TWI701992B - Temperature-uniformizing board - Google Patents

Temperature-uniformizing board Download PDF

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Publication number
TWI701992B
TWI701992B TW108139437A TW108139437A TWI701992B TW I701992 B TWI701992 B TW I701992B TW 108139437 A TW108139437 A TW 108139437A TW 108139437 A TW108139437 A TW 108139437A TW I701992 B TWI701992 B TW I701992B
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Taiwan
Prior art keywords
heat
sheet
groove
ring edge
capillary structure
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TW108139437A
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Chinese (zh)
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TW202119897A (en
Inventor
洪銀樹
尹佐國
李明聰
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建準電機工業股份有限公司
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Application filed by 建準電機工業股份有限公司 filed Critical 建準電機工業股份有限公司
Priority to TW108139437A priority Critical patent/TWI701992B/en
Priority to CN201921926908.XU priority patent/CN211234063U/en
Priority to CN201911090148.8A priority patent/CN112747619B/en
Priority to CN202210964960.4A priority patent/CN115143828A/en
Priority to CN202210964939.4A priority patent/CN115143827A/en
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Publication of TWI701992B publication Critical patent/TWI701992B/en
Publication of TW202119897A publication Critical patent/TW202119897A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A temperature-uniformizing board is provided to solve the problem where the thinning of the conventional temperature-uniformizing board is difficult. The temperature-uniformizing board includes a heat-discharging plate, a heat-absorbing plate, a capillary structure, and a working fluid. At least one of the heat-discharging plate and the heat-absorbing plate includes a recess formed by an etching process. The heat-discharging plate and the heat-absorbing plate are engaged with each other face by face such that the recess can form a chamber. The capillary structure is disposed in the chamber. The chamber is filled with the working fluid.

Description

均溫板 Temperature plate

本發明係關於一種散熱裝置，尤其是一種對電子元件進行散熱的均溫板。 The invention relates to a heat dissipation device, in particular to a temperature equalizing plate for dissipating electronic components.

於電子產品中，習知的均溫板係結合於發熱源的表面，該習知均溫板內部填充有一工作流體，發熱源可以加熱該工作流體並使該工作流體汽化，氣態的工作流體係蒸發至遠離熱源的一側放熱後凝結，藉此可以帶離該發熱源的熱量以達到散熱的目的。該習知的均溫板係具有一上板體及一下板體，藉由衝壓或壓鑄使該上板體及該下板體的周緣形成彎折以使該上板體及該下板體分別形成一凹槽，藉此，可以將該上板體及該下板體對接以形成一空間，該空間係能夠用以填充該工作流體，且該空間內係可以具有毛細結構以幫助該工作流體進行蒸發凝結的循環。 In electronic products, the conventional uniform temperature plate is combined with the surface of the heat source. The interior of the conventional uniform temperature plate is filled with a working fluid. The heat source can heat the working fluid and vaporize the working fluid. A gaseous working flow system It evaporates to the side far away from the heat source and then condenses, so that the heat from the heat source can be taken away to achieve the purpose of heat dissipation. The conventional uniform temperature plate has an upper plate body and a lower plate body. The peripheries of the upper plate body and the lower plate body are bent by stamping or die-casting so that the upper plate body and the lower plate body are respectively A groove is formed, whereby the upper plate body and the lower plate body can be butted to form a space, the space can be used to fill the working fluid, and the space can have a capillary structure to help the working fluid Carry out the cycle of evaporation and condensation.

惟，當習知的均溫板用於微小的電子元件而薄型化時，係難以對該上板體及該下板體的周緣進行彎折加工，而提高了生產上的困難，又，為了因應薄型化，該上板體及該下板體彎折後的周緣厚度亦受到限制，進而使該上板體及該下板體所形成的凹槽過淺，導致該習知均溫板的空間不足而影響到散熱效率。 However, when the conventional uniform temperature plate is used for small electronic components and thinned, it is difficult to bend the upper plate body and the periphery of the lower plate body, which increases the difficulty in production. In response to the thinning, the thickness of the upper plate body and the lower plate body after bending is also limited, so that the groove formed by the upper plate body and the lower plate body is too shallow, resulting in the conventional uniform temperature plate Lack of space affects heat dissipation efficiency.

有鑑於此，習知的均溫板確實仍有加以改善之必要。 In view of this, the conventional uniform temperature plate does still need to be improved.

為解決上述問題，本發明的目的是提供一種均溫板，係可易於加工，以提升生產效率者。 In order to solve the above problems, the purpose of the present invention is to provide a uniform temperature plate that can be easily processed to improve production efficiency.

本發明的次一目的是提供一種均溫板，係可提升散熱效率者。 The second objective of the present invention is to provide a temperature equalizing plate that can improve heat dissipation efficiency.

本發明全文所述方向性或其近似用語，例如「前」、「後」、「左」、「右」、「上(頂)」、「下(底)」、「內」、「外」、「側面」等，主要係參考附加圖式的方向，各方向性或其近似用語僅用以輔助說明及理解本發明的各實施例，非用以限制本發明。 The directionality described in the full text of the present invention or its similar terms, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inner", "outer" , "Side", etc., mainly refer to the directions of the attached drawings. The directional or similar terms are only used to help explain and understand the embodiments of the present invention, and are not used to limit the present invention.

本發明全文所記載的元件及構件使用「一」或「一個」之量詞，僅是為了方便使用且提供本發明範圍的通常意義；於本發明中應被解讀為包括一個或至少一個，且單一的概念也包括複數的情況，除非其明顯意指其他意思。 The elements and components described in the full text of the present invention use the quantifiers "one" or "one" for convenience and to provide the general meaning of the scope of the present invention; the present invention should be interpreted as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

本發明的均溫板，包含：一放熱片；一吸熱片，該放熱片及該吸熱片分別具有一槽，該槽係由蝕刻製程所形成，該放熱片及該吸熱片係互相對合，以由該槽形成一腔室，該放熱片或該吸熱片具有至少一支撐柱，該支撐柱係位於該放熱片及該吸熱片之間，該放熱片的槽及該吸熱片的槽分別具有一槽面，以及該槽面的周緣形成一環邊，該環邊係圍繞於該槽面，該放熱片的環邊係抵接於相對的該吸熱片的槽面或該吸熱片的環邊係抵接於相對的該放熱片的槽面；一毛細結構，該毛細結構位於該腔室；及一工作流體，填充於該腔室。 The uniform temperature plate of the present invention includes: a heat-radiating sheet; a heat-absorbing sheet; the heat-radiating sheet and the heat-absorbing sheet each have a groove formed by an etching process; the heat-radiating sheet and the heat-absorbing sheet are aligned with each other, A cavity is formed by the groove, the heat release sheet or the heat absorption sheet has at least one support column, the support pillar is located between the heat release sheet and the heat absorption sheet, the groove of the heat release sheet and the groove of the heat absorption sheet respectively have A groove surface and the peripheral edge of the groove surface form a ring edge, the ring edge is surrounding the groove surface, and the ring edge of the heat releasing sheet abuts against the groove surface of the heat absorption sheet or the ring edge of the heat absorption sheet Abutting against the opposite groove surface of the heat radiating sheet; a capillary structure located in the chamber; and a working fluid filled in the chamber.

據此，本發明的均溫板，藉由蝕刻形成該放熱片的槽及該吸熱片的槽，而不須對該放熱片及該吸熱片的周緣進行彎折，係可以簡單地對薄型化的均溫板進行加工，並且藉由蝕刻，係能夠以深度小於mm為單位形成該槽，以符合薄型化均溫板的生產需求，係可以達到提升生產效率的功效。 再者，藉由蝕刻形成該槽，係能夠以降低該放熱片及該吸熱片的厚度來提升外殼之腔室的容量，在不增加該均溫板厚度的前提下提升該工作流體的量，或者提供該工作流體足夠的蒸發空間，係可以達到提供良好散熱效能的功效。 According to this, the uniform temperature plate of the present invention is formed by etching the grooves of the heat-radiating sheet and the grooves of the heat-absorbing sheet, without bending the periphery of the heat-radiating sheet and the heat-absorbing sheet, and can be easily thinned The uniform temperature plate is processed, and by etching, the groove can be formed in a unit with a depth of less than mm to meet the production requirements of thin uniform temperature plates, and the effect of improving production efficiency can be achieved. Furthermore, by forming the groove by etching, the capacity of the housing chamber can be increased by reducing the thickness of the heat-radiating sheet and the heat-absorbing sheet, and the amount of the working fluid can be increased without increasing the thickness of the uniform temperature plate, Or, by providing enough evaporation space for the working fluid, the effect of providing good heat dissipation efficiency can be achieved.

其中，該放熱片或該吸熱片具有至少一支撐柱，該支撐柱係位於於該放熱片及該吸熱片之間。如此，係可以提升該外殼的強度，係具有使該外殼不易產生彎折的功效。 Wherein, the heat release sheet or the heat absorption sheet has at least one support column, and the support pillar is located between the heat release sheet and the heat absorption sheet. In this way, the strength of the casing can be improved, and the casing is not easily bent.

其中，該放熱片或該吸熱片係具有至少一定位柱，該定位柱係對位於該支撐柱。如此，該放熱片與該吸熱片相對接時，該定位柱能夠與該支撐柱形成定位，係具有穩固定位該放熱片及該吸熱片的功效。 Wherein, the heat radiating sheet or the heat absorbing sheet has at least one positioning column, and the positioning column is opposite to the supporting column. In this way, when the heat radiating fin and the heat absorbing fin are connected to each other, the positioning column can be positioned with the supporting column, which has the effect of stably fixing the heat radiating fin and the heat absorbing fin.

其中，該放熱片的環邊與該吸熱片的環邊係相鄰接。如此，係可以提升該放熱片的槽及該吸熱片的槽對合所形成腔室的容積，係具有提供良好散熱效能的功效。 Wherein, the ring edge of the heat radiation sheet is adjacent to the ring edge of the heat absorption sheet. In this way, the volume of the cavity formed by the combination of the grooves of the heat-radiating fin and the groove of the heat-absorbing fin can be increased, and it has the effect of providing good heat dissipation performance.

其中，該放熱片的環邊或該吸熱片的環邊之厚度，係大於相對的該吸熱片的槽或該放熱片的槽的深度，該放熱片的環邊或該吸熱片的環邊抵接於相對的該吸熱片之槽面或該放熱片之槽面以形成一段差。如此，係可以方便由30~75°的夾角進行雷射銲接，係具有使該放熱片及該吸熱片能夠確實銲接結合而不會產生縫隙的功效。 Wherein, the thickness of the ring edge of the heat radiation sheet or the ring edge of the heat absorption sheet is greater than the depth of the groove of the heat absorption sheet or the groove of the heat dissipation sheet opposite, and the ring edge of the heat dissipation sheet or the ring edge of the heat absorption sheet abuts It is connected to the groove surface of the heat absorption sheet or the groove surface of the heat release sheet to form a gap. In this way, the laser welding can be conveniently performed from an included angle of 30 to 75°, and the heat radiation sheet and the heat absorption sheet can be reliably welded and combined without a gap.

其中，該放熱片或該吸熱片係於該環邊以蝕刻製程形成一環肩部，該環肩部相對於該環邊所形成的深度係等於相對的該放熱片之環邊或該吸熱片之環邊的厚度。如此，係可以使該放熱片不突出於該吸熱片，係具有進一步降低該外殼的整體厚度的功效。 Wherein, the heat-radiating sheet or the heat-absorbing sheet is attached to the ring edge by an etching process to form a ring shoulder, and the depth of the ring shoulder with respect to the ring edge is equal to the ring edge of the heat-radiating sheet or the heat-absorbing sheet. The thickness of the ring edge. In this way, the heat-radiating sheet can be prevented from protruding from the heat-absorbing sheet, which has the effect of further reducing the overall thickness of the shell.

一種均溫板，包含：一放熱片；一吸熱片，該放熱片及該吸熱片分別具有一槽，該槽係由蝕刻製程所形成，該放熱片及該吸熱片係互相對合，以由該槽形成一腔室，該放熱片的槽及該吸熱片的槽分別具有一槽面， 以及該槽面的周緣形成一環邊，該環邊係圍繞於該槽面，該放熱片的環邊與該吸熱片的環邊相對接；一毛細結構，該毛細結構位於該腔室；及一工作流體，填充於該腔室。如此，以形成較大的腔室，係具有提升散熱效能的功效。 A uniform temperature plate, comprising: a heat-radiating sheet; a heat-absorbing sheet, the heat-radiating sheet and the heat-absorbing sheet each have a groove formed by an etching process, the heat-radiating sheet and the heat-absorbing sheet are aligned with each other, The groove forms a cavity, and the groove of the heat release sheet and the groove of the heat absorption sheet respectively have a groove surface, And the circumferential edge of the groove surface forms a ring edge, the ring edge is surrounding the groove surface, the ring edge of the heat release sheet is opposite to the ring edge of the heat absorption sheet; a capillary structure, the capillary structure is located in the cavity; and a The working fluid is filled in the chamber. In this way, a larger cavity is formed, which has the effect of improving heat dissipation efficiency.

其中，該放熱片及該吸熱片對合後的交界處，係不具有開口。如此，可以更容易應用於小型電子產品中薄型化的均溫板上，具有提升生產便利性的功效。 Wherein, the junction between the heat radiating fin and the heat absorbing fin after being joined does not have an opening. In this way, it can be more easily applied to the thinner temperature equalizing plate in small electronic products, and has the effect of improving the convenience of production.

其中，係藉由雷射對該放熱片及該吸熱片的交界處進行銲接，該雷射銲接的角度為30~75度。如此，具有使該放熱片及該吸熱片能夠確實銲接結合而不會產生縫隙的功效。 Wherein, the junction of the heat radiating sheet and the heat absorbing sheet is welded by laser, and the angle of the laser welding is 30 to 75 degrees. In this way, it has the effect of ensuring that the heat radiating sheet and the heat absorbing sheet can be welded and combined without creating a gap.

其中，該毛細結構的厚度為0.05~0.5mm。如此，具有減縮該毛細結構厚度的功效。 Wherein, the thickness of the capillary structure is 0.05 to 0.5 mm. In this way, it has the effect of reducing the thickness of the capillary structure.

其中，該毛細結構的厚度為0.2~0.4mm。如此，具有減縮該毛細結構厚度的功效。 Wherein, the thickness of the capillary structure is 0.2 to 0.4 mm. In this way, it has the effect of reducing the thickness of the capillary structure.

其中，該毛細結構係具有至少一穿孔，穿孔對位於該支撐柱。如此，可以使該毛細結構準確對位，係具有提升生產便利性的功效。 Wherein, the capillary structure has at least one perforation, and the perforation is located on the supporting column. In this way, the capillary structure can be accurately aligned, which has the effect of improving production convenience.

其中，該毛細結構係為粉末燒結成的一薄片。如此，係能夠將該毛細結構置入於該槽中，係可以避免在該放熱片或該吸熱片上進行燒結等困難作業，係具有更容易應用於小型電子產品中薄型化的均溫板上，以提升生產便利性的功效。 Wherein, the capillary structure is a thin sheet formed by sintering powder. In this way, the capillary structure can be placed in the groove, and difficult operations such as sintering on the heat radiating sheet or the heat absorption sheet can be avoided, and the uniform temperature plate that is easier to apply to the thinning of small electronic products is provided. To enhance the efficiency of production convenience.

其中，該支撐柱為數個，數個該支撐柱交錯地同時位於該放熱片的槽及該吸熱片的槽，數個該支撐柱分別抵接於該毛細結構。如此，可以使形成薄片的該毛細結構呈波浪狀結構，使該毛細結構與該放熱片及該吸熱片之間形成數個間隙，以提升該工作流體的蒸發效率，係具有進一步提升該均溫板整體的散熱效率的功效。 Wherein, there are several supporting columns, and several supporting columns are staggered and located in the grooves of the heat-radiating fin and the groove of the heat-absorbing fin at the same time, and the several supporting columns abut against the capillary structure respectively. In this way, the capillary structure forming the sheet can be made into a wave-like structure, and several gaps are formed between the capillary structure, the heat release sheet and the heat absorption sheet, so as to improve the evaporation efficiency of the working fluid, thereby further improving the uniform temperature The effect of the overall heat dissipation efficiency of the board.

1:放熱片 1: Exothermic film

11:槽 11: Slot

12:槽面 12: Groove surface

13:環邊 13: Ring edge

14:支撐柱 14: Support column

15:結合孔 15: Combination hole

2:吸熱片 2: Heat-absorbing film

21:槽 21: Slot

22:槽面 22: Groove surface

23:環邊 23: ring edge

231:環肩部 231: Ring shoulder

24:定位柱 24: positioning column

241:沉孔 241: Counterbore

25:抵接柱 25: abutment column

251:抵接肩部 251: Abutting Shoulder

3:毛細結構 3: Capillary structure

31:穿孔 31: Piercing

S:腔室 S: Chamber

P:基板 P: substrate

P1:穿透部 P1: Penetration

P2:截斷部 P2: Truncated part

D1:厚度 D1: thickness

D2:深度 D2: depth

D3:段差 D3: Difference

D4:深度 D4: depth

θ:角度 θ: Angle

〔第1圖〕本發明的均溫板一較佳實施例的分解立體圖。 [Figure 1] An exploded perspective view of a preferred embodiment of the uniform temperature plate of the present invention.

〔第2圖〕本發明的均溫板一較佳實施例的組合正面圖。 [Figure 2] A front view of the assembly of a preferred embodiment of the uniform temperature plate of the present invention.

〔第3圖〕沿第2圖的A-A線剖面圖。 [Figure 3] A sectional view taken along the line A-A in Figure 2.

〔第4圖〕本發明的均溫板之放熱片及吸熱片一對接型態的剖面圖。 [Figure 4] A cross-sectional view of the heat sink and heat sink of the uniform temperature plate of the present invention.

〔第5圖〕本發明的均溫板之放熱片及吸熱片另一對接型態的剖面圖。 [Figure 5] A cross-sectional view of another butt joint type of the heat radiating fin and the heat absorbing fin of the uniform temperature plate of the present invention.

〔第6圖〕本發明的均溫板第二實施例的剖視圖。 [Figure 6] A cross-sectional view of the second embodiment of the temperature equalizing plate of the present invention.

〔第7圖〕本發明的均溫板第三實施例的剖視圖。 [Figure 7] A cross-sectional view of the third embodiment of the temperature equalizing plate of the present invention.

〔第8圖〕本發明的均溫板第四實施例的剖視圖。 [Figure 8] A cross-sectional view of the fourth embodiment of the temperature equalizing plate of the present invention.

〔第9圖〕本發明的均溫板第五實施例的分解立體圖。 [Figure 9] An exploded perspective view of the fifth embodiment of the uniform temperature plate of the present invention.

〔第10圖〕本發明的均溫板第五實施例的剖面圖。 [Figure 10] A cross-sectional view of the fifth embodiment of the temperature equalizing plate of the present invention.

〔第11a圖〕以一基板成形本發明的均溫板之吸熱片俯視圖。 [Figure 11a] A top view of the heat-absorbing sheet of the uniform temperature plate of the present invention formed from a substrate.

〔第11b圖〕以一基板成形本發明的均溫板之放熱片俯視圖。 [Figure 11b] A top view of the heat sink of the uniform temperature plate of the present invention formed from a substrate.

為讓本發明之上述及其他目的、特徵及優點能更明顯易懂，下文特舉本發明之較佳實施例，並配合所附圖式，作詳細說明如下： In order to make the above and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings:

請參照第1、2圖所示，其係本發明均溫板結構的第一實施例，係包含一放熱片1及一吸熱片2，該放熱片1及該吸熱片2係相對接。 Please refer to Figures 1 and 2, which is the first embodiment of the uniform temperature plate structure of the present invention. It includes a heat-radiating sheet 1 and a heat-absorbing sheet 2, and the heat-radiating sheet 1 and the heat-absorbing sheet 2 are oppositely connected.

該均溫板結構可以例如為銅或鋁等高導熱性能之材質所製成，使能夠用以直接或間接地連接一發熱源，以對該發熱源進行散熱，該發熱源可以例如為手機、電腦或其他電器產品的中央處理器，或者電路板上因運作 而產生熱之晶片等電子元件。該均溫板結構內係可以填充一工作流體，該工作流體可以為水、酒精或其他低沸點之液體，較佳地該工作流體係可以為不導電之液體，藉此使該工作流體可以從液態吸收熱量而蒸發成氣態，該均溫板結構內較佳可以為真空封閉狀態，以避免該工作流體形成氣態後散失，以及避免內部因為空氣佔據，而壓縮到該工作流體形成氣態後的空間，進而影響到散熱效率。 The uniform temperature plate structure can be made of materials with high thermal conductivity such as copper or aluminum, so that it can be used to directly or indirectly connect a heat source to dissipate heat from the heat source. The heat source may be, for example, a mobile phone, The central processing unit of the computer or other electrical products, or the circuit board due to operation And electronic components such as chips that generate heat. The uniform temperature plate structure can be filled with a working fluid. The working fluid can be water, alcohol or other low-boiling liquids. Preferably, the working fluid system can be a non-conductive liquid, so that the working fluid can be The liquid absorbs heat and evaporates into a gaseous state. The uniform temperature plate structure can preferably be in a vacuum-sealed state to prevent the working fluid from being lost after forming a gaseous state, and to prevent the interior from being occupied by air and compressing to the space after the working fluid becomes a gaseous state , Which in turn affects the heat dissipation efficiency.

請續參照第1圖所示，該放熱片1可以具有至少一槽11，該槽11可以用以容納該工作流體，以使該工作流體所攜帶的熱可以由該放熱片1傳遞出去，例如，可以傳遞至外界散失，或者該放熱片1可以連結如鰭片、金屬管或風扇等，其他具導熱效果的構件，以將熱量帶離該放熱片1來達到散熱的目的。 Please continue to refer to Figure 1, the heat radiating fin 1 may have at least one groove 11, and the groove 11 may be used to contain the working fluid, so that the heat carried by the working fluid can be transferred by the heat radiating fin 1, for example , Can be transferred to the outside, or the heat radiating fin 1 can be connected to other components with heat conduction effects such as fins, metal pipes or fans, so as to take the heat away from the heat radiating fin 1 to achieve the purpose of heat dissipation.

值得注意的是，該槽11係由蝕刻製程的方式形成，舉例而言，係可以由乾式蝕刻、濕式蝕刻或電漿蝕刻所形成，本發明不予限制，如此，係可以簡單的於該放熱片1形成該槽11，並且藉由蝕刻係可以精準以小於mm為單位來控制該槽11的深度，例如在小型電子產品中，薄型化的該均溫板厚度係小於等於1mm，藉由蝕刻的方式係可以於薄型化的該均溫板中形成該槽11，係具有降低加工難度的作用。 It is worth noting that the groove 11 is formed by an etching process. For example, it can be formed by dry etching, wet etching or plasma etching. The present invention is not limited. In this way, it can be simply The heat sink 1 forms the groove 11, and the depth of the groove 11 can be accurately controlled in units of less than mm by etching. For example, in small electronic products, the thickness of the thinned temperature equalizing plate is less than or equal to 1 mm. The etching method can form the groove 11 in the thinned temperature equalizing plate, which has the effect of reducing the processing difficulty.

請續參照第1圖所示，該槽11係由蝕刻形成一槽面12，以及該槽面12的周緣係形成一環邊13，該環邊13係圍繞於該槽面12。本實施例中，該槽面12可以具有至少一支撐柱14，該支撐柱14係可以抵接於該放熱片1及該吸熱片2之間，且該支撐柱14係能夠與該放熱片1分別製造後再以組裝的方式結合於該槽面12，例如能夠以銲接結合於該槽面12，或者，該支撐柱14係能夠一體成形於該槽面12，例如，能夠在蝕刻形成該槽11時一併形成該支撐柱14，本發明不予限制，藉此，係可以提升該均溫板結構的強度， 具有避免使該均溫板結構產生變形，以及不易產生彎折的作用。 Please continue to refer to FIG. 1, the groove 11 is etched to form a groove surface 12, and the periphery of the groove surface 12 forms a ring edge 13, and the ring edge 13 surrounds the groove surface 12. In this embodiment, the groove surface 12 may have at least one supporting column 14. The supporting column 14 can abut between the heat radiating fin 1 and the heat absorbing fin 2, and the supporting column 14 can be connected to the heat radiating fin 1 After being manufactured separately, they are combined to the groove surface 12 by assembly. For example, they can be joined to the groove surface 12 by welding, or the support column 14 can be integrally formed on the groove surface 12, for example, the groove can be formed by etching. The supporting column 14 is formed at 11 o'clock, and the present invention is not limited, so that the strength of the temperature equalizing plate structure can be improved. It has the function of avoiding deformation of the uniform temperature plate structure and not easy to bend.

該吸熱片2係可以與該放熱片1互相對接，使該吸熱片2及該放熱片1可以共同形成一腔室S，該腔室S係能夠用以容納該工作流體，以藉由該工作流體的蒸發凝結循環來達到散熱的目的，並且該吸熱片2能夠用以連接該發熱源，以吸收該發熱源所產生的熱。在本實施例中，該吸熱片2亦可以具有至少一槽21，該槽21同樣係由蝕刻製程的方式形成，係可以例如由乾式蝕刻、濕式蝕刻或電漿蝕刻所形成，本發明不予限制，藉此，同樣可以藉由蝕刻的方式於薄型化的該均溫板中形成該槽21，係具有降低加工難度的作用。該槽21係由蝕刻形成一槽面22，以及該槽面22的周緣係形成一環邊23，該環邊23係圍繞於該槽面22，該吸熱片2的槽21係可以與該放熱片1的槽11互相對位，使該吸熱片2的槽21及該放熱片1的槽11可以共同形成該腔室S。較佳地，係能夠在一基板(panel)P上以蝕刻製程形成數個具有該環邊13、23的槽11、21，以及於該數個環邊13、23的周圍形成數個穿透部P1，該數個穿透部P1之間係分別形成一截斷部P2，該數個穿透部P1係可以例如為郵票孔(stamp-hole)或槽孔(如第11a、11b圖所示)，藉此，通過截斷該截斷部P2即可獲得具有該槽11、21的數個放熱片1或數個該吸熱片2，係可以大量製造，具有提升生產便利性的作用。 The heat-absorbing fin 2 and the heat-radiating fin 1 can be connected to each other, so that the heat-absorbing fin 2 and the heat-radiating fin 1 can jointly form a cavity S, and the cavity S can be used to contain the working fluid for the work The evaporation and condensation cycle of the fluid achieves the purpose of heat dissipation, and the heat absorption sheet 2 can be used to connect the heat source to absorb the heat generated by the heat source. In this embodiment, the heat absorption sheet 2 may also have at least one groove 21. The groove 21 is also formed by an etching process, such as dry etching, wet etching or plasma etching. The present invention does not By this limitation, the groove 21 can also be formed in the thinned temperature equalizing plate by etching, which has the effect of reducing the processing difficulty. The groove 21 is etched to form a groove surface 22, and the periphery of the groove surface 22 forms a ring edge 23. The ring edge 23 surrounds the groove surface 22. The groove 21 of the heat absorption sheet 2 can be connected to the heat release sheet. The grooves 11 of 1 are aligned with each other, so that the grooves 21 of the heat absorption sheet 2 and the grooves 11 of the heat release sheet 1 can jointly form the cavity S. Preferably, a plurality of grooves 11, 21 having the ring edges 13, 23 can be formed on a substrate (panel) P by an etching process, and a plurality of penetrations can be formed around the plurality of ring edges 13, 23 Part P1, a cut-off part P2 is formed between the plurality of penetrating parts P1, and the plurality of penetrating parts P1 may be, for example, stamp-holes or slots (as shown in Figures 11a and 11b) ), thereby, by cutting off the cut-off portion P2, several heat-radiating fins 1 or several heat-absorbing fins 2 with the grooves 11 and 21 can be obtained, which can be manufactured in large quantities and has the effect of improving production convenience.

該吸熱片2的槽面22另可以具有至少一定位柱24，該定位柱24係對位於該放熱片1的支撐柱14，較佳地係可以由點銲的方式使該支撐柱14能銲接結合該定位柱24，本實施例中該定位柱24可以具有一沉孔241，該沉孔241可以與該支撐柱14的柱體相對合，藉此，該放熱片1與該吸熱片2相對接時，該支撐柱14與該定位柱24能夠互相形成定位，係具有穩固定位該放熱片1及該吸熱片2的作用，另，定位柱24亦可以不具有該沉孔241，以該定位柱24的端面抵接於該支撐柱14的端面。該定位柱24同樣能夠與該 吸熱片2分別製造後再以組裝或銲接的方式結合於該槽面22，本發明不予限制。值得注意的是，該支撐柱14係可以位於該放熱片1或者位於該吸熱片2，且該支撐柱14可以為數個，且可以交錯地位於該放熱片1及該吸熱片2，藉此，能夠從該放熱片1或從該吸熱片2，以該支撐柱14的端面直接抵接於相對的該放熱片1或該吸熱片2(如第8圖所示)，並由點銲的方式使該支撐柱14能銲接結合該放熱片1或該吸熱片2，同樣地，該吸熱片2及該放熱片1亦可以具有對位於該支撐柱14的定位柱24，係為本領域人員可以瞭解，在此不作贅述。 The groove surface 22 of the heat absorption sheet 2 may additionally have at least one positioning post 24 which is opposite to the support post 14 of the heat release sheet 1. Preferably, the support post 14 can be welded by spot welding. In combination with the positioning column 24, the positioning column 24 in this embodiment may have a counterbore 241, and the counterbore 241 can be opposed to the column of the support column 14, whereby the heat release sheet 1 is opposite to the heat absorption sheet 2 When connected, the support column 14 and the positioning column 24 can form a positioning with each other, which has the function of stably fixing the heat release sheet 1 and the heat absorption sheet 2. In addition, the positioning pillar 24 may not have the counterbore 241, so that the positioning The end surface of the column 24 abuts against the end surface of the support column 14. The positioning column 24 can also interact with the The heat absorbing sheet 2 is separately manufactured and then joined to the groove surface 22 by assembly or welding, which is not limited by the present invention. It is worth noting that the supporting pillars 14 may be located on the heat-radiating sheet 1 or the heat-absorbing sheet 2, and the supporting pillars 14 may be several, and may be alternately positioned on the heat-radiating sheet 1 and the heat-absorbing sheet 2, thereby, It can be from the heat radiating fin 1 or the heat absorbing fin 2 with the end face of the support column 14 directly abutting the opposite heat radiating fin 1 or the heat absorbing fin 2 (as shown in Fig. 8) by spot welding The supporting column 14 can be welded and combined with the heat radiating fin 1 or the heat absorbing fin 2. Similarly, the heat absorbing fin 2 and the heat radiating fin 1 can also have a positioning column 24 opposite to the support column 14, which can be used by those skilled in the art Understand, I won’t repeat it here.

請參照第3圖所示，該放熱片1的環邊13係可以抵接於該吸熱片2的槽面22，或者，亦可以由該吸熱片2的環邊23抵接於該放熱片1的槽面12，本發明不予限制，在本實施例中，係以該放熱片1的環邊13抵接於該吸熱片2的槽面22為例進行說明，藉此，可以降低該均溫板結構的整體厚度(即，該放熱片1及該吸熱片2之間的厚度)，以達到薄型化需求。此時，係可以藉由雷射對該放熱片1及該吸熱片2的交界處進行銲接，較佳地，雷射銲接的角度θ(與水平面的夾角)較佳採用30~75度，使該放熱片1及該吸熱片2能夠確實銲接結合而不會產生縫隙。 Please refer to Figure 3, the ring edge 13 of the heat radiating sheet 1 can abut against the groove surface 22 of the heat absorbing sheet 2 or, alternatively, the ring edge 23 of the heat absorbing sheet 2 can abut against the heat radiating sheet 1 The present invention is not limited to the groove surface 12. In this embodiment, the ring edge 13 of the heat radiating fin 1 abuts against the groove surface 22 of the heat absorbing fin 2 is taken as an example for description, whereby the uniformity can be reduced. The overall thickness of the warm plate structure (that is, the thickness between the heat-releasing sheet 1 and the heat-absorbing sheet 2) can meet the requirements of thinning. At this time, it is possible to weld the junction of the heat radiating sheet 1 and the heat absorbing sheet 2 by laser. Preferably, the angle θ of the laser welding (the angle with the horizontal plane) is preferably 30 to 75 degrees, so that The heat radiating sheet 1 and the heat absorbing sheet 2 can be reliably welded together without a gap.

請續參照第3~5圖所示，較佳地，該放熱片1的環邊13與該吸熱片2的環邊23係相鄰接，藉此，可以提升該放熱片1的槽11及該吸熱片2的槽21對合所形成腔室S的容積，其中，該放熱片1的環邊13厚度D1係可以大於該吸熱片2的槽21的深度D2，使該放熱片1的環邊13抵接於相對的該吸熱片2的槽面22時，係可以形成一段差D3，以方便由30~75的角度θ進行雷射銲接，或者，該吸熱片2係可以於該環邊23蝕刻形成一環肩部231，該環肩部231相對於該吸熱片2的環邊23所形成的深度D4，係可以等於該放熱片1之環邊13的厚度D1(如第4圖所示)，藉此，可以使該放熱 片1不突出於該吸熱片2，具有進一步降低該均溫板結構的整體厚度的作用。另，亦可以由該放熱片1的環邊13與該吸熱片2的環邊23相對接(如第5圖所示)，藉此以形成較大的腔室S，具有提升散熱效能的作用。 Please continue to refer to Figures 3 to 5. Preferably, the ring edge 13 of the heat radiating fin 1 and the ring edge 23 of the heat absorbing fin 2 are adjacent to each other, so that the groove 11 and the heat radiating fin 1 can be lifted. The groove 21 of the heat-absorbing sheet 2 forms the volume of the cavity S formed by the alignment, wherein the thickness D1 of the ring edge 13 of the heat-radiating sheet 1 may be greater than the depth D2 of the groove 21 of the heat-absorbing sheet 2, so that the ring of the heat-radiating sheet 1 When the edge 13 abuts against the groove surface 22 of the heat-absorbing sheet 2 opposite, a difference D3 can be formed to facilitate laser welding at an angle θ of 30 to 75, or the heat-absorbing sheet 2 can be attached to the ring edge 23 is etched to form a ring shoulder 231. The depth D4 formed by the ring shoulder 231 relative to the ring edge 23 of the heat sink 2 can be equal to the thickness D1 of the ring edge 13 of the heat sink 1 (as shown in Figure 4) ), by which the heat can be made The sheet 1 does not protrude from the heat-absorbing sheet 2 and has the effect of further reducing the overall thickness of the uniform temperature plate structure. In addition, the ring edge 13 of the heat radiating fin 1 and the ring edge 23 of the heat absorbing fin 2 can also be connected to each other (as shown in Fig. 5) to form a larger cavity S, which has the effect of improving heat dissipation efficiency. .

請續參照第1、3圖所示，本發明均溫板結構還可以包含一毛細結構3，該毛細結構3係位於該腔室S，以幫助凝結後的工作流體可以重新聚集進行回流，以重新吸收發熱源的熱量，該毛細結構3係可以為多孔性網目結構、微型溝槽或燒結粉末等結構，以增加該工作流體因毛細現象的流動，該毛細結構3係可以由一粉末燒結(power sintering process)而製成，該粉末係可以為銅粉或其他適當粉末，本發明不予限制。詳言之，該毛細結構3的厚度可以為0.05~0.5mm，較佳為0.2~0.4mm，該毛細結構3係可以直接燒結於該放熱片1的槽面12或該吸熱片2的槽面22，使該放熱片1及該吸熱片2相對合後，該毛細結構3可以位於該腔室S。在本實施例中，係可以預先由粉末燒結成一薄片以作為該毛細結構3，再將形成薄片的該毛細結構3置於該放熱片1的槽面12，或置於該吸熱片2的槽面22，較佳地，係可以先進行粉末冶金燒結，亦可以加壓、整平將燒結後的粉末進行加工以形成所需的厚度或尺寸，以及適當形狀的該薄片狀的該毛細結構3，此時係可以同時於該毛細結構3上形成溝槽，以提升該毛細結構3的導流能力，藉此，係能夠在真空環境下於該腔室S置入形成薄片的該毛細結構3，以及於該腔室S注入該工作流體，再將該放熱片1及該吸熱片2相對合銲接以形成該均溫板結構，據此，係可以避免在該放熱片1或該吸熱片2上進行燒結等困難作業，亦不需要預留用以注入該工作流體及對該腔室S進行抽真空的開口，具有更容易應用於小型電子產品中薄型化的均溫板上，以提升生產便利性的作用。該毛細結構3係可以具有至少一穿孔31，該穿孔31的位置及數量係可以對應於該支撐柱14及該定位柱24，以供該支撐柱14及該定位柱24穿伸通過。 Please continue to refer to Figures 1 and 3, the temperature equalizing plate structure of the present invention may also include a capillary structure 3, which is located in the chamber S to help the condensed working fluid to re-assemble and flow back. To re-absorb the heat from the heat source, the capillary structure 3 can be a porous mesh structure, micro grooves or sintered powder structure to increase the flow of the working fluid due to capillary phenomena. The capillary structure 3 can be sintered by a powder ( power sintering process), the powder can be copper powder or other suitable powder, and the present invention is not limited. In detail, the thickness of the capillary structure 3 can be 0.05 to 0.5 mm, preferably 0.2 to 0.4 mm, and the capillary structure 3 can be directly sintered on the groove surface 12 of the heat radiating sheet 1 or the groove surface of the heat absorption sheet 2 22. After the heat release sheet 1 and the heat absorption sheet 2 are relatively combined, the capillary structure 3 can be located in the cavity S. In this embodiment, a thin sheet can be pre-sintered from powder to serve as the capillary structure 3, and then the capillary structure 3 formed into the sheet is placed on the groove surface 12 of the heat sink 1, or placed on the heat sink 2 Preferably, the groove surface 22 may be powder metallurgical sintered first, or the sintered powder may be processed by pressing and leveling to form the required thickness or size, and the flake-like capillary structure of the appropriate shape 3. At this time, grooves can be formed on the capillary structure 3 at the same time to improve the flow conductivity of the capillary structure 3, whereby the capillary structure forming a thin sheet can be placed in the chamber S in a vacuum environment 3. Inject the working fluid into the chamber S, and then weld the heat-releasing sheet 1 and the heat-absorbing sheet 2 to form the uniform temperature plate structure. According to this, it can be avoided that the heat-radiating sheet 1 or the heat-absorbing sheet 2 For difficult operations such as sintering, there is no need to reserve openings for injecting the working fluid and vacuuming the chamber S. It has a thinner temperature equalizing plate that is easier to apply to small electronic products to improve The role of production convenience. The capillary structure 3 may have at least one perforation 31, and the position and number of the perforations 31 may correspond to the support column 14 and the positioning column 24, so that the support column 14 and the positioning column 24 can pass through.

請參照第6、7圖所示，該毛細結構3係可以位於該支撐柱14及相對的該放熱片1或該吸熱片2之間，較佳地，該支撐柱14係可以抵接於該毛細結構3，舉例而言，係可以由該放熱片1的支撐柱14抵接於該毛細結構3(如第6圖所示)，並可以由點銲的方式使該支撐柱14能銲接結合該毛細結構3，藉此，可以將該毛細結構3鄰接於該吸熱片2，以確保該工作流體可以聚集於該吸熱片2的槽面22，以充分吸收發熱源的熱量，具有提升散熱效率的作用。或者，可以由交錯地位於該放熱片1及該吸熱片2的數個支撐柱14，分別抵接於形成薄片的該毛細結構3，以使形成薄片的該毛細結構3呈波浪狀結構(如第7圖所示)，藉此，可以使該毛細結構3與該放熱片1及該吸熱片2之間形成數個間隙，以提升該工作流體的蒸發效率，進一步提升該均溫板整體的散熱效率。 Please refer to Figures 6 and 7, the capillary structure 3 can be located between the supporting column 14 and the opposite heat radiating fin 1 or the heat absorbing fin 2. Preferably, the supporting column 14 can abut against the The capillary structure 3, for example, can be abutted against the capillary structure 3 by the support column 14 of the heat sink 1 (as shown in Figure 6), and the support column 14 can be welded and combined by spot welding The capillary structure 3, whereby the capillary structure 3 can be adjacent to the heat absorbing sheet 2 to ensure that the working fluid can gather on the groove surface 22 of the heat absorbing sheet 2 to fully absorb the heat of the heat source, thereby improving the heat dissipation efficiency The role of. Alternatively, a plurality of supporting pillars 14 staggered between the heat-radiating sheet 1 and the heat-absorbing sheet 2 may abut against the capillary structure 3 forming the sheet, so that the capillary structure 3 forming the sheet has a wavy structure (such as As shown in Figure 7), by this, several gaps can be formed between the capillary structure 3 and the heat radiating fin 1 and the heat absorbing fin 2, so as to improve the evaporation efficiency of the working fluid and further improve the overall temperature uniformity plate Heat dissipation efficiency.

請參照第9、10圖所示，該放熱片1係可以不具有該槽11，並使該放熱片1抵接於該吸熱片2之環肩部231，藉此，可以僅對該吸熱片2進行蝕刻，具有精簡加工步驟的作用。詳言之，該放熱片1可以具有至少一結合孔15，該結合孔15可以例如以沖壓成形為一長型孔，係具有簡化製程的作用，該吸熱片2可以由蝕刻製程形成至少一抵接柱25，該抵接柱25係對位於該結合孔15，較佳地，該抵接柱25可以具有一抵接肩部251，使該結合孔15結合於該抵接柱25時，該結合周圍係可以抵接於該抵接肩部251，藉此，係可以由該吸熱片2的環肩部231及該抵接肩部251共同支撐該放熱片1。係可以由雷射對該放熱片1與該吸熱片2的交界處，以及該結合孔15與該抵接柱25的交界處進行銲接，以使該放熱片1及該吸熱片2形成密封。該放熱片1及該吸熱片2之間亦可以具有該毛細結構3，該毛細結構3之穿孔31係可以對位於該抵接柱25，以供該抵接柱25穿伸通過。另，本發明不限制上述結合孔15及該抵接柱25的位置，即，亦可以於該放熱片1由蝕刻製 程形成上述抵接柱25，並使該吸熱片2不具有該槽21並設置該結合孔15以抵接於該放熱片1上的抵接柱25。 Please refer to Figures 9 and 10, the heat sink 1 may not have the groove 11, and the heat sink 1 abuts against the ring shoulder 231 of the heat sink 2, so that only the heat sink can 2 Etching has the effect of streamlining the processing steps. In detail, the heat sink 1 may have at least one coupling hole 15. The coupling hole 15 may be formed into an elongated hole by punching, for example, to simplify the manufacturing process. The heat sink 2 may be formed by an etching process to form at least one resistance. The abutting post 25 is positioned in the coupling hole 15. Preferably, the abutting post 25 may have an abutting shoulder 251, so that when the coupling hole 15 is coupled to the abutting post 25, the The coupling periphery can abut against the abutting shoulder 251, so that the ring shoulder 231 and the abutting shoulder 251 of the heat absorption sheet 2 can jointly support the heat radiating sheet 1. The junction between the heat-radiating sheet 1 and the heat-absorbing sheet 2 and the junction between the coupling hole 15 and the abutting post 25 can be welded by laser, so that the heat-radiating sheet 1 and the heat-absorbing sheet 2 are sealed. The capillary structure 3 may also be provided between the heat-radiating sheet 1 and the heat-absorbing sheet 2, and the perforation 31 of the capillary structure 3 may be positioned on the abutting post 25 for the abutting post 25 to pass through. In addition, the present invention does not limit the position of the above-mentioned coupling hole 15 and the abutting post 25, that is, the heat-radiating sheet 1 may be made by etching The above-mentioned abutment post 25 is formed during the process, and the heat absorption sheet 2 does not have the groove 21 and the coupling hole 15 is provided to abut the abutment post 25 on the heat release sheet 1.

綜上所述，本發明的均溫板結構，藉由蝕刻形成該放熱片的槽及該吸熱片的槽，而不須對該放熱片及該吸熱片的周緣進行彎折，係可以簡單地對薄型化的均溫板進行加工，並且藉由蝕刻，係能夠以深度小於mm為單位形成該槽，以符合薄型化均溫板的生產需求，係可以達到提升生產效率的功效。再者，藉由蝕刻形成該槽，係能夠以降低該放熱片及該吸熱片的厚度來提升外殼之腔室的容量，在不增加該均溫板厚度的前提下提升該工作流體的量，或者提供該工作流體足夠的蒸發空間，係可以達到提供良好散熱效能的功效。 In summary, the uniform temperature plate structure of the present invention is formed by etching the grooves of the heat-radiating sheet and the grooves of the heat-absorbing sheet without bending the periphery of the heat-radiating sheet and the heat-absorbing sheet, which can be simply The thinner temperature equalizing plate is processed, and by etching, the groove can be formed with a depth of less than mm as a unit to meet the production requirements of the thinner temperature equalizing plate, and the effect of improving production efficiency can be achieved. Furthermore, by forming the groove by etching, the capacity of the housing chamber can be increased by reducing the thickness of the heat-radiating sheet and the heat-absorbing sheet, and the amount of the working fluid can be increased without increasing the thickness of the uniform temperature plate, Or, by providing enough evaporation space for the working fluid, the effect of providing good heat dissipation efficiency can be achieved.

雖然本發明已利用上述較佳實施例揭示，然其並非用以限定本發明，任何熟習此技藝者在不脫離本發明之精神和範圍之內，相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art without departing from the spirit and scope of the present invention may make various changes and modifications relative to the above-mentioned embodiments. The technical scope of the invention is protected. Therefore, the scope of protection of the invention shall be subject to the scope of the attached patent application.

1:放熱片 1: Exothermic film

11:槽 11: Slot

12:槽面 12: Groove surface

13:環邊 13: Ring edge

14:支撐柱 14: Support column

2:吸熱片 2: Heat-absorbing film

21:槽 21: Slot

22:槽面 22: Groove surface

23:環邊 23: ring edge

24:定位柱 24: positioning column

241:沉孔 241: Counterbore

3:毛細結構 3: Capillary structure

31:穿孔 31: Piercing

Claims (14)

一種均溫板，包含：一放熱片；一吸熱片，該放熱片及該吸熱片分別具有一槽，該槽係由蝕刻製程所形成，該放熱片及該吸熱片係互相對合，以由該槽形成一腔室，該放熱片的槽及該吸熱片的槽分別具有一槽面，以及該槽面的周緣形成一環邊，該環邊係圍繞於該槽面，該放熱片的環邊係抵接於相對的該吸熱片的槽面或該吸熱片的環邊係抵接於相對的該放熱片的槽面；一毛細結構，該毛細結構位於該腔室；及一工作流體，填充於該腔室。 A uniform temperature plate, comprising: a heat-radiating sheet; a heat-absorbing sheet, the heat-radiating sheet and the heat-absorbing sheet each have a groove formed by an etching process, the heat-radiating sheet and the heat-absorbing sheet are aligned with each other, The groove forms a cavity, the groove of the heat release sheet and the groove of the heat absorption sheet each have a groove surface, and the periphery of the groove surface forms a ring edge, the ring edge is surrounding the groove surface, and the ring edge of the heat release sheet Abutting against the groove surface of the opposite heat absorption sheet or the ring edge of the heat absorption sheet against the groove surface of the opposite heat releasing sheet; a capillary structure, the capillary structure located in the chamber; and a working fluid filled In the chamber. 如請求項1之均溫板，該放熱片或該吸熱片具有至少一支撐柱，該支撐柱係位於該放熱片及該吸熱片之間。 For example, in the uniform temperature plate of claim 1, the heat radiation sheet or the heat absorption sheet has at least one support column, and the support pillar is located between the heat radiation sheet and the heat absorption sheet. 如請求項2之均溫板，其中，該放熱片或該吸熱片係具有至少一定位柱，該定位柱係對位於該支撐柱。 For example, the temperature equalization plate of claim 2, wherein the heat release sheet or the heat absorption sheet has at least one positioning column, and the positioning column is opposite to the support column. 如請求項1之均溫板，其中，該放熱片的環邊與該吸熱片的環邊係相鄰接。 For example, the temperature equalization plate of claim 1, wherein the ring edge of the heat radiation sheet is adjacent to the ring edge of the heat absorption sheet. 如請求項4之均溫板，其中，該放熱片的環邊或該吸熱片的環邊之厚度，係大於相對的該吸熱片的槽或該放熱片的槽的深度，該放熱片的環邊或該吸熱片的環邊抵接於相對的該吸熱片之槽面或該放熱片之槽面以形成一段差。 For example, the temperature equalization plate of claim 4, wherein the thickness of the ring edge of the heat radiation sheet or the ring edge of the heat absorption sheet is greater than the depth of the groove of the heat absorption sheet or the groove of the heat dissipation sheet, and the ring of the heat dissipation sheet The edge or the ring edge of the heat absorption sheet abuts against the groove surface of the heat absorption sheet or the groove surface of the heat release sheet to form a gap. 如請求項1之均溫板，其中，該放熱片或該吸熱片係於該環邊蝕刻形成一環肩部，該環肩部相對於該環邊所形成的深度係等於相對的該吸熱片之環邊或該放熱片之環邊的厚度。 The temperature equalization plate of claim 1, wherein the heat radiation sheet or the heat absorption sheet is etched on the ring edge to form a ring shoulder, and the depth of the ring shoulder with respect to the ring edge is equal to that of the opposite heat absorption sheet The thickness of the ring edge or the ring edge of the radiator sheet. 一種均溫板，包含： 一放熱片；一吸熱片，該放熱片及該吸熱片分別具有一槽，該槽係由蝕刻製程所形成，該放熱片及該吸熱片係互相對合，以由該槽形成一腔室，該放熱片的槽及該吸熱片的槽分別具有一槽面，以及該槽面的周緣形成一環邊，該環邊係圍繞於該槽面，該放熱片的環邊與該吸熱片的環邊相對接；一毛細結構，該毛細結構位於該腔室；及一工作流體，填充於該腔室。 A uniform temperature board, including: A heat-radiating sheet; a heat-absorbing sheet, the heat-radiating sheet and the heat-absorbing sheet each have a groove, the groove is formed by an etching process, the heat-radiating sheet and the heat-absorbing sheet are aligned with each other to form a cavity by the groove, The groove of the heat release sheet and the groove of the heat absorption sheet respectively have a groove surface, and the peripheral edge of the groove surface forms a ring edge, the ring edge is surrounding the groove surface, the ring edge of the heat release sheet and the ring edge of the heat absorption sheet Opposite; a capillary structure, the capillary structure is located in the chamber; and a working fluid filled in the chamber. 如請求項1之均溫板，其中，該放熱片及該吸熱片對合後的交界處，係不具有開口。 For example, the uniform temperature plate of claim 1, wherein the junction of the heat-radiating fin and the heat-absorbing fin is not provided with an opening. 如請求項1之均溫板，其中，係藉由雷射對該放熱片及該吸熱片的交界處進行銲接，該雷射銲接的角度為30~75度。 For example, the uniform temperature plate of claim 1, wherein the junction of the heat radiating sheet and the heat absorption sheet is welded by laser, and the angle of the laser welding is 30 to 75 degrees. 如請求項1之均溫板，其中，該毛細結構的厚度為0.05~0.5mm。 Such as the temperature equalizing plate of claim 1, wherein the thickness of the capillary structure is 0.05~0.5mm. 如請求項10之均溫板，其中，該毛細結構的厚度為0.2~0.4mm。 For example, the uniform temperature plate of claim 10, wherein the thickness of the capillary structure is 0.2~0.4mm. 如請求項1之均溫板，其中，該毛細結構係具有至少一穿孔。 Such as the temperature equalization plate of claim 1, wherein the capillary structure has at least one perforation. 如請求項1之均溫板，其中，該毛細結構係為粉末燒結成的一薄片。 Such as claim 1, wherein the capillary structure is a thin sheet formed by sintering powder. 如請求項13之均溫板，其中，該支撐柱為數個，數個該支撐柱交錯地同時位於該放熱片的槽及該吸熱片的槽，數個該支撐柱分別抵接於該毛細結構。 For example, the temperature equalization plate of claim 13, wherein the supporting pillars are several, and the supporting pillars are alternately located in the groove of the heat releasing sheet and the groove of the heat absorbing sheet at the same time, and the supporting pillars respectively abut on the capillary structure .
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