TWI706487B - Prober and operation method of prober - Google Patents

Prober and operation method of prober Download PDF

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TWI706487B
TWI706487B TW106110149A TW106110149A TWI706487B TW I706487 B TWI706487 B TW I706487B TW 106110149 A TW106110149 A TW 106110149A TW 106110149 A TW106110149 A TW 106110149A TW I706487 B TWI706487 B TW I706487B
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probe
height
tip
position detection
detector
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TW106110149A
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TW201806051A (en
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森敏郎
西田智哉
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日商東京精密股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates

Abstract

提供一種防止探針與探針位置檢測相機衝撞之探針機台及探針機台的操作方法。 Provides an operation method for a probe machine and a probe machine that prevents collision between the probe and the probe position detection camera.

一種探針機台10，係使探針25接觸於晶圓W的電極以進行檢查之探針機台10，其具備：探針位置檢測相機18，為進行晶圓的電極與探針25之相對的對位而檢測探針25的前端位置；探針高度檢測器20，與探針位置檢測相機18分開設置，檢測從作為探針位置檢測相機18的高度基準之基準面算起之探針的前端的高度；及第1高度調整機構21，依據探針高度檢測器20的檢測結果，改變從基準面算起之探針位置檢測相機18之高度。 A probe machine 10 is a probe machine 10 that makes the probe 25 contact the electrode of the wafer W for inspection. The probe machine 10 is provided with a probe position detection camera 18, which is used to perform the difference between the electrode of the wafer and the probe 25 Relative alignment detects the tip position of the probe 25; the probe height detector 20 is installed separately from the probe position detection camera 18, and detects the probe from the reference plane as the height reference of the probe position detection camera 18 And the first height adjustment mechanism 21, according to the detection result of the probe height detector 20, changes the height of the probe position detection camera 18 from the reference plane.

Description

探針機台及探針機台的操作方法 Probe machine and operation method of probe machine

本發明係有關一種進行被形成於半導體晶圓上的複數個晶片的電氣檢查之探針機台及其操作方法。 The present invention relates to a probe machine for electrical inspection of a plurality of wafers formed on a semiconductor wafer and an operating method thereof.

半導體製程中，於切割步驟藉由切割裝置將固定於切割框之圓板狀半導體晶圓切開分成複數個晶片(die)。在此切割步驟之前或之後進行檢查各晶片電氣特性之晶圓測試步驟，在此晶圓測試步驟中有使用探針機台。 In the semiconductor manufacturing process, the disc-shaped semiconductor wafer fixed to the dicing frame is cut into a plurality of dies by a dicing device in the dicing step. Before or after the dicing step, a wafer test step to check the electrical characteristics of each chip is performed. In this wafer test step, a probe machine is used.

在探針機台的晶圓測試步驟中，有必要使設於探針機台的探針卡的針(探針)的前端與晶圓正確地接觸。因此，作為在探針機台的晶圓測試步驟之前段階，有必要高精度檢測探針的前端與探針卡之相對的位置關係。 In the wafer test step of the probe tool, it is necessary to accurately contact the tip of the needle (probe) of the probe card provided in the probe tool with the wafer. Therefore, as a stage before the wafer test step of the probe tool, it is necessary to detect the relative positional relationship between the tip of the probe and the probe card with high accuracy.

作為此種技術，例如，提案有專利文獻1及專利文獻2所載的技術。 As such a technique, for example, techniques described in Patent Document 1 and Patent Document 2 are proposed.

就專利文獻1所載的技術而言，記載一種藉由將探針卡的探針從下方用顯微鏡(探針位置檢測相機)拍攝以 檢測探針之技術。專利文獻1所載的技術中，探針位置檢測相機係於Z軸方向升降驅動，使探針位置檢測相機的焦點對準探針的前端，進行探針的前端的位置之檢測。 With regard to the technique contained in Patent Document 1, it is described that the probe of the probe card is photographed from below with a microscope (probe position detection camera). Detection probe technology. In the technique described in Patent Document 1, the probe position detection camera is driven up and down in the Z-axis direction, and the focus of the probe position detection camera is aligned with the tip of the probe to detect the position of the tip of the probe.

就專利文獻2所載的技術而言，記載一種藉由以相機(探針位置檢測相機)檢測複數部位的探針的前端、檢測各探針的前端的高度而檢測探針卡的傾斜之技術。 The technique described in Patent Document 2 describes a technique for detecting the inclination of the probe card by detecting the tip of a plurality of probes with a camera (probe position detection camera) and detecting the height of the tip of each probe. .

先前技術文獻Prior art literature 專利文獻Patent literature

專利文獻1 日本專利特開2004-39752號公報 Patent Document 1 Japanese Patent Laid-Open No. 2004-39752

專利文獻2 日本專利特開2007-71824號公報 Patent Document 2 Japanese Patent Laid-Open No. 2007-71824

然而，就專利文獻1所記載的技術而言，在使探針位置檢測相機沿著Z軸方向上升時，因作業員的錯誤或輸錯資料等使探針位置檢測相機上升過度，而有發生探針與探針位置檢測相機衝撞之虞。 However, with the technology described in Patent Document 1, when the probe position detection camera is raised in the Z-axis direction, the probe position detection camera may be raised excessively due to an operator's error or incorrect data input. The probe may collide with the probe position detection camera.

例如，於交換探針卡後用探針位置檢測相機檢測探針的前端之情況，由於探針的長度或位置因探針卡之交換而改變，故有發生探針位置檢測相機與探針衝撞之情況。此外，探針卡係因應晶片及測定目的而存在各種的種類，而有探針卡之種類一改變，探針的長度就會改變之情況。 For example, after the probe card is exchanged, the probe position detection camera is used to detect the tip of the probe. Since the length or position of the probe changes due to the exchange of the probe card, collisions between the probe position detection camera and the probe may occur. The situation. In addition, there are various types of probe cards according to the wafer and the purpose of measurement. When the type of probe card is changed, the length of the probe may change.

又例如，雖由作業員(或使用者)對探針機台輸入構成資料或種類參數等之資訊，而使用其資訊使探針位置檢測相機上升，但有輸錯其資訊之情形。當資訊誤輸入時，導致依據其錯誤的資訊使探針位置檢測相機沿著Z軸方向上升，而有探針與探針位置檢測相機衝撞的情形。 For another example, although an operator (or user) inputs information such as constituent data or type parameters to the probe machine, and uses the information to raise the probe position detection camera, the information may be incorrectly entered. When the information is entered incorrectly, the probe position detection camera will rise along the Z axis based on the wrong information, and the probe may collide with the probe position detection camera.

又，在專利文獻2所記載的技術亦同樣有所謂探針與探針位置檢測相機發生衝撞之虞的問題。而且，探針的前端因為是利用探針位置檢測相機檢測，故需要探針位置檢測相機迄至對焦於探針的前端為止的時間，具有所謂探針機台的總處理量(through-put)降低之問題。 In addition, the technique described in Patent Document 2 also has the problem of a so-called collision between the probe and the probe position detection camera. Moreover, because the tip of the probe is detected by the probe position detection camera, it takes time for the probe position detection camera to focus on the tip of the probe, which has the so-called throughput of the probe machine. The problem of reduction.

本發明係有鑑於此種情事而完成者，其目的在於提供一種防止探針與探針位置檢測相機衝撞的探針機台及探針機台的操作方法。 The present invention was completed in view of this situation, and its purpose is to provide a probe machine and an operating method of the probe machine that prevent the probe from colliding with the probe position detection camera.

為達成上述目的，本發明的一態樣之探針機台，係使探針接觸於晶圓的電極以進行檢查之探針機台，其具備：探針位置檢測相機，為了進行晶圓的電極與探針之相對的對位而檢測探針的前端位置；探針高度檢測器，與探針位置檢測相機分開設置，檢測從作為探針位置檢測相機的高度基準之基準面算起之探針的前端的高度；及第1高度調整機構，依據探針高度檢測器的檢測結果，改變從基準面算起之探針位置檢測相機之高度。 In order to achieve the above-mentioned object, an aspect of the probe machine of the present invention is a probe machine that makes the probe contact the electrode of the wafer for inspection. It is equipped with a probe position detection camera for wafer inspection. The relative alignment of the electrode and the probe detects the tip position of the probe; the probe height detector is installed separately from the probe position detection camera, and the detection starts from the reference plane as the height reference of the probe position detection camera The height of the tip of the needle; and the first height adjustment mechanism, according to the detection result of the probe height detector, changes the height of the probe position detection camera from the reference plane.

依據本態樣，利用與探針位置檢測相機分開設置之探針高度檢測器檢測探針的前端的高度，依據所檢測之探針的前端的高度，利用第1高度調整機構改變探針位置檢測相機的高度。因此，由於本態樣即使是探針卡被調換或所輸入之資訊(構成資料、種類參數)有誤，仍會利用探針高度檢測器進行探針的前端的高度之測定，故探針的前端的高度被正確地檢測，可防止發生探針位置檢測相機與探針衝撞。 According to this aspect, the height of the tip of the probe is detected by the probe height detector installed separately from the probe position detection camera, and the probe position detection camera is changed by the first height adjustment mechanism according to the height of the tip of the probe to be detected the height of. Therefore, even if the probe card is replaced or the input information (configuration data, type parameter) is incorrect in this mode, the probe height detector is still used to measure the height of the tip of the probe, so the tip of the probe The height of the probe is correctly detected, which can prevent collision between the probe position detection camera and the probe.

較佳為，探針高度檢測器係接觸型檢測器，其具有與探針的前端接觸之接觸面，檢測探針的前端接觸於接觸面時之接觸面的高度作為探針的前端的高度。 Preferably, the probe height detector is a contact type detector, which has a contact surface that contacts the tip of the probe, and detects the height of the contact surface when the tip of the probe contacts the contact surface as the height of the tip of the probe.

依據本態樣，探針高度檢測器係具有接觸面且使接觸面接觸探針的前端，藉以檢測探針的前端的高度，故能更正確地快速檢測探針的前端的高度。 According to this aspect, the probe height detector has a contact surface and makes the contact surface contact the front end of the probe, thereby detecting the height of the front end of the probe, so that the height of the front end of the probe can be detected more accurately and quickly.

較佳為，探針高度檢測器具有檢測探針的前端朝向接觸面之接觸的線性可變差動變壓器。 Preferably, the probe height detector has a linear variable differential transformer that detects the contact of the tip of the probe toward the contact surface.

依據本態樣，可提升探針的前端對接觸面接觸的檢測精度。其結果，可提升從基準面算起之探針的前端的高度之測定精度。又，可精度佳地檢測伴隨於探針的前端朝向接觸面之接觸的接觸面之移動量(推入量)及伴隨於接觸的推壓力。 According to this aspect, the detection accuracy of the probe tip to the contact surface contact can be improved. As a result, the measurement accuracy of the height of the tip of the probe from the reference surface can be improved. In addition, it is possible to accurately detect the movement amount (pushing amount) of the contact surface accompanying the contact of the tip of the probe toward the contact surface and the pushing force accompanying the contact.

較佳為，探針高度檢測器係與探針位置檢測相機一體設置，探針高度檢測器之接觸面的高度，係設於比探針位置檢測相機的物鏡端部的高度還高的位置。 Preferably, the probe height detector is integrated with the probe position detection camera, and the height of the contact surface of the probe height detector is set at a position higher than the height of the objective lens end of the probe position detection camera.

依據本態樣，因為探針高度檢測器係與探針位置檢測相機一體設置，所以探針高度檢測器係藉由探針位置檢測相機的高度調整機構改變高度。藉此，本態樣係無需另外設置探針高度檢測器的高度調整機構，能減少高度調整機構數量以實現簡化高度調整機構之控制及簡化探針機台的製造。 According to this aspect, because the probe height detector is integrated with the probe position detection camera, the probe height detector changes the height by the height adjustment mechanism of the probe position detection camera. Thereby, in this aspect, there is no need to additionally provide a height adjustment mechanism for the probe height detector, and the number of height adjustment mechanisms can be reduced to simplify the control of the height adjustment mechanism and simplify the manufacture of the probe machine.

又，依據本態樣，因為探針高度檢測器之接觸面的高度係設於比探針位置檢測相機的高度還高的位置，所以在探針的前端衝撞探針位置檢測相機之前會接觸探針高度檢測器，故可防止發生探針位置檢測相機與探針的前端衝撞。 Also, according to this aspect, because the height of the contact surface of the probe height detector is set at a position higher than the height of the probe position detection camera, the probe tip will touch the probe before colliding with the probe position detection camera The height detector prevents collision between the probe position detection camera and the tip of the probe.

較佳為，探針高度檢測器的接觸面，係設於比在探針位置檢測相機的高度再加上探針位置檢測相機的作業距離(working-distance)後的高度還低的位置。 Preferably, the contact surface of the probe height detector is set at a position lower than the height of the probe position detection camera plus the working-distance of the probe position detection camera.

依據本態樣，探針高度檢測器之接觸面的高度係設置於比在探針位置檢測相機的高度再加上探針位置檢測相機的作業距離後之高度還低的位置。因此，本態樣為， 在探針位置檢測相機檢測探針的前端時，防止探針高度檢測器接觸探針的前端而妨礙探針位置檢測相機之檢測動作。 According to this aspect, the height of the contact surface of the probe height detector is set at a position lower than the height of the probe position detection camera plus the working distance of the probe position detection camera. Therefore, this state is, When the probe position detection camera detects the tip of the probe, it prevents the probe height detector from contacting the tip of the probe and hinders the detection operation of the probe position detection camera.

較佳為，探針高度檢測器係與探針位置檢測相機獨立地設置，且更具備改變從基準面算起之探針高度檢測器的高度之第2高度調整機構。 Preferably, the probe height detector is installed separately from the probe position detection camera, and further includes a second height adjustment mechanism for changing the height of the probe height detector from the reference plane.

依據本態樣，探針高度檢測器係與探針位置檢測相機獨立地設置，且具備使探針高度檢測器的高度改變之高度調整機構。因此，本態樣中，探針高度檢測器與探針位置檢測相機是獨立地調整高度，故能效率佳地檢測探針的前端的高度。 According to this aspect, the probe height detector is installed independently of the probe position detection camera, and has a height adjustment mechanism that changes the height of the probe height detector. Therefore, in this aspect, the height of the probe height detector and the probe position detection camera are adjusted independently, so the height of the tip of the probe can be detected efficiently.

較佳為，前述探針高度檢測器為接觸型，且探針機台更具備依據利用前述探針高度檢測器進行之複數次的檢測結果，檢測設於探針機台的探針卡的傾斜之控制部。此外，較佳為，探針高度檢測器係具有與探針的前端接觸之接觸面且以前述探針的前端接觸接觸面時之接觸面的高度作為探針的前端的高度作檢測，對從作為探針的前端的高度之基準的基準面算起之探針的前端的高度作複數次檢測。 Preferably, the probe height detector is a contact type, and the probe machine is further equipped to detect the inclination of the probe card provided in the probe machine based on the results of multiple inspections performed by the probe height detector. The control department. In addition, it is preferable that the probe height detector has a contact surface in contact with the tip of the probe and uses the height of the contact surface when the tip of the probe contacts the contact surface as the height of the tip of the probe to detect The height of the tip of the probe from the reference plane, which is the reference for the height of the tip of the probe, is detected multiple times.

較佳為，探針高度檢測器係具有與探針的前端接觸的接觸面及檢測探針的前端接觸接觸面之線性可變差動 變壓器，以探針的前端接觸於接觸面時之接觸面的高度作為探針的前端的高度檢測。 Preferably, the probe height detector has a contact surface contacting the front end of the probe and a linear variable differential of the front end contact contact surface of the detection probe For transformers, the height of the contact surface when the tip of the probe contacts the contact surface is used as the height of the tip of the probe.

本發明其他態樣之探針機台的操作方法，係使探針接觸於晶圓的電極以進行檢查之探針機台的操作方法，包含：使用與探針位置檢測相機分開設置的探針高度檢測器，檢測從作為探針位置檢測相機的高度基準之基準面算起之探針的前端的高度之第1高度檢測步驟；依據探針高度檢測器的檢測結果，改變從基準面算起之探針位置檢測相機的高度之步驟；及使用探針位置檢測相機檢測探針的前端位置，用以進行晶圓的電極與探針之相對的對位之步驟。 Another aspect of the operation method of the probe machine of the present invention is the operation method of the probe machine that makes the probe contact the electrode of the wafer for inspection, including: using a probe that is installed separately from the probe position detection camera The height detector is the first height detection step of detecting the height of the tip of the probe from the reference plane which is the height reference of the probe position detection camera; according to the detection result of the probe height detector, change from the reference plane The probe position detection camera is used to detect the height of the camera; and the probe position detection camera is used to detect the tip position of the probe to perform the step of aligning the electrode of the wafer with the probe.

較佳為，在第1高度檢測步驟，使用探針高度檢測器，檢測探針的前端的高度，探針高度檢測器具有與探針的前端接觸之接觸面、及檢測探針的前端朝向接觸面之接觸的線性可變差動變壓器。 Preferably, in the first height detection step, a probe height detector is used to detect the height of the tip of the probe, the probe height detector has a contact surface that contacts the tip of the probe, and the tip of the detection probe faces the contact Linear variable differential transformer with surface contact.

較佳為，探針高度檢測器係接觸型，第1高度檢測步驟中，使用接觸型探針高度檢測器，對探針的前端的高度作複數次檢測，探針機台的操作方法更包含依據在第1高度檢測步驟之檢測結果，檢測探針卡的傾斜之傾斜檢測步驟。此外，較佳為，第1高度檢測步驟係使用具有與探針的前端接觸之接觸面且以探針的前端接觸於接觸面時之接觸面的高度作為探針的前端的高度來進行 檢測之接觸型探針高度檢測器，對從成為探針的前端的高度之基準的基準面算起之探針的前端的高度作複數次檢測。 Preferably, the probe height detector is a contact type. In the first height detection step, the contact probe height detector is used to detect the height of the tip of the probe several times. The operation method of the probe machine further includes Based on the detection result in the first height detection step, the tilt detection step of detecting the tilt of the probe card. In addition, it is preferable that the first height detection step is performed using a contact surface that is in contact with the tip of the probe, and the height of the contact surface when the tip of the probe is in contact with the contact surface is used as the height of the tip of the probe. The contact-type probe height detector for detection detects the height of the tip of the probe from a reference plane that serves as a reference for the height of the tip of the probe multiple times.

依據本態樣，因為探針卡所具有之探針的前端之檢測是利用探針高度檢測器來進行，所以無需與探針的前端對焦之時間，可防止探針機台的總處理量降低。 According to this aspect, because the detection of the tip of the probe of the probe card is performed by the probe height detector, there is no need for time to focus on the tip of the probe, which prevents the total throughput of the probe machine from decreasing.

較佳為，探針機台的操作方法更具備使用與探針高度檢測器一體設置之探針位置檢測相機，對從基準面算起之探針的前端的高度作複數次檢測之第2高度檢測步驟，傾斜檢測步驟係依據在第1高度檢測步驟的檢測結果及在第2高度檢測步驟的檢測結果，檢測探針卡的傾斜。 Preferably, the operation method of the probe machine is further equipped with a probe position detection camera integrated with the probe height detector to detect the height of the tip of the probe from the reference plane multiple times as the second height In the detection step, the tilt detection step detects the tilt of the probe card based on the detection result in the first height detection step and the detection result in the second height detection step.

依據本態樣，因為使用與探針高度檢測器一體設置的探針位置檢測相機檢測探針的前端高度，所以探針高度檢測器與探針位置檢測相機係藉由相同高度調整機構進行高度調整，故高度調整之控制更為簡化。 According to this aspect, because the probe position detection camera integrated with the probe height detector is used to detect the tip height of the probe, the probe height detector and the probe position detection camera are height-adjusted by the same height adjustment mechanism. Therefore, the control of height adjustment is simplified.

又，依據本態樣，因為傾斜檢測步驟係利用第1高度檢測步驟與第2高度檢測步驟之檢測結果來檢測探針卡的傾斜，故可進行更高精度之探針卡的傾斜的檢測。 Furthermore, according to this aspect, because the tilt detection step uses the detection results of the first height detection step and the second height detection step to detect the tilt of the probe card, it is possible to detect the tilt of the probe card with higher accuracy.

較佳為，第1高度檢測步驟係先於第2高度檢測步驟進行。 Preferably, the first height detection step is performed before the second height detection step.

較佳為，在第1高度檢測步驟中，使用具有接觸於探針的前端之接觸面及檢測探針的前端朝向接觸面之接觸的線性可變差動變壓器之探針高度檢測器，以探針的前端接觸於接觸面時之接觸面的高度作為探針的前端的高度進行檢測。 Preferably, in the first height detection step, a probe height detector of a linear variable differential transformer with a contact surface contacting the tip of the probe and a contact surface of the detection probe facing the contact surface is used to detect The height of the contact surface when the tip of the needle contacts the contact surface is detected as the height of the tip of the probe.

依據本態樣，可提升探針的前端對接觸面之接觸的檢測精度。其結果，可提升從基準面算起之探針的前端的高度之測定精度。又，可精度佳地檢測伴隨於探針的前端朝向接觸面之接觸的接觸面之移動量(推入量)及伴隨於接觸的推壓力。 According to this aspect, the detection accuracy of the contact between the tip of the probe and the contact surface can be improved. As a result, the measurement accuracy of the height of the tip of the probe from the reference surface can be improved. In addition, it is possible to accurately detect the movement amount (pushing amount) of the contact surface accompanying the contact of the tip of the probe toward the contact surface and the pushing force accompanying the contact.

依據本態樣，因為是在利用藉實體接觸而檢測探針的前端的高度之探針高度檢測器來檢測探針的前端的高度之步驟後，使用探針位置檢測相機檢測探針的前端的高度，故可一邊防止探針位置檢測相機衝撞探針一邊檢測探針卡的傾斜。 According to this aspect, after the step of detecting the height of the tip of the probe using the probe height detector that detects the height of the tip of the probe by physical contact, the tip position detection camera is used to detect the height of the tip of the probe , It can detect the tilt of the probe card while preventing the probe position detection camera from colliding with the probe.

依據本發明，因為設有探針位置檢測相機及與探針位置檢測相機分開設置的探針高度檢測器，且第1高度調整機構係依據探針高度檢測器所檢測之探針的前端的 高度，使探針位置檢測相機的高度改變，故可防止發生探針位置檢測相機與探針衝撞。 According to the present invention, the probe position detection camera and the probe height detector provided separately from the probe position detection camera are provided, and the first height adjustment mechanism is based on the tip of the probe detected by the probe height detector. The height changes the height of the probe position detection camera, so it can prevent the probe position detection camera from colliding with the probe.

10‧‧‧探針機台 10‧‧‧Probe machine

11‧‧‧基台 11‧‧‧Abutment

12‧‧‧移動座 12‧‧‧Mobile seat

13‧‧‧Y軸移動台 13‧‧‧Y-axis moving stage

14‧‧‧X軸移動台 14‧‧‧X axis moving table

15‧‧‧旋轉部 15‧‧‧Rotating part

16‧‧‧晶圓夾盤 16‧‧‧Wafer Chuck

18‧‧‧探針位置檢測相機 18‧‧‧Probe position detection camera

18a‧‧‧物鏡 18a‧‧‧Objective lens

19‧‧‧晶圓校準相機 19‧‧‧Wafer alignment camera

20、100‧‧‧探針高度檢測器 20, 100‧‧‧Probe height detector

20a‧‧‧接觸面 20a‧‧‧Contact surface

20b‧‧‧感測機構 20b‧‧‧Sensing mechanism

21‧‧‧高度調整機構 21‧‧‧Height adjustment mechanism

22‧‧‧探針頭平台 22‧‧‧Probe head platform

23‧‧‧探針卡保持器 23‧‧‧Probe card holder

24‧‧‧探針卡 24‧‧‧Probe card

25‧‧‧探針 25‧‧‧Probe

27‧‧‧高度調整機構 27‧‧‧Height adjustment mechanism

29‧‧‧臂部 29‧‧‧Arm

30‧‧‧測試器 30‧‧‧Tester

31‧‧‧測試器本體 31‧‧‧Tester body

32‧‧‧接觸環 32‧‧‧Contact ring

60‧‧‧控制部 60‧‧‧Control Department

61‧‧‧顯示部 61‧‧‧Display

62‧‧‧輸入部 62‧‧‧Input Department

100‧‧‧晶圓測試系統 100‧‧‧Wafer Test System

106‧‧‧線性可變差動變壓器(LVDT) 106‧‧‧Linear Variable Differential Transformer (LVDT)

W‧‧‧晶圓 W‧‧‧wafer

圖1係顯示晶圓測試系統之概略構成圖。 Figure 1 shows a schematic configuration diagram of the wafer test system.

圖2係表示僅以探針位置檢測相機檢測探針的前端的高度之情況的概念圖。 Fig. 2 is a conceptual diagram showing a case where only the probe position detection camera detects the height of the tip of the probe.

圖3係有關藉探針高度檢測器所進行之探針的前端的高度檢測之說明圖。 Fig. 3 is an explanatory diagram of the height detection of the tip of the probe performed by the probe height detector.

圖4係將輸入於控制部的資訊及從控制部輸出的資訊連同功能塊一起作概念性地表示的圖。 4 is a diagram conceptually showing information input to the control unit and information output from the control unit together with functional blocks.

圖5係顯示探針機台的操作方法之流程圖。 Figure 5 is a flowchart showing the operation method of the probe machine.

圖6係顯示探針機台的其他操作方法之流程圖。 Figure 6 is a flow chart showing other operation methods of the probe machine.

圖7係顯示晶圓測試系統之概略構成圖。 Fig. 7 shows a schematic configuration diagram of the wafer test system.

圖8係有關探針的前端的高度檢測之說明圖。 Fig. 8 is an explanatory diagram for detecting the height of the tip of the probe.

圖9係有關探針卡保持器或探針卡的傾斜檢測之說明圖。 Fig. 9 is an explanatory diagram of the probe card holder or the tilt detection of the probe card.

圖10係顯示藉探針高度檢測器檢測探針卡的傾斜之圖。 Figure 10 is a diagram showing the detection of the tilt of the probe card by the probe height detector.

圖11係將輸入於控制部的資訊及從控制部輸出的資訊連同功能塊一起作概念性地表示的圖。 FIG. 11 is a diagram conceptually showing information input to the control unit and information output from the control unit together with functional blocks.

圖12係顯示藉探針位置檢測相機檢測探針卡的傾斜之圖。 Fig. 12 shows a view of detecting the tilt of the probe card by the probe position detection camera.

圖13係顯示檢測傾斜的程序之流程圖。 Fig. 13 is a flowchart showing the procedure for detecting tilt.

圖14係用以說明其他實施形態涉及之探針高度檢測器之說明圖。 Fig. 14 is an explanatory diagram for explaining a probe height detector according to another embodiment.

以下，依據所附上的圖面，針對本發明較佳實施形態作說明。 Hereinafter, the preferred embodiments of the present invention will be described based on the attached drawings.

<第1實施形態> <First Embodiment>

圖1係顯示本發明所適用之晶圓測試系統的第1實施形態之概略構成圖。如同一圖所示，晶圓測試系統100係以使探針25接觸晶圓W上的各晶片的電極的探針機台10、及與探針25電性連接且為進行電氣檢查而施加電流或電壓於各晶片以測定特性之測試器30所構成。 FIG. 1 is a schematic configuration diagram showing the first embodiment of the wafer test system to which the present invention is applied. As shown in the same figure, the wafer test system 100 uses a probe tool 10 that makes probes 25 contact the electrodes of each wafer on the wafer W, and is electrically connected to the probes 25 and applies current for electrical inspection. Or, it is constituted by a tester 30 whose voltage is applied to each chip to measure the characteristics.

探針機台10具有：基台11；設於其上的移動座12；Y軸移動台13；X軸移動台14；Z軸移動/旋轉部15；晶圓夾盤16；探針位置檢測相機18；探針高度檢測器20，高度調整機構21、27；晶圓校準相機19；探針頭平台22；設於探針頭平台22的探針卡保持器23；安裝於探針卡保持器23的探針卡24；控制探針機台10及測試器30的各部分的控制部60(電腦)。在探針卡24設有探針25。 The probe machine 10 has: a base 11; a moving base 12 provided on it; a Y-axis moving table 13; an X-axis moving table 14; a Z-axis moving/rotating part 15; a wafer chuck 16; probe position detection Camera 18; probe height detector 20, height adjustment mechanism 21, 27; wafer calibration camera 19; probe head platform 22; probe card holder 23 provided on the probe head platform 22; mounted on the probe card holder The probe card 24 of the device 23; the control unit 60 (computer) that controls the various parts of the probe machine 10 and the tester 30. The probe card 24 is provided with a probe 25.

移動座12、Y軸移動台13、X軸移動台14、及Z軸移動/旋轉部15係構成使晶圓夾盤16繞3軸方向及繞Z軸旋轉的移動旋轉機構。由於移動旋轉機構係廣為所悉，故此處省略說明。 The moving base 12, the Y-axis moving table 13, the X-axis moving table 14, and the Z-axis moving/rotating unit 15 constitute a moving and rotating mechanism that rotates the wafer chuck 16 around the 3-axis direction and around the Z axis. Since the moving and rotating mechanism is widely known, the description is omitted here.

晶圓夾盤16係將形成有複數個晶片的晶圓W藉由真空吸附來保持，且在晶圓夾盤16的內部，以高溫狀態例如最高為150℃、或低溫狀態例如最低為-40℃下可進行晶片之電氣特性檢查的方式設置作為加熱/冷卻源的加熱/冷卻機構(加熱冷卻機構)。作為加熱/冷卻機構，可採用公知的適宜的加熱器/冷卻器，例如，可考慮作成面加熱器的加熱層與設有冷卻流體的通路的冷卻層之雙層構造或於熱傳導體內埋設將加熱器捲繞的冷卻管之一層構造的加熱/冷卻裝置等各式各樣者。又，亦可不是電氣加熱而是使熱流體循環者，且亦可使用帕耳帖元件。 The wafer chuck 16 holds the wafer W on which a plurality of wafers are formed by vacuum suction, and the inside of the wafer chuck 16 is in a high temperature state, for example, a maximum of 150° C., or a low temperature state, for example, a minimum of -40 A heating/cooling mechanism (heating and cooling mechanism) as a heating/cooling source can be installed in a way that the electrical characteristics of the wafer can be inspected at ℃. As the heating/cooling mechanism, a well-known suitable heater/cooler can be used. For example, a double-layer structure of a heating layer of a surface heater and a cooling layer provided with a passage for cooling fluid can be considered, or it can be embedded in a heat conducting body to heat Various types of heating/cooling devices with one-layer structure of the cooling pipe wound around the device. In addition, it is possible to circulate hot fluid instead of electric heating, and a Peltier element may also be used.

晶圓夾盤16係被安裝於Z軸移動/旋轉部15之上，藉由上述之移動旋轉機構可移動於3軸方向(X、Y、Z軸方向)，且可在繞Z軸的旋轉方向(θ方向)旋轉。 The wafer chuck 16 is mounted on the Z-axis moving/rotating part 15, and can be moved in three-axis directions (X, Y, Z-axis directions) by the above-mentioned moving and rotating mechanism, and can rotate around the Z-axis Direction (theta direction) rotation.

在供保持晶圓W的晶圓夾盤16上方配置有探針卡24。探針卡24裝設有探針卡保持器23，其被安裝於構成探針機台10的框體的頂板之探針頭平台22的開口部。 A probe card 24 is arranged above the wafer chuck 16 where the wafer W is held. The probe card 24 is equipped with a probe card holder 23 which is attached to the opening of the probe head platform 22 of the top plate of the housing of the probe machine table 10.

探針卡24係具有因應於要檢查的晶片的電極配置而配置的探針25，因應於要檢查的晶片而作交換。此外，探針卡24係探針保持部的一例。 The probe card 24 has probes 25 arranged in accordance with the electrode configuration of the wafer to be inspected, and exchanged in accordance with the wafer to be inspected. In addition, the probe card 24 is an example of a probe holder.

測試器30備有測試器本體31、及設於測試器本體31的接觸環32。在探針卡24設有與各探針25連接的端子，接觸環32係具有以和此端子接觸的方式配置的彈簧探針。測試器本體31係藉未圖示的支持機構而對探針機台10保持。 The tester 30 is provided with a tester body 31 and a contact ring 32 provided on the tester body 31. The probe card 24 is provided with terminals connected to the probes 25, and the contact ring 32 has spring probes arranged so as to be in contact with the terminals. The tester main body 31 is held by the probe machine 10 by a supporting mechanism not shown.

探針位置檢測相機18係為進行晶圓W的電極與探針25之相對的對位而檢測探針25的前端的位置。探針位置檢測相機18係安裝於X軸移動台14之上，藉X軸移動台14及Y軸移動台13而與晶圓夾盤16成為一體並可在XY方向移動。又，探針位置檢測相機18在Z軸方向的升降驅動係藉由被控制部60所控制之高度調整機構21來進行。探針位置檢測相機18係將探針卡24的探針25從下方拍攝以檢測探針25的前端位置。探針25的前端的水平面內的位置(X及Y座標)係藉相機的座標所檢出，垂直方向(Z軸方向)的位置，亦即探針25的前端的高度(測定高度)係在相機的焦點位置被檢出。利用探針位置檢測相機18的檢測結果被輸入於控制部60。探針位置檢測相機18係使用包含備有例如物鏡18a的針對位顯微鏡之相機(參照圖2)。 The probe position detection camera 18 detects the position of the tip of the probe 25 in order to align the electrode of the wafer W and the probe 25 facing each other. The probe position detection camera 18 is installed on the X-axis moving stage 14 and is integrated with the wafer chuck 16 by the X-axis moving stage 14 and the Y-axis moving stage 13 and can move in the XY direction. In addition, the elevation drive of the probe position detection camera 18 in the Z-axis direction is performed by the height adjustment mechanism 21 controlled by the control unit 60. The probe position detection camera 18 photographs the probe 25 of the probe card 24 from below to detect the tip position of the probe 25. The position in the horizontal plane (X and Y coordinates) of the tip of the probe 25 is detected by the coordinates of the camera, and the position in the vertical direction (Z axis direction), that is, the height of the tip of the probe 25 (measured height) is The focus position of the camera is detected. The detection result by the probe position detection camera 18 is input to the control unit 60. The probe position detection camera 18 is a camera including a positioning microscope equipped with, for example, an objective lens 18a (refer to FIG. 2).

晶圓校準相機19係配置在與供探針卡24配置的探針區域相鄰接的校準區域。晶圓校準相機19係藉未圖示的支柱所支持，可藉由未圖示的相機升降機構移動於Z軸方向(上下方向)。此相機升降機構只要為公知直線的 移動機構即可，例如藉由線性導引機構、滾珠螺桿機構等所構成，藉由來自於控制部60的輸出而被驅動。晶圓校準相機19係將被晶圓夾盤16所保持的晶圓W從上方拍攝以檢測形成於晶圓W表面的晶片的電極(晶片表面電極)的位置。利用晶圓校準相機19的檢測結果係被輸入於控制部60。在控制部60中，將以晶圓校準相機19所獲得之資訊及以探針位置檢測相機18所獲得之探針25的前端的位置資訊一起使用公知的影像處理技術，自動進行在探針25與晶圓W的晶片的電極(晶片表面電極)的XY面內之二維的位置匹配。 The wafer alignment camera 19 is arranged in the alignment area adjacent to the probe area where the probe card 24 is arranged. The wafer alignment camera 19 is supported by a column (not shown), and can be moved in the Z-axis direction (up and down direction) by a camera lift mechanism (not shown). As long as the camera lifting mechanism is well-known linear The moving mechanism may be, for example, constituted by a linear guide mechanism, a ball screw mechanism, etc., and is driven by an output from the control unit 60. The wafer alignment camera 19 photographs the wafer W held by the wafer chuck 16 from above to detect the position of the wafer electrode (wafer surface electrode) formed on the surface of the wafer W. The detection result by the wafer calibration camera 19 is input to the control unit 60. In the control unit 60, the information obtained by the wafer calibration camera 19 and the position information of the tip of the probe 25 obtained by the probe position detection camera 18 are used together with the well-known image processing technology to automatically perform the positioning of the probe 25. It matches the two-dimensional position in the XY plane of the wafer electrode (wafer surface electrode) of the wafer W.

探針高度檢測器20係與探針位置檢測相機18分開設置，檢測從成為探針位置檢測相機18的高度基準之基準面算起之探針25的前端的高度。探針高度檢測器20係所謂的接觸型檢測器，藉由實體接觸於探針25的前端以檢測探針25的前端的高度。若為探針高度檢測器20係實體接觸探針25的前端而能檢測探針25的前端的高度者則未特別限定，可適用公知技術。此處，所謂基準面係指在探針機台10整體成為高度基準的面，為任意設定者。例如基準面係設定在X軸移動台14的上面。此外，探針高度檢測器20未受限於藉由實體的接觸以檢測探針25的前端者，亦可採用檢測公知的探針25的前端之技術。例如，探針高度檢測器20亦可藉由非接觸型的方法檢測探針25的前端。 The probe height detector 20 is provided separately from the probe position detection camera 18, and detects the height of the tip of the probe 25 from a reference plane that becomes the height reference of the probe position detection camera 18. The probe height detector 20 is a so-called contact type detector, which detects the height of the tip of the probe 25 by physically contacting the tip of the probe 25. If the probe height detector 20 physically contacts the tip of the probe 25 and can detect the height of the tip of the probe 25, it is not particularly limited, and a known technique can be applied. Here, the reference surface refers to a surface that serves as a height reference in the entire probe station 10, and is an arbitrary setting. For example, the reference plane is set on the upper surface of the X-axis moving table 14. In addition, the probe height detector 20 is not limited to detecting the tip of the probe 25 through physical contact, and a known technique for detecting the tip of the probe 25 can also be used. For example, the probe height detector 20 may detect the tip of the probe 25 by a non-contact method.

探針高度檢測器20備有接觸面20a及感測機構20b(參照圖3)。接觸面20a係與探針25的前端接觸，於接觸時向感測機構20b輸出信號。然後，感測機構20b係接收從接觸面20a輸出的信號及與從高度調整機構27輸出的高度相關的信號，將與探針的前端的高度相關的資訊向控制部60輸出。亦即感測機構20b係使接觸面20a接觸探針25的前端，以接觸面20a在接觸探針25的前端的時點的接觸面20a的高度作為探針25的前端的高度並向控制部60輸出。 The probe height detector 20 has a contact surface 20a and a sensing mechanism 20b (refer to FIG. 3). The contact surface 20a is in contact with the tip of the probe 25, and outputs a signal to the sensing mechanism 20b when in contact. Then, the sensing mechanism 20b receives the signal output from the contact surface 20a and the signal related to the height output from the height adjustment mechanism 27, and outputs information related to the height of the tip of the probe to the control unit 60. That is, the sensing mechanism 20b makes the contact surface 20a contact the tip of the probe 25, and the height of the contact surface 20a at the point when the contact surface 20a is in contact with the tip of the probe 25 is the height of the tip of the probe 25 and faces the control unit 60 Output.

探針位置檢測相機18的高度調整機構21(第1高度調整機構)，係藉控制部60之控制使探針位置檢測相機18沿著Z軸方向升降驅動。高度調整機構21係受探針機台10的控制部60(圖4)所控制，由使用者或安裝於控制部60的程式而控制升降驅動。例如，高度調整機構21係依據探針高度檢測器20的檢測結果，使從基準面算起之探針位置檢測相機18的高度改變。亦即高度調整機構21依據探針高度檢測器20所測定之探針25的前端的高度，將探針位置檢測相機18調整成與探針25的前端相距作業距離的高度。如此，因為會使用探針高度檢測器20所一次檢測的探針的前端的高度來調整探針位置檢測相機的高度，故可防止讓探針位置檢測相機18上升過度，藉由探針位置檢測相機18沿著Z軸方向的升降驅動而可防止衝撞探針25的前端。 The height adjustment mechanism 21 (first height adjustment mechanism) of the probe position detection camera 18 is controlled by the control unit 60 to drive the probe position detection camera 18 up and down along the Z-axis direction. The height adjustment mechanism 21 is controlled by the control unit 60 (FIG. 4) of the probe machine 10, and the lifting drive is controlled by the user or a program installed in the control unit 60. For example, the height adjustment mechanism 21 changes the height of the probe position detection camera 18 from the reference plane based on the detection result of the probe height detector 20. That is, the height adjustment mechanism 21 adjusts the probe position detection camera 18 to the height of the working distance from the front end of the probe 25 according to the height of the front end of the probe 25 measured by the probe height detector 20. In this way, since the height of the tip of the probe detected by the probe height detector 20 at one time is used to adjust the height of the probe position detection camera, it is possible to prevent the probe position detection camera 18 from rising excessively. The camera 18 is driven up and down in the Z-axis direction to prevent collision with the tip of the probe 25.

探針高度檢測器20的高度調整機構27(第2高度調整機構)，係使探針高度檢測器20沿著Z軸升降驅動。高度調整機構27係與上述的高度調整機構21獨立地設置，與高度調整機構21同樣地受控制部60所控制，使探針高度檢測器20升降驅動。 The height adjustment mechanism 27 (second height adjustment mechanism) of the probe height detector 20 drives the probe height detector 20 up and down along the Z axis. The height adjustment mechanism 27 is provided separately from the above-mentioned height adjustment mechanism 21, and is controlled by the control unit 60 like the height adjustment mechanism 21 to drive the probe height detector 20 up and down.

控制部60係可控制晶圓測試系統100整體(探針機台10/測試器30)，由電腦所構成。控制部60係被連接於晶圓測試系統100的各部位(圖示省略)，可進行接收來自於晶圓測試系統100各部位的信號及朝向各部位傳送信號。構成控制部60的電腦係具有輸入部62及顯示部61，使用者藉由輸入部62輸入資訊，控制部60係藉由在顯示部61顯示資訊而向使用者報知錯誤等。 The control unit 60 can control the entire wafer test system 100 (probe tool 10/tester 30), and is composed of a computer. The control unit 60 is connected to each part of the wafer test system 100 (not shown), and can receive signals from each part of the wafer test system 100 and transmit signals to each part. The computer constituting the control unit 60 has an input unit 62 and a display unit 61. The user inputs information through the input unit 62, and the control unit 60 reports an error to the user by displaying the information on the display unit 61.

圖2係表示僅以探針位置檢測相機18檢測探針25的前端的高度之情況的概念圖。 FIG. 2 is a conceptual diagram showing a case where only the height of the tip of the probe 25 is detected by the probe position detection camera 18.

圖2(A)係探針位置檢測相機18正常地進行探針25的前端之檢測的情況之概念圖。探針位置檢測相機18進行探針25的前端的高度之檢測的情況為，首先由使用者經由輸入部62向控制部60輸入構成資料或種類參數等，依據所輸入之值而於控制部60算出晶圓夾盤16與探針25的前端之間的距離A。接著，探針位置檢測相機18係依據所算出之距離A藉高度調整機構21一口氣上升到探針25的前端與探針位置檢測相機18分離的作業 距離(圖中所記載的WD)的高度(作業距離高度)。此外，在這情況，晶圓夾盤16的高度係已知。 FIG. 2(A) is a conceptual diagram of a situation where the probe position detection camera 18 normally detects the tip of the probe 25. When the probe position detection camera 18 detects the height of the tip of the probe 25, the user first inputs configuration data or type parameters to the control section 60 via the input section 62, and then sends the input to the control section 60 based on the input value. The distance A between the wafer chuck 16 and the tip of the probe 25 is calculated. Next, the probe position detection camera 18 is moved up to the tip of the probe 25 and the probe position detection camera 18 to be separated from the probe position detection camera 18 in one go by the height adjustment mechanism 21 based on the calculated distance A The height of the distance (WD in the figure) (working distance height). In addition, in this case, the height of the wafer chuck 16 is known.

此處所謂構成資料係指，探針機台10的各種功能之設定參數或顯微鏡等搭載機器之安裝位置的座標值等之資料，按每探針機台10以固有資料儲存於控制部60的HDD(hard disk drive；硬碟)。 The so-called configuration data here refers to data such as the setting parameters of various functions of the probe machine 10 or the coordinate values of the installation position of the equipment such as a microscope, etc., which are stored in the control unit 60 as unique data for each probe machine 10 HDD (hard disk drive; hard disk).

例如構成資料含有從探針機台的座標基準到探針卡安裝面為止的高度尺寸。 For example, the configuration data includes the height dimension from the coordinate reference of the probe machine base to the probe card mounting surface.

又，所謂種類參數係記錄著製品晶圓W或其上的晶片之大小或配置等之製品的規格的資料。種類參數係由使用者任意作成的資料且通常記憶於控制部60的HDD。 In addition, the so-called type parameter is data that records product specifications such as the size or arrangement of the product wafer W or the wafer on it. The type parameter is data arbitrarily created by the user and is usually stored in the HDD of the control unit 60.

又，探針卡24因為是配合製品晶圓W的規格而被專用地製作，故亦含有探針卡24的個別資訊。例如，種類參數亦含有從探針卡24的基板面到探針25的前端為止的高度尺寸。 In addition, because the probe card 24 is specially manufactured in accordance with the specifications of the product wafer W, the individual information of the probe card 24 is also included. For example, the type parameter also includes the height dimension from the substrate surface of the probe card 24 to the tip of the probe 25.

被提升到作業距離高度之探針位置檢測相機18係進行朝向探針之自動對焦，進行探針25的前端之檢測及探針25的前端的高度之檢測。此處，作為使探針位置檢測相機18上升的手法，也可考慮一邊使探針位置檢測相機18進行自動對焦一邊繼續探針25的檢測而使探針位 置檢測相機18一點一點上升的手法。但是，以將此種探針位置檢測相機18一點一點上升的手法而言，需要長的作動時間，從總處理量的觀點考量並不佳。 The probe position detection camera 18 raised to the height of the working distance performs autofocus toward the probe, and detects the tip of the probe 25 and the height of the tip of the probe 25. Here, as a method for raising the probe position detection camera 18, it is also conceivable to continue the detection of the probe 25 while the probe position detection camera 18 is autofocused to set the probe position Set to detect the way the camera 18 rises little by little. However, the method of raising the probe position detection camera 18 little by little requires a long operating time, which is not preferable from the viewpoint of the total throughput.

圖2(B)係表示探針位置檢測相機18與探針25的前端發生衝撞之情況的一例之圖。 FIG. 2(B) is a diagram showing an example of a situation where the probe position detection camera 18 and the tip of the probe 25 collide.

當構成資料或種類參數等之輸入有錯誤時，控制部60係無法正確地算出在圖2(A)所說明那樣的距離A。在圖2(B)所示的情況，探針25的前端與晶圓夾盤16之距離係應該和圖2(A)同樣算出距離A，控制部60卻誤算出為距離B(距離B>距離A)。由於控制部60係依據誤算出的距離B控制高度調整機構21將探針位置檢測相機18一口氣提升到作業距離高度，故導致探針位置檢測相機18與探針25的前端衝撞。探針位置檢測相機18與探針25之衝撞會引起所謂探針25及探針卡24之破損、及探針位置檢測相機18之破損的問題。 When there is an error in the input of the configuration data or the type parameter, the control unit 60 cannot accurately calculate the distance A as described in FIG. 2(A). In the case shown in FIG. 2(B), the distance between the tip of the probe 25 and the wafer chuck 16 should be calculated as the distance A as in FIG. 2(A), but the control unit 60 erroneously calculates the distance B (distance B> Distance A). Since the control unit 60 controls the height adjustment mechanism 21 according to the erroneously calculated distance B to raise the probe position detection camera 18 to the working distance height at one go, the probe position detection camera 18 collides with the tip of the probe 25. The collision between the probe position detection camera 18 and the probe 25 will cause the damage of the probe 25 and the probe card 24 and the damage of the probe position detection camera 18.

依據本發明的一態樣，可防止在圖2說明的探針位置檢測相機18與探針25的前端衝撞。 According to an aspect of the present invention, the probe position detection camera 18 described in FIG. 2 can be prevented from colliding with the tip of the probe 25.

其次，藉圖3及圖4說明有關本發明中使用探針高度檢測器20之探針25的前端的高度檢測。 Next, the height detection of the tip of the probe 25 using the probe height detector 20 in the present invention will be explained with reference to FIGS. 3 and 4.

圖3係有關藉探針高度檢測器20所進行之探針25的前端的檢測之說明圖。 FIG. 3 is an explanatory diagram related to the detection of the tip of the probe 25 by the probe height detector 20.

圖3(A)係說明藉探針高度檢測器20檢測探針25的高度之圖。在使探針位置檢測相機18對焦於探針25的前端之情況或上升到作業距離高度之情況，首先藉探針高度檢測器20檢測探針25的位置。具體言之，探針高度檢測器20係藉由高度調整機構27而被上升迄至接觸探針25的前端為止。探針高度檢測器20係在以接觸面20a接觸探針25時向感測機構20b輸出信號，感測機構20b係依據從接觸面20a輸出的信號及表示從高度調整機構27輸出的高度之信號，將有關探針25的前端的高度之資訊向控制部60傳送(參照圖4)。 FIG. 3(A) is a diagram illustrating the detection of the height of the probe 25 by the probe height detector 20. When the probe position detection camera 18 is focused on the tip of the probe 25 or when it is raised to the height of the working distance, the probe height detector 20 first detects the position of the probe 25. Specifically, the probe height detector 20 is raised by the height adjustment mechanism 27 until it contacts the tip of the probe 25. The probe height detector 20 outputs a signal to the sensing mechanism 20b when the contact surface 20a contacts the probe 25. The sensing mechanism 20b is based on the signal output from the contact surface 20a and the signal indicating the height output from the height adjustment mechanism 27 , The information about the height of the tip of the probe 25 is sent to the control unit 60 (refer to FIG. 4).

圖4係將輸入於控制部60的資訊及從控制部60輸出的資訊連同功能塊一起作概念性地表示的圖。 4 is a diagram conceptually showing information input to the control unit 60 and information output from the control unit 60 together with functional blocks.

如圖4所示，控制部60被輸入探針高度檢測器20的實測值、即探針25的前端的高度相關的資訊。又，控制部60被輸入使用者經由輸入部62所輸入之構成資料或種類參數，控制部60係藉由所輸入之構成資料或種類參數算出晶圓夾盤16與探針25的前端之距離。 As shown in FIG. 4, the control unit 60 is inputted with the actual measurement value of the probe height detector 20, that is, information about the height of the tip of the probe 25. In addition, the control unit 60 receives the configuration data or type parameters input by the user via the input unit 62, and the control unit 60 calculates the distance between the wafer chuck 16 and the tip of the probe 25 based on the input configuration data or type parameters. .

之後，控制部60係比較以探針高度檢測器20所檢測之探針25的高度與從構成資料及種類參數所算出之 探針25的高度。然後控制部60係依比較結果將使從基準面算起之探針位置檢測相機18的高度變化的指令向高度調整機構21輸出。關於從構成資料或種類參數等所算出之探針25的高度與藉探針高度檢測器20檢測之探針25的高度之比較，控制部60係可使用的各種手法。例如，亦可為控制部60係使用閥值，若為閥值的範圍內則判斷高度一致，在閥值的範圍外則判斷高度不一致。 After that, the control unit 60 compares the height of the probe 25 detected by the probe height detector 20 with the height calculated from the configuration data and type parameters The height of the probe 25. Then, the control unit 60 outputs an instruction to change the height of the probe position detection camera 18 from the reference plane to the height adjustment mechanism 21 according to the comparison result. Regarding the comparison between the height of the probe 25 calculated from the configuration data or the type parameter and the height of the probe 25 detected by the probe height detector 20, various methods can be used by the control unit 60. For example, the control unit 60 may use a threshold value. If it is within the range of the threshold value, it is judged that the height is consistent, and if it is outside the range of the threshold value, it is judged that the height does not match.

然後，控制部60係在藉構成資料或種類參數等所算出之探針25的高度與藉探針高度檢測器20所檢測之探針25的高度是相同的情況，判斷所輸入之構成資料或種類參數係正確者。例如圖3(A)及(B)所示，控制部60係將藉探針高度檢測器20所檢測之從基準面(晶圓夾盤16的上面)起算的距離A與藉構成資料或種類參數等所算出之探針25的高度、即距離B作比較，判定B近似於A。之後，控制部60係如圖3(B)所示向高度調整機構21輸出將探針位置檢測相機18一口氣上升到作業距離高度的指令，探針位置檢測相機18係進行自動對焦而進行探針25的前端之檢測。亦即，探針位置檢測相機18係依據藉探針高度檢測器20所檢測之探針25的前端的高度在Z軸方向被升降驅動，被移動到作業距離高度。 Then, the control unit 60 determines whether the height of the probe 25 calculated by the configuration data or the type parameter is the same as the height of the probe 25 detected by the probe height detector 20 The type parameter is correct. For example, as shown in Figures 3(A) and (B), the control unit 60 compares the distance A from the reference plane (the upper surface of the wafer chuck 16) detected by the probe height detector 20 with the component data or type The height of the probe 25 calculated by the parameters, that is, the distance B is compared, and it is determined that B is similar to A. After that, the control unit 60 outputs an instruction to raise the probe position detection camera 18 to the working distance height at a stretch to the height adjustment mechanism 21 as shown in FIG. 3(B), and the probe position detection camera 18 performs automatic focusing and detection Detection of the tip of the needle 25. That is, the probe position detection camera 18 is driven up and down in the Z-axis direction according to the height of the tip of the probe 25 detected by the probe height detector 20, and is moved to the working distance height.

一方面，在以構成資料或種類參數等所設定之探針25的高度與以探針高度檢測器20所取得之探針25的高度不同之情況，控制部60判斷所輸入之構成資料或種類 參數等是錯誤，在顯示部61進行錯誤顯示讓使用者知悉，停止探針機台10的動作。藉此，可防止在圖2(B)說明的探針25與探針位置檢測相機18衝撞。 On the one hand, when the height of the probe 25 set by the configuration data or type parameter is different from the height of the probe 25 obtained by the probe height detector 20, the control unit 60 determines the input configuration data or type The parameters and the like are errors, and the error display is displayed on the display unit 61 to let the user know, and the operation of the probe machine 10 is stopped. Thereby, it is possible to prevent the probe 25 described in FIG. 2(B) from colliding with the probe position detection camera 18.

作為其他態樣，在控制部60判定被輸入的構成資料或種類參數等是錯誤的情況，亦可將所輸入的值以使用藉探針高度檢測器20所取得之探針25的高度來取代，將探針位置檢測相機18上升到作業距離高度。藉此，即便所輸入之構成資料或種類參數錯誤，仍可在未停止探針機台10下繼續進行測定。 As another aspect, when the control unit 60 determines that the input configuration data or type parameters are wrong, the input value may be replaced by the height of the probe 25 obtained by the probe height detector 20 , Raise the probe position detection camera 18 to the height of the working distance. In this way, even if the input composition data or type parameter is wrong, the measurement can be continued without stopping the probe machine 10.

圖5係顯示探針機台10的操作方法之流程圖。在圖5所示的操作方法中，依據藉探針高度檢測器20所檢測之探針25的高度，進行藉構成資料或種類參數所算出之探針前端高度的判斷。 FIG. 5 is a flowchart showing the operation method of the probe machine 10. In the operation method shown in FIG. 5, the height of the probe tip calculated by the configuration data or the type parameter is judged based on the height of the probe 25 detected by the probe height detector 20.

首先，使用者係經由輸入部62將構成資料及種類參數向控制部60輸入。之後，控制部60係依據所輸入之構成資料及種類參數而算出探針25的前端的高度(步驟S10)。其次，藉探針高度檢測器20檢測探針25的高度(步驟S11)。具體言之，探針高度檢測器20係藉高度調整機構27而被上升，與探針25接觸而檢測探針25的高度。 First, the user inputs configuration data and type parameters to the control unit 60 via the input unit 62. After that, the control unit 60 calculates the height of the tip of the probe 25 based on the input configuration data and type parameters (step S10). Next, the height of the probe 25 is detected by the probe height detector 20 (step S11). Specifically, the probe height detector 20 is raised by the height adjustment mechanism 27 and contacts the probe 25 to detect the height of the probe 25.

然後，控制部60係針對依據構成資料及種類參數所算出之探針25的前端的高度與藉探針高度檢測器20所 實際檢測之探針25的前端的高度進行比較。控制部60係在兩者是不一致的情況，使顯示部61進行表示錯誤的警告顯示(步驟S14)。 Then, the control unit 60 controls the height of the tip of the probe 25 calculated based on the configuration data and type parameters and the height of the probe height detector 20. The height of the tip of the probe 25 actually detected is compared. When the two do not match, the control unit 60 causes the display unit 61 to perform a warning display indicating an error (step S14).

另一方面，控制部60在兩者是一致的情況，對高度調整機構21輸出將探針位置檢測相機18上升到作業距離高度為止的指令。之後，探針位置檢測相機18係依據指令而被上升到作業距離高度(步驟S13)。 On the other hand, when the two match, the control unit 60 outputs a command to the height adjustment mechanism 21 to raise the probe position detection camera 18 to the height of the working distance. After that, the probe position detection camera 18 is raised to the working distance height in accordance with the instruction (step S13).

圖6係顯示探針機台10的其他操作方法之流程圖。在圖6所示的其他操作方法中，係未依據構成資料或種類參數來算出探針25的前端的高度，而依據藉探針高度檢測器20所檢測出之探針高度使探針位置檢測相機18上升。 FIG. 6 is a flowchart showing other operation methods of the probe machine 10. In the other operation method shown in FIG. 6, the height of the tip of the probe 25 is not calculated based on the configuration data or type parameters, and the probe position is detected based on the probe height detected by the probe height detector 20 The camera 18 rises.

首先，藉探針高度檢測器20檢測探針25的高度(步驟S20)。具體言之，探針高度檢測器20是藉高度調整機構27而上升，與探針25接觸而檢測探針25的前端的高度。然後，控制部60依據所檢測之探針25的前端的高度，算出與探針25的前端相距探針位置檢測相機18的作業距離之高度(作業距離高度)，向高度調整機構21輸出指令(步驟S21)。 First, the height of the probe 25 is detected by the probe height detector 20 (step S20). Specifically, the probe height detector 20 is raised by the height adjustment mechanism 27 and contacts the probe 25 to detect the height of the tip of the probe 25. Then, the control unit 60 calculates the height of the working distance (working distance height) of the probe position detection camera 18 from the front end of the probe 25 based on the height of the front end of the detected probe 25, and outputs a command to the height adjustment mechanism 21 ( Step S21).

之後，依據藉探針高度檢測器20所檢測之探針25的前端的高度，使探針位置檢測相機18的高度變化達到 作業距離高度(步驟S22)。如圖6所示，亦可在輸入構成資料或種類參數而未算出探針25的前端的高度下，使用藉探針高度檢測器20所檢測出之探針25的前端的高度。 Then, according to the height of the tip of the probe 25 detected by the probe height detector 20, the height of the probe position detection camera 18 is changed to Work distance height (step S22). As shown in FIG. 6, the height of the tip of the probe 25 detected by the probe height detector 20 may be used when the configuration data or the type parameter is input without calculating the height of the tip of the probe 25.

上述的各構成及功能係可藉任意的硬體、軟體或兩者的組合而適當地實現。例如，使電腦執行上述處理步驟(處理程序)的程式、記錄有那樣的程式之電腦可讀取之記錄媒體(非暫時性的記錄媒體)、或對於可安裝那樣的程式之電腦亦可適用本發明。 Each of the above-mentioned configurations and functions can be appropriately realized by arbitrary hardware, software, or a combination of both. For example, a program that causes a computer to execute the above-mentioned processing steps (processing procedures), a computer-readable recording medium (non-transitory recording medium) on which such a program is recorded, or a computer that can install such a program can also apply this invention.

<第2實施形態> <Second Embodiment>

其次，說明關於第2實施形態。 Next, the second embodiment will be explained.

圖7係顯示本發明所適用之晶圓測試系統100的第2實施形態之概略構成圖。此外，在圖1已說明過的部位係賦予相同符號並省略說明。 FIG. 7 is a schematic configuration diagram showing the second embodiment of the wafer test system 100 to which the present invention is applied. In addition, the parts already described in FIG. 1 are given the same reference numerals and their description is omitted.

圖7所示的探針機台10相較於圖1所示的探針機台10，係在探針高度檢測器20是和探針位置檢測相機18一體設置這點有所不同。 The probe machine 10 shown in FIG. 7 is different from the probe machine 10 shown in FIG. 1 in that the probe height detector 20 is integrated with the probe position detection camera 18.

探針高度檢測器20係一體設於探針位置檢測相機18，藉由探針位置檢測相機18的高度調整機構21調整高度。亦即，透過探針高度檢測器20與探針位置檢測相機18係藉由臂部29而一體設置，可利用一高度調整機 構調整高度，所以高度調整的控制更簡化。又，因為也可省略設置一個高度調整機構，所以探針機台10的設計及組裝被簡化。又，藉由探針高度檢測器20一體設置於探針位置檢測相機18，會抑制探針高度檢測器20受溫度的影響。亦即，通常探針位置檢測相機18的溫度變化小，所以藉由探針高度檢測器20一體設置於探針位置檢測相機18上，探針高度檢測器20的溫度變化之影響會受到抑制。另一方面，例如，在探針位置檢測相機18被設於晶圓夾盤16的情況，晶圓夾盤16的溫度變化是-60℃~200℃，故探針高度檢測器20容易受溫度變化的影響。 The probe height detector 20 is integrated with the probe position detection camera 18, and the height is adjusted by the height adjustment mechanism 21 of the probe position detection camera 18. That is, the penetrating probe height detector 20 and the probe position detection camera 18 are integrally provided by the arm 29, and a height adjustment machine can be used. The structure adjusts the height, so the height adjustment control is simplified. In addition, because a height adjustment mechanism can also be omitted, the design and assembly of the probe machine 10 are simplified. In addition, the probe height detector 20 is integrally provided with the probe position detection camera 18, which prevents the probe height detector 20 from being affected by temperature. That is, generally, the temperature change of the probe position detection camera 18 is small. Therefore, the probe height detector 20 is integrally provided on the probe position detection camera 18, and the influence of the temperature change of the probe height detector 20 is suppressed. On the other hand, for example, when the probe position detection camera 18 is installed on the wafer chuck 16, the temperature change of the wafer chuck 16 is -60°C to 200°C, so the probe height detector 20 is easily affected by the temperature The impact of changes.

此外，探針高度檢測器20係藉公知技術而一體設於探針位置檢測相機18。圖7中的探針高度檢測器20係藉由臂部29設於探針位置檢測相機18的側方，但亦可藉其他手段安裝。 In addition, the probe height detector 20 is integrated with the probe position detection camera 18 by a well-known technique. The probe height detector 20 in FIG. 7 is provided on the side of the probe position detection camera 18 by the arm 29, but it can also be installed by other means.

圖8係有關在探針高度檢測器20與探針位置檢測相機18是一體設置的情況下所進行之探針25的前端的檢測之說明圖。 FIG. 8 is an explanatory diagram of the detection of the tip of the probe 25 performed when the probe height detector 20 and the probe position detection camera 18 are integrally installed.

如圖8(A)所示，在探針高度檢測器20是與探針位置檢測相機18一體設置的情況，探針高度檢測器20的接觸面20a的高度係以設在高於探針位置檢測相機18的物鏡18a的端部的高度的位置較佳。藉此，在探針25衝撞 探針位置檢測相機18的物鏡18a之前，可藉探針高度檢測器20的接觸面20a檢測探針25的前端。又，探針高度檢測器20的接觸面20a係設於比在探針位置檢測相機18的高度上加上作業距離後的高度還低的位置。因此，不會妨礙探針位置檢測相機18進行自動對焦以檢測探針25的前端。 As shown in FIG. 8(A), when the probe height detector 20 is integrated with the probe position detection camera 18, the height of the contact surface 20a of the probe height detector 20 is set higher than the probe position The position to detect the height of the end of the objective lens 18a of the camera 18 is preferable. With this, collide with probe 25 Before the objective lens 18a of the probe position detection camera 18, the tip of the probe 25 can be detected by the contact surface 20a of the probe height detector 20. In addition, the contact surface 20 a of the probe height detector 20 is provided at a position lower than the height of the probe position detection camera 18 plus the working distance. Therefore, it does not prevent the probe position detection camera 18 from performing automatic focusing to detect the tip of the probe 25.

圖8(B)係有關藉探針高度檢測器20測定探針25的前端的高度之圖。探針高度檢測器20係和探針位置檢測相機18一體設置，探針位置檢測相機18被高度調整機構21升降驅動以測定探針25的前端的高度。 FIG. 8(B) is a diagram of measuring the height of the tip of the probe 25 by the probe height detector 20. FIG. The probe height detector 20 is provided integrally with the probe position detection camera 18, and the probe position detection camera 18 is driven up and down by the height adjustment mechanism 21 to measure the height of the tip of the probe 25.

圖8(C)係顯示移動到作業距離高度的探針位置檢測相機18之圖。探針位置檢測相機18係依據藉探針高度檢測器20所檢測之探針25的前端的高度，利用高度調整機構21移動到作業距離高度。此處，因為是被一體設置，所以探針位置檢測相機18與探針高度檢測器20之高度關係不變，控制部60係因應於藉探針高度檢測器20所檢測之探針25的前端的高度，可容易地控制探針位置檢測相機18的高度。再者，由於是一體設置，所以探針高度檢測器20的接觸面20a與探針位置檢測相機18的物鏡18a之距離在Z軸方向、X軸方向及Y軸方向(參照圖7)變得極短。因此，在以探針高度檢測器20的接觸面20a檢測探針25的前端之後，可縮短用以使探針位置檢測相機18對焦於探針25的前端之移動時間。 FIG. 8(C) is a diagram showing the probe position detection camera 18 moved to the height of the working distance. The probe position detection camera 18 is moved to the working distance height by the height adjustment mechanism 21 according to the height of the tip of the probe 25 detected by the probe height detector 20. Here, because it is integrally installed, the height relationship between the probe position detection camera 18 and the probe height detector 20 remains unchanged, and the control unit 60 corresponds to the tip of the probe 25 detected by the probe height detector 20 The height of the probe position detection camera 18 can be easily controlled. Furthermore, because it is integrally installed, the distance between the contact surface 20a of the probe height detector 20 and the objective lens 18a of the probe position detection camera 18 becomes in the Z-axis direction, X-axis direction, and Y-axis direction (see FIG. 7) Extremely short. Therefore, after detecting the tip of the probe 25 with the contact surface 20a of the probe height detector 20, the movement time for the probe position detection camera 18 to focus on the tip of the probe 25 can be shortened.

<探針的前端的高度檢測的應用例> <Application example of height detection of the tip of the probe>

其次，說明有關應用上述說明之探針25的前端的高度之檢測的態樣。 Next, a description will be given of the aspect of detecting the height of the tip of the probe 25 described above.

探針25的前端的高度檢測係可應用於各種態樣。特別可適當應用於需要探針25的前端的正確高度之態樣。例如，上述的探針25的前端的高度檢測係可適用於探針25的探針卡24之傾斜的檢測。 The height detection system of the tip of the probe 25 can be applied to various aspects. In particular, it can be suitably applied to situations requiring the correct height of the tip of the probe 25. For example, the above-mentioned height detection system of the tip of the probe 25 can be applied to the detection of the tilt of the probe card 24 of the probe 25.

圖9係有關自昔以來通常所進行的探針卡保持器23或設置於探針卡保持器23的探針卡24的傾斜檢測之方法的說明圖。在圖9所示的情況中，將平行度確認治具70設定於探針卡保持器23以取代探針卡24來檢測探針卡保持器23的傾斜。具體言之，藉探針位置檢測相機18對設定於探針卡保持器23的平行度確認治具70之表面的高度作複數次檢測以檢測探針卡保持器23的傾斜。 FIG. 9 is an explanatory diagram of a method of detecting the inclination of the probe card holder 23 or the probe card 24 provided in the probe card holder 23 that has been generally performed from the past. In the case shown in FIG. 9, the parallelism checking jig 70 is set in the probe card holder 23 instead of the probe card 24 to detect the tilt of the probe card holder 23. Specifically, the probe position detection camera 18 detects the height of the surface of the parallelism confirmation jig 70 set on the probe card holder 23 multiple times to detect the tilt of the probe card holder 23.

當欲以探針位置檢測相機18檢測探針卡24的探針25的前端時，在探針前端的檢測上需要時間而使探針機台10的總處理量降低。於是當使用平行度確認治具70來取代探針卡24時，由於平行度確認治具70係表面平坦的面，故即便是利用探針位置檢測相機18亦能用較短的時間對焦。此外，平行度確認治具70係例如為與探針卡24相似地經加工的金屬板。 When the tip of the probe 25 of the probe card 24 is to be detected by the probe position detection camera 18, it takes time to detect the tip of the probe, and the total throughput of the probe machine 10 is reduced. Therefore, when the parallelism checking jig 70 is used instead of the probe card 24, since the parallelism checking jig 70 is a flat surface, the probe position detection camera 18 can focus in a short time. In addition, the parallelism checking jig 70 is, for example, a metal plate processed similarly to the probe card 24.

然而，當使用平行度確認治具70進行探針卡保持器23的傾斜檢測，平行度確認治具70的加工精度會影響傾斜檢測的精度。又，在利用平行度確認治具70進行傾斜檢測完了後，必須將探針卡24設定於探針卡保持器23，會導致總處理量降低。 However, when the parallelism checking jig 70 is used to perform the tilt detection of the probe card holder 23, the processing accuracy of the parallelism checking jig 70 will affect the accuracy of the tilt detection. In addition, after the tilt detection using the parallelism confirmation jig 70 is completed, the probe card 24 must be set in the probe card holder 23, which will reduce the total throughput.

於是，本例中，應用使用了上述的探針高度檢測器20之探針25的前端的高度的檢測來進行使用在探針卡24的探針卡保持器23(或探針卡24)的傾斜之檢測。 Therefore, in this example, the detection of the height of the tip of the probe 25 using the above-mentioned probe height detector 20 is applied to the probe card holder 23 (or probe card 24) used in the probe card 24. Tilt detection.

圖10及圖11係有關本例的探針卡保持器23或探針卡24的傾斜檢測之說明圖。圖10中，藉由探針高度檢測器20檢測被設定於探針卡保持器23的探針卡24的傾斜。 10 and FIG. 11 are explanatory diagrams for detecting the tilt of the probe card holder 23 or the probe card 24 of this example. In FIG. 10, the inclination of the probe card 24 set in the probe card holder 23 is detected by the probe height detector 20.

探針高度檢測器20係與探針位置檢測相機18一體設置，藉由探針位置檢測相機18的高度調整機構21而被升降驅動，透過與探針25的前端接觸而檢測探針25的前端的高度。 The probe height detector 20 is integrated with the probe position detection camera 18, and is driven up and down by the height adjustment mechanism 21 of the probe position detection camera 18, and detects the tip of the probe 25 by contacting the tip of the probe 25 the height of.

圖11係將輸入於控制部60的資訊及從控制部60輸出的資訊連同功能塊一起作概念性地表示的圖。 FIG. 11 is a diagram conceptually showing information input to the control unit 60 and information output from the control unit 60 together with functional blocks.

如圖11所示，控制部60被輸入複數個關於來自於探針高度檢測器20之經實際測定所求得之探針25的前端的高度的資訊。此處，輸入複數個探針25的前端的高度係為了算出探針卡24的傾斜或探針卡保持器23的傾斜。因此，例如探針高度檢測器20係將相異的3點的探針25的前端的高度向控制部傳送，控制部60係輸出探針卡24的傾斜。此外，本案中未特別針對依據所檢測之傾斜來調整傾斜的傾斜調整機構作說明，但亦可藉由公知的傾斜調整機構依據所檢測之傾斜來調整傾斜。 As shown in FIG. 11, the control unit 60 receives a plurality of pieces of information about the height of the tip of the probe 25 obtained through actual measurement from the probe height detector 20. Here, inputting the height of the tip of a plurality of probes 25 is to calculate the tilt of the probe card 24 or the tilt of the probe card holder 23. Therefore, for example, the probe height detector 20 transmits three different heights of the tip of the probe 25 to the control unit, and the control unit 60 outputs the tilt of the probe card 24. In addition, this case does not specifically describe the tilt adjustment mechanism that adjusts the tilt based on the detected tilt, but a well-known tilt adjustment mechanism can also adjust the tilt based on the detected tilt.

其次，說明在上述的應用例中進一步藉探針位置檢測相機18進行探針卡24的傾斜之檢測的例子。 Next, an example in which the probe position detection camera 18 further detects the tilt of the probe card 24 in the above-mentioned application example will be described.

圖12中藉由探針位置檢測相機18來檢測探針卡24的傾斜。在這情況，探針位置檢測相機18係依據藉探針高度檢測器20所檢測到之探針25的前端的高度，來檢測探針25的前端的高度。亦即如圖3及圖8所說明，探針位置檢測相機18係依據藉探針高度檢測器20所檢測到之探針25的前端的高度而藉高度調整機構21移動到作業距離高度，之後，檢測探針25的前端的高度。探針位置檢測相機18係和上述的探針高度檢測器20之情況同樣，在相異的複數個點檢測探針25的前端的高度，控制部60依據所檢測到之探針25的前端的高度來檢測探針卡24的傾斜。 In FIG. 12, the probe position detection camera 18 is used to detect the tilt of the probe card 24. In this case, the probe position detection camera 18 detects the height of the tip of the probe 25 based on the height of the tip of the probe 25 detected by the probe height detector 20. That is, as illustrated in FIGS. 3 and 8, the probe position detection camera 18 is moved to the working distance height by the height adjustment mechanism 21 according to the height of the tip of the probe 25 detected by the probe height detector 20, and then , The height of the tip of the probe 25 is detected. The probe position detection camera 18 is similar to the above-mentioned probe height detector 20. It detects the height of the tip of the probe 25 at a plurality of different points, and the control unit 60 depends on the detected tip height of the probe 25 Height to detect the tilt of the probe card 24.

如此，本例中，依據從探針高度檢測器20及探針位置檢測相機18所輸出之探針25的前端的高度，檢測探針卡24的傾斜。 In this way, in this example, the inclination of the probe card 24 is detected based on the height of the tip of the probe 25 output from the probe height detector 20 and the probe position detection camera 18.

圖13係顯示檢測本例的探針卡24(探針卡保持器23)的傾斜之程序的流程圖。圖13中顯示藉探針高度檢測器20及探針位置檢測相機18來檢測探針25的前端的高度以檢測傾斜的例子。 FIG. 13 is a flowchart showing a procedure for detecting the tilt of the probe card 24 (probe card holder 23) of this example. FIG. 13 shows an example in which the probe height detector 20 and the probe position detection camera 18 are used to detect the height of the tip of the probe 25 to detect the tilt.

首先，藉由探針高度檢測器20對探針25的前端的高度作複數次測定，測定結果被傳送於控制部60(第1高度檢測步驟：步驟S30)。複數次的測定係在相異的點進行，探針高度檢測器20係在X軸方向及Y軸方向移動以測定探針25的前端的高度。 First, the height of the tip of the probe 25 is measured multiple times by the probe height detector 20, and the measurement result is transmitted to the control unit 60 (first height detection step: step S30). Multiple measurements are performed at different points, and the probe height detector 20 is moved in the X-axis direction and the Y-axis direction to measure the height of the tip of the probe 25.

其次，藉由探針位置檢測相機18對探針25的前端的高度作複數次測定，測定結果被傳送於控制部60(第2高度檢測步驟：步驟S31)。探針位置檢測相機18亦和探針高度檢測器20同樣，在複數次的相異點進行探針25的前端的高度之檢測。此處，探針位置檢測相機18係依據以探針高度檢測器20所預先檢測到之探針25的前端的高度，被移動到作業距離高度而在探針25的前端進行自動對焦。因此，由於可縮短探針位置檢測相機18探索探針25的前端之時間，故可抑制探針機台10的總處理量之降低。 Next, the height of the tip of the probe 25 is measured multiple times by the probe position detection camera 18, and the measurement result is transmitted to the control unit 60 (second height detection step: step S31). Like the probe height detector 20, the probe position detection camera 18 detects the height of the tip of the probe 25 at multiple different points. Here, the probe position detection camera 18 is moved to the working distance height based on the height of the front end of the probe 25 previously detected by the probe height detector 20 to automatically focus on the front end of the probe 25. Therefore, since the time for the probe position detection camera 18 to search for the tip of the probe 25 can be shortened, the decrease in the total throughput of the probe machine 10 can be suppressed.

之後，控制部60係依據從探針高度檢測器20及探針位置檢測相機18所輸出之複數根探針25的前端的高度，算出探針卡24的傾斜(傾斜檢測步驟：步驟S32)。此處，控制部60係依據以探針高度檢測器20所檢測到之探針25的前端的高度來檢測傾斜，之後，依據以探針位置檢測相機18所檢測之探針25的前端的高度來檢測傾斜。由於控制部60亦使用能以更高精度檢測探針25的前端的高度之探針位置檢測相機18的檢測結果進行傾斜檢測，故可進行更正確的傾斜檢測。 After that, the control unit 60 calculates the tilt of the probe card 24 based on the height of the tip of the plurality of probes 25 output from the probe height detector 20 and the probe position detection camera 18 (tilt detection step: step S32). Here, the control unit 60 detects the tilt based on the height of the tip of the probe 25 detected by the probe height detector 20, and then based on the height of the tip of the probe 25 detected by the probe position detection camera 18 To detect tilt. Since the control unit 60 also performs tilt detection using the detection result of the probe position detection camera 18 that can detect the height of the tip of the probe 25 with higher accuracy, more accurate tilt detection can be performed.

<其他實施形態之探針高度檢測器> <Probe height detector of other embodiments>

圖14係用以說明其他實施形態的探針高度檢測器100之說明圖。如圖14所示，其他實施形態的探針高度檢測器100係使用屬線性可變差動變壓器(Linear Variable Differential Transformer)的LVDT106，檢測從所述基準面算起之探針25的前端的高度。此探針高度檢測器100備有基座102、空氣軸承103、上下可動部104、螺旋彈簧105、及LVDT106。 FIG. 14 is an explanatory diagram for explaining a probe height detector 100 according to another embodiment. As shown in FIG. 14, the probe height detector 100 of another embodiment uses a linear variable differential transformer (Linear Variable Differential Transformer) LVDT 106 to detect the height of the tip of the probe 25 from the reference plane. . The probe height detector 100 is equipped with a base 102, an air bearing 103, a vertical movable part 104, a coil spring 105, and an LVDT 106.

基座102係藉由未圖示之支持構件在高度調整機構27上方被支持著。基座102係形成大致環狀，於此基座102的中心形成有平行於Z軸方向(上下方向)的貫通孔102a。在此基座102的上面設有空氣軸承103。 The base 102 is supported above the height adjustment mechanism 27 by a supporting member not shown. The base 102 is formed in a substantially ring shape, and a through hole 102a parallel to the Z-axis direction (up and down direction) is formed in the center of the base 102. An air bearing 103 is provided on the upper surface of the base 102.

空氣軸承103係形成大致圓筒狀，具有平行於Z軸方向的保持孔103a。此保持孔103a的中心之XY軸方向的位置與所述的貫通孔102a的中心之XY軸方向的位置係一致。符號C係通過保持孔103a及貫通孔102a雙方的中心之中心軸。空氣軸承103係將***通於保持孔103a之後述的上下可動部104的上下移動軸110以移動自如的方式保持於Z軸方向。 The air bearing 103 is formed in a substantially cylindrical shape and has a holding hole 103a parallel to the Z-axis direction. The position of the center of the holding hole 103a in the XY axis direction coincides with the position of the center of the through hole 102a in the XY axis direction. The symbol C is a central axis passing through the centers of both the holding hole 103a and the through hole 102a. The air bearing 103 movably holds the vertical moving shaft 110 inserted into the holding hole 103a in the vertical movable portion 104 described later in the Z-axis direction.

又，在空氣軸承103上形成有由其外周面貫通於保持孔103a的內面之未圖示的空氣供給孔，從未圖示之空氣源所供給的空氣經由此空氣供給孔被供給至保持孔103a內。藉此，在保持孔103a的內面與上下移動軸110的外面之間形成有未圖示之空氣層，故而上下移動軸110係藉空氣軸承103(保持孔103a)被以非接觸方式導引。 In addition, the air bearing 103 is formed with an air supply hole (not shown) penetrating the inner surface of the holding hole 103a from its outer peripheral surface, and air supplied from an air source not shown is supplied to the holding hole through the air supply hole.孔103a. Thereby, an air layer (not shown) is formed between the inner surface of the holding hole 103a and the outer surface of the vertical movement shaft 110, so the vertical movement shaft 110 is guided in a non-contact manner by the air bearing 103 (holding hole 103a) .

再者，在空氣軸承103下端部的外周面，沿著其周向形成有環狀的凸緣部103b。 Furthermore, on the outer peripheral surface of the lower end of the air bearing 103, an annular flange portion 103b is formed along the circumferential direction.

上下可動部104係藉空氣軸承103被以非接觸方式移動自如地保持於Z軸方向。此上下可動部104備有上下移動軸110、止動環111、彈簧支承部112、平台底座113、及平台114。 The vertical movable portion 104 is movably held in the Z-axis direction by the air bearing 103 in a non-contact manner. The vertical movable portion 104 is provided with a vertical moving shaft 110, a stop ring 111, a spring supporting portion 112, a platform base 113, and a platform 114.

上下移動軸110係如所述，***通於空氣軸承103的保持孔103a，且藉空氣軸承103被以非接觸方式移動 自如地保持於Z軸方向。大致環狀的止動環111被外嵌於此上下移動軸110外周面的下端部。又，在上下移動軸110的上面固定有彈簧支承部112。 The vertical movement shaft 110 is inserted into the holding hole 103a of the air bearing 103 as described above, and is moved in a non-contact manner by the air bearing 103 Freely maintain the Z-axis direction. A substantially annular stop ring 111 is externally fitted on the lower end of the outer peripheral surface of the vertical movement shaft 110. In addition, a spring support 112 is fixed to the upper surface of the vertical movement shaft 110.

止動環111的外徑係形成大於保持孔103a的直徑。彈簧支承部112備有圓板部112a、及設於此圓板部112a下面的嵌合部112b。圓板部112a的外徑係形成大於螺旋彈簧105的外徑。嵌合部112b係與螺旋彈簧105的上側的開口部嵌合。 The outer diameter of the stop ring 111 is formed to be larger than the diameter of the holding hole 103a. The spring support portion 112 is provided with a disc portion 112a and a fitting portion 112b provided under the disc portion 112a. The outer diameter of the circular plate portion 112 a is formed to be larger than the outer diameter of the coil spring 105. The fitting portion 112b is fitted into the upper opening of the coil spring 105.

平台底座113係固定於彈簧支承部112的上面。於此平台底座113的上面固定著平台114。平台114的上面係成為所述的接觸面20a。 The platform base 113 is fixed on the upper surface of the spring supporting portion 112. A platform 114 is fixed on the upper surface of the platform base 113. The upper surface of the platform 114 becomes the aforementioned contact surface 20a.

螺旋彈簧105係以被壓縮於Z軸方向的狀態下安裝在凸緣部103b與彈簧支承部112之間。所述的空氣軸承103的上端部***螺旋彈簧105下側的開口部。藉此，螺旋彈簧105下端抵接於凸緣部103b的上面。另一方面，在螺旋彈簧105的上側的開口部有嵌合所述的嵌合部112b。因此，螺旋彈簧105係隔著彈簧支承部112將上下可動部104的各部位(平台114等)朝Z軸方向的上方偏置。其結果，止動環111抵接於保持孔103a下側的開口緣部，平台114在Z軸方向的高度位置被維持固定。 The coil spring 105 is installed between the flange portion 103b and the spring support portion 112 in a state compressed in the Z-axis direction. The upper end of the air bearing 103 is inserted into the opening on the lower side of the coil spring 105. Thereby, the lower end of the coil spring 105 abuts on the upper surface of the flange portion 103b. On the other hand, the above-mentioned fitting portion 112b is fitted into the opening on the upper side of the coil spring 105. Therefore, the coil spring 105 biases each portion (the platform 114 and the like) of the vertical movable portion 104 upward in the Z-axis direction via the spring support portion 112. As a result, the stop ring 111 abuts on the opening edge portion on the lower side of the holding hole 103a, and the height position of the platform 114 in the Z-axis direction is maintained and fixed.

LVDT106係設於基座102下面。此LVDT106備有鐵心等之芯部106a、及線圈106b。芯部106a係固定於上下移動軸110的下面，往Z軸方向的下方延伸。此芯部106a的中心軸係與所述的中心軸C一致。芯部106a係與上下移動軸110(上下可動部104)一體地往Z軸方向移動。 The LVDT106 is located under the base 102. This LVDT 106 is equipped with a core 106a such as an iron core and a coil 106b. The core 106a is fixed to the lower surface of the vertical movement shaft 110 and extends downward in the Z-axis direction. The central axis of the core 106a is consistent with the aforementioned central axis C. The core 106a moves in the Z-axis direction integrally with the vertical movement shaft 110 (the vertical movable portion 104).

線圈106b具有與Z軸方向平行的大致圓筒形狀。芯部106a以非接觸方式***此線圈106b的內部。線圈106b具有：藉輸入電壓(交流)而被激磁的一次線圈(未圖示)；及依芯部106a在Z軸方向的變位而產生輸出電壓(感應電壓)的二次線圈(未圖示)。 The coil 106b has a substantially cylindrical shape parallel to the Z-axis direction. The core 106a is inserted into this coil 106b in a non-contact manner. The coil 106b has: a primary coil (not shown) that is excited by an input voltage (AC); and a secondary coil (not shown) that generates an output voltage (induced voltage) according to the displacement of the core 106a in the Z-axis direction ).

微小移動檢測部118係向線圈106b供給輸入電壓，並因應芯部106a在Z軸方向的變位而檢測從線圈106b所輸出之輸出電壓。微小移動檢測部118係依據從線圈106b輸出的輸出電壓，檢測芯部106a、亦即上下可動部104(平台114等)在Z軸方向的微小移動。 The minute movement detection unit 118 supplies an input voltage to the coil 106b, and detects the output voltage output from the coil 106b in response to the displacement of the core 106a in the Z-axis direction. The minute movement detection unit 118 detects the minute movement in the Z-axis direction of the core portion 106a, that is, the vertical movable portion 104 (table 114, etc.) based on the output voltage output from the coil 106b.

依據上述構成的探針高度檢測器100，透過高度調整機構27使探針高度檢測器100朝Z軸方向上方移動，當平台114的接觸面20a接觸於探針25的前端時，上下可動部104(平台114等)及芯部106a往Z軸方向的下方微小移動。藉此，因應於芯部106a的微小移動而從線圈106b輸出的輸出電壓是被輸入於微小移動檢測部118。 因此，微小移動檢測部118可檢測上下可動部104(平台114等)在Z軸方向的微小移動、亦即，探針25的前端對接觸面20a之接觸。以下，因為是與所述的探針高度檢測器20相同，故省略具體的說明。 According to the probe height detector 100 constructed as described above, the probe height detector 100 is moved upward in the Z-axis direction through the height adjustment mechanism 27. When the contact surface 20a of the platform 114 contacts the tip of the probe 25, the vertical movable portion 104 (The platform 114 etc.) and the core 106a move slightly downward in the Z-axis direction. Thereby, the output voltage output from the coil 106b in response to the minute movement of the core 106a is input to the minute movement detection unit 118. Therefore, the minute movement detection unit 118 can detect the minute movement of the vertical movable portion 104 (the platform 114 and the like) in the Z-axis direction, that is, the contact of the tip of the probe 25 with the contact surface 20a. Hereinafter, since it is the same as the probe height detector 20 described above, a detailed description is omitted.

如此，就探針高度檢測器100而言，因為使用LVDT106檢測探針25的前端對接觸面20a之接觸，故能提升此接觸的檢測精度〔接觸響應性(敏感性)〕。其結果，可提升從所述的基準面算起之探針25的前端的高度之測定精度。又，可精度佳地檢測伴隨於探針25的前端朝向接觸面20a之接觸的平台114等在Z軸方向之移動量(推入量)及伴隨於接觸之在Z軸方向的推壓力。 In this way, for the probe height detector 100, because the LVDT 106 is used to detect the contact of the tip of the probe 25 with the contact surface 20a, the detection accuracy of the contact (contact responsiveness (sensitivity)) can be improved. As a result, the measurement accuracy of the height of the tip of the probe 25 from the reference plane can be improved. In addition, it is possible to accurately detect the movement amount (pushing amount) of the platform 114 and the like in the Z-axis direction accompanying the contact of the tip of the probe 25 toward the contact surface 20a and the pushing force in the Z-axis direction accompanying the contact.

以上針對本發明的例子作了說明，惟本發明不受上述實施形態所限，當然可在不悖離本發明精神之範圍下進行各種變形。 The examples of the present invention have been described above, but the present invention is not limited to the above-mentioned embodiments, of course, various modifications can be made without departing from the scope of the present invention.

10‧‧‧探針機台 10‧‧‧Probe machine

11‧‧‧基台 11‧‧‧Abutment

12‧‧‧移動座 12‧‧‧Mobile seat

13‧‧‧Y軸移動台 13‧‧‧Y-axis moving stage

14‧‧‧X軸移動台 14‧‧‧X axis moving table

15‧‧‧旋轉部 15‧‧‧Rotating part

16‧‧‧晶圓夾盤 16‧‧‧Wafer Chuck

18‧‧‧探針位置檢測相機 18‧‧‧Probe position detection camera

19‧‧‧晶圓校準相機 19‧‧‧Wafer alignment camera

20‧‧‧探針高度檢測器 20‧‧‧Probe height detector

20a‧‧‧接觸面 20a‧‧‧Contact surface

20b‧‧‧感測機構 20b‧‧‧Sensing mechanism

21‧‧‧高度調整機構 21‧‧‧Height adjustment mechanism

22‧‧‧探針頭平台 22‧‧‧Probe head platform

23‧‧‧探針卡保持器 23‧‧‧Probe card holder

24‧‧‧探針卡 24‧‧‧Probe card

25‧‧‧探針 25‧‧‧Probe

27‧‧‧高度調整機構 27‧‧‧Height adjustment mechanism

30‧‧‧測試器 30‧‧‧Tester

31‧‧‧測試器本體 31‧‧‧Tester body

32‧‧‧接觸環 32‧‧‧Contact ring

60‧‧‧控制部 60‧‧‧Control Department

61‧‧‧顯示部 61‧‧‧Display

62‧‧‧輸入部 62‧‧‧Input Department

100‧‧‧晶圓測試系統 100‧‧‧Wafer Test System

W‧‧‧晶圓 W‧‧‧wafer

Claims (14)

一種探針機台，係使探針接觸於晶圓的電極以進行檢查之探針機台，該晶圓的電極係與探針呈對向配置，該探針機台具備：探針位置檢測相機，在和前述探針對向的位置，檢測前述探針的前端位置，該前述探針的前端位置係包含前述探針的前端的水平面內的位置及相對於水平面之垂直方向的高度位置；及探針高度檢測器，與前述探針位置檢測相機一體設置，在和前述探針對向的位置，檢測前述探針的前端的高度位置。 A probe machine is a probe machine that makes the probe contact the electrode of the wafer for inspection. The electrode of the wafer is arranged opposite to the probe. The probe machine has: probe position detection The camera detects the tip position of the probe at a position opposite to the probe. The tip position of the probe includes the position in the horizontal plane of the tip of the probe and the height position in the vertical direction relative to the horizontal plane; and The probe height detector is provided integrally with the probe position detection camera, and detects the height position of the tip of the probe at a position facing the probe. 如請求項1之探針機台，其更具備：高度調整機構，依據前述探針高度檢測器的檢測結果，改變從作為前述探針位置檢測相機的高度基準之基準面算起之前述探針位置檢測相機之高度。 For example, the probe machine of claim 1, which is further equipped with: a height adjustment mechanism to change the probe from the reference plane as the height reference of the probe position detection camera based on the detection result of the probe height detector The height of the position detection camera. 如請求項1或2之探針機台，其中前述探針高度檢測器具有差動變壓器，其檢測前述探針的前端之接觸。 Such as the probe machine of claim 1 or 2, wherein the probe height detector has a differential transformer that detects the contact of the tip of the probe. 如請求項1或2之探針機台，其中前述探針高度檢測器係接觸型檢測器，其具有與前述探針的前端接觸之接觸面，檢測前述探針的前端接觸於前述接觸面時之前述接觸面的高度作為前述探針的前端的高度，前述接觸面的高度，係設於比前述探針位置檢測相機的高度還高的位置。 The probe machine of claim 1 or 2, wherein the probe height detector is a contact type detector, which has a contact surface that contacts the tip of the probe, and detects when the tip of the probe is in contact with the contact surface The height of the contact surface is the height of the tip of the probe, and the height of the contact surface is set at a position higher than the height of the probe position detection camera. 一種探針機台的操作方法，係使探針接觸於晶圓的電極以進行檢查，該方法包含：第1檢測步驟，在和前述探針對向的位置，藉由探針高度檢測器檢測前述探針的前端的高度位置，該探針高度檢測器係與前述探針位置檢測相機一體設置；和第2檢測步驟，在和前述探針對向的位置，藉由探針位置檢測相機檢測前述探針的前端位置，該前述探針的前端位置係包含前述探針的前端的水平面內的位置及相對於水平面之垂直方向的高度位置。 An operating method of a probe machine is to make a probe contact the electrode of a wafer for inspection. The method includes: a first detection step, at a position opposite to the probe, detecting the probe height by a probe height detector The height position of the tip of the probe, the probe height detector is integrated with the probe position detection camera; and the second detection step, in the position opposite to the probe, the probe position detection camera detects the probe The tip position of the needle, the tip position of the probe includes the position in the horizontal plane of the tip of the probe and the height position in the vertical direction relative to the horizontal plane. 如請求項5之探針機台的操作方法，其更具備：高度調整步驟，依據前述第1檢測步驟的檢測結果，改變從作為前述探針位置檢測相機的高度基準之基準面算起之前述探針位置檢測相機之高度。 For example, the operation method of the probe machine of claim 5, which further includes: a height adjustment step, according to the detection result of the first detection step, change the aforementioned reference plane as the height reference of the aforementioned probe position detection camera The probe position detects the height of the camera. 如請求項5或6之探針機台的操作方法，其中前述第1檢測步驟係包含使用差動變壓器檢測前述探針的前端之接觸。 Such as claim 5 or 6, wherein the first detection step includes using a differential transformer to detect the contact of the tip of the probe. 如請求項5或6之探針機台的操作方法，其中前述探針高度檢測器係接觸型檢測器，其具有與前述探針的前端接觸之接觸面，檢測前述探針的前端接觸於前述接觸面時之前述接觸面的高度作為前述探針的前端的高度，前述接觸面的高度，係設於比前述探針位置檢測相機的高度還高的位置。 The operation method of the probe machine of claim 5 or 6, wherein the probe height detector is a contact type detector, which has a contact surface that contacts the tip of the probe, and detects that the tip of the probe is in contact with the tip The height of the contact surface at the time of contact is the height of the tip of the probe, and the height of the contact surface is set at a position higher than the height of the probe position detection camera. 一種探針機台的操作方法，係使探針接觸於晶圓的電 極以進行檢查之探針機台的操作方法，包含：使用與探針位置檢測相機分開設置的探針高度檢測器，檢測從作為前述探針位置檢測相機的高度基準之基準面算起之前述探針的前端的高度之第1高度檢測步驟；依據前述探針高度檢測器的檢測結果，改變從前述基準面算起之前述探針位置檢測相機的高度之步驟；及為了進行前述晶圓的電極與前述探針之相對的對位，使用探針位置檢測相機檢測前述探針的前端位置之第2高度檢測步驟。 A method of operating a probe machine is to make the probe contact the electrical The operation method of the probe machine for inspection includes: using a probe height detector installed separately from the probe position detection camera to detect the aforementioned reference plane as the height reference of the probe position detection camera The first height detection step of the height of the tip of the probe; the step of changing the height of the probe position detection camera from the reference plane based on the detection result of the probe height detector; and for performing the wafer The electrode and the probe are aligned relative to each other, and a probe position detection camera is used to detect the second height detection step of the tip position of the probe. 如請求項9之探針機台的操作方法，其中在前述第1高度檢測步驟，使用前述探針高度檢測器，檢測前述探針的前端的高度，前述探針高度檢測器具有與前述探針的前端接觸之接觸面、及檢測前述探針的前端朝向前述接觸面之接觸的線性可變差動變壓器。 For example, the method for operating a probe machine of claim 9, wherein in the first height detection step, the probe height detector is used to detect the height of the tip of the probe, and the probe height detector has the same height as the probe The front end of the probe contacts the contact surface, and the linear variable differential transformer that detects the contact of the front end of the probe toward the contact surface. 如請求項9或10之探針機台的操作方法，其中前述探針高度檢測器係接觸型，前述第1高度檢測步驟中，使用前述接觸型探針高度檢測器，對前述探針的前端的高度作複數次檢測，且更包含依據在前述第1高度檢測步驟之複數次的檢測結果，檢測探針卡的傾斜之傾斜檢測步驟。 Such as claim 9 or 10 of the method of operating the probe machine, wherein the probe height detector is a contact type, and in the first height detection step, the contact type probe height detector is used for the tip of the probe The height of is detected multiple times, and further includes a tilt detection step of detecting the tilt of the probe card according to the multiple detection results in the first height detection step. 如請求項11之探針機台的操作方法，其中在前述第2高度檢測步驟中，使用與前述探針高 度檢測器一體設置之探針位置檢測相機，將從前述基準面算起之前述探針的前端的高度作複數次檢測，前述傾斜檢測步驟係依據在前述第1高度檢測步驟的檢測結果及在前述第2高度檢測步驟的檢測結果，檢測前述探針卡的傾斜。 Such as claim 11 of the operating method of the probe machine, wherein in the second height detection step, the height of the probe is The probe position detection camera integrated with the degree detector detects the height of the tip of the probe from the reference plane multiple times. The tilt detection step is based on the detection result in the first height detection step and the As a result of the detection in the second height detection step, the tilt of the probe card is detected. 如請求項11之探針機台的操作方法，其中前述第1高度檢測步驟係於前述第2高度檢測步驟之前進行。 Such as the method of operating the probe machine of claim 11, wherein the first height detection step is performed before the second height detection step. 如請求項12之探針機台的操作方法，其中前述第1高度檢測步驟係於前述第2高度檢測步驟之前進行。 Such as the method of operating the probe machine of claim 12, wherein the first height detection step is performed before the second height detection step.
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