TWI705490B - Cutting device - Google Patents

Cutting device Download PDF

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TWI705490B
TWI705490B TW106110731A TW106110731A TWI705490B TW I705490 B TWI705490 B TW I705490B TW 106110731 A TW106110731 A TW 106110731A TW 106110731 A TW106110731 A TW 106110731A TW I705490 B TWI705490 B TW I705490B
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light
cutting
unit
amount
tool
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TW106110731A
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TW201740452A (en
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笠井剛史
佐藤雅史
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本發明之課題為提供一種能夠精度良好地檢測切割刀之刀尖位置的切割裝置。解決手段為刀具檢測器件具有包夾切割刀侵入之刀具侵入部而相面對的發光部與受光部，控制裝置具有閾值登錄部與判斷部，該閾值登錄部可登錄在切割刀已遠離刀具侵入部的退避狀態下，規定將來自發光部之光接收的受光部之受光量的適當範圍的閾値，該判斷部在退避狀態下的受光量在適當範圍内的情況下，會使其實施使切割刀侵入刀具侵入部來檢測切割刀之前端位置的檢測動作，在退避狀態下的該受光量在適當範圍外的情況下，會將包含該切割水之霧氣的該環境氣體排出且直至該霧氣之影響下已降低的該受光量成為在適當範圍内以前使該檢測動作待機。The subject of the present invention is to provide a cutting device capable of accurately detecting the position of the tip of a cutting knife. The solution is that the tool detection device has a light-emitting part and a light-receiving part facing the tool intrusion part of the cutting knife, and the control device has a threshold registration part and a judgment part. The threshold registration part can register when the cutting knife is far away from the tool invasion. In the retracted state of the light-emitting section, it defines the threshold value of the appropriate range of the light-receiving amount of the light-receiving section that receives the light from the light-emitting section. When the light-receiving amount in the retracted state is within the appropriate range, the judgment section will make it cut The knife penetrates into the cutting tool intrusion part to detect the detection action of the cutting knife's front end position. When the amount of light received in the retracted state is outside the appropriate range, the ambient gas containing the cutting water mist will be discharged until the mist The detection operation is put on standby until the amount of received light that has been reduced under the influence becomes within an appropriate range.

Description

切割裝置Cutting device

發明領域 本發明是有關於一種具有切割被加工物之切割刀的切割裝置。FIELD OF THE INVENTION The present invention relates to a cutting device having a cutting knife for cutting workpieces.

發明背景 一般在將半導體晶圓或樹脂封裝基板等的被加工物沿預定的分割線分割時，會使用具有沿此分割線切割被加工物之切割刀的切割裝置。在此種切割裝置中，會藉由使保持被加工物的工作夾台與切割刀，在與工作夾台之保持面平行的方向(加工進給方向)上相對地移動，而在被加工物上加工切割溝。又，會藉由相對於被加工物使切割刀在鉛直方向(切入進給方向)上進行上下動，而調整切割溝的切入深度。另 一方面，由於切割刀會因為使用而摩耗，所以鉛直方向上之切割刀的刀尖位置(前端位置)的管理就變得很重要。BACKGROUND OF THE INVENTION Generally, when a workpiece such as a semiconductor wafer or a resin package substrate is divided along a predetermined dividing line, a cutting device having a dicing blade for cutting the workpiece along the dividing line is used. In this cutting device, the work chuck table and the cutting knife that hold the workpiece are moved relatively in a direction parallel to the holding surface of the work chuck table (processing feed direction). Upper processing cutting groove. In addition, the cutting blade is moved up and down in the vertical direction (cutting feed direction) relative to the workpiece to adjust the cutting depth of the cutting groove. On the other hand, since the cutting knife wears due to use, the management of the tip position (tip position) of the cutting knife in the vertical direction becomes very important.

因此，已知以往有一種具有發光部及受光部，並使切割刀侵入此發光部與受光部之間，而進行該切割刀之刀尖位置的檢測的構成(參照例如專利文獻1)。在此構成中，是將以受光部所接受到的光量轉換成電壓，並藉由使切割刀的刀尖遮蔽光之作法，而從電壓減少至預定的值之時的切割刀的刀尖位置計算出該切割刀的原點位置(中心位置)。 先前技術文獻 專利文獻Therefore, conventionally, there is known a configuration that has a light-emitting portion and a light-receiving portion, and allows a cutting blade to penetrate between the light-emitting portion and the light-receiving portion to detect the position of the tip of the cutting blade (see, for example, Patent Document 1). In this configuration, the amount of light received by the light-receiving part is converted into voltage, and the tip of the cutter is shielded from the light, and the position of the tip of the cutter when the voltage is reduced to a predetermined value The origin position (center position) of the cutter is calculated. Prior art documents Patent documents

專利文獻1：日本專利特許第4590060號公報Patent Document 1: Japanese Patent No. 4590060

發明概要 發明欲解決之課題 然而，在上述的切割裝置中，由於會對被保持在工作夾台的被加工物供給純水等的切割水並進行切割加工，所以可設想為具備有圍繞工作夾台及切割刀的加工室、及排出此加工室内之環境氣體的排氣部之構成。此時，雖然受光部可利用來自發光部之光的受光量，感測切割刀的刀尖位置，但是當設置有這些發光部及受光部之加工室的環境氣體中含有大量霧氣(切割水)時，會有受光量被霧氣遮蔽或因霧氣而進行亂反射並變動之疑慮。因此，存在有錯誤計算出切割刀的原點位置，而導致對被加工物之切入深度不同的疑慮。SUMMARY OF THE INVENTION Problems to be solved by the invention. However, in the above-mentioned cutting device, since cutting water such as pure water is supplied to the workpiece held on the work clamp table to perform cutting processing, it is conceivable that it is provided with a surrounding work clamp The structure of the processing chamber of the table and the cutting knife, and the exhaust part that discharges the ambient air in the processing chamber. At this time, although the light-receiving part can use the amount of light from the light-emitting part to sense the position of the tip of the cutting blade, when the ambient air in the processing room where these light-emitting parts and light-receiving parts are installed contains a lot of mist (cutting water) At that time, there is a concern that the amount of light received is blocked by fog or that it is randomly reflected and changed due to fog. Therefore, there is a miscalculation of the origin position of the cutting knife, which leads to doubts about the difference in the cutting depth of the workpiece.

本發明是有鑑於上述而作成的發明，其目的在於提供一種能夠精度良好地檢測切割刀之刀尖位置的切割裝置。 用以解決課題之手段The present invention is an invention made in view of the above, and its object is to provide a cutting device capable of accurately detecting the position of the tip of a cutting knife. Means to solve the problem

為了解決上述的課題並達成目的，本發明是一種切割裝置，其具備將被加工物以保持面保持的工作夾台、對被該工作夾台所保持的被加工物供給切割液並且以切割刀切割的切割單元、檢測與該保持面正交之切入進給方向上的該切割刀之前端位置的刀尖位置檢測單元、圍繞該工作夾台與該切割單元與該刀尖位置檢測單元的加工室、將該加工室内之環境氣體排出的排氣單元、及控制各構成要素的控制器件，該切割裝置的特徵在於： 該刀尖位置檢測單元具有包夾該切割刀侵入的刀具侵入部而相面對的發光部、與接收來自該發光部之光的受光部， 該控制器件具有： 閾值登錄部，可登錄在該切割刀已遠離該刀具侵入部的退避狀態下，規定將來自該發光部之光接收的該受光部之受光量的適當範圍的閾値；及 判斷部，在該退避狀態下之該受光量在該適當範圍内的情況下，使其實施使該切割刀侵入該刀具侵入部來檢測該切割刀之前端位置的檢測動作，在該退避狀態下之該受光量在該適當範圍外的情況下，將包含該切割液之霧氣的該環境氣體排出且直至該受光量成為該適當範圍内以前讓該檢測動作的開始待機。In order to solve the above-mentioned problems and achieve the object, the present invention is a cutting device that includes a work chuck table for holding a workpiece on a holding surface, and supplies cutting fluid to the workpiece held by the work chuck table and cuts with a cutting knife A cutting unit, a tool tip position detection unit that detects the front end position of the cutting knife in the cutting feed direction orthogonal to the holding surface, and a processing chamber surrounding the work clamp table and the cutting unit and the tool tip position detection unit , An exhaust unit that exhausts the ambient air in the processing chamber, and a control device that controls each component, the cutting device is characterized in that: the tool tip position detection unit has a tool intrusion part that entraps the cutting knife and faces The control device has: a threshold registration part, which can register the cutting knife in the retracted state where the cutting knife is far away from the tool intrusion part, and stipulate that the light-emitting part will come from the light-emitting part and the light-receiving part that receives the light from the light-emitting part. The threshold value of the appropriate range of the light-receiving portion of the light-receiving portion receiving light; and the judging portion, when the light-receiving amount in the retracted state is within the appropriate range, the cutting knife is made to intrude into the tool intruding portion. The detection action of detecting the front end position of the cutting knife, and when the received light amount in the retracted state is outside the appropriate range, the ambient gas containing the mist of the cutting fluid is discharged until the received light amount reaches the appropriate range Let the start of the detection operation wait before inside.

依據此種構成，由於會因應於刀尖位置檢測單元之受光部的受光量，而判斷加工室内的環境氣體是否為適合於刀尖位置的檢測之狀態，所以能夠精度良好地檢測刀尖位置。According to this configuration, it is determined whether the ambient air in the processing chamber is in a state suitable for detection of the tool nose position according to the amount of light received by the light receiving part of the tool nose position detection unit, so that the tool nose position can be accurately detected.

在此構成中，該閾值登錄部亦可登錄有每單位時間之測量到該適當範圍内的受光量之時間的閾値。 發明效果In this configuration, the threshold value registration unit may also register the threshold value of the time per unit time to measure the amount of light received within the appropriate range. Invention effect

依據本發明，由於是因應於刀尖位置檢測單元之受光部的受光量，來判斷加工室内之環境氣體是否為適合於刀尖位置之檢測的狀態，所以可以發揮能夠精度良好地檢測刀尖位置的効果。According to the present invention, it is determined whether the ambient gas in the processing chamber is in a state suitable for detection of the tool tip position according to the amount of light received by the light receiving part of the tool tip position detection unit, so that the tool tip position can be accurately detected. Effect.

用以實施發明之形態 針對用於實施本發明之形態(實施形態)，參照圖式並且詳細地進行說明。本發明並非因以下實施形態所記載之內容而受到限定的發明。又，在以下所記載之構成要素中，包含所屬技術領域中具有通常知識者可輕易設想得到之事物或實質上相同之事物。此外，以下所記載之構成是可以適當組合的。又，在不脫離本發明之要旨的範圍內，可進行各種構成之省略、置換或變更。Modes for Carrying Out the Invention The modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the constituent elements described below include things that can be easily imagined by a person with ordinary knowledge in the technical field or things that are substantially the same. In addition, the configurations described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made in various configurations without departing from the scope of the present invention.

圖1為本實施形態之加工裝置的立體圖。加工裝置1是對例如圓板狀的半導體晶圓或光元件晶圓等之晶圓W(被加工物)進行切割加工的裝置。在被加工物中，可包含的不只圓板形状的晶圓W，還有形成為矩形形狀的封裝基板、陶瓷基板、玻璃基板等。如圖1所示，加工裝置1具備工作夾台10與切割單元30，該工作夾台10是配置於直方體狀的基台2上，且保持具有上述晶圓W之晶圓單元(被加工物單元)WU，該切割單元30會對被工作夾台10所保持之晶圓單元WU的晶圓W進行切割加工。又，加工裝置1具備搭載於基台2上，且遮蓋工作夾台10及切割單元30的加工室3。又，加工裝置1具備控制包含工作夾台10及切割單元30之各構成要素的動作的控制裝置(控制器件)6。Fig. 1 is a perspective view of the processing device of the embodiment. The processing apparatus 1 is an apparatus that cuts and processes a wafer W (worked object) such as a disc-shaped semiconductor wafer or an optical element wafer. In the workpiece, not only the wafer W in the shape of a disc may be included, but also a package substrate, a ceramic substrate, a glass substrate, etc. formed in a rectangular shape. As shown in FIG. 1, the processing apparatus 1 includes a work chuck table 10 and a cutting unit 30. The work chuck table 10 is arranged on a rectangular parallelepiped base 2 and holds a wafer unit (processed) having the above-mentioned wafer W. Object unit) WU, the cutting unit 30 will cut the wafer W of the wafer unit WU held by the work chuck table 10. In addition, the processing device 1 includes a processing chamber 3 mounted on the base 2 and covering the work clamp table 10 and the cutting unit 30. In addition, the processing apparatus 1 includes a control device (control device) 6 that controls the operation of each component including the work chuck table 10 and the cutting unit 30.

晶圓單元WU具備：形成為圓環狀的框架F、配置於此框架F之開口Fa之形成為圓板形狀的晶圓W、及貼附於此晶圓W及框架F之背面的黏著膠帶T。在本實施形態中，晶圓W是藉由黏著膠帶T而保持於框架F的開口Fa。晶圓W在其正面藉由形成為格子狀的切割道(分割預定線)所區劃出的多數個區域中形成有IC、LSI等的元件。The wafer unit WU includes: a frame F formed in a ring shape, a wafer W formed in the shape of a disc arranged in the opening Fa of the frame F, and adhesive tape attached to the back of the wafer W and the frame F T. In this embodiment, the wafer W is held in the opening Fa of the frame F by the adhesive tape T. On the front surface of the wafer W, elements such as ICs, LSIs, etc. are formed in a plurality of regions divided by dicing lines (planned dividing lines) formed in a lattice shape.

工作夾台10是可在X軸方向(加工進給方向)上移動地設置在上述之基台2上。工作夾台10具有載置並吸引晶圓單元WU的保持面11。又，工作夾台10是藉由圖未示的旋轉機構而以Z軸方向作為旋轉軸並可旋動地構成。The work chuck table 10 is provided on the above-mentioned base 2 so as to be movable in the X-axis direction (processing feed direction). The work chuck table 10 has a holding surface 11 on which the wafer unit WU is placed and sucked. In addition, the work chuck table 10 is configured to be rotatable with the Z-axis direction as a rotation axis by a rotation mechanism not shown.

又，在基台2的上表面，設置有沿Y軸方向(分度方向)擴展，並且跨越加工室3而配置之門型的支撐構造4。加工裝置1具備：設置於支撐構造4上，且可在Y軸方向(分度方向)上移動地支撐切割單元30的分度進給機構(分度進給器件)13、及可在與工作夾台10之保持面11正交的Z軸方向(切入進給方向)上移動地支撐切割單元30的切入進給機構(切入進給器件)14。分度進給機構13具備固定於支撐構造4的側面且在Y軸方向上延伸之一對導軌15、與這些導軌15平行地配設的滾珠螺桿16、及在內部具有螺合於此滾珠螺桿16的螺帽(圖未示)，而沿導軌15移動的Y軸滑板17。於滾珠螺桿16的一端連結有使該滾珠螺桿16旋轉的脈衝馬達(圖未示)，藉由滾珠螺桿16的旋轉，Y軸滑板17會沿著導軌15在Y軸方向上移動。In addition, on the upper surface of the base 2, a gate-shaped support structure 4 that extends in the Y-axis direction (indexing direction) and is arranged across the processing chamber 3 is provided. The processing device 1 is provided with an indexing feed mechanism (indexing feed device) 13 that is provided on the support structure 4 and supports the cutting unit 30 movably in the Y-axis direction (indexing direction), and can work in and The holding surface 11 of the chuck table 10 supports the cutting and feeding mechanism (cutting and feeding device) 14 of the cutting unit 30 to move in the Z-axis direction (cutting and feeding direction) orthogonal to the holding surface 11 of the chuck table 10. The indexing feed mechanism 13 is provided with a pair of guide rails 15 fixed to the side surface of the support structure 4 and extending in the Y-axis direction, a ball screw 16 arranged in parallel with the guide rails 15, and a ball screw threaded therein. 16 nut (not shown), and Y-axis sliding plate 17 moving along the guide rail 15. A pulse motor (not shown) is connected to one end of the ball screw 16 to rotate the ball screw 16. By the rotation of the ball screw 16, the Y-axis slide plate 17 moves along the guide rail 15 in the Y-axis direction.

切入進給機構14具備固定於Y軸滑板17的側面，且在Z軸方向上延伸的一對導軌18、與這些導軌18平行地配設的滾珠螺桿19、及在內部具有螺合於此滾珠螺桿19的螺帽 (圖未示)，而沿導軌18移動的Z軸滑板20。於滾珠螺桿19的一端連結有使該滾珠螺桿19旋轉的脈衝馬達21，藉由滾珠螺桿19的旋轉，Z滑板20會沿導軌18在Z軸方向上移動。The cutting and feeding mechanism 14 is provided with a pair of guide rails 18 fixed to the side surface of the Y-axis slide plate 17 and extending in the Z-axis direction, ball screws 19 arranged in parallel with the guide rails 18, and a ball screwed therein. The screw cap of the screw 19 (not shown), and the Z-axis sliding plate 20 that moves along the guide rail 18. A pulse motor 21 that rotates the ball screw 19 is connected to one end of the ball screw 19. By the rotation of the ball screw 19, the Z slide plate 20 moves along the guide rail 18 in the Z axis direction.

切割單元30是連結於Z軸滑板20的下端部。因此，切割單元30會藉由分度進給機構13的動作，而與Z軸滑板20一起在Y軸方向上移動，並調整對於晶圓W的切割位置，且藉由切入進給機構14的動作，而在Z軸方向上移動，並調整對於晶圓W的切入深度。The cutting unit 30 is connected to the lower end of the Z-axis sliding plate 20. Therefore, the cutting unit 30 moves in the Y-axis direction together with the Z-axis slide plate 20 by the action of the indexing and feeding mechanism 13, and adjusts the cutting position for the wafer W, and by the cutting-in and feeding mechanism 14 Moves in the Z-axis direction, and adjusts the depth of cutting into the wafer W.

圖2是加工裝置之加工室内的側剖面圖，圖3是加工裝置之加工室内的平面圖。加工室3是形成為遮蓋工作夾台10及切割單元30的箱型形狀。具體來說，其具備矩形形狀的頂板3A、從此頂板3A之沿著X軸方向(加工進給方向)的緣部各自朝下方延伸的一對側板3B、及從該頂板3A之沿著Y軸方向(分度方向)的縁部各自朝下方延伸的一對側板3C。加工室3是藉由配設於X軸方向中間的隔板3D，而分隔成對工作夾台10裝卸晶圓W的裝卸區域5A、及對已保持於工作夾台10的晶圓W進行切割加工的加工區域5B。在隔板3D的下部形成有容許工作夾台10之通過的開口部3E。Fig. 2 is a side sectional view of the processing chamber of the processing device, and Fig. 3 is a plan view of the processing chamber of the processing device. The processing chamber 3 is formed in a box shape that covers the work clamp table 10 and the cutting unit 30. Specifically, it includes a rectangular top plate 3A, a pair of side plates 3B each extending downward from the edge of the top plate 3A along the X axis direction (processing feed direction), and a pair of side plates 3B extending downward from the top plate 3A along the Y axis A pair of side plates 3C each extending downward in the direction (indexing direction). The processing chamber 3 is partitioned by a partition 3D arranged in the middle of the X-axis direction into a loading and unloading area 5A where the wafer W is loaded and unloaded on the work chuck 10, and the wafer W held on the work chuck 10 is cut. Processing area 5B for processing. An opening 3E that allows the work clamp table 10 to pass through is formed in the lower part of the partition 3D.

如圖2所示，加工裝置1具備在加工室3内使工作夾台10在X軸方向(加工進給方向)上移動的加工進給機構(加工進給器件)40。加工進給機構40具備沿X軸方向移動的工作台基座41、及豎立設置於此工作台基座41上的支撐基台42，且於此支撐基台42上支撐工作夾台10。如圖3所示，在工作夾台10的周圍，設置有防水蓋43，在此防水蓋43上連結有用於保護加工進給機構40的伸縮件44。又，如圖2所示，加工裝置1在加工室3内之切割單元30的下方具備刀具檢測單元(刀尖位置檢測單元)60。此刀具檢測單元60是檢測鉛直方向上的切割刀31的前端位置(鉛直方向的下端位置)的單元。As shown in FIG. 2, the processing apparatus 1 includes a processing feed mechanism (processing feed device) 40 that moves the work chuck table 10 in the X-axis direction (processing feed direction) in the processing chamber 3. The machining feed mechanism 40 includes a table base 41 that moves in the X-axis direction, and a support base 42 erected on the table base 41, and the work chuck table 10 is supported on the support base 42. As shown in FIG. 3, a waterproof cover 43 is provided around the work chuck table 10, and a telescopic member 44 for protecting the processing and feeding mechanism 40 is connected to the waterproof cover 43. In addition, as shown in FIG. 2, the processing apparatus 1 includes a tool detection unit (tool edge position detection unit) 60 below the cutting unit 30 in the processing chamber 3. This tool detection unit 60 is a unit that detects the tip position (lower end position in the vertical direction) of the cutting blade 31 in the vertical direction.

如圖2所示，切割單元30具備裝設於被旋轉驅動之旋轉主軸(圖未示)上的切割刀31、及覆蓋此切割刀31的大致上半部的輪罩32。在輪罩32上安裝有連接管33、34，這些連接管33、34會透過軟管而連接到對切割單元30供給切割水(切割液)的切割水供給源(圖未示)。透過連接管33所供給的切割水，是從切割水噴嘴35朝切割刀31的刀尖供給，而透過連接管34所供給的切割水，是從配設於切割刀31之兩側的刀具冷卻器噴嘴36朝向加工點供給。切割水可使用例如純水。又，切割單元30具備與切割刀31並排設置，且拍攝工作夾台10上之晶圓W的攝像器件37。As shown in FIG. 2, the cutting unit 30 includes a cutting knife 31 installed on a rotating spindle (not shown) that is rotatably driven, and a wheel cover 32 covering substantially the upper half of the cutting knife 31. Connecting pipes 33 and 34 are installed on the wheel cover 32. These connecting pipes 33 and 34 are connected to a cutting water supply source (not shown) for supplying cutting water (cutting fluid) to the cutting unit 30 through a hose. The cutting water supplied through the connecting pipe 33 is supplied from the cutting water nozzle 35 to the tip of the cutting blade 31, and the cutting water supplied through the connecting pipe 34 is cooled from the cutters arranged on both sides of the cutting blade 31 The nozzle 36 is supplied toward the processing point. For cutting water, pure water can be used. In addition, the dicing unit 30 is provided with an imaging device 37 which is arranged side by side with the dicing blade 31 and photographs the wafer W on the work chuck table 10.

在本實施形態中，切割單元30在對保持於工作夾台10的晶圓W進行切割加工時，會一邊從切割水噴嘴35及刀具冷卻器噴嘴36噴出切割水一邊使工作夾台10在X軸方向(加工進給方向)上加工進給。此時，含有切割屑的切割水(切割液)38(圖2)，會藉由切割刀31的高速旋轉朝該旋轉方向的下游側飛散。因此，加工室3在加工區域5B側之側板3B的上端部具備將該加工室3内之環境氣體排出的排氣口3F，且對此排氣口3F如圖3所示地連接有排氣單元39。此排氣單元39會透過排氣管39A，而連接於排氣口3F，並將加工室3内的環境氣體排出至外部。作為排氣單元39，可以採用例如設於設置有加工裝置1之加工區的排氣設備、或連接於排氣管39A又或排氣口3F的排氣風扇等。In this embodiment, when the dicing unit 30 performs cutting processing on the wafer W held on the work chuck 10, while spraying cutting water from the cutting water nozzle 35 and the tool cooler nozzle 36, the work chuck 10 is at X Machining feed in the axis direction (processing feed direction). At this time, cutting water (cutting fluid) 38 (FIG. 2) containing cutting chips is scattered toward the downstream side of the rotation direction by the high-speed rotation of the cutting blade 31. Therefore, the processing chamber 3 is provided with an exhaust port 3F at the upper end of the side plate 3B on the side of the processing area 5B to exhaust the ambient gas in the processing chamber 3, and the exhaust port 3F is connected to the exhaust port 3F as shown in FIG. Unit 39. The exhaust unit 39 passes through the exhaust pipe 39A, is connected to the exhaust port 3F, and exhausts the ambient gas in the processing chamber 3 to the outside. As the exhaust unit 39, for example, an exhaust equipment provided in a processing area where the processing device 1 is installed, or an exhaust fan connected to the exhaust pipe 39A or the exhaust port 3F, or the like can be used.

又，如圖1所示，加工室3設置有保護分度進給機構(分度進給器件)13的滾珠螺桿16免於受到切割水之飛沫的保護伸縮件50。此保護伸縮件50是將一端部52固定於支撐構造4的其中一邊的立設部，將中間部54安裝於Y軸滑板17的一端部，並將伸縮件50的另一端部56固定於支撐構造4的另一邊的立設部。雖然在圖1中為了清楚化而顯示的是保護伸縮件50並未安裝於預定位置的狀態，但實際上會安裝於如圖2所示的位置上。Moreover, as shown in FIG. 1, the processing chamber 3 is provided with a protective telescopic member 50 that protects the ball screw 16 of the indexing feeding mechanism (indexing feeding device) 13 from the spray of cutting water. This protective telescopic member 50 is a standing portion that fixes one end 52 to one side of the support structure 4, mounts the middle portion 54 to one end of the Y-axis slide plate 17, and fixes the other end 56 of the telescopic member 50 to the support The standing part on the other side of the structure 4. Although FIG. 1 shows a state where the protective telescopic member 50 is not installed at a predetermined position for clarity, it will actually be installed at the position shown in FIG. 2.

接著，說明刀具檢測單元60。圖4是顯示刀具檢測單元的立體圖。圖5是控制刀具檢測單元之控制裝置的方塊圖。如圖4所示，刀具檢測單元60具備固定在包夾防水蓋43及伸縮件44(圖3)而相向配置之内壁2A上的支撐構件61、及被此支撐構件61所支撐的檢測機構62。檢測機構62是在Z軸方向(切入進給方向)上，檢測切割刀31的前端位置(鉛直方向的下端位置)。Next, the tool detection unit 60 will be described. Fig. 4 is a perspective view showing the tool detection unit. Fig. 5 is a block diagram of a control device that controls the tool detection unit. As shown in FIG. 4, the tool detection unit 60 includes a support member 61 fixed to the inner wall 2A that is arranged opposite to the waterproof cover 43 and the telescopic member 44 (FIG. 3), and a detection mechanism 62 supported by the support member 61 . The detection mechanism 62 detects the tip position (lower end position in the vertical direction) of the cutting blade 31 in the Z-axis direction (cutting feed direction).

如圖4所示，檢測機構62具備固定於支撐構件61的基台部62A、及豎立設置於此基台部62A的安裝構件62B。此安裝構件62B是具備水平部62B1與2個垂直部62B2、62B2而形成為U形狀，且在這些垂直部62B2、62B2間界定形成刀具侵入部63。又，於垂直部62B2、62B2上具備將刀具侵入部63包夾並相向的發光部64、及接收來自此發光部64之光的受光部65。如圖5所示，發光部64會透過光纖66而連接於光源67，受光部65會透過光纖66而連接於光電轉換部68。檢測機構62是藉由在切入進給方向上，切割刀31侵入刀具侵入部63(亦即發光部64與受光部65之間)，以根據受光部65檢測之受光量的變化來檢測切割刀31的前端位置。As shown in FIG. 4, the detection mechanism 62 is equipped with the base part 62A fixed to the support member 61, and the attachment member 62B erected on this base part 62A. This mounting member 62B is provided with a horizontal portion 62B1 and two vertical portions 62B2, 62B2 and is formed in a U shape, and a tool intrusion portion 63 is defined between these vertical portions 62B2 and 62B2. In addition, the vertical portions 62B2 and 62B2 are provided with a light-emitting portion 64 that sandwiches the tool penetration portion 63 and faces each other, and a light-receiving portion 65 that receives light from the light-emitting portion 64. As shown in FIG. 5, the light emitting unit 64 is connected to the light source 67 through the optical fiber 66, and the light receiving unit 65 is connected to the photoelectric conversion unit 68 through the optical fiber 66. The detection mechanism 62 detects the cutting knife based on the change in the amount of light detected by the light receiving unit 65 by intruding the cutting knife 31 into the cutting tool intrusion portion 63 (that is, between the light emitting portion 64 and the light receiving portion 65) in the cutting feed direction 31's front position.

又，檢測機構62具備設置於基台部62A上，且對發光部64及受光部65的端面供給經恆溫調整之洗淨水的洗淨水供給噴嘴69、及對發光部64及受光部65的端面供給氣體的氣體供給噴嘴70。藉由對發光部64及受光部65噴吹洗淨水及氣體，能夠防止於發光部64及受光部65上附著水滴等之情形，而實現檢測精度的提升。又，檢測機構62具備透過鉸鏈部71而連接於基台部62A，且覆蓋安裝構件62B(發光部64及受光部65)的罩蓋72。此罩蓋72會在使用檢測機構62時打開並露出發光部64及受光部65，在不使用檢測機構62時會關閉，並覆蓋發光部64及受光部65。In addition, the detection mechanism 62 is provided with a washing water supply nozzle 69 which is provided on the base portion 62A and supplies constant temperature-adjusted washing water to the end surfaces of the light-emitting portion 64 and the light-receiving portion 65, and the light-emitting portion 64 and the light-receiving portion 65 The end face of the gas supply nozzle 70 supplies gas. By spraying washing water and gas on the light emitting section 64 and the light receiving section 65, it is possible to prevent the adhesion of water droplets on the light emitting section 64 and the light receiving section 65, and to improve the detection accuracy. In addition, the detection mechanism 62 includes a cover 72 that is connected to the base portion 62A through the hinge portion 71 and covers the attachment member 62B (the light-emitting portion 64 and the light-receiving portion 65). The cover 72 is opened when the detection mechanism 62 is used to expose the light emitting portion 64 and the light receiving portion 65, and is closed when the detection mechanism 62 is not used, and covers the light emitting portion 64 and the light receiving portion 65.

那麼，在加工裝置1中，會設置圍繞工作夾台10及切割單元30的加工室3，並在此加工室3内對保持於工作夾台10之晶圓W供給切割水並且進行切割加工。因此，檢測機構62的發光部64及受光部65會由於暴露在含有大量霧氣(切割水)的環境氣體中，而有受光部65檢測的受光量被霧氣遮蔽或因霧氣亂反射而變動的疑慮。因此，會有將切割刀31的前端位置錯誤檢測之結果，導致錯誤算出切割刀31的原點位置，而使對晶圓W之切入深度不同的疑慮。Then, in the processing apparatus 1, a processing chamber 3 surrounding the work chuck table 10 and the cutting unit 30 is provided, and the wafer W held on the work chuck table 10 is supplied with cutting water in the processing chamber 3 and the cutting process is performed. Therefore, the light-emitting portion 64 and the light-receiving portion 65 of the detection mechanism 62 may be exposed to ambient air containing a large amount of mist (cutting water), and there is a concern that the amount of light detected by the light-receiving portion 65 is blocked by the mist or fluctuates due to random reflection of the mist . Therefore, as a result of erroneous detection of the tip position of the dicing blade 31, the origin position of the dicing blade 31 may be incorrectly calculated, and there may be doubts about the difference in the cutting depth of the wafer W.

依據發明人的專心研究，已清楚的是，藉由使利用檢測機構62來檢測切割刀31的前端位置之時讓檢測待機預定時間(例如4～5秒的期間)，會有使受光部65檢測的受光量安定之傾向。但是，在每逢前端位置的檢測時，都必定待機預定時間(例如4～5秒的期間)的構成，由於會相應於該量而使加工時間延長所以會有成品率降低的問題。因此，在本構成中，會根據受光部65檢測的受光量，來判斷最佳的待機時間，藉此抑制加工時間的延長，並且精度良好地檢測刀尖的前端位置。According to the concentrating research of the inventor, it is clear that when the detection mechanism 62 is used to detect the tip position of the cutting blade 31, the detection waits for a predetermined time (for example, a period of 4 to 5 seconds), and the light receiving unit 65 The tendency of the detected light intensity to stabilize. However, every time the tip position is detected, it must be configured to wait for a predetermined time (for example, a period of 4 to 5 seconds). Since the processing time is prolonged corresponding to this amount, there is a problem of a decrease in yield. Therefore, in this configuration, the optimal waiting time is determined based on the amount of received light detected by the light receiving unit 65, thereby suppressing the prolongation of the machining time, and accurately detecting the tip position of the tool tip.

因此，如圖5所示，控制裝置6具備閾值登錄部80、判斷部81、基準電壓設定部82、電壓比較部83、端部位置檢測部84、計算部85及位置補正部86。閾值登錄部80會登錄在切割刀31已遠離刀具侵入部63的退避狀態下，規定將來自發光部64之光接收的受光部65之受光量的適當範圍的閾値。在本實施形態中，閾值登錄部80會將規定受光量之適當範圍的上限閾値及下限閾値各自轉換成電壓值來登錄。判斷部81會取得以光電轉換部68所轉換而得的電壓値，並在上述之退避狀態下的受光量(電壓値)在適當範圍内時，做出許可使其將切割刀31侵入刀具侵入部63並進行切割刀31之刀尖的前端位置的檢測動作之判斷。具體來說，判斷部81會藉由判定在退避狀態下的受光量是否為上限閾値以上、下限閾値以下而判定是否在適當範圍内。又，判斷部81在退避狀態下的受光量(電壓値)為適當範圍外時，會做出在該受光量成為適當範圍内以前使該檢測動作待機。此時，藉由讓檢測動作待機，以從加工室3將包含切割水之霧氣的環境氣體排出，藉此使因受該霧氣之影響而降低的該受光量回復至適當範圍内。依據此構成，即使是在受光部65檢測的受光量被霧氣遮蔽、或因霧氣亂反射而變動的情形下，都可在受光量回復至適當範圍内以前使檢測動作待機，因此能夠正確地檢測切割刀31的前端位置。Therefore, as shown in FIG. 5, the control device 6 includes a threshold registration unit 80, a determination unit 81, a reference voltage setting unit 82, a voltage comparison unit 83, an end position detection unit 84, a calculation unit 85, and a position correction unit 86. The threshold value registering unit 80 registers a threshold value that defines an appropriate range of the amount of light received by the light receiving unit 65 that receives light from the light emitting unit 64 in the retracted state where the cutter 31 has moved away from the tool intruding unit 63. In this embodiment, the threshold value registration unit 80 converts the upper limit threshold value and the lower limit threshold value of the appropriate range of the received light amount into voltage values and registers them. The judging unit 81 obtains the voltage value converted by the photoelectric conversion unit 68, and when the received light amount (voltage value) in the above-mentioned retracted state is within an appropriate range, permits the cutting knife 31 to intrude into the tool. The portion 63 also performs the determination of the detection operation of the tip position of the cutting edge of the cutting knife 31. Specifically, the determining unit 81 determines whether the received light amount in the retreat state is greater than or equal to the upper limit threshold value and less than the lower limit threshold value to determine whether it is within the appropriate range. In addition, when the amount of received light (voltage value) in the retracted state is out of the appropriate range, the determination unit 81 will make the detection operation stand by until the amount of received light becomes within the appropriate range. At this time, by allowing the detection operation to stand by, the ambient gas including the mist of cutting water is discharged from the processing chamber 3, thereby returning the amount of received light that has been reduced by the mist to an appropriate range. According to this configuration, even when the amount of received light detected by the light receiving unit 65 is blocked by fog or fluctuates due to the haze reflected by the fog, the detection operation can be on standby before the amount of received light returns to the proper range, so accurate detection can be achieved. The position of the front end of the cutter 31.

在本實施形態中，除了在退避狀態下的受光量成為適當範圍内以前使檢測動作待機外，判斷部81還會每隔預定的循環時間(例如100ms)，進行複數次(例如5次)受光量的檢測，並判斷與先前所檢測出的受光量(電壓値)間的變化量是否在預定的閾値範圍内，只要在所檢測出的複數次全部之中，變化量都在閾値範圍内便會許可檢測動作。如圖6所示，在此構成中，由於在所檢測出的受光量(電壓値)變動為仍在發生的情況下會讓檢測待機，在所檢測出的受光量(電壓値)的變動為已被抑制且收斂為某個值的情況下會許可檢測動作，所以能夠判斷無過與不及之最佳的待機時間，且能夠抑制加工時間的延長，並精度良好地檢測刀尖的前端位置。在此構成中，在閾值登錄部80中，是將規定受光量(電壓値)之適當範圍的上限閾値、下限閾値、以及規定與受光量(電壓値)間之變化量的範圍作為閾値來進行設定。In the present embodiment, in addition to waiting for the detection operation until the received light amount in the retracted state becomes within the appropriate range, the determination unit 81 also receives light multiple times (e.g., 5 times) every predetermined cycle time (e.g., 100ms) Detection of the amount of light, and determine whether the amount of change from the previously detected received light amount (voltage value) is within a predetermined threshold range, as long as the amount of change is within the threshold range in all the multiple times detected Will permit detection actions. As shown in Fig. 6, in this configuration, since the detected light received amount (voltage value) change is still occurring, the detection is put on standby, and the detected light received amount (voltage value) changes as If it is suppressed and converges to a certain value, the detection operation is permitted. Therefore, it is possible to determine the optimal waiting time of no over or under, and it is possible to suppress the extension of the machining time and accurately detect the tip position of the tool tip. In this configuration, in the threshold value registering unit 80, the upper limit threshold value, the lower limit threshold value, and the range of the change amount between the predetermined amount of light (voltage value) and the received light amount (voltage value) are defined as the threshold value. set up.

又，若是檢測到上述之適當範圍内的受光量(電壓値)在每單位時間為預定比例以上的話，亦可許可檢測動作。此時，於閾值登錄部80中會登錄每預定之單位時間(例如50ms)的測量到適當範圍内之受光量的時間的閾値(例如40ms)。在此構成中，即使是在可稍微看到受光量(電壓)之變動的情況下，仍然能夠判斷為在預定的單位時間下受光量(電壓)是安定的，因此能夠抑制加工時間的延長，且精度良好地檢測刀尖的前端位置。In addition, if it is detected that the received light amount (voltage value) in the above-mentioned appropriate range is more than a predetermined ratio per unit time, the detection operation may be permitted. At this time, the threshold value registering unit 80 registers the threshold value (for example, 40 ms) of the time for measuring the received light amount within the appropriate range for every predetermined unit time (for example, 50 ms). In this configuration, even when the change in the amount of received light (voltage) is slightly visible, it can still be determined that the amount of received light (voltage) is stable in a predetermined unit time, so it is possible to suppress the extension of the processing time. And it can detect the tip position of the tool tip accurately.

在判斷部81已許可檢測動作的情況下，會將所檢測到的受光量(電壓値)輸出至電壓比較部83。基準電壓設定部82會設定檢測機構62檢測切割刀31之侵入時的基準電壓値(例如3V)，並將此設定好的基準電壓値輸出至電壓比較部83。電壓比較部83會比較由判斷部81所輸出的受光量(電壓値)、及藉由基準電壓設定部82所設定的基準電壓値，並在來自判斷部81的輸出達到基準電壓値時，將該意旨的訊號輸出至端部位置檢測部84。若更詳細地說明，在檢測切割刀31之Z軸方向(切入進給方向)的基準位置的情況下，會驅動切入進給機構14的脈衝馬達21，使切割刀31從上方朝刀具檢測器件60的刀具侵入部63侵入前進。When the detection operation has been permitted by the determination unit 81, the detected received light amount (voltage value) is output to the voltage comparison unit 83. The reference voltage setting unit 82 sets a reference voltage value (for example, 3V) when the detection mechanism 62 detects the penetration of the cutting blade 31, and outputs the set reference voltage value to the voltage comparison unit 83. The voltage comparison unit 83 compares the received light amount (voltage value) output by the judgment unit 81 with the reference voltage value set by the reference voltage setting unit 82, and when the output from the judgment unit 81 reaches the reference voltage value, The signal of this intention is output to the end position detection unit 84. In more detail, in the case of detecting the reference position of the cutting blade 31 in the Z-axis direction (cutting feed direction), the pulse motor 21 of the cutting feed mechanism 14 will be driven to make the cutting blade 31 face the tool detection device from above The tool intruding portion 63 of 60 invades and advances.

此時，在切割刀31為完全未遮蔽在發光部64與受光部65之間的情況下，受光部65接收的光量為最大，並將對應此光量之來自光電轉換部68(判斷部81)的輸出如例如圖7所示地設定成5V。At this time, when the cutting blade 31 is completely unshielded between the light-emitting portion 64 and the light-receiving portion 65, the light-receiving portion 65 receives the maximum amount of light, and the corresponding light amount comes from the photoelectric conversion portion 68 (determining portion 81) The output of is set to 5V as shown in FIG. 7, for example.

由於依照切割刀31侵入刀具侵入部63之情形，而使切割刀31遮蔽從發光部64所射出之光的量逐漸地增加，所以受光部65所接收的光量會逐漸地減少，來自光電轉換部68的輸出電壓會如圖7所示地逐漸地減少。Since the amount of light emitted from the light emitting portion 64 by the cutting knife 31 is gradually increased according to the situation in which the cutting knife 31 invades the knife intrusion portion 63, the amount of light received by the light receiving portion 65 gradually decreases, coming from the photoelectric conversion portion The output voltage of 68 will gradually decrease as shown in Figure 7.

並且，設定成在切割刀31的刀尖已到達連結發光部64與受光部65之中心的位置時，使來自光電轉換部68的輸出電壓成為例如3V。因此，在光電轉換部68的輸出電壓成為3V時，電壓比較部83會將表示光電轉換部68的輸出電壓已達到基準電壓値之意旨的訊號輸出至端部位置檢測部84。In addition, it is set so that the output voltage from the photoelectric conversion unit 68 becomes, for example, 3V when the tip of the cutting blade 31 has reached a position connecting the center of the light emitting unit 64 and the light receiving unit 65. Therefore, when the output voltage of the photoelectric conversion unit 68 becomes 3V, the voltage comparison unit 83 outputs a signal indicating that the output voltage of the photoelectric conversion unit 68 has reached the reference voltage value to the end position detection unit 84.

端部位置檢測部84會將檢測到前端位置(端部位置)之意旨的訊號傳送至脈衝馬達21，並停止脈衝馬達21的驅動。此時，端部位置檢測部84會將切割刀31在Z軸方向(切入進給方向)的高度位置座標作為前端位置來儲存。The end position detection unit 84 transmits a signal indicating that the front end position (end position) is detected to the pulse motor 21 and stops the driving of the pulse motor 21. At this time, the end position detection unit 84 stores the height position coordinates of the cutting blade 31 in the Z axis direction (cutting feed direction) as the tip position.

在本構成中，由於切割刀31會被帶著進行切割加工而摩耗，所以可藉由定期地檢測切割刀31的前端位置，以提高對晶圓W施行之切割溝的切入深度的精度。具體來說，計算部85會從端部位置檢測部84所儲存之切割刀31的前端位置的高度位置座標、與前次所測量之切割刀31的前端位置的高度位置座標間的差中，計算切割刀31對於工作夾台10之保持面11的旋轉中心的基準高度位置(原點位置)的補正量。位置補正部86會根據所計算出的補正量，補正切割刀31的原點位置。因此，由於控制裝置6會根據已補正的原點位置，將切入進給機構14控制成對晶圓W形成加工的目標切入量，所以能夠實際地提高對晶圓W加工之切割溝的切入深度的精度。In this configuration, since the dicing blade 31 is worn during the dicing process, the tip position of the dicing blade 31 can be periodically detected to improve the accuracy of the cutting depth of the dicing groove applied to the wafer W. Specifically, the calculation unit 85 calculates the difference between the height position coordinates of the tip position of the cutting blade 31 stored in the end position detection unit 84 and the height position coordinates of the tip position of the cutting blade 31 measured last time, The correction amount of the cutter blade 31 with respect to the reference height position (origin position) of the rotation center of the holding surface 11 of the work chuck table 10 is calculated. The position correction unit 86 corrects the origin position of the cutter 31 based on the calculated correction amount. Therefore, since the control device 6 controls the cutting and feeding mechanism 14 to a target cutting amount for forming and processing of the wafer W according to the corrected origin position, it is possible to actually increase the cutting depth of the cutting groove for processing the wafer W. Accuracy.

如以上所說明地，因為其具備將晶圓W以保持面11保持的工作夾台10、對被該工作夾台10所保持的晶圓W供給切割水並且以切割刀31切割的切割單元30、檢測與保持面11正交之切入進給方向上的切割刀31之前端位置的刀具檢測器件60、圍繞工作夾台10、切割單元30與刀具檢測器件60的加工室3、將該加工室3内之環境氣體排出的排氣單元39、及控制各構成要素的控制裝置6，且刀具檢測器件60具有包夾切割刀31侵入的刀具侵入部63而相面對的發光部64、與接收來自發光部64之光的受光部65，控制裝置6具有閾值登錄部80與判斷部81，該閾值登錄部80可登錄在切割刀31已遠離刀具侵入部63的退避狀態下，規定將來自發光部64之光接收的受光部65之受光量的適當範圍的閾値，該判斷部81在退避狀態下的受光量在適當範圍内的情況下，會使其實施使切割刀31侵入刀具侵入部63來檢測切割刀31之前端位置的檢測動作，在退避狀態下之該受光量在適當範圍外的情況下，會將包含該切割水之霧氣的該環境氣體排出且直至在該霧氣之影響下已降低的該受光量成為在適當範圍内以前使該檢測動作待機，所以能夠因應於刀具檢測器件60之受光部65的受光量，判斷加工室3内的環境氣體是否為適合於切割刀31之刀尖的前端位置之檢測的狀態，而能夠精度良好地檢測前端位置。As described above, it is provided with the work chuck table 10 that holds the wafer W on the holding surface 11, and the cutting unit 30 that supplies cutting water to the wafer W held by the work chuck table 10 and cuts with the dicing knife 31. , The tool detection device 60 that detects the front end position of the cutting knife 31 in the cutting feed direction orthogonal to the holding surface 11, the processing room 3 surrounding the work clamp table 10, the cutting unit 30 and the tool detection device 60, the processing room 3, an exhaust unit 39 for exhausting ambient gas, and a control device 6 that controls each component, and the tool detection device 60 has a light-emitting portion 64 facing the tool intrusion portion 63 into which the cutting knife 31 enters, and a receiving The light-receiving part 65 of the light from the light-emitting part 64, the control device 6 has a threshold value registering part 80 and a judging part 81. The threshold value registering part 80 can register when the cutting blade 31 has moved away from the tool intruding part 63, it is specified The threshold value of the appropriate range of the light-receiving portion 65 received by the light of the portion 64. When the light-receiving amount of the judging portion 81 in the retracted state is within the appropriate range, it will cause the cutter 31 to intrude into the knife intruding portion 63 To detect the front end position of the cutting knife 31, when the amount of light received in the retracted state is outside the appropriate range, the ambient gas containing the mist of the cutting water will be discharged until it is under the influence of the mist. The reduced amount of received light is in the proper range until the detection operation is on standby. Therefore, it is possible to determine whether the ambient gas in the processing chamber 3 is suitable for the cutter 31 according to the amount of light received by the light receiving portion 65 of the tool detection device 60 The state of detecting the tip position of the tip can accurately detect the tip position.

又，由於閾值登錄部80會登錄每單位時間之測量到該閾値以上的受光量之時間的閾値，所以即使是在可稍微看到受光量(電壓)之變動的情況下，仍然能夠判斷為預定的單位時間下受光量(電壓)是安定的，因此能夠抑制加工時間的延長，並且精度良好地檢測刀尖的前端位置。In addition, since the threshold value registering unit 80 registers the threshold value of the time per unit time when the received light amount above the threshold value is measured, it can still be determined as a predetermined even when a slight change in the received light amount (voltage) can be seen The amount of received light (voltage) per unit time is stable, so it is possible to suppress the prolongation of the processing time and accurately detect the tip position of the tool tip.

以上，說明了本發明的一實施形態，但上述實施形態是作為例子而提示的實施形態，並非意欲限定發明的範圍。As mentioned above, although an embodiment of this invention was described, the said embodiment is an embodiment shown as an example, and is not intended to limit the scope of the invention.

1‧‧‧加工裝置2‧‧‧基台2A‧‧‧內壁3‧‧‧加工室3A‧‧‧頂板3B、3C‧‧‧側板3D‧‧‧隔板3E‧‧‧開口部3F‧‧‧排氣口4‧‧‧支撐構造5A‧‧‧裝卸區域5B‧‧‧加工區域6‧‧‧控制裝置(控制器件)10‧‧‧工作夾台11‧‧‧保持面13‧‧‧分度進給機構(分度進給器件)14‧‧‧切入進給機構15、18‧‧‧導軌16、19‧‧‧滾珠螺桿17‧‧‧Y軸滑板20‧‧‧Z軸滑板21‧‧‧脈衝馬達30‧‧‧切割單元31‧‧‧切割刀32‧‧‧輪罩33、34‧‧‧連接管35‧‧‧切割水噴嘴36‧‧‧刀具冷卻器噴嘴37‧‧‧攝像器件38‧‧‧切割水(切割液)39‧‧‧排氣單元39A‧‧‧排氣管40‧‧‧加工進給機構(加工進給器件)41‧‧‧工作台基座42‧‧‧支撐基台43‧‧‧防水蓋44‧‧‧伸縮件50‧‧‧保護伸縮件52、56‧‧‧端部54‧‧‧中間部60‧‧‧刀具檢測器件(刀尖位置檢測器件)61‧‧‧支撐構件62‧‧‧檢測機構62A‧‧‧基台部62B‧‧‧安裝構件62B1‧‧‧水平部62B2‧‧‧垂直部63‧‧‧刀具侵入部64‧‧‧發光部65‧‧‧受光部66‧‧‧光纖67‧‧‧光源68‧‧‧光電轉換部69‧‧‧洗淨水供給噴嘴70‧‧‧氣體供給噴嘴71‧‧‧鉸鍊部72‧‧‧罩蓋80‧‧‧閾值登錄部81‧‧‧判斷部82‧‧‧基準電壓設定部83‧‧‧電壓比較部84‧‧‧端部位置檢測部85‧‧‧計算部86‧‧‧位置補正部F‧‧‧框架Fa‧‧‧開口T‧‧‧黏著膠帶W‧‧‧晶圓(被加工物)WU‧‧‧晶圓單元(被加工物單元)X、Y、Z‧‧‧方向1‧‧‧Processing device 2‧‧‧Base 2A‧‧‧Inner wall 3‧‧‧Processing room 3A‧‧‧Top plate 3B, 3C‧‧ Side plate 3D‧‧‧Partition 3E‧‧‧Opening 3F‧ ‧‧Exhaust port 4‧‧‧Support structure 5A‧‧‧Loading and unloading area 5B‧‧‧Processing area 6‧‧‧Control device (control device) 10‧‧‧Working clamping table 11‧‧‧Retaining surface 13‧‧‧ Indexing feed mechanism (indexing feed device) 14‧‧‧Cutting feed mechanism 15, 18‧‧‧Guide 16,19‧‧‧Ball screw 17‧‧‧Y-axis sliding plate 20‧‧‧Z-axis sliding plate 21 ‧‧‧Pulse motor 30‧‧‧Cutting unit 31‧‧‧Cutting knife 32‧‧‧Wheel cover 33,34‧‧‧Connecting pipe 35‧‧‧Cutting water nozzle 36‧‧‧Knife cooler nozzle 37‧‧‧ Camera device 38‧‧‧Cutting water (cutting fluid) 39‧‧‧Exhaust unit 39A‧‧‧Exhaust pipe 40‧‧‧Processing feed mechanism (processing feed device) 41‧‧‧Working table base 42‧ ‧‧Support base 43‧‧‧Waterproof cover 44‧‧‧Expansion piece 50‧‧‧Protection expansion piece 52,56‧‧‧End 54‧‧‧Middle part 60‧‧‧Tool detection device (tool tip position detection Device) 61‧‧‧Support member 62‧‧‧Detection mechanism 62A‧‧‧Base part 62B‧‧‧Mounting member 62B1‧‧‧Horizontal part 62B2‧‧‧Vertical part 63‧‧‧Tool intrusion part 64‧‧‧ Light emitting part 65‧‧‧Light receiving part 66‧‧Optical fiber 67‧‧‧Light source 68‧‧‧Photoelectric conversion part 69‧‧‧Washing water supply nozzle 70‧‧‧Gas supply nozzle 71‧‧‧Hinge part 72‧‧ ‧Cover 80‧‧‧Threshold registration unit 81‧‧‧Judging unit 82‧‧‧Reference voltage setting unit 83‧‧‧Voltage comparison unit 84‧‧‧End position detection unit 85‧‧‧Calculation unit 86‧‧‧ Position correction part F‧‧‧Frame Fa‧‧‧Opening T‧‧‧Adhesive tape W‧‧‧Wafer (processed object) WU‧‧‧ Wafer unit (processed object unit) X, Y, Z‧‧ ‧direction

圖1是本實施形態之加工裝置的立體圖。 圖2是加工裝置之加工室內的側剖面圖。 圖3是加工裝置之加工室內的平面圖。 圖4是顯示刀具檢測單元的立體圖。 圖5是控制刀具檢測單元之控制裝置的方塊圖。 圖6是顯示在霧氣環境氣體下的檢測機構之檢測値的時間變化之圖。 圖7是顯示因應於切割刀的Z軸方向的位置之檢測機構的檢測値的變化之圖。Fig. 1 is a perspective view of the processing device of this embodiment. Figure 2 is a side sectional view of the processing chamber of the processing device. Figure 3 is a plan view of the processing chamber of the processing device. Fig. 4 is a perspective view showing the tool detection unit. Fig. 5 is a block diagram of a control device that controls the tool detection unit. Fig. 6 is a graph showing the time change of the detection value of the detection mechanism in a mist environment. Fig. 7 is a diagram showing the change of the detection value of the detection mechanism according to the position of the cutting blade in the Z-axis direction.

6‧‧‧控制裝置(控制器件) 6‧‧‧Control device (control device)

14‧‧‧切入進給機構 14‧‧‧Cutting feed mechanism

21‧‧‧脈衝馬達 21‧‧‧Pulse motor

30‧‧‧切割單元 30‧‧‧Cutting Unit

31‧‧‧切割刀 31‧‧‧Cutting knife

62‧‧‧檢測機構 62‧‧‧Testing agency

63‧‧‧刀具侵入部 63‧‧‧Tool invasion part

64‧‧‧發光部 64‧‧‧Lighting part

65‧‧‧受光部 65‧‧‧Light receiving part

66‧‧‧光纖 66‧‧‧Fiber

67‧‧‧光源 67‧‧‧Light source

68‧‧‧光電轉換部 68‧‧‧Photoelectric Conversion Department

80‧‧‧閾值登錄部 80‧‧‧Threshold Registration Department

81‧‧‧判斷部 81‧‧‧Judgment Department

82‧‧‧基準電壓設定部 82‧‧‧Reference voltage setting section

83‧‧‧電壓比較部 83‧‧‧Voltage comparison section

84‧‧‧端部位置檢測部 84‧‧‧End position detection unit

85‧‧‧計算部 85‧‧‧Calculation Department

86‧‧‧位置補正部 86‧‧‧Position Correction Department

Claims (2)

一種切割裝置，具備將被加工物以保持面保持的工作夾台、對被該工作夾台所保持的被加工物供給切割液並且以切割刀切割的切割單元、檢測與該保持面正交之切入進給方向上的該切割刀之前端位置的刀尖位置檢測單元、圍繞該工作夾台與該切割單元與該刀尖位置檢測單元的加工室、將該加工室内之環境氣體排出的排氣單元、及控制各構成要素的控制器件，該切割裝置的特徵在於： 該刀尖位置檢測單元具有包夾該切割刀侵入的刀具侵入部而相面對的發光部、與接收來自該發光部之光的受光部， 該控制器件具有： 閾值登錄部，可登錄在該切割刀已遠離該刀具侵入部的退避狀態下，規定將來自該發光部之光接收的該受光部之受光量的適當範圍的閾値；及 判斷部，在該退避狀態下的該受光量在該適當範圍内的情況下，使其實施使該切割刀侵入該刀具侵入部來檢測該切割刀之前端位置的檢測動作，在該退避狀態下之該受光量在該適當範圍外的情況下，將包含該切割液之霧氣的該環境氣體排出且直至該受光量成為該適當範圍内以前讓該檢測動作的開始待機。A cutting device is provided with a work chuck table that holds a workpiece on a holding surface, a cutting unit that supplies cutting fluid to the workpiece held by the work chuck table and cuts with a cutting knife, and detects a cut perpendicular to the holding surface The cutting edge position detection unit at the front end of the cutting knife in the feed direction, the processing chamber surrounding the work clamp table and the cutting unit and the cutting edge position detection unit, and an exhaust unit that exhausts ambient air in the processing chamber , And a control device for controlling each constituent element, the cutting device is characterized in that: the tool tip position detection unit has a light-emitting portion that encloses the cutting tool invading portion into which the cutting knife invades and faces, and receives light from the light-emitting portion The control device has: a threshold registration unit that can register an appropriate range of the amount of light received by the light-receiving unit that receives the light from the light-emitting unit in the retracted state where the cutting knife is far away from the tool intrusion unit Threshold value; and a judging part, when the received light amount in the retracted state is within the appropriate range, make the cutting knife intrude into the tool intruding part to detect the front end position of the cutting knife detection operation, in the When the received light amount in the retracted state is outside the appropriate range, the ambient gas containing the mist of the cutting fluid is discharged, and the detection operation is waited until the received light amount falls within the appropriate range. 如請求項1之切割裝置，其中，該閾值登錄部也登錄有每單位時間之測量到該適當範圍内的受光量之時間的閾値。The cutting device according to claim 1, wherein the threshold value registration unit also registers the threshold value of the time per unit time to measure the amount of light received within the appropriate range.
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