TWI698319B - Substrate breaking device and substrate breaking method - Google Patents

Substrate breaking device and substrate breaking method Download PDF

Info

Publication number
TWI698319B
TWI698319B TW105111475A TW105111475A TWI698319B TW I698319 B TWI698319 B TW I698319B TW 105111475 A TW105111475 A TW 105111475A TW 105111475 A TW105111475 A TW 105111475A TW I698319 B TWI698319 B TW I698319B
Authority
TW
Taiwan
Prior art keywords
substrate
pressing
bonded
scribe line
end portion
Prior art date
Application number
TW105111475A
Other languages
Chinese (zh)
Other versions
TW201714721A (en
Inventor
西尾仁孝
高松生芳
上野勉
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201714721A publication Critical patent/TW201714721A/en
Application granted granted Critical
Publication of TWI698319B publication Critical patent/TWI698319B/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)

Abstract

在貼合基板之分斷時，壓入量之最佳範圍較大，能確實地形成 良好之裂縫，且能容易地除去端材。 When the bonding substrate is broken, the optimal range of the press-in amount is large, and it can be formed reliably Good cracks, and the end material can be easily removed.

此裝置係貼合基板G之分斷裝置，該貼合基板G具有於表 面形成有用於將端部切離之刻劃線S之第1基板G1、以及貼合於第1基板G1之背面之第2基板G2。該分斷裝置具備按壓部11以及吸附部12。按壓部11自第1基板G1側按壓成為端材之端部GL，以沿刻劃線S將端部GL分斷。吸附部12吸附以按壓部11分斷之端部GL，以自第1基板G1取出端部GL。 This device is a cutting device for the bonded substrate G. The bonded substrate G is shown in the table The surface is formed with the first substrate G1 of the scribe line S for cutting off the end, and the second substrate G2 bonded to the back surface of the first substrate G1. This breaking device includes a pressing part 11 and a suction part 12. The pressing portion 11 presses the end portion GL that becomes the end material from the side of the first substrate G1 to divide the end portion GL along the scribe line S. The suction part 12 sucks the end part GL divided by the pressing part 11 to take out the end part GL from the first substrate G1.

Description

基板分斷裝置及基板分斷方法 Substrate breaking device and substrate breaking method

本發明係關於一種基板分斷裝置，特別係關於一種貼合基板之分斷裝置，該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於該第1基板之背面之第2基板。此外，本發明係關於一種基板分斷方法。 The present invention relates to a substrate cutting device, and more particularly to a cutting device of a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and is bonded to The second substrate on the back of the first substrate. In addition, the present invention relates to a substrate breaking method.

液晶裝置係藉由貼合基板構成，該貼合基板係以使液晶層介於其間之方式以密封材貼合第1基板與第2基板而成者。該貼合基板以生產性觀點來看，首先被製作成大片狀態，再藉由將其分斷得到複數個貼合基板。若詳細說明此分斷方法，則係先於貼合基板之第1基板側之面形成刻劃線，接著自第2基板側按壓貼合基板使其彎曲，進而使第1基板沿刻劃線裂斷。而後於貼合基板之第2基板側之面形成刻劃線，接著自第1基板側按壓貼合基板使其彎曲，進而使第2基板沿刻劃線裂斷。 The liquid crystal device is composed of a bonded substrate that is formed by bonding a first substrate and a second substrate with a sealing material with a liquid crystal layer interposed therebetween. From the viewpoint of productivity, the laminated substrate is first produced in a large-sized state, and then divided to obtain a plurality of laminated substrates. To describe this method in detail, the scribe line is formed on the first substrate side surface of the bonded substrate, and then the bonded substrate is pressed from the second substrate side to bend it, and then the first substrate is along the scribe line Cracked. Then, a scribe line is formed on the surface of the second substrate side of the bonded substrate, and then the bonded substrate is pressed from the first substrate side to bend it, and the second substrate is broken along the scribe line.

於以上方法中，在裂斷第1基板後，需要使貼合基板之表背面反轉，再進行第2基板之裂斷。專利文獻1中揭示了一種不需像這樣使貼合基板之表背面反轉之裝置。 In the above method, after the first substrate is fractured, the front and back surfaces of the bonded substrate need to be reversed, and then the second substrate is fractured. Patent Document 1 discloses a device that does not need to reverse the front and back of the bonded substrate in this way.

專利文獻1之裝置具備第1裂斷單元及第2裂斷單元。並且，藉由搬送單元搬送之貼合基板，首先藉由第1裂斷單元裂斷第1基板，接著藉由第2裂斷單元裂斷第2基板。如此，藉由並列配置於搬送方向之 第1裂斷單元及第2裂斷單元，不需使貼合基板之表背面反轉，即能裂斷第1基板及第2基板。 The device of Patent Document 1 includes a first breaking unit and a second breaking unit. In addition, the bonded substrate conveyed by the conveying unit first breaks the first substrate by the first breaking unit, and then breaks the second substrate by the second breaking unit. In this way, by arranging in parallel in the conveying direction The first breaking unit and the second breaking unit can break the first substrate and the second substrate without reversing the front and back of the bonded substrate.

[先前技術文獻][Prior Technical Literature] [專利文獻][Patent Literature]

[專利文獻1]日本特開2014-200940號公報。 [Patent Document 1] JP 2014-200940 A.

於專利文獻1之裝置中，第1裂斷單元及第2裂斷單元在上下方向之對向位置具有裂斷棒與備用棒。然而，於此種使用裂斷棒與備用棒之方法中，裂斷棒之壓入量之最佳範圍狹小。例如，於厚度為0.2mm之玻璃基板中，最佳壓入量為0.2mm~0.3mm。並且，若壓入量較此範圍淺，則不會形成裂縫，反之若較深，則有非預期形狀之裂縫形成至相反側之基板為止之情況。 In the device of Patent Document 1, the first rupture unit and the second rupture unit have a rupture rod and a spare rod at positions facing each other in the vertical direction. However, in this method of using the cracking rod and the spare rod, the optimum range of the pressing amount of the cracking rod is narrow. For example, in a glass substrate with a thickness of 0.2mm, the optimal press-in amount is 0.2mm~0.3mm. In addition, if the indentation amount is shallower than this range, cracks will not be formed, and if it is deep, cracks of an unexpected shape may be formed to the substrate on the opposite side.

本發明之課題在於，在貼合基板之分斷時，壓入量之最佳範圍較大，能確實地形成良好之裂縫，且能容易地除去端材。 The subject of the present invention is that the optimum range of the press-in amount is large when the bonded substrate is broken, good cracks can be formed reliably, and the end material can be easily removed.

(1)本發明一方面提供一種基板分斷裝置，其係貼合基板之分斷裝置，該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於該第1基板之背面之第2基板。該分斷裝置具備按壓部以及吸附部。按壓部自第1基板側按壓端部，以沿刻劃線將端部分斷。吸附部吸附以按壓部分斷之端部，以自第1基板取出端部。 (1) One aspect of the present invention provides a substrate cutting device, which is a cutting device for a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and a sticker The second substrate that fits on the back of the first substrate. The breaking device includes a pressing part and a suction part. The pressing portion presses the end portion from the side of the first substrate to break the end portion along the scribe line. The suction part sucks and presses the partially broken end to take out the end from the first substrate.

此裝置，並非如現有技術般自與形成有刻劃線之側相反之側進行按壓，反之係自形成有刻劃線之側按壓基板。並且，利用吸附部吸附藉由按壓而分斷之端部，並自基板取出。 This device does not press from the side opposite to the side on which the scribe line is formed as in the prior art, but instead presses the substrate from the side where the scribe line is formed. In addition, the end portion broken by pressing is adsorbed by the suction portion, and taken out from the substrate.

藉由此種分斷，與現有技術相比，壓入量之最佳範圍較大，能確實地形成良好之裂縫。此外，藉由吸附部，能容易地自基板除去已分斷之端部。 With this breaking, compared with the prior art, the optimum range of the press-in amount is larger, and a good crack can be formed reliably. In addition, with the suction part, the divided end can be easily removed from the substrate.

(2)較佳為，該裝置更具備載置有貼合基板之載台、以及能相對於載台往水平方向及上下方向相對移動之頭部。並且，按壓部及吸附部配置於頭部。於此，按壓部及吸附部係作為一體設於頭部，因此可使裝置小型化。 (2) Preferably, the device further includes a stage on which the laminated substrate is placed, and a head that can move relative to the stage in the horizontal and vertical directions. In addition, the pressing part and the suction part are arranged on the head. Here, the pressing part and the suction part are integrally provided on the head, so the device can be miniaturized.

(3)較佳為，貼合基板係以刻劃線位於較載台之端部更外側之方式載置於載台上。於此，藉由以按壓部按壓端部，能沿刻劃線容易地進行分斷。 (3) Preferably, the bonded substrate is placed on the carrier in such a way that the scribe line is located outside the end of the carrier. Here, by pressing the end portion with the pressing portion, it can be easily broken along the scribe line.

(4)較佳為，按壓部具有按壓端部之按壓面，吸附部具有形成為較按壓面往貼合基板側突出且吸附端部之吸附面。 (4) Preferably, the pressing portion has a pressing surface that presses the end portion, and the suction portion has a suction surface formed to protrude toward the bonding substrate side from the pressing surface and suck the end portion.

於此，若將按壓部之按壓面與吸附部之吸附面設定為相同高度(亦即同一平面)，則在以吸附部吸附已分斷之端部時，按壓部會與基板之其他部分之表面接觸。此時，按壓部所接觸之基板表面有損傷之虞。 Here, if the pressing surface of the pressing part and the suction surface of the suction part are set to the same height (that is, the same plane), when the divided end is sucked by the suction part, the pressing part will be in contact with other parts of the substrate. Surface contact. At this time, the surface of the substrate contacted by the pressing portion may be damaged.

據此，與按壓面相比，使吸附面較為突出。如此，在藉由吸附部之吸附面吸附端部時，能避免按壓部之按壓面碰到基板表面。 According to this, the suction surface is made more protruding than the pressing surface. In this way, when the end portion is sucked by the suction surface of the suction portion, the pressing surface of the pressing portion can be prevented from touching the surface of the substrate.

(5)較佳為，按壓部係由按壓端部時能彈性變形之彈性構件形成。 (5) Preferably, the pressing portion is formed of an elastic member that can elastically deform when the end portion is pressed.

(6)較佳為，吸附部係由多孔介質材料形成。 (6) Preferably, the adsorption part is formed of a porous medium material.

(7)本發明一方面提供一種基板分斷方法，其係貼合基板之分斷方法，該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於該第1基板之背面之第2基板。並且，該方法包括以下步驟。 (7) One aspect of the present invention provides a substrate cutting method, which is a method of cutting a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and a bonded substrate. The second substrate that fits on the back of the first substrate. And, the method includes the following steps.

a：以使第1基板位於上方，且刻劃線位於較載台之端部更外側之方式將貼合基板載置於載台上之步驟。 a: The step of placing the bonded substrate on the stage in such a way that the first substrate is located above and the scribe line is located more outside than the end of the stage.

b：自上方按壓第1基板之端部，以沿刻劃線將端部分斷之步驟。 b: A step of pressing the end of the first substrate from above to break the end along the scribe line.

c：吸附以按壓部分斷之端部，自第1基板取出端部之步驟。 c: A step of sucking to press the partially broken end and removing the end from the first substrate.

如上所述之本發明，在貼合基板之分斷時，壓入量之最佳範圍較大，能確實地形成良好之裂縫，且能容易地除去端材。 In the present invention as described above, the optimum range of the press-in amount is large when the bonded substrate is broken, a good crack can be formed reliably, and the end material can be easily removed.

1‧‧‧頭部 1‧‧‧Head

2‧‧‧載台 2‧‧‧ Stage

11‧‧‧按壓部 11‧‧‧Pressing part

11a‧‧‧按壓面 11a‧‧‧Pressing surface

12‧‧‧吸附部 12‧‧‧Adsorption part

12a‧‧‧吸附面 12a‧‧‧Adsorption surface

G‧‧‧貼合基板 G‧‧‧Laminated substrate

G1‧‧‧第1基板 G1‧‧‧First substrate

G2‧‧‧第2基板 G2‧‧‧Second substrate

GL‧‧‧端材 GL‧‧‧End Material

S‧‧‧刻劃線 S‧‧‧Scribe

圖1係本發明一實施形態之基板分斷裝置之示意圖。 Fig. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention.

圖2係用以說明基板分斷方法之按壓步驟之示意圖。 Fig. 2 is a schematic diagram for explaining the pressing step of the substrate breaking method.

圖3係用以說明基板分斷方法之基板移動步驟之示意圖。 Fig. 3 is a schematic diagram for explaining the substrate moving step of the substrate breaking method.

圖4係用以說明基板分斷方法之吸附步驟之示意圖。 Fig. 4 is a schematic diagram for explaining the adsorption step of the substrate breaking method.

圖5係用以說明基板分斷方法之端材取出步驟之示意圖。 Fig. 5 is a schematic diagram for explaining the end material removal step of the substrate breaking method.

圖6係用以說明基板分斷方法之端材排出步驟之示意圖。 Fig. 6 is a schematic diagram for explaining the end material discharge step of the substrate breaking method.

圖1係本發明一實施形態之基板分斷裝置之示意圖。此裝置係用於除去位於貼合基板G之一方表面之端部之端材GL之裝置。貼合基板G如圖1所示，由第1基板G1、以及貼合於第1基板G1之第2基板G2構成。於此，於第1基板G1之表面形成有刻劃線S，端材GL沿此刻劃線S被除去。 Fig. 1 is a schematic diagram of a substrate cutting device according to an embodiment of the present invention. This device is used to remove the end material GL located at the end of one surface of the bonded substrate G. As shown in FIG. 1, the bonded substrate G is composed of a first substrate G1 and a second substrate G2 bonded to the first substrate G1. Here, a scribe line S is formed on the surface of the first substrate G1, and the end material GL is removed along the scribe line S.

分斷裝置具有複數個頭部1、以及載台2。複數個頭部1於圖1之紙面垂直方向並列支撐於未圖示之門架等支撐機構。各頭部1藉由驅動機構M1而昇降自如，且具有按壓部11、以及吸附部12。載台2以第1基板G1位於上方之方式載置有貼合基板G。又，貼合基板G係以端材GL位於較載台2之端面更外側之方式，即端材GL之下方不存在載台2之載置面之方式配置。載台2藉由包含驅動馬達或導引機構等之驅動機構M2而能移動於圖1之左右方向。 The breaking device has a plurality of heads 1 and a carrier 2. A plurality of heads 1 are supported side by side by a supporting mechanism such as a door frame (not shown) in the vertical direction of the paper in FIG. 1. Each head 1 is movable up and down by a driving mechanism M1, and has a pressing part 11 and a suction part 12. The stage 2 mounts the bonded substrate G so that the first substrate G1 is positioned above. In addition, the bonded substrate G is arranged in such a manner that the end material GL is located more outside than the end surface of the carrier 2, that is, the placement surface of the carrier 2 does not exist under the end material GL. The stage 2 can be moved in the left-right direction of FIG. 1 by a drive mechanism M2 including a drive motor or a guide mechanism.

頭部1之按壓部11對貼合基板G，自第1基板G1側按壓端材GL。藉此，端材GL沿刻劃線S被分斷。按壓部11由剛性較第1基板G1低之樹脂等形成。因此，按壓部11在按壓端材GL時能彈性變形。 The pressing portion 11 of the head 1 presses the end material GL from the side of the first substrate G1 against the bonded substrate G. Thereby, the end material GL is divided along the scribe line S. The pressing portion 11 is formed of resin or the like having lower rigidity than the first substrate G1. Therefore, the pressing portion 11 can elastically deform when pressing the end material GL.

吸附部12配置於按壓部11之側方(沿載台2之移動方向之側方)。吸附部12由多孔介質材料形成，透過設於頭部1內部之通路等及外部配管3連接於真空泵P。 The suction part 12 is arranged on the side of the pressing part 11 (the side along the moving direction of the stage 2). The adsorption part 12 is formed of a porous medium material, and is connected to the vacuum pump P through a passage or the like provided inside the head 1 and an external pipe 3.

按壓部11之下面成為與端材GL接觸並往下方按壓之按壓面11a。又，吸附部12之下面形成為較按壓面11a往下方(第1基板G1側)突出，且成為吸附端材GL之吸附面12a。 The lower surface of the pressing portion 11 becomes a pressing surface 11a that is in contact with the end material GL and is pressed downward. In addition, the lower surface of the suction portion 12 is formed to protrude downward (on the side of the first substrate G1) from the pressing surface 11a, and becomes the suction surface 12a for sucking the end material GL.

接著，說明自貼合基板G分斷第1基板G1之端材GL，並 自第1基板G1取出已分斷之端材GL之方法。 Next, it is explained that the end material GL of the first substrate G1 is separated from the bonded substrate G, and A method of taking out the broken end material GL from the first substrate G1.

首先，準備貼合第1基板G1及第2基板G2而成之貼合基板G，藉由未圖示之刻劃線形成裝置，於第1基板G1之表面(未貼合第2基板G2之側之面)形成刻劃線S。 First, prepare a bonded substrate G formed by bonding the first substrate G1 and the second substrate G2, and apply a scribe line forming device not shown on the surface of the first substrate G1 (the second substrate G2 is not bonded). The side surface) forms a scribe line S.

接著，將貼合基板G載置於載台2之載置面。於此，在將貼合基板G載置於載台2上時，以如下方式載置。即如圖1所示，以使於表面形成有刻劃線之第1基板位於上方，且刻劃線S及端部(成為端材之部分)GL位於較載台2之載置面更外側之方式配置貼合基板G。進一步以端材GL位於頭部1之按壓部11之正下方，且遠離吸附部12之方式(以頭部1下降時，吸附部12不與端材GL接觸之方式)進行配置。 Next, the bonded substrate G is placed on the placement surface of the stage 2. Here, when mounting the bonded substrate G on the stage 2, it is mounted as follows. That is, as shown in FIG. 1, the first substrate on which the scribed line is formed on the surface is located above, and the scribed line S and the end portion (the part that becomes the end material) GL are located outside the mounting surface of the stage 2 The way to configure the bonded substrate G. Furthermore, the end material GL is arranged directly below the pressing part 11 of the head 1 and away from the suction part 12 (when the head 1 is lowered, the suction part 12 does not contact the end material GL).

接著，如圖2所示，使頭部1下降，並藉由按壓部11將端材GL往下方按壓。此時，由於端材GL之下方不存在載台2之載置面，因此藉由以按壓部11按壓端材GL部分，於第1基板G1以刻劃線S為起點形成裂縫，端材GL被完全切割。 Next, as shown in FIG. 2, the head 1 is lowered, and the end material GL is pressed downward by the pressing part 11. At this time, since there is no placement surface of the stage 2 under the end material GL, by pressing the end material GL portion with the pressing portion 11, a crack is formed in the first substrate G1 starting from the scribe line S, and the end material GL Was completely cut.

其後，如圖3所示，使頭部1上升，而後進一步使載台2往圖3之左方向移動。此時，以使頭部1之吸附部12位於端材GL之正上方之方式移動載台2。 Thereafter, as shown in FIG. 3, the head 1 is raised, and then the stage 2 is further moved to the left in FIG. 3. At this time, the stage 2 is moved so that the suction part 12 of the head 1 is located directly above the end material GL.

接著，如圖4所示，使頭部1下降，使吸附部12抵接於端材GL。藉此，端材GL被吸附保持於吸附部12。於此狀態下，如圖5所示，使頭部1上升。藉此，自第1基板G1切離基材GL。 Next, as shown in FIG. 4, the head 1 is lowered, and the adsorption|suction part 12 is contact|abutted to the end material GL. Thereby, the end material GL is sucked and held by the sucking portion 12. In this state, as shown in Fig. 5, the head 1 is raised. Thereby, the base material GL is cut away from the first substrate G1.

其後，如圖6所示，使載台2後退(往圖之右方向移動)，以使貼合基板G自頭部1之下方退出。接著，只要解除以吸附部12進行之 吸附，端材GL即落下至端材置放處。 After that, as shown in FIG. 6, the stage 2 is retreated (moved to the right in the figure) so that the bonded substrate G is withdrawn from below the head 1. Then, just release the Adsorption, the end material GL will drop to the end material placement place.

於如上所述本實施形態之方法中，例如，於貼合基板之厚度為0.2mm之情況，壓入量之最佳範圍，相較習知方法中之0.2mm~0.3mm，擴大至0.2mm~0.5mm。 In the method of this embodiment as described above, for example, when the thickness of the bonded substrate is 0.2mm, the optimum range of the pressing amount is expanded to 0.2mm compared to the 0.2mm~0.3mm in the conventional method ~0.5mm.

又，由於使按壓面11a與吸附面12a之高度不同，並使吸附面12a位於較下方處，因此於藉由吸附部12吸附端材GL時，能避免按壓面11a接觸第1基板G1之表面。據此，能避免第1基板G1之表面因按壓部11而損傷。 In addition, since the pressing surface 11a and the suction surface 12a have different heights, and the suction surface 12a is located lower, when the end material GL is sucked by the suction portion 12, the pressing surface 11a can be prevented from contacting the surface of the first substrate G1 . According to this, it is possible to prevent the surface of the first substrate G1 from being damaged by the pressing portion 11.

[其他實施形態] [Other embodiments]

本發明不限定於如上所述實施形態，可在不脫離本發明之範圍內進行各種變形或修正。 The present invention is not limited to the above-mentioned embodiments, and various modifications or corrections can be made without departing from the scope of the present invention.

於前述實施形態中，雖將按壓部及吸附部設於單一頭部，但按壓部及吸附部亦可設於不同構件。 In the foregoing embodiment, although the pressing part and the suction part are provided in a single head, the pressing part and the suction part may be provided in different members.

1‧‧‧頭部 1‧‧‧Head

2‧‧‧載台 2‧‧‧ Stage

3‧‧‧外部配管 3‧‧‧External piping

11‧‧‧按壓部 11‧‧‧Pressing part

11a‧‧‧按壓面 11a‧‧‧Pressing surface

12‧‧‧吸附部 12‧‧‧Adsorption part

12a‧‧‧吸附面 12a‧‧‧Adsorption surface

G‧‧‧貼合基板 G‧‧‧Laminated substrate

G1‧‧‧第1基板 G1‧‧‧First substrate

G2‧‧‧第2基板 G2‧‧‧Second substrate

GL‧‧‧端材 GL‧‧‧End Material

S‧‧‧刻劃線 S‧‧‧Scribe

P‧‧‧真空泵 P‧‧‧Vacuum pump

M1、M2‧‧‧驅動機構 M1, M2‧‧‧Drive mechanism

Claims (7)

一種基板分斷裝置，其係貼合基板之分斷裝置，該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於前述第1基板之背面之第2基板，該分斷裝置具備：按壓部，自前述第1基板側按壓前述端部，以沿前述刻劃線將前述端部分斷；以及吸附部，吸附以前述按壓部分斷之前述端部，以自前述第1基板取出前述端部。 A substrate cutting device, which is a cutting device for a bonded substrate. The bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and a back surface bonded to the first substrate A second substrate, the breaking device includes: a pressing portion that presses the end portion from the first substrate side to break the end portion along the scribe line; and a suction portion that sucks the end broken by the pressing portion Part to take out the end part from the first substrate. 如申請專利範圍第1項之基板分斷裝置，其更具備：載台，載置有前述貼合基板；以及頭部，能相對於前述載台往水平方向及上下方向相對移動；其中，前述按壓部及前述吸附部配置於前述頭部。 For example, the substrate cutting device of the first item of the scope of the patent application is further equipped with: a stage on which the aforementioned laminated substrate is placed; and a head capable of moving relative to the aforementioned stage in the horizontal and vertical directions; wherein, the aforementioned The pressing part and the suction part are arranged on the head. 如申請專利範圍第1或2項之基板分斷裝置，其中，前述貼合基板係以前述刻劃線位於較前述載台之端部更外側之方式載置於前述載台上。 For example, the substrate cutting device of item 1 or 2 of the scope of patent application, wherein the bonded substrate is placed on the carrier in such a way that the scribe line is located more outside than the end of the carrier. 如申請專利範圍第1或2項之基板分斷裝置，其中，前述按壓部具有按壓前述端部之按壓面，前述吸附部具有形成為較前述按壓面往前述貼合基板側突出且吸附前述端部之吸附面。 For example, the substrate cutting device of claim 1 or 2, wherein the pressing portion has a pressing surface that presses the end portion, and the suction portion has a pressing surface formed to protrude toward the laminated substrate side from the pressing surface and suck the end Department of adsorption surface. 如申請專利範圍第1或2項之基板分斷裝置，其中，前述按壓部係由按壓前述端部時能彈性變形之彈性構件形成。 For example, the substrate cutting device according to the first or second patent application, wherein the pressing portion is formed by an elastic member that can elastically deform when the end portion is pressed. 如申請專利範圍第1或2項之基板分斷裝置，其中，前述吸附部係由 多孔介質材料形成。 For example, the substrate cutting device of item 1 or 2 of the scope of patent application, wherein the aforementioned adsorption part is made of Porous media material is formed. 一種基板分斷方法，其係貼合基板之分斷方法，該貼合基板具有於表面形成有用於將端部切離之刻劃線之第1基板、以及貼合於前述第1基板之背面之第2基板，該方法包括以下步驟：以使前述第1基板位於上方，且前述刻劃線位於較載台之端部更外側之方式將前述貼合基板載置於載台上之步驟；自上方按壓前述第1基板之端部，以沿前述刻劃線將前述端部分斷之步驟；以及吸附以前述按壓部分斷之前述端部，自前述第1基板取出前述端部之步驟。 A substrate cutting method, which is a cutting method of a bonded substrate, the bonded substrate has a first substrate with a scribe line for cutting off the end formed on the surface, and a back surface bonded to the first substrate For the second substrate, the method includes the following steps: placing the bonded substrate on the stage in such a way that the first substrate is located above and the scribe line is located more outside than the end of the stage; The step of pressing the end portion of the first substrate from above to break the end portion along the scribe line; and the step of sucking the end portion broken by the pressing portion and removing the end portion from the first substrate.
TW105111475A 2015-07-03 2016-04-13 Substrate breaking device and substrate breaking method TWI698319B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015134087A JP6582630B2 (en) 2015-07-03 2015-07-03 Substrate cutting apparatus and substrate cutting method
JPJP2015-134087 2015-07-03

Publications (2)

Publication Number Publication Date
TW201714721A TW201714721A (en) 2017-05-01
TWI698319B true TWI698319B (en) 2020-07-11

Family

ID=57726358

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105111475A TWI698319B (en) 2015-07-03 2016-04-13 Substrate breaking device and substrate breaking method

Country Status (4)

Country Link
JP (1) JP6582630B2 (en)
KR (1) KR20170004841A (en)
CN (1) CN106316089B (en)
TW (1) TWI698319B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017095294A (en) * 2015-11-20 2017-06-01 三星ダイヤモンド工業株式会社 Substrate cutting device
JP2019107779A (en) * 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 Pickup unit
JP2019109292A (en) * 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 End material removing device and end material removing method
KR102023453B1 (en) * 2018-03-28 2019-09-20 주식회사 카이테크 Apparatus and method for dividing substrate

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06205757A (en) * 1993-01-07 1994-07-26 Hitachi Ltd Nuclear magnetic resonance inspecting system device
JPH10268275A (en) * 1997-03-24 1998-10-09 Nec Kagoshima Ltd Glass substrate cutting method
JP2001163642A (en) * 1999-12-09 2001-06-19 Toyota Autom Loom Works Ltd Device for taking out laminated glass panel
CN1979278A (en) * 2005-12-08 2007-06-13 Nec液晶技术株式会社 Method of manufacturing liquid crystal display panel and apparatus for cutting liquid crystal display panel
US20100011928A1 (en) * 2008-07-16 2010-01-21 Jae-Pil Lee Flat display panel cutting apparatus
JP6205757B2 (en) 2013-03-07 2017-10-04 オムロン株式会社 Control system, control apparatus, image processing apparatus, and control method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06305757A (en) * 1993-04-16 1994-11-01 Citizen Watch Co Ltd Substrate glass dividing device for display panel
JP6163341B2 (en) 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 Break device
JP2014214054A (en) * 2013-04-25 2014-11-17 三星ダイヤモンド工業株式会社 Laminated substrate processing device
JP6105414B2 (en) * 2013-07-08 2017-03-29 三星ダイヤモンド工業株式会社 Bonded substrate processing equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06205757A (en) * 1993-01-07 1994-07-26 Hitachi Ltd Nuclear magnetic resonance inspecting system device
JPH10268275A (en) * 1997-03-24 1998-10-09 Nec Kagoshima Ltd Glass substrate cutting method
JP2001163642A (en) * 1999-12-09 2001-06-19 Toyota Autom Loom Works Ltd Device for taking out laminated glass panel
CN1979278A (en) * 2005-12-08 2007-06-13 Nec液晶技术株式会社 Method of manufacturing liquid crystal display panel and apparatus for cutting liquid crystal display panel
US20100011928A1 (en) * 2008-07-16 2010-01-21 Jae-Pil Lee Flat display panel cutting apparatus
JP6205757B2 (en) 2013-03-07 2017-10-04 オムロン株式会社 Control system, control apparatus, image processing apparatus, and control method

Also Published As

Publication number Publication date
CN106316089A (en) 2017-01-11
CN106316089B (en) 2021-04-02
KR20170004841A (en) 2017-01-11
JP6582630B2 (en) 2019-10-02
JP2017013418A (en) 2017-01-19
TW201714721A (en) 2017-05-01

Similar Documents

Publication Publication Date Title
TWI698319B (en) Substrate breaking device and substrate breaking method
US8029879B2 (en) Display device having pair of glass substrates and method for cutting it
JP4870046B2 (en) Sheet glass bonding method and apparatus
JP4996703B2 (en) Substrate cutting device
JP5210409B2 (en) Break device
JP6105414B2 (en) Bonded substrate processing equipment
TWI613057B (en) Substrate breaking device
TWI659849B (en) Peeling device and method of laminated body, and manufacturing method of electronic device
KR20150090813A (en) Scribing apparatus
KR20110067306A (en) Substrate dividing apparatus and method for dividing substrate using thereof
KR20190072464A (en) Pickup unit
KR102400550B1 (en) Breaking system for attached substrate
KR20140079310A (en) Device for peeling substrate, method for peeling substrate and method for producing electronic device
TWI739869B (en) Substrate breaking system
TW201540681A (en) Method for separating end material of brittle-material substrate and device thereof
JP2009083079A (en) Cutting device and method for pasted substrate
JP2017100281A (en) Laminated substrate processing device
US20080251557A1 (en) Scribing unit and apparatus for scribing panel with the scribing unit, and scribing method and method for manufacutring substrate
KR100642902B1 (en) Breaking system of glass
TWI681917B (en) Substrate transfer device
JP2017001191A (en) Dividing device for aligned substrate
JP2017100925A (en) Cutting device
JP2017001190A (en) Dividing device for aligned substrate
CN106045292A (en) Scribing apparatus
JP2015126017A (en) Separation unit