TWI687291B

TWI687291B - Triple handling forks robot structure and angle monitoring module thereof

Info

Publication number: TWI687291B
Application number: TW107135374A
Authority: TW
Inventors: 廖崇文; 陳茂全; 蘇啟郎
Original assignee: 聚昌科技股份有限公司
Priority date: 2018-10-08
Filing date: 2018-10-08
Publication date: 2020-03-11
Also published as: TW202014279A

Abstract

The present invention provides a triple handling forks robot structure, which comprises: a support frame having a slide rail arranged on the inner side; a lifting module having a lifting seat that can be slid up and down to be coupled to the sliding rail; a rotating module having a rotating rod horizontally mounted on the lifting seat; and an arm module having an arm frame fixed to the top end of the rotating rod. A first fork; a second fork and a third fork are all in the shape of a plate and are parallel to each other in parallel and telescopically slidably coupled to the arm frame. By the practice of the present invention, at least the problem of improving film thickness uniformity can be achieved.

Description

三重托叉式之機械手臂結構及其角度監測模組 Three-fold fork type mechanical arm structure and its angle monitoring module

本發明為一種三重托叉式之機械手臂結構及其角度監測模組，其特別為一種應用於半導體光阻塗佈顯影機中，對晶圓片進行搬移之三重托叉式之機械手臂及其手臂模組/吸附式牙叉臂/托夾式牙叉臂結構。 The invention is a triple fork-type mechanical arm structure and its angle monitoring module, which is especially a triple fork-type mechanical arm and its application in semiconductor photoresist coating and developing machine to move wafers and its Arm module/adsorption type fork arm/support clip type fork arm structure.

如第1A圖至第1B圖所示，有關半導體的製造技術，在黃光製程中，光阻塗佈機可說是第一站，因此塗佈機的穩定及均勻性，可說是決定製程良莠的首站關卡。為了達到自動化生產，一般均藉由塗佈機加以大量生產及製造，而塗佈機內設有雙牙叉臂的機械手臂P100，其具有一第一牙叉臂310及一第二牙叉臂320，又每一牙叉臂設有一晶圓片托盤。 As shown in Figures 1A to 1B, regarding the semiconductor manufacturing technology, in the yellow light process, the photoresist coating machine can be said to be the first station, so the stability and uniformity of the coating machine can be said to determine the process Liangju's first stop. In order to achieve automated production, it is generally mass-produced and manufactured by a coating machine, and the coating machine is equipped with a double-prong arm mechanical arm P100, which has a first fork arm 310 and a second fork arm 320, and each fork arm is provided with a wafer tray.

塗佈機內依照製程的順序，大致設有一卡匣模組(CST)，用以在常溫下存放晶圓片900；一對位模組(ALN)，用以在常溫下使被搬運的晶圓片900設定正確的位置；一塗佈模組(COT/DEV)，一般在23℃的溫度下對晶圓片900進行鍍膜作業；一加熱模組(HPL)，一般在120℃的溫度下對鍍膜後的晶圓片900加熱，以使鍍膜固化成型；固化後的晶圓片900又會再次放回卡匣模組(CST)，以便後續的搬運。 In the coating machine, according to the order of the process, there is roughly a cassette module (CST) for storing wafers 900 at room temperature; a pair of alignment modules (ALN) for crystals to be transported at room temperature The wafer 900 is set to the correct position; a coating module (COT/DEV), which generally coats the wafer 900 at a temperature of 23°C; a heating module (HPL), generally at a temperature of 120°C Correct The coated wafer 900 is heated to cure the coated film; the cured wafer 900 is put back into the cassette module (CST) again for subsequent handling.

如第2圖所示，而上述的製程中，所有晶圓片900的搬運，都必須藉由機器手臂P100加以完成。目前習知的機器手臂P100，均使用雙牙叉臂的機械手臂；又在作業的安排上，兩隻牙叉臂必須頻繁進出塗佈模組(23℃)及加熱模組(120℃)，使得兩隻牙叉臂310,320隨著進出的次數增加，不斷的產生升溫現象。累積在兩支牙叉臂上的溫度，也造成不同時期被搬運晶圓片900，產生不同的溫度影響。 As shown in FIG. 2, in the above process, all wafers 900 must be transported by the robot arm P100. At present, the conventional robot arm P100 uses a mechanical arm with double tines. In the arrangement of operations, the two tines must frequently enter and exit the coating module (23℃) and the heating module (120℃). As a result, the two fork arms 310 and 320 continuously increase in temperature as the number of entry and exit increases. The temperature accumulated on the two fork arms also causes the wafer 900 to be transported at different times, resulting in different temperature effects.

經過實際檢測，習知製程使用雙牙叉臂機械手臂時，針對一卡匣模組共25片晶圓片之每一片晶圓片其五個量測點，中央(Center)、底側(Bottom)、右側(Right)、左側(Left)、及頂側(Top)進行膜厚量測，發現當製作到第8片晶圓片時，在上述各量測點的膜厚(Thickness)，開始產生了嚴重的膜厚不一致性，這對後續元件的製做，在良率上也將造成嚴重的影響。 After actual inspection, when the conventional manufacturing process uses a double-wish-arm mechanical arm, it has five measurement points for each wafer of 25 wafers in a cassette module, Center and Bottom. ), the right side (Right), the left side (Left), and the top side (Top) film thickness measurement, found that when the eighth wafer is produced, the film thickness (Thickness) at each measurement point above, start A serious film thickness inconsistency is generated, which will also have a serious impact on the yield of subsequent components.

造成上述膜厚不一致所產生的均勻性(Uniformity)問題，其主要的原因是因為習知使用兩支牙叉臂310,320進行全流程的搬運，牙叉臂310,320被加工後的熱晶圓片持續加熱後，造成後續待鍍膜晶圓片，在搬運過程中就開始被具有餘熱之牙叉臂所加熱，導致進塗佈模組(COT/DEV)的晶圓片，其表面温度已經被熱的牙叉臂310,320所影響，以致塗佈模組生產的晶圓片膜厚均勻度(U%)也受到嚴重的影響。因此如何有效克服膜厚不一致的問題，已經成為半導體製程中一項重要的課題。 The main reason for the uniformity (Uniformity) problem caused by the above-mentioned film thickness inconsistency is that it is known to use two fork arms 310, 320 for the whole process of transportation, and the fork arms 310, 320 are continuously heated by the processed hot wafer After that, the wafers to be coated later are heated by the fork arm with residual heat during the transportation process, resulting in the wafers entering the coating module (COT/DEV) whose surface temperature has been heated by the teeth. The fork arms 310 and 320 are affected, so that the uniformity (U%) of the film thickness of the wafer produced by the coating module is also seriously affected. Therefore, how to effectively overcome the problem of inconsistent film thickness has become an important issue in the semiconductor manufacturing process.

本發明為一種三重托叉式之機械手臂結構及其角度監測模組，其主要是要解決機械手臂設計及使用上造成晶圓片生產時，膜厚不均勻、水平旋轉位置不精準、晶圓片夾持不當及機械手臂維修不易…等問題。 The invention is a triple fork-type mechanical arm structure and its angle monitoring module, which is mainly to solve the problem of uneven film thickness, inaccurate horizontal rotation position and wafers during wafer production caused by the design and use of the mechanical arm Problems such as improper clamping of the film and maintenance of the robot arm are not easy.

本發明提供一種三重托叉式之機械手臂結構，其包括：一支撐框架，其內側設有一滑軌；一升降模組，其具有一升降座，又藉由一升降驅動單元之驅動，使升降座可上、下滑動的結合於滑軌；一旋轉模組，其具有一旋轉桿，又藉由一水平旋轉驅動單元之驅動，使旋轉桿可水平旋轉的設置於升降座上；以及一手臂模組，其具有：一手臂框架，其固設於旋轉桿之頂端；一第一牙叉臂，其藉由一第一驅動單元，伸縮滑動的結合於手臂框架；一第二牙叉臂，其藉由一第二驅動單元，伸縮滑動的結合於手臂框架；一第三牙叉臂，其藉由一第三驅動單元，伸縮滑動的結合於手臂框架；其中第一牙叉臂、第二牙叉臂、及第三牙叉臂均為一板狀且彼此上下平行並列之結構。 The invention provides a triple fork-type mechanical arm structure, which includes: a support frame with a slide rail inside; a lifting module with a lifting seat, which is driven by a lifting driving unit to make the lifting The seat can be combined with the slide rail up and down; a rotating module with a rotating rod, which is driven by a horizontal rotating drive unit, so that the rotating rod can be horizontally arranged on the lifting seat; and an arm The module has: an arm frame fixed on the top of the rotating rod; a first prong arm, which is telescopically coupled to the arm frame by a first drive unit; a second prong arm, It is telescopically coupled to the arm frame by a second drive unit; a third prong arm is telescopically coupled to the arm frame by a third drive unit; wherein the first prong arm and the second The tine fork arm and the third tine fork arm are both a plate-like structure parallel to each other up and down.

本發明又提供一種角度監測模組，其係應用於上述之一種三重托叉式之機械手臂結構中，又角度監測模組具有：一旋轉位置件，其係固設於一旋轉桿一側；以及複數個位置感測件，其係設置於旋轉桿之旋轉半徑上，當任一位置感測件與旋轉位置件產生重疊時，產生一位置訊號。 The invention also provides an angle monitoring module, which is applied to the above-mentioned three-fold fork type mechanical arm structure, and the angle monitoring module has: a rotating position piece, which is fixed on a side of a rotating rod; And a plurality of position sensing elements, which are arranged on the rotation radius of the rotating rod, and when any position sensing element overlaps with the rotating position element, a position signal is generated.

藉由本發明之實施，至少可以達成下列之進步功效： Through the implementation of the present invention, at least the following improved effects can be achieved:

一、可以有效的改善膜厚不均勻的問題。 1. It can effectively improve the problem of uneven film thickness.

二、可以精準監控旋轉桿及機械手臂的水平旋轉位置。 Second, it can accurately monitor the horizontal rotation position of the rotating rod and the mechanical arm.

三、可以穩固有效的夾持晶圓片並進行搬移。 3. It can firmly and effectively hold the wafer and move it.

四、可以更方便的使機械手臂平移，以方便維修。 4. The robot arm can be moved more conveniently to facilitate maintenance.

為了使任何熟習相關技藝者了解本發明之技術內容並據以實施，且根據本說明書所揭露之內容、申請專利範圍及圖式，任何熟習相關技藝者可輕易的理解本發明相關之目的及優點，因此將在實施方式中詳細敘述本發明之詳細特徵以及優點。 In order to let any person skilled in the art understand the technical content of the present invention and implement it accordingly, and according to the content, patent application scope and drawings disclosed in this specification, any person skilled in the art can easily understand the purpose and advantages related to the present invention Therefore, the detailed features and advantages of the present invention will be described in detail in the embodiments.

P100:習知雙牙叉臂的機械手臂 P100: The mechanical arm of the conventional double-wish-fork arm

100:三重托叉式之機械手臂結構 100: Triple-arm type robot arm structure

10:支撐框架 10: Support frame

110:滑軌 110: Slide rail

20:升降模組 20: Lifting module

210:升降座 210: Lifting seat

211:升降驅動單元 211: Lifting drive unit

212:升降螺桿 212: Lifting screw

25:旋轉模組 25: Rotating module

220:旋轉桿 220: Rotating rod

221:水平旋轉驅動單元 221: Horizontal rotation drive unit

230:角度監測模組 230: Angle monitoring module

231:旋轉位置件 231: Rotating position piece

232:位置感測件 232: Position sensor

233:歸位感測件 233: Homing sensor

234:正角度位置感測件 234: Positive angle position sensor

235:負角度位置感測件 235: Negative angle position sensor

30:手臂模組 30: Arm module

301:手臂框架 301: Arm frame

302:平行滑軌 302: parallel rail

310:第一牙叉臂 310: The first fork arm

311:第一驅動單元 311: First drive unit

320:第二牙叉臂 320: second fork arm

321:第二驅動單元 321: Second drive unit

330:第三牙叉臂 330: Third fork arm

331:第三驅動單元 331: Third drive unit

340:散熱模組 340: Cooling module

341:複數個開孔 341: plural openings

350:晶圓片感測單元 350: Wafer sensing unit

360:吸附式牙叉臂 360: adsorption fork arm

361:托盤 361: Tray

362:支撐件 362: Support

363:真空吸附件 363: vacuum suction parts

364:吸氣孔 364: suction hole

365:環狀吸氣槽 365: annular suction trough

366:連通氣槽 366: Connect the air tank

370:托夾式牙叉臂 370: Bracket type fork arm

371:托夾部 371: Holder

372:檔塊托盤 372: Block tray

373:伸縮夾 373: Telescopic clip

374:檔塊 374: Block

375:夾持塊 375: clamping block

376:汽壓缸 376: Cylinder

380:冷卻流道 380: cooling runner

390:噴氣單元 390: Jet unit

391:氣體流道 391: Gas channel

392:噴氣口 392: Jet port

40:控制單元 40: control unit

50:維修模組 50: maintenance module

510:底盤 510: Chassis

520:頂盤 520: Top plate

530:平移滑軌 530: Pan slide

540:防滑卡塊 540: Non-slip card block

550:手動閥 550: Manual valve

560:頂升氣缸 560: jacking cylinder

900:晶圓片 900: Wafer

CST:卡匣模組 CST: cassette module

ALN:對位模組 ALN: alignment module

COT/DEV:塗佈模組 COT/DEV: coating module

HPL:加熱模組 HPL: heating module

M:伺服馬達 M: servo motor

B:皮帶 B: belt

HOME:初始位置 HOME: initial position

[第1A圖]為習知之一種雙牙叉臂的機械手臂之側視圖；[第1B圖]為習知雙牙叉臂應用於塗佈機之製程循序圖；[第2圖]為習知以雙牙叉臂搬運晶圓片產生不同膜厚及均勻性之檢測圖；[第3圖]為本發明之一種三重托叉式之機械手臂實施例圖；[第4圖]為本發明之一種升降模組實施例圖；[第5圖]為本發明之一種旋轉模組角度監測模組實施例圖；[第5A圖]為本發明之一種角度監測模組實施例圖；[第6圖]為本發明之一種手臂模組之分解實施例圖；[第7A圖]為本發明之一種吸附式牙叉臂之施例圖；[第7B圖]為本發明之一種托夾式牙叉臂之施例圖；[第8A圖]為本發明之一種具有冷卻流道及氣道之吸附式牙叉臂施例圖；[第8B圖]為本發明之一種具有冷卻流道及氣道之托夾式牙叉臂之施例圖；[第9圖]為習知與本發明機械手臂應用於塗佈機製程之循序對照施例圖；[第10圖]為習知與本發明機械手臂之膜厚及均勻性檢測對照圖； [第11圖]為使用習知與本發明機械手臂之塗佈機製程效能對照圖；[第12A圖]為本發明之一種維修模組立體實施例圖；[第12B圖]為本發明之一種維修模組分解實施例圖；[第12C圖]為本發明之一種維修模組鎖固狀態實施例圖；以及[第13圖]為本發明之一種電路架構實施例圖。 [Picture 1A] is a side view of a conventional double-wish-fork arm mechanical arm; [Picture 1B] is a sequential diagram of the conventional double-wish-fork arm applied to a coating machine; [Picture 2] is a conventional The inspection graphs of different film thickness and uniformity are produced when the wafers are transported by the double-pronged fork arms; [Picture 3] is an embodiment of a three-fold fork-type robot arm of the invention; [Picture 4] is the invention An embodiment diagram of a lifting module; [Figure 5] is an embodiment diagram of a rotation module angle monitoring module of the present invention; [Figure 5A] is an embodiment diagram of an angle monitoring module of the present invention; [第6 [Figure 7] is an exploded embodiment diagram of an arm module of the present invention; [Figure 7A] is an embodiment diagram of an adsorption fork arm of the present invention; [Figure 7B] is a bracket-type tooth of the present invention [Picture 8A] is an embodiment of an adsorption tine fork arm with cooling flow channels and air channels; [Picture 8B] is a embodiment of the invention having cooling flow channels and air channels Example drawing of the bracket-type fork arm; [Figure 9] is a sequential comparison example of the application of the mechanical arm of the conventional and the present invention to the coating mechanism; [Figure 10] is the mechanical arm of the conventional and the present invention Comparison chart of film thickness and uniformity detection; [Figure 11] is a comparison chart of the coating mechanism performance of the conventional and the robot arm of the present invention; [Figure 12A] is a three-dimensional embodiment of a maintenance module of the present invention; [Figure 12B] is the present invention A diagram of an exploded embodiment of a maintenance module; [Figure 12C] is a diagram of an embodiment of a locked state of a maintenance module of the present invention; and [Figure 13] is a diagram of an embodiment of a circuit architecture of the present invention.

如第3圖所示，本發明提供一種三重托叉式之機械手臂結構100，其包括：一支撐框架10；一升降模組20；以及一手臂模組30。 As shown in FIG. 3, the present invention provides a triple-arm type robot arm structure 100, which includes: a support frame 10; a lifting module 20; and an arm module 30.

手臂模組30，其又具有：一手臂框架301；一第一牙叉臂310；一第二牙叉臂320；以及一第三牙叉臂330。其中第三牙叉臂330負責對位模組(ALN)與塗佈模組(COT/DEV)間之晶圓片900搬運，藉此以漸少牙叉臂310,320,330上之餘熱，造成製程上晶圓片900膜厚均勻性不佳的問題。 The arm module 30 further includes: an arm frame 301; a first fork arm 310; a second fork arm 320; and a third fork arm 330. Among them, the third fork arm 330 is responsible for the wafer 900 transfer between the alignment module (ALN) and the coating module (COT/DEV), thereby reducing the residual heat on the fork arm 310, 320, 330, causing the process to go up The problem of poor uniformity of film thickness of wafer 900.

如第3圖所示，支撐框架10，其主要是作為整個機械手臂之支撐結構，支撐框架10之一內側設有一滑軌110，用以引導升降模組20進行上、下移動。 As shown in FIG. 3, the supporting frame 10 is mainly used as a supporting structure of the entire robot arm. A slide rail 110 is provided inside one of the supporting frames 10 to guide the lifting module 20 to move up and down.

如第4圖所示，升降模組20，其具有一升降座210，又升降座210藉由一升降驅動單元211之驅動，例如是一伺服馬達M藉由皮帶B驅動一升降螺桿212，然後使升降座210可上、下滑動的結合於滑軌110。當升降驅動單元211，其使升降座210完成上、下滑動時，整個機械手臂100也同時完成上、下移動之動作。 As shown in FIG. 4, the lifting module 20 has a lifting seat 210, and the lifting seat 210 is driven by a lifting driving unit 211, for example, a servo motor M drives a lifting screw 212 by a belt B, and then The lifting base 210 can be combined with the slide rail 110 to slide up and down. When the lifting drive unit 211 causes the lifting base 210 to slide up and down, the entire robot arm 100 also completes the movement of moving up and down at the same time.

如第5圖所示，旋轉模組25，其具有一旋轉桿220，其可水平旋轉的設置於升降座210上；旋轉桿220其藉由一水平旋轉驅動單元221之驅動，例如是一伺服馬達M驅動一皮帶B然後又帶動旋轉桿220旋轉，進而使整個機械手臂100完成水平旋轉動作。 As shown in FIG. 5, the rotating module 25 has a rotating rod 220 which can be horizontally rotatably arranged on the lifting base 210; the rotating rod 220 is driven by a horizontal rotating driving unit 221, such as a servo The motor M drives a belt B and then drives the rotating rod 220 to rotate, so that the entire robot arm 100 completes the horizontal rotating motion.

如第5A圖所示，為了有效的完成鍍膜機的調校及控制，因此有必要掌握或控制機械手臂100其旋轉位置狀態；因此、旋轉桿220可進一步設有一角度監測模組230，角度監測模組230其具有：一旋轉位置件231；以及複數個位置感測件232。 As shown in FIG. 5A, in order to effectively complete the adjustment and control of the coating machine, it is necessary to grasp or control the rotation position of the robot arm 100; therefore, the rotation rod 220 may be further provided with an angle monitoring module 230, angle monitoring The module 230 has: a rotating position member 231; and a plurality of position sensing members 232.

旋轉位置件231，其係固設於旋轉桿220一側，旋轉位置件231將隨著旋轉桿220進行同步旋轉；此外、旋轉位置件231又配合設置於旋轉桿220旋轉半徑上的複數個位置感測件232，當任一位置感測件232與旋轉位置件231產生重疊或訊號耦合時，即可以藉由例如磁感應或光電訊號之檢測，而產生一位置訊號。 The rotating position member 231 is fixedly arranged on the side of the rotating rod 220, and the rotating position member 231 will rotate synchronously with the rotating rod 220; in addition, the rotating position member 231 cooperates with a plurality of positions provided on the rotating radius of the rotating rod 220 The sensing element 232, when any position sensing element 232 overlaps with the rotating position element 231 or signals are coupled, a position signal can be generated by, for example, magnetic induction or photoelectric signal detection.

上述之位置感測件232，可以包括一機械手臂回到初始位置，用以偵測一歸位訊號(HOME)的歸位感測件233，或一正角度位置的正角度位置感測件234，或者一負角度位置的負角度位置感測件235；藉由上述位置訊號，即可達到有效操作機械手臂100，及使機械手臂100操作在安全範圍的目的。 The above position sensor 232 may include a robot arm returning to the initial position to detect a home signal (HOME) of the home sensor 233 or a positive angle position sensor 234 , Or a negative angle position sensor 235 of a negative angle position; with the above position signal, the purpose of effectively operating the robot arm 100 and operating the robot arm 100 within a safe range can be achieved.

如第6圖所示，手臂模組30，其具有：一手臂框架301；一第一牙叉臂310；一第二牙叉臂320；以及一第三牙叉臂330。藉由手臂框架301，可以有效的使第一牙叉臂310、第二牙叉臂320、以及第三牙叉臂330獲得穩固的結構支撐，同時也能穩定的運作。 As shown in FIG. 6, the arm module 30 has: an arm frame 301; a first fork arm 310; a second fork arm 320; and a third fork arm 330. With the arm frame 301, the first fork arm 310, the second fork arm 320, and the third fork arm 330 can be effectively supported with stable structure, and can also operate stably.

手臂框架301，其固設於旋轉桿220之頂端，因此手臂框架301會隨著旋轉桿220進行同步旋轉；手臂框架301其內部設有三組平行滑軌302，分別用以與第一牙叉臂310、第二牙叉臂320、及第三牙叉臂330結合。又第一牙叉臂310、第二牙叉臂320、及第三牙叉臂330，其均為一板狀且彼此上、下平行並列之結構。 The arm frame 301 is fixed on the top of the rotating rod 220, so the arm frame 301 rotates synchronously with the rotating rod 220; the arm frame 301 is provided with three sets of parallel slide rails 302 inside, which are respectively used for the first fork arm 310, the second fork arm 320, and the third fork arm 330 are combined. The first fork arm 310, the second fork arm 320, and the third fork arm 330 are all plate-shaped structures that are parallel to each other.

第一牙叉臂310、第二牙叉臂320、及第三牙叉臂330係分別以一第一驅動單元311、一第二驅動單元321、及一第三驅動單元331，例如是一伺服馬達M驅動一皮帶B，然後又分別帶動第一牙叉臂310、第二牙叉臂320、及第三牙叉臂330，於該些平行滑軌302內保持水平又可伸縮的滑動。 The first fork arm 310, the second fork arm 320, and the third fork arm 330 are respectively a first driving unit 311, a second driving unit 321, and a third driving unit 331, such as a servo The motor M drives a belt B, and then drives the first fork arm 310, the second fork arm 320, and the third fork arm 330, respectively, to maintain a horizontal and telescopic slide in the parallel slide rails 302.

為了讓第一牙叉臂310、第二牙叉臂320、及第三牙叉臂330，有更好的散熱效果，因次在第二牙叉臂320之托盤與第三牙叉臂330之托盤間，可進一步設置一散熱模組340，又散熱模組340可以是一平板，又平板具有複數個開孔341；藉此、散熱模組340不但能阻隔牙叉臂間的熱傳導或熱輻射，也可以使塗佈機台內部之下降氣流，能快速的穿過散熱模組340進行降溫。 In order to allow the first fork arm 310, the second fork arm 320, and the third fork arm 330 to have a better heat dissipation effect, the second fork arm 320 tray and the third fork arm 330 Between the trays, a heat dissipation module 340 can be further provided, and the heat dissipation module 340 can be a flat plate, and the flat plate has a plurality of openings 341; thereby, the heat dissipation module 340 can not only block the heat conduction or heat radiation between the fork arms It can also make the downdraft inside the coating machine quickly pass through the cooling module 340 to cool down.

當手臂模組30於晶圓卡匣中取片時，為了精準的掌握每一卡匣內是否仍有晶圓片900的存在，因此在手臂模組30之取片側，可以設有一晶圓片感測單元350，其可以藉由例如紅外線或雷射之光學感測，辨識出卡匣內是否有待製作的晶圓片900。 When the arm module 30 takes a wafer in a wafer cassette, in order to accurately grasp whether there is still a wafer 900 in each cassette, a wafer can be provided on the side of the arm module 30 The sensing unit 350 can recognize whether there is a wafer 900 to be produced in the cassette by optical sensing such as infrared or laser.

第7A圖所示，吸附式牙叉臂360，為了穩固的夾持晶圓片900，第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330其可以為一吸附式牙叉臂360。 As shown in FIG. 7A, the suction fork arm 360, in order to firmly hold the wafer 900, the first fork fork arm 310, the second fork fork arm 320, or the third fork arm 330 may be a suction fork arm Fork arm 360.

吸附式牙叉臂360其係於第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330之端部形成具有一托盤361，又托盤361可以為一雙叉子狀平板。此外，托盤361可以設有複數個相對稱之支撐件362及複數個相對稱之真空吸附件363，以有效吸附晶圓片900。 The suction-type fork arm 360 is formed at the end of the first fork arm 310, the second fork arm 320, or the third fork arm 330 to have a tray 361, and the tray 361 may be a pair of fork-shaped flat plates. In addition, the tray 361 may be provided with a plurality of symmetric support members 362 and a plurality of symmetric vacuum suction members 363 to effectively adsorb the wafer 900.

真空吸附件363具有一吸氣孔364，將吸氣孔364藉由一管線進行抽氣，如此可以有效的吸附住晶圓片900。又真空吸附件363之頂面，可設有一環狀吸氣槽365，又環狀吸氣槽365與吸氣孔364係藉由至少一連通氣槽366相互連通。如此可以增加晶圓片900的吸附面積。 The vacuum suction element 363 has a suction hole 364, which is sucked through a pipeline to effectively suck the wafer 900. A vacuum suction groove 365 may be provided on the top surface of the vacuum suction member 363, and the circular suction groove 365 and the suction hole 364 are communicated with each other through at least one communication air groove 366. In this way, the adsorption area of the wafer 900 can be increased.

第7B圖所示，托夾式牙叉臂370，除了上述的吸附式牙叉臂360外，第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330亦可以為一托夾式牙叉臂370。 As shown in FIG. 7B, in addition to the above-mentioned suction-type fork arm 360, the bracket-type fork arm 370, the first fork arm 310, the second fork arm 320, or the third fork arm 330 may also be a托夹式牙叉臂370.

托夾式牙叉臂370，其同樣於第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330之端部，形成具有一托夾部371，又托夾部371具有：一檔塊托盤372；以及一伸縮夾373。 A bracket-type fork arm 370, which is also formed at the end of the first fork arm 310, the second fork arm 320, or the third fork arm 330, has a bracket portion 371, and the bracket portion 371 has : A block tray 372; and a telescopic clip 373.

檔塊托盤372，其可以為一雙叉子狀平板，用以托住晶圓片900，又於每一叉子端部設有一檔塊374，以防止晶圓片900滑脫；此外托夾部371又具有一伸縮夾373，其亦為一雙叉子結構，在每一端部設有一夾持塊375。伸縮夾373設置於檔塊托盤372上方，並位於檔塊374相對之另一側。 The block tray 372 may be a pair of fork-shaped flat plates for supporting the wafer 900, and a block 374 is provided at the end of each fork to prevent the wafer 900 from slipping; in addition, the holding portion 371 It also has a telescopic clip 373, which is also a double-fork structure, with a clamping block 375 at each end. The telescopic clip 373 is disposed above the block tray 372 and is located on the opposite side of the block 374.

伸縮夾373係藉由一汽壓缸376之帶動，進行一夾放移動，也就是說，當晶圓片900置放於檔塊托盤372上時，托夾式牙叉臂370藉由檔塊托盤372托住晶圓片900，又藉由檔塊374、夾持塊375在汽壓缸376帶動、及到位磁簧377的偵測下進行一夾放移動；夾持後即可進行晶圓片900的搬移動作，又當晶圓片900移動到定位時，伸縮夾373進行一釋放動作，然後置放晶圓片900。 The telescopic clamp 373 is driven by a pneumatic cylinder 376 to perform a clamping movement, that is to say, when the wafer 900 is placed on the block tray 372, the bracket-type fork arm 370 passes through the block tray 372 holds the wafer 900, and the clamp block 374 and the clamping block 375 are driven by the cylinder 376 and detected by the in-position magnetic spring 377 to perform a clamping movement; after clamping, the wafer can be carried out 900 move During the movement, when the wafer 900 moves to the position, the telescopic clip 373 performs a release action, and then the wafer 900 is placed.

如第8A圖及第8B圖所示，上述之第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330也就是吸附式牙叉臂360或托夾式牙叉臂370，均可分別再進一步具有一冷卻流道380及/或一噴氣單元390；冷卻流道380係藉由冷卻液體在第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330內流動，將第一牙叉臂310、第二牙叉臂320、或第三牙叉臂330上所累積的餘熱去除；而噴氣單元390係藉由氣體流道391傳輸冷卻空氣，並藉由噴氣口392向晶圓片900吹送，藉此加速晶圓片900的冷卻。 As shown in FIG. 8A and FIG. 8B, the first fork arm 310, the second fork arm 320, or the third fork arm 330 is also the suction-type fork arm 360 or the bracket-type fork arm 370 , Can each further have a cooling channel 380 and/or a jet unit 390; the cooling channel 380 is cooled by the liquid in the first fork arm 310, the second fork arm 320, or the third fork arm Flow in 330 to remove the residual heat accumulated on the first fork arm 310, the second fork arm 320, or the third fork arm 330; and the air jet unit 390 transmits cooling air through the gas flow channel 391, and The air jet 392 blows the wafer 900 to accelerate the cooling of the wafer 900.

如第9圖所示，設計成三隻牙叉臂310,320,330，其主要是在鍍膜機的應用上，藉由控制單元40將第一牙叉臂310及第二牙叉臂320，應用於卡匣模組(CST)至對位模組(ALN)間、塗佈模組(COT/DEV)與加熱模組(HPL)間、或者進一步應用於冷卻模組(CST)製程前後之晶圓片900搬運。 As shown in Fig. 9, it is designed as three fork arms 310, 320, 330, which are mainly used in the coating machine. The first fork arm 310 and the second fork arm 320 are applied to the cassette by the control unit 40 Module 900 (CST) to alignment module (ALN), coating module (COT/DEV) and heating module (HPL), or further applied to wafer 900 before and after the cooling module (CST) process Handling.

又藉由控制單元40將第二牙叉臂320，應用於對位模組(ALN)與塗佈模組(COT/DEV)間的晶圓片900搬運，如此可以避免牙叉臂310,320殘餘溫度，使晶圓片900於鍍膜前產生不均勻加熱，進而克服晶圓片900製程上膜厚不均勻的問題。 The control unit 40 applies the second fork arm 320 to the wafer 900 between the alignment module (ALN) and the coating module (COT/DEV), so that the residual temperature of the fork arms 310 and 320 can be avoided In this way, the wafer 900 is unevenly heated before being coated, thereby overcoming the problem of uneven film thickness in the wafer 900 process.

如第10圖所示，以與習知相同的5個量測點，針對25片晶圓片900進行習知雙叉臂(Two Handling Forks)與本實施例三叉臂(Triple Handling Forks)之對照測試，可以清楚的得知，習知膜厚均勻(Uniformity)度係大於3%，而本實施例之膜厚均勻度係小於或等於0.7%。 As shown in FIG. 10, using the same 5 measurement points as the conventional one, the comparison between the conventional two-handling forks and the three-handling forks of this embodiment is performed for 25 wafers 900. Through testing, it can be clearly understood that the conventional film thickness uniformity degree is greater than 3%, and the film thickness uniformity degree in this embodiment is less than or equal to 0.7%.

此外、在習知雙叉臂(Two Handling Forks)的檢測，可以得知在底側(Bottom)、左側(Left)、及頂側(Top)三個量測點的膜厚，從第8片晶圓片900開始產生膜厚變厚的問題；而本實施例三叉臂(Triple Handling Forks)的檢測結果顯示，膜厚不均勻的現象已經被有效的被克服了。 In addition, in the conventional two-handling forks (Two Handling Forks) test, you can know the thickness of the three measurement points on the bottom side (Bottom), left side (Left), and top side (Top), from the eighth piece The wafer 900 starts to have a problem of thickening of the film thickness; and the detection result of the Triple Handling Forks of this embodiment shows that the phenomenon of uneven film thickness has been effectively overcome.

第11圖所示，由產能試驗得知，當增加使用冷卻模組(CPL)製程時，即使增加了第三牙叉臂(X3)，每小時機臺產出晶片數(WPH)依然維持在145片；假若在不使用冷卻模組(CPL)製程時，每小時機臺產出晶片數(WPH)也是維持在180片。 As shown in Figure 11, from the capacity test, when the cooling module (CPL) process is added, even if the third fork arm (X3) is added, the number of wafers per hour (WPH) is still maintained at 145 wafers; if the cooling module (CPL) process is not used, the number of wafers per hour (WPH) of the machine is also maintained at 180 wafers.

在上述在產能相同的情況下，再次就膜厚均勻度(U%)進行比較實則發現，測試代碼(Test ID)為U%-X1X2X3+CPL及U%-X1X2X3者，是本實施例三叉臂(Triple Handling Forks)的部分，其膜厚均勻度(U%)顯然比測試代碼(Test ID)為U%-X1X2及U%-X1X2+CPL使用習知雙叉臂(Two Handling Forks)的部分，有更佳的表現。 In the above case under the same production capacity, the film thickness uniformity (U%) is again compared and it is found that the test code (Test ID) is U%-X1X2X3+CPL and U%-X1X2X3, which is the trigeminal arm of this embodiment (Triple Handling Forks), the film thickness uniformity (U%) is obviously better than the test code (Test ID) of U%-X1X2 and U%-X1X2+CPL using the conventional two-handling forks (Two Handling Forks) , With better performance.

第12A圖至第12C圖所示，維修模組50，其為一滑動托盤，維修模組50，其具有一底盤510及一頂盤520，底盤510及頂盤520係藉由一組平移滑軌530相互滑動連接。 As shown in FIGS. 12A to 12C, the maintenance module 50 is a sliding tray, and the maintenance module 50 has a bottom plate 510 and a top plate 520. The bottom plate 510 and the top plate 520 are slid by a set of translation The rails 530 are slidingly connected to each other.

維修模組50之設計，主要是為了方便對整個三重托叉式之機械手臂100進行維修。應用時，藉由支撐框架10固設於頂盤520上；當維修時，三重托叉式之機械手臂100可以藉由維修模組50的平移，將機械手臂100從塗佈機之中央位置移至側邊位置，以方便維修。 The design of the maintenance module 50 is mainly to facilitate the maintenance of the entire triple-arm mechanical arm 100. In application, the support frame 10 is fixed on the top tray 520; when repairing, the triple-arm type robot arm 100 can move the robot arm 100 from the central position of the coating machine by the translation of the maintenance module 50 To the side position for easy maintenance.

為了確保維修模組50在應用時的穩固及安全，當維修模組50在塗佈機中央位置處於鍍膜作業狀態時，此時可操作手動閥550，使頂升氣缸560讓防滑卡塊540與頂盤520相干涉，因此頂盤520被鎖固不動；當維修模組50欲進行維修時，可操作手動閥550，使頂升氣缸560讓防滑卡塊540與頂盤520相脫離，因此頂盤520被釋放可以平移，並使三重托叉式之機械手臂100進行位置移動。 In order to ensure the stability and safety of the maintenance module 50 during application, when the maintenance module 50 is in the coating operation state at the center of the coating machine, the manual valve 550 can be operated at this time to make the lifting cylinder 560 allow the anti-skid block 540 and The top plate 520 interferes, so the top plate 520 is locked; when the maintenance module 50 is to be repaired, the manual valve 550 can be operated to make the lifting cylinder 560 disengage the anti-skid block 540 from the top plate 520, so the top The disk 520 is released and can be translated, and the triple-arm type robot arm 100 is moved in position.

第13圖所示，控制單元40，為了使上述的操作流程可以自動化的完成，因此本實施例之升降模組20、旋轉模組25、手臂模組30、及維修模組50可藉由可程式化的控制單元40，進一步完成相關自動化生產作業。 As shown in FIG. 13, the control unit 40 can automate the above operation flow, so the lifting module 20, the rotating module 25, the arm module 30, and the maintenance module 50 of this embodiment can be The programmed control unit 40 further completes related automated production operations.

惟上述各實施例係用以說明本發明之特點，其目的在使熟習該技術者能瞭解本發明之內容並據以實施，而非限定本創作之專利範圍，故凡其他未脫離本發明所揭示之精神而完成之等效修飾或修改，仍應包含在以下所述之申請專利範圍中。 However, the above embodiments are used to illustrate the characteristics of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, rather than limiting the scope of the patent of this creation, so any other The equivalent modification or modification done by the spirit of disclosure should still be included in the scope of the patent application described below.

10:支撐框架 10: Support frame

110:滑軌 110: Slide rail

20:升降模組 20: Lifting module

210:升降座 210: Lifting seat

211:升降驅動單元 211: Lifting drive unit

25:旋轉模組 25: Rotating module

220:旋轉桿 220: Rotating rod

221:水平旋轉驅動單元 221: Horizontal rotation drive unit

30:手臂模組 30: Arm module

301:手臂框架 301: Arm frame

310:第一牙叉臂 310: The first fork arm

311:第一驅動單元 311: First drive unit

320:第二牙叉臂 320: second fork arm

321:第二驅動單元 321: Second drive unit

330:第三牙叉臂 330: Third fork arm

331:第三驅動單元 331: Third drive unit

340:散熱模組 340: Cooling module

Claims

一種三重托叉式之機械手臂結構，其包括：一支撐框架，其內側設有一滑軌；一升降模組，其具有一升降座，又藉由一升降驅動單元之驅動，使該升降座可上、下滑動的結合於該滑軌；一旋轉模組，其具有一旋轉桿，又藉由一水平旋轉驅動單元之驅動，使該旋轉桿可水平旋轉的設置於該升降座上；以及一手臂模組，其具有：一手臂框架，其固設於該旋轉桿之頂端；一第一牙叉臂，其藉由一第一驅動單元，伸縮滑動的結合於該手臂框架；一第二牙叉臂，其藉由一第二驅動單元，伸縮滑動的結合於該手臂框架；一第三牙叉臂，其藉由一第三驅動單元，伸縮滑動的結合於該手臂框架；其中該第一牙叉臂、該第二牙叉臂、及該第三牙叉臂均為一且彼此上下平行並列之結構；以及一維修模組，該維修模組其具有一底盤及一頂盤，該底盤及該頂盤係藉由一組滑軌相互滑動連接，又該支撐框架係固設於該頂盤上；其中該維修模組具有一防滑卡塊，又該防滑卡塊，其藉由一頂升氣缸之升降，而控制該頂盤之釋放或鎖固。 A triple fork-type mechanical arm structure includes: a support frame with a slide rail inside; a lifting module with a lifting seat, which is driven by a lifting drive unit to make the lifting seat Up and down sliding is combined with the slide rail; a rotating module with a rotating rod, and driven by a horizontal rotating drive unit, the rotating rod can be horizontally arranged on the lifting base; and a The arm module has: an arm frame fixed on the top of the rotating rod; a first prong arm, which is telescopically coupled to the arm frame by a first driving unit; a second tooth A fork arm, which is telescopically coupled to the arm frame by a second drive unit; a third fork arm, telescopically coupled to the arm frame by a third drive unit; wherein the first The fork arm, the second fork arm, and the third fork arm are all one and parallel to each other; and a maintenance module, the maintenance module has a chassis and a top chassis, the chassis And the top plate is connected to each other by a set of slide rails, and the support frame is fixed on the top plate; wherein the maintenance module has a non-slip block, and the non-slip block, which is connected by a top The lifting of the lifting cylinder controls the release or locking of the top plate.

如申請專利範圍第1項所述之機械手臂結構，其中該升降驅動單元，其係由一伺服馬達驅動一升降螺桿，又該升降螺桿帶動該升降座。 The mechanical arm structure as described in item 1 of the patent application scope, wherein the lifting drive unit drives a lifting screw by a servo motor, and the lifting screw drives the lifting seat.

如申請專利範圍第1項所述之機械手臂結構，其中該水平旋轉驅動單元，其係為一伺服馬達驅動一皮帶帶動該旋轉桿旋轉。 The mechanical arm structure as described in item 1 of the patent application scope, wherein the horizontal rotation drive unit is a servo motor driving a belt to drive the rotation rod to rotate.

如申請專利範圍第1項所述之機械手臂結構，其中第一牙叉臂、該第二牙叉臂、或該第三牙叉臂，進一步具有一冷卻流道及/或一噴氣單元。 The mechanical arm structure as described in item 1 of the patent application scope, in which the first fork The arm, the second fork arm, or the third fork arm further has a cooling flow channel and/or a jet unit.

如申請專利範圍第1項所述之機械手臂結構，其中該手臂框架其內部設有三組平行滑軌，又該第一牙叉臂、該第二牙叉臂、及該第三牙叉臂係分別藉由一伺服馬達驅動一皮帶帶動並於該些平行滑軌內進行伸縮移動。 The mechanical arm structure as described in item 1 of the patent application scope, wherein the arm frame is provided with three sets of parallel slide rails inside, and the first fork arm, the second fork arm, and the third fork arm are They are driven by a belt driven by a servo motor and move telescopically in the parallel slide rails.

如申請專利範圍第1項所述之機械手臂結構，其中該第一牙叉臂、該第二牙叉臂、或該第三牙叉臂其為一吸附式牙叉臂，其具有一托盤，該托盤為一雙叉子狀平板，又該托盤設有複數個相對稱之支撐件及複數個相對稱之真空吸附件。 The mechanical arm structure as described in item 1 of the patent application scope, wherein the first fork arm, the second fork arm, or the third fork arm is an adsorption fork arm, which has a tray, The tray is a pair of fork-shaped flat plates, and the tray is provided with a plurality of symmetric support members and a plurality of symmetric vacuum suction members.

如申請專利範圍第6項所述之機械手臂結構，其中該真空吸附件具有一吸氣孔，又該真空吸附件之頂面設有一環狀吸氣槽，又該環狀吸氣槽係與該吸氣孔係藉由至少一連通氣槽相互連通。 The mechanical arm structure as described in item 6 of the patent application scope, wherein the vacuum suction member has an air suction hole, and a top surface of the vacuum suction member is provided with a ring-shaped suction groove, and the ring-shaped suction groove is connected with The suction holes communicate with each other through at least one communicating air groove.

如申請專利範圍第1項所述之機械手臂結構，其中該第一牙叉臂、該第二牙叉臂、或該第三牙叉臂為一托夾式牙叉臂，其具有一托夾部，該托夾部具有：一檔塊托盤，其為一雙叉子狀平板，又於每一叉子端部設有一檔塊；以及一伸縮夾，其為一雙叉子結構且設置於該托盤上方，並位於該檔塊相對之另一側。 The mechanical arm structure as described in item 1 of the patent application, wherein the first fork arm, the second fork arm, or the third fork arm is a bracket-type fork arm, which has a bracket The holding clip part has: a block tray, which is a pair of fork-shaped flat plates, and a block is provided at the end of each fork; and a telescopic clip, which is a double fork structure and is arranged above the tray And located on the opposite side of the block.

如申請專利範圍第8項所述之機械手臂結構，其中該伸縮夾係藉由一汽壓缸之帶動及一到位磁簧的偵測，以進行一夾放移動。 The mechanical arm structure as described in item 8 of the patent application scope, wherein the telescopic clamp is driven by a cylinder and detected by a magnetic spring in place to perform a clamp movement.

如申請專利範圍第1項至第9項其中之一項所述之機械手臂結構，其具有一控制單元，以控制升降模組、旋轉模組、手臂模組、及維修模組完成自動化生產作業。 The mechanical arm structure as described in one of the first to ninth items of the patent application scope has a control unit to control the lifting module, the rotating module, the arm module, and the maintenance module to complete automated production operations .

一種角度監測模組，其係應用於申請專利範圍第1項之一種三重托叉式之機械手臂結構中，該角度監測模組具有：一旋轉位置件，其係固設於一旋轉桿一側；以及複數個位置感測件，其係設置於該旋轉桿之旋轉半徑上，當任一該位置感測件與該旋轉位置件產生重疊時，產生一位置訊號；其中該位置感測件包括一歸位感測件、一正角度位置感測件、及一負角度位置感測件。 An angle monitoring module, which is applied to a triple fork-type mechanical arm structure of patent application item 1, the angle monitoring module has: a rotating position piece, which is fixed on the side of a rotating rod And a plurality of position sensing elements, which are disposed on the rotation radius of the rotating rod, when any of the position sensing elements overlaps with the rotating position element, a position signal is generated; wherein the position sensing element includes A homing sensor, a positive angle position sensor, and a negative angle position sensor.