TWI691008B - Heating device and heating method - Google Patents

Heating device and heating method Download PDF

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TWI691008B
TWI691008B TW107142825A TW107142825A TWI691008B TW I691008 B TWI691008 B TW I691008B TW 107142825 A TW107142825 A TW 107142825A TW 107142825 A TW107142825 A TW 107142825A TW I691008 B TWI691008 B TW I691008B
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heater
suction cup
heating
heating device
heat
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TW201926511A (en
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程靜
朱鷙
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大陸商上海微電子裝備（集團）股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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Abstract

本發明提供一種加熱裝置及其加熱方法，將吸盤直接固定在隔熱座上，通過柔性固定裝置將薄型加熱器倒掛於吸盤下表面，加熱器和吸盤受熱形變產生的力軸向向下傳遞，減小了加熱器在加熱過程中自身形變對基底的高度及平面度的影響。在加熱器與吸盤之間增加溫度均化層，實現加熱器和吸盤之間的均勻傳熱，在加熱器下表面增加固定層，避免加熱器由於熱量無法迅速傳遞致使其局部受熱而發生翹曲。同時本發明採用薄型加熱器，降低了加熱裝置的重量，進而降低了對工作台的負載需求，由於加熱器厚度的降低，加熱器熱容減小，加熱裝置加熱和冷卻的週期縮短，提高了加熱效率。The invention provides a heating device and a heating method thereof. The suction cup is directly fixed on the heat insulation seat, and the thin heater is hung upside down on the lower surface of the suction cup through the flexible fixing device. The force generated by the heating and deformation of the heater and the suction cup is transmitted downward axially. The influence of the heater's self-deformation on the height and flatness of the substrate during heating is reduced. Add a temperature homogenization layer between the heater and the suction cup to achieve uniform heat transfer between the heater and the suction cup, and add a fixed layer on the lower surface of the heater to avoid the heater from warping due to the heat cannot be quickly transferred to cause local heating. . At the same time, the present invention adopts a thin heater, which reduces the weight of the heating device, thereby reducing the load demand on the workbench. Due to the reduction in the thickness of the heater, the heat capacity of the heater is reduced, and the heating and cooling cycle of the heating device is shortened. Heating efficiency.

Description

一種加熱裝置及加熱方法Heating device and heating method

本發明係關於半導體技術領域，具體是關於一種鍵合加熱裝置及加熱方法。The present invention relates to the field of semiconductor technology, specifically to a bonding heating device and a heating method.

晶圓鍵合技術可以將不同材料的晶圓結合在一起。利用晶圓鍵合技術組合新結構材料有極大的自由度，被廣泛應用於微電子電路、傳感器、功率器件微機械加工、光電子器件、絕緣性矽晶片等領域。Wafer bonding technology can combine wafers of different materials. The use of wafer bonding technology to combine new structural materials has great freedom and is widely used in microelectronic circuits, sensors, power device micromachining, optoelectronic devices, insulating silicon wafers and other fields.

晶圓鍵合過程一般是將矽片、玻璃襯底等基底材料在真空環境下加熱到一定的溫度，施加一定的外力，並持續一定時間，進行鍵合。現有晶圓鍵合設備的主要加熱裝置如圖1所示：通過軟焊將加熱絲埋在高溫合金的金屬盤中製作加熱器13，將所述加熱器13置於隔熱座14上，在加熱器13上疊加吸盤12，或者將加熱器13和吸盤12合併成一個零件，通過吸盤12吸附基底11，加熱過程熱傳導依次經過加熱器13、吸盤12，最後到基底11，完成基底11加熱。該加熱裝置中，加熱器13重量較大，對承載該加熱裝置的工作台動力學性能影響非常大，不適合用於對重量有限制的場合，而且加熱過程中熱膨脹會導致加熱器13及吸盤12整體厚度變厚，使其平面度（表面平坦程度）變差，進一步影響吸附於吸盤12上基底11的高度及平面度。由於在晶圓鍵合設備中需要用機器視覺系統對基底11上的晶片進行位置檢測，當基底11的高度變化或者平面度很差時，機器視覺系統需要增加自動調焦功能，否則難以捕獲基底11上的晶片的清晰成像，影響位置檢測，但增加該功能會增加系統複雜度以及減小產率，同時該加熱使用的加熱器厚度較厚，自身熱容較大，加熱和冷卻消耗的時間較長，不適用於需頻繁加熱—冷卻—加熱的場合。The wafer bonding process generally heats the silicon wafer, glass substrate and other base materials to a certain temperature in a vacuum environment, applies a certain external force, and lasts for a certain time to perform bonding. The main heating device of the existing wafer bonding equipment is shown in FIG. 1: the heater wire is buried in the metal plate of the high-temperature alloy by soldering to make the heater 13, and the heater 13 is placed on the heat insulation seat 14, The suction cup 12 is superimposed on the heater 13, or the heater 13 and the suction cup 12 are combined into one part, and the substrate 11 is adsorbed through the suction cup 12, the heat conduction in the heating process passes through the heater 13, the suction cup 12, and finally reaches the substrate 11 to complete the heating of the substrate 11. In this heating device, the heater 13 has a heavy weight, which has a great influence on the dynamic performance of the workbench carrying the heating device, and is not suitable for occasions with weight restrictions, and thermal expansion during heating will cause the heater 13 and the suction cup 12 The overall thickness becomes thicker, making its flatness (surface flatness) worse, further affecting the height and flatness of the base 11 adsorbed on the suction cup 12. Since the machine vision system is required to detect the position of the wafer on the substrate 11 in the wafer bonding equipment, when the height of the substrate 11 changes or the flatness is very poor, the machine vision system needs to add an automatic focus function, otherwise it is difficult to capture the substrate The clear imaging of the wafer on 11 affects the position detection, but adding this function will increase the complexity of the system and reduce the yield. At the same time, the thickness of the heater used for this heating is thicker, its own heat capacity is larger, and the time consumed for heating and cooling Long, not suitable for occasions requiring frequent heating-cooling-heating.

採用薄型加熱器替代原有厚型加熱器，這樣能夠大幅減少加熱器的重量，但是在現有的加熱裝置中，即使採用薄型加熱器也並不能解決加熱過程中熱膨脹導致的加熱器厚度增加及平面度變差問題。由於薄型加熱器厚度較薄，相比於原有厚型加熱器來說，其厚度尺寸精度較差且呈現一定的弧型，如圖2a所示（自然放置的吸盤21，自然放置的薄型加熱器22），在現有加熱裝置中，薄型加熱器和吸盤固定後會將吸盤帶成弧形，如圖2b所示（吸盤同薄型加熱器固定後的吸盤23，吸盤同薄型加熱器固定後的加熱器24），導致基底相對於隔熱座的高度尺寸及基底平面度無法控制。A thin heater is used to replace the original thick heater, which can greatly reduce the weight of the heater, but in the existing heating device, even using a thin heater can not solve the increase in heater thickness and flatness caused by thermal expansion during heating Degree of deterioration. Because the thickness of the thin heater is thinner, compared with the original thick heater, its thickness dimension accuracy is poor and it has a certain arc shape, as shown in Figure 2a (naturally placed suction cup 21, naturally placed thin heater 22) In the existing heating device, after the thin heater and the suction cup are fixed, the suction cup will be brought into an arc shape, as shown in FIG. 2b (the suction cup 23 after the fixed suction cup and the thin heater are fixed, and the heating after the fixed suction cup and the thin heater are fixed 24), the height dimension and the flatness of the substrate relative to the heat insulation seat cannot be controlled.

為解決上述問題，本發明提出了一種加熱裝置，其特徵在於，包括：加熱器、吸盤及隔熱座，In order to solve the above problems, the present invention proposes a heating device, which is characterized by comprising: a heater, a suction cup and a heat insulation seat,

所述吸盤直接固定在所述隔熱座上，所述隔熱座支撐所述吸盤的下表面的邊緣；所述加熱器連接至所述吸盤的所述下表面以及且位於所述隔熱座的內側。The suction cup is directly fixed on the heat insulation seat, the heat insulation seat supports the edge of the lower surface of the suction cup; the heater is connected to the lower surface of the suction cup and is located on the heat insulation seat Inside.

進一步的，所述加熱器為薄型加熱器。Further, the heater is a thin heater.

進一步的，所述加熱器和所述吸盤的重量比小於1。Further, the weight ratio of the heater and the suction cup is less than 1.

進一步的，所述加熱器與所述吸盤的所述下表面相貼合。Further, the heater is attached to the lower surface of the suction cup.

進一步的，所述加熱裝置還包括柔性固定裝置，所述加熱器通過所述柔性固定裝置固定在所述吸盤的下表面。Further, the heating device further includes a flexible fixing device, and the heater is fixed to the lower surface of the suction cup through the flexible fixing device.

進一步的，所述柔性固定裝置包括蝶形彈簧和台階螺栓，所述蝶形彈簧的一端抵靠在所述台階螺栓的台階上。Further, the flexible fixing device includes a butterfly spring and a step bolt, and one end of the butterfly spring abuts on the step of the step bolt.

進一步的，所述柔性固定裝置中所述台階螺栓的台階高度由所述加熱器的厚度、重量及所述蝶形彈簧的的壓縮量決定。Further, the step height of the step bolt in the flexible fixing device is determined by the thickness and weight of the heater and the compression amount of the butterfly spring.

進一步的，所述柔性固定裝置中所述蝶形彈簧形變所需要的力小於所述吸盤受熱形變所需要的的力，且所述蝶形彈簧形變所需要的力小於所述加熱器受熱形變所需要的的力。Further, the force required for the deformation of the butterfly spring in the flexible fixing device is less than the force required for the heat deformation of the suction cup, and the force required for the deformation of the butterfly spring is less than the force required for the heater The force needed.

進一步的，所述加熱裝置還包括溫度均化層，所述溫度均化層位於所述加熱器和所述吸盤之間，用於使所述加熱器和所述吸盤之間實現均勻熱傳遞。Further, the heating device further includes a temperature homogenization layer, and the temperature homogenization layer is located between the heater and the suction cup, and is used to achieve uniform heat transfer between the heater and the suction cup.

進一步的，所述加熱裝置還包括固定層，所述固定層通過所述柔性固定裝置固定於所述加熱器的下表面。Further, the heating device further includes a fixing layer, and the fixing layer is fixed to the lower surface of the heater by the flexible fixing device.

進一步的，所述台階螺栓的負荷大於所述加熱器、所述溫度均化層、所述固定層和所述蝶形彈簧的自身重量之和。Further, the load of the step bolt is greater than the sum of the weights of the heater, the temperature equalization layer, the fixing layer, and the butterfly spring.

進一步的，所述吸盤的材料為鈦合金。Further, the material of the suction cup is a titanium alloy.

進一步的，所述吸盤的總厚度在加熱過程中控制在8mm以內。Further, the total thickness of the suction cup is controlled within 8 mm during heating.

相應的，本發明提供一種加熱方法，採用以上所述的加熱裝置對基底進行加熱，包括：將所述基底固定在所述吸盤的上表面；對所述基底進行加熱。Correspondingly, the present invention provides a heating method that uses the above-mentioned heating device to heat the substrate, including: fixing the substrate on the upper surface of the suction cup; and heating the substrate.

與現有加熱裝置相比，本發明將吸盤直接固定在隔熱座上，將薄型加熱器倒掛於吸盤下表面，加熱器和吸盤受熱形變產生的力軸向向下傳遞，減小了加熱器在加熱過程中自身形變對基底的高度及平面度的影響。Compared with the existing heating device, the present invention fixes the suction cup directly on the heat insulation seat, and hangs the thin heater on the lower surface of the suction cup. The force generated by the heating and deformation of the heater and the suction cup is transmitted downward axially, reducing the heater The effect of self-deformation on the height and flatness of the substrate during heating.

進一步的，在加熱器與吸盤之間增加溫度均化層，實現加熱器和吸盤之間的均勻傳熱，在加熱器下表面增加固定層，避免加熱器由於熱量無法迅速傳遞致使其局部受熱而發生翹曲。Further, a temperature homogenization layer is added between the heater and the suction cup to achieve uniform heat transfer between the heater and the suction cup, and a fixed layer is added on the lower surface of the heater to avoid the heater from being locally heated due to the inability to quickly transfer heat Warpage occurs.

進一步的，本發明採用薄型加熱器，降低了加熱裝置的重量，進而降低了對工作台的負載需求，由於加熱器厚度的降低，加熱器熱容減小，加熱裝置加熱和冷卻的週期縮短，提高了加熱效率。Further, the present invention uses a thin heater to reduce the weight of the heating device, thereby reducing the load demand on the workbench. Due to the reduction in the thickness of the heater, the heat capacity of the heater is reduced, and the heating and cooling cycle of the heating device is shortened. Increased heating efficiency.

為使本發明的內容更加清楚易懂，以下結合說明書附圖，對本發明的內容做進一步說明。當然本發明並不局限於該具體實施例，本領域的技術人員所熟知的一般替換也涵蓋在本發明的保護範圍內。In order to make the content of the present invention more clear and understandable, the content of the present invention will be further described below in conjunction with the accompanying drawings of the description. Of course, the present invention is not limited to this specific embodiment, and general replacements well known to those skilled in the art are also covered by the protection scope of the present invention.

其次，本發明利用示意圖進行了詳細的表述，在詳述本發明實例時，為了便於說明，示意圖不依照一般比例局部放大，不應對此作為本發明的限定。Secondly, the present invention is described in detail using schematic diagrams. When describing the examples of the present invention in detail, the schematic diagrams are not partially enlarged in accordance with the general scale, and should not be regarded as a limitation of the present invention.

實施例一Example one

請參考圖3，其為本發明實施例一所提供的加熱裝置的結構示意圖。如圖3所示，所述加熱裝置包括吸盤32、溫度均化層33、加熱器34、隔熱座35及柔性固定裝置36。所述吸盤32實現基底31的承載與吸附，所述加熱器34實現所述加熱裝置的熱量輸出，根據所述加熱器34的種類可選擇在所述吸盤32和加熱器34之間增加溫度均化層33，實現所述吸盤32與所述加熱器34之間的均勻傳熱，所述溫度均化層33和加熱器34通過所述柔性固定裝置36倒掛於所述吸盤32下表面，所述吸盤32通過隔熱座35支撐。Please refer to FIG. 3, which is a schematic structural diagram of a heating device according to Embodiment 1 of the present invention. As shown in FIG. 3, the heating device includes a suction cup 32, a temperature homogenizing layer 33, a heater 34, a heat insulating seat 35 and a flexible fixing device 36. The suction cup 32 realizes the loading and adsorption of the substrate 31, the heater 34 realizes the heat output of the heating device, and the temperature can be increased between the suction cup 32 and the heater 34 according to the type of the heater 34. Layer 33 to achieve uniform heat transfer between the suction cup 32 and the heater 34, the temperature homogenization layer 33 and the heater 34 are hung upside down on the lower surface of the suction cup 32 by the flexible fixing device 36, so The suction cup 32 is supported by the heat insulating seat 35.

圖4 為所述柔性固定裝置36的結構示意圖。如圖4所示，所述柔性固定裝置36包括蝶形彈簧41和台階螺栓42，所述蝶形彈簧41的一端抵靠在所述台階螺栓42的台階上，所述蝶形彈簧41的另一端抵靠在所述吸盤32的下表面。參考圖3和圖4，所述加熱器34和所述溫度均化層33通過所述柔性固定裝置36倒掛於所述吸盤32下表面，即所述台階螺栓42固定於所述吸盤32的下表面，所述蝶形彈簧41承載所述加熱器34和所述溫度均化層33置於所述台階螺栓42的台階上。所述加熱器34和所述吸盤32的重量比小於1，使所述加熱器34倒掛於所述吸盤32時，所述吸盤32自身高度及平面度不受影響。FIG. 4 is a schematic structural diagram of the flexible fixing device 36. As shown in FIG. 4, the flexible fixing device 36 includes a butterfly spring 41 and a step bolt 42, one end of the butterfly spring 41 abuts on the step of the step bolt 42, and the other of the butterfly spring 41 One end abuts against the lower surface of the suction cup 32. Referring to FIGS. 3 and 4, the heater 34 and the temperature homogenization layer 33 are hung upside down on the lower surface of the suction cup 32 by the flexible fixing device 36, that is, the step bolt 42 is fixed under the suction cup 32 On the surface, the butterfly spring 41 carries the heater 34 and the temperature homogenization layer 33 and is placed on the step of the step bolt 42. The weight ratio of the heater 34 and the suction cup 32 is less than 1, so that when the heater 34 is hung upside down on the suction cup 32, the height and flatness of the suction cup 32 itself are not affected.

根據所述加熱器34的厚度、重量以及所述蝶形彈簧41的壓縮量選擇所述台階螺栓42的台階高度，使所述台階螺栓42在擰緊後通過所述蝶形彈簧41給予所述加熱器34和所述溫度均化層33提供支撐力，進而保證所述加熱器34同所述吸盤32的貼合，其中所述支撐力大於所述加熱器34、所述溫度均化層33和所述蝶形彈簧41的自身重量之和，優選的，所述支撐力為所述加熱器34、所述溫度均化層33和所述蝶形彈簧41的自身重量之和的一到兩倍。The step height of the step bolt 42 is selected according to the thickness and weight of the heater 34 and the compression amount of the butterfly spring 41, so that the step bolt 42 is given the heating by the butterfly spring 41 after tightening The heater 34 and the temperature homogenizing layer 33 provide a supporting force, thereby ensuring the fit of the heater 34 and the suction cup 32, wherein the supporting force is greater than the heater 34, the temperature homogenizing layer 33 and the The sum of the weight of the butterfly spring 41 is preferably one to two times the sum of the weight of the heater 34, the temperature equalization layer 33 and the weight of the butterfly spring 41 .

同時，所述蝶形彈簧41形變所需要的力小於所述加熱器34受熱形變所需要的力，同樣，所述蝶形彈簧41形變所需要的力小於所述吸盤32受熱形變所需要的力，當所述加熱器34進行熱量輸出時，自身受熱形變會使蝶形彈簧41壓縮，減小所述加熱器34受熱形變對所述吸盤32的影響。At the same time, the force required for the deformation of the butterfly spring 41 is less than the force required for the heater 34 to be deformed by heat. Similarly, the force required for the deformation of the butterfly spring 41 is less than the force required by the suction cup 32 to be deformed by heat When the heater 34 is performing heat output, the thermal deformation of the heater will compress the butterfly spring 41 to reduce the influence of the heating deformation of the heater 34 on the suction cup 32.

本實施例中所述加熱裝置中所述加熱器32可為厚型加熱器或薄型加熱器，優選為薄型加熱器，例如厚度為3mm左右的薄型加熱器，相比於現有的厚型加熱器，薄型加熱器自身重量都大幅降低，進而降低了所述加熱裝置的重量，降低了對工作台的負載要求，同時由於所述加熱器32厚度的降低，其自身熱容減小，降低了所述加熱器32自身加熱的能量消耗，使所述加熱裝置加熱和冷卻的週期縮短，提高了加熱效率。The heater 32 in the heating device in this embodiment may be a thick heater or a thin heater, preferably a thin heater, for example, a thin heater with a thickness of about 3 mm, as compared to the conventional thick heater The weight of the thin heater is greatly reduced, which reduces the weight of the heating device and the load requirements on the workbench. At the same time, due to the reduced thickness of the heater 32, its own heat capacity is reduced, which reduces the The energy consumption of the heater 32 for heating itself shortens the heating and cooling cycle of the heating device and improves the heating efficiency.

本實施例中所述吸盤32的材質優選為TA12（鈦合金）材料，相比現有技術中吸盤所採用的高溫合金或不銹鋼材料，TA12材料的高溫性能更優良，減小所述吸盤32在高溫時的形變量，使所述吸盤32的總厚度在整個加熱過程中控制在8mm以下，同時由於TA12材料的密度約為鋼材料的一半，減小TA12材料製成的所述吸盤32的自身重量，進一步降低了對工作台的負載要求。In this embodiment, the material of the suction cup 32 is preferably TA12 (titanium alloy) material. Compared with the high-temperature alloy or stainless steel material used in the prior art, the TA12 material has better high-temperature performance and reduces the high temperature of the suction cup 32. The amount of deformation of the time, the total thickness of the suction cup 32 is controlled to be less than 8mm during the entire heating process, and because the density of the TA12 material is about half of the steel material, the weight of the suction cup 32 made of TA12 material is reduced , Further reducing the load requirements on the workbench.

本發明還提供了一種加熱方法，採用以上所述加熱裝置對所述基底31進行加熱，具體如下：The present invention also provides a heating method, which uses the above heating device to heat the substrate 31, as follows:

首先，將所述吸盤32置於所述隔熱座35上，所述溫度均化層33及所述加熱器34通過所述柔性固定裝置36倒掛於所述吸盤32的下表面；優選地，先在所述溫度均化層33及所述加熱器34中打孔以供蝶形彈簧41的嵌入，其次，調節所述台階螺栓42進入蝶形彈簧41的深度，使所述加熱器34通過所述溫度均化層33與所述吸盤32相貼合；然後，通過真空吸附將所述基底31固定在所述吸盤32的上表面；最後，所述加熱器34 進行熱量輸出對所述基底31進行加熱。First, place the suction cup 32 on the heat insulation base 35, and the temperature homogenization layer 33 and the heater 34 are hung upside down on the lower surface of the suction cup 32 by the flexible fixing device 36; preferably, First, perforate the temperature homogenizing layer 33 and the heater 34 for the embedding of the butterfly spring 41, and secondly, adjust the depth of the step bolt 42 into the butterfly spring 41, so that the heater 34 passes The temperature homogenizing layer 33 is attached to the suction cup 32; then, the substrate 31 is fixed to the upper surface of the suction cup 32 by vacuum adsorption; finally, the heater 34 performs heat output to the substrate 31 for heating.

實施例二Example 2

請參考圖5，其為本發明實施例二所提供的加熱裝置的結構示意圖。如圖5所示，所述加熱裝置包括吸盤52、溫度均化層53、加熱器54、固定層55、柔性固定裝置56及隔熱座57。所述吸盤52實現基底51的承載與吸附，所述加熱器54實現所述加熱裝置的熱量輸出，根據所述加熱器54的種類可選擇在所述吸盤52和所述加熱器54之間增加溫度均化層53，實現所述吸盤52與所述加熱器54之間的均勻傳熱，根據所述加熱器54的種類可選擇在所述加熱器54下表面增加固定層55，實現對所述加熱器54的固定，避免所述加熱器54由於熱量無法迅速傳遞致使其局部受熱而發生翹曲，所述溫度均化層53、所述加熱器54及所述固定層55通過所述柔性固定裝置56倒掛於所述吸盤52下表面，所述吸盤52通過隔熱座57支撐。Please refer to FIG. 5, which is a schematic structural diagram of a heating device according to Embodiment 2 of the present invention. As shown in FIG. 5, the heating device includes a suction cup 52, a temperature homogenizing layer 53, a heater 54, a fixing layer 55, a flexible fixing device 56 and a heat insulating seat 57. The suction cup 52 realizes the loading and adsorption of the substrate 51, the heater 54 realizes the heat output of the heating device, and can be selected to increase between the suction cup 52 and the heater 54 according to the type of the heater 54 The temperature homogenizing layer 53 realizes uniform heat transfer between the chuck 52 and the heater 54. According to the type of the heater 54, a fixed layer 55 may be added on the lower surface of the heater 54 to achieve The fixing of the heater 54 prevents the heater 54 from being warped due to the inability of heat to be quickly transferred, causing the temperature homogenizing layer 53, the heater 54 and the fixing layer 55 to pass the flexibility The fixing device 56 is hung upside down on the lower surface of the suction cup 52, and the suction cup 52 is supported by the heat insulation seat 57.

本實施例中所述加熱裝置中所述加熱器54可為薄型加熱器，優選為厚度為1mm左右的脆性材質的加熱器，例如陶瓷加熱器，所述陶瓷加熱器加熱速度快，如果加熱過快，而熱量無法迅速傳遞，會使陶瓷加熱器局部受熱發生翹曲，為避免此類現象，本實施例在所述加熱器54下表面增加一固定層55，用於實現所述陶瓷加熱器熱量的及時傳遞。所述固定層55同所述溫度均化層53和所述加熱器54通過所述柔性固定裝置56倒掛於所述吸盤52下表面。In the heating device in this embodiment, the heater 54 may be a thin heater, preferably a heater of a brittle material with a thickness of about 1 mm, such as a ceramic heater. The ceramic heater has a fast heating speed. Fast, and the heat can not be transferred quickly, which will cause the local heating of the ceramic heater to warp. In order to avoid this phenomenon, this embodiment adds a fixed layer 55 to the lower surface of the heater 54 to implement the ceramic heater The timely transmission of heat. The fixing layer 55 is hung upside down on the lower surface of the suction cup 52 through the flexible fixing device 56 together with the temperature homogenizing layer 53 and the heater 54.

同實施例一中一樣，本實施例中所述加熱器54和所述吸盤52的重量比小於1，所述吸盤52的材質優選為高溫性能良好的TA12材料，所述柔性固定裝置56包括蝶形彈簧41和台階螺栓42，所述台階螺栓42的負荷大於所述加熱器54、所述溫度均化層53、所述固定層55和所述蝶形彈簧41的自身重量之和。As in the first embodiment, the weight ratio of the heater 54 and the suction cup 52 in this embodiment is less than 1. The material of the suction cup 52 is preferably TA12 material with good high temperature performance. The flexible fixing device 56 includes a butterfly A spring 41 and a step bolt 42, and the load of the step bolt 42 is greater than the sum of the weights of the heater 54, the temperature homogenizing layer 53, the fixing layer 55 and the butterfly spring 41.

本發明還提供了一種加熱方法，採用以上所述加熱裝置對所述基底51進行加熱，具體如下：The invention also provides a heating method, which uses the above-mentioned heating device to heat the substrate 51, as follows:

首先，將所述吸盤52置於所述隔熱座57上，所述溫度均化層53、所述加熱器54及所述固定層55通過所述柔性固定裝置56倒掛於所述吸盤52的下表面；優選地，先在所述溫度均化層53及所述加熱器54中打孔以供蝶形彈簧41的嵌入，其次，調節所述台階螺栓42進入蝶形彈簧41的深度，使所述加熱器54通過所述溫度均化層53與所述吸盤52相貼合，所述固定層55與所述加熱器54相貼合；然後，通過真空吸附將所述基底51固定在所述吸盤52的上表面；最後，所述加熱器54 進行熱量輸出對所述基底51進行加熱。First, the suction cup 52 is placed on the heat insulation seat 57, and the temperature homogenizing layer 53, the heater 54 and the fixing layer 55 are hung upside down on the suction cup 52 by the flexible fixing device 56 Lower surface; preferably, first make holes in the temperature homogenizing layer 53 and the heater 54 for the embedding of the butterfly spring 41, and secondly, adjust the depth of the step bolt 42 into the butterfly spring 41, so that The heater 54 is bonded to the suction cup 52 through the temperature homogenization layer 53, and the fixing layer 55 is bonded to the heater 54; then, the substrate 51 is fixed to the substrate by vacuum suction The upper surface of the suction cup 52; finally, the heater 54 performs heat output to heat the substrate 51.

實施例三Example Three

請參考圖6，其為本發明實施例三所提供的加熱裝置的結構示意圖。如圖6所示，所述加熱裝置包括吸盤62、加熱器63及隔熱座64。所述吸盤62實現基底61的承載與吸附，所述加熱器63實現所述加熱裝置的熱量輸出，加熱器63固定在所述吸盤62的下表面，所述吸盤62通過隔熱座64支撐。Please refer to FIG. 6, which is a schematic structural diagram of a heating device according to Embodiment 3 of the present invention. As shown in FIG. 6, the heating device includes a suction cup 62, a heater 63 and a heat insulation seat 64. The suction cup 62 realizes the loading and adsorption of the base 61, the heater 63 realizes the heat output of the heating device, the heater 63 is fixed on the lower surface of the suction cup 62, and the suction cup 62 is supported by the heat insulation seat 64.

本實施例中所述加熱裝置中所述加熱器63可為薄型加熱器，優選為厚度為0.2mm左右的柔性材質的加熱器，例如聚醯亞胺加熱器。所述聚醯亞胺加熱器為柔性材質，熱膨脹時產生的形變不會影響所述吸盤62的平面度，故不需要採用柔性固定裝置進行固定。The heater 63 in the heating device in this embodiment may be a thin heater, preferably a heater of a flexible material with a thickness of about 0.2 mm, such as a polyimide heater. The polyimide heater is a flexible material, and the deformation generated during thermal expansion does not affect the flatness of the suction cup 62, so there is no need to use a flexible fixing device for fixing.

同上述實施例，本實施例中所述加熱器63和所述吸盤62的重量比小於1，所述吸盤62的材質優選高溫性能良好的為TA12材料。Similar to the above embodiment, in this embodiment, the weight ratio of the heater 63 and the suction cup 62 is less than 1, and the material of the suction cup 62 is preferably TA12 with good high-temperature performance.

本發明還提供了一種加熱方法，採用以上所述加熱裝置對所述基底61進行加熱，具體如下：The present invention also provides a heating method, which uses the heating device described above to heat the substrate 61, as follows:

首先，將所述吸盤62置於所述隔熱座64上，加熱器63固定在所述吸盤62的下表面；然後，通過真空吸附將所述基底61固定在所述吸盤62的上表面；最後，所述加熱器63 進行熱量輸出對所述基底61進行加熱。First, the suction cup 62 is placed on the heat insulation seat 64, and the heater 63 is fixed on the lower surface of the suction cup 62; then, the base 61 is fixed on the upper surface of the suction cup 62 by vacuum suction; Finally, the heater 63 performs heat output to heat the substrate 61.

綜上所述，本發明直接將吸盤固定在隔熱座上，通過柔性固定裝置將薄型加熱器倒掛於吸盤下表面，加熱器和吸盤受熱形變產生的力軸向向下傳遞，減小了加熱器在加熱過程中自身形變對基底的高度及平面度的影響。在加熱器與吸盤之間增加溫度均化層，實現加熱器和吸盤之間的均勻傳熱，在加熱器下表面增加固定層，避免加熱器由於熱量無法迅速傳遞致使其局部受熱而發生翹曲。同時本發明採用薄型加熱器，降低了加熱裝置的重量，進而降低了對工作台的負載需求，由於加熱器厚度的降低，加熱器熱容減小，加熱裝置加熱和冷卻的週期縮短，提高了加熱效率。In summary, the invention directly fixes the suction cup on the heat insulation seat, and the thin heater is hung upside down on the lower surface of the suction cup through the flexible fixing device. The force generated by the heating and deformation of the heater and the suction cup is transmitted axially downward, reducing heating The effect of the device's own deformation on the height and flatness of the substrate during the heating process. Add a temperature homogenization layer between the heater and the suction cup to achieve uniform heat transfer between the heater and the suction cup, and add a fixed layer on the lower surface of the heater to avoid the heater from warping due to the heat cannot be quickly transferred to cause local heating. . At the same time, the present invention adopts a thin heater, which reduces the weight of the heating device, thereby reducing the load demand on the workbench. Due to the reduction in the thickness of the heater, the heat capacity of the heater is reduced, and the heating and cooling cycle of the heating device is shortened. Heating efficiency.

上述僅為本發明的較佳實施例而已，並不對本發明起到任何限制作用。任何所屬技術領域的技術人員，在不脫離本發明的技術方案的範圍內，對本發明揭露的技術方案和技術內容做任何形式的等同替換或修改等變動，均屬未脫離本發明的技術方案的內容，仍屬於本發明的保護範圍之內。The above are only preferred embodiments of the present invention, and do not limit the present invention in any way. Any person skilled in the art in the art, without departing from the scope of the technical solution of the present invention, makes any form of equivalent replacement or modification of the technical solution and technical content disclosed by the present invention, which are all within the technical solution of the present invention. The content still falls within the protection scope of the present invention.

11‧‧‧基底12‧‧‧吸盤13‧‧‧加熱器14‧‧‧隔熱座21‧‧‧吸盤22‧‧‧薄型加熱器23‧‧‧吸盤24‧‧‧加熱器31‧‧‧基底32‧‧‧吸盤33‧‧‧溫度均化層34‧‧‧加熱器35‧‧‧隔熱座36‧‧‧柔性固定裝置41‧‧‧蝶形彈簧42‧‧‧台階螺栓51‧‧‧基底52‧‧‧吸盤53‧‧‧溫度均化層54‧‧‧加熱器55‧‧‧固定層56‧‧‧柔性固定裝置57‧‧‧隔熱座61‧‧‧基底62‧‧‧吸盤63‧‧‧加熱器64‧‧‧隔熱座11‧‧‧Base 12‧‧‧Suction cup 13‧‧‧ Heater 14‧‧‧Insulation seat 21‧‧‧Suction cup 22‧‧‧ Thin heater 23‧‧‧Suction cup 24‧‧‧ Heater 31‧‧‧ Base 32 ‧ ‧ ‧ suction cup 33 ‧ ‧ ‧ temperature homogenization layer 34 ‧ ‧ ‧ heater 35 ‧ ‧ ‧ heat insulation seat 36 ‧ ‧ ‧ flexible fixing device 41 ‧ ‧ butterfly spring 42 ‧ ‧ step bolt 51 ‧ ‧ ‧Base 52‧‧‧Sucker 53‧‧‧Temperature homogenization layer 54‧‧‧Heating heater 55‧‧‧Fixed layer 56‧‧‧Flexible fixing device 57‧‧‧Insulation base 61‧‧‧Base 62‧‧‧ Suction cup 63‧‧‧ Heater 64‧‧‧ Heat insulation seat

圖1為現有加熱裝置的結構示意圖； 圖2a為自然放置的吸盤和加熱器的結構示意圖； 圖2b為吸盤和加熱器固定後的結構示意圖； 圖3為本發明實施例一所提供的加熱裝置的結構示意圖； 圖4為本發明實施例一和實施例二所提供的柔性固定裝置的結構示意圖； 圖5為本發明實施例二所提供的加熱裝置的結構示意圖； 圖6為本發明實施例三所提供的加熱裝置的結構示意圖。Fig. 1 is a schematic structural view of a conventional heating device; Fig. 2a is a schematic structural view of a naturally placed suction cup and heater; Fig. 2b is a schematic structural view of a fixed suction cup and heater; Fig. 3 is a heating device provided in Example 1 of the present invention 4 is a schematic structural view of the flexible fixing device provided by the first and second embodiments of the present invention; FIG. 5 is a schematic structural view of the heating device provided by the second embodiment of the present invention; FIG. 6 is an embodiment of the present invention 3. Schematic diagram of the heating device provided.

31‧‧‧基底 31‧‧‧ base

32‧‧‧吸盤 32‧‧‧Sucker

33‧‧‧溫度均化層 33‧‧‧Temperature homogenization layer

34‧‧‧加熱器 34‧‧‧ Heater

35‧‧‧隔熱座 35‧‧‧Insulation seat

36‧‧‧柔性固定裝置 36‧‧‧Flexible fixing device

Claims (12)

一種加熱裝置，其特徵在於包括：加熱器、吸盤、隔熱座及柔性固定裝置，所述吸盤直接固定在所述隔熱座上，所述隔熱座支撐所述吸盤的下表面的邊緣；所述加熱器通過所述柔性固定裝置固定在所述吸盤的所述下表面以及且位於所述隔熱座的內側；所述柔性固定裝置包括蝶形彈簧和台階螺栓，所述蝶形彈簧的一端抵靠在所述台階螺栓的台階上。 A heating device is characterized by comprising: a heater, a suction cup, a heat insulation seat and a flexible fixing device, the suction cup is directly fixed on the heat insulation seat, and the heat insulation seat supports the edge of the lower surface of the suction cup; The heater is fixed on the lower surface of the suction cup and inside the heat insulation seat by the flexible fixing device; the flexible fixing device includes a butterfly spring and a step bolt, One end abuts on the step of the step bolt. 如請求項1所述的加熱裝置，其中所述加熱器為薄型加熱器。 The heating device according to claim 1, wherein the heater is a thin heater. 如請求項1所述的加熱裝置，其中所述加熱器和所述吸盤的重量比小於1。 The heating device according to claim 1, wherein the weight ratio of the heater and the suction cup is less than 1. 如請求項1所述的加熱裝置，其中所述加熱器與所述吸盤的所述下表面相貼合。 The heating device according to claim 1, wherein the heater is in contact with the lower surface of the suction cup. 如請求項1所述的加熱裝置，其中所述台階螺栓的台階高度由所述加熱器的厚度、重量及所述蝶形彈簧的壓縮量決定。 The heating device according to claim 1, wherein the step height of the step bolt is determined by the thickness, weight and compression amount of the butterfly spring of the heater. 如請求項1所述的加熱裝置，其中所述蝶形彈簧形變所需要的力小於所述吸盤受熱形變所需要的力，且所述蝶形彈簧形變所需要的力小於所述加熱器受熱形變所需要的力。 The heating device according to claim 1, wherein the force required for deformation of the butterfly spring is smaller than the force required for heat deformation of the suction cup, and the force required for deformation of the butterfly spring is less than heat deformation of the heater The force required. 如請求項1所述的加熱裝置，其中還包括溫度均化層，所述溫度均化層位於所述加熱器和所述吸盤之間，用於使所述加熱器和所述吸盤之間實現均勻熱傳遞。 The heating device according to claim 1, further comprising a temperature homogenization layer, the temperature homogenization layer is located between the heater and the suction cup, and is used for realizing between the heater and the suction cup Even heat transfer. 如請求項7所述的加熱裝置，其中還包括固定層，所述固定層通過所述柔性固定裝置固定於所述加熱器的下表面。 The heating device according to claim 7, further comprising a fixing layer, and the fixing layer is fixed to the lower surface of the heater by the flexible fixing device. 如請求項8所述的加熱裝置，其中所述台階螺栓的負荷大於所述加熱器、所述溫度均化層、所述固定層和所述蝶形彈簧的自身重量之和。 The heating device according to claim 8, wherein the load of the step bolt is greater than the sum of the weights of the heater, the temperature equalization layer, the fixing layer, and the butterfly spring. 如請求項1至9中任一項所述的加熱裝置，其中所述吸盤的材料為鈦合金。 The heating device according to any one of claims 1 to 9, wherein the material of the suction cup is a titanium alloy. 如請求項1至9中任一項所述的加熱裝置，其中所述吸盤的總厚度在加熱過程中控制在8mm以內。 The heating device according to any one of claims 1 to 9, wherein the total thickness of the suction cup is controlled within 8 mm during heating. 一種加熱方法，採用如請求項1至11中任一項所述的加熱裝置對基底進行加熱，其特徵在於包括：將所述基底固定在所述吸盤的上表面；對所述基底進行加熱。 A heating method that uses a heating device according to any one of claims 1 to 11 to heat a substrate, which includes: fixing the substrate on an upper surface of the suction cup; and heating the substrate.
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