TWI698375B - Automatic calibration sealing array system and automatic calibration method - Google Patents

Automatic calibration sealing array system and automatic calibration method Download PDF

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TWI698375B
TWI698375B TW108117544A TW108117544A TWI698375B TW I698375 B TWI698375 B TW I698375B TW 108117544 A TW108117544 A TW 108117544A TW 108117544 A TW108117544 A TW 108117544A TW I698375 B TWI698375 B TW I698375B
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heat
sealing
calibration
sensor
array system
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TW202043101A (en
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鄭秋福
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鄭秋福
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Abstract

The present invention provides an automatic calibration sealing array system comprising a conveying device, a plurality of heat seal devices, and a controller. The conveying device moves the continuous plastic film to a processing path according to a preset conveying speed. The heat sealing device is arranged on the processing path at intervals. Each of the heat sealing devices includes a position calibration unit which moves in the direction of the processing path according to the received signal. The controller outputs one or more calibration signal to the position calibration units to calibrate the position of the heat sealing device according to the inputted error distance.

Description

自動校準式熱封陣列系統及自動校準方法Automatic calibration type heat-sealing array system and automatic calibration method

本發明係有關於一種自動校準式熱封陣列系統及自動校準方法，尤指一種用於包裝袋熱封製程的自動校準式熱封陣列系統及自動校準方法。The present invention relates to an automatic calibration type heat-sealing array system and an automatic calibration method, in particular to an automatic calibration type heat-sealing array system and an automatic calibration method used in the heat-sealing process of packaging bags.

一般而言，包裝袋的製作方式，多是以整捆的塑膜原料開始進行製作，將整捆塑膜原料餵料至包裝袋製作機台，經過印刷、複合等程序後，經由熱壓方式封邊，最後進行裁切完成包裝袋製作的程序。然而整捆的塑膜在經過各個加工站台的過程中，經常會有伸縮的情況。這類情況例如塑膜承受過度張力時造成的形變，或是塑膜傳送時突破靜摩擦力產生的偏移等。Generally speaking, the production method of packaging bags is mostly started with a whole bundle of plastic film raw materials, and the whole bundle of plastic film raw materials are fed to the packaging bag making machine, after printing, compounding, etc., through the hot pressing method Seal the edges, and finally cut to complete the packaging bag production process. However, when the whole bundle of plastic film passes through various processing stations, it often expands and contracts. Such situations are, for example, the deformation caused when the plastic film is subjected to excessive tension, or the deviation caused by the breakthrough of static friction when the plastic film is conveyed.

當塑膜發生伸縮的情況時，在製作的過程中會造成印刷或是熱封的位置偏移，造成包裝袋製作的良率下降。一般情況，在不追求高精密度良率情況下，這類的公差是可以被忽略的。然而機台在長時間的運作下，公差會持續的累計，而導致偏差的位置嚴重偏移，在這樣的情況下，設備工程師必須經常性的停機、校準、重啟，使包裝袋成品得以保持一定的良率，而這樣的過程會明顯導致製程上的不經濟，不僅是在於停機時所造成的時間損失，人力的減損以及良率不穩定都是習知技術可能會產生的問題。是以，要如何解決上述習用之問題與缺失，即為本發明之發明人與從事此行業之相關廠商所亟欲研究改善之方向所在者。When the plastic film expands and contracts, the printing or heat sealing position will shift during the production process, resulting in a decrease in the yield of packaging bags. In general, this type of tolerance can be ignored when high precision yield is not pursued. However, under long-term operation of the machine, the tolerances will continue to accumulate, resulting in a serious deviation of the position of the deviation. In this case, the equipment engineer must frequently stop, calibrate, and restart to keep the finished packaging bag at a certain level. Such a process will obviously lead to uneconomical processes. Not only the time loss caused by the shutdown, but also the loss of manpower and unstable yield are all problems that may be caused by conventional technologies. Therefore, how to solve the above-mentioned conventional problems and deficiencies is the direction that the inventor of the present invention and related manufacturers engaged in this industry urgently want to study and improve.

本發明的主要目的，在於提供一種自動校準式熱封陣列系統，係用以重覆對連續塑膜的相同位置進行分段漸次熱封。該自動校準式熱封陣列系統包括一傳送裝置、複數個熱封裝置、以及一連接或耦接至該複數個位置校準單元以及該感測器的控制器。該傳送裝置依據預先設定輸送速度將該連續塑膜沿一加工路徑移動。該熱封裝置依序間隔排列設置於該加工路徑上，每一該熱封裝置包括一位置校準單元，該位置校準單元依據所接收到的訊號沿該加工路徑的方向上移動。該控制器連接或耦接至該複數個位置校準單元，該控制器係依據輸入的誤差偏移量輸出一或複數個校準訊息至該位置校準單元以校準該熱封裝置的位置。The main purpose of the present invention is to provide an auto-calibration heat-sealing array system, which is used to repeatedly heat-seal the same position of a continuous plastic film in stages. The automatic calibration type heat-sealing array system includes a transmission device, a plurality of heat-sealing devices, and a controller connected or coupled to the plurality of position calibration units and the sensor. The conveying device moves the continuous plastic film along a processing path according to a preset conveying speed. The heat-sealing devices are arranged on the processing path sequentially and at intervals, and each heat-sealing device includes a position calibration unit that moves in the direction of the processing path according to the received signal. The controller is connected or coupled to the plurality of position calibration units, and the controller outputs one or more calibration messages to the position calibration unit according to the input error offset to calibrate the position of the heat sealing device.

本發明的另一目的，在於提供一種自動校準方法，配合如上所述的自動校準式熱封陣列系統，該自動校準方法包括：該控制器於停機狀態時接收到停機校準指令；依據使用者設定儲存複數個該熱封裝置個別的基準參數值，並依據該基準參數值控制將複數個該熱封裝置移動至對應的起始位置。Another object of the present invention is to provide an automatic calibration method that cooperates with the above-mentioned automatic calibration type heat-sealing array system. The automatic calibration method includes: the controller receives a shutdown calibration command when the controller is in a shutdown state; A plurality of individual reference parameter values of the heat-sealing device are stored, and the plurality of heat-sealing devices are controlled to move to corresponding starting positions according to the reference parameter value.

本發明的另一目的，在於提供一種自動校準方法，配合如上所述的自動校準式熱封陣列系統，該自動校準方法包括：該控制器於運行狀態時；於接收到該誤差偏移量時，啟動運行同動模式，將輸入的該誤差偏移量同步加入所有位置校準單元的基準參數值，依據修正過後的該基準參數值同步校準該熱封裝置的位置。Another object of the present invention is to provide an automatic calibration method that cooperates with the above-mentioned automatic calibration type heat-sealing array system. The automatic calibration method includes: when the controller is in operation; when the error offset is received , Start the running simultaneous mode, add the input error offset to the reference parameter values of all position calibration units synchronously, and calibrate the position of the heat-sealing device synchronously according to the corrected reference parameter value.

本發明的另一目的，在於提供一種自動校準方法，配合如上所述的自動校準式熱封陣列系統，該自動校準方法包括：該控制器於運行狀態時，即時由該第一感測器及該第二感測器檢測該連續塑膜加工位置的該誤差偏移量；於接收到該誤差偏移量時，該控制器啟動運行累進模式，將該誤差偏移量依據順序累計加入各基準參數值，依據修正過後的該基準參數值同步校準該熱封裝置的位置。Another object of the present invention is to provide an automatic calibration method that cooperates with the above-mentioned automatic calibration type heat-sealing array system. The automatic calibration method includes: when the controller is in operation, the first sensor and The second sensor detects the error offset of the continuous plastic film processing position; when receiving the error offset, the controller starts the running progressive mode, and adds the error offset to each reference according to the order. The parameter value is synchronized to calibrate the position of the heat-sealing device according to the corrected reference parameter value.

本發明的另一目的，在於提供一種非暫存式電腦可讀取記錄媒體，經由電腦或控制器執行後，係可完成如上所述的方法。Another object of the present invention is to provide a non-transitory computer-readable recording medium, which can complete the above-mentioned method after being executed by a computer or a controller.

是以，本發明係比起習知技術具有以下的優勢功效：Therefore, the present invention has the following advantages compared with the conventional technology:

1. 本發明可以於塑膜熱封的過程中自動控制複數個熱封裝置校準至正確的位置，減少停機造成的時間、人力減損。1. The present invention can automatically control a plurality of heat-sealing devices to be calibrated to the correct positions during the process of plastic film heat-sealing, reducing the time and labor loss caused by shutdown.

2. 本發明可以大幅地提升最終成品的良率，提升成品的美觀性及細緻度。2. The present invention can greatly improve the yield of the final finished product, and enhance the aesthetics and fineness of the finished product.

有關本發明之詳細說明及技術內容，現就配合圖式說明如下。再者，本發明中之圖式，為說明方便，其比例未必照實際比例繪製，該等圖式及其比例並非用以限制本發明之範圍，在此先行敘明。The detailed description and technical content of the present invention will now be described with the drawings as follows. Furthermore, the figures in the present invention are not necessarily drawn according to actual proportions for the convenience of description, and these figures and their proportions are not used to limit the scope of the present invention, and are described here first.

以下針對本發明舉一較佳具體實施例進行說明，請先一併參閱「圖1」，係為本發明自動校準式熱封陣列系統的方塊示意圖，如圖所示：The following is a description of a preferred embodiment of the present invention. Please refer to "Figure 1" first, which is a block diagram of the automatic calibration heat-sealing array system of the present invention, as shown in the figure:

本實施例揭示一種自動校準式熱封陣列系統100，係用以重覆對連續塑膜的相同位置進行分段漸次熱封，經由多次熱壓合使連續塑膜的邊緣封合，最終加工製成包裝袋。於一可行的實施例中，該自動校準式熱封陣列系統100於前端方向(即朝向餵料裝置的方向上)的位置可以包括複數個加工站台，用以執行印刷、複合等先行加工步驟；該自動校準式熱封陣列系統100於後端方向(即朝向最終製程的方向上)的位置可以包括複數個加工站台，用以執行校準、裁切、分撿的工作。具體而言，該自動校準式熱封陣列系統100於整個產線中所配置的位置並非屬於本發明所欲限制的範圍。This embodiment discloses an auto-calibration heat-sealing array system 100, which is used to repeatedly heat-seal the same position of a continuous plastic film in stages, and seal the edges of the continuous plastic film through multiple heat pressing, and finally process Made into packaging bags. In a feasible embodiment, the position of the auto-calibration heat-sealing array system 100 in the front-end direction (that is, in the direction toward the feeding device) may include a plurality of processing stations for performing advanced processing steps such as printing and compounding; The position of the auto-calibration heat-sealing array system 100 in the rear end direction (that is, in the direction toward the final manufacturing process) may include a plurality of processing stations for performing calibration, cutting, and sorting tasks. Specifically, the location of the auto-calibration heat-sealing array system 100 in the entire production line does not fall within the scope of the present invention.

所述的自動校準式熱封陣列系統100主要包括一傳送裝置10、複數個熱封裝置20、一超音波熔接裝置30、複數個冷卻裝置40、一第一感測器50A、一第二感測器50B、以及一控制器60。The automatic calibration type heat-sealing array system 100 mainly includes a conveying device 10, a plurality of heat-sealing devices 20, an ultrasonic welding device 30, a plurality of cooling devices 40, a first sensor 50A, and a second sensor. Detector 50B, and a controller 60.

所述的傳送裝置10依據預先設定輸送速度將該連續塑膜沿一加工路徑PT移動。於一可行的實施例中，該傳送裝置10係為一或複數個由伺服馬達控制轉動行程的旋轉輥，用以捲動連續塑膜朝該加工路徑PT移動。於該傳送裝置10的前端可以設置餵料裝置70，對前端加工後的半成品塑膜提供適當的緩衝並餵料至該傳送裝置10，避免連續塑膜因前後加工裝置的行程不同步而累計公差導致過度拉伸。The conveying device 10 moves the continuous plastic film along a processing path PT according to a preset conveying speed. In a feasible embodiment, the conveying device 10 is one or more rotating rollers whose rotation strokes are controlled by a servo motor to roll the continuous plastic film toward the processing path PT. A feeding device 70 can be provided at the front end of the conveying device 10 to provide appropriate buffering for the semi-finished plastic film processed at the front end and feeding it to the conveying device 10 to avoid accumulated tolerances due to the unsynchronized strokes of the front and rear processing devices. Causes excessive stretching.

所述的熱封裝置20依序間隔排列設置於該加工路徑PT上，每一該熱封裝置20包括一位置校準單元21，該位置校準單元21依據所接收到的訊號沿該加工路徑PT的方向上移動。於一可行的實施例中，該熱封裝置20係為直下式熱封機，經由直上直下的方式對半成品塑膜進行熱封合。須注意的是，於本實施例中，雖然揭示所述的加工路徑PT係以水平的方向遞送連續塑膜，但不排除在實際上的需求變更加路徑的方向，在此先行敘明。為了避免熱封合時，溫度過高導致塑膜過度形變，該熱封裝置20的數量係配置為複數個，經由相對低溫的方式重複壓合連續塑膜的相同位置，完成熱封合。The heat-sealing devices 20 are arranged on the processing path PT in sequence and spaced apart. Each heat-sealing device 20 includes a position calibration unit 21. The position calibration unit 21 moves along the processing path PT according to the received signal. Move in the direction. In a feasible embodiment, the heat-sealing device 20 is a direct-type heat-sealing machine, which heat-seals the semi-finished plastic film in a straight-up and straight-down manner. It should be noted that in this embodiment, although it is disclosed that the processing path PT is to deliver the continuous plastic film in a horizontal direction, it does not rule out that the actual demand changes to the direction of the path, which is described here first. In order to avoid excessive deformation of the plastic film when the temperature is too high during heat sealing, the number of the heat sealing device 20 is configured to be plural, and the same position of the continuous plastic film is repeatedly pressed at a relatively low temperature to complete the heat sealing.

所述的超音波熔接裝置30係設置於複數個該熱封裝置20的前端，該超音波熔接裝置30的主要功能在於一次性高溫封合夾鏈袋條的邊緣，藉此融熔厚度較厚的夾鏈袋條。同樣地，於一可行的實施例中，該超音波熔接裝置30亦包括一位置校準單元31，該位置校準單元31依據所接收到的訊號沿該加工路徑PT的方向上移動。The ultrasonic welding device 30 is arranged at the front end of a plurality of the heat sealing devices 20. The main function of the ultrasonic welding device 30 is to seal the edges of the zipper bag at a high temperature at a time, thereby making the thickness thicker. Zipper bag. Similarly, in a feasible embodiment, the ultrasonic welding device 30 also includes a position calibration unit 31 that moves in the direction of the processing path PT according to the received signal.

所述的冷卻裝置40依序間隔排列設置於該加工路徑PT對應於該熱封裝置20的後端方向上，每一該冷卻裝置40包括一位置校準單元41，該位置校準單元41依據該控制器60輸出的訊號沿該加工路徑PT的方向上移動。於一可行的實施例中，該冷卻裝置40可以為通過冷水(或其他冷媒，於本發明中不予以限制)的直下式冷卻管，經由直上直下的方式重覆按壓熱封合的位置以固化塑模熱封合的區域。The cooling devices 40 are arranged in sequence and spaced in the rear direction of the processing path PT corresponding to the heat sealing device 20. Each cooling device 40 includes a position calibration unit 41, and the position calibration unit 41 controls The signal output by the device 60 moves in the direction of the processing path PT. In a feasible embodiment, the cooling device 40 may be a direct-type cooling pipe that passes cold water (or other refrigerant, which is not limited in the present invention), and repeatedly presses the heat-sealed position in a straight-up and straight-down manner to solidify The area where the mold is heat-sealed.

所述的第一感測器50A設置於該加工路徑PT上相對於複數個該熱封裝置20的前端、第二感測器50B則設置於該加工路徑PT上相對於複數個該熱封裝置20的後端，經由該第一感測器50A及該第二感測器50B檢測該連續塑膜加工位置的誤差偏移量。於一可行的實施例中，該第一感測器50A及該第二感測器50B係為光電感測器或攝影機。於另一可行的實施例中，該第一感測器50A及該第二感測器50B亦可以配置微處理器，用以暫存並記錄所獲取的位置資料，並與預先設定的基準位置之間的變化量計算所述的誤差偏移量。該等計算方式亦可以交給控制器或可程式化邏輯控制器(PLC)執行，執行該等運算的硬體形式非屬本發明所欲限制的範圍。The first sensor 50A is arranged on the processing path PT relative to the front end of the plurality of heat sealing devices 20, and the second sensor 50B is arranged on the processing path PT relative to the plurality of heat sealing devices At the rear end of 20, the first sensor 50A and the second sensor 50B detect the error offset of the continuous plastic film processing position. In a feasible embodiment, the first sensor 50A and the second sensor 50B are photoelectric sensors or cameras. In another feasible embodiment, the first sensor 50A and the second sensor 50B can also be equipped with a microprocessor to temporarily store and record the acquired position data, and compare it with a preset reference position The amount of change between the calculation of the error offset. These calculation methods can also be executed by a controller or a programmable logic controller (PLC), and the hardware form for performing these calculations is not within the scope of the present invention.

所述的控制器60連接或耦接至該複數個位置校準單元21(位置校準單元31、位置校準單元41)以及該第一感測器50A、及第二感測器50B，該控制器60可以依據人機介面供人員直接操作輸入誤差偏移量，或是經由該第一感測器50A、及第二感測器50B反饋的數值估計誤差偏移量，將回傳的誤差偏移量輸出一或複數個校準訊息至該位置校準單元21(位置校準單元31、位置校準單元41)以校準該熱封裝置20(超音波熔接裝置30、冷卻裝置40)的位置。具體而言，該控制器60依據誤差偏移量協調複數個熱封裝置20(及/或超音波熔接裝置30、冷卻裝置40)移動至適當的位置，藉以達到高精密度的熱封加工。The controller 60 is connected or coupled to the plurality of position calibration units 21 (position calibration unit 31, position calibration unit 41) and the first sensor 50A and the second sensor 50B, the controller 60 The error offset can be input by direct operation of the human-machine interface, or the error offset can be estimated through the values fed back by the first sensor 50A and the second sensor 50B, and the error offset returned One or more calibration messages are output to the position calibration unit 21 (position calibration unit 31, position calibration unit 41) to calibrate the position of the heat sealing device 20 (ultrasonic welding device 30, cooling device 40). Specifically, the controller 60 coordinates the movement of the plurality of heat sealing devices 20 (and/or the ultrasonic welding device 30 and the cooling device 40) to appropriate positions according to the error offset, so as to achieve high-precision heat sealing processing.

於一可行的實施例中，控制器60可以與儲存單元共同構成一電腦或處理器，例如是個人電腦、工作站、主機電腦或其他型式之電腦或處理器，在此並不限制其種類。在另一可行的實施例中，控制器60可連接或耦接於儲存單元。控制器60例如是中央處理器（Central Processing Unit, CPU），或是其他可程式化之一般用途或特殊用途的微處理器（Microprocessor）、數位訊號處理器（Digital Signal Processor, DSP）、可程式化控制器、特殊應用積體電路（Application Specific Integrated Circuits, ASIC）、可程式化邏輯裝置（Programmable Logic Device, PLD）、或其他類似裝置或這些裝置的組合等，該等控制器60的種類繁多，非屬本發明所欲限制的範圍。In a feasible embodiment, the controller 60 can form a computer or processor together with the storage unit, such as a personal computer, a workstation, a host computer, or other types of computers or processors, and the type is not limited herein. In another feasible embodiment, the controller 60 may be connected or coupled to the storage unit. The controller 60 is, for example, a central processing unit (Central Processing Unit, CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessor), digital signal processors (Digital Signal Processor, DSP), programmable Controllers, application specific integrated circuits (ASIC), programmable logic devices (Programmable Logic Device, PLD), or other similar devices or combinations of these devices, etc. There are many types of such controllers 60 It is not within the scope of the present invention.

有關於該自動校準式熱封陣列系統100的工作方式及自動校準方法，以下配合參閱「圖2」、「圖3」、「圖4」、及「圖5」，為本發明自動校準式熱封陣列系統的工作狀態示意圖(一)、工作狀態示意圖(二)、工作狀態示意圖(三)、以及自動校準方法的流程示意圖，如圖所示：Regarding the working mode and automatic calibration method of the auto-calibration heat-sealing array system 100, please refer to "Figure 2", "Figure 3", "Figure 4" and "Figure 5" for the following cooperation. The schematic diagram of the working state of the sealed array system (1), the schematic diagram of the working state (2), the schematic diagram of the working state (3), and the flow diagram of the automatic calibration method, as shown in the figure:

請先一併參閱圖2及圖5，於一可行的實施例中，該熱封裝置20A~20F、冷卻裝置40A~40B之間係彼此保持適當的距離，為了確保熱封裝置20A~20F、冷卻裝置40A~40B壓合在連續塑膜正確的位置上，該熱封裝置20A~20F以及冷卻裝置40A~40B彼此之間的距離可以是包裝袋成品長度(或寬度)的整數倍，於本發明中將每一倍數以單位級距簡稱。即一單位級距相當於一個包裝袋成品長度(或寬度)、二單位級距相當於二個包裝袋成品長度(或寬度)，以此類推。於實務的操作上，該等單位級距亦可以作為簡易的指令供操作人員輸入，藉以調整各冷卻裝置40A~40B之間的相對位置，例如設定一單位級距為100mm時，依據對應的熱封裝置20A~20F(或冷卻裝置40A~40B)輸入2單位代表與下一裝置之間的距離調整為200mm，藉此簡化操作程序。Please refer to FIGS. 2 and 5 together. In a feasible embodiment, the heat-sealing devices 20A-20F and the cooling devices 40A-40B are kept at an appropriate distance from each other, in order to ensure that the heat-sealing devices 20A-20F, The cooling device 40A~40B is pressed on the correct position of the continuous plastic film. The distance between the heat sealing device 20A~20F and the cooling device 40A~40B can be an integer multiple of the length (or width) of the finished packaging bag. In the invention, each multiple is abbreviated as unit pitch. That is, one unit level distance is equivalent to the length (or width) of one packaging bag, two unit level distance is equivalent to the length (or width) of two packaging bags, and so on. In practical operation, these unit step distances can also be used as simple commands for the operator to input, so as to adjust the relative positions of the cooling devices 40A-40B. For example, when a unit step distance is set to 100mm, based on the corresponding heat The distance between the sealing device 20A-20F (or the cooling device 40A-40B) and the next device is adjusted to 200mm by inputting 2 units, thereby simplifying the operation procedure.

於本實施例中，該熱封裝置20A~20F以及冷卻裝置40A~40B彼此間的間距大致保持兩個單位級距，其主要的目的在於保留適當的間距以便人員(例如設備工程師)確認熱封裝置20A~20F以及冷卻裝置40A~40B是否壓合在正確的位置上(即確認是否有產生誤差)，在設定兩個單位級距的情況下可以保留適當的間隔區供人眼或感測器辨識。該超音波熔接裝置30與熱封裝置20A的間距可以大致保持一個單位級距。惟，上面單位級距的數量係可以配合實際需求調整，非屬本發明所欲限制的範圍。In this embodiment, the distance between the heat sealing devices 20A-20F and the cooling devices 40A-40B is roughly maintained at two unit levels. The main purpose is to maintain an appropriate distance so that personnel (such as equipment engineers) can confirm the heat sealing. Whether the device 20A~20F and the cooling device 40A~40B are pressed in the correct position (that is, confirm whether there is an error), in the case of setting two unit steps, an appropriate interval can be reserved for the human eye or the sensor Identify. The distance between the ultrasonic welding device 30 and the heat sealing device 20A can be approximately maintained at a unit pitch. However, the number of unit steps above can be adjusted according to actual needs and is not within the scope of the present invention.

於本發明的一較佳實施例中，該控制器60係可以切換於三種工作模式：停機佈陣模式、運行累進模式、以及運行同動模式。In a preferred embodiment of the present invention, the controller 60 can be switched to three working modes: stop array mode, run progressive mode, and run simultaneous mode.

於停機佈陣模式中，機台執行於停機狀態，該控制器60於停機狀態時經由接收到停機校準指令觸發停機佈陣模式(步驟S1)。於停機佈陣模式中，控制器60將依據使用者的設定，儲存複數個該熱封裝置20A~20F、冷卻裝置40A~40B個別的基準參數值，並依據該基準參數值控制將複數個該熱封裝置20A~20F、冷卻裝置40A~40B移動至對應的起始位置。舉例而言，例如將該超音波熔接裝置30的位置設為零點(或稱基準點)；將熱封裝置20A的位置設定為100；將熱封裝置20B的位置設定為300；將熱封裝置20C的位置設定為500；將熱封裝置20D的位置設定為700；將熱封裝置20E的位置設定為900；將熱封裝置20F的位置設定為1100；將冷卻裝置40A的位置設定為1300；將冷卻裝置40B的位置設定為1500。須注意的是該基準點可以配合第一感測器50A、第二感測器50B的位置而變更，或是當超音波熔接裝置30與第一感測器50A、第二感測器50B的位置為固定時設定該超音波熔接裝置30為零點，此部分非屬本發明所欲限制的範圍。In the stop array mode, the machine is executed in the stop state, and the controller 60 triggers the stop array mode by receiving the stop calibration command when in the stop state (step S1). In the shutdown array mode, the controller 60 will store a plurality of individual reference parameter values of the heat-sealing device 20A~20F and the cooling device 40A~40B according to the user’s setting, and control the multiple reference parameter values according to the reference parameter value. The heat sealing device 20A-20F and the cooling device 40A-40B move to the corresponding starting position. For example, for example, the position of the ultrasonic welding device 30 is set to the zero point (or reference point); the position of the heat sealing device 20A is set to 100; the position of the heat sealing device 20B is set to 300; Set the position of 20C to 500; set the position of the heat-sealing device 20D to 700; set the position of the heat-sealing device 20E to 900; set the position of the heat-sealing device 20F to 1100; set the position of the cooling device 40A to 1300; The position of the cooling device 40B is set to 1500. It should be noted that the reference point can be changed according to the positions of the first sensor 50A and the second sensor 50B, or when the ultrasonic welding device 30 is connected to the first sensor 50A and the second sensor 50B. When the position is fixed, the ultrasonic welding device 30 is set to the zero point. This part is not within the scope of the present invention.

請一併參閱圖3及圖5，控制器60偵測機台是否啟動(步驟S2)，當機台啟動時，該控制器60係啟動運行同動模式(步驟S3)，人員可以經由人機介面(例如控制屏幕)輸入誤差偏移量。輸入的方式可以為具體的數字，或是經由增加或減少按鈕以固定單位增減，於本發明中不予以限制。該控制器60接收到該誤差偏移量後，將該誤差偏移量同步加入所有該基準參數值，依據修正過後的該基準參數值同步校準該熱封裝置20A~20F、冷卻裝置40A、40B的位置。舉例而言，例如由基準點偵測到一單位的誤差時；將熱封裝置20A的位置設定為101；將熱封裝置20B的位置設定為301；將熱封裝置20C的位置設定為501；將熱封裝置20D的位置設定為701；將熱封裝置20E的位置設定為901；將熱封裝置20F的位置設定為1101；將冷卻裝置40A的位置設定為1301；將冷卻裝置40B的位置設定為1501，以此類推。Please refer to Figures 3 and 5 together. The controller 60 detects whether the machine is activated (step S2). When the machine is activated, the controller 60 starts the simultaneous operation mode (step S3). The interface (such as the control screen) enters the error offset. The input method can be a specific number, or increase or decrease in a fixed unit through the increase or decrease button, which is not limited in the present invention. After receiving the error offset, the controller 60 adds the error offset to all the reference parameter values synchronously, and calibrates the heat-sealing device 20A-20F and the cooling devices 40A, 40B according to the corrected reference parameter value. s position. For example, when a unit error is detected from the reference point; set the position of the heat-sealing device 20A to 101; set the position of the heat-sealing device 20B to 301; set the position of the heat-sealing device 20C to 501; Set the position of the heat-sealing device 20D to 701; set the position of the heat-sealing device 20E to 901; set the position of the heat-sealing device 20F to 1101; set the position of the cooling device 40A to 1301; set the position of the cooling device 40B It is 1501, and so on.

請一併參閱圖4及圖5，接續，控制器60可以經由人員透過人機介面切換或是自動切換至一運行累進模式(步驟S4)。於運行累進模式中，控制器60會自行依據第一感測器50A、以及第二感測器50B所偵測到的數值計算誤差偏移量(例如第一感測器50A偵測到偏移-5單位的偏移量、第二感測器偵測到-8，則誤差偏移量則為-3)，並將該誤差偏移量依據順序累計加入各該基準參數值，依據修正過後的該基準參數值同步校準該該熱封裝置20A~20F、冷卻裝置40A~40B的位置。具體而言，例如由基準點偵測到15單位的誤差時；將熱封裝置20A的位置設定為101；將熱封裝置20B的位置設定為303；將熱封裝置20C的位置設定為505；將熱封裝置20D的位置設定為707；將熱封裝置20E的位置設定為909；將熱封裝置20F的位置設定為1111；將冷卻裝置40A的位置設定為1313；將冷卻裝置40B的位置設定為1515，以此類推。經由上述的方式，讓控制器60執行全自動校正的功能。Please refer to FIG. 4 and FIG. 5 together. In continuation, the controller 60 can be switched through a human-machine interface or automatically switched to a running progressive mode (step S4). In the running progressive mode, the controller 60 will automatically calculate the error offset based on the values detected by the first sensor 50A and the second sensor 50B (for example, the first sensor 50A detects the offset -5 units of offset, the second sensor detects -8, the error offset is -3), and the error offset is added to each reference parameter value according to the order, and after correction The position of the heat-sealing device 20A-20F and the cooling device 40A-40B is calibrated synchronously with the reference parameter value. Specifically, for example, when an error of 15 units is detected from the reference point; set the position of the heat-sealing device 20A to 101; set the position of the heat-sealing device 20B to 303; set the position of the heat-sealing device 20C to 505; Set the position of the heat-sealing device 20D to 707; set the position of the heat-sealing device 20E to 909; set the position of the heat-sealing device 20F to 1111; set the position of the cooling device 40A to 1313; set the position of the cooling device 40B It is 1515, and so on. Through the above method, the controller 60 is allowed to perform the function of fully automatic calibration.

上述的方法步驟可透過非暫存式電腦可讀取紀錄媒體的方式實施，所述的電腦可讀取紀錄媒體例如可為唯讀記憶體、快閃記憶體、軟碟、硬碟、光碟、隨身碟、磁帶、可由網路存取之資料庫或熟悉此技藝者可輕易思及具有相同功能之儲存媒介。經由電腦或控制器載入並執行該非暫存式電腦可讀取紀錄媒體後，可以完成如上所述的方法。The above method steps can be implemented by a non-temporary computer readable recording medium. The computer readable recording medium can be, for example, read-only memory, flash memory, floppy disk, hard disk, optical disk, Flash drives, tapes, databases that can be accessed over the Internet, or storage media with the same functions can be easily thought of by those familiar with the art. After the non-temporary computer-readable recording medium is loaded and executed by the computer or controller, the method described above can be completed.

綜上所述，本發明可以於塑膜熱封的過程中自動控制複數個熱封裝置校準至正確的位置，減少停機造成的時間、人力減損。此外，發明可以大幅地提升最終成品的良率，提升成品的美觀性及細緻度。In summary, the present invention can automatically control a plurality of heat-sealing devices to be calibrated to the correct positions during the process of plastic film heat-sealing, reducing time and labor loss caused by shutdown. In addition, the invention can greatly improve the yield of the final finished product, and enhance the aesthetics and detail of the finished product.

以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之一較佳實施例而已，當不能以此限定本發明實施之範圍，即凡依本發明申請專利範圍所作之均等變化與修飾，皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, everything made in accordance with the scope of the patent application of the present invention is equal Changes and modifications should still fall within the scope of the patent of the present invention.

100:自動校準式熱封陣列系統100: Auto-calibration heat sealing array system

10:傳送裝置10: Conveyor

20:熱封裝置20: Heat sealing device

21:位置校準單元21: Position calibration unit

20A~20F:熱封裝置20A~20F: Heat sealing device

30:超音波熔接裝置30: Ultrasonic welding device

31:位置校準單元31: Position calibration unit

40:冷卻裝置40: Cooling device

41:位置校準單元41: Position calibration unit

40A、40B:冷卻裝置40A, 40B: cooling device

50A:第一感測器50A: the first sensor

50B:第二感測器50B: second sensor

60:控制器60: Controller

70:餵料裝置70: Feeding device

PT:加工路徑PT: Processing path

S1~S4:步驟S1~S4: steps

圖1，為本發明自動校準式熱封陣列系統的方塊示意圖。Fig. 1 is a block diagram of the automatic calibration type heat-sealing array system of the present invention.

圖2，為本發明自動校準式熱封陣列系統的工作狀態示意圖(一)。Figure 2 is a schematic diagram (1) of the working state of the auto-calibration heat-sealing array system of the present invention.

圖3，為本發明自動校準式熱封陣列系統的工作狀態示意圖(二)。Figure 3 is a schematic diagram (2) of the working state of the auto-calibration heat-sealing array system of the present invention.

圖4，為本發明自動校準式熱封陣列系統的工作狀態示意圖(三)。Figure 4 is a schematic diagram (3) of the working state of the auto-calibration heat-sealing array system of the present invention.

圖5，為本發明自動校準方法的流程示意圖。Figure 5 is a schematic flow chart of the automatic calibration method of the present invention.

100:自動校準式熱封陣列系統 100: Auto-calibration heat sealing array system

10:傳送裝置 10: Conveyor

20:熱封裝置 20: Heat sealing device

21:位置校準單元 21: Position calibration unit

30:超音波熔接裝置 30: Ultrasonic welding device

31:位置校準單元 31: Position calibration unit

40:冷卻裝置 40: Cooling device

41`:位置校準單元 41`: Position calibration unit

50A:第一感測器 50A: the first sensor

50B:第二感測器 50B: second sensor

60:控制器 60: Controller

70:餵料裝置 70: Feeding device

PT:加工路徑 PT: Processing path

Claims (11)

一種自動校準式熱封陣列系統，係用以重覆對連續塑膜的相同位置進行分段漸次熱封，該自動校準式熱封陣列系統包括：一傳送裝置，依據預先設定輸送速度將該連續塑膜沿一加工路徑移動；複數個熱封裝置，依序間隔排列設置於該加工路徑上，每一該熱封裝置包括一位置校準單元，該位置校準單元依據所接收到的訊號沿該加工路徑的方向上移動；一控制器，連接或耦接至該複數個位置校準單元，該控制器係依據輸入的誤差偏移量輸出一或複數個校準訊息至該位置校準單元以校準該熱封裝置的位置；其中，該控制器於運行狀態時，即時由一第一感測器及一第二感測器檢測該連續塑膜加工位置的該誤差偏移量，於接收到該誤差偏移量時，該控制器啟動運行累進模式，將該誤差偏移量依據順序累計加入各基準參數值，依據修正過後的該基準參數值同步校準該熱封裝置的位置。 An auto-calibration heat-sealing array system is used to repeatedly heat-seal the same position of a continuous plastic film in stages. The auto-calibration heat-sealing array system includes: a conveying device that performs continuous heat sealing according to a preset conveying speed. The plastic film moves along a processing path; a plurality of heat-sealing devices are arranged on the processing path at intervals in sequence, and each of the heat-sealing devices includes a position calibration unit, which is processed along the processing path according to the received signal Move in the direction of the path; a controller, connected or coupled to the plurality of position calibration units, the controller outputs one or more calibration messages to the position calibration unit according to the input error offset to calibrate the heat seal The position of the device; wherein, when the controller is in operation, a first sensor and a second sensor detect the error offset of the continuous plastic film processing position immediately, and then receive the error offset When measuring, the controller starts the running progressive mode, adds the error offset to each reference parameter value according to the sequence accumulation, and synchronizes the position of the heat sealing device according to the corrected reference parameter value. 如申請專利範圍第1項所述的自動校準式熱封陣列系統，更進一步包括一或複數個冷卻裝置，依序間隔排列設置於該加工路徑對應於該熱封裝置的後端方向上，每一該冷卻裝置包括一位置校準單元，該位置校準單元依據該控制器輸出的訊號沿該加工路徑的方向上移動。 For example, the auto-calibration heat-sealing array system described in item 1 of the scope of patent application further includes one or more cooling devices arranged at intervals in sequence in the direction of the processing path corresponding to the rear end of the heat-sealing device, each A cooling device includes a position calibration unit that moves in the direction of the processing path according to the signal output by the controller. 如申請專利範圍第1項所述的自動校準式熱封陣列系統，該第一感測器及該第二感測器分別設置於複數個該熱封裝置前端及後端，該控制器係連接至該第一感測器及該第二感測器並依據該第一感測器及該第二感測器回傳的數值輸出一或複數個該校準訊息至該位置校準單元以校準該熱封裝置的位置。 For the auto-calibration heat-sealing array system described in item 1 of the scope of patent application, the first sensor and the second sensor are respectively arranged at the front and back ends of the plurality of heat-sealing devices, and the controller is connected To the first sensor and the second sensor and output one or more calibration messages to the position calibration unit to calibrate the heat according to the values returned by the first sensor and the second sensor The location of the sealing device. 如申請專利範圍第3項所述的自動校準式熱封陣列系統，其中該第一感測器及/或該第二感測器係為光電感測器或攝影機。 According to the auto-calibration heat-sealing array system described in item 3 of the scope of patent application, the first sensor and/or the second sensor are photoelectric sensors or cameras. 如申請專利範圍第1項所述的自動校準式熱封陣列系統，更進一步包括一設置於複數個該熱封裝置前端方向上的超音波熔接裝置，該超音波熔接裝置包括一位置校準單元，該位置校準單元依據所接收到的訊號沿該加工路徑的方向上移動。 The auto-calibration heat-sealing array system described in item 1 of the scope of patent application further includes an ultrasonic welding device arranged in the front end direction of a plurality of the heat-sealing devices, and the ultrasonic welding device includes a position calibration unit, The position calibration unit moves in the direction of the processing path according to the received signal. 如申請專利範圍第5項所述的自動校準式熱封陣列系統，其中該熱封裝置彼此間的間距保持兩個單位級距，該超音波熔接裝置與最後一個該熱封裝置的間距保持一個單位級距。 The auto-calibration heat-sealing array system as described in item 5 of the scope of patent application, wherein the distance between the heat-sealing devices is kept at two unit steps, and the distance between the ultrasonic welding device and the last heat-sealing device is kept by one Unit level distance. 如申請專利範圍第1項所述的自動校準式熱封陣列系統，其中該熱封裝置係為直下式熱封機。 The automatic calibration type heat-sealing array system described in item 1 of the scope of patent application, wherein the heat-sealing device is a direct-type heat-sealing machine. 如申請專利範圍第1項所述的自動校準式熱封陣列系統，其中該傳送裝置係為一或複數個由伺服馬達控制轉動行程的旋轉輥。 According to the auto-calibration heat-sealing array system described in item 1 of the scope of patent application, the conveying device is one or more rotating rollers whose rotation stroke is controlled by a servo motor. 一種自動校準方法，配合如申請專利範圍第1至8項所述的自動校準式熱封陣列系統，該自動校準方法包括：該控制器於運行狀態時；於接收到該誤差偏移量時，啟動運行同動模式，將輸入的該誤差偏移量同步加入所有位置校準單元的基準參數值，依據修正過後的該基準參數值同步校準該熱封裝置的位置。 An automatic calibration method that cooperates with the automatic calibration heat-sealing array system described in items 1 to 8 of the scope of the patent application. The automatic calibration method includes: when the controller is in operation; when the error offset is received, Start the simultaneous operation mode, add the input error offset to the reference parameter values of all position calibration units simultaneously, and calibrate the position of the heat sealing device synchronously according to the corrected reference parameter value. 一種自動校準方法，配合如申請專利範圍第3至8項所述的自動校準式熱封陣列系統，該自動校準方法包括：該控制器於運行狀態時，即時由該第一感測器及該第二感測器檢測該連續塑膜加工位置的該誤差偏移量；於接收到該誤差偏移量時，該控制器啟動運行累進模式，將該誤差偏移量依據順序累計加入各基準參數值，依據修正過後的該基準參數值同步校準該熱封裝置的位置。 An automatic calibration method that cooperates with the automatic calibration heat-sealing array system described in items 3 to 8 of the scope of the patent application. The automatic calibration method includes: when the controller is in operation, the first sensor and the The second sensor detects the error offset of the continuous plastic film processing position; upon receiving the error offset, the controller starts the running progressive mode, and adds the error offset to each reference parameter according to the order. According to the corrected reference parameter value, the position of the heat-sealing device is calibrated synchronously. 一種非暫存式電腦可讀取記錄媒體，經由電腦或控制器載入並執行後，係可完成如申請專利範圍第9至10項中任一項所述的方法。A non-temporary computer-readable recording medium, loaded and executed by a computer or a controller, can complete the method described in any one of the 9th to 10th patent applications.
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JP2016043523A (en) * 2014-08-20 2016-04-04 大日本印刷株式会社 Bag-making machine
CN205273977U (en) * 2015-11-27 2016-06-01 楚天科技股份有限公司 Mould membrane packagine machine and seal membrane device

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JP2016043523A (en) * 2014-08-20 2016-04-04 大日本印刷株式会社 Bag-making machine
CN205273977U (en) * 2015-11-27 2016-06-01 楚天科技股份有限公司 Mould membrane packagine machine and seal membrane device

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