TWI692136B - Low-particle gas enclosure systems and methods - Google Patents
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本申請案主張2013年6月10日申請之美國臨時申請案第61/833,398號之權利。本申請案主張2013年12月4日申請之美國臨時申請案第61/911,934號之權利。本申請案主張2014年1月9日申請之美國臨時申請案第61/925,578號之權利。本申請案主張2014年4月23日申請之美國臨時申請案第61/983,417號之權利。本申請案為2014年3月11日申請之美國申請案第14/205,340號之部分接續申請案。2014年3月11日申請之美國申請案第14/205,340號為2013年3月13日申請且在2013年8月15日作為US 2013/0206058公開之美國申請案第13/802,304號之部分接續申請案。美國申請案第13/802,304號為2012年12月19日申請且在2013年9月26日作為US 2013/0252533公開之美國申請案第13/720,830號之部分接續申請案。美國申請案第13/720,830號主張2011年12月22日申請之美國臨時申請案第61/579,233號之權利。2012年12月19日申請之美國申請案第13/720,830號為2010年1月5日申請且在2013年2月26日作為US 8,383,202頒予之美國申請案第12/652,040號之部分接續申請案，美國申請案第12/652,040號為2008年6月13日申請且在2008年12月18日作為US 2008/0311307公開之美國申請案第12/139.391號之部分接續申請案。美國申請案第12/652,040號亦主張2009年1月5日申請之美國臨時申請案第61/142,575號之權利。本文中列出之所有交叉參考之申請案全部被以引用的方式併入。 This application claims the rights of US Provisional Application No. 61/833,398 filed on June 10, 2013. This application claims the rights of US Provisional Application No. 61/911,934 filed on December 4, 2013. This application claims the right of US Provisional Application No. 61/925,578 filed on January 9, 2014. This application claims the right of US Provisional Application No. 61/983,417 filed on April 23, 2014. This application is a partial continuation application of US Application No. 14/205,340 filed on March 11, 2014. U.S. Application No. 14/205,340 filed on March 11, 2014 is part of U.S. Application No. 13/802,304 filed on March 13, 2013 and published on August 15, 2013 as US 2013/0206058 Application. U.S. Application No. 13/802,304 is a partial continuation of U.S. Application No. 13/720,830 filed on December 19, 2012 and published on September 26, 2013 as US 2013/0252533. US Application No. 13/720,830 claims the right of US Provisional Application No. 61/579,233 filed on December 22, 2011. U.S. Application No. 13/720,830 filed on December 19, 2012 was filed on January 5, 2010 and was continued on February 26, 2013 as part of U.S. Application No. 12/652,040 issued to US 8,383,202 The US application No. 12/652,040 was filed on June 13, 2008 and was continued as part of US application No. 12/139.391 published on December 18, 2008 as US 2008/0311307. US Application No. 12/652,040 also claims the right of US Provisional Application No. 61/142,575 filed on January 5, 2009. All cross-reference applications listed in this article are incorporated by reference.
本教示係關於一種氣體封裝系統之各種具體實例，該氣體封裝系統具有一惰性、實質上低粒環境，用於在多種基板大小及基板材料上製造OLED面板。 This teaching is about various specific examples of a gas encapsulation system that has an inert, substantially low-grain environment and is used to manufacture OLED panels on a variety of substrate sizes and substrate materials.
對有機發光二極體(OLED)顯示器技術之潛力的興趣已受到OLED顯示器技術屬性驅動，該等屬性包括展現具有高飽和色彩、為高對比度、超薄、快速回應且具有能量效率之顯示面板。另外，包括可撓性聚合材料之多種基板材料可用於OLED顯示器技術之製造中。雖然用於小螢幕應用(主要用於蜂巢式電話)的顯示器之展現已足以強調該技術之潛力，但在按高良率按比例調整一系列基板格式的大量製造方面仍存在挑戰。 Interest in the potential of organic light-emitting diode (OLED) display technology has been driven by OLED display technology attributes, which include display panels with high saturation colors, high contrast, ultra-thin, fast response, and energy efficiency. In addition, various substrate materials including flexible polymer materials can be used in the manufacture of OLED display technology. Although the displays used for small screen applications (mainly used in cellular phones) have demonstrated enough to emphasize the potential of the technology, there are still challenges in mass manufacturing a series of substrate formats that are scaled to a high yield.
關於格式之按比例調整，Gen 5.5基板具有約130cm×150cm之尺寸，且可產生約八個26"平板顯示器。比較之下，較大格式基板可包括使用Gen 7.5及Gen 8.5母玻璃基板大小。Gen 7.5母玻璃具有約195cm×225cm之尺寸，且可每基板切割成八個42"或六個47"平板顯示器。在Gen 8.5中使用之母玻璃大致為220cm×250cm，且可每基板切割至六個55"或八個46"平板顯示器。在將OLED顯示器製造按比例調整至較大格式中仍存在的挑戰之一指示為，在大於Gen 5.5基板之基板上按高良率大量製造OLED顯示器已證明非常有挑戰性。 Regarding format scaling, the Gen 5.5 substrate has a size of approximately 130cm x 150cm and can produce approximately eight 26" flat panel displays. In comparison, larger format substrates may include the use of Gen 7.5 and Gen 8.5 mother glass substrate sizes. Gen 7.5 mother glass has a size of about 195cm×225cm, and can be cut into eight 42" or six 47" flat panel displays per substrate. The mother glass used in Gen 8.5 is roughly 220cm×250cm, and can be cut to Six 55" or eight 46" flat panel displays. One of the challenges that still exists in scaling OLED display manufacturing to a larger format is that mass production of OLED displays on substrates larger than Gen 5.5 substrates at high yield The proof is very challenging.
原則上，可藉由使用OLED印刷系統在基板上印刷各種有機薄膜以及其他材料來製造OLED器件。此等有機材料可易受氧化及其他化學製程損壞。按可針對各種基板大小按比例調整且可在惰性、實質上低粒印刷環境中進行之方式容納OLED印刷系統可呈現多種工程設計挑戰。用於高輸送量大格式基板印刷(例如，Gen 7.5及Gen 8.5基板之印刷)之製造工具需要實質上大的設施。因此，將大設施維持於惰性氣氛下、需要氣體淨化以移除反應性大氣物質(諸如，水蒸氣及氧)以及有機溶劑蒸氣，以 及維持實質上低粒印刷環境已證明為顯著挑戰性的。 In principle, OLED devices can be manufactured by printing various organic thin films and other materials on a substrate using an OLED printing system. These organic materials can be easily damaged by oxidation and other chemical processes. Various engineering design challenges can be presented by accommodating OLED printing systems in a manner that can be scaled for various substrate sizes and can be performed in an inert, substantially low-grain printing environment. Manufacturing tools for high throughput and large format substrate printing (eg, Gen 7.5 and Gen 8.5 substrate printing) require substantially large facilities. Therefore, maintaining large facilities under an inert atmosphere requires gas purification to remove reactive atmospheric substances (such as water vapor and oxygen) and organic solvent vapors, to And maintaining a substantially low-grain printing environment has proven to be significantly challenging.
因而，在按高良率按比例調整一系列基板格式的OLED顯示器技術之大量製造過程中仍存在挑戰。因此，存在對本教示之氣體封裝系統之各種具體實例的需求，該氣體封裝系統可容納在惰性、實質上低粒環境中之OLED印刷系統，且可易於按比例調整以提供在多種基板大小及基板材料上的OLED面板之製造。另外，本教示之各種氣體封裝系統可提供容易在處理期間自外部接取OLED印刷系統，且容易接取內部以進行維護同時停機時間最小。 Therefore, there are still challenges in the mass manufacturing process of OLED display technology that scales a series of substrate formats at a high yield. Therefore, there is a need for various specific examples of the gas encapsulation system of the present teaching, which can accommodate an OLED printing system in an inert, substantially low-grain environment, and can be easily scaled to provide a variety of substrate sizes and substrates Manufacture of OLED panels on materials. In addition, the various gas packaging systems taught in this teaching can provide easy access to the OLED printing system from outside during processing, and easy access to the inside for maintenance while minimizing downtime.
本教示揭示可容納OLED印刷系統之氣體封裝組裝件之各種具體實例。氣體封裝組裝件之各種具體實例可被可密封地建構且與提供粒子控制系統、氣體循環及過濾系統、氣體淨化系統及類似者之各種組件整合，以形成氣體封裝系統之各種具體實例，該氣體封裝系統可為了需要實質上低粒惰性氣體環境的製程維持此環境。 This teaching discloses various specific examples of gas packaging assemblies that can accommodate OLED printing systems. Various specific examples of gas packaging assemblies can be sealingly constructed and integrated with various components that provide particle control systems, gas circulation and filtration systems, gas purification systems, and the like to form various specific examples of gas packaging systems. The packaging system can maintain this environment for processes that require a substantially low particle inert gas environment.
原則上可允許印刷包括大格式基板大小的多種基板大小之製造工具可需要實質上大的設施，以用於容納此等OLED製造工具。因此，將整個大設施維持在惰性氣氛下呈現工程設計挑戰，諸如，大量惰性氣體之持續淨化。根據本教示，惰性氣體可為在一組定義之條件下不經歷化學反應之任何氣體。惰性氣體之一些通用非限制性實例可包括氮、稀有氣體中之任何者及其任何組合。另外，提供經基本上氣密封以防止各種反應性大氣源氣體(諸如，水蒸氣及氧)以及自各種印刷製程產生之有機溶劑蒸氣的污染之大設施造成工程設計挑戰。根據本教示，OLED印刷設施可將各種反應性物質(包括諸如水蒸氣及氧之各種反應性大氣源氣體以及有機溶劑蒸氣)中之每一物質之含量維持於100ppm或更低，例如，處於10ppm或更低、處於1.0ppm或更低或處於0.1ppm或更低。 In principle, manufacturing tools that can allow printing of multiple substrate sizes including large format substrate sizes may require substantially large facilities for accommodating such OLED manufacturing tools. Therefore, maintaining the entire large facility under an inert atmosphere presents engineering design challenges, such as continuous purification of large amounts of inert gas. According to this teaching, an inert gas can be any gas that does not undergo a chemical reaction under a defined set of conditions. Some general non-limiting examples of inert gases may include any of nitrogen, noble gases, and any combination thereof. In addition, providing large facilities that are substantially hermetically sealed to prevent the contamination of various reactive atmospheric source gases (such as water vapor and oxygen) and organic solvent vapors generated from various printing processes poses engineering challenges. According to this teaching, the OLED printing facility can maintain the content of each substance in various reactive substances (including various reactive atmospheric source gases such as water vapor and oxygen and organic solvent vapor) at 100 ppm or less, for example, at 10 ppm Or lower, at 1.0 ppm or lower, or at 0.1 ppm or lower.
持續維持需要惰性環境的大設施還造成額外挑戰。舉例而言，製造設施可能需要各種服務束之實質長度，該等服務束可操作性地自各種系統及組裝件連接以提供操作(例如但不限於)印刷系統所需之光學、電、機械及流體連接。根據本教示，服務束可包括(藉由非限制性實例)光纜、電纜、電線及管系及類似者。作為藉由使各種纜線、電線及管系及類似者一起捆紮於服務束中創造的大量空隙空間之結果，根據本教示的服務束之各種具體實例可具有顯著的總死體積。自服務束中之大量空隙空間產生的總死體積可導致堵塞於其中的大量反應性氣態物質之滯留。此大量堵塞之反應性氣態物質可對於有效使氣體封裝符合關於反應性大氣構成物(諸如，氧及水蒸氣)以及有機蒸氣之含量的規範造成挑戰。此外，在印刷系統之操作中使用的此等服務束可為持續存在的顆粒物來源。 The continued maintenance of large facilities that require an inert environment also creates additional challenges. For example, a manufacturing facility may require the substantial length of various service bundles that are operably connected from various systems and assemblies to provide the optical, electrical, mechanical, and Fluid connection. According to the teachings, service bundles can include (by way of non-limiting examples) optical cables, electrical cables, wires and piping, and the like. As a result of the large amount of void space created by bundling various cables, wires and piping and the like together in the service bundle, various specific examples of service bundles according to the teachings can have a significant total dead volume. The total dead volume generated from the large amount of void spaces in the service beam can lead to the retention of large amounts of reactive gaseous substances plugged therein. This large amount of clogged reactive gaseous substances can pose a challenge for effectively encapsulating the gas with specifications regarding the content of reactive atmospheric constituents (such as oxygen and water vapor) and organic vapor. In addition, these service bundles used in the operation of the printing system can be a source of persistent particulate matter.
在此點上，提供且維持OLED製造設施中之實質上惰性且低粒環境提供了在(例如)戶外高流量層流過濾罩下在大氣條件中進行之製程中不存在的額外挑戰。因而，本教示之系統及方法之各種具體實例解決了在惰性、實質上低粒環境中多種大小及材料之OLED基板之OLED印刷中存在的挑戰。 In this regard, providing and maintaining a substantially inert and low particle environment in OLED manufacturing facilities provides additional challenges that do not exist in processes that are conducted in atmospheric conditions under, for example, outdoor high-flow laminar flow hoods. Thus, various specific examples of the system and method of the present teaching solve the challenges in OLED printing of OLED substrates of multiple sizes and materials in an inert, substantially low-grain environment.
關於維持實質上低粒環境，氣體循環及過濾系統之各種具體實例可經設計以提供符合國際標準組織標準(ISO)14644-1：1999「潔淨室及相關聯之受控制之環境--第1部分：空氣清潔度之分類(Cleanrooms and associated controlled environments-Part 1：Classification of air cleanliness)」(如由第1類別至第5類別指定)之標準的針對空中顆粒之低粒惰性氣體環境。然而，單獨控制空中顆粒物並不足夠用於在(例如但不限於)印刷製程期間提供最接近基板處之低粒環境，因為在此製程期間最接近基板而產生之粒子可在其可經由氣體循環及過濾系統吹掃前累積於基板表面上。
With regard to maintaining a substantially low-particle environment, various specific examples of gas circulation and filtration systems can be designed to provide compliance with International Standards Organization (ISO) 14644-1: 1999 "Clean rooms and associated controlled environments-
因此，本教示之氣體封裝系統之各種具體實例可具有一粒子 控制系統，除了氣體循環及過濾系統之外，粒子控制系統亦可包括可在印刷步驟中之處理期間提供最接近基板之低粒地帶之組件。根據本教示之氣體封裝系統之各種具體實例，用於本教示之氣體封裝系統之各種具體實例的粒子控制系統可包括一氣體循環及過濾系統、用於相對於基板移動印刷頭組裝件之一低粒產生X軸線性軸承系統、一服務束外殼排氣系統及一印刷頭組裝件排氣系統。在此點上，除了用於維持針對空中顆粒物之實質上低粒規格的循環及過濾系統之外，本教示之氣體封裝系統之各種具體實例亦可具有一粒子控制系統，其可包括用於維持沈積於基板上之顆粒物的實質上低粒規格之額外組件。 Therefore, various specific examples of the gas encapsulation system of this teaching may have a particle The control system, in addition to the gas circulation and filtration system, the particle control system may also include components that can provide a low-grain zone closest to the substrate during processing in the printing step. According to various specific examples of the gas packaging system of this teaching, the particle control system used for various specific examples of the gas packaging system of this teaching may include a gas circulation and filtering system, which is used to move the print head assembly relative to the substrate. Pellets produce an X-axis linear bearing system, a service beam housing exhaust system, and a print head assembly exhaust system. In this regard, in addition to the circulation and filtration system used to maintain a substantially low particle size specification for airborne particulate matter, various specific examples of gas encapsulation systems taught by this teaching may also have a particle control system, which may include Extra components of substantially low-grain size of the particles deposited on the substrate.
本教示之系統及方法之各種具體實例可維持實質上低粒環境，從而提供感興趣之特定大小範圍之粒子之不超過基板上沈積速率規範的平均基板上分佈。可針對在約0.1μm及更大至約10μm及更大之間的感興趣之粒徑範圍中之每一者設定基板上沈積速率規範。在本教示之系統及方法之各種具體實例中，可將基板上粒子沈積速率規範表達為針對目標粒徑範圍中之每一者的每分鐘每平方公尺基板沈積的粒子之數目之極限。 Various specific examples of the system and method of the present teachings can maintain a substantially low particle environment, thereby providing an average on-substrate distribution of particles of a particular size range of interest that does not exceed the deposition rate specification on the substrate. The deposition rate specification on the substrate can be set for each of the particle size ranges of interest between about 0.1 μm and greater to about 10 μm and greater. In various specific examples of the system and method of the present teachings, the particle deposition rate specification on the substrate can be expressed as the limit of the number of particles deposited per minute per square meter of the substrate for each of the target particle size ranges.
基板上粒子沈積速率規範之各種具體實例可易於自每分鐘每平方公尺基板沈積的粒子之數目之極限轉換至針對目標粒徑範圍中之每一者的每分鐘每基板沈積的粒子之數目之極限。可易於經由基板(例如，具體一代大小之基板)與彼基板代之對應的面積之間的已知關係進行此轉換。舉例而言，下表1總結一些具有已知代大小之基板的縱橫比及面積。應理解，可看出製造者之間的縱橫比及因此大小之輕微變化。然而，與此變化無關，對於多種代大小之基板中的任何者，可獲得針對具體代大小之基板的轉換因數及以平方公尺計之面積。 Various specific examples of particle deposition rate specifications on the substrate can be easily converted from the limit of the number of particles deposited per minute per square meter of the substrate to the number of particles deposited per minute for each of the target particle size ranges limit. This conversion can be easily performed via a known relationship between the substrate (for example, a substrate of a specific generation size) and the corresponding area of the substrate generation. For example, Table 1 below summarizes the aspect ratio and area of some substrates with known generation sizes. It should be understood that a slight change in aspect ratio and therefore size between manufacturers can be seen. However, irrespective of this change, for any of the substrates of various generation sizes, the conversion factor and the area in square meters for the substrate of a specific generation size can be obtained.
另外，可易於將表達為每分鐘每平方公尺基板沈積的粒子之數目之極限的基板上粒子沈積速率規範轉換至多種單位時間表達中之任何者。將易於理解，可易於經由已知時間關係將正規化至分鐘之基板上粒子沈積速率規範轉換至任一其他時間表達，例如(但不限於)，秒、小時、天等。另外，可使用與處理具體有關的時間單位。舉例而言，印刷循環可與時間單位相關聯。對於根據本教示的氣體封裝系統之各種具體實例，印刷循環可為將基板移動至氣體封裝系統內用於印刷且接著在印刷完成後自氣體封裝系統移除所用之時間週期。對於根據本教示的氣體封裝系統之各種具體實例，印刷循環可為自基板與印刷頭組裝件之對準之起始至最後一滴噴出之墨水傳遞至基板上的時間週期。在處理之技術領域中，總平均循環時間或TACT可為針對特定製程循環的時間單位之表達。根據本教示之系統及方法之各種具體實例，針對印刷循環之TACT可為約30秒。對於本教示之系統及方法之各種具體實例，針對印刷循環之TACT可為約60秒。在本教示之系統及方法之各種具體實例中，針對印刷循環之TACT可為約90秒。對於本教示之系統及方法之各種具體實例，針對印刷循環之TACT可為約120秒。在本教示之系統及方法之各種具體實例中，針對印刷循環之 TACT可為約300秒。 In addition, the specification of the particle deposition rate on the substrate expressed as the limit of the number of particles deposited per minute per square meter of the substrate can be easily converted to any of a variety of unit time expressions. It will be easy to understand, and it is easy to convert the specification of the particle deposition rate on the substrate normalized to minutes to any other time expression, such as (but not limited to), seconds, hours, days, etc., via a known time relationship. In addition, time units specifically related to processing may be used. For example, a printing cycle can be associated with a unit of time. For various specific examples of the gas packaging system according to the present teachings, the printing cycle may be the time period for moving the substrate into the gas packaging system for printing and then removing from the gas packaging system after printing is completed. For various specific examples of the gas packaging system according to the present teachings, the printing cycle may be the time period from the start of the alignment of the substrate to the print head assembly to the last drop of ink ejected onto the substrate. In the technical field of processing, the total average cycle time or TACT can be an expression of the time unit for a specific process cycle. According to various specific examples of the system and method of this teaching, the TACT for the printing cycle may be about 30 seconds. For various specific examples of the system and method of this teaching, the TACT for the printing cycle can be about 60 seconds. In various specific examples of the system and method of this teaching, the TACT for the printing cycle may be about 90 seconds. For various specific examples of the system and method of this teaching, the TACT for the printing cycle can be about 120 seconds. In various specific examples of the system and method of this teaching, TACT may be about 300 seconds.
關於空中顆粒物及在系統內之粒子沈積，大量變數可影響可充分計算(例如)針對任一特定製造系統的在表面(諸如，基板)上之粒子散落速率的近似值之一般模型的開發。諸如粒子之大小、特定大小之粒子的分佈、基板之表面積及系統內的基板之暴露時間的變數可取決於各種製造系統而變化。舉例而言，粒子之大小及特定大小之粒子的分佈可實質上受到各種製造系統中的粒子產生組件之源及位置影響。基於本教示之氣體封裝系統之各種具體實例的計算表明，在無本教示之各種粒子控制系統之情況下，對於在0.1μm及更大之大小範圍中的粒子，顆粒物之每平方公尺基板每印刷循環的基板上沈積可在大於約1百萬至大於約1千萬個粒子之間。此等計算表明，在無本教示之各種粒子控制系統之情況下，對於在約2μm及更大之大小範圍中的粒子，顆粒物之每平方公尺基板每印刷循環的基板上沈積可在大於約1000至大於約10,000個粒子之間。 With regard to airborne particulate matter and particle deposition within the system, a large number of variables can affect the development of a general model that can adequately calculate, for example, the approximate value of the particle scattering rate on a surface (such as a substrate) for any particular manufacturing system. Variables such as the size of the particles, the distribution of particles of a specific size, the surface area of the substrate, and the exposure time of the substrate within the system can vary depending on various manufacturing systems. For example, the size of a particle and the distribution of particles of a particular size can be substantially affected by the source and location of particle generating components in various manufacturing systems. Calculations based on various specific examples of the gas encapsulation system of this teaching show that, without the various particle control systems of this teaching, for particles in the size range of 0.1 μm and larger, the particles per square meter of substrate The deposition on the substrate of the printing cycle may be between greater than about 1 million and greater than about 10 million particles. These calculations show that, without the various particle control systems of this teaching, for particles in the size range of about 2 μm and larger, the deposition of particles per square meter of substrate per printing cycle can be greater than about Between 1000 and greater than about 10,000 particles.
本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於10μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之低粒氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於2μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之 各種具體實例可維持低粒環境，從而對於大小大於或等於0.5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。對於本教示之氣體封裝系統之各種具體實例，可維持低粒環境，從而對於大小大於或等於0.3μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。 Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a particle deposition rate specification that is less than or equal to about 100 particles per square meter substrate per minute for particles larger than or equal to 10 μm Average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing particles with a size greater than or equal to 5 μm that meet the deposition rate specification on the substrate of less than or equal to about 100 particles per square meter of substrate per minute Average particle distribution on the substrate. In various specific examples of the low-particle gas encapsulation system taught in this teaching, a low-particle environment can be maintained, so that for particles with a size greater than or equal to 2 μm, deposition on a substrate that meets approximately 100 particles per minute per square meter of substrate can be provided Rate-specific average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low-grain environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 1 μm The average particle distribution on the substrate. The low particle gas packaging system of this teaching Various specific examples can maintain a low particle environment to provide an average on-substrate particle distribution that conforms to the on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles larger than or equal to 0.5 μm. For various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.3 μm The average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.1 μm The average particle distribution on the substrate.
如本文中先前所論述，在大於Gen 5.5基板之基板上按高良率大量製造OLED顯示器已證明為實質上有挑戰性。為了更清晰瞭解可在各種OLED器件之製造中使用的基板大小，自從約20世紀90年代早期，已針對使用OLED印刷以外的方法製造的平板顯示器演進了數代母玻璃基板大小。標明為Gen 1之第一代母玻璃基板大致為30cm×40cm，且因此可生產15"面板。大約在20世紀90年代中期，用於生產平板顯示器之現有技術已演進至Gen 3.5之母玻璃基板大小，其具有約60cm×72cm之尺寸。比較之下，Gen 5.5基板具有約130cm×150cm之尺寸。
As previously discussed in this article, mass production of OLED displays on substrates larger than Gen 5.5 substrates at high yields has proven to be substantially challenging. In order to more clearly understand the size of substrates that can be used in the manufacture of various OLED devices, since the early 1990s, several generations of mother glass substrate sizes have evolved for flat panel displays manufactured using methods other than OLED printing. The first generation mother glass substrate marked as
隨著一代代地進展，對於不同於OLED印刷之製造製程，正在生產Gen 7.5及Gen 8.5之母玻璃大小。Gen 7.5母玻璃具有約195cm×225cm之尺寸，且可每基板切割成八個42"或六個47"平板。在Gen 8.5中使用之母玻璃大致為220cm×250cm，且可每基板切割至六個55"或八個46"平板。已認識到OLED平板顯示器在諸如更真實色彩、更高對比度、薄度、可撓性、透明度及能量效率之品質方面的前景，同時，OLED製造實際上限於G 3.5及更小。當前，OLED印刷咸信為打破此限制且允許實現不僅Gen 3.5及更小母玻璃大小且亦在最大母玻璃大小(諸如，Gen 5.5、Gen 7.5及Gen 8.5) 下的OLED面板製造之最佳製造技術。OLED面板顯示器技術的特徵中之一者包括可使用多種基板材料，例如(但不限於)多種玻璃基板材料，以及多種聚合基板材料。在此點上，根據由使用基於玻璃之基板而引起的術語敍述之大小可應用於適合於在OLED印刷中使用的任何材料之基板。 With the progress from generation to generation, Gen 7.5 and Gen 8.5 mother glass sizes are being produced for manufacturing processes different from OLED printing. Gen 7.5 mother glass has a size of about 195cm x 225cm, and can be cut into eight 42" or six 47" plates per substrate. The mother glass used in Gen 8.5 is roughly 220cm x 250cm, and can be cut to six 55" or eight 46" plates per substrate. The prospects of OLED flat panel displays in terms of quality such as more realistic colors, higher contrast, thinness, flexibility, transparency, and energy efficiency have been recognized, while OLED manufacturing is actually limited to G 3.5 and smaller. Currently, OLED printing is to break this limitation and allow the realization of not only Gen 3.5 and smaller mother glass size but also the largest mother glass size (such as Gen 5.5, Gen 7.5 and Gen 8.5) The best manufacturing technology for OLED panel manufacturing. One of the characteristics of OLED panel display technology includes the use of multiple substrate materials, such as (but not limited to) multiple glass substrate materials, and multiple polymeric substrate materials. In this regard, the size stated in terms caused by the use of glass-based substrates can be applied to substrates of any material suitable for use in OLED printing.
預期可在本教示之氣體封裝系統之各種具體實例之惰性、實質上低粒環境內印刷廣泛多種墨水調配物。在OLED顯示器之製造期間，可形成OLED像素以包括OLED膜堆疊，當施加電壓時，OLED膜堆疊可發射具體峰值波長之光。在陽極與陰極之間的OLED膜堆疊結構可包括電洞注入層(HIL)、電洞輸送層(HTL)、發射層(EL)、電子輸送層(ETL)及電子注入層(EIL)。在OLED膜堆疊結構之一些具體實例中，可將電子輸送層(ETL)與電子注入層(EIL)組合以形成ETL/EIL層。根據本教示，可使用噴墨印刷來印刷用於OLED膜堆疊之各種色彩像素EL膜的針對EL之各種墨水調配物。另外，例如(但不限於)HIL、HTL、EML及ETL/EIL層可具有可使用噴墨印刷來印刷之墨水調配物。 It is expected that a wide variety of ink formulations can be printed in the inert, substantially low-grain environment of various specific examples of gas encapsulation systems taught in this teaching. During the manufacture of an OLED display, OLED pixels can be formed to include an OLED film stack, which can emit light at a specific peak wavelength when a voltage is applied. The OLED film stack structure between the anode and the cathode may include a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EL), an electron transport layer (ETL), and an electron injection layer (EIL). In some specific examples of the OLED film stack structure, an electron transport layer (ETL) and an electron injection layer (EIL) may be combined to form an ETL/EIL layer. According to this teaching, inkjet printing can be used to print various ink formulations for EL for various color pixel EL films of OLED film stacks. In addition, for example (but not limited to) HIL, HTL, EML, and ETL/EIL layers may have ink formulations that can be printed using inkjet printing.
進一步預期，可使用噴墨印刷將有機囊封層印刷於OLED面板上。預期，可使用噴墨印刷來印刷有機囊封層，因為噴墨印刷可提供若干優勢。首先，可消除一系列真空處理操作，此係因為可在大氣壓力下執行此基於噴墨之製造。另外，在噴墨印刷製程期間，有機囊封層可被局部化於在作用區上及最接近作用區的OLED基板之蓋部分，以有效囊封作用區(包括作用區之橫向邊緣)。使用噴墨印刷之目標圖案化導致消除材料浪費，以及消除達成有機層之圖案化通常所需之額外處理。囊封墨水可包含聚合物(包括例如(但不限於)丙烯酸酯、甲基丙烯酸酯、胺基甲酸酯或其他材料)以及共聚物及其混合物，可使用熱處理(例如，烘焙)、UV曝露及其組合來使其固化。 It is further expected that the organic encapsulation layer can be printed on the OLED panel using inkjet printing. It is expected that inkjet printing can be used to print the organic encapsulation layer because inkjet printing can provide several advantages. First, a series of vacuum processing operations can be eliminated because this inkjet-based manufacturing can be performed at atmospheric pressure. In addition, during the inkjet printing process, the organic encapsulation layer can be localized on the cover portion of the OLED substrate on and closest to the active area to effectively encapsulate the active area (including the lateral edges of the active area). Targeted patterning using inkjet printing results in the elimination of material waste and the additional processing normally required to achieve patterning of organic layers. The encapsulated ink may contain polymers (including, for example, but not limited to, acrylates, methacrylates, urethanes, or other materials) and copolymers and mixtures thereof, which may use heat treatment (eg, baking), UV exposure And their combination to cure.
關於OLED印刷，根據本教示，已發現維持實質上低含量的 反應性物質(例如但不限於諸如氧及水蒸氣之大氣構成物以及在OLED墨水中使用之各種有機溶劑蒸氣)與提供符合必需的使用期限規範之OLED平板顯示器相關。使用期限規範對於OLED面板技術而言具有特別重要性，因為此直接與顯示器產品壽命相關，顯示器產品壽命為對於所有面板技術之產品規範，OLED面板技術一直難以符合該規範。為了提供符合必需的使用期限規範之面板，藉由本教示之氣體封裝系統之各種具體實例，諸如水蒸氣、氧以及有機溶劑蒸氣的反應性物質中之每一者之含量可維持在100ppm或更低，例如，在10ppm或更低，在1.0ppm或更低，或在0.1ppm或更低。 Regarding OLED printing, according to this teaching, it has been found that maintaining a substantially low content Reactive substances (such as but not limited to atmospheric constituents such as oxygen and water vapor and various organic solvent vapors used in OLED inks) are related to providing OLED flat panel displays that meet the required lifetime specifications. The service life specification is of particular importance for OLED panel technology, because this is directly related to the life of the display product. The display product life is the product specification for all panel technologies, and OLED panel technology has been difficult to meet this specification. In order to provide a panel that meets the required lifetime specification, the content of each of the reactive substances such as water vapor, oxygen, and organic solvent vapor can be maintained at 100 ppm or lower by various specific examples of the gas encapsulation system taught by this teaching For example, at 10 ppm or less, at 1.0 ppm or less, or at 0.1 ppm or less.
在審視表2中總結之資訊的過程中可說明對於在可將諸如水蒸氣、氧以及有機溶劑蒸氣的反應性物質中之每一者之含量維持在100ppm或更低(例如，在10ppm或更低，在1.0ppm或更低，或在0.1ppm或更低)的設施中印刷OLED面板之需求。表2上總結之資料係自包含按大像素、旋塗器件格式製造的針對紅、綠及藍中之每一者之有機薄膜組成物的附體試片中之每一者之測試產生。為了各種調配物及製程之快速評估之目的，此等附體試片實質上較易於製造及測試。雖然不應將附體試片測試與印刷面板的使用期限測試混淆，但其可指示各種調配物及製程對使用期限之影響。在下表中展示之結果表示在附體試片之製造中的製程步驟之變化，其中與在空氣中而不是在氮環境中類似地製造之附體試片相比，對於在反應性物質小於1ppm之氮環境中製造之附體試片，僅旋塗環境變化。 The process of reviewing the information summarized in Table 2 may indicate that the content of each of the reactive substances such as water vapor, oxygen, and organic solvent vapor may be maintained at 100 ppm or less (for example, at 10 ppm or more Low, the demand for printing OLED panels in facilities at 1.0 ppm or less, or at 0.1 ppm or less). The data summarized in Table 2 was generated from the test of each of the appendages containing organic thin film compositions for each of red, green, and blue fabricated in large pixel, spin-on device formats. For the purpose of rapid evaluation of various formulations and processes, these appendage test pieces are substantially easier to manufacture and test. Although the test of the attached test piece should not be confused with the lifetime test of the printed panel, it can indicate the impact of various formulations and processes on the lifetime. The results shown in the table below represent changes in the process steps in the manufacture of appendage test pieces, which are less than 1 ppm for reactive substances compared to appendage test pieces made similarly in air rather than in a nitrogen environment. The appendage test piece manufactured in the nitrogen environment is only spin-coated for environmental changes.
經由檢驗在不同處理環境下製造之附體試片的在表2中之資料(特別在紅及藍之情況下)，顯然，在有效地減少有機薄膜組成物向反應性物質之暴露之環境中的印刷可對各種EI之穩定性且因此對使用期限具有實質影響。 By examining the data in Table 2 (especially in the case of red and blue) of appendage test pieces manufactured under different processing environments, it is clear that in an environment that effectively reduces the exposure of the organic thin film composition to reactive substances The printing of can have a substantial impact on the stability of various EIs and therefore the lifetime.
另外，維持用於OLED印刷之實質上低粒環境具有特別重要性，因為甚至非常小的粒子亦可導致OLED面板上之可見缺陷。在此點上，本教示之系統及方法提供維持諸如水蒸氣、氧以及有機溶劑蒸氣的反應性物質中之每一者之低含量，且另外提供維持用於高品質OLED面板製造之足夠低粒環境。氣體封裝系統之各種具體實例可具有一粒子控制系統，粒子控制系統除了氣體循環及過濾系統之外亦可包括組件以在印刷步驟中之處理期間提供最接近基板之低粒地帶。 In addition, maintaining a substantially low-grain environment for OLED printing is of particular importance because even very small particles can cause visible defects on OLED panels. In this regard, the system and method of the present teaching provides for maintaining a low content of each of reactive substances such as water vapor, oxygen, and organic solvent vapor, and additionally provides for maintaining a sufficiently low particle size for high-quality OLED panel manufacturing surroundings. Various specific examples of gas encapsulation systems may have a particle control system that may include components in addition to the gas circulation and filtration system to provide a low-grain zone closest to the substrate during processing in the printing step.
本教示之氣體封裝系統之各種具體實例可具有一提供最接近基板之低粒地帶的粒子控制系統，藉此可圍阻最接近基板之各種粒子產生組件及使其排氣以防止粒子在印刷製程期間累積於基板上。在氣體封裝系統之各種具體實例中，粒子控制系統可包括用於維持符合國際標準組織標準(ISO)14644-1：1999(如由第1類別至第5類別指定)之標準的空中顆粒含量之一氣體循環及過濾系統，兩者皆在氣體封裝系統內，以及最接近基板。粒子控制系統之各種具體實例可包括與已圍阻之粒子產生組件流體連通的氣體循環及過濾系統，使得可將此等圍阻粒子之組件排氣至氣體循環及過濾系統內。對於粒子控制系統之各種具體實例，已圍阻之粒子產生組件可被排氣至死空間內，從而致使此顆粒物不可在氣體封裝系統內再循
環。本教示之氣體封裝系統之各種具體實例可具有一粒子控制系統，因此各種組件可固有地為低粒產生的，藉此防止粒子在印刷製程期間累積於基板上。本教示之粒子控制系統之各種組件可利用粒子產生組件之圍阻及排氣，以及選擇固有地低粒產生的組件來提供最接近基板之低粒地帶。
Various specific examples of the gas encapsulation system of this teaching can have a particle control system that provides a low-grain zone closest to the substrate, whereby various particle-generating components closest to the substrate can be enclosed and exhausted to prevent particles in the printing process During the accumulation on the substrate. In various specific examples of gas encapsulation systems, the particle control system may include airborne particle content for maintaining standards that comply with International Standards Organization Standards (ISO) 14644-1:1999 (as specified by
對於本教示之低粒氣體封裝系統之各種具體實例，維持經封裝系統(例如，經封裝OLED印刷系統)中的實質上低粒環境提供了未由可在大氣條件中(諸如，在戶外高流量層流過濾罩下)進行之製程的粒子減少呈現之額外挑戰。氣體封裝系統之各種具體實例可藉由例如(但不限於)以下操作提供實質上低粒環境：1)經由消除最接近基板的顆粒物可收集於之區域，2)藉由在本教示之粒子控制系統之各種具體實例內圍阻及排氣粒子產生組件，諸如，可包括捆紮之纜線、電線及管系及類似者之服務束，以及(例如)利用諸如使用摩擦軸承之風扇或線性運動系統之組件的各種裝置、組裝件及系統，及3)藉由使用多種固有地低粒產生的氣動操作式組件，諸如(但不限於)基板浮動台、空氣軸承及氣動操作式機器人及類似者。根據本教示之氣體封裝系統之各種具體實例，實質上低粒子環境可包括一粒子控制系統，其包括用於在印刷期間提供最接近基板之低粒地帶之組件。 For various specific examples of low particle gas encapsulation systems taught in this teaching, maintaining a substantially low particle environment in an encapsulated system (e.g., an encapsulated OLED printing system) provides a high flow rate that can be prevented in atmospheric conditions (such as outdoors Under the laminar flow hood, the particle reduction of the process performed presents additional challenges. Various specific examples of gas encapsulation systems can provide a substantially low-particle environment by, for example, but not limited to, the following operations: 1) by eliminating the areas where particles closest to the substrate can be collected, 2) by particle control in this teaching Various specific examples of systems include internal containment and exhaust particle generation components, such as service bundles that may include bundled cables, wires and piping, and the like, as well as, for example, the use of fans such as friction bearings or linear motion systems Various devices, assemblies and systems of components, and 3) Pneumatically-operated components that are produced by using a variety of intrinsically low-particles, such as (but not limited to) substrate floating tables, air bearings, and pneumatically-operated robots and the like. According to various specific examples of the gas encapsulation system of the present teachings, a substantially low-particle environment may include a particle control system including components for providing a low-grain zone closest to the substrate during printing.
如本文中隨後將更詳細地論述，對最接近基板的粒子產生進行直接控制以提供最接近基板之低粒地帶可藉由圍阻粒子產生元件、藉由使用低粒產生組件及藉由圍阻粒子產生與使用低粒產生組件之組合來實施。因此，氣體封裝系統之各種具體實例可具有一粒子控制系統，其可包括與用於相對於基板移動印刷頭組裝件之低粒產生X軸線性軸承系統流體連通之一氣體循環及過濾系統、一服務束外殼排氣系統及一印刷頭組裝件排氣系統。對於服務束外殼排氣系統及印刷頭組裝件排氣系統之各種具體實例，此等系統中圍阻之粒子可排出至氣體循環及過濾系統內。在服務束 外殼排氣系統及印刷頭組裝件排氣系統之各種具體實例中，此等系統中圍阻之粒子可排氣至死空間內，藉此致使此顆粒物如此排出至不可用於在氣體封裝系統內循環之死空間內。 As will be discussed in more detail later in this article, direct control of particle generation closest to the substrate to provide a low-grain zone closest to the substrate can be achieved by containment of particle generation elements, by use of low-particle generation components, and by containment Particle generation and the use of a combination of low particle generation components are implemented. Therefore, various specific examples of gas encapsulation systems may have a particle control system, which may include a gas circulation and filtration system in fluid communication with a low particle generation X-axis linear bearing system for moving the print head assembly relative to the substrate Service bundle shell exhaust system and a print head assembly exhaust system. For various specific examples of the exhaust system of the service beam housing and the exhaust system of the print head assembly, the particles contained in these systems can be discharged into the gas circulation and filtration system. In service bundle In various specific examples of the exhaust system of the housing and the exhaust system of the print head assembly, the particles contained in these systems can be exhausted into the dead space, thereby causing this particulate matter to be discharged so that it cannot be used in the gas encapsulation system In the dead space of circulation.
另外，可針對空中及基板上粒子監視執行系統驗證以及持續進行中之系統監視。可使用(例如)攜帶型粒子計數器件在印刷製程前針對氣體封裝系統之各種具體實例執行空中顆粒物之判定，作為品質檢查。在氣體封裝系統之各種具體實例中，可當印刷基板時在原地執行空中顆粒物之判定，作為持續進行中之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行空中顆粒物之判定，作為品質檢查。可使用(例如)測試基板在印刷基板前針對氣體封裝系統之各種具體實例執行在基板上的顆粒物的基板上分佈之判定，用於系統驗證。在氣體封裝系統之各種具體實例中，可(例如)使用安裝於X軸托架組裝件上之相機組裝件當印刷基板時在原地執行顆粒物之基板上分佈之判定，作為持續進行中之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行顆粒物之基板上分佈之判定，用於系統驗證。 In addition, system verification and ongoing system monitoring can be performed for airborne and on-board particle monitoring. For example, a portable particle counter device can be used to determine airborne particulate matter for various specific examples of the gas encapsulation system before the printing process, as a quality check. In various specific examples of the gas encapsulation system, the determination of airborne particles can be performed in situ when the substrate is printed, as a continuous quality inspection. For various specific examples of the gas encapsulation system, the determination of airborne particles can be performed in situ before printing the substrate and also when printing the substrate as a quality check. For example, the test substrate can be used to perform the determination of the distribution of the particulate matter on the substrate on the substrate for various specific examples of the gas encapsulation system before printing the substrate for system verification. In various specific examples of the gas packaging system, for example, the camera assembly mounted on the X-axis bracket assembly can be used to perform the determination of the distribution of particulates on the substrate when printing the substrate, as an ongoing quality inspection . For various specific examples of the gas encapsulation system, the determination of the distribution of the particulate matter on the substrate can be performed in situ before printing the substrate and additionally when printing the substrate, for system verification.
氣體封裝系統之各種具體實例可具有可維持實質上低粒環境之一粒子控制系統，從而提供用於在約0.1μm或更大至約10μm或更大之間的粒子之基板上粒子規範。對於目標粒徑範圍中之每一者，基板上粒子規範之各種具體實例可易於自每分鐘每平方公尺基板之平均基板上粒子分佈轉換至每分鐘每基板之平均基板上粒子分佈。如本文中先前所論述，可易於經由基板(例如，具體代大小之基板)與彼基板代之對應面積之間的已知關係進行此轉換。另外，可易於將每分鐘每平方公尺基板之平均基板上粒子分佈轉換至多種單位時間表達中之任何者。舉例而言，除了在標準時間單位(例如，秒、分鐘及天)之間的轉換外，亦可使用與處理 具體有關之時間單位。舉例而言，如本文中先前所論述，印刷循環可與時間單位相關聯。 Various specific examples of gas encapsulation systems may have a particle control system that can maintain a substantially low particle environment, thereby providing on-substrate particle specifications for particles between about 0.1 μm or greater and about 10 μm or greater. For each of the target particle size ranges, various specific examples of the on-substrate particle specification can be easily converted from the average on-substrate particle distribution per minute per square meter of substrate to the average on-substrate particle distribution per minute per substrate. As previously discussed herein, this conversion can be easily performed via a known relationship between the substrate (eg, a substrate of a specific generation size) and the corresponding area of the substrate generation. In addition, the average particle distribution on the substrate per minute per square meter of substrate can be easily converted to any of a variety of unit time expressions. For example, in addition to converting between standard time units (eg, seconds, minutes, and days), it can also be used and processed The specific time unit. For example, as previously discussed herein, a printing cycle may be associated with a unit of time.
本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於10μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於2μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。對於本教示之氣體封裝系統之各種具體實例，可維持低粒環境，從而對於大小大於或等於0.3μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。 Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a particle deposition rate specification that is less than or equal to about 100 particles per square meter substrate per minute for particles larger than or equal to 10 μm Average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing particles with a size greater than or equal to 5 μm that meet the deposition rate specification on the substrate of less than or equal to about 100 particles per square meter of substrate per minute Average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that meets a particle size of less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 2 μm The average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low-grain environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 1 μm The average particle distribution on the substrate. Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.5 μm The average particle distribution on the substrate. For various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.3 μm The average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.1 μm The average particle distribution on the substrate.
另外，預期氣體封裝系統將具有包括(例如但不限於)氣體封裝組裝件之屬性，該氣體封裝組裝件可易於按比例調整以提供用於OLED 印刷系統之最佳化工作空間，同時提供最小化之惰性氣體容積，且另外提供易於在處理期間自外部接取OLED印刷系統，同時提供對內部之接取以進行維護同時停機時間最小。在此點上，可用於需要惰性環境之各種空氣敏感製程的氣體封裝組裝件之各種具體實例可包括可密封在一起之複數個壁框及頂板框構件。在一些具體實例中，可使用可重新使用之扣件(例如，螺釘及螺紋孔)將複數個壁框及頂板框構件緊固在一起。對於根據本教示的氣體封裝組裝件之各種具體實例，可建構複數個框構件(每一框構件包含複數個面板框區段)以界定氣體封裝框組裝件。氣體封裝組裝件之各種具體實例可包括建構為氣體封裝組裝件之一區段的一輔助封裝，其可與氣體封裝系統(諸如，印刷系統封裝)之工作容積可密封地隔離。輔助封裝與(例如)印刷系統封裝之此實體隔離可使得能夠進行各種程序(例如但不限於對印刷頭組裝件之各種維護程序)而極少打斷或不打斷印刷製程，藉此最小化或消除氣體封裝系統停機時間。 In addition, it is expected that the gas packaging system will have properties including (for example, but not limited to) a gas packaging assembly that can be easily scaled to provide for OLED The optimized working space of the printing system, while providing a minimum volume of inert gas, and in addition to providing easy access to the OLED printing system from the outside during processing, while providing access to the interior for maintenance while minimizing downtime. In this regard, various specific examples of gas packaging assemblies that can be used in various air-sensitive processes requiring an inert environment may include a plurality of wall frames and roof frame components that can be sealed together. In some specific examples, reusable fasteners (eg, screws and threaded holes) may be used to fasten the plurality of wall frames and roof frame members together. For various specific examples of the gas package assembly according to the present teachings, a plurality of frame members (each frame member including a plurality of panel frame sections) may be constructed to define the gas package assembly. Various specific examples of gas packaging assemblies may include an auxiliary package constructed as a section of the gas packaging assembly, which may be sealably isolated from the working volume of a gas packaging system, such as a printing system package. This physical isolation of auxiliary packaging from, for example, printing system packaging can enable various procedures (such as, but not limited to, various maintenance procedures for printhead assemblies) with little or no interruption of the printing process, thereby minimizing or Eliminate gas packaging system downtime.
本教示之氣體封裝組裝件可經設計以按可使系統周圍之封裝之容積最小化的方式容納一印刷系統(諸如，OLED印刷系統)。可按使氣體封裝組裝件之內部容積最小化且同時最佳化工作空間以容納各種OLED印刷系統之各種佔據面積的方式建構氣體封裝組裝件之各種具體實例。根據本教示之氣體封裝系統之各種具體實例的OLED印刷系統可包含(例如)花崗岩基底、可支撐OLED印刷器件之可移動橋、自加壓之惰性氣體再循環系統之各種具體實例運作之一或多個器件及裝置，諸如，基板浮動台、空氣軸承、軌道、軌、用於將OLED膜形成材料沈積至基板上之噴墨印刷機系統(包括OLED墨水供應子系統及噴墨印刷頭)、一或多個機器人及類似者。考慮到可組成OLED印刷系統的多種組件，OLED印刷系統之各種具體實例可具有多種佔據面積及外觀尺寸。如此建構的氣體封裝組裝件之各種具體實例另外使得易於在處理期間自外部接取氣體封裝組裝件之 內部及易於接取內部以進行維護，同時使停機時間最小化。在此點上，根據本教示的氣體封裝組裝件之各種具體實例可具有關於各種OLED印刷系統之各種佔據面積的輪廓。根據各種具體實例，一旦輪廓化框構件經建構以形成氣體封裝框組裝件，則各種類型之面板可被可密封地裝設於組成框構件之複數個面板區段中以完成氣體封裝組裝件之裝設。在氣體封裝組裝件之各種具體實例中，包括(例如但不限於)複數個壁框構件及至少一頂板框構件之複數個框構件以及用於裝設於面板框區段中之複數個面板可在一或多個位置處加以製造，且接著在另一位置處加以建構。此外，考慮到用以建構本教示之氣體封裝組裝件的組件之可輸送本質，可經由建構及解構之循環重複地裝設及移除氣體封裝組裝件之各種具體實例。 The gas package assembly of this teaching can be designed to accommodate a printing system (such as an OLED printing system) in a manner that minimizes the volume of the package around the system. Various specific examples of gas packaging assemblies can be constructed in a manner that minimizes the internal volume of the gas packaging assembly and at the same time optimizes the working space to accommodate various occupied areas of various OLED printing systems. The OLED printing system according to various specific examples of the gas encapsulation system of the present teaching may include, for example, one of various specific examples of operation of various specific examples of a granite substrate, a movable bridge that can support an OLED printed device, a self-pressurized inert gas recycling system, or Multiple devices and devices, such as substrate floating tables, air bearings, rails, rails, inkjet printer systems (including OLED ink supply subsystems and inkjet printheads) for depositing OLED film-forming materials onto substrates, One or more robots and the like. Considering the various components that can make up an OLED printing system, various specific examples of OLED printing systems can have a variety of occupied areas and appearance dimensions. The various specific examples of the gas package assembly thus constructed also make it easy to access the gas package assembly from the outside during processing Internal and easy access to internal for maintenance, while minimizing downtime. In this regard, various specific examples of gas package assemblies according to the present teachings can have contours regarding various occupied areas of various OLED printing systems. According to various specific examples, once the outlined frame member is constructed to form a gas encapsulated frame assembly, various types of panels can be sealably installed in the plurality of panel sections that make up the frame member to complete the gas encapsulated assembly Installation. In various specific examples of gas packaging assemblies, including (for example but not limited to) a plurality of wall frame members and a plurality of frame members of at least one top panel frame member and a plurality of panels for installation in the panel frame section may It is manufactured at one or more locations and then constructed at another location. In addition, considering the transportable nature of the components used to construct the gas package assembly of the present teachings, various specific examples of the gas package assembly can be repeatedly installed and removed through the cycle of construction and deconstruction.
為了確保氣體封裝被氣密封，本教示之氣體封裝組裝件之各種具體實例提供接合每一框構件以提供框密封。可藉由各種框構件(其可包括墊片或其他密封件)之間的緊密配合相交來充分密封(例如，氣密封)內部。一旦經完全建構，密封之氣體封裝組裝件可包含一內部及複數個內部拐角邊緣，至少一內部拐角邊緣設在每一框構件與鄰近框構件之相交處。框構件中之一或多者(例如，框構件之至少一半)可包含沿著其一或多個各別邊緣固定之一或多個可壓縮墊片。該一或多個可壓縮墊片可經組態以一旦將複數個框構件接合在一起且裝設了氣密性面板，則創造氣密封之氣體封裝組裝件。可形成具有由複數個可壓縮墊片密封的框構件之拐角邊緣之經密封氣體封裝組裝件。對於每一框構件，例如(但不限於)，內部壁框表面、頂部壁框表面、垂直側壁框表面、底部壁框表面及其組合可具備一或多個可壓縮墊片。 In order to ensure that the gas package is hermetically sealed, various specific examples of the gas package assembly of the present teaching provide for joining each frame member to provide a frame seal. The interior can be fully sealed (eg, hermetically sealed) by the close fit intersection between various frame members (which may include gaskets or other seals). Once fully constructed, the sealed gas package assembly may include an inner and a plurality of inner corner edges, at least one inner corner edge is provided at the intersection of each frame member and the adjacent frame member. One or more of the frame members (eg, at least half of the frame member) may include one or more compressible spacers secured along one or more respective edges thereof. The one or more compressible gaskets can be configured to create a hermetically sealed gas packaging assembly once the plurality of frame members are joined together and the airtight panel is installed. A sealed gas package assembly having corner edges of a frame member sealed by a plurality of compressible gaskets can be formed. For each frame member, for example (but not limited to), the inner wall frame surface, top wall frame surface, vertical side wall frame surface, bottom wall frame surface, and combinations thereof may be provided with one or more compressible gaskets.
對於氣體封裝組裝件之各種具體實例，每一框構件可包含複數個區段，其經成框及製造以收納可被可密封地裝設於每一區段中的多種面板類型中之任何者以針對每一面板提供氣密性面板密封。在本教示之氣 體封裝組裝件之各種具體實例中，每一區段框可具有一區段框墊片，其與選定扣件一起確保裝設於每一區段框中之每一面板可為每一面板且因此為完全建構之氣體封裝提供氣密性密封。在各種具體實例中，氣體封裝組裝件可在壁面板中之每一者中具有窗面板或保養窗中之一或多者；其中每一窗面板或保養窗可具有至少一手套端口。在氣體封裝組裝件之組裝期間，每一手套端口可具有附接之手套，使得手套可延伸至內部。根據各種具體實例，每一手套端口可具有用於安裝手套之硬體，其中此硬體利用在每一手套端口周圍之墊片密封，其提供氣密性密封以使經由手套端口的洩漏或分子擴散最小化。對於本教示之氣體封裝組裝件之各種具體實例，進一步設計了硬體以為終端使用者提供將手套端口蓋住及開蓋之容易性。 For various specific examples of gas packaging assemblies, each frame member may include a plurality of sections that are framed and manufactured to accommodate any of a variety of panel types that can be sealably installed in each section To provide a hermetic panel seal for each panel. In the spirit of this teaching In various specific examples of body packaging assemblies, each section frame may have a section frame gasket, which together with the selected fasteners ensures that each panel installed in each section frame may be each panel and This provides a gas-tight seal for a fully constructed gas package. In various specific examples, the gas package assembly may have one or more of a window panel or maintenance window in each of the wall panels; wherein each window panel or maintenance window may have at least one glove port. During assembly of the gas package assembly, each glove port may have an attached glove so that the glove can be extended to the inside. According to various specific examples, each glove port may have a hardware for installing gloves, wherein this hardware is sealed with a gasket around each glove port, which provides an airtight seal to prevent leakage or molecules through the glove port Diffusion is minimized. For various specific examples of the gas packaging assembly of this teaching, the hardware is further designed to provide the end user with the ease of covering and opening the glove port.
根據本教示的氣體封裝系統之各種具體實例可包括自複數個框構件及面板區段形成之氣體封裝組裝件以及氣體循環、過濾及淨化組件。對於氣體封裝系統之各種具體實例，可在組裝過程期間裝設管道系統。根據本教示之各種具體實例，管道系統可裝設於已自複數個框構件建構之氣體封裝框組裝件內。在各種具體實例中，在將複數個框構件接合以形成氣體封裝框組裝件前，可將管道系統裝設於框構件上。用於氣體封裝系統之各種具體實例的管道系統可經組態，使得自一或多個管道系統入口吸入至管道系統內之實質上所有氣體被移動經過用於移除在氣體封裝系統內部之顆粒物的氣體過濾迴路之各種具體實例。另外，氣體封裝系統之各種具體實例之管道系統可經組態以將在氣體封裝組裝件外部的氣體淨化迴路之入口及出口與在氣體封裝組裝件內部的氣體過濾迴路分開。根據本教示之氣體封裝系統之各種具體實例，氣體循環及過濾系統可與(例如但不限於)粒子控制系統之組件流體連通。對於氣體封裝組裝件之各種具體實例，氣體循環及過濾系統可與服務束外殼排氣系統流體連通。對於氣體封裝組裝件之各種具體實例，氣體循環及過濾系統可與印刷頭組裝件排氣系統流體 連通。在氣體封裝系統之各種具體實例中，與氣體循環及過濾系統流體連通的粒子控制系統之各種組件可提供最接近定位於印刷系統中之基板的低粒地帶。 Various specific examples of the gas packaging system according to the present teachings may include gas packaging assemblies formed from a plurality of frame members and panel sections, and gas circulation, filtration, and purification components. For various specific examples of gas packaging systems, piping systems can be installed during the assembly process. According to various specific examples of this teaching, the piping system can be installed in a gas encapsulated frame assembly that has been constructed from a plurality of frame members. In various specific examples, before joining a plurality of frame members to form a gas-encapsulated frame assembly, a piping system may be installed on the frame members. Piping systems for various specific examples of gas encapsulation systems can be configured such that substantially all gas drawn into the piping system from one or more pipe system inlets is moved past for removing particulate matter inside the gas encapsulation system Various specific examples of gas filter circuits. In addition, the piping system of various specific examples of the gas packaging system may be configured to separate the inlet and outlet of the gas purification circuit outside the gas packaging assembly from the gas filtering circuit inside the gas packaging assembly. According to various specific examples of the gas encapsulation system of the present teachings, the gas circulation and filtration system can be in fluid communication with (eg, but not limited to) the components of the particle control system. For various specific examples of gas packaging assemblies, the gas circulation and filtration system may be in fluid communication with the service bundle housing exhaust system. For various specific examples of gas encapsulated assemblies, the gas circulation and filtration system can be fluidized with the exhaust system of the print head assembly Connected. In various specific examples of gas encapsulation systems, the various components of the particle control system in fluid communication with the gas circulation and filtration system can provide a low-grain zone closest to the substrate positioned in the printing system.
舉例而言，氣體封裝系統可具有在氣體封裝組裝件內部之氣體循環及過濾系統。此內部過濾系統可具有在內部之複數個扇形過濾器單元，且可經組態以提供氣體在內部之層流。層流可在自內部之頂部至內部之底部的方向上，或在任一其他方向上。雖然由循環系統產生的氣體之流動不需要為分層的，但氣體之層流可用以確保內部的氣體之澈底且完全更新。氣體之層流亦可用以使亂流最小化，此亂流係不良的，因為其可使環境中之粒子收集於此等亂流區域中，從而防止過濾系統自環境中移除彼等粒子。另外，為了維持內部的所要溫度，可提供利用複數個熱交換器之一熱調節系統，例如，與風扇或另一氣體循環器件一起操作、鄰近風扇或另一氣體循環器件或與風扇或另一氣體循環器件相結合使用。氣體淨化迴路可經組態以使來自氣體封裝組裝件之內部的氣體循環經過在封裝外部之至少一氣體淨化組件。在此點上，與在氣體封裝組裝件外部之氣體淨化迴路相結合的在氣體封裝組裝件內部之循環及過濾系統可提供具有實質上低含量之反應性物質的實質上低粒惰性氣體在整個氣體封裝系統中的連續循環。具有氣體淨化系統的氣體封裝系統之各種具體實例可經組態以維持非常低含量之不當組分，例如，有機溶劑及其蒸氣，以及水、水蒸氣、氧及類似者。 For example, the gas packaging system may have a gas circulation and filtration system inside the gas packaging assembly. This internal filtration system may have a plurality of fan-shaped filter units inside, and may be configured to provide a laminar flow of gas inside. Laminar flow can be in the direction from the top of the interior to the bottom of the interior, or in any other direction. Although the flow of gas generated by the circulation system does not need to be stratified, the laminar flow of gas can be used to ensure that the internal gas is clean and completely renewed. The laminar flow of gas can also be used to minimize turbulence, which is undesirable because it allows particles in the environment to collect in these turbulence areas, thereby preventing the filtration system from removing those particles from the environment. In addition, in order to maintain the desired temperature inside, a thermal regulation system using one of a plurality of heat exchangers may be provided, for example, operating with a fan or another gas circulation device, adjacent to the fan or another gas circulation device or with the fan or another Used in combination with gas circulation devices. The gas purification circuit may be configured to circulate gas from inside the gas package assembly through at least one gas purification component outside the package. In this regard, the circulation and filtration system inside the gas package assembly combined with the gas purification circuit outside the gas package assembly can provide a substantially low particle inert gas with a substantially low content of reactive substances throughout Continuous circulation in gas packaging system. Various specific examples of gas encapsulation systems with gas purification systems can be configured to maintain very low levels of inappropriate components, such as organic solvents and their vapors, as well as water, water vapor, oxygen, and the like.
除了提供氣體循環、過濾及淨化組件之外，管道系統亦可經定大小及成形以在其中容納至少一服務束。根據本教示，服務束可包括(例如但不限於)光纜、電纜、電線以及各種含有流體之管系及類似者。本教示之服務束之各種具體實例可具有由形成於服務束之各種組件之間的空隙空間創造的相當大之死體積。可在各種光纜、電纜、電線及含有流體之管 系之集束中創造的實質死體積可具有截獲於空隙空間中的大量反應性大氣物質(諸如，水、水蒸氣、氧及類似者)。此大量堵塞之反應性大氣物質可難以由淨化系統快速移除。另外，此等服務束為確定之顆粒物源。在一些具體實例中，纜線、電線及電線束及含有流體之管系中之任何者的組合可實質上安置於管道系統內，且可分別操作性地與收容於氣體封裝系統內之光學系統、電系統、機械系統及冷卻系統中之至少一者相關聯。因為氣體循環、過濾及淨化組件可經組態使得基本上所有循環之惰性氣體被抽吸經過管道系統，所以可藉由使此等捆紮之組件實質上圍阻於管道系統內來有效地移除自此等束引起之顆粒物以及截獲於各種捆紮材料之死體積中的大氣構成物。 In addition to providing gas circulation, filtration and purification components, the piping system can also be sized and shaped to accommodate at least one service beam therein. According to the teachings, service bundles can include, for example, but not limited to, optical cables, cables, wires, and various fluid-containing piping systems and the like. Various specific examples of service bundles of this teaching may have a considerable dead volume created by the void spaces formed between various components of the service bundle. Can be used in various optical cables, cables, wires and tubes containing fluids The substantial dead volume created in the cluster may have a large amount of reactive atmospheric material (such as water, water vapor, oxygen, and the like) trapped in the void space. This large amount of clogged reactive atmospheric material can be difficult to remove quickly by the purification system. In addition, these service bundles are a definite source of particles. In some specific examples, the combination of any of the cables, wires and bundles of wires, and the piping system containing fluids can be substantially housed in the piping system, and can be operable separately from the optical system housed in the gas encapsulation system , At least one of electrical system, mechanical system and cooling system. Because the gas circulation, filtration and purification components can be configured so that substantially all of the circulating inert gas is drawn through the piping system, it can be effectively removed by substantially enclosing these bundled components within the piping system Particles caused by these beams and atmospheric constituents trapped in the dead volume of various strapping materials.
根據本教示的氣體封裝系統之各種具體實例可包括自複數個框構件及面板區段形成之氣體封裝組裝件以及粒子控制系統、氣體循環、過濾及淨化組件，以及加壓之惰性氣體再循環系統之各種具體實例。此加壓之惰性氣體再循環系統可用於用於各種氣動驅動式器件及裝置之OLED印刷系統的操作中，如本文中隨後將更詳細地論述。 Various specific examples of the gas packaging system according to the present teaching may include gas packaging assemblies and particle control systems, gas circulation, filtration and purification components formed from a plurality of frame members and panel sections, and pressurized inert gas recirculation systems Various specific examples. This pressurized inert gas recirculation system can be used in the operation of OLED printing systems for various pneumatically driven devices and devices, as will be discussed in more detail later in this document.
根據本教示，解決了若干工程設計挑戰，以便提供在氣體封裝系統中的加壓之惰性氣體再循環系統之各種具體實例。首先，在無加壓之惰性氣體再循環系統的氣體封裝系統之典型操作中，可將氣體封裝系統維持於相對於外部壓力稍微正之內部壓力下，以便在氣體封裝系統中出現出任何洩漏時防止外部氣體或空氣進入內部。舉例而言，在典型操作下，對於本教示之氣體封裝系統之各種具體實例，可將氣體封裝系統之內部維持在相對於在封裝系統外部之周圍大氣的(例如)至少2mbarg之壓力下，例如，至少4mbarg之壓力下、至少6mbarg之壓力下、至少8mbarg之壓力下或更高壓力下。維持氣體封裝系統內的加壓之惰性氣體再循環系統可為挑戰性的，因為其呈現關於維持氣體封裝系統之稍微正內部壓力，同時持 續地將加壓氣體引入至氣體封裝系統內的動態且進行中之平衡動作。另外，各種器件及裝置之可變需求可對於本教示之各種氣體封裝組裝件及系統創造不規則壓力分佈。在此等條件下維持保持於相對於外部環境之稍微正壓力下的氣體封裝系統之動態壓力平衡可提供正在進行中之OLED印刷製程之完整性。 According to this teaching, several engineering design challenges have been solved in order to provide various specific examples of pressurized inert gas recirculation systems in gas encapsulation systems. First, in typical operation of a gas encapsulation system without a pressurized inert gas recirculation system, the gas encapsulation system can be maintained at a slightly positive internal pressure relative to the external pressure to prevent any leaks in the gas encapsulation system Outside air or air enters inside. For example, under typical operations, for various specific examples of the gas packaging system of the present teachings, the inside of the gas packaging system may be maintained at a pressure of at least 2 mbarg relative to the surrounding atmosphere outside the packaging system, for example , At least 4 mbarg pressure, at least 6 mbarg pressure, at least 8 mbarg pressure or higher pressure. Maintaining a pressurized inert gas recirculation system within the gas encapsulation system can be challenging because it presents a slightly positive internal pressure with respect to maintaining the gas encapsulation system while maintaining The dynamic and ongoing balancing action of continuously introducing pressurized gas into the gas encapsulation system. In addition, the variable requirements of various devices and devices can create irregular pressure distributions for various gas packaging assemblies and systems taught in this teaching. Maintaining the dynamic pressure balance of the gas packaging system maintained at a slightly positive pressure relative to the external environment under these conditions can provide the integrity of the ongoing OLED printing process.
對於氣體封裝系統之各種具體實例，根據本教示的加壓之惰性氣體再循環系統可包括可利用壓縮機、積貯器及吹風機及其組合中之至少一者的加壓之惰性氣體迴路之各種具體實例。包括加壓之惰性氣體迴路之各種具體實例的加壓之惰性氣體再循環系統之各種具體實例可具有一特殊設計之壓力控制式旁路迴路，其可提供在本教示之氣體封裝系統中的惰性氣體之處於穩定定義值的內部壓力。在氣體封裝系統之各種具體實例中，加壓之惰性氣體再循環系統可經組態以當加壓之惰性氣體迴路之積貯器中的惰性氣體之壓力超過預設定之臨限壓力時經由壓力控制式旁路迴路使加壓之惰性氣體再循環。臨限壓力可(例如)在自約25psig至約200psig之間的範圍內，或更具體言之，在約75psig至約125psig之間的範圍內，或更具體言之，在約90psig至約95psig之間的範圍內。在此點上，具有具特殊設計之壓力控制式旁路迴路之各種具體實例的加壓之惰性氣體再循環系統的本教示之氣體封裝系統可維持在氣密封之氣體封裝中具有加壓之惰性氣體再循環系統的平衡。 For various specific examples of gas encapsulation systems, the pressurized inert gas recirculation system according to the teachings may include various types of pressurized inert gas circuits that can utilize at least one of compressors, accumulators and blowers, and combinations thereof Specific examples. Including various specific examples of pressurized inert gas circuits Various specific examples of pressurized inert gas recirculation systems can have a specially designed pressure controlled bypass circuit that can provide inertness in the gas packaging system of this teaching The internal pressure of the gas is at a stable defined value. In various specific examples of gas encapsulation systems, the pressurized inert gas recirculation system may be configured to pass the pressure when the pressure of the inert gas in the reservoir of the pressurized inert gas circuit exceeds a preset threshold pressure Controlled bypass circuit recirculates pressurized inert gas. The threshold pressure can be, for example, in the range from about 25 psig to about 200 psig, or more specifically, in the range from about 75 psig to about 125 psig, or more specifically, in the range from about 90 psig to about 95 psig Within the range. In this regard, the gas encapsulation system of the present teaching having a pressurized inert gas recirculation system with various specific examples of specially designed pressure-controlled bypass circuits can be maintained with pressurized inertness in a hermetically sealed gas encapsulation Balance of gas recirculation system.
根據本教示，各種器件及裝置可安置於內部且與具有可利用多種加壓之氣體源(諸如，壓縮機、吹風機及其組合中之至少一者)的各種加壓之惰性氣體迴路的加壓之惰性氣體再循環系統之各種具體實例流體連通。對於本教示之氣體封裝及系統之各種具體實例，各種氣動操作式器件及裝置之使用可提供低粒產生效能，以及為低維護性的。可安置於氣體封裝系統之內部且與各種加壓之惰性氣體迴路流體連通的例示性器件及裝 置可包括(例如但不限於)氣動機器人、基板浮動台、空氣軸承、空氣襯套、壓縮氣體工具、氣動致動器及其組合中之一或多者。基板浮動台以及空氣軸承可用於操作根據本教示之氣體封裝系統之各種具體實例的OLED印刷系統之各種態樣。舉例而言，利用空氣軸承技術之基板浮動台可用以將基板輸送至印刷頭腔室中之位置，以及在OLED印刷製程期間支撐基板。 According to the teachings, various devices and devices can be placed inside and pressurized with various pressurized inert gas circuits that can utilize various pressurized gas sources (such as at least one of compressors, blowers, and combinations thereof) Various specific examples of inert gas recirculation systems are in fluid communication. For various specific examples of gas packaging and systems taught in this teaching, the use of various pneumatically-operated devices and devices can provide low-grain production efficiency and be low-maintenance. Exemplary devices and equipment that can be placed inside a gas encapsulation system and are in fluid communication with various pressurized inert gas circuits The device may include, for example but not limited to, one or more of a pneumatic robot, a substrate floating table, an air bearing, an air bush, a compressed gas tool, a pneumatic actuator, and combinations thereof. The substrate floating table and the air bearing can be used to operate various aspects of the OLED printing system according to various specific examples of the gas packaging system of this teaching. For example, a substrate floating table using air bearing technology can be used to transport the substrate to a location in the print head chamber and support the substrate during the OLED printing process.
10:***面板區段 10: Insert panel section
12:框 12: box
14:盲螺紋孔 14: blind threaded hole
15:螺桿 15: screw
16:墊片 16: Gasket
18:可壓縮墊片 18: Compressible gasket
20:窗面板區段 20: Window panel section
22:框 22: Box
30:面板區段 30: Panel section
32:面板區段框 32: Panel section frame
34:窗導引間隔物 34: window guide spacer
35:窗夾 35: window clip
36:夾緊夾板 36: clamping splint
38:可壓縮墊片 38: Compressible gasket
40:頂板框區段 40: Top frame section
41:第一側 41: First side
42:頂板框樑 42: roof beam
43:第二側 43: Second side
44:頂板框樑 44: Roof beam
45:第一照明元件 45: The first lighting element
46:照明元件對 46: lighting element pair
47:第二照明元件 47: Second lighting element
100:氣體封裝組裝件 100: Gas package assembly
101:氣體封裝組裝件 101: Gas package assembly
103:扇形過濾器單元蓋 103: Fan filter unit cover
105:第一頂板框管道 105: the first top frame pipe
107:第二頂板框管道 107: second top frame pipe
109:金屬薄片面板區段 109: Sheet metal panel section
110:***面板 110: Insert panel
120:窗面板 120: window panel
122:面板框 122: panel frame
124:窗 124: window
125:窗面板 125: window panel
130:可易於移除之保養窗 130: Maintenance window that can be easily removed
132:保養窗框 132: Maintenance window frame
134:窗 134: Window
136:肘節夾 136: toggle clamp
138:窗把手 138: Window handle
140:手套端口 140: glove port
142:手套 142: Gloves
200:框構件組裝件 200: frame member assembly
202:基底 202: base
204:底盤 204: chassis
210:第一壁框 210: first wall frame
210':第一壁面板 210': first wall panel
220:壁框 220: Wall frame
220':左壁面板 220': Left wall panel
226:頂部 226: top
227:頂部壁框間隔板 227: Top wall frame partition
228:底部 228: bottom
229:底部壁框間隔板 229: bottom wall frame partition
230:第三壁框 230: third wall frame
230':第三壁面板 230': third wall panel
240:壁框 240: Wall frame
240':後壁面板 240': Rear wall panel
250:頂板框 250: top plate frame
250':頂板面板 250': top panel
251:內部部分 251: Internal part
300:密封組裝件 300: Seal assembly
302:間隙 302: clearance
304:間隙 304: clearance
306:間隙 306: clearance
310:壁框 310: Wall frame
311:內部側 311: inner side
312:間隔板 312: Spacer
314:垂直側 314: Vertical side
315:頂表面 315: top surface
316:間隔板 316: Spacer
317:內邊緣 317: inner edge
320:第一墊片 320: first gasket
321:垂直墊片長度 321: Vertical gasket length
323:曲線墊片長度 323: Curved gasket length
325:墊片長度 325: gasket length
340:第二墊片 340: second gasket
345:墊片之長度 345: the length of the gasket
350:壁框 350: Wall frame
353:框側 353: Frame side
354:垂直側 354: vertical side
355:頂表面 355: top surface
356:間隔板 356: Spacer
360:第一墊片 360: the first gasket
361:水平長度 361: horizontal length
363:曲線長度 363: curve length
365:長度 365: Length
370:頂板框 370: top plate frame
500:氣體封裝系統 500: gas packaging system
501:氣體封裝系統 501: Gas packaging system
502:氣體封裝系統 502: Gas packaging system
503:氣體封裝系統 503: Gas packaging system
504:氣體封裝系統 504: Gas packaging system
505:氣體封裝系統 505: Gas packaging system
506:氣體封裝系統 506: Gas packaging system
507:氣體封裝系統 507: Gas packaging system
508:氣體封裝系統 508: Gas packaging system
509:氣體封裝系統 509: Gas packaging system
510:氣體封裝系統 510: Gas packaging system
511:氣體封裝系統 511: gas packaging system
512:氣體封裝系統 512: Gas packaging system
800:粒子計數器 800: particle counter
800A:粒子計數器圖示 800A: particle counter icon
800B:粒子計數器圖示 800B: particle counter icon
800C:粒子計數器圖示 800C: particle counter icon
800D:粒子計數器圖示 800D: particle counter icon
810:電源按鈕 810: Power button
812:顯示器 812: display
814:入口噴嘴 814: Inlet nozzle
815:入口探針 815: Entrance probe
816:取樣探針 816: Sampling probe
817:取樣探針連接器 817: Sampling probe connector
820:光源 820: Light source
821:發射之源光 821: Source light
822:偵測區域 822: Detection area
823:向前散射之光 823: Light scattered forward
824:流動路徑 824: Flow path
825:光路徑 825: light path
826:聚焦透鏡 826: focusing lens
828:偵測器 828: Detector
830:粒子計數器偵測器 830: Particle counter detector
850:光源 850: light source
851:發射之源光 851: Source Light
852:粒子 852: Particle
853:反射之光線 853: reflected light
854:基板 854: substrate
855:散射之光 855: Scattered light
856:聚焦透鏡 856: focusing lens
857:光學濾光片 857: Optical filter
858:偵測器 858: Detector
860:基板上粒子計數器偵測系統 860: Particle counter detection system on substrate
1000:氣體封裝組裝件 1000: gas package assembly
1100:氣體封裝組裝件 1100: Gas package assembly
1101:氣體封裝組裝件 1101: Gas package assembly
1101-S1:第一氣體封裝組裝件區段 1101-S1: The first gas package assembly section
1101-S2:第二氣體封裝組裝件區段 1101-S2: Second gas package assembly section
1110:負載鎖定之入口腔室 1110: Load locked inlet chamber
1112:入口閘 1112: Entrance gate
1130:系統控制器 1130: System controller
1200':前部面板組裝件 1200': front panel assembly
1220':前部基底面板組裝件 1220': front base panel assembly
1240':前部壁面板組裝件 1240': front wall panel assembly
1242:開口 1242: opening
1260':前部頂板面板組裝件 1260': front roof panel assembly
1300':中間面板組裝件 1300': middle panel assembly
1320:氣體封裝組裝件基底 1320: Gas package assembly base
1320':中間基底面板組裝件 1320': Intermediate base panel assembly
1325':第一隔離器井面板 1325': the first isolator well panel
1327':第二隔離器井面板 1327': Second isolator well panel
1330':第一印刷頭管理系統輔助面板組裝件 1330': Auxiliary panel assembly of the first print head management system
1338':第一後壁面板組裝件 1338': first rear wall panel assembly
1340':第一中間封裝面板組裝件 1340': the first middle package panel assembly
1341':第一底面板組裝件 1341': the first bottom panel assembly
1342:第一印刷頭組裝件開口 1342: First print head assembly opening
1345:第一印刷頭組裝件銜接墊片 1345: First printing head assembly connection gasket
1360':中間壁及頂板面板組裝件 1360': middle wall and roof panel assembly
1365:第二通路 1365: The second channel
1367:第二密封件 1367: Second seal
1370':第二印刷頭管理系統輔助面板組裝件 1370': Auxiliary panel assembly of the second print head management system
1375:第二密封件支撐面板 1375: second seal support panel
1378:第二後壁框組裝件 1378: Second rear wall frame assembly
1378':第二後壁面板組裝件 1378': Second rear wall panel assembly
1380':第二中間封裝面板組裝件 1380': Second middle package panel assembly
1381':第二底面板組裝件 1381': Second bottom panel assembly
1382:第二印刷頭組裝件開口 1382: Second print head assembly opening
1385:第二印刷頭組裝件銜接墊片 1385: second printing head assembly connection gasket
1400':後部面板組裝件 1400': rear panel assembly
1420':後部基底面板組裝件 1420': Rear base panel assembly
1440':後部壁面板組裝件 1440': Rear wall panel assembly
1460':後部頂板面板組裝件 1460': Rear roof panel assembly
1500:循環及過濾系統 1500: circulation and filtration system
1501:管道系統組裝件 1501: Pipe system assembly
1502:扇形過濾器單元組裝件 1502: Fan filter unit assembly
1505:頂板管道 1505: Roof pipe
1507:頂板管道 1507: Roof pipe
1509:入口管道系統組裝件 1509: Inlet piping system assembly
1510:前壁面板管道系統組裝件 1510: Front wall panel piping system assembly
1511:開口 1511: opening
1512:前壁面板入口管道 1512: Front wall panel inlet duct
1514:第一前壁面板升流管 1514: First front wall riser
1515:出口 1515: Export
1516:第二前壁面板升流管 1516: second front wall riser
1517:出口 1517: Export
1520:左壁面板組裝件 1520: Left wall panel assembly
1521:開口 1521: opening
1522:左壁面板入口管道 1522: Inlet duct of the left wall panel
1524:左壁面板第一升流管 1524: First riser on the left wall panel
1525:第一管道入口端 1525: Entrance end of the first pipe
1526:左壁面板第二升流管 1526: Second riser on the left wall panel
1527:第二管道出口端 1527: Outlet end of the second pipeline
1528:左壁面板上部管道 1528: Upper pipe of left wall panel
1530:右壁面板組裝件 1530: right wall panel assembly
1531:開口 1531: opening
1532:右壁面板入口管道 1532: Inlet duct of right wall panel
1533:管道開口 1533: Pipe opening
1534:右壁面板第一升流管 1534: the first riser of the right wall panel
1535:第一管道入口端 1535: Entrance end of the first pipe
1536:右壁面板第二升流管 1536: second riser on the right wall panel
1537:第二管道出口端 1537: Outlet end of the second pipeline
1538:右壁面板上部管道 1538: Upper pipe of right wall panel
1540:後壁面板管道系統組裝件 1540: Rear wall panel piping system assembly
1541:後壁面板第一入口 1541: the first entrance of the rear wall panel
1542:後壁面板入口管道 1542: rear wall panel inlet duct
1543:後壁面板第二入口 1543: Second entrance of rear wall panel
1544:後壁面板底部管道 1544: The bottom pipe of the rear wall panel
1545:通風孔 1545: Ventilation hole
1546:後壁面板上部管道 1546: Upper duct of rear wall panel
1547:第一隔壁 1547: Next door
1549:第二隔壁 1549: Second next door
1551:扇形過濾器單元 1551: Sector filter unit
1552:扇形過濾器單元 1552: Fan filter unit
1553:扇形過濾器單元 1553: Sector filter unit
1554:扇形過濾器單元 1554: Sector filter unit
1555:扇形過濾器單元 1555: Sector filter unit
1556:扇形過濾器單元 1556: Sector filter unit
1562:第一熱交換器 1562: the first heat exchanger
1564:第二熱交換器 1564: Second heat exchanger
1566:第三熱交換器 1566: Third heat exchanger
1571:第一管道系統入口 1571: Entrance of the first piping system
1572:第二管道系統入口 1572: Entrance of the second piping system
1573:第一管道系統管路 1573: First piping system piping
1574:第二管道系統管路 1574: Second piping system piping
1575:第一管道系統出口 1575: the first pipeline system outlet
1576:第二管道系統出口 1576: Exit of the second pipeline system
1580:空間 1580: Space
1590:死空間 1590: Dead space
1605:返回管道 1605: Return pipeline
1610:***面板 1610: Insert panel
1630:右壁面板 1630: Right wall panel
1631:開口 1631: opening
1632:管道 1632: Pipeline
1633:滑動蓋 1633: Sliding cover
1634:第一服務束管道進入口 1634: The first service beam pipeline entrance
1635:頂部 1635: top
1636:第二服務束管道進入口 1636: Second service beam pipeline entrance
1637:上部部分 1637: upper part
1640:後壁面板 1640: Rear wall panel
2000:OLED印刷系統 2000: OLED printing system
2001:OLED噴墨印刷系統 2001: OLED inkjet printing system
2002:印刷系統 2002: Printing system
2003:印刷系統 2003: Printing system
2004:印刷系統 2004: printing system
2050:基板 2050: substrate
2100:印刷系統基底 2100: Printing system substrate
2101:印刷系統基底 2101: Printing system substrate
2110:第一隔離器組 2110: First isolator group
2112:第二隔離器組 2112: Second isolator group
2120:第一升流管 2120: First riser
2122:第二升流管 2122: Second riser
2130:橋接部 2130: Bridge Department
2132:第一側 2132: first side
2133:頂表面 2133: top surface
2134:第二側 2134: second side
2200:基板浮動台 2200: substrate floating stage
2210:地帶 2210: Strip
2211:第一過渡地帶 2211: First transition zone
2212:第二過渡地帶 2212: Second transition zone
2213:僅壓力地帶 2213: Pressure zone only
2214:僅壓力地帶 2214: Pressure zone only
2220:基板浮動台基底 2220: substrate floating table base
2250:基板支撐裝置 2250: substrate support device
2252:頂表面 2252: top surface
2300:X,Z托架組裝件 2300: X, Z bracket assembly
2300A:第一托架組裝件 2300A: First bracket assembly
2300B:第二托架組裝件 2300B: Second bracket assembly
2301:第一X軸托架組裝件 2301: The first X-axis bracket assembly
2302:第二X軸托架組裝件 2302: Second X-axis bracket assembly
2310:第一Z軸移動板 2310: The first Z-axis moving plate
2310A:第一Z軸移動板 2310A: The first Z-axis moving plate
2310B:第二Z軸移動板 2310B: Second Z-axis moving plate
2312:第二Z軸移動板 2312: Second Z-axis moving plate
2315:第一Z軸移動板 2315: The first Z-axis moving plate
2320:線性空氣軸承系統 2320: Linear air bearing system
2330:空氣軸承圓盤 2330: Air bearing disc
2332:第一圓盤 2332: The first disc
2334:第二圓盤 2334: second disc
2336:第三圓盤 2336: third disc
2338:第四圓盤 2338: Fourth disc
2340:線性馬達 2340: linear motor
2342:X,Z軸托架組裝件磁體軌道 2342: X, Z axis bracket assembly magnet track
2344:線性馬達繞組 2344: Linear motor winding
2346:編碼器讀取頭 2346: Encoder read head
2351:第一Y軸軌道 2351: The first Y axis track
2352:第二Y軸軌道 2352: Second Y-axis track
2355:Y軸運動組裝件 2355: Y-axis motion assembly
2360:軌系統 2360: Rail system
2400:服務束外殼排氣系統 2400: Service bundle housing exhaust system
2401:第一服務束載體伸展部 2401: First service beam carrier extension
2402:服務束外殼頂表面 2402: Top surface of service bundle shell
2404:服務束外殼底部側 2404: Service bundle shell bottom side
2406:服務束外殼第一側 2406: the first side of the service bundle shell
2407:第二服務束載體伸展部 2407: Second service beam carrier extension
2408:服務束外殼第二側 2408: second side of service bundle shell
2410:服務束外殼 2410: Service bundle shell
2411:第一服務束外殼開口 2411: First service beam shell opening
2412:第一組槽 2412: the first set of slots
2413:第二服務束外殼開口 2413: Second service beam housing opening
2414:第二組槽 2414: second set of slots
2415:服務束外殼第一端 2415: The first end of the service bundle shell
2417:服務束外殼第二端 2417: The second end of the service bundle shell
2420:服務束外殼排氣空間 2420: Service beam housing exhaust space
2422:服務束外殼排氣空間第一管道 2422: The first pipe of the exhaust space of the service bundle shell
2424:服務束外殼排氣空間第二管道 2424: Service duct shell exhaust space second pipe
2430:服務束載體 2430: Service bundle carrier
2500:印刷頭組裝件 2500: Print head assembly
2501:第一印刷頭組裝件 2501: The first print head assembly
2502:第二印刷頭組裝件 2502: Second print head assembly
2503:第一印刷頭組裝件封裝 2503: The first print head assembly package
2504:第二印刷頭組裝件封裝 2504: Packaging of the second print head assembly
2505:印刷頭 2505: print head
2530:把手 2530: handle
2536:末端執行器 2536: End effector
2550:相機組裝件 2550: camera assembly
2552:相機 2552: Camera
2554:相機支架組裝件 2554: Camera bracket assembly
2556:透鏡組裝件 2556: Lens assembly
2600:印刷頭組裝件排氣系統 2600: Print head assembly exhaust system
2610:印刷頭組裝件排氣系統外殼 2610: Print head assembly exhaust system housing
2612:印刷頭組裝件排氣系統第一管路 2612: The first pipeline of the exhaust system of the print head assembly
2614:印刷頭組裝件排氣系統第二管路 2614: Second line of exhaust system of print head assembly
2616:過濾頭 2616: filter head
2620:風扇 2620: Fan
2622:風扇 2622: Fan
2701:第一印刷頭管理系統 2701: The first print head management system
2702:第二印刷頭管理系統 2702: Second print head management system
2703:第一維護系統平台 2703: The first maintenance system platform
2704:第二維護系統平台 2704: Second maintenance system platform
2707:第一印刷頭管理系統裝置 2707: The first print head management system device
2709:第一印刷頭管理系統裝置 2709: The first print head management system device
2711:第一印刷頭管理系統裝置 2711: The first print head management system device
2713:印刷頭替換模組 2713: Print head replacement module
3000:加壓之惰性氣體再循環系統 3000: Pressurized inert gas recycling system
3130:氣體淨化系統 3130: Gas purification system
3131:氣體淨化出口線路 3131: Gas purification outlet line
3132:溶劑移除組件 3132: Solvent removal assembly
3133:氣體淨化入口線路 3133: Gas purification inlet circuit
3134:氣體淨化系統 3134: Gas purification system
3140:熱調節系統 3140: Thermal regulation system
3141:流體出口線路 3141: Fluid outlet circuit
3142:流體冷卻器 3142: Fluid cooler
3143:冷卻器入口線路 3143: Cooler inlet line
3200:外部氣體迴路 3200: External gas circuit
3201:惰性氣體源 3201: Inert gas source
3202:第一機械閥 3202: The first mechanical valve
3203:清潔乾燥空氣(CDA)源 3203: Clean dry air (CDA) source
3204:第二機械閥 3204: Second mechanical valve
3206:第三機械閥 3206: Third mechanical valve
3208:第四機械閥 3208: Fourth mechanical valve
3210:室內惰性氣體線路 3210: Indoor inert gas circuit
3212:低消耗歧管線路 3212: Low consumption manifold circuit
3214:交叉線路第一區段 3214: The first section of the crossover line
3215:低消耗歧管 3215: Low consumption manifold
3216:第一流動接合點 3216: First flow junction
3218:第二流動接合點 3218: Second flow junction
3220:壓縮機惰性氣體線路 3220: Compressor inert gas circuit
3222:CDA線路 3222: CDA line
3225:高消耗歧管 3225: High consumption manifold
3226:第三流動接合點 3226: Third flow junction
3228:交叉線路第二區段 3228: The second section of the crossover line
3230:閥 3230: Valve
3250:壓縮機迴路 3250: Compressor circuit
3252:氣體封裝組裝件出口 3252: Gas package assembly outlet
3254:線路 3254: Line
3256:閥 3256: Valve
3258:止回閥 3258: Check valve
3260:壓力控制式旁路迴路 3260: Pressure controlled bypass circuit
3261:第一旁路入口閥 3261: First bypass inlet valve
3262:壓縮機 3262: Compressor
3263:第二閥 3263: Second valve
3264:第一積貯器 3264: first reservoir
3266:後壓力調節器 3266: Rear pressure regulator
3268:第二積貯器 3268: Second reservoir
3270:真空系統 3270: Vacuum system
3272:線路 3272: Line
3274:閥 3274: Valve
3280:吹風機迴路 3280: Hair dryer circuit
3282:外殼 3282: Shell
3283:第一隔離閥 3283: First isolation valve
3284:第一吹風機 3284: The first blower
3285:止回閥 3285: Check valve
3286:可調整閥 3286: Adjustable valve
3287:第二隔離閥 3287: Second isolation valve
3288:熱交換器 3288: Heat exchanger
3290:真空吹風機 3290: Vacuum blower
3292:線路 3292: Line
3294:閥 3294: Valve
V1:閥 V 1 : Valve
V2:閥 V 2 : Valve
V3:閥 V 3 : Valve
V4:閥 V 4 : Valve
將藉由參看隨附圖式獲得本發明之特徵及優勢之更好理解，隨附圖式意欲說明(不限制)本教示。 A better understanding of the features and advantages of the present invention will be obtained by referring to the accompanying drawings, which are intended to illustrate (not limit) the teachings.
圖1為根據本教示之各種具體實例的氣體封裝組裝件之右前部透視圖。 FIG. 1 is a front right perspective view of a gas package assembly according to various specific examples of the present teachings.
圖2描繪根據本教示之各種具體實例的氣體封裝組裝件之分解圖。 2 depicts an exploded view of a gas package assembly according to various specific examples of the present teachings.
圖3為根據本教示之各種具體實例的描繪各種面板框區段及區段面板之框構件組裝件之分解前部透視圖。 3 is an exploded front perspective view depicting various panel frame segments and frame member assembly of segment panels according to various specific examples of the present teachings.
圖4A至圖4C為用於形成接頭的墊片密封之各種具體實例之頂部示意圖。 4A to 4C are schematic top views of various specific examples of gasket seals used to form joints.
圖5A及圖5B為描繪根據本教示之氣體封裝組裝件之各種具體實例的框構件之密封之各種透視圖。 5A and 5B are various perspective views depicting sealing of frame members of various specific examples of gas package assemblies according to the present teachings.
圖6A及圖6B為係關於根據本教示之氣體封裝組裝件之各種具體實例的用於收納可易於移除之保養窗的區段面板之密封之各種視圖。 FIGS. 6A and 6B are various views regarding the sealing of section panels for accommodating maintenance windows that can be easily removed, according to various specific examples of the gas package assembly according to the present teachings.
圖7A及圖7B為係關於根據本教示之各種具體實例的用於收納***面板或窗面板之區段面板之密封之擴大透視剖視圖。 7A and 7B are enlarged perspective cross-sectional views regarding the sealing of a section panel for receiving an insertion panel or a window panel according to various specific examples of the present teachings.
圖8為包括用於根據本教示之氣體封裝系統之各種具體實例的照明系統之頂板之視圖。 FIG. 8 is a view of a top plate of a lighting system including various specific examples of gas encapsulation systems according to the present teachings.
圖9為根據本教示之各種具體實例的氣體封裝組裝件之前部透視圖。 9 is a front perspective view of a gas package assembly according to various specific examples of the present teachings.
圖10A描繪根據本教示之各種具體實例的如在圖9中所描繪之氣體封裝組裝件及有關印刷之各種具體實例之分解圖。圖10B描繪圖10A中描繪 的印刷系統之擴大等角透視圖。圖10C展示圖10A中描繪的輔助封裝之擴大等角透視圖。 10A depicts an exploded view of various specific examples of the gas package assembly and related printing as depicted in FIG. 9 according to various specific examples of the present teachings. Figure 10B depicts the depiction in Figure 10A Enlarged isometric perspective view of the printing system. 10C shows an enlarged isometric perspective view of the auxiliary package depicted in FIG. 10A.
圖11描繪根據本教示之各種具體實例的浮動台之透視圖。 FIG. 11 depicts a perspective view of a floating table according to various specific examples of this teaching.
圖12為本教示之氣體封裝組裝件及有關系統組件之各種具體實例之示意圖。 12 is a schematic diagram of various specific examples of the gas package assembly and related system components of the teaching.
圖13為本教示之氣體封裝組裝件及有關系統組件之各種具體實例之示意圖。 13 is a schematic diagram of various specific examples of the gas package assembly and related system components of the teaching.
圖14為根據本教示之各種具體實例的氣體封裝系統之示意圖。 14 is a schematic diagram of a gas packaging system according to various specific examples of the present teaching.
圖15為根據本教示之各種具體實例的氣體封裝系統之示意圖。 15 is a schematic diagram of a gas packaging system according to various specific examples of the present teaching.
圖16為根據本教示之各種具體實例的氣體封裝組裝件之幻象前部透視圖，其描繪裝設於氣體封裝組裝件之內部中的管道系統。 16 is a phantom front perspective view of a gas package assembly according to various specific examples of the present teachings, depicting a piping system installed in the interior of the gas package assembly.
圖17為根據本教示之各種具體實例的氣體封裝組裝件之幻象頂部透視圖，其描繪裝設於氣體封裝組裝件之內部中的管道系統。 17 is a phantom top perspective view of a gas package assembly according to various specific examples of the present teachings, depicting a piping system installed in the interior of the gas package assembly.
圖18為根據本教示之各種具體實例的氣體封裝組裝件之幻象底部透視圖，其描繪裝設於氣體封裝組裝件之內部中的管道系統。 18 is a phantom bottom perspective view of a gas package assembly according to various specific examples of the present teachings, which depicts a piping system installed in the interior of the gas package assembly.
圖19A為展示根據本教示之各種具體實例的服務束之示意性表示。圖19B描繪氣體掃過經由根據本教示的管道系統之各種具體實例饋入的服務束。 FIG. 19A is a schematic representation showing service bundles according to various specific examples of the present teachings. FIG. 19B depicts gas sweeping through a service bundle fed through various specific examples of piping systems according to the present teachings.
圖20為示意性表示，其展示如何由於惰性氣體(B)掃過束被排線穿過之管道而有效地淨化堵塞於服務束之死空間中的反應性物質(A)。 Fig. 20 is a schematic representation showing how to effectively purify the reactive material (A) clogged in the dead space of the service beam as the inert gas (B) sweeps through the pipe through which the beam is passed by the cable.
圖21A為根據本教示之氣體封裝系統之各種具體實例的經排線穿過管道系統之纜線及管系之幻象透視圖。圖21B為根據本教示之氣體封裝系統之各種具體實例的在圖21A中展示的開口之展開圖，其展示用於在開口上閉合的蓋之細節。 21A is a phantom perspective view of cables and piping systems passing through a piping system via a flat cable according to various specific examples of a gas packaging system of the present teachings. FIG. 21B is a developed view of the opening shown in FIG. 21A according to various specific examples of the gas packaging system of the present teaching, which shows details of the cover for closing on the opening.
圖22為根據本教示之各種具體實例的描繪經由氣體封裝組裝件之氣體 循環之一具體實例的氣體封裝系統之示意性側剖視圖。 FIG. 22 is a diagram depicting gas through a gas package assembly according to various specific examples of the teaching A schematic side cross-sectional view of a gas packaging system of a specific example of a cycle.
圖23為根據本教示之各種具體實例的描繪經由氣體封裝組裝件之氣體循環之一具體實例的氣體封裝系統之示意性側剖視圖。 23 is a schematic side cross-sectional view of a gas packaging system depicting one specific example of gas circulation through a gas packaging assembly according to various specific examples of the present teachings.
圖24為根據本教示之各種具體實例的描繪經由氣體封裝組裝件之氣體循環之一具體實例的氣體封裝之示意性前剖視圖。 24 is a schematic front cross-sectional view of a gas package depicting a specific example of gas circulation through a gas package assembly according to various specific examples of the present teachings.
圖25為根據本教示之各種具體實例的具有系統組件之氣體封裝組裝件之橫截面示意圖。 25 is a schematic cross-sectional view of a gas package assembly with system components according to various specific examples of the present teachings.
圖26為描繪本教示之粒子控制系統之各種具體實例的印刷系統之透視圖，該印刷系統可包括低粒X軸運動系統及服務束外殼排氣系統。 26 is a perspective view of a printing system depicting various specific examples of the particle control system of the present teachings. The printing system may include a low-grain X-axis motion system and a service beam housing exhaust system.
圖27A及圖27B為根據本教示之各種具體實例的低粒X軸運動系統之剖視圖。 27A and 27B are cross-sectional views of a low-grain X-axis motion system according to various specific examples of the present teachings.
圖28A及圖28B為根據本教示之各種具體實例的用於印刷系統之服務束外殼排氣系統之各種透視圖。 28A and 28B are various perspective views of a service beam housing exhaust system for a printing system according to various specific examples of the present teachings.
圖29A為根據本教示之各種具體實例的服務束外殼排氣系統之示意圖。圖29B、圖29C及圖29D為根據本教示之各種具體實例的使服務束外殼通風之各種具體實例之示意圖。 FIG. 29A is a schematic diagram of a service bundle housing exhaust system according to various specific examples of the present teachings. 29B, 29C, and 29D are schematic diagrams of various specific examples of ventilating the service bundle housing according to various specific examples of the present teachings.
圖30A及圖30B為根據本教示之各種具體實例的描繪在氣體封裝組裝件中之印刷頭組裝件周圍的氣體循環及粒子收集之一具體實例的氣體封裝系統之示意圖。 30A and 30B are schematic diagrams of a gas packaging system depicting a specific example of gas circulation and particle collection around a print head assembly in a gas packaging assembly according to various specific examples of the present teachings.
圖31A及圖31B為根據本教示之各種具體實例的描繪在氣體封裝組裝件中之印刷頭組裝件周圍的氣體循環及粒子收集之一具體實例的氣體封裝系統之示意圖。 31A and 31B are schematic diagrams of a gas packaging system depicting one specific example of gas circulation and particle collection around a print head assembly in a gas packaging assembly according to various specific examples of the present teachings.
圖32A及圖32B為根據本教示之各種具體實例的描繪在氣體封裝組裝件中之印刷頭組裝件周圍的氣體循環及粒子收集之一具體實例的氣體封裝系統之示意圖。 32A and 32B are schematic diagrams of a gas packaging system depicting a specific example of gas circulation and particle collection around a print head assembly in a gas packaging assembly according to various specific examples of the present teachings.
圖33為根據本教示的攜帶型空中粒子計數器件之一具體實例。 FIG. 33 is a specific example of a portable aerial particle counter device according to the teaching.
圖34為基於電磁輻射之散射的各種攜帶型空中粒子計數器件之操作原理之示意性表示。 34 is a schematic representation of the operating principle of various portable aerial particle counter devices based on the scattering of electromagnetic radiation.
圖35為描繪攜帶型空中粒子計數器件可在本教示之各種印刷系統中位於的各種區域之示意性表示。 FIG. 35 is a schematic representation depicting various areas where portable airborne particle counter devices can be located in various printing systems of the present teachings.
圖36為根據本教示之各種具體實例的位置最接近基板支撐裝置的攜帶型空中粒子計數器件之等角透視圖。 36 is an isometric perspective view of a portable aerial particle counter device positioned closest to the substrate support device according to various specific examples of the present teachings.
圖37A及圖37B為描繪在本教示之氣體封裝系統之各種具體實例中的粒子計數之長期測試結果之曲線圖。 37A and 37B are graphs depicting long-term test results of particle counting in various specific examples of the gas encapsulation system of the present teaching.
圖38為描繪在氣體封裝系統窗打開前及後的粒子計數之回收測試結果之曲線圖。 FIG. 38 is a graph depicting the recovery test results of the particle count before and after the opening of the gas encapsulation system window.
圖39為用於基於電磁輻射之散射的基板上粒子偵測的各種粒子偵測器件之操作原理之示意性表示。 39 is a schematic representation of the operating principle of various particle detection devices for particle detection on a substrate based on scattering of electromagnetic radiation.
圖40為根據本教示之各種具體實例的最接近印刷區域之測試基板之置放之等角透視圖。 FIG. 40 is an isometric perspective view of the placement of the test substrate closest to the printing area according to various specific examples of the teaching.
圖41為根據本教示之各種具體實例的最接近裝備有相機之印刷系統中的印刷區域之基板之置放之等角透視圖。 41 is an isometric perspective view of the placement of the substrate closest to the printing area in the camera-equipped printing system according to various specific examples of the present teachings.
圖1A為根據本教示之各種具體實例的氣體封裝組裝件100之右前部透視圖。氣體封裝組裝件100可與各種組件整合以提供本教示之氣體封裝系統之各種具體實例。本教示之氣體封裝系統可含有用於維持氣體封裝組裝件內部中的惰性環境之一或多種氣體，以及用於維持實質上低粒環境之組件。藉由非限制性實例，氣體封裝系統之各種具體實例可具有可包括一氣體循環及過濾系統之一粒子控制系統以及用於自再循環之惰性氣體移除反應性物質的淨化組件，且可具有加壓之惰性氣體再循環系統之
各種具體實例。因而本教示之氣體封裝系統之各種具體實例可適用於維持內部中的惰性、實質上低粒氣體氣氛。
FIG. 1A is a front right perspective view of a
舉例而言，圖1B為氣體封裝系統500之各種具體實例之左前部透視圖。圖1B描繪可包括氣體封裝組裝件100之各種具體實例的氣體封裝系統500。氣體封裝系統500可具有負載鎖定之入口腔室1110，其可具有入口閘1112。圖1B之氣體封裝系統500可包括一氣體淨化系統3130，其用於給氣體封裝組裝件100提供具有實質上低含量的反應性大氣物質(諸如，水蒸氣及氧)以及自OLED印刷製程產生之有機溶劑蒸氣之惰性氣體之恆定供應。根據本教示，惰性氣體可為在一組定義之條件下不經歷化學反應之任何氣體。惰性氣體之一些通用非限制性實例可包括氮、稀有氣體中之任何者及其任何組合。根據本教示的氣體淨化系統之各種具體實例(諸如，圖1B之氣體淨化系統3130)可將包括各種反應性大氣源氣體(諸如，水蒸氣及氧)以及有機溶劑蒸氣的各種反應性物質中之每一物質之含量維持處於100ppm或更低，例如，處於10ppm或更低，處於1.0ppm或更低，或處於0.1ppm或更低。
For example, FIG. 1B is a front left perspective view of various specific examples of the
圖1B之氣體封裝系統500亦可具有用於系統控制功能之控制器系統1130。舉例而言，系統控制器1130可包括與一或多個記憶體電路(圖中未示)通信之一或多個處理器電路(圖中未示)。系統控制器1130亦可與負載鎖定之入口腔室1110、出口腔室(圖中未示)且最終與OLED印刷系統之印刷噴嘴連通，入口腔室、出口腔室及印刷噴嘴可收容於氣體封裝系統500中。以此方式，系統控制器1130可協調(例如)負載鎖定之入口腔室1110中的閘1112之打開以允許基板進入至氣體封裝系統500內。系統控制器1130可控制多種系統功能，諸如，控制施配至OLED印刷系統之印刷噴嘴的墨水。圖1B之氣體封裝系統500經組態以涵蓋且保護空氣敏感製程，諸如，使用工業印刷系統的適用於創造OLED堆疊的多種墨水之印
刷。對於OLED墨水有反應性的大氣源氣體之實例包括水蒸氣及氧，以及來自用作(例如)各種OLED墨水之載劑的有機溶劑之多種有機蒸氣。如本文中先前所論述，氣體封裝組裝件100可經組態以維持密封之氣氛且允許組件或印刷系統有效地操作，同時氣體封裝系統500可提供對於維持惰性環境所必要之所有組件。另外，氣體封裝500可具有一粒子控制系統，其提供最接近基板之低粒地帶，該系統可包括諸如(藉由非限制性實例)以下各者之組件：氣體循環及過濾系統、用於相對於基板移動印刷頭組裝件之低粒產生X軸線性軸承系統、服務束外殼排氣系統及印刷頭組裝件排氣系統。
The
如圖1A中所描繪，氣體封裝組裝件100之各種具體實例可包含包括以下各者之組件零件：前或第一壁面板210'、左或第二壁面板(圖中未示)、右或第三壁面板230'、後或第四壁面板(圖中未示)及頂板面板250'，該氣體封裝組裝件可附接至擱置於基底(圖中未示)上之底盤204。如本文中隨後將更詳細地論述，圖1A之氣體封裝組裝件100之各種具體實例可自前或第一壁框210、左或第二壁框(圖中未示)、右或第三壁框230、後或第四壁面板(圖中未示)及頂板框250建構。頂板框250之各種具體實例可包括扇形過濾器單元蓋103，以及第一頂板框管道105及第一頂板框管道107。根據本教示之具體實例，可將各種類型之區段面板裝設於組成框構件之複數個面板區段中的任何者中。在圖1之氣體封裝100之各種具體實例中，可在框之建構期間將金屬薄片面板區段109焊接至框構件。對於氣體封裝組裝件100之各種具體實例，可經由氣體封裝組裝件之建構及解構之循環重複裝設及移除的區段面板之類型可包括***面板110(如針對壁面板210'所指示)以及窗面板120及可易於移除之保養窗130(如針對壁面板230'所指示)。
As depicted in FIG. 1A, various specific examples of the
雖然可易於移除之保養窗130可提供對封裝100之內部的容
易接取，但可移除之任何面板可用以為了修理及定期保養之目的而提供對氣體封裝系統之內部的接取。用於保養或修理之此接取與由諸如窗面板120及可易於移除之保養窗130的面板提供之接取有所區別，諸如窗面板120及可易於移除之保養窗130的面板可向終端使用者提供在使用期間自氣體封裝組裝件之外部對氣體封裝組裝件之內部的手套接取。舉例而言，諸如附接至手套端口140之手套142(如在圖1A中針對面板230所展示)的手套中之任一者可向終端使用者提供在氣體封裝系統之使用期間對內部之接取。
Although the easy-to-remove
圖2描繪如圖1A中描繪的氣體封裝組裝件之各種具體實例之分解圖。氣體封裝組裝件之各種具體實例可具有複數個壁面板，包括前壁面板210'之外部透視圖、左壁面板220'之外部透視圖、右壁面板230'之內部透視圖、後壁面板240'之內部透視圖及頂板面板250'之頂部透視圖，如在圖1A中所示，該等壁面板可附接至擱置於基底202上之底盤204。可將OLED印刷系統安裝於底盤204之上，該印刷製程已知為對大氣條件敏感。根據本教示，可自框構件(例如，壁面板210'之壁框210、壁面板220'之壁框220、壁面板230'之壁框230、壁面板240'之壁框240及頂板面板250'之頂板框250)建構氣體封裝組裝件，複數個區段面板接著可裝設於該等框構件中。在此點上，可能需要使可經由本教示之氣體封裝組裝件之各種具體實例之建構及解構的循環重複裝設及移除之區段面板之設計成流線型。此外，可設定氣體封裝組裝件100之輪廓以容納OLED印刷系統之各種具體實例之佔據面積，以便在氣體封裝組裝件之使用期間以及在維護期間使在氣體封裝組裝件中需要的惰性氣體之體積最小化，以及使終端使用者易於接取。
FIG. 2 depicts an exploded view of various specific examples of the gas package assembly as depicted in FIG. 1A. Various specific examples of the gas package assembly may have a plurality of wall panels, including an external perspective view of the front wall panel 210', an external perspective view of the left wall panel 220', an internal perspective view of the right wall panel 230', and a rear wall panel 240 'Internal perspective view and top perspective view of the top panel 250', as shown in FIG. 1A, the wall panels may be attached to the
將前壁面板210'及左壁面板220'用作例示性，框構件之各種具體實例可具有在框構件建構期間焊接至框構件之金屬薄片面板區段109。***面板110、窗面板120及可易於移除之保養窗130可裝設於壁框構
件中之每一者中，且可經由圖2之氣體封裝組裝件100之建構及解構之循環重複地裝設及移除。如可看出，在壁面板210'及壁面板220'之實例中，壁面板可具有最接近可易於移除之保養窗130的窗面板120。類似地，如在實例後壁面板240'中所描繪，壁面板可具有一窗面板(諸如，窗面板125)，其具有兩個鄰近手套端口140。對於根據本教示的壁框構件之各種具體實例，且如針對圖1A之氣體封裝組裝件100看出，手套之此配置使得易於自氣體封裝之外部接取所封裝之系統內的組件零件。因此，氣體封裝之各種具體實例可提供兩個或兩個以上手套端口，使得終端使用者可將左手套及右手套延伸至內部且操作內部中之一或多個項目，而不干擾在內部內的氣態大氣之組成。舉例而言，窗面板120及保養窗130中之任一者可經定位以有助於易於自氣體封裝組裝件之外部接取氣體封裝組裝件之內部中的可調整組件。根據窗面板(諸如，窗面板120及保養窗130)之各種具體實例，當未指示終端使用者可經由手套端口手套進行接取時，此等窗可不包括手套端口及手套端口組裝件。
Using the front wall panel 210' and the left wall panel 220' as illustrative, various specific examples of the frame member may have a sheet
如圖2中描繪之壁及頂板面板之各種具體實例可具有複數個***面板110。如可在圖2中看出，***面板可具有多種形狀及縱橫比。除了***面板之外，頂板面板250'可具有安裝、螺釘連接、螺紋連接、固定或另外緊固至頂板框250之一扇形過濾器單元蓋103以及第一頂板框管道105及第二頂板框管道107。如本文中隨後將更詳細地論述，與頂板面板250'之管道107流體連通之管道系統可裝設於氣體封裝組裝件之內部。根據本教示，此管道系統可為在氣體封裝組裝件內部之氣體循環系統之部分，以及提供分離退出氣體封裝組裝件之氣流，以用於在氣體封裝組裝件外部之至少一氣體淨化組件中循環。
Various specific examples of wall and ceiling panels as depicted in FIG. 2 may have
圖3為框構件組裝件200之分解前部透視圖，在其中可建構壁框220以包括全套面板。雖然不限於所展示之設計，但對於根據本教示
之框構件組裝件之各種具體實例，可將使用壁框220的框構件組裝件200用作例示性的。根據本教示，框構件組裝件之各種具體實例可包含各種框構件及裝設於各種框構件之各種框面板區段中的區段面板。
FIG. 3 is an exploded front perspective view of the
根據本教示之各種框構件組裝件之各種具體實例，框構件組裝件200可包含一框構件，諸如，壁框220。對於氣體封裝組裝件(諸如，圖1A之氣體封裝組裝件100)之各種具體實例，可利用收容於此氣體封裝組裝件中之設備的製程可不僅需要提供惰性環境的氣密封之封裝，且亦需要實質上無顆粒物之環境。在此點上，根據本教示之框構件可將各種尺寸之金屬管材料用於框之各種具體實例之建構。此等金屬管材料解決了所要的材料屬性，包括(但不限於)不會降級而產生顆粒物以及產生具有高強度然而最佳重量之框構件的高完整性材料，從而提供包含各種框構件及面板區段的氣體封裝組裝件之自一位點至另一位點的方便的輸送、建構及解構。根據本教示，滿足此等要求之任何材料可用於創造根據本教示之各種框構件。
According to various specific examples of various frame member assemblies of the present teaching, the
舉例而言，根據本教示的框構件之各種具體實例(諸如，框構件組裝件200)可自擠壓之金屬管系建構。根據框構件之各種具體實例，可將鋁、鋼及多種金屬複合材料用於建構框構件。在各種具體實例中，具有(例如但不限於)2"w×2"h、4"w×2"h及4"w×4"h之尺寸且具有1/8"至1/4"壁厚度之金屬管系可用以建構根據本教示的框構件之各種具體實例。另外，具有包括(但不限於)以下各者之材料屬性的多種管或其他形式之多種加強纖維聚合複合材料係可用的：不會降級而產生顆粒物以及產生具有高強度然而最佳重量之框構件的高完整性材料，從而提供自一位點至另一位點的方便的輸送、建構及解構。
For example, various specific examples of frame members according to the present teachings, such as
關於自各種尺寸之金屬管材料建構各種框構件，預期可進行焊接以創造框焊接件之各種具體實例。另外，可使用適當工業黏著劑自各
種尺寸之建置材料建構各種框構件。預期，應以將不固有地創造經由框構件之洩漏路徑的方式進行各種框構件之建構。在此點上，對於氣體封裝組裝件之各種具體實例，可使用不固有地創造經由框構件之洩漏路徑的任何方法進行各種框構件之建構。另外，可漆塗或塗佈根據本教示的框構件之各種具體實例(諸如，圖2之壁框220)。對於自易於(例如)氧化之金屬管系材料製造的框構件之各種具體實例，在形成於表面處之材料可創造顆粒物之情況下，可進行漆塗或塗佈或其他表面處理(諸如，陽極化)，以防止顆粒物之形成。
Regarding the construction of various frame members from metal tube materials of various sizes, it is expected that welding can be performed to create various specific examples of frame welded parts. In addition, suitable industrial adhesives can be used from various
Construction materials of various sizes are used to construct various frame members. It is expected that the construction of various frame members should be carried out in a manner that will not inherently create leakage paths through the frame members. In this regard, for various specific examples of gas packaging assemblies, construction of various frame members may be performed using any method that does not inherently create a leakage path through the frame members. In addition, various specific examples of the frame member according to the present teaching (such as the
框構件組裝件(諸如，圖3之框構件組裝件200)可具有一框構件，諸如，壁框220。壁框220可具有頂部壁框間隔板227可固定於其上之頂部226以及底部壁框間隔板229可固定於其上之底部228。如本文中隨後將更詳細地論述，安裝於框構件之表面上的間隔板為墊片密封系統之一部分，其與安裝於框構件區段中的面板之墊片密封一起提供根據本教示的氣體封裝組裝件之各種具體實例之氣密封。框構件(諸如，圖3之框構件組裝件200之壁框220)可具有若干面板框區段，其中每一區段可經製造以收納各種類型之面板，諸如(但不限於)***面板110、窗面板120及可易於移除之保養窗130。各種類型之面板區段可形成於框構件之建構中。面板區段之類型可包括(例如但不限於)用於收納***面板110之***面板區段10、用於收納窗面板120之窗面板區段20及用於收納可易於移除之保養窗130之保養窗面板區段30。
The frame member assembly (such as the
每一類型之面板區段可具有一面板區段框以收納一面板，且可使得每一面板可被可密封地固定至根據本教示之每一面板區段中，以用於建構氣密封之氣體封裝組裝件。舉例而言，在描繪根據本教示之框組裝件之圖3中，展示***面板區段10具有框12，展示窗面板區段20具有框22，且展示保養窗面板區段30具有框32。對於本教示之壁框組裝件之各種
具體實例，各種面板區段框可為藉由連續焊珠而焊接至面板區段之金屬薄片材料以提供氣密封。對於壁框組裝件之各種具體實例，可自包括選自加強之纖維聚合合成材料之建置材料的多種薄片材料製造各種面板區段框，可使用適當工業黏著劑將面板區段框安裝於面板區段中。如在關於密封之隨後教示中將更詳細地論述，每一面板區段框可具有安置於其上之可壓縮墊片以確保針對裝設且固定於每一面板區段中之每一面板形成氣密性密封。除了面板區段框之外，每一框構件區段亦可具有與定位面板以及與將面板牢固地固定於面板區段中有關之硬體。
Each type of panel section may have a panel section frame to receive a panel, and may enable each panel to be sealably fixed to each panel section according to the present teachings for use in the construction of hermetically sealed Gas package assembly. For example, in FIG. 3 depicting a frame assembly according to the present teachings, the
***面板110及用於窗面板120之面板框122之各種具體實例可自諸如(但不限於)鋁、鋁之各種合金及不鏽鋼的金屬薄片材料建構。面板材料之屬性可與構成框構件之各種具體實例的結構材料的屬性相同。在此點上，具有用於各種面板構件之屬性的材料包括(但不限於)不會降級而產生顆粒物以及產生具有高強度然而最佳重量之面板的高完整性材料，以便提供自一位點至另一位點的方便的輸送、建構及解構。(例如)蜂房狀核心薄片材料之各種具體實例可具有用作用於建構***面板110及窗面板120之面板框122之面板材料的必需屬性。蜂房狀核心薄片材料可由多種材料製成--金屬以及金屬複合物及聚合物，以及聚合物複合蜂房狀核心薄片材料。當自金屬材料製造時的可移除面板之各種具體實例可具有包括於面板中之接地連接，以確保當建構氣體封裝組裝件時，整個結構接地。
Various specific examples of the
考慮到用以建構本教示之氣體封裝組裝件的組件之可輸送本質，可在氣體封裝系統之使用期間重複地裝設及移除本教示之區段面板之各種具體實例中之任何者以提供對氣體封裝組裝件之內部的接取。 Considering the transportable nature of the components used to construct the gas packaging assembly of this teaching, any of various specific examples of the section panel of this teaching can be repeatedly installed and removed during use of the gas packaging system to provide Access to the inside of the gas package assembly.
舉例而言，用於收納可易於移除之保養窗面板130之面板區段30可具有四個間隔物之一集合，其中之一者指示為窗導引間隔物34。另外，經建構用於收納可易於移除之保養窗面板130之面板區段30可具有四
個夾緊夾板36之一集合，夾緊夾板可用以針對可易於移除之保養窗130中之每一者使用安裝於保養窗框132上之四個反向作用肘節夾136之一集合將保養窗130夾緊至保養窗面板區段30。另外，窗把手138中之每一者中的兩個可安裝於可易於移除之保養窗框132上以使得終端使用者易於移除及裝設保養窗130。可變化可移除保養窗把手之數目、類型及置放。另外，用於收納可易於移除之保養窗面板130之保養窗面板區段30可具有選擇性地裝設於每一保養窗面板區段30中的窗夾35中之至少兩個。雖然被描繪為在保養窗面板區段30中之每一者的頂部及底部中，但可按用以將保養窗130緊固於面板區段框32中之任何方式裝設至少兩個窗夾。可使用工具來移除及裝設窗夾35，以便允許移除及再裝設保養窗130。
For example, the
保養窗130之反向作用肘節夾136以及裝設於面板區段30中之硬體(包括夾緊夾板36、窗導引間隔物34及窗夾35)可由任何合適材料以及材料之組合建構成。舉例而言，一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。可移除之保養窗把手138可由任何合適材料以及材料之組合建構成。舉例而言，一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠、至少一種橡膠及其組合。封裝窗(諸如，窗面板120之窗124或保養窗130之窗134)可包含任何合適材料以及材料之組合。根據本教示之氣體封裝組裝件之各種具體實例，封裝窗可包含透明及半透明材料。在氣體封裝組裝件之各種具體實例中，封裝窗可包含基於矽石之材料(例如但不限於，玻璃及石英)以及各種類型的基於聚合之材料(例如但不限於，各種類別之聚碳酸酯、丙烯酸系物及乙烯基物)。根據本教示之系統及方法，各種複合物及其組合之透明及半透明性質為對於例示性窗材料合乎需要之屬性。
The reverse acting
如在針對圖8A至圖9B之以下教示中將論述，壁及頂板框構件密封件與氣密性區段面板框密封件一起提供用於需要惰性環境之空氣 敏感製程的氣密封之氣體封裝組裝件之各種具體實例。對提供反應性物質之實質上低濃度以及實質上低粒環境有影響的氣體封裝系統之組件可包括(但不限於)氣密封之氣體封裝組裝件，以及高度有效的氣體循環及粒子過濾系統(包括管道系統)。提供用於氣體封裝組裝件之有效氣密封件可為挑戰性的，尤其在三個框構件一起形成三側接頭之情況下。因而，三側接頭密封呈現關於提供用於可經由建構及解構之循環組裝及拆卸的氣體封裝組裝件之可易於裝設之氣密封的特別困難挑戰。 As will be discussed in the following teachings for FIGS. 8A-9B, the wall and roof frame member seals together with the airtight section panel frame seal provide air for inert environments Various specific examples of hermetically sealed gas packaging assemblies for sensitive processes. Components of a gas encapsulation system that have an impact on providing a substantially low concentration of reactive substances and a substantially low particle environment may include (but are not limited to) hermetically sealed gas encapsulation assemblies, and highly efficient gas circulation and particle filtration systems ( Including piping system). Providing effective gas seals for gas encapsulated assemblies can be challenging, especially where three frame members form a three-sided joint together. Thus, the three-side joint seal presents a particularly difficult challenge with regard to providing a gas seal that can be easily installed for gas packaging assemblies that can be assembled and disassembled through cycles of construction and deconstruction.
在此點上，根據本教示之氣體封裝組裝件之各種具體實例經由接頭之有效墊片密封提供完全建構之氣體封裝系統的氣密封，以及提供在負載支承建置組件周圍之有效墊片密封。與習知接頭密封不同，根據本教示之接頭密封：1)包括來自正交定向之墊片長度的鄰接之墊片段在接合三個框構件之頂部及底部終端框接頭接合點處的均勻平行對準，藉此避免了有角度的縫隙對準及密封，2)提供跨接頭之整個寬度形成鄰接之長度，藉此增大在三側接頭接合點處之密封接觸面積，3)經設計具有間隔板，間隔板提供跨所有垂直及水平以及頂部及底部三側接頭墊片密封件之均勻壓縮力。另外，墊片材料之選擇可影響提供氣密封件之有效性，其將在本文中隨後論述。 In this regard, various specific examples of gas encapsulation assemblies according to the present teachings provide effective gas seals for fully constructed gas encapsulation systems via effective gasket sealing of joints, as well as effective gasket sealing around load-bearing building components. Unlike conventional joint seals, joint seals according to the present teachings: 1) The adjacent pad segments including the gasket lengths from orthogonal orientations are evenly parallel at the joints of the top and bottom terminal frame joints joining the three frame members Alignment, thereby avoiding angular gap alignment and sealing, 2) providing the entire width of the joint to form an adjacent length, thereby increasing the sealing contact area at the joint of the three-side joint, 3) designed to have Spacers, spacers provide uniform compression across all vertical and horizontal and top and bottom joint gasket seals. In addition, the choice of gasket material can affect the effectiveness of providing a gas seal, which will be discussed later in this article.
圖4A至圖4C為描繪習知三側接頭密封件與根據本教示之三側接頭密封件的比較之頂部示意圖。根據本教示之氣體封裝組裝件之各種具體實例，可存在(例如但不限於)至少四個壁框構件、一頂板框構件及一底盤(其可接合以形成氣體封裝組裝件)，從而創造需要氣密封之複數個垂直、水平及三側接頭。在圖4A中，自第一墊片I(其在X-Y平面中與墊片II正交地定向)形成的習知三側墊片密封之頂部示意圖。如圖4A中所示，在X-Y平面中以正交定向形成之縫隙具有在由墊片之寬度尺寸界定的兩個段之間的接觸長度W1。另外，墊片III(其為在垂直方向上與墊片I及
墊片II兩者正交定向之墊片)之終端部分可鄰接墊片I及墊片II，如由影線所指示。在圖4B中，自第一墊片長度I形成的習知三側接頭墊片密封之頂部示意圖，第一墊片長度I與第二墊片長度II正交，且具有兩個長度之縫隙接合45°面，其中縫隙具有大於墊片材料之寬度的在兩個段之間的接觸長度W2。類似於圖4A之組態，墊片III(其在垂直方向上與墊片I及墊片II兩者正交)之終端部分可鄰接墊片I及墊片II，如由影線所指示。假定墊片寬度在圖4A與圖4B中相同，圖4B之接觸長度W2大於圖4A之接觸長度W1。
4A to 4C are schematic top views depicting a comparison of a conventional three-side joint seal and a three-side joint seal according to the present teachings. According to various specific examples of the gas packaging assembly of the present teaching, there may be (for example, but not limited to) at least four wall frame members, a top plate frame member and a chassis (which can be joined to form a gas packaging assembly), thereby creating a need A plurality of vertical, horizontal and three-side joints with air seal. In FIG. 4A, a schematic top view of a conventional three-sided gasket seal formed from a first gasket I (which is oriented orthogonally to gasket II in the XY plane). As shown in FIG. 4A, a slit formed in an orthogonal orientation in the XY plane has a contact length W 1 between two segments defined by the width dimension of the gasket. In addition, the terminal portion of the gasket III (which is a gasket oriented orthogonally to both the gasket I and the gasket II in the vertical direction) may be adjacent to the gasket I and the gasket II, as indicated by hatching. In FIG. 4B, a schematic top view of a conventional three-side joint gasket seal formed from the first gasket length I, the first gasket length I is orthogonal to the second gasket length II, and has two lengths of
圖4C為根據本教示的三側接頭墊片密封之頂部示意圖。第一墊片長度I可具有與墊片長度I之方向正交地形成之墊片段I'，其中墊片段I'具有可大致為正被接合的結構組件(諸如，用以形成本教示之氣體封裝組裝件之各種壁框構件的4"w×2"h或4"w×4"h金屬管)之寬度之尺寸的長度。墊片II在X-Y平面中與墊片I正交，且具有墊片段II'，墊片段II'具有大致為正被接合的結構組件之寬度的與墊片段I'之重疊長度。墊片段I'及II'之寬度為經選擇的可壓縮墊片材料之寬度。墊片III在垂直方向上與墊片I及墊片II兩者正交地定向。墊片段III'為墊片III之端部分。墊片段III'自墊片段III'的與墊片III之垂直長度正交之定向形成。墊片段III'可經形成使得其大致具有與墊片段I'及II'相同的長度，及為經選擇的可壓縮墊片材料之厚度的寬度。在此點上，針對圖4C中展示之三個對準之段的接觸長度W3大於在圖4A或圖4B中展示之習知三拐角接頭密封件(其分別具有接觸長度W1及W2)。 4C is a schematic diagram of the top of a three-sided joint gasket seal according to the teachings. The first shim length I may have a pad segment I′ formed orthogonal to the direction of the shim length I, wherein the pad segment I′ has a structural component (such as used to form the present teachings) that may be approximately being joined 4”w×2”h or 4”w×4”h metal tubes) of various wall frame members of the gas packaging assembly. The shim II is orthogonal to the shim I in the XY plane, and has a shim segment II′ having an overlap length with the shim segment I′ that is approximately the width of the structural component being joined. The width of the pad segments I'and II' is the width of the selected compressible pad material. The gasket III is oriented orthogonally to both the gasket I and the gasket II in the vertical direction. The pad segment III' is an end portion of the pad III. The pad segment III' is formed from the orientation of the pad segment III' orthogonal to the vertical length of the pad III. The pad segment III' may be formed so that it has approximately the same length as the pad segments I'and II', and a width that is the thickness of the selected compressible gasket material. At this point, the contact length W 3 for the three aligned segments shown in FIG. 4C is greater than the conventional three-corner joint seal shown in FIG. 4A or 4B (which have contact lengths W 1 and W 2, respectively) ).
在此點上，根據本教示之三側接頭墊片密封在終端接頭接合點處創造墊片段之均勻平行對準，而非原本的正交對準之墊片(如圖4A及圖4B之情況中所展示)。三側接頭墊片密封段之此均勻平行對準提供在各段上施加均勻橫向密封力，以促進在自壁框構件形成的接頭之頂角及底角 處之氣密性三側接頭密封件。另外，將用於每一三側接頭密封件的均勻對準之墊片段之每一段選擇為大致為正接合的結構組件之寬度，從而提供均勻對準之段之最大接觸長度。此外，根據本教示之接頭密封經設計具有間隔板，間隔板提供跨建置接頭之所有垂直、水平及三側墊片密封件之均勻壓縮力。可證明為針對圖6A及圖6B之實例給出的習知三側密封件選擇的墊片材料之寬度可為至少正被接合的結構組件之寬度。 At this point, the three-sided joint gasket seal according to the teachings creates uniform and parallel alignment of the pad segments at the terminal joint junction, rather than the original orthogonally aligned gasket (as shown in Figures 4A and 4B) Shown in the case). The uniform parallel alignment of the sealing sections of the three-sided joint gasket provides uniform lateral sealing force on each section to promote the top and bottom angles of the joint formed from the wall frame member Airtight three-side joint seals. In addition, each segment of the uniformly aligned pad segments for each three-side joint seal is selected to be approximately the width of the structural component being joined to provide the maximum contact length of the uniformly aligned segments. In addition, the joint seals according to this teaching are designed with spacer plates that provide uniform compressive force across all vertical, horizontal, and three-sided gasket seals across the joint. It can be demonstrated that the width of the gasket material selected for the conventional three-side seal given for the examples of FIGS. 6A and 6B can be at least the width of the structural component being joined.
圖5A之分解透視圖描繪在已接合所有框構件前的根據本教示之密封組裝件300，使得描繪處於未壓縮狀態中之墊片。在圖5A中，可在自氣體封裝組裝件之各種組件建構氣體封裝之第一步驟中可密封地接合複數個壁框構件(諸如，壁框310、壁框350以及頂板框370)。根據本教示之框構件密封為使得氣體封裝組裝件一旦經完全建構則可氣密封以及提供可經由氣體封裝組裝件之建構及解構之循環實施的密封之實質部分。雖然針對圖7A至圖7B之以下教示中給出之實例係針對氣體封裝組裝件之一部分之密封，但此等教示亦適用於本教示之氣體封裝組裝件中之任何者之全部。
The exploded perspective view of FIG. 5A depicts the
圖5A中描繪之第一壁框310可具有其上安裝間隔板312之內部側311、垂直側314及其上安裝間隔板316之頂表面315。第一壁框310可具有安置於自間隔板312形成之空間中且貼附至該空間的第一墊片320。在將第一墊片320安置於自間隔板312形成之空間中且貼附至該空間後剩餘的間隙302可沿第一墊片320之垂直長度伸展，如圖5A中所示。如圖5A中所描繪，柔性墊片320可安置於自間隔板312形成之空間中且貼附至該空間，且可具有垂直墊片長度321、曲線墊片長度323及在平面中與內部框構件311上之垂直墊片長度321成90°形成且終止於壁框310之垂直側314的墊片長度325。在圖5A中，第一壁框310可具有其上安裝間隔板316之頂表面315，藉此在最接近壁框310之內邊緣317處形成第二墊片340安置於
且貼附至的表面315上的空間。在將第二墊片340安置於自間隔板316形成之空間中且貼附至該空間後剩餘的間隙304可沿第二墊片340之水平長度伸展，如圖5A中所示。另外，如由影線所指示，墊片340之長度345與墊片320之長度325均勻地平行且相鄰地對準。
The
圖5A中描繪之第二壁框350可具有外部框側353、垂直側354及其上安裝間隔板356之頂表面355。第二壁框350可具有安置於自間隔板356形成之空間中且貼附至該空間之第一墊片360。在將第一墊片360安置於自間隔板356形成之空間中且貼附至該空間後剩餘的間隙306可沿第一墊片360之水平長度伸展，如圖5A中所示。如圖5A中所描繪，柔性墊片360可具有水平長度361、曲線長度363及在頂表面355上之平面中按90°形成且終止於外部框構件353處之長度365。
The
如在圖5A之分解透視圖中所指示，壁框310之內部框構件311可接合至壁框350之垂直側354以形成氣體封裝框組裝件之一個建置接頭。關於如此形成的建置接頭之密封，在如在圖5A中所描繪之處於根據本教示的壁框構件之終端接頭接合點處的墊片密封之各種具體實例中，墊片320之長度325、墊片360之長度365及墊片340之長度345皆相鄰且均勻地對準。另外，如本文中隨後將更詳細地論述，本教示之間隔板之各種具體實例可提供用於氣密封本教示之氣體封裝組裝件之各種具體實例的可壓縮墊片材料之具有約20%至約40%之間的偏轉的均勻壓縮。
As indicated in the exploded perspective view of FIG. 5A, the
圖5B描繪在已接合了所有框構件後的根據本教示之密封組裝件300，使得描繪處於壓縮狀態中之墊片。圖5B為展示形成於第一壁框310、第二壁框350與頂板框370之間的頂部終端接頭接合點處的三側接頭之拐角密封件之細節(其以幻象圖展示)之透視圖。如圖5B中所示，由間隔板界定之墊片空間可經判定為寬度，使得在接合了壁框310、壁框350及頂板框370(以幻象圖展示)後，用於形成垂直、水平及三側墊片密封件的
可壓縮墊片材料之具有約20%至約40%之間的偏轉的均勻壓縮確保在密封於壁框構件之接頭處的所有表面處之墊片密封可提供氣密封。另外，墊片間隙302、304及306(圖中未示)經定尺寸，使得在可壓縮墊片材料之具有約20%至約40%之間的偏轉的最佳壓縮後，每一墊片可填充墊片間隙，如針對圖5B中之墊片340及墊片360所展示。因而，除了藉由界定每一墊片可安置於其中且貼附至之空間來提供均勻壓縮外，經設計以提供間隙的間隔板之各種具體實例亦確保每一壓縮之墊片可在由間隔板界定之空間內保形，而不會起皺或膨脹或另外以可形成洩漏路徑之方式按壓縮狀態不規則地形成。
FIG. 5B depicts the
根據本教示之氣體封裝組裝件之各種具體實例，可使用安置於面板區段框之每一者上的可壓縮墊片材料來密封各種類型之區段面板。與框構件墊片密封一起，用以形成各種區段面板與面板區段框之間的密封件之可壓縮墊片之位置及材料可提供具有極少或無氣體洩漏的氣密封之氣體封裝組裝件。另外，針對所有類型之面板(諸如，圖3之***面板110、窗面板120及可易於移除之保養窗130)之密封設計可提供在此等面板之重複移除及裝設後的持久面板密封，為了接取氣體封裝組裝件之內部，重複移除及裝設可為需要的，例如，為了維護。
According to various specific examples of the gas packaging assembly of the present teachings, a compressible gasket material disposed on each of the panel segment frames can be used to seal various types of segment panels. Together with the frame member gasket seal, the location and material of the compressible gasket used to form the seal between various section panels and panel section frames can provide a hermetically sealed gas packaging assembly with little or no gas leakage . In addition, the sealing design for all types of panels (such as the
舉例而言，圖6A為描繪保養窗面板區段30及可易於移除之保養窗130之分解圖。如本文中先前所論述，保養窗面板區段30可經製造，用於收納可易於移除之保養窗130。對於氣體封裝組裝件之各種具體實例，諸如可移除之服務面板區段30之面板區段可具有面板區段框32以及安置於面板區段框32上之可壓縮墊片38。在各種具體實例中，與將可易於移除之保養窗130固定於可移除之保養窗面板區段30中有關的硬體可對終端使用者提供裝設及重新裝設之容易性，且同時確保當可易於移除之保養窗130由需要對氣體封裝組裝件之內部之直接接取的終端使用者按需要裝設
及重新裝設於面板區段30中時維持氣密性密封。可易於移除之保養窗130可包括剛性窗框132，其可自(例如但不限於)如針對建構本教示之框構件中之任何者所描述的金屬管材料建構。保養窗130可利用快速起作用固定硬體(例如但不限於，反向作用肘節夾136)，以便使得終端使用者易於移除及重新裝設保養窗130。
For example, FIG. 6A is an exploded view depicting the maintenance
如在圖6A之可移除之保養窗面板區段30之前視圖中所示，可易於移除之保養窗130可具有緊固於窗框132上的四個肘節夾136之一集合。可按用於確保對墊片38之恰當壓縮力的經定義之距離將保養窗130定位至面板區段框30內。使用如圖6B中展示的四個窗導引間隔物34之集合，其可裝設於面板區段30之每一拐角中用於將保養窗130定位於面板區段30中。可提供夾緊夾板36中之每一者之集合以收納可易於移除之保養窗130之反向作用肘節夾136。根據保養窗130之氣密封之各種具體實例，經由裝設及移除之循環，保養窗框132之機械強度與由窗導引間隔物34之集合相對於可壓縮墊片38提供的保養窗130之經界定位置一起的組合可確保一旦藉由(例如但不限於)使用固定於各別夾緊夾板36中之反向作用肘節夾136將保養窗130緊固於適當位置，則保養窗框132可藉由如由窗導引間隔物34之集合設定的定義之壓縮在面板區段框32上提供均勻力。窗導引間隔物34之集合經定位使得窗130對墊片38的壓縮力使可壓縮墊片38在約20%至約40%之間偏轉。在此點上，保養窗130之建構以及面板區段30之製造提供在面板區段30中的保養窗130之氣密性密封。如本文中先前所論述，可在將保養窗130固定至面板區段30內之後將窗夾35裝設於面板區段30內，且在需要移除保養窗130時而移除窗夾35。
As shown in the front view of the removable maintenance
可使用任何合適方式以及方式之組合將反向作用肘節夾136緊固至可易於移除之保養窗框132。可使用的合適的緊固方式之實例包括至少一種黏著劑(例如但不限於，環氧樹脂或黏合劑)、至少一螺釘、至少一
螺桿、至少另一扣件、至少一槽、至少一軌道、至少一焊接部及其組合。反向作用肘節夾136可直接連接至可移除之保養窗框132或間接地經由轉接板連接。反向作用肘節夾136、夾緊夾板36、窗導引間隔物34及窗夾35可由任何合適的材料以及材料之組合建構成。舉例而言，一或多個此等元件可包含至少一種金屬、至少一種陶瓷、至少一種塑膠及其組合。
Any suitable method and combination of methods may be used to secure the reverse-acting
除了密封可易於移除之保養窗之外，亦可針對***面板及窗面板提供氣密性密封。可在面板區段中重複裝設及移除的其他類型之區段面板包括(例如但不限於)***面板110及窗面板120，如圖3中所示。如可在圖3中看出，類似於***面板110建構窗面板120之面板框122。因而，根據氣體封裝組裝件之各種具體實例，用於收納***面板與窗面板的面板區段之製造可相同。在此點上，可使用相同原理實施***面板及窗面板之密封。
In addition to sealing maintenance windows that can be easily removed, airtight seals can also be provided for insert panels and window panels. Other types of section panels that can be repeatedly installed and removed in the panel section include (eg, but not limited to) the
參看圖7A及圖7B，且根據本教示之各種具體實例，氣體封裝(諸如，圖1之氣體封裝組裝件100)的面板中之任何者可包括一或多個***面板區段10，其可具有經組態以收納各別***面板110之框12。圖7A為指示圖9B中展示的擴大部分之透視圖。在圖7A中，描繪關於***框12定位之***面板110。如圖7B中可見，***面板110貼附至框12，其中框12可(例如)由金屬建構成。在一些具體實例中，金屬可包含鋁、鋼、銅、不鏽鋼、鉻、合金及其組合及類似者。可在***面板區段框12中製造複數個盲螺紋孔14。面板區段框12經建構以便在***面板110與框12之間包含一墊片16，可壓縮墊片18可安置於其中。盲螺紋孔14可屬於M5種類。螺桿15可由盲螺紋孔14收納，壓縮在***面板110與框12之間的墊片16。一旦與墊片16相抵固定至適當位置，則***面板110在***面板區段10內形成氣密性密封。如本文中先前所論述，可針對多種區段面板(包括但不限於，***面板110及窗面板120，如圖3中所示)實施此面板密封。
7A and 7B, and according to various specific examples of the present teachings, any of the panels of a gas package (such as the
根據根據本教示的可壓縮墊片之各種具體實例，用於框構件密封及面板密封之可壓縮墊片材料可選自多種可壓縮聚合材料，例如(但不限於)，在封閉氣室式聚合材料之類別中的任何者，在此項技術領域中亦被稱作膨脹橡膠材料或膨脹聚合物材料。簡要地，按氣體封裝於離散氣室中之方式製備封閉氣室式聚合物，其中每一離散氣室由聚合材料封裝。對於在框及面板組件之氣密性密封中使用合乎需要的可壓縮封閉氣室式聚合墊片材料之性質包括(但不限於)其對廣泛範圍的化學物質的化學侵蝕穩固，擁有優異的防濕性質，在寬泛的溫度範圍上有回彈性，且其抵抗永久壓縮變形。一般而言，與開放氣室式結構之聚合材料相比，封閉氣室式聚合材料具有較高之尺寸穩定性、較低水分吸收係數及較高強度。可藉以製成封閉氣室式聚合材料的各種類型之聚合材料包括(例如但不限於)聚矽氧、氯丁橡膠、乙烯-聚丙烯-二烯三元共聚物(EPT)；使用乙烯-聚丙烯-二烯單體(EPDM)製造之聚合物及複合物、乙烯腈、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合物。 According to various specific examples of compressible gaskets according to the present teachings, the compressible gasket material used for frame member sealing and panel sealing can be selected from a variety of compressible polymeric materials, such as (but not limited to), polymerized in a closed air chamber Any of the categories of materials is also referred to as expanded rubber material or expanded polymer material in this technical field. Briefly, a closed cell type polymer is prepared in such a way that the gas is enclosed in discrete gas cells, wherein each discrete gas cell is encapsulated by a polymeric material. For the use of desirable compressible closed gas chamber type polymeric gasket materials in the airtight sealing of frame and panel components, including (but not limited to) its chemical attack on a wide range of chemical substances is stable, with excellent protection Wet properties, resilience over a wide temperature range, and it resists permanent compression deformation. Generally speaking, compared with the polymer material of open cell structure, the polymer material of closed cell type has higher dimensional stability, lower moisture absorption coefficient and higher strength. Various types of polymeric materials that can be used to make closed-cell polymeric materials include (for example, but not limited to) polysiloxane, neoprene, ethylene-polypropylene-diene terpolymer (EPT); use ethylene-polyethylene Propylene-diene monomer (EPDM) polymers and composites, vinyl nitrile, styrene-butadiene rubber (SBR) and various copolymers and blends thereof.
僅當包含塊材之氣室在使用期間保持完整時，才能維持封閉氣室式聚合物之合乎需要的材料性質。在此點上，按可超過針對封閉氣室式聚合物設定之材料規範(例如，超過用於在規定溫度或壓縮範圍內使用之規範)的方式使用此材料可造成墊片密封之降級。在用於密封框面板區段中之框構件及區段面板的封閉氣室式聚合物墊片之各種具體實例中，此等材料之壓縮不應超過約50%至約70%之間的偏轉，且為了最佳效能，可為在約20%至約40%之間的偏轉。 Only when the gas cell containing the block material remains intact during use, the desirable material properties of the closed gas cell polymer can be maintained. At this point, the use of this material in a manner that can exceed the material specifications set for closed cell polymers (eg, exceeding the specifications for use within the specified temperature or compression range) can cause degradation of the gasket seal. In various specific examples of closed-chamber polymer gaskets used to seal frame members and section panels in frame panel sections, the compression of these materials should not exceed a deflection between about 50% and about 70% And, for best performance, it can be a deflection between about 20% to about 40%.
除了封閉氣室式可壓縮墊片材料之外，具有用於在建構根據本教示之氣體封裝組裝件之具體實例的過程中使用的所要屬性之可壓縮墊片材料之類別之另一實例包括中空擠壓之可壓縮墊片材料之類別。作為一材料類別的中空擠壓之墊片材料具有合乎需要之屬性，包括(但不限於) 其對廣泛範圍的化學物質的化學侵蝕穩固，擁有優異的防濕性質，在寬泛的溫度範圍上有回彈性，且其抵抗永久壓縮變形。此等中空擠壓之可壓縮墊片材料可呈廣泛多種外觀尺寸，諸如(但不限於)，U形氣室、D型氣室、正方形氣室、矩形氣室以及多種定製外觀尺寸的中空擠壓之墊片材料中之任何者。各種中空擠壓之墊片材料可自用於封閉氣室式可壓縮墊片製造之聚合材料製造。舉例而言(但不限於)，中空擠壓之墊片之各種具體實例可自以下各物製造：聚矽氧、氯丁橡膠、乙烯-聚丙烯-二烯三元共聚物(EPT)；使用乙烯-聚丙烯-二烯單體(EPDM)製造之聚合物及複合物、乙烯腈、苯乙烯-丁二烯橡膠(SBR)及其各種共聚物及摻合物。此等中空氣室墊片材料之壓縮不應超過約50%偏轉，以便維持所要的屬性。雖然封閉氣室式可壓縮墊片材料之類別及中空擠壓之可壓縮墊片材料之類別已被給定為實例，但具有所要屬性之任何可壓縮墊片材料可用於密封結構組件(諸如，各種壁及頂板框構件)以及密封面板區段框中之各種面板，如由本教示所提供。 In addition to closed-air-chamber compressible gasket materials, another example of a category of compressible gasket materials having the desired attributes for use in constructing specific examples of gas package assemblies according to the teachings includes hollow The type of extruded compressible gasket material. As a material category, hollow extruded gasket materials have desirable properties, including (but not limited to) It is chemically aggressive against a wide range of chemicals, has excellent moisture resistance, has resilience over a wide temperature range, and it resists permanent compression deformation. These hollow extruded compressible gasket materials can have a wide variety of appearance sizes, such as (but not limited to), U-shaped gas chamber, D-shaped gas chamber, square gas chamber, rectangular gas chamber and various customized appearance hollow sizes Any of the extruded gasket materials. Various hollow extruded gasket materials can be manufactured from polymeric materials used in the manufacture of compressible gaskets with closed air chambers. For example (but not limited to), various specific examples of hollow extruded gaskets can be manufactured from the following: polysiloxane, neoprene, ethylene-polypropylene-diene terpolymer (EPT); use Polymers and composites made of ethylene-polypropylene-diene monomer (EPDM), vinyl nitrile, styrene-butadiene rubber (SBR) and various copolymers and blends thereof. The compression of these air chamber gasket materials should not exceed about 50% deflection in order to maintain the desired properties. Although the types of compressible gasket materials for closed-air chambers and the types of compressible gasket materials for hollow extrusion have been given as examples, any compressible gasket material with the desired properties can be used to seal structural components (such as, Various wall and roof frame members) and various panels in the sealing panel section frame, as provided by this teaching.
圖8為本教示的頂板面板(例如，圖1A之氣體封裝組裝件100之頂板面板250')之各種具體實例之仰視圖。根據用於氣體封裝之組裝的本教示之各種具體實例，可在頂板面板(例如，圖1A之氣體封裝組裝件100之頂板面板250')之內部頂表面上裝設照明設備。如圖8中所描繪，具有內部部分251之頂板框250可具有裝設於各種框構件之內部部分上的照明設備。舉例而言，頂板框250可具有兩個頂板框區段40，其共同地具有兩個頂板框樑42及44。每一頂板框區段40可具有朝向頂板框250之內部定位的第一側41及朝向頂板框250之外部定位的第二側43。對於提供氣體封裝之照明的根據本教示之各種具體實例，可裝設數對照明元件46。每一對照明元件46可包括最接近頂板框區段40之第一側41的第一照明元件45，及最接近第二側43的第二照明元件47。圖8中展示的照明元件之數目、定
位及分群係例示性的。可按任何所要的或合適方式變化照明元件之數目及分群。在各種具體實例中，可平地安裝照明元件，而在其他具體實例中，其可經安裝使得其可移動至多種位置及角度。照明元件之置放不限於頂部面板頂板433，而可位於(另外或在替代方案中)任一其他內表面、外表面及圖1A中展示的氣體封裝組裝件100之表面之組合上。
FIG. 8 is a bottom view of various specific examples of the top panel (eg, the
各種照明元件可包含任何數目個燈、任何類型之燈或燈之任何組合，例如，鹵素燈、白色燈、白熾燈、弧光燈或發光二極體或器件(LED)。舉例而言，每一照明元件可包含1個LED至約100個LED、約10個LED至約50個LED或大於100個LED。LED或其他照明器件可發射在色彩光譜中、在色彩光譜外或其組合的任一色彩或色彩組合。根據用於OLED材料之噴墨印刷的氣體封裝組裝件之各種具體實例，因為一些材料對一些波長之光敏感，所以用於裝設於氣體封裝組裝件中的照明器件之光之波長可被具體選擇以避免在處理期間之材料降級。舉例而言，可將4X冷白LED用作4X黃LED或其任何組合。4X冷白LED之一實例為可購自加利福尼亞州Sunnyvale之IDEC Corporation的LF1B-D4S-2THWW4。可使用的4X黃LED之一實例為亦可購自IDEC Corporation之LF1B-D4S-2SHY6。LED或其他照明元件可經定位於頂板框250之內部部分251上或氣體封裝組裝件之另一表面上或自該內部部分上或該另一表面上之任一位置懸掛。照明元件不限於LED。可使用任一合適的照明元件或照明元件之組合。圖9為IDEC LED光譜之曲線圖且展示對應於當峰值強度為100%時之強度的X軸及對應於波長(以奈米計)之Y軸。展示用於LF1B黃類型、黃螢光燈、LF1B白型LED、LF1B冷白型LED及LF1B紅型LED之光譜。根據本教示之各種具體實例，可使用其他光譜及光譜之組合。
The various lighting elements may include any number of lamps, any type of lamp, or any combination of lamps, for example, halogen lamps, white lamps, incandescent lamps, arc lamps, or light emitting diodes or devices (LEDs). For example, each lighting element may include 1 LED to about 100 LEDs, about 10 LEDs to about 50 LEDs, or more than 100 LEDs. The LED or other lighting device may emit any color or combination of colors in the color spectrum, outside the color spectrum, or a combination thereof. According to various specific examples of gas packaging assemblies used for inkjet printing of OLED materials, since some materials are sensitive to light of some wavelengths, the wavelength of light used for lighting devices installed in the gas packaging assembly can be specified Choose to avoid material degradation during processing. For example, 4X cool white LEDs can be used as 4X yellow LEDs or any combination thereof. An example of a 4X cold white LED is LF1B-D4S-2THWW4 available from IDEC Corporation of Sunnyvale, California. An example of a 4X yellow LED that can be used is LF1B-D4S-2SHY6, also available from IDEC Corporation. The LED or other lighting element may be positioned on or suspended from the
回想起按使氣體封裝組裝件之內部容積最小化且同時最佳化工作空間以容納各種OLED印刷系統之各種佔據面積的方式建構氣體封 裝組裝件之各種具體實例。如此建構的氣體封裝組裝件之各種具體實例另外使得易於在處理期間自外部接取氣體封裝組裝件之內部及易於接取內部以為了維護，同時使停機時間最小化。在此點上，根據本教示的氣體封裝組裝件之各種具體實例可具有關於各種OLED印刷系統之各種佔據面積的輪廓。 Recall that the gas enclosure was constructed in such a way as to minimize the internal volume of the gas packaging assembly and at the same time optimize the working space to accommodate various occupied areas of various OLED printing systems Various specific examples of assembly. The various specific examples of the gas package assembly thus constructed additionally make it easy to access the inside of the gas package assembly from the outside during processing and the inside for maintenance, while minimizing downtime. In this regard, various specific examples of gas package assemblies according to the present teachings can have contours regarding various occupied areas of various OLED printing systems.
根據本教示之系統及方法，框構件建構、面板建構、框及面板密封以及氣體封裝(諸如，圖1A之氣體封裝100)之建構可應用於多種大小及設計之氣體封裝。氣體封裝組裝件之各種具體實例可具有經建構以提供氣體封裝組裝件之輪廓的各種框構件。本教示之氣體封裝組裝件之各種具體實例可容納一OLED印刷系統，同時最佳化工作空間以使惰性氣體容積最小化，且亦允許易於在處理期間自外部接取OLED印刷系統。在此點上，本教示之各種氣體封裝組裝件可在輪廓拓撲及容積上有變化。作為非限制性實例，根據本教示之輪廓化氣體封裝之各種具體實例可具有用於容納能夠印刷自Gen 3.5至Gen 10之基板大小的印刷系統之各種具體實例的在約6m3至約95m3之間的氣體封裝容積。藉由再一非限制性實例，根據本教示之輪廓化氣體封裝之各種具體實例可具有用於容納能夠印刷(例如)Gen 5.5至Gen 8.5基板大小的印刷系統之各種具體實例的在約15m3至約30m3之間的氣體封裝容積。與具有針對寬度、長度及高度之非輪廓化尺寸之非輪廓化封裝相比，輪廓化氣體封裝之此等具體實例可具有在約30%至約70%之間的容積節省。
According to the system and method of the present teachings, frame member construction, panel construction, frame and panel sealing, and gas packaging (such as the
圖9之氣體封裝組裝件1000可具有在本教示中針對圖1A之例示性氣體封裝組裝件100所敍述之所有特徵。舉例而言(但不限於)，氣體封裝組裝件1000可利用在建構及解構之循環中提供氣密性封裝的根據本教示之密封。基於氣體封裝組裝件1000的氣體封裝系統之各種具體實例可具有一氣體淨化系統，該氣體淨化系統可將包括各種反應性大氣源氣體(諸
如，水蒸氣及氧)以及有機溶劑蒸氣的各種反應性物質中之每一物質之含量維持處於100ppm或更低，例如，處於10ppm或更低，處於1.0ppm或更低，或處於0.1ppm或更低。
The
另外，如本文中隨後將更詳細地論述，基於(例如但不限於)圖1A之氣體封裝組裝件100及圖9之氣體封裝組裝件1000的氣體封裝系統之各種具體實例可具有可提供層流環境之循環及過濾系統，層流環境可使亂流最小化且可藉由維持符合國際標準組織標準(ISO)14644-1：1999(如由第1類別至第5類別指定)之標準的空中顆粒含量來創造實質上低粒環境。可使用(例如)攜帶型粒子計數器件在印刷製程前針對氣體封裝系統之各種具體實例執行空中顆粒物之判定，用於系統驗證。在氣體封裝系統之各種具體實例中，可當印刷基板時在原地執行空中顆粒物之判定，作為持續進行之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行空中顆粒物之判定，用於系統驗證。
In addition, as will be discussed in more detail later in this document, various specific examples of gas packaging systems based on (eg, but not limited to) the
另外，對於本教示之氣體封裝系統之各種具體實例，實質上低粒環境可提供實質上低粒基板表面。基於本教示之氣體封裝系統之各種具體實例的模型化表明，在無本教示之各種粒子控制系統之情況下，對於在0.1μm及更大之大小範圍中的粒子，每平方公尺基板每印刷循環的基板上沈積可在大於約1百萬至大於約1千萬個粒子之間。此等計算表明，在無本教示之各種粒子控制系統之情況下，對於在約2μm及更大之大小範圍中的粒子，每平方公尺基板每印刷循環的基板上沈積可在大於約1000至大於約10,000個粒子之間。可使用(例如)測試基板在印刷基板前針對氣體封裝系統之各種具體實例執行基板上的顆粒物的基板上分佈之判定，用於系統驗證。在氣體封裝系統之各種具體實例中，可當印刷基板時在原地執行顆粒物之基板上分佈之判定，作為持續進行之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行 顆粒物之基板上分佈之判定，用於系統驗證。 In addition, for various specific examples of the gas packaging system of the present teachings, a substantially low-grain environment can provide a substantially low-grain substrate surface. Modeling based on various specific examples of the gas packaging system of this teaching shows that, without the various particle control systems of this teaching, for particles in the size range of 0.1 μm and larger, each square meter of substrate per printing The deposition on the circulating substrate may be between greater than about 1 million and greater than about 10 million particles. These calculations show that, without the various particle control systems of this teaching, for particles in the size range of about 2 μm and larger, the deposition per square meter of substrate per printing cycle can be greater than about 1000 to Between about 10,000 particles. For example, the test substrate can be used to perform the determination of the distribution of particulates on the substrate on the substrate for various specific examples of the gas encapsulation system before printing the substrate for system verification. In various specific examples of the gas encapsulation system, the determination of the distribution of particles on the substrate can be performed in situ when the substrate is printed, as a continuous quality inspection. Various specific examples of gas packaging systems can be performed in situ before printing the substrate and additionally when printing the substrate The determination of the distribution of particles on the substrate is used for system verification.
氣體封裝系統之各種具體實例可具有可維持實質上低粒環境之一粒子控制系統，從而提供在約0.1μm或更大至約10μm或更大之間的粒子之基板上粒子規範。對於目標粒徑範圍中之每一者，基板上粒子規範之各種具體實例可易於自每分鐘每平方公尺基板之平均基板上粒子分佈轉換至每分鐘每基板之平均基板上粒子分佈。如本文中先前所論述，可易於經由基板(例如，具體代大小之基板)與彼基板代之對應面積之間的已知關係進行此轉換。另外，可易於將每分鐘每平方公尺基板之平均基板上粒子分佈轉換至多種單位時間表達中之任何者。舉例而言，除了在標準時間單位(例如，秒、分鐘及天)之間的轉換外，亦可使用與處理具體有關之時間單位。舉例而言，如本文中先前所論述，印刷循環可與時間單位相關聯。 Various specific examples of gas encapsulation systems may have a particle control system that can maintain a substantially low particle environment, thereby providing on-substrate particle specifications for particles between about 0.1 μm or greater and about 10 μm or greater. For each of the target particle size ranges, various specific examples of the on-substrate particle specification can be easily converted from the average on-substrate particle distribution per minute per square meter of substrate to the average on-substrate particle distribution per minute per substrate. As previously discussed herein, this conversion can be easily performed via a known relationship between the substrate (eg, a substrate of a specific generation size) and the corresponding area of the substrate generation. In addition, the average particle distribution on the substrate per minute per square meter of substrate can be easily converted to any of a variety of unit time expressions. For example, in addition to conversion between standard time units (e.g., seconds, minutes, and days), time units specifically related to processing may also be used. For example, as previously discussed herein, a printing cycle may be associated with a unit of time.
本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於10μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於2μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.5μm之粒子提供符 合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。對於本教示之氣體封裝系統之各種具體實例，可維持低粒環境，從而對於大小大於或等於0.3μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。 Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a particle deposition rate specification that is less than or equal to about 100 particles per square meter substrate per minute for particles larger than or equal to 10 μm Average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing particles with a size greater than or equal to 5 μm that meet the deposition rate specification on the substrate of less than or equal to about 100 particles per square meter of substrate per minute Average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that meets a particle size of less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 2 μm The average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low-grain environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 1 μm The average particle distribution on the substrate. Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a symbol for particles larger than or equal to 0.5 μm The average on-substrate particle distribution at a substrate deposition rate that is less than or equal to about 1,000 particles per square meter of substrate per minute on the substrate. For various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.3 μm The average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.1 μm The average particle distribution on the substrate.
圖9描繪根據本教示之氣體封裝組裝件之各種具體實例的氣體封裝組裝件1000之透視圖。氣體封裝組裝件1000可包括前部面板組裝件1200'、中間面板組裝件1300'及後部面板組裝件1400'。前部面板組裝件1200'可包括前部頂板面板組裝件1260'、可具有用於收納基板之開口1242的前部壁面板組裝件1240'及前部基底面板組裝件1220'。後部面板組裝件1400'可包括後部頂板面板組裝件1460'、後部壁面板組裝件1440'及後部基底面板組裝件1420'。中間面板組裝件1300'可包括第一中間封裝面板組裝件1340'、中間壁及頂板面板組裝件1360'及第二中間封裝面板組裝件1380'以及中間基底面板組裝件1320'。
9 depicts a perspective view of a
另外，中間面板組裝件1300'可包括第一印刷頭管理系統輔助面板組裝件1330'以及第二印刷頭管理系統輔助面板組裝件(圖中未示)。如本文中先前所論述，建構為氣體封裝組裝件之一區段的輔助封裝之各種具體實例可被與氣體封裝系統之工作容積可密封地隔離。輔助封裝與(例如)印刷系統封裝之此實體隔離可使得能夠進行各種程序(例如但不限於對印刷頭組裝件之各種維護程序)同時極少打斷或不打斷印刷製程，藉此最小化或消除氣體封裝系統停機時間。 In addition, the intermediate panel assembly 1300' may include a first print head management system auxiliary panel assembly 1330' and a second print head management system auxiliary panel assembly (not shown). As previously discussed herein, various specific examples of auxiliary packaging constructed as a section of a gas packaging assembly can be sealably isolated from the working volume of the gas packaging system. This physical isolation of auxiliary packaging from, for example, printing system packaging can enable various procedures (such as, but not limited to, various maintenance procedures for the print head assembly) with little or no interruption of the printing process, thereby minimizing or Eliminate gas packaging system downtime.
如圖10A中所描繪，氣體封裝組裝件1000可包括前部基底
面板組裝件1220'、中間基底面板組裝件1320'及後部基底面板組裝件1420'，該等面板組裝件當經完全建構時形成其上可安裝OLED印刷系統2000之相鄰基底或底盤。按與針對圖1A之氣體封裝組裝件100所描述類似的方式，氣體封裝組裝件1000的包含前部面板組裝件1200'、中間面板組裝件1300'及後部面板組裝件1400'之各種框構件及面板可接合於OLED印刷系統2000周圍以形成印刷系統封裝。因此，完全建構之氣體封裝組裝件(諸如，氣體封裝組裝件1000)當與各種環境控制系統整合時可形成包括OLED印刷系統2000之各種具體實例的氣體封裝系統之各種具體實例。根據如先前所描述的本教示之氣體封裝系統之各種具體實例，由氣體封裝組裝件界定的內部容積之環境控制可包括對照明之控制(例如，藉由特定波長之燈的數目及置放)、使用粒子控制系統之各種具體實例的顆粒物之控制、使用氣體淨化系統之各種具體實例的反應性氣體物質之控制及使用熱控制系統之各種具體實例的氣體封裝組裝件之溫度控制。
As depicted in FIG. 10A, the
圖10B中之展開圖中展示的OLED噴墨印刷系統(諸如，圖10A之OLED印刷系統2000)可包含允許將墨滴可靠地置放至基板上之特定位置上之若干個器件及裝置。此等器件及裝置可包括(但不限於)印刷頭組裝件、墨水傳遞系統、用於在印刷頭組裝件與基板之間提供相對移動之運動系統、基板支撐裝置、基板裝載及卸載系統及印刷頭管理系統。
The OLED inkjet printing system shown in the expanded view of FIG. 10B (such as the
印刷頭組裝件可包括至少一噴墨頭，其具有能夠按受控速率、速度及大小噴出墨水滴之至少一孔。噴墨頭由將墨水提供至噴墨頭的墨水供應系統饋入。如在圖10B之展開圖中所展示，OLED噴墨印刷系統2000可具有一基板(諸如，基板2050)，其可由基板支撐裝置支撐，基板支撐裝置諸如夾盤，例如(但不限於)真空夾盤、具有壓力端口之基板浮動夾盤及具有真空及壓力端口之基板浮動夾盤。在本教示之系統及方法之各種具體實例中，基板支撐裝置可為基板浮動台。如本文中隨後將更詳細地
論述，圖10B之基板浮動台2200可用於支撐基板2050，且與Y軸運動系統一起可為提供基板2050之無摩擦傳送的基板傳送系統之部分。本教示之Y軸運動系統可包括第一Y軸軌道2351及第二Y軸軌道2352，其可包括用於固持基板之一夾爪系統(圖中未示)。Y軸運動可由線性空氣軸承或線性機械系統提供。圖10A及圖10B中展示的OLED噴墨印刷系統2000之基板浮動台2200可界定基板2050在印刷製程期間穿過圖9之氣體封裝組裝件1000之行進。
The printing head assembly may include at least one inkjet head having at least one hole capable of ejecting ink droplets at a controlled rate, speed, and size. The inkjet head is fed by an ink supply system that supplies ink to the inkjet head. As shown in the expanded view of FIG. 10B, the OLED
印刷需要在印刷頭組裝件與基板之間的相對運動。此藉由運動系統(典型地，高架或***軸線XYZ系統)實現。印刷頭組裝件可在靜止基板上移動(高架式)，或在***軸線組態之情況下，印刷頭及基板皆可移動。在另一具體實例中，印刷頭組裝件可實質上靜止(例如，在X及Y軸上)，且基板可相對於印刷頭在X及Y軸上移動，其中Z軸運動由基板支撐裝置或由與印刷頭組裝件相關聯之Z軸運動系統提供。隨著印刷頭相對於基板移動，在正確的時間噴出待沈積於基板上之所要的位置中之墨水滴。可使用基板裝載及卸載系統***基板及自印刷機移除基板。取決於印刷機組態，此可藉由機械傳送機、具有傳送組裝件之基板浮動台或具有末端執行器之基板轉移機器人實現。印刷頭管理系統可包含允許此等量測任務(諸如，檢查噴嘴發射以及量測來自印刷頭中之每一噴嘴的滴體積、速度及軌跡)及維護任務(諸如，擦拭或吸乾噴墨噴嘴表面的過多墨水、藉由經由印刷頭自墨水供應器噴出墨水且至廢料盆內來灌注且清洗印刷頭，及替換印刷頭)之若干個子系統。考慮到可組成OLED印刷系統的多種組件，OLED印刷系統之各種具體實例可具有多種佔據面積及外觀尺寸。 Printing requires relative movement between the print head assembly and the substrate. This is achieved by a motion system (typically, an elevated or split-axis XYZ system). The print head assembly can move on a stationary substrate (overhead type), or in the case of split axis configuration, both the print head and the substrate can move. In another specific example, the print head assembly may be substantially stationary (eg, on the X and Y axes), and the substrate may move on the X and Y axes relative to the print head, where the Z axis movement is supported by the substrate or Provided by the Z-axis motion system associated with the print head assembly. As the print head moves relative to the substrate, the ink droplets to be deposited in the desired location on the substrate are ejected at the correct time. A substrate loading and unloading system can be used to insert the substrate and remove the substrate from the printer. Depending on the printer configuration, this can be achieved by a mechanical conveyor, a substrate floating table with a transfer assembly, or a substrate transfer robot with an end effector. The printhead management system may include such tasks as allowing measurement (such as checking nozzle firing and measuring the drop volume, velocity and trajectory from each nozzle in the printhead) and maintenance tasks (such as wiping or drying inkjet nozzles) Too much ink on the surface, by spraying ink from the ink supply through the print head and into the waste basin to pour and clean the print head, and replace the print head) several subsystems. Considering the various components that can make up an OLED printing system, various specific examples of OLED printing systems can have a variety of occupied areas and appearance dimensions.
關於圖10B，印刷系統基底2100可包括第一升流管(不可見)及第二升流管2122，橋接部2130安裝於其上。對於OLED印刷系統2000之各種具體實例，橋接部2130可支撐第一X軸托架組裝件2301及第二X
軸托架組裝件2302，其可分別控制第一印刷頭組裝件2501及第二印刷頭組裝件2502跨橋接部2130之移動。對於印刷系統2000之各種具體實例，第一X軸托架組裝件2301及第二X軸托架組裝件2302可利用為固有地低粒產生之線性空氣軸承運動系統。根據本教示之印刷系統之各種具體實例，X軸托架可具有安裝於其上之Z軸移動板。在圖10B中，描繪第一X軸托架組裝件2301具有第一Z軸移動板2310，而描繪第二X軸托架組裝件2302具有第二Z軸移動板2312。雖然圖10B描繪兩個托架組裝件及兩個印刷頭組裝件，但對於OLED噴墨印刷系統2000之各種具體實例，可存在單一托架組裝件及單一印刷頭組裝件。舉例而言，可將第一印刷頭組裝件2501及第二印刷頭組裝件2502中之任一者安裝於X,Z軸托架組裝件上，而可將用於檢驗基板2050之特徵的相機系統安裝於第二X,Z軸托架組裝件上。OLED噴墨印刷系統2000之各種具體實例可具有一單一印刷頭組裝件，例如，可將第一印刷頭組裝件2501及第二印刷頭組裝件2502中之任一者安裝於X,Z軸托架組裝件上，而可將用於固化印刷於基板2050上之囊封層的UV燈安裝於第二X,Z軸托架組裝件上。對於OLED噴墨印刷系統2000之各種具體實例，可存在一單一印刷頭組裝件，例如，將第一印刷頭組裝件2501及第二印刷頭組裝件2502中之任一者安裝於X,Z軸托架組裝件上，而可將用於固化印刷於基板2050上之囊封層的熱源安裝於第二托架組裝件上。
Regarding FIG. 10B, the
在圖10B中，第一X,Z軸托架組裝件2301可用以將可安裝於第一Z軸移動板2310上之第一印刷頭組裝件2501定位於基板2050上，該基板被展示為支撐於基板浮動台2200上。具有第二Z軸移動板2312之第二X,Z軸托架組裝件2302可經類似地組態，以用於控制第二印刷頭組裝件2502相對於基板2050之X-Z軸移動。諸如圖10B之第一印刷頭組裝件2501及第二印刷頭組裝件2502之每一印刷頭組裝件可具有安裝於至少一印刷頭器件中之複數個印刷頭，如在針對第一印刷頭組裝件2501之部分視圖中所
描繪，該視圖描繪複數個印刷頭2505。印刷頭器件可包括(例如但不限於)通往至少一印刷頭之流體及電子連接；每一印刷頭具有能夠按受控速率、速度及大小噴出墨水之複數個噴嘴或孔。對於印刷系統2000之各種具體實例，印刷頭組裝件可包括在約1個至約60個之間的印刷頭器件，其中每一印刷頭器件可具有在每一印刷頭器件中的約1個至約30個之間的印刷頭。一印刷頭(例如，工業噴墨頭)可具有在約16個至約2048個之間的噴嘴，噴嘴可排出在約0.1pL至約200pL之間的小滴體積。
In FIG. 10B, the first X, Z
根據本教示之氣體封裝系統之各種具體實例，純粹考慮到印刷頭器件及印刷頭的數目，第一印刷頭管理系統2701及第二印刷頭管理系統2702可收容於輔助封裝中，輔助封裝可在印刷製程期間與印刷系統封裝隔離，以用於執行各種量測及維護任務，而極少打斷或不打斷印刷製程。如可在圖10B中看出，可看出第一印刷頭組裝件2501相對於第一印刷頭管理系統2701定位，以易於執行可由第一印刷頭管理系統裝置2707、2709及2711執行之各種量測及維護程序。裝置2707、2709及2011可為用於執行各種印刷頭管理功能的多種子系統或模組中之任何者。舉例而言，裝置2707、2709及2011可為滴量測模組、印刷頭替換模組、清洗盆模組及吸墨器模組中之任何者。
According to various specific examples of the gas packaging system of this teaching, purely considering the number of print head devices and print heads, the first print
圖10C描繪根據本教示之氣體封裝組裝件及系統之各種具體實例的收容於第一印刷頭管理系統輔助面板組裝件1330'內的第一印刷頭管理系統2701之展開圖。如圖10C中所描繪，將輔助面板組裝件1330'展示為剖示圖以更清晰地看出第一印刷頭管理系統2701之細節。根據本教示之印刷頭管理系統(諸如，圖10C之第一印刷頭管理系統2701)之各種具體實例，裝置2707、2709及2011可為用於執行各種功能的多種子系統或模組。舉例而言，裝置2707、2709及2011可為滴量測模組、印刷頭清洗盆模組及吸墨器模組。如圖10C中所描繪，印刷頭替換模組2713可提供用於銜接至
少一印刷頭器件2505之位置。在第一印刷頭管理系統2701之各種具體實例中，可按維護氣體封裝組裝件1000(見圖19)之相同環境規範維護第一印刷頭管理系統輔助面板組裝件1330'。第一印刷頭管理系統輔助面板組裝件1330'可具有經定位用於進行與各種印刷頭管理程序相關聯之任務的把手2530。舉例而言，每一子系統可具有本來即可消耗且需要替換之各種零件，諸如，替換吸墨紙、墨水及廢料儲集器。各種可消耗零件可經包裝以便容易使用把手以完全自動化模式***。作為非限制性實例，可按可易於***以用於在吸乾模組內使用之濾筒格式包裝吸墨紙。藉由另一非限制性實例，可將墨水包裝於可替換儲集器中，以及按用於在印刷系統中使用之濾筒格式包裝。可按可易於***以用於在清洗盆模組內使用之濾筒格式包裝廢料儲集器之各種具體實例。另外，持續使用的印刷系統之各種組件之零件可需要週期性替換。在印刷製程期間，對印刷頭組裝件之便利管理(例如但不限於，印刷頭器件或印刷頭之交換)可為合乎需要的。印刷頭替換模組可具有諸如印刷頭器件或印刷頭之零件，其易於為了使用而***印刷頭組裝件內。用於檢查噴嘴發射之滴量測模組以及基於對來自每一噴嘴之滴容積、速度及軌跡之光學偵測的量測可具有一來源及一偵測器，其可需要在使用之後的週期性替換。各種可消耗及高利用率零件可經包裝以便容易使用把手以例如完全自動化模式***。把手2530可具有安裝至臂2534之末端執行器2536。可使用末端執行器組態之各種具體實例，例如，刀片型末端執行器、夾具型末端執行器及夾爪型末端執行器。末端執行器之各種具體實例可包括機械抓緊及夾緊以及氣動或真空輔助式組裝件以致動末端執行器之部分或以其他方式保持印刷頭器件或來自印刷頭器件之印刷頭。
10C depicts an expanded view of a first
關於印刷頭器件或印刷頭之替換，圖10C之印刷頭管理系統2701之印刷頭替換模組2713可包括用於具有至少一印刷頭之印刷頭器件
的銜接台，以及用於印刷頭之儲存容器。因為每一印刷頭組裝件(見圖10B)可包括在約1個至約60個之間的印刷頭器件，且每一印刷頭器件可具有在約1個至約30個之間的印刷頭，於是本教示之印刷系統之各種具體實例可具有在約1個至約1800個之間的印刷頭。在印刷頭替換模組2713之各種具體實例中，當印刷頭器件經銜接時，可在不在印刷系統中使用時將安裝至印刷頭器件之每一印刷頭維持在可操作條件中。舉例而言，當置放於銜接台中時，每一印刷頭器件上之印刷頭可連接至墨水供應器及電連接。可將電力提供至每一印刷頭器件上之每一印刷頭，使得可在銜接時施加至每一印刷頭之每一噴嘴的週期性發射脈衝，以便確保噴嘴保持經灌注且不堵塞。圖10C之把手2530可定位成最接近印刷頭組裝件2500。印刷頭組裝件2500可銜接在第一印刷頭管理系統輔助面板組裝件1330'上，如在圖10C中所描繪。在用於交換印刷頭之程序期間，把手2530可自印刷頭組裝件2500移除一目標零件--印刷頭或具有至少一印刷頭之印刷頭器件。把手2530可自印刷頭替換模組2713擷取一替換零件(諸如，印刷頭器件或印刷頭)，且完成替換過程。可將移除之零件置放於印刷頭替換模組2713中以供擷取。
Regarding the printing head device or the replacement of the printing head, the printing
關於具有可對第一工作容積封鎖以及可密封地與第一工作容積(例如，印刷系統封裝)隔離之一輔助封裝的氣體封裝組裝件之各種具體實例，再次參看圖10A。如圖10B中所描繪，在OLED印刷系統2000上可存在四個隔離器；支撐OLED印刷系統2000之基板浮動台2200的第一隔離器組2110(第二者未展示於相對側上)及第二隔離器組2112(第二者未展示於相對側上)。對於圖10A之氣體封裝組裝件1000，可將第一隔離器組2110及第二隔離器組2112安裝於各別隔離器井面板(諸如，中間基底面板組裝件1320'之第一隔離器井面板1325'及第二隔離器井面板1327')中之每一者上。對於圖10A之氣體封裝組裝件1000，中間基底面板組裝件1320'可包括第一印刷頭管理系統輔助面板組裝件1330'以及第二印刷頭管理系統
輔助面板組裝件1370'。氣體封裝組裝件1000之圖10A描繪可包括第一後壁面板組裝件1338'之第一印刷頭管理系統輔助面板組裝件1330'。類似地，如此描述的為可包括第二後壁面板組裝件1378'之第二印刷頭管理系統輔助面板組裝件1370'。第一印刷頭管理系統輔助面板組裝件1330'之第一後壁面板組裝件1338'可按類似於針對第二後壁面板組裝件1378'所展示之方式建構。可自具有可密封地安裝至第二後壁框組裝件1378之第二密封件支撐面板1375的第二後壁框組裝件1378建構第二印刷頭管理系統輔助面板組裝件1370'之第二後壁面板組裝件1378'。第二密封件支撐面板1375可具有最接近基底2100之第二端(圖中未示)的第二通路1365。第二密封件1367可在第二通路1365周圍安裝於第二密封件支撐面板1375上。第一密封件可類似地定位及安裝於用於第一印刷頭管理系統輔助面板組裝件1330'之第一通路周圍。輔助面板組裝件1330'及輔助面板組裝件1370'中之每一通路可容納使每一維護系統平台，諸如，圖10B之第一維護系統平台2703及第二維護系統平台2704穿過通路。如本文中隨後將更詳細地論述，為了可密封地隔離輔助面板組裝件1330'及輔助面板組裝件1370'，該等通路(諸如，圖10A之第二通路1365)必須可密封。預期各種密封件(諸如，可膨脹密封件、波紋管密封件及唇形密封件)可用於在貼附至印刷系統基底之維護平台周圍密封通路(諸如，圖10A之第二通路1365)。
For various specific examples of a gas package assembly having one of the auxiliary packages that can be sealed off from the first working volume and sealably isolated from the first working volume (eg, printing system package), see FIG. 10A again. As depicted in FIG. 10B, there may be four isolators on the
第一印刷頭管理系統輔助面板組裝件1330'及第二印刷頭管理系統輔助面板組裝件1370'可分別包括第一底面板組裝件1341'之第一印刷頭組裝件開口1342及第二底面板組裝件1381'之第二印刷頭組裝件開口1382。第一底面板組裝件1341'在圖10A中被描繪為中間面板組裝件1300'之第一中間封裝面板組裝件1340'之部分。第一底面板組裝件1341'為與第一中間封裝面板組裝件1340'及第一印刷頭管理系統輔助面板組裝件1330'共同之面板組裝件。第二底面板組裝件1381'在圖10A中被描繪為中間面板組裝
件1300'之第二中間封裝面板組裝件1380'之部分。第二底面板組裝件1381'為與第二中間封裝面板組裝件1380'及第二印刷頭管理系統輔助面板組裝件1370'共同之面板組裝件。
The first print head management system auxiliary panel assembly 1330' and the second print head management system auxiliary panel assembly 1370' may include a first print
如本文中先前所論述，第一印刷頭組裝件2501可收容於第一印刷頭組裝件封裝2503中，且第二印刷頭組裝件2502可收容於第二印刷頭組裝件封裝2504中。根據本教示之系統及方法，第一印刷頭組裝件封裝2503及第二印刷頭組裝件封裝2504可具有在底部的可具有一輪緣(圖中未示)之一開口，使得可定位各種印刷頭組裝件以用於在印刷製程期間印刷。另外，可如先前針對各種面板組裝件所描述而建構形成外殼的第一印刷頭組裝件封裝2503及第二印刷頭組裝件封裝2504之部分，使得框組裝件構件及面板能夠提供氣密性封裝。
As previously discussed herein, the first
諸如先前針對各種框構件之氣密封所描述的，可壓縮墊片可貼附於第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382中之每一者周圍，或替代地，第一印刷頭組裝件封裝2503及第二印刷頭組裝件封裝2504之輪緣周圍。
As described previously for the hermetic sealing of various frame members, a compressible gasket may be attached around each of the first print
如圖10A中所描繪，第一印刷頭組裝件銜接墊片1345及第二印刷頭組裝件銜接墊片1385可分別貼附於第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382周圍。在各種印刷頭量測及維護程序期間，第一印刷頭組裝件2501及第二印刷頭組裝件2502可分別由第一X,Z軸托架組裝件2301及第二X,Z軸托架組裝件2302分別定位於第一底面板組裝件1341'之第一印刷頭組裝件開口1342及第二底面板組裝件1381'之第二印刷頭組裝件開口1382上。在此點上，對於各種印刷頭量測及維護程序，可分別將第一印刷頭組裝件2501及第二印刷頭組裝件2502定位於第一底面板組裝件1341'之第一印刷頭組裝件開口1342及第二底面板組裝件1381'之第二印刷頭組裝件開口1382上，而不覆蓋或密封第一印刷頭組裝件開口1342
及第二印刷頭組裝件開口1382。第一X,Z軸托架組裝件2301及第二X,Z軸托架組裝件2302可分別將第一印刷頭組裝件封裝2503及第二印刷頭組裝件封裝2504分別與第一印刷頭管理系統輔助面板組裝件1330'及第二印刷頭管理系統輔助面板組裝件1370'銜接。在各種印刷頭量測及維護程序中，此銜接可有效地閉合第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382，而不需要密封第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382。對於各種印刷頭量測及維護程序，銜接可包括形成在印刷頭組裝件封裝中之每一者與印刷頭管理系統面板組裝件之間的墊片密封。與可密封地閉合通路(諸如，圖10A之第二通路1365及互補第一通路)一起，當將第一印刷頭組裝件封裝2503及第二印刷頭組裝件封裝2504與第一印刷頭管理系統輔助面板組裝件1330'及第二印刷頭管理系統輔助面板組裝件1370'銜接以可密封地閉合第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382時，如此形成之組合結構經氣密封。
As depicted in FIG. 10A, the first print head
另外，根據本教示，可將輔助封裝與(例如)另一內部封裝容積(諸如，印刷系統封裝)以及氣體封裝組裝件之外部隔離，藉由使用結構閉合物可密封地閉合過道，諸如，圖10A之第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382。根據本教示，結構閉合物可包括針對開口或過道之多種可密封覆蓋物；此開口或過道包括封裝面板開口或過道之非限制性實例。根據本教示之系統及方法，閘可為可用以使用氣動、液壓、電或手動致動來可逆地覆蓋或可逆地可密封式閉合任一開口或過道之任何結構閉合物。因而，可使用閘可逆地覆蓋或可逆地可密封式閉合圖10A之第一印刷頭組裝件開口1342及第二印刷頭組裝件開口1382。
In addition, according to the present teachings, the auxiliary package can be isolated from, for example, another internal package volume (such as a printing system package) and the exterior of the gas package assembly, and the aisle can be hermetically closed by using a structural closure, such as, The first print
在圖10B之OLED印刷系統2000之展開圖中，印刷系統之各種具體實例可包括由基板浮動台基底2220支撐之基板浮動台2200。基板浮動台基底2220可安裝於印刷系統基底2100上。OLED印刷系統之基板浮
動台2200可支撐基板2050，以及界定基板2050可在OLED基板之印刷期間穿過氣體封裝組裝件1000移動之行程。本教示之Y軸運動系統可包括第一Y軸軌道2351及第二Y軸軌道2352，其可包括用於固持基板之一夾爪系統(圖中未示)。Y軸運動可由線性空氣軸承或線性機械系統提供。在此點上，與運動系統(如圖10B中所描繪，Y軸運動系統)一起，基板浮動台2200可提供穿過印刷系統的基板2050之無摩擦傳送。
In the expanded view of the
圖11描繪根據本教示之各種具體實例的浮動台，其用於無摩擦支撐，及與傳送系統一起，用於負載(諸如，圖10B之基板2050)之穩定傳送。浮動台之各種具體實例可用於本教示之氣體封裝系統之各種具體實例中之任何者中。如本文中先前所論述，本教示之氣體封裝系統之各種具體實例可處理自小於Gen 3.5基板(其具有約61cm×72cm之尺寸)起的OLED平板顯示器基板之一系列大小以及逐漸變大的代大小。預期，氣體封裝系統之各種具體實例可處理具有約130cm×150cm之尺寸的Gen 5.5之基板大小，以及具有約195cm×225cm之尺寸的Gen 7.5基板，且可每基板切割成八個42"或六個47"平板及更大。Gen 8.5基板為大致220cm×250cm，且可每基板切割至六個55"或八個46"平板。然而，基板代大小不斷提高，使得具有約285cm×305cm的尺寸之當前可用之Gen 10基板遠非基板大小之最終一代。另外，自由使用基於玻璃之基板而引起的術語敍述之大小可應用於適合於在OLED印刷中使用的任何材料之基板。對於OLED噴墨印刷系統之各種具體實例，可將多種基板材料(例如但不限於多種玻璃基板材料，以及多種聚合基板材料)用於基板2050。因此，在本教示之氣體封裝系統之各種具體實例中，存在需要在印刷期間之穩定傳送的多種基板大小及材料。
11 depicts a floating table according to various specific examples of the present teachings, which is used for frictionless support, and together with a transfer system, for stable transfer of loads such as the
如圖11中所描繪，根據本教示之各種具體實例之基板浮動台2200可具有用於支撐複數個浮動台地帶之浮動台基底2220。基板浮動台
2200可具有可經由複數個端口施加壓力及真空之地帶2210。具有壓力及真空控制之此地帶可有效地在地帶2210與基板(圖中未示)之間提供流體彈簧。具有壓力及真空控制之地帶2210為具有雙向剛度之流體彈簧。負載與浮動台表面之間存在的間隙被稱作飛行高度。諸如圖11之基板浮動台2200之地帶2210的地帶(使用複數個壓力及真空端口在其中創造具有雙向剛度之流體彈簧)可提供用於負載(諸如，基板)之可控制飛行高度。
As depicted in FIG. 11, the substrate floating table 2200 according to various specific examples of the present teaching may have a floating
最接近地帶2210的分別為第一過渡地帶2211及第二過渡地帶2212，且最接近第一過渡地帶2211及第二過渡地帶2212則分別為僅壓力地帶2213及2214。在過渡地帶中，壓力對真空噴嘴之比率朝向僅壓力地帶逐漸增大以提供自地帶2210至地帶2213及2214之逐漸過渡。對於基板浮動台(例如，如在圖11中所描繪)之各種具體實例，將僅壓力地帶2213、2214描繪為包含軌結構。對於基板浮動台之各種具體實例，僅壓力地帶(諸如，圖11之僅壓力地帶2213、2214)可包含一連續板，諸如，針對圖11之壓力真空地帶2210所描繪之連續板。
Those closest to the
對於如圖11中描繪之浮動台之各種具體實例，在壓力真空地帶、過渡地帶與僅壓力地帶之間可存在基本上均勻的高度，使得在容差內，三個地帶基本上位於一個平面中且可在長度上有變化。舉例而言(但不限於)，為了提供定標及比例之意義，對於本教示之浮動台之各種具體實例，過渡地帶可為約400mm，而僅壓力地帶可為約2.5m，且壓力真空地帶可為約800mm。在圖11中，僅壓力地帶2213及2214不提供具有雙向剛度之流體彈簧，且因此不提供地帶2210可提供之控制。因此，負載之飛行高度可典型地在僅壓力地帶上比在壓力真空地帶上的基板之飛行高度大，以便允許足夠的高度使得負載將不與僅壓力地帶中之浮動台碰撞。舉例而言(但不限於)，可能需要處理OLED面板基板以在僅壓力地帶(諸如，地帶2213及2214)上方具有在約150μ至約300μ之間的飛行高度，且接著在
壓力真空地帶(諸如，地帶2210)上方具有在約30μ至約50μ之間的飛行高度。
For various specific examples of floating platforms as depicted in FIG. 11, there may be a substantially uniform height between the pressure vacuum zone, the transition zone, and the pressure-only zone, so that within tolerance, the three zones are substantially in one plane And can vary in length. For example (but not limited to), in order to provide the meaning of calibration and scale, for various specific examples of the floating platform of this teaching, the transition zone may be about 400mm, and only the pressure zone may be about 2.5m, and the pressure vacuum zone It can be about 800 mm. In FIG. 11, only the
除了氣體循環及過濾系統之外，本教示之氣體封裝系統之各種具體實例亦可利用多種器件、裝置及系統以維持受控制之氣體封裝環境。舉例而言，除了用於提供在氣體封裝之內部中的氣體之澈底且完全更新之氣體循環及過濾系統之外，亦可提供利用複數個熱交換器之熱調節系統以維持在氣體封裝之內部中的所要溫度。舉例而言，可提供藉由扇或另一氣體循環器件操作、鄰近扇或另一氣體循環器件或與扇或另一氣體循環器件一起使用之複數個熱交換器。氣體淨化迴路可經組態以使來自氣體封裝組裝件之內部內的氣體循環經過在封裝外部之至少一氣體淨化組件。在此點上，與在氣體封裝組裝件外部之氣體淨化迴路結合的在氣體封裝組裝件內部之循環及過濾系統可提供具有實質上低含量的反應性物質之實質上低粒惰性氣體在整個氣體封裝系統中的連續循環。根據本教示，惰性氣體可為在一組定義之條件下不經歷化學反應之任何氣體。惰性氣體之一些通用非限制性實例可包括氮、稀有氣體中之任何者及其任何組合。具有氣體淨化系統的氣體封裝系統之各種具體實例可經組態以維持非常低含量之不當組分(例如，有機溶劑及其蒸氣，以及水、水蒸氣、氧及類似者)。氣體封裝系統之此等具體實例可將各種反應性物質(包括諸如水蒸氣及氧之各種反應性大氣源氣體以及有機溶劑蒸氣)中之每一物質之含量維持處於100ppm或更低，例如，處於10ppm或更低、處於1.0ppm或更低或處於0.1ppm或更低。 In addition to gas circulation and filtration systems, various specific examples of gas encapsulation systems taught in this teaching can also utilize a variety of devices, devices, and systems to maintain a controlled gas encapsulation environment. For example, in addition to providing a clean and completely renewed gas circulation and filtration system for the gas in the interior of the gas package, a thermal regulation system using multiple heat exchangers can also be provided to maintain the interior of the gas package The desired temperature in For example, a plurality of heat exchangers operated by a fan or another gas circulation device, adjacent to or used with a fan or another gas circulation device may be provided. The gas purification circuit may be configured to circulate gas from inside the gas package assembly through at least one gas purification component outside the package. At this point, the circulation and filtration system inside the gas package assembly combined with the gas purification circuit outside the gas package assembly can provide a substantially low-particle inert gas with a substantially low content of reactive substances throughout the gas Continuous cycle in the packaging system. According to this teaching, an inert gas can be any gas that does not undergo a chemical reaction under a defined set of conditions. Some general non-limiting examples of inert gases may include any of nitrogen, noble gases, and any combination thereof. Various specific examples of gas encapsulation systems with gas purification systems can be configured to maintain very low levels of inappropriate components (eg, organic solvents and their vapors, and water, water vapor, oxygen, and the like). These specific examples of gas encapsulation systems can maintain the content of each substance in various reactive substances (including various reactive atmospheric source gases such as water vapor and oxygen and organic solvent vapors) at 100 ppm or lower, for example, at 10 ppm or less, 1.0 ppm or less, or 0.1 ppm or less.
圖12為展示氣體封裝系統501之示意圖。根據本教示之氣體封裝系統501之各種具體實例可包含用於收容印刷系統之氣體封裝組裝件1101、與氣體封裝組裝件1101流體連通之氣體淨化迴路3130及至少一熱調節系統3140。另外，氣體封裝系統501之各種具體實例可具有加壓之惰
性氣體再循環系統3000，其可供應用於操作各種器件(諸如，用於OLED印刷系統之基板浮動台)之惰性氣體。加壓之惰性氣體再循環系統3000之各種具體實例可將一壓縮機、一吹風機及兩者之組合用作加壓之惰性氣體再循環系統3000之各種具體實例的源，如本文中隨後將更詳細地論述。另外，氣體封裝系統501可具有在氣體封裝系統501內部之循環及過濾系統(圖中未示)。
FIG. 12 is a schematic diagram showing the
如圖12中所描繪，對於根據本教示之氣體封裝組裝件之各種具體實例，管道系統之設計可將經由氣體淨化迴路3130循環之惰性氣體與氣體封裝組裝件之各種具體實例的在內部連續過濾及循環之惰性氣體分開。氣體淨化迴路3130包括自氣體封裝組裝件1101至溶劑移除組件3132且接著至氣體淨化系統3134之出口線路3131。被淨化掉溶劑及其他反應性氣體物質(諸如，氧及水蒸氣)之惰性氣體接著經由入口線路3133返回至氣體封裝組裝件1101。氣體淨化迴路3130亦可包括適當的管路及連接及感測器(例如，氧、水蒸氣及溶劑蒸氣感測器)。諸如風扇、吹風機或馬達及類似者之氣體循環單元可分開來提供或整合於(例如)氣體淨化系統3134中以使氣體循環經由氣體淨化迴路3130。根據氣體封裝組裝件之各種具體實例，雖然在圖12中展示之示意圖中將溶劑移除系統3132及氣體淨化系統3134展示為分開的單元，但溶劑移除系統3132及氣體淨化系統3134可作為單一淨化單元收容在一起。
As depicted in FIG. 12, for various specific examples of gas packaging assemblies according to the present teachings, the design of the piping system can continuously filter the inert gas circulating through the
圖12之氣體淨化迴路3130可具有置放於氣體淨化系統3134之上游的溶劑移除系統3132，使得自氣體封裝組裝件1101循環之惰性氣體經由出口線路3131穿過溶劑移除系統3132。根據各種具體實例，溶劑移除系統3132可為基於吸附來自穿過圖12之溶劑移除系統3132之惰性氣體的溶劑蒸氣之溶劑截獲系統。吸附劑(例如但不限於，活性炭、分子篩及類似者)之一或多個床可有效地移除廣泛多種有機溶劑蒸氣。對於氣體封裝
系統之各種具體實例，可使用冷截獲技術來移除溶劑移除系統3132中之溶劑蒸氣。如本文中先前所論述，對於根據本教示之氣體封裝系統之各種具體實例，感測器(諸如，氧、水蒸氣及溶劑蒸氣感測器)可用以監視此等物質自連續循環經過氣體封裝系統(諸如，圖12之氣體封裝系統501)之惰性氣體的有效移除。溶劑移除系統之各種具體實例可指示吸附劑(諸如，活性炭、分子篩及類似者)何時已達到容量，使得可再生或替換吸附劑之該或該等床。分子篩之再生可涉及加熱分子篩，使分子篩與形成氣體接觸、其組合及類似者。經組態以截獲各種物質(包括氧、水蒸氣及溶劑)之分子篩可藉由加熱及暴露至包含氫之形成氣體(例如，包含約96%氮及4%氫之形成氣體，其中該等百分比以體積計或以重量計)來再生。可使用在惰性環境下之加熱的類似程序進行活性炭之物理再生。
The
任何合適氣體淨化系統可用於圖12之氣體淨化迴路3130之氣體淨化系統3134。可購自(例如)新罕布什爾州Statham之MBRAUN Inc.或馬薩諸塞州Amesbury之Innovative Technology的氣體淨化系統可適用於整合至根據本教示之氣體封裝組裝件之各種具體實例內。氣體淨化系統3134可用以淨化氣體封裝系統501中之一或多種惰性氣體，例如，以淨化氣體封裝組裝件內之全部氣體氣氛。如本文中先前所論述，為了使氣體循環經過氣體淨化迴路3130，氣體淨化系統3134可具有一氣體循環單元，諸如，風扇、吹風機或馬達及類似者。在此點上，可取決於封裝之容積選擇氣體淨化系統，封裝之容積可定義將惰性氣體移動穿過氣體淨化系統之體積流率。對於具有容積高達約4m3之氣體封裝組裝件的氣體封裝系統之各種具體實例，可使用可每小時移動約84m3之氣體淨化系統。對於具有容積高達約10m3之氣體封裝組裝件的氣體封裝系統之各種具體實例，可使用可每小時移動約155m3之氣體淨化系統。對於具有在約52m3至114m3之間的容積的氣體封裝組裝件之各種具體實例，可使用一個以上氣體淨化系統。
Any suitable gas purification system can be used for the
任何合適的氣體過濾器或淨化器件可包括於本教示之氣體淨化系統3134中。在一些具體實例中，氣體淨化系統可包含兩個並行的淨化器件，使得可使器件中之一者離線用於維護，且另一器件可用以無間斷地繼續系統操作。舉例而言，在一些具體實例中，氣體淨化系統可包含一或多個分子篩。在一些具體實例中，氣體淨化系統可包含至少一第一分子篩及一第二分子篩，使得當分子篩中之一者因雜質而變得飽和或以其他方式被視為不夠有效率地操作時，系統可切換至另一分子篩，同時對飽和或無效率之分子篩進行再生。可提供一控制單元以用於判定每一分子篩之操作效率，用於在不同分子篩之操作之間切換，用於再生一或多個分子篩，或用於其組合。如本文中先前所論述，可再生且重新使用分子篩。
Any suitable gas filter or purification device may be included in the
圖12之熱調節系統3140可包括至少一冷卻器3142，其可具有用於使冷卻劑循環至氣體封裝組裝件內之流體出口線路3141，及用於使冷卻劑返回至冷卻器之流體入口線路3143。可提供至少一流體冷卻器3142以用於冷卻氣體封裝系統501內之氣體氣氛。對於本教示之氣體封裝系統之各種具體實例，流體冷卻器3142將經冷卻之流體傳遞至封裝內之熱交換器，其中在封裝內部之過濾系統上遞送惰性氣體。至少一流體冷卻器亦可具備氣體封裝系統501以冷卻自封裝於氣體封裝系統501內之裝置放出的熱量。舉例而言(但不限於)，亦可針對氣體封裝系統501提供至少一流體冷卻器以冷卻自OLED印刷系統放出之熱量。熱調節系統3140可包含熱交換或帕耳貼(Peltier)器件且可具有各種冷卻容量。舉例而言，對於氣體封裝系統之各種具體實例，冷卻器可提供在約2kW至約20kW之間的冷卻容量。氣體封裝系統之各種具體實例可具有可冷卻一或多種流體之複數個流體冷卻器。在一些具體實例中，流體冷卻器可將許多流體用作冷卻劑(例如但不限於，水、防凍劑、致冷劑及其組合)，作為熱交換流體。在連接相關聯之管路與系統組件的過程中可使用適當無洩漏、鎖定連接。
The
如本文中所論述，本教示揭露可包括界定第一容積之印刷系統封裝及界定第二容積之輔助封裝的氣體封裝系統之各種具體實例。氣體封裝系統之各種具體實例可具有可被可密封地建構為氣體封裝組裝件之一區段的一輔助封裝。根據本教示之系統及方法，輔助封裝可被可密封地與印刷系統封裝隔離，且可對在氣體封裝組裝件外部之環境開放，而不使印刷系統封裝暴露至外部環境。可進行輔助封裝之此實體隔離以執行(例如但不限於)各種印刷頭管理程序，以消除或最小化印刷系統封裝對污染(諸如，空氣及水蒸氣及各種有機蒸氣以及顆粒污染)之暴露。可進行可包括對印刷頭組裝件之量測及維護程序的各種印刷頭管理程序，而極少打斷或不打斷印刷製程，藉此最小化或消除氣體封裝系統停機時間。 As discussed herein, the present teachings can include various specific examples of a printing system package that defines a first volume and a gas packaging system that defines an auxiliary package of a second volume. Various specific examples of gas packaging systems may have an auxiliary package that may be sealably constructed as a section of the gas packaging assembly. According to the system and method of the present teachings, the auxiliary package can be sealably isolated from the printing system package, and can be open to the environment outside the gas package assembly without exposing the printing system package to the external environment. This physical isolation of auxiliary packaging can be performed to perform (eg, but not limited to) various print head management procedures to eliminate or minimize the exposure of the printing system package to pollution (such as air and water vapor and various organic vapor and particulate pollution). Various print head management procedures that can include measurement and maintenance procedures for print head assemblies can be performed with little or no interruption of the printing process, thereby minimizing or eliminating gas packaging system downtime.
對於本教示之系統及方法之各種具體實例，輔助封裝可小於或等於氣體封裝系統之封裝容積的約1%。在本教示之系統及方法之各種具體實例中，輔助封裝可小於或等於氣體封裝系統之封裝容積的約2%。對於本教示之系統及方法之各種具體實例，輔助封裝可小於或等於氣體封裝系統之封裝容積的約5%。在本教示之系統及方法之各種具體實例中，輔助封裝可小於或等於氣體封裝系統之封裝容積的約10%。在本教示之系統及方法之各種具體實例中，輔助封裝可小於或等於氣體封裝系統之封裝容積的約20%。若為了執行(例如)維護程序而指示將輔助封裝對含有反應性氣體之周圍環境開放，則將輔助封裝與氣體封裝之工作容積隔離可防止對氣體封裝之整個容積之污染。另外，考慮到與氣體封裝之印刷系統封裝部分相比相對小的輔助封裝容積，輔助封裝之恢復時間可比整個印刷系統封裝之恢復時間少得多。 For various specific examples of the system and method of this teaching, the auxiliary packaging may be less than or equal to about 1% of the packaging volume of the gas packaging system. In various specific examples of the system and method taught in this teaching, the auxiliary packaging may be less than or equal to about 2% of the packaging volume of the gas packaging system. For various specific examples of the system and method of this teaching, the auxiliary packaging may be less than or equal to about 5% of the packaging volume of the gas packaging system. In various specific examples of the system and method of the present teaching, the auxiliary packaging may be less than or equal to about 10% of the packaging volume of the gas packaging system. In various specific examples of the system and method of the present teaching, the auxiliary packaging may be less than or equal to about 20% of the packaging volume of the gas packaging system. If the auxiliary package is instructed to be open to the surrounding environment containing reactive gases in order to perform, for example, maintenance procedures, isolating the auxiliary package from the working volume of the gas package can prevent contamination of the entire volume of the gas package. In addition, considering the relatively small auxiliary packaging volume compared to the packaging part of the gas packaging printing system, the recovery time of the auxiliary packaging can be much shorter than the recovery time of the entire printing system packaging.
對於具有界定第一容積之印刷系統封裝及界定第二容積之輔助封裝的氣體封裝系統，可易於將兩個容積與氣體循環、過濾及淨化組件整合以形成可維持惰性、實質上低粒環境之氣體封裝系統(針對需要此 環境之製程)而極少打斷或不打斷印刷製程。根據本教示之各種系統及方法，印刷系統封裝可被引入有一定量的污染，該污染量足夠低使得淨化系統可在污染可影響印刷製程前將其移除。輔助封裝之各種具體實例可為氣體封裝組裝件的總容積中之實質上較小容積，且可易於與氣體循環、過濾及淨化組件整合以形成可在暴露至外部環境後迅速恢復惰性低粒環境之輔助封裝系統，藉此極少打斷或不打斷印刷製程。 For a gas packaging system with a printing system packaging defining a first volume and an auxiliary packaging defining a second volume, the two volumes can be easily integrated with gas circulation, filtration, and purification components to form an inert, substantially low-grain environment Gas packaging system Environmental process) with little or no interruption to the printing process. According to the various systems and methods taught in this teaching, a certain amount of contamination can be introduced into the printing system package. The amount of contamination is low enough that the purification system can remove the contamination before it can affect the printing process. Various specific examples of auxiliary packaging can be a substantially smaller volume of the total volume of the gas packaging assembly, and can be easily integrated with gas circulation, filtration, and purification components to form an inert low-grain environment that can be quickly restored after exposure to the external environment The auxiliary packaging system, with little or no interruption of printing process.
根據本教示之系統及方法，建構為氣體封裝組裝件之區段的印刷系統封裝及輔助封裝之各種具體實例可按提供分開揮發功能的框構件組裝件區段之方式建構。除了具有所有揭示之元件之外，藉由非限制性實例，對於氣體封裝系統500及501，圖13之氣體封裝系統502可具有氣體封裝組裝件1101之界定第一容積的第一氣體封裝組裝件區段1101-S1及氣體封裝組裝件1101之界定第二容積的第二氣體封裝組裝件區段1101-S2。若所有閥V1、V2、V3及V4皆打開，則氣體淨化迴路3130基本上如先前針對圖12之氣體封裝組裝件及系統1101所描述而操作。在V3及V4閉合之情況下，僅第一氣體封裝組裝件區段1101-S1與氣體淨化迴路3130流體連通。例如(但不限於)，當在需要第二氣體封裝組裝件區段1101-S2對大氣開放之各種量測及維護程序期間第二氣體封裝組裝件區段1101-S2可密封地閉合且藉此與第一氣體封裝組裝件區段1101-S1隔離時，可使用此閥狀態。在V1及V2閉合之情況下，僅第二氣體封裝組裝件區段1101-S2與氣體淨化迴路3130流體連通。例如(但不限於)，在已將該區段對大氣開放之後的第二氣體封裝組裝件區段1101-S2之恢復期間，可使用此閥狀態。如本文中先前針對與圖12有關之本教示所論述，關於氣體封裝組裝件1101之總容積指定了對氣體淨化迴路3130之要求。因此，藉由使氣體淨化系統之資源專用於氣體封裝組裝件區段(諸如，第二氣體封裝組裝件區段1101-S2，對於圖13之氣體封裝系統502，其被描繪為在容積上顯著比氣體封裝1101之總容積小)之
恢復，可實質上減少恢復時間。
According to the system and method of the present teaching, various specific examples of printing system packaging and auxiliary packaging constructed as sections of a gas packaging assembly can be constructed in a manner that provides a frame member assembly section that separates the volatilization function. In addition to having all the disclosed elements, by way of non-limiting example, for the
另外，輔助封裝之各種具體實例可易於與一組專用環境調節系統組件(諸如，照明、氣體循環及過濾、氣體淨化及恆溫組件)整合。在此點上，包括可作為氣體封裝組裝件之一區段可密封地隔離之一輔助封裝的氣體封裝系統之各種具體實例可具有一受控制之環境，其經設定為與由收容印刷系統的氣體封裝組裝件界定之第一容積一致。另外，包括可作為氣體封裝組裝件之一區段可密封地隔離之一輔助封裝的氣體封裝系統之各種具體實例可具有一受控制之環境，其經設定為與由收容印刷系統的氣體封裝組裝件界定之第一容積的受控制之環境不同。 In addition, various specific examples of auxiliary packaging can be easily integrated with a set of dedicated environmental conditioning system components, such as lighting, gas circulation and filtration, gas purification, and thermostatic components. In this regard, various specific examples of a gas encapsulation system including an auxiliary encapsulation that can be sealingly isolated as a section of a gas encapsulation assembly can have a controlled environment that is set to The first volume defined by the gas packaging assembly is consistent. In addition, various specific examples of a gas packaging system including an auxiliary package that can be hermetically sealed as a section of the gas packaging assembly can have a controlled environment that is configured to be assembled with the gas packaging containing the printing system The controlled environment of the first volume defined by the piece is different.
回想起，可按使氣體封裝組裝件之內部容積最小化且同時使用於容納OLED印刷系統設計之各種佔據面積之工作容積最佳化的輪廓化方式建構在本教示之氣體封裝系統之具體實例中利用的氣體封裝組裝件之各種具體實例。舉例而言，根據本教示之輪廓化氣體封裝組裝件之各種具體實例對於覆蓋(例如)自Gen 3.5至Gen 10之基板大小之本教示的氣體封裝組裝件之各種具體實例可具有在約6m3至約95m3之間的氣體封裝容積。根據本教示之輪廓化氣體封裝組裝件之各種具體實例可具有(例如但不限於)在約15m3至約30m3之間的氣體封裝容積，其可能適用於(例如)Gen 5.5至Gen 8.5基板大小之OLED印刷。可將輔助封裝之各種具體實例建構為氣體封裝組裝件之一區段，且易於與氣體循環及過濾以及淨化組件整合以形成可維持惰性、實質上低粒環境(針對需要此環境之製程)之氣體封裝系統。
Recall that it can be constructed in a specific example of the gas packaging system of this teaching in a contoured manner that minimizes the internal volume of the gas packaging assembly and simultaneously optimizes the working volume used to accommodate the various occupied areas of the OLED printing system design Various specific examples of gas packaging assemblies used. For example, various specific examples of contoured gas package assemblies according to the present teachings may have a range of about 6 m 3 for various specific examples of gas package assemblies covering (for example) substrate sizes from Gen 3.5 to
如圖12及圖13中所展示，氣體封裝系統之各種具體實例可包括一加壓之惰性氣體再循環系統3000。加壓之惰性氣體再循環迴路之各種具體實例可利用一壓縮機、一吹風機及其組合。
As shown in FIGS. 12 and 13, various specific examples of the gas packaging system may include a pressurized inert
舉例而言，如圖14及圖15中所展示，氣體封裝系統503及
氣體封裝系統504之各種具體實例可具有外部氣體迴路3200，其用於整合及控制用於在氣體封裝系統503及氣體封裝系統504之各種操作態樣中使用的惰性氣體源3201及清潔乾燥空氣(CDA)源3203。氣體封裝系統503及氣體封裝系統504亦可包括內部粒子過濾及氣體循環系統之各種具體實例，以及如先前所描述的外部氣體淨化系統之各種具體實例。氣體封裝系統之此等具體實例可包括用於自惰性氣體淨化各種反應性物質的氣體淨化系統。惰性氣體之一些通用非限制性實例可包括氮、稀有氣體中之任何者及其任何組合。根據本教示之氣體淨化系統之各種具體實例可將各種反應性物質(包括諸如水蒸氣及氧之各種反應性大氣源氣體以及有機溶劑蒸氣)中之每一物質之含量維持處於100ppm或更低，例如，處於10ppm或更低、處於1.0ppm或更低或處於0.1ppm或更低。除了用於整合及控制惰性氣體源3201及CDA源3203之外部迴路3200之外，氣體封裝系統503及氣體封裝系統504可具有壓縮機迴路3250，其可供應用於操作可安置於氣體封裝系統503及氣體封裝系統504之內部中的各種器件及裝置之惰性氣體。
For example, as shown in FIGS. 14 and 15, the
圖14之壓縮機迴路3250可包括經組態以流體連通之壓縮機3262、第一積貯器3264及第二積貯器3268。壓縮機3262可經組態以將自氣體封裝組裝件1101抽取之惰性氣體壓縮至所要的壓力。壓縮機迴路3250之入口側可經線路3254(具有閥3256及止回閥3258)經由氣體封裝組裝件出口3252而與氣體封裝組裝件1101流體連通。壓縮機迴路3250可經由外部氣體迴路3200而與壓縮機迴路3250之出口側上的氣體封裝組裝件1101流體連通。積貯器3264可安置於壓縮機3262與壓縮機迴路3250與外部氣體迴路3200之接合點之間，且可經組態以產生5psig或更高之壓力。第二積貯器3268可處於壓縮機迴路3250中，用於提供歸因於在約60Hz下之壓縮機活塞循環的衰減波動。對於壓縮機迴路3250之各種具體實例，第一積貯器3264可具有在約80加侖至約160加侖之間的容量，而第二積貯器可具
有在約30加侖至約60加侖之間的容量。根據氣體封裝系統503之各種具體實例，壓縮機3262可為零入口(zero ingress)壓縮機。各種類型之零入口壓縮機可在不將大氣源氣體洩漏至本教示之氣體封裝系統之各種具體實例內的情況下操作。零入口壓縮機之各種具體實例可連續地運作，例如，在利用需要壓縮惰性氣體的各種器件及裝置的OLED印刷製程期間。
The
積貯器3264可經組態以接收且積貯來自壓縮機3262的經壓縮之惰性氣體。積貯器3264可按需要在氣體封裝組裝件1101中供應經壓縮之惰性氣體。舉例而言，積貯器3264可提供氣體以維持用於氣體封裝組裝件1101之各種組件(諸如但不限於，氣動機器人、基板浮動台、空氣軸承、空氣襯套、壓縮氣體工具、氣動致動器及其組合中之一或多者)的壓力。如圖14中針對氣體封裝系統503所展示，氣體封裝組裝件1101可具有封裝於其中之OLED印刷系統2000。如在圖14中示意性地描繪，噴墨印刷系統2000可由可為花崗岩平台之印刷系統基底2100支撐。印刷系統基底2100可支撐基板支撐裝置，諸如，夾盤，例如(但不限於)，真空夾盤、具有壓力端口之基板浮動夾盤及具有真空及壓力端口之基板浮動夾盤。在本教示之各種具體實例中，基板支撐裝置可為基板浮動台，諸如，圖14中指示之基板浮動台2200。基板浮動台2200可用於基板之無摩擦支撐。除了低粒產生浮動台之外，為了進行基板之無摩擦Y軸傳送，印刷系統2000可具有利用空氣襯套之Y軸運動系統。另外，印刷系統2000可具有至少一X,Z軸托架組裝件，其中運動控制由低粒產生X軸空氣軸承組裝件提供。可使用低粒產生運動系統之各種組件(諸如，X軸空氣軸承組裝件)代替(例如)各種粒子產生線性機械軸承系統。對於本教示之氣體封裝及系統之各種具體實例，多種氣動操作式器件及裝置之使用可提供低粒產生效能，以及為低維護性的。壓縮機迴路3250可經組態以連續供應加壓之惰性氣體至氣體封裝系統503之各種器件及裝置。除了加壓之惰性氣體之供應之外，利用
空氣軸承技術的噴墨印刷系統2000之基板浮動台2200亦利用真空系統3270，當閥3274在打開位置中時，該真空系統經由線路3272與氣體封裝組裝件1101連通。
The
根據本教示的加壓之惰性氣體再循環系統可具有如圖14中針對壓縮機迴路3250所展示之壓力控制式旁路迴路3260，其用以補償在使用期間對加壓氣體之可變需求，藉此提供本教示之氣體封裝系統之各種具體實例的動態平衡。對於根據本教示之氣體封裝系統之各種具體實例，旁路迴路可維持積貯器3264中之恆定壓力，而不破壞或改變封裝1101中之壓力。旁路迴路3260可具有在旁路迴路之入口側上的第一旁路入口閥3261，其係閉合的，除非使用旁路迴路3260。旁路迴路3260亦可具有後壓力調節器3266，當第二閥3263閉合時，可使用該後壓力調節器。旁路迴路3260可具有安置於旁路迴路3260之出口側處的第二積貯器3268。對於利用零入口壓縮機的壓縮機迴路3250之具體實例，旁路迴路3260可補償可在氣體封裝系統之使用期間隨著時間過去而發生的壓力之小漂移。當旁路入口閥3261處在打開位置中時，旁路迴路3260可與旁路迴路3260之入口側上的壓縮機迴路3250流體連通。當旁路入口閥3261打開時，若在氣體封裝組裝件1101之內部不需要來自壓縮機迴路3250之惰性氣體，則經由旁路迴路3260分流之惰性氣體可再循環至壓縮機。壓縮機迴路3250經組態以當積貯器3264中的惰性氣體之壓力超過預設定臨限壓力時經由旁路迴路3260分流惰性氣體。用於積貯器3264之預設定臨限壓力在每分鐘至少約1立方英尺(cfm)之流率下可在自約25psig至約200psig之間，或在每分鐘至少約1立方英尺(cfm)之流率下可在自約50psig至約150psig之間，或在每分鐘至少約1立方英尺(cfm)之流率下可在自約75psig至約125psig之間，或在每分鐘至少約1立方英尺(cfm)之流率下可在自約90psig至約95psig之間。
The pressurized inert gas recirculation system according to the present teachings can have a pressure controlled
壓縮機迴路3250之各種具體實例可利用不同於零入口壓縮機之多種壓縮機，諸如，變速壓縮機或可經控制為處於開或關狀態中之壓縮機。如本文中先前所論述，零入口壓縮機確保無大氣反應性物質可被引入至氣體封裝系統內。因而，可將防止大氣反應性物質被引入至氣體封裝系統內之任何壓縮機組態用於壓縮機迴路3250。根據各種具體實例，氣體封裝系統503之壓縮機3262可收容於(例如但不限於)氣密性外殼中。外殼內部可經組態成與惰性氣體(例如，形成用於氣體封裝組裝件1101之惰性氣體氣氛的相同惰性氣體)之源流體連通。對於壓縮機迴路3250之各種具體實例，可按恆定速度控制壓縮機3262以維持恆定壓力。在不利用零入口壓縮機的壓縮機迴路3250之其他具體實例中，當達到最大臨限壓力時，可關閉壓縮機3262，且當達到最小臨限壓力時接通該壓縮機。
Various specific examples of the
在圖15中，對於氣體封裝系統504，展示了利用真空吹風機3290之吹風機迴路3280，其用於操作收容於氣體封裝組裝件1101中的噴墨印刷系統2000之基板浮動台2200。如本文中先前針對壓縮機迴路3250所論述，吹風機迴路3280可經組態以連續將加壓之惰性氣體供應至印刷系統2000之基板浮動台2200。
In FIG. 15, for the
可利用加壓之惰性氣體再循環系統的氣體封裝系統之各種具體實例可具有利用多種加壓氣體源的各種迴路，諸如，壓縮機、吹風機及其組合中之至少一者。在圖15中，對於氣體封裝系統504，壓縮機迴路3250可與外部氣體迴路3200(其可用於供應用於高消耗歧管3225以及低消耗歧管3215之惰性氣體)流體連通。對於如圖15中針對氣體封裝系統504展示的根據本教示之氣體封裝系統之各種具體實例，高消耗歧管3225可用以將惰性氣體供應至各種器件及裝置，諸如(但不限於)，基板浮動台、氣動機器人、空氣軸承、空氣襯套及壓縮氣體工具及其組合中之一或多者。對於根據本教示之氣體封裝系統之各種具體實例，低消耗3215可用以將惰
性氣體供應至各種裝置及器件，諸如(但不限於)，隔離器及氣動致動器及其組合中之一或多者。
Various specific examples of gas encapsulation systems that can utilize pressurized inert gas recirculation systems can have various circuits that utilize multiple sources of pressurized gas, such as at least one of compressors, blowers, and combinations thereof. In FIG. 15, for the
對於圖15之氣體封裝系統504之各種具體實例，吹風機迴路3280可用以將加壓之惰性氣體供應至基板浮動台2200之各種具體實例，而與外部氣體迴路3200流體連通之壓縮機迴路3250可用以將加壓之惰性氣體供應至(例如但不限於)氣動機器人、空氣軸承、空氣襯套及壓縮氣體工具及其組合中之一或多者。除了加壓之惰性氣體之供應之外，利用空氣軸承技術的OLED噴墨印刷系統2000之基板浮動台2200亦利用吹風機真空3290，當閥3294在打開位置中時，該吹風機真空經由線路3292而與氣體封裝組裝件1101連通。吹風機迴路3280之外殼3282可維護用於將加壓之惰性氣體源供應至基板浮動台2200的第一吹風機3284，及充當用於基板浮動台2200之真空源的第二吹風機3290(其收容於氣體封裝組裝件1101中之惰性氣體環境中)。可使吹風機適合於用作基板浮動台之各種具體實例的加壓惰性氣體或真空之源的屬性包括(例如，但不限於)其具有高度可靠性；使其具有低維護性，具有變速控制，及具有廣泛的一系列流量；各種具體實例能夠提供在約100m3/h至約2,500m3/h之間的容積流量。吹風機迴路3280之各種具體實例另外可具有在吹風機迴路3280之入口端處的第一隔離閥3283以及止回閥3285及在吹風機迴路3280之出口端處的第二隔離閥3287。吹風機迴路3280之各種具體實例可具有可調整閥3286(其可為(例如，但不限於)閘閥、蝶形閥、針閥或球閥)以及熱交換器3288(用於將自吹風機迴路3280至基板浮動台2200之惰性氣體維持在定義之溫度)。
For various specific examples of the
圖15描繪外部氣體迴路3200(亦在圖14中所展示)，其用於整合及控制用於在圖14之氣體封裝系統503及在圖15之氣體封裝系統504之各種操作態樣中使用的惰性氣體源3201及清潔乾燥空氣(CDA)源3203。圖14及圖15之外部氣體迴路3200可包括至少四個機械閥。此等閥
包含第一機械閥3202、第二機械閥3204、第三機械閥3206及第四機械閥3208。此等各種閥位於各種流動線路中之允許控制惰性氣體及諸如清潔乾燥空氣(CDA)之空氣源的位置處。根據本教示，惰性氣體可為在一組定義之條件下不經歷化學反應之任何氣體。惰性氣體之一些通用非限制性實例可包括氮、稀有氣體中之任何者及其任何組合。室內惰性氣體線路3210自室內惰性氣體源3201延伸。室內惰性氣體線路3210繼續線性延伸，作為與低消耗歧管3215流體連通之低消耗歧管線路3212。交叉線路第一區段3214自位於室內惰性氣體線路3210、低消耗歧管線路3212與交叉線路第一區段3214之相交處的第一流動接合點3216延伸。交叉線路第一區段3214延伸至第二流動接合點3218。壓縮機惰性氣體線路3220自壓縮機迴路3250之積貯器3264延伸且終止於第二流動接合點3218。CDA線路3222自CDA源3203延伸，且作為與高消耗歧管3225流體連通之高消耗歧管線路3224繼續。第三流動接合點3226定位於交叉線路第二區段3228、清潔乾燥空氣線路3222與高消耗歧管線路3224之相交處。交叉線路第二區段3228自第二流動接合點3218延伸至第三流動接合點3226。在維護期間，可藉由高消耗歧管3225對高消耗之各種組件供應CDA。使用閥3204、3208及3230隔離壓縮機可防止諸如氧及水蒸氣之反應性物質污染壓縮機及積貯器內之惰性氣體。
15 depicts an external gas circuit 3200 (also shown in FIG. 14), which is used to integrate and control for use in various operational aspects of the
氣體封裝組裝件之各種具體實例的惰性氣體之不斷循環及過濾為粒子控制系統之一部分，該粒子控制系統可提供維持氣體封裝系統之各種具體實例內的實質上低粒環境。氣體循環及過濾系統之各種具體實例可經設計以提供符合國際標準組織標準(ISO)14644-1：1999「潔淨室及相關聯之受控制之環境--第1部分：空氣清潔度之分類(Cleanrooms and associated controlled environments-Part 1：Classification of air cleanliness)」(如由第1類別至第5類別指定)之標準的針對空中顆粒之低粒環境。另外，粒子控制系統之各種組件可將顆粒物排出至氣體循環及過濾系統以便維持
最接近基板之低粒地帶。可使用(例如)攜帶型粒子計數器件在印刷製程前針對氣體封裝系統之各種具體實例執行空中顆粒物之判定，用於系統驗證。在氣體封裝系統之各種具體實例中，可當印刷基板時在原地執行空中顆粒物之判定，作為持續進行之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行空中顆粒物之判定，用於系統驗證。
The continuous circulation and filtration of inert gas in various specific examples of gas packaging assemblies is part of a particle control system that can provide for maintaining a substantially low particle environment within various specific examples of gas packaging systems. Various specific examples of gas circulation and filtration systems can be designed to provide compliance with International Standards Organization (ISO) 14644-1: 1999 "Clean rooms and associated controlled environments-Part 1: Classification of air cleanliness ( Cleanrooms and associated controlled environments-Part 1: Classification of air cleanliness) (as specified by
氣體循環及過濾系統之各種具體實例描繪於圖16至圖18中。根據本教示之氣體循環及過濾系統之各種具體實例，可將管道系統裝設於藉由接合壁框與頂板框構件而形成的內部部分中。對於氣體封裝組裝件之各種具體實例，可在建構過程期間裝設管道系統。根據本教示之各種具體實例，管道系統可裝設於已自複數個框構件建構之氣體封裝框組裝件內。在各種具體實例中，在將複數個框構件接合以形成氣體封裝框組裝件前，可將管道系統裝設於框構件上。用於氣體封裝系統之各種具體實例的管道系統可經組態使得自一或多個管道系統入口吸入至管道系統內之實質上所有氣體被移動經過在氣體封裝組裝件內部之用於移除顆粒物的氣體過濾迴路之各種具體實例。另外，氣體封裝系統之各種具體實例之管道系統可經組態以將在氣體封裝組裝件外部的氣體淨化迴路之入口及出口與用於移除在氣體封裝組裝件內部之顆粒物的氣體過濾迴路分開。根據本教示之管道系統之各種具體實例可自金屬薄片(例如但不限於，具有約80密耳之厚度的鋁薄片)製造。 Various specific examples of gas circulation and filtration systems are depicted in FIGS. 16-18. According to various specific examples of the gas circulation and filtration system of the present teaching, the piping system can be installed in the inner portion formed by joining the wall frame and the roof frame member. For various specific examples of gas packaging assemblies, piping systems can be installed during the construction process. According to various specific examples of this teaching, the piping system can be installed in a gas encapsulated frame assembly that has been constructed from a plurality of frame members. In various specific examples, before joining a plurality of frame members to form a gas-encapsulated frame assembly, a piping system may be installed on the frame members. Piping systems for various specific examples of gas encapsulation systems can be configured such that substantially all gas drawn into the piping system from one or more pipe system inlets is moved through the interior of the gas encapsulation assembly for particulate removal Various specific examples of gas filter circuits. In addition, the piping system of various specific examples of the gas packaging system can be configured to separate the inlet and outlet of the gas purification circuit outside the gas packaging assembly from the gas filtering circuit for removing particulate matter inside the gas packaging assembly . Various specific examples of piping systems according to the present teachings can be manufactured from metal flakes (such as, but not limited to, aluminum flakes having a thickness of about 80 mils).
圖16描繪可包括氣體封裝組裝件100之管道系統組裝件1501及扇形過濾器單元組裝件1502的循環及過濾系統1500之右前部幻象透視圖。封裝管道系統組裝件1501可具有前壁面板管道系統組裝件1510。如展示，前壁面板管道系統組裝件1510可具有前壁面板入口管道1512、第一前壁面板升流管1514及第二前壁面板升流管1516，兩個升流管皆與前壁面
板入口管道1512流體連通。展示第一前壁面板升流管1514具有出口1515，其與扇形過濾器單元蓋103之頂板管道1505可密封地嚙合。以類似方式，展示第二前壁面板升流管1516具有出口1517，其與扇形過濾器單元蓋103之頂板管道1507可密封地嚙合。在此點上，前壁面板管道系統組裝件1510提供利用前壁面板入口管道1512在氣體封裝系統內自底部經由每一前壁面板升流管1514及1516循環惰性氣體及分別經由出口1505及1507傳遞空氣，使得空氣可由(例如)扇形過濾器單元組裝件1502之扇形過濾器單元1552過濾。最接近扇形過濾器單元1552的為熱交換器1562，其作為熱調節系統之部分，可將循環經過氣體封裝組裝件100之惰性氣體維持在所要的溫度。
16 depicts a phantom perspective view of the circulation and
右壁面板管道系統組裝件1530可具有右壁面板入口管道1532，其經由右壁面板第一升流管1534及右壁面板第二升流管1536而與右壁面板上部管道1538流體連通。右壁面板上部管道1538可具有第一管道入口端1535及第二管道出口端1537，該第二管道出口端1537與後壁管道系統組裝件1540之後壁面板上部管道1546流體連通。左壁面板管道系統組裝件1520可具有與針對右壁面板組裝件1530所描述相同的組件，在圖16中可顯而易見其中的經由第一左壁面板升流管1524與左壁面板上部管道(圖中未示)流體連通之左壁面板入口管道1522及第一左壁面板升流管1524。後壁面板管道系統組裝件1540可具有後壁面板入口管道1542，其與左壁面板組裝件1520及右壁面板組裝件1530流體連通。另外，後壁面板管道系統組裝件1540可具有後壁面板底部管道1544，其可具有後壁面板第一入口1541及後壁面板第二入口1543。後壁面板底部管道1544可經由第一隔壁1547及第二隔壁1549而與後壁面板上部管道1546流體連通，該等隔壁結構可用以將(例如但不限於)服務自氣體封裝組裝件100之外部饋入至內部。根據本教示，服務束可包括(例如但不限於)光纜、電纜、電線及管系及類
似者。回想起，製造設施可能需要實質長度之各種服務束，該等服務束可操作性地自各種系統及組裝件連接以提供操作印刷系統所需之光學、電、機械及流體連接。管道開口1533提供將至少一服務束移出後壁面板上部管道1546，可使該至少一服務束經由隔壁1549穿過後壁面板上部管道1546。可使用可移除之***面板在外部氣密性地密封隔壁1547及隔壁1549，如先前所描述。後壁面板上部管道經由通風孔1545與(例如但不限於)扇形過濾器單元1554流體連通，通風孔之一拐角展示於圖16中。在此點上，左壁面板管道系統組裝件1520、右壁面板管道系統組裝件1530及後壁面板管道系統組裝件1540提供分別利用壁面板入口管道1522、1532及1542以及後部面板下部管道1544(其經由如先前所描述之各種升流管、管道、隔壁通路及類似者而與通風孔1545流體連通)在氣體封裝組裝件內自底部循環惰性氣體。因此，空氣可由(例如)循環及過濾系統1500之扇形過濾器單元組裝件1502之扇形過濾器單元1554過濾。最接近扇形過濾器單元1554的為熱交換器1564，其作為熱調節系統之部分，可將經由氣體封裝組裝件100循環之惰性氣體維持在所要的溫度。如本文中隨後將更詳細地論述，可根據在處理期間在印刷系統中的基板之實體位置來選擇扇形過濾器單元組裝件(諸如循環及過濾系統1500之包括扇形過濾器單元1552及1554的扇形過濾器單元組裝件1502)之扇形過濾器單元的數目、大小及形狀。關於基板之實體行程選擇的扇形過濾器單元組裝件的扇形過濾器單元之數目、大小及形狀可為可在基板製造製程期間提供最接近基板之低粒地帶的低粒氣體封裝系統之要素。
The right wall panel
在圖16中，展示經由開口1533之纜線饋入。如本文中隨後將更詳細地論述，本教示之氣體封裝組裝件之各種具體實例提供使服務束經過管道系統。為了消除在此等服務束周圍形成之洩漏路徑，可使用用於使用保形材料密封服務束中的不同大小之纜線、電線及管系之各種方法。
亦在圖16中針對封裝管道系統組裝件1501展示了管路I及管道II，其被展示為扇形過濾器單元蓋103之部分。管路I提供惰性氣體至外部氣體淨化系統之出口，而管路II使經淨化之惰性氣體返回至在氣體封裝組裝件100內部之循環及過濾迴路。
In Fig. 16, the cable feed through the
在圖17中，展示封裝管道系統組裝件1501之頂部幻象透視圖。可看出左壁面板管道系統組裝件1520與右壁面板管道系統組裝件1530之對稱本質。對於右壁面板管道系統組裝件1530，右壁面板入口管道1532經由右壁面板第一升流管1534及右壁面板第二升流管1536而與右壁面板上部管道1538流體連通。右壁面板上部管道1538可具有第一管道入口端1535及第二管道出口端1537，該第二管道出口端1537與後壁管道系統組裝件1540之後壁面板上部管道1546流體連通。類似地，左壁面板管道系統組裝件1520可具有左壁面板入口管道1522，其經由左壁面板第一升流管1524及左壁面板第二升流管1526而與左壁面板上部管道1528流體連通。左壁面板上部管道1528可具有第一管道入口端1525及第二管道出口端1527，該第二管道出口端1527與後壁管道系統組裝件1540之後壁面板上部管道1546流體連通。另外，後壁面板管道系統組裝件可具有後壁面板入口管道1542，其與左壁面板組裝件1520及右壁面板組裝件1530流體連通。另外，後壁面板管道系統組裝件1540可具有後壁面板底部管道1544，其可具有後壁面板第一入口1541及後壁面板第二入口1543。後壁面板底部管道1544可經由第一隔壁1547及第二隔壁1549而與後壁面板上部管道1546流體連通。如圖16及圖17中展示之管道系統組裝件1501可提供惰性氣體自前壁面板管道系統組裝件1510之有效循環，此將惰性氣體自前壁面板入口管道1512分別經由前臂面板出口1515及1517循環至頂板面板管道1505及1507，以及將惰性氣體自分別自入口管道1522、1532及1542循環空氣之左壁面板組裝件1520、右壁面板組裝件1530及後壁面板管道系統組裝件1540循環至通風孔
1545。一旦經由頂板面板管道1505及1507及通風孔1545將惰性氣體排出至在封裝100之扇形過濾器單元蓋103下之封裝區域內，如此排出之惰性氣體就可經由扇形過濾器單元組裝件1502之扇形過濾器單元1552及1554過濾。另外，循環之惰性氣體可由為熱調節系統之部分的熱交換器1562及1564維持在所要的溫度。
In FIG. 17, a top phantom perspective view of the packaged
圖18為封裝管道系統組裝件1501之底部幻象圖。入口管道系統組裝件1509包括相互流體連通之前壁面板入口管道1512、左壁面板入口管道1522、右壁面板入口管道1532及後壁面板入口管道1542。如本文中先前所論述，管路I提供惰性氣體至外部氣體淨化系統之出口，而管路II使經淨化之惰性氣體返回至在氣體封裝組裝件100內部之循環及過濾迴路。
FIG. 18 is a bottom phantom view of the package
對於入口管道系統組裝件1509中包括之每一入口管道，存在跨每一管道之底部均勻分佈之明顯開口，為了本教示之目的，將開口之集合具體地突出表示為前壁面板入口管道1512之開口1511、左壁面板入口管道1522之開口1521、右壁面板入口管道1532之開口1531及後壁面板入口管道1542之開口1541。如跨每一入口管道之底部顯而易見的，此等開口提供對封裝100內的惰性氣體之有效吸取，以用於不斷的循環及過濾。氣體封裝組裝件之各種具體實例之惰性氣體的不斷循環及過濾為可提供維持氣體封裝系統之各種具體實例內的實質上低粒環境的粒子控制系統之一部分。氣體循環及過濾系統之各種具體實例可經設計以提供用於維持符合國際標準組織標準(ISO)14644-1：1999(如由第1類別至第5類別指定)之標準的空中顆粒含量之低粒環境。另外，可包括捆紮在一起之纜線、電線及管系及類似者之服務束可充當顆粒物之來源。因此，使服務束經由管道系統饋入可將經識別之粒子源圍阻於管道系統內，且經由循環及過濾系統排出顆粒物。
For each inlet pipe included in the inlet
氣體封裝系統之各種具體實例可具有可維持實質上低粒環 境之一粒子控制系統，從而提供在約0.1μm或更大至約10μm或更大之間的粒子之基板上粒子規範。對於目標粒徑範圍中之每一者，基板上粒子規範之各種具體實例可易於自每分鐘每平方公尺基板之平均基板上粒子分佈轉換至每分鐘每基板之平均基板上粒子分佈。如本文中先前所論述，可易於經由基板(例如，具體代大小之基板)與彼基板代之對應面積之間的已知關係進行此轉換。另外，可易於將每分鐘每平方公尺基板之平均基板上粒子分佈轉換至多種單位時間表達中之任何者。舉例而言，除了在標準時間單位(例如，秒、分鐘及天)之間的轉換外，亦可使用與處理特定有關之時間單位。舉例而言，如本文中先前所論述，印刷循環可與時間單位相關聯。 Various specific examples of gas encapsulation systems may have a ring that can maintain a substantially low particle A particle control system to provide particle specifications on a substrate of particles between about 0.1 μm or greater and about 10 μm or greater. For each of the target particle size ranges, various specific examples of the on-substrate particle specification can be easily converted from the average on-substrate particle distribution per minute per square meter of substrate to the average on-substrate particle distribution per minute per substrate. As previously discussed herein, this conversion can be easily performed via a known relationship between the substrate (eg, a substrate of a specific generation size) and the corresponding area of the substrate generation. In addition, the average particle distribution on the substrate per minute per square meter of substrate can be easily converted to any of a variety of unit time expressions. For example, in addition to conversion between standard time units (e.g., seconds, minutes, and days), time units specific to processing may also be used. For example, as previously discussed herein, a printing cycle may be associated with a unit of time.
本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於10μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於2μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。對於本教示之氣體封裝系統之各種具體實例，可 維持低粒環境，從而對於大小大於或等於0.3μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。 Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a particle deposition rate specification that is less than or equal to about 100 particles per square meter substrate per minute for particles larger than or equal to 10 μm Average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing particles with a size greater than or equal to 5 μm that meet the deposition rate specification on the substrate of less than or equal to about 100 particles per square meter of substrate per minute Average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that meets a particle size of less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 2 μm The average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low-grain environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 1 μm The average particle distribution on the substrate. Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.5 μm The average particle distribution on the substrate. For various specific examples of the gas packaging system taught in this Maintain a low particle environment to provide an average on-substrate particle distribution that conforms to the on-substrate deposition rate specification of less than or equal to about 1,000 particles per square meter of substrate per minute for particles larger than or equal to 0.3 μm. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.1 μm The average particle distribution on the substrate.
製造設施可能需要實質長度之各種服務束，該等服務束可操作性地自各種裝置及系統連接以提供(例如)操作印刷系統所需之光學、電、機械及流體連接。根據本教示，服務束可包括(例如但不限於)光纜、電纜、電線及管系及類似者。作為藉由使各種纜線、電線及管系及類似者一起捆紮於服務束中而創造的大量空隙空間之結果，根據本教示的服務束之各種具體實例可具有顯著的總死體積。自服務束中之大量空隙空間產生的總死體積可導致堵塞於其中的大量反應性氣態物質之滯留。反應性大氣源氣體之此實質來源可顯著增加氣體封裝組裝件之恢復時間，例如，在維護後。 Manufacturing facilities may require various lengths of service bundles that are operatively connected from various devices and systems to provide, for example, the optical, electrical, mechanical, and fluid connections required to operate the printing system. According to the teachings, service bundles may include (for example, but not limited to) optical cables, electrical cables, wires and piping, and the like. As a result of the large amount of void space created by bundling various cables, wires and piping and the like together in the service bundle, various specific examples of service bundles according to the teachings can have a significant total dead volume. The total dead volume generated from the large amount of void spaces in the service beam can lead to the retention of large amounts of reactive gaseous substances plugged therein. This substantial source of reactive atmospheric source gas can significantly increase the recovery time of the gas package assembly, for example, after maintenance.
因此，除了提供粒子控制系統之組件之外，經由管道系統饋入服務束可減少氣體封裝組裝件的關於反應性物質之恢復時間；藉此更迅速地使氣體封裝組裝件重新達到用於執行空氣敏感性製程的規範。對於適用於印刷OLED器件的本教示之氣體封裝系統之各種具體實例，可將各種反應性物質(包括諸如水蒸氣及氧之各種反應性大氣源氣體以及有機溶劑蒸氣)中之每一物質維持處於100ppm或更低，例如，處於10ppm或更低、處於1.0ppm或更低或處於0.1ppm或更低。 Therefore, in addition to providing the components of the particle control system, feeding the service beam through the piping system can reduce the recovery time of the gas encapsulation assembly with respect to reactive substances; thereby, the gas encapsulation assembly can be re-reached for performing air more quickly Specification of sensitive processes. For various specific examples of the gas encapsulation system applicable to the printing of OLED devices, each of various reactive substances (including various reactive atmospheric source gases such as water vapor and oxygen and organic solvent vapors) can be maintained at 100 ppm or lower, for example, at 10 ppm or lower, at 1.0 ppm or lower, or at 0.1 ppm or lower.
為了理解經由管道系統饋入之纜線敷設可如何導致減少淨化來自由服務束中之空隙空間(其作為捆紮各種光纜、電纜、電線及流體管系及類似者之結果而創造)創造之死體積的堵塞之反應性大氣源氣體所 花費之時間，對圖19A、圖19B及圖20進行參看。圖19A描繪服務束I之展開圖，服務束I可為可包括諸如管系A之管系的束，該管系可(例如)用於將各種墨水、溶劑及類似者傳遞至印刷系統(諸如，圖13A之印刷系統1050)。圖19A之服務束I可另外包括電佈線(諸如，電線B)或纜線(諸如，纜線C)，其可為同軸纜線或光纜。包括於服務束中之此等管系、電線及纜線可自外部排線至內部以連接至組成OLED印刷系統的各種器件及裝置。如在圖19A之影線區域中看出，服務束中之空隙空間可創造明顯的死體積D。在圖19B之示意性透視圖中，當經由管道II饋入服務束I時，惰性氣體III可連續掃過該束。圖20之展開剖視圖描繪連續掃過捆紮之管系、電線及纜線的惰性氣體可如何有效地增大堵塞之反應性物質自形成於服務束中之死體積的移除速率。反應性物質A向如在圖20中由物質A佔據之聚集區域所指示的死體積外之擴散速率與在如在圖20中由惰性氣體物質B佔據之聚集區域所指示的死體積外部之反應性物質之濃度成反比。亦即，若在恰好處於死體積外部之容積中的反應性物質之濃度高，則擴散速率減小。若在此區域中的反應性物質濃度因惰性氣體之氣流而連續地自恰好處於死體積空間外部之容積減小，則藉由質量作用，反應性物質自死體積擴散之速率增大。另外，藉由相同原理，當堵塞之反應性物質被有效地自彼等空間移除時，惰性氣體可擴散至死體積內。 In order to understand how the laying of cables fed through the piping system can lead to the reduction of the dead volume created by the purification of the void space in the service bundle (which is created as a result of bundling various optical cables, cables, wires and fluid piping and the like) Blocked by reactive atmospheric source gas For the time spent, refer to FIGS. 19A, 19B, and 20. 19A depicts an expanded view of service bundle I, which may be a bundle that may include a piping system such as piping system A, which may be used, for example, to deliver various inks, solvents, and the like to a printing system (such , The printing system 1050 of FIG. 13A). The service bundle I of FIG. 19A may additionally include electrical wiring (such as wire B) or cable (such as cable C), which may be a coaxial cable or an optical cable. These piping systems, wires and cables included in the service bundle can be routed from the outside to the inside to connect to the various devices and devices that make up the OLED printing system. As seen in the hatched area of FIG. 19A, the void space in the service bundle can create a significant dead volume D. In the schematic perspective view of FIG. 19B, when the service beam I is fed through the pipeline II, the inert gas III may continuously sweep through the beam. The expanded cross-sectional view of FIG. 20 depicts how continuous inert gas sweeping through the bundled piping, wires and cables can effectively increase the rate of removal of blocked reactive material from the dead volume formed in the service bundle. The reaction rate of the reactive substance A to the outside of the dead volume indicated by the aggregation area occupied by the substance A in FIG. 20 and the reaction outside the dead volume indicated by the aggregation area occupied by the inert gas substance B in FIG. 20 The concentration of sexual substances is inversely proportional. That is, if the concentration of the reactive substance in the volume just outside the dead volume is high, the diffusion rate decreases. If the concentration of the reactive substance in this area continuously decreases from the volume just outside the dead volume space due to the flow of inert gas, the rate of diffusion of the reactive substance from the dead volume increases by the action of mass. In addition, by the same principle, when the clogged reactive substances are effectively removed from their spaces, the inert gas can diffuse into the dead volume.
圖21A為氣體封裝組裝件101之各種具體實例之後部拐角之透視圖，還具有穿過返回管道1605至氣體封裝組裝件101之內部的幻象圖。對於氣體封裝組裝件101之各種具體實例，後壁面板1640可具有***面板1610，該***面板經組態以提供對(例如)電隔壁之接取。可經由隔壁將服務束饋入至纜線排線管道(諸如，在右壁面板1630中展示之管道1632)，針對該管道，已移除可移除之***面板以顯露排線至第一服務束管道進入口636之服務束。自其處，服務束可饋入至氣體封裝組裝件101之內部，且
在穿過返回管道1605之幻象圖中展示為處於氣體封裝組裝件101之內部。氣體封裝組裝件之用於服務束排線的各種具體實例可具有一個以上服務束進入口，諸如圖21A中所展示，該圖描繪第一服務束管道進入口1634及用於另一服務束的第二服務束管道進入口1636。圖21B描繪用於纜線、電線及管系束的第一服務束管道進入口1634之展開圖。第一服務束管道進入口1634可具有開口1631，其經設計以形成具有滑動蓋1633之密封件。在各種具體實例中，開口1631可容納可撓性密封模組(諸如，由Roxtec Company針對纜線進入口密封件提供之可撓性密封模組)，其可容納服務束中的各種直徑之纜線、電線及管系及類似者。替代地，滑動蓋1633之頂部1635及開口1631之上部部分1637可具有安置於每一表面上的保形材料，使得保形材料可在經由進入口(諸如，第一服務束管道進入口1634)饋入之服務束中的各種大小之直徑之纜線、電線及管系及類似者周圍形成密封件。
21A is a perspective view of the rear corners of various specific examples of the
如在圖22及圖23中所描繪，一或多個扇形過濾器單元可經組態以提供經由氣體封裝組裝件之內部的氣體之實質上層流。根據用於本教示之氣體封裝組裝件的循環及過濾系統之各種具體實例，鄰近氣體封裝組裝件之第一內表面安置一或多個扇形單元，且鄰近氣體封裝組裝件之第二相對內表面安置一或多個管道系統入口。舉例而言，氣體封裝組裝件可包含一內部頂板及一底部內部周邊，該一或多個扇形單元可鄰近內部頂板安置，且該一或多個管道系統入口可包含鄰近底部內部周邊安置之複數個入口開口，該等入口開口為管道系統之部分，如在圖16至圖18中所展示。 As depicted in FIGS. 22 and 23, one or more fan filter units may be configured to provide a substantially laminar flow of gas through the interior of the gas packaging assembly. According to various specific examples of circulation and filtration systems used in the gas package assembly of the present teachings, one or more fan-shaped units are disposed adjacent to the first inner surface of the gas package assembly and adjacent to the second opposite inner surface of the gas package assembly Place one or more piping system inlets. For example, the gas package assembly may include an inner top plate and a bottom inner periphery, the one or more fan-shaped units may be disposed adjacent to the inner top plate, and the one or more piping system inlets may include a plurality of disposed adjacent to the bottom inner periphery Inlet openings, which are part of the piping system, as shown in FIGS. 16-18.
圖22為根據本教示之各種具體實例的沿著氣體封裝系統505之長度截取之橫截面圖。圖22之氣體封裝系統505可包括一氣體封裝組裝件1100，其可容納一OLED噴墨印刷系統2001以及循環及過濾系統1500、氣體淨化系統3130(圖12及圖13)及熱調節系統3140。循環及過濾系統1500可包括管道系統組裝件1501及扇形過濾器單元組裝件1502。熱調
節系統3140可包括流體冷卻器3142，其與冷卻器出口線路3141且與冷卻器入口線路3143流體連通。經冷卻之流體可退出流體冷卻器3142，流過冷卻器出口線路3141，且經傳遞至熱交換器，對於氣體封裝系統之各種具體實例，如在圖22中所展示，熱交換器的位置可最接近複數個扇形過濾器單元中之每一者。流體可經由冷卻器入口線路3143而自最接近扇形過濾器單元之熱交換器返回至冷卻器3142以維持在恆定所要的溫度下。如本文中先前所論述，冷卻器出口線路3141及冷卻器入口線路3143與包括第一熱交換器1562、第二熱交換器1564及第三熱交換器1566之複數個熱交換器流體連通。根據如圖22中展示的氣體封裝系統505之各種具體實例，第一熱交換器1562、第二熱交換器1564及第三熱交換器1566分別與循環及過濾系統1500之扇形過濾器單元組裝件1502之第一扇形過濾器單元1552、第二扇形過濾器單元1554及第三扇形過濾器單元1556熱連通。
22 is a cross-sectional view taken along the length of the
在圖22中，許多箭頭描繪循環及過濾系統1500中之空氣流提供在氣體封裝組裝件1100內的低粒過濾空氣。在圖22中，管道系統組裝件1501可包括第一管道系統管路1573及第二管道系統管路1574，如在圖22之簡化示意圖中所描繪。第一管道系統管路1573可經由第一管道系統入口1571接收氣體，且可經由第一管道系統出口1575排出。類似地，第二管道系統管路1574可經由第二管道系統入口1572接收氣體，且經由第二管道系統出口1576排出。另外，如在圖22中所示，管道系統組裝件1501藉由有效界定可經由氣體淨化出口線路3131及氣體淨化入口線路3133而與氣體淨化系統3130流體連通之空間1580來分開經由扇形過濾器單元組裝件1502在內部再循環之惰性氣體。包括如針對圖16至圖18所描述之管道系統之各種具體實例的此循環系統提供實質上層流，使亂流最小化，促進封裝之內部中的氣體氣氛之顆粒物之循環、更新及過濾，且提供經由在氣體封裝組裝件外部之氣體淨化系統之循環。
In FIG. 22, many arrows depict low-grain filtered air provided by the air flow in the circulation and
圖23為根據根據本教示之氣體封裝系統之各種具體實例的沿著氣體封裝系統506之長度截取之橫截面圖。如圖22之氣體封裝系統505，圖23之氣體封裝系統506可包括一氣體封裝組裝件1100，其可收容一OLED噴墨印刷系統2001以及循環及過濾系統1500、氣體淨化系統3130(圖15)及熱調節系統3140。循環及過濾系統1500可包括管道系統組裝件1501及扇形過濾器單元組裝件1502。對於氣體封裝系統506之各種具體實例，可包括與冷卻器出口線路3141且與冷卻器入口線路3143流體連通之流體冷卻器3142的熱調節系統3140可與複數個熱交換器(例如，如在圖23中所描繪之第一熱交換器1562及第二熱交換器1564)流體連通。根據如圖22中展示的氣體封裝系統506之各種具體實例，諸如第一熱交換器1562及第二熱交換器1564之各種熱交換器可藉由最接近管道出口(諸如，管道系統組裝件1501之第一管道系統出口1575及第二管道系統出口1576)定位而與循環惰性氣體熱連通。在此點上，自管道入口(諸如，管道入口，諸如，管道系統組裝件1501之第一管道系統入口1571及第二管道系統入口1572)返回用於過濾之惰性氣體可在分別經由(例如)圖23之扇形過濾器單元組裝件1502之第一扇形過濾器單元1552、第二扇形過濾器單元1554及第三扇形過濾器單元1556循環前經熱調節。
23 is a cross-sectional view taken along the length of the
如可自展示經由圖22及圖23中之封裝的惰性氣體循環之方向之箭頭看出，扇形過濾器單元可經組態以提供自封裝之頂部向下朝向底部之實質上層流。可購自(例如)北卡羅來納州Washington之Flanders Corporation或北卡羅來納州Sanford之Envirco Corporation的扇形過濾器單元可適用於整合至根據本教示之氣體封裝組裝件之各種具體實例內。扇形過濾器單元之各種具體實例可經由每一單元交換在每分鐘約350立方英尺(CFM)至約700CFM之間之惰性氣體。如圖22及圖23中所展示，當扇形過濾器單元並聯且非串聯配置時，可在包含複數個扇形過濾器單元之系統 中交換的惰性氣體之量與使用的單元之數目成比例。 As can be seen from the arrows showing the direction of circulation of the inert gas through the package in FIGS. 22 and 23, the sector filter unit can be configured to provide a substantial laminar flow from the top of the package down toward the bottom. The fan filter units available from, for example, Flanders Corporation of Washington, North Carolina, or Envirco Corporation of Sanford, North Carolina, are suitable for integration into various specific examples of gas packaging assemblies according to this teaching. Various specific examples of fan filter units can exchange inert gas between about 350 cubic feet per minute (CFM) to about 700 CFM per minute through each unit. As shown in FIGS. 22 and 23, when the fan-shaped filter units are arranged in parallel and not in series, a system including a plurality of fan-shaped filter units The amount of inert gas exchanged in is proportional to the number of units used.
在封裝之底部附近，朝向複數個管道系統入口(在圖22及圖23中示意性地指示為管道系統組裝件1501之第一管道系統入口1571及第二管道系統入口1572)引導氣體流。如本文中先前針對圖16至圖18所論述，將管道入口實質上定位於封裝之底部且造成來自上部扇形過濾器單元的向下氣體流有助於封裝內的氣體氣氛之良好更新，且促進整個氣體氣氛經由結合封裝使用之氣體淨化系統之澈底更新及移動。藉由經由管道系統循環氣體氣氛且使用循環及過濾系統1500(該管道系統組裝件1501分開惰性氣體流以用於經由氣體淨化迴路3130循環)促進封裝中的氣體氣氛之層流及澈底更新，在氣體封裝組裝件之各種具體實例中，可將諸如水及氧以及溶劑中之每一者的反應性物質中之每一者之含量維持在100ppm或更低，例如，1ppm或更低，例如，在0.1ppm或更低。
Near the bottom of the package, a gas flow is directed toward a plurality of piping system inlets (indicated as first
圖24為氣體封裝系統507之前部示意圖，其可為圖22之氣體封裝系統505之前部示意圖。在圖24中，可看出被描繪為封裝於氣體封裝系統507中的印刷系統2001之更多細節。具有粒子控制系統的本教示之氣體封裝系統之各種具體實例可提供最接近基板(諸如，圖24之基板2050)的低粒地帶，該基板可由基板支撐裝置2200支撐。印刷系統之各種具體實例的印刷系統2001之基板支撐裝置2200可為夾盤或浮動台。如本文中先前所論述，根據本教示之氣體循環及過濾系統之各種具體實例可包括一管道系統組裝件(諸如，圖24之管道系統組裝件1501)以及可具有複數個扇形過濾器單元之扇形過濾器單元組裝件(諸如，扇形過濾器單元組裝件1502，其中在圖24之前部示意圖中展示扇形過濾器單元1552)。由箭頭指示之氣體流描繪最接近基板2050的經過濾之氣體之層流。回想起，層流環境可使亂流最小化，且可創造可維持符合國際標準組織標準(ISO)14644-1：1999(如由第1類別至第5類別指定)之標準的空中顆粒含量之實質上低粒環境。
24 is a schematic front view of the
如本文中隨後將更詳細地論述，對於本教示之氣體封裝系統之各種具體實例，一有效氣體循環及過濾系統可為粒子控制系統之一部分。然而，本教示之各種粒子控制系統亦預防在印刷製程期間最接近基板之粒子產生。如圖24中針對氣體封裝系統507之氣體封裝組裝件1100所描繪，基板2050可最接近印刷系統2001之可產生粒子的各種組件。舉例而言，X,Z托架組裝件2300可包括諸如可產生粒子之線性軸承系統之組件。服務束外殼2410可含有操作性地自各種裝置及系統連接至包括印刷系統之氣體封裝系統的粒子產生服務束。服務束之各種具體實例可包括捆紮之光纜、電纜、電線及管系及類似者，用於提供用於安置於氣體封裝系統之內部內的各種組裝件及系統之光學、電、機械及流體功能。
As will be discussed in more detail later in this article, for various specific examples of gas encapsulation systems of the present teachings, an effective gas circulation and filtration system can be part of the particle control system. However, the various particle control systems taught in this teaching also prevent the generation of particles closest to the substrate during the printing process. As depicted in FIG. 24 for the
本教示之氣體封裝系統可具有提供一粒子控制系統之各種組件。粒子控制系統之各種具體實例可包括與已被圍阻之粒子產生組件流體連通的氣體循環及過濾系統，使得可將此等圍阻粒子之組件排氣至氣體循環及過濾系統內。對於粒子控制系統之各種具體實例，已圍阻之粒子產生組件可被排氣至死空間內，從而致使此顆粒物不可用於在氣體封裝系統內再循環。本教示之氣體封裝系統之各種具體實例可具有一粒子控制系統，用於該粒子控制系統之各種組件可固有地為低粒產生的，藉此防止粒子在印刷製程期間累積於基板上。本教示之粒子控制系統之各種組件可利用粒子產生組件之圍阻及排氣，以及對固有地低粒產生的組件之選擇來提供最接近基板之低粒地帶。 The gas packaging system of this teaching can have various components that provide a particle control system. Various specific examples of the particle control system may include a gas circulation and filtration system in fluid communication with the contained particle generating component, so that the particle containment component can be exhausted into the gas circulation and filtration system. For various specific examples of particle control systems, the enclosed particle generating components can be exhausted into the dead space, rendering the particulate matter unusable for recirculation within the gas encapsulation system. Various specific examples of the gas encapsulation system of the present teaching may have a particle control system, and various components used in the particle control system may be inherently low-grain generated, thereby preventing particles from accumulating on the substrate during the printing process. The various components of the particle control system of this teaching can utilize the containment and exhaust of the particle generating components, as well as the selection of components that are inherently low in particle generation, to provide a low particle zone closest to the substrate.
根據用於OLED印刷系統的氣體封裝系統之各種具體實例，在處理期間可根據印刷系統中的基板之實體位置選擇扇形過濾器單元之數目。因而，扇形過濾器單元之數目可根據經由氣體封裝系統的基板之行程來變化。舉例而言，圖25為沿著氣體封裝系統508(其為類似於圖9中描繪之氣體封裝系統的氣體封裝系統)之長度截取之橫截面圖。氣體封
裝系統508可包括氣體封裝組裝件1100，其收容支撐於氣體封裝組裝件基底1320上之OLED噴墨印刷系統2001。OLED印刷系統之基板浮動台2200界定在基板之處理期間基板可在氣體封裝系統508中移動經過之行程。因而，氣體封裝系統508之扇形過濾器單元組裝件1502具有對應於在處理期間基板在噴墨印刷系統2001中之實體行程的適當數目個扇形過濾器單元(展示為1551-1555)。另外，圖25之示意性剖視圖描繪氣體封裝之各種具體實例之輪廓，其可有效減小在OLED印刷製程期間需要的惰性氣體之體積，且同時使得易於在處理期間遠端地(例如)使用裝設於各種手套端口中之手套或在維護操作之情況下直接藉由各種可移除之面板來接取氣體封裝組裝件1100之內部。
According to various specific examples of the gas packaging system used in the OLED printing system, the number of sector filter units can be selected according to the physical position of the substrate in the printing system during processing. Thus, the number of sector filter units can be varied according to the travel of the substrate through the gas encapsulation system. For example, FIG. 25 is a cross-sectional view taken along the length of the gas packaging system 508 (which is a gas packaging system similar to the gas packaging system depicted in FIG. 9). Gas seal
The mounting
圖26描繪根據本教示之印刷系統之各種具體實例的印刷系統2002。印刷系統2002可具有如先前針對圖10B之印刷系統2000所描述的特徵中之許多者。印刷系統2002可由印刷系統基底2101支撐。與印刷系統基底2101正交且安裝於印刷系統基底2101上的可為第一升流管2120及第二升流管2122，橋接部2130可安裝於該等升流管上。對於噴墨印刷系統2002之各種具體實例，橋接部2130可支撐可在X軸方向上相對於基板支撐裝置2250移動穿過服務束載體伸展部2401之至少一X軸托架組裝件2300。如本文中隨後將更詳細地論述，對於印刷系統2002之各種具體實例，X軸托架組裝件2300可利用固有地為低粒產生之一線性空氣軸承運動系統。根據本教示之印刷系統之各種具體實例，X軸托架可具有安裝於其上之Z軸移動板。在圖26中，描繪X軸托架組裝件2300具有第一Z軸移動板2315。在印刷系統2002之各種具體實例中，第二X軸托架組裝件可安裝於橋接部2130上，該橋接部亦可具有安裝於其上之Z軸移動板。在此點上，類似於圖10B之印刷系統2000，對於OLED噴墨印刷系統2002之各種具體實例，可存在兩個托架組裝件，每一者具有一印刷頭組裝件，例如，圖26之印刷
頭組裝件2500，以及安裝於第二X,Z軸托架組裝件(圖中未示)上之第二印刷頭組裝件。在印刷系統2002之各種具體實例中，第一印刷頭組裝件(諸如，圖26之印刷頭組裝件2500)可安裝於第一X,Z軸托架組裝件上，而用於檢驗基板2050之特徵的相機系統可安裝於第二X,Z軸托架組裝件(圖中未示)上。在圖26之印刷系統2002之各種具體實例中，印刷頭組裝件(諸如，圖26之印刷頭組裝件2500)可安裝於X,Z軸托架組裝件上，而用於固化印刷於基板2050上之囊封層的UV燈或熱源可安裝於第二X,Z軸托架組裝件(圖中未示)上。
FIG. 26 depicts a
根據印刷系統2002之各種具體實例，基板支撐裝置2250可為浮動台，其類似於圖10B之印刷系統2000之浮動台2200，其中在X,Y平面中可含有一基板，且浮動台可用以固定穩定的Z軸飛行高度。在印刷系統2002之各種具體實例中，基板支撐裝置2250可為夾盤。在印刷系統2002之各種具體實例中，夾盤可具有用於安裝基板之頂表面2252。在印刷系統2002之各種具體實例中，頂表面2252可支撐可替換之頂部板，從而實現容易的不同基板大小及類型之間的可交換性。在印刷系統2002之各種具體實例中，頂部板可容納不同大小及類型之多個基板。在可利用夾盤作為基板支撐裝置的印刷系統2002之各種具體實例中，在印刷製程期間，可使用此項技術中已知之真空、磁性或機械方式將基板牢固地固持於夾盤上。精確XYZ運動系統可具有用於使安裝於基板支撐裝置2250上之基板相對於印刷頭組裝件2500定位的各種組件，其可包括Y軸運動組裝件2355，以及X,Z托架組裝件2300。基板支撐裝置2250可安裝於Y軸運動組裝件2355上，且可使用(例如但不限於)線性軸承系統(利用機械軸承或空氣軸承)在軌系統2360上移動。對於氣體封裝系統之各種具體實例，空氣軸承運動系統有助於置放於基板支撐裝置2250上之基板在Y軸方向上的無摩擦傳送。Y軸運動系統2355亦可視情況使用雙軌運動，再次，由線性空氣軸承
運動系統或線性機械軸承運動系統提供。根據本教示，可使用其他精確XYZ運動系統，諸如(但不限於)，3軸線高架系統之各種具體實例。舉例而言，3軸線高架系統之各種具體實例可具有安裝於高架橋接部上的用於精確X,Z軸移動之X,Z托架組裝件，其中可精確地在Y軸方向上移動高架。
According to various specific examples of the
除了用於維持氣體封裝系統內之低粒環境之氣體循環及過濾系統之外，印刷系統(諸如，圖10B之印刷系統2000及圖26之印刷系統2002)之各種具體實例亦可具有整合至氣體封裝系統內的額外組件，其預防在印刷製程期間最接近基板之粒子產生。舉例而言，圖10B之印刷系統2000及圖26之印刷系統2002可具有一固有地低粒產生的X軸運動系統，其中可使用線性空氣軸承系統2320在橋接部2130上安裝及定位X,Z托架組裝件2300。另外，圖10B之印刷系統2000及圖26之印刷系統2002可具有服務束外殼排氣系統2400，以用於圍阻及排出自服務束產生之粒子。
In addition to gas circulation and filtration systems used to maintain a low particle environment in the gas packaging system, various specific examples of printing systems (such as the
根據本教示，服務束可包括(藉由非限制性實例)光纜、電纜、電線及管系及類似者。本教示之服務束之各種具體實例可操作性地連接至氣體封裝系統中之各種器件及裝置以提供在(例如但不限於)與印刷系統相關聯之各種器件及裝置之操作中所需的光學、電、機械及流體連接。考慮到各種服務束之大小及複雜性，各種運動系統常需要當將服務束與運動系統一起移動時服務束載體能對服務束進行管理。對於本教示之氣體封裝系統之各種具體實例，服務束載體可為可撓性帶，以用於將纜線、電線及管系及類似者之束按規則間隔系在一起。對於本教示之氣體封裝系統之各種具體實例，服務束載體可為服務束之護套或外套，其可覆蓋纜線、電線及管系及類似者之束。在本教示之氣體封裝系統之各種具體實例中，服務束載體可與服務束之纜線、電線及管系及類似者之束模製在一起。在各種具體實例中，服務束載體可為分段或可撓性鏈，其可支撐及載運纜線、電線及管系及類似者之束。 According to the teachings, service bundles can include (by way of non-limiting examples) optical cables, electrical cables, wires and piping, and the like. Various specific examples of the service bundle of this teaching can be operatively connected to various devices and devices in the gas packaging system to provide the optical required in the operation of (e.g., but not limited to) various devices and devices associated with the printing system , Electrical, mechanical and fluid connections. Considering the size and complexity of various service bundles, various motion systems often require that the service bundle carrier can manage the service bundle when moving the service bundle with the motion system. For various specific examples of the gas encapsulation system of this teaching, the service bundle carrier may be a flexible tape used to tie bundles of cables, wires, and piping and the like at regular intervals. For various specific examples of the gas packaging system of the present teachings, the service bundle carrier may be a sheath or jacket of the service bundle, which may cover bundles of cables, wires, and piping systems and the like. In various specific examples of the gas packaging system of the present teachings, the service bundle carrier may be molded with the bundle of cables, wires, and piping of the service bundle and the like. In various specific examples, the service bundle carrier can be a segmented or flexible chain that can support and carry bundles of cables, wires, and piping and the like.
根據本教示之氣體封裝系統之各種具體實例，可包括使用服務束載體管理之服務束的服務束外殼可圍阻自服務束外殼內之服務束及服務束載體產生之顆粒物。另外，如本文中隨後將更詳細地論述，服務束載體之移動可當其在服務束外殼內移動時按活塞狀方式壓縮空氣容積，從而創造內部服務束外殼與在服務束外殼外部之周圍環境之間的正壓力差，其可允許自與服務束載體相關聯之粒子產生組件形成的顆粒物經由(例如)由載體伸展部形成之開口逸散。十分接近基板之此顆粒物在被掃走至循環及過濾系統內之前具有污染基板表面之大機率。因此，服務束外殼排氣系統可為可圍阻且排氣服務束外殼的氣體封裝系統之粒子控制系統之各種具體實例之組件，以便確保實質上低粒印刷環境。 According to various specific examples of the gas encapsulation system of the present teaching, the service bundle housing of the service bundle managed by the service bundle carrier can contain the particulate matter generated from the service bundle and the service bundle carrier within the service bundle housing. In addition, as will be discussed in more detail later in this article, the movement of the service beam carrier can compress the air volume in a piston-like manner as it moves within the service beam shell, thereby creating an internal service beam shell and the surrounding environment outside the service beam shell The positive pressure difference between them may allow particulate matter formed from the particle generating assembly associated with the service beam carrier to escape through, for example, the opening formed by the carrier extension. The particulate matter that is very close to the substrate has a high probability of contaminating the substrate surface before being swept away into the circulation and filtration system. Therefore, the service beam housing exhaust system may be a component of various specific examples of particle control systems that can contain and exhaust the gas encapsulation system of the service beam housing in order to ensure a substantially low-grain printing environment.
如圖26中所示且由虛線所指示，對於服務束外殼排氣系統2400之各種具體實例，服務束外殼2410及服務束外殼排氣空間2420可為整體組裝件。對於此等具體實例，服務束外殼排氣系統2400可確保可維持服務束外殼之入口部分與出口部分之間的正壓力差，以用於經由服務束外殼排氣空間第一管道2422及服務束外殼排氣空間第二管道2424將在服務束外殼2410中產生之粒子排出至氣體循環及過濾系統內。替代地，對於各種具體實例，服務束外殼排氣系統2400可包括服務束外殼排氣空間2420，其可安裝至服務束外殼2410且與該服務束外殼流體連通。服務束外殼2410可圍阻由可包括捆紮之光纜、電纜、電線及管系及類似者之服務束產生的粒子。本教示之服務束之各種具體實例可提供一氣體封裝系統，其可包括一印刷系統，其中用於各種組裝件及系統的光學、電、機械及流體功能中之至少一者安置於氣體封裝之內部內。對於印刷系統2002之各種具體實例，服務束外殼排氣系統2400可確保可維持在服務束外殼之入口部分與出口部分之間的正壓力差，以用於將服務束外殼2410中所圍阻之粒子排出至服務束外殼排氣空間2420內。服務束外殼排氣空間2420可經由服務束外殼排氣空間
第一管道2422及服務束外殼排氣空間第二管道2424而與氣體循環及過濾系統流體連通。替代地，服務束外殼排氣空間第一管道2422及服務束外殼排氣空間第二管道2424可配有可撓性排氣軟管，使得由服務束外殼圍阻之粒子可經由服務束外殼排氣空間排出且經由可撓性排氣軟管引導至目標死空間內。
As shown in FIG. 26 and indicated by dashed lines, for various specific examples of the service bundle
此外，除了維持在服務束外殼排氣系統之入口部分與出口部分之間的正壓力差之外，對於服務束外殼排氣系統之各種具體實例，亦可進一步維持服務束外殼排氣系統之內部與周圍環境之間的相對中性或負壓力差。可在服務束外殼排氣系統之內部與周圍環境之間維持的此相對中性或負壓力差可防止粒子經由裂縫、縫隙及類似者自服務束外殼排氣系統洩漏。在十分接近基板處經由裂縫、縫隙及類似者洩漏的粒子在被掃走至循環及過濾系統內之前具有污染基板表面之大機率。 In addition to maintaining a positive pressure difference between the inlet and outlet portions of the service bundle housing exhaust system, various specific examples of the service bundle housing exhaust system can further maintain the interior of the service bundle housing exhaust system Relatively neutral or negative pressure difference with the surrounding environment. This relatively neutral or negative pressure difference that can be maintained between the interior of the service beam housing exhaust system and the surrounding environment can prevent particles from leaking from the service beam housing exhaust system through cracks, crevices, and the like. Particles leaking through cracks, crevices and the like very close to the substrate have a high probability of contaminating the substrate surface before being swept away into the circulation and filtration system.
圖27A描繪根據本教示之各種具體實例的低粒產生X軸運動系統2320之側剖視圖。在圖27A中，按與服務束外殼排氣系統2400之關係描繪低粒產生X軸運動系統2320，如圖27A中展示，服務束外殼排氣系統2400可具有服務束外殼2410及與服務束外殼排氣空間第一管道2422流體連通之服務束外殼排氣空間2420。印刷系統2002可包括基底2101，可將基板支撐裝置2250安裝於該基底上。X,Z托架組裝件2300可安裝至橋接部2130。如可在圖27A中呈現之剖視圖中看出，X軸運動系統2320可為線性空氣軸承運動系統，其為固有地低粒產生的。X軸運動系統2320可包括複數個空氣軸承圓盤2330及無刷線性馬達2340。服務束載體2430可安裝至X,Z托架組裝件2300，且可收容於服務束外殼2410中。如圖27A中所描繪，服務束外殼排氣空間2420可與服務束外殼2410流體連通，以及經由管道系統(諸如，服務束外殼排氣空間第一管道2422)而與氣體循環及過濾系統流體連通。在此點上，服務束外殼2410可排出自服務束之各種具體實例產
生的粒子。根據本教示之服務束可為可包括(例如但不限於)光纜、電纜、電線及管系及類似者之束，可使用服務束載體2430之各種具體實例來管理該束。本教示之服務束之各種具體實例可操作性地連接至印刷系統以提供操作(例如但不限於)印刷系統所需之各種光學、電、機械及流體連接。對於本教示之氣體封裝之各種具體實例，服務束載體(諸如，服務束載體2430)可由服務束外殼底部側2404支撐。對於本教示之氣體封裝之各種具體實例，服務束載體(諸如，服務束載體2430)可由托盤或架子支撐。
27A depicts a side cross-sectional view of a low-grain generating
圖27B為圖27A之展開圖，其更詳細地描繪印刷系統2002之低粒產生X軸運動系統2320。可將複數個空氣軸承圓盤2330安裝至X,Z軸托架組裝件2300之內表面。在此點上，低粒產生X軸運動系統2320之各種具體實例可提供X,Z軸托架組裝件2300在橋接部2130上之無摩擦行進。在圖27A中，展示最接近橋接部2130之第一側2132的第一圓盤2332及第二圓盤2334。圖27B之第三圓盤2336可最接近橋接部2130之頂表面2133，而第四圓盤2338可最接近橋接部2130之第二側2134。無刷線性馬達可包括可安裝於橋接部2130上之X,Z軸托架組裝件磁體軌道2342及可安裝至X,Z軸托架組裝件2300之線性馬達繞組2344。編碼器讀取頭2346可與線性馬達繞組2344相關聯以用於定位線性馬達2340。在無刷線性馬達2340之各種具體實例中，編碼器讀取頭2346可為光學編碼器。如本文中隨後將更詳細地論述，利用無摩擦空氣軸承圓盤的低粒X軸運動系統2320之各種具體實例可與壓縮機迴路之各種具體實例整合，如針對圖33及圖34展示及描述。最後，如圖27B中所展示，服務束外殼排氣系統2400可包括可收容服務束載體2430之服務束外殼2410。服務束外殼排氣系統2400可圍阻及排出來自服務束外殼2410之粒子，粒子可在服務束中產生，可使用服務束載體(諸如，服務束載體2430)來管理服務束。
27B is an expanded view of FIG. 27A, which depicts the low-grain generating
圖28A為印刷系統2003之前部透視圖，該印刷系統被展示
為具有安裝於橋接部2130之上的服務束外殼排氣系統2400。印刷系統2003之各種具體實例可具有如先前針對圖10B之印刷系統2000及圖26之印刷系統2002所描述之許多特徵。舉例而言，印刷系統2003可由印刷系統基底2101支撐。與印刷系統基底2101正交且安裝於其上的可為第一升流管2120及第二升流管2122，橋接部2130可安裝於該等升流管上。對於噴墨印刷系統2003之各種具體實例，橋接部2130可支撐至少一X軸托架組裝件2300，其可在X軸方向上相對於基板支撐裝置2250移動穿過服務束載體伸展部2401。根據本教示之印刷系統之各種具體實例，X軸托架2300可具有安裝於其上之Z軸移動板2310。在此點上，托架組裝件2300之各種具體實例可提供印刷頭組裝件2500關於基板支撐裝置2250之精確X,Z定位。在印刷系統2003之各種具體實例中，可將第二X軸托架組裝件安裝於橋接部2130上，該第二X軸托架可具有安裝於其上之一Z軸移動板。對於具有兩個X軸托架組裝件之印刷系統2003之具體實例，印刷頭組裝件可安裝於每一X,Z軸托架上，或各種其他器件(例如，如相機、UV燈及熱源，如針對圖10B之印刷系統2000及圖26之印刷系統2002所描述)可安裝於兩個X,Z軸托架組裝件上。根據印刷系統2003之各種具體實例，用於支撐基板之基板支撐裝置2250可為浮動台(類似於圖10B之印刷系統2000之浮動台2200)，或其可為夾盤，如先前針對圖26之印刷系統2002所描述。圖28A之印刷系統2003可具有固有地低粒產生的X軸運動系統，其中可使用空氣軸承線性滑塊組裝件將X,Z托架組裝件2300安裝且定位於橋接部2130上。對於本教示之各種印刷系統，空氣軸承線性滑塊組裝件可環繞整個橋接部2130，從而允許X,Z托架組裝件2300在橋接部2130上之無摩擦移動，以及提供可維持X,Z托架組裝件2300的行程之準確性之三點安裝，以及抵抗偏斜。
Figure 28A is a perspective view of the front of the
關於基板相對於印刷頭組裝件之精確移動，圖28A之印刷
系統2003之各種具體實例可具有精確XYZ運動系統，除了X,Z托架組裝件2300之外，其亦可包括Y軸運動組裝件2355。基板支撐裝置2250可安裝於Y軸運動組裝件2355上，且可使用(例如但不限於)線性軸承系統(利用機械軸承或空氣軸承)在軌系統2360上移動。對於氣體封裝系統之各種具體實例，空氣軸承運動系統有助於置放於基板支撐裝置2250上之基板在Y軸方向上的無摩擦傳送。Y軸運動系統2355亦可視情況使用雙軌運動，再次，由線性空氣軸承運動系統或線性機械軸承運動系統提供。根據本教示，可使用其他精確XYZ運動系統，諸如(但不限於)，3軸線高架系統之各種具體實例。舉例而言，3軸線高架系統之各種具體實例可具有安裝於高架橋接部上的用於精確X,Z軸移動之X,Z托架組裝件，其中可精確地在Y軸方向移動高架。
Regarding the precise movement of the substrate relative to the print head assembly, the printing of FIG. 28A
Various specific examples of the
如圖28A中所描繪，對於印刷系統2003之各種具體實例，可將服務束外殼排氣系統2400安裝於橋接部2130上。服務束外殼排氣系統2400可包括服務束外殼排氣空間2420，其可安裝至服務束外殼2410且與該服務束外殼流體連通。服務束外殼2410可圍阻由可包括捆紮之光纜、電纜、電線及管系之服務束產生的粒子。本教示之服務束之各種具體實例可為包括印刷系統的氣體封裝系統提供用於安置於內部的各種組裝件及系統的光學、電、機械及流體功能中之至少一者。對於印刷系統2003之各種具體實例，服務束外殼排氣系統2400可確保可維持在服務束外殼排氣系統之入口部分與出口部分之間的正壓力差，以用於將服務束外殼2410中所圍阻之粒子排出至服務束外殼排氣空間2420內。服務束外殼排氣空間2420可經由服務束外殼排氣空間第一管道2422及服務束外殼排氣空間第二管道2424而與氣體循環及過濾系統流體連通。替代地，服務束外殼排氣空間第一管道2422及服務束外殼排氣空間第二管道2424可配有可撓性排氣軟管，使得由服務束外殼圍阻之粒子可經由服務束外殼排氣空間排出且經由可撓性排氣軟管
引導至目標死空間內。
As depicted in FIG. 28A, for various specific examples of the
對於服務束外殼排氣系統之各種具體實例，除了維持在服務束外殼排氣系統之入口部分與出口部分之間的正壓力差之外，亦可進一步維持服務束外殼排氣系統之內部與周圍環境之間的相對中性或負壓力差。可在服務束外殼排氣系統之內部與周圍環境之間維持的此相對中性或負壓力差可防止粒子經由裂縫、縫隙及類似者自服務束外殼排氣系統洩漏。在十分接近基板處經由裂縫、縫隙及類似者洩漏之粒子在被掃走至循環及過濾系統內之前具有污染基板表面之大機率。 For various specific examples of the service bundle housing exhaust system, in addition to maintaining a positive pressure difference between the inlet and outlet portions of the service bundle housing exhaust system, the inside and surrounding of the service bundle housing exhaust system can be further maintained A relatively neutral or negative pressure difference between environments. This relatively neutral or negative pressure difference that can be maintained between the interior of the service beam housing exhaust system and the surrounding environment can prevent particles from leaking from the service beam housing exhaust system through cracks, crevices, and the like. Particles that leak through cracks, crevices, and the like very close to the substrate have a high probability of contaminating the substrate surface before being swept away into the circulation and filtration system.
圖28B描繪印刷系統2003之展開部分剖示前部透視圖。在圖28B中，X,Z托架組裝件2300可利用一空氣軸承線性滑塊組裝件以用於將X,Z托架組裝件2300定位於橋接部2130上。X,Z托架組裝件2300之移動在由服務束載體伸展部2401界定之距離上在X軸方向上移動。服務束載體伸展部2401為一開口，其允許捆紮至一服務束內的光纜、電纜、電線及管系及類似者之移動，該服務束收容於服務束外殼2410中且可連接(例如但不限於)至印刷頭組裝件2500。考慮到各種服務束之大小及複雜性，各種運動系統常需要當將服務束與運動系統一起移動時服務束載體能對服務束進行管理。在此點上，服務束載體2430被展示為收容於圖28B之服務束外殼2410中。在印刷期間，當托架組裝件移動以相對於定位於其下方之基板在X軸方向上精確定位印刷頭組裝件時，可包括纜線、電線及管系及類似者的服務束之移動以及服務束載體自身之移動可創造十分接近定位於服務束外殼下方之基板的顆粒物。此外，服務束載體之移動可當其在服務束外殼內移動時按活塞狀方式壓縮空氣容積，從而創造正壓力，正壓力可允許自與服務束載體相關聯之粒子產生組件形成的顆粒物經由(例如)載體伸展部2401逸散。十分接近基板之此顆粒物在被掃走至循環及過濾系統內之前具有污染基板表面之大機率。因此，服務束外殼排氣系統可為氣體封
裝系統之粒子控制系統之各種具體實例之組件，其可確保實質上低粒印刷環境。
FIG. 28B depicts a front perspective view of the unfolded portion of the
在圖28B中，展示服務束外殼頂表面2402具有一組槽2414，從而形成有槽之頂表面。對於圖28B之服務束外殼排氣系統2400之各種具體實例，存在為了確保自與服務束載體相關聯之粒子產生組件形成的顆粒物被吹掃至循環及過濾系統內的對此系統之兩個要求：1)當服務束載體在服務束外殼中移動時，經由服務束外殼排氣系統之排氣流量應大於在服務束載體之氣體壓縮側上的容積改變；及2)應存在恆定排氣流之均勻分佈以有效地吹掃服務束外殼容積。本教示之服務束外殼排氣系統之各種具體實例確保符合此等兩個要求。
In FIG. 28B, it is shown that the
舉例而言，如圖29A中所描繪，服務束外殼排氣系統之各種具體實例可包括服務束外殼2410，其可用以收容服務束載體2430。在圖29A中，將服務束載體2430描繪為分段可撓性鏈類型之服務束載體，可使用的各種其他類型之服務束載體可具有類似表現，藉此需要使用本教示之服務束外殼排氣系統之各種具體實例。服務束載體伸展部2401為一開口，其可允許自與服務束載體相關聯之粒子產生組件形成的顆粒物作為由服務束載體之移動創造之正壓力的結果而逸散出服務束外殼。可將服務束外殼排氣空間2420維持在正壓力下，正壓力可確保與服務束載體相關聯之粒子產生組件可經由服務束外殼排氣空間第一管道2422及服務束外殼排氣空間第二管道2424排氣且至循環及過濾系統內。在服務束外殼頂表面2402中形成之一組服務束外殼槽2412(如圖29A中所展示)可確保恆定排氣流之均勻分佈以有效地吹掃服務束外殼2410之容積。
For example, as depicted in FIG. 29A, various specific examples of a service bundle housing exhaust system may include a
雖然服務束外殼槽2412在圖29A中被展示為跨服務束外殼頂側2402形成，但可瞭解，一組槽可位於服務束外殼之各種表面上，如在圖29B中所描繪。如圖29B中所描繪，一組槽可位於服務束外殼底部側2404
(組I)、服務束外殼第一側2406(組II)以及服務束外殼第二側2408(組III)上。此外，如圖29C中所描繪，雖然槽可為用於促進恆定排氣流之均勻分佈以有效地吹掃服務束外殼容積的一類型之開口，但可使用具有各種形狀、縱橫比及位置之開口。如圖29C中所展示，可使用諸如描繪為形成於服務束外殼頂側2402中之第一服務束外殼開口2411及第二服務束外殼開口2413的實質上圓形開口來促進恆定排氣流之均勻分佈以有效地吹掃服務束外殼容積。如圖29C中所描繪，實質上圓形開口之一替代置放可為在服務束外殼之端部上。在圖29C中，描繪為分別形成於服務束外殼第一端2415及服務束外殼第二端2417中之第一服務束外殼開口2411及第二服務束外殼開口2413可用以促進恆定排氣流之均勻分佈以有效地吹掃服務束外殼容積。另外，服務束外殼之各種具體實例可具有第一服務束載體伸展部2401及第二服務束載體伸展部2407。服務束外殼頂表面2402可具有分別最接近第一服務束載體伸展部2401及第二服務束載體伸展部2407之第一組槽2412及第二組槽2414，可用以促進恆定排氣流之均勻分佈以有效地吹掃服務束外殼容積。最後，如圖27B中所展示，當服務束外殼排氣系統包括為單一件之外殼時，可藉由考慮有效排氣氣體流量來促進恆定排氣流之均勻分佈。
Although the service
如在圖30A/30B至圖32A/32B中所描繪的本教示之氣體封裝系統之各種具體實例可具有如本文中先前關於圖22、圖23及圖24所論述的關於可促進層流及封裝中的氣體氣氛之澈底更新藉此確保可維持用於空中顆粒物之實質上低粒環境的氣體循環及過濾系統之特徵。如本文中先前所論述，用於維持低空中顆粒規範之循環及過濾系統為用於本教示之氣體封裝系統之各種具體實例的顆粒控制系統之一部分。本教示之粒子控制系統亦可包括利用空氣軸承以及利用服務束外殼排氣系統之一低粒產生X軸運動系統。利用空氣軸承的低粒產生X軸運動系統之各種具體實例可實質上消除顆粒物之產生。另外，可利用服務束外殼排氣系統之各種具體實例 以確保可圍阻在印刷製程期間在十分接近基板處產生之顆粒物，且接著將顆粒物吹掃至循環及過濾系統內用於移除。另外，如在圖30A/30B至圖32A/32B中所描繪，為了控制在印刷製程期間由可最接近基板定位的各種器件、裝置、服務束及類似者形成之顆粒物，本教示之粒子控制系統之各種具體實例可具有印刷頭組裝件排氣系統。 Various specific examples of the gas packaging system of the present teachings as depicted in FIGS. 30A/30B to 32A/32B may have as discussed previously with respect to FIGS. 22, 23, and 24 in this document regarding the promotion of laminar flow and packaging The renewal of the gas atmosphere in the process thereby ensures that the characteristics of the gas circulation and filtration system for a substantially low-particle environment of airborne particulate matter can be maintained. As previously discussed herein, the circulation and filtration systems used to maintain low-altitude particulate specifications are part of the particulate control system used in various specific examples of gas encapsulation systems of the present teachings. The particle control system of this teaching can also include a low particle generation X-axis motion system that uses air bearings and a service beam housing exhaust system. Various specific examples of the X-axis motion system using low-particle generation of air bearings can substantially eliminate the generation of particles. In addition, various specific examples of service bundle housing exhaust systems are available To ensure that particles generated during the printing process are very close to the substrate can be contained, and then the particles are purged into the circulation and filtration system for removal. In addition, as depicted in FIGS. 30A/30B to 32A/32B, in order to control particles formed by various devices, devices, service beams, and the like that can be positioned closest to the substrate during the printing process, the particle control system of the present teaching Various specific examples may have a print head assembly exhaust system.
圖30A/30B描繪氣體封裝系統509，而圖31A/31B描繪氣體封裝系統510，且圖32A/32B描繪氣體封裝系統511，其皆可具有如先前針對如展示的圖22及圖23描述之特徵。氣體封裝系統509至511可具有循環及過濾系統1500、氣體淨化系統3130及熱調節系統3140。循環及過濾系統1500可包括管道系統組裝件1501及扇形過濾器單元組裝件1502。管道系統組裝件1501可藉由有效界定實際上為與氣體淨化系統3130流體連通之管路的空間1580而分開在內部經由扇形過濾器單元組裝件1502再循環之惰性氣體及在外部再循環至氣體淨化系統3130之惰性氣體。空間1580可經由氣體淨化出口線路3131及氣體淨化入口線路3133而與氣體淨化系統3130(圖12及圖13)流體連通。包括如針對圖16至圖18描述之管道系統之各種具體實例的此循環系統提供實質上層流，使亂流最小化，促進氣體封裝之內部中的氣體氣氛之顆粒物之循環、更新及過濾，且提供經由在氣體封裝組裝件外部之氣體淨化系統的循環。
FIGS. 30A/30B depict a
另外，如分別在圖30A/30B至圖32A/32B中描繪之氣體封裝系統509至511可具有印刷頭組裝件排氣系統2600，其可用以圍阻及排出由與印刷系統2003相關聯之各種組裝件形成的顆粒。對於氣體封裝系統509、510及511之各種具體實例，印刷頭組裝件排氣系統2600可收容(例如但不限於)托架組裝件2300，可將印刷頭組裝件2500貼附至該托架組裝件上，如分別在圖30A/30B、圖31A/31B及圖32A/32B中所描繪。此移動板可利用摩擦軸承，如本文中先前所論述，摩擦軸承可在OLED印刷系統之
操作期間產生粒子。另外，如本文中先前所論述，托架組裝件可用以安裝諸如UV燈組裝件或熱源組裝件之裝置，以用於固化囊封層。UV燈或熱源可需要使用風扇來冷卻。
In addition, the
因此，氣體封裝系統509、510及511之印刷頭組裝件排氣系統2600可為用於圍阻及排出在印刷製程期間由可最接近基板定位的各種器件、裝置、服務束及類似者形成之顆粒物的顆粒控制系統之部分。印刷頭組裝件排氣系統之各種具體實例(諸如，氣體封裝系統509、510及511之印刷頭組裝件排氣系統2600)可確保可維持在印刷頭組裝件排出外殼之入口部分與出口部分之間的正壓力差，以用於將由印刷頭組裝件之各種組件產生的粒子排出至氣體循環及過濾系統內。對於印刷頭組裝件排氣系統之各種具體實例，可維持在印刷頭組裝件排出外殼之入口部分與出口部分之間的正壓力差，以用於將由印刷頭組裝件之各種組件產生的粒子排出至死空間內。如本文中隨後將更詳細地論述，用於排出由印刷頭組裝件之各種組件產生的粒子之正壓力差可藉由使用風扇以及(諸如但不限於)提供印刷頭組裝件排氣外殼與循環及過濾系統之間的流體連通的其他系統組件創造。
Therefore, the print head
對於印刷頭組裝件排氣系統之各種具體實例，除了維持在印刷頭排氣組裝件之入口部分與出口部分之間的正壓力差之外，亦可進一步維持印刷頭排氣組裝件之內部與周圍環境之間的相對中性或負壓力差。可在印刷頭排氣組裝件之內部與周圍環境之間維持的此相對中性或負壓力差可防止粒子經由裂縫、縫隙及類似者自印刷頭排氣組裝件洩漏。在十分接近基板處經由裂縫、縫隙及類似者洩漏之粒子在被掃走至循環及過濾系統內之前具有污染基板表面之大機率。 For various specific examples of the exhaust system of the print head assembly, in addition to maintaining a positive pressure difference between the inlet and outlet portions of the print head exhaust assembly, the internal and The relative neutral or negative pressure difference between the surrounding environment. This relatively neutral or negative pressure difference that can be maintained between the interior of the print head exhaust assembly and the surrounding environment can prevent particles from leaking from the print head exhaust assembly through cracks, crevices, and the like. Particles that leak through cracks, crevices, and the like very close to the substrate have a high probability of contaminating the substrate surface before being swept away into the circulation and filtration system.
如圖30A及圖30B中所描繪，服務束外殼2410可支撐於印刷系統2003之橋接部2130上。如本文中先前關於圖10B之印刷系統2000
所論述，托架組裝件2300可具有用於控制X-Z軸移動之組件，包括印刷頭組裝件2500可貼附於其上之Z軸移動板。印刷頭組裝件排氣系統外殼2610可與服務束外殼2410(例如但不限於，印刷頭組裝件排氣系統第一管路2612)流體連通。服務束外殼2410可經由(例如但不限於)印刷頭組裝件排氣系統第二管路2614(其可與第二管道系統管路1574流體連通)而與管道系統組裝件1501流體連通。可含有具有產生粒子之危險的組件(諸如，移動板)的圖30A及圖30B之印刷頭組裝件排氣系統2600可具有至少一風扇(諸如，風扇2620)，用於促進氣體移動穿過印刷頭組裝件排氣系統2600且至服務束外殼2410內。在此點上，印刷頭組裝件排氣系統2600及服務束外殼2410中所圍阻之全部空氣可有效地由循環及過濾系統1500過濾，如圖30A中所描繪。
As depicted in FIGS. 30A and 30B, the
根據本教示，收集於遠離安裝於基板支撐裝置上之基板的死空間區域中之顆粒物不能在氣體封裝系統內再循環。在此點上，圖31A/31B及圖32A/32B中描繪的氣體封裝系統之各種具體實例可利用將顆粒物引導至管道系統內，以及至死空間內。在定期的氣體封裝系統維護期間，可自死空間移除此顆粒物。 According to the teachings, particulate matter collected in the dead space area away from the substrate mounted on the substrate support device cannot be recycled in the gas encapsulation system. In this regard, various specific examples of gas encapsulation systems depicted in FIGS. 31A/31B and 32A/32B can be utilized to guide particulate matter into the piping system and into dead spaces. During regular gas packaging system maintenance, this particulate matter can be removed from the dead space.
在此點上，對於氣體封裝系統之各種具體實例(諸如，圖31A及圖31B之氣體封裝系統510)，服務束外殼2410可與循環及過濾系統1500流體連通。如圖31B中所描繪，印刷頭組裝件排氣系統外殼2610可與服務束外殼2410(例如但不限於，印刷頭組裝件排氣系統第一管路2612)流體連通。服務束外殼2410可與可具有最接近管道系統組裝件1501之第二管道系統入口1572之出口端的印刷頭組裝件排氣系統第二管路2614流體連通。在此點上，印刷頭組裝件排氣系統第二管路2614可經由第二管道系統管路1574而與管道系統組裝件流體連通。印刷頭組裝件排氣系統第一管路2612可具有一風扇(諸如，風扇2620)，以用於促進經由印刷頭組裝件排氣
系統第一管路2612之氣體移動。另外，印刷頭組裝件排氣系統第二管路2614可具有用於促進經由印刷頭組裝件排氣系統2614之氣體移動的風扇2622，使得由印刷頭組裝件排氣系統2600及服務束外殼2410圍阻之粒子可有效地由循環及過濾系統1500過濾，如圖31A中所描繪。對於氣體封裝系統之各種具體實例(諸如，圖31A及圖31B之氣體封裝系統510)，未流入第二管道系統入口1572內之任何顆粒物將具有朝向死空間1590之軌跡。
In this regard, for various specific examples of gas encapsulation systems (such as the
如針對圖32A及圖32B之氣體封裝系統511所描繪，服務束外殼2410可與循環及過濾系統1500流體連通。如在圖32B中所描繪，印刷頭組裝件排氣系統外殼2610可與服務束外殼2410(例如但不限於，印刷頭組裝件排氣系統第一管路2612)流體連通，該印刷頭組裝件排氣系統第一管路可具有一風扇(諸如，風扇2620)，以用於促進經由印刷頭組裝件排氣系統第一管路2612之氣體移動。服務束外殼2410可與可具有過濾頭2616之印刷頭組裝件排氣系統第二管路2614流體連通。過濾頭2616可過濾自印刷頭組裝件排氣系統2600發出且至服務束外殼2410內之顆粒物，且將自過濾頭2616流動之低粒氣流直接引導至氣體封裝系統511內。在此點上，印刷頭組裝件排氣系統第二管路2614可將低粒氣體排出至氣體封裝系統511內，接著可使低粒氣體循環經過氣體封裝系統511之循環及過濾系統1500，如圖32A中所描繪。
As depicted for the
本教示之各種氣體封裝系統(諸如，圖12之氣體封裝系統501及圖13之氣體封裝系統502)可利用各種氣體封裝，例如(但不限於)，圖1A之氣體封裝100及圖9之氣體封裝1000。另外，各種氣體封裝(諸如，圖1A之氣體封裝100及圖9之氣體封裝1000)可收容各種印刷系統，諸如，圖10B之印刷系統2000、圖26之印刷系統2002及圖28A之印刷系統2003。對於本教示之氣體封裝系統及方法，監視氣體封裝之受控制環境為維持氣體封裝之受控制環境的重要態樣。
Various gas packaging systems of this teaching (such as the
可監視的受控制環境之一參數為顆粒物之控制之有效性。可針對空中及基板上粒子監視兩者執行系統驗證以及持續進行之原地系統監視。 One of the parameters of the controlled environment that can be monitored is the effectiveness of the control of particulate matter. System verification and continuous in-situ system monitoring can be performed for both airborne and on-substrate particle monitoring.
可使用(例如)攜帶型粒子計數器件在印刷製程前針對氣體封裝系統之各種具體實例執行空中顆粒物之判定，以用於系統驗證。在氣體封裝系統之各種具體實例中，可當印刷基板時在原地執行空中顆粒物之判定，作為持續進行之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行空中顆粒物之判定，以用於系統驗證。 For example, a portable particle counter device can be used to determine airborne particulate matter for various specific examples of the gas encapsulation system before the printing process for system verification. In various specific examples of gas encapsulation systems, the determination of airborne particles can be performed in situ when the substrate is printed, as a continuous quality inspection. For various specific examples of the gas encapsulation system, the determination of airborne particles can be performed in situ before printing the substrate and additionally when printing the substrate, for system verification.
圖33描繪用於量測空中顆粒物之器件。根據本教示，圖33之粒子計數器800之各種具體實例可為手持型或以其他方式為攜帶型的。如圖33中所描繪，粒子計數器800可具有電源按鈕810，以及顯示器812以用於對各種參數(諸如，正監視之粒徑，以及彼大小之顆粒物之當前計數)之即時視覺監視。本教示之攜帶型粒子計數器可具有用於在分析期間監視若干粒徑範圍之多個通道。藉由非限制性實例，描繪了監視三個截然不同粒徑範圍的粒子計數器800之顯示器812。對於本教示之系統及方法之各種具體實例，監視在約
雖然各種商業粒子計數器可基於可包括光阻擋、直接成像及光散射之各種量測原理，但基於自粒子之光散射之量測十分適合於產生包括粒徑的感興趣之資訊。原則上，可使用光散射判定低至約1nm之粒徑。 Although various commercial particle counters can be based on various measurement principles that can include light blocking, direct imaging, and light scattering, measurements based on light scattering from particles are well-suited for generating interesting information including particle size. In principle, light scattering can be used to determine particle sizes as low as about 1 nm.
圖34為基於光散射的粒子計數器偵測器830之示意性描繪。基於光散射的粒子計數器偵測器可具有已知波長之已知波長範圍之電磁輻射源，諸如，光源820。對於粒子計數器偵測器830之各種具體實例，光源820可為發射已知波長之光的雷射源。對於粒子計數器之各種具體實例，尤其(但不排他性地)對於手持型及攜帶型粒子計數器件，光源820可為發射在約600nm至約850nm之間的已知波長之光的發光二極體(LED)。發射之源光821可聚焦在流動路徑824之偵測區域822處(其在圖34中描繪為頂部剖視圖)。在偵測區域822中之任何粒子可散射光，從而創造向前散射之光823或在許多有角度之方向(包括與發射之源光821之方向正交)上散射之光，如針對光路徑825所描繪。由在偵測區域822中之粒子正交地散射之光可使用聚焦透鏡826來聚焦，且可在由偵測器828偵測前使用至少一光學濾光片(例如，空間或光學帶通濾光片或其組合)來濾光，偵測器可為各種類型之光度計偵測器，例如，基於光電二極體技術。可使用校準標準來校準粒子計數器之各種具體實例，該校準標準諸如在各種大小範圍中的粒子具有經定義之分佈的顆粒物氣溶膠，其中每一大小範圍具有定義之濃度。
FIG. 34 is a schematic depiction of a
舉例而言，基於光散射的各種商業粒子計數器可偵測在約
圖35為使用粒子計數器圖示800A至800D之示意性表示，且意在傳達粒子計數器件之各種具體實例可相對於最接近基板的印刷系統之低粒地帶位於何位置。圖35之氣體封裝系統512可具有如本文中先前針對氣體封裝系統500-511所描述之組件，包括(但不限於)氣體封裝組裝件1100、可與循環及過濾系統(如由最接近熱交換器1562之扇形過濾器單元1552指示)整合之熱調節系統3140。圖35之氣體封裝系統512可具有出口線路3131及至氣體淨化系統(圖中未示)之入口線路3133，以及外殼印刷系統2004。印刷系統2004可具有基底2101，可將基板支撐裝置2200安裝於該基底上。印刷系統2004可另外具有橋接部2130，其可具有安裝於其上之第一托架組裝件2300A及第二托架組裝件2300B。印刷系統2004亦可具有用於收容服務纜線(圖中未示)之服務纜線外殼2410。
FIG. 35 is a schematic representation of using particle counter diagrams 800A to 800D, and is intended to convey where various specific examples of particle counter devices can be located relative to the low-grain zone of the printing system closest to the substrate. The
關於圖35，至少一粒子計數器可定位或安裝於(例如)服務束外殼2410上，如由在扇形過濾器單元1552之層流氣流中描繪的粒子計
數器圖示800A指示。如此定位於來自扇形過濾器單元的層流氣流中之粒子計數器可允許監視氣體封裝系統之過濾系統的有效性。另外，印刷系統2004之橋接部2130可支撐印刷頭組裝件2500可安裝至之第一X,Z軸托架組裝件2300A。第二X,Z軸托架組裝件2300B可具有安裝於其上之至少一粒子計數器，如由粒子計數器圖示800B指示。在最接近諸如托架組裝件之各種印刷器件及裝置的位置處之監視可適用於監視粒子產生之各種來源，諸如，服務束。如由粒子計數器圖示800C所描繪的所安裝之粒子計數器可適用於程序開發及氣體封裝系統驗證運作。如由粒子計數器圖示800D描繪的所安裝之粒子計數器可適用於程序開發，及氣體封裝系統驗證運作以及在印刷製程期間對空中顆粒物之原地監視。
Regarding FIG. 35, at least one particle counter may be positioned or installed on, for example, the
根據本教示之各種系統及方法，可將粒子計數器件安裝或置放於基板支撐裝置上以量測在於印刷期間基板可位於之緊鄰區域中的在定義之條件下之粒子。舉例而言，如圖35中所描繪，可將粒子計數器置放或安裝於基板支撐裝置2200之上，如由粒子計數器圖示800C之位置指示。在本教示之系統及方法之各種具體實例中，可針對各種類型之程序開發或氣體封裝系統驗證運作研究進行使用置放或安裝於基板支撐裝置之上的粒子計數器的顆粒物監視。藉由另一非限制性實例，可將粒子計數器安裝於基板支撐裝置2200之一側上，如由粒子計數器圖示800D之位置指示。藉由使用具有取樣探針(具有可撓性連接器)之粒子計數器(諸如，具有取樣探針816的圖33之粒子計數器800)，安裝至基板支撐裝置之側的粒子計數器可具有剛好置放於基板之高度處的取樣探針。
According to various systems and methods of the present teachings, particle counter devices can be installed or placed on a substrate support device to measure particles under defined conditions in the immediate area where the substrate can be located during printing. For example, as depicted in FIG. 35, the particle counter may be placed or installed on the
安裝於基板支撐裝置之一側上的粒子計數器(如由粒子計數器圖示800D指示)可適用於程序開發，及氣體封裝系統驗證運作以及在印刷製程期間對空中顆粒物之原地監視。舉例而言，在圖36中，如先前針對圖26及圖28A描述之印刷系統2003可具有安裝於橋接部2130上之X軸托
架組裝件2300，其亦可包括用於印刷頭組裝件2500之Z軸定位的Z軸移動板2310。在此點上，托架組裝件2300之各種具體實例可提供印刷頭組裝件2500相對於基板2050之精確X,Z定位。對於印刷系統2003之各種具體實例，X軸托架組裝件2300可利用為固有地低粒產生之一線性空氣軸承運動系統。圖36之印刷系統2003可具有用於圍阻及排出自服務束產生之粒子的服務束外殼排氣系統2400，其可包括用於收容服務束之服務束外殼2410。根據本教示，服務束可操作性地連接至印刷系統以提供操作氣體封裝系統中之各種器件及裝置(例如但不限於，與印刷系統相關聯之各種器件及裝置)所需的各種光學、電、機械及流體連接。圖36之印刷系統2003可具有用於支撐基板2050之基板支撐裝置2250，可使用Y軸定位系統2355在Y軸方向上精確地定位該基板。基板支撐裝置2250及Y軸定位系統2355皆由印刷系統基底2101支撐。
A particle counter (as indicated by the
對於圖36之印刷系統2003，精確XYZ運動系統可具有用於將安裝於基板支撐裝置2250上之基板相對於印刷頭組裝件2500定位的各種組件，其可包括Y軸運動組裝件2355，以及X軸托架組裝件2300。基板支撐裝置2250可安裝於Y軸運動組裝件2355上，且可使用(例如但不限於)線性軸承系統(利用機械軸承或空氣軸承)在軌系統2360上移動。對於氣體封裝系統之各種具體實例，空氣軸承運動系統有助於置放於基板支撐裝置2250上之基板在Y軸方向上的無摩擦傳送。Y軸運動系統2355亦可視情況使用雙軌運動，其再次由線性空氣軸承運動系統或線性機械軸承運動系統提供。根據本教示，可使用其他精確XYZ運動系統，諸如(但不限於)，3軸線高架系統之各種具體實例。舉例而言，3軸線高架系統之各種具體實例可具有安裝於高架橋接部上用於精確X,Z軸移動之一X,Z托架組裝件，其中可精確地在Y軸方向移動高架。
For the
根據本教示之各種系統及方法，圖36之印刷系統2003可具
有安裝至基板支撐裝置2250之一側的一粒子計數器800，使得等動力取樣探針816在大約與基板2050相同的高度處。雖然圖36描繪在基板支撐裝置之前側上的粒子計數器800，但可將一或多個粒子計數器安裝於基板支撐裝置之各種位置處，以有效地監視最接近基板之空中顆粒物。另外，對於系統及方法之各種具體實例，可將額外粒子計數器安裝或置放於其他位置中，如針對圖35所描述。
According to the various systems and methods taught in this teaching, the
根據在本教示之氣體封裝系統之各種具體實例中含有的氣體循環及過濾系統之各種具體實例，可在氣體封裝系統中進行空中粒子之連續量測。在本教示之氣體封裝系統之各種具體實例中，此等量測可在完全自動化之模式中執行且連續地對終端使用者報告，例如，經由圖形使用者介面(GUI)。在本教示之氣體封裝系統之各種具體實例中，可在感興趣之目標位置中進行空中顆粒物之量測，如在圖35中所描繪。可將自位於氣體封裝中的粒子計數器中之每一者之輸出對終端使用者報告，例如，經由GUI。舉例而言，感興趣之目標區域可為十分接近在基板支撐裝置(諸如，夾盤或浮動台，如圖36中所描繪)上之基板的空中顆粒物。 According to various specific examples of gas circulation and filtration systems contained in various specific examples of the gas packaging system of this teaching, continuous measurement of airborne particles can be performed in the gas packaging system. In various specific examples of the gas packaging system of this teaching, these measurements can be performed in a fully automated mode and continuously reported to the end user, for example, via a graphical user interface (GUI). In various specific examples of the gas encapsulation system of this teaching, the measurement of airborne particulates can be performed in the target location of interest, as depicted in FIG. 35. The output from each of the particle counters located in the gas package can be reported to the end user, for example, via the GUI. For example, the target area of interest may be airborne particles very close to the substrate on the substrate support device (such as a chuck or floating table, as depicted in FIG. 36).
在此點上，本教示之氣體封裝系統之各種具體實例之不斷監視已確認可在印刷循環上將約
舉例而言，圖37A及圖37B描繪在本教示之氣體封裝系統之各種具體實例中進行的長期量測之結果。在圖37A中，描繪在不同天進行之兩個測試。在維持於惰性氮環境中之氣體封裝系統(諸如，圖12及圖13中展示之氣體封裝系統)中執行此等測試。最接近基板支撐裝置(諸如，夾盤或浮動台，如圖36中所描繪)地執行量測。在測試週期期間，氣體封裝系統連續用於包括印刷、維護及閒置之序列。在測試1中，即時量測之持續時間為約16個小時。在彼週期期間，量測到一共2個約
對於本教示之系統及方法之各種具體實例，在氣體封裝系統中量測的空中顆粒物對於約
如在針對圖37B呈現之資料中所論證，本教示之循環及過濾系統之各種具體實例的此迅速系統恢復另外描繪於圖38之曲線圖中。在圖38中，監視最接近基板支撐裝置(諸如，夾盤或浮動台)的約
可使用(例如)測試基板在印刷基板前針對氣體封裝系統之各種具體實例執行基板上的顆粒物的基板上分佈之判定，用於系統驗證。在氣體封裝系統之各種具體實例中，可當印刷基板時在原地執行顆粒物之基板上分佈之判定，作為持續進行之品質檢查。對於氣體封裝系統之各種具體實例，可在印刷基板前及另外當印刷基板時在原地執行顆粒物之基板上分佈之判定，用於系統驗證。 For example, the test substrate can be used to perform the determination of the distribution of particulates on the substrate on the substrate for various specific examples of the gas encapsulation system before printing the substrate for system verification. In various specific examples of the gas encapsulation system, the determination of the distribution of particles on the substrate can be performed in situ when the substrate is printed, as a continuous quality inspection. For various specific examples of the gas encapsulation system, the determination of the distribution of the particulate matter on the substrate can be performed in situ before printing the substrate and additionally when printing the substrate, for system verification.
圖39描繪基於光散射之基板上偵測方案，其可具有與先前關於用於空中顆粒物之偵測系統針對圖34之粒子計數器偵測器830所描述的組件基本上相同的組件。
FIG. 39 depicts a light scattering based on-substrate detection scheme, which may have substantially the same components as previously described with respect to the
在圖39中，基於光散射的基板上粒子計數器偵測系統860可具有已知波長之已知波長範圍之電磁輻射源，諸如，光源850。對於基板上粒子計數器偵測系統860之各種具體實例，光源850可為發射具有在約600nm至約850nm之間的已知波長之光的雷射源。藉由射線追蹤來描繪發射之源光851以與基板854上之粒子852相互作用。對於本教示之系統及方法之各種具體實例，基板可為測試基板，諸如，矽晶圓。考慮到半導體行業內已演進的基板上粒子判定之歷史，矽晶圓上之粒子判定為廣為接受之測試方法。另外，矽晶圓可具有諸如具有反射性表面(其對於基於光散射之基板上偵測系統為較佳的)之屬性。另外，矽晶圓為實質上傳導性材料，使得其可接地。具有電中性之基板表面對於進行基板上粒子沈積之無偏差取樣係重要的。因為顆粒物攜載電荷並非不同尋常，所以帶電表面可藉此
取決於帶電粒子與帶電表面之間的相互作用為吸引或是排斥而導致虛假的肯定結果或虛假的否定結果。
In FIG. 39, the on-substrate particle
關於具有反射性表面之基板(諸如，矽晶圓測試基板)，可反射發射之源光851(如由反射之光線853展示)，且其亦可與基板表面854上之粒子852相互作用以產生散射光，如由散射光855所描繪。如本文中先前針對基於光散射的空中粒子偵測(諸如，圖34之粒子計數器偵測器830)之情況所論述，可在許多有角度之方向上散射光，包括與發射之源光851之方向正交，如針對落在光路徑I內的散射光855所描繪。聚焦透鏡856可聚焦由粒子852與發射之源光851之方向正交地散射的光，如朝向諸如濾光片857之至少一光學濾光片的光路徑II所描繪。光學濾光片857可為(例如)空間或光學帶通濾光片，或可添加額外濾光片以提供其組合。最後，與發射之源光851之方向正交地散射的光可由偵測器858偵測，該偵測器可為各種類型之光度計偵測器，例如，基於光電二極體技術。根據本教示之系統及方法之各種具體實例，使用基板上粒子計數器偵測系統(諸如，圖39之基板上粒子計數器偵測系統860)，可將包括具有一粒徑之粒子之數目以及在表面上偵測到的每一粒子之位置之報告提供給終端使用者。
Regarding a substrate with a reflective surface (such as a silicon wafer test substrate), it can reflect the emitted source light 851 (as shown by the reflected light 853), and it can also interact with
關於用於基板上粒子判定(例如但不限於，用於系統驗證)之測試協定，可獲得已經分析且接著密封之矽測試晶圓以及針對每一測試晶圓判定的粒子之大小及位置之報告。可按個別密封地或在盒子中的方式獲得測試晶圓。根據本教示之各種系統及方法，可將一盒佐證晶圓密封於盒外殼內，且接著可藉由可移除之密封材料(諸如，密封之聚合小袋)密封盒外殼。對於用於為了氣體封裝系統驗證之基板上粒子判定的各種測試協定，一盒佐證晶圓可由終端使用者或由機器人置放至氣體封裝系統內。舉例而言，盒可由終端使用者或機器人置放於輔助封裝中，如本文中先前所描述，且可使輔助封裝經過恢復過程，直至使氣體環境達到關於反應性 氣體之規範。盒可由終端使用者或機器人轉移至印刷系統封裝內。一旦密封之盒在氣體封裝系統內，就可將佐證晶圓之盒拆封，且可打開盒外殼以易於接取晶圓。 Regarding the test protocol used for particle determination on the substrate (for example, but not limited to, for system verification), a report of the size and position of the silicon test wafer that has been analyzed and then sealed and the particle determined for each test wafer can be obtained . Test wafers can be obtained individually sealed or in a box. According to various systems and methods of the present teachings, a box supporting wafer can be sealed within the box housing, and then the box housing can be sealed by a removable sealing material, such as a sealed polymeric pouch. For various test protocols used for particle determination on substrates for gas packaging system verification, a box of supporting wafers can be placed into the gas packaging system by the end user or by a robot. For example, the box can be placed in an auxiliary package by an end user or a robot, as previously described herein, and the auxiliary package can be subjected to a recovery process until the gas environment is about reactive Gas specifications. The cartridge can be transferred into the printing system package by the end user or robot. Once the sealed box is in the gas packaging system, the box supporting the wafer can be unsealed, and the box shell can be opened to easily access the wafer.
參看圖40，具有測試晶圓854之所描繪印刷系統2003可具有先前針對圖26之印刷系統2002以及圖28A及圖36之印刷系統2003所描述的所有元件。舉例而言(但不限於)，在圖40中，如先前針對圖26、圖28A及圖36描述之印刷系統2003可具有安裝於橋接部2130上之X軸托架組裝件2300，其亦可包括用於印刷頭組裝件2500之Z軸定位的Z軸移動板2310。在此點上，托架組裝件2300之各種具體實例可提供印刷頭組裝件2500相對於定位於基板支撐件2250上之基板的精確X,Z定位。對於印刷系統2003之各種具體實例，X軸托架組裝件2300可利用為固有地低粒產生之一線性空氣軸承運動系統。圖40之印刷系統2003可具有用於圍阻及排出自服務束產生之粒子的服務束外殼排氣系統2400，其可包括用於收容服務束之服務束外殼2410。圖40之印刷系統2003可具有用於支撐基板之基板支撐裝置2250，可使用Y軸定位系統2355在Y軸方向上精確地定位該基板。基板支撐裝置2250及Y軸定位系統2355由印刷系統基底2101支撐。基板支撐裝置2250可安裝於Y軸運動組裝件2355上，且可使用(例如但不限於)線性軸承系統(利用機械軸承或空氣軸承)在軌系統2360上移動。對於氣體封裝系統之各種具體實例，空氣軸承運動系統有助於置放於基板支撐裝置2250上之基板在Y軸方向上的無摩擦傳送。Y軸運動系統2355亦可視情況使用再次由線性空氣軸承運動系統或線性機械軸承運動系統提供的雙軌運動。
Referring to FIG. 40, the depicted
圖40之測試晶圓854可置放於印刷系統2003之基板支撐裝置2250上。基板支撐裝置2250可最接近橋接部2130定位，處於可模擬在印刷製程期間基板可定位於的位置的多種位置中。測試晶圓可具有邊緣排
除地帶，在該地帶中在測試後不執行粒子判定，因為邊緣排除地帶為執行處置(其可在晶圓邊緣處引入污染)之地帶。根據用於為了氣體封裝系統驗證之基板上粒子判定之各種測試協定，邊緣排除地帶在晶圓之周邊周圍且自晶圓邊緣量測的寬度可在約1cm至約2cm之間。對於用於為了氣體封裝系統驗證之基板上粒子判定的各種測試協定，可進行一系列基板上粒子判定以評價收容印刷系統的氣體封裝系統之狀態。首先，可執行背景測試，其中可藉由恰好在邊緣排除地帶處處置測試基板來取出統計數目個測試晶圓，且接著將測試晶圓置放回至盒內。在下一個靜態測試中，可藉由恰好在邊緣排除地帶處處置測試基板來取出統計數目個測試晶圓，且接著在設定之持續時間內(諸如，在印刷製程之持續時間內)使測試晶圓暴露至工具環境，而無氣體封裝系統內的任何裝置或器件之任何致動。在此點上，處於測試晶圓之靜態集合中之測試晶圓處於靜態印刷環境中。接著可將用於靜態測試之一組測試晶圓移動回至盒外殼內。在印刷測試中，可藉由恰好在邊緣排除地帶處處置測試基板來取出統計數目個測試晶圓，且接著在印刷製程之持續時間內使測試晶圓暴露至工具環境，而無墨水噴出之任何致動，但伴有氣體封裝系統內的裝置或器件之完全致動。舉例而言，安裝於托架組裝件2300上之印刷頭組裝件2500可相對於安裝於在圖40中描繪之印刷系統2003之基板支撐裝置上的測試晶圓854移動，從而模擬真實印刷循環。在此點上，處於測試晶圓之印刷集合中之測試晶圓處於靜態印刷環境中。接著可將用於印刷測試之該組測試晶圓移動回至盒外殼內。
The
一旦已完成包括背景測試、靜態測試及印刷測試之測試協定，則可重新密封盒外殼，且可自印刷系統封裝移除盒以用於測試。舉例而言，可將具有該一系列測試晶圓的密封之盒置放於輔助封裝中。當印刷系統封裝可密封地與輔助封裝隔離(如本文中先前所描述)時，可將輔助封裝對周圍環境開放，且具有測試晶圓的經密封之盒可被擷取且發送以供 分析。用於本教示之基板上粒子判定測試協定之各種具體實例的所有過程步驟可由終端使用者或機器人或其組合執行。最後，可閉合輔助封裝且使其經過恢復過程，直至使氣體環境達到關於反應性氣體之規範。 Once the test protocol including background test, static test, and printing test has been completed, the box housing can be resealed, and the box can be removed from the printing system package for testing. For example, a sealed box with the series of test wafers can be placed in an auxiliary package. When the printing system package is sealably isolated from the auxiliary package (as previously described herein), the auxiliary package can be opened to the surrounding environment, and the sealed box with the test wafer can be retrieved and sent for analysis. All process steps of various specific examples of the particle determination test protocol on the substrate used in this teaching can be performed by an end user or a robot or a combination thereof. Finally, the auxiliary package can be closed and subjected to a recovery process until the gas environment reaches the specifications for reactive gases.
可將本教示之各種成像系統及方法用於原地基板上顆粒物判定，以及用於執行系統驗證程序。參看圖41，印刷系統2004可具有先前針對圖26之印刷系統2002以及圖28A、圖36及圖40之印刷系統2003所描述的所有元件。舉例而言(但不限於)，圖41之印刷系統2004可具有用於圍阻及排出自服務束產生之粒子的服務束外殼排氣系統2400。印刷系統2004之服務束外殼排氣系統2400可包括服務束外殼2410，其可收容一服務束。根據本教示，服務束可操作性地連接至印刷系統以提供操作氣體封裝系統中之各種器件及裝置(例如但不限於，與印刷系統相關聯之各種器件及裝置)所需的各種光學、電、機械及流體連接。圖41之印刷系統2004可具有用於支撐基板2050之基板支撐裝置2250，可使用Y軸定位系統2355在Y軸方向上精確地定位該基板。基板支撐裝置2250及Y軸定位系統2355由印刷系統基底2101支撐。基板支撐裝置2250可安裝於Y軸運動組裝件2355上，且可使用(例如但不限於)線性軸承系統(利用機械軸承或空氣軸承)在軌系統2360上移動。對於氣體封裝系統之各種具體實例，空氣軸承運動系統有助於置放於基板支撐裝置2250上之基板在Y軸方向上的無摩擦傳送。Y軸運動系統2355亦可視情況使用再次由線性空氣軸承運動系統或線性機械軸承運動系統提供的雙軌運動。
The various imaging systems and methods of this teaching can be used for in-situ substrate particle determination and for performing system verification procedures. Referring to FIG. 41, the
關於支撐各種托架組裝件之運動系統，圖41之印刷系統2004可具有第一X軸托架組裝件2300A(其被描繪為具有安裝於其上之印刷頭組裝件2500)及第二X軸托架組裝件2300B(其被描繪為具有安裝於其上之相機組裝件2550)。處於基板支撐裝置2250上之基板2050(例如，在印刷製程期間)可位於最接近橋接部2130之各種位置中。可將基板支撐
裝置2250安裝於印刷系統基底2101上。在圖41中，印刷系統2004可具有安裝於橋接部2130上之第一X軸托架組裝件2300A及第二X軸托架組裝件2300B。第一X軸托架組裝件2300A亦可包括用於印刷頭組裝件2500之Z軸定位的第一Z軸移動板2310A，而第二X軸托架組裝件2300B可具有用於相機組裝件2550之Z軸定位的第二Z軸移動板2310B。在此點上，托架組裝件2300A及2300B之各種具體實例可分別為印刷頭組裝件2500及相機組裝件2550提供相對於定位於基板支撐件2250上之基板的精確X,Z定位。對於印刷系統2004之各種具體實例，第一X軸托架組裝件2300A及第二X軸托架組裝件2300B可利用為固有地低粒產生之線性空氣軸承運動系統。
Regarding the motion system supporting various carriage assemblies, the
圖41之相機組裝件2550可為高速、高解析度相機。相機組裝件2550可包括相機2552、相機支架組裝件2554及透鏡組裝件2556。相機組裝件2550可經由相機支架組裝件2556安裝至運動系統2300B的Z軸移動板2310B上。相機2552可為將光學影像轉換成電子信號之任何影像感測器器件，諸如(藉由非限制性實例)，電荷耦合器件(CCD)、互補金屬氧化物半導體(CMOS)器件或N型金屬氧化物半導體(NMOS)器件。可將各種影像感測器器件組態為用於區域掃描相機之感測器陣列或用於線掃描相機之單一感測器列。相機組裝件2550可連接至影像處理系統，影像處理系統可包括(例如)用於儲存、處理及提供結果之電腦。如本文中先前針對圖41之印刷系統2004所論述，Z軸移動板2310B可可控制地調整相機組裝件2550相對於基板2050之Z軸位置。在各種製程(諸如，印刷及資料收集)期間，可使用X軸運動系統2300B及Y軸運動系統2355相對於相機組裝件2550可控制地定位基板2050。
The
因此，圖41之***軸線運動系統可提供相機組裝件2550及基板2050在三維中相對於彼此之精確定位，以便在任何所要的焦點及/或高度處捕獲關於基板2050之任何部分的影像資料。此外，可針對區域掃描或
線掃描過程進行相機相對於基板之精確XYZ運動。如本文中先前所論述，諸如高架運動系統之其他運動系統亦可用以提供(例如)印刷頭組裝件及/或相機組裝件相對於基板的在三維中之精確移動。另外，可將照明裝置安裝於各種位置中，在X軸運動系統上或在最接近基板之基板支撐裝置上，及其組合。在彼點上，可根據執行各種明視野及暗視野分析及其組合來定位照明裝置。運動系統之各種具體實例可使用連續或步進式運動或其組合相對於基板2050定位相機組裝件2550以捕獲基板2050之表面的一系列一或多個影像。每一影像可涵蓋OLED基板之與一或多個像素井相關聯之區域、相關聯之電子電路組件、路徑及連接器。藉由使用影像處理，可獲得粒子之影像，且可判定大小及特定大小之粒子的數目。在本教示之系統及方法之各種具體實例中，可使用具有約8192個像素之線掃描相機，其具有約190mm之工作高度，且能夠按約34kHz掃描。另外，對於印刷系統基板相機組裝件之各種具體實例，可將一個以上相機安裝於X軸托架組裝件上，其中每一相機可具有關於視野及解析度之不同規格。舉例而言，一相機可為線掃描相機以用於原地粒子檢驗，而第二相機可用於氣體封裝系統中的基板之常規操縱。適用於常規操縱之此相機可為具有在當放大率為約0.9X時之約5.4mm×4mm至當放大率為約0.45X時之約10.6mm×8mm之範圍中的視野之區域掃描相機。在再其他具體實例中，一相機可為線掃描相機以用於原地粒子檢驗，而第二相機可用於氣體封裝系統中的基板之精確操縱，例如，用於基板對準。適用於精確操縱之此相機可為當放大率為約7.2X時具有約0.7mm×0.5mm的視野之區域掃描相機。
Therefore, the split axis motion system of FIG. 41 can provide precise positioning of the
關於OLED基板之原地檢驗，可使用印刷系統基板相機組裝件之各種具體實例(諸如，圖41中描繪的印刷系統2004之相機組裝件2550)來檢驗面板，而無對總平均循環時間(TACT)之顯著影響。舉例而言，可在少於70秒中掃描Gen 8.5基板以找到基板上顆粒物。除了OLED基板之
原地檢驗之外，藉由使用測試基板來判定是否可在將氣體封裝系統用於印刷製程前驗證氣體封裝系統之充分低粒環境，印刷系統基板相機組裝件亦可用於系統驗證研究。
Regarding in-situ inspection of OLED substrates, various specific examples of printing system substrate camera assemblies (such as the
關於空中顆粒物及在系統內之粒子沈積，大量變數可影響開發可充分計算(例如)任一特定製造系統的在表面(諸如，基板)上之粒子散落速率的值之近似值之一般模型。諸如粒子之大小、特定大小之粒子的分佈、基板之表面積及系統內的基板之暴露時間的變數可取決於各種製造系統而變化。舉例而言，粒子之大小及特定大小之粒子的分佈可實質上受到各種製造系統中的粒子產生組件之源及位置影響。基於本教示之氣體封裝系統之各種具體實例的計算表明，在無本教示之各種粒子控制系統之情況下，對於在0.1μm及更大之大小範圍中的粒子，每平方公尺基板每印刷循環的基板上沈積可在大於約1百萬至大於約1千萬個粒子之間。此等計算表明，在無本教示之各種粒子控制系統之情況下，對於在約2μm及更大之大小範圍中的粒子，每平方公尺基板每印刷循環的基板上沈積可在大於約1000至大於約10,000個粒子之間。 With regard to airborne particulate matter and particle deposition within the system, a large number of variables can affect the development of a general model that can adequately calculate, for example, the approximate value of the particle scattering rate on the surface (such as the substrate) of any particular manufacturing system. Variables such as the size of the particles, the distribution of particles of a specific size, the surface area of the substrate, and the exposure time of the substrate within the system can vary depending on various manufacturing systems. For example, the size of a particle and the distribution of particles of a particular size can be substantially affected by the source and location of particle generating components in various manufacturing systems. Calculations based on various specific examples of the gas encapsulation system of this teaching show that, without the particle control systems of this teaching, for particles in the size range of 0.1 μm and larger, each square meter of substrate per printing cycle The substrate can be deposited between more than about 1 million and more than about 10 million particles. These calculations show that, without the various particle control systems of this teaching, for particles in the size range of about 2 μm and larger, the deposition per square meter of substrate per printing cycle can be greater than about 1000 to Between about 10,000 particles.
藉由使用如針對本教示之基板上粒子判定測試協定之各種具體實例所描述的測試協定，本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於10μm之粒子，提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於2μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。在本教 示之氣體封裝系統之各種具體實例中，可維持低粒環境，從而對於大小大於或等於1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約100個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.5μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。對於本教示之氣體封裝系統之各種具體實例，可維持低粒環境，從而對於大小大於或等於0.3μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。本教示之低粒氣體封裝系統之各種具體實例可維持低粒環境，從而對於大小大於或等於0.1μm之粒子提供符合小於或等於每分鐘每平方公尺基板約1000個粒子之基板上沈積速率規範的平均基板上粒子分佈。 By using the test protocol as described for various specific examples of the particle determination test protocol on the substrate of this teaching, the various specific examples of the low particle gas encapsulation system of this teaching can maintain a low particle environment, thus for the size greater than or equal to 10 μm The particles provide an average on-substrate particle distribution that meets the specification of a deposition rate on the substrate of less than or equal to about 100 particles per square meter of substrate per minute. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing particles with a size greater than or equal to 5 μm that meet the deposition rate specification on the substrate of less than or equal to about 100 particles per square meter of substrate per minute Average particle distribution on the substrate. In various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that meets a particle size of less than or equal to about 100 particles per square meter of substrate per minute for particles larger than or equal to 2 μm The average particle distribution on the substrate. In this teaching In various specific examples of the gas encapsulation system shown, a low-particle environment can be maintained, thereby providing an average of the deposition rate specification on the substrate that meets the requirement of less than or equal to about 100 particles per square meter substrate per minute for particles larger than or equal to 1 μm Particle distribution on the substrate. Various specific examples of the low particle gas encapsulation system taught by this teaching can maintain a low particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.5 μm The average particle distribution on the substrate. For various specific examples of the gas encapsulation system taught in this teaching, a low particle environment can be maintained, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per square meter substrate per minute for particles larger than or equal to 0.3 μm The average particle distribution on the substrate. Various specific examples of the low-particle gas encapsulation system taught by this teaching can maintain a low-particle environment, thereby providing a deposition rate specification on a substrate that is less than or equal to about 1000 particles per minute per square meter of substrate for particles larger than or equal to 0.1 μm The average particle distribution on the substrate.
在本說明書中提到之所有公開案、專利及專利申請案被以引用的方式併入本文，就如同每一個別公開案、專利或專利申請案被具體且個別地指示為以引用的方式併入一樣。 All publications, patents, and patent applications mentioned in this specification are incorporated herein by reference, as if each individual publication, patent, or patent application was specifically and individually indicated to be incorporated by reference. Into the same.
雖然本文中已展示及描繪本發明之具體實例，但對熟習此項技術者而言顯然，此等具體實例係僅藉由實例提供。在不脫離本發明之情況下，熟習此項技術者現在將想到眾多變化、改變及取代。 Although specific examples of the present invention have been shown and described herein, it will be apparent to those skilled in the art that these specific examples are provided by way of example only. Without departing from the invention, those skilled in the art will now think of numerous changes, changes, and substitutions.
應理解，在實踐本發明過程中可使用對本文中描述之本發明之具體實例的各種替代方案。舉例而言，諸如化學、生物技術、高技術及藥物技術領域之大量不同技術領域可受益於本教示。將OLED印刷用以舉例說明根據本教示的氣體封裝系統之各種具體實例之效用。可收容一OLED印刷系統的氣體封裝系統之各種具體實例可提供諸如(但不限於)以下特徵：密封(從而提供建構及解構循環中之氣密性封裝)、封裝容積之最小化，及在處理期間以及在維護期間易於自外部接取內部。氣體封裝系統之各種 具體實例之此等特徵可具有對功能性之影響，諸如(但不限於)，結構完整性(從而易於在處理期間維持低含量之反應性物質)，以及使維護循環期間的停機時間最小化之迅速封裝容積更新。因而，提供用於OLED面板印刷之效用的各種特徵及規範亦可對多種技術領域提供益處。希望以下申請專利範圍定義本發明之範疇，且由其涵蓋在此等申請專利範圍及其等效物之範疇內的方法及結構。 It should be understood that various alternatives to the specific examples of the invention described herein may be used in practicing the invention. For example, a large number of different technical fields such as chemistry, biotechnology, high technology, and pharmaceutical technology fields can benefit from this teaching. OLED printing is used to illustrate the effectiveness of various specific examples of gas packaging systems according to the teachings. Various specific examples of gas packaging systems that can accommodate an OLED printing system can provide features such as (but not limited to) the following: sealing (thus providing hermetic packaging during construction and deconstruction cycles), minimizing packaging volume, and processing During and during maintenance, it is easy to access the inside from the outside. Various types of gas packaging systems These characteristics of specific examples may have an impact on functionality, such as (but not limited to), structural integrity (thus easily maintaining low levels of reactive substances during processing), and minimizing downtime during maintenance cycles Package volume update quickly. Thus, providing various features and specifications for the effectiveness of OLED panel printing can also provide benefits in a variety of technical fields. It is hoped that the following patent application scope defines the scope of the present invention and that it covers methods and structures within the scope of these patent application scopes and their equivalents.
100:氣體封裝組裝件 100: Gas package assembly
103:扇形過濾器單元蓋 103: Fan filter unit cover
105:第一頂板框管道 105: the first top frame pipe
107:第二頂板框管道 107: second top frame pipe
109:金屬薄片面板區段 109: Sheet metal panel section
110:***面板 110: Insert panel
120:窗面板 120: window panel
130:可易於移除之保養窗 130: Maintenance window that can be easily removed
140:手套端口 140: glove port
142:手套 142: Gloves
204:底盤 204: chassis
210:第一壁框 210: first wall frame
210':第一壁面板 210': first wall panel
230:第三壁框 230: third wall frame
230':第三壁面板 230': third wall panel
250:頂板框 250: top plate frame
250':頂板面板 250': top panel
Claims (22)
Applications Claiming Priority (16)
| Application Number | Priority Date | Filing Date | Title |
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| US201361833398P | 2013-06-10 | 2013-06-10 | |
| US61/833,398 | 2013-06-10 | ||
| US201361911934P | 2013-12-04 | 2013-12-04 | |
| US61/911,934 | 2013-12-04 | ||
| US201461925578P | 2014-01-09 | 2014-01-09 | |
| US61/925,578 | 2014-01-09 | ||
| US14/205,340 US9604245B2 (en) | 2008-06-13 | 2014-03-11 | Gas enclosure systems and methods utilizing an auxiliary enclosure |
| WOPCT/US14/23820 | 2014-03-11 | ||
| PCT/US2014/023820 WO2014164932A2 (en) | 2013-03-13 | 2014-03-11 | Gas enclosure systems and methods utilizing an auxiliary enclosure |
| US14/205,340 | 2014-03-11 | ||
| US201461983417P | 2014-04-23 | 2014-04-23 | |
| US61/983,417 | 2014-04-23 | ||
| US14/275,637 US10434804B2 (en) | 2008-06-13 | 2014-05-12 | Low particle gas enclosure systems and methods |
| US14/275,637 | 2014-05-12 | ||
| PCT/US2014/037722 WO2014200642A1 (en) | 2013-06-10 | 2014-05-12 | Low-particle gas enclosure systems and methods |
| WOPCT/US14/37722 | 2014-05-12 |
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| US8030212B2 (en) * | 2007-09-26 | 2011-10-04 | Eastman Kodak Company | Process for selective area deposition of inorganic materials |
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| TW200302678A (en) * | 2002-01-23 | 2003-08-01 | Seiko Epson Corporatoin | Manufacturing method of organic EL device, organic EL device, electronic machine and liquid drop spraying device |
| JP2010134315A (en) * | 2008-12-08 | 2010-06-17 | Seiko Epson Corp | Liquid discharge apparatus |
| US20130040061A1 (en) * | 2011-08-09 | 2013-02-14 | Kateeva, Inc. | Face-down printing apparatus and method |
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