TWI709286B - Adaptor device and network card module - Google Patents

Adaptor device and network card module Download PDF

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Publication number
TWI709286B
TWI709286B TW108147967A TW108147967A TWI709286B TW I709286 B TWI709286 B TW I709286B TW 108147967 A TW108147967 A TW 108147967A TW 108147967 A TW108147967 A TW 108147967A TW I709286 B TWI709286 B TW I709286B
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circuit board
ocp
network card
connector
power converter
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TW108147967A
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Chinese (zh)
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TW202125928A (en
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李怡明
栗宇平
廖峻德
林英玉
方思堯
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技嘉科技股份有限公司
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Abstract

An adaptor includes a circuit board, a power converter, a U.2 connector disposed at a side of the circuit board and an OCP 3.0 interface slot disposed at another side of the circuit board. The U.2 connector and OCP 3.0 interface slot are electrically connected to the power converter. A network card module is further provided.

Description

轉接裝置及網路卡模組Switching device and network card module

本發明是有關於一種轉接裝置及網路卡模組,且特別是有關於一種具有OCP 3.0介面的轉接裝置及網路卡模組。The present invention relates to a switching device and a network card module, and more particularly to a switching device and a network card module with an OCP 3.0 interface.

隨著大數據時代的來臨,網際網路用戶對數據中心的需求越來越大,企業為了滿足資料大量運送與處理資料的需求,需要考量導入新的存儲架構,來建構一個成本合理、且能處理資料異質的存儲硬體架構。OCP網路卡提供了靈活、可靠、高性價比的儲存網域連接方式,也滿足未來的擴充需求。此外,OCP 3.0介面可提供從系統外簡單插拔的功能,而成為目前的趨勢。With the advent of the era of big data, Internet users’ demand for data centers is increasing. In order to meet the needs of large amounts of data transportation and processing, enterprises need to consider introducing new storage architectures to build a reasonable cost and Storage hardware architecture that handles heterogeneous data. The OCP network card provides a flexible, reliable, and cost-effective way to connect to the storage network domain, and also meets future expansion needs. In addition, the OCP 3.0 interface can provide simple plug-in functions from outside the system, which has become the current trend.

然而,目前伺服器的外接插槽大多是用來供硬碟插設的U.2插槽,OCP 3.0插槽相當有限,而難以利用OCP 3.0網路卡來對網路功能或是儲存網域的連接性進行大幅擴充。此外,OCP 3.0插槽所佔的空間較大,若主機板的板邊配置較多的OCP 3.0插槽,則會占用較多主機板的空間,對應的要犧牲其他的傳輸接口。However, most of the current server’s external slots are U.2 slots for hard drives. OCP 3.0 slots are quite limited, and it is difficult to use OCP 3.0 network cards to perform network functions or storage domains. Connectivity has been greatly expanded. In addition, the OCP 3.0 slot occupies a larger space. If the motherboard is equipped with more OCP 3.0 slots on the side of the board, it will occupy more space on the motherboard, and correspondingly, other transmission interfaces will be sacrificed.

本發明提供一種轉接裝置,其可使具有OCP 3.0連接器的裝置插設至U.2插槽。The present invention provides an adapter device, which allows a device with an OCP 3.0 connector to be inserted into a U.2 slot.

本發明提供一種網路卡模組,具有上述的轉接裝置。The present invention provides a network card module with the above-mentioned switching device.

本發明的一種轉接裝置,包括一電路板、一電源轉換器、一U.2連接器及一OCP 3.0介面插槽。電源轉換器配置於電路板。U.2連接器配置於電路板的一端。OCP 3.0介面插槽配置於電路板的另一端。U.2連接器與OCP 3.0介面插槽且電性連接至電源轉換器。An adapter device of the present invention includes a circuit board, a power converter, a U.2 connector, and an OCP 3.0 interface slot. The power converter is configured on the circuit board. The U.2 connector is arranged at one end of the circuit board. The OCP 3.0 interface slot is located at the other end of the circuit board. The U.2 connector and the OCP 3.0 interface socket are electrically connected to the power converter.

本發明的一種網路卡模組,適於插設至一伺服器的一U.2介面插槽,包括一轉接裝置及一網路卡。轉接裝置包括一電路板、一電源轉換器、一U.2連接器及一OCP 3.0介面插槽。電源轉換器配置於電路板。U.2連接器配置於電路板的一端,且適於插設至伺服器的U.2介面插槽,以電性連接於伺服器。OCP 3.0介面插槽配置於電路板的另一端。U.2連接器與OCP 3.0介面插槽且電性連接至電源。網路卡包括一OCP 3.0連接器,可拆卸地插設在轉接裝置的OCP 3.0介面插槽。A network card module of the present invention is suitable for being inserted into a U.2 interface slot of a server, and includes a switching device and a network card. The adapter device includes a circuit board, a power converter, a U.2 connector and an OCP 3.0 interface slot. The power converter is configured on the circuit board. The U.2 connector is arranged at one end of the circuit board and is suitable for plugging into the U.2 interface socket of the server to be electrically connected to the server. The OCP 3.0 interface slot is located at the other end of the circuit board. The U.2 connector and the OCP 3.0 interface socket are electrically connected to the power supply. The network card includes an OCP 3.0 connector, which is detachably inserted into the OCP 3.0 interface slot of the adapter device.

在本發明的一實施例中,上述的網路卡模組更包括一殼座,轉接裝置與網路卡配置於殼座上,殼座的尺寸符合一2.5吋硬碟托盤的尺寸,而適於插設在伺服器上。In an embodiment of the present invention, the above-mentioned network card module further includes a housing, the adapter device and the network card are disposed on the housing, and the size of the housing conforms to the size of a 2.5-inch hard disk tray, and Suitable for plugging in the server.

在本發明的一實施例中,上述的殼座具有一底板及位於底板相對兩側的兩側板,而呈U型,底板具有一定位部,轉接裝置固定於定位部。In an embodiment of the present invention, the aforementioned housing has a bottom plate and two side plates located on opposite sides of the bottom plate, and are U-shaped, the bottom plate has a positioning portion, and the adapter device is fixed to the positioning portion.

在本發明的一實施例中,上述的轉接裝置更包括一訊號中繼器,配置於電路板,且電性連接於U.2連接器與OCP 3.0介面插槽。In an embodiment of the present invention, the aforementioned adapter device further includes a signal repeater, which is disposed on the circuit board and is electrically connected to the U.2 connector and the OCP 3.0 interface slot.

在本發明的一實施例中,上述的電路板具有相對的一第一面及一第二面及凹陷於第二面的一背鑽孔,且包括位於第一面的一第一線路層、位於電路板的內部的一第二線路層及連接於第一線路層與第二線路層的一導電貫孔,背鑽孔對應於導電貫孔。In an embodiment of the present invention, the above-mentioned circuit board has a first surface and a second surface opposite to each other, and a back hole recessed in the second surface, and includes a first circuit layer on the first surface, A second circuit layer located inside the circuit board and a conductive through hole connected to the first circuit layer and the second circuit layer, and the back drilling corresponds to the conductive through hole.

基於上述,本發明的轉接裝置可使具有OCP 3.0連接器的裝置插設至U.2插槽,而增加OCP 3.0裝置(例如是網路卡)的相容性與U.2插槽的使用率。相較於習知受限於伺服器上OCP 3.0插槽只有一到三個,而僅能連接一到三個網路卡,本發明的轉接裝置能夠使外接的OCP 3.0裝置的數量跟著U.2插槽的數量而擴增,大幅提升伺服器的網路能力。Based on the above, the adapter device of the present invention allows devices with OCP 3.0 connectors to be inserted into the U.2 slot, and increases the compatibility of OCP 3.0 devices (such as network cards) with the U.2 slot Usage rate. Compared with the conventional limitation that there are only one to three OCP 3.0 slots on the server, and only one to three network cards can be connected, the adapter device of the present invention can make the number of external OCP 3.0 devices follow U .2 The number of slots has been expanded, greatly improving the server's network capabilities.

一般來說,伺服器的前端與後端的其中一者會有一至三個OCP插槽,以供網路卡插設,另一者則是設有多個U.2插槽,以供硬碟連接。U.2插槽的數量可多達20至30個,以因應不同的擴充需求。由於常設的OCP插槽的數量少,能夠外接的網路卡數量受到了限制。另一方面,U.2插槽的數量眾多,在某些狀況下,若不需要插設那麼多硬碟,則可能會有U.2插槽閒置的狀況。本實施例的網路卡模組可插設在U.2插槽,而能夠有效利用伺服器具有數量眾多的U.2插槽的特性,來增加擴充性。下面將對此詳細說明。Generally speaking, one of the front and back of the server has one to three OCP slots for network card insertion, and the other has multiple U.2 slots for hard drives. connection. The number of U.2 slots can be as many as 20 to 30 to meet different expansion needs. Due to the small number of permanent OCP slots, the number of external network cards is limited. On the other hand, there are a large number of U.2 slots. Under certain conditions, if there is no need to insert so many hard disks, the U.2 slots may be idle. The network card module of this embodiment can be inserted into the U.2 slot, and the characteristic of the server having a large number of U.2 slots can be effectively utilized to increase the expandability. This will be explained in detail below.

圖1是依照本發明的一實施例的一種網路卡模組的示意圖。圖2是圖1的另一視角的示意圖。圖3是圖1的***圖。圖4是圖2的***圖。請參閱圖1至圖4,本實施例的網路卡模組10適於插設至一伺服器(未繪示)的一U.2介面插槽(未繪示)。網路卡模組10包括一轉接裝置100及可拆卸地插設於轉換裝置的一網路卡30。FIG. 1 is a schematic diagram of a network card module according to an embodiment of the invention. FIG. 2 is a schematic diagram of FIG. 1 from another perspective. Figure 3 is an exploded view of Figure 1. Figure 4 is an exploded view of Figure 2. 1 to 4, the network card module 10 of this embodiment is suitable for plugging into a U.2 interface slot (not shown) of a server (not shown). The network card module 10 includes a switching device 100 and a network card 30 detachably inserted into the switching device.

圖5是依照本發明的一實施例的一種轉接裝置的示意圖。請參閱圖5,轉接裝置100包括一電路板110、一電源轉換器114b(圖6)、一U.2連接器120及一OCP 3.0介面插槽130。U.2連接器120配置於電路板110的一端,且適於插設至伺服器的U.2介面插槽,以電性連接於伺服器。OCP 3.0介面插槽130配置於電路板110的另一端。U.2連接器120與OCP 3.0介面插槽130電性連接至電源轉換器114b。電源轉換器114b可用來將U.2介面的所需的電壓與OCP 3.0介面所需的電壓相互轉換,而使得U.2介面能夠提供OCP 3.0介面所需的電壓。Fig. 5 is a schematic diagram of a switching device according to an embodiment of the present invention. Please refer to FIG. 5, the adapter device 100 includes a circuit board 110, a power converter 114 b (FIG. 6 ), a U.2 connector 120 and an OCP 3.0 interface socket 130. The U.2 connector 120 is disposed at one end of the circuit board 110 and is suitable for being inserted into the U.2 interface socket of the server to be electrically connected to the server. The OCP 3.0 interface slot 130 is disposed at the other end of the circuit board 110. The U.2 connector 120 and the OCP 3.0 interface socket 130 are electrically connected to the power converter 114b. The power converter 114b can be used to convert the voltage required by the U.2 interface and the voltage required by the OCP 3.0 interface, so that the U.2 interface can provide the voltage required by the OCP 3.0 interface.

請回到圖3,網路卡30包括一網路接口32、一網卡晶片34及一OCP 3.0連接器36。網路接口32及OCP 3.0連接器36電性連接於網卡晶片34。一散熱器40配置於網卡晶片34上,以對網卡晶片34散熱。網路卡30透過OCP 3.0連接器36而可拆卸地插設在轉接裝置100的OCP 3.0介面插槽130。Please return to FIG. 3. The network card 30 includes a network interface 32, a network card chip 34 and an OCP 3.0 connector 36. The network interface 32 and the OCP 3.0 connector 36 are electrically connected to the network card chip 34. A heat sink 40 is disposed on the network card chip 34 to dissipate heat to the network card chip 34. The network card 30 is detachably inserted into the OCP 3.0 interface slot 130 of the adapter device 100 through the OCP 3.0 connector 36.

在本實施例中,網路卡30可透過轉接裝置100而連接至伺服器的U.2插槽。由於伺服器中會有很多個U.2插槽,使用者可視需求使用一個或多個本實施例的網路卡模組10,以進行網路卡30的擴充。相較於習知受限於伺服器上OCP 3.0插槽只有一到三個,而僅能連接一到三個網路卡,本實施例的網路卡模組10可插設在U.2插槽上,而能夠使外接的網路卡30的數量跟著U.2插槽的數量而擴增,大幅提升伺服器的網路能力。In this embodiment, the network card 30 can be connected to the U.2 slot of the server through the adapter device 100. Since there are many U.2 slots in the server, the user can use one or more of the network card modules 10 of this embodiment to expand the network card 30 according to needs. Compared with the conventional limitation that only one to three OCP 3.0 slots on the server can be connected to one to three network cards, the network card module 10 of this embodiment can be plugged into U.2. On the slot, the number of external network cards 30 can be increased with the number of U.2 slots, which greatly improves the network capability of the server.

另外,如圖3所示,網路卡模組10更包括一殼座20,轉接裝置100與網路卡30配置於殼座20上。殼座20具有一底板22及位於底板22相對兩側的兩側板26,而呈U型,以方便使用者從上方插拔網路卡30。底板22具有一定位部24,轉接裝置100固定於定位部。更具體地說,鎖固件會穿過電路板110而固定於定位部24,以將轉接裝置100固定於定位部。In addition, as shown in FIG. 3, the network card module 10 further includes a housing 20, and the adapter device 100 and the network card 30 are disposed on the housing 20. The housing 20 has a bottom plate 22 and two side plates 26 located on opposite sides of the bottom plate 22, and are U-shaped to facilitate the user to insert and remove the network card 30 from above. The bottom plate 22 has a positioning portion 24, and the adapter device 100 is fixed to the positioning portion. More specifically, the fastener passes through the circuit board 110 and is fixed to the positioning portion 24 to fix the adapter device 100 to the positioning portion.

在本實施例中,殼座20的尺寸符合一2.5吋硬碟托盤(tray)的尺寸,而適於如硬碟托盤一樣地插設在伺服器上。一般來說,伺服器的機殼上會有軌道,軌道的尺寸符合硬碟托盤的尺寸以方便拆裝。此外,若伺服器為2U或2U以上的伺服器,殼座20除水平插設之外還可直立插設,以在伺服器的前端或後端的有限空間擺放更多數量的硬碟。In this embodiment, the size of the housing base 20 conforms to the size of a 2.5-inch hard disk tray, and is suitable for being inserted on a server like a hard disk tray. Generally speaking, there are tracks on the chassis of the server, and the size of the track matches the size of the hard disk tray to facilitate disassembly. In addition, if the server is a 2U or more than 2U server, the housing 20 can be installed vertically in addition to being horizontally inserted, so that a larger number of hard disks can be placed in the limited space at the front or rear of the server.

在本實施例中,將網路卡模組10的殼座20設計為與硬碟托盤的尺寸接近或相同,而可直接應用伺服器的機殼上的軌道,伺服器端並不需要做任何修改。因此,網路卡模組10具有良好的相容性。並且,網路卡模組10可如同硬碟托盤一樣直立地插設在伺服器的機殼上,而相當節省空間。In this embodiment, the housing 20 of the network card module 10 is designed to be close to or the same size as the hard disk tray, and the track on the server housing can be directly applied, and the server does not need to do anything. modify. Therefore, the network card module 10 has good compatibility. In addition, the network card module 10 can be inserted upright on the chassis of the server like a hard disk tray, which saves space.

要說明的是,在其他實施例中,轉接裝置100也可以供其他具有OCP 3.0連接器36的裝置來插設,不以網路卡30為限制。It should be noted that in other embodiments, the adapter device 100 can also be inserted into other devices having the OCP 3.0 connector 36, and is not limited by the network card 30.

圖6是圖5的另一視角的示意圖。請參閱圖6,在本實施例中,轉接裝置100更包括一訊號中繼器114a及一電源轉換器114b。訊號中繼器114a及電源轉換器114b配置於電路板110,且電性連接於晶片12。訊號中繼器114a用來整頓波形以及強化訊號,電源轉換器114b用來對U.2介面的電壓與OCP 3.0介面的電壓進行轉換。舉例來說,可用來將U.2介面的5V電壓降至3.3V電壓,以供OCP 3.0介面運作。FIG. 6 is a schematic diagram of FIG. 5 from another perspective. Please refer to FIG. 6, in this embodiment, the switching device 100 further includes a signal repeater 114a and a power converter 114b. The signal repeater 114 a and the power converter 114 b are disposed on the circuit board 110 and are electrically connected to the chip 12. The signal repeater 114a is used to rectify the waveform and strengthen the signal, and the power converter 114b is used to convert the voltage of the U.2 interface and the voltage of the OCP 3.0 interface. For example, it can be used to reduce the 5V voltage of the U.2 interface to a 3.3V voltage for OCP 3.0 interface operation.

在本實施例中,電路板110可藉由選取適當的材料製作,例如絕緣層的材質,以降低高速訊號的衰減率。具體而言,電路板110可使用低損耗(Low Loss)等級以上的高速板材,一般來說,低損耗等級的填充用的基材用樹脂為特殊樹脂、改性環氧特殊樹脂,此外,若使用聚四氟乙烯(PTFE)樹脂、碳氫化物樹脂或聚氧二甲苯(PPE)樹脂等基材用樹脂,則可達到更低的衰減率。當然,電路板110的絕緣層的材質不以此為限制。In this embodiment, the circuit board 110 can be made by selecting appropriate materials, such as the material of the insulating layer, to reduce the attenuation rate of high-speed signals. Specifically, the circuit board 110 can use a high-speed board of a low loss (Low Loss) level or higher. Generally, the base resin for filling of the low loss level is a special resin or a modified epoxy special resin. In addition, if Using polytetrafluoroethylene (PTFE) resin, hydrocarbon resin, or polyoxyxylene (PPE) resin and other base resins can achieve a lower attenuation rate. Of course, the material of the insulating layer of the circuit board 110 is not limited by this.

此外,高速訊號線可佈線在電路板110的內層或外層,當高速訊號線佈線至電路板110的內層時,也可以藉由下面的設計,來降低高速訊號的衰減率。In addition, the high-speed signal line can be routed on the inner layer or the outer layer of the circuit board 110. When the high-speed signal line is routed to the inner layer of the circuit board 110, the following design can also be used to reduce the attenuation rate of the high-speed signal.

圖7是圖5的轉接裝置的電路板的局部剖面示意圖。請參閱圖7,在本實施例中,電路板110具有相對的一第一面111及一第二面113及凹陷於第二面113的一背鑽孔118。電路板110包括位於第一面111的一第一線路層115、位於電路板110的內部的一第二線路層117及連接於第一線路層115與第二線路層117的一導電貫孔116。FIG. 7 is a schematic partial cross-sectional view of the circuit board of the adapter device of FIG. 5. Please refer to FIG. 7. In this embodiment, the circuit board 110 has a first surface 111 and a second surface 113 opposite to each other, and a back hole 118 recessed in the second surface 113. The circuit board 110 includes a first circuit layer 115 located on the first surface 111, a second circuit layer 117 located inside the circuit board 110, and a conductive through hole 116 connected to the first circuit layer 115 and the second circuit layer 117 .

由圖7可見,背鑽孔118對應於導電貫孔116。導電貫孔116可以外露於背鑽孔118,或者,在一實施例中,導電貫孔116的底部可被一絕緣層覆蓋。在導電貫孔116的背後設置背鑽孔118的設計可避免導電貫孔116留有殘段,殘段會造成高速訊號衰減。上述設計可有效降低高速訊號的衰減率。因此,本實施例的轉接裝置100可有效傳遞高速訊號,而具有很低的訊號衰減率。It can be seen from FIG. 7 that the back drilling 118 corresponds to the conductive through hole 116. The conductive through hole 116 may be exposed to the back drilling 118, or, in one embodiment, the bottom of the conductive through hole 116 may be covered by an insulating layer. The design of setting the back drilling 118 behind the conductive through hole 116 can prevent the conductive through hole 116 from leaving residual sections, which may cause high-speed signal attenuation. The above design can effectively reduce the attenuation rate of high-speed signals. Therefore, the switching device 100 of this embodiment can effectively transmit high-speed signals with a very low signal attenuation rate.

綜上所述,本發明的轉接裝置可使具有OCP 3.0連接器的裝置插設至U.2插槽,而增加OCP 3.0裝置(例如是網路卡)的相容性與U.2插槽的使用率。相較於習知受限於伺服器上OCP 3.0插槽只有一到三個,而僅能連接一到三個網路卡,本發明的轉接裝置能夠使外接的OCP 3.0裝置的數量跟著U.2插槽的數量而擴增,大幅提升伺服器的網路能力。In summary, the adapter device of the present invention enables devices with OCP 3.0 connectors to be plugged into U.2 slots, and increases the compatibility of OCP 3.0 devices (such as network cards) with U.2 plugs. Slot usage rate. Compared with the conventional limitation that there are only one to three OCP 3.0 slots on the server, and only one to three network cards can be connected, the adapter device of the present invention can make the number of external OCP 3.0 devices follow U .2 The number of slots has been expanded, greatly improving the server's network capabilities.

10:網路卡模組 20:殼座 22:底板 24:定位部 26:側板 30:網路卡 32:網路接口 34:網卡晶片 36:OCP 3.0連接器 40:散熱器 100:轉接裝置 110:電路板 111:第一面 113:第二面 114a:訊號中繼器 114b:電源轉換器 115:第一線路層 116:導電貫孔 117:第二線路層 118:背鑽孔 120:U.2連接器 130:OCP 3.0介面插槽10: Network card module 20: Shell seat 22: bottom plate 24: Positioning department 26: side panel 30: network card 32: network interface 34: NIC chip 36: OCP 3.0 connector 40: radiator 100: Adapter 110: circuit board 111: The first side 113: The second side 114a: signal repeater 114b: power converter 115: first circuit layer 116: conductive through hole 117: second circuit layer 118: Back drilling 120: U.2 connector 130: OCP 3.0 interface slot

圖1是依照本發明的一實施例的一種網路卡模組的示意圖。 圖2是圖1的另一視角的示意圖。 圖3是圖1的***圖。 圖4是圖2的***圖。 圖5是依照本發明的一實施例的一種轉接裝置的示意圖。 圖6是圖5的另一視角的示意圖。 圖7是圖5的轉接裝置的電路板的局部剖面示意圖。 FIG. 1 is a schematic diagram of a network card module according to an embodiment of the invention. FIG. 2 is a schematic diagram of FIG. 1 from another perspective. Figure 3 is an exploded view of Figure 1. Figure 4 is an exploded view of Figure 2. Fig. 5 is a schematic diagram of a switching device according to an embodiment of the present invention. FIG. 6 is a schematic diagram of FIG. 5 from another perspective. FIG. 7 is a schematic partial cross-sectional view of the circuit board of the adapter device of FIG. 5.

10:網路卡模組 10: Network card module

20:殼座 20: Shell seat

22:底板 22: bottom plate

24:定位部 24: Positioning department

26:側板 26: side panel

30:網路卡 30: network card

32:網路接口 32: network interface

34:晶片 34: chip

36:OCP 3.0連接器 36: OCP 3.0 connector

40:散熱器 40: radiator

100:轉接裝置 100: Adapter

110:電路板 110: circuit board

120:U.2連接器 120: U.2 connector

130:OCP 3.0介面插槽 130: OCP 3.0 interface slot

Claims (8)

一種轉接裝置,包括: 一電路板; 一電源轉換器,配置於該電路板; 一U.2連接器,配置於該電路板的一端,且電性連接至該電源轉換器;以及 一OCP 3.0介面插槽,配置於該電路板的另一端,且電性連接至該電源轉換器。 A switching device, including: A circuit board; A power converter configured on the circuit board; A U.2 connector, configured at one end of the circuit board and electrically connected to the power converter; and An OCP 3.0 interface slot is disposed at the other end of the circuit board and is electrically connected to the power converter. 如申請專利範圍第1項所述的轉接裝置,更包括一訊號中繼器,配置於該電路板,且電性連接於該U.2連接器與該OCP 3.0介面插槽。The adapter device described in item 1 of the scope of patent application further includes a signal repeater disposed on the circuit board and electrically connected to the U.2 connector and the OCP 3.0 interface slot. 如申請專利範圍第1項所述的轉接裝置,其中該電路板具有相對的一第一面及一第二面及凹陷於該第二面的一背鑽孔,且包括位於該第一面的一第一線路層、位於該電路板的內部的一第二線路層及連接於該第一線路層與該第二線路層的一導電貫孔,該背鑽孔對應於該導電貫孔。The adapter device described in claim 1, wherein the circuit board has a first surface and a second surface opposite to each other, and a back hole recessed in the second surface, and includes the first surface A first circuit layer, a second circuit layer located inside the circuit board, and a conductive through hole connected to the first circuit layer and the second circuit layer, and the back drilling corresponds to the conductive through hole. 一種網路卡模組,適於插設至一伺服器的一U.2介面插槽,包括: 一轉接裝置,包括: 一電路板; 一電源轉換器,配置於該電路板; 一U.2連接器,配置於該電路板的一端,且電性連接至該電源轉換器,該U.2連接器適於插設至該伺服器的該U.2介面插槽,以電性連接於該伺服器;以及 一OCP 3.0介面插槽,配置於該電路板的另一端,且電性連接至該電源轉換器;以及 一網路卡,包括一OCP 3.0連接器,可拆卸地插設在該轉接裝置的該OCP 3.0介面插槽。 A network card module suitable for plugging into a U.2 interface slot of a server, including: A switching device, including: A circuit board; A power converter configured on the circuit board; A U.2 connector is disposed at one end of the circuit board and is electrically connected to the power converter. The U.2 connector is suitable for plugging into the U.2 interface slot of the server for electrical Sexually connect to the server; and An OCP 3.0 interface socket, which is disposed at the other end of the circuit board and is electrically connected to the power converter; and A network card includes an OCP 3.0 connector, which is detachably inserted into the OCP 3.0 interface slot of the adapter device. 如申請專利範圍第4項所述的網路卡模組,更包括一殼座,該轉接裝置與該網路卡配置於該殼座上,該殼座的尺寸符合一2.5吋硬碟托盤的尺寸,而適於插設在該伺服器上。For example, the network card module described in item 4 of the scope of patent application further includes a housing, and the adapter and the network card are arranged on the housing, and the size of the housing conforms to a 2.5-inch hard disk tray The size is suitable for plugging in the server. 如申請專利範圍第5項所述的網路卡模組,其中該殼座具有一底板及位於該底板相對兩側的兩側板,而呈U型,該底板具有一定位部,該轉接裝置固定於該定位部。For the network card module described in item 5 of the scope of patent application, the housing has a bottom plate and two side plates located on opposite sides of the bottom plate, and is U-shaped, the bottom plate has a positioning part, and the adapter device Fixed to the positioning part. 如申請專利範圍第4項所述的網路卡模組,其中該轉接裝置更包括一訊號中繼器,配置於該電路板,且電性連接於該U.2連接器與該OCP 3.0介面插槽。The network card module described in item 4 of the scope of patent application, wherein the adapter device further includes a signal repeater, which is arranged on the circuit board and is electrically connected to the U.2 connector and the OCP 3.0 Interface slot. 如申請專利範圍第4項所述的網路卡模組,其中該電路板具有相對的一第一面及一第二面及凹陷於該第二面的一背鑽孔,且包括位於該第一面的一第一線路層、位於該電路板的內部的一第二線路層及連接於該第一線路層與該第二線路層的一導電貫孔,該背鑽孔對應於該導電貫孔。The network card module according to claim 4, wherein the circuit board has a first surface and a second surface opposite to each other, and a back hole recessed in the second surface, and includes the A first circuit layer on one side, a second circuit layer located inside the circuit board, and a conductive through hole connected to the first circuit layer and the second circuit layer, and the back drill hole corresponds to the conductive through hole hole.
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Publication number Priority date Publication date Assignee Title
CN112765067A (en) * 2020-12-31 2021-05-07 西安易朴通讯技术有限公司 Hard disk backboard and mainboard assembling structure

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TWI566103B (en) * 2015-11-16 2017-01-11 宇瞻科技股份有限公司 Pcie bridge transformation device and method thereof
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Publication number Priority date Publication date Assignee Title
TWM346982U (en) * 2008-07-17 2008-12-11 Inventec Corp Power adapter
CN102902489A (en) * 2012-08-17 2013-01-30 杭州华澜微科技有限公司 Dual-interface memory controller and system thereof
TWI566103B (en) * 2015-11-16 2017-01-11 宇瞻科技股份有限公司 Pcie bridge transformation device and method thereof
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112765067A (en) * 2020-12-31 2021-05-07 西安易朴通讯技术有限公司 Hard disk backboard and mainboard assembling structure

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