TWI711895B - Drawing method and drawing apparatus - Google Patents
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- TWI711895B TWI711895B TW108137506A TW108137506A TWI711895B TW I711895 B TWI711895 B TW I711895B TW 108137506 A TW108137506 A TW 108137506A TW 108137506 A TW108137506 A TW 108137506A TW I711895 B TWI711895 B TW I711895B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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Abstract
於對基板照射會聚光束來進行描繪之技術中，相對於在表面具有高低差之基板的表面使光束適當地追蹤。本發明係使將在表面配置有相對地突出之突出區域與相較於突出區域後退之後退區域的基板以水平姿勢加以載置之平台及對基板之表面照射會聚光束而進行描繪之描繪頭相對地移動，從而使光束之入射位置在基板表面掃描而對基板進行描繪之描繪方法；其具備有：光學性地檢測光束所入射之基板的表面位置之步驟；及根據表面位置之檢測結果而在光軸方向上調整光束之會聚位置，並使其追蹤基板之表面之步驟。會聚位置之調整被限制在根據突出區域及後退區域之各者中基板之表面位置之檢測結果所設定的追蹤範圍內。 In the technique of irradiating a condensed light beam to a substrate for drawing, the light beam is appropriately tracked with respect to the surface of the substrate having a height difference on the surface. The present invention opposes a platform on which a protruding area that protrudes relatively on the surface and a substrate with a retreat area from the protruding area are placed in a horizontal posture, and a drawing head that irradiates the surface of the substrate with a convergent light beam for drawing. The method of drawing the substrate by scanning the incident position of the light beam on the surface of the substrate by moving the light beam; it has the steps of optically detecting the surface position of the substrate on which the light beam is incident; and according to the detection result of the surface position The step of adjusting the convergent position of the light beam in the direction of the optical axis and making it track the surface of the substrate. The adjustment of the convergence position is limited to the tracking range set according to the detection result of the surface position of the substrate in each of the protruding area and the receding area.
Description
本發明係關於對基板照射會聚光束來進行描繪之描繪裝置的控制者，尤其關於光束之會聚位置的控制。 The present invention relates to a controller of a drawing device that irradiates a condensed light beam to a substrate for drawing, and particularly relates to the control of the converging position of the light beam.
作為在例如半導體晶圓或玻璃基板等之基板形成圖案之方法，存在有藉由光照射來進行描繪之技術。在該技術中，將形成有感光層之基板作為描繪對象物，並根據描繪資料對描繪對象物照射經調變之光而對感光層進行曝光。作為如此之用以進行光調變的光學調變器，可適當地應用空間光調變元件。例如在本案申請人所先揭示之日本專利特開2015-066869號公報(專利文獻1)記載之描繪裝置中，使線束光入射至空間光調變元件。然後，根據描繪資料對空間光調變元件之可動帶狀構件施加控制電壓，藉此利用光學系統使經調變之反射光會聚，使其作為會聚光束而入射至描繪對象物即基板來進行描繪。 As a method of forming a pattern on a substrate such as a semiconductor wafer or a glass substrate, there is a technique of drawing by light irradiation. In this technique, a substrate on which a photosensitive layer is formed is used as a drawing object, and the drawing object is irradiated with modulated light based on drawing data to expose the photosensitive layer. As such an optical modulator for light modulation, a spatial light modulation element can be suitably used. For example, in the drawing device described in Japanese Patent Laid-Open No. 2015-066869 (Patent Document 1) first disclosed by the applicant of this case, the line beam light is incident on the spatial light modulating element. Then, according to the drawing data, a control voltage is applied to the movable belt-shaped member of the spatial light modulating element, thereby using the optical system to converge the modulated reflected light and make it incident as a convergent beam on the substrate, which is the drawing object, for drawing. .
在該習知技術中，為了不藉由基板表面高度之變化等之變動因素便將光束之會聚位置維持在基板表面，以光束始終在基板之表面位置會聚之方式具備有自動對焦機構。自動對焦機構自入射至基板表面之光之反射光的受光位置檢測出基板表面位置，並依據該檢測結果使聚焦鏡上下移動。 In this prior art, in order to maintain the converging position of the light beam on the surface of the substrate without changing factors such as the height of the substrate surface, an autofocus mechanism is provided in such a way that the light beam always converges on the surface of the substrate. The auto-focusing mechanism detects the position of the substrate surface from the receiving position of the reflected light of the light incident on the surface of the substrate, and moves the focusing lens up and down according to the detection result.
於作為處理對象之基板中，亦可包含在表面具有高低差者。例如，存在有藉由作為描繪對象之半導體晶片被黏貼於平坦之基材的表面所排列之基板。在如此之基板中，於晶片表面與基材表面之間存在有較大之高低差，其中，不需要使光束會聚於並非描繪對象之基材的表面。 The substrate to be processed may also include those having height differences on the surface. For example, there are substrates arranged by attaching a semiconductor chip as a drawing object to the surface of a flat base material. In such a substrate, there is a large difference in height between the surface of the wafer and the surface of the substrate, and there is no need to converge the light beam on the surface of the substrate that is not the object of drawing.
然而，於習知之自動對焦控制技術中，只要位置之檢測值不超過為了防止異常動作所設定之臨限值，便會嘗試對基板表面的追蹤。因此，有可能會產生由於連並非描繪對象的部分都追蹤而對可動部施加過多的負荷或者對描繪對象之部位的追蹤會產生延遲的問題。 However, in the conventional autofocus control technology, as long as the detection value of the position does not exceed the threshold set to prevent abnormal motion, it will try to track the substrate surface. Therefore, there may be a problem that an excessive load is applied to the movable portion due to tracking even the part that is not the drawing target, or the tracking of the part of the drawing target may be delayed.
本發明係鑑於上述課題所完成者，其目的在於提供在對基板照射會聚光束來進行描繪之技術中，可相對於在表面具有高低差之基板的表面使光束適當地追蹤之技術。 The present invention has been accomplished in view of the above-mentioned problems, and its object is to provide a technology that can appropriately track the light beam with respect to the surface of the substrate having a height difference in the surface of the substrate in the technology of irradiating a convergent light beam to the substrate for drawing.
本發明一態樣係使將在表面具有高低差之基板以水平姿勢加以載置之平台及對上述基板之表面照射會聚光束而進行描繪之描繪頭相對地移動，從而使上述光束之入射位置在上述基板之表面掃描而對上述基板進行描繪之描繪方法；為了達成上述目的，其具備有：光學性地檢測上述光束所入射之上述基板的表面位置之步驟；及根據上述表面位置之檢測結果而在光軸方向上調整上述光束之會聚位置，並使其追蹤上述基板之表面之步驟；上述會聚位置之調整被限制在根據上述基板之表面中相對地自周圍突出之突出區域及相較於上述突出區域相對地後退之後退區域之各者中上述基板之表面位置之檢測結果 所設定的追蹤範圍內。 In one aspect of the present invention, a platform on which a substrate with a height difference on the surface is placed in a horizontal position and a drawing head that irradiates a condensed light beam on the surface of the substrate to perform drawing are relatively moved, so that the incident position of the light beam is at A drawing method for scanning the surface of the substrate and drawing the substrate; in order to achieve the above purpose, it includes: a step of optically detecting the surface position of the substrate on which the light beam is incident; and based on the detection result of the surface position The step of adjusting the converging position of the light beam in the direction of the optical axis and making it track the surface of the substrate; the adjustment of the converging position is limited to the protruding area that protrudes from the surroundings on the surface of the substrate and compared to the above The detection result of the surface position of the above-mentioned substrate in each of the protruding areas relatively retreating and retreating areas Within the set tracking range.
又，本發明之描繪裝置之一態樣為了達成上述目的，其具備有：平台，其可將在表面具有高低差之基板以水平姿勢加以載置；描繪頭，其對上述基板之表面照射會聚光束而進行描繪；掃描移動部，其使上述平台與上述描繪頭相對地移動而在上述基板表面掃描上述光束之入射位置；檢測部，其光學性地檢測上述光束要入射之上述基板的表面位置；及對焦調整部，其根據上述檢測部之檢測結果，將上述光束之會聚位置在既定之追蹤範圍內於光軸方向上加以調整而使其追蹤上述基板之表面；上述追蹤範圍根據突出區域及後退區域之各者之上述基板之表面位置的檢測結果而預先被設定，該突出區域係在上述基板之表面中自周圍相對地突出者，而該後退區域係相較於上述突出區域相對地後退者。 In addition, one aspect of the drawing device of the present invention, in order to achieve the above object, is provided with: a platform which can place a substrate with a height difference on the surface in a horizontal position; and a drawing head which irradiates and converges on the surface of the substrate Light beam for drawing; a scanning moving part which moves the platform and the drawing head relatively to scan the incident position of the light beam on the surface of the substrate; a detection part which optically detects the surface position of the substrate on which the light beam is to be incident And a focus adjustment unit, which adjusts the converging position of the light beam in the optical axis direction within a predetermined tracking range according to the detection result of the detection unit to make it track the surface of the substrate; the tracking range is based on the protruding area and The detection result of the surface position of the substrate for each of the retreat areas is set in advance, the protruding area protrudes relatively from the surrounding on the surface of the substrate, and the retreat area is relatively retreated compared to the protruding area By.
在如此所構成之發明中，追蹤範圍在光束會聚位置相對於基板表面之光軸方向上被限制。該追蹤範圍根據基板表面中對周圍相對地突出之突出區域與其周邊之後退區域之各者之表面位置之檢測結果而被設定。因此，可進行例如一方面對於突出區域設為光束在其整體追蹤基板表面，另一方面對於後退區域則不進行追蹤等的控制。亦即，可限制在不需要之區域對基板表面的追蹤。追蹤範圍並非只是設定同樣之追蹤範圍，而是根據實際之檢測結果所設定，藉此可進行依據基板之表面狀態之正確的控制。 In the invention thus constituted, the tracking range is limited in the direction of the optical axis of the beam converging position relative to the surface of the substrate. The tracking range is set based on the detection result of the surface position of each of the protruding area and the surrounding receding area on the surface of the substrate. Therefore, it is possible to perform control such as, on the one hand, that the light beam tracks the substrate surface as a whole for the protruding area, and does not perform tracking for the receding area. That is, the tracking of the substrate surface can be restricted to areas that are not needed. The tracking range is not just set the same tracking range, but is set according to the actual inspection results, so that the correct control according to the surface condition of the substrate can be performed.
如上述般，根據本發明，於對基板照射會聚光束而進行描繪時，在根據突出區域與後退區域之檢測結果所設定之追蹤範圍內，被控制為光束之會聚位置追蹤基板表面。因此，即便對在表面具 有高低差之基板的表面，仍可適當地使光束追蹤。 As described above, according to the present invention, when the substrate is irradiated with a convergent beam for drawing, the convergent position of the beam is controlled to track the surface of the substrate within the tracking range set based on the detection results of the protruding area and the receding area. Therefore, even if The surface of the substrate with height difference can still track the beam properly.
4:光學頭(描繪頭) 4: Optical head (drawing head)
5:光照射部 5: Light irradiation part
10:平台 10: Platform
20:平台移動機構(掃描移動部) 20: Platform moving mechanism (scanning moving part)
22:支撐板 22: Support plate
23:副掃描機構 23: Deputy scanning mechanism
24:基座板 24: Base plate
25:主掃描機構 25: Main scanning mechanism
41:空間光調變器 41: Spatial light modulator
42:反射鏡 42: mirror
43:投影光學系統 43: Projection optical system
45:自動對焦機構(檢測部) 45: Autofocus mechanism (detection section)
51:雷射驅動部 51: Laser Drive
52:雷射振盪器 52: Laser oscillator
53:照明光學系統 53: Illumination optical system
60:對位單元 60: Alignment unit
61:照明單元 61: lighting unit
70:搬送裝置 70: Conveying device
80:觀察光學系統 80: Observation optical system
90:控制部 90: Control Department
91:照明控制部 91: Lighting Control Department
92:描繪控制部 92: Drawing control unit
93:對位控制部 93: Alignment Control Department
94:平台控制部 94: Platform Control Department
95:對焦控制部(控制部) 95: Focus control section (control section)
96:射束入射位置控制部 96: Beam incident position control unit
99:儲存部 99: Storage Department
100:描繪裝置 100: drawing device
101:本體框架 101: body frame
102:處理區域 102: Processing area
103:交接區域 103: Handover area
104:匣盒載置部 104: Cartridge placement part
400:支柱 400: Pillar
410:繞射光學元件 410: Diffraction optics
414:可動平台 414: movable platform
441:對焦鏡 441: Focus lens
442:對焦驅動機構(對焦調整部) 442: Focus drive mechanism (focus adjustment section)
451:照射部 451: Irradiation Department
452:受光部 452: Light Receiving Department
601:對位攝影機 601: Counterpoint camera
611:光纖 611: Fiber
921:驅動器 921: drive
B:基材 B: Substrate
Bs:基材上表面(後退區域) Bs: The upper surface of the substrate (recessed area)
C:匣盒 C: Box
Cb:基板上表面之近似曲線 Cb: Approximate curve of the upper surface of the substrate
Cr:裝置區域上表面之近似曲線 Cr: Approximate curve of the upper surface of the device area
FP:焦點 FP: Focus
OA:光軸 OA: Optical axis
Ps:描繪開始位置 Ps: drawing start position
Px:間距 Px: pitch
R:裝置區域 R: Device area
Rs:裝置區域上表面(突出區域) Rs: The upper surface of the device area (protruding area)
Rt、Rt1~Rt5:追蹤範圍 Rt, Rt1~Rt5: tracking range
U:光學單元 U: Optical unit
W:基板 W: substrate
Ws:基板上表面(基板表面) Ws: the upper surface of the substrate (substrate surface)
X:副掃描方向 X: sub scanning direction
Y:主掃描方向 Y: Main scanning direction
Z:鉛直方向 Z: Vertical direction
Z3~Z5:(基板上表面之)位置 Z3~Z5: (on the upper surface of the substrate) position
Zf:(對焦鏡之)Z方向位置 Zf: (Focusing lens) Z direction position
Zth:臨限值 Zth: Threshold
△Z:距離(高低差) △Z: distance (height difference)
圖1 係示意性地表示本發明之描繪裝置之概略構成的前視圖。 Fig. 1 is a front view schematically showing the schematic configuration of the drawing device of the present invention.
圖2 係示意地表示光學頭所具備之詳細構成之一例的圖。 Fig. 2 is a diagram schematically showing an example of the detailed structure of the optical head.
圖3 係表示該描繪裝置之控制系統的方塊圖。 Figure 3 is a block diagram showing the control system of the drawing device.
圖4 係表示由該描繪裝置所進行之描繪動作的流程圖。 Fig. 4 is a flowchart showing the drawing action performed by the drawing device.
圖5 係表示描繪處理的流程圖。 Fig. 5 is a flowchart showing the drawing process.
圖6A 係表示成為描繪處理之對象之基板之一例的圖。 FIG. 6A is a diagram showing an example of a substrate to be a target of drawing processing.
圖6B 係表示成為描繪處理之對象之基板之一例的圖。 Fig. 6B is a diagram showing an example of a substrate to be subjected to a drawing process.
圖6C 係表示成為描繪處理之對象之基板之一例的圖。 Fig. 6C is a diagram showing an example of a substrate to be subjected to a drawing process.
圖7A 係表示基板之段差與自動對焦控制之關係的圖。 FIG. 7A is a diagram showing the relationship between the level difference of the substrate and the auto focus control.
圖7B 係表示基板之段差與自動對焦控制之關係的圖。 Fig. 7B is a diagram showing the relationship between the level difference of the substrate and the autofocus control.
圖8A 係表示本實施形態之對焦控制之概念的圖。 Fig. 8A is a diagram showing the concept of focus control in this embodiment.
圖8B 係表示本實施形態之對焦控制之概念的圖。 Fig. 8B is a diagram showing the concept of focus control in this embodiment.
圖9(a)至(d) 係表示追蹤範圍之設定方法之原理的圖。 Figure 9 (a) to (d) are diagrams showing the principle of the tracking range setting method.
圖10(a)至(d) 係表示於基板存在小翹曲之情形時之追蹤範圍之設定方法的圖。 10(a) to (d) are diagrams showing the setting method of the tracking range when the substrate has small warpage.
圖11 係表示用以設定追蹤範圍之處理的流程圖。 Fig. 11 is a flowchart showing the processing for setting the tracking range.
圖12 係表示對焦控制處理之流程圖。 Fig. 12 is a flowchart showing the focus control processing.
圖13A 係表示追蹤範圍之更新處理之概要的圖。 FIG. 13A is a diagram showing the outline of the update processing of the tracking range.
圖13B 係表示追蹤範圍之更新處理之概要的圖。 FIG. 13B is a diagram showing the outline of the update processing of the tracking range.
圖1係示意性地表示本發明之描繪裝置之概略構成的前 視圖。於以下之各圖中為了統一地表示方向，如圖1所示般設定XYZ正交座標。此處，XY平面表示水平面，而Z方向表示鉛直方向。更具體而言，(-Z)方向表示鉛直向下方向。 Figure 1 is a schematic representation of the front of the drawing device of the present invention view. In the following figures, in order to show the directions uniformly, the XYZ orthogonal coordinates are set as shown in Fig. 1. Here, the XY plane represents the horizontal plane, and the Z direction represents the vertical direction. More specifically, the (-Z) direction means the vertical downward direction.
描繪裝置100係對形成有光阻等之感光材料之層之基板W的上表面照射光而描繪圖案之裝置。再者，作為基板W，可應用半導體基板、印刷基板、彩色濾光片用基板、液晶顯示裝置或電漿顯示裝置所具備之平板顯示器用玻璃基板、光碟用基板等之各種基板。
The
描繪裝置100為在本體內部與本體外部配置有各種構成元件之構成，該本體內部係藉由罩板(省略圖示)被安裝在由本體框架101所構成之骨架的頂壁面及周圍面所形成者，而該本體外部係作為本體框架101之外側者。
The
描繪裝置100之本體內部被區分為處理區域102與交接區域103。於該等區域中，在處理區域102主要配置有平台10、平台移動機構20、光學單元U、及對位單元60。另一方面，在交接區域103配置有對處理區域102進行基板W之搬入搬出之搬送機器人等的搬送裝置70。
The inside of the main body of the
又，於描繪裝置100之本體外部配置有對對位單元60供給照明光之照明單元61。又，於該本體配置有與描繪裝置100所具備之裝置各部分被電性連接而對該等各部分之動作進行控制的控制部90。
In addition, an
再者，於描繪裝置100之本體外部且鄰接於交接區域103之位置，配置有用以載置匣盒C之匣盒載置部104。對應於匣盒載置部104而被配置於本體內部之交接區域103的搬送裝置70，將被收容於在匣盒載置部104所載置之匣盒C之未處理的基板W加以取出並搬
入(裝載至)處理區域102，並且將處理完畢之基板W自處理區域102加以搬出(卸載)並收容至匣盒C。匣盒C相對於匣盒載置部104之交接由未圖示之外部搬送裝置所進行。該未處理基板W之裝載處理及處理完畢基板W之卸載處理藉由搬送裝置70依據來自控制部90之指示進行運作所進行。
Furthermore, outside the main body of the
平台10係具有平板狀之外形且將基板W以水平姿勢載置並保持於其上表面之保持部。於平台10之上表面形成有複數個抽吸孔(省略圖示)。藉由對該抽吸孔施予負壓(抽吸壓)，可將被載置於平台10上之基板W固定保持於平台10之上表面。平台10藉由平台移動機構20而被移動。
The
平台移動機構20係使平台10沿著主掃描方向(Y軸方向)、副掃描方向(X軸方向)、及旋轉方向(繞Z軸之旋轉方向)移動之機構。平台移動機構20具備有：基座板24，其支撐可旋轉地支撐平台10之支撐板22；副掃描機構23，其使支撐板22沿著副掃描方向移動；及主掃描機構25，其使基座板24沿著主掃描方向移動。副掃描機構23及主掃描機構25依據來自控制部90之指示使平台10移動。
The
對位單元60係對被形成在基板W之上表面之未圖示的對位標記進行攝影。對位單元60具備有對位攝影機601，而該對位攝影機601具有鏡筒、對物鏡、及CCD(Charge Coupled Device；電荷耦合器件)影像感測器。對位攝影機601所具備之CCD影像感測器，例如由區域影像感測器(二維影像感測器)所構成。又，對位單元60藉由未圖示之升降機構而可在既定之範圍內升降地被支撐。
The
照明單元61經由光纖611與鏡筒連接，而對對位單元60供給照明用之光。藉由自照明單元61延伸之光纖611所導引之光，
經由對位攝影機601之鏡筒而被導引至基板W之上表面，且其反射光經由對物鏡而由CCD影像感測器所接收。藉此，基板W之上表面被攝影而取得攝影資料。對位攝影機601與控制部90之圖像處理部被電性地連接，依據來自控制部90之指示而取得攝影資料，並將所取得之攝影資料發送至控制部90。
The
根據自對位攝影機601所施予之攝影資料，控制部90進行對位處理，該對位處理係檢測被設在基板W之基準位置的基準標記而將光學單元U與基板W之相對位置加以定位。然後，自光學單元U將依據描繪圖案所調變之雷射光照射至基板W之既定位置，藉此進行圖案描繪。
Based on the photographic data given by the self-aligning
光學單元U具有將2台光學頭4沿著X軸方向加以排列之概略構成，該光學頭4係根據對應於描繪圖案之帶狀資料而對雷射光進行調變者。再者，光學頭4之台數並不限定於此。又，該等光學頭4由於相互地具有相同之構成，因此以下對與1台光學頭4相關之構成進行說明。
The optical unit U has a schematic configuration in which two
於光學單元U設置有對光學頭4照射雷射光之光照射部5。光照射部5具有雷射驅動部51、雷射振盪器52及照明光學系統53。而且，藉由雷射驅動部51之運作而自雷射振盪器52被射出之雷射光，經由照明光學系統53而朝向光學頭4被照射。光學頭4藉由空間光調變器對自光照射部5所照射之雷射光進行調變，並將其落射於在光學頭4之正下方移動之基板W。藉此，對未處理之基板W進行藉由曝光所進行之描繪。
The optical unit U is provided with a
圖2係示意性地表示光學頭所具備之詳細構成之一例的圖。如圖2所示，在光學頭4中，設置有具有繞射光學元件410之空
間光調變器41。具體而言，在光學頭4沿著上下方向(Z方向)被延伸設置之支柱400之上部所安裝的空間光調變器41，在將繞射光學元件410之反射面朝向下方之狀態下，經由可動平台414而被支撐於支柱400。
FIG. 2 is a diagram schematically showing an example of the detailed structure of the optical head. As shown in Figure 2, the
於光學頭4中，繞射光學元件410其反射面之法線相對於光軸OA傾斜地被配置，且自照明光學系統53所射出之光通過支柱400之開口而入射於反射鏡42，並在藉由反射鏡42所反射後被照射至繞射光學元件410。然後，繞射光學元件410之各通道的狀態，會依據描繪資料由控制部90所切換，使入射至繞射光學元件410之雷射光被調變。
In the
然後，作為0次繞射光而自繞射光學元件410所反射之雷射光束會朝向投影光學系統43之透鏡入射，另一方面，作為1次以上之繞射光而自繞射光學元件410所反射之雷射光，則不會朝向投影光學系統43之透鏡入射。亦即，被構成為基本上僅由繞射光學元件410所反射之0次繞射光會朝向投影光學系統43入射。
Then, the laser beam reflected from the diffractive
通過投影光學系統43之透鏡的光，會作為藉由對焦鏡441所會聚之會聚光束而以既定倍率朝向基板W上被導引。該對焦鏡441被安裝於對焦驅動機構442。然後，依據來自控制部90之控制指令，藉由對焦驅動機構442使對焦鏡441沿著鉛直方向(Z軸方向)升降，自對焦鏡441所射出之光束的會聚位置會被調整至基板W之上表面Ws。
The light passing through the lens of the projection
於光學頭4之框體下部，設置有作為自動對焦機構45而發揮功能之照射部451與受光部452。照射部451使從由雷射二極體(LD；Laser Diode)所構成之光源所射出的光傾斜地入射於基板W之上表面Ws。受光部452由CMOS(Complementary Metal Oxide
Semiconductor；互補金氧半導體)感測器或CCD(Charge Coupled Device；電荷耦合器件)感測器等之固體攝影元件所構成，而對來自基板W之上表面Ws的反射光進行檢測。然後，控制部90從受光部452之檢測結果，檢測出基板上表面Ws於Z方向上之位置、即光學頭4與基板上表面Ws之距離。
In the lower part of the housing of the
亦即，於圖中如實線箭頭所示般在基板上表面Ws遠離光學頭4時、或如虛線箭頭所示般在基板上表面Ws接近光學頭4時，來自基板上表面Ws之反射光的光路會分別朝實線箭頭及虛線箭頭所示之方向產生變化，而受光部452之各受光位置上的受光量亦產生變動。因此，受光部452中受光量的峰值位置，會分別如實線箭頭及虛線箭頭所示般產生變化。控制部90藉此檢測出光學頭4與基板上表面Ws之距離。然後，控制部90依據檢測距離使對焦驅動機構442運作，而使對焦鏡441上下移動。如此，使對焦鏡441之焦點對焦於基板上表面Ws，而正確地將雷射光之會聚位置朝向基板上表面Ws調整(自動對焦)。
That is, when the upper surface Ws of the substrate is far from the
圖3係表示該描繪裝置之控制系統的方塊圖。在控制部90中，以下之各功能區塊91~96係藉由未圖示之CPU(Central Processing Unit；中央處理單元)執行預先被儲存於儲存部99之控制程式、或藉由專用硬體所實現。照明控制部91控制光學單元U之光照射部5使光束出射。描繪控制部92根據被儲存於儲存部99之描繪配方來控制驅動器921，使控制電壓自驅動器921施加至繞射光學元件410，使其對應於應描繪之圖案而對光束進行調變。
Fig. 3 is a block diagram showing the control system of the drawing device. In the
對焦控制部95負責自動對焦動作。具體而言，對焦控制部95根據來自自動對焦機構45之受光部452的輸出來檢測出基板
上表面Ws之位置，自該結果計算出為了使會聚光束的焦點FP對焦於基板上表面Ws所需要之對焦調整量並將其發送至對焦驅動機構442。平台控制部94控制平台移動機構20，使平台10對光學頭4相對移動。對位控制部93根據自對位單元60之對位攝影機601所輸出之圖像資料來執行對位處理。
The
然後，射束入射位置控制部96依據需要，而執行將入射至繞射光學元件410之線束光的位置加以最佳化之入射位置調整處理。在入射位置調整處理中，根據來自觀察光學系統80之輸出信號使空間光調變器41之可動平台414運作，該觀察光學系統80係被設置於平台10之側邊而對來自光學頭4之光束的入射方向進行測量者。再者，對於入射位置調整處理或自動對焦調整、對位調整等之具體方法，例如可應用專利文獻1所記載者。
Then, the beam incident
其次，對如以上所構成之描繪裝置100的動作進行說明。如上述般，該描繪裝置100可對各種基板進行藉由曝光所進行之描繪。此處，作為其一例，列舉對在大致矩形之基板二維矩陣地配置有複數個半導體裝置區域之半導體基板進行描繪時之描繪動作來進行說明。該描繪動作藉由控制部90執行預先所準備之控制程式並使裝置各部執行既定之動作所實現。
Next, the operation of the
圖4係表示該描繪裝置所進行之描繪動作的流程圖。在描繪動作中，首先進行，取得表示應描繪之內容的描繪配方(步驟S101)、及作為描繪對象物之未處理基板W自匣盒C朝向平台10之搬入(步驟S102)。描繪配方被儲存保存於儲存部99。其次，藉由對位單元60，進行使基板W與光學頭4之相對位置對齊之對位處理(步驟S103)。藉此，使朝向基板W之圖案描繪位置被精密地對齊。
Fig. 4 is a flowchart showing the drawing operation performed by the drawing device. In the drawing operation, first, the drawing recipe indicating the content to be drawn is obtained (step S101), and the unprocessed substrate W as the drawing object is carried in from the cassette C to the platform 10 (step S102). The drawing recipe is stored in the
然後，描繪控制部92根據描繪配方而準備描繪資料(步驟S104)，將其施予光學頭4之空間光調變器41一邊對光束進行調變一邊照射基板W，藉此進行圖案之描繪處理(步驟S105)。若描繪處理結束，處理完畢之基板W便自平台10被搬出且被收容至匣盒C(步驟S106)。依據需要重複地進行上述處理，藉此可依序對複數片基板W進行描繪。
Then, the
圖5係表示描繪處理之流程圖。最初執行「追蹤範圍設定處理」(步驟S201)，但對此將於後詳細地進行說明。接著，基板W與光學頭4相對地被定位於既定之描繪開始位置(步驟S202)，並開始自動對焦機構45所進行之對焦控制、及平台移動機構20所進行之基板W朝向Y方向之掃描移動(步驟S203)。
Fig. 5 is a flowchart showing the drawing process. The "tracking range setting process" is initially executed (step S201), but this will be described in detail later. Next, the substrate W is positioned at a predetermined drawing start position relative to the optical head 4 (step S202), and the focus control by the
圖6A至圖6C係表示成為描繪處理之對象之基板之一例的圖。圖6A係作為處理對象物之基板W的俯視圖。又，圖6B係圖6A之A-A線剖視圖，但對此將於後進行說明。又，圖6C係表示光束對基板W之掃描移動之路徑之一例的圖。再者，此處雖將基板之外形設為矩形，但並不限定於此，例如亦可對圓形基板執行該描繪處理。 6A to 6C are diagrams showing an example of a substrate to be a target of drawing processing. Fig. 6A is a plan view of a substrate W as a processing target. In addition, FIG. 6B is a cross-sectional view taken along line A-A of FIG. 6A, but this will be described later. 6C is a diagram showing an example of the path of the scanning movement of the light beam on the substrate W. In addition, although the outer shape of the substrate is rectangular, it is not limited to this. For example, the drawing process may be performed on a circular substrate.
基板W係例如於玻璃板、陶瓷板、半導體晶圓等之大致矩形之基材B的表面二維矩陣地配置有作為描繪對象物之複數個半導體晶片等所構成之裝置區域R者。作為於各裝置區域R製造半導體裝置之製造製程的一部分，該描繪裝置100在各裝置區域R以既定之描繪圖案進行描繪。被描繪於各裝置區域R之圖案相同，因此描繪裝置100將依據預先所施予之描繪資料的描繪圖案依序地描繪在各裝置區域R。此時，使被載置於平台10之基板W與光學頭4相對地水平移動、即使其掃描移動，藉此依序變更光學頭4所要進行基板上表面
Ws之描繪位置。
The substrate W is, for example, a device region R composed of a plurality of semiconductor wafers as drawing objects arranged in a two-dimensional matrix on the surface of a substantially rectangular base material B such as a glass plate, a ceramic plate, and a semiconductor wafer. As part of the manufacturing process for manufacturing semiconductor devices in each device region R, the
圖6C係表示掃描移動之路徑之一例的圖。再者，於此雖將基板W與光學頭4之相對移動作為來自光學頭4之光會入射至基板W之描繪位置相對於基板W進行移動者來進行說明，但如前所述般，實際上藉由載置有基板W之平台10沿著XY方向進行移動來實現掃描移動。於圖中如虛線箭頭所示般，在該描繪動作中，將圖中相當於基板W之左下的位置設為描繪開始位置Ps，首先描繪位置會朝(+Y)方向移動。若描繪位置進行到基板W之左上端部，描繪位置便朝(+X)方向僅移動既定間距Px。然後，其次使移動方向朝向(-Y)方向反轉。若描繪位置來到基板W圖中之下端、即(-Y)側端部，便再次使描繪位置朝(+X)方向僅移動既定間距Px，並再次進行朝向(+X)方向之移動。
Fig. 6C is a diagram showing an example of a path of scanning movement. In addition, although the relative movement of the substrate W and the
如此，基板W與光學頭4之相對移動，為使朝向(+Y)方向或(-Y)方向之掃描移動與朝向(+X)方向之間距進給移動交互地組合而成者。最後，若描繪位置到達相當於基板W之右下的位置，掃描移動便結束。以下，將描繪位置朝向Y方向之移動稱為「主掃描移動」，並將Y方向稱為「主掃描方向」。又，將描繪位置朝向X方向之間距進給稱為「副掃描移動」，並將X方向稱為「副掃描方向」。
In this way, the relative movement of the substrate W and the
返回圖5繼續進行描繪處理之說明。藉由依據描繪資料而自光學頭4所出射之調變光束而開始描繪(步驟S204)。亦即，一邊進行對焦控制及朝向(+Y)方向之主掃描移動，一邊自光學頭4對基板W進行光照射，藉此被描繪於基板上表面Ws。於第1次之主掃描移動中若描繪位置到達Y方向之主掃描結束位置(步驟S205)，描繪位置便沿著X方向被移動1步，更詳細而言係朝(+X)方向進給而僅被移動間
距Px(步驟S207)，且主掃描移動方向會被反轉為(-Y)方向(步驟S208)。藉此，開始第2次之主掃描移動。藉由重複進行上述內容直至到達相當於基板W之(+X)方向側端部之副掃描結束位置(步驟S206)，對於基板W所有之裝置區域R的描繪便結束。
Return to FIG. 5 to continue the description of the drawing process. The drawing is started by the modulated light beam emitted from the
若描繪結束，來自光學頭4之光束的出射便會結束(步驟S211)，而且對焦控制及掃描移動會結束(步驟S212)。然後，使裝置各部轉移至既定之結束狀態的結束動作被執行(步驟S213)，對於1片基板W之描繪處理便結束。
If the drawing is finished, the emission of the light beam from the
如圖6A所示，複數個裝置區域R於基材B之表面Bs沿著X方向及Y方向隔開一定之間隔被排列成二維矩陣狀。因此，如圖6B所示，於基材B之表面(上表面)Bs與裝置區域R之上表面Rs之間，存在有相當於形成裝置區域R之半導體晶片之厚度的高低差。又，於相鄰之裝置區域R之間存在有間隙，且基材表面Bs自該間隙露出。因此，於將基材B與裝置區域R視為一體之基板W時，在基板上表面Ws存在有週期性之段差。 As shown in FIG. 6A, a plurality of device regions R are arranged in a two-dimensional matrix at a certain interval along the X direction and the Y direction on the surface Bs of the substrate B. Therefore, as shown in FIG. 6B, between the surface (upper surface) Bs of the substrate B and the upper surface Rs of the device region R, there is a height difference corresponding to the thickness of the semiconductor wafer forming the device region R. In addition, there is a gap between adjacent device regions R, and the substrate surface Bs is exposed from the gap. Therefore, when the substrate B and the device region R are regarded as the integrated substrate W, there are periodic steps on the upper surface Ws of the substrate.
圖7A及圖7B係表示基板之段差與自動對焦控制之關係的圖。在該裝置之對焦控制中以光束始終會聚於基板上表面Ws之方式，依據基板上表面Ws之高度而使對焦鏡441上下移動。因此，若不限制追蹤範圍，便會如圖7A所示般，在具有段差之基板W中對焦鏡441以依然該段差進行平行移動之方式上下移動。
7A and 7B are diagrams showing the relationship between the level difference of the substrate and autofocus control. In the focusing control of the device, the light beam is always focused on the upper surface Ws of the substrate, and the focusing
然而，描繪之對象係基板上表面Ws中自周圍突出之裝置區域R的上表面Rs，並不需要對較其後退之基材上表面Bs進行對焦。若對較其後退之基材上表面Bs進行對焦，反而可能產生如下之許多不良影響：因對焦鏡441過度地大幅移動所導致之機械性故障、或
因追蹤對象自基材上表面Bs移行至裝置區域上表面Rs時之反應延遲所導致之在裝置區域上表面Rs上之暫時性的失焦狀態等。
However, the object of drawing is the upper surface Rs of the device region R protruding from the periphery of the upper surface Ws of the substrate, and it is not necessary to focus on the upper surface Bs of the substrate that is receded from it. If focus is performed on the upper surface Bs of the substrate that is receding from it, many adverse effects may occur: mechanical failure caused by excessive and large movement of the focusing
因此，對焦控制較佳為：光束之會聚位置如圖7B中分別以實線及虛線所示般，一方面相對於裝置區域上表面Rs始終正確地進行追蹤，另一方面相對基材上表面Bs不使其進行追蹤而停留在既定之位置。對於可進行上述對焦控制之細節，將於後進行說明。 Therefore, the focus control is better as follows: the convergent position of the beam is shown by the solid line and the dashed line in FIG. Do not make it track and stay in the established position. The details of the above-mentioned focus control will be described later.
圖8A及圖8B係表示本實施形態之對焦控制之概念的圖。如圖8A所示，於以在裝置區域R進行描繪為目的之對焦控制中，相對於有可能存在於作為描繪對象之裝置區域上表面Rs之較小凹凸，需要確實地進行追蹤。另一方面，相對於並非描繪對象之基材上表面Bs，不需要使焦點進行追蹤。 8A and 8B are diagrams showing the concept of focus control in this embodiment. As shown in FIG. 8A, in the focus control for the purpose of drawing in the device region R, it is necessary to reliably track the smaller irregularities that may exist on the upper surface Rs of the device region as the drawing target. On the other hand, with respect to the upper surface Bs of the substrate which is not the object of drawing, it is not necessary to track the focus.
因此，在本實施形態中，如圖8B所示般預先設定在Z方向上包含裝置區域R之上表面Rs，且於上方側及下方側具有一定擴展之追蹤範圍Rt。使光束之會聚位置確實地追蹤在該追蹤範圍Rt內所檢測出之基板上表面Ws。另一方面，於在追蹤範圍Rt內基板上表面Ws之存在未被檢測出之情形時，不使射束會聚位置移動至較追蹤範圍Rt更外側，而使其停留在追蹤範圍Rt內之適當位置(於本例中為追蹤範圍Rt之下限)。 Therefore, in this embodiment, as shown in FIG. 8B, it is preset to include the upper surface Rs of the device region R in the Z direction, and to have a certain expanded tracking range Rt on the upper and lower sides. The convergent position of the light beam can reliably track the upper surface Ws of the substrate detected within the tracking range Rt. On the other hand, when the presence of the upper surface Ws of the substrate in the tracking range Rt is not detected, the beam convergence position is not moved to the outside of the tracking range Rt, but stays within the tracking range Rt. Position (in this example, the lower limit of the tracking range Rt).
如此一來，伴隨著對焦控制之對焦鏡441的上下移動便會被限定於追蹤範圍Rt之擴展寬度，追蹤至不需要進行描繪之基材上表面Bs之大幅度的動作便會受到抑制。又，於裝置區域上表面Rs在追蹤範圍Rt內再次被檢測出而再次開始追蹤時，對焦鏡441由於亦位於較近之位置，因此可迅速地再次開始進行追蹤。
In this way, the up and down movement of the
為了做到如此，必須適當地訂定追蹤範圍Rt。追蹤範圍
Rt必須為確實地包含裝置區域R之上表面Rs，且不包含裝置區域R以外之基材上表面Bs者。若考量到描繪裝置100之各部及基板W之個體的差異，便不可能將追蹤範圍Rt預先訂定為固定者。追蹤範圍Rt必須依照每個描繪裝置100與基板W之組合而動態地加以設定。
In order to do so, the tracking range Rt must be appropriately determined. Tracking range
Rt must definitely include the upper surface Rs of the device region R and not include the upper surface Bs of the substrate other than the device region R. If the individual differences between the parts of the
圖9係表示追蹤範圍之設定方法之原理的圖。其考量一邊使光學頭4相對於基板W朝向Y方向掃描移動，一邊藉由自動對焦機構45持續地檢測出基板上表面Ws之高度的情形。此時，只要能檢測出基板上表面Ws之高度即可，並不需要使對焦鏡441上下移動。以一定之取樣週期來取樣而取得自動對焦機構45之輸出。如此一來，例如如圖9(a)所示般，對應於裝置區域上表面Rs而呈現較高位置之取樣資料、及對應於基材上表面Bs而呈現較低位置之取樣資料，便會由既定之重複週期所檢測出。
Fig. 9 is a diagram showing the principle of the setting method of the tracking range. It is considered that the
如此，於取樣資料在較高數值之群組與較低數值之群組存在具有意義之差異之情形時，如圖9(b)所示般，可於該等群組之間設定臨限值Zth，而將較臨限值大之取樣資料(白圓點)作為對應於裝置區域上表面Rs者，並將較小之取樣資料(黑圓點)作為對應於基材上表面Bs者，而分別進行處理。然後，如圖9(c)所示般，若以較臨限值大之取樣資料的群組與較臨限值小之取樣資料的群組分別對資料之分布進行曲線擬合，便可得到表示各者之表面輪廓的曲線Cr、Cb。此處，兩曲線Cr、Cb之Z方向上的距離△Z，會成為表示裝置區域上表面Rs與基材上表面Bs之高低差。利用該高低差可訂定追蹤範圍Rt。例如，可將高低差△Z之50%至150%左右設為追蹤範圍Rt之寬度。 In this way, when the sampled data has a significant difference between the group with a higher value and a group with a lower value, as shown in Figure 9(b), threshold values can be set between these groups Zth, and the sampling data (white dots) larger than the threshold value is regarded as the one corresponding to the upper surface Rs of the device area, and the smaller sampling data (black circles) is regarded as the one corresponding to the upper surface Bs of the substrate, and Treat them separately. Then, as shown in Figure 9(c), if the group of sampling data with a larger threshold value and the group of sampling data with a smaller threshold are used to curve-fit the distribution of the data, you can get Curves Cr and Cb showing the surface profile of each. Here, the distance ΔZ in the Z direction between the two curves Cr and Cb will represent the height difference between the upper surface Rs of the device area and the upper surface Bs of the substrate. Using this height difference, the tracking range Rt can be determined. For example, about 50% to 150% of the height difference ΔZ can be set as the width of the tracking range Rt.
為了成為於裝置區域上表面Rs上確實地進行追蹤者，追蹤範圍Rt較佳為完全地包含對應於裝置區域上表面Rs之近似曲線 Cr者。因此，追蹤範圍Rt於Y方向上並非固定，而成為於存在裝置區域上表面Rs之高度變動之情形時會與其連動而具有位置依存性者。例如，可將使近似曲線Cr朝上方向及下方向分別偏移既定值之曲線，分別設為表示追蹤範圍Rt之上限及下限的曲線。 In order to be a person who can reliably track on the upper surface Rs of the device area, the tracking range Rt preferably completely includes an approximate curve corresponding to the upper surface Rs of the device area Cr person. Therefore, the tracking range Rt is not fixed in the Y direction, but will be linked to it when there is a change in the height of the upper surface Rs of the device area, and is position-dependent. For example, a curve that shifts the approximate curve Cr in the upward direction and the downward direction by a predetermined value can be set as a curve representing the upper limit and the lower limit of the tracking range Rt, respectively.
近似曲線Cr在上方向與下方向之偏移量並不一定需要相同。例如於上述之高低差△Z較小之情形時，為了避免將基材上表面Bs誤判定為裝置區域上表面Rs，因此不可將朝向下方向之偏移量設為過大。於如此之情形時，只要一邊維持追蹤範圍Rt之寬度，一邊將朝向上方向之偏移量設為較朝向下方向之偏移量大即可。 The offset of the approximate curve Cr in the upper direction and the lower direction does not necessarily need to be the same. For example, when the above-mentioned height difference ΔZ is small, in order to avoid mistakenly determining the upper surface Bs of the substrate as the upper surface Rs of the device area, the offset in the downward direction cannot be set too large. In such a case, it is only necessary to set the offset in the upward direction to be larger than the offset in the downward direction while maintaining the width of the tracking range Rt.
圖10係表示在基板存在有小翹曲之情形時之追蹤範圍之設定方法的圖。例如於基板W存在有Y方向之小翹曲之情形時，如圖10(a)所示般，於取樣資料之分布會出現因翹曲所造成的起伏。如圖10(b)至(d)所示，該起伏較小，只要對對應於裝置區域上表面Rs之資料與對應於基材上表面Bs之資料的分離沒有影響，便可以與上述相同之方法來訂定追蹤範圍Rt。如圖10(d)所示，表示追蹤範圍Rt之上限及下限的曲線，亦會具有因基板W之翹曲所造成起伏。 FIG. 10 is a diagram showing a setting method of the tracking range when the substrate has a small warpage. For example, when the substrate W has a small warpage in the Y direction, as shown in FIG. 10(a), the distribution of the sampled data will have fluctuations caused by the warpage. As shown in Figure 10(b) to (d), the fluctuations are small, as long as there is no effect on the separation of the data corresponding to the upper surface Rs of the device area and the data corresponding to the upper surface Bs of the substrate, it can be the same as the above Method to define the tracking range Rt. As shown in FIG. 10(d), the curve representing the upper limit and the lower limit of the tracking range Rt will also have fluctuations caused by the warpage of the substrate W.
圖11係表示用以設定追蹤範圍之處理的流程圖。該處理係用以依照上述原理來設定追蹤範圍Rt之處理，於基板W朝向描繪裝置100之搬入後，且於描繪處理之執行會前先被執行(圖5中之步驟S201)。
FIG. 11 is a flowchart showing the processing for setting the tracking range. This process is a process for setting the tracking range Rt according to the above-mentioned principle, and is executed after the substrate W is moved into the
最初進行基板W之預掃描(步驟S301)。預掃描係不進行用於描繪之光照射而使光學頭4相對於基板W進行掃描移動之動作，且依照上述原理而於此時在基板上表面Ws之位置進行取樣。藉此，可取得如圖9(a)或圖10(a)所示之取樣資料列。再者，用於預掃描
之光學頭4的掃描，只要進行自圖6C所示之描繪開始位置Ps朝向Y方向之一列的掃描即可。
Initially, a pre-scan of the substrate W is performed (step S301). The pre-scanning system does not perform the operation of scanning and moving the
然後，如圖9(b)所示，對所得到之取樣資料列設定適當之臨限值Zth(步驟S302)，並分別針對較臨限值Zth大的資料及小的資料特定出近似曲線Cr、Cb(步驟S303)。 Then, as shown in Figure 9(b), an appropriate threshold Zth is set for the obtained sampling data row (step S302), and approximate curves Cr are specified for data larger and smaller than the threshold Zth. , Cb (step S303).
此處，例如若基板W之翹曲較大，使圖10(b)所示之起伏變得更大，便存在單純之臨限值設定無法將取樣資料列二分為對應於裝置區域上表面Rs之資料與對應於基材上表面Bs之資料之情形。於如此之情形時，所求得之近似曲線Cr、Cb之分離會不足而無法得到具有意義之數值來作為高低差△Z。於如此之情形時，由於無法計算出高低差(步驟S304中為NO)，因此追蹤範圍Rt將藉由使用者設定所決定(步驟S307)。 Here, for example, if the warpage of the substrate W is large, and the fluctuation shown in FIG. 10(b) becomes larger, there is a simple threshold setting that cannot divide the sampling data row into two corresponding to the upper surface of the device area Rs The data and the data corresponding to the upper surface of the substrate Bs. In such a case, the obtained approximate curve Cr and Cb will not be separated enough to obtain a meaningful value as the height difference △Z. In this case, since the height difference cannot be calculated (NO in step S304), the tracking range Rt will be determined by the user setting (step S307).
於近似曲線Cr、Cb較為分離而可求得具有意義之高低差△Z之情形時(步驟S304中為YES)，求出該值△Z(步驟S305)，並進一步設定追蹤範圍Rt(步驟S306)。該等處理係等同於先前所說明之原理者。如此一來，追蹤範圍Rt便被設定。 When the approximate curves Cr and Cb are relatively separated and the meaningful height difference ΔZ can be obtained (YES in step S304), the value ΔZ is obtained (step S305), and the tracking range Rt is further set (step S306 ). These treatments are equivalent to the principles previously explained. In this way, the tracking range Rt is set.
圖12係表示對焦控制處理之流程圖。該處理在描繪裝置100執行描繪處理之期間，每當來到既定之調整時間點便會定期地被執行。若來到調整時間點(步驟S401)，根據來自自動對焦機構45之受光部452的受光結果可取得當下之基板上表面Ws的Z方向位置(步驟S402)。此處，依據需要來進行追蹤範圍Rt之更新(步驟S403)，但對此將於後進行說明。
Fig. 12 is a flowchart showing the focus control process. This process is periodically executed when the
若所取得之基板上表面位置在預先被設定之追蹤範圍Rt的範圍內(步驟S404中為YES)，便可自所取得之基板上表面位置的 檢測結果，求得為了使光束的會聚位置朝向該位置合焦所需要的對焦調整量(步驟S405)。 If the obtained substrate upper surface position is within the preset tracking range Rt (YES in step S404), the obtained substrate upper surface position can be As a result of the detection, the amount of focus adjustment required to bring the converging position of the light beam toward that position to focus on is obtained (step S405).
另一方面，於所取得之基板上表面位置不在追蹤範圍Rt內時(步驟S404中為NO)，判斷為偏離上限側或偏離下限側(步驟S411)。在偏離上限側之情形時(步驟S411中為YES)，追蹤範圍Rt之上限值被設為射束位置控制之目標(步驟S412)，而在偏離下限側之情形時(步驟S411中為NO)，追蹤範圍Rt之下限值被設為射束位置控制之目標(步驟S413)。然後，為了使光束之會聚位置對準所設定之目標位置而求出所需要之對焦調整量(步驟S405)。 On the other hand, when the obtained substrate upper surface position is not within the tracking range Rt (NO in step S404), it is determined that it is off the upper limit side or off the lower limit side (step S411). In the case of deviation from the upper limit side (YES in step S411), the upper limit of the tracking range Rt is set as the target of beam position control (step S412), and in the case of deviation from the lower limit side (NO in step S411) ), the lower limit of the tracking range Rt is set as the target of beam position control (step S413). Then, in order to align the convergent position of the light beam with the set target position, the required focus adjustment amount is obtained (step S405).
若要求得用以將射束位置調整至所期望之位置的調整量(步驟S405)，包含所要求得之對焦調整量的控制指令，便會自控制部90之對焦控制部95被施予至對焦驅動機構442。據此，對焦調整會藉由對焦鏡441之Z方向位置Zf被調整而被進行(步驟S406)。
If the adjustment amount required to adjust the beam position to the desired position is required (step S405), the control command including the required focus adjustment amount will be applied to the
藉由於每個預先所設定之調整時間點執行上述處理，可以一定之控制週期來進行對焦調整。藉此，光束之會聚位置穩定地被對齊於基板上表面Ws。因此，可以優異之解析度對基板上表面Ws進行描繪。於所檢測出之基板上表面位置自追蹤範圍Rt偏離時，對焦鏡441不會被驅動到超出追蹤範圍Rt。亦即，於如此之情形時，射束會聚位置以追蹤範圍Rt之上限或下限為目標而被控制。
By performing the above processing at each preset adjustment time point, the focus adjustment can be performed in a certain control period. Thereby, the converging position of the light beam is stably aligned with the upper surface Ws of the substrate. Therefore, the upper surface Ws of the substrate can be drawn with excellent resolution. When the detected position of the upper surface of the substrate deviates from the tracking range Rt, the focusing
如此，藉由導入根據利用預掃描所取得之基板上表面位置的資訊而求得之追蹤範圍Rt，可進行能對應於基板W沿著Y方向之翹曲的對焦控制。然而，於掃描移動繼續進行而光束之入射位置逐漸地沿著X方向移動時，存在有基板W沿著X方向之翹曲的影響會成為問題之情形。其原因在於，利用上述原理所求得之追蹤範圍Rt並 未反映出關於基板上表面位置在X方向上之變動的資訊。 In this way, by introducing the tracking range Rt obtained based on the information on the position of the upper surface of the substrate obtained by the pre-scan, it is possible to perform focus control that can correspond to the warpage of the substrate W in the Y direction. However, when the scanning movement continues and the incident position of the light beam gradually moves along the X direction, there are cases where the influence of the warpage of the substrate W along the X direction may become a problem. The reason is that the tracking range Rt obtained by the above principle is not It does not reflect the information about the change in the position of the upper surface of the substrate in the X direction.
若欲在預掃描之階段檢測出基板上表面位置在X方向上的變動，預掃描所需要之時間便會變得過長。因此，在本實施形態中，若欲隨著描繪處理之進行來得到關於基板上表面位置之X方向上的變化之資訊，藉由使用該資訊來修正追蹤範圍Rt，即亦可對應於基板W之X方向上的翹曲。為了達成上述內容之處理，係步驟S403所記載之追蹤範圍Rt的更新處理。 If it is desired to detect the change in the position of the upper surface of the substrate in the X direction during the pre-scanning stage, the time required for the pre-scanning will become too long. Therefore, in this embodiment, if it is desired to obtain information about the change in the X-direction of the position of the upper surface of the substrate as the drawing process progresses, by using the information to correct the tracking range Rt, it can also correspond to the substrate W The warpage in the X direction. In order to achieve the above processing, it is the update processing of the tracking range Rt described in step S403.
圖13A及圖13B係表示追蹤範圍之更新處理之概要的圖。隨著描繪處理之進行，表示基板W在X方向上之上表面位置變動的資訊會逐漸增加。如圖13A所示，於在X方向上基板W之上表面位置產生變動之情形時，存在有就當下之基板上表面Ws之位置而言，最初所設定之追蹤範圍Rt已不適當之情形。為了避免該問題發生的方法之一，係使追蹤範圍Rt對應於X方向上之基板W的上表面位置之變動而使其沿著Z方向偏移。圖13B係表示第1次之主掃描移動時所應用之追蹤範圍Rt1會依據後續之主掃描移動之基板W之上表面位置的變動逐漸地偏移為Rt2、Rt3、...而被加以應用之情形。 13A and 13B are diagrams showing the outline of the update processing of the tracking range. As the drawing process progresses, the information indicating the position of the upper surface of the substrate W in the X direction will gradually increase. As shown in FIG. 13A, when the position of the upper surface of the substrate W changes in the X direction, there are cases where the tracking range Rt set initially is not appropriate for the current position of the upper surface of the substrate Ws. In order to avoid this problem, one of the methods is to make the tracking range Rt correspond to the change in the position of the upper surface of the substrate W in the X direction and shift it along the Z direction. FIG. 13B shows that the tracking range Rt1 applied during the first main scanning movement will gradually shift to Rt2, Rt3,... and be applied according to the change in the position of the upper surface of the substrate W in the subsequent main scanning movement. The situation.
例如於Y方向上在相同位置進行比較時，假設第3次之主掃描移動中基板上表面Ws之位置為Z3，而第4次之主掃描移動中基板上表面Ws之位置為Z4。若在第5次之主掃描移動中仍出現相同的傾向，則第5次之主掃描移動中基板上表面Ws之Z方向位置的推定位置Z5可表示為Z5=Z4+(Z4-Z3)。 For example, when comparing at the same position in the Y direction, suppose that the position of the upper surface Ws of the substrate in the third main scanning movement is Z3, and the position of the upper surface Ws of the substrate in the fourth main scanning movement is Z4. If the same tendency occurs in the fifth main scanning movement, the estimated position Z5 of the Z-direction position of the substrate upper surface Ws in the fifth main scanning movement can be expressed as Z5=Z4+(Z4-Z3).
藉此，第5次之主掃描移動之追蹤範圍Rt5，可應用使第4次主掃描移動之追蹤範圍Rt4沿著Z方向偏移(Z4-Z3)者。如此，可自過去之主掃描移動所應用之追蹤範圍及基板上表面位置之變化態 樣，來導出可應用於其後之主掃描移動之經更新後的追蹤範圍。 Thus, the tracking range Rt5 of the fifth main scanning movement can be applied to offset the tracking range Rt4 of the fourth main scanning movement along the Z direction (Z4-Z3). In this way, the tracking range applied from the main scanning movement in the past and the change state of the substrate surface position In this way, to derive the updated tracking range that can be applied to the subsequent main scan movement.
如此，在該實施形態中，添加Y方向之變動的追蹤範圍Rt係根據藉由朝向Y方向之預掃描所求得之裝置區域上表面Rs與基材上表面Bs的位置檢測結果所設定。其依據X方向之變動的實際情形而被修正、更新，且被應用於對焦控制。因此，即便於存在有裝置區域上表面Rs與基材上表面Bs之段差的基板W上，亦可一邊使光束會聚於作為描繪對象之裝置區域上表面Rs，一邊避免朝向非描繪對象之基材上表面Bs的追蹤。 In this way, in this embodiment, the tracking range Rt added with the Y-direction variation is set based on the position detection results of the upper surface Rs of the device area and the upper surface Bs of the substrate obtained by pre-scanning in the Y direction. It is corrected and updated according to the actual situation of changes in the X direction, and is applied to focus control. Therefore, even on a substrate W with a step difference between the upper surface Rs of the device area and the upper surface Bs of the substrate, it is possible to converge the light beam on the upper surface Rs of the device area as the drawing object while avoiding the substrate that is not the object of drawing. Tracking of Bs on the upper surface.
如以上所說明般，在本實施形態之描繪裝置100中，基板W相當於本發明之「基板」，基板上表面Ws相當於本發明之「基板表面」。又，平台10作為本發明之「平台」而發揮功能。又，光學頭4作為本發明之「描繪頭」而發揮功能，另一方面，平台移動機構20作為本發明之「掃描移動部」而發揮功能。又，自動對焦機構45作為本發明之「檢測部」而發揮功能，另一方面，對焦驅動機構442作為本發明之「對焦調整部」而發揮功能。又，在上述實施形態中，基板上表面Ws中裝置區域之上表面Rs相當於本發明之「突出區域」，另一方面，基材上表面Bs相當於本發明之「後退區域」。
As described above, in the
再者，本發明並非被限定於上述之實施形態者，只要不脫離其主旨，即可於上述內容以外進行各種變更。例如，上述實施形態雖為作為光束之調變手段而利用繞射光學元件410的描繪裝置，但調變方式不限定於此，可將本發明應用於利用任意之調變方式來進行描繪之裝置。
In addition, the present invention is not limited to the above-mentioned embodiments, and various changes other than the above can be made without departing from the gist. For example, although the above-mentioned embodiment is a drawing device using the diffractive
又，在上述實施形態中，於基板上表面位置之檢測結果自追蹤範圍偏離時，雖將光束之會聚位置設定為追蹤範圍之上限值或 下限值，但並不限定於此，亦可被設定為追蹤範圍內之任意位置。 Furthermore, in the above embodiment, when the detection result of the position on the upper surface of the substrate deviates from the tracking range, the convergent position of the beam is set to the upper limit of the tracking range or The lower limit is not limited to this, and can be set to any position within the tracking range.
又，在上述實施形態中，作為對基板上表面Ws中較周圍更突出之「突出區域」即裝置區域上表面Rs進行描繪，追蹤範圍被設定為包含裝置區域Rs之高度。另一方面，亦存在有欲對基板上表面中較周圍更後退之「後退區域」進行描繪之需要。本發明亦可對應於如此之案例，於該情形時，只要追蹤範圍之設定一方面包含作為描繪對象之後退區域之高度，且另一方面不包含非描繪對象之突出區域之高度即可。藉此，由於光束一方面會追蹤作為描繪對象之後退區域之表面而確實地會聚，且另一方面不會追蹤突出區域，因此與上述實施形態相同地，可避免為了無用之會聚所進行之動作。 Furthermore, in the above-mentioned embodiment, the device area upper surface Rs, which is a "protruding area" which is more protruding from the periphery of the substrate upper surface Ws, is drawn, and the tracking range is set to include the height of the device area Rs. On the other hand, there is also a need to describe the "retreat area" on the upper surface of the substrate that is more retreat than the surrounding area. The present invention can also correspond to such a case. In this case, as long as the setting of the tracking range includes the height of the receding area as the drawing object on the one hand, and on the other hand it does not include the height of the protruding area of the non-drawing object. As a result, since the light beam traces the surface that is the receding area of the drawing object and converges surely, on the other hand, it does not trace the protruding area. Therefore, as in the above embodiment, it is possible to avoid unnecessary converging actions. .
又，在上述實施形態中，相對於基板上表面Ws使光自傾斜方向入射，而基板表面之位置自其正反射光的受光結果所檢測出。然而，本發明之「檢測部」並不限於如此之原理者，而可利用以光學性之方法取得基板表面之位置的各種機構。 In addition, in the above-mentioned embodiment, light is incident from an oblique direction with respect to the upper surface Ws of the substrate, and the position of the substrate surface is detected from the result of receiving light of the regular reflection light. However, the "detection unit" of the present invention is not limited to such a principle, and various mechanisms for obtaining the position of the substrate surface by optical methods can be used.
又，上述實施形態所使用之基板W雖為將作為裝置區域R之半導體晶片貼附於基材B而成者，但即便對於例如由薄膜形成或微影技術等而形成有段差之基板，本發明亦可有效地發揮功能。 In addition, the substrate W used in the above-mentioned embodiment is formed by attaching a semiconductor chip as the device region R to the base material B. However, even for a substrate with steps formed by thin film formation or lithography technology, this Inventions can also function effectively.
此外，本發明之應用對象並不限定於將晶圓等之半導體基板W作為描繪對象物而對該基板照射光來進行描繪之裝置者，亦可將例如印刷配線基板或玻璃基板等之各種物品作為描繪對象物而加以利用。 In addition, the application object of the present invention is not limited to a device that uses a semiconductor substrate W such as a wafer as a drawing object and irradiates the substrate with light to perform drawing. Various articles such as a printed wiring board or a glass substrate may be used. Use it as a drawing object.
以上，如例示具體之實施形態來進行說明般，於本發明中，當自表面位置之檢測結果所求得之會聚位置超過追蹤範圍時，會聚位置可設定在追蹤範圍內之任意位置。根據如此之構成，可於再次 對基板表面進行檢測時迅速地使光束會聚於基板表面。 As described above, as an example of a specific embodiment, in the present invention, when the convergence position obtained from the detection result of the surface position exceeds the tracking range, the convergence position can be set to any position within the tracking range. According to this structure, you can When detecting the surface of the substrate, the light beam is quickly converged on the surface of the substrate.
又，可構成為，於描繪之執行前，沿著一掃描方向進行表面位置之檢測，並自其結果特定出突出區域與後退區域。根據如此之構成，由於依據所實測之基板的表面位置而特定出突出區域與後退區域，因此亦可對應於基板厚度或翹曲等之個體差異而適當地設定追蹤範圍。 Furthermore, it may be configured to detect the surface position along a scanning direction before the execution of the drawing, and from the result to specify the protruding area and the retreating area. According to such a configuration, since the protruding area and the receding area are specified based on the measured surface position of the substrate, it is also possible to appropriately set the tracking range corresponding to individual differences in substrate thickness or warpage.
又，可自沿著一掃描方向之表面位置的檢測結果來分別特定出對應於突出區域之表面輪廓與對應於後退區域之表面輪廓，並設定包含對應於突出區域之表面輪廓且不包含對應於後退區域之表面輪廓的追蹤範圍。根據如此之構成，對於突出區域可確實地使光束會聚於其表面，且確實地避免朝向後退區域之無用的追蹤。 In addition, the surface contour corresponding to the protruding area and the surface contour corresponding to the receding area can be respectively specified from the detection result of the surface position along a scanning direction, and it can be set to include the surface contour corresponding to the protruding area and not include the surface contour corresponding to the protruding area. The tracking range of the surface contour in the receding area. According to such a structure, it is possible to surely converge the light beam on the surface of the protruding area, and to avoid useless tracking toward the retreating area.
又，可特定出表示對應於突出區域之表面輪廓的近似曲線，將包含該近似曲線且於光軸方向上一定寬度的範圍設為追蹤範圍。根據如此之構成，可使光束之會聚位置僅追蹤由近似曲線所表示之突出區域的表面附近，且亦可對應於其表面之位置變動。 In addition, an approximate curve representing the surface contour corresponding to the protruding area can be specified, and a range including the approximate curve and a certain width in the optical axis direction is set as the tracking range. According to such a configuration, the convergent position of the light beam can be traced only to the vicinity of the surface of the protruding area represented by the approximate curve, and it can also correspond to the position change of the surface.
又，可構成為交互地重複執行使光束的入射位置沿著既定之主掃描方向而自基板一端朝向另一端移動的主掃描移動、及使光束的入射位置沿著與主掃描方向正交之副掃描方向僅移動既定間距之副掃描移動，並特定出沿著主掃描方向之表面輪廓。根據如此之構成，由於追蹤範圍係對應於沿著主掃描方向之基板表面的凹凸而被設定，因此可於主掃描移動時穩定地使光束朝向突出區域會聚。 Furthermore, it may be configured to alternately repeat the main scanning movement in which the incident position of the light beam moves from one end to the other end of the substrate along the predetermined main scanning direction, and the sub The scanning direction only moves the sub-scanning movement of a predetermined interval, and the surface contour along the main scanning direction is specified. According to such a configuration, since the tracking range is set corresponding to the unevenness of the substrate surface along the main scanning direction, it is possible to stably converge the light beam toward the protruding area during the main scanning movement.
又，可構成為依據在副掃描方向上所檢測出之表面位置的變化來更新追蹤範圍。根據如此之構成，亦可對應於副掃描方向上之基板表面的凹凸。 In addition, it may be configured to update the tracking range based on changes in the surface position detected in the sub-scanning direction. According to such a configuration, it can also correspond to the unevenness of the substrate surface in the sub-scanning direction.
(產業上之可利用性) (Industrial availability)
本發明可適當地應用於對描繪對象物照射光而進行描繪之技術，尤其適於使用繞射光學元件來對線束光進行調變而進行描繪之技術領域。 The present invention can be suitably applied to a technique of irradiating a drawing object with light for drawing, and is particularly suitable for the technical field of drawing by modulating the light of a line beam by using a diffractive optical element.
Bs:基材上表面(後退區域) Bs: The upper surface of the substrate (recessed area)
Cb:基板上表面之近似曲線 Cb: Approximate curve of the upper surface of the substrate
Cr:裝置區域上表面之近似曲線 Cr: Approximate curve of the upper surface of the device area
Rs:裝置區域上表面(突出區域) Rs: The upper surface of the device area (protruding area)
Rt:追蹤範圍 Rt: Tracking range
Ws:基板上表面(基板表面) Ws: the upper surface of the substrate (substrate surface)
Y:主掃描方向 Y: Main scanning direction
Z:鉛直方向 Z: Vertical direction
Zth:臨限值 Zth: Threshold
△Z:距離(高低差) △Z: distance (height difference)
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