TWI707119B - Pipe type two-phase flow radiator - Google Patents
Pipe type two-phase flow radiator Download PDFInfo
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- TWI707119B TWI707119B TW108120110A TW108120110A TWI707119B TW I707119 B TWI707119 B TW I707119B TW 108120110 A TW108120110 A TW 108120110A TW 108120110 A TW108120110 A TW 108120110A TW I707119 B TWI707119 B TW I707119B
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- phase flow
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Abstract
Description
本發明係有關於散熱器,特別指一種管路型二相流散熱器。 The present invention relates to a radiator, in particular to a pipeline type two-phase flow radiator.
由於通訊設備的快速發展與應用,設備散熱的要求也愈發嚴格,而傳統鰭片式散熱器在有限的空間中已難以滿足散熱需求,解決這類散熱難題常常採用風扇強制對流,或者改為水冷。 Due to the rapid development and application of communication equipment, the requirements for heat dissipation of equipment have become more stringent. Traditional fin-type radiators have been unable to meet the heat dissipation requirements in limited spaces. To solve this kind of heat dissipation problems, forced convection of fans is often used, or instead Water-cooled.
然而,風扇強制對流需要充足的散熱空間安裝風扇並耗費電能,水冷散熱效果雖然較好,但是需要較大冷卻設備放置空間且成本較高。 However, forced convection of the fan requires sufficient heat dissipation space to install the fan and consumes electric energy. Although the water cooling effect is better, it requires a larger space for cooling equipment and higher cost.
因此,如何解決上述問題係為本領域研究人員所要努力的方向。 Therefore, how to solve the above problems is the direction that researchers in this field should strive for.
本發明之一目的係為,實現熱量在基座均勻分布且最大限度的利用散熱鰭片的散熱功能。 One purpose of the present invention is to realize the heat dissipation function of evenly distributing heat on the base and utilizing the heat dissipation fins to the maximum.
為達成上述之目的,本發明提供一種管路型二相流散熱器,係包含:一基座,具有一上側面及一下側面,該上側面設有複數散熱鰭片;及一管體,係嵌設於該下側面,該管體具有一第一側、一第二側及一儲液腔室透過至少一連接部連通至少一冷凝端,該管體的第二側及該基座的下側面齊平。 In order to achieve the above object, the present invention provides a pipeline type two-phase flow radiator, which includes: a base with an upper side and a lower side, the upper side is provided with a plurality of radiating fins; and a tube body, Embedded on the lower side surface, the tube body has a first side, a second side, and a liquid storage chamber communicated with at least one condensing end through at least one connecting portion, the second side of the tube body and the bottom of the base The sides are flush.
藉由本發明此設計,該儲液腔室可儲存較多的工作流體,將設有該儲液腔室的吸熱區貼設於一發熱源上,令大量的工作流體可以快速的吸收熱量並將熱 量傳遞至冷凝端,使發熱源的熱量不會集中在吸熱區,進而實現熱量在基座均勻分布且最大限度的利用散熱鰭片的散熱功能。 With this design of the present invention, the liquid storage chamber can store more working fluid, and the heat absorption area provided with the liquid storage chamber is attached to a heat source, so that a large amount of working fluid can quickly absorb heat and heat The amount of heat is transferred to the condensing end, so that the heat of the heating source will not be concentrated in the heat absorption area, thereby realizing the uniform distribution of heat in the base and the heat dissipation function of the heat dissipation fins to the maximum.
1:基座 1: base
11:上側面 11: upper side
12:下側面 12: Lower side
121:側邊 121: side
122:另一側邊 122: The other side
123:中央位置處 123: Central location
13:散熱鰭片 13: cooling fins
14:凹槽 14: Groove
141:開放側 141: open side
142:封閉側 142: closed side
143:吸熱區 143: Endothermic Zone
144:冷凝區 144: Condensing zone
2:管體 2: Tube body
21:第一側 21: First side
22:第二側 22: second side
23:儲液腔室 23: Liquid storage chamber
24:連接部 24: Connection part
25:冷凝端 25: Condensing side
26:除氣輸液管 26: Degassing infusion tube
27:內壁面 27: inner wall
28:毛細結構 28: Capillary structure
第1圖係為本發明管路型二相流散熱器之第一實施例之立體分解圖;第2圖係為本發明管路型二相流散熱器之第一實施例之立體分解圖另一視角;第3圖係為本發明管路型二相流散熱器之第一實施例之立體組合圖;第4圖係為本發明管路型二相流散熱器之第3圖A-A線剖視圖;第5圖係為本發明管路型二相流散熱器之第一實施例之基座剖視圖;第6圖係為本發明管路型二相流散熱器之第二實施例之立體組合圖;第7圖係為本發明管路型二相流散熱器之第二實施例之替代實施例示意圖;第8圖係為本發明管路型二相流散熱器之第三實施例之組合剖視圖。 Figure 1 is a perspective exploded view of the first embodiment of the pipeline-type two-phase flow radiator of the present invention; Figure 2 is a perspective exploded view of the first embodiment of the pipeline-type two-phase flow radiator of the present invention One perspective; Figure 3 is a three-dimensional assembly view of the first embodiment of the pipeline-type two-phase flow radiator of the present invention; Figure 4 is a cross-sectional view taken along line AA in Figure 3 of the pipeline-type two-phase flow radiator of the present invention Figure 5 is a cross-sectional view of the base of the first embodiment of the pipeline-type two-phase flow radiator of the present invention; Figure 6 is a perspective view of the second embodiment of the pipeline-type two-phase flow radiator of the present invention Figure 7 is a schematic diagram of an alternative embodiment of the second embodiment of the pipeline-type two-phase flow radiator of the present invention; Figure 8 is a combined cross-sectional view of the third embodiment of the pipeline-type two-phase flow radiator of the present invention .
本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。 The above-mentioned objects and structural and functional characteristics of the present invention will be described based on the preferred embodiments of the accompanying drawings.
請參考第1至5圖,係為本發明管路型二相流散熱器之第一實施例之立體分解圖、立體分解圖另一視角、立體組合圖、第3圖A-A線剖視圖及基座剖視圖,如圖所示,本發明所述管路型二相流散熱器係包含一基座1及一管體2。
Please refer to Figures 1 to 5, which are the three-dimensional exploded view, the three-dimensional exploded view, another perspective, the three-dimensional assembly view, the AA line cross-sectional view and the base of the first embodiment of the pipeline type two-phase flow radiator of the present invention As shown in the cross-sectional view, the pipeline-type two-phase flow radiator of the present invention includes a
該基座1具有一上側面11及一下側面12,該上側面11設有複數散熱鰭片13。
The
該管體2係嵌設於該下側面12,並該管體2具有一第一側21、一第二側22、一儲液腔室23、至少一連接部24、至少一冷凝端25、及一除氣輸液管26。
The
在本實施例中,該基座1的下側面12設有一凹槽14,該管體2可選擇為緊配、焊接、嵌合及膠合其中任一方式容設於該凹槽14內。該凹槽14係凹設在該下側面12,且其形狀係匹配該管體2的形狀所設計。該凹槽14具有一開放側141及一封閉側142、一吸熱區143及一冷凝區144。
In this embodiment, the
該儲液腔室23透過該連接部24連通該冷凝端25,該連接部24對應該冷凝端25設置的數量並不侷限,在本實施例中係表示為複數連接部24連通複數冷凝端25,在其他實施例中也可以表示為一個連接部24連通一個冷凝端25,並不引以為限。
The
該儲液腔室23對應設於該吸熱區143,並與該吸熱區143相互貼設,該冷凝端25對應設於該冷凝區144,並與該冷凝區144相互貼設;該管體2之第一側21貼附該封閉側142,該管體2之第二側22相對該開放側141,並該管體2的第二側22及該基座1的下側面12齊平(如第4圖所示)。
The
該除氣輸液管26接設並連通該儲液腔室23,該除氣輸液管26係用以抽除該儲液腔室23內部的非凝結氣體並抽真空,以及用以輸入一工作流體(未繪示),該工作流體選擇為氣相流體及氣液兩相變化流體其中任一。
The degassing
在本實施例中,該吸熱區143位於該下側面12的一側邊121,該冷凝區144朝該下側面12的另一側邊122延伸。
In this embodiment, the
藉由本發明此設計,由於該儲液腔室23的設置可儲存較多的工作流體,並將設有該儲液腔室23的吸熱區143貼設於一發熱源(未繪示)上,令大量的工作流體可以快速的吸收熱量並將熱量傳遞至冷凝端25,使發熱源的熱量不會集中在吸熱區143,進而實現熱量在基座1均勻分布且最大限度的利用散熱鰭片13的散熱功能。
With this design of the present invention, the
請參閱第6圖,係為本發明管路型二相流散熱器之第二實施例之立體組合圖,並輔以參閱第1至5圖,如圖所示,本實施例部分結構及功能係與上述第一實施例相同,故在此將不再贅述,惟本實施例與上述第一實施例之不同處係為,該吸熱區143位於該下側面12的一中央位置處123,該冷凝區144朝該下側面12的兩側邊121、122延伸,並該管體2對應該冷凝區144的形狀及數量延伸設置複數連接部24及複數冷凝端25。
Please refer to Figure 6, which is a three-dimensional assembly view of the second embodiment of the pipeline-type two-phase flow radiator of the present invention, supplemented by referring to Figures 1 to 5. As shown in the figure, part of the structure and function of this embodiment It is the same as the above-mentioned first embodiment, so it will not be repeated here. However, the difference between this embodiment and the above-mentioned first embodiment is that the
在一替代實施例中,請參第7圖,該冷凝區144朝該中央位置處123的四周延伸。
In an alternative embodiment, please refer to FIG. 7, the
請參閱第8圖,係為本發明管路型二相流散熱器之第三實施例之組合剖視圖,並輔以參閱第1至7圖,如圖所示,本實施例部分結構及功能係與上述第一、二、三實施例相同,故在此將不再贅述,惟本實施例與上述第一、二、三實施例之不同處係為,該管體2的一內壁面27設有一毛細結構28,該毛細結構28選擇為燒結體、網格體、纖維體、編織體或溝槽或前述之組合,當該管體2填充的工作流體為氣液兩相變化流體時,該工作流體在該儲液腔室23內吸熱蒸發後朝冷凝端25方向擴散,並在冷凝端25冷凝為液態,藉由該毛細結構28的毛細力使冷凝端25液態的工作流體快速回流至該儲液腔室23,降低該儲液腔室23內部乾燒的機率。
Please refer to Figure 8, which is a combined cross-sectional view of the third embodiment of the pipeline-type two-phase flow radiator of the present invention, supplemented by referring to Figures 1 to 7. As shown in the figure, part of the structure and function of this embodiment is It is the same as the first, second, and third embodiments described above, so it will not be repeated here. However, the difference between this embodiment and the first, second, and third embodiments described above is that an
以上已將本發明做一詳細說明,惟以上所述者,僅為本發明之一較佳實施例而已,當不能限定本發明實施之範圍。即凡依本發明申請範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍。 The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention and should not limit the scope of implementation of the present invention. That is to say, all equal changes and modifications made in accordance with the scope of application of the present invention should still be covered by the patent of the present invention.
1:基座 1: base
12:下側面 12: Lower side
121:側邊 121: side
122:另一側邊 122: The other side
13:散熱鰭片 13: cooling fins
143:吸熱區 143: Endothermic Zone
144:冷凝區 144: Condensing zone
2:管體 2: Tube body
23:儲液腔室 23: Liquid storage chamber
24:連接部 24: Connection part
25:冷凝端 25: Condensing side
26:除氣輸液管 26: Degassing infusion tube
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TW108120110A TWI707119B (en) | 2019-06-11 | 2019-06-11 | Pipe type two-phase flow radiator |
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TW202045883A TW202045883A (en) | 2020-12-16 |
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Citations (5)
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US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
TWM309147U (en) * | 2006-11-01 | 2007-04-01 | Shine Huan Entpr Co | Heat-sink device of CPU |
US20090260782A1 (en) * | 2008-04-17 | 2009-10-22 | Aavid Thermalloy, Llc | Heat sink base plate with heat pipe |
TWI334525B (en) * | 2004-08-10 | 2010-12-11 | ||
CN104470323A (en) * | 2013-09-17 | 2015-03-25 | 财团法人工业技术研究院 | Heat source device with pulse type heat dissipation |
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2019
- 2019-06-11 TW TW108120110A patent/TWI707119B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US6626233B1 (en) * | 2002-01-03 | 2003-09-30 | Thermal Corp. | Bi-level heat sink |
TWI334525B (en) * | 2004-08-10 | 2010-12-11 | ||
TWM309147U (en) * | 2006-11-01 | 2007-04-01 | Shine Huan Entpr Co | Heat-sink device of CPU |
US20090260782A1 (en) * | 2008-04-17 | 2009-10-22 | Aavid Thermalloy, Llc | Heat sink base plate with heat pipe |
CN104470323A (en) * | 2013-09-17 | 2015-03-25 | 财团法人工业技术研究院 | Heat source device with pulse type heat dissipation |
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