TWI698975B - Wireless communication chip having embedded antenna, embedded antenna for wireless communication chip, and method of manufacturing wireless communication chip having embedded antenna - Google Patents

Wireless communication chip having embedded antenna, embedded antenna for wireless communication chip, and method of manufacturing wireless communication chip having embedded antenna Download PDF

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Publication number
TWI698975B
TWI698975B TW107128046A TW107128046A TWI698975B TW I698975 B TWI698975 B TW I698975B TW 107128046 A TW107128046 A TW 107128046A TW 107128046 A TW107128046 A TW 107128046A TW I698975 B TWI698975 B TW I698975B
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antenna
pattern
radiation pattern
parasitic
wireless communication
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TW107128046A
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Chinese (zh)
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TW201911532A (en
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金兌炯
李昇勳
氏姮 阮
韓昇洙
金暎昊
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南韓商Ｌｓ美創有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)

Abstract

The present invention relates to a wireless communication chip, which includes a substrate including a first mounting region and a second mounting region, a wireless communication integrated circuit mounted on the first mounting region, and an antenna block mounted on the second mounting region, wherein the antenna block includes a first antenna formed on the substrate, a parasitic element formed on the substrate to be spaced apart from the first antenna and configured to induce coupling with the first antenna, a connection element connected to the first antenna, an insulating layer formed on the first antenna, the parasitic element, and the connection element to cover the first antenna, the parasitic element, and the connection element, and a second antenna formed on the insulating layer and electrically connected to the first antenna through the connection element.

Description

具有嵌入式天線之無線通訊晶片、用於無線通訊晶片之嵌入式天線及具有嵌入式天線之無線通訊晶片之製造方法Wireless communication chip with embedded antenna, embedded antenna for wireless communication chip, and method for manufacturing wireless communication chip with embedded antenna

本發明是關於一種通訊模組，特別是一種通訊模組之天線。The present invention relates to a communication module, especially an antenna of the communication module.

能執行無線通訊功能之各種電子裝置包含用於無線通訊之晶片，例如藍芽、無線區域網路、全球定位系統(GPS)或類似之晶片，以及一天線。天線為了無線通訊及執行無線通訊功能而耦合於該晶片，以傳送通訊資料至外界或自外界接收通訊資料。Various electronic devices capable of performing wireless communication functions include chips for wireless communication, such as Bluetooth, wireless local area network, global positioning system (GPS) or similar chips, and an antenna. The antenna is coupled to the chip for wireless communication and performing wireless communication functions to transmit communication data to or receive communication data from the outside world.

舉例來說，如圖1所示，於一般之電子裝置100中，用於傳送及接收通訊資料之無線通訊晶片120及天線130安裝於底基板110上。無線通訊晶片120及天線130藉由無線射頻(RF)線纜140彼此電性連接。For example, as shown in FIG. 1, in a general electronic device 100, a wireless communication chip 120 and an antenna 130 for transmitting and receiving communication data are mounted on a base substrate 110. The wireless communication chip 120 and the antenna 130 are electrically connected to each other by a radio frequency (RF) cable 140.

然而，如圖1所示，於一般之電子裝置100中，因為無線通訊晶片120及天線130以相分離的方式安裝，所以必須設置用於連接無線通訊晶片120至天線130之無線射頻線纜140。如此一來便會產生增加生產成本以及增加微小化電子裝置100之難度之問題。However, as shown in FIG. 1, in a general electronic device 100, because the wireless communication chip 120 and the antenna 130 are installed in a separate manner, a radio frequency cable 140 for connecting the wireless communication chip 120 to the antenna 130 must be provided . As a result, the problems of increasing production cost and increasing the difficulty of miniaturizing the electronic device 100 will arise.

此外，由於天線130直接安裝於底基板110上，所以會產生天線130之共振頻率可能隨著底基板110之形狀及尺寸而改變的問題。In addition, since the antenna 130 is directly mounted on the base substrate 110, the resonant frequency of the antenna 130 may change with the shape and size of the base substrate 110.

因此，本發明用以解決上述問題，並針對上述問題提供具有設計為嵌入通訊模組之嵌入式天線的無線通訊晶片、用於無線通訊晶片之嵌入式天線及具有嵌入式天線之無線通訊晶片之製造方法。Therefore, the present invention is used to solve the above-mentioned problems and provide wireless communication chips with embedded antennas designed to be embedded in communication modules, embedded antennas for wireless communication chips, and wireless communication chips with embedded antennas. Manufacturing method.

此外，本發明針對上述問題提供具有各種共振頻率之具有嵌入式天線的無線通訊晶片、用於無線通訊晶片之嵌入式天線及具有嵌入式天線之無線通訊晶片之製造方法。In addition, the present invention addresses the above-mentioned problems and provides a method for manufacturing wireless communication chips with embedded antennas having various resonance frequencies, embedded antennas for wireless communication chips, and wireless communication chips with embedded antennas.

再者，本發明針對上述問題提供能補償長度值及提高效率之具有嵌入式天線的無線通訊晶片、用於無線通訊晶片之嵌入式天線及具有嵌入式天線之無線通訊晶片之製造方法。Furthermore, the present invention provides a wireless communication chip with an embedded antenna, an embedded antenna for a wireless communication chip, and a manufacturing method of a wireless communication chip with an embedded antenna that can compensate for the length value and improve the efficiency for the above-mentioned problems.

為了解決上述問題，本發明可包含下列態樣。To solve the above problems, the present invention may include the following aspects.

根據本發明之具有嵌入式天線之一無線通訊晶片，包含一基板、一無線通訊積體電路及一天線塊。基板包含一第一安裝區域以及一第二安裝區域。一無線通訊積體電路，安裝於第一安裝區域。天線塊安裝於第二安裝區域以電性連接於無線通訊積體電路。其中天線塊包含一第一天線、一寄生元件、一連接元件、一絕緣層以及一第二天線。第一天線形成於基板上。寄生元件形成於基板上以與第一天線相間隔，並用以引起與第一天線之耦合。連接元件連接於第一天線。絕緣層形成於第一天線、寄生元件以及連接元件上以覆蓋第一天線、寄生元件以及連接元件。第二天線形成於絕緣層上，且藉由連接元件電性連接於第一天線。The wireless communication chip with embedded antenna according to the present invention includes a substrate, a wireless communication integrated circuit and an antenna block. The substrate includes a first mounting area and a second mounting area. A wireless communication integrated circuit is installed in the first installation area. The antenna block is installed in the second installation area to be electrically connected to the wireless communication integrated circuit. The antenna block includes a first antenna, a parasitic element, a connecting element, an insulating layer and a second antenna. The first antenna is formed on the substrate. The parasitic element is formed on the substrate to be spaced from the first antenna and used to cause coupling with the first antenna. The connecting element is connected to the first antenna. The insulating layer is formed on the first antenna, the parasitic element and the connecting element to cover the first antenna, the parasitic element and the connecting element. The second antenna is formed on the insulating layer and is electrically connected to the first antenna through the connecting element.

於一實施例中，寄生元件可包含具有迴路外型之一第一寄生輻射圖案，且一開口可形成於第一寄生輻射圖案中。In one embodiment, the parasitic element may include a first parasitic radiation pattern having a loop shape, and an opening may be formed in the first parasitic radiation pattern.

寄生元件可更包含一第二寄生輻射圖案以及一第三寄生輻射圖案。第二寄生輻射圖案用以沿第一天線之一方向自第一寄生輻射圖案之一端延伸並將第一寄生輻射圖案連接至第一天線。第三寄生輻射圖案用以沿第一天線之方向自第一寄生輻射圖案之另一端延伸並將第一寄生輻射圖案連接至第一天線。The parasitic element may further include a second parasitic radiation pattern and a third parasitic radiation pattern. The second parasitic radiation pattern is used to extend from one end of the first parasitic radiation pattern along a direction of the first antenna and connect the first parasitic radiation pattern to the first antenna. The third parasitic radiation pattern is used to extend from the other end of the first parasitic radiation pattern along the direction of the first antenna and connect the first parasitic radiation pattern to the first antenna.

第一天線可包含一主圖案、一第一連接圖案、一第二連接圖案、一饋入接腳以及一第一接地單元。主圖案用以沿一第一方向延伸。第一連接圖案用以沿不同於第一方向之一第二方向自主圖案之一端延伸。第二連接圖案用以沿第二方向自主圖案之另一端延伸。饋入接腳形成以沿第二方向自第一連接圖案延伸且用以提供由無線通訊積體電路供應之一電源供應訊號給第一天線，而第一接地單元用以使第一天線接地。其中第一接地單元可包含用以於第一方向中分支饋入接腳之一分支單元以及用以沿第二方向自分支單元一端延伸之一接地接腳。The first antenna may include a main pattern, a first connection pattern, a second connection pattern, a feeding pin, and a first ground unit. The main pattern is used to extend along a first direction. The first connection pattern is used to extend one end of the autonomous pattern in a second direction different from the first direction. The second connection pattern is used to extend the other end of the main pattern along the second direction. The feeding pin is formed to extend from the first connection pattern in the second direction and is used to provide a power supply signal supplied by the wireless communication integrated circuit to the first antenna, and the first ground unit is used to enable the first antenna Ground. The first ground unit may include a branch unit for branching the feeding pin in the first direction and a ground pin for extending from one end of the branch unit in the second direction.

於一實施例中，分支單元以及第一寄生輻射圖案之間的距離可大於第一寄生輻射圖案之一內部寬度。In an embodiment, the distance between the branch unit and the first parasitic radiation pattern may be greater than an inner width of the first parasitic radiation pattern.

於另一實施例中，分支單元以及第一寄生輻射圖案之間的距離可小於第一寄生輻射圖案之一內部寬度。In another embodiment, the distance between the branch unit and the first parasitic radiation pattern may be smaller than an inner width of the first parasitic radiation pattern.

上述之寄生元件可設置於基板上由主圖案、第一連接圖案以及第二連接圖案所形成之一區域中。The above-mentioned parasitic element can be disposed in an area formed by the main pattern, the first connection pattern, and the second connection pattern on the substrate.

同時，連接元件可連接於第二連接圖案，且第一天線可更包含用以沿第二方向自連接元件延伸且使連接元件接地之一第二接地單元。At the same time, the connecting element may be connected to the second connecting pattern, and the first antenna may further include a second ground unit for extending from the connecting element in the second direction and grounding the connecting element.

根據本發明之用以設置於無線通訊晶片之嵌入式天線，包含一第一天線、一寄生元件、一連接元件、一絕緣層以及一第二天線。第一天線形成於一基板上。寄生元件設置於基板上以與第一天線相間隔，並用以引起與第一天線之耦合。連接元件連接於第一天線。絕緣層形成於第一天線、寄生元件以及連接元件上以覆蓋第一天線、寄生元件以及連接元件。第二天線形成於絕緣層上，且藉由連接元件電性連接於第一天線。The embedded antenna used in the wireless communication chip according to the present invention includes a first antenna, a parasitic element, a connecting element, an insulating layer and a second antenna. The first antenna is formed on a substrate. The parasitic element is arranged on the substrate to be spaced apart from the first antenna and used to cause coupling with the first antenna. The connecting element is connected to the first antenna. The insulating layer is formed on the first antenna, the parasitic element and the connecting element to cover the first antenna, the parasitic element and the connecting element. The second antenna is formed on the insulating layer and is electrically connected to the first antenna through the connecting element.

於一實施例中，寄生元件可包含具有迴路外型之一第一寄生輻射圖案，且第一寄生輻射圖案中形成有一開口。如此一來，第一寄生輻射圖案可具有N個側，其中N為正整數，且開口可形成於N個側中面對第一天線之一側。In one embodiment, the parasitic element may include a first parasitic radiation pattern having a loop shape, and an opening is formed in the first parasitic radiation pattern. In this way, the first parasitic radiation pattern may have N sides, where N is a positive integer, and the opening may be formed on one of the N sides facing the first antenna.

根據本發明之一電子裝置，包含一第一基板、一第一天線、一寄生元件以及一無線通訊晶片。第一天線形成於第一基板上。寄生元件設置於第一基板上以與第一天線相間隔，並用以引起與第一天線之耦合。無線通訊晶片安裝於第一基板上且電性連接第一天線。其中無線通訊晶片包含一第二基板、一無線通訊積體電路及一天線塊。第二基板包含一第一安裝區域以及一第二安裝區域。無線通訊積體電路成型於第一安裝區域上。天線塊安裝於第二安裝區域上以電性連接於無線通訊積體電路與第一天線，且天線塊包含一連接元件、一絕緣層以及一第二天線。連接元件形成於第二基板之第二安裝區域上以電性連接於第一天線。絕緣層形成於連接元件上以覆蓋連接元件。第二天線形成於絕緣層上且藉由連接元件電性連接於第一天線。According to an electronic device of the present invention, it includes a first substrate, a first antenna, a parasitic element, and a wireless communication chip. The first antenna is formed on the first substrate. The parasitic element is arranged on the first substrate to be spaced from the first antenna and used to cause coupling with the first antenna. The wireless communication chip is mounted on the first substrate and electrically connected to the first antenna. The wireless communication chip includes a second substrate, a wireless communication integrated circuit and an antenna block. The second substrate includes a first mounting area and a second mounting area. The wireless communication integrated circuit is formed on the first installation area. The antenna block is installed on the second installation area to be electrically connected to the wireless communication integrated circuit and the first antenna, and the antenna block includes a connecting element, an insulating layer and a second antenna. The connecting element is formed on the second mounting area of the second substrate to be electrically connected to the first antenna. The insulating layer is formed on the connecting element to cover the connecting element. The second antenna is formed on the insulating layer and is electrically connected to the first antenna through the connecting element.

根據本發明之一種製造具有嵌入式天線之無線通訊晶片的方法，包含形成一晶片以及一電路佈局於一基板之一第一安裝區域上，其中晶片與電路佈局構成一無線通訊積體電路、形成一第一天線、一寄生元件以及一連接元件於基板之一第二安裝區域上、形成一絕緣層於基板之一整個表面上、形成一第二天線於形成於第二安裝區域之絕緣層上以及將第二天線電性連接至第一天線。其中，寄生元件設置於基板之第二安裝區域上以與第一天線間隔並引起與第一天線之耦合。A method for manufacturing a wireless communication chip with an embedded antenna according to the present invention includes forming a chip and a circuit layout on a first mounting area of a substrate, wherein the chip and the circuit layout constitute a wireless communication integrated circuit, forming A first antenna, a parasitic element, and a connecting element are formed on a second mounting area of the substrate, an insulating layer is formed on the entire surface of a substrate, and a second antenna is formed on the insulation formed in the second mounting area On the layer and electrically connecting the second antenna to the first antenna. The parasitic element is arranged on the second mounting area of the substrate to be spaced from the first antenna and cause coupling with the first antenna.

根據本發明之一種製造電子裝置之方法，包含形成一晶片以及一電路佈局於一次基板之一第一安裝區域上，其中晶片與電路佈局電路佈局構成一無線通訊積體電路、形成一連接元件於次基板之一第二安裝區域上、形成一絕緣層於次基板之一整個表面上、形成一第二天線於形成於第二安裝區域之絕緣層上、將第二天線電性連接至連接元件以製造一無線通訊晶片以及安裝無線通訊晶片於形成有一第一天線以及一寄生元件之一主機板上，以使無線通訊晶片電性連接於第一天線。其中寄生元件設置於主機板上以與第一天線間隔，並引起與第一天線之耦合。A method of manufacturing an electronic device according to the present invention includes forming a chip and a circuit layout on a first mounting area of a primary substrate, wherein the chip and the circuit layout circuit layout form a wireless communication integrated circuit, forming a connecting element on An insulating layer is formed on the entire surface of one of the secondary substrates on a second mounting area of the secondary substrate, a second antenna is formed on the insulating layer formed on the second mounting area, and the second antenna is electrically connected to The connection element is used to manufacture a wireless communication chip and install the wireless communication chip on a main board formed with a first antenna and a parasitic element, so that the wireless communication chip is electrically connected to the first antenna. The parasitic element is arranged on the main board to be separated from the first antenna and causes coupling with the first antenna.

根據本發明，因為天線嵌入無線通訊晶片中，便可無須於電子裝置中之底基板上設置用於連接天線至無線晶片之無線射頻(RF)線纜。如此一來便可降低生產成本並可將電子裝置微小化。According to the present invention, because the antenna is embedded in the wireless communication chip, there is no need to provide a radio frequency (RF) cable for connecting the antenna to the wireless chip on the base substrate of the electronic device. In this way, the production cost can be reduced and the electronic device can be miniaturized.

此外，根據本發明，天線不是直接安裝在電子裝置的底基板上，因此可避免天線之共振頻率隨著底基板的外型與尺寸改變。In addition, according to the present invention, the antenna is not directly mounted on the base substrate of the electronic device, so the resonance frequency of the antenna can be prevented from changing with the appearance and size of the base substrate.

再者，根據本發明，天線可利用包含於天線內之各元件改變天線之共振頻率，因而無須額外的元件或改變構造即能於各種應用層面使用。Furthermore, according to the present invention, the antenna can use the components included in the antenna to change the resonant frequency of the antenna, and thus can be used in various application levels without additional components or changes in structure.

再者，根據本發明，因額外提供有設置於距離第一天線一預定間隔位置之寄生元件，而使第一天線之長度實質上藉由寄生元件及第一天線之間引起之耦合所延伸。如此一來，第一天線的長度便可被補償且第一天線的效率也可被提升。Furthermore, according to the present invention, the parasitic element is additionally provided at a predetermined interval from the first antenna, so that the length of the first antenna is substantially caused by the coupling between the parasitic element and the first antenna By extension. In this way, the length of the first antenna can be compensated and the efficiency of the first antenna can also be improved.

於說明書中描述之用詞應以下列方式解讀。The terms described in the manual should be interpreted in the following way.

除非內文中清楚指出，否則應理解的是本發明中以單數呈現之元件也可以複數的方式呈現。雖然「第一」、「第二」等用詞用於分辨不同的元件，本發明之範圍並不以這些用詞為限。Unless clearly indicated in the context, it should be understood that elements presented in the singular in the present invention may also be presented in the plural. Although terms such as "first" and "second" are used to distinguish different elements, the scope of the present invention is not limited to these terms.

應理解的是「包含」、「包括」及/或其他在此使用之相似用詞，指定所述特徵、數量、步驟、操作、元件、部件及/或上述之結合之存在。It should be understood that "including", "including" and/or other similar terms used herein designate the existence of the described features, numbers, steps, operations, elements, components and/or combinations of the foregoing.

應理解的是「至少一」之用詞包含一個或更多相關物品之所有可能之結合。舉例來說，「至少一第一物品、第二物品及第三物品」可不僅指第一物品、第二物品或第三物品，也可以指能以兩個或更多個第一物品、第二物品及第三物品中呈現之所有物品之結合。It should be understood that the term "at least one" includes all possible combinations of one or more related items. For example, "at least one first article, second article, and third article" can not only refer to the first article, the second article, or the third article, but can also refer to two or more first articles, The combination of all items presented in the second item and the third item.

以下，將參照圖2A至圖4詳細描述本發明第一實施例。圖2A根據本發明第一實施例之無線通訊晶片之部分立體圖。圖2B為根據本發明第一實施例之無線通訊晶片之部分立體分解圖。圖2C至圖2E為根據第一實施例之修改範例之無線通訊晶片之部分立體分解圖。圖3為根據本發明第一實施例之無線通訊晶片之側視圖。圖4繪示基板上之第一安裝區域及第二安裝區域之尺寸之範例。Hereinafter, the first embodiment of the present invention will be described in detail with reference to FIGS. 2A to 4. Fig. 2A is a partial perspective view of the wireless communication chip according to the first embodiment of the present invention. 2B is a partially exploded perspective view of the wireless communication chip according to the first embodiment of the present invention. 2C to 2E are partial three-dimensional exploded views of a wireless communication chip according to a modified example of the first embodiment. 3 is a side view of the wireless communication chip according to the first embodiment of the invention. FIG. 4 shows an example of the size of the first mounting area and the second mounting area on the substrate.

根據本發明第一實施例之一無線通訊晶片200安裝於一電子裝置之一底基板上(未繪示)以實施電子裝置之一無線通訊功能。於一實施例中，根據本發明之無線通訊晶片200可為能執行近場通訊如藍芽(Bluetooth)、無線區域網路(Wi-Fi)、信標(beacon)、近場通訊(NFC)等類似功能之近場通訊晶片。然而，本發明並不以此為限，且根據本發明之無線通訊晶片200可為能執行無線通訊例如第三世代通訊(3G)、第四世代通訊(4G)、第五世代通訊(5G)或類似功能之通訊晶片。According to the first embodiment of the present invention, a wireless communication chip 200 is mounted on a base substrate (not shown) of an electronic device to implement a wireless communication function of the electronic device. In one embodiment, the wireless communication chip 200 according to the present invention may be capable of performing near field communication such as Bluetooth, Wi-Fi, beacon, and near field communication (NFC) Near field communication chips with similar functions. However, the present invention is not limited to this, and the wireless communication chip 200 according to the present invention may be capable of performing wireless communication such as third-generation communication (3G), fourth-generation communication (4G), and fifth-generation communication (5G). Or a communication chip with similar functions.

如圖2A及圖2B所示，根據本發明之無線通訊晶片200包含一基板210、一無線通訊積體電路220以及一天線塊230。As shown in FIGS. 2A and 2B, the wireless communication chip 200 according to the present invention includes a substrate 210, a wireless communication integrated circuit 220, and an antenna block 230.

無線通訊積體電路220及天線塊230安裝於基板210上。於一實施例中，基板210可為印刷電路板(PCB)。如圖2A及圖2B所示，根據本發明之基板210包含一第一安裝區域212及一第二安裝區域214，且無線通訊積體電路220安裝於第一安裝區域212，而天線塊230則安裝於第二安裝區域214。如此一來，基板210於一第一方向D1中之長度可小於基板210於一第二方向D2之長度。The wireless communication integrated circuit 220 and the antenna block 230 are mounted on the substrate 210. In one embodiment, the substrate 210 may be a printed circuit board (PCB). As shown in FIGS. 2A and 2B, the substrate 210 according to the present invention includes a first installation area 212 and a second installation area 214, and the wireless communication integrated circuit 220 is installed in the first installation area 212, and the antenna block 230 is Installed in the second installation area 214. In this way, the length of the substrate 210 in a first direction D1 can be less than the length of the substrate 210 in a second direction D2.

於一實施例中，第一安裝區域212之面積可大於第二安裝區域214之面積。舉例來說，如圖4所示，當基板210之一第一側a之長度為6.5毫米(mm)，且基板210之一第二側b之長度為6.5毫米(mm)時，第一安裝區域212之一第一側a-c(也就是無線通訊積體電路220安裝之位置)的長度為5.0毫米(mm)，第一安裝區域212之一第二側b之長度為6.5毫米(mm)、第二安裝區域214之第一側c(也就是天線塊230安裝的位置)的長度為1.5毫米(mm)，而第二安裝區域214之一第二側b之長度為6.5毫米(mm)。In one embodiment, the area of the first installation area 212 may be larger than the area of the second installation area 214. For example, as shown in FIG. 4, when the length of a first side a of the substrate 210 is 6.5 millimeters (mm), and the length of a second side b of the substrate 210 is 6.5 millimeters (mm), the first mounting The length of the first side ac of one of the regions 212 (that is, the position where the wireless communication integrated circuit 220 is installed) is 5.0 millimeters (mm), and the length of the second side b of the first mounting region 212 is 6.5 millimeters (mm), The length of the first side c of the second installation area 214 (that is, the position where the antenna block 230 is installed) is 1.5 millimeters (mm), and the length of the second side b of the second installation area 214 is 6.5 millimeters (mm).

無線通訊積體電路220壓模成型於基板210之第一安裝區域212上。於一實施例中，無線通訊積體電路220可為用於藍芽(Bluetooth)、無線區域網路(Wi-Fi)、信標(beacon)或近場通訊(NFC)之一近場通訊模組，或可為用於第三世代通訊(3G)、第四世代通訊(4G)、第五世代通訊(5G)或類似功能之通訊模組。The wireless communication integrated circuit 220 is compression molded on the first mounting area 212 of the substrate 210. In one embodiment, the wireless communication integrated circuit 220 may be a near field communication module used for Bluetooth, Wi-Fi, beacon, or near field communication (NFC). The group may be a communication module used for third-generation communication (3G), fourth-generation communication (4G), fifth-generation communication (5G) or similar functions.

無線通訊積體電路220包含圖案化於基板210之第一安裝區域212上的一電路佈局(未繪示)、安裝於基板210之第一安裝區域212以電性連接電路佈局而實施通訊功能之一基頻晶片/射頻晶片222、以及用於覆蓋基頻晶片/射頻晶片222之一絕緣層224。The wireless communication integrated circuit 220 includes a circuit layout (not shown) patterned on the first mounting area 212 of the substrate 210, and the first mounting area 212 mounted on the substrate 210 is electrically connected to the circuit layout to implement the communication function. A baseband chip/RF chip 222, and an insulating layer 224 for covering the baseband chip/RF chip 222.

天線塊230電性連接於無線通訊積體電路220並將無線通訊積體電路220提供之通訊資料傳送至外界或自外界接收通訊資料。天線塊230可發送通訊資料至外界或利用無線通訊積體電路220提供之電性訊號(例如電流)自外界接收通訊資料。The antenna block 230 is electrically connected to the wireless communication integrated circuit 220 and transmits the communication data provided by the wireless communication integrated circuit 220 to the outside or receives communication data from the outside. The antenna block 230 can send communication data to the outside or receive communication data from the outside by using electrical signals (such as current) provided by the wireless communication integrated circuit 220.

如圖2A、圖2B及圖3所示，於一實施例中，根據本發明之天線塊230包含一第一天線240、一連接元件250、一寄生元件260、一絕緣層270以及一第二天線280。As shown in FIG. 2A, FIG. 2B and FIG. 3, in one embodiment, the antenna block 230 according to the present invention includes a first antenna 240, a connecting element 250, a parasitic element 260, an insulating layer 270, and a second antenna. Two antennas 280.

第一天線240形成於基板210上以電性連接無線通訊積體電路220。第一天線240可形成並圖案化於基板210上。於一實施例中，第一天線240可與設計於第一安裝區域212上之電路佈局一併形成及圖案化。The first antenna 240 is formed on the substrate 210 to be electrically connected to the wireless communication integrated circuit 220. The first antenna 240 may be formed and patterned on the substrate 210. In one embodiment, the first antenna 240 can be formed and patterned together with the circuit layout designed on the first mounting area 212.

如圖2A、圖2B及圖3所示，根據本發明之第一天線240可包含一輻射圖案310、一饋入接腳320以及一第一接地單元330。As shown in FIGS. 2A, 2B, and 3, the first antenna 240 according to the present invention may include a radiation pattern 310, a feeding pin 320, and a first ground unit 330.

輻射圖案310形成於基板210之第二安裝區域214以具有一預定長度。在此情況下，輻射圖案310之長度可根據理想之共振頻寬決定。於一實施例中，輻射圖案310包含一主圖案312、一第一連接圖案314以及一第二連接圖案316。The radiation pattern 310 is formed on the second mounting area 214 of the substrate 210 to have a predetermined length. In this case, the length of the radiation pattern 310 can be determined according to the ideal resonance bandwidth. In one embodiment, the radiation pattern 310 includes a main pattern 312, a first connection pattern 314, and a second connection pattern 316.

主圖案312沿第一方向D1延伸並形成於基板210之第二安裝區域214上。第一連接圖案314沿第二方向D2自主圖案312之一端延伸。第一連接圖案314連接於饋入接腳320。第二連接圖案316沿第二方向D2自主圖案312之另一端延伸。第二連接圖案316連接於連接元件250。於一實施例中，第一連接圖案314及第二連接圖案316可具有相同的長度，且主圖案312可具有長於第一及第二連接圖案314、316之長度的長度。The main pattern 312 extends along the first direction D1 and is formed on the second mounting area 214 of the substrate 210. The first connection pattern 314 extends along one end of the main pattern 312 in the second direction D2. The first connection pattern 314 is connected to the feeding pin 320. The second connection pattern 316 extends along the other end of the main pattern 312 in the second direction D2. The second connection pattern 316 is connected to the connection element 250. In an embodiment, the first connection pattern 314 and the second connection pattern 316 may have the same length, and the main pattern 312 may have a length longer than the length of the first and second connection patterns 314 and 316.

饋入接腳320將電性訊號由無線通訊積體電路220提供至輻射圖案310。於一實施例中，饋入接腳320可沿第二方向D2自輻射圖案310之第一連接圖案314延伸。The feeding pin 320 provides an electrical signal from the wireless communication integrated circuit 220 to the radiation pattern 310. In one embodiment, the feeding pin 320 may extend from the first connection pattern 314 of the radiation pattern 310 along the second direction D2.

第一接地單元330使輻射圖案310接地。第一接地單元330可電性連接輻射圖案310至無線通訊積體電路220之一接地單元(未繪示)以使輻射圖案310接地。The first ground unit 330 grounds the radiation pattern 310. The first ground unit 330 can electrically connect the radiation pattern 310 to a ground unit (not shown) of the wireless communication integrated circuit 220 to ground the radiation pattern 310.

於一實施例中，第一接地單元330可從饋入接腳320分支。如圖2B所示，根據如此實施例，第一接地單元330包含一分支單元332以及一接地接腳334。In an embodiment, the first ground unit 330 may branch from the feeding pin 320. As shown in FIG. 2B, according to this embodiment, the first ground unit 330 includes a branch unit 332 and a ground pin 334.

分支單元332可沿第一方向D1自饋入接腳320及第一連接圖案314連接之處延伸。接地接腳334沿第二方向D2自分支單元332之一端延伸。接地接腳334電性連接無線通訊積體電路220中之接地單元。也就是說，接地接腳334之一端連接於分支單元332，且接地接腳334之另一端電性連接無線通訊積體電路220中之接地單元。The branch unit 332 can extend from the connection point of the feeding pin 320 and the first connection pattern 314 along the first direction D1. The ground pin 334 extends from one end of the branch unit 332 along the second direction D2. The ground pin 334 is electrically connected to the ground unit in the wireless communication integrated circuit 220. In other words, one end of the ground pin 334 is connected to the branch unit 332, and the other end of the ground pin 334 is electrically connected to the ground unit in the wireless communication integrated circuit 220.

於上述實施例中，分支單元332之長度可設定為能使電流集中分布於分支單元332及接地接腳334之數值。舉例來說，分支單元332之長度可設定為介於0.02 λ至0.03 λ之間。如此一來，饋入接腳320及接地接腳334便以0.02 λ至0.03 λ之距離相互間隔。In the above-mentioned embodiment, the length of the branch unit 332 can be set to a value that enables the current to be concentrated in the branch unit 332 and the ground pin 334. For example, the length of the branch unit 332 can be set to be between 0.02 λ and 0.03 λ. In this way, the feeding pin 320 and the ground pin 334 are separated from each other by a distance of 0.02 λ to 0.03 λ.

請再次參照圖2A、圖2B及圖3，連接元件250將第一天線240電性連接至第二天線280。連接元件250可形成於基板210上以沿第二方向D2自輻射圖案310之第二連接圖案316延伸。Please refer to FIGS. 2A, 2B and 3 again, the connecting element 250 electrically connects the first antenna 240 to the second antenna 280. The connection element 250 may be formed on the substrate 210 to extend from the second connection pattern 316 of the radiation pattern 310 in the second direction D2.

於一實施例中，連接元件250可為一總成元件(lumped element)。根據如此實施例，第一天線240及第二天線280連接於連接元件250之一第一終端252，而連接元件250之一第二終端254可懸空。當連接元件250做為總成元件時，連接元件250形成於基板210之表面而具有一預定高度。因此，第一天線240之輻射圖案310連接於連接元件250之第一終端252之一底面且第二天線280連接於連接元件250之第一終端252之一頂面。如此一來第一天線240及第二天線280便彼此電性連接。In one embodiment, the connecting element 250 may be a lumped element. According to this embodiment, the first antenna 240 and the second antenna 280 are connected to the first terminal 252 of the connecting element 250, and the second terminal 254 of the connecting element 250 can be suspended. When the connecting element 250 is used as an assembly element, the connecting element 250 is formed on the surface of the substrate 210 and has a predetermined height. Therefore, the radiation pattern 310 of the first antenna 240 is connected to a bottom surface of the first terminal 252 of the connecting element 250 and the second antenna 280 is connected to a top surface of the first terminal 252 of the connecting element 250. In this way, the first antenna 240 and the second antenna 280 are electrically connected to each other.

寄生元件260形成於基板210之第二安裝區域214上以與第一天線240之間具有一預定間隔。寄生元件260引起與第一天線240之耦合，因此便能得到如同延伸第一天線240之效果而保持第一天線240之表現。The parasitic element 260 is formed on the second mounting area 214 of the substrate 210 to have a predetermined distance from the first antenna 240. The parasitic element 260 causes the coupling with the first antenna 240, so the effect of extending the first antenna 240 can be obtained while maintaining the performance of the first antenna 240.

寄生元件260可圖案化並形成於基板210上。於一實施例中，寄生元件260可與設計於第一安裝區域212上之電路佈局一併圖案化而形成。The parasitic element 260 may be patterned and formed on the substrate 210. In one embodiment, the parasitic element 260 can be formed by patterning together with the circuit layout designed on the first mounting area 212.

如圖2B所示，寄生元件260可形成於構成基板210之第二安裝區域214上之輻射圖案310之主圖案312、第一連接圖案314及第二連接圖案316所形成的區域中。As shown in FIG. 2B, the parasitic element 260 may be formed in the area formed by the main pattern 312, the first connection pattern 314 and the second connection pattern 316 of the radiation pattern 310 on the second mounting area 214 of the substrate 210.

於一實施例中，寄生元件260可包含具有迴路外型之一第一寄生輻射圖案262。於此情況中，一開口264形成於迴路狀的第一寄生輻射圖案262中。於本發明中，寄生元件260以迴路狀第一寄生輻射圖案262形成之原因係為了增加寄生元件260之長度，而開口264形成於第一寄生輻射圖案262之原因係為了藉由開口264促使因第一寄生輻射圖案262及第一天線240之間引起之耦合而產生之電流交換。In one embodiment, the parasitic element 260 may include a first parasitic radiation pattern 262 having a loop shape. In this case, an opening 264 is formed in the loop-shaped first parasitic radiation pattern 262. In the present invention, the reason why the parasitic element 260 is formed in the loop-shaped first parasitic radiation pattern 262 is to increase the length of the parasitic element 260, and the reason why the opening 264 is formed in the first parasitic radiation pattern 262 is to cause the cause by the opening 264 The coupling between the first parasitic radiation pattern 262 and the first antenna 240 results in current exchange.

根據上述實施例，迴路狀第一寄生輻射圖案262可具有N個側(其中N為正整數)。詳細來說，第一寄生輻射圖案262可包含面對無線通訊積體電路220形成之一第一側N1、於主圖案312相對於第一側N1之方向中面對第一側N1形成之一第二側N2、將第一側N1之一端連接至第二側N2之一端之一第三側N3、以及將第一側N1之另一端連接至第二側N2之另一端之一第四側N4。如此一來，開口264大約形成於N個側中面對主圖案312之第二側N2之中心位置。According to the above embodiment, the loop-shaped first parasitic radiation pattern 262 may have N sides (where N is a positive integer). In detail, the first parasitic radiation pattern 262 may include a first side N1 formed facing the wireless communication integrated circuit 220 and a first side N1 formed facing the first side N1 in the direction of the main pattern 312 relative to the first side N1 A second side N2, a third side N3 connecting one end of the first side N1 to one end of the second side N2, and a fourth side connecting the other end of the first side N1 to the other end of the second side N2 N4. In this way, the opening 264 is formed approximately at the center of the second side N2 facing the main pattern 312 among the N sides.

在此狀況下，如圖2B所示，第一寄生輻射圖案262可形成以使分支單元332與N側中之第一側N1之間的距離W1大於為第一寄生輻射圖案262內部寬度之第一側N1及第二側N2之間的距離W2。In this situation, as shown in FIG. 2B, the first parasitic radiation pattern 262 can be formed so that the distance W1 between the branch unit 332 and the first side N1 of the N side is greater than the first parasitic radiation pattern 262 inner width. The distance W2 between one side N1 and the second side N2.

於另一實施例中，如圖2D所示，第一寄生輻射圖案262可形成以使分支單元332與N側中之第一側N1之間的距離W1小於為第一寄生輻射圖案262內部寬度之第一側N1及第二側N2之間的距離W2。In another embodiment, as shown in FIG. 2D, the first parasitic radiation pattern 262 may be formed so that the distance W1 between the branch unit 332 and the first side N1 of the N side is less than the inner width of the first parasitic radiation pattern 262 The distance W2 between the first side N1 and the second side N2.

為了匹配頻率，可藉由調整上述距離W1、W2而調整天線之長度及阻抗。In order to match the frequency, the length and impedance of the antenna can be adjusted by adjusting the distances W1 and W2.

然而，圖2B及圖2D中，寄生元件260僅包含形成有開口264之第一寄生輻射圖案262。然而，於修改之範例中，如圖2C及圖2E所示，寄生元件260可更包含一第二寄生輻射圖案266以及一第三寄生輻射圖案268。However, in FIGS. 2B and 2D, the parasitic element 260 only includes the first parasitic radiation pattern 262 formed with the opening 264. However, in the modified example, as shown in FIGS. 2C and 2E, the parasitic element 260 may further include a second parasitic radiation pattern 266 and a third parasitic radiation pattern 268.

第二寄生輻射圖案266沿第二方向D2自第一寄生輻射圖案262之一端延伸並連接於主圖案312。於一實施例中，當第一寄生輻射圖案262具有N個側，第二寄生輻射圖案266沿第二方向D2自構成第一寄生輻射圖案262之N個側中之第二側N2之開口264之一側延伸，並連接於主圖案312。The second parasitic radiation pattern 266 extends from one end of the first parasitic radiation pattern 262 along the second direction D2 and is connected to the main pattern 312. In one embodiment, when the first parasitic radiation pattern 262 has N sides, the second parasitic radiation pattern 266 forms the opening 264 of the second side N2 of the N sides of the first parasitic radiation pattern 262 along the second direction D2. One side extends and is connected to the main pattern 312.

第三寄生輻射圖案268沿第二方向D2自第一寄生輻射圖案262之另一端延伸，並連接於主圖案312。於一實施例中，當第一寄生輻射圖案262具有N個側，第三寄生輻射圖案268沿第二方向D2自構成第一寄生輻射圖案262之N個側中之第二側N2之開口264之另一側延伸，並連接於主圖案312。The third parasitic radiation pattern 268 extends from the other end of the first parasitic radiation pattern 262 along the second direction D2 and is connected to the main pattern 312. In one embodiment, when the first parasitic radiation pattern 262 has N sides, the third parasitic radiation pattern 268 forms the opening 264 of the second side N2 of the N sides of the first parasitic radiation pattern 262 along the second direction D2. The other side extends and is connected to the main pattern 312.

圖5為比較包含有寄生元件260之天線塊230之效率以及無包含寄生元件260之天線塊230之效率的圖表。如圖5所示，可觀察到，相對天線塊230無包含寄生元件260之情況620之效率而言，天線塊230包含有寄生元件260之情況610之效率有被改善。5 is a graph comparing the efficiency of the antenna block 230 including the parasitic element 260 and the efficiency of the antenna block 230 not including the parasitic element 260. As shown in FIG. 5, it can be observed that the efficiency of the case 610 where the antenna block 230 includes the parasitic element 260 is improved compared to the efficiency of the case 620 where the antenna block 230 does not include the parasitic element 260.

請再次參閱圖2B，絕緣層270形成於基板210之第二安裝區域214上以覆蓋第一天線240、連接元件250以及寄生元件260。絕緣層270可具有使第一天線240、連接元件250及寄生元件260不會暴露於外之一厚度。如此一來，根據本發明之天線塊230可無需藉由額外之外部殼體而僅以絕緣層270保護第一天線240、連接元件250以及寄生元件260。Please refer to FIG. 2B again, the insulating layer 270 is formed on the second mounting area 214 of the substrate 210 to cover the first antenna 240, the connecting element 250 and the parasitic element 260. The insulating layer 270 may have a thickness such that the first antenna 240, the connection element 250, and the parasitic element 260 are not exposed to the outside. In this way, the antenna block 230 according to the present invention can protect the first antenna 240, the connection element 250, and the parasitic element 260 with only the insulating layer 270 without using an additional external casing.

然而，絕緣層270可形成而具有與無線通訊積體電路220之絕緣層224相同之高度。如此一來，絕緣層270可與無線通訊積體電路220之絕緣層224一起形成。However, the insulating layer 270 can be formed to have the same height as the insulating layer 224 of the wireless communication integrated circuit 220. In this way, the insulating layer 270 can be formed together with the insulating layer 224 of the wireless communication integrated circuit 220.

於一實施例中，絕緣層270可由環氧樹脂形成。於另一實施例中，絕緣層270可由具有高於或等於一參考值之介電常數之高介電材料形成，且高介電材料例如為陶瓷。In one embodiment, the insulating layer 270 may be formed of epoxy resin. In another embodiment, the insulating layer 270 may be formed of a high dielectric material having a dielectric constant higher than or equal to a reference value, and the high dielectric material is, for example, ceramic.

第二天線280形成於絕緣層270上以藉由連接元件250電性連接第一天線240。如上所述，第二天線280電性連接於第一天線240，因此產生將第一天線240之長度以第二天線280之長度延伸之效果。於一實施例中，第二天線280可形成於絕緣層270上以沿第一方向D1延伸，且第二天線280及基板210之間的距離可介於0.2 λ至0.3 λ之間。The second antenna 280 is formed on the insulating layer 270 to be electrically connected to the first antenna 240 through the connection element 250. As described above, the second antenna 280 is electrically connected to the first antenna 240, so that the length of the first antenna 240 is extended by the length of the second antenna 280. In one embodiment, the second antenna 280 may be formed on the insulating layer 270 to extend along the first direction D1, and the distance between the second antenna 280 and the substrate 210 may be between 0.2λ and 0.3λ.

於此情況下，第二天線280之第一表面接觸於絕緣層270，且第二天線280相對第一表面之第二表面暴露於無線通訊晶片200外。也就是說，於本發明中，天線塊230之第二天線280設置於一最外側部分且暴露於外。In this case, the first surface of the second antenna 280 is in contact with the insulating layer 270, and the second surface of the second antenna 280 opposite to the first surface is exposed outside the wireless communication chip 200. That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed on an outermost part and exposed to the outside.

於上述實施例中，第一天線240、絕緣層270及第二天線280以堆疊結構設置於基板210之頂面上之原因係為，當第一天線240設置於基板210之底面且第二天線280設置於基板210之頂面時，必須於基板210形成一穿孔以電性連接第一天線240至第二天線280，但由於基板210的厚度很小，所以很難直接於基板210中形成穿孔。In the above embodiment, the reason why the first antenna 240, the insulating layer 270, and the second antenna 280 are disposed on the top surface of the substrate 210 in a stacked structure is that when the first antenna 240 is disposed on the bottom surface of the substrate 210 and When the second antenna 280 is disposed on the top surface of the substrate 210, a through hole must be formed in the substrate 210 to electrically connect the first antenna 240 to the second antenna 280. However, since the thickness of the substrate 210 is small, it is difficult to directly A through hole is formed in the substrate 210.

因此，本發明之第一實施例中，第一天線240、絕緣層270及第二天線280以堆疊結構設置於基板210之頂面上，以使第一及第二天線240、280可不藉由在基板210中形成穿孔的方式而彼此電性連接。可確定第二天線280以及第一天線240之間之一分離距離以及第二天線280以及第一接地單元330之間之一分離距離從而改善天線之表現。Therefore, in the first embodiment of the present invention, the first antenna 240, the insulating layer 270, and the second antenna 280 are disposed on the top surface of the substrate 210 in a stacked structure, so that the first and second antennas 240, 280 It is possible to electrically connect to each other without forming a through hole in the substrate 210. A separation distance between the second antenna 280 and the first antenna 240 and a separation distance between the second antenna 280 and the first ground unit 330 can be determined to improve the performance of the antenna.

如圖2A至圖3所示，於一實施例中，第二天線280可包含一壓縮槽282將第二天線280電性連接至連接元件250。根據本發明之第二天線280包含壓縮槽282之原因係為，當連接元件250之高度較絕緣層270之高度低時，連接元件250不會暴露於外，且形成於絕緣層270上之第二天線280不會連接於連接元件250。因此，一部分之第二天線280可被壓縮而形成壓縮槽282，而使第二天線280可藉由穿過絕緣層270而連接於連接元件250。As shown in FIGS. 2A to 3, in one embodiment, the second antenna 280 may include a compression groove 282 to electrically connect the second antenna 280 to the connecting element 250. The reason why the second antenna 280 according to the present invention includes the compression groove 282 is that when the height of the connecting element 250 is lower than the height of the insulating layer 270, the connecting element 250 will not be exposed to the outside, and is formed on the insulating layer 270 The second antenna 280 is not connected to the connecting element 250. Therefore, a part of the second antenna 280 can be compressed to form a compression groove 282, so that the second antenna 280 can be connected to the connecting element 250 by passing through the insulating layer 270.

根據如此實施例，第二天線280之壓縮槽282連接於連接元件250之第一終端252之頂面。According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the top surface of the first terminal 252 of the connecting element 250.

於上述實施例中，因為連接元件250具有較絕緣層270高度低之高度，第二天線280為具有壓縮槽282以連接第二天線280至連接元件250。然而，於另一實施例中，當連接元件250之第一終端252之頂面因連接元件250之高度高於或等於絕緣層270之高度而暴露於外，第二天線280可無需藉由壓縮槽282便能直接連接連接元件250之第一終端252之頂面。因此，壓縮槽282可根據連接元件250以及絕緣層270之高度選擇性地提供。In the above embodiment, because the connecting element 250 has a height lower than the height of the insulating layer 270, the second antenna 280 has a compression groove 282 to connect the second antenna 280 to the connecting element 250. However, in another embodiment, when the top surface of the first terminal 252 of the connecting element 250 is exposed because the height of the connecting element 250 is higher than or equal to the height of the insulating layer 270, the second antenna 280 may not need to use The compression groove 282 can be directly connected to the top surface of the first terminal 252 of the connecting element 250. Therefore, the compression groove 282 can be selectively provided according to the height of the connection element 250 and the insulating layer 270.

於一實施例中，第二天線280之共振頻率可相同於第一天線240之共振頻率。如此一來，便可避免第二天線280以及第一天線240之間發生干涉。In one embodiment, the resonance frequency of the second antenna 280 may be the same as the resonance frequency of the first antenna 240. In this way, interference between the second antenna 280 and the first antenna 240 can be avoided.

如上所述，根據本發明，因為天線塊230安裝於無線通訊晶片200中，所以當無線通訊晶片200安裝於底基板上，便不需要連接無線通訊晶片200至天線的無線射頻線纜，因此可降低生產成本。底基板之整合程度可被增加而使電子裝置能微小化，且可增加底基板上之電路佈局之容易性，從而增加生產作業的方便性。As described above, according to the present invention, because the antenna block 230 is installed in the wireless communication chip 200, when the wireless communication chip 200 is mounted on the base substrate, there is no need to connect the wireless communication chip 200 to the antenna with a radio frequency cable, so reduce manufacturing cost. The degree of integration of the base substrate can be increased so that the electronic device can be miniaturized, and the ease of circuit layout on the base substrate can be increased, thereby increasing the convenience of production operations.

尤其，根據本發明，除了第一天線240外，基板210上還額外設置有用於引起與第一天線240之耦合之寄生元件260，因此可能得到如同將第一天線240之長度以寄生元件260之長度延伸之效果而保持第一天線240之表現。In particular, according to the present invention, in addition to the first antenna 240, the substrate 210 is additionally provided with a parasitic element 260 for causing coupling with the first antenna 240. Therefore, it is possible to obtain a parasitic element like the length of the first antenna 240. The length extension of the element 260 maintains the performance of the first antenna 240.

更根據本發明，因為天線塊230安裝於無線通訊晶片200中且不為直接安裝於電子裝置之底基板上，所以能避免天線的共振頻率因底基板之形狀及尺寸而改變。According to the present invention, because the antenna block 230 is installed in the wireless communication chip 200 and is not directly installed on the base substrate of the electronic device, the resonance frequency of the antenna can be prevented from changing due to the shape and size of the base substrate.

如圖2B至圖2E所示，於第一實施例及第一實施例之修改範例中，連接元件250之第一終端252電性連接於第一天線240以及第二天線280，且連接元件250之第二終端254甚至於天線塊230之連接元件250為總成元件時懸空。As shown in FIGS. 2B to 2E, in the first embodiment and the modified example of the first embodiment, the first terminal 252 of the connecting element 250 is electrically connected to the first antenna 240 and the second antenna 280, and is connected to The second terminal 254 of the element 250 is suspended even when the connecting element 250 of the antenna block 230 is an assembly element.

然而，如圖6所示，根據第二實施例之一天線塊230更包含用於使一連接元件250接地之一第二接地單元340，以利用以總成元件實施之連接元件250改變天線塊230之共振頻率。However, as shown in FIG. 6, an antenna block 230 according to the second embodiment further includes a second grounding unit 340 for grounding a connecting element 250, so that the connecting element 250 implemented as an assembly element can be used to change the antenna block The resonance frequency of 230.

如圖6所示之根據第二實施例之一無線通訊晶片200及圖2B至圖2E所示之根據第一實施例及修改範例之無線通訊晶片200之間的差異僅在於根據第二實施例之一無線通訊晶片200包含一第二接地單元340。因此，以下，為了方便說明僅描述第二接地單元340。於圖6中，雖然為了方便描述而使一寄生元件260之形狀相同於圖2B中之寄生元件260之形狀，但是包含如圖2C至圖2E所示之形狀之寄生元件260之無線通訊晶片200也可包含第二接地單元340。The difference between the wireless communication chip 200 according to the second embodiment shown in FIG. 6 and the wireless communication chip 200 according to the first embodiment and the modified example shown in FIGS. 2B to 2E is only according to the second embodiment A wireless communication chip 200 includes a second ground unit 340. Therefore, in the following, for convenience of description, only the second grounding unit 340 is described. In FIG. 6, although the shape of a parasitic element 260 is the same as that of the parasitic element 260 in FIG. 2B for convenience of description, the wireless communication chip 200 includes the parasitic element 260 in the shape shown in FIGS. 2C to 2E The second ground unit 340 may also be included.

第二接地單元340電性連接連接元件250至位於一無線通訊積體電路220內之一接地單元(未繪示)以使連接元件250接地。為此，第二接地單元340被形成以沿一第二方向D2自連接元件250之一第二終端254延伸。The second ground unit 340 electrically connects the connection element 250 to a ground unit (not shown) in a wireless communication integrated circuit 220 to ground the connection element 250. To this end, the second ground unit 340 is formed to extend from a second terminal 254 of the connecting element 250 along a second direction D2.

如上所述，根據本發明第二實施例，連接元件250可作為包含一電感、一電容及一電阻至少其中一者的一總成元件，其中連接元件250之一第一終端252連接於一第一天線240及一第二天線280，而連接元件250之第二終端254藉由第二接地單元340接地，因此天線塊230之共振頻率可藉由改變構成連接元件250之電路元件之數值而改變。因此，天線塊230無需設置額外元件或改變構造便可使用於各種應用層面。As described above, according to the second embodiment of the present invention, the connecting element 250 can be used as an assembly element including at least one of an inductor, a capacitor and a resistor, wherein a first terminal 252 of the connecting element 250 is connected to a first terminal 252 An antenna 240 and a second antenna 280, and the second terminal 254 of the connecting element 250 is grounded by the second grounding unit 340, so the resonance frequency of the antenna block 230 can be changed by changing the value of the circuit elements constituting the connecting element 250 And change. Therefore, the antenna block 230 can be used in various application levels without requiring additional components or changing the structure.

於第二實施例中，第一天線240、一絕緣層270及第二天線280以相同於第一實施例之方式以堆疊結構設置於一基板210之頂面，因此第一及第二天線240、280無需在基板210形成穿孔便可彼此電性連接。可確保第二天線280及第一天線240之間的間隔距離以及第二天線280及第一/第二接地單元330、340之間的距離從而改善天線的表現。In the second embodiment, the first antenna 240, an insulating layer 270, and the second antenna 280 are stacked on the top surface of a substrate 210 in the same manner as in the first embodiment. Therefore, the first and second antennas The antennas 240 and 280 can be electrically connected to each other without forming a through hole in the substrate 210. The separation distance between the second antenna 280 and the first antenna 240 and the distance between the second antenna 280 and the first/second ground units 330 and 340 can be ensured to improve the performance of the antenna.

於第一及第二實施例中，第一天線240、寄生元件260以及第二天線280為包含於無線通訊晶片200中。然而，根據第三實施例之一無線通訊晶片720可僅包含一第二天線280、一第一天線240及可直接形成於一電子裝置之一主機板710上的一寄生元件260。以下，根據本發明第三實施例之包含無線通訊晶片之電子裝置將參照圖7A至圖8詳細說明。In the first and second embodiments, the first antenna 240, the parasitic element 260, and the second antenna 280 are included in the wireless communication chip 200. However, a wireless communication chip 720 according to the third embodiment may only include a second antenna 280, a first antenna 240, and a parasitic element 260 that can be directly formed on a motherboard 710 of an electronic device. Hereinafter, the electronic device including the wireless communication chip according to the third embodiment of the present invention will be described in detail with reference to FIGS. 7A to 8.

圖7A為根據本發明第三實施例之包含無線通訊晶片之電子裝置之部分立體圖。圖7B為根據本發明第三實施例之包含無線通訊晶片之電子裝置之部分立體分解圖。圖7C至圖7E為根據第三實施例之修改範例包含無線通訊晶片之電子裝置之部分立體分解圖。圖8為根據本發明第三實施例之包含無線通訊晶片之電子裝置之側視圖。FIG. 7A is a partial perspective view of an electronic device including a wireless communication chip according to a third embodiment of the present invention. 7B is a partially exploded perspective view of an electronic device including a wireless communication chip according to the third embodiment of the present invention. 7C to 7E are partial perspective exploded views of an electronic device including a wireless communication chip according to a modified example of the third embodiment. 8 is a side view of an electronic device including a wireless communication chip according to a third embodiment of the invention.

如圖7A至圖8所示，一電子裝置700包含一主機板710、一無線通訊晶片720、一第一天線240以及一寄生元件260。As shown in FIGS. 7A to 8, an electronic device 700 includes a motherboard 710, a wireless communication chip 720, a first antenna 240, and a parasitic element 260.

執行電子裝置700不同功能之各種晶片(未繪示)安裝於主機板710上。尤其，根據本發明第三實施例之無線通訊晶片720安裝於根據本發明之主機板710，且根據本發明之第一天線240及寄生元件260形成於主機板710上。也就是說，於第一及第二實施例中，第一天線240以及寄生元件260被包含於無線通訊晶片200中。另一方面，於第三實施例中，第一天線240及寄生元件260並無被包含於無線通訊晶片720中而是直接形成於主機板710上。Various chips (not shown) that perform different functions of the electronic device 700 are mounted on the motherboard 710. In particular, the wireless communication chip 720 according to the third embodiment of the present invention is mounted on the motherboard 710 according to the present invention, and the first antenna 240 and the parasitic element 260 according to the present invention are formed on the motherboard 710. That is, in the first and second embodiments, the first antenna 240 and the parasitic element 260 are included in the wireless communication chip 200. On the other hand, in the third embodiment, the first antenna 240 and the parasitic element 260 are not included in the wireless communication chip 720 but are directly formed on the motherboard 710.

無線通訊晶片720安裝於主機板710之一預定區域，因此電子裝置700可執行通訊功能。於一實施例中，無線通訊晶片720可為能執行近場通訊如藍芽、無線區域網路、信標、近場通訊(NFC)等類似功能之近場通訊晶片。然而，本發明並不以此限，且根據本發明之無線通訊晶片720可為能執行無線通訊例如第三世代通訊、第四世代通訊、第五世代通訊或類似功能之一通訊模組。The wireless communication chip 720 is installed in a predetermined area of the motherboard 710, so the electronic device 700 can perform communication functions. In one embodiment, the wireless communication chip 720 may be a near field communication chip capable of performing near field communication such as Bluetooth, wireless local area network, beacon, near field communication (NFC) and similar functions. However, the present invention is not limited to this, and the wireless communication chip 720 according to the present invention may be a communication module capable of performing wireless communication such as third-generation communication, fourth-generation communication, fifth-generation communication, or similar functions.

如圖9A所示，於一實施例中，無線通訊晶片720可安裝於主機板710之一側之中心區域上，或可如圖10A所示安裝於主機板710之角落部分上。當無線通訊晶片720安裝於主機板710之一側之中心區域上時，會呈現如圖9B之一輻射圖案，而當無線通訊晶片720安裝於主機板710之角落部分上時，會呈現如圖10B之一輻射圖案。如圖9B及圖10B所示，相較於將無線通訊晶片720安裝於主機板710之角落部分上，當無線通訊晶片720安裝於主機板710之一側之中心區域上時能確保更均勻的輻射圖案。As shown in FIG. 9A, in one embodiment, the wireless communication chip 720 may be installed on the central area of one side of the motherboard 710, or may be installed on the corner portion of the motherboard 710 as shown in FIG. 10A. When the wireless communication chip 720 is installed on the central area on one side of the motherboard 710, it will show a radiation pattern as shown in FIG. 9B, and when the wireless communication chip 720 is installed on the corner portion of the motherboard 710, it will appear as shown One of 10B radiation pattern. As shown in FIGS. 9B and 10B, compared to mounting the wireless communication chip 720 on the corner portion of the motherboard 710, when the wireless communication chip 720 is mounted on the central area on one side of the motherboard 710, it can ensure a more uniform Radiation pattern.

根據本發明第三實施例之無線通訊晶片720包含一次基板210、一無線通訊積體電路220以及一天線塊230。天線塊230包含一連接元件250、一絕緣層270以及一第二天線280。此處，第一及第二實施例中各包含之基板210與次基板210相同。The wireless communication chip 720 according to the third embodiment of the present invention includes a primary substrate 210, a wireless communication integrated circuit 220, and an antenna block 230. The antenna block 230 includes a connecting element 250, an insulating layer 270, and a second antenna 280. Here, the substrate 210 included in each of the first and second embodiments is the same as the sub-substrate 210.

無線通訊積體電路220及天線塊230安裝於次基板210上。於一實施例中，次基板210可為一印刷電路板。根據本發明之次基板210包含安裝有無線通訊積體電路220之一第一安裝區域212以及安裝有天線塊230之一第二安裝區域214。於此情況下，次基板210沿一第一方向D1之長度可小於次基板210沿一第二方向D2之長度。The wireless communication integrated circuit 220 and the antenna block 230 are mounted on the sub-board 210. In one embodiment, the sub-substrate 210 may be a printed circuit board. The secondary substrate 210 according to the present invention includes a first installation area 212 in which the wireless communication integrated circuit 220 is installed and a second installation area 214 in which the antenna block 230 is installed. In this case, the length of the sub-substrate 210 along a first direction D1 may be less than the length of the sub-substrate 210 along a second direction D2.

如圖7B所示，於一實施例中，為了連接第一天線240及無線通訊積體電路220之一第一穿孔810可形成於次基板210中。As shown in FIG. 7B, in one embodiment, a first through hole 810 may be formed in the sub-substrate 210 for connecting the first antenna 240 and the wireless communication integrated circuit 220.

如圖7B及圖8所示，第一穿孔810填滿用於電性連接無線通訊積體電路220及第一天線240之一第一導體812。如圖7B所示，於此情況下，為了連接第一穿孔810至無線通訊積體電路220，可於次基板210上形成為了電性連接第一穿孔810至無線通訊積體電路220之一次饋入接腳322。As shown in FIGS. 7B and 8, the first through hole 810 is filled with a first conductor 812 used to electrically connect the wireless communication integrated circuit 220 and the first antenna 240. As shown in FIG. 7B, in this case, in order to connect the first through hole 810 to the wireless communication integrated circuit 220, a primary feeder for electrically connecting the first through hole 810 to the wireless communication integrated circuit 220 may be formed on the secondary substrate 210.入pin 322.

此外，如圖7B所示，可為了將第一天線240連接至連接元件250而於次基板210中額外形成一第二穿孔820。如圖7B及圖8所示，第二穿孔820填滿用於將連接元件250電性連接至第一天線240的一第二導體822。In addition, as shown in FIG. 7B, in order to connect the first antenna 240 to the connecting element 250, a second through hole 820 may be additionally formed in the sub-substrate 210. As shown in FIGS. 7B and 8, the second through hole 820 is filled with a second conductor 822 for electrically connecting the connecting element 250 to the first antenna 240.

如上所述，於第三實施例中，因為第一天線240直接形成於主機板710上，所以無線通訊晶片720及第一天線240藉由形成於次基板210中之第一及第二穿孔810、820彼此電性連接。As described above, in the third embodiment, because the first antenna 240 is directly formed on the main board 710, the wireless communication chip 720 and the first antenna 240 are formed by the first and second antennas on the sub-substrate 210. The through holes 810 and 820 are electrically connected to each other.

無線通訊積體電路220壓模成型於次基板210之第一安裝區域212上。於一實施例中，無線通訊積體電路220可為能執行近場通訊如藍芽、無線區域網路、信標、近場通訊等類似功能之近場通訊模組，或是可為能執行無線通訊例如第三世代通訊、第四世代通訊、第五世代通訊或類似功能之一通訊模組。The wireless communication integrated circuit 220 is compression molded on the first mounting area 212 of the secondary substrate 210. In one embodiment, the wireless communication integrated circuit 220 may be a near field communication module capable of performing near field communication such as Bluetooth, wireless local area network, beacon, near field communication, etc., or may be capable of performing Wireless communication such as third-generation communication, fourth-generation communication, fifth-generation communication, or a communication module with similar functions.

無線通訊積體電路220包含圖案化於次基板210之第一安裝區域212上之一電路佈局(未繪示)、安裝於次基板210之第一安裝區域212上以電性連接電路佈局而執行通訊功能之一基頻晶片/射頻晶片222、以及用於覆蓋基頻晶片/射頻晶片222之一絕緣層224。The wireless communication integrated circuit 220 includes a circuit layout (not shown) patterned on the first mounting area 212 of the sub-substrate 210, and is mounted on the first mounting area 212 of the sub-substrate 210 to electrically connect the circuit layout. One of the communication functions is a baseband chip/RF chip 222, and an insulating layer 224 for covering the baseband chip/RF chip 222.

天線塊230電性連接於無線通訊積體電路220並傳送自無線通訊積體電路220提供之通訊資料至外界，或自外界接收通訊資料。天線塊230可發送通訊資料至外界，或利用無線通訊積體電路220提供之電性訊號(例如電流)而自外界接收通訊資料。The antenna block 230 is electrically connected to the wireless communication integrated circuit 220 and transmits communication data provided by the wireless communication integrated circuit 220 to the outside, or receives communication data from the outside. The antenna block 230 can send communication data to the outside, or use the electrical signal (such as current) provided by the wireless communication integrated circuit 220 to receive communication data from the outside.

如圖7A至圖8所示，天線塊230包含連接元件250、絕緣層270以及第二天線280。As shown in FIGS. 7A to 8, the antenna block 230 includes a connecting element 250, an insulating layer 270 and a second antenna 280.

連接元件250形成於次基板210之第二安裝區域214上以將第二天線280電性連接至形成於主機板710上之第一天線240。連接元件250藉由第二穿孔820電性連接於形成於主機板710上之第一天線240的一第二連接圖案316。The connecting element 250 is formed on the second mounting area 214 of the sub-board 210 to electrically connect the second antenna 280 to the first antenna 240 formed on the main board 710. The connection element 250 is electrically connected to a second connection pattern 316 of the first antenna 240 formed on the motherboard 710 through the second through hole 820.

於一實施例中，連接元件250可實現為總成元件。根據此實施例，第一天線240及第二天線280連接於連接元件250之一第一終端252，且連接元件250之一第二終端254懸空。In one embodiment, the connecting element 250 may be implemented as an assembly element. According to this embodiment, the first antenna 240 and the second antenna 280 are connected to a first terminal 252 of the connecting element 250, and a second terminal 254 of the connecting element 250 is suspended.

當連接元件250以總成元件實施時，連接元件250具有自次基板210之表面起算之預定高度。如此一來，連接元件250之第一終端252之底面藉由第二穿孔820連接於第一天線240之第二連接圖案316，且連接元件250之第一終端252之頂面連接於第二天線280。因此，第一天線240及第二天線280彼此電性連接。When the connecting element 250 is implemented as an assembly element, the connecting element 250 has a predetermined height from the surface of the sub-substrate 210. In this way, the bottom surface of the first terminal 252 of the connecting element 250 is connected to the second connecting pattern 316 of the first antenna 240 through the second through hole 820, and the top surface of the first terminal 252 of the connecting element 250 is connected to the second Antenna 280. Therefore, the first antenna 240 and the second antenna 280 are electrically connected to each other.

絕緣層270形成於次基板210之第二安裝區域214上以覆蓋連接元件250。絕緣層270可具有使連接元件250暴露於外之一厚度。如此一來，根據本發明之天線塊230可不藉由額外之外部殼體而僅藉由絕緣層270保護連接元件250。The insulating layer 270 is formed on the second mounting area 214 of the sub-substrate 210 to cover the connection element 250. The insulating layer 270 may have a thickness such that the connection element 250 is exposed to the outside. In this way, the antenna block 230 according to the present invention can protect the connection element 250 only by the insulating layer 270 without using an additional outer casing.

然而，絕緣層270可具有與無線通訊積體電路220之絕緣層224相同之高度。於此情況下，絕緣層270可與無線通訊積體電路220之絕緣層224一起形成。However, the insulating layer 270 may have the same height as the insulating layer 224 of the wireless communication integrated circuit 220. In this case, the insulating layer 270 can be formed together with the insulating layer 224 of the wireless communication integrated circuit 220.

於一實施例中，絕緣層270可由環氧樹脂形成。於另一實施例中，絕緣層270可由具有高於或等於一參考值之介電常數之高介電材料形成，且高介電材料例如為陶瓷。In one embodiment, the insulating layer 270 may be formed of epoxy resin. In another embodiment, the insulating layer 270 may be formed of a high dielectric material having a dielectric constant higher than or equal to a reference value, and the high dielectric material is, for example, ceramic.

第二天線280形成於絕緣層270上以藉由連接元件250電性連接第一天線240。如上所述，第二天線280電性連接於第一天線240，以產生將第一天線240之長度以第二天線280之長度延伸之效果。於一實施例中，第二天線280可形成於絕緣層270上以沿第一方向D1延伸，且第二天線280及基板210之間的距離可介於0.2 λ至0.3 λ之間。The second antenna 280 is formed on the insulating layer 270 to be electrically connected to the first antenna 240 through the connection element 250. As described above, the second antenna 280 is electrically connected to the first antenna 240 to produce the effect of extending the length of the first antenna 240 by the length of the second antenna 280. In one embodiment, the second antenna 280 may be formed on the insulating layer 270 to extend along the first direction D1, and the distance between the second antenna 280 and the substrate 210 may be between 0.2λ and 0.3λ.

於此情況下，第二天線280之第一表面接觸於絕緣層270，且第二天線280相對第一表面之第二表面暴露於無線通訊晶片200外。也就是說，於本發明中，天線塊230之第二天線280設置於一最外側部分且暴露於外。In this case, the first surface of the second antenna 280 is in contact with the insulating layer 270, and the second surface of the second antenna 280 opposite to the first surface is exposed outside the wireless communication chip 200. That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed on an outermost part and exposed to the outside.

如圖7A至圖8所示，於一實施例中，第二天線280可包含一壓縮槽282以電性連接第二天線280至連接元件250。根據本發明之第二天線280包含壓縮槽282之原因係為，當連接元件250之高度較絕緣層270之高度低時，連接元件250不會暴露於外，且形成於絕緣層270上之第二天線280不會連接於連接元件250。因此，藉由壓縮一部分之第二天線280而形成壓縮槽282，第二天線280可穿過絕緣層270而連接於連接元件250。As shown in FIGS. 7A to 8, in one embodiment, the second antenna 280 may include a compression groove 282 to electrically connect the second antenna 280 to the connecting element 250. The reason why the second antenna 280 according to the present invention includes the compression groove 282 is that when the height of the connecting element 250 is lower than the height of the insulating layer 270, the connecting element 250 will not be exposed to the outside, and is formed on the insulating layer 270 The second antenna 280 is not connected to the connecting element 250. Therefore, a compression groove 282 is formed by compressing a part of the second antenna 280, and the second antenna 280 can pass through the insulating layer 270 to be connected to the connection element 250.

根據此實施例，第二天線280之壓縮槽282連接於連接元件250之第一終端252之頂面。According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the top surface of the first terminal 252 of the connecting element 250.

於上述實施例中，因為連接元件250具有較絕緣層270高度低之高度，因而第二天線280具有壓縮槽282以將第二天線280連接至連接元件250。然而，於另一實施例中，當連接元件250之第一終端252之頂面因連接元件250之高度高於或等於絕緣層270之高度而暴露於外，第二天線280可無需藉由壓縮槽282便能直接連接連接元件250之第一終端252之頂面。因此，壓縮槽282可根據連接元件250以及絕緣層270之高度選擇性地提供。In the above embodiment, because the connecting element 250 has a height lower than the height of the insulating layer 270, the second antenna 280 has a compression groove 282 to connect the second antenna 280 to the connecting element 250. However, in another embodiment, when the top surface of the first terminal 252 of the connecting element 250 is exposed because the height of the connecting element 250 is higher than or equal to the height of the insulating layer 270, the second antenna 280 may not need to use The compression groove 282 can be directly connected to the top surface of the first terminal 252 of the connecting element 250. Therefore, the compression groove 282 can be selectively provided according to the height of the connection element 250 and the insulating layer 270.

第一天線240直接形成於主機板710上。第一天線240形成於主機板710上以電性連接無線通訊積體電路220及天線塊230之第二天線280。第一天線240可圖形化且形成於主機板710上。The first antenna 240 is directly formed on the main board 710. The first antenna 240 is formed on the main board 710 to electrically connect the wireless communication integrated circuit 220 and the second antenna 280 of the antenna block 230. The first antenna 240 can be patterned and formed on the motherboard 710.

於一實施例中，第一天線240可包含一輻射圖案310、一饋入接腳320以及一第一接地單元330。In an embodiment, the first antenna 240 may include a radiation pattern 310, a feeding pin 320, and a first ground unit 330.

輻射圖案310直接形成於主機板710上。於此情況下，輻射圖案310之長度可根據理想共振頻寬決定。於一實施例中，輻射圖案310包含一主圖案312、一第一連接圖案314以及一第二連接圖案316。The radiation pattern 310 is directly formed on the main board 710. In this case, the length of the radiation pattern 310 can be determined according to the ideal resonance bandwidth. In one embodiment, the radiation pattern 310 includes a main pattern 312, a first connection pattern 314, and a second connection pattern 316.

主圖案312沿第一方向D1形成於主機板710上而具有一預定長度。第一連接圖案314沿第二方向D2自主圖案312之一端延伸。第一連接圖案314連接於饋入接腳320。第二連接圖案316沿第二方向D2自主圖案312之另一端延伸。第二連接圖案316連接於連接元件250。於一實施例中，第一連接圖案314及第二連接圖案316可具有相同之長度，且主圖案312可具有較第一及第二連接圖案314、316之長度長之一長度。The main pattern 312 is formed on the main board 710 along the first direction D1 and has a predetermined length. The first connection pattern 314 extends along one end of the main pattern 312 in the second direction D2. The first connection pattern 314 is connected to the feeding pin 320. The second connection pattern 316 extends along the other end of the main pattern 312 in the second direction D2. The second connection pattern 316 is connected to the connection element 250. In an embodiment, the first connection pattern 314 and the second connection pattern 316 may have the same length, and the main pattern 312 may have a length that is longer than the length of the first and second connection patterns 314 and 316.

饋入接腳320藉由第一穿孔810及次饋入接腳322電性連接於無線通訊積體電路220，且饋入接腳320提供一自無線通訊積體電路220提供之電性訊號至輻射圖案310。於一實施例中，饋入接腳320可形成以沿第二方向D2自輻射圖案310之第一連接圖案314延伸。The feeding pin 320 is electrically connected to the wireless communication integrated circuit 220 through the first through hole 810 and the secondary feeding pin 322, and the feeding pin 320 provides an electrical signal provided from the wireless communication integrated circuit 220 to Radiation pattern 310. In one embodiment, the feeding pin 320 may be formed to extend from the first connection pattern 314 of the radiation pattern 310 along the second direction D2.

第一接地單元330使輻射圖案310接地。第一接地單元330可電性連接輻射圖案310至形成於主機板710上之一接地單元(未繪示)以使輻射圖案310接地。The first ground unit 330 grounds the radiation pattern 310. The first ground unit 330 can electrically connect the radiation pattern 310 to a ground unit (not shown) formed on the main board 710 to ground the radiation pattern 310.

如圖7B所示，於一實施例中，第一接地單元330可從饋入接腳320分支。根據如此實施例，第一接地單元330包含一分支單元332及一接地接腳334。As shown in FIG. 7B, in one embodiment, the first ground unit 330 may branch from the feeding pin 320. According to this embodiment, the first ground unit 330 includes a branch unit 332 and a ground pin 334.

分支單元332形成以沿第一方向D1自饋入接腳320以及第一連接圖案314之連接處延伸。接地接腳334形成以沿第二方向D2自分支單元332之一端延伸。接地接腳334電性連接於形成於主機板710上之接地單元。也就是說，接地接腳334之一端連接於分支單元332，而接地接腳334之另一端電性連接於主機板710之接地單元。The branch unit 332 is formed to extend from the connection between the feeding pin 320 and the first connection pattern 314 along the first direction D1. The ground pin 334 is formed to extend from one end of the branch unit 332 along the second direction D2. The ground pin 334 is electrically connected to a ground unit formed on the motherboard 710. That is, one end of the ground pin 334 is connected to the branch unit 332, and the other end of the ground pin 334 is electrically connected to the ground unit of the main board 710.

於上述實施例中，分支單元332之長度可設定為能使電流集中分布於分支單元332及接地接腳334之數值。舉例來說，分支單元332之長度可設定為介於0.02 λ至0.03 λ之間。如此一來，饋入接腳320及接地接腳334便以0.02 λ至0.03 λ之距離相互間隔。In the above-mentioned embodiment, the length of the branch unit 332 can be set to a value that enables the current to be concentrated in the branch unit 332 and the ground pin 334. For example, the length of the branch unit 332 can be set to be between 0.02 λ and 0.03 λ. In this way, the feeding pin 320 and the ground pin 334 are separated from each other by a distance of 0.02 λ to 0.03 λ.

於一實施例中，第一天線240之共振頻率可與第二天線280之共振頻率相同。如此一來，可避免第一天線240及第二天線280之間發生干涉。In one embodiment, the resonance frequency of the first antenna 240 may be the same as the resonance frequency of the second antenna 280. In this way, interference between the first antenna 240 and the second antenna 280 can be avoided.

如上所述，根據本發明第三實施例，形成於主機板710之第一天線240電性連接於嵌入於無線通訊晶片720中之天線塊230，而能改善輻射密度。As described above, according to the third embodiment of the present invention, the first antenna 240 formed on the motherboard 710 is electrically connected to the antenna block 230 embedded in the wireless communication chip 720, thereby improving the radiation density.

寄生元件260直接形成於主機板710上。寄生元件260形成於主機板710上以位於與第一天線240具有預定間隔之位置。寄生元件260引起與第一天線240之耦合，而可產生如同延長第一天線240之效果，而維持第一天線240之表現。The parasitic element 260 is directly formed on the main board 710. The parasitic element 260 is formed on the main board 710 to be located at a predetermined distance from the first antenna 240. The parasitic element 260 causes the coupling with the first antenna 240, and can produce the effect of extending the first antenna 240 while maintaining the performance of the first antenna 240.

如圖7B所示，寄生元件260可形成於由構成主機板710上之輻射圖案310之主圖案312、第一連接圖案314及一第二連接圖案316所形成之區域上。As shown in FIG. 7B, the parasitic element 260 can be formed on the area formed by the main pattern 312, the first connection pattern 314, and a second connection pattern 316 constituting the radiation pattern 310 on the main board 710.

於一實施例中，寄生元件260可包含具有迴路外型之一第一寄生輻射圖案262。於此情況下，一開口264形成於迴路狀之第一寄生輻射圖案262。於本發明中，寄生元件260以迴路狀第一寄生輻射圖案262形成之原因係為了增加寄生元件260之長度，而開口264形成於第一寄生輻射圖案262之原因係為了藉由開口264促使因第一寄生輻射圖案262及第一天線240之間引起之耦合而產生之電流交換。In one embodiment, the parasitic element 260 may include a first parasitic radiation pattern 262 having a loop shape. In this case, an opening 264 is formed in the loop-shaped first parasitic radiation pattern 262. In the present invention, the reason why the parasitic element 260 is formed in the loop-shaped first parasitic radiation pattern 262 is to increase the length of the parasitic element 260, and the reason why the opening 264 is formed in the first parasitic radiation pattern 262 is to cause the cause by the opening 264 The coupling between the first parasitic radiation pattern 262 and the first antenna 240 results in current exchange.

根據上述實施例，迴路狀第一寄生輻射圖案262可具有N個側(其中N為正整數)。詳細來說，第一寄生輻射圖案262可包含面對無線通訊積體電路220形成之一第一側N1、於主圖案312相對於第一側N1之方向中面對第一側N1形成之一第二側N2、將第一側N1之一端連接至第二側N2之一端之一第三側N3、以及將第一側N1之另一端連接至第二側N2之另一端之一第四側N4。如此一來，開口264大約形成於N個側中面對主圖案312之第二側N2之中心位置。According to the above embodiment, the loop-shaped first parasitic radiation pattern 262 may have N sides (where N is a positive integer). In detail, the first parasitic radiation pattern 262 may include a first side N1 formed facing the wireless communication integrated circuit 220 and a first side N1 formed facing the first side N1 in the direction of the main pattern 312 relative to the first side N1 A second side N2, a third side N3 connecting one end of the first side N1 to one end of the second side N2, and a fourth side connecting the other end of the first side N1 to the other end of the second side N2 N4. In this way, the opening 264 is formed approximately at the center of the second side N2 facing the main pattern 312 among the N sides.

於此情況下，如圖7B所示，第一寄生輻射圖案262可形成於主機板710上以使分支單元332與N側中之第一側N1之間的距離W1大於為第一寄生輻射圖案262內部寬度之第一側N1及第二側N2之間的距離W2。In this case, as shown in FIG. 7B, the first parasitic radiation pattern 262 may be formed on the main board 710 so that the distance W1 between the branch unit 332 and the first side N1 of the N side is greater than the first parasitic radiation pattern The distance W2 between the first side N1 and the second side N2 of the inner width of 262.

如圖7D所示，於另一實施例中第一寄生輻射圖案262可形成於主機板710上以使分支單元332與N側中之第一側N1之間的一距離W1小於為第一寄生輻射圖案262內部寬度之第一側N1及第二側N2之間的一距離W2。As shown in FIG. 7D, in another embodiment, the first parasitic radiation pattern 262 may be formed on the main board 710 so that a distance W1 between the branch unit 332 and the first side N1 of the N side is smaller than the first parasitic radiation pattern. A distance W2 between the first side N1 and the second side N2 of the inner width of the radiation pattern 262.

為了匹配頻率，可藉由調整上述距離W1、W2而調整天線之長度及阻抗。In order to match the frequency, the length and impedance of the antenna can be adjusted by adjusting the distances W1 and W2.

同時，於圖7B及圖7D中，寄生元件260僅包含形成有開口264之第一寄生輻射圖案262。然而，於修改之範例中，如圖7C及圖7E所示，寄生元件260可更包含一第二寄生輻射圖案266以及一第三寄生輻射圖案268。Meanwhile, in FIGS. 7B and 7D, the parasitic element 260 only includes the first parasitic radiation pattern 262 with the opening 264 formed thereon. However, in the modified example, as shown in FIGS. 7C and 7E, the parasitic element 260 may further include a second parasitic radiation pattern 266 and a third parasitic radiation pattern 268.

第二寄生輻射圖案266沿第二方向D2自第一寄生輻射圖案262之一端延伸，且連接於第一天線240之主圖案312。於一實施例中，當第一寄生輻射圖案262具有N個側，第二寄生輻射圖案266沿第二方向D2自構成第一寄生輻射圖案262之N個側中之第二側N2之開口264之一側延伸，且連接於主圖案312。The second parasitic radiation pattern 266 extends from one end of the first parasitic radiation pattern 262 along the second direction D2 and is connected to the main pattern 312 of the first antenna 240. In one embodiment, when the first parasitic radiation pattern 262 has N sides, the second parasitic radiation pattern 266 forms the opening 264 of the second side N2 of the N sides of the first parasitic radiation pattern 262 along the second direction D2. One side extends and is connected to the main pattern 312.

第三寄生輻射圖案268沿第二方向D2自第一寄生輻射圖案262之另一端延伸，且連接於第一天線240之主圖案312。於一實施例中，當第一寄生輻射圖案262具有N個側，第三寄生輻射圖案268沿第二方向D2自構成第一寄生輻射圖案262之N個側中之第二側N2之開口264之另一側延伸，且連接於主圖案312。The third parasitic radiation pattern 268 extends from the other end of the first parasitic radiation pattern 262 along the second direction D2 and is connected to the main pattern 312 of the first antenna 240. In one embodiment, when the first parasitic radiation pattern 262 has N sides, the third parasitic radiation pattern 268 forms the opening 264 of the second side N2 of the N sides of the first parasitic radiation pattern 262 along the second direction D2. The other side extends and is connected to the main pattern 312.

然而，如圖7B至圖7E所示，於第三實施例及第三實施例之修改範例中，連接元件250之第一終端252電性連接第一天線240及第二天線280，而連接元件250之第二終端254懸空。然而，如圖11所示，根據第四實施例之一天線塊230可更包含用於使一連接元件250接地之一第二接地單元340，以利用以總成元件實施之連接元件250改變天線塊230之共振頻率。However, as shown in FIGS. 7B to 7E, in the third embodiment and the modified examples of the third embodiment, the first terminal 252 of the connecting element 250 is electrically connected to the first antenna 240 and the second antenna 280, and The second terminal 254 of the connecting element 250 is suspended. However, as shown in FIG. 11, the antenna block 230 according to the fourth embodiment may further include a second grounding unit 340 for grounding a connecting element 250, so that the connecting element 250 implemented as an assembly element can be used to change the antenna. Resonance frequency of block 230.

於圖11中，雖然為了說明方便而使一寄生元件260之形狀與圖7B中寄生元件260之形狀相同，但是包含如圖7C至圖7E所示形狀之寄生元件之電子裝置700也可包含第二接地單元340。In FIG. 11, although the shape of a parasitic element 260 is the same as that of the parasitic element 260 in FIG. 7B for the convenience of description, the electronic device 700 including the parasitic element in the shape shown in FIGS. 7C to 7E may also include the first Two grounding unit 340.

以下，僅描述對於第三實施例及第三實施例之修改範例為額外元件之第二接地單元340。Hereinafter, only the second ground unit 340 of the third embodiment and the modified example of the third embodiment is described as an additional element.

第二接地單元340電性連接連接元件250至位於無線通訊積體電路220中之一接地單元(未繪示)以使連接元件250接地。第二接地單元340沿第二方向D2自連接元件250之第二終端254延伸，且電性連接至無線通訊積體電路220中之接地單元。The second ground unit 340 electrically connects the connection element 250 to a ground unit (not shown) in the wireless communication integrated circuit 220 to ground the connection element 250. The second ground unit 340 extends from the second terminal 254 of the connection element 250 along the second direction D2 and is electrically connected to the ground unit in the wireless communication integrated circuit 220.

如上所述，根據本發明第四實施例，連接元件250可為包含一電感、一電容及一電組至少其中一者之總成元件。連接元件250之一第一終端252連接於一第一天線240及一第二天線280，而連接元件250之第二終端254藉由第二接地單元340接地，而可藉由改變構成連接元件250之電路元件之數值而改變天線塊230之共振頻率。因此，天線塊230無需具有額外元件或改變構造便可使用於各種應用層面。As described above, according to the fourth embodiment of the present invention, the connecting element 250 may be an assembly element including at least one of an inductor, a capacitor, and an electrical group. A first terminal 252 of the connecting element 250 is connected to a first antenna 240 and a second antenna 280, and the second terminal 254 of the connecting element 250 is grounded by the second ground unit 340, and the connection can be formed by changing The value of the circuit element of the element 250 changes the resonance frequency of the antenna block 230. Therefore, the antenna block 230 can be used in various application levels without requiring additional components or changing the structure.

以下，將參照圖12簡短說明根據本發明之一種製造無線通訊晶片之方法。Hereinafter, a method of manufacturing a wireless communication chip according to the present invention will be briefly described with reference to FIG. 12.

圖12為根據本發明上述第一及第二實施例之無線通訊晶片之製造方法之流程圖。FIG. 12 is a flowchart of the manufacturing method of the wireless communication chip according to the first and second embodiments of the present invention.

首先，如圖12所示，將構成一無線通訊積體電路220之一電路佈局及電性連接該電路佈局之一基頻晶片/射頻晶片222安裝於一基板210之一第一安裝區域212上(S1200)。First, as shown in FIG. 12, a baseband chip/RF chip 222 that constitutes a circuit layout of a wireless communication integrated circuit 220 and is electrically connected to the circuit layout is mounted on a first mounting area 212 of a substrate 210 (S1200).

接著，將一第一天線240、一連接元件250以及一寄生元件260形成於基板210之一第二安裝區域214上(S1210)。如上述圖2A至圖3所述，第一天線240包含一輻射圖案310、一饋入接腳320及一第一接地單元330。此外，如圖6所示，第一天線240可更包含用以使連接元件250接地之一第二接地單元340。輻射圖案310包含一主圖案312、一第一連接圖案314以及一第二連接圖案316。因為輻射圖案310、饋入接腳320、第一接地單元330及第二接地單元340已參照有關於上述圖2A至圖2E、圖3及圖6之部分詳細描述，因此其說明將被省略。Next, a first antenna 240, a connecting element 250, and a parasitic element 260 are formed on a second mounting area 214 of the substrate 210 (S1210). As described in FIGS. 2A to 3, the first antenna 240 includes a radiation pattern 310, a feeding pin 320 and a first ground unit 330. In addition, as shown in FIG. 6, the first antenna 240 may further include a second ground unit 340 for grounding the connecting element 250. The radiation pattern 310 includes a main pattern 312, a first connection pattern 314, and a second connection pattern 316. Since the radiation pattern 310, the feeding pin 320, the first ground unit 330, and the second ground unit 340 have already been described in detail with reference to the above-mentioned parts of FIGS. 2A to 2E, 3, and 6, their description will be omitted.

連接元件250形成於基板210以沿一第二方向D2自第一天線240之第二連接圖案316延伸。於一實施例中，連接元件250可作為總成元件。根據如此實施例，第一天線240連接於連接元件250之一第一終端252，而連接元件250之一第二終端254懸空或藉由第二接地單元340接地。The connection element 250 is formed on the substrate 210 to extend from the second connection pattern 316 of the first antenna 240 along a second direction D2. In one embodiment, the connecting element 250 can be used as an assembly element. According to this embodiment, the first antenna 240 is connected to the first terminal 252 of the connecting element 250, and the second terminal 254 of the connecting element 250 is suspended or grounded by the second grounding unit 340.

寄生元件260形成於基板210之第二安裝區域214上以與第一天線240以預定距離相間隔。寄生元件260引起與第一天線240之耦合，而可產生如同延長第一天線240之長度之效果。寄生元件260可包含迴路狀之第一寄生輻射圖案262，且可更包含一第二寄生輻射圖案266及一第三寄生輻射圖案268(如圖2A至圖2E及圖6所示)。由於第一寄生輻射圖案262、第二寄生輻射圖案266及第三寄生輻射圖案268以參照有關於上述圖2A至圖2E之部分詳細描述，其描述將被省略。The parasitic element 260 is formed on the second mounting area 214 of the substrate 210 to be spaced apart from the first antenna 240 by a predetermined distance. The parasitic element 260 causes coupling with the first antenna 240, and can produce an effect like extending the length of the first antenna 240. The parasitic element 260 may include a loop-shaped first parasitic radiation pattern 262, and may further include a second parasitic radiation pattern 266 and a third parasitic radiation pattern 268 (as shown in FIGS. 2A to 2E and FIG. 6). Since the first parasitic radiation pattern 262, the second parasitic radiation pattern 266, and the third parasitic radiation pattern 268 are described in detail with reference to the above-mentioned parts of FIGS. 2A to 2E, the description thereof will be omitted.

接著，將絕緣層224、270形成於基板210之整個表面上(S1220)。換言之，絕緣層224、270整個形成於基板210之第一安裝區域212及第二安裝區域214上。構成無線通訊積體電路220之電路佈局、電性連接電路佈局之基頻晶片/射頻晶片222、第一天線240、連接元件250及寄生元件260皆由絕緣層224、270覆蓋。Next, the insulating layers 224 and 270 are formed on the entire surface of the substrate 210 (S1220). In other words, the insulating layers 224 and 270 are entirely formed on the first mounting area 212 and the second mounting area 214 of the substrate 210. The circuit layout of the wireless communication integrated circuit 220, the baseband chip/RF chip 222, the first antenna 240, the connection element 250, and the parasitic element 260 of the electrical connection circuit layout are all covered by the insulating layers 224 and 270.

於一實施例中，絕緣層224、270可利用分配器(dispenser)由沉積環氧樹脂或如陶瓷具有高介電常數之材料形成於基板210上。In one embodiment, the insulating layers 224 and 270 may be formed on the substrate 210 by depositing epoxy resin or a material with a high dielectric constant such as ceramic using a dispenser.

於上述實施例中，絕緣層224、270為同時形成於基板210之第一安裝區域212及第二安裝區域214上。然而，於修改範例中，絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成，然後絕緣層270可藉由沉積絕緣材料於第二安裝區域214而形成。In the above embodiment, the insulating layers 224 and 270 are formed on the first mounting area 212 and the second mounting area 214 of the substrate 210 at the same time. However, in the modified example, the insulating layer 224 may be formed by depositing an insulating material on the first mounting area 212, and then the insulating layer 270 may be formed by depositing an insulating material on the second mounting area 214.

於另一實施例中，絕緣層270可藉由沉積絕緣材料於第二安裝區域214上而形成，然後絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成。In another embodiment, the insulating layer 270 may be formed by depositing an insulating material on the second mounting area 214, and then the insulating layer 224 may be formed by depositing an insulating material on the first mounting area 212.

於再另一實施例中，步驟S1200可執行完後，絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成。接著，第一天線240、連接元件250及寄生元件260可藉由執行步驟S1210而形成，然後絕緣層270可藉由沉積絕緣材料於第二安裝區域214而形成。In still another embodiment, after step S1200 is performed, the insulating layer 224 may be formed by depositing an insulating material on the first mounting area 212. Next, the first antenna 240, the connecting element 250, and the parasitic element 260 can be formed by performing step S1210, and then the insulating layer 270 can be formed by depositing an insulating material on the second mounting area 214.

於更另一實施例中，第一天線240、連接元件250及寄生元件260可藉由執行步驟S1210而形成，然後絕緣層270可藉由沉積絕緣材料於第二安裝區域214而形成。接著，構成無線通訊積體電路220之電路佈局以及電性連接電路佈局之基頻晶片/射頻晶片222可藉由執行步驟S1200安裝於第一安裝區域212上，然後絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成。In still another embodiment, the first antenna 240, the connecting element 250 and the parasitic element 260 can be formed by performing step S1210, and then the insulating layer 270 can be formed by depositing an insulating material on the second mounting area 214. Next, the baseband chip/RF chip 222 that constitutes the circuit layout of the wireless communication integrated circuit 220 and the electrical connection circuit layout can be mounted on the first mounting area 212 by performing step S1200, and then the insulating layer 224 can be insulated by deposition The material is formed on the first installation area 212.

接著，將一第二天線280形成於絕緣層270上(S1230)。於一實施例中，第二天線280形成於絕緣層270上以沿一第一方向D1延伸。於此情況下，第二天線280之第一表面接觸絕緣層270，且第二天線280相對第一表面之第二表面暴露於無線通訊晶片200外。也就是說，於本發明中，天線塊230之第二天線280設置於最外側的部分並暴露於外。Next, a second antenna 280 is formed on the insulating layer 270 (S1230). In one embodiment, the second antenna 280 is formed on the insulating layer 270 to extend along a first direction D1. In this case, the first surface of the second antenna 280 contacts the insulating layer 270, and the second surface of the second antenna 280 opposite to the first surface is exposed outside the wireless communication chip 200. That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed at the outermost part and exposed to the outside.

接著，將第二天線280及第一天線240電性連接(S1240)。於此情況下，第二天線280及基板210之間的距離可介於0.2 λ至0.3 λ。Next, the second antenna 280 and the first antenna 240 are electrically connected (S1240). In this case, the distance between the second antenna 280 and the substrate 210 may be between 0.2 λ and 0.3 λ.

於一實施例中，當連接元件250之高度低於絕緣層270之高度，第二天線280可通過絕緣層270而可藉由壓靠一部份之第二天線280而形成一壓縮槽282，進而連接至連接元件250。根據如此實施例，第二天線280之壓縮槽282連接於連接元件250之第一終端252之頂面。In one embodiment, when the height of the connecting element 250 is lower than the height of the insulating layer 270, the second antenna 280 can pass through the insulating layer 270 and a compression groove can be formed by pressing a portion of the second antenna 280 282, and then connected to the connecting element 250. According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the top surface of the first terminal 252 of the connecting element 250.

如上所述，第二天線280電性連接於第一天線240，而能產生如同以第二天線280之長度延伸第一天線240之長度的效果。於上述實施例中，因為連接元件250之高度低於絕緣層270之高度，壓縮槽282形成於第二天線280中以將第二天線280連接至連接元件250。然而，於另一實施例中，當連接元件250之第一終端252之頂面因連接元件250之高度大於或等於絕緣層270之高度而暴露於外時，第二天線280無需壓縮槽282便可直接連接至連接元件250之第一終端252之頂面。As described above, the second antenna 280 is electrically connected to the first antenna 240, and can produce the effect of extending the length of the first antenna 240 by the length of the second antenna 280. In the above embodiment, because the height of the connecting element 250 is lower than the height of the insulating layer 270, the compression groove 282 is formed in the second antenna 280 to connect the second antenna 280 to the connecting element 250. However, in another embodiment, when the top surface of the first terminal 252 of the connecting element 250 is exposed because the height of the connecting element 250 is greater than or equal to the height of the insulating layer 270, the second antenna 280 does not need to compress the groove 282 It can be directly connected to the top surface of the first terminal 252 of the connecting element 250.

以下，將參照圖13說明根據本發明第三及第四實施例之包含無線通訊晶片之電子裝置之製造方法。於圖13中，將僅詳細描述製造電子裝置之過程中，製造無線通訊晶片之方法及安裝無線通訊晶片於主機板上之方法。Hereinafter, referring to FIG. 13, a method of manufacturing an electronic device including a wireless communication chip according to the third and fourth embodiments of the present invention will be described. In FIG. 13, only the method of manufacturing the wireless communication chip and the method of mounting the wireless communication chip on the motherboard will be described in detail in the process of manufacturing the electronic device.

首先，如圖13所示，將構成一無線通訊積體電路220之一電路佈局及電性連接該電路佈局之一基頻晶片/射頻晶片222安裝於一次基板210之一第一安裝區域212上(S1300)。First, as shown in FIG. 13, a circuit layout of a wireless communication integrated circuit 220 and a baseband chip/RF chip 222 that is electrically connected to the circuit layout are mounted on a first mounting area 212 of a primary substrate 210 (S1300).

接著，將一連接元件250形成於次基板210之第二安裝區域214上(S1310)。連接元件250可作為總成元件。於一實施例中，連接元件250之一第二終端254可藉由第二接地單元340電性連接至無線通訊積體電路220中之一接地單元。Next, a connecting element 250 is formed on the second mounting area 214 of the sub-substrate 210 (S1310). The connecting element 250 can be used as an assembly element. In one embodiment, the second terminal 254 of the connecting element 250 may be electrically connected to a grounding unit of the wireless communication integrated circuit 220 through the second grounding unit 340.

接著，將絕緣層224、270形成於次基板210之整個表面上(S1320)。也就是說，絕緣層224、270整個形成於次基板210之第一安裝區域212及第二安裝區域214上。構成無線通訊積體電路220之電路佈局、電性連接電路佈局之基頻晶片/射頻晶片222及連接元件250皆由絕緣層224、270覆蓋。Next, insulating layers 224 and 270 are formed on the entire surface of the sub-substrate 210 (S1320). In other words, the insulating layers 224 and 270 are entirely formed on the first mounting area 212 and the second mounting area 214 of the secondary substrate 210. The circuit layout of the wireless communication integrated circuit 220, the baseband chip/RF chip 222 and the connection element 250 of the electrical connection circuit layout are all covered by insulating layers 224 and 270.

於一實施例中，絕緣層224、270可利用分配器(dispenser)由沉積環氧樹脂或例如陶瓷等具有高介電常數之材料而形成於次基板210上。In one embodiment, the insulating layers 224 and 270 may be formed on the sub-substrate 210 by depositing epoxy resin or materials with high dielectric constant such as ceramics using a dispenser.

於上述實施例中，絕緣層224、270描述為同時形成於次基板210之第一安裝區域212及第二安裝區域214上。然而，於修改範例中，絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成，然後絕緣層270可藉由沉積絕緣材料於第二安裝區域214而形成。In the above embodiment, the insulating layers 224 and 270 are described as being formed on the first mounting area 212 and the second mounting area 214 of the sub-substrate 210 at the same time. However, in the modified example, the insulating layer 224 may be formed by depositing an insulating material on the first mounting area 212, and then the insulating layer 270 may be formed by depositing an insulating material on the second mounting area 214.

於另一實施例中，絕緣層270可藉由沉積絕緣材料於第二安裝區域214上而形成，然後絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成。In another embodiment, the insulating layer 270 may be formed by depositing an insulating material on the second mounting area 214, and then the insulating layer 224 may be formed by depositing an insulating material on the first mounting area 212.

於再另一實施例中，步驟S1300可執行完後，絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成。接著，連接元件250可藉由執行步驟S1310而形成，然後絕緣層270可藉由沉積絕緣材料於第二安裝區域214而形成。In still another embodiment, after step S1300 is performed, the insulating layer 224 may be formed by depositing an insulating material on the first mounting area 212. Next, the connection element 250 can be formed by performing step S1310, and then the insulating layer 270 can be formed by depositing an insulating material on the second mounting area 214.

於更另一實施例中，連接元件250可藉由執行步驟S1310而形成，然後絕緣層270可藉由沉積絕緣材料於第二安裝區域214而形成。接著，構成無線通訊積體電路220之電路佈局以及電性連接電路佈局之基頻晶片/射頻晶片222可藉由執行步驟S1300安裝於第一安裝區域212上，然後絕緣層224可藉由沉積絕緣材料於第一安裝區域212上而形成。In still another embodiment, the connecting element 250 can be formed by performing step S1310, and then the insulating layer 270 can be formed by depositing an insulating material on the second mounting area 214. Next, the baseband chip/RF chip 222 that constitutes the circuit layout of the wireless communication integrated circuit 220 and the electrical connection circuit layout can be mounted on the first mounting area 212 by performing step S1300, and then the insulating layer 224 can be insulated by deposition The material is formed on the first installation area 212.

接著，將一第二天線280形成於絕緣層270上(S1330)。於一實施例中，第二天線280形成於絕緣層270上以沿一第一方向D1延伸。於此情況下，第二天線280之第一表面接觸絕緣層270，且第二天線280相對第一表面之第二表面暴露於無線通訊晶片200外。也就是說，於本發明中，天線塊230之第二天線280設置於最外側的部分並暴露於外。Next, a second antenna 280 is formed on the insulating layer 270 (S1330). In one embodiment, the second antenna 280 is formed on the insulating layer 270 to extend along a first direction D1. In this case, the first surface of the second antenna 280 contacts the insulating layer 270, and the second surface of the second antenna 280 opposite to the first surface is exposed outside the wireless communication chip 200. That is, in the present invention, the second antenna 280 of the antenna block 230 is disposed at the outermost part and exposed to the outside.

接著，將一第二天線280及第一天線240電性連接(S1340)。如此一來，便完成無線通訊晶片720。於此情況下，第二天線280及基板210之間的距離可介於0.2 λ至0.3 λ之間。Then, a second antenna 280 and the first antenna 240 are electrically connected (S1340). In this way, the wireless communication chip 720 is completed. In this case, the distance between the second antenna 280 and the substrate 210 may be between 0.2 λ and 0.3 λ.

於一實施例中，當連接元件250之高度低於絕緣層270之高度，第二天線280可通過絕緣層270而可藉由壓靠一部份之第二天線280而形成壓縮槽282，進而連接至連接元件250。根據如此實施例，第二天線280之壓縮槽282連接於連接元件250之第一終端252之頂面。In one embodiment, when the height of the connecting element 250 is lower than the height of the insulating layer 270, the second antenna 280 can pass through the insulating layer 270 and a compression groove 282 can be formed by pressing a portion of the second antenna 280 , And then connected to the connecting element 250. According to this embodiment, the compression groove 282 of the second antenna 280 is connected to the top surface of the first terminal 252 of the connecting element 250.

於上述實施例中，因為連接元件250之高度低於絕緣層270之高度，壓縮槽282形成於第二天線280中以將第二天線280連接至連接元件250。然而，於另一實施例中，當連接元件250之第一終端252之頂面因連接元件250之高度大於或等於絕緣層270之高度而暴露於外時，第二天線280無需壓縮槽282便可直接連接至連接元件250之第一終端252之頂面。In the above embodiment, because the height of the connecting element 250 is lower than the height of the insulating layer 270, the compression groove 282 is formed in the second antenna 280 to connect the second antenna 280 to the connecting element 250. However, in another embodiment, when the top surface of the first terminal 252 of the connecting element 250 is exposed because the height of the connecting element 250 is greater than or equal to the height of the insulating layer 270, the second antenna 280 does not need to compress the groove 282 It can be directly connected to the top surface of the first terminal 252 of the connecting element 250.

接著，將一第一穿孔810及一第二穿孔820形成於次基板210之第二安裝區域214上(S1350)。第一穿孔810用於電性連接形成於一主機板710上之一第一天線240以及無線通訊積體電路220，而第二穿孔820用於電性連接第一天線240及連接元件250。Next, a first through hole 810 and a second through hole 820 are formed on the second mounting area 214 of the sub-substrate 210 (S1350). The first through hole 810 is used to electrically connect a first antenna 240 formed on a motherboard 710 and the wireless communication integrated circuit 220, and the second through hole 820 is used to electrically connect the first antenna 240 and the connecting element 250 .

接著，將無線通訊晶片720安裝於主機板710上第一天線240及一寄生元件260所形成之位置而使無線通訊晶片720電性連接於第一天線240(S1360)。因為第一天線240及寄生元件260形成於主機板710上之構造已經參照圖7A至圖7E及圖11於上方說明，其詳細說明將於此忽略。Then, the wireless communication chip 720 is mounted on the main board 710 at the position formed by the first antenna 240 and a parasitic element 260 to electrically connect the wireless communication chip 720 to the first antenna 240 (S1360). Since the structure of the first antenna 240 and the parasitic element 260 formed on the motherboard 710 has been described above with reference to FIGS. 7A to 7E and FIG. 11, the detailed description will be omitted here.

於此情況下，當無線通訊晶片720安裝於主機板710上，第一天線240之饋入接腳320藉由填滿一第一導體812於第一穿孔810中而電性連接於無線通訊積體電路220，且第一天線240藉由填滿一第二導體822於第二穿孔820中而電性連接於連接元件250之第一終端252之一底端。如上所述，第一天線240藉由第二穿孔820電性連接於連接元件250，且連接元件250電性連接於第二天線280，因此第一天線240及第二天線280彼此電性連接而產生如同以第二天線280之長度延伸第一天線240之長度之效果。In this case, when the wireless communication chip 720 is mounted on the motherboard 710, the feeding pin 320 of the first antenna 240 is electrically connected to the wireless communication by filling a first conductor 812 in the first through hole 810 The integrated circuit 220 and the first antenna 240 are electrically connected to a bottom end of the first terminal 252 of the connecting element 250 by filling a second conductor 822 in the second through hole 820. As described above, the first antenna 240 is electrically connected to the connecting element 250 through the second through hole 820, and the connecting element 250 is electrically connected to the second antenna 280, so the first antenna 240 and the second antenna 280 are mutually connected. The electrical connection produces the effect of extending the length of the first antenna 240 by the length of the second antenna 280.

然而，雖然未繪示於圖13中，於上述步驟S1300至S1360中，無線通訊晶片之製造方法可更包含一形成第一天線240及寄生元件260於主機板710上之步驟。However, although not shown in FIG. 13, in the above steps S1300 to S1360, the method for manufacturing the wireless communication chip may further include a step of forming the first antenna 240 and the parasitic element 260 on the motherboard 710.

可以理解的是，在不改變本發明之技術範圍及必要特徵的前題下，熟悉此技藝者可以其他具體的形式實施本發明。It can be understood that those skilled in the art can implement the present invention in other specific forms without changing the technical scope and essential features of the present invention.

因此，上述實施例僅用於描述而不是用於限制本發明。本發明之範圍並不由上述之詳細說明定義而是由申請專利範圍定義，並包含所有根據申請專利範圍之意義、範圍及相等用語所推導出之修改及改變。Therefore, the above-mentioned embodiments are only used for description and not for limiting the present invention. The scope of the present invention is not defined by the above detailed description but by the scope of the patent application, and includes all modifications and changes derived from the meaning, scope and equivalent terms of the scope of the patent application.

100‧‧‧電子裝置110‧‧‧底基板120‧‧‧無線通訊晶片130‧‧‧天線140‧‧‧無線射頻線纜200‧‧‧無線通訊晶片210‧‧‧基板、次基板212‧‧‧第一安裝區域214‧‧‧第二安裝區域220‧‧‧無線通訊積體電路222‧‧‧基頻晶片/射頻晶片224‧‧‧絕緣層230‧‧‧天線塊240‧‧‧第一天線250‧‧‧連接元件252‧‧‧第一終端254‧‧‧第二終端260‧‧‧寄生元件262‧‧‧第一寄生輻射圖案264‧‧‧開口266‧‧‧第二寄生輻射圖案268‧‧‧第三寄生輻射圖案270‧‧‧絕緣層280‧‧‧第二天線282‧‧‧壓縮槽310‧‧‧輻射圖案312‧‧‧主圖案314‧‧‧第一連接圖案316‧‧‧第二連接圖案320‧‧‧饋入接腳322‧‧‧次饋入接腳330‧‧‧第一接地單元332‧‧‧分支單元334‧‧‧接地接腳340‧‧‧第二接地單元610、620‧‧‧情況700‧‧‧電子裝置710‧‧‧主機板、第一基板720‧‧‧無線通訊晶片810‧‧‧第一穿孔812‧‧‧第一導體820‧‧‧第二穿孔822‧‧‧第二導體D1‧‧‧第一方向D2‧‧‧第二方向a、c‧‧‧第一側b‧‧‧第二側a-c‧‧‧第一側N1‧‧‧第一側N2‧‧‧第二側N3‧‧‧第三側N4‧‧‧第四側W1、W2‧‧‧距離S1200、S1210、S1220、S1230、S1240、S1300、S1310、S1320、S1330、S1340、S1350、S1360‧‧‧步驟100‧‧‧Electronic device 110‧‧‧Base substrate 120‧‧‧Wireless communication chip 130‧‧‧Antenna 140‧‧‧Wireless RF cable 200‧‧‧Wireless communication chip 210‧‧‧Substrate, Sub-substrate 212‧‧ ‧First installation area 214‧‧‧Second installation area 220‧‧‧Wireless communication integrated circuit 222‧‧‧Baseband chip/RF chip 224‧‧‧Insulation layer 230‧‧‧Antenna block 240‧‧‧First Antenna 250‧‧‧Connecting element 252‧‧‧First terminal 254‧‧‧Second terminal 260‧‧‧ Parasitic element 262‧‧‧First parasitic radiation pattern 264‧‧‧ Opening 266‧‧‧Second parasitic radiation Pattern 268‧‧‧Third parasitic radiation pattern 270‧‧‧Insulation layer 280‧‧‧Second antenna 282‧‧‧Compression groove 310‧‧‧Radiation pattern 312‧‧‧Main pattern 314‧‧‧First connection pattern 316‧‧‧Second connection pattern 320‧‧‧Feeding pin 322‧‧‧Sub-feeding pin 330‧‧‧First grounding unit 332‧‧‧Branch unit 334‧‧‧Grounding pin 340‧‧‧ Second grounding unit 610, 620‧‧‧ situation 700‧‧‧ electronic device 710‧‧‧ motherboard, first substrate 720‧‧‧ wireless communication chip 810‧‧‧ first through hole 812‧‧‧ first conductor 820‧ ‧‧Second perforation 822‧‧‧Second conductor D1‧‧‧First direction D2‧‧‧Second direction a, c‧‧‧First side b‧‧‧Second side ac‧‧‧First side N1 ‧‧‧First side N2‧‧‧Second side N3‧‧‧Third side N4‧‧‧Fourth side W1, W2‧‧‧Distance S1200, S1210, S1220, S1230, S1240, S1300, S1310, S1320, S1330, S1340, S1350, S1360‧‧‧Step

圖1為將無線通訊晶片及天線分離安裝之一般電子裝置之構造之示意圖。 圖2A根據本發明第一實施例之無線通訊晶片之部分立體圖。 圖2B為根據本發明第一實施例之無線通訊晶片之部分立體分解圖。 圖2C至圖2E為根據第一實施例之修改範例之無線通訊晶片之部分立體分解圖。 圖3為根據本發明第一實施例之無線通訊晶片之側視圖。 圖4繪示基板上之第一安裝區域及第二安裝區域之尺寸之範例。 圖5為比較包含有寄生元件之天線塊之效率以及無包含寄生元件之天線塊之效率的圖表。 圖6根據本發明第二實施例之無線通訊晶片之部分立體分解圖。 圖7A為根據本發明第三實施例之包含無線通訊晶片之電子裝置之部分立體圖。 圖7B為根據本發明第三實施例之包含無線通訊晶片之電子裝置之部分立體分解圖。 圖7C至圖7E為根據第三實施例之修改範例包含無線通訊晶片之電子裝置之部分立體分解圖。 圖8為根據本發明第三實施例之包含無線通訊晶片之電子裝置之側視圖。 圖9A及圖9B繪示根據本發明之無線通訊晶片安裝於底基板一側之中心，及此狀況之輻射圖案。 圖10A及圖10B繪示根據本發明之無線通訊晶片安裝於底基板之中心，及此狀況之輻射圖案。 圖11為根據本發明第四實施例之包含無線通訊晶片之電子裝置之部分立體***圖。 圖12為根據本發明第一及第二實施例之無線通訊晶片之製造方法之流程圖。 圖13為根據本發明第三及第四實施例之無線通訊晶片之製造方法之流程圖。Figure 1 is a schematic diagram of the structure of a general electronic device with a wireless communication chip and an antenna mounted separately. Fig. 2A is a partial perspective view of the wireless communication chip according to the first embodiment of the present invention. 2B is a partially exploded perspective view of the wireless communication chip according to the first embodiment of the present invention. 2C to 2E are partial three-dimensional exploded views of a wireless communication chip according to a modified example of the first embodiment. 3 is a side view of the wireless communication chip according to the first embodiment of the invention. FIG. 4 shows an example of the size of the first mounting area and the second mounting area on the substrate. FIG. 5 is a graph comparing the efficiency of an antenna block containing parasitic elements and the efficiency of an antenna block not containing parasitic elements. Fig. 6 is a partially exploded perspective view of a wireless communication chip according to a second embodiment of the present invention. FIG. 7A is a partial perspective view of an electronic device including a wireless communication chip according to a third embodiment of the present invention. 7B is a partially exploded perspective view of an electronic device including a wireless communication chip according to the third embodiment of the present invention. 7C to 7E are partial perspective exploded views of an electronic device including a wireless communication chip according to a modified example of the third embodiment. 8 is a side view of an electronic device including a wireless communication chip according to a third embodiment of the invention. 9A and 9B show the wireless communication chip according to the present invention mounted on the center of one side of the base substrate, and the radiation pattern in this situation. 10A and 10B show the wireless communication chip according to the present invention mounted in the center of the base substrate, and the radiation pattern in this situation. 11 is a partial three-dimensional exploded view of an electronic device including a wireless communication chip according to a fourth embodiment of the present invention. FIG. 12 is a flowchart of a method of manufacturing a wireless communication chip according to the first and second embodiments of the present invention. FIG. 13 is a flowchart of a method of manufacturing a wireless communication chip according to the third and fourth embodiments of the present invention.

200‧‧‧無線通訊晶片 200‧‧‧Wireless communication chip

210‧‧‧基板 210‧‧‧Substrate

220‧‧‧無線通訊積體電路 220‧‧‧Wireless communication integrated circuit

230‧‧‧天線塊 230‧‧‧antenna block

Claims (32)

一種無線通訊晶片，具有一嵌入式天線，該無線通訊晶片包含：一基板，包含一第一安裝區域以及一第二安裝區域；一無線通訊積體電路，安裝於該第一安裝區域；以及一天線塊，安裝於該第二安裝區域以電性連接於該無線通訊積體電路，其中該天線塊包含一第一天線、一寄生元件、一連接元件、一絕緣層以及一第二天線，該第一天線形成於該基板上，該寄生元件形成於該基板上以與該第一天線相間隔，並用以引起與該第一天線之耦合，該連接元件連接於該第一天線，該絕緣層形成於該第一天線、該寄生元件以及該連接元件上以覆蓋該第一天線、該寄生元件以及該連接元件，該第二天線形成於該絕緣層上且藉由該連接元件電性連接於該第一天線，其中該寄生元件被圖案化並形成在該基板上，並且其中該絕緣層形成為具有使得該第一天線、該連接元件和該寄生元件不暴露於外的一厚度，該寄生元件包含一第一寄生輻射圖案，該第一寄生輻射圖案具有一開口，該第一寄生輻射圖案更具有N個側，N為正整數，且該開口形成於該N個側中面對該第一天線之一側。 A wireless communication chip with an embedded antenna. The wireless communication chip includes: a substrate including a first installation area and a second installation area; a wireless communication integrated circuit installed in the first installation area; and The wire block is installed in the second installation area to be electrically connected to the wireless communication integrated circuit, wherein the antenna block includes a first antenna, a parasitic element, a connecting element, an insulating layer, and a second antenna , The first antenna is formed on the substrate, the parasitic element is formed on the substrate to be spaced apart from the first antenna and used to cause coupling with the first antenna, and the connecting element is connected to the first antenna Antenna, the insulating layer is formed on the first antenna, the parasitic element and the connecting element to cover the first antenna, the parasitic element and the connecting element, the second antenna is formed on the insulating layer and The connection element is electrically connected to the first antenna, wherein the parasitic element is patterned and formed on the substrate, and wherein the insulating layer is formed to have such that the first antenna, the connection element and the parasitic element The element is not exposed to a thickness, the parasitic element includes a first parasitic radiation pattern, the first parasitic radiation pattern has an opening, the first parasitic radiation pattern further has N sides, N is a positive integer, and the opening It is formed on a side facing the first antenna among the N sides. 如申請專利範圍第1項所述之無線通訊晶片，其中該第一寄生輻射圖案具有迴路外型。 According to the wireless communication chip described in claim 1, wherein the first parasitic radiation pattern has a loop shape. 如申請專利範圍第2項所述之無線通訊晶片，其中該寄生元件更包含一第二寄生輻射圖案以及一第三寄生輻射圖案，該第二寄生輻射圖案用以沿該第一天線之一方向自該第一寄生輻射圖案之一端延伸並將該 第一寄生輻射圖案連接至該第一天線，該第三寄生輻射圖案用以沿該第一天線之該方向自該第一輻射圖案之另一端延伸並將該第一寄生輻射圖案連接至該第一天線。 According to the wireless communication chip described in claim 2, wherein the parasitic element further includes a second parasitic radiation pattern and a third parasitic radiation pattern, and the second parasitic radiation pattern is used along one of the first antennas. Direction extends from one end of the first parasitic radiation pattern and extends the The first parasitic radiation pattern is connected to the first antenna, and the third parasitic radiation pattern is used to extend from the other end of the first radiation pattern along the direction of the first antenna and connect the first parasitic radiation pattern to The first antenna. 如申請專利範圍第1項所述之無線通訊晶片，其中該第一天線包含一主圖案、一第一連接圖案、一第二連接圖案、一饋入接腳以及一第一接地單元，該主圖案用以沿一第一方向延伸，該第一連接圖案用以沿不同於該第一方向之一第二方向自該主圖案之一端延伸，該第二連接圖案用以沿該第二方向自該主圖案之另一端延伸，該饋入接腳沿該第二方向自該第一連接圖案延伸且用以提供由該無線通訊積體電路供應之一電源供應訊號給該第一天線，而該第一接地單元用以使該第一天線接地。 According to the wireless communication chip described in claim 1, wherein the first antenna includes a main pattern, a first connection pattern, a second connection pattern, a feeding pin and a first ground unit, the The main pattern is used to extend along a first direction, the first connection pattern is used to extend from one end of the main pattern in a second direction different from the first direction, and the second connection pattern is used to extend along the second direction Extending from the other end of the main pattern, the feeding pin extends from the first connection pattern along the second direction and is used to provide a power supply signal supplied by the wireless communication integrated circuit to the first antenna, The first grounding unit is used to ground the first antenna. 如申請專利範圍第4項所述之無線通訊晶片，其中該第一寄生輻射圖案具有迴路外型，該第一接地單元包含用以自該饋入接腳沿該第一方向分支的一分支單元以及用以自該分支單元一端沿該第二方向延伸的一接地接腳，該分支單元以及該第一寄生輻射圖案之間的一距離大於該第一寄生輻射圖案之一內部寬度。 The wireless communication chip described in claim 4, wherein the first parasitic radiation pattern has a loop shape, and the first ground unit includes a branch unit for branching from the feeding pin in the first direction And a ground pin extending from one end of the branch unit in the second direction, and a distance between the branch unit and the first parasitic radiation pattern is greater than an inner width of the first parasitic radiation pattern. 如申請專利範圍第4項所述之無線通訊晶片，其中該第一寄生輻射圖案具有迴路外型，該第一接地單元包含用以自該饋入接腳沿該第一方向分支的一分支單元以及用以自該分支單元一端沿該第二方向延伸的一接地接腳，該分支單元以及該第一寄生輻射圖案之間的一距離小於該第一寄生輻射圖案之一內部寬度。 The wireless communication chip described in claim 4, wherein the first parasitic radiation pattern has a loop shape, and the first ground unit includes a branch unit for branching from the feeding pin in the first direction And a ground pin for extending from one end of the branch unit in the second direction. A distance between the branch unit and the first parasitic radiation pattern is smaller than an inner width of the first parasitic radiation pattern. 如申請專利範圍第4項所述之無線通訊晶片，其中該寄生元件設置於該基板上由該主圖案、該第一連接圖案以及該第二連接圖案所形 成之一區域中。 The wireless communication chip described in claim 4, wherein the parasitic element is disposed on the substrate and is formed by the main pattern, the first connection pattern, and the second connection pattern Into one area. 如申請專利範圍第4項所述之無線通訊晶片，其中該連接元件連接於該第二連接圖案，且該第一天線更包含用以沿該第二方向自該連接元件延伸且使該連接元件接地之一第二接地單元。 The wireless communication chip according to claim 4, wherein the connecting element is connected to the second connecting pattern, and the first antenna further includes a device for extending from the connecting element in the second direction and connecting the The element is grounded to a second ground unit. 一種嵌入式天線，用於一無線通訊晶片，該嵌入式天線包含：一第一天線，形成於一基板上；一寄生元件，設置於該基板上以與該第一天線相間隔，並用以引起與該第一天線之耦合；一連接元件，連接於該第一天線；一絕緣層，形成於該第一天線、該寄生元件以及該連接元件上以覆蓋該第一天線、該寄生元件以及該連接元件；以及一第二天線，形成於該絕緣層上，且藉由該連接元件電性連接於該第一天線，其中該寄生元件被圖案化並形成在該基板上，並且其中該絕緣層形成為具有使得該第一天線、該連接元件和該寄生元件不暴露於外的一厚度，該寄生元件包含一第一寄生輻射圖案，該第一寄生輻射圖案具有一開口，該第一寄生輻射圖案更具有N個側，N為正整數，且該開口形成於該N個側中面對該第一天線之一側。 An embedded antenna for a wireless communication chip. The embedded antenna includes: a first antenna formed on a substrate; a parasitic element arranged on the substrate to be spaced apart from the first antenna and used To cause coupling with the first antenna; a connecting element connected to the first antenna; an insulating layer formed on the first antenna, the parasitic element, and the connecting element to cover the first antenna , The parasitic element and the connecting element; and a second antenna formed on the insulating layer and electrically connected to the first antenna through the connecting element, wherein the parasitic element is patterned and formed on the On a substrate, and wherein the insulating layer is formed to have a thickness such that the first antenna, the connecting element, and the parasitic element are not exposed to the outside, the parasitic element includes a first parasitic radiation pattern, and the first parasitic radiation pattern There is an opening, the first parasitic radiation pattern further has N sides, where N is a positive integer, and the opening is formed on one side of the N sides facing the first antenna. 如申請專利範圍第9項所述之嵌入式天線，其中該第一寄生輻射圖案具有迴路外型。 According to the embedded antenna described in claim 9, wherein the first parasitic radiation pattern has a loop shape. 如申請專利範圍第10項所述之嵌入式天線，其中該寄生元件更包含一第二寄生輻射圖案以及一第三寄生輻射圖案，該第二寄生輻射 圖案用以沿該第一天線之方向自該第一寄生輻射圖案之一端延伸且將該第一寄生輻射圖案連接至該第一天線，該第三寄生輻射圖案用以沿該第一方向之方向自該第一寄生輻射圖案之另一端延伸且將該第一寄生輻射圖案連接至該第一天線。 The embedded antenna described in claim 10, wherein the parasitic element further includes a second parasitic radiation pattern and a third parasitic radiation pattern, and the second parasitic radiation The pattern is used to extend from one end of the first parasitic radiation pattern along the direction of the first antenna and connect the first parasitic radiation pattern to the first antenna, and the third parasitic radiation pattern is used to be along the first direction The direction extends from the other end of the first parasitic radiation pattern and connects the first parasitic radiation pattern to the first antenna. 如申請專利範圍第9項所述之嵌入式天線，其中該第一天線包含一主圖案、一第一連接圖案、一第二連接圖案、一饋入接腳以及一第一接地單元，該主圖案用以沿一第一方向延伸，該第一連接圖案用以沿不同於該第一方向之一第二方向自該主圖案之一端延伸，該第二連接圖案用以沿該第二方向自該主圖案之另一端延伸，該饋入接腳形成以沿該第二方向自該第一連接圖案延伸且用以提供由該無線通訊積體電路供應之一電源供應訊號給該第一天線，而該第一接地單元用以使該第一天線接地。 The embedded antenna described in claim 9, wherein the first antenna includes a main pattern, a first connection pattern, a second connection pattern, a feeding pin and a first ground unit, the The main pattern is used to extend along a first direction, the first connection pattern is used to extend from one end of the main pattern in a second direction different from the first direction, and the second connection pattern is used to extend along the second direction Extending from the other end of the main pattern, the feeding pin is formed to extend from the first connection pattern along the second direction and used to provide a power supply signal supplied by the wireless communication integrated circuit to the first day Wire, and the first ground unit is used to ground the first antenna. 如申請專利範圍第12項所述之嵌入式天線，其中該第一寄生輻射圖案具有迴路外型，該第一接地單元包含用以自該饋入接腳沿該第一方向分支的一分支單元以及用以自該分支單元一端沿該第二方向延伸的一接地接腳，該分支單元以及該第一寄生輻射圖案之間的距離大於該第一寄生輻射圖案之內部寬度。 The embedded antenna according to claim 12, wherein the first parasitic radiation pattern has a loop shape, and the first ground unit includes a branch unit for branching from the feeding pin in the first direction And a ground pin extending from one end of the branch unit in the second direction, and the distance between the branch unit and the first parasitic radiation pattern is greater than the inner width of the first parasitic radiation pattern. 如申請專利範圍第12項所述之嵌入式天線，其中該第一寄生輻射圖案具有迴路外型，該第一接地單元包含用以自該饋入接腳沿該第一方向分支的一分支單元以及用以自該分支單元一端沿該第二方向延伸的一接地接腳，該分支單元以及該第一寄生輻射圖案之間的距離小於該第一寄生輻射圖案之內部寬度。 The embedded antenna according to claim 12, wherein the first parasitic radiation pattern has a loop shape, and the first ground unit includes a branch unit for branching from the feeding pin in the first direction And a ground pin for extending from one end of the branch unit in the second direction. The distance between the branch unit and the first parasitic radiation pattern is smaller than the inner width of the first parasitic radiation pattern. 如申請專利範圍第12項所述之嵌入式天線，其中該寄生元 件設置於該基板上由該主圖案、該第一連接圖案以及該第二連接圖案所形成之一區域中。 As the embedded antenna described in item 12 of the scope of patent application, the parasitic element The component is arranged on the substrate in an area formed by the main pattern, the first connection pattern and the second connection pattern. 如申請專利範圍第12項所述之嵌入式天線，其中該連接元件連接於該第二連接圖案，且該第一天線更包含用以沿該第二方向自該連接元件延伸且使該連接元件接地之一第二接地單元。 The embedded antenna described in claim 12, wherein the connecting element is connected to the second connecting pattern, and the first antenna further includes a device for extending from the connecting element in the second direction and connecting the The element is grounded to a second ground unit. 一種電子裝置，包含：一第一基板；一第一天線，形成於該第一基板上；一寄生元件，設置於該第一基板上以與該第一天線相間隔，並用以引起與該第一天線之耦合；以及一無線通訊晶片，安裝於該第一基板上且電性連接該第一天線，其中該無線通訊晶片包含一第二基板、一無線通訊積體電路及一天線塊，該第二基板包含一第一安裝區域以及一第二安裝區域，該無線通訊積體電路成型於該第一安裝區域上，該天線塊安裝於該第二安裝區域上以電性連接於該無線通訊積體電路與該第一天線，且該天線塊包含一連接元件、一絕緣層以及一第二天線，該連接元件形成於該第二基板之該第二安裝區域上以電性連接於該第一天線，該絕緣層形成於該連接元件上以覆蓋該連接元件，該第二天線形成於該絕緣層上且藉由該連接元件電性連接於該第一天線，其中該寄生元件被圖案化並形成在該第一基板上，並且其中該絕緣層形成為具有使得該連接元件不暴露於外的一厚度，該寄生元件包含一第一寄生輻射圖案，該第一寄生輻射圖案具有一開口，該 第一寄生輻射圖案更具有N個側，N為正整數，且該開口形成於該N個側中面對該第一天線之一側。 An electronic device, comprising: a first substrate; a first antenna formed on the first substrate; a parasitic element arranged on the first substrate to be spaced apart from the first antenna and used to cause and The coupling of the first antenna; and a wireless communication chip mounted on the first substrate and electrically connected to the first antenna, wherein the wireless communication chip includes a second substrate, a wireless communication integrated circuit and a day The second substrate includes a first installation area and a second installation area, the wireless communication integrated circuit is formed on the first installation area, and the antenna block is installed on the second installation area for electrical connection The wireless communication integrated circuit and the first antenna, and the antenna block includes a connecting element, an insulating layer and a second antenna, the connecting element is formed on the second mounting area of the second substrate to Is electrically connected to the first antenna, the insulating layer is formed on the connecting element to cover the connecting element, the second antenna is formed on the insulating layer and is electrically connected to the first antenna through the connecting element Wire, wherein the parasitic element is patterned and formed on the first substrate, and wherein the insulating layer is formed to have a thickness such that the connecting element is not exposed to the outside, the parasitic element includes a first parasitic radiation pattern, the The first parasitic radiation pattern has an opening, the The first parasitic radiation pattern further has N sides, where N is a positive integer, and the opening is formed on one side of the N sides facing the first antenna. 如申請專利範圍第17項所述之電子裝置，其中該第一寄生輻射圖案具有迴路外型。 According to the electronic device described in claim 17, wherein the first parasitic radiation pattern has a loop shape. 如申請專利範圍第18項所述之電子裝置，其中該寄生元件更包含一第二寄生輻射圖案以及一第三寄生輻射圖案，該第二寄生輻射圖案用以沿該第一天線之方向自該第一寄生輻射圖案之一端延伸，且將該第一寄生輻射圖案連接至該第一天線，該第三寄生輻射圖案用以沿該第一天線之方向自該第一寄生輻射圖案之另一端延伸，且將該第一寄生輻射圖案連接至該第一天線。 According to the electronic device described in claim 18, the parasitic element further includes a second parasitic radiation pattern and a third parasitic radiation pattern, and the second parasitic radiation pattern is used to move from the direction of the first antenna One end of the first parasitic radiation pattern extends, and the first parasitic radiation pattern is connected to the first antenna, and the third parasitic radiation pattern is used to move from one end of the first parasitic radiation pattern along the direction of the first antenna. The other end extends and connects the first parasitic radiation pattern to the first antenna. 如申請專利範圍第17項所述之電子裝置，其中該第一天線包含一主圖案、一第一連接圖案、一第二連接圖案、一饋入接腳以及一第一接地單元，該主圖案用以沿一第一方向延伸，該第一連接圖案用以沿不同於該第一方向之一第二方向自該主圖案之一端延伸，該第二連接圖案用以沿該第二方向自該主圖案之另一端延伸，該饋入接腳形成以沿該第二方向自該第一連接圖案延伸且用以提供由該無線通訊積體電路供應之一電源供應訊號給該第一天線，而該第一接地單元用以使該第一天線接地。 According to the electronic device described in claim 17, wherein the first antenna includes a main pattern, a first connection pattern, a second connection pattern, a feeding pin and a first ground unit, the main The pattern is used to extend in a first direction, the first connection pattern is used to extend from one end of the main pattern in a second direction different from the first direction, and the second connection pattern is used to extend from one end of the main pattern in the second direction The other end of the main pattern extends, and the feeding pin is formed to extend from the first connection pattern along the second direction and used to provide a power supply signal supplied by the wireless communication integrated circuit to the first antenna , And the first grounding unit is used to ground the first antenna. 如申請專利範圍第20項所述之電子裝置，其中該第一寄生輻射圖案具有迴路外型，該第一接地單元包含用以自該饋入接腳沿該第一方向分支的一分支單元以及用以自該分支單元一端沿該第二方向延伸的一接地接腳，該分支單元以及該第一寄生輻射圖案之間的一距離大於該第一寄生輻射圖案之一內部寬度。 The electronic device according to claim 20, wherein the first parasitic radiation pattern has a loop shape, the first ground unit includes a branch unit for branching from the feeding pin in the first direction, and For a ground pin extending from one end of the branch unit along the second direction, a distance between the branch unit and the first parasitic radiation pattern is greater than an inner width of the first parasitic radiation pattern. 如申請專利範圍第20項所述之電子裝置，其中該第一寄生輻射圖案具有迴路外型，該第一接地單元包含用以自該饋入接腳沿該第一方向分支的一分支單元以及用以自該分支單元一端沿該第二方向延伸的一接地接腳，該分支單元以及該第一寄生輻射圖案之間的一距離小於該第一寄生輻射圖案之一內部寬度。 The electronic device according to claim 20, wherein the first parasitic radiation pattern has a loop shape, the first ground unit includes a branch unit for branching from the feeding pin in the first direction, and For a ground pin extending from one end of the branch unit along the second direction, a distance between the branch unit and the first parasitic radiation pattern is smaller than an inner width of the first parasitic radiation pattern. 如申請專利範圍第20項所述之電子裝置，其中該寄生元件設置於該第一基板上由該主圖案、該第一連接圖案以及該第二連接圖案所形成之一區域中。 According to the electronic device described in claim 20, the parasitic element is disposed in an area formed by the main pattern, the first connection pattern, and the second connection pattern on the first substrate. 如申請專利範圍第20項所述之電子裝置，其中該第二基板上對應於該饋入接腳之一區域中形成有一第一穿孔，該第一穿孔填滿一第一導體以將該無線通訊積體電路電性連接至該饋入接腳，該第二基板上對應於該第二連接圖案之一端之一區域中形成有一第二穿孔，該第二穿孔填滿一第二導體以將該第二連接圖案電性連接至該連接元件。 According to the electronic device described in claim 20, wherein a first through hole is formed in an area of the second substrate corresponding to the feeding pin, and the first through hole is filled with a first conductor to make the wireless The communication integrated circuit is electrically connected to the feeding pin, a second through hole is formed in an area of the second substrate corresponding to one end of the second connection pattern, and the second through hole is filled with a second conductor to The second connection pattern is electrically connected to the connection element. 一種製造具有嵌入式天線之無線通訊晶片的方法，該方法包含：形成一晶片以及一電路佈局於一基板之一第一安裝區域上，其中該晶片與該電路佈局構成一無線通訊積體電路；形成一第一天線、一寄生元件以及一連接元件於該基板之一第二安裝區域上；形成一絕緣層於該基板之一整個表面上；形成一第二天線於形成於該第二安裝區域之該絕緣層上；以及將該第二天線電性連接至該第一天線； 其中，該寄生元件設置於該基板之該第二安裝區域上以與該第一天線間隔並引起與該第一天線之耦合，其中圖案化並形成該寄生元件在該基板上，並且其中形成該絕緣層為具有使得該第一天線、該連接元件和該寄生元件不暴露於外的一厚度，該寄生元件包含一第一寄生輻射圖案，該第一寄生輻射圖案具有一開口，該第一寄生輻射圖案更具有N個側，N為正整數，且該開口形成於該N個側中面對該第一天線之一側。 A method of manufacturing a wireless communication chip with an embedded antenna, the method comprising: forming a chip and a circuit layout on a first mounting area of a substrate, wherein the chip and the circuit layout form a wireless communication integrated circuit; Forming a first antenna, a parasitic element, and a connecting element on a second mounting area of the substrate; forming an insulating layer on the entire surface of the substrate; forming a second antenna on the second mounting area On the insulating layer in the installation area; and electrically connecting the second antenna to the first antenna; Wherein, the parasitic element is disposed on the second mounting area of the substrate to be spaced from the first antenna and cause coupling with the first antenna, wherein the parasitic element is patterned and formed on the substrate, and wherein The insulating layer is formed to have a thickness such that the first antenna, the connecting element and the parasitic element are not exposed to the outside, the parasitic element includes a first parasitic radiation pattern, the first parasitic radiation pattern has an opening, the The first parasitic radiation pattern further has N sides, where N is a positive integer, and the opening is formed on one side of the N sides facing the first antenna. 如申請專利範圍第25項所述之方法，其中該第一寄生輻射圖案具有迴路外型。 The method described in claim 25, wherein the first parasitic radiation pattern has a loop shape. 如申請專利範圍第26項所述之方法，其中該寄生元件更包含一第二寄生輻射圖案以及一第三寄生輻射圖案，該第二寄生輻射圖案用以沿該第一天線之一方向自該第一寄生輻射圖案之一端延伸並將該第一寄生輻射圖案連接至該第一天線，該第三寄生輻射圖案用以沿該第一天線之該方向自該第一輻射圖案之另一端延伸並將該第一寄生輻射圖案連接至該第一天線。 According to the method described in claim 26, the parasitic element further includes a second parasitic radiation pattern and a third parasitic radiation pattern, and the second parasitic radiation pattern is used for moving from one direction to the first antenna. One end of the first parasitic radiation pattern extends and connects the first parasitic radiation pattern to the first antenna, and the third parasitic radiation pattern is used to move from another of the first radiation pattern along the direction of the first antenna One end extends and connects the first parasitic radiation pattern to the first antenna. 如申請專利範圍第25項所述之方法，其中該第一天線包含一主圖案、一第一連接圖案、一第二連接圖案、一饋入接腳以及一第一接地單元，該主圖案用以沿一第一方向延伸，該第一連接圖案用以沿不同於該第一方向之一第二方向自該主圖案之一端延伸，該第二連接圖案用以沿該第二方向自該主圖案之另一端延伸，該饋入接腳沿該第二方向自該第一連接圖案延伸且用以提供由該無線通訊積體電路供應之一電源供應訊號給該第一天線，而該第一接地單元用以使該第一天線接地。 According to the method described in claim 25, the first antenna includes a main pattern, a first connection pattern, a second connection pattern, a feeding pin, and a first ground unit, and the main pattern For extending in a first direction, the first connection pattern is used for extending from an end of the main pattern in a second direction different from the first direction, and the second connection pattern is used for extending from the end of the main pattern in the second direction The other end of the main pattern extends, the feeding pin extends from the first connection pattern along the second direction and is used to provide a power supply signal supplied by the wireless communication integrated circuit to the first antenna, and the The first grounding unit is used for grounding the first antenna. 一種製造電子裝置之方法，該方法包含：形成一晶片以及一電路佈局於一次基板之一第一安裝區域上，其中該晶片與該電路佈局構成一無線通訊積體電路；形成一連接元件於該次基板之一第二安裝區域上；形成一絕緣層於該次基板之一整個表面上；形成一第二天線於形成於該第二安裝區域之該絕緣層上；將該第二天線電性連接至該連接元件以製造一無線通訊晶片；以及安裝該無線通訊晶片於形成有一第一天線以及一寄生元件之一主機板上以使該無線通訊晶片電性連接於該第一天線；其中該寄生元件設置於該主機板上以與該第一天線間隔，並引起與該第一天線之耦合，其中圖案化並形成該寄生元件在該主機板上，並且其中形成該絕緣層為具有使得該連接元件不暴露於外的一厚度，該寄生元件包含一第一寄生輻射圖案，該第一寄生輻射圖案具有一開口，該第一寄生輻射圖案更具有N個側，N為正整數，且該開口形成於該N個側中面對該第一天線之一側。 A method of manufacturing an electronic device, the method comprising: forming a chip and a circuit layout on a first mounting area of a primary substrate, wherein the chip and the circuit layout constitute a wireless communication integrated circuit; forming a connecting element on the Forming an insulating layer on an entire surface of the sub-substrate; forming a second antenna on the insulating layer formed in the second mounting area; forming the second antenna Electrically connected to the connecting element to manufacture a wireless communication chip; and installing the wireless communication chip on a motherboard formed with a first antenna and a parasitic element so that the wireless communication chip is electrically connected to the first day Line; wherein the parasitic element is provided on the motherboard to be spaced apart from the first antenna and causes coupling with the first antenna, wherein the parasitic element is patterned and formed on the motherboard, and the parasitic element is formed therein The insulating layer has a thickness such that the connecting element is not exposed to the outside. The parasitic element includes a first parasitic radiation pattern, the first parasitic radiation pattern has an opening, and the first parasitic radiation pattern further has N sides. Is a positive integer, and the opening is formed on one of the N sides facing the first antenna. 如申請專利範圍第29項所述之方法，其中該第一寄生輻射圖案具有迴路外型。 The method according to claim 29, wherein the first parasitic radiation pattern has a loop shape. 如申請專利範圍第30項所述之方法，其中該寄生元件更包含一第二寄生輻射圖案以及一第三寄生輻射圖案，該第二寄生輻射圖案用以沿該第一天線之一方向自該第一寄生輻射圖案之一端延伸並將該第一 寄生輻射圖案連接至該第一天線，該第三寄生輻射圖案用以沿該第一天線之該方向自該第一輻射圖案之另一端延伸並將該第一寄生輻射圖案連接至該第一天線。 According to the method described in claim 30, wherein the parasitic element further includes a second parasitic radiation pattern and a third parasitic radiation pattern, and the second parasitic radiation pattern is used for moving from a direction along the first antenna One end of the first parasitic radiation pattern is extended and the first The parasitic radiation pattern is connected to the first antenna, and the third parasitic radiation pattern is used to extend from the other end of the first radiation pattern along the direction of the first antenna and connect the first parasitic radiation pattern to the first antenna An antenna. 如申請專利範圍第29項所述之方法，其中該第一天線包含一主圖案、一第一連接圖案、一第二連接圖案、一饋入接腳以及一第一接地單元，該主圖案用以沿一第一方向延伸，該第一連接圖案用以沿不同於該第一方向之一第二方向自該主圖案之一端延伸，該第二連接圖案用以沿該第二方向自該主圖案之另一端延伸，該饋入接腳沿該第二方向自該第一連接圖案延伸且用以提供由該無線通訊積體電路供應之一電源供應訊號給該第一天線，而該第一接地單元用以使該第一天線接地，其中該寄生元件設置於一底基板上由該主圖案、該第一連接圖案以及該第二連接圖案所形成之一區域中。According to the method described in claim 29, the first antenna includes a main pattern, a first connection pattern, a second connection pattern, a feeding pin and a first ground unit, and the main pattern For extending in a first direction, the first connection pattern is used for extending from an end of the main pattern in a second direction different from the first direction, and the second connection pattern is used for extending from the end of the main pattern in the second direction The other end of the main pattern extends, the feeding pin extends from the first connection pattern along the second direction and is used to provide a power supply signal supplied by the wireless communication integrated circuit to the first antenna, and the The first grounding unit is used for grounding the first antenna, wherein the parasitic element is disposed in an area formed by the main pattern, the first connection pattern, and the second connection pattern on a base substrate.
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TW201705427A (en) * 2015-03-19 2017-02-01 半導體能源研究所股份有限公司 Semiconductor device and electronic device
TW201709348A (en) * 2015-07-08 2017-03-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof
TW201724515A (en) * 2015-08-26 2017-07-01 半導體能源研究所股份有限公司 Semiconductor device and manufacturing method thereof

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