TWI708896B - Centrifugal fan - Google Patents

Centrifugal fan Download PDF

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TWI708896B
TWI708896B TW108133440A TW108133440A TWI708896B TW I708896 B TWI708896 B TW I708896B TW 108133440 A TW108133440 A TW 108133440A TW 108133440 A TW108133440 A TW 108133440A TW I708896 B TWI708896 B TW I708896B
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Taiwan
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heat
ring
blades
centrifugal fan
heat conducting
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TW108133440A
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Chinese (zh)
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TW202113235A (en
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謝時昕
楊智凱
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英業達股份有限公司
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Abstract

A centrifugal fan includes a case and a fan. The case has a containing space and an inlet and an outlet connecting with the containing space. The fan locates in the containing space. The fan includes a hub, many blades and at least one heat guiding ring. The hub disposes on the case rotably. The blades connect with the outer edge of the hub. The at least one heat guiding ring connects the blades.

Description

離心式風扇Centrifugal fan

本發明係關於一種風扇,特別是一種離心式風扇。 The present invention relates to a fan, particularly a centrifugal fan.

隨著人們電腦使用習慣的改變,筆記型電腦已成為市面上的很重要的產品類型。筆記型電腦由於體積小且方便攜帶,人們常常會帶著筆記型電腦通勤,在辦公室做些文書處理,在咖啡店上網看些文章或影片,也有可能跟三五好友用筆記型電腦來打幾場電玩遊戲。如果使用者特別要求筆記型電腦在電玩遊戲的流暢度或者畫面細緻度,那麼需要將筆記型電腦備配更高階的處理器與顯示晶片。但是,更高階的處理器與顯示晶片伴隨著產生過多廢熱的問題,且筆記型電腦的體積受到限制,在散熱設計上往往不夠理想。 As people’s computer habits change, notebook computers have become a very important product type on the market. Because laptops are small and easy to carry, people often take laptops to commute to work, do some paperwork in the office, read some articles or videos on the Internet in coffee shops, and may also use laptops with friends to play a few times. Field video game. If the user particularly requires the fluency or screen detail of the notebook computer in video games, the notebook computer needs to be equipped with a higher-end processor and display chip. However, higher-end processors and display chips are accompanied by excessive waste heat generation, and the size of notebook computers is limited, and the heat dissipation design is often not ideal.

傳統上,有些筆記型電腦的內部設計有風扇,利用氣流將筆記型電腦內部的廢熱帶出。但是,隨著筆記型電腦的性能越來越優異,筆記型電腦所產生的廢熱也隨之劇增。因此傳統的氣冷式散熱設計將難以達到所需的散熱效果。 Traditionally, some notebook computers are designed with fans inside, which use airflow to remove waste heat inside the notebook computers. However, as the performance of notebook computers becomes more and more excellent, the waste heat generated by notebook computers also increases sharply. Therefore, the traditional air-cooled heat dissipation design will be difficult to achieve the required heat dissipation effect.

本發明在於提供一種離心式風扇,藉以提升離心式風扇的散熱效果。 The present invention is to provide a centrifugal fan, so as to improve the heat dissipation effect of the centrifugal fan.

本發明之一實施例所揭露之離心式風扇包含一外殼及一 扇葉。外殼具有一容置空間及連通容置空間的一進氣口及一出氣口。扇葉位於容置空間。扇葉包含一輪轂、多個葉片及至少一導熱環。輪轂可轉動地設置於外殼。這些葉片連接於輪轂之外周緣,至少一導熱環連接於這些葉片。 The centrifugal fan disclosed in an embodiment of the present invention includes a housing and a Fan leaves. The shell has an accommodating space and an air inlet and an air outlet communicating with the accommodating space. The fan blade is located in the accommodating space. The fan blade includes a hub, a plurality of blades and at least one heat conducting ring. The hub is rotatably arranged on the housing. The blades are connected to the outer periphery of the hub, and at least one heat conducting ring is connected to the blades.

根據上述實施例之離心式風扇,雖然這些導熱環與散熱架之導熱圈相分離,照理由相分離之導熱環與散熱架之導熱圈間的導熱方式應為熱對流,但因為導熱環與導熱圈的間距極小,使得當離心式風扇在運轉時,形成於導熱環之邊界層與形成於導熱圈之邊界層因極小間距而被破壞。也就是說,透過這些導熱環之設置,使得導熱環得以與散熱架之導熱圈間的導熱改為類似熱傳導的效果,進而進一步提升離心式風扇整體的散熱效能。 According to the centrifugal fan of the above embodiment, although these heat conducting rings are separated from the heat conducting ring of the heat sink, the heat conduction method between the separated heat conducting ring and the heat conducting ring of the heat sink should be thermal convection. The distance between the rings is extremely small, so that when the centrifugal fan is running, the boundary layer formed on the heat conducting ring and the boundary layer formed on the heat conducting ring are destroyed due to the extremely small distance. That is to say, through the arrangement of these heat-conducting rings, the heat conduction between the heat-conducting ring and the heat-conducting ring of the heat sink is changed to a similar heat conduction effect, thereby further improving the overall heat dissipation efficiency of the centrifugal fan.

以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

10:離心式風扇 10: Centrifugal fan

20:熱管 20: Heat pipe

30:散熱器 30: radiator

40:導熱架組 40: Heat conduction rack group

41:吸熱架 41: heat sink

42:散熱架 42: heat sink

50:熱源 50: heat source

100:外殼 100: shell

110:底板 110: bottom plate

120:蓋板 120: cover

200、200a、200b、200c:扇葉 200, 200a, 200b, 200c: fan blades

210、210a、210b、210c:輪轂 210, 210a, 210b, 210c: wheel hub

220、220a、220b、220c:葉片 220, 220a, 220b, 220c: blades

230、230a、230b、230c:導熱環 230, 230a, 230b, 230c: heat conducting ring

240、240a:靜音環 240, 240a: mute ring

250、250b:散熱環 250, 250b: cooling ring

421:基板 421: Substrate

422:導熱圈 422: heat conduction ring

C:凹槽 C: groove

S:容置空間 S: housing space

O1:進氣口 O1: Air inlet

O2:出氣口 O2: Outlet

圖1為根據本發明第一實施例所述之離心式風扇與熱管、散熱器及導熱架組的立體示意圖。 FIG. 1 is a three-dimensional schematic diagram of a centrifugal fan, heat pipe, radiator, and heat conducting rack assembly according to the first embodiment of the present invention.

圖2為沿圖1之2-2割面線所繪示的局部剖面示意圖。 Fig. 2 is a schematic partial cross-sectional view taken along the line 2-2 of Fig. 1.

圖3為圖1之離心式風扇之扇葉的立體示意圖。 Fig. 3 is a three-dimensional schematic diagram of the blade of the centrifugal fan of Fig. 1.

圖4為根據本發明第二實施例所述之離心式風扇之扇葉的立體示意圖。 Fig. 4 is a perspective schematic view of a fan blade of a centrifugal fan according to a second embodiment of the present invention.

圖5為圖4之局部剖面示意圖。 Fig. 5 is a schematic partial cross-sectional view of Fig. 4.

圖6為根據本發明第三實施例所述之離心式風扇之扇葉的立體示意圖。 Fig. 6 is a perspective view of a fan blade of a centrifugal fan according to a third embodiment of the present invention.

圖7為圖6之局部剖面示意圖。 Fig. 7 is a schematic partial cross-sectional view of Fig. 6.

圖8為根據本發明第四實施例所述之離心式風扇之扇葉的立體示意圖。 Fig. 8 is a three-dimensional schematic diagram of a fan blade of a centrifugal fan according to a fourth embodiment of the present invention.

圖9為圖8之局部剖面示意圖。 Fig. 9 is a schematic partial cross-sectional view of Fig. 8.

請參閱圖1至圖3。圖1為根據本發明第一實施例所述之離心式風扇與熱管、散熱器及導熱架組的立體示意圖。圖2為沿圖1之2-2割面線所繪示的局部剖面示意圖。圖3為圖1之離心式風扇之扇葉的立體示意圖。 Please refer to Figure 1 to Figure 3. FIG. 1 is a three-dimensional schematic diagram of a centrifugal fan, heat pipe, radiator, and heat conducting rack assembly according to the first embodiment of the present invention. Fig. 2 is a schematic partial cross-sectional view taken along the line 2-2 of Fig. 1. Fig. 3 is a three-dimensional schematic diagram of the blade of the centrifugal fan of Fig. 1.

本實施例之離心式風扇10適於與一熱管20、一散熱器30及一導熱架組40共同組成一散熱系統,且散熱系統適於熱耦合於一熱源50。熱源50例如為中央處理晶片、顯示晶片等高發熱元件。熱管20熱耦合於熱源50。散熱器30例如為散熱鰭片。散熱器30位於出氣口O2,並熱耦合於熱管20,以將熱源50所產生之熱量傳導至散熱器30,再透過離心式風扇10所產生之冷卻氣流將累積於散熱器30的熱量帶走。導熱架組40包含一吸熱架41及一散熱架42。吸熱架41用以供熱源50組裝,並與熱源50熱耦合。散熱架42裝設於離心式風扇10之外殼100並部分位於容置空間S內。散熱架42熱耦合於吸熱架41。如此一來,熱源50所產生之熱量除了可以透過熱管20傳導至散熱器30, 以藉由離心式風扇10之冷卻氣流帶走外,更可透過導熱架組40傳導至散熱架42,以同樣藉由離心式風扇10之冷卻氣流帶走。也就是說,除了傳統熱管20這條導熱路徑外,本實施例更增加了導熱架組40這條導熱路徑,以提升熱源50的散熱效率。 The centrifugal fan 10 of this embodiment is suitable for forming a heat dissipation system together with a heat pipe 20, a radiator 30 and a heat conducting frame group 40, and the heat dissipation system is suitable for thermally coupling to a heat source 50. The heat source 50 is, for example, a high heating element such as a central processing wafer and a display wafer. The heat pipe 20 is thermally coupled to the heat source 50. The heat sink 30 is, for example, a heat dissipation fin. The radiator 30 is located at the air outlet O2 and is thermally coupled to the heat pipe 20 to conduct the heat generated by the heat source 50 to the radiator 30, and then the heat accumulated in the radiator 30 is taken away by the cooling airflow generated by the centrifugal fan 10 . The heat conducting rack assembly 40 includes a heat absorption rack 41 and a heat dissipation rack 42. The heat absorption frame 41 is used for assembly of the heat source 50 and thermally coupled with the heat source 50. The heat dissipation frame 42 is installed in the casing 100 of the centrifugal fan 10 and is partially located in the accommodating space S. The heat dissipation frame 42 is thermally coupled to the heat absorption frame 41. In this way, the heat generated by the heat source 50 can be conducted to the radiator 30 through the heat pipe 20, It can be taken away by the cooling airflow of the centrifugal fan 10, and can be conducted to the heat sink 42 through the heat conducting rack assembly 40, and taken away by the cooling airflow of the centrifugal fan 10 as well. That is to say, in addition to the heat conduction path of the traditional heat pipe 20, this embodiment further adds the heat conduction path of the heat conduction frame assembly 40 to improve the heat dissipation efficiency of the heat source 50.

此外,散熱架42包含一基板421及多個導熱圈422。這些導熱圈422凸出於基板421。基板421疊設於底板110背向容置空間S之一側,且與下列之離心式風扇10之扇葉200間形成類似熱傳導之導熱效果,以透過導熱架組40將熱源50所產生的熱量傳導至離心式風扇10之扇葉200,再透過離心式風扇10所產生之氣流來將累積於扇葉200的熱量帶走。 In addition, the heat dissipation frame 42 includes a substrate 421 and a plurality of heat conducting rings 422. These heat conducting rings 422 protrude from the substrate 421. The base plate 421 is stacked on the side of the bottom plate 110 that faces away from the accommodating space S, and forms a heat conduction effect similar to heat conduction with the fan blades 200 of the centrifugal fan 10 below, so as to transfer the heat generated by the heat source 50 through the heat conducting frame group 40 The fan blade 200 conducted to the centrifugal fan 10 then takes away the heat accumulated in the fan blade 200 through the airflow generated by the centrifugal fan 10.

離心式風扇10包含一外殼100及一扇葉200。外殼100具有一容置空間S及連通容置空間S的一進氣口O1及一出氣口O2。具體來說,外殼100包含一底板110及一蓋板120。蓋板120組裝於底板110並共同圍繞出容置空間S及出氣口O2,且進氣口O1位於蓋板120。 The centrifugal fan 10 includes a casing 100 and a fan blade 200. The housing 100 has an accommodation space S and an air inlet O1 and an air outlet O2 communicating with the accommodation space S. Specifically, the housing 100 includes a bottom plate 110 and a cover plate 120. The cover 120 is assembled on the bottom plate 110 and collectively surrounds the accommodating space S and the air outlet O2, and the air inlet O1 is located on the cover 120.

扇葉200位於容置空間S。扇葉200包含一輪轂210、多個葉片220及多個導熱環230。輪轂210可轉動地設置於外殼100。這些葉片220連接於輪轂210之外周緣。多個導熱環230連接於這些葉片220,且這些導熱環230與散熱架42之這些導熱圈422相分離,但兩者之間的間距極小。由於這些導熱環230與散熱架42之導熱圈422相分離,照理由相分離之導熱環230與散熱架42之導熱圈422間的導熱方式應為熱對流,但因為導熱環230與導熱圈422的間距極小,使得當離心式 風扇10在運轉時,形成於導熱環230之邊界層與形成於導熱圈422之邊界層因極小間距而被破壞,進而讓導熱環230與導熱圈422的導熱方式改為類似熱傳導,進而讓導熱環230與導熱圈422間的導熱達到接近熱傳導的導熱效果。 The fan blade 200 is located in the accommodating space S. The fan blade 200 includes a hub 210, a plurality of blades 220 and a plurality of heat conducting rings 230. The hub 210 is rotatably disposed on the housing 100. These blades 220 are connected to the outer periphery of the hub 210. A plurality of heat-conducting rings 230 are connected to the blades 220, and the heat-conducting rings 230 are separated from the heat-conducting rings 422 of the heat sink 42, but the distance between the two is extremely small. Since these heat conduction rings 230 are separated from the heat conduction ring 422 of the heat dissipation frame 42, the heat conduction method between the heat conduction ring 230 and the heat conduction ring 422 of the heat dissipation frame 42 which are separated for the reason should be thermal convection, but because the heat conduction ring 230 and the heat conduction ring 422 The spacing is extremely small, which makes when centrifugal When the fan 10 is in operation, the boundary layer formed on the heat conducting ring 230 and the boundary layer formed on the heat conducting ring 422 are destroyed due to the extremely small distance, so that the heat conduction method of the heat conducting ring 230 and the heat conducting ring 422 is changed to be similar to thermal conduction, thereby allowing heat conduction The heat conduction between the ring 230 and the heat conducting ring 422 achieves a heat conduction effect close to heat conduction.

在本實施例中,至少一導熱環230連接於這些葉片220遠離進氣口O1之一側,但並不以此為限。在其他實施例中,若對應之散熱架之基板改裝設於外殼之頂板,則導熱環亦可連接於這些葉片靠近進氣口之一側。 In this embodiment, at least one heat conducting ring 230 is connected to the side of the blades 220 away from the air inlet O1, but it is not limited to this. In other embodiments, if the base plate of the corresponding heat sink is retrofitted to the top plate of the housing, the heat conducting ring can also be connected to the side of the blades near the air inlet.

在本實施例中,散熱環250連接於這些導熱環230靠近進氣口O1之一側,以加大扇葉200整體之散熱面積,以進一步提升離心式風扇10的散熱效率。 In this embodiment, the heat dissipation ring 250 is connected to one side of the heat conduction ring 230 close to the air inlet O1 to increase the heat dissipation area of the fan blade 200 as a whole, so as to further improve the heat dissipation efficiency of the centrifugal fan 10.

在本實施例中,靜音環240連接於這些葉片220靠近進氣口O1之一側,但並不以此為限。在其他實施例中,靜音環也可以連接於這些葉片遠離進氣口之一側。 In this embodiment, the silent ring 240 is connected to one side of the blades 220 close to the air inlet O1, but it is not limited to this. In other embodiments, the silent ring may also be connected to the side of the blades away from the air inlet.

在本實施例中,導熱環230的數量為多個,但並不以此為限。在其他實施例中,導熱環的數量也可以僅為單個。 In this embodiment, the number of heat conducting rings 230 is multiple, but it is not limited thereto. In other embodiments, the number of heat conducting rings can also be only a single one.

在本實施例中,靜音環240連接於這些葉片220遠離輪轂210之一側,即靜音環240連接於葉片220的最末端,但並不以此為限。在其他實施例中,靜音環的位置也可以連接於葉片之中段。 In this embodiment, the silent ring 240 is connected to the side of the blades 220 away from the hub 210, that is, the silent ring 240 is connected to the end of the blade 220, but it is not limited to this. In other embodiments, the position of the silent ring can also be connected to the middle section of the blade.

在本實施例中,這些葉片220遠離出氣口O2之一側各具有一凹槽C,至少一導熱環230位於凹槽C內。 In this embodiment, each of the blades 220 has a groove C on one side away from the air outlet O2, and at least one heat conducting ring 230 is located in the groove C.

在本實施例中,葉片220採有凹槽C之設計,但並不以 此為限。在其他實施例中,葉片亦可以採無凹槽之設計,以進一步增加葉片的受風面積。 In this embodiment, the blade 220 is designed with a groove C, but not This is limited. In other embodiments, the blades can also be designed without grooves to further increase the wind-receiving area of the blades.

上述實施例中,離心式風扇10之扇葉200同時包含了導熱環230、靜音環240及散熱環250之設計,但並不以此為限。請參閱圖4與圖5。圖4為根據本發明第二實施例所述之離心式風扇之扇葉的立體示意圖。圖5為圖4之局部剖面示意圖。在本實施例中,扇葉200a包含一輪轂210a、多個葉片220a、多個導熱環230a及一靜音環240a。這些葉片220a連接於輪轂210a之外周緣。多個導熱環230連接於這些葉片220a。靜音環240a連接於這些葉片220a靠近進氣口O1之一側。也就是說,本實施例之扇葉200a僅同時包含了導熱環230a與靜音環240a之設計。 In the above embodiment, the fan blade 200 of the centrifugal fan 10 includes the design of the heat conducting ring 230, the mute ring 240 and the heat dissipation ring 250 at the same time, but it is not limited to this. Please refer to Figure 4 and Figure 5. Fig. 4 is a perspective schematic view of a fan blade of a centrifugal fan according to a second embodiment of the present invention. Fig. 5 is a schematic partial cross-sectional view of Fig. 4. In this embodiment, the fan blade 200a includes a hub 210a, a plurality of blades 220a, a plurality of heat conducting rings 230a, and a silent ring 240a. These blades 220a are connected to the outer periphery of the hub 210a. A plurality of heat conducting rings 230 are connected to the blades 220a. The silent ring 240a is connected to one side of the blades 220a close to the air inlet O1. In other words, the fan blade 200a of this embodiment only includes the design of the heat conducting ring 230a and the silent ring 240a at the same time.

請參閱圖6與圖7。圖6為根據本發明第三實施例所述之離心式風扇之扇葉的立體示意圖。圖7為圖6之局部剖面示意圖。在本實施例中,扇葉200b包含一輪轂210b、多個葉片220b、多個導熱環230b及一散熱環250b。這些葉片220b連接於輪轂210b之外周緣。多個導熱環230b連接於這些葉片220b。散熱環250b連接於這些導熱環230b靠近進氣口O1之一側,以加大扇葉200b整體之散熱面積,而進一步提升離心式風扇10的散熱效率。也就是說,本實施例之扇葉200b僅同時包含了導熱環230b與散熱環250b之設計。 Please refer to Figure 6 and Figure 7. Fig. 6 is a perspective view of a fan blade of a centrifugal fan according to a third embodiment of the present invention. Fig. 7 is a schematic partial cross-sectional view of Fig. 6. In this embodiment, the fan blade 200b includes a hub 210b, a plurality of blades 220b, a plurality of heat conducting rings 230b, and a heat dissipation ring 250b. These blades 220b are connected to the outer periphery of the hub 210b. A plurality of heat conducting rings 230b are connected to the blades 220b. The heat dissipation ring 250b is connected to a side of the heat conduction ring 230b close to the air inlet O1 to increase the heat dissipation area of the fan blade 200b as a whole, thereby further improving the heat dissipation efficiency of the centrifugal fan 10. In other words, the fan blade 200b of this embodiment only includes the design of the heat conducting ring 230b and the heat dissipation ring 250b at the same time.

請參閱圖8與圖9。圖8為根據本發明第四實施例所述之離心式風扇之扇葉的立體示意圖。圖9為圖8之局部剖面示意圖。在本實施例中,扇葉200c包含一輪轂210c、多個葉片220c及多個導熱環230c。 這些葉片220c連接於輪轂210c之外周緣。多個導熱環230c連接於這些葉片220c。也就是說,本實施例之扇葉200c僅包含了導熱環230c之設計。 Please refer to Figure 8 and Figure 9. Fig. 8 is a three-dimensional schematic diagram of a fan blade of a centrifugal fan according to a fourth embodiment of the present invention. Fig. 9 is a schematic partial cross-sectional view of Fig. 8. In this embodiment, the fan blade 200c includes a hub 210c, a plurality of blades 220c, and a plurality of heat conducting rings 230c. These blades 220c are connected to the outer periphery of the hub 210c. A plurality of heat conducting rings 230c are connected to the blades 220c. In other words, the fan blade 200c of this embodiment only includes the design of the heat conducting ring 230c.

根據上述實施例之離心式風扇,雖然這些導熱環與散熱架之導熱圈相分離,照理由相分離之導熱環與散熱架之導熱圈間的導熱方式應為熱對流,但因為導熱環與導熱圈的間距極小,使得當離心式風扇在運轉時,形成於導熱環之邊界層與形成於導熱圈之邊界層因極小間距而被破壞。也就是說,透過這些導熱環之設置,使得導熱環得以與散熱架之導熱圈間的導熱改為類似熱傳導的效果,進而進一步提升離心式風扇整體的散熱效能。 According to the centrifugal fan of the above embodiment, although these heat conducting rings are separated from the heat conducting ring of the heat sink, the heat conduction method between the separated heat conducting ring and the heat conducting ring of the heat sink should be thermal convection. The distance between the rings is extremely small, so that when the centrifugal fan is running, the boundary layer formed on the heat conducting ring and the boundary layer formed on the heat conducting ring are destroyed due to the extremely small distance. That is to say, through the arrangement of these heat-conducting rings, the heat conduction between the heat-conducting ring and the heat-conducting ring of the heat sink is changed to a similar heat conduction effect, thereby further improving the overall heat dissipation efficiency of the centrifugal fan.

雖然本發明以前述之諸項實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed in the foregoing embodiments as described above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

200:扇葉 200: fan blade

210:輪轂 210: Wheel Hub

220:葉片 220: blade

230:導熱環 230: thermal ring

240:靜音環 240: Mute ring

250:散熱環 250: cooling ring

Claims (7)

一種離心式風扇,包含:一外殼,具有一容置空間及連通該容置空間的一進氣口及一出氣口;以及一扇葉,位於該容置空間,該扇葉包含一輪轂、多個葉片及至少一導熱環,該輪轂可轉動地設置於該外殼,該些葉片連接於該輪轂之外周緣,該至少一導熱環連接於該些葉片;其中該扇葉更包含一靜音環,該靜音環連接於該些葉片靠近該進氣口之一側。 A centrifugal fan includes: a housing with an accommodating space and an air inlet and an air outlet communicating with the accommodating space; and a fan blade located in the accommodating space, the fan blade including a hub, multiple Blades and at least one heat conducting ring, the hub is rotatably disposed on the shell, the blades are connected to the outer periphery of the hub, the at least one heat conducting ring is connected to the blades; wherein the fan blade further includes a silent ring, The silent ring is connected to a side of the blades close to the air inlet. 如申請專利範圍第1項所述之離心式風扇,其中該至少一導熱環連接於該些葉片遠離該進氣口之一側。 The centrifugal fan described in claim 1, wherein the at least one heat conducting ring is connected to a side of the blades away from the air inlet. 如申請專利範圍第2項所述之離心式風扇,其中該至少一導熱環的數量為多個。 In the centrifugal fan described in item 2 of the scope of patent application, the number of the at least one heat conducting ring is multiple. 如申請專利範圍第3項所述之離心式風扇,其中該扇葉更包含一散熱環,該散熱環連接於該些導熱環靠近該進氣口之一側。 According to the centrifugal fan described in item 3 of the scope of patent application, the fan blade further includes a heat dissipation ring connected to a side of the heat conducting rings close to the air inlet. 如申請專利範圍第1項所述之離心式風扇,其中該靜音環連接於該些葉片遠離該輪轂之一側。 The centrifugal fan described in item 1 of the scope of patent application, wherein the silent ring is connected to a side of the blades away from the hub. 如申請專利範圍第1項所述之離心式風扇,其中該些葉片遠離該出氣口之一側各具有一凹槽,該至少一導熱環位於該凹槽內。 In the centrifugal fan described in item 1 of the scope of patent application, each side of the blades away from the air outlet has a groove, and the at least one heat conducting ring is located in the groove. 如申請專利範圍第1項所述之離心式風扇,其中該外殼包含一底板及一蓋板,該蓋板組裝於該底板並共同圍繞出該容置空間,該扇葉可轉動地裝設於該底板。 For the centrifugal fan described in claim 1, wherein the housing includes a bottom plate and a cover plate, the cover plate is assembled on the bottom plate and collectively surrounds the accommodating space, and the fan blade is rotatably installed in The bottom plate.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002021782A (en) * 2000-07-05 2002-01-23 Toshiba Home Technology Corp Centrifugal fan
JP2008255865A (en) * 2007-04-04 2008-10-23 Matsushita Electric Ind Co Ltd Centrifugal fan device and electronic apparatus provided with same
JP2016102469A (en) * 2014-11-28 2016-06-02 ミネベア株式会社 Centrifugal fan
TW201640026A (en) * 2015-05-15 2016-11-16 力致科技股份有限公司 Centrifugal cooling fan
TWM535273U (en) * 2016-09-21 2017-01-11 宏碁股份有限公司 Airflow guide structure of fan
TW201917295A (en) * 2017-10-26 2019-05-01 宏碁股份有限公司 Heat dissipation fan

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002021782A (en) * 2000-07-05 2002-01-23 Toshiba Home Technology Corp Centrifugal fan
JP2008255865A (en) * 2007-04-04 2008-10-23 Matsushita Electric Ind Co Ltd Centrifugal fan device and electronic apparatus provided with same
JP2016102469A (en) * 2014-11-28 2016-06-02 ミネベア株式会社 Centrifugal fan
TW201640026A (en) * 2015-05-15 2016-11-16 力致科技股份有限公司 Centrifugal cooling fan
TWM535273U (en) * 2016-09-21 2017-01-11 宏碁股份有限公司 Airflow guide structure of fan
TW201917295A (en) * 2017-10-26 2019-05-01 宏碁股份有限公司 Heat dissipation fan

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