TWI710294B - installation method - Google Patents

installation method Download PDF

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Publication number
TWI710294B
TWI710294B TW106121898A TW106121898A TWI710294B TW I710294 B TWI710294 B TW I710294B TW 106121898 A TW106121898 A TW 106121898A TW 106121898 A TW106121898 A TW 106121898A TW I710294 B TWI710294 B TW I710294B
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Prior art keywords
paste
sheet
electronic component
installation
electronic
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TW106121898A
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Chinese (zh)
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TW201803436A (en
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片塩勉
薄井照幸
平木和雄
立岩剛
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日商鈴木股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)

Abstract

提供一種可將糊劑塗布於電子零件的技術。 To provide a technology that can apply paste to electronic parts.

將糊劑(11)設於工作臺(10)，將電子零件(13)設於薄片(14)。以糊劑(11)和電子零件(13)相互對向的方式將工作臺(10)和薄片(14)空出間隔地設置。以糊劑(11)和電子零件(13)接近的方式使薄片(14)逐漸彎曲，將電子零件(13)向糊劑(11)按壓。藉由使電子零件(13)從設於工作臺(10)的糊劑(11)離開，使糊劑(11)附著於電子零件(13)。 The paste (11) is set on the workbench (10), and the electronic component (13) is set on the sheet (14). The workbench (10) and the sheet (14) are arranged at intervals in such a way that the paste (11) and the electronic component (13) face each other. The sheet (14) is gradually bent so that the paste (11) and the electronic component (13) approach, and the electronic component (13) is pressed against the paste (11). By separating the electronic component (13) from the paste (11) provided on the workbench (10), the paste (11) is attached to the electronic component (13).

Description

安裝方法 installation method

本發明係有關一種塗布技術及使用塗布技術之安裝技術。 The present invention relates to a coating technology and an installation technology using coating technology.

日本國特開2011-82242號公報(專利文獻1)記載一種使附著在塗布銷下端的糊劑(接著劑)塗布於基板的既定位置，並於其位置安裝(裝設)電子零件的技術。 Japanese Patent Application Laid-Open No. 2011-82242 (Patent Document 1) describes a technique of applying a paste (adhesive) attached to the lower end of a coating pin to a predetermined position on a substrate, and mounting (installing) electronic components in the position.

先前技術文獻Prior art literature 專利文獻Patent literature

專利文獻1 日本國特開2011-82242號公報 Patent Document 1 Japanese Patent Application Publication No. 2011-82242

然而，就專利文獻1所記載的技術而言，需要與電子零件的大小(亦即糊劑量)配合的塗布銷，且必需依各個電子零件作交換。又，為了配合基板的既定位置塗布糊劑，進而配合其位置安裝電子零件，必需精度佳地對位，而在調整上耗費時間。如此，在包含使用塗布銷將糊劑塗布於基板的工序之情況，會有生產率降低之虞。抑或在塗布裝置、安裝裝置要求高的定位精度之情況，構造變複雜而導致裝置價格變高。 However, the technique described in Patent Document 1 requires a coating pin that matches the size of the electronic component (that is, the amount of paste), and must be exchanged for each electronic component. In addition, in order to apply the paste to the predetermined position of the substrate and to mount the electronic component in accordance with the position, it is necessary to accurately align the position, and it takes time for adjustment. In this way, when the step of applying the paste to the substrate using the application pin is included, there is a possibility that the productivity may decrease. Or, in the case where high positioning accuracy is required for the coating device and the mounting device, the structure becomes complicated and the device price increases.

本發明之一目的為，提供可將糊劑塗布於電子零件的技術。此外，本發明之一目的及其他目的以及新穎的特徵可從本說明書的記述及附件圖面清楚明瞭。 An object of the present invention is to provide a technique capable of applying paste to electronic parts. In addition, one and other objects and novel features of the present invention can be clearly understood from the description of this specification and the attached drawings.

簡單地說明有關本案所揭示的發明當中具代表性者的概要如下。 A brief description of the representative ones of the inventions disclosed in this case is as follows.

本發明之一解決手段的塗布方法，其特徵為包含：(a)將糊劑設於第1設置部之工序；(b)將電子零件設於第2設置部之工序；(c)以前述糊劑和前述電子零件互相對向的方式將前述第1設置部和前述第2設置部空出間隔地設置之工序；(d)前述第1設置部或前述第2設置部是具有彈性的薄片，以前述糊劑和前述電子零件接近的方式使前述薄片逐漸彎曲，向前述糊劑按壓前述電子零件之工序；及(e)藉由使前述電子零件從設於前述第1設置部的前述糊劑離開，使前述糊劑附著於前述電子零件之工序。據此，可將糊劑塗布於電子零件。 The coating method, which is one of the solutions of the present invention, is characterized by comprising: (a) the step of placing the paste on the first installation portion; (b) the step of installing the electronic component on the second installation portion; (c) The step of arranging the first installation portion and the second installation portion at intervals such that the paste and the electronic component face each other; (d) the first installation portion or the second installation portion is a sheet with elasticity , The step of gradually bending the sheet so that the paste and the electronic part approach, and pressing the electronic part against the paste; and (e) removing the electronic part from the paste provided in the first installation part The step of removing the agent and attaching the paste to the electronic component. Accordingly, the paste can be applied to electronic parts.

更佳為，前述(a)工序中，使用刮刀使前述糊劑的厚度均一。據此，藉由調整刮刀與第1設置部相隔的距離，可調整糊劑的厚度。 More preferably, in the step (a), a spatula is used to make the thickness of the paste uniform. Accordingly, the thickness of the paste can be adjusted by adjusting the distance between the spatula and the first installation portion.

更佳為，前述(b)工序中，將複數個前述電子零件設置於前述第2設置部，前述(d)工序中，將複數個前述電子零件一次性地向前述糊劑按壓。據此，與依各個電子零件來塗布糊劑之情況相比，能更加提升生產率。 More preferably, in the step (b), a plurality of the electronic components are installed in the second installation portion, and in the step (d), a plurality of the electronic components are pressed against the paste at a time. According to this, the productivity can be improved more than when the paste is applied to each electronic component.

更佳為，前述(a)工序中，在前述第1設置部所具有的第1面上設有前述糊劑，前述(b)工序中，在前述第2設置部所具有的第2面上設有前述電子零件，前述(c)工序中，以前述第1設置部的前述第1面和前述第2設置部的前述第2面成為平行的方式，將前述第1設置部和前述第2設置部空出間隔地設置。據此，朝電子零件塗布之糊劑的量變得容易調整。 More preferably, in the step (a), the paste is provided on the first surface of the first installation portion, and in the step (b), the paste is provided on the second surface of the second installation portion. The electronic component is provided, and in the step (c), the first installation portion and the second installation portion are arranged so that the first surface of the first installation portion and the second surface of the second installation portion are parallel to each other. The installation part is installed at intervals. According to this, the amount of paste applied to electronic parts becomes easy to adjust.

更佳為，前述(d)工序之前，前述薄片被形成平坦狀態，前述(d)工序中，使用具有端面且形成朝向前述端面變細之形狀的按壓部，使前述按壓部的前述端面與平坦狀態的前述薄片平行，且用前述按壓部按壓前述薄片使之彎曲。據此，可防止薄片在按壓部之端面的緣部破裂。 More preferably, before the step (d), the sheet is formed into a flat state, and in the step (d), a pressing portion having an end surface and a shape tapering toward the end surface is used to make the end surface of the pressing portion flat. The sheet in the state is parallel, and the sheet is pressed by the pressing portion to bend it. Accordingly, it is possible to prevent the sheet from cracking at the edge of the end surface of the pressing portion.

更佳為，前述第1設置部是工作臺，前述第2設置部是前述薄片，前述(d)工序中，以從設有前述電子零件之側的相反側朝向前述糊劑的方式使前述薄片彎曲。據此，可將電子零件按壓於糊劑。更佳為，此處，藉由附加於前述工作臺的調溫機構，將設於前述工作臺的前述糊劑保持成既定溫度。據此，使糊劑的黏度穩定，可提升塗布的品質。 More preferably, the first installation portion is a table, the second installation portion is the sheet, and in the step (d), the sheet is formed from the side opposite to the side on which the electronic component is provided toward the paste. bending. According to this, the electronic component can be pressed against the paste. More preferably, here, the paste provided on the workbench is maintained at a predetermined temperature by a temperature adjustment mechanism attached to the workbench. Accordingly, the viscosity of the paste is stabilized and the coating quality can be improved.

更佳為，前述第1設置部是前述薄片，前述第2設置部是工作臺，前述(d)工序中，以從設有前述糊劑之側的相反側朝向前述電子零件的方式使前述薄片彎曲。據此，可將糊劑按壓於電子零件。換言之，可將電子零件相對地按壓於糊劑。 More preferably, the first installation portion is the sheet, the second installation portion is a table, and in the step (d), the sheet is made to face the electronic component from the side opposite to the side where the paste is provided. bending. According to this, the paste can be pressed on the electronic component. In other words, the electronic component can be pressed against the paste relatively.

含有前述塗布方法之安裝方法，在前述(e)工序之後，藉由前述糊劑將前述電子零件安裝於基板者更佳。據此，即便未使糊劑塗布於基板，亦可將電子零件安裝於基板。 In the mounting method including the aforementioned coating method, after the aforementioned step (e), the aforementioned electronic component is mounted on the substrate by the aforementioned paste. According to this, even if the paste is not applied to the substrate, the electronic component can be mounted on the substrate.

簡單地說明有關本案所揭示的發明當中具代表性者的概要如下。依據本發明的一解決手段之塗布方法，可將糊劑塗布於電子零件。 A brief description of the representative ones of the inventions disclosed in this case is as follows. According to the coating method of a solution of the present invention, the paste can be applied to electronic parts.

10:工作臺 10: Workbench

11:糊劑 11: Paste

13:電子零件 13: Electronic parts

14:薄片 14: flakes

圖1係本發明一實施形態的安裝方法(塗布方法)之概略說明圖。 Fig. 1 is a schematic explanatory diagram of a mounting method (coating method) according to an embodiment of the present invention.

圖2係接於圖1後的安裝方法(塗布方法)之概略說明圖。 Fig. 2 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 1.

圖3係接於圖2後的安裝方法(塗布方法)之概略說明圖。 Fig. 3 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 2.

圖4係接於圖3後的安裝方法(塗布方法)之概略說明圖。 Fig. 4 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 3.

圖5係接於圖4後的安裝方法(塗布方法)之概略說明圖。 Fig. 5 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 4.

圖6係接於圖5後的安裝方法之概略說明圖。 Fig. 6 is a schematic explanatory diagram of the installation method following Fig. 5.

圖7係本發明其他實施形態的安裝方法(塗布方法)之概略說明圖。 Fig. 7 is a schematic explanatory diagram of a mounting method (coating method) of another embodiment of the present invention.

圖8係接於圖7後的安裝方法(塗布方法)之概略說明圖。 Fig. 8 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 7.

圖9係接於圖8後的安裝方法(塗布方法)之概略說明圖。 Fig. 9 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 8.

圖10係接於圖9後的安裝方法(塗布方法)之概略說明圖。 Fig. 10 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 9.

圖11係接於圖10後的安裝方法(塗布方法)之概略說明圖。 Fig. 11 is a schematic explanatory diagram of the mounting method (coating method) following Fig. 10.

在以下的本發明之實施形態中，在有必要的情況會分成複數個段落等作說明，原則上，其等並非相互無關，而是一者為另一者的一部分或全部的變形例、詳情等之關係。因此，在所有圖中，具有同一機能的構件賦予同一符號且省略重複的說明。又，針對構成要素之數(包含個數、數值、量、範圍等)，除了特別明示之情況或原理上清楚限定是特定的數之情況等之外，並非限定為其特定的數，亦可為特定的數以上或以下。又，在提及構成要素等之形狀時，除了特別明示之情況及認為原理上很清楚並非如此之情況等以外，實質上是設為包含近似或類似於其形狀等者。 In the following embodiments of the present invention, the description will be divided into multiple paragraphs when necessary. In principle, they are not independent of each other, but are modified examples and details in which one is part or all of the other. And so on. Therefore, in all the drawings, members having the same function are given the same reference numerals, and repeated descriptions are omitted. In addition, the number of constituent elements (including number, value, amount, range, etc.) is not limited to a specific number, except for the case where it is specifically stated or when it is clearly defined as a specific number in principle. It is a specific number or more. In addition, when referring to the shape of the constituent elements and the like, except for cases where it is particularly clearly stated and when it is considered that it is not the case that it is clear in principle, it is substantially assumed to include those that are similar or similar to the shape.

(第1實施形態) (First Embodiment)

參照圖1~圖6，針對本發明實施形態的含有塗布方法的安裝方法作說明。圖1~圖6係安裝方法的概略說明圖。本實施形態中，在包含於半導體裝置(電子裝置)的製造方法之安裝工序(接合工序)應用本發明的塗布技術。亦即，將糊劑(paste)11塗布於電子零件13(圖5)，此電子零件13被安裝於基板16(圖6)。就電子零件 13而言，使用半導體晶片(IC晶片、LED晶片等)。又，就基板16而言，使用陶瓷基板、印刷基板、引線框等。 1 to 6, the installation method including the coating method according to the embodiment of the present invention will be described. Figures 1 to 6 are schematic diagrams of the installation method. In this embodiment, the coating technology of the present invention is applied to the mounting process (bonding process) included in the manufacturing method of the semiconductor device (electronic device). That is, a paste 11 is applied to the electronic component 13 (FIG. 5 ), and the electronic component 13 is mounted on the substrate 16 (FIG. 6 ). For electronic parts For 13, semiconductor wafers (IC wafers, LED wafers, etc.) are used. In addition, as the substrate 16, a ceramic substrate, a printed circuit board, a lead frame, etc. are used.

首先，如圖1所示，準備塗布用工作臺10(table)作為設有糊劑11的糊劑設置部(第1設置部)。工作臺10係具有平坦面10a(圖中，上面)且被固定。糊劑11係例如從未圖示的分配器(dispenser)吐出而被(載於)設於面10a。本實施形態中，使用異方性導電糊來作為糊劑11。異方性導電糊係為使熱硬化性樹脂中含有導電粒子者。此導電粒子有焊料粒子或在樹脂粒子表面形成有金屬膜者。又，亦可於工作臺10附加調溫機構(未圖示)。藉此調溫機構將設於工作臺10的糊劑11保持在既定溫度，使糊劑11的黏度穩定，可提升塗布的品質。 First, as shown in FIG. 1, a coating table 10 (table) is prepared as a paste installation portion (first installation portion) provided with the paste 11. The workbench 10 has a flat surface 10a (upper side in the figure) and is fixed. The paste 11 is, for example, discharged from a dispenser (not shown) and is set on the surface 10a. In this embodiment, an anisotropic conductive paste is used as the paste 11. The anisotropic conductive paste is a thermosetting resin containing conductive particles. The conductive particles include solder particles or a metal film formed on the surface of resin particles. In addition, a temperature adjustment mechanism (not shown) may be added to the workbench 10. In this way, the temperature adjustment mechanism keeps the paste 11 provided on the worktable 10 at a predetermined temperature, so that the viscosity of the paste 11 is stabilized, and the coating quality can be improved.

接著，如圖2所示，調整糊劑11的厚度並將糊劑11設於工作臺10。具體言之，在糊劑11被載放於工作臺10的面10a的狀態下，使用刮刀(squeegee)12，使之移動將糊劑11擴展成面狀，使厚度均一(形成糊劑11的薄膜)。此時，作成在工作臺10上呈面狀設置的糊劑11於平面視的大小是比設於薄片(sheet)14的複數個電子零件13所佔有區域(圖3)還大。藉由調整刮刀12(前端)與工作臺10的面10a相隔的距離(刮刀12的按壓量)，可調整糊劑11的厚度。藉由事先將糊劑11的厚度設為均一，變得容易調整被塗布於電子零件13上的糊劑11的量。 Next, as shown in FIG. 2, the thickness of the paste 11 is adjusted and the paste 11 is set on the table 10. Specifically, in the state where the paste 11 is placed on the surface 10a of the table 10, a squeegee 12 is used to move it to spread the paste 11 into a surface shape to make the thickness uniform (formed paste 11 film). At this time, the size of the paste 11 formed in a planar shape on the table 10 in plan view is larger than the area occupied by the plurality of electronic components 13 provided on the sheet 14 (FIG. 3 ). The thickness of the paste 11 can be adjusted by adjusting the distance between the scraper 12 (front end) and the surface 10a of the table 10 (the pressing amount of the scraper 12). By making the thickness of the paste 11 uniform in advance, it becomes easy to adjust the amount of the paste 11 applied on the electronic component 13.

接著，如圖3所示，準備具有彈性的薄片14作為設有電子零件13的零件設置部(第2設置部)。電子 零件13具有成為外部連接端子的設有電極13a(參照圖6)的面13b(圖中，下面)及其相反側的面13c(上面)。又，薄片14具有面14a(圖中，下面)及其相反側的面14b(上面)。此處，電子零件13的面13c和薄片14的面14a相接，使電子零件13被設於(被貼附於)薄片14。 Next, as shown in FIG. 3, the sheet|seat 14 which has elasticity is prepared as a part installation part (2nd installation part) in which the electronic component 13 is provided. electronic The component 13 has a surface 13b (lower surface in the figure) provided with an electrode 13a (see FIG. 6) serving as an external connection terminal and a surface 13c (upper surface) on the opposite side. In addition, the sheet 14 has a surface 14a (lower surface in the figure) and a surface 14b (upper surface) on the opposite side. Here, the surface 13c of the electronic component 13 and the surface 14a of the sheet 14 are in contact with each other, and the electronic component 13 is provided on (attached to) the sheet 14.

本實施形態中，在薄片14設置複數個作為電子零件13的半導體晶片時，首先，於半導體晶圓貼附薄片14(例如，切割薄片等之黏著薄片)。此處，作成將薄片14設為平坦狀態，在此薄片14的中央部貼附有半導體晶圓。藉由使用夾環(以內環和外環包夾薄片14的外周部的構造)等之薄片保持部，使薄片14以伸展成平坦的狀態被保持。接著，若將薄片14與半導體晶圓一起切割，再將薄片14擴展，則於薄片14的中央部設有複數個電子零件13。 In this embodiment, when a plurality of semiconductor wafers as electronic components 13 are set on the sheet 14, first, the sheet 14 (for example, an adhesive sheet such as a dicing sheet) is attached to the semiconductor wafer. Here, the sheet 14 is made into a flat state, and a semiconductor wafer is attached to the center of the sheet 14. By using a sheet holding portion such as a clamp ring (a structure in which the outer peripheral portion of the sheet 14 is sandwiched by an inner ring and an outer ring), the sheet 14 is held in a flat state stretched out. Next, if the sheet 14 is cut together with the semiconductor wafer, and then the sheet 14 is expanded, a plurality of electronic components 13 are provided in the center of the sheet 14.

又，如圖3所示，按壓部方面是準備塗布用頭部(head)15。頭部15係構成為例如藉由線性馬達、滾珠螺桿機構等公知的驅動機構而可往復移動(圖中，上下移動)。藉此，頭部15可相對於被固定設置的工作臺10接近或離開。頭部15具有端面15a(圖中，下面)及斜面15b(倒角部)且形成為朝向端面15a變細的形狀。在用頭部15按壓薄片14之際，依據此種頭部15，可防止薄片14在頭部15之端面15a的緣部破裂。 Moreover, as shown in FIG. 3, the head 15 for application|coating is prepared for the pressing part. The head 15 is configured to be capable of reciprocating movement (up and down movement in the figure) by a known drive mechanism such as a linear motor and a ball screw mechanism. Thereby, the head 15 can approach or leave with respect to the fixedly arranged workbench 10. The head 15 has an end surface 15a (lower surface in the figure) and an inclined surface 15b (chamfered portion), and is formed in a shape tapering toward the end surface 15a. When pressing the sheet 14 with the head 15, according to this head 15, the sheet 14 can be prevented from breaking at the edge of the end surface 15 a of the head 15.

接著，如圖3所示，以糊劑11和電子零件13相互對向的方式將工作臺10和薄片14空出間隔地設置。此處，以工作臺10的面10a和薄片14的面14a成 為平行的方式，將工作臺10和薄片14空出間隔地設置。據此，在對經薄膜化的糊劑11按壓電子零件13時，可易於調整朝電子零件13塗布的糊劑11的量。又，以薄片14的面14b和頭部15的端面15a成為平行的方式，將薄片14和頭部15空出間隔地設置。 Next, as shown in FIG. 3, the table 10 and the sheet 14 are installed with an interval so that the paste 11 and the electronic component 13 face each other. Here, the surface 10a of the table 10 and the surface 14a of the sheet 14 are formed In a parallel manner, the table 10 and the sheet 14 are arranged at intervals. Accordingly, when the electronic component 13 is pressed against the thinned paste 11, the amount of the paste 11 applied to the electronic component 13 can be easily adjusted. In addition, the sheet 14 and the head 15 are provided at an interval so that the surface 14b of the sheet 14 and the end surface 15a of the head 15 become parallel.

因此，如圖3所示，設有經薄膜化的糊劑11之工作臺10的上方配置設有電子零件13的薄片14，在薄片14的上方配置頭部15。本實施形態中，將處在此種工作臺10、薄片14及頭部15的位置(待機位置)時設為待機狀態。 Therefore, as shown in FIG. 3, the sheet 14 provided with the electronic components 13 is arranged above the workbench 10 where the thin-filmed paste 11 is provided, and the head 15 is arranged above the sheet 14. In the present embodiment, the position (standby position) of the table 10, the sheet 14 and the head 15 is set to a standby state.

接著，如圖4所示，以糊劑11和電子零件13接近的方式使薄片14逐漸彎曲，向糊劑11按壓電子零件13。具體言之，從圖3所示之狀態，使用頭部15，以從設有電子零件13之側的相反側朝向糊劑11的方式使頭部15下降使薄片14彎曲。藉此，可向糊劑11按壓電子零件13。此時，使頭部15的端面15a與呈平坦狀態的薄片14平行，並用頭部15按住薄片14使薄片14彎曲。藉此頭部15的移動量，可容易地調整被塗布於電子零件13之糊劑11的量。 Next, as shown in FIG. 4, the sheet 14 is gradually bent so that the paste 11 and the electronic component 13 approach, and the electronic component 13 is pressed against the paste 11. Specifically, from the state shown in FIG. 3, the head 15 is used, and the head 15 is lowered toward the paste 11 from the side opposite to the side where the electronic component 13 is provided, and the sheet 14 is bent. Thereby, the electronic component 13 can be pressed against the paste 11. At this time, the end surface 15a of the head 15 is parallel to the sheet 14 in a flat state, and the sheet 14 is pressed by the head 15 to bend the sheet 14. With this, the amount of movement of the head 15 can easily adjust the amount of the paste 11 applied to the electronic component 13.

又，使薄片14的外周部位在待機位置而讓薄片14彎曲。本實施形態中，因為將夾環固定且其上保持有薄片14(此外周部)，所以薄片14的外周部是處在待機位置。據此，在薄片14的外周部處於待機位置的狀態下可使薄片14的中央部朝糊劑11突出。亦即，可使電子零件13從薄片14突出地向糊劑11按壓。此外，亦可將薄片14的外周部進行真空吸引使保持於待機位置。 In addition, the outer peripheral portion of the sheet 14 is placed at the standby position, and the sheet 14 is bent. In this embodiment, since the clip ring is fixed and the sheet 14 (outer peripheral portion) is held thereon, the outer peripheral portion of the sheet 14 is in the standby position. According to this, the center portion of the sheet 14 can be protruded toward the paste 11 in a state where the outer peripheral portion of the sheet 14 is in the standby position. That is, the electronic component 13 can be pressed against the paste 11 protruding from the sheet 14. In addition, the outer peripheral portion of the sheet 14 may be vacuum sucked and held in the standby position.

又，複數個電子零件13一次性地被朝向糊劑11按壓。據此，與按電子零件13來塗布糊劑11之情況相比，可更加提升生產率。本實施形態中，作成頭部15之端面15a的大小是比設置於薄片14上的複數個電子零件13所佔有區域(平面區域)還大。依據此種頭部15，成為可一次性地將糊劑11塗布於複數個電子零件13。 In addition, a plurality of electronic components 13 are pressed toward the paste 11 at once. According to this, compared with the case where the paste 11 is applied according to the electronic component 13, the productivity can be further improved. In this embodiment, the size of the end surface 15a of the head 15 is larger than the area (planar area) occupied by the plurality of electronic components 13 provided on the sheet 14. According to such a head 15, the paste 11 can be applied to a plurality of electronic components 13 at a time.

接著，如圖5所示，藉由使電子零件13從設於工作臺10的糊劑11離開而在電子零件13附著糊劑11。具體言之，使頭部15從工作臺10向上方離開(使逐漸上升)，直到彎曲的薄片14返回待機狀態。亦即，使被貼附於薄片14的電子零件13從設於工作臺10的糊劑11剝離。此時，只要在設有電子零件13的電極13a的面13b附著有糊劑11即可。 Next, as shown in FIG. 5, by separating the electronic component 13 from the paste 11 provided on the table 10, the paste 11 is attached to the electronic component 13. Specifically, the head 15 is moved upwardly from the table 10 (increased gradually) until the bent sheet 14 returns to the standby state. That is, the electronic component 13 attached to the sheet 14 is peeled off from the paste 11 provided on the table 10. In this case, it is sufficient that the paste 11 is adhered to the surface 13b on which the electrode 13a of the electronic component 13 is provided.

如此，可將糊劑11塗布於貼附在薄片14的電子零件13。此外，為了確認糊劑11是否被塗布於電子零件13，亦可分析從相機所攝影之畫像資料。 In this way, the paste 11 can be applied to the electronic component 13 attached to the sheet 14. In addition, in order to confirm whether the paste 11 is applied to the electronic component 13, it is also possible to analyze the image data taken from the camera.

其後，如圖6所示，藉由糊劑11將電子零件13安裝於基板16。具體言之，要針對糊劑11方面是使用在熱硬化性樹脂11a中含有焊料粒子11b(導電粒子)的異方性導電糊之情況作說明。首先，使基板16的電極16a(圖案)和電子零件13的電極13a相對並在基板16上配置電子零件13。接著，利用加熱器例如加熱到160℃左右使焊料粒子11b熔融。此熔融的焊料粒子11b彼此在電極13a和電極16a之間逐漸黏聚。接著，使加熱器溫度降低到140℃左右，藉以使熱硬化性樹脂11a熱硬化。 After that, as shown in FIG. 6, the electronic component 13 is mounted on the substrate 16 via the paste 11. Specifically, the case where the paste 11 is an anisotropic conductive paste containing solder particles 11b (conductive particles) in a thermosetting resin 11a will be described. First, the electrode 16a (pattern) of the substrate 16 and the electrode 13a of the electronic component 13 are opposed to each other, and the electronic component 13 is placed on the substrate 16. Next, the solder particles 11b are melted by heating, for example, to about 160°C with a heater. The molten solder particles 11b gradually adhere to each other between the electrode 13a and the electrode 16a. Next, the heater temperature is lowered to approximately 140°C, thereby thermally curing the thermosetting resin 11a.

如此，可將電子零件13安裝於基板16。電子零件13的電極13a和基板16的電極16a藉由糊劑11(焊料粒子11b)而被電連接。依據本實施形態的安裝方法，配合基板16的既定位置(電極16a)塗布糊劑11，進而配合其位置而安裝電子零件13的電極13a之情況相比，可減少對位的次數，可達成生產率、精度的提升。 In this way, the electronic component 13 can be mounted on the substrate 16. The electrode 13a of the electronic component 13 and the electrode 16a of the substrate 16 are electrically connected by the paste 11 (solder particles 11b). According to the mounting method of this embodiment, the paste 11 is applied to a predetermined position (electrode 16a) of the substrate 16, and then the electrode 13a of the electronic component 13 is mounted in accordance with the position. The number of alignments can be reduced and productivity can be achieved. , Increased accuracy.

此外，亦可為使用熱硬化性樹脂11a中含有在樹脂粒子表面形成有金屬膜者(導電粒子)之異方性導電糊來作為糊劑11的情況。在該情況，只要藉由於基板16上配置電子零件13之後，利用加熱器一邊加熱一邊對基板16加壓電子零件13，而在電極13a和電極16a包夾著導電粒子的狀態下使熱硬化性樹脂11a熱硬化即可。 In addition, as the paste 11, an anisotropic conductive paste containing a metal film formed on the surface of the resin particles (conductive particles) in the thermosetting resin 11a may be used. In this case, as long as the electronic component 13 is placed on the substrate 16, the electronic component 13 is pressed against the substrate 16 while heating by a heater, and the electrode 13a and the electrode 16a sandwich the conductive particles to make the thermosetting property. The resin 11a may be thermally cured.

(第2實施形態) (Second Embodiment)

參照圖7~圖11，針對本發明實施形態的含有塗布方法的安裝方法作說明。圖7~圖11係安裝方法的概略說明圖。第1實施形態(參照圖3)中，針對將設有糊劑11的糊劑設置部設為工作臺10，設有電子零件13的零件設置部設為薄片14的情況作了說明。對此，本實施形態(參照圖9)中，在將糊劑設置部設為薄片30，零件設置部設為工作臺31的點是有差異的。以下以差異點為中心作說明。 Referring to Figs. 7 to 11, an installation method including a coating method according to an embodiment of the present invention will be described. Figures 7 to 11 are schematic illustrations of the installation method. In the first embodiment (refer to FIG. 3 ), the case where the paste installation portion provided with the paste 11 is set as the workbench 10 and the component installation portion provided with the electronic component 13 is set as the sheet 14 has been described. In this regard, in the present embodiment (see FIG. 9), there is a difference in the point that the paste setting part is the sheet 30 and the parts setting part is the table 31. The following description focuses on the differences.

首先，如圖7所示，準備具有彈性的薄片30作為設有糊劑11的糊劑設置部。薄片30具有面30a(圖中，上面)及其相反側的面30b(下面)。關於此薄片30， 例如，可使用切割薄片或延伸薄片等。圖7所示之狀態的薄片30被鋪設於工作臺(未圖示)的上面。糊劑11從例如分配器(未圖示)吐出並被設置於(被載放)此薄片30的面30a上。本實施形態中，使用異方性導電糊來作為糊劑11。 First, as shown in FIG. 7, a sheet 30 having elasticity is prepared as a paste installation portion where the paste 11 is provided. The sheet 30 has a surface 30a (upper surface in the figure) and a surface 30b (lower surface) on the opposite side. Regarding this sheet 30, For example, a cut sheet or an extended sheet can be used. The sheet 30 in the state shown in FIG. 7 is laid on the upper surface of the workbench (not shown). The paste 11 is ejected from, for example, a dispenser (not shown), and is placed (mounted) on the surface 30a of the sheet 30. In this embodiment, an anisotropic conductive paste is used as the paste 11.

接著，如圖8所示，調整糊劑11的厚度將糊劑11設於薄片30。具體言之，在薄片30的面30a被載放有糊劑11的狀態下，使用刮刀12，使之移動將糊劑11擴展成面狀，使厚度均一(形成糊劑11的薄膜)。此處，在薄片30的中央部設有糊劑11。此際，作成於薄片30呈面狀設置的糊劑11之俯視的大小是比設於工作臺31的複數個電子零件13所佔有區域(圖9)還大。 Next, as shown in FIG. 8, the thickness of the paste 11 is adjusted to set the paste 11 on the sheet 30. Specifically, in a state where the paste 11 is placed on the surface 30a of the sheet 30, the scraper 12 is used to move the blade 12 to spread the paste 11 into a surface shape to make the thickness uniform (a thin film of the paste 11 is formed). Here, the paste 11 is provided in the center of the sheet 30. At this time, the size of the paste 11 formed on the sheet 30 and arranged in a plane is larger than the area occupied by the plurality of electronic components 13 arranged on the table 31 (FIG. 9 ).

接著，如圖9所示，在設有電子零件13的零件設置部方面，準備塗布用工作臺31。此工作臺31係具有平坦面31a(圖中，下面)且被固定。此處，使電子零件13的面13c和工作臺31的面31a相對，電子零件13藉由薄片32(例如，切割薄片等之黏著薄片)被設置於工作臺31。此際，例如，可用工作臺31的面31a將貼附有電子零件13的薄片32吸附保持。 Next, as shown in FIG. 9, a coating table 31 is prepared for the parts installation part where the electronic parts 13 are provided. The workbench 31 has a flat surface 31a (lower surface in the figure) and is fixed. Here, the surface 13c of the electronic component 13 and the surface 31a of the table 31 are opposed, and the electronic component 13 is set on the table 31 by a sheet 32 (for example, an adhesive sheet such as a cutting sheet). In this case, for example, the surface 31a of the table 31 can be used to suck and hold the sheet 32 to which the electronic component 13 is attached.

又，如圖9所示，在按壓部方面準備塗布用頭部15。具有端面15a(圖中，上面)的頭部15係構成為：例如，可藉線性馬達或滾珠螺桿機構等公知的驅動機構而往復移動(圖中，上下移動)。藉此，頭部15可相對於被固定設置的工作臺31接近或離開。 Moreover, as shown in FIG. 9, the head 15 for application|coating is prepared for the pressing part. The head 15 having an end surface 15a (upper side in the figure) is configured to be reciprocated (up and down in the figure) by a known drive mechanism such as a linear motor or a ball screw mechanism. Thereby, the head 15 can approach or leave with respect to the fixedly arranged workbench 31.

然而，以糊劑11和電子零件13相互對向的方式將薄片30和工作臺31空出間隔地設置。此處，以薄片30的面30a和工作臺31的面31a成為平行的方式，將薄片30和工作臺31空出間隔地設置。 However, the sheet 30 and the table 31 are provided with an interval in such a manner that the paste 11 and the electronic component 13 face each other. Here, so that the surface 30a of the sheet 30 and the surface 31a of the table 31 become parallel, the sheet 30 and the table 31 are provided with an interval.

因此，如圖9所示，在設有糊劑11的薄膜之薄片30上方配置被設於工作臺31的面31a之電子零件13，在薄片30的下方配置頭部15。本實施形態中，將處在此種工作臺31、薄片30及頭部15的位置(待機位置)時設為待機狀態。 Therefore, as shown in FIG. 9, the electronic components 13 provided on the surface 31 a of the table 31 are arranged above the sheet 30 provided with the film of the paste 11, and the head 15 is arranged below the sheet 30. In this embodiment, the position (standby position) of the table 31, the sheet 30, and the head 15 is set to a standby state.

接著，如圖10所示，以糊劑11和電子零件13接近的方式使薄片30逐漸彎曲，向電子零件13按壓糊劑11。具體言之，使用頭部15，從設有糊劑11之側的相反側以朝向電子零件13的方式使頭部15上升使薄片30彎曲。藉此，可將電子零件13向糊劑11相對地按壓。 Next, as shown in FIG. 10, the sheet 30 is gradually bent so that the paste 11 and the electronic component 13 approach, and the paste 11 is pressed against the electronic component 13. Specifically, using the head 15, the head 15 is raised toward the electronic component 13 from the side opposite to the side where the paste 11 is provided, and the sheet 30 is bent. Thereby, the electronic component 13 can be pressed against the paste 11 relatively.

此處，以使薄片30的外周部位在待機位置的方式使薄片30彎曲。薄片30的外周部，例如藉由真空吸引可保持在待機位置。據此，於薄片30的外周部是處在待機位置的狀態，利用頭部15可使薄片30的中央部朝電子零件13突出。亦即，可使糊劑11從薄片30突出而向電子零件13按壓。 Here, the sheet 30 is bent so that the outer peripheral portion of the sheet 30 is in the standby position. The outer peripheral portion of the sheet 30 can be held in the standby position by, for example, vacuum suction. According to this, since the outer peripheral portion of the sheet 30 is in the standby position, the central portion of the sheet 30 can be protruded toward the electronic component 13 by the head 15. That is, the paste 11 can be protruded from the sheet 30 and pressed against the electronic component 13.

又，複數個電子零件13被一次性地朝向糊劑11按壓。據此，與依每一個電子零件13來塗布糊劑11之情況相比，能更加提升生產率。本實施形態中，作成頭部15的端面15a的大小是比設置於工作臺31的複數 個電子零件13所佔有區域(平面區域)還大。依據此種頭部15，形成可向複數個電子零件13一次性地塗布糊劑11。 In addition, a plurality of electronic components 13 are pressed toward the paste 11 at once. According to this, compared with the case where the paste 11 is applied for each electronic component 13, the productivity can be improved. In this embodiment, the size of the end surface 15a of the head 15 is larger than the size of the plural The area (planar area) occupied by each electronic component 13 is still large. According to such a head 15, the paste 11 can be applied to a plurality of electronic components 13 at once.

接著，如圖11所示，藉由使糊劑11從設於工作臺31的電子零件13離開，使糊劑11附著於電子零件13。具體言之，使頭部15從工作臺31朝下方逐漸離去(逐漸下降)直到使彎曲的薄片30回到待機狀態。亦即，使設於薄片30的糊劑11從設於工作臺31的電子零件13剝離。此時，只要在設有電子零件13的電極13a之面13b上附著有糊劑11即可。 Next, as shown in FIG. 11, by separating the paste 11 from the electronic component 13 provided on the table 31, the paste 11 is attached to the electronic component 13. Specifically, the head 15 is gradually moved downward from the table 31 (gradually lowered) until the bent sheet 30 is returned to the standby state. That is, the paste 11 provided on the sheet 30 is peeled off from the electronic component 13 provided on the table 31. At this time, it is sufficient that the paste 11 is attached to the surface 13b of the electrode 13a on which the electronic component 13 is provided.

如此，可將糊劑11塗布於設置在工作臺31的電子零件13。其後，如同參照圖6所作的說明，藉由糊劑11將電子零件13安裝於基板16。據此，就算未使糊劑11塗布於基板16，亦可將電子零件13安裝於基板16，故與第1實施形態同樣地，可達成生產率、精度的提升。 In this way, the paste 11 can be applied to the electronic component 13 installed on the table 31. After that, as described with reference to FIG. 6, the electronic component 13 is mounted on the substrate 16 by the paste 11. According to this, even if the paste 11 is not applied to the substrate 16, the electronic component 13 can be mounted on the substrate 16, so similar to the first embodiment, productivity and accuracy can be improved.

以上，本發明已依據實施形態作了具體說明，本發明不受前述實施形態所限定，當然可在不背離其要旨之範圍作各種變更。 As mentioned above, the present invention has been specifically described based on the embodiments, and the present invention is not limited to the foregoing embodiments, and of course, various modifications can be made without departing from the scope of the gist.

前述實施形態中，針對作為零件而應用於半導體晶片的情況作了說明。惟不侷限於此，就零件而言，只要是被貼附於薄片上者(例如，晶片狀的零件)即可，也能應用半導體晶片、晶片電阻、片式電容器、晶片電感器等之電子零件。 In the foregoing embodiment, the case where it is applied to a semiconductor wafer as a part has been described. However, it is not limited to this. As far as the parts are concerned, as long as they are attached to a sheet (for example, a chip-shaped part), electronic components such as semiconductor chips, chip resistors, chip capacitors, and chip inductors can also be used. Components.

前述實施形態中，針對作為糊劑而應用於異向性導電糊的情況作了說明。惟不侷限於此，就糊劑而言，也可應用焊料、助熔劑(flux)等。 In the foregoing embodiment, the case where it is applied to an anisotropic conductive paste as a paste has been described. However, it is not limited to this. As far as the paste is concerned, solder, flux, etc. may also be used.

前述實施形態中，針對使糊劑一次性地塗布於複數個電子零件的情況作了說明。惟不侷限於此，可將糊劑塗布於1個電子零件。 In the foregoing embodiment, the case where the paste is applied to a plurality of electronic components at once has been described. But it is not limited to this, the paste can be applied to one electronic part.

10:工作臺 10: Workbench

10a:工作臺10的面 10a: Surface of workbench 10

11:糊劑 11: Paste

13:電子零件 13: Electronic parts

14:薄片 14: flakes

14a:薄片14的面 14a: the side of flake 14

14b:薄片14的面 14b: the side of flake 14

15:頭部 15: head

15a:端面 15a: end face

15b:斜面 15b: inclined plane

Claims (7)

一種安裝方法，其特徵為具有塗布方法，該塗布方法包含：(a)將糊劑設於第1設置部之工序；(b)將電子零件設於第2設置部之工序；(c)以前述糊劑和前述電子零件互相對向的方式，將前述第1設置部和前述第2設置部空出間隔地設置之工序；(d)前述第1設置部是工作臺，且前述第2設置部是具有彈性的薄片，以前述糊劑和前述電子零件接近的方式，使前述薄片逐漸彎曲，向前述糊劑按壓前述電子零件之工序；及(e)藉由使前述電子零件從設於前述第1設置部的前述糊劑離開，使前述糊劑附著於前述電子零件之工序，且該安裝方法係在前述(e)工序之後，藉由附著於前述電子零件的前述糊劑將前述電子零件安裝於基板。 An installation method, characterized by having a coating method, the coating method comprising: (a) a step of placing a paste on a first installation part; (b) a step of placing an electronic component on a second installation part; (c) with The paste and the electronic components are opposed to each other, and the first installation part and the second installation part are arranged at intervals; (d) The first installation part is a workbench, and the second installation The part is a thin sheet with elasticity. The step of gradually bending the sheet so that the paste and the electronic part approach, and pressing the electronic part against the paste; and (e) by removing the electronic part from the The step of separating the paste of the first installation portion to attach the paste to the electronic component, and the mounting method is after the step (e), the electronic component is attached to the electronic component by the paste attached to the electronic component Mounted on the substrate. 如請求項1之安裝方法，其中前述(a)工序中，使用刮刀使前述糊劑的厚度均一。 The mounting method of claim 1, wherein in the step (a), a spatula is used to make the thickness of the paste uniform. 如請求項1之安裝方法，其中前述(b)工序中，將複數個前述電子零件設置於前述第2設置部，前述(d)工序中，將複數個前述電子零件一次性地向前述糊劑按壓。 The mounting method of claim 1, wherein in the step (b), a plurality of the electronic components are set in the second installation portion, and in the step (d), a plurality of the electronic components are applied to the paste at once Press. 如請求項1之安裝方法，其中 前述(a)工序中，在前述第1設置部所具有的第1面上設有前述糊劑，前述(b)工序中，在前述第2設置部所具有的第2面上設有前述電子零件，前述(c)工序中，以前述第1設置部的前述第1面和前述第2設置部的前述第2面成為平行的方式，將前述第1設置部和前述第2設置部空出間隔地設置。 Such as the installation method of claim 1, where In the step (a), the paste is provided on the first surface of the first installation portion, and in the step (b), the electrons are provided on the second surface of the second installation portion. For parts, in the step (c), the first installation portion and the second installation portion are vacated so that the first surface of the first installation portion and the second surface of the second installation portion are parallel to each other Set at intervals. 如請求項1之安裝方法，其中前述(d)工序之前，前述薄片被形成為平坦狀態，前述(d)工序中，使用具有端面且形成朝向前述端面變細之形狀的按壓部，使前述按壓部的前述端面與平坦狀態的前述薄片平行，且用前述按壓部按壓前述薄片使之彎曲。 The mounting method of claim 1, wherein before the step (d), the sheet is formed into a flat state, and in the step (d), a pressing portion having an end surface and a shape tapering toward the end surface is used to press the The end surface of the portion is parallel to the sheet in a flat state, and the sheet is pressed by the pressing portion to bend it. 如請求項1之安裝方法，其中前述第1設置部是工作臺，前述第2設置部是前述薄片，前述(d)工序中，以從設有前述電子零件之側的相反側朝向前述糊劑的方式，使前述薄片彎曲。 The mounting method of claim 1, wherein the first setting part is a workbench, the second setting part is the sheet, and the step (d) is directed from the side opposite to the side where the electronic components are provided toward the paste The way to make the aforementioned sheet bend. 如請求項6之安裝方法，其中藉由附加於前述工作臺的調溫機構，將設於前述工作臺的前述糊劑保持在既定溫度。 The installation method of claim 6, wherein the paste provided on the workbench is maintained at a predetermined temperature by a temperature adjustment mechanism attached to the workbench.
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