TWI691164B - Manufacturing method of filter with seal structure - Google Patents
Manufacturing method of filter with seal structure Download PDFInfo
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Abstract
Description
本發明是關於一種包含密封結構之濾波器製造方法，特別是關於一種能藉由自動焊接形成濾波器結構之製造方法。The invention relates to a method for manufacturing a filter including a sealed structure, in particular to a method for manufacturing a filter structure by automatic welding.
濾波器是電子通訊裝置或網路傳輸裝置當中常見的元件，一般在製作濾波器元件時，製造過程需要大量的人力，不論是針對於線圈上的繞線，線圈與基板之焊接等製程，都是以人工方式來進行。在現今電子裝置之零件微型化的趨勢下，以人工方式製作的電子元件，不但產出效率低，製程的品質也難以保障。舉例來說，以人工方式進行焊接，需要以放大鏡檢視導線顏色，並焊至對應的接點，由於操作區域相當有限，些微的偏差都可能造成焊接不良或是焊接位置錯誤。Filters are common components in electronic communication devices or network transmission devices. Generally, when manufacturing filter components, the manufacturing process requires a lot of manpower, whether it is for the winding on the coil, the welding of the coil and the substrate, and other processes. It is done manually. Under the current trend of miniaturization of electronic device parts, the electronic components manufactured manually are not only low in output efficiency, but also difficult to guarantee the quality of the manufacturing process. For example, when soldering manually, it is necessary to use a magnifying glass to check the color of the wire and solder to the corresponding contact. Since the operation area is quite limited, slight deviations may cause poor welding or wrong welding position.
另一方面，濾波器依據線圈大小、繞線等設計而具有各種不同規格，依上述人工方式製作的濾波器，難以調整各種不同線圈組合，反而在製程上不容易區分各自的規格。再者，目前的濾波器元件並無法整合於自動化生產的產線，當濾波器欲安裝於其他電子裝置時，仍需以人工焊接方式進行，難以提升整體製程效率。On the other hand, the filter has various specifications according to the design of the coil size, winding, etc. The filter manufactured according to the above manual method is difficult to adjust various coil combinations, but it is not easy to distinguish the respective specifications in the manufacturing process. Furthermore, the current filter components cannot be integrated into the automated production line. When the filter is to be installed in other electronic devices, it still needs to be soldered manually, which is difficult to improve the overall process efficiency.
綜觀前所述，在習知的濾波器製造方法當中，仍然具有部分整合及製造上之困難，因此，本發明之發明人思索並設計一種包含密封結構之濾波器製造方法，以針對現有技術之缺失加以改善，進而增進產業上之實施利用。In view of the foregoing, among the conventional filter manufacturing methods, there are still some difficulties in integration and manufacturing. Therefore, the inventor of the present invention contemplates and designs a filter manufacturing method including a sealed structure to address the prior art The lack of improvement, and then promote the implementation and utilization of industry.
有鑑於上述習知技藝之問題，本發明之目的就是在提供一種包含密封結構之濾波器製造方法，以解決現有製程需要大量人力且難以提升製程效率與品質的問題。In view of the above-mentioned problems of the prior art, the object of the present invention is to provide a filter manufacturing method including a sealed structure to solve the problem that the existing manufacturing process requires a lot of manpower and it is difficult to improve the efficiency and quality of the manufacturing process.
根據本發明之一目的，提出一種包含密封結構之濾波器製造方法，其包含以下步驟：設置基板，於基板之兩端形成複數個電氣接點，複數個電氣接點間隔設置且貫穿基板；將線圈放置於基板上，並將線圈之複數個導線拉至複數個電氣接點；藉由雷射焊接方式將複數個導線焊接於複數個電氣接點；設置模具以包覆線圈，於模具中形成膠體，膠體覆蓋線圈而露出複數個電氣接點；以及移除模具而形成包含膠體之濾波器模組。According to an object of the present invention, a method for manufacturing a filter including a sealed structure is provided, which includes the following steps: providing a substrate, forming a plurality of electrical contacts on both ends of the substrate, and the plurality of electrical contacts are spaced apart and penetrate the substrate; The coil is placed on the substrate, and the plurality of wires of the coil are drawn to the plurality of electrical contacts; the plurality of wires are welded to the plurality of electrical contacts by laser welding; a mold is provided to cover the coil and formed in the mold Colloid, the colloid covers the coil to expose a plurality of electrical contacts; and the mold is removed to form a filter module containing the colloid.
較佳地，基板可包含印刷電路板，印刷電路板於兩端形成複數個凹槽，且於複數個凹槽電鍍金屬層以形成複數個電氣接點。Preferably, the substrate may include a printed circuit board. The printed circuit board has a plurality of grooves formed on both ends, and a metal layer is plated on the plurality of grooves to form a plurality of electrical contacts.
較佳地，基板可包含陶瓷基板，陶瓷基板於兩端連接複數個金屬凸點，以形成複數個電氣接點。Preferably, the substrate may include a ceramic substrate, and the ceramic substrate is connected to a plurality of metal bumps at both ends to form a plurality of electrical contacts.
較佳地，設置線圈可包含將第一線圈與第二線圈並列放置於基板上，第一線圈與第二線圈之導線互相連接且分別拉至基板兩端之複數個電氣接點。Preferably, the setting of the coil may include placing the first coil and the second coil on the substrate in parallel. The wires of the first coil and the second coil are connected to each other and are respectively pulled to a plurality of electrical contacts on both ends of the substrate.
較佳地，基板可設置複數個濾波器單元，將複數個線圈分別設置於複數個濾波器單元，形成並列設置之複數個濾波器模組。Preferably, the substrate may be provided with a plurality of filter units, and the plurality of coils are respectively provided on the plurality of filter units to form a plurality of filter modules arranged in parallel.
較佳地，包含密封結構之濾波器製造方法可進一步包含切割製程，切割複數個濾波器模組以形成預設大小之複數個濾波器單元。Preferably, the manufacturing method of the filter including the sealing structure may further include a cutting process to cut a plurality of filter modules to form a plurality of filter units of a predetermined size.
較佳地，複數個濾波器單元可通過露出之複數個電氣接點電性連接控制線路。濾波器模組可通過露出之複數個電氣接點電性連接控制線路。Preferably, the plurality of filter units can be electrically connected to the control circuit through the exposed plurality of electrical contacts. The filter module can be electrically connected to the control circuit through a plurality of exposed electrical contacts.
較佳地，雷射焊接方式可通過雷射焊接頭對複數個導線與複數個電氣接點之重疊處發射一雷射光，使該複數個導線自動焊接於該複數個電氣接點。Preferably, the laser welding method can emit a laser light at the overlap of the plurality of wires and the plurality of electrical contacts through the laser welding head, so that the plurality of wires are automatically welded to the plurality of electrical contacts.
根據本發明之另一目的，提出一種包含密封結構之濾波器製造方法，其包含以下步驟：設置盒體，於盒體之上緣兩端形成複數個電氣接點，複數個電氣接點間隔設置；將線圈放置於盒體內，並將線圈之複數個導線拉至複數個電氣接點；藉由雷射焊接方式將複數個導線焊接於複數個電氣接點；以及於盒體中形成膠體，膠體覆蓋線圈而露出複數個電氣接點以形成濾波器模組。According to another object of the present invention, a method for manufacturing a filter including a sealed structure is proposed, which includes the following steps: providing a box body, forming a plurality of electrical contacts on both ends of the upper edge of the body, and the plurality of electrical contacts are arranged at intervals ; Place the coil in the box, and pull the multiple wires of the coil to the multiple electrical contacts; solder the multiple wires to the multiple electrical contacts by laser welding; and form the colloid, colloid in the box The coil is covered to expose a plurality of electrical contacts to form a filter module.
較佳地，設置線圈可包含將第一線圈與第二線圈並列放置於盒體內，第一線圈與第二線圈之導線互相連接且分別拉至盒體兩端之複數個電氣接點。Preferably, the setting of the coil may include placing the first coil and the second coil side by side in the box body, the wires of the first coil and the second coil are connected to each other and are respectively pulled to a plurality of electrical contacts at both ends of the box body.
較佳地，包含密封結構之濾波器製造方法可進一步包含以下步驟：於盒體上設置上蓋，上蓋覆蓋盒體及膠體而露出複數個電氣接點之一部分。Preferably, the manufacturing method of the filter including the sealing structure may further include the following steps: setting an upper cover on the box body, the upper cover covering the box body and the gel body to expose a part of the plurality of electrical contacts.
較佳地，雷射焊接方式可通過雷射焊接頭對複數個導線與複數個電氣接點之重疊處發射雷射光，使複數個導線自動焊接於複數個電氣接點。Preferably, in the laser welding method, the laser welding head can emit laser light at the overlap of the plurality of wires and the plurality of electrical contacts, so that the plurality of wires are automatically welded to the plurality of electrical contacts.
承上所述，依本發明之包含密封結構之濾波器製造方法，其可具有一或多個下述優點：As mentioned above, the method for manufacturing a filter including a sealed structure according to the present invention may have one or more of the following advantages:
(1) 此包含密封結構之濾波器製造方法能藉由自動焊接的方式焊接導線與電氣接點，避免人工焊接產生偏差，進而提高生產效率並降低產品不良率。(1) This filter manufacturing method including a sealed structure can weld wires and electrical contacts by automatic welding to avoid deviations caused by manual welding, thereby improving production efficiency and reducing product defect rate.
(2) 此包含密封結構之濾波器製造方法能藉由密封結構增加對濾波器元件的保護，避免在後續製程當中損壞線圈或導線，降低不良品發生之機率。(2) The manufacturing method of the filter including the sealing structure can increase the protection of the filter element through the sealing structure, avoid damage to the coil or wire in the subsequent manufacturing process, and reduce the probability of occurrence of defective products.
(3) 此包含密封結構之濾波器製造方法能藉由電氣接點直接將濾波器模組安裝至印刷電路板或電子裝置的機板上，無須經由人工焊接來連接控制線路，提升製程自動化的相容性。(3) This filter manufacturing method including a sealed structure can directly install the filter module to the printed circuit board or the board of the electronic device through the electrical contacts, without the need to connect the control circuit through manual welding, and enhance the automation of the process compatibility.
為瞭解本發明之技術特徵、內容與優點及其所能達成之功效，茲將本發明配合附圖，並以實施例之表達形式詳細說明如下，而其中所使用之圖式，其主旨僅為示意及輔助說明書之用，未必為本發明實施後之真實比例與精準配置，故不應就所附之圖式的比例與配置關係解讀、侷限本發明於實際實施上的權利範圍，合先敘明。In order to understand the technical features, contents and advantages of the present invention and the achievable effects, the present invention is described in detail in conjunction with the drawings and in the form of expressions of the embodiments, and the figures used therein are only for the purpose of The schematic and auxiliary descriptions are not necessarily the true proportion and precise configuration after the implementation of the present invention, so the ratio and configuration relationship of the attached drawings should not be interpreted and limited to the scope of the actual implementation of the present invention. Bright.
在附圖中，為了淸楚起見，放大了層、膜、面板、區域、導光件等的厚度或寬度。在整個說明書中，相同的附圖標記表示相同的元件。應當理解，當諸如層、膜、區域或基板的元件被稱為在另一元件“上”或“連接到”另一元件時，其可以直接在另一元件上或與另一元件連接，或者中間元件可以也存在。相反地，當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時，不存在中間元件。如本文所使用的“連接”，其可以指物理及/或電性的連接。再者，“電性連接”或“耦合”係可為二元件間存在其它元件。此外，應當理解，儘管術語“第一”、“第二”、“第三”在本文中可以用於描述各種元件、部件、區域、層及/或部分，其係用於將一個元件、部件、區域、層及/或部分與另一個元件、部件、區域、層及/或部分區分開。因此，僅用於描述目的，而不能將其理解為指示或暗示相對重要性或者其順序關係。In the drawings, for the sake of clarity, the thickness or width of layers, films, panels, regions, light guides, etc. are exaggerated. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “connected to” another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connection" may refer to a physical and/or electrical connection. Furthermore, the "electrically connected" or "coupled" system may be that there are other elements between the two elements. In addition, it should be understood that although the terms "first", "second", and "third" may be used herein to describe various elements, components, regions, layers, and/or portions, they are used to refer to one element, component , Region, layer and/or part is distinguished from another element, component, region, layer and/or part. Therefore, it is for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or its order relationship.
除非另有定義，本文所使用的所有術語(包括技術和科學術語)具有與本發明所屬技術領域的通常知識者通常理解的含義。將進一步理解的是，諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義，並且將不被解釋為理想化的或過度正式的意義，除非本文中明確地如此定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the meaning commonly understood by those of ordinary knowledge in the technical field to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and the present invention, and will not be interpreted as idealized or excessive Formal meaning unless explicitly defined in this article.
請參閱第1圖，其係為本發明實施例之包含密封結構之濾波器製造方法之流程圖。如圖所示，含密封結構之濾波器製造方法以下步驟(S01~S05)：Please refer to FIG. 1, which is a flowchart of a method for manufacturing a filter including a sealed structure according to an embodiment of the present invention. As shown in the figure, the manufacturing steps of the filter with sealed structure are as follows (S01~S05):
步驟S01：設置基板，於基板之兩端形成複數個電氣接點，複數個電氣接點間隔設置且貫穿基板。於工作基台上固定基板，基板的種類可包含印刷電路板或陶瓷基板，將基板預先裁切至單一濾波器模組之尺寸，並於基板的兩端設置多個電氣接點。一般而言，接點數量需視濾波器規格來決定，通常單一端可具備3~4個接點。電氣接點係間隔設置且貫穿基板，換言之，基板的上下表面均能作為電氣接點連接的端點，後續步驟當中，線圈的導線可連接在基板的一個表面上，而另一表面的接點則連接線路或電子裝置的機板上。Step S01: setting a substrate, forming a plurality of electrical contacts on both ends of the substrate, the plurality of electrical contacts are arranged at intervals and penetrate the substrate. The substrate is fixed on the working base. The type of the substrate may include a printed circuit board or a ceramic substrate. The substrate is pre-cut to the size of a single filter module, and a plurality of electrical contacts are provided at both ends of the substrate. Generally speaking, the number of contacts depends on the filter specifications. Usually, a single end can have 3~4 contacts. The electrical contacts are spaced apart and penetrate the substrate. In other words, the upper and lower surfaces of the substrate can be used as the endpoints of the electrical contacts. In the subsequent steps, the coil wires can be connected to one surface of the substrate and the contacts of the other surface It is connected to the board of the circuit or electronic device.
請參閱第2圖，其係為本發明實施例之濾波器基板之示意圖。如圖所示，於印刷電路板10而言，電氣接點可利用印刷電路板上原本的線路，或者在印刷電路板10的兩端分別形成3個凹槽11，在凹槽11中鍍上金屬層12，並且延伸至印刷電路板10之上下表面來做為接點。另外，對於陶瓷基板15來說，電氣接點則可在兩端分別連接3個金屬凸點16，金屬凸點16可與陶瓷基板15厚度相同，使得陶瓷基板15的上下表面均具備作為導通的接點。Please refer to FIG. 2, which is a schematic diagram of a filter substrate according to an embodiment of the invention. As shown in the figure, for the
步驟S02：將線圈放置於基板上，並將線圈之複數個導線拉至複數個電氣接點。在基板的一個表面上放置線圈，線圈包含金屬環及其上之繞線，在本實施例當中，線圈可配合自動繞線機事先完成繞線，並且區分連接的導線類型，使繞好線的線圈置於基板上時，能將各條導線拉至基板兩端對應之電氣接點上。Step S02: place the coil on the substrate, and pull the plurality of wires of the coil to the plurality of electrical contacts. Place a coil on one surface of the substrate. The coil contains a metal ring and the winding on it. In this embodiment, the coil can be completed with an automatic winding machine in advance, and the type of connected wire is distinguished to make the winding good. When the coil is placed on the substrate, each wire can be pulled to the corresponding electrical contact at both ends of the substrate.
步驟S03：藉由雷射焊接方式將複數個導線焊接於複數個電氣接點。當線圈與基板固定後，藉由雷射焊接方式將導線焊接於對應之電氣接點上，工作機台可設置一個以上之雷射焊接頭，同時對準兩端導線與電氣接點重疊處，發射雷射光來進行雷射焊接。或者也可設置單一雷射焊接頭，依序焊接各個電氣接點。Step S03: Welding a plurality of wires to a plurality of electrical contacts by laser welding. After the coil and the substrate are fixed, the wires are welded to the corresponding electrical contacts by laser welding. The working machine can be equipped with more than one laser welding head, and at the same time align the ends of the wires and the electrical contacts. Laser light is emitted to perform laser welding. Alternatively, a single laser welding head may be provided to weld each electrical contact in sequence.
請參閱第3圖，其係為本發明實施例之雷射焊接之示意圖。如圖所示，雷射焊接頭20可同時發射兩道雷射光21來照射基板22，對準線圈的導線與電氣接點之焊接處23，使得導線焊接於對應之電氣接點上。通過雷射焊接能有效提升焊接的精準度及製程的良率，避免人工焊接產生之不良品影響後續製程的產出。Please refer to FIG. 3, which is a schematic diagram of laser welding according to an embodiment of the present invention. As shown in the figure, the
步驟S04：設置模具以包覆線圈，於模具中形成膠體，膠體覆蓋線圈而露出複數個電氣接點。當完成導線與電氣接點的焊接後，將半成品以模具包覆，例如設計略高於線圈高度的上蓋覆蓋半成品，僅露出兩端之電氣接點。將液態熱固性密封膠注入模具當中，將線圈包覆覆蓋，經由加熱或照射紫外光使該材料固化形成密封的膠體，進而完成密封結構。Step S04: setting a mold to cover the coil, forming a gel in the mold, and the gel covers the coil to expose a plurality of electrical contacts. After the welding of the wire and the electrical contact is completed, the semi-finished product is covered with a mold. For example, an upper cover designed to be slightly higher than the height of the coil covers the semi-finished product, and only the electrical contacts at both ends are exposed. The liquid thermosetting sealant is injected into the mold, the coil is covered, and the material is cured by heating or irradiating ultraviolet light to form a sealed colloid, and then the sealing structure is completed.
步驟S05：移除模具而形成包含膠體之濾波器模組。當膠體固化後，將模具移除，形成包含密封膠體結構之濾波器模組。此處的濾波器模組由於具備基板另一表面之電氣接點，能夠直接作為表面黏著技術(SMT)或利用自動插件安裝在印刷電路板上，例如在通訊裝置或網路裝置的機板上，使得濾波器模組能配合自動化產線進行生產，無須耗費過多人工，進而提升生產效率及產品良率。Step S05: Remove the mold to form a filter module containing colloid. After the colloid is cured, the mold is removed to form a filter module containing a sealed colloidal structure. The filter module here has electrical contacts on the other surface of the substrate, so it can be directly mounted on a printed circuit board as surface mount technology (SMT) or using an automatic plug-in, such as on the board of a communication device or a network device , So that the filter module can be produced in conjunction with the automated production line, without the need to consume too much labor, and thus improve the production efficiency and product yield.
請參閱第4圖，其係為本發明實施例之密封結構之示意圖。如圖所示，當完成焊接的半成品30，可藉由模具31來覆蓋，並於其中注入密封膠，帶固化後將模具移除，形成密封的膠體32結構。本實施例所製作的密封結構，能夠避免濾波器模組在後續製程當中受到損害，例如要藉由雷射焊接將多個濾波器模組焊接在電子裝置基板上時，可避免雷射光損壞線圈或導線，或者通過表面黏著技術(SMT)將濾波器模組安裝到印刷電路板上，需要經過錫爐烘烤時，也能避免高溫造成線路損壞。Please refer to FIG. 4, which is a schematic diagram of a sealing structure according to an embodiment of the present invention. As shown in the figure, when the welded
請參閱第5圖，其係為本發明另一實施例之包含密封結構之濾波器製造方法之流程圖。如圖所示，包含密封結構之濾波器製造方法以下步驟(S11~S15)：步驟S11：設置基板，於基板之兩端形成複數個電氣接點，複數個電氣接點間隔設置且貫穿基板；步驟S12：將第一線圈與第二線圈並列放置於基板上，第一線圈與第二線圈之導線互相連接且分別拉至基板兩端之複數個電氣接點；步驟S13：藉由雷射焊接方式將複數個導線焊接於複數個電氣接點；步驟S14：設置模具以包覆線圈，於模具中形成膠體，膠體覆蓋線圈而露出複數個電氣接點；以及步驟S15：移除模具而形成包含膠體之濾波器模組。Please refer to FIG. 5, which is a flowchart of a filter manufacturing method including a sealed structure according to another embodiment of the present invention. As shown in the figure, the method of manufacturing a filter including a sealed structure includes the following steps (S11-S15): Step S11: setting a substrate, forming a plurality of electrical contacts on both ends of the substrate, the plurality of electrical contacts are spaced apart and penetrate the substrate; Step S12: Place the first coil and the second coil on the substrate in parallel, the wires of the first coil and the second coil are connected to each other and pulled to a plurality of electrical contacts on both ends of the substrate; Step S13: by laser welding Soldering a plurality of wires to a plurality of electrical contacts; step S14: setting a mold to cover the coil, forming a gel in the mold, the gel covers the coil to expose the plurality of electrical contacts; and step S15: removing the mold to form Colloidal filter module.
其中，步驟S11、S13~S15與前述實施例之步驟S01、S03~S05相同，因此不再重複描述，本實施例僅就差異部分(步驟S12)進行說明。在本實施例當中，步驟S12：將第一線圈與第二線圈並列放置於基板上，第一線圈與第二線圈之導線互相連接且分別拉至基板兩端之複數個電氣接點。與前述實施例差異部分在於每個濾波器模組的機板上可設置不同數量之線圈，在本實施例中雖然以第一線圈及第二線圈為例，但本發明之線圈數量不侷限於2個，單一濾波器模組也可包含2個以上的感應線圈。針對複數個線圈的設置，其線圈與線圈之間的導線連接，可同樣於繞線時完成，進而僅需將欲焊接之導線拉設置電氣接點，即可接續後續步驟形成不同線圈數量之濾波器模組。Wherein, steps S11, S13~S15 are the same as steps S01, S03~S05 of the previous embodiment, so the description will not be repeated, this embodiment only describes the difference (step S12). In this embodiment, step S12: placing the first coil and the second coil on the substrate in parallel, the wires of the first coil and the second coil are connected to each other, and are respectively pulled to a plurality of electrical contacts on both ends of the substrate. The difference from the previous embodiment is that different numbers of coils can be provided on the board of each filter module. Although the first coil and the second coil are taken as examples in this embodiment, the number of coils of the present invention is not limited to Two, a single filter module can also contain more than two induction coils. For the setting of a plurality of coils, the wire connection between the coils and the coils can also be completed during winding, and then only the wires to be welded need to be set to electrical contacts, and subsequent steps can be followed to form filters with different numbers of coils Module.
請參閱第6圖，其係為本發明又一實施例之包含密封結構之濾波器製造方法之流程圖。如圖所示，包含密封結構之濾波器製造方法以下步驟(S21~S26)：步驟S21：設置基板，於基板之兩端形成複數個電氣接點，複數個電氣接點間隔設置且貫穿基板，基板設置複數個濾波器單元；步驟S22：將複數個線圈分別設置於複數個濾波器單元，複數個線圈之導線分別拉至基板兩端之複數個電氣接點；步驟S23：藉由雷射焊接方式將複數個導線焊接於複數個電氣接點；步驟S24：設置模具以包覆線圈，於模具中形成膠體，膠體覆蓋線圈而露出複數個電氣接點；步驟S25：移除模具而形成包含膠體之濾波器模組；以及步驟S26：進行切割製程以切割複數個濾波器模組，形成預設大小之複數個濾波器單元。Please refer to FIG. 6, which is a flowchart of a filter manufacturing method including a sealed structure according to another embodiment of the present invention. As shown in the figure, the method of manufacturing a filter including a sealed structure includes the following steps (S21-S26): Step S21: setting a substrate, forming a plurality of electrical contacts on both ends of the substrate, the plurality of electrical contacts are spaced apart and penetrate the substrate, The substrate is provided with a plurality of filter units; Step S22: The plurality of coils are respectively provided in the plurality of filter units, and the wires of the plurality of coils are respectively drawn to the plurality of electrical contacts at both ends of the substrate; Step S23: By laser welding Soldering a plurality of wires to a plurality of electrical contacts; step S24: setting a mold to cover the coil, forming a gel in the mold, the gel covers the coil to expose the plurality of electrical contacts; step S25: removing the mold to form a gel Filter module; and step S26: performing a cutting process to cut a plurality of filter modules to form a plurality of filter units of a preset size.
其中，步驟S23~S25與前述實施例之步驟S03~S05相同，因此不再重複描述，本實施例僅就差異部分(步驟S21~S22、S26)進行說明。在本實施例當中，步驟S21：設置基板，於基板之兩端形成複數個電氣接點，複數個電氣接點間隔設置且貫穿基板，基板設置複數個濾波器單元。於基板設置複數個濾波器單元是為了增加產量，一般單一濾波器模組之尺寸通常較小，事先裁切相關基板可能造成多餘的製程或成本浪費。因此，於較大的機板上同時設置多個濾波器單元，使其在相同的機板上製作，待完成後續密封結構後才裁切成所需尺寸。Steps S23 to S25 are the same as steps S03 to S05 of the previous embodiment, so the description will not be repeated. This embodiment only describes the differences (steps S21 to S22, S26). In this embodiment, step S21: setting a substrate, forming a plurality of electrical contacts on both ends of the substrate, the plurality of electrical contacts are spaced apart and penetrate the substrate, and the substrate is provided with a plurality of filter units. The plurality of filter units is provided on the substrate to increase the output. Generally, the size of a single filter module is usually small. Cutting the relevant substrate in advance may cause redundant manufacturing processes or cost waste. Therefore, multiple filter units are set on the larger machine board at the same time, so that they are manufactured on the same machine board, and then cut to the required size after the subsequent sealing structure is completed.
步驟S22：將複數個線圈分別設置於複數個濾波器單元，複數個線圈之導線分別拉至基板兩端之複數個電氣接點。由於在基板上設置較多的線圈來形成多個濾波器單元，導線的位置也變得較為複雜，一般而言，設置方式是以並排設置方式，維持基板兩端之複數個電氣接點，並列多個濾波器單元，分別將導線拉至對應之兩端的電氣接點，接著進行自動焊接、製作密封結構等步驟。Step S22: The plurality of coils are respectively arranged in the plurality of filter units, and the wires of the plurality of coils are respectively pulled to the plurality of electrical contacts on both ends of the substrate. As more coils are installed on the substrate to form multiple filter units, the positions of the wires are also more complicated. Generally speaking, the arrangement method is to arrange them side by side, maintaining a plurality of electrical contacts on both ends of the substrate, in parallel A plurality of filter units respectively pull the wires to the corresponding electrical contacts at both ends, and then perform steps such as automatic welding and making a sealed structure.
S26：進行切割製程以切割複數個濾波器模組，形成預設大小之複數個濾波器單元。當完成密封結構的製作，基板上可包含多個濾波器單元，其可直接出貨至下游廠商，待需要加工時才進行切割。或者可直接依據濾波器模組的大小，將其分割成單一濾波器模組後，接續後續製程。後續製程包含將濾波器模組安裝在印刷電路板或控制基板上，與控制線路相連接，作為電子裝置之濾波元件。S26: Perform a cutting process to cut a plurality of filter modules to form a plurality of filter units of a preset size. When the production of the sealing structure is completed, a plurality of filter units may be included on the substrate, which can be directly shipped to downstream manufacturers for cutting only when needed for processing. Or it can be divided into a single filter module directly according to the size of the filter module, and then the subsequent manufacturing process can be continued. The subsequent process includes installing the filter module on the printed circuit board or the control substrate and connecting it with the control circuit as the filter element of the electronic device.
請參閱第7圖，其係為本發明再一實施例之包含密封結構之濾波器製造方法之流程圖。如圖所示，包含密封結構之濾波器製造方法以下步驟(S31~S36)：步驟S31：設置盒體，於盒體之上緣兩端形成複數個電氣接點，複數個電氣接點間隔設置；步驟S32：將第一線圈與第二線圈並列放置於盒體內，第一線圈與第二線圈之導線互相連接且分別拉至盒體兩端之複數個電氣接點；步驟S33：藉由雷射焊接方式將複數個導線焊接於複數個電氣接點；步驟S34：於盒體中形成膠體，膠體覆蓋線圈而露出複數個電氣接點；以及步驟S35：於盒體上設置上蓋，上蓋覆蓋盒體及膠體而露出複數個電氣接點之一部分。Please refer to FIG. 7, which is a flowchart of a filter manufacturing method including a sealed structure according to yet another embodiment of the present invention. As shown in the figure, the manufacturing method of the filter including the sealed structure is as follows (S31~S36): Step S31: setting the box, forming a plurality of electrical contacts on both ends of the upper edge of the box, and setting the electrical contacts at intervals ; Step S32: Place the first coil and the second coil side by side in the box, the wires of the first coil and the second coil are connected to each other and pulled to a plurality of electrical contacts at both ends of the box; Step S33: by thunder Multiple wires are welded to a plurality of electrical contacts by shot welding; step S34: forming a gel in the box, the gel covers the coil to expose the plurality of electrical contacts; and step S35: setting an upper cover on the box and covering the box with the upper cover Body and colloid to expose part of a plurality of electrical contacts.
步驟S31與前述實施例最大的不同在於將濾波器的承載件由基板改為盒體結構，盒體可為方形或矩形，內部具有容置空間，盒體的兩側上緣之兩端設置複數個電氣接點。在另一實施例中，電氣接點可延伸至盒體的側表面，增加後續製程安裝之便利性。接著步驟S32則是將線圈至於盒體內，在本實施例中，是將第一線圈與第二線圈置於盒體的容置空間當中，但本發明不侷限於此，線圈也可為單獨線圈或是多組線圈，藉由線圈數量、大小，進一步調整使用之盒體規格。當線圈置入於盒體並將導線拉至對應之電氣接點後，通過步驟S33，將複數個導線自動焊接於複數個電氣接點，此處雷射焊接的方式與前述實施例類似不再重複描述。The biggest difference between step S31 and the previous embodiment is that the filter carrier is changed from a substrate to a box structure. The box body can be square or rectangular, with an accommodating space inside, and a plurality of ends on both sides of the box body are provided with pluralities Electrical contacts. In another embodiment, the electrical contacts can be extended to the side surface of the box body, which increases the convenience of subsequent process installation. Next, step S32 is to place the coil inside the case. In this embodiment, the first coil and the second coil are placed in the accommodating space of the case, but the invention is not limited to this, and the coil may also be a separate coil Or multiple sets of coils, according to the number and size of coils, to further adjust the specifications of the box used. After the coil is placed in the box and the wire is pulled to the corresponding electrical contact, through step S33, the plurality of wires are automatically welded to the plurality of electrical contacts. The laser welding method here is similar to that in the previous embodiment. Repeat the description.
在步驟S34當中，由於盒體本身容置空間的結構，可直接於其中注入液態熱固性密封膠來包覆線圈及導線，經由加熱或照射紫外光使該材料固化形成密封的膠體。與前述實施例相同，膠體同樣露出複數個電氣接點，以供後續自動化製程安裝使用。此外，為了進一步保護濾波器結構，可藉由步驟S35設置盒體之上蓋，以上蓋覆蓋盒體及膠體而僅露出複數個電氣接點之一部分。上蓋可選擇與盒體相同之材質，其大小可稍小於盒體之外徑，使得盒體上緣部分之電氣接點仍有部分露出來做為與其他電路連接之接點。或者上蓋可完全覆蓋盒體，藉由側表面之電氣接點來連接其他電路。In step S34, due to the structure of the housing body accommodating the space, a liquid thermosetting sealant may be directly injected to cover the coil and the wire, and the material may be cured by heating or irradiating ultraviolet light to form a sealed gel. Similar to the previous embodiment, the gel also exposes a plurality of electrical contacts for subsequent automated process installation. In addition, in order to further protect the filter structure, the upper cover of the box body may be provided through step S35, and the upper cover covers the box body and the gel body to expose only a part of the plurality of electrical contacts. The upper cover can be selected from the same material as the box body, and its size can be slightly smaller than the outer diameter of the box body, so that the electrical contacts of the upper edge of the box body are still partially exposed as contacts for connection with other circuits. Or the upper cover can completely cover the box body, and connect other circuits through the electrical contacts on the side surface.
以上所述僅為舉例性，而非為限制性者。任何未脫離本發明之精神與範疇，而對其進行之等效修改或變更，均應包含於後附之申請專利範圍中。The above is only exemplary, and not restrictive. Any equivalent modifications or changes made without departing from the spirit and scope of the present invention shall be included in the scope of the attached patent application.
10:印刷電路板 11:凹槽 12:金屬層 15:陶瓷基板 16:金屬凸點 20:雷射焊接頭 21:雷射光 22:基板 23:焊接處 30:半成品 31:模具 32:膠體 S01~S05、S11~S15、S21~S26、S31~S35:步驟10: Printed circuit board 11: groove 12: metal layer 15: ceramic substrate 16: Metal bump 20: Laser welding head 21: Laser light 22: substrate 23: Welding 30: Semi-finished products 31: Mold 32: Colloid S01~S05, S11~S15, S21~S26, S31~S35: Steps
為使本發明之技術特徵、內容與優點及其所能達成之功效更為顯而易見，茲將本發明配合附圖，並以實施例之表達形式詳細說明如下：In order to make the technical features, contents and advantages of the present invention and the achievable effects more obvious, the present invention is described in detail in conjunction with the drawings and in the form of expressions of the embodiments as follows:
第1圖係為本發明實施例之包含密封結構之濾波器製造方法之流程圖。FIG. 1 is a flowchart of a method for manufacturing a filter including a sealed structure according to an embodiment of the invention.
第2圖係為本發明實施例之濾波器基板之示意圖。FIG. 2 is a schematic diagram of a filter substrate according to an embodiment of the invention.
第3圖係為本發明實施例之雷射焊接之示意圖。FIG. 3 is a schematic diagram of laser welding according to an embodiment of the invention.
第4圖係為本發明實施例之密封結構之示意圖。FIG. 4 is a schematic diagram of a sealing structure according to an embodiment of the invention.
第5圖係為本發明另一實施例之包含密封結構之濾波器製造方法之流程圖。FIG. 5 is a flowchart of a method for manufacturing a filter including a sealed structure according to another embodiment of the invention.
第6圖係為本發明又一實施例之包含密封結構之濾波器製造方法之流程圖。FIG. 6 is a flowchart of a filter manufacturing method including a sealed structure according to another embodiment of the invention.
第7圖係為本發明再一實施例之包含密封結構之濾波器製造方法之流程圖。FIG. 7 is a flowchart of a filter manufacturing method including a sealed structure according to another embodiment of the present invention.
S01~S05:步驟 S01~S05: Step
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| TW201303921A (en) * | 2011-07-04 | 2013-01-16 | Shu-Yan Guan | Chip inductor with preformed housing and manufacturing method thereof |
| TW201346953A (en) * | 2012-05-04 | 2013-11-16 | Jian-Xing Chen | Manufacturing method of inductors and the inductor |
| TWI578606B (en) * | 2014-12-25 | 2017-04-11 | 訊芯電子科技(中山)有限公司 | Packaging structure of filter and manufacture method thereof |
| TW201737724A (en) * | 2016-04-15 | 2017-10-16 | 富祐鴻科技股份有限公司 | Loudspeaker unit and loudspeaker featuring a voice coil with multiple coil groups possessing efficacies of high reliable electrical connection and easy and quick assembly |
-
2019
- 2019-07-05 TW TW108123788A patent/TWI691164B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201303921A (en) * | 2011-07-04 | 2013-01-16 | Shu-Yan Guan | Chip inductor with preformed housing and manufacturing method thereof |
| TW201346953A (en) * | 2012-05-04 | 2013-11-16 | Jian-Xing Chen | Manufacturing method of inductors and the inductor |
| TWI578606B (en) * | 2014-12-25 | 2017-04-11 | 訊芯電子科技(中山)有限公司 | Packaging structure of filter and manufacture method thereof |
| TW201737724A (en) * | 2016-04-15 | 2017-10-16 | 富祐鴻科技股份有限公司 | Loudspeaker unit and loudspeaker featuring a voice coil with multiple coil groups possessing efficacies of high reliable electrical connection and easy and quick assembly |
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| TW202103441A (en) | 2021-01-16 |
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