TWI704649B - 半導體元件保護用材料及半導體裝置 - Google Patents

半導體元件保護用材料及半導體裝置 Download PDF

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Publication number
TWI704649B
TWI704649B TW108104052A TW108104052A TWI704649B TW I704649 B TWI704649 B TW I704649B TW 108104052 A TW108104052 A TW 108104052A TW 108104052 A TW108104052 A TW 108104052A TW I704649 B TWI704649 B TW I704649B
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Taiwan
Prior art keywords
semiconductor element
weight
semiconductor
protection material
cured product
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TW108104052A
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English (en)
Chinese (zh)
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TW201921605A (zh
Inventor
西村貴史
前中寛
小林祐輔
中村秀
青山卓司
金千鶴
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日商積水化學工業股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW108104052A 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置 TWI704649B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-147608 2014-07-18
JP2014147608 2014-07-18

Publications (2)

Publication Number Publication Date
TW201921605A TW201921605A (zh) 2019-06-01
TWI704649B true TWI704649B (zh) 2020-09-11

Family

ID=55078557

Family Applications (4)

Application Number Title Priority Date Filing Date
TW104123309A TWI598401B (zh) 2014-07-18 2015-07-17 Semiconductor element protection material and semiconductor device
TW106123589A TWI653714B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置
TW108104052A TWI704649B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置
TW109126737A TWI754342B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW104123309A TWI598401B (zh) 2014-07-18 2015-07-17 Semiconductor element protection material and semiconductor device
TW106123589A TWI653714B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109126737A TWI754342B (zh) 2014-07-18 2015-07-17 半導體元件保護用材料及半導體裝置

Country Status (5)

Country Link
JP (1) JPWO2016010067A1 (ja)
KR (3) KR102383397B1 (ja)
CN (1) CN105849187A (ja)
TW (4) TWI598401B (ja)
WO (1) WO2016010067A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101864096B1 (ko) * 2015-08-17 2018-06-01 세키스이가가쿠 고교가부시키가이샤 반도체 장치 및 반도체 소자 보호용 재료
KR101756824B1 (ko) * 2017-01-03 2017-07-11 주식회사 아모센스 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
KR102611441B1 (ko) * 2017-01-03 2023-12-07 주식회사 아모센스 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
WO2018154832A1 (ja) * 2017-02-24 2018-08-30 三菱電機株式会社 熱伝導性樹脂組成物、その硬化物、ならびに熱伝導性シートおよびその製造方法
JP7191988B2 (ja) * 2019-02-01 2022-12-19 富士フイルム株式会社 熱伝導材料形成用組成物、熱伝導材料
KR20230112491A (ko) * 2022-01-20 2023-07-27 (주)에버텍엔터프라이즈 반도체 소자 봉지용 변성 에폭시 수지, 이의 제조 방법 및 이를 포함하는 낮은 휨을 나타내는 반도체 소자 봉지용 액상 수지 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006023295A (ja) * 2004-06-10 2006-01-26 Canon Inc 複屈折測定法及びそれを用いた複屈折測定装置
WO2009011383A1 (ja) * 2007-07-19 2009-01-22 Sekisui Chemical Co., Ltd. 電子部品用接着剤
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤

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Publication number Priority date Publication date Assignee Title
JP2817474B2 (ja) 1991-09-25 1998-10-30 信越化学工業株式会社 エポキシ樹脂組成物及び硬化物
JP3821173B2 (ja) 1996-12-19 2006-09-13 信越化学工業株式会社 エポキシ樹脂組成物
JP2005200533A (ja) 2004-01-15 2005-07-28 Kyocera Chemical Corp 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置
JP2006232950A (ja) * 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2007217469A (ja) 2006-02-14 2007-08-30 Kyocera Chemical Corp 封止用エポキシ樹脂組成物および半導体装置
US9786576B2 (en) * 2007-11-12 2017-10-10 Hitachi Chemical Company, Ltd Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device
CN102246295B (zh) * 2008-12-10 2013-09-04 住友电木株式会社 颗粒状半导体封装用环氧树脂组合物及使用它的半导体装置以及半导体装置的制造方法
JP2012201696A (ja) 2011-03-23 2012-10-22 Panasonic Corp 電子部品用液状エポキシ樹脂組成物とそれを用いた電子装置
WO2014021386A1 (ja) * 2012-07-31 2014-02-06 旭化成イーマテリアルズ株式会社 エポキシ樹脂組成物、エポキシ樹脂、及び硬化物
JP2014040538A (ja) 2012-08-23 2014-03-06 Hitachi Chemical Co Ltd ２液タイプのエポキシ樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006023295A (ja) * 2004-06-10 2006-01-26 Canon Inc 複屈折測定法及びそれを用いた複屈折測定装置
WO2009011383A1 (ja) * 2007-07-19 2009-01-22 Sekisui Chemical Co., Ltd. 電子部品用接着剤
JP2012126762A (ja) * 2010-12-13 2012-07-05 Sekisui Chem Co Ltd 熱伝導性接着剤

Also Published As

Publication number Publication date
WO2016010067A1 (ja) 2016-01-21
TW201735273A (zh) 2017-10-01
KR20170013195A (ko) 2017-02-06
TWI754342B (zh) 2022-02-01
KR101808472B1 (ko) 2017-12-12
KR20210127793A (ko) 2021-10-22
TWI598401B (zh) 2017-09-11
JPWO2016010067A1 (ja) 2017-04-27
CN105849187A (zh) 2016-08-10
KR20170118261A (ko) 2017-10-24
TW201609945A (zh) 2016-03-16
TW201921605A (zh) 2019-06-01
KR102383397B1 (ko) 2022-04-08
TWI653714B (zh) 2019-03-11
KR102313846B1 (ko) 2021-10-18
TW202105621A (zh) 2021-02-01

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