipment of this piezoelectric material film includes an injection device, a power grid, and a DC power supply. The spray device is configured to spray piezoelectric paint toward the substrate to form a piezoelectric material coating on the substrate, wherein the spray device includes at least one conductive spray head. The power grid is arranged between the injection device and the substrate and is adjacent to the substrate. The power grid has at least one opening, and the piezoelectric paint is sprayed on the substrate through the at least one opening. The DC power supply includes a first output terminal, a second output terminal, and a third output terminal. The first output terminal is electrically coupled to the at least one conductive nozzle, the second output terminal is electrically coupled to the power grid, and the third output terminal is electrically coupled Coupled to the substrate, the DC power supply is configured to form a high electric field environment between the conductive showerhead and the substrate, and the electric field value in the high electric field environment is at least about 4000V/cm.
依據本發明之一實施例,上述之導電噴頭的電壓大於電網的電壓,電網的電壓大於基板的電壓。 According to an embodiment of the present invention, the voltage of the aforementioned conductive nozzle is greater than the voltage of the power grid, and the voltage of the power grid is greater than the voltage of the substrate.
依據本發明之一實施例,上述之壓電材料薄膜之製造設備更包含電子源,其中電子源設於電網上方,且配置以朝基板提供電子束,電子源之電壓大於電網之電壓。 According to an embodiment of the present invention, the above-mentioned piezoelectric material film manufacturing equipment further includes an electron source, wherein the electron source is arranged above the power grid and is configured to provide electron beams to the substrate. The voltage of the electron source is greater than the voltage of the power grid.
依據本發明之一實施例,上述之壓電材料薄膜之製造設備更包含紅外燈設於電網上方,其中此紅外燈配置以對壓電材料塗層進行烘乾處理。 According to an embodiment of the present invention, the aforementioned piezoelectric material film manufacturing equipment further includes an infrared lamp arranged above the power grid, wherein the infrared lamp is configured to dry the piezoelectric material coating.
依據本發明之一實施例,上述之壓電材料薄膜之製造設備更包含加熱器鄰設於基板,其中加熱器配置以利用熱傳導方式對壓電材料塗層進行烘乾處理。 According to an embodiment of the present invention, the above-mentioned piezoelectric material film manufacturing equipment further includes a heater adjacent to the substrate, wherein the heater is configured to dry the piezoelectric material coating by heat conduction.
依據本發明之一實施例,上述之基板包含透明導電膜,壓電材料塗層塗布在透明導電膜之表面上,壓電材料薄膜之製造設備更包含加熱電源,此加熱電源配置以對透明導電膜施加電力來提高透明導電膜之溫度,藉以對壓電材料塗層進行烘乾處理。 According to an embodiment of the present invention, the above-mentioned substrate includes a transparent conductive film, the piezoelectric material coating is coated on the surface of the transparent conductive film, and the manufacturing equipment of the piezoelectric material film further includes a heating power source configured to conduct the transparent conductive film. Electricity is applied to the film to increase the temperature of the transparent conductive film, thereby drying the piezoelectric material coating.
根據本發明之上述目的,另提出一種壓電材料薄膜之製造方法。在此方法中,將基板設於電網與噴射裝置之下方,其中電網介於基板與噴射裝置之間,且鄰近基板之表面。利用直流電源對基板、電網、與噴射裝置之至少一導電噴頭施加電力,以使上述電網與至少一導電噴頭具有相同或相近電位,且使基板具有不同於上述電網與至少一導電噴頭之電位。於利用直流電源對基板、電網、與噴射裝置之至少一導電噴頭施加電力時,利用噴射裝置之至少一導電噴頭經由電網之至少一開孔朝基板噴射壓電塗料,以在基板上形 成壓電材料塗層,其中電網極化在電網與基板之間之壓電塗料與壓電材料塗層。 According to the above objective of the present invention, another method for manufacturing a piezoelectric material film is proposed. In this method, the substrate is placed under the power grid and the spraying device, where the power grid is between the substrate and the spraying device and adjacent to the surface of the substrate. The DC power supply is used to apply power to the substrate, the power grid, and at least one conductive nozzle of the spray device, so that the power grid and the at least one conductive nozzle have the same or similar potential, and the substrate has a different potential from the power grid and the at least one conductive nozzle. When the DC power supply is used to apply power to at least one conductive spray head of the substrate, the power grid, and the spraying device, at least one conductive spray head of the spraying device is used to spray piezoelectric paint toward the substrate through at least one opening of the power grid to form a shape on the substrate. A piezoelectric material coating, where the grid is polarized between the grid and the substrate, and the piezoelectric paint and piezoelectric material coating.
依據本發明之一實施例,上述利用噴射裝置之至少一導電噴頭經由電網之至少一開孔朝基板之表面噴射壓電塗料時,更包含使電網與基板相對移動。 According to an embodiment of the present invention, when at least one conductive nozzle of the spray device is used to spray piezoelectric paint toward the surface of the substrate through at least one opening of the power grid, it further includes moving the power grid and the substrate relatively.
依據本發明之一實施例,上述於電網極化在電網與基板之間之壓電塗料與壓電材料塗層時,更包含利用加熱器以照光方式或熱傳導方式對壓電材料塗層進行烘乾處理。 According to an embodiment of the present invention, when the piezoelectric paint and the piezoelectric material coating are polarized between the power grid and the substrate, the piezoelectric material coating further includes using a heater to bake the piezoelectric material coating by illumination or thermal conduction. Dry treatment.
依據本發明之一實施例,上述之基板包含透明導電膜,且壓電材料塗層塗布在透明導電膜之表面上,於電網極化在電網與基板之間之壓電塗料與壓電材料塗層時,更包含利用加熱電源對透明導電膜施加電力來提高透明導電膜之溫度,藉以對壓電材料塗層進行烘乾處理。 According to an embodiment of the present invention, the above-mentioned substrate includes a transparent conductive film, and the piezoelectric material coating is coated on the surface of the transparent conductive film, and the piezoelectric coating and piezoelectric material coating are polarized between the power grid and the substrate. When layering, it also includes the use of heating power to apply power to the transparent conductive film to increase the temperature of the transparent conductive film, thereby drying the piezoelectric material coating.
100‧‧‧製造設備 100‧‧‧Manufacturing equipment
100a‧‧‧製造設備 100a‧‧‧Manufacturing equipment
100b‧‧‧製造設備 100b‧‧‧Manufacturing equipment
100c‧‧‧製造設備 100c‧‧‧Manufacturing equipment
100d‧‧‧製造設備 100d‧‧‧Manufacturing equipment
110‧‧‧噴射裝置 110‧‧‧Spraying device
112‧‧‧導電噴頭 112‧‧‧Conductive nozzle
114‧‧‧容置部 114‧‧‧Containment Department
120‧‧‧電網 120‧‧‧Grid
122‧‧‧開孔 122‧‧‧Opening
130‧‧‧直流電源 130‧‧‧DC power supply
132‧‧‧第一輸出端 132‧‧‧First output
134‧‧‧第二輸出端 134‧‧‧Second output
136‧‧‧第三輸出端 136‧‧‧Third output
140‧‧‧基板 140‧‧‧Substrate
140a‧‧‧基板 140a‧‧‧Substrate
142‧‧‧表面 142‧‧‧surface
144‧‧‧表面 144‧‧‧surface
146‧‧‧導電基底 146‧‧‧Conductive substrate
148‧‧‧透明導電膜 148‧‧‧Transparent conductive film
148a‧‧‧表面 148a‧‧‧surface
150‧‧‧壓電塗料 150‧‧‧Piezoelectric paint
152‧‧‧壓電材料塗層 152‧‧‧Piezoelectric material coating
160‧‧‧壓電材料供應源 160‧‧‧Piezoelectric material supply source
162‧‧‧管路 162‧‧‧Pipe
170‧‧‧紅外燈 170‧‧‧Infrared light
180‧‧‧加熱器 180‧‧‧Heater
190‧‧‧加熱電源 190‧‧‧Heating power supply
192‧‧‧電子源 192‧‧‧Electron source
194‧‧‧電子束 194‧‧‧Electron beam
196‧‧‧網孔 196‧‧‧Mesh
200‧‧‧步驟 200‧‧‧Step
210‧‧‧步驟 210‧‧‧Step
220‧‧‧步驟 220‧‧‧Step
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附圖式之說明如下:〔圖1〕係繪示依照本發明之一實施方式的一種壓電材料薄膜之製造設備的裝置示意圖;〔圖2〕係繪示依照本發明之一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖; 〔圖3〕係繪示依照本發明之另一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖;〔圖4〕係繪示依照本發明之又一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖;〔圖5〕係繪示依照本發明之再一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖;〔圖6〕係繪示依照本發明之再一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖;以及〔圖7〕係繪示依照本發明之一實施方式的一種壓電材料薄膜之製造方法的流程圖。 In order to make the above and other objects, features, advantages and embodiments of the present invention more comprehensible, the description of the accompanying drawings is as follows: [Figure 1] shows a piezoelectric material film according to one embodiment of the present invention [Figure 2] is a schematic cross-sectional view of a piezoelectric material thin film manufacturing equipment according to an embodiment of the present invention; [FIG. 3] is a schematic cross-sectional view of a manufacturing equipment of a piezoelectric material film according to another embodiment of the present invention; [FIG. 4] is a schematic view of a piezoelectric material film according to another embodiment of the present invention A schematic cross-sectional view of the manufacturing equipment; [FIG. 5] A schematic cross-sectional view of a piezoelectric material thin film manufacturing equipment according to another embodiment of the present invention; [FIG. 6] A schematic view of another embodiment of the present invention A schematic cross-sectional view of a manufacturing equipment for a piezoelectric material film; and [FIG. 7] is a flowchart showing a manufacturing method of a piezoelectric material film according to an embodiment of the present invention.
請參照圖1與圖2,其係分別繪示依照本發明之一實施方式的一種壓電材料薄膜之製造設備的裝置示意圖與剖面示意圖。在一些實施例中,壓電材料薄膜之製造設備100主要包含噴射裝置110、電網120、以及直流電源130。噴射裝置110包含一個或多個導電噴頭112。噴射裝置110配置以經由這些導電噴頭112朝基板140之表面142噴射壓電塗料150,而在基板140之表面142上形成壓電材料塗層152。舉例而言,導電噴頭112之材料可為金屬。在一些示範例子中,噴射裝置110可包含至少一容置部114,其中容置部114可用以裝填容置壓電塗料150。容置部114與導電噴頭112相連通。舉例而言,在噴射裝置110中,一個容置部114可與一個導電噴頭112連接且相通,或者一個容置部
114可同時與多個導電噴頭112連通。容置部114為非導體。在一些示範例子中,壓電材料薄膜之製造設備100之噴射裝置110可透過管路162而與壓電材料供應源160互相連通。壓電材料供應源160儲放有壓電塗料150。壓電材料供應源160可利用管路162將其內所儲放之壓電塗料150輸送至噴射裝置110之容置部114,容置部114再將所接收之壓電塗料150傳送到導電噴頭112,導電噴頭112接下來將壓電塗料150朝基板140之表面142的方向噴射。舉例而言,壓電材料供應源160可利用蠕動式幫浦或注射幫浦來將壓電塗料150輸送至噴射裝置110。
Please refer to FIG. 1 and FIG. 2, which respectively show a schematic diagram and a cross-sectional schematic diagram of a piezoelectric material film manufacturing equipment according to an embodiment of the present invention. In some embodiments, the
請再次參照圖1與圖2,電網120設置在噴射裝置110之導電噴頭112與基板140之表面142之間,且電網120鄰近基板140之表面142。在一些例子中,電網120橫設於基板140之表面142的上方。舉例而言,電網120之延伸方向可實質平行於基板140之表面142。電網120具有至少一開孔122。在一些示範例子中,可根據所需圖案來設計電網120之開孔122的形狀。噴射裝置110朝基板140噴射壓電塗料150時,壓電塗料150可穿過電網120之開孔122而噴射在基板140之表面142上。
Please refer to FIGS. 1 and 2 again. The
直流電源130可為高壓直流電源。在一些例子中,直流電源130配置以在導電噴頭112與基板140之間形成高電場環境,此高電場環境中的電場值至少約4000V/cm。在一些示範例子中,直流電源130之電壓範圍從約5kV至約40kV。直流電源130可包含第一輸出端132、
第二輸出端134、與第三輸出端136。舉例而言,第三輸出端136可接地而具有接地電位(即電位0),第一輸出端132與第二輸出端134為負電電位;或者,第三輸出端136可為正電電位,第一輸出端132與第二輸出端134為負電電位。如圖1與圖2所示,直流電源130之第一輸出端132電性耦合於噴射裝置110之導電噴頭112,第二輸出端134電性耦合於電網120,而直流電源130之第三輸出端136電性耦合於基板140。在一些示範例子中,藉由這樣的電性耦合,使噴射裝置110之導電噴頭112的電壓大於電網120的電壓,電網120的電壓大於基板140的電壓。在一些特定例子中,導電噴頭112與電網120的電壓可彼此相同或相近。容置部114為非導體且壓電塗料150從管路162採用點滴方式應料到容置部114,因此第一輸出端132與管路162和壓電材料供應源160隔絕。在一些示範例子中,分別與導電噴頭112及電網120耦接之第一輸出端132及第二輸出端134為高壓輸出端,第三輸出端134與基板140接地。
The
在一些例子中,壓電材料薄膜之製造設備100利用電紡絲原理或電噴霧原理來進行壓電塗料150的塗布製程。壓電塗料150由壓電材料供應源160的供應機制傳輸到噴射裝置110之導電噴頭112,由於導電噴頭112以及基板140分別與直流電源130的第一輸出端132及第三輸出端136電性耦接,因此不僅可使導電噴頭112內的壓電塗料150帶電,亦可在導電噴頭112與基板140之間產生極大的電場。藉此,壓電塗料150可自導電噴頭112朝基板140噴
出,同時使壓電塗料150變成非常細小的液滴或絲狀液,而在基板140之表面142上形成均勻的壓電材料塗層152。
In some examples, the piezoelectric material
此外,由於電網120之電位與導電噴頭112之電位可相同或相近,因此電網120與基板140之間亦形成很大的電壓差,而可使電子從電網120發射到塗布於基板140之表面142上的壓電材料塗層152上,來對壓電材料塗層152進行極化製程。在極化製程中,電網120發射到壓電材料塗層152上的電子在壓電材料塗層152形成電應力,而強迫壓電材料塗層152之電域跟著電應力方向來轉向,藉此可形成具有壓電特性之壓電材料薄膜。在一些例子中,從電網120朝基板140之表面142發射之電子也會極化電網120與基板140之表面142之間的壓電塗料150。此時,壓電塗料150與壓電材料塗層152均處於尚未完全固化的狀態,因此壓電塗料150與壓電材料塗層152較已固化的壓電薄膜容易被極化,故可大幅提升壓電材料薄膜之極化速度與效率。
In addition, since the potential of the
請參照圖3,其係繪示依照本發明之另一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖。本實施方式之壓電材料薄膜之製造設備100a之元件與架構大致上與上述壓電材料薄膜之製造設備100的元件與架構相同,二者之間的差異在於壓電材料薄膜之製造設備100a更包含一或多個紅外燈170。在壓電材料薄膜之製造設備100a中,紅外燈170係配置以對塗布於基板140之表面142上之壓電材料塗層152進行烘乾處理,以加速壓電材料塗層152的固化。在一些示範例子中,紅外燈170設於電網120之上方,朝電
網120下方之壓電材料塗層152發射紅外光來加速固化壓電材料塗層152。
Please refer to FIG. 3, which is a schematic cross-sectional view of a piezoelectric material film manufacturing equipment according to another embodiment of the present invention. The elements and structure of the piezoelectric material
請參照圖4,其係繪示依照本發明之又一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖。本實施方式之壓電材料薄膜之製造設備100b之元件與架構大致上與上述壓電材料薄膜之製造設備100的元件與架構相同,二者之間的差異在於壓電材料薄膜之製造設備100b更包含加熱器180。在壓電材料薄膜之製造設備100b中,加熱器180係配置以對塗布於基板140之表面142上之壓電材料塗層152進行烘乾處理,以加快壓電材料塗層152固化的速度。在本實施方式中,加熱器180鄰設於基板140。在一些示範例子中,加熱器180與基板140之另一表面144接合,其中基板140之表面144與142分別位於基板140的相對二側。加熱器180可利用熱傳導方式從基板140之表面144經由基板140來對另一側之表面142上的壓電材料塗層152進行烘乾處理,以縮短壓電材料塗層152固化的時間。
Please refer to FIG. 4, which is a schematic cross-sectional view of a manufacturing equipment of a piezoelectric material film according to another embodiment of the present invention. The components and structure of the piezoelectric material
請參照圖5,其係繪示依照本發明之再一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖。本實施方式之壓電材料薄膜之製造設備100c之元件與架構大致上與上述壓電材料薄膜之製造設備100的元件與架構相同,二者之間的差異在於壓電材料薄膜之製造設備100c更包含加熱電源190。在此實施方式中,基板140a包含透明導電膜148,其中壓電材料塗層152係塗布在透明導電膜148之表面148a上。舉例而言,透明導電膜148可為氧化銦錫(ITO)
膜、氧化銦鋅(IZO)、或氧化鋁鋅(AZO)等。在一些例子中,基板140a更包含導電基底146,透明導電膜148係覆蓋在導電基底146上。
Please refer to FIG. 5, which is a schematic cross-sectional view of a piezoelectric material film manufacturing equipment according to another embodiment of the present invention. The elements and structure of the piezoelectric material
在壓電材料薄膜之製造設備100c中,直流電源130之第一輸出端132電性耦合於噴射裝置110之導電噴頭112,直流電源130之第二輸出端134電性耦合於電網120,而直流電源130之第三輸出端134電性耦合於基板140之導電基底146。加熱電源190與透明導電膜148電性耦合,因此加熱電源190可對透明導電膜148施加電力,藉此可提高透明導電膜148的溫度,進一步可利用透明導電膜148來對其表面148a上的壓電材料塗層152進行烘乾處理,以加速壓電材料塗層152的固化。
In the piezoelectric material
請參照圖6,其係繪示依照本發明之再一實施方式的一種壓電材料薄膜之製造設備的剖面示意圖。本實施方式之壓電材料薄膜之製造設備100d之元件與架構大致上與上述壓電材料薄膜之製造設備100的元件與架構相同,二者之間的差異在於壓電材料薄膜之製造設備100d更包含電子源192。此實施方式可適用於電網120無法提供充足的電子量的情況。
Please refer to FIG. 6, which is a schematic cross-sectional view of a piezoelectric material film manufacturing equipment according to another embodiment of the present invention. The elements and structure of the piezoelectric material
在壓電材料薄膜之製造設備100d中,電子源192裝設於電網120的上方。電子源192可與導電噴頭112均連接至第一輸出端132,因而電子源192與導電噴頭112及第一輸出端132具有相同電位。電子源192亦可獨立連接其他電源,而產生高電壓。電子源192可利用尖端放電方式
或電暈放電方式提供電子束194。採尖端放電方式之電子源192可包含例如針狀電極、排針電極、或線狀電極。電子源192電壓大於電網120的電壓,且電網120的電壓大於基板140的電壓,因而在電子源192與電網120之間以及電網120與基板140之間產生電場。電子源192所提供之電子束192隨著電場方向噴射到電網120,接著電子束194經由電網120之網格架構的網孔196繼續往基板140發射。
In the
除了壓電材料薄膜之製造設備100外,電子源192亦可設置在圖3至圖5所示之壓電材料薄膜之製造設備100a、100b、與100c中。當電子源192設置於圖3之製造設備100a中時,電子源192位於紅外燈170之上方。
In addition to the piezoelectric material
上述實施方式之壓電材料薄膜之製造設備100、100a、100b、100c、與100d可用以製造壓電材料薄膜。以下利用壓電材料薄膜之製造設備100為例來說明製造壓電材料薄膜的實施方式。
The piezoelectric material
請同時參照圖7以及圖1與圖2,其中圖7係繪示依照本發明之一實施方式的一種壓電材料薄膜之製造方法的流程圖。在一些實施例中,製造壓電材料薄膜時,可進行步驟200,以將基板140設於電網120與噴射裝置110的下方。如圖1與圖2所示,電網120係設於基板140與噴射裝置110之導電噴頭112之間,且電網120可鄰近於基板140之表面142。
Please refer to FIG. 7 and FIG. 1 and FIG. 2 at the same time. FIG. 7 is a flowchart of a method for manufacturing a piezoelectric material film according to an embodiment of the present invention. In some embodiments, when the piezoelectric material film is manufactured,
接下來,可進行步驟210,以將直流電源130之第一輸出端132電性耦合於噴射裝置110之導電噴頭
112,將直流電源130之第二輸出端134電性耦合於電網120,且將直流電源130之第三輸出端136電性耦合於基板140。接下來,可利用直流電源130對基板140、電網120、與噴射裝置110之導電噴頭112施加電力,以使電網120與噴射裝置110之導電噴頭112具有相同或相近電位,且使基板140具有不同於電網120與導電噴頭112的電位。在一些示範例子中,分別與導電噴頭112及電網120耦接之第一輸出端132及第二輸出端134為高壓輸出端,第二輸出端136與基板140接地。
Next, step 210 can be performed to electrically couple the
於利用直流電源130對基板140、電網120、與噴射裝置110之導電噴頭112施加電力的同時,可進行步驟220,以利用壓電材料供應源160經由管路162將壓電塗料150輸送至噴射裝置110之容置部114再供應給導電噴頭112,再利用導電噴頭112將壓電塗料150經由電網120之開孔122朝基板140之表面142噴射。在一些例子中,噴塗壓電塗料150時,直流電源130可在導電噴頭112與基板140之間形成高電場環境,此高電場環境中的電場值至少約4000V/cm。在一些示範例子中,噴塗壓電塗料150時,直流電源130之電壓可控制在從約5kV至約40kV。
While the
由於導電噴頭112以及基板140分別電性耦接於直流電源130之第一輸出端132及第三輸出端136,因此經由導電噴頭112噴出之壓電塗料150會帶電,且導電噴頭112與基板140之間產生極大的電場。導電噴頭112噴出之壓電塗料150可被吸引至基板140之表面142,而在基板140
之表面142上形成壓電材料塗層152。在噴塗壓電塗料150時,由於電網120的電位可與導電噴頭112的電位相等或相近,因此導電噴頭112噴射出的帶電壓電塗料150與電網120相斥,壓電塗料150噴射範圍集中在電網120的開孔122。故,電網120之開孔122圖案可影響壓電材料塗層152的圖案。在一些示範例子中,可根據所需之壓電材料塗層152的圖案來設計電網120之開孔122的形狀。在一些替代實施例中,利用噴射裝置110之導電噴頭112經由電網120之開孔122朝基板140之表面142噴塗壓電塗料150時,可使電網120與基板140相對移動,以形成具有所需圖案之壓電材料塗層152。舉例而言,在電網120不動的情況下,可前後左右橫向地移動基板140;或者,在基板140不動的情況下,可前後左右橫向地移動電網120;亦或者,橫向移動基板140與電網120。在一些例子中,基板140可為連續延伸的帶狀結構,且帶狀之基板140可捲成一捲,在基板140之表面142上噴塗壓電塗料150時,電網120可不動,而基板140連續的通過電網120之下方,接續地接受噴射裝置110之導電噴頭112噴塗壓電塗料150。在一些示範例子中,配合電網120的移動,可移動噴射裝置110,以使噴射裝置110之導電噴頭112所噴出之壓電塗料150可順利經由電網120之開孔122而塗布在基板140的表面142上。
Since the
噴塗壓電材料150的同時,由於電網120之電位與導電噴頭112之電位相同或相近,因此電網120與基板140之間也具有很大的電壓差,如此電子可從電網120朝基
板140之表面142的方向發射,而可對電網120與基板140之表面142之間的壓電塗料150、以及基板140之表面142上的壓電材料塗層152進行極化製程。在極化製程中,電網120發射到壓電塗料150與壓電材料塗層152上的電子在壓電塗料150與壓電材料塗層152形成電應力,而強迫壓電塗料150與壓電材料塗層152之電域跟著電應力方向來轉向,藉此可形成具有壓電特性之壓電材料薄膜。此時,壓電塗料150與壓電材料塗層152均處於尚未完全固化的狀態,因此壓電塗料150與壓電材料塗層152可比已經固化的壓電薄膜容易極化,故可大幅提升壓電材料薄膜之極化速度與效率。在本實施方式中,電網120所進行的極化程序必須維持到壓電材料塗層152完全固化成壓電材料薄膜。因此,壓電塗料150從液狀變成固狀的過程都在高電場的環境。
While spraying the
在一些例子中,在電網120對電網120與基板140之表面142之間的壓電塗料150與基板140之表面142上之壓電材料塗層152進行極化製程時,製造壓電材料薄膜之方法更可利用加熱器以照光方式或熱傳導方式對壓電材料塗層152進行烘乾處理。舉例而言,利用如圖3所示之紅外燈170來對壓電材料塗層152照光,以烘乾固化壓電材料塗層152;或者利用如圖4所示之加熱器180,以熱傳導方式來烘乾固化壓電材料塗層152。在一些替代例子中,如圖5所示,電網120對電網120與基板140a之間的壓電塗料150與基板140a上之壓電材料塗層152進行極化製程時,更可利用加熱電源190對基板140a之透明導電膜148施加電力,藉
此提高透明導電膜148之溫度,而進一步透過透明導電膜148來烘乾固化壓電材料塗層152。
In some examples, when the
由上述之實施方式可知,本發明之一優點就是因為本發明實施方式之壓電材料薄膜之製造方法與設備可同時進行壓電塗料的噴塗與極化,因此不僅可有效縮短壓電材料薄膜的製程時間,更可簡化壓電材料薄膜的製程,進而可提升壓電材料薄膜的製作效率,降低製程成本。 It can be seen from the above-mentioned embodiments that one of the advantages of the present invention is that the piezoelectric material film manufacturing method and equipment according to the embodiment of the present invention can simultaneously spray and polarize the piezoelectric paint, so it can not only effectively shorten the piezoelectric material film The manufacturing process time can further simplify the manufacturing process of the piezoelectric material film, thereby improving the manufacturing efficiency of the piezoelectric material film and reducing the manufacturing cost.
由上述之實施方式可知,本發明之另一優點就是因為本發明實施方式之壓電材料薄膜之製造方法與設備可在壓電塗料及/或壓電材料塗層尚未固化時,便對壓電塗料及/或壓電材料塗層進行極化處理,因此可大幅縮減極化時間,減少製程能耗。 As can be seen from the above-mentioned embodiments, another advantage of the present invention is that the piezoelectric material film manufacturing method and equipment according to the embodiments of the present invention can be applied to the piezoelectric material when the piezoelectric paint and/or piezoelectric material coating is not yet cured. The paint and/or piezoelectric material coating is polarized, so the polarizing time can be greatly reduced and the energy consumption of the process can be reduced.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何在此技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in this technical field can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.
100‧‧‧製造設備 100‧‧‧Manufacturing equipment
110‧‧‧噴射裝置 110‧‧‧Spraying device
112‧‧‧導電噴頭 112‧‧‧Conductive nozzle
114‧‧‧容置部 114‧‧‧Containment Department
120‧‧‧電網 120‧‧‧Grid
122‧‧‧開孔 122‧‧‧Opening
130‧‧‧直流電源 130‧‧‧DC power supply
132‧‧‧第一輸出端 132‧‧‧First output
134‧‧‧第二輸出端 134‧‧‧Second output
136‧‧‧第三輸出端 136‧‧‧Third output
140‧‧‧基板 140‧‧‧Substrate
142‧‧‧表面 142‧‧‧surface
150‧‧‧壓電塗料 150‧‧‧Piezoelectric paint
152‧‧‧壓電材料塗層 152‧‧‧Piezoelectric material coating
160‧‧‧壓電材料供應源 160‧‧‧Piezoelectric material supply source
162‧‧‧管路 162‧‧‧Pipe
Claims (10)
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0711424A (en) * | 1993-06-18 | 1995-01-13 | Ulvac Japan Ltd | Production of organic pyroelectric and piezoelectric body and device therefor |
JP2001286814A (en) * | 2000-04-05 | 2001-10-16 | Horiba Ltd | Particle film forming method |
TW201039474A (en) * | 2009-03-13 | 2010-11-01 | Mitsui Chemicals Inc | Polymer piezoelectric material and fabrication method thereof and piezoelectric device |
TW201344724A (en) * | 2012-03-29 | 2013-11-01 | Mitsubishi Materials Corp | Method of manufacturing ferroelectric thin film |
TW201343990A (en) * | 2012-03-29 | 2013-11-01 | Mitsubishi Materials Corp | Method of manufacturing ferroelectric thin film |
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2018
- 2018-11-06 TW TW107139375A patent/TWI717651B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0711424A (en) * | 1993-06-18 | 1995-01-13 | Ulvac Japan Ltd | Production of organic pyroelectric and piezoelectric body and device therefor |
JP2001286814A (en) * | 2000-04-05 | 2001-10-16 | Horiba Ltd | Particle film forming method |
TW201039474A (en) * | 2009-03-13 | 2010-11-01 | Mitsui Chemicals Inc | Polymer piezoelectric material and fabrication method thereof and piezoelectric device |
TW201344724A (en) * | 2012-03-29 | 2013-11-01 | Mitsubishi Materials Corp | Method of manufacturing ferroelectric thin film |
TW201343990A (en) * | 2012-03-29 | 2013-11-01 | Mitsubishi Materials Corp | Method of manufacturing ferroelectric thin film |
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