TWI684485B

TWI684485B - Substrate treatment device

Info

Publication number: TWI684485B
Application number: TW107145468A
Authority: TW
Inventors: 童瑞發; 宋香怡
Original assignee: 辛耘企業股份有限公司
Priority date: 2018-12-17
Filing date: 2018-12-17
Publication date: 2020-02-11
Also published as: TW202023688A

Abstract

A substrate treatment device includes a substrate support unit, a liquid delivery unit, and a control unit. The substrate support unit includes a rotary table that is adapted for permitting a substrate to be disposed thereon. The liquid delivery unit includes a nozzle that corresponds in position to the rotary table and that is movable along a path passing through the center of rotation of the rotary table for delivering a treatment liquid. The control unit is coupled to the liquid delivery unit, includes a human-machine interface that displays a control region for receiving a user input, and that generates a control command in response to the user input, and executes a control program to control the nozzle according to the control command.

Description

基板處理裝置Substrate processing device

本發明是有關於一種基板處理裝置，特別是指一種以程式控制噴嘴的基板處理裝置。The invention relates to a substrate processing device, in particular to a substrate processing device which controls nozzles by a program.

在半導體製程中，常會運用基板處理裝置對基板進行蝕刻或清洗。在對基板進行蝕刻或清洗時，需利用噴嘴對基板供應處理液，且噴嘴需相對基板移動以使處理液能夠均勻分布於基板的表面。現有的基板處理裝置中，噴嘴的移動速度是藉由機械式的固定機構控制。例如以一控制圓盤控制一噴嘴的移動速度，該控制圓盤在360度範圍內均分12格以對應在一基板表面的路徑範圍劃分12等份，該噴嘴移動範圍對應該基板的路徑範圍。當需要改變該噴嘴的移動速度或是移動範圍時，需要重新設計製作新的控制盤以對應所欲改變的該噴嘴的移動速度或是移動範圍，如此使得基板處理裝置的運作彈性大幅降低。In semiconductor manufacturing processes, substrate processing equipment is often used to etch or clean substrates. When etching or cleaning the substrate, a nozzle needs to be used to supply the processing liquid to the substrate, and the nozzle needs to move relative to the substrate so that the processing liquid can be evenly distributed on the surface of the substrate. In the existing substrate processing apparatus, the moving speed of the nozzle is controlled by a mechanical fixing mechanism. For example, a control disk is used to control the moving speed of a nozzle. The control disk is divided into 12 divisions within a range of 360 degrees to divide the path range of a substrate surface into 12 equal parts. The nozzle moving range corresponds to the path range of the substrate . When the movement speed or movement range of the nozzle needs to be changed, a new control panel needs to be redesigned to correspond to the movement speed or movement range of the nozzle to be changed, so that the operation flexibility of the substrate processing apparatus is greatly reduced.

因此，本發明之其中一目的，在提供可避免先前技術之至少一種上述缺點的基板處理裝置。Therefore, one of the objects of the present invention is to provide a substrate processing apparatus that can avoid at least one of the aforementioned disadvantages of the prior art.

於是，本發明基板處理裝置在一些實施態樣中，是包含一基板承載單元、一流體供應單元及一控制單元。該基板承載單元包括一旋轉台以供設置一基板。該流體供應單元包括至少一噴嘴，對應該旋轉台設置且可受控地在通過該旋轉台中心的一路徑範圍內移動以供應一處理液。該控制單元與該流體供應單元耦接並包括一人機介面且儲存一控制程式。該人機介面具有一噴嘴控制區塊以供一操作者輸入一控制指令，且該控制單元接收該控制指令並由該控制程式對應該控制指令控制該噴嘴。Therefore, in some embodiments, the substrate processing apparatus of the present invention includes a substrate carrying unit, a fluid supply unit, and a control unit. The substrate carrying unit includes a rotating table for setting a substrate. The fluid supply unit includes at least one nozzle, which is provided corresponding to the rotary table and is controllably movable within a path through the center of the rotary table to supply a processing liquid. The control unit is coupled to the fluid supply unit and includes a human-machine interface and stores a control program. The man-machine interface mask has a nozzle control block for an operator to input a control command, and the control unit receives the control command and controls the nozzle corresponding to the control command by the control program.

在一些實施態樣中，該控制程式預設對應該路徑範圍內有N個等距連續分布的區段，其中N不小於10，該控制指令包括選擇該N個區段的其中兩個以作為該噴嘴移動範圍的端點區段，而使該控制程式控制該噴嘴相對於該旋轉台在對應該兩端點區段的位置之間移動。In some implementation forms, the control program presets corresponding to N equidistant continuously distributed sections within the path range, where N is not less than 10, and the control command includes selecting two of the N sections as The end point section of the nozzle movement range, and the control program controls the nozzle to move relative to the rotary table between positions corresponding to the end point section.

在一些實施態樣中，該控制指令還包括設定該兩端點區段範圍內對應各區段的該噴嘴的移動速度，而使該控制程式控制該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度。In some embodiments, the control instruction further includes setting the moving speed of the nozzle corresponding to each section in the range of the two end point sections, so that the control program controls the nozzle relative to the position when corresponding to the position of each section The speed of the rotary table.

在一些實施態樣中，該控制指令還包括設定該兩端點區段範圍內對應各區段的流體供應量，而使該控制程式控制該噴嘴位於對應各區段位置時噴出的處理液對應該流體供應量。In some implementations, the control instruction further includes setting the fluid supply amount of each section within the range of the two end point sections, and causing the control program to control the pair of treatment liquid ejected when the nozzle is located at the position of each section The fluid supply should be.

在一些實施態樣中，該噴嘴控制區塊顯示一直角座標畫面，該直角座標畫面具有一第一座標軸及一第二座標軸，該第一座標軸對應該等N個區段的位置，且該第二座標軸對應該噴嘴的移動速度，該人機介面具有一輸入模式以供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內的多個座標位置以產生該控制指令，而使該控制指令包括對應該等座標位置的參數。In some implementations, the nozzle control block displays a rectangular coordinate screen, the rectangular coordinate screen has a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N segments, and the first The two coordinate axes correspond to the moving speed of the nozzle. The man-machine interface has an input mode for the operator to select multiple coordinate positions in the range of the two end point segments on the right-angle coordinate screen to generate the control command, and The control command includes parameters corresponding to the coordinate positions.

在一些實施態樣中，該噴嘴控制區塊顯示一直角座標畫面，該直角座標畫面具有一第一座標軸及一第二座標軸，該第一座標軸對應該等N個區段的位置，且該第二座標軸對應該噴嘴的流體供應量，該人機介面具有一輸入模式以供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內的多個座標位置以產生該控制指令，而使該控制指令包括對應該等座標位置的參數。In some implementations, the nozzle control block displays a rectangular coordinate screen, the rectangular coordinate screen has a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N segments, and the first The two coordinate axes correspond to the fluid supply of the nozzle. The man-machine interface has an input mode for the operator to select multiple coordinate positions in the range of the two end point segments on the right-angle coordinate screen to generate the control command. Therefore, the control command includes parameters corresponding to the coordinate positions.

在一些實施態樣中，該輸入模式供該操作者在該直角座標畫面上以訊號觸發的判斷方式連續選擇該等座標位置以產生該控制指令。In some implementations, the input mode is for the operator to continuously select the coordinate positions on the rectangular coordinate screen by signal-triggered judgment to generate the control command.

在一些實施態樣中，該輸入模式供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內相鄰其中一端點區段的一半範圍的座標位置且由該輸入模式以呈鏡射對稱圖形的方式自動選擇相鄰其中另一端點區段的一半範圍的座標位置以產生該控制指令。In some implementations, the input mode is for the operator to select a coordinate position on the rectangular coordinate screen that corresponds to half of the range of one of the adjacent end points within the range of the end point segments and the input mode is used to present The method of mirroring the symmetrical figure automatically selects the coordinate position of the half of the range of the other adjacent end segment to generate the control command.

在一些實施態樣中，該輸入模式供該操作者在該直角座標畫面上選擇對應該兩端點區段的兩個座標位置及對應該兩端點區段範圍內至少一個座標位置且由該輸入模式以對應該操作者所選擇的座標位置形成一折線圖的方式自動選擇該兩端點區段範圍內其餘的座標位置以產生該控制指令。In some implementations, the input mode is for the operator to select two coordinate positions corresponding to the two end point sections on the rectangular coordinate screen and at least one coordinate position within the range corresponding to the two end point sections The input mode automatically selects the remaining coordinate positions in the range of the two end point segments in a manner that forms a line graph corresponding to the coordinate position selected by the operator to generate the control command.

在一些實施態樣中，該控制指令還包括設定一供液時間及一起始供應位置，該供液時間為該噴嘴起始噴出該處理液至結束噴出該處理液的時間，該起始供應位置為使該噴嘴相對於該旋轉台起始噴出該處理液的位置。In some embodiments, the control instruction further includes setting a liquid supply time and an initial supply position, the liquid supply time is the time from when the nozzle starts to discharge the treatment liquid to when the treatment liquid is finally discharged, the start supply position In order for the nozzle to start ejecting the processing liquid relative to the rotary table.

在一些實施態樣中，該控制指令還包括設定一移動次數、一起始供應位置及一結束供應位置，該移動次數為使該噴嘴在對應該兩端點區段範圍內往返移動的次數，該起始供應位置為使該噴嘴相對於該旋轉台起始噴出該處理液的位置，該結束供應位置為使該噴嘴相對於該旋轉台結束噴出該處理液的位置。In some implementations, the control instruction further includes setting a number of movements, a start supply position and an end supply position. The number of movements is the number of times the nozzle moves back and forth within the range corresponding to the two end points, the The initial supply position is a position where the nozzle starts to discharge the processing liquid relative to the rotary table, and the end supply position is a position where the nozzle ends the discharge of the processing liquid relative to the rotary table.

在一些實施態樣中，該控制指令還包括設定一起始供應位置及一結束供應位置至少其中之一且該起始供應位置及該結束供應位置至少其中之一設定為在該兩端點區段範圍外，其中，該起始供應位置為使該噴嘴相對於該旋轉台起始噴出該處理液的位置，該結束供應位置為使該噴嘴相對於該旋轉台結束噴出該處理液的位置。In some embodiments, the control instruction further includes setting at least one of a start supply position and an end supply position and at least one of the start supply position and the end supply position is set at the two end point sections Outside the scope, wherein the initial supply position is a position where the nozzle starts to discharge the processing liquid relative to the rotary table, and the end supply position is a position where the nozzle ends the discharge of the processing liquid relative to the rotary table.

在一些實施態樣中，該控制指令還包括設定一期望移動時間，該期望移動時間為該操作者欲使該噴嘴對應自其中一端點區段移動至另一端點區段的時間，該控制程式對應該期望移動時間調整原已由該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴的移動速度，以使該噴嘴自其中一端點區段移動至另一端點區段的時間符合該期望移動時間。In some embodiments, the control command further includes setting a desired movement time, which is the time when the operator wants the nozzle to move from one end section to another end section, the control program Adjust the movement speed of the nozzle corresponding to each section within the range of the two-end point section that was originally set by the operator according to the desired movement time, so that the nozzle moves from one end section to the other end section The time of meets the expected movement time.

在一些實施態樣中，該控制程式以等量調整的方式調整該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴的移動速度。In some embodiments, the control program adjusts the movement speed of the nozzle corresponding to each segment within the range of the two end point segments set by the operator in an equal adjustment manner.

在一些實施態樣中，該控制程式係根據該噴嘴實際相對於該旋轉台自對應其中一端點區段移動至另一端點區段的一實際移動時間與該期望移動時間對比，若該期望移動時間與該實際移動時間有一誤差值，則該控制程式根據該誤差值對該兩端點區段範圍內對應各區段的該噴嘴的移動速度進行調整。In some embodiments, the control program is based on the actual movement time of the nozzle relative to the rotary table from one of the end-point segments to the other end-point segment compared with the expected movement time, if the desired movement There is an error value between the time and the actual moving time, and the control program adjusts the moving speed of the nozzle corresponding to each segment in the range of the two end point segments according to the error value.

在一些實施態樣中，該流體供應單元包括多個噴嘴，且該噴嘴控制區塊還供該操作者選擇欲使用的其中一噴嘴並輸入該控制指令。In some embodiments, the fluid supply unit includes a plurality of nozzles, and the nozzle control block is also for the operator to select one of the nozzles to be used and input the control command.

在一些實施態樣中，還包含多個分別對應該等噴嘴設置的收集單元，且該噴嘴控制區塊還供該操作者選擇與欲使用的該噴嘴相對應的收集單元，以使該控制單元控制該收集單元與相對應的噴嘴共同運作。In some embodiments, a plurality of collection units respectively corresponding to the nozzles are also included, and the nozzle control block is also provided for the operator to select a collection unit corresponding to the nozzle to be used, so that the control unit Control the collection unit to work with the corresponding nozzle.

本發明至少具有以下功效：該控制單元可供該操作者設定變更控制該噴嘴的參數，可大幅提高該基板處理裝置運作的彈性。The present invention has at least the following effects: the control unit can be used by the operator to set and change parameters for controlling the nozzle, which can greatly improve the flexibility of operation of the substrate processing apparatus.

在本發明被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numbers.

參閱圖1至圖3與圖5，本發明基板處理裝置100之一實施例，包含一基板承載單元1、一流體供應單元2、一控制單元3及多個收集單元4。該基板承載單元1包括一旋轉台11以供設置一基板5，以承載該基板5旋轉，該基板5為用於半導體製程的基板，例如晶圓。該流體供應單元2包括多個噴嘴21對應該旋轉台11設置且每一噴嘴21可受控地在通過該旋轉台11的中心C的一路徑範圍D內移動以供應一處理液，不同的噴嘴21可供應不同的處理液，例如酸、去離子水等。由於設置在該旋轉台11的基板5的中心位置與該旋轉台11的中心位置相同，在圖式中皆以C點標示。該路徑範圍D對應該基板5的直徑長度，亦即每一噴嘴21的移動範圍是對應該旋轉台11設置該基板5的區域的一直徑，該路徑範圍D隨該基板5的尺寸調整。該等收集單元4分別對應該等噴嘴21供應的液體種類而設置，例如該等收集單元4與該等噴嘴21一對一相對應，當其中一噴嘴21運作時，與該噴嘴21相對應的收集單元4也一起運作，以收集該噴嘴21噴向該基板5後在該基板5表面因旋轉甩出的處理液。1 to 3 and FIG. 5, an embodiment of the substrate processing apparatus 100 of the present invention includes a substrate carrying unit 1, a fluid supply unit 2, a control unit 3, and a plurality of collection units 4. The substrate carrying unit 1 includes a rotating table 11 for setting a substrate 5 to carry the substrate 5 for rotation. The substrate 5 is a substrate used in a semiconductor manufacturing process, such as a wafer. The fluid supply unit 2 includes a plurality of nozzles 21 corresponding to the rotary table 11 and each nozzle 21 can be controlledly moved within a path range D passing through the center C of the rotary table 11 to supply a processing liquid, different nozzles 21 can supply different treatment liquids, such as acid, deionized water, etc. Since the center position of the substrate 5 provided on the turntable 11 is the same as the center position of the turntable 11, they are all marked with point C in the drawings. The path range D corresponds to the diameter length of the substrate 5, that is, the movement range of each nozzle 21 is a diameter corresponding to the area where the substrate 5 is provided on the turntable 11, and the path range D is adjusted according to the size of the substrate 5. The collection units 4 are provided corresponding to the types of liquids supplied by the nozzles 21, for example, the collection units 4 correspond to the nozzles 21 one-to-one, and when one of the nozzles 21 operates, the nozzle 21 The collection unit 4 also operates together to collect the processing liquid that is sprayed on the surface of the substrate 5 by the nozzle 21 after being sprayed toward the substrate 5 due to rotation.

該控制單元3與該流體供應單元2及該等收集單元4耦接並包括一人機介面31且儲存一控制程式32，該人機介面31具有一噴嘴控制區塊311以供一操作者選擇欲使用的其中一噴嘴21並輸入一控制指令312，且該控制單元3接收該控制指令312並由該控制程式32對應該控制指令312控制該噴嘴21。而且，該噴嘴控制區塊311還供該操作者選擇與欲使用的該噴嘴21相對應的收集單元4，以使該控制單元3控制該收集單元4與相對應的噴嘴21共同運作。在本實施例中，是以多個噴嘴21及多個收集單元4為例說明，可理解地，在變化實施例僅有一個噴嘴21及一個收集單元4亦可實施，不以本實施例為限。由於在本實施例中，該控制單元3接受該操作者操作以控制每一噴嘴21運作的原理相同，以下僅以操作單一噴嘴21為例說明。The control unit 3 is coupled to the fluid supply unit 2 and the collection units 4 and includes a man-machine interface 31 and stores a control program 32. The man-machine interface 31 has a nozzle control block 311 for an operator to choose One of the nozzles 21 used is input with a control command 312, and the control unit 3 receives the control command 312 and the control program 32 controls the nozzle 21 corresponding to the control command 312. Moreover, the nozzle control block 311 also allows the operator to select the collection unit 4 corresponding to the nozzle 21 to be used, so that the control unit 3 controls the collection unit 4 and the corresponding nozzle 21 to operate together. In this embodiment, a plurality of nozzles 21 and a plurality of collection units 4 are taken as an example for description. Understandably, in a modified embodiment, only one nozzle 21 and a collection unit 4 can also be implemented, not in this embodiment. limit. Since in this embodiment, the control unit 3 accepts the operator's operation to control the operation of each nozzle 21 with the same principle, the following only uses a single nozzle 21 as an example.

該控制程式32預設對應該路徑範圍D內有N個等距連續分布的區段，其中N不小於10，以能對該噴嘴21的移動控制有較佳解析度，N值的上限可以依據驅動該噴嘴21的馬達(圖未示)可接受的範圍而調整，在本實施例中，N值具體為50。該控制指令312包括選擇N個區段的其中兩個以作為該噴嘴21移動範圍的端點區段，而使該控制程式32控制該噴嘴21相對於該旋轉台11在對應該兩端點區段的位置之間移動，而該兩端點區段亦可設同一區段，亦即使該噴嘴21位於一定點不移動。The control program 32 is preset to correspond to N equidistant continuously distributed segments in the path range D, where N is not less than 10, so as to have better resolution for the movement control of the nozzle 21, and the upper limit of the N value can be based on A motor (not shown) that drives the nozzle 21 is adjusted within an acceptable range. In this embodiment, the N value is specifically 50. The control command 312 includes selecting two of the N sections to be the end sections of the movement range of the nozzle 21, and the control program 32 controls the nozzle 21 to correspond to the rotary table 11 at the corresponding end point areas The positions of the segments move, and the two end point segments can also be set to the same segment, even if the nozzle 21 is located at a certain point and does not move.

具體說明請參圖5至圖8，其分別顯示在50區段中選擇不同區段的情況。圖5所示，當該操作者輸入該控制指令312選擇1至50區段，則使該控制程式32控制該噴嘴21相對於該旋轉台11在對應該基板5直徑兩端的範圍內移動，即在該路徑範圍D內移動；圖6所示當該操作者輸入該控制指令312選擇1至25區段，則使該控制程式32控制該噴嘴21相對於該旋轉台11在對應該基板5直徑的一端至中心C的範圍內移動，即在一局部範圍R內移動；圖7所示當該操作者輸入該控制指令312選擇13至37區段，則使該控制程式32控制該噴嘴21相對於該旋轉台11在對應該基板5的中心C兩側的局部範圍R內移動；圖8所示當該操作者輸入該控制指令312選擇13至25區段，則使該控制程式32控制該噴嘴21相對於該旋轉台11在對應該基板5的中心C一側的局部範圍R內移動。換言之，該操作者可以依據所需要的製程參數設定該噴嘴21的移動範圍。需特別說明的是，本實施例之路徑範圍D和局部範圍R係為該噴嘴21以直線移動方式為例說明，可依需求改變該噴嘴21的移動路線，例如為通過中心C的圓弧線或是於該基板5一端和中心C之間移動的圓弧線，不以本實施例為限。Please refer to Figures 5 to 8 for specific descriptions, which show the selection of different sections among the 50 sections. As shown in FIG. 5, when the operator enters the control command 312 to select the section 1 to 50, the control program 32 controls the nozzle 21 to move relative to the rotary table 11 within a range corresponding to both ends of the diameter of the substrate 5, ie Move within the path range D; as shown in FIG. 6, when the operator enters the control command 312 to select the section 1 to 25, the control program 32 controls the nozzle 21 to correspond to the diameter of the substrate 5 relative to the rotary table 11 Moves from one end to the center C, that is, within a partial range R; as shown in FIG. 7 when the operator enters the control command 312 to select the segment 13 to 37, the control program 32 controls the nozzle 21 relative As the rotary table 11 moves in a partial range R corresponding to both sides of the center C of the substrate 5; as shown in FIG. 8 when the operator enters the control command 312 to select sections 13 to 25, the control program 32 controls the The nozzle 21 moves relative to the turntable 11 within a partial range R on the side corresponding to the center C of the substrate 5. In other words, the operator can set the movement range of the nozzle 21 according to the required process parameters. It should be particularly noted that the path range D and the local range R in this embodiment are described for the nozzle 21 in a linear movement mode, and the movement route of the nozzle 21 can be changed according to requirements, for example, a circular arc line passing through the center C Or the arc line moving between the end of the substrate 5 and the center C is not limited to this embodiment.

該控制指令312還包括設定該兩端點區段範圍內對應各區段的該噴嘴21的移動速度，而使該控制程式32控制該噴嘴21位於對應各區段位置時相對於該旋轉台11的移動速度。在本實施例中，如圖3所示，該噴嘴控制區塊311顯示一直角座標畫面，該直角座標畫面具有一第一座標軸及一第二座標軸，該第一座標軸對應該等N個區段的位置，在本實施例N為50，且該第二座標軸對應該噴嘴21的移動速度，在本實施例中，該移動速度的單位為毫米(mm)/秒(sec)，該人機介面31具有一輸入模式以供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內的多個座標位置以產生該控制指令312，而使該控制指令312包括對應該等座標位置的參數。The control command 312 further includes setting the moving speed of the nozzle 21 corresponding to each section within the range of the two end point sections, so that the control program 32 controls the nozzle 21 to be relative to the rotary table 11 when the nozzle 21 is located at the position corresponding to each section Moving speed. In this embodiment, as shown in FIG. 3, the nozzle control block 311 displays a rectangular coordinate screen with a first coordinate axis and a second coordinate axis, the first coordinate axis corresponding to the N segments The position of N in this embodiment is 50, and the second coordinate axis corresponds to the moving speed of the nozzle 21. In this embodiment, the unit of the moving speed is millimeter (mm)/second (sec). 31 has an input mode for the operator to select a plurality of coordinate positions corresponding to the two end point segments on the rectangular coordinate screen to generate the control command 312, so that the control command 312 includes corresponding coordinate positions Parameters.

更具體說明如下，參圖9至圖13，以該操作者選擇該兩端點區段範圍為1至50為例，圖9所示為該操作者選擇每一區段該噴嘴21對應的移動速度相同為均速移動；圖10所示為該操作者選擇對應靠近該基板5外圍的區段使該噴嘴21對應的移動速度較快而越接近對應該基板5的中心C的區段使該噴嘴21對應的移動速度較慢；圖11所示為該操作者選擇對應靠近該基板5外圍的區段使該噴嘴21對應的移動速度較慢而越接近對應該基板5的中心C的區段使該噴嘴21對應的移動速度較快；圖12所示為該操作者選擇對應沿該基板5直徑移動的過程中以特定數量的區段為單位使該噴嘴21在每單位區段中對應的移動速度規律地快慢變化；圖13所示為該操作者亦可選擇使該噴嘴21在對應各區段的移動速度不規則地變化。亦即，該操作者可以依據其需求設定，並不限制。More specifically, as follows, referring to FIGS. 9 to 13, taking the operator’s selection of the range of the two end points as an example of 1 to 50, FIG. 9 shows the operator’s selection of the movement of the nozzle 21 corresponding to each segment The same speed is the same speed movement; FIG. 10 shows that the operator selects the section corresponding to the periphery of the substrate 5 to make the movement speed of the nozzle 21 faster, and the closer to the section corresponding to the center C of the substrate 5 makes the The movement speed corresponding to the nozzle 21 is slow; FIG. 11 shows that the operator selects the section corresponding to the periphery of the substrate 5 to make the movement speed corresponding to the nozzle 21 slower and closer to the section corresponding to the center C of the substrate 5 Make the movement speed corresponding to the nozzle 21 faster; Figure 12 shows that the operator selects a specific number of sections as the unit moves along the diameter of the substrate 5 so that the nozzle 21 corresponds to each unit section The moving speed changes regularly and slowly; FIG. 13 shows that the operator can also choose to make the moving speed of the nozzle 21 corresponding to each section change irregularly. That is, the operator can set according to his needs, without limitation.

為了方便該操作者輸入，在本實施例中，該人機介面31的輸入模式可供該操作者在該直角座標畫面上以訊號觸發的判斷方式連續選擇該等座標位置以產生該控制指令312，例如為觸控滑動方式或滑鼠按壓滑動方式，以圖9所示圖形為例，該操作者可以在該直角座標畫面由位置為1、移動速度為50的座標位置開始水平的滑動畫一直線至位置為50、移動速度為50的座標位置即可完成輸入；另以圖10所示圖形為例，該操作者可以在該直角座標畫面由位置為1、移動速度為100的座標位置開始依序由位置1至50滑動至各區段對應之移動速度的座標位置，畫出近似V形的圖形即可完成輸入，以此類推。在一變化的實施例，該輸入模式亦可供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內相鄰其中一端點區段的一半範圍的座標位置且由該輸入模式以呈鏡射對稱圖形的方式自動選擇相鄰其中另一端點區段的一半範圍的座標位置以產生該控制指令312，以圖10所示圖形為例，該操作者可以在該直角座標畫面設定位置為1至25範圍內各區段的對應移動速度，再由該輸入模式以呈鏡射對稱圖形的方式自動選擇位置26至50範圍內各區段的對應移動速度，使該操作者僅須設定一半範圍的資料，方便該操作者使用。在另一變化的實施例，該輸入模式供該操作者在該直角座標畫面上選擇對應該兩端點區段的兩個座標位置及對應該兩端點區段範圍內至少一個座標位置且由該輸入模式以對應該操作者所選擇的座標位置形成一折線圖的方式自動選擇該兩端點區段範圍內其餘的座標位置以產生該控制指令312，再以圖9所示圖形為例，該操作者可以在該直角座標畫面選擇位置為1且移動速度為50的座標位置、位置為25且移動速度為50的座標位置及位置為50且移動速度為50的座標位置後，即可由該輸入模式依序將該等座標位置連線而自動選擇在該連線上的座標位置，亦即其餘該操作者未設定的區段由該輸入模式設定對應的移動速度為50，以此類推，在該兩端點區段範圍內的座標位置亦可為兩個或兩個以上，再以圖10所示圖形為例，該操作者可在該兩端點區段範圍內另設三個轉折點的座標位置，再由該輸入模式依序將該等座標位置連線而形成近似V形的折線圖。可理解地，該人機介面31可以僅具有前述輸入模式其中之一，或者可以具有前述輸入模式其中兩個以上以供該操作者選擇其所欲的輸入模式使用。In order to facilitate the operator's input, in this embodiment, the input mode of the human-machine interface 31 allows the operator to continuously select the coordinate positions on the rectangular coordinate screen by signal-triggered judgment to generate the control command 312 , For example, the touch sliding method or the mouse pressing sliding method. Taking the graph shown in FIG. 9 as an example, the operator can start a horizontal sliding line drawing on the rectangular coordinate screen from the coordinate position of the position 1 and the movement speed of 50 The input can be completed when the coordinate position is 50 and the movement speed is 50; taking the graph shown in FIG. 10 as an example, the operator can start from the coordinate position of position 1 and movement speed 100 on the right-angle coordinate screen. The sequence slides from position 1 to 50 to the coordinate position of the corresponding moving speed of each section, and the input is completed by drawing an approximately V-shaped figure, and so on. In a variant embodiment, the input mode is also available for the operator to select on the right-angle coordinate screen the coordinate position corresponding to half of the adjacent one of the end point sections within the range of the end point sections and the input mode Automatically select the coordinate position of the half of the adjacent one of the other end points in a mirror-symmetrical pattern to generate the control command 312. Taking the figure shown in FIG. 10 as an example, the operator can set on the right-angle coordinate screen The corresponding movement speed of each section in the range of 1 to 25, and then the corresponding input movement speed of each section in the range of 26 to 50 is automatically selected by the input mode in a mirror-symmetrical pattern, so that the operator only needs to Set the data in half of the range for the operator to use. In another modified embodiment, the input mode is for the operator to select two coordinate positions corresponding to the two end point sections on the rectangular coordinate screen and at least one coordinate position within the range corresponding to the two end point sections and by The input mode automatically selects the remaining coordinate positions in the range of the two end point segments in a manner that forms a line graph corresponding to the coordinate position selected by the operator to generate the control command 312, and then takes the graph shown in FIG. 9 as an example. The operator can select the coordinate position of position 1 and movement speed 50, the coordinate position of position 25 and movement speed 50 and the coordinate position of position 50 and movement speed 50 on the rectangular coordinate screen. The input mode sequentially connects the coordinate positions and automatically selects the coordinate positions on the connection, that is, the remaining sections not set by the operator are set by the input mode to the corresponding moving speed of 50, and so on, The coordinate positions within the range of the two end points can also be two or more. Taking the graph shown in FIG. 10 as an example, the operator can set three additional turning points within the range of the two end points. The coordinate position of, then the input mode sequentially connects these coordinate positions to form an approximately V-shaped line graph. Understandably, the human-machine interface 31 may have only one of the aforementioned input modes, or may have more than two of the aforementioned input modes for the operator to select his desired input mode.

參閱圖3、圖9與圖14，該控制指令312還包括設定一期望移動時間，該期望移動時間為該操作者欲使該噴嘴21對應自其中一端點區段移動至另一端點區段的時間，該控制程式32對應該期望移動時間調整原已由該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴21的移動速度，以使該噴嘴21自其中一端點區段移動至另一端點區段的時間符合該期望移動時間。例如圖9所示為原已由該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴21的移動速度，圖14所示為該控制程式32以等量調整的方式調整該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴21的移動速度。亦即圖14所示為該控制程式32自動調整後實際用以控制該噴嘴21移動的控制參數。該控制程式32係根據該噴嘴21實際相對於該旋轉台11自對應其中一端點區段移動至另一端點區段的一實際移動時間與該期望移動時間對比，若該期望移動時間與該實際移動時間有一誤差值，則該控制程式32根據該誤差值對該兩端點區段範圍內對應各區段的該噴嘴21的移動速度進行調整。以圖14所示為例，原已由該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴21的移動速度所執行的時間為該實際移動時間，若該實際移動時間與該期望移動時間有該誤差值，控制程式32根據該誤差值逐步調整該實際移動時間，以本實施例說明，對應該實際移動時間係為位置為1至50且移動速度為50的座標位置所產生的時間，此時，若該實際移動時間低於該期望移動時間，則該控制程式32增加位置為1至50的移動速度，使該實際移動時間對應位置為1至50移動速度為60的座標位置所產生的時間，以使該實際移動時間和該期望移動時間相同或接近。Referring to FIGS. 3, 9 and 14, the control command 312 further includes setting a desired movement time, which is the operator’s desire to move the nozzle 21 from one end section to another end section At this time, the control program 32 adjusts the movement speed of the nozzle 21 corresponding to each section within the range of the two end point sections previously set by the operator according to the desired movement time, so that the nozzle 21 moves from one of the end points The time when the segment moves to the other end point segment corresponds to the expected moving time. For example, FIG. 9 shows the movement speed of the nozzle 21 corresponding to each section within the range of the two-end point section that has been previously set by the operator, and FIG. 14 shows that the control program 32 is adjusted in an equal amount. The movement speed of the nozzle 21 corresponding to each section within the range of the two end point sections set by the operator. That is, FIG. 14 shows the control parameters actually used to control the movement of the nozzle 21 after the control program 32 is automatically adjusted. The control program 32 compares the actual movement time of the nozzle 21 with respect to the rotary table 11 from the corresponding one of the end point sections to the other end section and the expected movement time, if the expected movement time and the actual movement time If the movement time has an error value, the control program 32 adjusts the movement speed of the nozzle 21 corresponding to each section within the range of the two end point sections according to the error value. Taking the example shown in FIG. 14, the time that the movement speed of the nozzle 21 corresponding to each section within the range of the two end point sections that has been set by the operator is the actual movement time, if the actual movement time If there is an error value with the expected movement time, the control program 32 gradually adjusts the actual movement time according to the error value. In this embodiment, the actual movement time corresponds to the coordinate position with a position of 1 to 50 and a movement speed of 50. The generated time, at this time, if the actual movement time is lower than the expected movement time, the control program 32 increases the movement speed of the position from 1 to 50, so that the actual movement time corresponds to the position of 1 to 50, and the movement speed is 60 The time generated by the coordinate position of, so that the actual movement time is the same as or close to the expected movement time.

參閱圖4，該控制指令312還包括設定該兩端點區段範圍內對應各區段的流體供應量，而使該控制程式32控制該噴嘴21位於對應各區段位置時噴出的處理液對應該流體供應量。該噴嘴控制區塊311顯示一直角座標畫面，該直角座標畫面具有一第一座標軸及一第二座標軸，該第一座標軸對應該等N個區段的位置，且該第二座標軸對應該噴嘴21的流體供應量，該人機介面31具有一輸入模式以供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內的多個座標位置以產生該控制指令312，而使該控制指令312包括對應該等座標位置的參數。在本實施例中，用以輸入該噴嘴21的移動速度的直角座標畫面及用以輸入該噴嘴21的流體供應量的直角座標畫面可以藉由該操作者選擇該噴嘴控制區塊311上的移動速度選項或流體供應量選項作切換。用以輸入該噴嘴21的流體供應量的直角座標畫面的輸入模式與前述用以輸入該噴嘴21的移動速度的直角座標畫面的輸入模式相同，於此不再重述。Referring to FIG. 4, the control command 312 also includes setting the fluid supply amount of each section within the range of the two end point sections, and causing the control program 32 to control the pair of treatment liquid ejected when the nozzle 21 is located at the position of each section The fluid supply should be. The nozzle control block 311 displays a rectangular coordinate screen, the rectangular coordinate screen has a first coordinate axis and a second coordinate axis, the first coordinate axis corresponds to the positions of the N segments, and the second coordinate axis corresponds to the nozzle 21 The fluid supply of the human-machine interface 31 has an input mode for the operator to select a plurality of coordinate positions within the range of the two end point segments on the rectangular coordinate screen to generate the control command 312, so that the The control command 312 includes parameters corresponding to the coordinate positions. In this embodiment, the rectangular coordinate screen for inputting the movement speed of the nozzle 21 and the rectangular coordinate screen for inputting the fluid supply amount of the nozzle 21 can be selected by the operator to move on the nozzle control block 311 Switch between speed options or fluid supply options. The input mode of the rectangular coordinate screen for inputting the fluid supply amount of the nozzle 21 is the same as the aforementioned input mode of the rectangular coordinate screen for inputting the moving speed of the nozzle 21, and will not be repeated here.

該控制指令312還包括設定一供液時間、一移動次數、一起始供應位置及一結束供應位置。該供液時間為該噴嘴21起始噴出該處理液至結束噴出該處理液的時間。該移動次數為使該噴嘴21在對應該兩端點區段範圍內往返移動的次數，可設定一次的單位是單程或為來回雙程。該起始供應位置為使該噴嘴21相對於該旋轉台11起始噴出該處理液的位置，該起始供應位置可以設定在兩端點區段範圍內的其中一個區段，也可以設定在兩端點區段範圍外。該結束供應位置為使該噴嘴21相對於該旋轉台11結束噴出該處理液的位置，同樣地，該結束供應位置可以設定在兩端點區段範圍內的其中一個區段，也可以設定在兩端點區段範圍外。在本實施例中，該噴嘴控制區塊311設有對應該供液時間、該移動次數、該起始供應位置及該結束供應位置的選項以供該操作者輸入該控制指令312。該操作者可以選擇該供液時間及該起始供應位置做為控制製程的參數；或者可以選擇該移動次數、該起始供應位置及該結束供應位置做為控制製程的參數，可視使用需求而定。在變化的實施例，該控制指令312可設定的參數可以依照需求而調整，可以省略不需要的參數。The control command 312 also includes setting a liquid supply time, a movement number, a starting supply position and an ending supply position. The liquid supply time is the time from when the nozzle 21 starts to discharge the processing liquid to when it finishes discharging the processing liquid. The number of movements is the number of times that the nozzle 21 moves back and forth within the range corresponding to the end points, and the unit that can be set once is one-way or two-way two-way. The initial supply position is the position where the nozzle 21 starts to discharge the treatment liquid relative to the rotary table 11. The initial supply position can be set in one of the two end point ranges, or it can be set in Outside the range of the two end points. The end supply position is the position where the nozzle 21 finishes ejecting the processing liquid with respect to the rotary table 11. Similarly, the end supply position may be set at one of the sections within the range of the end points, or may be set at Outside the range of the two end points. In this embodiment, the nozzle control block 311 is provided with options corresponding to the liquid supply time, the number of movements, the start supply position and the end supply position for the operator to input the control command 312. The operator can select the liquid supply time and the starting supply position as the parameters of the control process; or can select the number of movements, the starting supply position and the ending supply position as the parameters of the control process, depending on the use requirements set. In a changed embodiment, the parameters that can be set by the control command 312 can be adjusted according to requirements, and unnecessary parameters can be omitted.

本實施例所提及之基板5可為載板形式、晶圓形式、晶片形式等，並且可為圓型、方型，並不以此為限。並且藉由本實施例之基板處理裝置可應用於基板濕製程(蝕刻、清洗、乾燥等)，例：單基板濕製程、多基板濕製程、單一方晶片錫球下金屬蝕刻、薄化晶圓支撐/剝離、貼合/剝離製程、碳化矽再生晶圓、再生矽晶圓等，並不以此為限。The substrate 5 mentioned in this embodiment may be in the form of a carrier board, a wafer, a wafer, etc., and may be round or square, which is not limited thereto. Moreover, the substrate processing apparatus of this embodiment can be applied to substrate wet processing (etching, cleaning, drying, etc.), for example: single substrate wet processing, multi-substrate wet processing, metal etching under a single square wafer, thin wafer support /Removal, bonding/removal process, silicon carbide reclaimed wafers, reclaimed silicon wafers, etc. are not limited to this.

綜上所述，該控制單元3可供該操作者設定變更控制該噴嘴21的參數，可大幅提高該基板處理裝置100運作的彈性。In summary, the control unit 3 allows the operator to set and change the parameters for controlling the nozzle 21, which can greatly improve the flexibility of the substrate processing apparatus 100 in operation.

惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention, and should not be used to limit the scope of the present invention. Any simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the content of the patent specification are still classified as This invention covers the patent.

100‧‧‧基板處理裝置 1‧‧‧基板承載單元 11‧‧‧旋轉台 2‧‧‧流體供應單元 21‧‧‧噴嘴 3‧‧‧控制單元 31‧‧‧人機介面 311‧‧‧噴嘴控制區塊 312‧‧‧控制指令 32‧‧‧控制程式 4‧‧‧收集單元 5‧‧‧基板 C‧‧‧中心 D‧‧‧路徑範圍 R‧‧‧局部範圍100‧‧‧Substrate processing device 1‧‧‧ substrate carrier unit 11‧‧‧rotating table 2‧‧‧ fluid supply unit 21‧‧‧ nozzle 3‧‧‧Control unit 31‧‧‧Human-machine interface 311‧‧‧Nozzle control block 312‧‧‧Control instruction 32‧‧‧Control program 4‧‧‧Collection unit 5‧‧‧ substrate C‧‧‧ Center D‧‧‧path range R‧‧‧Local range

本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是本發明基板處理裝置的實施例的方塊圖；圖2是該實施例的示意圖；圖3是說明該實施例的一噴嘴控制區塊的示意圖；圖4是說明該噴嘴控制區塊的另一示意圖；圖5是說明該實施例的一噴嘴對應一旋轉台移動的一路徑範圍的示意圖；圖6是說明該噴嘴對應該旋轉台移動的一局部範圍的示意圖；圖7是說明該噴嘴對應該旋轉台移動的另一局部範圍的示意圖；圖8是說明該噴嘴對應該旋轉台移動的又一局部範圍的示意圖；圖9是說明一操作者在該噴嘴控制區塊設定該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度的一種態樣的一直角座標畫面的示意圖；圖10是說明該操作者在該噴嘴控制區塊設定該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度的另一種態樣的該直角座標畫面的示意圖；圖11是說明該操作者在該噴嘴控制區塊設定該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度的另一種態樣的該直角座標畫面的示意圖；圖12是說明該操作者在該噴嘴控制區塊設定該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度的另一種態樣的該直角座標畫面的示意圖；圖13是說明該操作者在該噴嘴控制區塊設定該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度的另一種態樣的該直角座標畫面的示意圖；及圖14是說明該實施例的一控制程式根據該操作者在該噴嘴控制區塊設定的一期望移動時間調整移動速度後的該直角座標畫面的示意圖。Other features and functions of the present invention will be clearly presented in the embodiments with reference to the drawings, in which: FIG. 1 is a block diagram of an embodiment of the substrate processing apparatus of the present invention; FIG. 2 is a schematic diagram of the embodiment; FIG. 3 4 is a schematic diagram illustrating a nozzle control block of the embodiment; FIG. 4 is another schematic diagram illustrating the nozzle control block; FIG. 5 is a schematic diagram illustrating a path range of a nozzle corresponding to the movement of a rotary table of the embodiment; 6 is a schematic diagram illustrating a partial range of the nozzle corresponding to the movement of the rotary table; FIG. 7 is a schematic diagram illustrating another partial range of the nozzle corresponding to the movement of the rotary table; A schematic diagram of a partial range; FIG. 9 is a schematic diagram illustrating an aspect of a rectangular coordinate screen in which the operator sets the nozzle at the position corresponding to each section in the nozzle control block with respect to the moving speed of the rotary table; FIG. 10 is a schematic diagram of the rectangular coordinate screen illustrating another aspect of the movement speed of the operator relative to the turntable when the nozzle is set at the position corresponding to each section in the nozzle control block; FIG. 11 is a diagram illustrating the operator A schematic diagram of the rectangular coordinate screen in another aspect of the moving speed relative to the rotary table when the nozzle is set at the position corresponding to each section in the nozzle control block; FIG. 12 is an illustration of the operator in the nozzle control block FIG. 13 is a schematic diagram of the rectangular coordinate screen in another aspect relative to the moving speed of the rotary table when the nozzle is located at a position corresponding to each section; FIG. 13 is a diagram illustrating that the operator sets the nozzle to the corresponding position in the nozzle control block. A schematic view of the rectangular coordinate screen in another aspect relative to the moving speed of the turntable at the time of the segment position; and FIG. 14 is a diagram illustrating a control program of the embodiment according to the operator setting in the nozzle control block Schematic diagram of the rectangular coordinate screen after the movement time is adjusted to the movement speed.

311‧‧‧噴嘴控制區塊 311‧‧‧Nozzle control block

Claims

一種基板處理裝置，包含：一基板承載單元，包括一旋轉台以供設置一基板；一流體供應單元，包括至少一噴嘴，對應該旋轉台設置且可受控地在通過該旋轉台中心的一路徑範圍內移動以供應一處理液；及一控制單元，與該流體供應單元耦接並包括一人機介面且儲存一控制程式，該人機介面具有一噴嘴控制區塊以供一操作者輸入一控制指令，且該控制單元接收該控制指令並由該控制程式對應該控制指令控制該噴嘴。A substrate processing apparatus includes: a substrate carrying unit including a rotating table for setting a substrate; a fluid supply unit including at least one nozzle corresponding to the rotating table and controllably passing through a center of the rotating table Move within the path to supply a processing liquid; and a control unit, coupled to the fluid supply unit and including a man-machine interface and storing a control program, the man-machine interface mask has a nozzle control block for an operator to enter a A control command, and the control unit receives the control command and controls the nozzle corresponding to the control command by the control program.

如請求項1所述基板處理裝置，其中，該控制程式預設對應該路徑範圍內有N個等距連續分布的區段，其中N不小於10，該控制指令包括選擇該N個區段的其中兩個以作為該噴嘴移動範圍的端點區段，而使該控制程式控制該噴嘴相對於該旋轉台在對應該兩端點區段的位置之間移動。The substrate processing apparatus according to claim 1, wherein the control program presets corresponding to N equidistant continuously distributed sections within the path range, where N is not less than 10, and the control instruction includes selecting the N sections Two of them are used as the end points of the nozzle movement range, and the control program controls the nozzle to move relative to the rotary table between the positions corresponding to the end point segments.

如請求項2所述基板處理裝置，其中，該控制指令還包括設定該兩端點區段範圍內對應各區段的該噴嘴的移動速度，而使該控制程式控制該噴嘴位於對應各區段位置時相對於該旋轉台的移動速度。The substrate processing apparatus according to claim 2, wherein the control instruction further includes setting a moving speed of the nozzle corresponding to each section in the range of the two end point sections, so that the control program controls the nozzle to be located in the corresponding section The speed of movement relative to the turntable when in position.

如請求項3所述基板處理裝置，其中，該控制指令還包括設定該兩端點區段範圍內對應各區段的流體供應量，而使該控制程式控制該噴嘴位於對應各區段位置時噴出的處理液對應該流體供應量。The substrate processing apparatus according to claim 3, wherein the control instruction further includes setting a fluid supply amount corresponding to each section within the range of the two end point sections, so that the control program controls the nozzle to be located at the position corresponding to each section The sprayed treatment liquid corresponds to the fluid supply.

如請求項3所述基板處理裝置，其中，該噴嘴控制區塊顯示一直角座標畫面，該直角座標畫面具有一第一座標軸及一第二座標軸，該第一座標軸對應該等N個區段的位置，且該第二座標軸對應該噴嘴的移動速度，該人機介面具有一輸入模式以供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內的多個座標位置以產生該控制指令，而使該控制指令包括對應該等座標位置的參數。The substrate processing apparatus according to claim 3, wherein the nozzle control block displays a rectangular coordinate screen having a first coordinate axis and a second coordinate axis, the first coordinate axis corresponding to the N segments Position, and the second coordinate axis corresponds to the moving speed of the nozzle, the man-machine interface has an input mode for the operator to select multiple coordinate positions corresponding to the range of the two end point segments on the right-angle coordinate screen to generate The control command, so that the control command includes parameters corresponding to the coordinate positions.

如請求項4所述基板處理裝置，其中，該噴嘴控制區塊顯示一直角座標畫面，該直角座標畫面具有一第一座標軸及一第二座標軸，該第一座標軸對應該等N個區段的位置，且該第二座標軸對應該噴嘴的流體供應量，該人機介面具有一輸入模式以供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內的多個座標位置以產生該控制指令，而使該控制指令包括對應該等座標位置的參數。The substrate processing apparatus according to claim 4, wherein the nozzle control block displays a rectangular coordinate screen having a first coordinate axis and a second coordinate axis, the first coordinate axis corresponding to the N segments Position, and the second coordinate axis corresponds to the fluid supply of the nozzle, the man-machine interface has an input mode for the operator to select multiple coordinate positions corresponding to the range of the two end point segments on the right-angle coordinate screen, The control command is generated so that the control command includes parameters corresponding to the coordinate positions.

如請求項5或6所述基板處理裝置，其中，該輸入模式供該操作者在該直角座標畫面上以訊號觸發的判斷方式連續選擇該等座標位置以產生該控制指令。The substrate processing apparatus according to claim 5 or 6, wherein the input mode is for the operator to continuously select the coordinate positions on the rectangular coordinate screen by signal-triggered judgment to generate the control command.

如請求項5或6所述基板處理裝置，其中，該輸入模式供該操作者在該直角座標畫面上選擇對應該兩端點區段範圍內相鄰其中一端點區段的一半範圍的座標位置且由該輸入模式以呈鏡射對稱圖形的方式自動選擇相鄰其中另一端點區段的一半範圍的座標位置以產生該控制指令。The substrate processing apparatus according to claim 5 or 6, wherein the input mode is for the operator to select a coordinate position on the rectangular coordinate screen corresponding to a half of the adjacent one of the end point segments within the range of the end point segments In addition, the input mode automatically selects the coordinate position of the half of the adjacent end point segment in a mirror-symmetrical pattern to generate the control command.

如請求項5或6所述基板處理裝置，其中，該輸入模式供該操作者在該直角座標畫面上選擇對應該兩端點區段的兩個座標位置及對應該兩端點區段範圍內至少一個座標位置且由該輸入模式以對應該操作者所選擇的座標位置形成一折線圖的方式自動選擇該兩端點區段範圍內其餘的座標位置以產生該控制指令。The substrate processing apparatus according to claim 5 or 6, wherein the input mode is for the operator to select two coordinate positions corresponding to the end point sections on the right-angle coordinate screen and within the range corresponding to the end point sections At least one coordinate position and the input mode automatically selects the remaining coordinate positions in the range of the two end point sections in a manner of forming a line graph corresponding to the coordinate position selected by the operator to generate the control command.

如請求項3或4所述基板處理裝置，其中，該控制指令還包括設定一供液時間及一起始供應位置，該供液時間為該噴嘴起始噴出該處理液至結束噴出該處理液的時間，該起始供應位置為使該噴嘴相對於該旋轉台起始噴出該處理液的位置。The substrate processing apparatus according to claim 3 or 4, wherein the control instruction further includes setting a liquid supply time and an initial supply position, the liquid supply time is the time when the nozzle starts to discharge the processing liquid to the end of the processing liquid At this time, the initial supply position is the position where the nozzle starts to eject the treatment liquid relative to the rotary table.

如請求項3或4所述基板處理裝置，其中，該控制指令還包括設定一移動次數、一起始供應位置及一結束供應位置，該移動次數為使該噴嘴在對應該兩端點區段範圍內往返移動的次數，該起始供應位置為使該噴嘴相對於該旋轉台起始噴出該處理液的位置，該結束供應位置為使該噴嘴相對於該旋轉台結束噴出該處理液的位置。The substrate processing apparatus according to claim 3 or 4, wherein the control instruction further includes setting a number of movements, a start supply position and an end supply position, the number of movements is such that the nozzle is in the range corresponding to the end points The number of internal reciprocating movements, the initial supply position is the position where the nozzle starts to discharge the processing liquid relative to the rotary table, and the end supply position is the position where the nozzle ends the discharge of the processing liquid relative to the rotary table.

如請求項3或4所述基板處理裝置，其中，該控制指令還包括設定一起始供應位置及一結束供應位置至少其中之一且該起始供應位置及該結束供應位置至少其中之一設定為在該兩端點區段範圍外，其中，該起始供應位置為使該噴嘴相對於該旋轉台起始噴出該處理液的位置，該結束供應位置為使該噴嘴相對於該旋轉台結束噴出該處理液的位置。The substrate processing apparatus according to claim 3 or 4, wherein the control instruction further includes setting at least one of a start supply position and an end supply position and at least one of the start supply position and the end supply position is set to Outside the range of the two end point sections, wherein the initial supply position is a position where the nozzle starts to eject the treatment liquid relative to the rotary table, and the end supply position is the end where the nozzle ends ejection with respect to the rotary table The location of the treatment liquid.

如請求項3或4所述基板處理裝置，其中，該控制指令還包括設定一期望移動時間，該期望移動時間為該操作者欲使該噴嘴對應自其中一端點區段移動至另一端點區段的時間，該控制程式對應該期望移動時間調整原已由該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴的移動速度，以使該噴嘴自其中一端點區段移動至另一端點區段的時間符合該期望移動時間。The substrate processing apparatus according to claim 3 or 4, wherein the control instruction further includes setting a desired movement time for the operator to move the nozzle from one end point section to another end point area The time of the segment, the control program adjusts the movement speed of the nozzle corresponding to each segment within the range of the two end point segments previously set by the operator according to the desired movement time, so that the nozzle is from one of the endpoint segments The time to move to the other end point segment corresponds to the desired moving time.

如請求項13所述基板處理裝置，其中，該控制程式以等量調整的方式調整該操作者設定的該兩端點區段範圍內對應各區段的該噴嘴的移動速度。The substrate processing apparatus according to claim 13, wherein the control program adjusts the movement speed of the nozzle corresponding to each section within the range of the two end point sections set by the operator in an equal adjustment manner.

如請求項14所述基板處理裝置，其中，該控制程式係根據該噴嘴實際相對於該旋轉台自對應其中一端點區段移動至另一端點區段的一實際移動時間與該期望移動時間對比，若該期望移動時間與該實際移動時間有一誤差值，則該控制程式根據該誤差值對該兩端點區段範圍內對應各區段的該噴嘴的移動速度進行調整。The substrate processing apparatus according to claim 14, wherein the control program compares the actual movement time of the nozzle with respect to the rotary table from the corresponding one of the end point sections to the other end section and the expected movement time If there is an error between the expected movement time and the actual movement time, the control program adjusts the movement speed of the nozzle corresponding to each section within the range of the two end point sections according to the error value.

如請求項1所述基板處理裝置，其中，該流體供應單元包括多個噴嘴，且該噴嘴控制區塊還供該操作者選擇欲使用的其中一噴嘴並輸入該控制指令。The substrate processing apparatus according to claim 1, wherein the fluid supply unit includes a plurality of nozzles, and the nozzle control block is also for the operator to select one of the nozzles to be used and input the control command.

如請求項16所述基板處理裝置，還包含多個分別對應該等噴嘴設置的收集單元，且該噴嘴控制區塊還供該操作者選擇與欲使用的該噴嘴相對應的收集單元，以使該控制單元控制該收集單元與相對應的噴嘴共同運作。As described in claim 16, the substrate processing apparatus further includes a plurality of collection units respectively corresponding to the nozzles, and the nozzle control block is also provided for the operator to select a collection unit corresponding to the nozzle to be used, so that The control unit controls the collection unit to work with the corresponding nozzle.