TWI690697B - Temperature sensor evaluation method - Google Patents
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本發明係有關於一溫度感測器,特別是有關於設置於一記憶體裝置內的該溫度感測器之評估方法。The invention relates to a temperature sensor, in particular to an evaluation method of the temperature sensor provided in a memory device.
動態隨機存取記憶體(Dynamic Random Access Memory: DRAM) 為了省電會根據不同溫度而有不同的自更新頻率,溫度愈低其自更新的頻率愈低,亦即間隔較長的時間做一次自更新;溫度愈高其自更新頻率愈高,亦即間隔較短的時間做一次自更新。而DRAM就是依據其內部的一溫度感測器的感測溫度,用以調整不同溫度下的該自更新頻率。如果該溫度感測器的感測溫度與實際溫度誤差過大,則會因為不適當的自更新頻率,而造成DRAM所儲存資料的遺失。Dynamic random access memory (Dynamic Random Access Memory: DRAM) will have different self-refresh frequencies according to different temperatures in order to save power. The lower the temperature, the lower the self-refresh frequency, which means that the self-refresh frequency is longer. Renewal; the higher the temperature, the higher the self-refresh frequency, that is, the self-refresh is performed at a shorter interval. The DRAM is used to adjust the self-refresh frequency at different temperatures according to the temperature sensed by a temperature sensor inside. If the temperature difference between the sensed temperature and the actual temperature of the temperature sensor is too large, the data stored in the DRAM may be lost due to an inappropriate self-refresh frequency.
在評估該溫度感測器的實際感測溫度時,以往的測試環境方式需將該溫度感測器放入一特定溫度(例如90∘C)的測試環境中,待熱平衡之後,上下調整該測試環境的溫度,例如以該特定溫度上下調整各2∘C、4∘C、6∘C,甚至8∘C,用以找出該溫度感測器切換該自更新頻率的溫度點。然而,在測試環境過程中,每調整一次測試環境溫度都需等待2小時的熱平衡時間,而造成該溫度感測器的測試環境效率低落,並且該溫度感測器的實際感測溫度的解析度僅為±3∘C,換句話說,若該溫度感測器切換該自更新頻率的溫度點在該特定溫度±2∘C的區間內時,在測試環境過程中並無法有效偵測該溫度感測器切換該自更新頻率的溫度點。When evaluating the actual sensing temperature of the temperature sensor, the conventional test environment method needs to put the temperature sensor into a test environment with a specific temperature (for example, 90∘C), and adjust the test up and down after the heat balance The temperature of the environment, for example, adjust each 2∘C, 4∘C, 6∘C, or even 8∘C up and down with the specific temperature to find the temperature point at which the temperature sensor switches the self-renewal frequency. However, in the test environment process, each time the test environment temperature is adjusted, it needs to wait for 2 hours of thermal equilibrium time, which causes the test environment of the temperature sensor to be inefficient, and the resolution of the actual temperature sensing of the temperature sensor Only ±3∘C, in other words, if the temperature point at which the temperature sensor switches the self-refresh frequency is within the range of ±2∘C of the specific temperature, the temperature cannot be effectively detected during the test environment The sensor switches the temperature point of the self-renewal frequency.
依據本發明一實施例之一溫度感測器的評估方法,該溫度感測器設置於一記憶體裝置內,且該溫度感測器包括一比較器、一分壓器、一二極體及一帶隙參考電壓源,該帶隙參考電壓源供電予該分壓器及該二極體,該比較器將該二極體產生隨溫度變化的一感溫參考電壓與該分壓器產生的複數分壓電壓進行比較;該評估方法包括:對預設的複數檢測溫度,在大於一既定溫度的該等檢測溫度中的一第一檢測溫度下,將該帶隙參考電壓源校準至一目標電壓,該分壓器依據該目標電壓輸出該等複數分壓電壓,且以該比較器對該等複數分壓電壓與該感溫參考電壓進行比較,取得對應於該第一檢測溫度的一第一目標分壓電壓; 其中該第一目標分壓電壓對應於該等複數分壓電壓之第一者;改變該分壓器的該等分壓電壓之第一者,且以該比較器對該等分壓電壓之第一者與該感溫參考電壓進行比較,取得對應於該第一檢測溫度的一第一檢測電壓;透過該第一目標分壓電壓與該第一檢測電壓的一電壓差值,在該第一檢測溫度時,得到該溫度感測器的實際感測溫度與該第一檢測溫度的一第一溫度誤差值。According to an evaluation method of a temperature sensor according to an embodiment of the invention, the temperature sensor is disposed in a memory device, and the temperature sensor includes a comparator, a voltage divider, a diode and A bandgap reference voltage source, the bandgap reference voltage source supplies the voltage divider and the diode, and the comparator generates a temperature-sensing reference voltage that varies with temperature from the diode and the complex number generated by the voltage divider Comparing divided voltages; the evaluation method includes: calibrating the bandgap reference voltage source to a target voltage at a first detection temperature among the detection temperatures greater than a predetermined temperature , The voltage divider outputs the plurality of divided voltages according to the target voltage, and the comparator is used to compare the plurality of divided voltages with the temperature reference voltage to obtain a first corresponding to the first detected temperature A target divided voltage; wherein the first target divided voltage corresponds to the first of the plurality of divided voltages; the first of the divided voltages of the voltage divider is changed, and the comparator The first of the divided voltages is compared with the temperature-sensing reference voltage to obtain a first detected voltage corresponding to the first detected temperature; through a voltage difference between the first target divided voltage and the first detected voltage , At the first detected temperature, a first temperature error value between the actual sensed temperature of the temperature sensor and the first detected temperature is obtained.
第1圖為本發明實施例之溫度感測器方塊圖。如第1圖所示,一記憶體裝置或積體電路(例如DRAM)內的一溫度感測器100包括:一分壓器102、一比較器104、一帶隙參考電壓源106、一二極體108、一控制器110。分壓器102依據帶隙參考電壓源106所提供的電源,產生複數分壓電壓Vout[0:5],以6個分壓為例,包括Vout[0]~Vout[5]總共6個分壓。帶隙參考電壓源106亦可輸出一定電流116流經二極體108,而產生隨溫度變化的一感溫參考電壓112。比較器104將隨溫度變化的該感溫參考電壓112與分壓器102產生的複數分壓電壓Vout[0:5]進行比較,以偵測該溫度感測器所處測試環境的溫度。控制器110依據比較器104所輸出的比較結果,可控制該記憶體的自更新頻率。FIG. 1 is a block diagram of a temperature sensor according to an embodiment of the invention. As shown in FIG. 1, a
分壓器102具有可調整該等分壓電壓Vout[0:5]的阻抗構件,例如,分壓器102具有可調整電阻值的一可變電阻、或是搭配開關、熔絲與電阻的可調阻抗網路 (未圖示),藉由調整該可變電阻的電阻值,透過分壓原理,分壓器102係可改變該等分壓電壓Vout[0:5]。溫度感測器100的評估方法,包括:對預設的複數檢測溫度,在大於一既定溫度的一第一檢測溫度下,將帶隙參考電壓源106校準至一目標電壓,分壓器102依據該目標電壓輸出該等複數分壓電壓(Vout[0:5]),且以比較器104對該等複數分壓電壓(Vout[0:5])與該感溫參考電壓112進行比較,取得對應於該第一檢測溫度的一第一目標分壓電壓。其中,該第一目標分壓電壓對應於該等複數分壓之第一者(Vout[5])。The
第2圖為本發明實施例第1圖之感溫參考電壓112及複數檔位電壓Vout[0:5]的電壓-溫度曲線圖。如第2圖所示,舉例來說,假設在90∘C以上的測試環境溫度下,選擇了90∘C及120∘C二個溫度點作為溫度感測器100的檢測溫度。首先,在120∘C的檢測溫度下(亦即,該記憶體裝置在120∘C測試環境溫度下),將帶隙參考電壓源106校準至一目標電壓,分壓器102依據該目標電壓輸出該等複數分壓電壓(Vout[0:5])至比較器104而與感溫參考電壓112做比較,在120∘C時,藉由改變該等複數分壓之第一者(Vout[5])的電壓值,可得到其與感溫參考電壓112的交點,即點A。在點A時,該等複數分壓之第一者(Vout[5])的電壓值相等於該感溫參考電壓112的電壓值,並且得到與點A相對應的在120∘C時的一第一目標分壓電壓,即點B,例如約為500mV。在90∘C的檢測溫度下,改變該等複數分壓之第二者(Vout[4])的電壓值,可得到其與感溫參考電壓112的交點,即點C。在點C時,該等複數分壓之第二者(Vout[4])的電壓值相等於該感溫參考電壓112的電壓值,並且得到與點C相對應在90℃時的一第二目標分壓電壓,即點D,例如約為570mV。
FIG. 2 is a voltage-temperature graph of the temperature-
帶隙參考電壓源106之中,一般具有正溫度係數區塊及負溫度係數區塊(未圖示)。其中,該正溫度係數電路區塊中的電路阻抗隨著溫度的上升而升高;該負溫度係數電路區塊中的電路阻抗隨著溫度的升高而降低。在本實施例中,藉由調整帶隙參考電壓源106中的正溫度係數電路區塊及/或負溫度係數電路區塊,用以校準該等複數分壓電壓Vout[0:5],使得該等複數分壓電壓Vout[0:5]在預設的該等複數檢測溫度時,不因溫度變化的影響而發生電壓偏移。
The bandgap
帶隙參考電壓源106包括一電流源114,該電流源114輸出一定電流116流經二極體108,而產生隨溫度變化的該感溫參考電壓。藉由調整流經二極體108的定電流116的大小,亦可改變該感溫參考電壓的電壓-溫度變化斜率,進而改變溫度感測器100的靈敏度;其中,感溫參考電壓112的電壓值是隨著溫度的升高而降低。舉例來說,藉由增加定電流116的電流大小,使得流經二極體108的電流變大,讓該感溫參考電壓的電壓-溫度變化斜率變大,溫度感測器100的靈敏度因此隨之變大。其中,該感溫參考電壓係基於溫度感測器100的靈敏度需求而設定,亦或依據實體元件的電壓-溫度變化特性而設定在本實施例,該感溫參考電壓的該電壓-溫度變化斜率,係為二極體108的跨壓對溫度變化的斜率(約-2mV/℃)。
The bandgap
溫度感測器100的評估方法更利用一雷射維修(laser repair)裝置(未圖示),在大於該既定溫度的該至少一第一檢測溫度下,依據該目標分壓電壓對帶隙參考電壓源106中的該正溫度係數電路區塊及/或負溫度係數電路區塊內的熔絲(fuse)執行燒斷的動作,使得溫度感測器100的感測溫度得以接近於該至少一第一檢測溫度。舉例來說,在120∘C的測試環境中,該雷射維修裝置依據第2圖中的該第一目標分壓電壓(點B, 500mV),對該正溫度係數電路區塊及/或負溫度係數電路區塊內的熔絲(fuse)執行燒斷的動作,進而影響該等複數分壓電壓(Vout[0:5])的電壓-溫度特性。不同的該等目標分壓電壓係可對應於在該正溫度係數電路區塊及/或負溫度係數電路區塊內不同的熔絲。因此在120∘C的測試環境時,藉由執行熔絲燒斷可使得該該等複數分壓電壓之第一者(Vout[5])在120∘C時被設定為500mV,亦即將該等複數分壓電壓之第一者(Vout[5])於120∘C時的電壓固定。在其他的檢測溫度下亦可執行相同動作以調校該該等複數分壓電壓(Vout[0:5])。換句話說,該熔絲燒斷的動作係在120∘C的測試環境中校準該該等複數分壓電壓之第一者(Vout[5]),故可使得溫度感測器100的感測溫度得以接近於120∘C的檢測溫度。The evaluation method of the
接著,在大於該既定溫度的該等檢測溫度中的該至少一第一檢測溫度下,由該記憶體或溫度感測器100內的帶隙參考電壓源106供電給分壓器102及二極體108,並改變分壓器102的該等複數分壓電壓Vout[0:5],且比較器104對該等複數分壓電壓Vout[0:5]與該感溫參考電壓112進行比較,取得對應於該至少一第一檢測溫度的一第一檢測電壓;並且透過該第一目標分壓電壓與該第一檢測電壓的一電壓差值,在該至少一第一檢測溫度時,得到溫度感測器100的實際感測溫度與該至少一第一檢測溫度的一第一溫度誤差值。Then, at the at least one first detection temperature among the detection temperatures greater than the predetermined temperature, the
舉例來說,假設在90∘C以上的測試環境溫度下,選擇了90∘C及120∘C二個溫度點作為溫度感測器100的檢測溫度。如第2圖所示,首先,在120∘C的檢測溫度下,將帶隙參考電壓源106校準至一目標電壓,分壓器102依據該目標電壓而輸出該等複數分壓電壓Vout[0:5],藉由改變該等複數分壓電壓Vout[0:5],例如改變該等複數分壓電壓之第一者Vout[5]的變化範圍為500mV±20mV(例如由Vout[5]改變為Vout[5]’),而得到其與感溫參考電壓112的交點,即點A’。在點A’時,該等複數分壓電壓之第一者Vout[5]’的電壓值相等於該感溫參考電壓112的電壓值,並且得到與點A’相對應的一第一檢測電壓,即點B’。 點A’所對應的第一檢測電壓B’約為520mV。第一目標分壓電壓B(500mV)與第一檢測電壓B’的差值為20mV,由於感溫參考電壓112的電壓-溫度變化斜率為-2mV/∘C,因此可得到溫度感測器100的實際感測溫度比120∘C的檢測溫度還要小10∘C,亦即110∘C(第2圖點A’所對應的感測溫度110∘C)。同理,在90∘C的檢測溫度下,亦改變該等複數分壓電壓Vout[0:5]的電壓值,例如改變該等複數分壓電壓之第二者Vout[4]的變化範圍為570mV±20mV,而得到其與感溫參考電壓112的交點。因此,亦可透過改變該等複數分壓之第二者(Vout[4])的電壓值而得到溫度感測器100的第二檢測電壓。For example, suppose that under the test environment temperature of 90∘C or more, two temperature points of 90∘C and 120∘C are selected as the detection temperature of the
在得到每一第一檢測溫度時的每一檢測電壓後,透過該目標分壓電壓與該檢測電壓的一電壓差值,在該至少一第一檢測溫度時,得到該溫度感測器的實際感測溫度與該至少一第一檢測溫度的一溫度誤差值。舉例來說,在120∘C測試環境溫度時,假設所取得的該目標分壓電壓為570mV、該檢測電壓為580mV,該電壓差值為10mV,假設感溫參考電壓112的電壓-溫度變化率為-2mV/∘C,則表示溫度感測器100的實際感測溫度比120∘C的測試環境溫度還要再低5∘C,換句話說,溫度感測器100的實際感測溫度為115∘C。After obtaining each detection voltage at each first detection temperature, through a voltage difference between the target divided voltage and the detection voltage, at the at least one first detection temperature, the actual temperature sensor is obtained A temperature error value between the sensed temperature and the at least one first detected temperature. For example, when testing the ambient temperature at 120∘C, it is assumed that the target divided voltage obtained is 570mV, the detection voltage is 580mV, the voltage difference is 10mV, and the voltage-temperature change rate of the
以檢測溫度120∘C為例,在該溫度感測器100的測試過程中,透過改變該等複數分壓電壓Vout[0:5],無需實際將測試環境溫度調整為115∘C ~125∘C,省去了等待熱平衡的時間,改善了溫度感測器100的測試效率,亦藉由得到該檢測電壓,用以精確地得知溫度感測器100的實際感測溫度,進而設定與該實際感測溫度相對應的該記憶體的自更新週期。Taking the detection temperature of 120∘C as an example, during the test of the
在本實施例中,在得知高於該既定溫度的每一第一檢測溫度時的每一檢測電壓後,該控制器110藉由溫度誤差值得知實際感測溫度,進而得知自更新周期,並用以更新該記憶體的該自更新週期。舉例來說,如第2圖所示,在點A時,120∘C時所對應的該等複數分壓電壓之第一者Vout[5]為500mV,並且設定相對應的自更新週期16ms;而在點C時,90∘C時所對應的該等複數分壓電壓之第二者Vout[4]為570mV,並且設定相對應的自更新週期32ms。換句話說,依據上述設定,該記憶體在高於120∘C的測試環境下,其自更新週期會是16ms,而在高於90∘C且不高於120∘C的測試環境下,其自更新週期會是32ms。因此,可達成根據不同溫度而有不同的自更新頻率的目的。In this embodiment, after knowing each detection voltage at each first detection temperature higher than the predetermined temperature, the
在完成高於該既定溫度的高溫測試環境下的溫度感測器100的準確度評估之後,接著,在低於該既定溫度(例如低於90∘C)的低溫或常溫測試環境下,繼續執行以取得對應於每一第二檢測溫度的一第二檢測電壓。其中該第二檢測溫度係小於該第一檢測溫度。該檢測電壓的量測方式係與上述第[0012]~[0014]段相同,故不再贅述。After completing the accuracy evaluation of the
原有的溫度感測器100之準確度評估方式,係會將複數記憶體中的每一溫度感測器在每一檢測溫度下,取±2∘C、±4∘C總共5個溫度點去評估溫度感測器的實際感測溫度的集中性。其中,所述集中性為在複數記憶體中的每一記憶體內的一溫度感測器彼此之間的集中性。本發明所提供的溫度感測器100的評估方法,可省去上述±2∘C、±4∘C總共4個溫度點皆需等2小時的熱平衡時間,故總共節省了80%的評估時間。並且由於二極體108的跨壓對溫度變化的斜率約為-2mV/∘C,因此可以更精確地計算出溫度感測器100的實際感測溫度,並且評估複數記憶體中的每一記憶體內的一溫度感測器彼此之間實際感測溫度的的集中性。The accuracy evaluation method of the
第3圖為本發明實施例第1圖之溫度感測器100評估方法的流程圖。如第3圖所示,在大於一既定溫度的一第一檢測溫度下, 將帶隙參考電壓源106校準至一目標電壓,並且分壓器102依據該目標電壓輸出複數分壓電壓(Vout[0:5])(S300),以該溫度感測器100內的一比較器104對該等複數分壓電壓(Vout[0:5])與一感溫參考電壓112進行比較,取得對應於該第一檢測溫度的一第一目標分壓電壓(S302)。
FIG. 3 is a flowchart of the
利用一雷射維修裝置,在大於該既定溫度的該第一檢測溫度下,依據該第一目標分壓電壓對一帶隙參考電壓源106中的一正溫度係數電路區塊及/或負溫度係數電路區塊內的熔絲執行燒斷的動作,使得該溫度感測器100的感測溫度得以接近於該第一檢測溫度(S304)。之後,在大於該既定溫度中的該第一檢測溫度下,改變分壓器102的該等複數分壓電壓之第一者(Vout[5])(S306)。該比較器104對該等複數分壓電壓之第一者(Vout[5])與該感溫參考電壓112進行比較,取得對應於該第一檢測溫度的一第一檢測電壓(S308)。透過該第一目標分壓電壓與該第一檢測電壓的一電壓差值,在該第一檢測溫度時,得到該溫度感測器100的實際感測溫度與該第一檢測溫度的一第一溫度誤差值(S310)。透過比較在該第一檢測溫度時的該溫度誤差值,可以更精確地計算出溫度感測器100的實際感測溫度。上述步驟S300~S310的詳細內容已描述於第[0008]~[0016]段,故不再贅述。
Using a laser maintenance device, at the first detected temperature that is greater than the predetermined temperature, a positive temperature coefficient circuit block and/or a negative temperature coefficient in a bandgap
雖然本發明的實施例如上述所描述,我們應該明白上述所呈現的只是範例,而不是限制。依據本實施例上述示範實施例的許多改變是可以在沒有違反發明精神及範圍下被執行。因此,本發明的廣度及範圍不該被上述所描述的實施例所限制。更確切地說,本發明的範圍應該要以以下的申請專利範圍及其相等物來定義。 Although the embodiments of the present invention are described above, we should understand that the above presented are only examples, not limitations. Many of the changes of the above-described exemplary embodiments according to this embodiment can be implemented without violating the spirit and scope of the invention. Therefore, the breadth and scope of the present invention should not be limited by the embodiments described above. More specifically, the scope of the present invention should be defined by the following patent applications and their equivalents.
100:溫度感測器 100: temperature sensor
102:分壓器 102: voltage divider
104:比較器 104: Comparator
106:帶隙參考電壓源 106: Bandgap reference voltage source
108:二極體 108: Diode
110:控制器 110: controller
112:感溫參考電壓 112: Temperature reference voltage
Vout[0:5]:複數分壓電壓 Vout[0:5]: complex divided voltage
Vout[5]、Vout[5]’:複數分壓電壓之第一者 Vout[5], Vout[5]’: the first of complex voltage division
Vout[4]:複數分壓電壓之第二者 Vout[4]: the second of complex voltage division
114:電流源 114: current source
116:定電流 116: constant current
A、A’、B、B’、C、D:點 A, A’, B, B’, C, D: point
第1圖為本發明實施例之溫度感測器100方塊圖。
第2圖為本發明實施例第1圖之感溫參考電壓112及複數分壓電壓Vout[0:5]的電壓-溫度曲線圖。
第3圖為本發明實施例第1圖之溫度感測器100評估方法的流程圖。
FIG. 1 is a block diagram of a
100:溫度感測器 100: temperature sensor
102:分壓器 102: voltage divider
104:比較器 104: Comparator
106:帶隙參考電壓源 106: Bandgap reference voltage source
108:二極體 108: Diode
110:控制器 110: controller
112:感溫參考電壓 112: Temperature reference voltage
Vout[0:5]:複數分壓電壓 Vout[0:5]: complex divided voltage
114:電流源 114: current source
116:定電流 116: constant current
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